TW201408152A - 凹版平版印刷用凹版及印刷配線基材 - Google Patents
凹版平版印刷用凹版及印刷配線基材 Download PDFInfo
- Publication number
- TW201408152A TW201408152A TW102127361A TW102127361A TW201408152A TW 201408152 A TW201408152 A TW 201408152A TW 102127361 A TW102127361 A TW 102127361A TW 102127361 A TW102127361 A TW 102127361A TW 201408152 A TW201408152 A TW 201408152A
- Authority
- TW
- Taiwan
- Prior art keywords
- gravure
- pattern
- intaglio plate
- ink
- lithography
- Prior art date
Links
- 238000007646 gravure printing Methods 0.000 title abstract description 14
- 238000007639 printing Methods 0.000 claims abstract description 39
- 238000001459 lithography Methods 0.000 claims description 64
- 239000000758 substrate Substances 0.000 claims description 24
- 230000009191 jumping Effects 0.000 abstract description 4
- 239000000976 ink Substances 0.000 description 50
- 238000012546 transfer Methods 0.000 description 47
- 238000000034 method Methods 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- 230000001154 acute effect Effects 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000006120 scratch resistant coating Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/04—Printing plates or foils; Materials therefor metallic
- B41N1/06—Printing plates or foils; Materials therefor metallic for relief printing or intaglio printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/12—Printing plates or foils; Materials therefor non-metallic other than stone, e.g. printing plates or foils comprising inorganic materials in an organic matrix
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09272—Layout details of angles or corners
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Methods (AREA)
- Printing Plates And Materials Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012170910 | 2012-08-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201408152A true TW201408152A (zh) | 2014-02-16 |
Family
ID=50027572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102127361A TW201408152A (zh) | 2012-08-01 | 2013-07-31 | 凹版平版印刷用凹版及印刷配線基材 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2014020863A1 (fr) |
| CN (1) | CN104411503A (fr) |
| TW (1) | TW201408152A (fr) |
| WO (1) | WO2014020863A1 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI678585B (zh) * | 2017-11-06 | 2019-12-01 | 日商日本航空電子工業股份有限公司 | 生產觸控面板之方法 |
| TWI853490B (zh) * | 2022-03-22 | 2024-08-21 | 日商日本航空電子工業股份有限公司 | 用於配線印刷的凹版 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0829616A (ja) * | 1994-07-19 | 1996-02-02 | Toppan Printing Co Ltd | カラーフィルタの製造方法 |
| KR19980024075A (ko) * | 1996-09-16 | 1998-07-06 | 퀴오그 매뉴엘 | 불용성 금속염을 사용하여 양이온성 염료, 음이온성 염료 및 안료 분산액을 부동화시키는 방법 |
| JP3474715B2 (ja) * | 1996-10-02 | 2003-12-08 | 松下電器産業株式会社 | 凹版オフセット印刷用凹版 |
| JP4429689B2 (ja) * | 2003-11-04 | 2010-03-10 | 住友ゴム工業株式会社 | オフセット印刷方法 |
| JP4993658B2 (ja) * | 2005-12-13 | 2012-08-08 | 住友ゴム工業株式会社 | 印刷方法 |
| US8101231B2 (en) * | 2007-12-07 | 2012-01-24 | Cabot Corporation | Processes for forming photovoltaic conductive features from multiple inks |
| WO2010007787A1 (fr) * | 2008-07-15 | 2010-01-21 | Yoshida Kenji | Système d'affichage d'images vidéo 3d à l'oeil nu, afficheur de ce type, machine de jeux de divertissement et feuille barrière à parallaxe |
| JP2012020404A (ja) * | 2010-07-12 | 2012-02-02 | Bridgestone Corp | 印刷版、及びこれを用いた導電性部材の製造方法 |
-
2013
- 2013-07-23 WO PCT/JP2013/004484 patent/WO2014020863A1/fr not_active Ceased
- 2013-07-23 JP JP2014527972A patent/JPWO2014020863A1/ja active Pending
- 2013-07-23 CN CN201380035956.9A patent/CN104411503A/zh active Pending
- 2013-07-31 TW TW102127361A patent/TW201408152A/zh unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI678585B (zh) * | 2017-11-06 | 2019-12-01 | 日商日本航空電子工業股份有限公司 | 生產觸控面板之方法 |
| US10725603B2 (en) | 2017-11-06 | 2020-07-28 | Japan Aviation Electronics Industry, Limited | Method for manufacturing touch panel |
| TWI853490B (zh) * | 2022-03-22 | 2024-08-21 | 日商日本航空電子工業股份有限公司 | 用於配線印刷的凹版 |
| US12280586B2 (en) | 2022-03-22 | 2025-04-22 | Japan Aviation Electronics Industry, Limited | Gravure plate for wiring printing |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014020863A1 (fr) | 2014-02-06 |
| CN104411503A (zh) | 2015-03-11 |
| JPWO2014020863A1 (ja) | 2016-07-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104520113B (zh) | 凹版胶印方法、凹版胶印装置以及凹版 | |
| CN103885246B (zh) | 定向膜印刷版及液晶显示装置的制造方法 | |
| CN113211949B (zh) | 图案转印设备及方法 | |
| TW201408152A (zh) | 凹版平版印刷用凹版及印刷配線基材 | |
| JP2013115237A (ja) | グラビアオフセット印刷用凹版およびそれを用いた印刷配線基材の製造方法ならびに印刷配線基材 | |
| TWI574853B (zh) | Gravure printing and gravure printing | |
| JP6069833B2 (ja) | 印刷配線基材およびその製造方法ならびにグラビア版 | |
| JP2009190264A (ja) | 印刷版及び缶の印刷装置 | |
| JP2019155652A (ja) | 印刷基板の製造方法 | |
| JP5499822B2 (ja) | 機能性薄膜の製造方法 | |
| CN217226970U (zh) | 凹版及凹版印刷机 | |
| CN110126449A (zh) | 刮刀以及印刷装置 | |
| JP2016072442A (ja) | 印刷回路、配線基板及び印刷版 | |
| JP2014128924A (ja) | グラビアオフセット印刷方法 | |
| JP2008258249A (ja) | パターン形成方法、パターン形成装置および表示装置用の基板 | |
| US10131175B2 (en) | Printing plate, laminated ceramic electronic component producing method, and printer | |
| TWI481510B (zh) | 移印方法 | |
| CN112918077A (zh) | 凹版印刷版和使用该凹版印刷版的凹版印刷装置 | |
| JP5347990B2 (ja) | インキング方法 | |
| JP2014073653A (ja) | グラビアオフセット印刷方法 | |
| TW201439682A (zh) | 標記基材以用於視覺校準的方法與系統 | |
| CN106183519B (zh) | 柔性印刷版 | |
| JPH03198029A (ja) | 液晶表示素子の製造装置 | |
| JP2008155614A (ja) | 凸版印刷装置 | |
| KR20150051410A (ko) | 후막 패턴 형성 방법 |