TW201003078A - Probe testing device - Google Patents

Abstract

Disclosed is a probe testing device, by providing a height-booster plate between a circuit board and a space transforming plate. Plural probes are provided on the space transforming plate so that the fixed height between the surface of the circuit board and the tips of the probes can be overcome by means of the height-booster plate without the need of making an additional space transforming plate with a great thickness, thereby effectively reducing the difficulty and cost involved in manufacturing of this invention.

Description

201003078 IX. Description of the Invention: [Technical Field] The present invention relates to a probe testing device, and more particularly to a probe testing device which can effectively reduce manufacturing difficulty and manufacturing cost. 5 [Prior Art] Please refer to the conventional vertical probe card (1〇) shown in the first figure, which mainly includes a circuit board (12), and is disposed on the lower surface of the circuit board (10) (such as a space conversion board) (14) and a vertical probe set disposed on the space conversion plate 4), wherein the vertical probe set (16) has a guide plate (162) disposed on the space conversion plate (14), The guide plate (164) is connected to the upper and lower guide plates (i62, 16 between the partition plate (166) and a plurality of vertical probes (168) passing through the upper and lower guide plates (162, 164). Since the height of the lower surface of the circuit board (12) to the tip of the vertical probe (168) is often limited by the use environment of the test machine, the upper and lower guides can be targeted. (162, 164) height adjustment with the spacer (166), at the same time, the needle or tip of each vertical probe (168) can be further polished to facilitate high-level fine adjustment. However, both upper and lower guides The height adjustment of the plate (162, 164), the spacer plate (166) or the vertical probe (168), the adjustment results that can be obtained are quite limited. For example, for micro-exploration In terms of 20, 'increasing or decreasing 1mm is a serious impact on specifications and difficulty. On the other hand, the use of increasing the thickness of the space conversion plate (14,) to overcome the height limitation caused by the use environment of the test machine. However, if The material of the space conversion plate (14') is a multi-layered organic structure (Multi-Layered Organic, ML〇). At the time of manufacture, the polypropylene layer 4 201003078 (Potypn) Pylene 'PP) inside the multilayer organic substrate may be passed through Hot pressing treatment causes it to change into * The overall thickness of the layered organic substrate is difficult to control. As a result, there are technical difficulties and costs in producing a multilayer organic substrate having a high thickness. 'Another conventional probe card (10,) as shown in the circle, if the space conversion plate (h) uses Multi_Layered Ceramic (MLC), 15 is manufactured with many ceramic substrates A polypropylene layer is disposed on each of the two sides, and a copper piece is disposed in the middle of the adjacent ceramic substrate, and finally a plurality of the Tauman substrate and the copper piece are sintered one by one. However, after the money is sintered, the thickness of the polypropylene layer is also changed by heat. The multilayer ceramic is also a problem in that the overall thickness of the substrate is difficult to control. In addition, a ceramic substrate has a plurality of through holes, and the surface of each of the copper sheets is combined with a circuit corresponding to the through hole of the ceramic substrate. In order to make the multi-layer ceramic substrate have space-converting impurities, the spacing of the ceramic board that is closer to the circuit board is better than that of the near-synchronized substrate. After sintering, the size of each ceramic substrate and each copper sheet will inevitably be slightly changed, so that the through holes of the ceramic substrates and the four sides of each side are difficult to accurately align, resulting in a high-thickness multilayer. The ceramic substrate does not provide good function. Therefore, the residual high-thickness "plate" will also have considerable difficulty and cost. For example, the probe card assembly provided by the Patent No. 293938 of the Republic of China uses ten insertions with an elastic structure. The material is electrically contacted with the interval converter and the circuit board. If the height of the intermediate insert is changed to make the height of the shoulder of the height of 5 20 201003078, the insertion of the Yin will be pushed outwards and the elastic force will not be 1°. It is changed so that the board of the (4) shrinkage touch will be subjected to the elasticity to deform with the elasticity. Moreover, the exploration of this patent: the elastic force of the ^ is easy and if the probe is damaged, the spacer must be welded. In the interval change, the relative increase will be made. The state/probe--the same as the replacement, and the next step is the cutting of the 2-1 card and the road board. The probe is turned to the required height, and then the back is turned. (4) Converting between a number of hard printed circuit board stacks, but being cut off: printing:::=cutting as empty is passing-times indentation='=this'in addition' these printed circuit board heights are beneficial Carry out 1 /, so that the printed circuit boards only have - 15 under There is also no problem with the limitation of the condition of the object to be tested. The high content caused by the use environment of the domain [invention content] The main purpose of the present invention is to improve the M, pil q^ easy to make, and, to record, The problem of its system. Because of the high limit caused by the use environment of the 5th meeting, there is a Lei Zheng in the above-mentioned purpose: V, the probe test device provided by Feng Mingming Bao Xuan & two conversion boards, one high A vertical spot probe is located in the electric ^ mU 'private needle set. The circuit board and the touch panel are electrically connected to the conversion board; the vertical probe set There are several 20 201003078 vertical probes electrically connected to the air domain change plate. In an embodiment of the invention, the high plate is rigid, so as to perform a secondary freshening operation 7; =;: box, In order to fix the height plate, the high plate is kept in good electrical contact with the "hai circuit board. Thereby, the invention utilizes the design of the high plate, and does not rotate; the thickness of the plate is thickened, and it is not required Another adjustment mechanism can have low clothes and manufacturing costs, as long as the hair If the thickness is increased according to actual needs, the height limit problem caused by the measurement can be overcome; moreover, the vertical type of the probe is ground and the height of the branch is difficult; in addition, if the vertical needle is damaged again, it can be directly replaced. The vertical probes do not completely affect the (4) of the circuit board, the height plate and the space conversion board, and can be effectively reduced to 15 [Embodiment] In order to explain in detail the structure, features and effects of the present invention, The following preferred embodiments are described with reference to the following figures. Please refer to the third figure, which is a preferred embodiment of the present invention, which comprises a circuit board (22), A space conversion plate is a high plate (26) and a vertical probe set (28). The space conversion plate (24) is shot in this embodiment as a multilayer organic structure (M Qin L^ered 0rganie, ML〇), having an internal Most circuits (moving). In the present embodiment, the mat plate (26) is a multilayer ceramic structure 7 201003078 (Multi-Layered Ceramic ’ MLC) and has a heat resistance compared to the space conversion plate (24). The pad (26) is electrically connected to the space conversion board (24) through the first reflow, and then electrically connected to the circuit board (22) through the second reflow. The high plate (26) has a plurality of vertically penetrating through holes (262) therein, and is provided for a plurality of circuits (264) electrically connected to the circuit board (22). The vertical probe set (28) has an upper guide (282), a lower guide (284), a spacer (286) and a plurality of vertical probes (288). The upper guide plate (282) is fixed to the space conversion plate (24); the partition plate (286) is connected to the upper guide plate (282) and the lower guide plate (284) respectively; the needles of the vertical probes (288) pass through The first plate (282) is electrically connected to the circuit (242) of the space conversion plate (24), and the tip of the vertical probe (288) passes through the lower guide (284). The minimum spacing (L1) of the adjacent two circuits (264) of the pad (26) is greater than the distance between the adjacent circuit (242) of the space conversion board (24) and the end of the vertical probe (28). Spacing (L2). 15 Through the above structure, since the height plate (26) is a multi-layer ceramic structure having a plurality of vertical through holes U (262), it is only used for height increase, not for space conversion, so that the height plate (26) The thickness can be increased according to the actual environmental requirements, which can effectively overcome the height problem between the surface of the circuit board (22) and the vertical probe (28) and the tip of the needle due to the influence of the test environment of the test machine, and effectively reduce the height by 20 The difficulty and cost of manufacturing the invention. Moreover, the needle of the vertical probe () can be ground synchronously with the tip to facilitate the height adjustment; in addition, if the vertical probe (288) is damaged, the user can replace the probe by itself, without affecting at all. The state of the circuit board (22), the height plate (26) and the space conversion board (24) can effectively reduce the cost. 8 201003078 Furthermore, since the pad (26) of the present invention needs to be reflowed twice, it can be electrically connected to the space conversion board (24) and the circuit board (22) respectively. Therefore, the pad = board (26) is selected. The high-heat-resistant multilayer ceramic substrate is optimized; of course, the empty=conversion plate (24) is not limited to the use of a multi-layer organic substrate, and the same heat resistance can be obtained as the height plate (26). . Referring to the fifth figure, a probe testing device (3G) according to a second preferred embodiment of the present invention is provided. In the production process, a circuit board (32) is provided first; and a conversion board (34) is further provided. ) with a padded high plate (36), in which the space conversion plate (3 sentences using the layer of organic substrate 'the pad (36) uses a multi-layer ceramic substrate, the high plate (36) and the space conversion plate (34) pass Reflow and electrical 15 20 (3_彳 surface forms a plurality of solder bumps (10)), such as the fourth connection = placing the slanting plate (36) on the circuit board (32) and the space board (34) Between, f provides - fixing frame (38) 'solid magic _' has a fixing portion (382) that abuts the soil portion (381) of the circuit board (5) and a connecting base portion (381), and the fixing portion (moving) Passing through the circuit board (32) and connecting with the base (381), the bottom of the fixing portion (382) is folded inwardly and pressed against the bottom side of the high plate (36), so that the height plate (10) is unloaded (10) The circuit board (32) is electrically contacted; finally, a plurality of probes are connected to the space conversion board (34) to complete the fabrication of the embodiment, as shown in FIG. 5. The above is known as 'this embodiment is Keep the high board (32) well with the fixed frame (38) Miscellaneous contact, and reduce the fresh-keeping operation between the high-grade board (36), avoiding the high-grade reflow of the high-grade board (36). Therefore, the high-grade board (36) does not have to use high heat-resistant eve. The layered Taojing substrate can also use a multi-layer organic substrate to have the same heat as the space conversion 9 201003078 board (34); of course, the space conversion board (5) and the high board P6) can also use the same multi-layer ceramic board; After the top side of the high board (10) is 数y, a plurality of solder bumps are formed (after 362, the grinding operation can be further performed to increase the contact area between the solder bumps (362) and the circuit board (5). In this embodiment, a tensioning component (42) can be further provided to ensure that the solder bump (10) of the inspection board (36) and the circuit board P are electrically connected. The tensile force reading (four) can be a bolt, and the bolt is worn. Passing the circuit board (32) and the high board ^36) screwing so that the height plate (36) can be tested and driven toward the electric 10 15 / board (^2), except that the structure of the embodiment is made More stable, the solder bump (362) of the board (36) is electrically connected to the circuit board (32). If the board (36) is a shouting material, it is not conducive to the thread. In the case of Wei, the metal block of the internal thread can be changed to the height plate (10), and the tension element (42) is locked to the high plate (36). Further, as shown in the seventh figure, 717 'is the third invention. Preferably, the device (10) provided by the present embodiment provides a 'support plate (56) and a plurality of electrical contacts (58) with a disk, wherein the support plate (56) is located on the high plate (8) 'clap board ( 52) The electrical contact (58) is disposed on the support plate (10), and the two electrodes are electrically connected to the pad (54) and the circuit board (52), respectively. Due to the sexual connection, the sub (π) has a fixed amount of money, and the miscellaneous range will also be limited by the charm. (4) The road board (52) and the space conversion board (55) directly pass through the electric 妾 邦 8 8) When connected, it is easy to cause poor contact. Because of the arrangement of the board (54) with the *t pad, it is possible to maintain a good electrical contact between the high board (54) and the circuit board (52) switch board (55). The constituent elements disclosed in the embodiments are not intended to limit the scope of the present invention. The substitution or variation of other equivalent elements is also covered by the scope of the patent application. 11 201003078 [Simple description of the diagram] The first diagram is a schematic diagram of the structure of the conventional probe test device. The figure = is a schematic diagram of the other-used probe test device. The third figure is a schematic structural view of the first preferred embodiment of the present invention. The fourth figure is a partial structure diagram of the second preferred embodiment of the present invention. Mainly showing the state in which the paddle plate and the space plate are connected back to each other. The fifth figure is a schematic structural view of the second preferred embodiment of the present invention. Figure 6 is a schematic view showing the structure of the second preferred embodiment of the present invention. Figure 7 is a schematic view showing the structure of the third preferred embodiment of the present invention. [Description of main component symbols] "First embodiment" Probe test device (20) Circuit (242, 264) Distance (LI, L2) Lower guide (284) "Second embodiment" Probe test device (30) Pad (36) Base (381) Tensioning element (42) "Third embodiment" Probe tester (5 0) Space conversion board (55) 15 Circuit board (22) Space conversion board (24) High board (26) Through Hole (262) Vertical Probe Set (28) Upper Guide (282) Spacer (286) Vertical Probe (288) Board (32) Space Conversion Board (34) Solder Bump (362) ) fixing frame (38) fixing part (382) probe (40) circuit board (52) height plate (54) support plate (56) electrical contact (58) 12 20

Claims (1)

201003078 X. Patent application scope: 1. A probe testing device, comprising: a circuit board; a space conversion board; - a board is located on the circuit board and the 5th board and the space conversion board The connection is made by a 'sub-sub-board, with a guide plate disposed above the space conversion plate, a connecting upper guide plate, and a plurality of vertical 々 朴 朴 甘 I 之间 板 板 板 板 ' ' ' ' And the eve of the straight type (4), wherein the hanging guides are electrically connected to the space conversion board. On the sea, 0 2. As requested in the item 1 of the probe test device, the inside of the P-gate shovel in the basin has a plurality of strips electrically connected to the vertical probes, and a plurality of strips are electrically connected to the circuit board. = the gate of the gate of the adjacent circuit of the board to which the circuit is electrically connected to the circuit board = the spacing between the ends of the gaps of the adjacent -3 of the space conversion board. The circuit is electrically connected to the special vertical probe. The probe testing device of the first embodiment has a heat resistance of the high plate greater than or equal to the heat of the space conversion plate. 4. The probe testing device according to claim 3, wherein the heat resistance of the high plate is equal to the heat resistance of the space conversion plate. The probe test device of the invention of claim 4, wherein the space conversion plate and the high plate are both a multi-layer ceramic structure _ki_Lay_, MLC. 6. The probe testing device of claim 3, wherein the high plate has a heat resistance greater than a heat resistance of the space conversion plate. The probe test device of claim 6, wherein the space conversion plate is a Muhi-Layered Organic (MLO), and the high plate is a Multi-Layered Ceramic (Multi-Layered Ceramic). MLC). The probe testing device of claim 1 further comprising a solid body, wherein the circuit board has a fixing portion that can be pressed against the surface of the potential plate. The probe testing device of claim 1, wherein the pad has a plurality of vertically penetrating through holes. H) The probe testing device of claim 1, further comprising a pulling force 7L member passing through the circuit board to be connected to the pad. The probe testing device according to claim 1, wherein == an elastic electrical contact, the interplate between the cutting board and the circuit board, the electrical connection is respectively connected to the height plate And the board is electrically connected again. The slab 'Asia 5 12 ·-probe test device includes: i a circuit board; a space conversion board; a matte board, located in the circuit board and the space conversion and the circuit board and the space conversion board兮曰 = 〕 degree is greater than or equal to the heat-resistant m of the space conversion plate and the heat-resistant plurality of probes of the board, electrically connected to the (four) conversion board. The heat resistance of the probe test 2 as set forth in claim 12 is equal to the heat resistance of the space conversion plate. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , . 15. The probe testing device of claim 12, wherein the height of the pad is greater than the heat resistance of the space conversion plate. Wherein the space turns, MLO), the 塾, MLC) ° further includes a pressure tester that can be pressed against the height of the probe. 16. The probe test device according to claim 15 is a multi-layer organic structure (M Qin Layered 〇 The Liuhua high board is a multi-layer pottery structure (M should cut the coffee C_ic Π. The probe test device according to item 12, the fixing frame is set on the circuit board, and has a fixing part, a board 0 changing board « Set, shoot the space to turn 15 20 inside the board with a number of strips and: == = way;: 塾 high adjacent two circuits and the board two: two sides and the board adjacent two - and two have a dependency, (four) (four) 20. The tension member as claimed in claim 12, wherein the tension member passes through the device, and further comprises: a high plate and the circuit board:: sex: s contact, the two ends of the four (4) plate and 4 =:: Cutting board, 201003078 22. A probe testing device, comprising: a circuit board; a space conversion board; 5 and the conversion board between the air board and the board, and a fixed frame on the circuit board, disposed in the circuit Board, > the high board is in electrical contact with the board; and, '疋^ pads the board, so that the pad 23 = item probe. 0 has 1 fixed part, The fixing portion is pressed against the mat, the middle, the middle frame 2-4: the probe test described in claim 22; the red component 'the tensile member is threaded on the circuit board, and the second 15 20 25. The probe according to claim 22, wherein the cutting plate is located between the ===way plates, wherein the electrical contact is disposed in the electrical contact with the circuit. The plate and the high plate. &' and the probes in contact with the two ends of the test device, each of the electrical: test device, which is difficult to high plate 2 ^ to the heat resistance of the 3 hai conversion plate The probe device according to claim 28, wherein the height plate is in the heat resistance of the space conversion plate. 愀29. The probe test device according to claim 28. The space test is performed on the surface of the multi-layered ceramic structure (MLC). The probe test device of claim 27, wherein the heat resistance of the height plate is The probe test device of claim 30, wherein the space conversion plate is a multi-layer organic structure (Mu丨ti-Laye). Red organic, MLO), which is a multi-layered ceramic (MLC). The probe testing device of claim 22, wherein the space conversion plate has a plurality of strips and the like a circuit electrically connected to the probe; the pad 10 has a plurality of circuits electrically connected to the circuit board; the distance between the adjacent two circuits of the high plate and the end electrically connected to the circuit board is greater than The spacing between adjacent two circuits of the space conversion board and one end of the probes that are electrically connected. 15 33. The probe testing device of claim 22, wherein the probes are vertical probes. 34. A method for manufacturing a probe testing device according to claim 22, comprising the steps of: a) providing a circuit board; and converting the space plate to the space plate塾 = board as purchased, Wei space conversion board and the side (four) connection: c) will record the slab of the stencil _ change the scale, the high board and the board electrical contact; and 〃 & Make d) provide a number of probe connections. The method of manufacturing the method of claim 34, wherein the heat resistance of the height plate of the step b) is greater than or equal to the heat resistance of the space conversion plate. The manufacturing method according to claim 35, wherein the heat resistance of the height plate is equal to the heat resistance of the space conversion plate. The manufacturing method of claim 36, wherein the height plate and the space conversion plate are both Multi-Layered Ceramic (MLC). The manufacturing method according to claim 35, wherein the height of the height plate is greater than the heat resistance of the space conversion plate. The manufacturing method according to claim 38, wherein the height plate is a multi-layered ceramic (MLC), and the space conversion plate is a multi-layered organic (MLO). 40. The method of claim 34, wherein the fixing frame of step c) has a fixing portion that is pressed against the pad to electrically contact the pad 15 with the circuit board. 41. The method of manufacturing of claim 34, wherein step c) further provides a tensile element that is coupled to the riser plate through the circuit board. 42. The manufacturing method of claim 34, wherein step c) is further provided for a support plate and a plurality of electrical contacts, and the electrical contacts are disposed on the support plate, and then the The support plate and the electrical contact are disposed between the pad and the circuit board, and then the pad is pressed against the pad to pass the pad to the circuit board and the circuit board Electrical connection. 43. The method of manufacture of claim 42, wherein each of the electrical contacts 18 201003078 is made of a resilient material. The manufacturing method of claim 34, wherein the step b) is to form a plurality of solder bumps on a top side of the height plate; and in the step c), the solid frame is to solder the pad The bump is in electrical contact with the circuit board. The manufacturing method of claim 44, wherein the solder bumps are subjected to a grinding operation. The method of manufacture of claim 34, wherein the probes are vertical probes. 19