TW201400818A - Probe space transformation module and the manufacturing method thereof - Google Patents

Abstract

Disclosed are a probe space transformation module and the manufacturing method thereof. It is mounted between a circuit board and multiple probes. The probe space transformation module has a rigid body composed of an upper plate, a lower plate, and a frame. Multiple conductors are provided in the rigid body. Intervals between each the conductor penetrating the upper plate are larger than intervals between each the conductor penetrating the lower plate. Thereby, it can be applied on electronic article to be tested with a small interval between test points so that needle point of multiple probes can be maintained on the same plane.

Description

Probe space conversion module and manufacturing method thereof

The present invention relates to a probe card, and more particularly to a probe space conversion module and a method of fabricating the same.

Pressing, the probe card is used as a test signal transmission interface between a test machine and an electronic object to be tested. However, in the trend that the design of electronic products is becoming increasingly miniaturized, and the use of functions is gradually increasing, the known probe card structure is often difficult to apply due to the smaller and smaller test point pitch of the electronic object to be tested. Especially when the electronic object to be tested is a wafer, not only because of the small spacing of the test points, but also with the enlargement of its area (such as twelve-inch ultra-large wafers), the structure of the probe card is forced to relatively adjust, however, The probe card is susceptible to bending due to its board being enlarged and carrying too many probes.

Although some manufacturers have proposed a new patent of the "Circuit Test Probe Card and Its Probe Substrate Structure" of China Announcement No. M423836, a plurality of wires are used in a substrate body, and the wires are exposed on the upper surface of the substrate body. The spacing is greater than the distance between the wires exposed to the lower surface of the substrate body. This patented technology allows the probe card to be used for electronic object detection with a small test point spacing. However, the structure still has some imperfections. For example, when the wire passes through the upper and lower openings of the substrate body, it is susceptible to other processes (such as the solidification of the filling compound inside the substrate body) and slightly deviates from the original position. Situation, this situation will be detrimental to the ends of the wire Do not align the contacts and probes on the board, and even cause poor electrical connections.

In view of the above, the main object of the present invention is to provide a probe space conversion module, which can ensure good electrical connection line contact, and can make the probe card suitable for detecting an electronic object to be tested with a small test point spacing, and The tip of most probes can be maintained in the same plane.

In order to achieve the above object, the probe space conversion module provided by the present invention comprises an upper plate, a lower plate, a supporting structure and a plurality of conductors. Wherein, the upper plate has a plurality of upper perforations, and one side surface thereof is provided with a glue layer; the lower plate has a plurality of lower perforations, and the distance between adjacent lower perforations is smaller than the spacing of adjacent upper perforations of the upper plate, the lower plate One of the side surfaces is also provided with a glue layer; the support structure is for maintaining the upper plate and the lower plate at a fixed distance; the guiding systems are disposed between the upper plate and the lower plate without contacting each other, and the conductors There are two ends, and each of them passes through a corresponding upper perforation and a corresponding lower perforation, and penetrates the glue layer.

The present invention further provides a method for fabricating a probe space conversion module, comprising the steps of: a) piercing one end of a plurality of conductors with a plurality of lower perforations; b) coating a non-conductive material under the coating The outer surface of the board is cured and formed into a glue layer; c) the other end of the plurality of conductors is respectively pierced with a plurality of upper perforations of the upper plate; d) the non-conductive rubber is coated on the outer surface of the upper plate, And solidified to form a glue layer.

Thereby, a good electrical connection between the probe card and the electronic object to be tested is maintained. The probe card can be used to detect electronic objects to be tested with a small distance between test points, and to make the tips of most probes maintain the same plane.

In order that the present invention may be more clearly described, the preferred embodiments are illustrated in the accompanying drawings.

1 shows a probe space conversion module 10 according to a first preferred embodiment of the present invention, which includes an upper plate 12, a lower plate 14, a support structure, a plurality of conductors 18, and an align film 20 a film 22, a second layer 26, 28, a plurality of pads 30 and an upper and lower insulating layers 32, 34, wherein: The upper plate 12 has a plurality of upper perforations 12a; the lower plate 14 has a plurality of lower perforations 14a, and the distance between adjacent lower perforations 14a of the lower plate 14 is smaller than the spacing of adjacent upper perforations 12a of the upper plate 12.

In the present embodiment, the support structure is an outer frame 16 surrounding the upper edge of the upper plate 12 and the lower plate 14. The outer frame 16 maintains a fixed distance between the upper plate 12 and the lower plate 14. In particular, the top edge of the outer frame 16 and its bottom edge protrude from the outer surfaces of the upper plate 12 and the lower plate 14, respectively. In other words, the protruding portion of the outer frame 16 surrounds a space.

The conductors 18 are of an elongated structure such as a thin needle or a thin wire. The conductors 18 are disposed between the upper plate 12 and the lower plate 14 in a non-contact manner, because the spacing of the upper perforations 12a of the upper plate 12 is made larger than the spacing of the lower perforations 14a of the lower plate 14. Therefore, each conductor 18 of this embodiment has an upturn The folded portion 18a and the lower turning portion 18b are such that both ends thereof can smoothly pass through a corresponding upper through hole 12a and a corresponding lower through hole 14a.

The stabilizing thin layer 20 has a non-conducting property that is fixedly disposed between the upper plate 12 and the lower plate 14 and passes through the conductors 18. The stabilizing thin layer 20 helps maintain the spacing of the conductors 18 to ensure that the conductors 18 do not contact each other. The stabilizing sheet 20 is provided or not provided as needed.

In the present embodiment, the film 22 is exemplified by the inner surface of the lower plate 14 , and the film 22 covers the lower turning portion 18 b of the conductors 18 , and has the effect of stabilizing the conductor 18 . Of course, it is also possible to select a film on the inner surface of the upper plate 12 to stabilize the upper turning portion 18a of the conductor 18. Preferably, the film 22 is poured into the reserved hole 24a of a fixing plate 24 and solidified by curing.

The two adhesive layers 26, 28 are respectively disposed on the outer surface of the upper plate 12 and the outer surface of the lower plate 14, and are located in a space surrounded by the top and bottom edges of the outer frame 16, preferably, the two glues The layers 26, 28 are flush with the top and bottom edges of the outer frame 16. The two adhesive layers 26, 28 also have non-conductive properties and are individually threaded out at both ends of the conductors 18. Each of the glue layers 26, 28 has a stabilizing conductor 18 to prevent sloshing.

The pads 30 are disposed on the surface of the two adhesive layers 26, 28 and are electrically connected to both ends of a corresponding conductor 18.

The upper and lower insulating layers 32, 34 are an insulating varnish (green lacquer or ink; Solder Mask or Solder Resist) coated on the surface of the two adhesive layers 26, 28 and cured, and the insulating layers do not cover the insulating layers. The surface of the pad 30.

The above is the description of the structure of each part of the probe space conversion module 10 of the present embodiment. The following is a brief description of the manufacturing method thereof. Please refer to FIG. 2 and FIG. 3 . In FIG. 3( a ), it is disclosed that one end of the conductor 18 is respectively threaded through a plurality of lower perforations 14 a of the lower plate 14 , and An outer side of the board 14 is provided with a positioning film 15 as an example, but not limited thereto. One end of each conductor 18 passes through the positioning film 15; then, as shown in FIG. 3(b), the coating is not conductive. The adhesive is applied to the outer surface of the lower plate 14. At this time, the restraining restriction of the positioning film 15 prevents the rubber material from being baked and solidified to form the adhesive layer 28, causing the conductors 18 to deviate from the original position. The film 15 additionally has a function of finely adjusting the position of each conductor 18; thereafter, the positioning film 15 is removed, and the surface of the adhesive layer 28 is subjected to a grinding treatment to planarize the surface of the adhesive layer 28.

FIG. 3(c) discloses that a positioning film 13 is disposed on the outer side of the upper plate 12, and the positioning film 13 passes through the other end of the through hole 12a of the upper plate 12 through the conductor 18. The function of the positioning film 13 is as described above. I will not go into details here. Next, a non-conductive rubber is applied to the outer surface of the upper plate 12, and is cured to form the adhesive layer 26, and after the positioning film 13 is removed and surface-polished, the conductor 18 is disposed. Since the stable thin layer 20 is provided as needed, it will not be described here.

Moreover, the surface of the adhesive layer 26 and the adhesive layer 28 is flattened to control the thickness of the adhesive layer 26, 28 to meet the required height of the probe card for the entire card; Applied as MicroElectroMechanical System (MEMS) for each layer of the glue The solder pads 30 are formed on the flat surface, and each of the solder pads 30 is electrically connected to both ends of a corresponding conductor 18. The solder pad 30 has an effect of expanding the contact area; it is worth mentioning that the soldering is performed. The arrangement of the pads 30 is not necessary to correspond to both ends of each of the conductors 18, that is, the number of the pads 30 may be reduced, and may be provided at both ends of the conductor 18 at a specific position.

Moreover, in order to stabilize the solder pads 30, an insulating varnish (green lacquer or ink) is applied to the surface of each of the adhesive layers and filled between the solder pads 30, and the insulating varnish after drying is formed thereon. And the lower insulating layers 32, 34, and the surface of each of the pads 30 is not covered by the insulating varnish. The upper and lower insulating layers 32, 34 are not necessarily provided, and are mainly used to prevent a poor electrical connection between the pads 30, and thus may be set as the case may be.

The application of the probe space conversion module 10 is as follows: As shown in FIG. 4, a probe card 100 includes the probe space conversion module 10, a circuit board 36, and a plurality of probes. 38 and a probe stabilizer 40. The probe space conversion module 10 is mounted between the circuit board 36 and the probe stabilizer 40 for electrically connecting the probes 38 that are disposed in the probe stabilizer 40. A corresponding contact 36a to the lower surface of the circuit board 36. More specifically, each of the conductors 18 of the probe space conversion module 10 passes through one end of the upper plate 12, and is in contact with a corresponding contact 36a by a pad 30; each of the conductors 18 passes through the One end of the lower plate 14 is also in contact with one end of a corresponding probe 38 by a pad 30; and since each pad 30 is disposed on the surface of the flattened glue layer 26, 28, the pad 30 is Contact 36a, pad 30 and The probes 38 are indeed in contact to form a good electrical connection.

The probe space conversion module 10 can reduce the spacing between the probes 38, so that the probe card 100 is suitable for detecting an electronic object to be tested with a small test point spacing, especially when the upper plate 12 is perforated. When the lower perforation 14a of the lower plate 14 and the lower plate 14a of the lower plate 14 are formed by drilling, the pitch of each probe 38 can be further reduced to about 40 μm, so as to be suitable for more delicate and fine electronic objects to be tested. For testing.

The combination of the upper plate 12, the lower plate 14 and the outer frame 16 of the probe space conversion module 10 constitutes a rigid body, which can support not only the conductors 18 but also the bending deformation after the super load is applied. Make sure that the tips of the probes 38 attached to the underside are maintained in the same plane for good detection contact. In addition, the stable thin layer 20, the adhesive film 22 and the adhesive layers 26, 28 of the probe space conversion module 10 can stabilize the conductors 18 to ensure smooth detection signal transmission.

FIG. 5 shows a probe space conversion module 42 according to a second preferred embodiment of the present invention, which has the same components as the first embodiment described above, except that the support structure of the probe space conversion module 42 is further improved. The reinforcing ribs 44 are disposed between the upper plate 12 and the lower plate 14 so as not to interfere with the conductors 18, and the two ends of the reinforcing ribs 44 respectively abut the upper ribs 44. The inner surface of the plate 12 and the lower plate 14 is preferably fixed. The reinforcing ribs 44 have the effect of increasing the overall rigidity of the probe space conversion module 42.

FIG. 6 shows a probe space conversion module according to a third preferred embodiment of the present invention; 46, which is different from the first preferred embodiment in that the inner side of the lower plate 48 of the probe space conversion module 46 of the present embodiment does not have the structure of the fixed plate 24, but is modified to the outer surface of the lower plate 48. A fixing plate 50 is provided. The fixing plate 50 has a reserved hole 50a for the conductors 18 to pass through, and the film 50 is filled in the hole 50a. The foregoing manner can also stabilize the conductor 18.

FIG. 7 shows a probe space conversion module 54 according to a fourth preferred embodiment of the present invention, which is based on the probe space conversion module of the first preferred embodiment, except that: The upper plate 56 and the lower plate 58 of the probe space conversion module 54 of the present embodiment are made of a metal plate having conductivity, and the outer portion of each of the wires 60 is covered with an insulating film 62, wherein two of the insulating films 62 are The ends extend into the upper perforations 56a of the upper plate 56 and the lower perforations 58a of the lower plate 58, respectively, and the wires 60 are barely exposed only in portions of the adhesive layers 64, 66. The foregoing insulating film 62 structure ensures that each of the wires 60 does not electrically contact between the upper plate 56 and the lower plate 58.

The configuration of the probe space conversion module 68 of the fifth preferred embodiment of the present invention is substantially the same as that of the probe space conversion module 10, and the difference is only in the space conversion of the probe. The outer surface of the upper plate 12 of the module 68 is not coated with a non-conductive rubber (ie, without the adhesive layer 26), but a non-conductive rubber is applied to the inner surface of the upper plate 12 and is to be cured. Forming a glue layer 70, in this embodiment, as described above, in FIG. 3(a), one end of the conductor 18 is first threaded through a plurality of lower perforations 14a of the lower plate 14, and the lower plate 14 is Outside setting A positioning film having a positioning film 15 as an example but not limited thereto, one end of each conductor 18 is passed out of the positioning film 15; then, as shown in FIG. 3(b), a non-conductive rubber compound is coated. At the outer surface of the lower plate 14, at this time, the restraining restriction of the positioning film 15 prevents the rubber material from being baked and solidified to form the adhesive layer 28, causing the conductors 18 to deviate from the original position. The positioning film 15 has another The position of each conductor 18 is finely adjusted; thereafter, the positioning film 15 is removed, and the surface of the adhesive layer 28 is ground to planarize the surface of the adhesive layer 28.

However, in Fig. 3(c), it is not necessary to provide a positioning film 13 on the outer side of the upper plate 12, but the conductor 18 is directly passed through the perforation 12a above the upper plate 12. Then, a non-conductive rubber is applied to the inner surface of the upper plate 12, and the adhesive layer 70 is to be cured to form the same, which has the effect of the first preferred embodiment, but on the inner surface of the upper plate 12. The film is formed without the need for surface grinding, that is, surface flattening. Therefore, only the surface of the adhesive layer 28 is flattened; then, the MEMS technology is applied to make the pads 30 on the surface of the adhesive layer 28 and the outer surface of the upper plate 12, and each of the pads 30 The solder pad 30 is electrically connected to both ends of a corresponding conductor 18, and the manner and description of the solder pad 30 are the same as those of the first preferred embodiment, and therefore will not be described.

The above is only a few preferred embodiments of the present invention, and equivalent changes to the scope of the present invention and the scope of the patent application are intended to be included in the scope of the present invention.

100‧‧‧ probe card

10‧‧‧Probe space conversion module

12‧‧‧Upper board

12a‧‧‧Perforation

13‧‧‧ Positioning film

14‧‧‧ Lower board

14a‧‧‧ underperture

15‧‧‧Positioning film

16‧‧‧Front frame

18‧‧‧Conductor

18a‧‧‧Upturned section

18b‧‧‧Next turning

20‧‧‧Stable thin layer

22‧‧‧film

24‧‧‧ fixed board

24a‧‧‧Reserved holes

26‧‧‧ glue layer

28‧‧‧ glue layer

30‧‧‧ solder pads

32‧‧‧Upper insulation

34‧‧‧lower insulation

36‧‧‧Circuit board

36a‧‧‧Contacts

38‧‧‧Probe

40‧‧‧Probe Stabilizer

42‧‧‧Probe space conversion module

44‧‧‧ reinforcing ribs

46‧‧‧Probe space conversion module

48‧‧‧ Lower board

50‧‧‧ fixed board

50a‧‧‧Reserved holes

52‧‧‧film

54‧‧‧Probe space conversion module

56‧‧‧Upper board

56a‧‧‧perforation

58‧‧‧ Lower board

58a‧‧‧ underperture

60‧‧‧ wire

62‧‧‧Insulation film

64‧‧‧ glue layer

66‧‧‧ glue layer

68‧‧‧Probe space conversion module

70‧‧‧ glue layer

1 is a cross-sectional view of a probe space conversion module according to a first preferred embodiment of the present invention; FIG. 2 is a flowchart of a probe space conversion module according to the first preferred embodiment of the present invention; FIG. 4 is a schematic diagram of application of the probe space conversion module of FIG. 1; FIG. 5 is a schematic diagram of a probe space conversion module according to a second preferred embodiment of the present invention; Figure 6 is a cross-sectional view of a probe space conversion module according to a third preferred embodiment of the present invention; Figure 7 is a cross-sectional view of a probe space conversion module according to a fourth preferred embodiment of the present invention; A cross-sectional view of a probe space conversion module of a fifth preferred embodiment of the invention.

10‧‧‧Probe space conversion module

12‧‧‧Upper board

12a‧‧‧Perforation

14‧‧‧ Lower board

14a‧‧‧ underperture

16‧‧‧Front frame

18‧‧‧Conductor

18a‧‧‧Upturned section

18b‧‧‧Next turning

20‧‧‧Stable thin layer

22‧‧‧film

24‧‧‧ fixed board

24a‧‧‧Reserved holes

26‧‧‧ glue layer

28‧‧‧ glue layer

30‧‧‧ solder pads

32‧‧‧Upper insulation

34‧‧‧lower insulation

Claims (20)

A probe space conversion module includes: an upper plate having a plurality of upper perforations, and one side surface of the upper plate is provided with a glue layer; the lower plate has a plurality of lower perforations, and the distance between adjacent lower perforations Less than the spacing of adjacent upper perforations of the upper plate, one side surface of the lower plate is also provided with a glue layer; a support structure for keeping the upper plate and the lower plate at a fixed distance; and the plurality of conductors are not mutually The contact is disposed between the upper plate and the lower plate, and each of the conductors has two ends, and each of them passes through a corresponding upper perforation and a corresponding lower perforation, and penetrates the glue layer. The probe space conversion module of claim 1, wherein the outer surface of the upper plate is provided with the glue layer, and the outer surface of the lower plate is provided with the glue layer. The probe space conversion module of claim 2, wherein the support structure comprises an outer frame surrounding the upper plate and the lower plate, and a top edge and a bottom edge of the outer frame protrude from the upper plate and the outer frame The outer surface of the lower plate has the glue layer in the space surrounded by the outer frame. The probe space conversion module of claim 1, wherein the support structure comprises a plurality of reinforcing ribs, the reinforcing ribs being located between the upper plate and the lower plate, and the two ends of the reinforcing ribs are respectively connected to the upper portion The plate and the inner surface of the lower plate. The probe space conversion module of claim 1, comprising a stable thin layer between the upper plate and the lower plate and passing through the conductors. The probe space conversion module of claim 1, wherein the conductors have at least one turning segment, and the probe space conversion module further comprises at least one film, the glue The film is disposed on at least one inner surface of the upper plate and the lower plate, and the film covers the turning sections of the conductors. The probe space conversion module of claim 1, comprising a plurality of pads, wherein the pads are disposed on the surface of each glue layer, and are electrically connected to both ends of a corresponding conductor. The probe space conversion module of claim 7, further comprising an upper and lower insulating layer, wherein the upper insulating layer is disposed on a surface of the adhesive layer of the upper plate, and the lower insulating layer is disposed on a surface of the adhesive layer of the lower plate And each insulating layer does not cover the surface of the pad. The probe space conversion module of claim 1, wherein the upper plate and the lower plate are metal plates; each of the conductors is externally covered with an insulating film, and two ends of the insulating films respectively extend to the upper plate The perforations are in the lower perforations of the lower plate. A method for manufacturing a probe space conversion module comprises the steps of: a) piercing one end of a plurality of conductors with a plurality of lower perforations; b) coating a non-conductive material on the outer surface of the lower plate And curing to form a glue layer; c) passing the other end of the plurality of conductors through a plurality of upper perforations of the upper plate; and d) coating the non-conductive rubber on the outer surface of the upper plate and solidifying A layer of glue. The method for fabricating a probe space conversion module according to claim 10, wherein before step b), a positioning structure is disposed outside the lower plate, and the positioning structure is worn by one end of the conductor penetrating the lower plate. Over. The method for fabricating the probe space conversion module according to claim 11 is included in After removing the positioning structure, the surface of the glue layer of step b) is ground to planarize the surface of the glue layer. The method for fabricating a probe space conversion module according to claim 10, wherein before step d), a positioning structure is disposed outside the upper plate, and the positioning structure is worn by one end of the conductor penetrating the upper plate. Over. The method for fabricating the probe space conversion module according to claim 13, comprising: after removing the positioning structure, grinding the surface of the glue layer of step d) to planarize the surface of the glue layer. The method for fabricating a probe space conversion module according to claim 10, comprising applying a MEMS technology to form a plurality of pads on each surface of the glue layer, and each of the pads and a corresponding conductor Both ends are electrically connected. The method for fabricating a probe space conversion module according to claim 15, comprising applying an insulating varnish to the surface of each of the adhesive layers, and the insulating varnish does not cover the surface of the solder pad. A method for manufacturing a probe space conversion module comprises the steps of: a) piercing one end of a plurality of conductors with a plurality of lower perforations; b) coating a non-conductive material on the outer surface of the lower plate And curing to form a glue layer; c) passing the other end of the plurality of conductors through a plurality of upper perforations of the upper plate; and d) coating the non-conductive rubber on the inner surface of the upper plate and solidifying A layer of glue. The method for fabricating a probe space conversion module according to claim 17, wherein before step b), a positioning structure is disposed outside the lower plate, and the positioning structure is worn. The end of the conductor pierced under the lower plate is passed through. The method for fabricating a probe space conversion module according to claim 17, comprising: after removing the positioning structure, grinding the surface of the glue layer of step b) to planarize the surface of the glue layer. The method for fabricating a probe space conversion module according to claim 17, comprising applying a MEMS technology to form a plurality of pads on the surface of the glue layer of the step b) and the outer surface of the upper plate, and Each of the pads is electrically connected to both ends of a corresponding conductor.