TW201448203A - Substrate structure - Google Patents

Abstract

A substrate structure including a bottom organic layer, at least one inorganic layer, at least one organic layer and at least one protruding object is provided. The at least one protruding object is protruded from a upper surface of the bottom organic layer or the organic layer. A maximum height of the protruding object protruded from the upper surface of the bottom organic layer or the organic layer is H, and a thickness of the organic layer covering the protruding object is T, wherein T ≥ 1.1H.

Description

Substrate structure

The present invention relates to a substrate structure.

Compared to general hard substrates, flexible substrates are more widely used. The advantages of the flexible substrate are flexibility, portability, safety and product application, but its disadvantages are low temperature resistance and poor resistance to water and oxygen. Since a typical flexible substrate cannot completely block the penetration of moisture and oxygen, the deterioration of electronic components on the substrate is accelerated, and the life of the electronic component is shortened, so that it is not sufficiently compatible with commercial requirements. Therefore, how to effectively improve the characteristics of the moisture barrier and oxygen of the flexible substrate in order to improve the reliability of the electronic component is one of the concerns of the developer.

One embodiment of the present invention provides a substrate structure including a bottom organic layer, at least one inorganic layer, at least one organic layer, and at least one protrusion. At least one protrusion protrudes from the upper surface of the bottom organic layer or the organic layer. The maximum height of the at least one protrusion protruding from the upper surface of the bottom organic layer or the organic layer is H, and the thickness of the organic layer covering at least one protrusion is T, wherein T 1.1H.

Another embodiment of the present invention provides a substrate structure including a bottom organic layer, at least one inorganic layer, and a plurality of organic layers. The organic layer and the inorganic layer are alternately stacked on the bottom organic layer, wherein the organic layer includes a first organic layer and a second organic layer, the first organic layer is adjacent to the bottom organic layer relative to the second organic layer, and the second organic layer is opposite to the first organic layer The layer is away from the bottom organic layer, and the thickness of the first organic layer is T1, and the thickness of the second organic layer is T2, wherein T1 T2.

In order to make the present invention more apparent, the following detailed description of the embodiments and the accompanying drawings are set forth below.

100, 100A~100L, 100B'‧‧‧ substrate structure

102‧‧‧ Carrier Board

104‧‧‧Removable area

104a, 110a, 200a, 1201a, 1202a, 1203a, 1301a, 1302a, 1303a‧‧‧ upper surface

104b, 110b, 1202b, 1301b, 1302b‧‧‧ side walls

106‧‧‧ cutting line

110‧‧‧ bottom organic layer

120‧‧‧Inorganic layer

130‧‧‧Organic layer

140, 140’, 140” ‧ ‧ bulges

152‧‧‧ first spacer

154‧‧‧Second spacer

155‧‧‧ third spacer

156‧‧‧fourth spacer

200A~200E‧‧‧Package structure

200b‧‧‧ side

200c‧‧‧ lower surface

210‧‧‧First substrate

212‧‧‧Organic electroluminescent components

220‧‧‧second substrate

230‧‧‧Box glue

240‧‧‧protection layer

250‧‧‧Stained materials

260‧‧‧ getter

270‧‧‧ gas barrier film

1201‧‧‧First inorganic layer

1202‧‧‧Second inorganic layer

1203‧‧‧ Third inorganic layer

1301‧‧‧First organic layer

1302‧‧‧Second organic layer

1303‧‧‧ Third organic layer

A, T1, T2, T3, Tb‧‧‧ thickness

A1, A2‧‧‧ area

B‧‧‧ distance

D, D’, D” ‧ ‧ maximum depth

H, H’, H” ‧ ‧ maximum height

Hb, Hs, Hs', Hs" ‧ ‧ height

I-I’‧‧‧ line

R‧‧‧Internal space

Tt‧‧‧ total thickness

1A to 1D are schematic views showing a manufacturing process of a substrate structure in accordance with a first embodiment of the present invention.

2A is a schematic cross-sectional view showing a structure of a substrate in accordance with a second embodiment of the present invention.

2B is a schematic cross-sectional view showing a structure of a substrate in accordance with a third embodiment of the present invention.

3A is a top plan view of a substrate structure in accordance with a fourth embodiment of the present invention.

Fig. 3B is a schematic cross-sectional view taken along line I-I' of Fig. 3A.

4 is a cross-sectional view showing a structure of a substrate in accordance with a fifth embodiment of the present invention.

Figure 5 is a cross-sectional view showing a structure of a substrate in accordance with a sixth embodiment of the present invention.

Figure 6 is a cross-sectional view showing the structure of a substrate in accordance with a seventh embodiment of the present invention.

Figure 7 is a cross-sectional view showing the structure of a substrate in accordance with an eighth embodiment of the present invention.

Figure 8 is a cross-sectional view showing the structure of a substrate in accordance with a ninth embodiment of the present invention.

Figure 9 is a schematic cross-sectional view of a spacer formed of an organic material.

Figure 10 is a cross-sectional view showing the structure of a substrate in accordance with a tenth embodiment of the present invention.

Figure 11 is a cross-sectional view showing the structure of a substrate in accordance with an eleventh embodiment of the present invention.

Figure 12 is a cross-sectional view showing the structure of a substrate in accordance with a twelfth embodiment of the present invention.

Figure 13 is a cross-sectional view showing the structure of a substrate in accordance with a thirteenth embodiment of the present invention.

14 is a cross-sectional view of a package structure in accordance with an embodiment of the present invention.

Fig. 15A is a schematic cross-sectional view showing a first substrate on which a lower-emitting organic electroluminescent device is disposed.

15B is a schematic cross-sectional view showing a first substrate on which an upper light-emitting type organic electroluminescent device is disposed.

16 to 19 are schematic cross-sectional views showing a package structure in accordance with other embodiments of the present invention.

1A to 1D are schematic views showing a manufacturing process of a substrate structure in accordance with a first embodiment of the present invention.

Referring to FIG. 1A, first, a detachable region 104 is formed on the carrier 102. The method of forming the detachable region 104 is, for example, performing the detachable region 104 on the carrier 102. The surface treatment is to reduce the adhesion of the bottom organic layer 110 to the carrier 102, or to form a film having poor adhesion to the bottom organic layer 110, or to form a layer with the bottom organic layer 110, but with the carrier 102. A film with poor adhesion. The material of the releaseable region 104 is, for example, a parylene series material, a polytetrafluoroethene (PTFE) series material, or a soloxane series material. Next, a bottom organic layer 110 is formed on the detachable region 104, wherein the bottom organic layer 110 covers the upper surface 104a of the detachable region 104 and the sidewall 104b, and the area of the bottom organic layer 110 may be larger than that of the detachable region 104. area. The bottom organic layer 110 is formed by, for example, forming a bottom organic material layer (not shown) by a wet coating method, and then curing (drying) the bottom organic material layer by, for example, heating, illuminating, or other suitable method. To form the bottom organic layer 110. The material of the bottom organic layer 110 includes polyiminamide (PI), polycarbonate (PC), polyether oxime (PES), polynorbornene (PNB), polyether quinone imine (PEI), polyisophthalene. Ethylene formate (PEN), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA) and other suitable organic materials. Further, the thickness of the bottom organic layer 110 is Tb.

In this embodiment, after the bottom organic layer 110 is formed, it may be cleaned first. The upper surface of the machine layer is then fabricated into the next film layer, but the cleaning process is not a necessary step. However, it is not always possible to completely remove the substance or particles on the upper surface during the cleaning process, and the residue on the bottom organic layer 110 which is not removed is formed as the protrusion 140. In more detail, at least one protrusion 140 may be located on the upper surface 110a of the bottom organic layer 110 during the formation of the bottom organic layer 110 or after the formation of the bottom organic layer 110. Wherein, the protrusion 140 may have a part embedded in the bottom The organic layer 110 is attached to the upper surface 110a of the bottom organic layer 110 by other means such as adhesion or electrostatic attraction. In general, the protrusions 140 are, for example, particles in a coating liquid, particles in a coating device, particles in a curing device, or particles in other environments, etc., wherein the particles in the coating liquid may be in a coating liquid. Undissolved matter or impurities. That is, the material of the protrusions 140 may be the same as the bottom organic layer 110 or may be different from the bottom organic layer 110.

In the present embodiment, the maximum height of the protrusions 140 protruding from the upper surface 110a of the bottom organic layer 110 is H, and the maximum depth of the protrusions 140 embedded in the bottom organic layer 110 is D, wherein, for example, D (1/4) (H+D). If the maximum depth D of the particles embedded in the bottom organic layer 110 is greater than or equal to 1/4 of the total height (H+D) of the particles, it is less likely to have D in the above cleaning process. The particles of the (1/4) (H+D) relationship are removed and thus formed as protrusions 140. In addition, the protrusions 140 have a maximum particle size of about 5 microns under the standard of a clean room.

Referring to FIG. 1B, a first inorganic layer 1201 may be formed, for example, conformally on the bottom organic layer 110, wherein the first inorganic layer 1201 covers the upper surface 110a of the bottom organic layer 110 and the protrusions 140 protrude from the upper surface 110a. Part of the surface. The method of forming the first inorganic layer 1201 is, for example, a chemical vapor deposition method, a sputtering method, an atomic layer deposition method, a liquid coating method, or other suitable methods. The material of the first inorganic layer 1201 is, for example, cerium oxide, cerium nitride, cerium oxynitride, aluminum oxide, aluminum or other suitable inorganic gas barrier material. Next, a first organic layer 1301 is formed on the first inorganic layer 1201, wherein the first organic layer 1301 covers the first inorganic layer 1201 and the protrusions 140. The method of forming the first organic layer 1301 is, for example, forming a first organic material layer by a wet coating method (not The first organic material layer is cured by, for example, heating, illumination, or other suitable method to form the first organic layer 1301. The method of forming the first organic layer 1301 may also deposit a thin film on the first inorganic layer 1201 by a vacuum plating method. The material of the first organic layer 1301 includes polyiminamide (PI), polycarbonate (PC), polyether oxime (PES), polynorbornene (PNB), polyether quinone imine (PEI), poly-m-benzene. Ethylene dicarboxylate (PEN), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polytetrafluoroethylene (PTFE), parylene series materials, fluorine Perfluorinated chemicals (PFCs) and other suitable organic materials.

In this embodiment, the thickness of the first organic layer 1301 is T1, and T1 1.1H. Wherein, the thickness T1 is determined by, for example, measuring the surface undulation of the upper surface 110a of the bottom organic layer 110 (that is, the maximum height at which the projection protrusion 140 protrudes from the upper surface 110a of the bottom organic layer 110 is H), T1 1.1H determines the value of the thickness T1. The height H of the protrusions 140 on the bottom organic layer 110 is generally not greater than the thickness Tb of the bottom organic layer 110, and the thickness T1 of the first organic layer 1301 may also be smaller than the previous organic layer (for example, the bottom organic layer 110). The height difference caused by the flattening protrusion 140 is smoothed. In other embodiments, the step of measuring the surface relief may be omitted, and the thickness T1 of the first organic layer 1301, that is, Tb, may be directly determined by the thickness Tb of the bottom organic layer 110. T1.

In the present embodiment, after the first organic layer 1301 is formed, the residue that has not been removed is configured as the protrusion 140'. The material of the protrusions 140' may be the same as the first organic layer 1301 or may be different from the first organic layer 1301. Moreover, in the present embodiment, the maximum height of the protrusion 140' protruding from the upper surface 1301a of the first organic layer 1301 is H', and the maximum depth of the protrusion 140' embedded in the first organic layer 1301 is D', where for example D' (1/4) (H'+D'). Additionally, in one embodiment, the thickness of the organic layer will be proportional to the size of the protrusions. In more detail, since the larger size residue on the thin organic layer is easier to remove, the size of the protrusions that may exist on the thin organic layer will be smaller and the amount will be smaller than the thick organic layer. less. Here, the thickness T1 of the first organic layer 1301 may be smaller than the thickness Tb of the bottom organic layer 110, and the size of the protrusion 140' may be smaller than the size of the protrusion 140, for example, (H+D)>(H'+D ').

Referring to FIG. 1C, a second inorganic layer 1202 may be formed, for example, conformally on the first organic layer 1301, wherein the second inorganic layer 1202 covers the upper surface 1301a of the first organic layer 1301 and the protrusion 140'. A portion of the surface on which the upper surface 1301a protrudes. The method of forming the second inorganic layer 1202 is, for example, a chemical vapor deposition method, a sputtering method, an atomic layer deposition method, a liquid coating method, or other suitable methods. The material of the second inorganic layer 1202 is, for example, cerium oxide, cerium nitride, cerium oxynitride, aluminum oxide, aluminum or other suitable inorganic gas barrier material. Next, a second organic layer 1302 is formed on the second inorganic layer 1202, wherein the second organic layer 1302 covers the second inorganic layer 1202 and the protrusions 140'. The second organic layer 1302 is formed by, for example, forming a second organic material layer (not shown) by a wet coating method, and then curing the second organic material layer by, for example, heating, illuminating, or other suitable method. A second organic layer 1302 is formed. The method of forming the second organic layer 1302 may also deposit a thin film on the second inorganic layer 1202 by a vacuum plating method. The material of the second organic layer 1302 includes polyiminamide (PI), polycarbonate (PC), polyether oxime (PES), polynorbornene (PNB), polyether quinone imine (PEI), poly-m-benzene. Ethylene dicarboxylate (PEN), polyethylene terephthalate (PET), polymethyl Methyl acrylate (PMMA), polytetrafluoroethylene (PTFE), parylene series materials, fluorocarbons (PFCs) and other suitable organic materials. In an embodiment, the material of the bottom organic layer 110 may be the same as the material of at least one of the first organic layer 1301 and the second organic layer 1302.

In this embodiment, the thickness of the second organic layer 1302 is T2, and T2 1.1H'. If the first organic layer 1301 has substantially smoothed the height difference caused by the protrusions 140, the thickness T2 of the second organic layer 1302 may also be set to T1. T2. After the second organic layer 1302 is formed, the upper surface of the second organic layer 1302 can be made clean and flat, for example, by cleaning the upper surface of the organic layer. In one embodiment, the larger size residue on the thin organic layer is easier to remove, and the size of the protrusions that may be present on the thin organic layer is smaller and the amount will be smaller than the thick organic layer. less. In this embodiment, the thickness T2 of the second organic layer 1302 away from the bottom organic layer 110 is smaller than the thickness T1 of the first organic layer 1301 adjacent to the bottom organic layer 110, and the upper surface 1302a of the second organic layer 1302 is the same. An organic layer 1301 is flat.

In this embodiment, the plurality of inorganic layers 120 (including, for example, the first inorganic layer 1201 and the second inorganic layer 1202) and the plurality of organic layers 130 (including, for example, the first organic layer 1301 and the second organic layer 1302) are alternately stacked on On the bottom organic layer 110. That is, the first inorganic layer 1201, the first organic layer 1301, the second inorganic layer 1202, and the second organic layer 1302 are sequentially stacked on the bottom organic layer 110 to constitute the substrate structure 100. The total thickness Tt of the substrate structure 100 is the sum of the thicknesses of the plurality of inorganic layers 120 and the thicknesses of the plurality of organic layers 130, and the total thickness Tt may be, for example, 5 to 50 μm. Furthermore, this embodiment is described by taking two inorganic layers 120 and two organic layers 130 alternately stacked as an example, but The invention is not limited to this. In other embodiments, at least one inorganic layer 120 and at least one organic layer 130 may be alternately stacked.

Referring to FIG. 1C again, the organic layer 130, the inorganic layer 120, the bottom organic layer 110, and the detachable region 104 are cut along the dicing line 106, and the organic layer 130, the inorganic layer 120, and the bottom organic layer 110 are stacked. The resulting substrate structure 100 can be separated from the carrier plate 102 by the detachable region 104. The cutting method is, for example, a laser cutting, a knife saw cutting or other suitable cutting process.

Referring to FIG. 1D, as described above, the fabrication of the independent substrate structure 100A is completed. In the substrate structure 100A, the thickness of the plurality of organic layers 130 may be gradually reduced from a direction adjacent to the bottom organic layer 110 away from the bottom organic layer 110, which causes the upper surface of the substrate structure 100 (ie, the upper surface 1302a) ) is relatively flat, but the invention is not limited thereto. In other embodiments, T1 may also be equal to or less than T2 (T1=T2 or T1<T2) as long as the upper surface of the substrate structure 100 can be flat. In this embodiment, the thickness of each of the organic layers 130 may cover and flatten the protrusions on the previous organic layer, and the thickness of each of the organic layers 130 is, for example, 0.1 to 10 μm. For example, if T1 1.1H, the thickness T1 of the first organic layer 1301 may be covered and the protrusions 140 on the upper surface 110a of the bottom organic layer 110 may be flattened.

In addition, when the thickness of the plurality of organic layers 130 is gradually decreased from the direction adjacent to the bottom organic layer 110 toward the bottom organic layer 110, the gas barrier capability of the plurality of inorganic layers 120 may be gradually reduced, wherein The inorganic layer 120 away from the bottom organic layer 110 mainly blocks lateral water oxygen permeation from the previous organic layer 130. When the organic layer 130 is thinner, the amount of water oxygen permeation is less, thereby reducing the process. The difficulty. That is to say, the process conditions for fabricating these inorganic layers 120 can be adjusted with different requirements. For example, when the gas barrier capability of the inorganic layer 120 is required to be low, the inorganic layer 120 can be formed using a lower temperature process or a shorter time.

The water vapor transmission rate (WVTR) of the substrate structure 100A is, for example, less than 0.001 g/m ² day at 60 ° C, preferably 10 ^-6 g/m ² day. In the present embodiment, the water vapor permeability of the substrate structure 100A is determined by the gas barrier effect (or quality) of the inorganic layer 120, but the gas barrier effect of the inorganic layer 120 is affected by the organic layer 130, for example, the organic layer 130. The flatness of the upper surface or the high temperature resistance of the material. Without changing the total thickness Tt of the substrate structure 100A (to maintain mechanical strength), an embodiment of the present invention may be optimized by the thickness of the plurality of organic layers 130 such that the upper surface of the substrate structure 100A (eg, The upper surface 1302a) is relatively flat and has better gas barrier properties as well as flexural properties.

In this embodiment, the material of at least one of the bottom organic layer 110 or the organic layer 130 may be, for example, a refractory material, and the 5% weight loss temperature may be greater than 400 ° C, and the gas is released at 400 ° C. The amount may be less than 50 ng/cm ² , preferably less than 20 ng/cm ² , more preferably less than 6 ng/cm ² . In the present embodiment, the organic layer 130 can be made of a material that is resistant to temperature. Therefore, in the high-temperature process of forming the inorganic layer 120, the gas release or decomposition of the organic layer 130 due to high temperature resistance can be avoided. Avoiding the formation of bubbles in the organic layer affects the quality of the inorganic layer 120. That is, the high temperature resistant organic layer 130 may have a relatively flat upper surface (because of no bubble formation), thereby avoiding uneven thickness of the inorganic layer 120 formed thereon, uneven upper surface, and discontinuous film layer Problems such as (such as breaking) can further improve the gas barrier properties and the flexural properties of the substrate structure 100A. During the high temperature curing (drying) of the high temperature resistant organic layer 130, the inorganic layer 120 may be tempered while heating the organic layer 130 to make the structure of the inorganic layer 120 denser, thereby improving the substrate structure 100A. The gas barrier properties and flexural properties simplify the process.

2A is a schematic cross-sectional view showing a structure of a substrate in accordance with a second embodiment of the present invention. The embodiment of FIG. 2A is similar to the structure and manufacturing method of the above-described embodiment of FIGS. 1A to 1D, and therefore the same or similar elements are denoted by the same or similar symbols, and the description thereof will not be repeated. Referring to FIG. 2A, the embodiment of FIG. 2A is different from the embodiment of FIG. 1A to FIG. 1D in that the substrate structure 100B further includes at least one protrusion 140", a third inorganic layer 1203, and a third organic layer 1303. At least one protrusion 140" is located on the upper surface 1302a of the second organic layer 1302. The material of the protrusion 140" may be the same as the second organic layer 1302, or may be different from the second organic layer 1302. Further, in the present embodiment, the protrusion 140" is from the upper surface 1302a of the second organic layer 1302. The maximum height of the protrusion is H", and the maximum depth of the protrusion 140" embedded in the second organic layer 1302 is D", where for example D" (1/4) (H"+D"). The third inorganic layer 1203 covers the upper surface 1302a of the second organic layer 1302 and a portion of the surface of the protrusion 140" protruding from the upper surface 1302a, and the third organic layer 1303 covers the third inorganic layer 1203 and the protrusion 140" . In an embodiment, the material of the bottom organic layer 110 may be the same as the material of at least one of the first organic layer 1301, the second organic layer 1302, and the third organic layer 1303. In this embodiment, the thickness of the third organic layer 1303 is T3, and T3 1.1H". In addition, the thickness T3 of the third organic layer 1303 can also be set to T1. T2 T3, but the invention is not limited thereto. In other embodiments, it may also be T1. T3 T2, T2 T1 T3, T2 T3 T1, T3 T1 T2 or T3 T2 T1 may be such that the upper surface (for example, the upper surface 1303a) of the substrate structure 100B can be flat.

2B is a schematic cross-sectional view showing a structure of a substrate in accordance with a third embodiment of the present invention. The embodiment of FIG. 2B is similar to the structure and manufacturing method of the embodiment of FIG. 2A described above, and thus the same or similar elements are designated by the same or similar symbols, and the description thereof will not be repeated. Referring to FIG. 2B, the embodiment of FIG. 2B is different from the embodiment of FIG. 2A described above in that the substrate structure 100B' does not have the protrusions 140, 140' and 140". In this embodiment, the organic layer 130 ( The thickness including the first organic layer 1301, the second organic layer 1302, and the third organic layer 1303) may be set to T1 T2 T3. Therefore, the thickness of the plurality of organic layers 130 gradually decreases from the direction adjacent to the bottom organic layer 110 toward the bottom organic layer 110, which makes the gas barrier capability of the inorganic layer 120 away from the bottom organic layer 110 gradually cut back.

3A is a top view of a substrate structure in accordance with a fourth embodiment of the present invention. Intention, and Fig. 3B is a schematic cross-sectional view taken along line I-I' in Fig. 3A. 3A to 3B are similar to the structures and manufacturing methods of the above-described embodiments of Figs. 1A to 1D, and therefore the same or similar elements are denoted by the same or similar symbols, and the description thereof will not be repeated. Referring to FIG. 3A to FIG. 3B , the embodiment of FIG. 3A to FIG. 3B is different from the embodiment of FIG. 1A to FIG. 1D in that, in the substrate structure 100C, the area A1 of the first organic layer 1301 is smaller than the second organic layer. The area A2 of the layer 1302, but the invention is not limited thereto. In other embodiments, the area A1 may be equal to or greater than the area A2.

The second inorganic layer 1202 covers the upper surface 1301a of the first organic layer 1301 And a side wall 1301b. In the present embodiment, the distance between the sidewall 1202b of the second inorganic layer 1202 and the sidewall 1301b of the first organic layer 1301 is B, the thickness of the first inorganic layer 1201 is A, and the distance B is greater than the thickness A. Therefore, the sidewall 1301b of the first organic layer 1301 may be protected by the second inorganic layer 1202 to prevent water oxygen from penetrating laterally to the first organic layer 1301, thereby improving the lateral gas barrier capability of the first organic layer 1301. However, the present invention is not limited thereto, and in other embodiments, the distance B may be equal to or smaller than the thickness A.

4 to 8 are the bases of the fifth to ninth embodiments according to the present invention, respectively. A schematic cross-sectional view of the plate structure. The embodiment of FIGS. 4 to 8 is similar to the structure and manufacturing method of the above-described embodiment of FIGS. 1A to 1D, and therefore the same or similar elements are denoted by the same or similar symbols, and the description thereof will not be repeated. The embodiment of FIGS. 4-8 differs from the embodiment of FIGS. 1A to 1D described above in that the substrate structure further includes a plurality of spacers, and the spacers may be located in the bottom organic layer 110 or the organic layer 130, or It is located on the upper surface of the substrate structure and is described in detail below.

Referring to FIG. 4, in the substrate structure 100D, at least one first spacer 152 Located in the bottom organic layer 110, and the height Hs of the first spacer 152 may correspond to the thickness Tb of the bottom organic layer 110. In this embodiment, the first spacer 152 is disposed adjacent to the sidewall 110b of the bottom organic layer 110, wherein the first spacer 152 may be a continuous and closed annular structure or a discontinuous segment structure surrounding the bottom The sidewall 110b of the organic layer 110, so the sidewall 110b of the bottom organic layer 110 can be protected by the first spacer 152 to prevent water oxygen from penetrating laterally to the bottom organic layer 110, thereby improving the lateral resistance of the bottom organic layer 110. Gas ability. However, the invention is not limited thereto, In other embodiments, the cross section of the first spacer 152 may have a rectangular shape, a trapezoidal shape, or other suitable shape as long as water oxygen can be prevented from penetrating from the side to the bottom organic layer 110.

The material of the first spacer 152 includes an inorganic material, an organic material, a metal composite material, a non-metal composite material, a metal material, or a combination thereof. The inorganic material is, for example, cerium oxide, cerium nitride or cerium oxynitride. The organic material is, for example, a photoresist. The metal composite material is, for example, a silver-containing composite material, an aluminum-containing composite material or other metal composite material. The method of forming the first spacers 152 is, for example, a spray, a screen print, a photolithography, a low temperature sintering, or other suitable method. For example, prior to the fabrication of the bottom organic layer 110 using the steps of FIG. 1A, a first spacer 152 can be fabricated on the carrier 102 (shown in FIG. 1A) using one of the methods described above.

Referring to FIG. 5 , in the substrate structure 100E , at least one first spacer 152 is located in the first organic layer 1301 , and the height Hs of the first spacer 152 may correspond to the thickness T1 of the first organic layer 1301 . Furthermore, at least one second spacer 154 is also located in the first organic layer 1301, and the height Hs' of the second spacer 154 may also correspond to the thickness T1 of the first organic layer 1301. In the present embodiment, the first spacer 152 is disposed adjacent to the sidewall 1301b of the first organic layer 1301, so the sidewall 1301b of the first organic layer 1301 can be protected by the first spacer 152 to avoid water and oxygen from the side. The penetration into the first organic layer 1301 further improves the lateral gas barrier capability of the first organic layer 1301. Furthermore, the second spacer 154 is disposed at any position in the first organic layer 1301 or has any suitable shape as long as the thickness T1 of the first organic layer 1301 can be maintained. However, the present invention is not limited thereto. In other embodiments, the first organic layer 1301 may also have only the first spacer 152 or the second spacer. 154. The cross section of the first spacer 152 or the second spacer 154 may have a rectangular shape, a trapezoidal shape, or other suitable shape. In addition, the first spacer 152 or the second spacer 154 may also be located in the second organic layer 1302 or other organic layer (not shown). The first spacer 152 or the second spacer 154 may be a continuous and closed annular structure or a discontinuous segment structure distributed on the first organic layer 1301, the second organic layer 1302 or other organic layers (not shown) in.

The method of forming the first spacer 152 and the second spacer 154 may be, for example, Spreading, screen printing, lithography, low temperature sintering or other suitable methods. The material of the first spacer 152 and the second spacer 154 may include an inorganic material, an organic material, a metal composite material, a non-metal composite material, a metal material, or a combination thereof. The inorganic material is, for example, cerium oxide, cerium nitride or cerium oxynitride. The organic material is, for example, a photoresist. The metal composite material is, for example, a silver-containing composite material, an aluminum-containing composite material or other metal composite material. When the material of the first spacer 152 or the second spacer 154 is a metal material, the first spacer 152 or the second spacer 154 may be formed by a sintering method, but not limited thereto.

Referring to FIG. 6, in the substrate structure 100F, a plurality of third spacers 155 For example, it is located in the first organic layer 1301, and the height Hb of the third spacer 155 is equal to or smaller than the thickness T1 of the first organic layer 1301. The third spacer 155 is disposed at any position in the first organic layer 1301 or has any suitable shape. The main function of the third spacer 155 is to maintain the shape of the whole substrate when it is bent, wherein the material of the organic layer 130 is soft. The thickness at the bending point is easy to be thin when bending, and the non-bending point is thick. This thickness variation may cause component failure on the substrate, and thus the organic layer 130 The addition of a rigid hard spacer adds to the excessive thickness variation of the substrate when it is bent. However, the present invention is not limited thereto, and in other embodiments, the cross sections of the third spacers 155 may each have a circular shape, an elliptical shape, or other suitable shape. In addition, the plurality of third spacers 155 may also be located in the second organic layer 1302 or other organic layers (not shown). The material of the third spacer 155 may include an inorganic material, an organic material, a metal material, or a combination thereof. The inorganic material is, for example, glass powder or ceramic powder. The organic material is, for example, a thermosetting photoresist. The metal material is, for example, silver powder, aluminum powder, lead powder, stainless steel powder or other metal powder.

Referring to FIG. 7, in the substrate structure 100G, at least one fourth spacer 156 Located on the upper surface of the substrate structure 100G (eg, the upper surface 1302a of the second organic layer 1302), and the height of the fourth spacer 156 is Hs". In the present embodiment, the fourth spacer 156 is disposed adjacent to the first The sidewalls 1302b of the second organic layer 1302, wherein the fourth spacers 156 may be a continuous and closed annular structure or a discontinuous segment structure surrounds the sidewalls 1302b of the second organic layer 1302, thus when the substrate structure 100G and When the opposite substrate (not shown) constitutes a package structure, the height Hs" of the fourth spacer 156 may correspond to the height of the internal space of the package structure, and the lateral resistance of the inner space of the package structure may be improved. Gas ability. However, the present invention is not limited thereto. In other embodiments, the cross section of the fourth spacer 156 may have a rectangular shape, a trapezoidal shape or other suitable shape as long as water oxygen can be prevented from penetrating laterally into the inner space of the package structure. can. The method of forming the fourth spacers 156 is, for example, sprinkling, screen printing, lithography, low temperature sintering, or other suitable method. The material of the fourth spacer 156 may include inorganic materials, organic materials, metal composite materials, and non-metal complexes. Composite materials, metallic materials or a combination thereof. The inorganic material is, for example, cerium oxide, cerium nitride or cerium oxynitride. The organic material is, for example, a photoresist. The metal composite material is, for example, a silver-containing composite material, an aluminum-containing composite material or other metal composite material.

Referring to FIG. 8 , in the substrate structure 100H , at least one first spacer 152 is located in the bottom organic layer 110 , and the first spacer 152 and the plurality of third spacers 155 are located in the first organic layer 1301 , and the fourth gap is The object 156 is located on the upper surface of the substrate structure 100H (for example, the upper surface 1302a of the second organic layer 1302), wherein the shapes of the first spacer 152, the third spacer 155, and the fourth spacer 156 may be different from each other. However, the present invention is not limited thereto. In other embodiments, the configuration of the plurality of spacers may also be any combination of the above-described embodiments of FIGS. 4 to 8.

In addition, as shown in FIG. 9, when the material of the first spacer 152 is an organic material, the inorganic layer 120 such as the first inorganic layer 1201 may selectively cover the first spacer 152. Therefore, the first spacer 152 may be located between the first inorganic layer 1201 and the bottom organic layer 110, and the first inorganic layer 1201 may conform to the contour configuration of the first spacer 152.

Figure 10 is a cross-sectional view showing the structure of a substrate in accordance with a tenth embodiment of the present invention. The embodiment of FIG. 10 is similar to the structure and manufacturing method of the above-described embodiment of FIGS. 1A to 1D, and therefore the same or similar elements are denoted by the same or similar symbols, and the description thereof will not be repeated. Referring to FIG. 10, the embodiment of FIG. 10 is different from the embodiment of FIG. 1A to FIG. 1D in that, in the substrate structure 100I, the area A1 of the first organic layer 1301 is smaller than the area of the bottom organic layer 110, but The invention is not limited to this. In other embodiments, the area A1 may be equal to or larger than the surface of the bottom organic layer 110. product. Furthermore, the substrate structure 100I further includes at least one fourth spacer 156.

The second inorganic layer 1202 covers the upper surface 1301a of the first organic layer 1301 And a side wall 1301b. In the present embodiment, the distance between the sidewall 1202b of the second inorganic layer 1202 and the sidewall 1301b of the first organic layer 1301 is B, the thickness of the first inorganic layer 1201 is A, and the distance B is greater than the thickness A. Therefore, the sidewall 1301b of the first organic layer 1301 may be protected by the second inorganic layer 1202 to prevent water oxygen from penetrating laterally to the first organic layer 1301, thereby improving the lateral gas barrier capability of the first organic layer 1301. However, the present invention is not limited thereto, and in other embodiments, the distance B may be equal to or smaller than the thickness A.

At least one fourth spacer 156 is located on the upper surface of the substrate structure 100I (eg, For example, the upper surface 1202a) of the second inorganic layer 1202, and the height of the fourth spacer 156 is Hs". In the present embodiment, the fourth spacer 156 is disposed adjacent to the sidewall 1202b of the second inorganic layer 1202. The fourth spacer 156 may be a continuous and closed annular structure or a discontinuous segment structure surrounding the sidewall 1202b of the second inorganic layer 1202, thus when the substrate structure 100I and another opposite substrate (not drawn When the package structure is formed, the height Hs" of the fourth spacer 156 may correspond to the height of the internal space of the package structure, and the lateral gas barrier capability of the inner space of the package structure may be improved.

In the embodiment of FIGS. 4, 5 and 8 above, the first spacer 152 is The bottom organic layer 110 or the first organic layer 1301 (that is, the height Hs of the first spacer 152 may correspond to the thickness Tb of the bottom organic layer 110 or the thickness T1 of the first organic layer 1301) is taken as an example, but The invention is not limited thereto. In other embodiments, the first The spacers 152 may also be through at least one organic layer. In other words, the height Hs of the first spacer 152 may also be greater than the thickness Tb of the bottom organic layer 110 or the thickness T1 of the first organic layer 1301.

Figure 11 is a cross-sectional view showing the structure of a substrate in accordance with an eleventh embodiment of the present invention. The embodiment of FIG. 11 is similar to the structure and manufacturing method of the embodiment of FIG. 4 described above, and thus the same or similar elements are denoted by the same or similar symbols, and the description thereof will not be repeated. The embodiment of FIG. 11 is different from the embodiment of FIG. 4 described above in that, in the substrate structure 100J, at least one first spacer 152 protrudes from the upper surface 110a of the bottom organic layer 110, and the first spacer 152 The height Hs is greater than the thickness Tb of the bottom organic layer 110. Furthermore, the first inorganic layer 1201 covers the bottom organic layer 110, the protrusions 140, and a portion of the surface of the first spacer 152 protruding from the upper surface 110a. The first organic layer 1301 is formed over the first inorganic layer 1201.

In the present embodiment, the first spacer 152 is disposed adjacent to the sidewall 110b of the bottom organic layer 110 and protrudes from the upper surface 110a of the bottom organic layer 110, and thus the sidewall 110b of the bottom organic layer 110 and the first organic layer 1301 The sidewall 1301b may be protected by the first spacer 152 to prevent water oxygen from penetrating from the side to the bottom organic layer 110 and the first organic layer 1301, thereby improving the lateral resistance of the bottom organic layer 110 and the first organic layer 1301. Gas ability. However, the present invention is not limited thereto. In other embodiments, the cross section of the first spacer 152 may have a rectangular shape, a trapezoidal shape, or other suitable shape as long as water oxygen can be prevented from laterally penetrating to the bottom organic layer 110 and the first organic Layer 1301 can be.

Figure 12 is a cross-sectional view showing the structure of a substrate in accordance with a twelfth embodiment of the present invention. intention. The embodiment of Fig. 12 is similar to the structure and the manufacturing method of the embodiment of Fig. 11 described above, and therefore the same or similar elements are denoted by the same or similar symbols, and the description thereof will not be repeated. The embodiment of FIG. 12 differs from the embodiment of FIG. 11 described above in that the substrate structure 100K further includes a second inorganic layer 1202. The second inorganic layer 1202 covers the upper surface 1301a of the first organic layer 1301. In more detail, in the substrate structure 100K, at least one first spacer 152 protrudes from the upper surface 110a of the bottom organic layer 110, and the height Hs of the first spacer 152 is greater than the thickness Tb of the bottom organic layer 110. Furthermore, the first inorganic layer 1201 covers the bottom organic layer 110, the protrusions 140, and a portion of the surface of the first spacer 152 protruding from the upper surface 110a. The first organic layer 1301 is formed over the first inorganic layer 1201. The second inorganic layer 1202 covers the upper surface 1301a of the first organic layer 1301, and the second inorganic layer 1202 has a flat upper surface 1202a. However, the present invention is not limited thereto. In other embodiments (not shown), at least one first spacer 152 may protrude from the upper surface 1301a of the first organic layer 1301, and the height of the first spacer 152 may be Hs is greater than the thickness T1 of the first organic layer 1301. Furthermore, the second inorganic layer 1202 covers the first organic layer 1301 and a portion of the surface of the first spacer 152 protruding from the upper surface 1301a.

Figure 13 is a cross-sectional view showing the structure of a substrate in accordance with a thirteenth embodiment of the present invention. intention. The embodiment of Fig. 13 is similar to the structure and manufacturing method of the embodiment of Fig. 12 described above, and therefore the same or similar elements are designated by the same or similar symbols, and the description thereof will not be repeated. The embodiment of FIG. 13 is different from the embodiment of FIG. 12 described above in that the substrate structure 100L further includes at least a fourth spacer 156. The fourth spacer 156 is located on the upper surface of the substrate structure 100L (for example, the upper surface 1202a of the second inorganic layer 1202) The height of the fourth spacer 156 is Hs". In the embodiment, the fourth spacer 156 is disposed adjacent to the sidewall 1202b of the second inorganic layer 1202, wherein the fourth spacer 156 can be continuous and The closed annular structure or the discontinuous segment structure surrounds the sidewall 1202b of the second inorganic layer 1202. Therefore, when the substrate structure 100L and another opposite substrate (not shown) constitute a package structure, the fourth spacer 156 The height Hs" may correspond to the height of the inner space of the package structure and may improve the lateral gas barrier capability of the inner space of the package structure.

14 is a cross-sectional view of a package structure in accordance with an embodiment of the present invention. Referring to FIG. 14, the package structure 200A is, for example, a package structure of an organic light emitting device (OLED) or other suitable components. Hereinafter, a package structure in which the package structure 200A is an organic electroluminescence element will be described as an example. The package structure 200A includes at least a first substrate 210, an organic electroluminescent element 212, and a second substrate 220.

The first substrate 210 is disposed opposite to the second substrate 220. First substrate 210 Or at least one of the second substrates 220 has one of the above-described substrate structures 100A to 100L.

The organic electroluminescent element 212 is disposed on the first substrate 210 and the second substrate Between 220. In the present embodiment, the organic electroluminescent device 212 is disposed on the first substrate 210, for example, but the invention is not limited thereto. In other embodiments, the organic electroluminescent device 212 may be disposed at any position of the internal space R of the package structure 200A. The organic electroluminescent device 212 is, for example, an active organic electroluminescent device or a passive organic electroluminescent device, wherein the active organic electroluminescent device or passive The organic electroluminescent device can be further subdivided into, for example, a lower emission type organic electroluminescence element or an upper emission type organic electroluminescence element, and the organic electroluminescence element 212 can be a display or a side light source or the like.

For example, as shown in FIGS. 15A and 15B, the first substrate 210 is, for example, The bottom organic layer 110, the inorganic layer 120, the organic layer 130, the at least one first spacer 152, and the at least one second spacer 154, and the organic electroluminescent device 212 is, for example, a third inorganic component disposed on the first substrate 210. On the upper surface 1203a of layer 1203. As shown in FIG. 15A, when the organic electroluminescent device 212 is a lower-emitting organic electroluminescent device, the organic electroluminescent device 212 is not disposed overlapped with the first spacer 152 or the second spacer 154 (for example, the first gap) The object 152 or the second spacer 154 may be disposed around the periphery of the organic electroluminescent element 212 to prevent the light emitted by the organic electroluminescent element 212 from being obscured by the spacer. Conversely, as shown in FIG. 15B, when the organic electroluminescent device 212 is an upper-emission type organic electroluminescent device, the organic electroluminescent device 212 may be disposed overlapping the first spacer 152 or the second spacer 154 (for example, The organic electroluminescent element 212 can be disposed over a range having the first spacer 152 or the second spacer 154). However, the present invention is not limited thereto, and in other embodiments, the arrangement of the spacers may also be any combination of the above-described embodiments of FIGS. 4 to 13.

Referring to FIG. 14 again, in the embodiment, the package structure 200A is, for example, More includes the frame glue 230. The sealant 230 is disposed between the first substrate 210 and the second substrate 220. The first substrate 210 and the second substrate 220 may be joined by the sealant 230. In other embodiments, the sealant 230 may also be replaced with a fusion glue (such as a glass bond) or other suitable adhesive layer, or in combination. In addition, the substrate structure of FIG. 7 is used. When 100G, the substrate structure 100H of FIG. 8, the substrate structure 100I of FIG. 10, or the substrate structure 100L of FIG. 13 as the first substrate 210, the fourth spacers 156 may contribute to the lateral gas barrier capability of the package structure 200A. However, the present invention is not limited thereto. In other embodiments, the fourth spacer 156 may also be a continuous and closed annular structure or a discontinuous segment structure. The fourth spacer 156 can be disposed between the first substrate 210 and the second substrate 220, and the fourth spacer 156 on the first substrate 210 can be replaced by an adhesive layer (not shown). The two substrates 220 are joined.

In the embodiment of FIG. 14 described above, the package structure 200A further includes the frame glue 230 as an example, but the invention is not limited thereto. In other embodiments, other suitable package structures are also possible.

16 to 19 are package structures according to other embodiments of the present invention, respectively. Schematic diagram of the section. The embodiment of FIGS. 16 to 19 is similar to the structure of the embodiment of FIG. 14 described above, and thus the same or similar elements are denoted by the same or similar symbols, and the description thereof will not be repeated. The embodiment of Figures 16 through 19 differs from the embodiment of Figure 14 above in that the package structure is different.

Referring to FIG. 16 , the package structure 200B includes a first substrate 210 , an organic electroluminescent device 212 , a second substrate 220 , a protective layer 240 , and a glue 250 . The protective layer 240 covers the first substrate 210 and the organic electroluminescent device 212 , and the protective layer 240 is located between the first substrate 210 and the second substrate 220 . The material of the protective layer 240 may be, for example, an inorganic material, an organic material, or other suitable material. Inorganic materials include cerium oxide, cerium nitride, cerium oxynitride, aluminum oxide, aluminum or other suitable inorganic gas barrier materials. The glue 250 is disposed between the first substrate 210 and the second substrate 220 to enable A substrate 210 and the second substrate 220 may be joined by a glue 250. In other embodiments, the glue 250 may also be replaced with a fusion glue (such as a glass bond) or other suitable adhesive layer, or in combination.

Referring to FIG. 17, the package structure 200C includes a first substrate 210 and an organic battery. The light-emitting element 212, the second substrate 220, the at least one fourth spacer 156, and the protective layer 240 are provided. For example, when the substrate structure 100G of FIG. 7, the substrate structure 100H of FIG. 8, the substrate structure 100I of FIG. 10, or the substrate structure 100L of FIG. 13 is used as the first substrate 210, the fourth spacers 156 may contribute to the lifting of the package structure 200C. Lateral gas barrier capability. However, the present invention is not limited thereto. In other embodiments, the fourth spacer 156 may also be a continuous and closed annular structure or a discontinuous segment structure. Furthermore, the protective layer 240 covers the first substrate 210, the organic electroluminescent device 212, and the fourth spacer 156, and the protective layer 240 is located between the first substrate 210 and the second substrate 220. In addition, in the embodiment, the first substrate 210 and the second substrate 220 can be joined by an adhesive layer (not shown).

Referring to FIG. 18, the package structure 200D is different from the package structure 200C. The package structure 200D further includes a getter 260. The getter 260 is located between the first substrate 210 and the second substrate 220. The getter 260 is used to maintain a vacuum inside the element and is capable of adsorbing a portion of the gas molecules. The getter 260 may include a non-evaporable getter, an evapotranspiration getter, or a combination thereof.

Referring to FIG. 19, the package structure 200E includes a first substrate 210 and an organic battery. The light-emitting element 212, the second substrate 220, the protective layer 240, and the gas barrier film 270 are provided. The protective layer 240 covers the first substrate 210 and the organic electroluminescent element 212, and the protective layer The 240 is located between the first substrate 210 and the second substrate 220. The gas barrier film 270 covers a portion of the upper surface 200a of the package structure 200E, the entire side surface 200b, and a portion of the lower surface 200c. The gas barrier film 270 is, for example, a metal foil, a plastic gas barrier film, or other suitable outer (package) gas barrier film. In addition, in the embodiment, the first substrate 210 and the second substrate 220 can be joined by an adhesive layer (not shown).

In the present embodiment, the gas barrier substrate (shown as the substrate structures 100A to 100L) having a good gas barrier capability is used to encapsulate the organic electroluminescent device 212, thereby blocking the penetration of moisture and oxygen to avoid organic electricity. The excitation light element 212 is deteriorated to cause a problem of shortened lifetime, so that the organic electroluminescence element 212 can have good reliability.

In the substrate structure of an embodiment of the present invention, due to T (thickness of each layer of organic layers) 1.1H (the raised height of the protrusion on the previous organic layer) or T1 (the thickness of the previous organic layer) T2 (thickness of each layer of organic layer), so the thickness of each layer of the organic layer can cover and flatten the protrusion on the previous layer of the organic layer, so that the upper surface of the substrate structure is relatively flat, thereby improving the gas barrier of the substrate structure (including water) Gas and oxygen) characteristics. In an embodiment, the organic layer may be made of a material that is resistant to temperature so that the high temperature resistant organic layer has a relatively flat upper surface (because of no bubble formation), thereby avoiding the inorganic layer formed thereon. The thickness is not uniform, the upper surface is not flat, and the film layer is discontinuous (such as breaking), which in turn allows the substrate structure to have better gas barrier properties and flexural properties.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art without departing from the invention. In the spirit and scope, the scope of protection of the present invention is subject to the definition of the appended patent application.

100A‧‧‧Substrate structure

110‧‧‧ bottom organic layer

110a, 1301a, 1302a‧‧‧ upper surface

120‧‧‧Inorganic layer

130‧‧‧Organic layer

140, 140’‧‧‧ Protrusions

1201‧‧‧First inorganic layer

1202‧‧‧Second inorganic layer

1301‧‧‧First organic layer

1302‧‧‧Second organic layer

D, D’‧‧‧Maximum depth

H, H’‧‧‧Maximum height

T1, T2, Tb‧‧‧ thickness

Tt‧‧‧ total thickness

Claims (30)

A substrate structure comprising: a bottom organic layer; at least one inorganic layer; at least one organic layer; and at least one protrusion protruding from the bottom organic layer or the upper surface of the organic layer, the at least one protrusion The maximum height of the bottom surface of the bottom organic layer or the organic layer is H, and the thickness of the organic layer covering the at least one protrusion is T, wherein T 1.1H. The substrate structure according to claim 1, wherein the at least one organic layer is in a plurality of layers, and at least two of the layers have different thicknesses. The substrate structure according to claim 1, wherein the at least one organic layer is in a plurality of layers, and at least two of the layers have different areas. The substrate structure according to claim 1, wherein the total thickness of the substrate structure is 5 to 50 μm. The substrate structure of claim 1, further comprising at least one first spacer, at least one second spacer or at least one third spacer, wherein the first spacer and the second spacer are located at the bottom In at least one of the organic layer and the organic layer, the third spacer is located on an upper surface of the substrate structure, wherein the first spacer is disposed adjacent to the at least one of the bottom organic layer and the organic layer At one side wall. The substrate structure of claim 5, wherein the height of the first spacer and the second spacer corresponds to a thickness of the at least one of the bottom organic layer and the organic layer. The substrate structure of claim 5, wherein the first spacer protrudes from an upper surface of the at least one of the bottom organic layer and the organic layer, and the height of the first spacer is greater than the a thickness of the at least one of the bottom organic layer and the organic layer. The substrate structure of claim 7, wherein the inorganic layer conformally covers the at least one of the bottom organic layer and the organic layer, the protrusion, and the first spacer are convex from the upper surface Part of the surface. The substrate structure according to claim 5, wherein the material of the first spacer, the second spacer or the third spacer comprises an inorganic material, an organic material, a metal composite material, a non-metal composite material, a metal Material or a combination thereof. The substrate structure of claim 1, further comprising a plurality of fourth spacers, wherein the fourth spacers are located in at least one of the bottom organic layer and the organic layer. The substrate structure of claim 10, wherein the height of each of the fourth spacers is equal to or less than a thickness of the at least one of the bottom organic layer and the organic layer. The substrate structure according to claim 10, wherein the materials of the fourth spacers comprise an inorganic material, an organic material, a metal material or a combination thereof. The substrate structure according to claim 1, wherein the material of the bottom organic layer comprises polyiminamide (PI), polycarbonate (PC), polyether oxime (PES), polynorbornene (PNB). Polyetherimine (PEI), polyethylene isophthalate (PEN), polyethylene terephthalate (PET) and polymethyl methacrylate (PMMA). The substrate structure according to claim 1, wherein the material of the organic layer comprises polybenzamine (PI), polycarbonate (PC), polyether oxime (PES), polynorbornene (PNB), Polyetherimine (PEI), polyethylene isophthalate (PEN), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polytetrafluoroethylene (PTFE) , parylene series of materials and fluorocarbons (PFCs). The substrate structure of claim 1, wherein the at least one protrusion is embedded in the bottom organic layer or the organic layer has a maximum depth of D, and D (1/4) (H+D). The substrate structure of claim 1, wherein the material of the bottom organic layer is the same as the material of at least one of the organic layers. A substrate structure comprising: a bottom organic layer; at least one inorganic layer; and a plurality of organic layers, the organic layers and the inorganic layer being alternately stacked on the bottom organic layer, wherein the organic layers comprise a first organic layer And a second organic layer, the first organic layer is adjacent to the bottom organic layer opposite to the second organic layer, the second organic layer is away from the bottom organic layer relative to the first organic layer, and the first organic layer is The thickness is T1, and the thickness of the second organic layer is T2, wherein T1 T2. The substrate structure of claim 17, wherein an area of the first organic layer is different from an area of the second organic layer. The substrate structure according to claim 17, wherein the total thickness of the substrate structure is 5 to 50 μm. The substrate structure of claim 17, further comprising at least one first spacer, at least one second spacer or at least one third spacer, wherein the first spacer and the second spacer are located at the bottom In at least one of the organic layer and the organic layers, the third spacer is located on an upper surface of the substrate structure, wherein the first spacer is disposed adjacent to the at least one of the bottom organic layer and the organic layers At one side of the wall. The substrate structure of claim 20, wherein a height of the first spacer and the second spacer corresponds to a thickness of the at least one of the bottom organic layer and the organic layers. The substrate structure of claim 20, wherein the first spacer protrudes from an upper surface of the bottom organic layer and the at least one of the organic layers, and the height of the first spacer is greater than a thickness of the bottom organic layer and the at least one of the organic layers. The substrate structure of claim 22, wherein the inorganic layer conformally covers the at least one of the bottom organic layer and the organic layers, the protrusions, and the first spacer from the upper surface a convex part of the surface. The substrate structure according to claim 20, wherein the material of the first spacer, the second spacer or the third spacer comprises an inorganic material, an organic material, a metal composite material, a non-metal composite material, a metal Material or a combination thereof. The substrate structure of claim 17, further comprising a plurality of fourth spacers, wherein the fourth spacers are located in at least one of the bottom organic layer and the organic layers. The substrate structure of claim 25, wherein the height of each of the fourth spacers is equal to or less than a thickness of the at least one of the bottom organic layer and the organic layers. The substrate structure according to claim 25, wherein the materials of the fourth spacers comprise an inorganic material, an organic material, a metal material or a combination thereof. The substrate structure according to claim 17, wherein the material of the bottom organic layer comprises polyiminamide (PI), polycarbonate (PC), polyether oxime (PES), polynorbornene (PNB). Polyetherimine (PEI), polyethylene isophthalate (PEN), polyethylene terephthalate (PET) and polymethyl methacrylate (PMMA). The substrate structure according to claim 17, wherein the materials of the organic layer comprise polyiminamide (PI), polycarbonate (PC), polyether oxime (PES), polynorbornene (PNB). , polyether phthalimide (PEI), polyethylene isophthalate (PEN), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polytetrafluoroethylene (PTFE) ), parylene series materials and fluorocarbons (PFCs). The substrate structure of claim 17, wherein the bottom organic layer material is the same as the material of at least one of the organic layers.