TW201437710A - Camera module and manufacturing method thereof - Google Patents

Abstract

A camera module and a manufacturing method for making the camera module are provided. The camera module includes a lens barrel, a pair of lens, a filter, a ceramic substrate and photoelectric sensor. The pair of lens is fixed in the lens barrel, and a through hole is set in the ceramic substrate. The photosensitive surface is in the face of the through hole. The filter is adhered on the ceramic substrate by UV glue and covers the through hole. A predetermined location around the through hole is not coated with UV glue to leave an opening between the filer an the ceramic substrate as a spillover passage of air between the filter and the ceramic substrate, thereby, to avoid the filter shifted or tilted by the escaped air between the filter and the ceramic substrate when the UV glue is irradiated by ultraviolet.

Description

Camera module and manufacturing method thereof

The invention relates to a camera module and a method of manufacturing the same.

At present, portable consumer electronic devices, such as mobile phones, tablet computers, notebooks, etc., are becoming more and more light and thin, and the flip chip package structure camera module is designed to be light and thin in the future. In the prior art, a blue filter is directly bonded to a ceramic substrate by coating a ring of shadowless glue on a ceramic substrate, but blue is generated when the air between the ceramic substrate and the filter is thermally expanded during baking. The problem of tilting or shifting the filter affects the quality of the camera module and even causes the product to be scrapped.

In view of this, the present invention provides a camera module and a method of manufacturing the same to solve the above problems.

A camera module includes a lens barrel, a lens group, a filter, a ceramic substrate and a photosensitive component, wherein the lens group is fixed in the lens barrel, and a through hole is arranged on the ceramic substrate, and the photosensitive surface of the photosensitive component faces the a through hole, the filter is adhered to the ceramic substrate by a shadowless adhesive, and the shadowless adhesive is coated on the periphery of the through hole on the ceramic substrate, and the shadowless adhesive is not applied at a specified position. An opening is formed between the ceramic substrate and the filter.

A camera module manufacturing method for manufacturing the above camera module comprises the following steps:

Applying a shadowless glue to the periphery of the through hole of the ceramic substrate, wherein the specified position of the periphery of the through hole is not coated with a shadowless glue to form an opening between the filter and the ceramic substrate;

Attaching a filter to the shadowless glue around the through hole, covering the through hole, baking with an ultraviolet light source, and fixing the filter to the ceramic substrate;

The filter, the ceramic substrate, and the photosensitive element subjected to the above treatment are assembled with the lens barrel and the lens group.

The invention avoids the problem that the filter is inclined or offset during ultraviolet baking by leaving an opening when the filter is adhered to the ceramic substrate by using the shadowless glue, and further, the filter and the ceramic substrate are firmly adhered. Thereafter, the opening is closed by applying a thermosetting glue at the remaining opening to prevent dust from entering the image sensing area from the opening, thereby ensuring the quality of the camera module and improving the product yield.

1. . . Camera module

10. . . Lens barrel

11. . . Lens group

12. . . Filter

13. . . Ceramic substrate

131. . . Through hole

132. . . Opening

14. . . Photosensitive component

15. . . Shadowless glue

16. . . Thermosetting glue

1 is a cross-sectional view of a camera module in accordance with an embodiment of the present invention.

2 is a schematic view of the shadowless coating of the camera module shown in FIG. 1.

FIG. 3 is a flowchart of a method for manufacturing a camera module according to an embodiment of the present invention.

Please refer to FIG. 1 and FIG. 2 together. FIG. 1 is a cross-sectional view of a camera module according to an embodiment of the present invention. The camera module 1 includes a lens barrel 10, a lens group 11, a filter 12, a ceramic substrate 13, and a photosensitive member 14. The ceramic substrate 13 is provided with a through hole 131. The through hole 131 is aligned with the lens barrel 10. The photosensitive surface of the photosensitive member 14 faces the through hole 131. The filter 12 is a blue filter and passes through the shadowless adhesive. (See FIG. 2) directly adhered to the ceramic substrate 13, covering the through hole 131, wherein the shadowless adhesive 15 is coated on the periphery of the through hole 131. In order to prevent the filter 12 from being displaced or tilted due to thermal expansion of the air between the filter 12 and the ceramic substrate 13 when ultraviolet baking is used, a position at the periphery of the through hole 131 is applied when the shadowless adhesive 15 is applied. The shadowless glue 15 is not applied, so that an opening 132 (see FIG. 2) is formed between the filter 12 and the ceramic substrate 13, and the opening 132 serves as a passage for air overflow between the filter 12 and the ceramic substrate 13. Thereby, it is possible to avoid the problem that the filter 12 is deflected or tilted by the push of the heat-expanded air when the ultraviolet-ray baking shadowless rubber 15 is performed.

In the present embodiment, the length of the opening 132 is between 0.15 mm and 1.9 mm.

FIG. 2 is a schematic view showing the coating of the shadowless adhesive 15 of the camera module shown in FIG. 1. Further, after the filter 12 and the ceramic substrate 13 are firmly adhered together, the image quality of the camera module 1 is affected to prevent the dust from entering the image sensing area between the filter 12 and the ceramic substrate 13 from the opening 132. The present invention also closes the opening 132 by applying a thermoset 16 at the opening 132 to prevent dust from entering the image sensing area. Wherein, to facilitate application of the thermoset glue 16 at the opening 132, the opening 132 can remain in a designated position to facilitate the application of the thermoset glue 16.

Please refer to FIG. 2 and FIG. 3 together. FIG. 3 is a flowchart of a method for manufacturing a camera module according to the present invention, which includes the following steps:

S201: Applying a shadowless adhesive 15 to the periphery of the through hole 131 of the ceramic substrate 13, wherein the shadowless adhesive 15 is not applied at a predetermined position around the through hole 131 to form an opening between the filter 12 and the ceramic substrate 13. 132;

S202: attaching the filter 12 to the shadowless glue around the through hole 131, covering the through hole 131, baking with an ultraviolet light source, and firmly bonding the filter 12 to the ceramic substrate 13;

S203: after the filter 12 is firmly adhered to the ceramic substrate 13, the thermosetting glue 16 is coated at the opening 132 to close the opening 132;

S204: The filter 12, the ceramic substrate 13, and the photosensitive element 14 subjected to the above processing are assembled with the lens barrel 10 and the lens group 11.

It is to be understood that the above-described embodiments are merely illustrative of the invention and are not intended to limit the invention. Variations made by the person skilled in the art in the corresponding technical field in accordance with the invention are within the scope of protection of the invention.

12. . . Filter

13. . . Ceramic substrate

131. . . Filter hole

132. . . Opening

15. . . Shadowless glue

16. . . Thermosetting glue

Claims (6)

A camera module includes a lens barrel, a lens group, a filter, a ceramic substrate and a photosensitive component, wherein the lens group is fixed in the lens barrel, and a through hole is arranged on the ceramic substrate, and the photosensitive surface of the photosensitive component faces the The through hole is improved in that the filter is adhered to the ceramic substrate by a shadowless adhesive to cover the through hole, wherein the shadowless adhesive is coated on the periphery of the through hole on the ceramic substrate, not at a specified position. The shadowless glue is applied to form an opening between the ceramic substrate and the filter. The camera module of claim 1, wherein after the filter and the ceramic substrate are firmly adhered together, the opening is closed by applying a thermosetting glue to the opening. The camera module of claim 1, wherein the opening has a length of between 0.15 mm and 1.9 mm. A camera module manufacturing method for manufacturing the camera module according to the first aspect of the patent application, the improvement comprising the steps of:
Applying a shadowless glue to the periphery of the through hole of the ceramic substrate, wherein the specified position of the periphery of the through hole is not coated with a shadowless glue to form an opening between the filter and the ceramic substrate;
Attaching a filter to the shadowless glue around the through hole, covering the through hole, and baking with an ultraviolet light source, so that the filter is firmly adhered to the ceramic substrate;
The filter, the ceramic substrate, and the photosensitive element subjected to the above treatment are assembled with the lens barrel and the lens group. The method for manufacturing a camera module according to the fourth aspect of the invention, further comprising the step of: after the filter is firmly adhered to the ceramic substrate, applying a thermosetting glue to the opening to close the opening. The method of manufacturing a camera module according to the fourth aspect of the invention, wherein the length of the opening is between 0.15 mm and 1.9 mm.