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TW201406835A - Resin foam, foam member, foam member laminate, and electric or electronic devices - Google Patents

Resin foam, foam member, foam member laminate, and electric or electronic devices Download PDF

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Publication number
TW201406835A
TW201406835A TW102118829A TW102118829A TW201406835A TW 201406835 A TW201406835 A TW 201406835A TW 102118829 A TW102118829 A TW 102118829A TW 102118829 A TW102118829 A TW 102118829A TW 201406835 A TW201406835 A TW 201406835A
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resin
foam
resin foam
adhesive
foaming
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TW102118829A
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Chinese (zh)
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Kiyoaki Kodama
Makoto Saitou
Kazumichi Kato
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Nitto Denko Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/12Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
    • C08J9/122Hydrogen, oxygen, CO2, nitrogen or noble gases
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2201/00Foams characterised by the foaming process
    • C08J2201/02Foams characterised by the foaming process characterised by mechanical pre- or post-treatments
    • C08J2201/03Extrusion of the foamable blend
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00Foams characterized by the expanding agent
    • C08J2203/06CO2, N2 or noble gases
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00Foams characterized by the expanding agent
    • C08J2203/08Supercritical fluid
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2205/00Foams characterised by their properties
    • C08J2205/04Foams characterised by their properties characterised by the foam pores
    • C08J2205/044Micropores, i.e. average diameter being between 0,1 micrometer and 0,1 millimeter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2205/00Foams characterised by their properties
    • C08J2205/04Foams characterised by their properties characterised by the foam pores
    • C08J2205/046Unimodal pore distribution
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2205/00Foams characterised by their properties
    • C08J2205/06Flexible foams
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00Characterised by the use of unspecified polymers
    • C08J2300/22Thermoplastic resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00Characterised by the use of unspecified polymers
    • C08J2300/26Elastomers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02Polyesters derived from dicarboxylic acids and dihydroxy compounds

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

Provided is a resin foam having a fine cell structure, being capable of suppressing or preventing foam destruction when peeling same from a carrier tape even if same is a flexible resin foam, and having excellent workability and transport properties when being held by the carrier tape. This resin foam is characterized by: having an interlayer peeling strength, as defined, of at least 10 N/20 mm; having a repulsive force at 50% compression of 0.1-4.0 N/cm2; having an average cell diameter of 10-200 [mu]m; and having a maximum cell diameter of no more than 300 [mu]m. Interlayer peeling strength: The peeling strength when a sheet-shaped resin foam is pasted to an adhesive surface of an adhesive tape (product name "No. 5603", manufactured by Nitto Denko Corporation) in an atmosphere of 23 DEG C, the resin foam is compressed under the conditions of one reciprocal movement by a 2 kg roller, and the resin foam is peeled from the adhesive tape under conditions of a peeling angle of 90 DEG and a peeling speed of 0.3 m/min.

Description

樹脂發泡體、發泡構件、發泡構件積層體及電氣或電子機器類 Resin foam, foam member, foam member laminate, and electrical or electronic equipment

本發明係關於一種樹脂發泡體、發泡構件、發泡構件積層體及電氣或電子機器類。更詳細而言,本發明係關於一種電氣或電子機器(例如,行動電話、移動終端、智能手機、平板電腦(平板PC)、數位相機、視訊攝影機、數位視訊攝影機、個人電腦、家電製品等)中所使用之樹脂發泡體、包含上述樹脂發泡體之發泡構件、包含上述發泡構件之發泡構件積層體及包含上述發泡構件之電氣或電子機器類。 The present invention relates to a resin foam, a foam member, a foam member laminate, and an electric or electronic device. More specifically, the present invention relates to an electrical or electronic device (eg, a mobile phone, a mobile terminal, a smart phone, a tablet (tablet PC), a digital camera, a video camera, a digital video camera, a personal computer, home appliances, etc.) A resin foam used in the present invention, a foamed member including the resin foam, a foamed member laminated body including the foamed member, and an electrical or electronic device including the foamed member.

樹脂發泡體通常係與所使用之構件之形狀相對應地以所需形狀沖裁,又,或者對樹脂發泡體之表面實施黏著加工,以便容易固定於構件,但實施有此種加工之樹脂發泡體不容易操作,因此為有效率地搬送至特定部位,有使用載帶之情形。即,樹脂發泡體係在貼合於載帶之狀態下被實施各種加工(沖裁加工或黏著加工等),或者於加工後被搬送。另一方面,加工後,樹脂發泡體必須自載帶剝離,於樹脂發泡體之表面強度較低(較弱)之情形時,剝離時,有導致樹脂發泡體遭到破壞之情形。尤其,於高發泡倍率之樹脂發泡體之情形時[例如,經過使高壓之惰性氣體(例如,超臨界狀態之二氧化碳等)含浸於熱塑性樹脂後進行減壓之步驟而形成之熱塑性樹脂發泡體等](參照專利文獻1),氣泡壁之厚度較薄,故而容易產生剝離時之破壞。尤其,若樹脂發泡體含有粗大泡孔,則發泡體表面之氣泡壁之比例減少,更容易 產生剝離時之破壞。 The resin foam is usually punched in a desired shape in accordance with the shape of the member to be used, or the surface of the resin foam is subjected to adhesive processing so as to be easily fixed to the member, but such processing is carried out. Since the resin foam is not easy to handle, it is often used to carry it to a specific portion. In other words, the resin foaming system is subjected to various processes (such as punching or adhesion processing) in a state of being bonded to a carrier tape, or is conveyed after processing. On the other hand, after the processing, the resin foam must be peeled off from the carrier tape, and when the surface strength of the resin foam is low (weak), the resin foam may be damaged when peeled off. In particular, in the case of a resin foam having a high expansion ratio [for example, a thermoplastic resin foamed by a step of subjecting a high-pressure inert gas (for example, carbon dioxide in a supercritical state) to a thermoplastic resin and then performing a pressure reduction step. (see Patent Document 1), since the thickness of the bubble wall is thin, breakage at the time of peeling is likely to occur. In particular, if the resin foam contains coarse cells, the proportion of the bubble walls on the surface of the foam is reduced, making it easier Destruction occurs when peeling occurs.

再者,若為防止剝離時之破壞而使用黏著力更小之載帶,則產生導致加工中偏移而使尺寸穩定性(形狀穩定性)下降之問題,或者裝配發泡體構件時自加工用襯紙剝離前已自載帶剝離而無法裝配之問題。 Further, if a carrier tape having a smaller adhesive force is used in order to prevent breakage during peeling, there is a problem that dimensional deviation (shape stability) is lowered due to offset during processing, or self-processing is performed when assembling a foam member. The problem that the self-loading tape is peeled off before being peeled off by the liner paper and cannot be assembled.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

專利文獻1:日本專利特開2001-247706號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2001-247706

因此,本發明之目的在於提供一種樹脂發泡體,其即便為具有微細泡孔結構且柔軟之樹脂發泡體,亦可抑制或防止自載帶剝離時之泡體破壞,且保持於載帶時之加工性及搬送性優異。 Therefore, an object of the present invention is to provide a resin foam which can suppress or prevent the destruction of the bubble when the self-supporting tape is peeled off, and which is retained on the carrier tape even if it is a soft resin foam having a fine cell structure. It is excellent in workability and conveyability.

進而,本發明之其他目的在於提供一種使用上述樹脂發泡體之發泡構件、使用該發泡構件之發泡構件積層體及使用該發泡構件之電氣或電子機器類。 Further, another object of the present invention is to provide a foam member using the above resin foam, a foam member laminate using the foam member, and an electric or electronic device using the foam member.

因此,本發明者等人進行努力研究,結果發現樹脂發泡體中,若將層間剝離強度設為特定值以上,將壓縮50%時之反彈力設為特定範圍內,將平均泡孔直徑設為特定範圍內,進而將最大泡孔直徑設為特定值以下,則具有微細泡孔結構,可獲得優異之柔軟性,並且可獲得對自載帶剝離時之泡體破壞之抑制性、保持於載帶時之加工性及搬送性。本發明係基於該等見解完成者。 Therefore, the inventors of the present invention have conducted an effort to find that when the interlaminar peeling strength is a specific value or more, the repulsive force at a compression of 50% is within a specific range, and the average cell diameter is set. When the maximum cell diameter is set to a specific value or less in a specific range, the fine cell structure is obtained, and excellent flexibility can be obtained, and the suppression of the bubble damage at the time of peeling off from the carrier tape can be obtained and maintained. Processability and transportability at the time of carrier tape. The present invention is based on such insights.

即,本發明提供一種樹脂發泡體,其特徵在於:下述所定義之層間剝離強度為10N/20mm以上,壓縮50%時之反彈力為0.1~4.0N/cm2,平均泡孔直徑為10~200μm,最大泡孔直徑為300μm以下。 That is, the present invention provides a resin foam characterized in that the interlaminar peel strength defined below is 10 N/20 mm or more, and the rebound force at a compression of 50% is 0.1 to 4.0 N/cm 2 , and the average cell diameter is 10~200μm, the maximum cell diameter is 300μm or less.

層間剝離強度:將片狀之樹脂發泡體在23℃環境下貼附於黏著膠帶(商品名「No.5603」,日東電工股份有限公司製造)之黏著面,在2kg滾輪、1次往返之條件下進行壓接後,將上述樹脂發泡體在剝離角度90°、拉伸速度0.3m/min之條件下自上述黏著膠帶剝離時之剝離強度。 Interlaminar peeling strength: The sheet-like resin foam was attached to the adhesive surface of an adhesive tape (trade name "No. 5603", manufactured by Nitto Denko Corporation) at 23 ° C, and was transferred to a 2 kg roller. After the pressure bonding, the peeling strength of the resin foam at the peeling angle of 90° and a tensile speed of 0.3 m/min from the adhesive tape was peeled off.

上述樹脂發泡體較佳為進而視密度為0.01~0.20g/cm3The resin foam preferably further has an apparent density of 0.01 to 0.20 g/cm 3 .

構成上述樹脂發泡體之樹脂較佳為熱塑性樹脂。 The resin constituting the above resin foam is preferably a thermoplastic resin.

上述熱塑性樹脂較佳為聚酯。 The above thermoplastic resin is preferably a polyester.

上述樹脂發泡體較佳為經過使高壓之氣體含浸於樹脂組合物後進行減壓之步驟而形成。 The resin foam is preferably formed by a step of impregnating a resin composition with a high-pressure gas and then reducing the pressure.

上述氣體較佳為惰性氣體。 The above gas is preferably an inert gas.

上述氣體較佳為二氧化碳。 The above gas is preferably carbon dioxide.

上述高壓之氣體較佳為超臨界狀態。 The high pressure gas is preferably in a supercritical state.

進而,本發明提供一種發泡構件,其特徵在於:包含上述樹脂發泡體。 Furthermore, the present invention provides a foamed member comprising the above resin foam.

上述發泡構件較佳為於上述樹脂發泡體上包含表面層。 The foam member preferably contains a surface layer on the resin foam.

上述表面層較佳為藉由上述樹脂發泡體表面之加熱熔融處理所形成之層。 The surface layer is preferably a layer formed by heat-melting treatment of the surface of the resin foam.

上述表面層較佳為黏著劑層。 The above surface layer is preferably an adhesive layer.

上述黏著劑層較佳為丙烯酸系黏著劑層。 The above adhesive layer is preferably an acrylic adhesive layer.

上述發泡構件較佳為電氣或電子機器用。 The foaming member is preferably used for electrical or electronic equipment.

進而,本發明提供一種發泡構件積層體,其特徵在於:具有利用在基材之至少單面側包含黏著劑層之載帶保持上述發泡構件之構成。 Further, the present invention provides a foamed member laminated body comprising a structure in which the foam member is held by a carrier tape including an adhesive layer on at least one side of the substrate.

進而,本發明提供一種電氣或電子機器類,其特徵在於:包含上述發泡構件。 Furthermore, the present invention provides an electric or electronic device comprising the above-described foam member.

本發明之樹脂發泡體由於具有上述構成,故而即便為具有微細泡孔結構且柔軟之樹脂發泡體,亦可抑制或防止自載帶剝離時之泡體破壞(發泡體中之泡孔結構之破壞),且保持於載帶時之加工性及搬送性等對載帶之特性優異。 Since the resin foam of the present invention has the above-described configuration, even if it is a soft resin foam having a fine cell structure, it is possible to suppress or prevent bubble breakage when the self-supporting tape is peeled off (cells in the foam) The structure is deteriorated, and the workability and the conveyability at the time of carrying the tape are excellent in the characteristics of the carrier tape.

於本發明之樹脂發泡體中,下述所定義之層間剝離強度為10N/20mm以上,壓縮50%時之反彈力為0.1~4.0N/cm2,平均泡孔直徑為10~200μm,最大泡孔直徑為300μm以下。 In the resin foam of the present invention, the interlayer peel strength defined below is 10 N/20 mm or more, the rebound force at 50% compression is 0.1 to 4.0 N/cm 2 , and the average cell diameter is 10 to 200 μm. The cell diameter is 300 μm or less.

層間剝離強度:將片狀之樹脂發泡體在23℃環境下貼附於黏著膠帶(商品名「No.5603」,日東電工股份有限公司製造)之黏著面,在2kg滾輪、1次往返之條件下進行壓接後,將上述樹脂發泡體在剝離角度90°(度)、拉伸速度0.3m/min之條件下自上述黏著膠帶剝離時之剝離強度。 Interlaminar peeling strength: The sheet-like resin foam was attached to the adhesive surface of an adhesive tape (trade name "No. 5603", manufactured by Nitto Denko Corporation) at 23 ° C, and was transferred to a 2 kg roller. After the pressure bonding, the peeling strength of the resin foam at the peeling angle of 90 (degrees) and a tensile speed of 0.3 m/min from the adhesive tape was peeled off.

再者,於本說明書中,有時將上述所定義之層間剝離強度僅稱作「層間剝離強度」。 Further, in the present specification, the interlayer peel strength defined above may be simply referred to as "interlayer peel strength".

本發明之樹脂發泡體係藉由使至少含有構成本發明之樹脂發泡體之樹脂的組合物(樹脂組合物)進行發泡而形成。上述樹脂組合物較佳為相對於樹脂組合物總量(100重量%),含有樹脂70重量%以上(較佳為80重量%以上)。 The resin foaming system of the present invention is formed by foaming a composition (resin composition) containing at least a resin constituting the resin foam of the present invention. The resin composition preferably contains 70% by weight or more (preferably 80% by weight or more) based on the total amount of the resin composition (100% by weight).

本發明之樹脂發泡體之層間剝離強度為10N/20mm以上,較佳為15N/20mm以上,更佳為20N/20mm以上。於本發明之樹脂發泡體中,由於上述層間剝離強度為10N/20mm以上,故而對自載帶剝離時之泡體破壞之抑制性優異。例如,於搬送樹脂發泡體時,利用載帶暫 時固定樹脂發泡體而搬送後,自載帶剝離樹脂發泡體時,難以產生樹脂發泡體之破壞。再者,上述層間剝離強度之上限並無特別限定,較佳為60N/20mm,更佳為50N/20mm。 The interlayer peel strength of the resin foam of the present invention is 10 N/20 mm or more, preferably 15 N/20 mm or more, and more preferably 20 N/20 mm or more. In the resin foam of the present invention, since the interlayer peeling strength is 10 N/20 mm or more, the foaming property at the time of peeling off from the carrier tape is excellent. For example, when carrying a resin foam, use a carrier tape temporarily. When the resin foam is fixed and transferred after the resin foam is fixed, it is difficult to cause breakage of the resin foam when the resin foam is peeled off from the carrier tape. Further, the upper limit of the interlayer peeling strength is not particularly limited, but is preferably 60 N/20 mm, more preferably 50 N/20 mm.

本發明之樹脂發泡體之壓縮50%時之反彈應力並無特別限定,較佳為0.1~4.0N/cm2,更佳為0.3~3.5N/cm2,進而較佳為0.5~3.0N/cm2。於本發明之樹脂發泡體中,若壓縮50%時之反彈應力為0.1N/cm2以上,則獲得適當之剛性而容易獲得良好之加工性,因此較理想。又,若壓縮50%時之反彈應力為4.0N/cm2以下,則容易獲得優異之柔軟性,故而較理想。 The rebound stress at 50% compression of the resin foam of the present invention is not particularly limited, but is preferably 0.1 to 4.0 N/cm 2 , more preferably 0.3 to 3.5 N/cm 2 , and still more preferably 0.5 to 3.0 N. /cm 2 . In the resin foam of the present invention, when the rebound stress at 50% compression is 0.1 N/cm 2 or more, it is preferable to obtain appropriate rigidity and to easily obtain good workability. Further, when the rebound stress at 50% compression is 4.0 N/cm 2 or less, it is easy to obtain excellent flexibility, which is preferable.

上述壓縮50%時之反彈應力意指壓縮率為50%時之壓縮應力。所謂壓縮率為50%,意指將片狀之樹脂發泡體沿著厚度方向壓縮成相當於初始高度之50%之高度之狀態,即意指壓縮成自初始厚度應變50%之狀態,壓縮率為50%之片狀之樹脂發泡體之厚度相當於初始厚度之50%之厚度。 The above-mentioned rebound stress at 50% compression means a compressive stress at a compression ratio of 50%. The compression ratio is 50%, which means that the sheet-like resin foam is compressed in the thickness direction to a height corresponding to 50% of the initial height, that is, it is compressed to a state of 50% from the initial thickness strain, and is compressed. The thickness of the sheet-like resin foam having a ratio of 50% corresponds to a thickness of 50% of the initial thickness.

本發明之樹脂發泡體之平均泡孔直徑為10~200μm,更佳為15~150μm,進而較佳為20~100μm。於本發明之樹脂發泡體中,由於平均泡孔直徑為10μm以上,故而具有優異之柔軟性。又,由於平均泡孔直徑為200μm以下,故而可抑制空隙之產生,從而具有優異之防塵性。又,可擴大對載帶之密著面積,故而對載帶之特性優異。 The resin foam of the present invention has an average cell diameter of 10 to 200 μm, more preferably 15 to 150 μm, still more preferably 20 to 100 μm. In the resin foam of the present invention, since the average cell diameter is 10 μm or more, it has excellent flexibility. Moreover, since the average cell diameter is 200 μm or less, generation of voids can be suppressed, and excellent dust resistance can be obtained. Moreover, since the adhesion area to the carrier tape can be enlarged, the characteristics of the carrier tape are excellent.

本發明之樹脂發泡體之最大泡孔直徑為300μm以下,更佳為250μm以下,進而較佳為200μm。於本發明之樹脂發泡體中,由於最大泡孔直徑為300μm以下,故而泡孔結構之均勻性優異,又,不含有粗大泡孔,因此強度或對載帶之特性優異。除此以外,可抑制灰塵自粗大泡孔進入而使防塵性下降之問題,故而密封性或防塵性優異。 The resin foam of the present invention has a maximum cell diameter of 300 μm or less, more preferably 250 μm or less, still more preferably 200 μm. In the resin foam of the present invention, since the maximum cell diameter is 300 μm or less, the cell structure is excellent in uniformity and does not contain coarse cells, so that the strength or the characteristics of the carrier tape are excellent. In addition to this, it is possible to suppress the problem that dust enters from the coarse cells and the dustproof property is lowered, so that the sealing property and the dustproof property are excellent.

本發明之樹脂發泡體之泡孔結構中之泡孔直徑係例如藉由如下方式求出:利用數位顯微鏡取得切斷面之泡孔結構部(氣泡結構部)之 放大圖像,求出泡孔之面積,進行近似圓的直徑換算。 The cell diameter in the cell structure of the resin foam of the present invention is obtained, for example, by obtaining a cell structure portion (bubble structure portion) of the cut surface by a digital microscope. The image is enlarged, the area of the cell is determined, and the diameter of the approximate circle is converted.

於本發明之樹脂發泡體中,由於平均泡孔直徑為10~200μm,且最大泡孔直徑為300μm,故而具有均勻且微細之泡孔結構。又,不含有粗大泡孔。 In the resin foam of the present invention, since the average cell diameter is 10 to 200 μm and the maximum cell diameter is 300 μm, it has a uniform and fine cell structure. Also, it does not contain coarse cells.

本發明之樹脂發泡體之泡孔結構並無特別限定,但就強度、密封性、防塵性、柔軟性之方面而言,較佳為半連續半獨立氣泡結構(獨立氣泡結構與連續氣泡結構混合而成之泡孔結構,其比例並無特別限定),尤佳為樹脂發泡體中之獨立氣泡結構部為40%以下(較佳為30%以下)之泡孔結構。 The cell structure of the resin foam of the present invention is not particularly limited, but is preferably a semi-continuous semi-closed cell structure (independent bubble structure and continuous cell structure) in terms of strength, sealing property, dust resistance, and flexibility. The ratio of the cell structure to be mixed is not particularly limited, and it is particularly preferable that the cell structure of the resin foam has a cell structure of 40% or less (preferably 30% or less).

本發明之樹脂發泡體之視密度並無特別限定,較佳為0.01~0.20g/cm3,更佳為0.02~0.17g/cm3,進而較佳為0.03~0.15g/cm3。於本發明之樹脂發泡體中,若密度為0.01g/cm3以上,則容易獲得良好之強度,故而較理想。又,若密度為0.20g/cm3以下,則獲得較高之發泡倍率而容易獲得優異之柔軟性,因此較理想。即,於本發明之樹脂發泡體中,若視密度為0.01~0.20g/cm3,則可獲得更好之發泡特性(較高之發泡倍率),故而容易發揮適當之強度、優異之柔軟性、優異之緩衝性。 The apparent density of the resin foam of the present invention is not particularly limited, but is preferably 0.01 to 0.20 g/cm 3 , more preferably 0.02 to 0.17 g/cm 3 , still more preferably 0.03 to 0.15 g/cm 3 . In the resin foam of the present invention, when the density is 0.01 g/cm 3 or more, good strength is easily obtained, which is preferable. Moreover, when the density is 0.20 g/cm 3 or less, a high expansion ratio is obtained and excellent flexibility is easily obtained, which is preferable. In other words, in the resin foam of the present invention, when the apparent density is 0.01 to 0.20 g/cm 3 , better foaming properties (high expansion ratio) can be obtained, so that it is easy to exhibit appropriate strength and excellent properties. Softness and excellent cushioning properties.

本發明之樹脂發泡體之形狀並無特別限定,較佳為片狀或帶狀。又,亦可根據使用目的加工成適當之形狀。例如,亦可利用切斷加工、沖裁加工等而加工成線狀、圓形或多角形狀、邊框形狀(框形狀)等。 The shape of the resin foam of the present invention is not particularly limited, but is preferably a sheet shape or a belt shape. Moreover, it can also be processed into an appropriate shape according to the purpose of use. For example, it may be processed into a linear shape, a circular shape or a polygonal shape, a frame shape (frame shape), or the like by cutting, punching, or the like.

本發明之樹脂發泡體之厚度並無特別限定,較佳為0.05~3.0mm,更佳為0.06~2.8mm,進而較佳為0.07~1.5mm,尤佳為0.08~1.0mm。 The thickness of the resin foam of the present invention is not particularly limited, but is preferably 0.05 to 3.0 mm, more preferably 0.06 to 2.8 mm, still more preferably 0.07 to 1.5 mm, and still more preferably 0.08 to 1.0 mm.

至於作為本發明之樹脂發泡體之原材料的樹脂,並無特別限定,可較佳地列舉熱塑性樹脂。本發明之樹脂發泡體可僅由一種樹脂 所構成,亦可由兩種以上之樹脂所構成。 The resin which is a raw material of the resin foam of the present invention is not particularly limited, and a thermoplastic resin is preferably used. The resin foam of the present invention may be composed of only one resin The composition may be composed of two or more kinds of resins.

作為上述熱塑性樹脂,例如可列舉低密度聚乙烯、中密度聚乙烯、高密度聚乙烯、線狀低密度聚乙烯、聚丙烯、乙烯與丙烯之共聚物、乙烯或丙烯與其他α-烯烴(例如,丁烯-1、戊烯-1、己烯-1、4-甲基戊烯-1等)之共聚物、乙烯與其他乙烯性不飽和單體(例如,乙酸乙烯酯、丙烯酸、丙烯酸酯、甲基丙烯酸、甲基丙烯酸酯、乙烯醇等)之共聚物等聚烯烴系樹脂;聚苯乙烯、丙烯腈-丁二烯-苯乙烯共聚物(ABS(Acrylonitrile Butadiene Styrene)樹脂)等苯乙烯系樹脂;6-尼龍、66-尼龍、12-尼龍等聚醯胺系樹脂;聚醯胺醯亞胺;聚胺基甲酸酯;聚醯亞胺;聚醚醯亞胺;聚甲基丙烯酸甲酯等丙烯酸系樹脂;聚氯乙烯;聚氟乙烯;烯基芳香族樹脂;聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯等聚酯系樹脂;雙酚A系聚碳酸酯等聚碳酸酯;聚縮醛;聚苯硫醚等。又,熱塑性樹脂係亦可單獨使用,或者將2種以上組合使用。再者,於熱塑性樹脂為共聚物之情形時,亦可為無規共聚物、嵌段共聚物之任一種形態之共聚物。 Examples of the thermoplastic resin include low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, polypropylene, a copolymer of ethylene and propylene, ethylene or propylene and other α-olefins (for example). a copolymer of butene-1, pentene-1, hexene-1, 4-methylpentene-1, etc., ethylene and other ethylenically unsaturated monomers (for example, vinyl acetate, acrylic acid, acrylate) a polyolefin resin such as a copolymer of methacrylic acid, methacrylic acid ester or vinyl alcohol; styrene such as polystyrene or acrylonitrile-butadiene-styrene copolymer (ABS (Acrylonitrile Butadiene Styrene) resin) Resin; 6-nylon, 66-nylon, 12-nylon and other polyamine resin; polyamidoquinone; polyurethane; polyimine; polyether quinone; polymethacrylic acid Acrylic resin such as methyl ester; polyvinyl chloride; polyvinyl fluoride; alkenyl aromatic resin; polyester resin such as polyethylene terephthalate or polybutylene terephthalate; bisphenol A polycarbonate Polycarbonate such as ester; polyacetal; polyphenylene sulfide. Further, the thermoplastic resin may be used singly or in combination of two or more. Further, when the thermoplastic resin is a copolymer, it may be a copolymer of any of a random copolymer and a block copolymer.

於上述熱塑性樹脂中,亦含有橡膠成分及/或熱塑性彈性體成分。橡膠成分或熱塑性彈性體成分係因玻璃轉移溫度為室溫以下(例如20℃以下),故而製成樹脂發泡體時之柔軟性及形狀追隨性明顯優異。再者,本發明之樹脂發泡體係亦可由含有上述熱塑性樹脂及橡膠成分及/或熱塑性彈性體成分之樹脂組合物所形成。 The thermoplastic resin also contains a rubber component and/or a thermoplastic elastomer component. Since the rubber component or the thermoplastic elastomer component is at room temperature or lower (for example, 20° C. or lower), the flexibility and shape followability of the resin foam are remarkably excellent. Further, the resin foaming system of the present invention may be formed of a resin composition containing the above thermoplastic resin and a rubber component and/or a thermoplastic elastomer component.

作為上述橡膠成分或熱塑性彈性體成分,只要係具有橡膠彈性且可發泡者,就無特別限定,例如可列舉天然橡膠、聚異丁烯、聚異戊二烯、氯丁二烯橡膠、丁基橡膠、丁腈橡膠等天然或合成橡膠;乙烯-丙烯共聚物、乙烯-丙烯-二烯共聚物、乙烯-乙酸乙烯酯共聚物、聚丁烯、氯化聚乙烯等烯烴系彈性體;苯乙烯-丁二烯-苯乙烯共聚物、苯乙烯-異戊二烯-苯乙烯共聚物及彼等之氫化物等苯乙烯系彈性 體;聚酯系彈性體;聚醯胺系彈性體;聚胺基甲酸酯系彈性體等各種熱塑性彈性體等。又,該等橡膠成分或熱塑性彈性體成分係亦可單獨使用,或者將2種以上組合使用。 The rubber component or the thermoplastic elastomer component is not particularly limited as long as it has rubber elasticity and can be foamed, and examples thereof include natural rubber, polyisobutylene, polyisoprene, chloroprene rubber, and butyl rubber. Natural or synthetic rubber such as nitrile rubber; olefin-based elastomer such as ethylene-propylene copolymer, ethylene-propylene-diene copolymer, ethylene-vinyl acetate copolymer, polybutene, chlorinated polyethylene; Styrene-based elastomers such as butadiene-styrene copolymers, styrene-isoprene-styrene copolymers and their hydrides Various thermoplastic elastomers such as polyester elastomers; polyamine elastomers; polyurethane elastomers. In addition, these rubber components or thermoplastic elastomer components may be used alone or in combination of two or more.

作為上述熱塑性樹脂,就獲得特定值以上之層間剝離強度、特定範圍內之壓縮50%時之反彈力、特定範圍內之平均泡孔直徑、特定值以下之最大泡孔直徑,即便具有微細泡孔結構且柔軟,亦可以優異之水平獲得自載帶剝離時之泡體破壞抑制性及保持於載帶時之加工性及搬送性等對載帶之特性之方面而言,較佳為聚酯(上述聚酯系樹脂或聚酯系彈性體等聚酯),更佳為聚酯系彈性體。即,本發明之樹脂發泡體更佳為由含有聚酯系彈性體之樹脂組合物所形成之樹脂發泡體(聚酯系彈性體發泡體)。 As the thermoplastic resin, an interlayer peel strength of a specific value or more, a rebound force at a compression of 50% in a specific range, an average cell diameter in a specific range, and a maximum cell diameter of a specific value or less are obtained, even if there are fine cells. The structure is soft, and the foam damage inhibition property at the time of peeling off from the carrier tape and the workability and transportability at the time of carrier tape are excellent at the level of the carrier tape, and polyester is preferable. The polyester such as the polyester resin or the polyester elastomer is more preferably a polyester elastomer. In other words, the resin foam of the present invention is more preferably a resin foam (polyester elastomer foam) formed of a resin composition containing a polyester elastomer.

作為上述聚酯系彈性體,只要係具有多元醇成分與聚羧酸成分之反應(縮聚)所形成之酯鍵部位之樹脂,就無特別限定,例如可列舉藉由芳香族二羧酸(二價之芳香族羧酸)與二醇成分之縮聚所獲得之聚酯系熱塑性樹脂。 The polyester-based elastomer is not particularly limited as long as it is a resin having an ester bond site formed by a reaction (polycondensation) of a polyol component and a polycarboxylic acid component, and examples thereof include an aromatic dicarboxylic acid (II). A polyester-based thermoplastic resin obtained by polycondensation of a valence aromatic carboxylic acid) and a diol component.

作為上述芳香族二羧酸,例如可列舉對苯二甲酸、間苯二甲酸、鄰苯二甲酸、萘羧酸(例如,2,6-萘二甲酸、1,4-萘二甲酸等)、二苯醚二羧酸、4,4'-聯苯二羧酸等。再者,芳香族二羧酸係亦可單獨使用,或者將2種以上組合使用。 Examples of the aromatic dicarboxylic acid include terephthalic acid, isophthalic acid, phthalic acid, and naphthalenecarboxylic acid (for example, 2,6-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, etc.). Diphenyl ether dicarboxylic acid, 4,4'-biphenyldicarboxylic acid, and the like. Further, the aromatic dicarboxylic acid system may be used singly or in combination of two or more kinds.

又,作為上述二醇成分,例如可列舉乙二醇、丙二醇、1,3-丙二醇、1,4-丁二醇(tetramethylene glycol)、2-甲基-1,3-丙二醇、1,5-戊二醇、2,2-二甲基-1,3-丙二醇(新戊二醇)、1,6-己二醇、3-甲基-1,5-戊二醇、2-甲基-2,4-戊二醇、1,7-庚二醇、2,2-二乙基-1,3-丙二醇、2-甲基-2-丙基-1,3-丙二醇、2-甲基-1,6-己二醇、1,8-辛二醇、2-丁基-2-乙基-1,3-丙二醇、1,3,5-三甲基-1,3-戊二醇、1,9-壬二醇、2,4-二乙基-1,5-戊二醇、2-甲基-1,8-辛二醇、1,10-癸二醇、2-甲基-1,9-壬二醇、 1,18-十八烷二醇、二聚醇等脂肪族二醇;1,4-環己二醇、1,3-環己二醇、1,2-環己二醇、1,4-環己烷二甲醇、1,3-環己烷二甲醇、1,2-環己烷二甲醇等脂環式二醇;雙酚A、雙酚A之環氧乙烷加成物、雙酚S、雙酚S之環氧乙烷加成物、苯二甲基二醇、萘二醇等芳香族二醇;二乙二醇、三乙二醇、四乙二醇、聚乙二醇、二丙二醇等醚二醇等二醇成分等。再者,作為二醇成分,亦可為聚醚二醇或聚酯二醇等聚合物形態之二醇成分。作為上述聚醚二醇,例如可列舉使環氧乙烷、環氧丙烷、四氫呋喃等進行開環聚合之聚乙二醇、聚丙二醇、聚丁二醇及將該等進行共聚合之共聚醚等聚醚二醇等。又,二醇成分係亦可單獨使用,或者將2種以上組合使用。 Further, examples of the diol component include ethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, 2-methyl-1,3-propanediol, and 1,5- Pentandiol, 2,2-dimethyl-1,3-propanediol (neopentyl glycol), 1,6-hexanediol, 3-methyl-1,5-pentanediol, 2-methyl- 2,4-pentanediol, 1,7-heptanediol, 2,2-diethyl-1,3-propanediol, 2-methyl-2-propyl-1,3-propanediol, 2-methyl -1,6-hexanediol, 1,8-octanediol, 2-butyl-2-ethyl-1,3-propanediol, 1,3,5-trimethyl-1,3-pentanediol 1,9-nonanediol, 2,4-diethyl-1,5-pentanediol, 2-methyl-1,8-octanediol, 1,10-nonanediol, 2-methyl -1,9-nonanediol, An aliphatic diol such as 1,18-octadecanediol or a dimer; 1,4-cyclohexanediol, 1,3-cyclohexanediol, 1,2-cyclohexanediol, 1,4- An alicyclic diol such as cyclohexane dimethanol, 1,3-cyclohexane dimethanol or 1,2-cyclohexane dimethanol; bisphenol A, an ethylene oxide adduct of bisphenol A, bisphenol S, an ethylene oxide adduct of bisphenol S, an aromatic diol such as benzene dimethyl glycol or naphthalene diol; diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol, A diol component such as an ether diol such as dipropylene glycol. Further, the diol component may be a diol component in a polymer form such as a polyether diol or a polyester diol. Examples of the polyether diol include polyethylene glycol, polypropylene glycol, polytetramethylene glycol, which are subjected to ring-opening polymerization of ethylene oxide, propylene oxide, tetrahydrofuran, and the like, and copolyethers obtained by copolymerizing the same. Polyether glycol and the like. Further, the diol component may be used singly or in combination of two or more.

作為上述聚酯系熱塑性樹脂,例如可列舉聚對苯二甲酸乙二酯、聚對苯二甲酸丙二酯、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯、聚萘二甲酸丁二酯、聚環己烷對苯二甲酸酯等聚對苯二甲酸烷二酯系樹脂等。又,亦可列舉將上述聚對苯二甲酸烷二酯系樹脂2種以上進行共聚合所獲得之共聚物。再者,於聚對苯二甲酸烷二酯系樹脂為共聚物之情形時,亦可為無規共聚物、嵌段共聚物、接枝共聚物之任一種形態之共聚物。 Examples of the polyester-based thermoplastic resin include polyethylene terephthalate, polytrimethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polynaphthalene dicarboxylic acid. A polyalkylene terephthalate resin such as butadiene ester or polycyclohexane terephthalate. Further, a copolymer obtained by copolymerizing two or more kinds of the above polyalkylene terephthalate resins may be used. Further, when the polyalkylene terephthalate resin is a copolymer, it may be a copolymer of any of a random copolymer, a block copolymer, and a graft copolymer.

進而,作為聚酯系彈性體,可列舉作為硬鏈段(hard segment)及軟鏈段(soft segment)之嵌段共聚物之聚酯系彈性體。 Further, examples of the polyester-based elastomer include a polyester-based elastomer which is a block copolymer of a hard segment and a soft segment.

作為此種聚酯系彈性體(作為硬鏈段及軟鏈段之嵌段共聚物之聚酯系彈性體),例如可列舉(i)將上述芳香族二羧酸和上述二醇成分中羥基與羥基之間之主鏈中之碳數為2~4之二醇成分的藉由縮聚所形成之聚酯設為硬鏈段並將上述芳香族二羧酸和上述二醇成分中羥基與羥基之間之主鏈中之碳數為5以上之二醇成分的藉由縮聚所形成之聚酯設為軟鏈段之聚酯‧聚酯型之共聚物;(ii)將與上述(i)相同之聚酯設為硬鏈段並將上述聚醚二醇等聚醚設為軟鏈段之聚酯‧聚醚型之共聚 物;(iii)將與上述(i)及(ii)相同之聚酯設為硬鏈段並將脂肪族聚酯設為軟鏈段之聚酯‧聚酯型之共聚物等。 Examples of the polyester-based elastomer (the polyester-based elastomer which is a block copolymer of a hard segment and a soft segment) include (i) a hydroxyl group in the above aromatic dicarboxylic acid and the above-mentioned diol component. A polyester formed by polycondensation of a diol component having a carbon number of 2 to 4 in a main chain with a hydroxyl group is a hard segment and a hydroxyl group and a hydroxyl group in the above aromatic dicarboxylic acid and the above diol component a polyester formed by polycondensation of a diol component having a carbon number of 5 or more in the main chain is a polyester/polyester copolymer of a soft segment; (ii) and (i) above Copolymerization of polyester ‧ polyether type in which the same polyester is set as a hard segment and the polyether such as polyether diol is set as a soft segment (iii) a polyester ‧ polyester type copolymer in which the polyesters similar to the above (i) and (ii) are hard segments and the aliphatic polyester is a soft segment.

尤其,於本發明之樹脂發泡體為聚酯系彈性體發泡體之情形時,作為進行構成之聚酯系彈性體,較佳為作為硬鏈段及軟鏈段之嵌段共聚物之聚酯系彈性體,更佳為上述(ii)之聚酯‧聚醚型之共聚物(將芳香族二羧酸和羥基與羥基之間之主鏈中之碳數為2~4之二醇成分的藉由縮聚所形成之聚酯設為硬鏈段並將聚醚設為軟鏈段之聚酯‧聚醚型之共聚物)。 In particular, when the resin foam of the present invention is a polyester elastomer foam, the polyester elastomer to be formed is preferably a block copolymer of a hard segment and a soft segment. a polyester elastomer, more preferably a polyester ‧ polyether copolymer of the above (ii) (a diol having a carbon number of 2 to 4 in the main chain between the aromatic dicarboxylic acid and the hydroxyl group and the hydroxyl group) The polyester formed by the polycondensation of the component is a hard segment and the polyether is a soft segment of the polyester ‧ polyether copolymer).

作為上述(ii)之聚酯‧聚醚型之共聚物,更具體而言可列舉具有作為硬鏈段之聚對苯二甲酸丁二酯及作為軟鏈段之聚醚之聚酯‧聚醚型嵌段共聚物等。 The polyester ‧ polyether type copolymer of the above (ii), more specifically, a polyester ‧ polyether having a polybutylene terephthalate as a hard segment and a polyether as a soft segment Type block copolymer and the like.

構成本發明之樹脂發泡體之樹脂在230℃下之熔融流動速率(MFR,Melt Flow Rate)並無特別限定,較佳為1.5~4.0g/10min,更佳為1.5~3.8g/10min,進而較佳為1.5~3.5g/10min。若樹脂在230℃下之熔融流動速率(MFR)為1.5g/10min以上,則形成本發明之樹脂發泡體時所使用之樹脂組合物之成形性提高,因此較理想。又,若樹脂在230℃下之熔融流動速率(MFR)為4.0g/10min以下,則泡孔結構形成後難以產生泡孔直徑之偏差,容易獲得均勻之泡孔結構,因此較理想。再者,於本說明書中,230℃下之MFR係指基於ISO1133(JIS K 7210),以溫度230℃、負荷2.16kgf所測定之MFR。 The melt flow rate (MFR, Melt Flow Rate) of the resin constituting the resin foam of the present invention at 230 ° C is not particularly limited, but is preferably 1.5 to 4.0 g/10 min, more preferably 1.5 to 3.8 g/10 min. Further preferably, it is 1.5 to 3.5 g/10 min. When the melt flow rate (MFR) of the resin at 230 ° C is 1.5 g/10 min or more, the formability of the resin composition used in forming the resin foam of the present invention is improved, which is preferable. Further, when the melt flow rate (MFR) of the resin at 230 ° C is 4.0 g/10 min or less, it is difficult to cause a variation in the cell diameter after the formation of the cell structure, and it is easy to obtain a uniform cell structure, which is preferable. In the present specification, the MFR at 230 ° C means the MFR measured at a temperature of 230 ° C and a load of 2.16 kgf based on ISO 1133 (JIS K 7210).

即,本發明之樹脂發泡體較佳為由含有230℃下之熔融流動速率(MFR)為1.5~4.0g/10min之樹脂之樹脂組合物所形成。尤其,於本發明之樹脂發泡體為聚酯系彈性體發泡體之情形時,較佳為由含有230℃下之熔融流動速率(MFR)為1.5~4.0g/10min之聚酯系彈性體(尤其是作為硬鏈段及軟鏈段之嵌段共聚物之聚酯系彈性體)之樹脂組合物所形成。 That is, the resin foam of the present invention is preferably formed of a resin composition containing a resin having a melt flow rate (MFR) of from 230 to 4.0 g/10 min at 230 °C. In particular, in the case where the resin foam of the present invention is a polyester elastomer foam, it is preferred to have a polyester-based elasticity containing a melt flow rate (MFR) at 230 ° C of 1.5 to 4.0 g/10 min. A resin composition of a body (especially a polyester elastomer which is a block copolymer of a hard segment and a soft segment).

形成本發明之樹脂發泡體之樹脂組合物較佳為除含有上述樹脂以外,含有發泡核劑。若上述樹脂組合物含有發泡核劑,則容易獲得良好之發泡狀態之樹脂發泡體。再者,發泡核劑係亦可單獨使用,或者將2種以上組合使用。 The resin composition forming the resin foam of the present invention preferably contains a foaming nucleating agent in addition to the above resin. When the resin composition contains a foaming nucleating agent, it is easy to obtain a resin foam having a good foaming state. Further, the foaming nucleating agent may be used singly or in combination of two or more.

作為上述發泡核劑,並無特別限定,可較佳地列舉無機物。作為上述無機物,例如可列舉氫氧化鋁、氫氧化鉀、氫氧化鈣、氫氧化鎂等氫氧化物;黏土(尤其是硬黏土);滑石;二氧化矽;沸石;例如,碳酸鈣、碳酸鎂等鹼土類金屬碳酸鹽;例如,氧化鋅、氧化鈦、氧化鋁等金屬氧化物;例如,鐵粉、銅粉、鋁粉、鎳粉、鋅粉、鈦粉等各種金屬粉,合金之粉等金屬粉;雲母;碳粒子;玻璃纖維;碳管;層狀矽酸鹽;玻璃等。 The foaming nucleating agent is not particularly limited, and an inorganic material can be preferably used. Examples of the inorganic substance include hydroxides such as aluminum hydroxide, potassium hydroxide, calcium hydroxide, and magnesium hydroxide; clay (especially hard clay); talc; cerium oxide; zeolite; for example, calcium carbonate and magnesium carbonate. An alkaline earth metal carbonate; for example, a metal oxide such as zinc oxide, titanium oxide or aluminum oxide; for example, various metal powders such as iron powder, copper powder, aluminum powder, nickel powder, zinc powder, titanium powder, alloy powder, etc. Metal powder; mica; carbon particles; glass fiber; carbon tube; layered niobate; glass.

其中,至於作為發泡核劑之無機物,就抑制粗大泡孔之產生,可容易獲得均勻且微細之泡孔結構之方面而言,較佳為黏土、鹼土類金屬碳酸鹽,更佳為硬黏土。 Among them, as the inorganic substance as the foaming nucleating agent, the generation of coarse cells is suppressed, and a uniform and fine cell structure can be easily obtained, and clay, alkaline earth metal carbonate, and more preferably hard clay are preferable. .

上述硬黏土係幾乎不含有粗大粒子之黏土。尤其,上述硬黏土較佳為166網眼篩餘物為0.01%以下之黏土,更佳為166網眼篩餘物為0.001%以下之黏土。再者,篩餘物(篩殘餘物)係利用篩進行篩分時,未穿過而殘留者對整體之比例(重量基準)。 The above hard clay system contains almost no clay of coarse particles. In particular, the hard clay is preferably a clay having a mesh residue of 0.01% or less of 0.01%, more preferably 0.001% or less of clay having a mesh residue of 0.001% or less. Further, the sieve residue (sieve residue) is a ratio (weight basis) of the residue to the whole when it is sieved by a sieve.

上述硬黏土係以氧化鋁及氧化矽作為必需成分所構成。上述硬黏土中之氧化鋁及氧化矽之合計比例係相對於上述硬黏土總量(100重量%),較佳為80重量%以上(例如80~100重量%),更佳為90重量%以上(例如90~100重量%)。又,上述硬黏土亦可進行煅燒。 The hard clay is composed of alumina and cerium oxide as essential components. The total ratio of the alumina and the cerium oxide in the hard clay is preferably 80% by weight or more (for example, 80 to 100% by weight), more preferably 90% by weight or more based on the total amount of the hard clay (100% by weight). (for example, 90 to 100% by weight). Further, the hard clay may be calcined.

上述硬黏土之平均粒徑(average grain diameter)並無特別限定,較佳為0.1~10μm,更佳為0.2~5.0μm,進而較佳為0.5~1.0μm。 The average grain diameter of the hard clay is not particularly limited, but is preferably 0.1 to 10 μm, more preferably 0.2 to 5.0 μm, still more preferably 0.5 to 1.0 μm.

又,上述無機物較佳為進行表面加工。即,上述發泡核劑較佳為經表面處理之無機物。作為無機物之表面處理時所使用之表面處理 劑,並無特別限定,就藉由實施表面加工處理而使與樹脂(尤其是聚酯)之親和性變得良好,獲得發泡時、成形時、混練時、延伸時等不產生空孔且發泡時泡孔不會破泡之效果之方面而言,可較佳地列舉鋁系化合物、矽烷系化合物、鈦酸酯系化合物、環氧系化合物、異氰酸酯系化合物、高級脂肪酸或其鹽及磷酸酯類,可更佳地列舉矽烷系化合物(尤其是矽烷偶合劑)、高級脂肪酸或其鹽(尤其是硬脂酸)。再者,上述表面處理劑係亦可單獨使用,或者將2種以上組合使用。 Further, the inorganic material is preferably subjected to surface processing. That is, the foaming nucleating agent is preferably a surface-treated inorganic substance. Surface treatment used as a surface treatment for inorganic materials The agent is not particularly limited, and the affinity with a resin (especially polyester) is improved by performing a surface treatment, and voids are not generated during foaming, molding, kneading, stretching, and the like. In view of the effect of not breaking the cells at the time of foaming, an aluminum compound, a decane compound, a titanate compound, an epoxy compound, an isocyanate compound, a higher fatty acid or a salt thereof and preferably As the phosphate ester, a decane-based compound (especially a decane coupling agent), a higher fatty acid or a salt thereof (especially stearic acid) can be more preferably exemplified. In addition, the surface treatment agent may be used alone or in combination of two or more.

即,上述無機物之表面處理加工尤佳為矽烷偶合處理、或者利用高級脂肪酸或其鹽之處理。 That is, the surface treatment of the above inorganic substance is preferably a decane coupling treatment or a treatment using a higher fatty acid or a salt thereof.

上述鋁系化合物並無特別限定,較佳為鋁系偶合劑。作為上述鋁系偶合劑,例如可列舉乙醯烷氧基二異丙醇鋁、乙醇鋁、異丙醇鋁、單-第二丁氧基二異丙醇鋁、第二丁醇鋁、乙醯乙酸乙酯二異丙醇鋁、三(乙醯乙酸乙酯)鋁、單乙醯丙酮雙(乙醯乙酸乙酯)鋁、三(乙醯丙酮)鋁、異丙酸環鋁氧化物(Cyclic Aluminum Oxide Isopropylate)、異硬脂酸環鋁氧化物(Cyclic Aluminum Oxide Isostearate)等。 The aluminum compound is not particularly limited, and is preferably an aluminum coupling agent. Examples of the aluminum-based coupling agent include aluminum acetaloxydiisopropylate, aluminum ethoxide, aluminum isopropoxide, aluminum mono-t-butoxydiisopropylate, aluminum second butoxide, and acetamidine. Ethyl acetate diisopropoxide aluminum, tris(acetonitrile ethyl acetate) aluminum, monoethyl acetonacetone bis(acetonitrile ethyl acetate) aluminum, tris(acetonitrile)aluminum, isopropyl acid cycloaluminum oxide (Cyclic Aluminum Oxide Isopropylate), Cyclic Aluminum Oxide Isostearate, and the like.

上述矽烷系化合物並無特別限定,較佳為矽烷系偶合劑。作為上述矽烷系偶合劑,例如可列舉含有乙烯基之矽烷系偶合劑、含有(甲基)丙烯醯基之矽烷系偶合劑、含有胺基之矽烷系偶合劑、含有環氧基之矽烷系偶合劑、含有巰基之矽烷系偶合劑、含有羧基之矽烷系偶合劑、含有鹵素原子之矽烷系偶合劑等。具體而言,作為矽烷系偶合劑,例如可列舉乙烯基三甲氧基矽烷、乙烯基乙氧基矽烷、二甲基乙烯基甲氧基矽烷、二甲基乙烯基乙氧基矽烷、甲基乙烯基二甲氧基矽烷、甲基乙烯基二乙氧基矽烷、乙烯基-三(2-甲氧基)矽烷、乙烯基三乙醯氧基矽烷、2-甲基丙烯醯氧基乙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3- 甲基丙烯醯氧基-丙基甲基二甲氧基矽烷、3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、2-胺基乙基三甲氧基矽烷、3-[N-(2-胺基乙基)胺基]丙基三甲氧基矽烷、3-[N-(2-胺基乙基)胺基]丙基三乙氧基矽烷、2-[N-(2-胺基乙基)胺基]乙基三甲氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷、2-(3,4-環氧環己基)乙基三乙氧基矽烷、3-縮水甘油氧基-丙基三甲氧基矽烷、3-縮水甘油氧基-丙基甲基二乙氧基矽烷、2-縮水甘油氧基-乙基三甲氧基矽烷、2-縮水甘油氧基-乙基三乙氧基矽烷、3-巰基丙基三甲氧基矽烷、羧基甲基三乙氧基矽烷、3-羧基丙基三甲氧基矽烷、3-羧基丙基三乙氧基矽烷等。 The decane-based compound is not particularly limited, and is preferably a decane-based coupling agent. Examples of the decane-based coupling agent include a vinyl-containing decane-based coupling agent, a (meth)acryl-based decane-based coupling agent, an amine-containing decane-based coupling agent, and an epoxy group-containing decane-based coupling agent. A mixture, a decane-based coupling agent containing a mercapto group, a decane-based coupling agent containing a carboxyl group, a decane-based coupling agent containing a halogen atom, and the like. Specific examples of the decane coupling agent include vinyl trimethoxy decane, vinyl ethoxy decane, dimethyl vinyl methoxy decane, dimethyl vinyl ethoxy decane, and methyl ethylene. Dimethoxy decane, methyl vinyl diethoxy decane, vinyl tris(2-methoxy) decane, vinyl triethoxy decane, 2-methyl propylene methoxyethyl three Ethoxy decane, 3-methacryloxypropyltrimethoxydecane, 3-methylpropenyloxypropyltriethoxydecane, 3- Methyl propylene methoxy-propyl methyl dimethoxy decane, 3-aminopropyl trimethoxy decane, 3-aminopropyl triethoxy decane, 2-aminoethyl trimethoxy decane 3-[N-(2-Aminoethyl)amino]propyltrimethoxydecane, 3-[N-(2-aminoethyl)amino]propyltriethoxydecane, 2- [N-(2-Aminoethyl)amino]ethyltrimethoxydecane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, 2-(3,4-epoxy ring Hexyl)ethyltriethoxydecane, 3-glycidoxy-propyltrimethoxydecane, 3-glycidoxy-propylmethyldiethoxydecane, 2-glycidoxy-ethyl Trimethoxydecane, 2-glycidoxy-ethyltriethoxydecane, 3-mercaptopropyltrimethoxydecane, carboxymethyltriethoxydecane, 3-carboxypropyltrimethoxydecane, 3 -Carboxypropyltriethoxydecane, and the like.

上述鈦酸酯系化合物並無特別限定,較佳為鈦酸酯系偶合劑。作為上述鈦酸酯系偶合劑,例如可列舉三異硬脂醯基鈦酸異丙酯、三(二辛基焦磷醯氧基)鈦酸異丙酯、三(N-胺基乙基-胺基乙基)鈦酸異丙酯、十三烷基苯磺醯基鈦酸異丙酯、四異丙基雙(二辛基亞磷醯氧基)鈦酸酯、四辛基雙(二-十三烷基亞磷醯氧基)鈦酸酯、四(2,2-二烯丙氧基甲基-1-丁基)雙(二-十三烷基)亞磷醯氧基鈦酸酯、雙(二辛基焦磷醯氧基)羥乙酸鈦酸酯、雙(二辛基焦磷醯氧基)乙烯鈦酸酯、三辛醯基鈦酸異丙酯、二甲基丙烯醯基異硬脂醯基鈦酸異丙酯、異硬脂醯基二丙烯醯基鈦酸異丙酯、三(二辛基磷醯氧基)鈦酸異丙酯、三異丙苯基苯基鈦酸異丙酯、二異丙苯基苯基羥乙酸鈦酸酯、二異硬脂醯基乙烯鈦酸酯等。 The titanate-based compound is not particularly limited, and is preferably a titanate-based coupling agent. Examples of the titanate coupling agent include isopropyl triisostearate isopropyl titanate, isopropyl tris(dioctylpyrophosphonium oxy)titanate, and tris(N-aminoethyl- Isopropyl ethyl) isopropyl titanate, isopropyl tridecyl benzene sulfonyl titanate, tetraisopropyl bis(dioctylphosphonium oxy) titanate, tetraoctyl bis (two) -tridecylphosphonium oxy) titanate, tetrakis(2,2-diallyloxymethyl-1-butyl)bis(di-tridecyl)phosphite-titoxytitanate Ester, bis(dioctylpyridiniumoxy)glycolic acid titanate, bis(dioctylpyridiniumoxy)ethene titanate, trioctylphosphonium titanate, dimethyl methacrylate Isopropyl stearyl phthalate, isopropyl isostearyl bis propylene methacrylate, isopropyl tris(dioctylphosphonium oxy) titanate, triisopropylphenyl phenyl titanic acid Isopropyl ester, dicumylphenyl hydroxyglycolate titanate, diisostearate vinyl titanate, and the like.

上述環氧化合物並無特別限定,較佳為環氧系樹脂、單環氧系化合物。作為上述環氧系樹脂,例如可列舉雙酚A型環氧系樹脂等縮水甘油醚型環氧樹脂、縮水甘油酯型環氧樹脂、縮水甘油胺型環氧樹脂、脂環型環氧樹脂等。又,作為上述單環氧系化合物,例如可列舉環氧苯乙烷、縮水甘油基苯醚、烯丙基縮水甘油醚、(甲基)丙烯酸縮水甘油酯、1,2-環氧環己烷、表氯醇、去水甘油等。 The epoxy compound is not particularly limited, and is preferably an epoxy resin or a monoepoxy compound. Examples of the epoxy resin include a glycidyl ether epoxy resin such as a bisphenol A epoxy resin, a glycidyl ester epoxy resin, a glycidylamine epoxy resin, and an alicyclic epoxy resin. . Further, examples of the monoepoxy compound include styrene oxide, glycidyl phenyl ether, allyl glycidyl ether, glycidyl (meth)acrylate, and 1,2-epoxycyclohexane. , epichlorohydrin, deglycerin, etc.

上述異氰酸酯系化合物並無特別限定,較佳為聚異氰酸酯系化合物、單異氰酸酯系化合物。作為上述聚異氰酸酯系化合物,例如可列舉四亞甲基二異氰酸酯、六亞甲基二異氰酸酯等脂肪族二異氰酸酯;異佛酮二異氰酸酯、4,4'-二環己基甲烷二異氰酸酯等脂環式二異氰酸酯;二苯基甲烷二異氰酸酯、2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、亞苯基二異氰酸酯、1,5-萘二異氰酸酯、苯二亞甲基二異氰酸酯、甲苯基二異氰酸酯等芳香族二異氰酸酯;具有藉由該等二異氰酸酯化合物與多元醇化合物之反應所形成之自由異氰酸酯基的聚合物等。又,作為上述單異氰酸酯系化合物,例如可列舉異氰酸苯酯、異氰酸硬脂酯等。 The isocyanate compound is not particularly limited, and is preferably a polyisocyanate compound or a monoisocyanate compound. Examples of the polyisocyanate-based compound include aliphatic diisocyanates such as tetramethylene diisocyanate and hexamethylene diisocyanate; and alicyclic groups such as isophorone diisocyanate and 4,4′-dicyclohexylmethane diisocyanate; Diisocyanate; diphenylmethane diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, phenylene diisocyanate, 1,5-naphthalene diisocyanate, benzene dimethylene diisocyanate, tolyl An aromatic diisocyanate such as a diisocyanate; a polymer having a free isocyanate group formed by the reaction of the diisocyanate compound and a polyol compound. Further, examples of the monoisocyanate compound include phenyl isocyanate and stearyl isocyanate.

作為上述高級脂肪酸或其鹽,例如可列舉油酸、硬脂酸、棕櫚酸、月桂酸等高級脂肪酸及該高級脂肪酸之鹽(例如,金屬鹽等)。作為上述高級脂肪酸之金屬鹽中之金屬原子,例如可列舉鈉原子、鉀原子等鹼金屬原子,鎂原子、鈣原子等鹼土類金屬原子等。 Examples of the higher fatty acid or a salt thereof include higher fatty acids such as oleic acid, stearic acid, palmitic acid, and lauric acid, and salts of the higher fatty acid (for example, metal salts). Examples of the metal atom in the metal salt of the above-mentioned higher fatty acid include an alkali metal atom such as a sodium atom or a potassium atom, and an alkaline earth metal atom such as a magnesium atom or a calcium atom.

上述磷酸酯類較佳為磷酸偏酯類。作為上述磷酸偏酯類,例如可列舉磷酸(正磷酸等)一部分藉由醇成分(硬脂醇等)而進行酯化(單酯化或二酯化)之磷酸偏酯、或者該磷酸偏酯之鹽(利用鹼金屬等之金屬鹽等)等。 The above phosphates are preferably partial esters of phosphoric acid. Examples of the above-mentioned phosphoric acid partial esters include a partial ester of phosphoric acid (monoesterified or diesterified) partially phosphoric acid (such as orthophosphoric acid), or a partial ester of the phosphoric acid. Salt (using a metal salt such as an alkali metal or the like) or the like.

作為對上述無機物利用表面處理劑進行表面處理時之方法,並無特別限定,例如可列舉乾式方法、濕式方法、整體摻合方法等。又,對無機物利用表面處理劑進行表面處理時之表面處理劑之量並無特別限定,相對於上述無機物100重量份,較佳為0.1~10重量份,更佳為0.3~8重量份。 The method for surface-treating the inorganic material by the surface treatment agent is not particularly limited, and examples thereof include a dry method, a wet method, and an overall blending method. In addition, the amount of the surface treatment agent in the surface treatment of the inorganic material by the surface treatment agent is not particularly limited, and is preferably 0.1 to 10 parts by weight, more preferably 0.3 to 8 parts by weight, per 100 parts by weight of the inorganic substance.

又,上述無機物之166網眼篩餘物並無特別限定,較佳為0.01%以下,更佳為0.001%以下。其原因在於:將樹脂組合物進行發泡時,若存在粗大粒子,則容易產生泡孔之破泡。其起因於粒子之大小超過 泡孔壁之厚度。 Further, the 166 mesh residue of the inorganic material is not particularly limited, but is preferably 0.01% or less, more preferably 0.001% or less. The reason for this is that when the resin composition is foamed, if coarse particles are present, foaming of the cells is likely to occur. It is caused by the size of the particles exceeding The thickness of the cell wall.

上述無機物之平均粒徑(average grain diameter)並無特別限定,較佳為0.1~10μm,更佳為0.2~5.0μm,進而較佳為0.5~1.0μm。若上述平均粒徑未達0.1μm,則存在作為核劑無法充分發揮作用之情形。另一方面,若上述平均粒徑超過10μm,則存在樹脂組合物之發泡時成為逸氣之原因之情形,故而較不理想。 The average grain diameter of the inorganic substance is not particularly limited, but is preferably 0.1 to 10 μm, more preferably 0.2 to 5.0 μm, still more preferably 0.5 to 1.0 μm. When the average particle diameter is less than 0.1 μm, it may not be sufficiently acted as a nucleating agent. On the other hand, when the average particle diameter exceeds 10 μm, there is a case where the resin composition becomes a cause of outgassing during foaming, which is not preferable.

尤其,上述發泡核劑係就可容易獲得與樹脂之親和性、或者可抑制樹脂與無機物之界面中之空孔產生所引起之發泡時之破泡而容易獲得微細之泡孔結構之方面而言,較佳為經表面處理加工之無機物(尤其是經表面處理加工之硬黏土)。 In particular, the above-mentioned foaming nucleating agent can easily obtain affinity with a resin, or can suppress foaming at the time of foaming due to generation of voids in the interface between the resin and the inorganic material, and can easily obtain a fine cell structure. In general, it is preferably a surface-treated inorganic substance (especially a surface-treated hard clay).

上述樹脂組合物中之發泡核劑之含量並無特別限定,相對於樹脂組合物總量(100重量%),較佳為0.1~20重量%,更佳為0.3~10重量%,進而較佳為0.5~6重量%。若上述含量為0.1重量%以上,若上述含量為0.1重量%以上,則可充分確保用以形成氣泡之部位(氣泡形成部位),容易獲得微細之泡孔結構,故而較理想。又,若上述含量為20重量%以下,則可抑制樹脂組合物之黏度明顯上升,進而可抑制樹脂組合物之發泡時之逸氣,容易獲得均勻之泡孔結構,故而較理想。 The content of the foaming nucleating agent in the resin composition is not particularly limited, and is preferably 0.1 to 20% by weight, more preferably 0.3 to 10% by weight, based on the total amount of the resin composition (100% by weight), and further Good is 0.5~6 wt%. When the content is 0.1% by weight or more, when the content is 0.1% by weight or more, the portion for forming bubbles (bubble forming portion) can be sufficiently ensured, and a fine cell structure can be easily obtained, which is preferable. In addition, when the content is 20% by weight or less, the viscosity of the resin composition is remarkably increased, and the outgas of the resin composition during foaming can be suppressed, and a uniform cell structure can be easily obtained, which is preferable.

又,上述樹脂組合物較佳為含有環氧改性聚合物。上述環氧改性聚合物係作為交聯劑發揮作用。又,作為提高樹脂組合物(尤其是含有聚酯系彈性體之樹脂組合物)之熔融張力及應變硬化度之改質劑(樹脂改質劑)發揮作用。因此,若上述樹脂組合物含有環氧改性聚合物,則獲得高發泡、微細且均勻之泡孔結構,並且獲得特定值以上之層間剝離強度,故而容易獲得柔軟性及優異之對載帶之特性(例如,自載帶剝離時之泡體破壞抑制性、對載帶之貼附性等)。再者,環氧改性聚合物係亦可單獨使用,或者將2種以上組合使用。 Further, the above resin composition preferably contains an epoxy-modified polymer. The above epoxy-modified polymer functions as a crosslinking agent. Moreover, it functions as a modifier (resin modifier) which improves the melt tension and the strain hardening degree of the resin composition (especially the resin composition containing a polyester-type elastomer). Therefore, when the resin composition contains an epoxy-modified polymer, a foamed structure having a high foaming, fineness, and uniformity is obtained, and an interlayer peeling strength of a specific value or more is obtained, so that flexibility and excellent carrier tape are easily obtained. Characteristics (for example, foam damage inhibition when peeling off from the carrier tape, adhesion to the carrier tape, etc.). Further, the epoxy-modified polymer may be used singly or in combination of two or more.

上述環氧改性聚合物並無特別限定,就與具有低分子量之環氧基之化合物相比難以形成立體網狀結構,可容易獲得熔融張力及應變硬化度優異之樹脂組合物(尤其是含有聚酯系彈性體之樹脂組合物)之方面而言,較佳為選自作為丙烯酸系聚合物之主鏈之末端或側鏈上具有環氧基之聚合物之環氧改性丙烯酸系聚合物或作為聚乙烯之主鏈之末端或側鏈上具有環氧基之聚合物之環氧改性聚乙烯的至少1種聚合物。 The epoxy-modified polymer is not particularly limited, and it is difficult to form a three-dimensional network structure as compared with a compound having a low molecular weight epoxy group, and a resin composition excellent in melt tension and strain hardening degree can be easily obtained (especially containing In terms of the resin composition of the polyester-based elastomer, an epoxy-modified acrylic polymer selected from a polymer having an epoxy group at the terminal or side chain of the main chain of the acrylic polymer is preferred. Or at least one polymer of an epoxy-modified polyethylene having a polymer having an epoxy group at the end of the main chain of the polyethylene or a side chain.

上述環氧改性聚合物之重量平均分子量並無特別限定,較佳為5,000~100,000,更佳為8,000~80,000,進而較佳為10,000~60,000,尤佳為20,000~60,000。再者,若分子量未達5,000,則存在環氧改性聚合物之反應性提高而無法進行高發泡化之情形。 The weight average molecular weight of the above epoxy-modified polymer is not particularly limited, but is preferably 5,000 to 100,000, more preferably 8,000 to 80,000, still more preferably 10,000 to 60,000, still more preferably 20,000 to 60,000. Further, when the molecular weight is less than 5,000, the reactivity of the epoxy-modified polymer is increased and the high foaming cannot be performed.

上述環氧改性聚合物之環氧當量並無特別限定,較佳為100~3000g/eq,更佳為200~2500g/eq,進而較佳為300~2000g/eq,尤佳為800~1600g/eq。若上述環氧改性聚合物之環氧當量為3000g/eq以下,則可充分提高樹脂組合物(尤其是含有聚酯系彈性體之樹脂組合物)之熔融張力及應變硬化度,容易獲得特定值以上之層間剝離強度或高發泡且微細之泡孔結構,因此較理想。又,若上述環氧改性聚合物之環氧當量為100g/eq以上,則可抑制環氧改性聚合物之反應性提高,樹脂組合物之黏度變得過高而無法進行高發泡化之不良情況,故而較理想。 The epoxy equivalent of the epoxy-modified polymer is not particularly limited, but is preferably 100 to 3000 g/eq, more preferably 200 to 2500 g/eq, still more preferably 300 to 2000 g/eq, and particularly preferably 800 to 1600 g. /eq. When the epoxy equivalent of the epoxy-modified polymer is 3,000 g/eq or less, the melt tension and strain hardening degree of the resin composition (especially the resin composition containing the polyester elastomer) can be sufficiently increased, and the specificity can be easily obtained. It is preferable that the interlayer peeling strength or the high foaming and fine cell structure is higher than the value. In addition, when the epoxy equivalent of the epoxy-modified polymer is 100 g/eq or more, the reactivity of the epoxy-modified polymer can be suppressed from being improved, and the viscosity of the resin composition becomes too high to allow high foaming. Bad conditions are therefore ideal.

上述環氧改性聚合物之黏度(B型黏度,25℃)並無特別限定,較佳為2000~4000mPa‧s,更佳為2500~3200mPa‧s。若上述環氧改性聚合物之黏度為2000mPa‧s以上,則抑制樹脂組合物之發泡時之氣泡壁之破壞而容易獲得高發泡且微細之泡孔結構,因此較理想。另一方面,若黏度為4000mPa‧s以下,則容易獲得樹脂組合物之流動性,可有效將樹脂組合物進行發泡,故而較理想。 The viscosity (B type viscosity, 25 ° C) of the above epoxy-modified polymer is not particularly limited, but is preferably from 2,000 to 4,000 mPa·s, more preferably from 2,500 to 3,200 mPa·s. When the viscosity of the epoxy-modified polymer is 2,000 mPa·s or more, it is preferable to suppress breakage of the cell wall during foaming of the resin composition and to easily obtain a highly foamed and fine cell structure. On the other hand, when the viscosity is 4,000 mPa·s or less, the fluidity of the resin composition is easily obtained, and the resin composition can be effectively foamed, which is preferable.

尤其,上述環氧改性聚合物較佳為重量平均分子量為5,000~100,000,環氧當量為100~3000g/eq。 In particular, the epoxy-modified polymer preferably has a weight average molecular weight of 5,000 to 100,000 and an epoxy equivalent of 100 to 3000 g/eq.

上述樹脂組合物中之上述環氧改性聚合物之含量並無特別限定,相對於樹脂組合物中之樹脂100重量份,較佳為0.5~15.0重量份,更佳為0.6~10.0重量份,進而較佳為0.7~7.0重量份,尤佳為0.8~3.0重量份。若上述環氧改性聚合物之含量為0.5重量份以上,則可提高樹脂組合物之熔融張力及應變硬化度,容易獲得特定值以上之層間剝離強度或高發泡且微細之泡孔結構,因此較理想。又,若上述環氧改性聚合物之含量為15.0重量份以下,則可抑制樹脂組合物之黏度變得過高而無法進行高發泡化之不良情況,容易獲得高發泡且微細之泡孔結構,因此較理想。 The content of the epoxy-modified polymer in the resin composition is not particularly limited, and is preferably 0.5 to 15.0 parts by weight, more preferably 0.6 to 10.0 parts by weight, per 100 parts by weight of the resin in the resin composition. Further, it is preferably 0.7 to 7.0 parts by weight, particularly preferably 0.8 to 3.0 parts by weight. When the content of the epoxy-modified polymer is 0.5 parts by weight or more, the melt tension and the strain hardening degree of the resin composition can be increased, and an interlayer peel strength of a specific value or more or a highly foamed and fine cell structure can be easily obtained. More ideal. In addition, when the content of the epoxy-modified polymer is 15.0 parts by weight or less, it is possible to suppress the problem that the viscosity of the resin composition is too high and the high foaming cannot be performed, and it is easy to obtain a highly foamed and fine cell structure. Therefore, it is ideal.

再者,上述環氧改性聚合物係可防止水解(例如,原料之吸濕所引起之水解等)、熱解、氧化分解等所造成之聚酯鏈之切斷,進而可將已被切斷之聚酯鏈進行再鍵結,故而可更提高含有聚酯系彈性體之樹脂組合物之熔融張力。又,於上述環氧改性聚合物中,由於環氧基在一個分子中具有多個環氧基,故而與先前之環氧系交聯劑相比更容易形成分支結構,可更提高含有聚酯系彈性體之樹脂組合物之應變硬化度。 Further, the epoxy-modified polymer can prevent the cutting of the polyester chain caused by hydrolysis (for example, hydrolysis due to moisture absorption of the raw material), pyrolysis, oxidative decomposition, etc., and can be cut. Since the broken polyester chain is re-bonded, the melt tension of the resin composition containing the polyester elastomer can be further improved. Further, in the above epoxy-modified polymer, since the epoxy group has a plurality of epoxy groups in one molecule, it is easier to form a branched structure than the conventional epoxy-based crosslinking agent, and the poly-containing polymer can be further improved. The degree of strain hardening of the resin composition of the ester elastomer.

又,上述樹脂組合物較佳為含有潤滑劑。若上述樹脂組合物含有潤滑劑,則樹脂組合物之成形性提高,故而較理想。滑動性變得良好,例如可自擠出機不停歇地以所需形狀容易擠出,故而較理想。再者,潤滑劑係亦可單獨使用,或者將2種以上組合使用。 Further, the above resin composition preferably contains a lubricant. When the resin composition contains a lubricant, the formability of the resin composition is improved, which is preferable. The slidability becomes good, and it is preferable, for example, to be easily extruded from the extruder in a desired shape without stopping. Further, the lubricants may be used singly or in combination of two or more.

作為上述潤滑劑,並無特別限定,例如可列舉脂肪族羧酸及其衍生物(例如,脂肪族羧酸酐、脂肪族羧酸之鹼金屬鹽、脂肪族羧酸之鹼土類金屬鹽等)。作為上述脂肪族羧酸及其衍生物,其中較佳為月桂酸及其衍生物、硬脂酸及其衍生物、丁烯酸及其衍生物、油酸及 其衍生物、順丁烯二酸及其衍生物、戊二酸及其衍生物、二十二酸及其衍生物、褐煤酸及其衍生物等碳數3~30之脂肪酸羧酸及其衍生物。又,碳數3~30之脂肪酸羧酸及其衍生物之中,就對樹脂組合物之分散性、溶解性、表面外觀改良之效果等觀點而言,較佳為硬脂酸及其衍生物、褐煤酸及其衍生物,尤佳為硬脂酸之鹼金屬鹽、硬脂酸之鹼土類金屬鹽。進而,硬脂酸之鹼金屬鹽、硬脂酸之鹼土類金屬鹽之中,更佳為硬脂酸鋅或硬脂酸鈣。 The lubricant is not particularly limited, and examples thereof include an aliphatic carboxylic acid and a derivative thereof (for example, an aliphatic carboxylic anhydride, an alkali metal salt of an aliphatic carboxylic acid, or an alkaline earth metal salt of an aliphatic carboxylic acid). As the above aliphatic carboxylic acid and derivatives thereof, preferred are lauric acid and derivatives thereof, stearic acid and derivatives thereof, crotonic acid and derivatives thereof, oleic acid and Its derivatives, maleic acid and its derivatives, glutaric acid and its derivatives, behenic acid and its derivatives, montanic acid and its derivatives, and other fatty acid carboxylic acids having 3 to 30 carbon atoms and their derivatives Things. Further, among the fatty acid carboxylic acids having a carbon number of 3 to 30 and derivatives thereof, stearic acid and derivatives thereof are preferred from the viewpoints of the dispersibility, solubility, and surface appearance of the resin composition. , montanic acid and its derivatives, particularly preferably alkali metal salts of stearic acid, alkaline earth metal salts of stearic acid. Further, among the alkali metal salts of stearic acid and the alkaline earth metal salts of stearic acid, zinc stearate or calcium stearate is more preferred.

又,作為上述潤滑劑,進而可列舉丙烯酸系潤滑劑。作為上述丙烯酸系潤滑劑之市售品,例如可列舉丙烯酸系高分子外部潤滑劑(商品名「Metablen L」,三菱麗陽(Mitsubishi Rayon)股份有限公司製造)等。 Further, examples of the lubricant include an acrylic lubricant. For example, an acrylic polymer external lubricant (trade name "Metablen L", manufactured by Mitsubishi Rayon Co., Ltd.) or the like can be mentioned as a commercial product of the above-mentioned acrylic lubricant.

尤其,作為上述潤滑劑,較佳為丙烯酸系潤滑劑。 In particular, as the lubricant, an acrylic lubricant is preferred.

上述樹脂組合物中之上述潤滑劑之含量並無特別限定,相對於樹脂組合物中之樹脂100重量份,較佳為0.1~20重量份,更佳為0.3~10重量份,進而較佳為0.5~8重量份。若上述潤滑劑之含量為0.1重量份以上,則容易獲得藉由含有上述潤滑劑所獲得之效果,故而較理想。另一方面,若上述潤滑劑之含量為20重量份以下,則抑制使樹脂組合物發泡時之氣泡逸出而可抑制無法進行高發泡化之不良情況,因此較理想。 The content of the lubricant in the resin composition is not particularly limited, and is preferably 0.1 to 20 parts by weight, more preferably 0.3 to 10 parts by weight, even more preferably 100 parts by weight of the resin in the resin composition. 0.5 to 8 parts by weight. When the content of the lubricant is 0.1 part by weight or more, the effect obtained by containing the lubricant is easily obtained, which is preferable. On the other hand, when the content of the lubricant is 20 parts by weight or less, it is preferable to suppress the escape of bubbles during foaming of the resin composition and to suppress the problem that high foaming cannot be performed.

於上述樹脂組合物中,在不抑制本申請案發明效果之範圍內,亦可含有交聯劑。作為上述交聯劑,並無特別限定,例如可列舉環氧系交聯劑、異氰酸酯系交聯劑、矽烷醇系交聯劑、三聚氰胺樹脂系交聯劑、金屬鹽系交聯劑、金屬螯合物系交聯劑、胺基樹脂系交聯劑等。再者,交聯劑係亦可單獨使用,或者將2種以上組合使用。 In the above resin composition, a crosslinking agent may be contained within a range not inhibiting the effects of the invention of the present application. The crosslinking agent is not particularly limited, and examples thereof include an epoxy crosslinking agent, an isocyanate crosslinking agent, a stanol alcohol crosslinking agent, a melamine resin crosslinking agent, a metal salt crosslinking agent, and a metal chelate. A compound-based crosslinking agent, an amine-based resin-based crosslinking agent, and the like. Further, the crosslinking agent may be used singly or in combination of two or more.

進而,於上述樹脂組合物中,在不抑制本申請案發明效果之範圍內,亦可含有結晶化促進劑。作為上述結晶化促進劑,並無特別限 定,例如可列舉烯烴系樹脂。作為此種烯烴系樹脂,較佳為分子量分佈廣泛且高分子量側具有肩峰之類型之樹脂、微交聯類型之樹脂(若干進行交聯而成之類型之樹脂)、長鏈分支類型之樹脂等。作為上述烯烴系樹脂,可列舉低密度聚乙烯、中密度聚乙烯、高密度聚乙烯、線狀低密度聚乙烯、聚丙烯、乙烯與丙烯之共聚物、乙烯或丙烯與其他α-烯烴(例如,丁烯-1、戊烯-1、己烯-1、4-甲基戊烯-1等)之共聚物、乙烯與其他乙烯性不飽和單體(例如,乙酸乙烯酯、丙烯酸、丙烯酸酯、甲基丙烯酸、甲基丙烯酸酯、乙烯醇等)之共聚物等。再者,於烯烴系樹脂為共聚物之情形時,亦可為無規共聚物、嵌段共聚物之任一種形態之共聚物。又,烯烴系樹脂係亦可單獨使用,或者將2種以上組合使用。 Further, the resin composition may contain a crystallization accelerator insofar as the effects of the invention of the present application are not inhibited. As the above crystallization accelerator, there is no particular limitation For example, an olefin resin can be mentioned. As such an olefin-based resin, a resin having a broad molecular weight distribution and a shoulder-type type on a high molecular weight side, a resin of a micro-crosslinking type (a resin in which a plurality of types are cross-linked), a resin having a long-chain branch type, and the like are preferable. . Examples of the olefin-based resin include low-density polyethylene, medium-density polyethylene, high-density polyethylene, linear low-density polyethylene, polypropylene, a copolymer of ethylene and propylene, ethylene or propylene, and other α-olefins (for example). a copolymer of butene-1, pentene-1, hexene-1, 4-methylpentene-1, etc., ethylene and other ethylenically unsaturated monomers (for example, vinyl acetate, acrylic acid, acrylate) a copolymer of methacrylic acid, methacrylic acid ester, vinyl alcohol, etc.). Further, when the olefin resin is a copolymer, it may be a copolymer of any of a random copolymer and a block copolymer. Further, the olefin resin may be used singly or in combination of two or more kinds.

進而,於上述樹脂組合物中,在不抑制本申請案發明效果之範圍內,亦可含有阻燃劑。其原因在於:本發明之樹脂發泡體係含有樹脂,故而具有容易燃燒之特性,但有時應用於電氣機器或電子機器用途等必須賦予阻燃性之用途。作為上述阻燃劑,並無特別限定,例如可列舉具有阻燃性之粉末粒子(例如,粉末狀之各種阻燃劑等),可較佳地列舉無機阻燃劑。作為上述無機阻燃劑,例如亦可為溴系阻燃劑、氯系阻燃劑、磷系阻燃劑、銻系阻燃劑等,但氯系阻燃劑或溴系阻燃劑係燃燒時產生對人體有害且對機器類具有腐蝕性之氣體成分,又,磷系阻燃劑或銻系阻燃劑存在有害性或爆發性等問題,故而較佳為無鹵-無銻系無機阻燃劑(不含有鹵素化合物及銻化合物之無機阻燃劑)。作為該無鹵-無銻系無機阻燃劑,例如可列舉氫氧化鋁、氫氧化鎂、氧化鎂‧氧化鎳之水合物、氧化鎂‧氧化鋅之水合物等水合金屬化合物等。再者,水合金屬氧化物亦可進行表面處理。上述阻燃劑係亦可單獨使用,或者將2種以上組合使用。 Further, the resin composition may contain a flame retardant within a range that does not inhibit the effects of the invention of the present application. The reason for this is that the resin foaming system of the present invention contains a resin and therefore has a property of being easily burned, but may be used for applications in which it is necessary to impart flame retardancy to an electric machine or an electronic device. The flame retardant is not particularly limited, and examples thereof include powder particles having flame retardancy (for example, various flame retardants in a powder form), and an inorganic flame retardant is preferably used. The inorganic flame retardant may be, for example, a bromine-based flame retardant, a chlorine-based flame retardant, a phosphorus-based flame retardant, or an antimony-based flame retardant, but a chlorine-based flame retardant or a bromine-based flame retardant is burned. When a gas component which is harmful to the human body and corrosive to the machine is generated, and the phosphorus-based flame retardant or the antimony-based flame retardant has problems such as harmfulness or explosiveness, it is preferably a halogen-free and non-antimony-based inorganic resistor. Burning agent (inorganic flame retardant that does not contain halogen compounds and antimony compounds). Examples of the halogen-free antimony-based inorganic flame retardant include hydrated metal compounds such as aluminum hydroxide, magnesium hydroxide, magnesium oxide, nickel oxide hydrate, and magnesium oxide/zinc oxide hydrate. Furthermore, the hydrated metal oxide can also be surface treated. These flame retardants may be used singly or in combination of two or more.

進而,於上述樹脂組合物中,在不抑制本發明效果之範圍內, 亦可視需要含有下述添加劑。作為此種添加劑,例如可列舉結晶核劑、塑化劑、著色劑(以黑色著色為目的之碳黑、顏料、染料等)、紫外線吸收劑、抗氧化劑、抗老化劑、增強劑、防靜電劑、界面活性劑、張力改質劑、抗收縮劑、流動性改質劑、硫化劑、表面處理劑、分散助劑、聚酯樹脂用改質劑等。又,添加劑係亦可單獨使用,或者將2種以上組合使用。 Further, in the above resin composition, within the range not inhibiting the effects of the present invention, The following additives may also be included as needed. Examples of such an additive include a crystal nucleating agent, a plasticizer, a coloring agent (carbon black for coloring, a pigment, a dye, etc.), an ultraviolet absorber, an antioxidant, an anti-aging agent, a reinforcing agent, and an antistatic agent. Agent, surfactant, tension modifier, anti-shrinkage agent, fluidity modifier, vulcanizing agent, surface treatment agent, dispersing aid, modifier for polyester resin, and the like. Further, the additives may be used singly or in combination of two or more.

尤其,上述樹脂組合物係就獲得特定值以上之層間剝離強度、特定範圍內之壓縮50%時之反彈力、特定範圍內之平均泡孔直徑及特定值以下之最大泡孔直徑,即便具有微細泡孔結構且柔軟,亦可以優異之水平獲得自載帶剝離時之泡體破壞抑制性及保持於載帶時之加工性及搬送性等對載帶之特性之方面而言,較佳為含有至少下述(i)~(iv)。 In particular, the resin composition obtains an interlayer peel strength of a specific value or more, a rebound force at a compression of 50% in a specific range, an average cell diameter within a specific range, and a maximum cell diameter of a specific value or less, even if it has a fineness. It is preferable that the cell structure is soft, and the foam damage suppressing property at the time of peeling off from the carrier tape and the workability and transportability at the time of carrying the tape are excellent at the level of the carrier tape. At least the following (i) to (iv).

(i):230℃下之熔融流動速率(MFR)為1.5~4.0g/10min之聚酯系彈性體(較佳為230℃下之熔融流動速率(MFR)為1.5~4.0g/10min,且作為硬鏈段及軟鏈段之嵌段共聚物之聚酯系彈性體,更佳為230℃下之熔融流動速率(MFR)為1.5~4.0g/10min,且將芳香族二羧酸和羥基與羥基之間之主鏈中之碳數為2~4之二醇成分的藉由縮聚所形成之聚酯設為硬鏈段並將聚醚設為軟鏈段之聚酯‧聚醚型之共聚物) (i): a polyester-based elastomer having a melt flow rate (MFR) of from 1.5 to 4.0 g/10 min at 230 ° C (preferably a melt flow rate (MFR) at 230 ° C of from 1.5 to 4.0 g/10 min, and The polyester elastomer as a block copolymer of a hard segment and a soft segment preferably has a melt flow rate (MFR) of from 1.5 to 4.0 g/10 min at 230 ° C, and an aromatic dicarboxylic acid and a hydroxyl group. a polyester formed by polycondensation of a diol component having a carbon number of 2 to 4 in a main chain with a hydroxyl group, which is a hard segment and a polyether as a soft segment. Copolymer)

(ii):環氧改性聚合物 (ii): epoxy modified polymer

(iii):潤滑劑(較佳為丙烯酸系潤滑劑) (iii): lubricant (preferably acrylic lubricant)

(iv):發泡核劑(較佳為經表面處理加工之無機物,更佳為經表面處理加工之硬黏土) (iv): foaming nucleating agent (preferably surface treated inorganic matter, more preferably surface treated hard clay)

作為上述樹脂組合物之製作方法,並無特別限定,例如可列舉將上述樹脂、視需要所添加之添加劑等進行混合之處理。再者,於製作時,亦可施加熱。 The method for producing the resin composition is not particularly limited, and examples thereof include a treatment in which the above-mentioned resin, an additive to be added, and the like are mixed. Furthermore, heat can also be applied during production.

上述樹脂組合物之熔融張力(拉取速度:2.0m/min)並無特別限 定,較佳為15~70cN,更佳為13~60cN,進而較佳為15~55cN,尤佳為26~50cN。若上述樹脂組合物之熔融張力未達10cN,則將上述樹脂組合物進行發泡之情形時,發泡倍率較低,難以形成獨立之氣泡,又,所形成之氣泡之形狀難以變得均勻。另一方面,若上述樹脂組合物之熔融張力超過70cN,則有流動性下降而對發泡造成不良影響之虞。 The melt tension (pull speed: 2.0 m/min) of the above resin composition is not particularly limited Preferably, it is preferably 15 to 70 cN, more preferably 13 to 60 cN, further preferably 15 to 55 cN, and particularly preferably 26 to 50 cN. When the melt tension of the resin composition is less than 10 cN, when the resin composition is foamed, the expansion ratio is low, and it is difficult to form independent bubbles, and the shape of the formed bubbles is less likely to be uniform. On the other hand, when the melt tension of the resin composition exceeds 70 cN, the fluidity is lowered to adversely affect the foaming.

再者,所謂熔融張力,意指使用規定之裝置,自規定之模頭,將以規定之溫度及擠出速度擠出之熔融樹脂,以規定之拉取速度拉取成繩狀時之張力。於本發明中,使用Malvern公司製造之Capillary Extrusion Rheometer(毛細管擠壓流變計),自直徑為2mm、長度為20mm之毛細管,將以8.8mm/min之固定速度擠出之樹脂以2m/min之拉取速度拉取之值設為熔融張力。 In addition, the term "melt tension" means a tension when a molten resin extruded at a predetermined temperature and an extrusion speed is drawn into a rope at a predetermined drawing speed from a predetermined die using a predetermined apparatus. In the present invention, a Capillary Extrusion Rheometer manufactured by Malvern Co., Ltd. was used, and a resin having a diameter of 2 mm and a length of 20 mm was used to extrude the resin at a fixed speed of 8.8 mm/min at 2 m/min. The pull rate of the pull speed is set to the melt tension.

又,熔融張力係自上述樹脂組合物之樹脂之熔點向高溫側10±2℃之溫度下進行測定所得值。其原因在於:樹脂在未達熔點之溫度下不會成為熔融狀態,另一方面,在自熔點向高溫側大幅超過之溫度下完全成為流動體,使得無法測定熔融張力。 Further, the melt tension was measured from the melting point of the resin of the resin composition to a temperature of 10 ± 2 ° C on the high temperature side. This is because the resin does not become in a molten state at a temperature that does not reach the melting point, and on the other hand, it completely becomes a fluid at a temperature that greatly exceeds the melting point to the high temperature side, so that the melt tension cannot be measured.

上述樹脂組合物之應變硬化度(應變速度:0.1[1/s])並無特別限定,但就均勻且緻密之泡孔結構,且抑制發泡時之泡孔之破泡而獲得高發泡之發泡體之方面而言,較佳為2.0~5.0,更佳為2.5~4.5。又,上述樹脂組合物之應變硬化度係上述樹脂組合物之樹脂之熔點下之應變硬化度。再者,應變硬化度係於測定單軸伸長黏度時,在自測定開始後隨著應變之增加而單軸伸長黏度緩慢上升之區域(線性區域)偏離,單軸伸長黏度上沖之區域(非線性區域)中,表示單軸伸長黏度之增加程度的指標。 The strain hardening degree (strain rate: 0.1 [1/s]) of the above resin composition is not particularly limited, but a uniform and dense cell structure is obtained, and foaming of cells at the time of foaming is suppressed to obtain high foaming. In terms of the foam, it is preferably from 2.0 to 5.0, more preferably from 2.5 to 4.5. Further, the strain hardening degree of the resin composition is a strain hardening degree at a melting point of the resin of the resin composition. Further, the strain hardening degree is a region in which the uniaxial elongation viscosity gradually rises (linear region) with an increase in strain after the start of the measurement, and the uniaxial elongation viscosity is over the region (non- In the linear region), an index indicating the degree of increase in the uniaxial elongation viscosity.

本發明之樹脂發泡體較佳為藉由將上述樹脂組合物進行發泡成形而形成。對上述樹脂組合物之發泡方法,並無特別限定,較佳為使 高壓之氣體含浸於樹脂組合物後,進行減壓(釋放壓力)之發泡方法。即,本發明之樹脂發泡體較佳為經過使高壓之氣體含浸於上述樹脂組合物後進行減壓之步驟而形成。 The resin foam of the present invention is preferably formed by foam molding the above resin composition. The foaming method of the above resin composition is not particularly limited, and it is preferred to After the high-pressure gas is impregnated into the resin composition, a pressure reduction method (release pressure) is performed. That is, the resin foam of the present invention is preferably formed by a step of impregnating the resin composition with a high-pressure gas and then reducing the pressure.

作為上述氣體,就獲得潔淨之樹脂發泡體之方面而言,較佳為惰性氣體。所謂惰性氣體,意指對樹脂組合物呈惰性且可含浸之氣體。再者,氣體係亦可混合使用。 As the gas, an inert gas is preferred in terms of obtaining a clean resin foam. By inert gas is meant a gas which is inert to the resin composition and which can be impregnated. Furthermore, the gas system can also be used in combination.

再者,作為樹脂組合物之發泡方法,亦可列舉物理性發泡方法(利用物理性方法之發泡方法)或化學性發泡方法(利用化學性方法之發泡方法)。擔心物理性發泡方法中,用作發泡劑(發泡劑氣體)之物質之可燃性或毒性及臭氧層破壞等對環境之影響,但使用惰性氣體之發泡方法係就不使用此種發泡劑之方面上考慮到環境之方法。於化學性發泡方法中,由於發泡劑所產生之發泡氣體之殘渣殘存於發泡體中,故而尤其是應用於低污染性之要求較高之電子機器時,存在腐蝕性氣體或氣體中之雜質所造成之污染成為問題之情形。然而,根據使用惰性氣體之發泡方法,可獲得不存在此種雜質等之潔淨之發泡體。進而,認為物理性發泡方法及化學性發泡方法之任一種方法中,均難以形成微細之泡孔結構,尤其是極為難以形成300μm以下之微細氣泡。 Further, examples of the foaming method of the resin composition include a physical foaming method (a foaming method using a physical method) or a chemical foaming method (a foaming method using a chemical method). Concerned about the environmental impact of the flammability or toxicity of the material used as a foaming agent (foaming agent gas) and the destruction of the ozone layer in the physical foaming method, but the foaming method using an inert gas does not use such a hair. The method of the environment is considered in terms of the foaming agent. In the chemical foaming method, since the residue of the foaming gas generated by the foaming agent remains in the foam, there is a corrosive gas or gas especially when applied to an electronic device having a high degree of low pollution. The pollution caused by the impurities in the problem becomes a problem. However, according to the foaming method using an inert gas, a clean foam in which such impurities or the like are not present can be obtained. Further, in any of the physical foaming method and the chemical foaming method, it is considered that it is difficult to form a fine cell structure, and in particular, it is extremely difficult to form fine bubbles of 300 μm or less.

作為上述惰性氣體,並無特別限定,例如可列舉二氧化碳氣體(碳酸氣體)、氮氣、氦氣、空氣等。其中,就含浸量較多且含浸速度較快之方面而言,較佳為二氧化碳氣體。 The inert gas is not particularly limited, and examples thereof include carbon dioxide gas (carbonic acid gas), nitrogen gas, helium gas, and air. Among them, carbon dioxide gas is preferred in terms of a large amount of impregnation and a high impregnation speed.

進而,就加快向樹脂組合物之含浸速度之方面而言,上述高壓之氣體較佳為超臨界狀態。在超臨界狀態下,向樹脂組合物之氣體之溶解度增大,可實現高濃度之混入。又,於含浸後之壓力急劇下降時,如上所述可以高濃度含浸,故而氣泡核之產生增多,即便孔隙率相同,該氣泡核生長所形成之氣泡之密度亦會增大,故而可獲得微細之氣泡。再者,二氧化碳之臨界溫度為31℃,臨界壓力為7.4MPa。 Further, in order to accelerate the impregnation speed to the resin composition, the high-pressure gas is preferably in a supercritical state. In the supercritical state, the solubility of the gas to the resin composition is increased, and high concentration of the mixture can be achieved. Further, when the pressure after impregnation is drastically lowered, as described above, it can be impregnated at a high concentration, so that the generation of bubble nuclei is increased, and even if the porosity is the same, the density of bubbles formed by the growth of the nuclei will increase, so that fineness can be obtained. Bubbles. Further, the critical temperature of carbon dioxide is 31 ° C and the critical pressure is 7.4 MPa.

如上所述,本發明之樹脂發泡體較佳為藉由使高壓之氣體含浸於樹脂組合物而製造,但此時,亦可使用預先將樹脂組合物成形為片狀等適當之形狀而製成未發泡樹脂成形體(未發泡成形物)後,使高壓之氣體含浸於該未發泡樹脂成形體,釋放壓力,由此進行發泡之批次方式,又,亦可使用將樹脂組合物在加壓下,與高壓之氣體一併進行混練,進行成形之同時釋放壓力,同時進行成形與發泡之連續方式。 As described above, the resin foam of the present invention is preferably produced by impregnating a resin composition with a high-pressure gas. However, in this case, a resin composition may be formed into a sheet shape or the like in advance. After forming an unfoamed resin molded body (unexpanded molded product), a high-pressure gas is impregnated into the unfoamed resin molded body, and a pressure is released to thereby form a batch method of foaming, and a resin may be used. The composition is kneaded together with a high-pressure gas under pressure to release the pressure while forming, while performing a continuous manner of forming and foaming.

對以批次方式製造本發明之樹脂發泡體之情形進行說明。於批次方式中,首先,製造樹脂發泡體時製造未發泡樹脂成形體,作為該未發泡樹脂成形體之製造方法,並無特別限定,例如可列舉將樹脂組合物使用單軸擠出機、雙軸擠出機等擠出機進行成形之方法;將樹脂組合物,預先使用滾輪、凸輪、捏合機、班布里型等設置有葉片之混練機均勻地進行混練,並使用熱板之加壓機等而加壓成形為特定厚度之方法;將樹脂組合物使用射出成形機進行成形之方法等。於該等方法中,較佳為以獲得所需之形狀或厚度之未發泡樹脂成形體之方式選擇適當之方法。再者,未發泡樹脂成形體係除擠出成形、加壓成形、射出成形以外,亦可利用其他成形方法而製造。又,未發泡樹脂成形體之形狀並不限定於片狀,可根據用途選擇各種形狀。例如可列舉片狀、輥狀、角柱狀、板狀等。其次,經過如下步驟而形成氣泡:將上述未發泡樹脂成形體(由樹脂組合物所形成之成形體)放入耐壓容器(高壓容器)中,注入(導入)高壓之氣體,使高壓之氣體含浸於未發泡樹脂成形體中之氣體含浸步驟;在充分含浸有高壓之氣體之時刻釋放壓力(通常,大氣壓為止),使未發泡樹脂成形體中產生氣泡核之減壓步驟;根據情況(視需要),藉由進行加熱而使氣泡核生長之加熱步驟。再者,亦可不設置加熱步驟,在室溫下使氣泡核生長。如此使氣泡生長後,視需要利用冷水等急速冷卻,將形狀固定化,由此可獲得樹脂發泡體。再者,高壓之氣體之導入係亦可連續進行亦可非連續進行。 進而,作為使氣泡核生長時之加熱方法,亦可採用水浴、油浴、熱輥、熱風烘箱、遠紅外線、近紅外線、微波等眾所周知或慣用之方法。 The case where the resin foam of the present invention is produced in a batch manner will be described. In the batch method, first, an unfoamed resin molded body is produced when the resin foam is produced, and the method for producing the unfoamed resin molded body is not particularly limited, and for example, the resin composition is uniaxially extruded. A method of forming an extruder such as a machine or a twin-screw extruder; and kneading the resin composition in advance using a kneading machine equipped with a blade such as a roller, a cam, a kneading machine, or a Banbury type, and using heat A method of press molding into a specific thickness by a press machine of a plate, a method of forming a resin composition by using an injection molding machine, or the like. Among these methods, an appropriate method is preferably selected in such a manner as to obtain an unexpanded resin molded body of a desired shape or thickness. Further, the unfoamed resin molding system may be produced by other molding methods in addition to extrusion molding, press molding, and injection molding. Moreover, the shape of the unfoamed resin molded body is not limited to a sheet shape, and various shapes can be selected depending on the application. For example, a sheet shape, a roll shape, a corner column shape, a plate shape, etc. are mentioned. Then, bubbles are formed by placing the above-mentioned unfoamed resin molded body (molded body formed of the resin composition) into a pressure-resistant container (high-pressure container), injecting (introducing) a high-pressure gas, and making high-pressure gas a gas impregnation step in which a gas is impregnated into an unfoamed resin molded body; a pressure reduction step (generally at atmospheric pressure) at a time when the gas is sufficiently impregnated with a high pressure, and a decompression step of generating a bubble nucleus in the unfoamed resin molded body; In the case (if necessary), a heating step of growing the bubble nuclei by heating. Further, the bubble nucleus may be grown at room temperature without providing a heating step. After the bubble is grown in this manner, it is rapidly cooled by cold water or the like as needed, and the shape is fixed, whereby a resin foam can be obtained. Further, the introduction of the high-pressure gas may be carried out continuously or discontinuously. Further, as a heating method for growing the bubble nuclei, a well-known or conventional method such as a water bath, an oil bath, a hot roll, a hot air oven, far infrared rays, near infrared rays, or microwaves may be used.

即,本發明之樹脂發泡體亦可藉由經過使高壓之氣體含浸於包含上述樹脂組合物之未發泡成形物後進行減壓之步驟使其發泡而形成。又,亦可藉由經過使高壓之氣體含浸於包含上述樹脂組合物之未發泡成形物後進行減壓之步驟,進而進行加熱而形成。 In other words, the resin foam of the present invention can be formed by foaming a high-pressure gas by impregnating an unfoamed molded article containing the resin composition and then decompressing it. Further, it may be formed by further heating by subjecting a high-pressure gas to an unfoamed molded article containing the resin composition, followed by depressurization.

另一方面,作為以連續方式製造之情形,例如可列舉藉由如下步驟製造之情形:將樹脂組合物,一面使用單軸擠出機、雙軸擠出機等擠出機進行混練,一面注入(導入)高壓之氣體,使氣體充分含浸於樹脂組合物中之混練含浸步驟;穿過設置於擠出機之前端之模頭等擠出樹脂組合物,由此釋放壓力(通常,大氣壓為止),同時進行成形與發泡之成形減壓步驟。又,根據情況(視需要),亦可設置藉由進行加熱而使氣泡生長之加熱步驟。如此使氣泡生長後,視需要利用冷水等急速冷卻,將形狀固定化,由此可獲得樹脂發泡體。再者,於上述混練含浸步驟及成形減壓步驟中,除擠出機以外,亦可使用射出成形機等。 On the other hand, in the case of being produced in a continuous manner, for example, a case where the resin composition is kneaded by using an extruder such as a single-axis extruder or a twin-screw extruder while being injected is used. (introducing) a high-pressure gas, a gas impregnation step in which the gas is sufficiently impregnated in the resin composition; extruding the resin composition through a die or the like provided at the front end of the extruder, thereby releasing the pressure (usually, at atmospheric pressure) At the same time, the forming and decompression steps of forming and foaming are carried out. Further, depending on the case (if necessary), a heating step of growing the bubbles by heating may be provided. After the bubble is grown in this manner, it is rapidly cooled by cold water or the like as needed, and the shape is fixed, whereby a resin foam can be obtained. Further, in the kneading impregnation step and the molding decompression step, an injection molding machine or the like may be used in addition to the extruder.

即,本發明之樹脂發泡體亦可藉由經過使高壓之氣體含浸於熔融之樹脂組合物後進行減壓之步驟使其發泡而形成。又,本發明之樹脂發泡體亦可藉由經過使高壓之氣體含浸於熔融之樹脂組合物後進行減壓之步驟,進而進行加熱而形成。 That is, the resin foam of the present invention can be formed by foaming by subjecting a high-pressure gas to a molten resin composition and then performing a pressure reduction step. Moreover, the resin foam of the present invention can be formed by further heating by subjecting a high-pressure gas to a molten resin composition, followed by depressurization.

於上述批次方式中之氣體含浸步驟或上述連續方式中之混練含浸步驟中,氣體之混合量並無特別限定,例如相對於樹脂組合物總量,較佳為1~10重量%,更佳為2~8重量%。 In the gas impregnation step in the above batch mode or the kneading impregnation step in the above-described continuous mode, the mixing amount of the gas is not particularly limited, and is preferably, for example, 1 to 10% by weight, more preferably, based on the total amount of the resin composition. It is 2 to 8 wt%.

於上述批次方式中之氣體含浸步驟或上述連續方式中之混練含浸步驟中,使高壓之氣體含浸於未發泡樹脂成形體或樹脂組合物時之 壓力較佳為3MPa以上(例如,3~100MPa),更佳為4MPa以上(例如,4~100MPa)。於氣體壓力低於3MPa之情形時,發泡時之氣泡生長明顯,氣泡徑變得過大,例如容易產生防塵效果下降等不良情況,故而較不理想。其原因在於:若壓力較低,則氣體之含浸量與高壓時相比相對較少,氣泡核形成速度下降而所形成之氣泡核數減少,故而每1個氣泡之氣體量反而增加而使氣泡徑極端增大。又,於低於3MPa之壓力區域內,僅藉由少許改變含浸壓力,便可使氣泡徑、氣泡密度大幅改變,故而氣泡徑及氣泡密度之控制容易變得困難。 In the gas impregnation step in the above batch mode or the kneading impregnation step in the above continuous mode, when the high pressure gas is impregnated into the unfoamed resin molded body or the resin composition The pressure is preferably 3 MPa or more (for example, 3 to 100 MPa), more preferably 4 MPa or more (for example, 4 to 100 MPa). When the gas pressure is less than 3 MPa, the bubble growth at the time of foaming is remarkable, and the bubble diameter becomes excessively large, and for example, a problem such as a decrease in dustproof effect is likely to occur, which is not preferable. The reason is that if the pressure is low, the amount of gas impregnation is relatively small compared to the case of high pressure, and the bubble nucleation rate decreases and the number of bubble nuclei formed decreases, so that the amount of gas per bubble increases instead of bubbles. The path is extremely increased. Further, in the pressure region of less than 3 MPa, the bubble diameter and the bubble density can be largely changed by merely changing the impregnation pressure a little, so that it is difficult to control the bubble diameter and the bubble density.

又,於批次方式中之氣體含浸步驟或連續方式中之混練含浸步驟中,使高壓之氣體含浸於未發泡樹脂成形體或聚酯系彈性體組合物時之溫度係可於廣泛範圍內選擇,但考慮到操作性等之情形時,較佳為10~350℃。例如,於批次方式中,使高壓之氣體含浸於片狀之未發泡樹脂成形體之情形之含浸溫度較佳為40~300℃,更佳為100~250℃。又,於連續方式中,將高壓之氣體注入到樹脂組合物並進行混練時之溫度較佳為150~300℃,更佳為210~250℃。再者,於使用二氧化碳作為高壓之氣體之情形時,為了保持超臨界狀態,含浸時之溫度(含浸溫度)較佳為32℃以上(尤其是40℃以上)。 Further, in the gas impregnation step in the batch mode or the kneading impregnation step in the continuous mode, the temperature at which the high-pressure gas is impregnated into the unfoamed resin molded body or the polyester-based elastomer composition can be widely used. The selection is preferably 10 to 350 ° C in consideration of the operability or the like. For example, in the batch mode, the impregnation temperature in the case where the high-pressure gas is impregnated into the sheet-shaped unfoamed resin molded body is preferably 40 to 300 ° C, more preferably 100 to 250 ° C. Further, in the continuous mode, the temperature at which the high-pressure gas is injected into the resin composition and kneaded is preferably 150 to 300 ° C, more preferably 210 to 250 ° C. Further, in the case of using carbon dioxide as a high-pressure gas, in order to maintain the supercritical state, the temperature (impregnation temperature) at the time of impregnation is preferably 32 ° C or more (especially 40 ° C or more).

再者,於上述減壓步驟中,減壓速度並無特別限定,為了獲得均勻之微細氣泡,較佳為5~300MPa/s。又,上述加熱步驟中之加熱溫度並無特別限定,較佳為40~250℃,更佳為60~250℃。 Further, in the pressure reduction step, the pressure reduction rate is not particularly limited, and is preferably 5 to 300 MPa/s in order to obtain uniform fine bubbles. Further, the heating temperature in the heating step is not particularly limited, but is preferably 40 to 250 ° C, more preferably 60 to 250 ° C.

又,根據上述樹脂發泡體之製造方法,可製造高發泡倍率之樹脂發泡體,因此可獲得較厚之樹脂發泡體。例如,於利用上述連續方式製造樹脂發泡體之情形時,於混練含浸步驟中,為了保持擠出機內部之壓力,必須儘量縮減安裝於擠出機前端之模頭之間距(通常0.1~1.0mm)。因此,為了獲得較厚之樹脂發泡體,必須將穿過狹窄間距擠出之樹脂組合物以較高之倍率進行發泡,但先前無法獲得較高之發 泡倍率,因此導致所形成之發泡體之厚度限定於較薄者(例如0.5~2.0mm)。與此相對,根據使用高壓之氣體所製造之上述樹脂發泡體之製造方法,可連續獲得最終厚度為0.30~5.00mm之樹脂發泡體。 Moreover, according to the method for producing a resin foam described above, a resin foam having a high expansion ratio can be produced, and thus a thick resin foam can be obtained. For example, in the case of manufacturing the resin foam by the above-described continuous method, in order to maintain the pressure inside the extruder in the kneading impregnation step, it is necessary to minimize the distance between the die mounted on the front end of the extruder (usually 0.1 to 1.0). Mm). Therefore, in order to obtain a thick resin foam, it is necessary to foam the resin composition extruded through a narrow pitch at a higher magnification, but it is not possible to obtain a higher hair previously. The bubble ratio, thus causing the thickness of the formed foam to be limited to a relatively thin one (for example, 0.5 to 2.0 mm). On the other hand, according to the method for producing the resin foam produced by using a high-pressure gas, a resin foam having a final thickness of 0.30 to 5.00 mm can be continuously obtained.

於本發明之樹脂發泡體中,由於層間剝離強度為特定值以上,故而對載帶之特性優異。例如,由於可有效抑制或防止自載帶剝離時之泡體破壞,故而將樹脂發泡體自載帶剝除時難以產生樹脂發泡體之破壞。 In the resin foam of the present invention, since the interlayer peel strength is at least a specific value, the properties of the carrier tape are excellent. For example, since it is possible to effectively suppress or prevent the destruction of the foam body when the self-supporting tape is peeled off, it is difficult to cause breakage of the resin foam when the resin foam is peeled off from the carrier tape.

又,於本發明之樹脂發泡體中,由於平均泡孔直徑在特定範圍內,最大泡孔直徑為特定值以下,且不含有粗大泡孔,故而具有均勻且微細之泡孔結構。因此,於發泡體表面上,可擴大對載帶之密著面積,進而發泡體表面之強度優異。故而,於本發明之樹脂發泡體中,由於對載帶之貼合性優異,故而使用載帶時之搬送性或使用載帶時之加工性優異。例如,可有效進行以貼合於載帶之狀態對樹脂發泡體進行加工,並搬送加工後之樹脂發泡體之一連串作業。進而,於本發明之樹脂發泡體中,由於對載帶之貼合性優異,故而拾取性優異。例如,可將載帶貼合於樹脂發泡體而簡單地抬起樹脂發泡體。又,若將樹脂發泡體貼合於剝離膜之一側面具有黏著劑層之黏著膠帶,其次將載帶貼合於樹脂發泡體後,抬起載帶,則自剝離膜與黏著劑層之界面剝離,從而可簡單地獲得載帶、樹脂發泡體及黏著劑層之結構物。 Further, in the resin foam of the present invention, since the average cell diameter is within a specific range, the maximum cell diameter is not more than a specific value, and does not contain coarse cells, it has a uniform and fine cell structure. Therefore, on the surface of the foam, the adhesion area to the carrier tape can be enlarged, and the strength of the surface of the foam is excellent. Therefore, in the resin foam of the present invention, since the adhesion to the carrier tape is excellent, the transportability at the time of use of the carrier tape or the workability at the time of using the carrier tape is excellent. For example, it is possible to efficiently perform processing in which the resin foam is processed in a state of being bonded to the carrier tape, and one of the resin foams after the processing is carried out in series. Further, in the resin foam of the present invention, since the adhesion to the carrier tape is excellent, the pickup property is excellent. For example, the carrier tape can be attached to the resin foam to easily lift the resin foam. Further, when the resin foam is bonded to the adhesive tape having the adhesive layer on one side of the release film, the carrier tape is bonded to the resin foam, and then the carrier tape is lifted, and the self-release film and the adhesive layer are applied. The interface is peeled off, so that the structure of the carrier tape, the resin foam, and the adhesive layer can be easily obtained.

於本發明之樹脂發泡體中,由於壓縮50%時之反彈力在特定範圍內,平均泡孔直徑在特定範圍內,最大泡孔直徑為特定值以下,故而具有均勻且微細之泡孔結構,柔軟性優異。因此,可追隨微小間隙。 In the resin foam of the present invention, since the repulsive force at a compression of 50% is within a specific range, the average cell diameter is within a specific range, and the maximum cell diameter is below a specific value, a uniform and fine cell structure is obtained. Excellent in softness. Therefore, it is possible to follow a small gap.

於本發明之樹脂發泡體中,由於平均泡孔直徑在特定範圍內,最大泡孔直徑為特定值以下,且不含有粗大泡孔,故而難以產生灰塵自粗大泡孔進入而使防塵性下降之問題。本發明之樹脂發泡體係防塵性亦優異。 In the resin foam of the present invention, since the average cell diameter is within a specific range, the maximum cell diameter is not more than a specific value, and does not contain coarse cells, it is difficult to generate dust from the coarse cells and the dustproof property is lowered. The problem. The resin foaming system of the present invention is also excellent in dustproofness.

本發明之樹脂發泡體係可較佳地用作電氣機器或電子機器等之密封材或防塵材。又,可較佳地用作緩衝材、減震材,尤其是可較佳地用作電氣機器或電子機器等之緩衝材、減震材。 The resin foaming system of the present invention can be preferably used as a sealing material or a dustproof material for an electric machine or an electronic machine. Moreover, it can be preferably used as a cushioning material or a shock absorbing material, and in particular, it can be preferably used as a cushioning material or a shock absorbing material for an electric machine or an electronic machine.

(發泡構件) (foaming member)

本發明之樹脂發泡體係亦可用作發泡構件。即,上述發泡構件係包含上述本發明之樹脂發泡體之構件。上述發泡構件例如亦可為僅包含上述本發明之樹脂發泡體之構成,亦可為具有至少上述樹脂發泡體及表面層之構成。 The resin foaming system of the present invention can also be used as a foaming member. That is, the foaming member is a member including the above-described resin foam of the present invention. The foam member may be, for example, a structure including only the resin foam of the present invention described above, or may have at least the resin foam and the surface layer.

上述發泡構件之形狀並無特別限定,較佳為片狀(包括膜狀)、帶狀。又,上述發泡構件係以具有所需之形狀或厚度等之方式,亦可實施加工。例如,亦可對照所使用之裝置或機器、殼體、構件等而實施加工成各種形狀。 The shape of the foam member is not particularly limited, but is preferably a sheet shape (including a film shape) or a belt shape. Further, the foaming member may be processed in such a manner as to have a desired shape or thickness. For example, it can be processed into various shapes in accordance with the apparatus or machine used, the housing, the member, and the like.

作為上述表面層,並無特別限定,例如就提高對載帶之特性之方面或者提高密封性之方面而言,可較佳地列舉樹脂層(聚合物層)。上述發泡構件例如亦可為上述本發明之樹脂發泡體上積層有樹脂層者。 The surface layer is not particularly limited. For example, a resin layer (polymer layer) is preferably used in terms of improving the properties of the carrier tape or improving the sealing property. The foam member may be, for example, a resin layer laminated on the resin foam of the present invention.

上述樹脂層較佳為具有與本發明之樹脂發泡體相同之樹脂組成之層。其原因在於:於上述聚合物層為由與上述本發明之樹脂發泡體不同之材料構成之層之情形時,有改變樹脂發泡體之物性之虞。 The resin layer is preferably a layer having the same resin composition as the resin foam of the present invention. The reason for this is that when the polymer layer is a layer composed of a material different from the above-described resin foam of the present invention, the physical properties of the resin foam are changed.

又,於樹脂發泡體上積層作為表面層之樹脂層之情形時,有時其製造步驟變得繁雜。例如,於藉由形成樹脂層之樹脂之塗敷、樹脂層之熔接、介隔黏著劑層之樹脂層之貼附等而樹脂發泡體上積層作為表面層之樹脂層之情形時,有時對作業性或生產性造成不良影響。 Moreover, when a resin layer which is a surface layer is laminated on a resin foam, the manufacturing process may become complicated. For example, when a resin layer as a surface layer is laminated on a resin foam by application of a resin forming a resin layer, welding of a resin layer, adhesion of a resin layer interposing an adhesive layer, or the like, Has an adverse effect on workability or productivity.

因此,上述表面層係就提高對載帶之特性之方面或者提高密封性之方面而言,更佳為藉由樹脂發泡體表面之加熱熔融處理所形成之層(加熱熔融處理層)。根據加熱熔融處理,可容易與樹脂發泡體之組 成相同,故而無需考慮與其他材料之配合性,厚度變化較少之方面上較為有利。又,作業性之方面上亦較為有利。 Therefore, the surface layer is more preferably a layer (heat-melted layer) formed by heat-melting treatment of the surface of the resin foam in terms of improving the characteristics of the carrier tape or improving the sealing property. According to the heat-melting treatment, it can be easily combined with the resin foam It is the same, so it is not necessary to consider the compatibility with other materials, and it is advantageous in terms of less thickness variation. Moreover, it is also advantageous in terms of workability.

作為上述加熱熔融處理,並無特別限定,例如可列舉利用熱輥之加壓處理、雷射照射處理、經加熱之輥上之接觸熔融處理、火焰處理等。 The heat-melting treatment is not particularly limited, and examples thereof include a pressure treatment by a hot roll, a laser irradiation treatment, a contact melting treatment on a heated roll, a flame treatment, and the like.

於利用熱輥之加壓處理之情形時,可使用熱貼合機等較佳地進行處理。再者,作為輥之材質,可列舉橡膠、金屬、氟系樹脂(例如,鐵氟龍(Teflon)(註冊商標))等。 In the case of the pressure treatment using a hot roll, it can be preferably processed using a heat bonding machine or the like. In addition, examples of the material of the roll include rubber, metal, and fluorine-based resin (for example, Teflon (registered trademark)).

加熱熔融處理之溫度並無特別限制,較佳為較構成樹脂發泡體之樹脂之軟化點或熔點低15℃之溫度(更佳為較構成樹脂發泡體之樹脂之軟化點或熔點低14℃之溫度,進而較佳為較構成樹脂發泡體之樹脂之軟化點或熔點低12℃之溫度)以上,又,較佳為較構成樹脂發泡體之樹脂之軟化點或熔點高20℃之溫度(更佳為較構成樹脂發泡體之樹脂之軟化點或熔點高10℃之溫度)以下。若加熱熔融處理時之溫度低於較構成樹脂發泡體之樹脂之軟化點或熔點低15℃之溫度,則存在無法進行樹脂之熔融之情形。另一方面,若加熱熔融處理時之溫度高於較構成樹脂發泡體之樹脂之軟化點或熔點高20℃之溫度,則存在引起氣泡結構之收縮而產生褶皺等問題之情形。 The temperature of the heat-melting treatment is not particularly limited, and is preferably a temperature lower than the softening point or melting point of the resin constituting the resin foam by 15 ° C (more preferably lower than the softening point or melting point of the resin constituting the resin foam). The temperature of °C, more preferably at least 12 ° C lower than the softening point or melting point of the resin constituting the resin foam), is preferably 20 ° C higher than the softening point or melting point of the resin constituting the resin foam. The temperature (more preferably, the temperature is 10 ° C higher than the softening point or melting point of the resin constituting the resin foam). If the temperature at the time of heat-melting treatment is lower than the temperature lower than the softening point or melting point of the resin constituting the resin foam, the melting of the resin may not be performed. On the other hand, when the temperature at the time of the heat-melting treatment is higher than the temperature higher than the softening point or the melting point of the resin constituting the resin foam, there is a problem that the bubble structure shrinks and wrinkles occur.

作為加熱熔融處理之處理時間,亦因處理溫度而有所不同,例如較佳為0.1秒~10秒,較佳為0.5秒~7秒。若時間太短,則有時無法進行表面之熔融而產生表面層之形成不良。另一方面,若時間太長,則存在引起樹脂發泡體之收縮而產生褶皺等問題之情形。 The treatment time as the heat-melting treatment differs depending on the treatment temperature, and is, for example, preferably 0.1 second to 10 seconds, preferably 0.5 second to 7 seconds. If the time is too short, the surface may not be melted to cause formation of a surface layer. On the other hand, if the time is too long, there is a problem that the resin foam shrinks and wrinkles occur.

進而,作為上述表面層,就可於發泡構件上介隔黏著劑層而設置加工用襯紙之方面或者可固定或暫時固定於被黏著體(例如,殼體或零件等)之方面而言,可較佳地列舉黏著劑層。 Further, as the surface layer, the adhesive sheet may be interposed between the foam member and the processing liner may be provided or fixed or temporarily fixed to the adherend (for example, a casing or a part). Preferably, the adhesive layer is exemplified.

作為形成上述黏著劑層之黏著劑,並無特別限定,例如可列舉 丙烯酸系黏著劑、橡膠系黏著劑(天然橡膠系黏著劑、合成橡膠系黏著劑等)、聚矽氧系黏著劑、聚酯系黏著劑、胺基甲酸酯系黏著劑、聚醯胺系黏著劑、環氧系黏著劑、乙烯基烷基醚系黏著劑、氟系黏著劑等。黏著劑係亦可單獨使用,或者將2種以上組合使用。又,黏著劑亦可為乳膠系黏著劑、溶劑系黏著劑、熱熔型黏著劑、寡聚物系黏著劑、固系黏著劑等任一種形態之黏著劑。其中,作為上述黏著劑,就對被黏著體之污染防止等觀點而言,較佳為丙烯酸系黏著劑。即,上述發泡構件較佳為於上述本發明之樹脂發泡體上具有丙烯酸系黏著劑層。 The adhesive for forming the above adhesive layer is not particularly limited, and for example, Acrylic adhesive, rubber adhesive (natural rubber adhesive, synthetic rubber adhesive, etc.), polyoxynoxy adhesive, polyester adhesive, urethane adhesive, polyamine An adhesive, an epoxy adhesive, a vinyl alkyl ether adhesive, a fluorine adhesive, or the like. The adhesive system may be used alone or in combination of two or more. Further, the adhesive may be an adhesive of any form such as a latex adhesive, a solvent adhesive, a hot melt adhesive, an oligomer adhesive, or a solid adhesive. In particular, the adhesive is preferably an acrylic adhesive from the viewpoint of preventing contamination of the adherend. In other words, the foam member preferably has an acrylic pressure-sensitive adhesive layer on the resin foam of the present invention.

上述黏著劑層之厚度並無特別限定,較佳為2~100μm,更佳為10~100μm。黏著劑層係層越薄,防止端部之灰塵或塵埃之附著之效果越高,故而厚度越薄越佳。再者,黏著劑層亦可具有單層、積層體之任一種形態。 The thickness of the above adhesive layer is not particularly limited, but is preferably 2 to 100 μm, more preferably 10 to 100 μm. The thinner the adhesive layer layer is, the higher the effect of preventing the adhesion of dust or dust at the ends, and the thinner the thickness, the better. Further, the adhesive layer may have any one of a single layer and a laminate.

於上述發泡構件中,上述黏著劑層係亦可介隔其他層(下層)所設置。作為此種下層,例如可列舉其他黏著劑層、中間層、下塗層、基材層(尤其是膜層或不織布層等)等。進而,上述黏著劑層係亦可受到剝離膜(隔片)(例如,剝離紙、剝離膜等)之保護。 In the above foamed member, the above adhesive layer may be provided via another layer (lower layer). Examples of such a lower layer include other adhesive layers, intermediate layers, undercoat layers, and base material layers (especially, a film layer or a nonwoven fabric layer). Further, the adhesive layer may be protected by a release film (separator) (for example, a release paper, a release film, or the like).

進而,上述發泡構件係就獲得密封性或對載帶之優異之特性之方面、可實現固定或暫時固定之方面等而言,亦可具有上述本發明之樹脂發泡體、樹脂層(尤其是藉由加熱熔融處理所形成之加熱熔融處理層)、黏著劑層(尤其是丙烯酸系黏著劑層)。例如,上述發泡構件係亦可於片狀之樹脂發泡體之一側面側具有上述樹脂層(尤其是藉由加熱熔融處理所形成之加熱熔融處理層),亦可於另一側面側具有黏著劑層(尤其是丙烯酸系黏著劑層)。 Further, the foaming member may have the above-described resin foam and resin layer of the present invention in terms of sealing property, excellent properties to the carrier tape, fixing or temporary fixing, and the like. It is a heat-melted layer formed by heat-melting treatment, and an adhesive layer (especially an acrylic adhesive layer). For example, the foam member may have the resin layer (especially a heat-melted layer formed by heat-melting treatment) on one side of the sheet-like resin foam, or may have the other side surface side. Adhesive layer (especially acrylic adhesive layer).

上述發泡構件係包含上述本發明之樹脂發泡體,因此柔軟性優異。又,具有可追隨微小間隙之柔軟性。進而,防塵性亦優異。 Since the foaming member contains the above-described resin foam of the present invention, it is excellent in flexibility. Moreover, it has flexibility to follow a small gap. Further, the dustproof property is also excellent.

又,上述發泡構件係包含上述本發明之樹脂發泡體,因此對載帶之特性優異。例如,對載帶之貼合性、自載帶之剝離性優異。又,使用載帶時之搬送性或加工性優異。 Moreover, since the said foaming member contains the resin foam of this invention mentioned above, it is excellent in the characteristics of a carrier tape. For example, it is excellent in the adhesiveness of a carrier tape and the peeling property of a self-carrier tape. Moreover, it is excellent in conveyability and workability at the time of using a carrier tape.

上述發泡構件係具有如上所述之特性,因此可較佳地用作將各種構件或零件安裝(裝著)於特定部位時所使用之構件。尤其,上述發泡構件係於電氣或電子機器中,可較佳地用作將構成電氣或電子機器之零件安裝(裝著)於特定部位時所使用之構件。 The above-mentioned foamed member has the characteristics as described above, and therefore can be preferably used as a member used when a plurality of members or parts are attached (mounted) to a specific portion. In particular, the foaming member is used in an electric or electronic device, and can be preferably used as a member used when attaching (mounting) a component constituting an electric or electronic device to a specific portion.

即,上述發泡構件係可較佳地用作電氣或電子機器用。即,上述發泡構件亦可為電氣或電子機器用發泡構件。 That is, the above foaming member can be preferably used as an electric or electronic machine. That is, the foam member may be a foam member for electric or electronic equipment.

作為可利用上述發泡構件安裝(裝著)之各種構件或零件,並無特別限定,例如可較佳地列舉電氣或電子機器類中之各種構件或零件等。作為此種電氣或電子機器用之構件或零件,例如可列舉安裝於液晶顯示器、電致發光顯示器、電漿顯示器等圖像顯示裝置之圖像顯示構件(顯示部)(尤其是小型之圖像顯示構件),或者安裝於所謂「行動電話」或「行動資訊終端」等移動體通信之裝置的相機或透鏡(尤其是小型之相機或透鏡)等光學構件或光學零件等。 The various members or components that can be attached (mounted) by the above-described foaming member are not particularly limited, and for example, various members or parts of electric or electronic equipment can be preferably used. Examples of the member or the component for the electric or electronic device include an image display member (display portion) mounted on an image display device such as a liquid crystal display, an electroluminescence display, or a plasma display (especially a small image). A display member) or an optical member or optical component such as a camera or a lens (especially a small camera or lens) mounted on a device for communicating with a mobile device such as a "mobile phone" or "mobile information terminal".

作為本發明之發泡構件之較佳之使用態樣,例如可列舉以防塵、遮光、緩衝等為目的,使用於LCD(liquid crystal display,液晶顯示器)等之顯示部周圍,或者夾持於LCD(液晶顯示器)等之顯示部與殼體(窗口部)之間所使用之情況。 The preferred embodiment of the foam member of the present invention is used for the purpose of dustproof, light-shielding, buffering, etc., and is used around a display portion such as an LCD (liquid crystal display) or clamped to an LCD ( A case where the display unit and the casing (window portion) are used in a liquid crystal display or the like.

(發泡構件積層體) (foaming member laminate)

本發明之發泡構件積層體係由至少上述發泡構件(包含上述本發明之樹脂發泡體之構件)及載帶(尤其是在基材之至少單面側具有黏著劑層之載帶)所構成,並具有利用載帶保持上述發泡構件之結構。 The foamed member laminate system of the present invention comprises at least the above-mentioned foamed member (a member comprising the above-described resin foam of the present invention) and a carrier tape (especially a carrier tape having an adhesive layer on at least one side of the substrate) The structure has a structure in which the foam member is held by a carrier tape.

如此,上述發泡構件積層體係具有將上述發泡構件貼合於載帶之黏著面之構成,因此可以將上述發泡構件貼合於載帶之黏著面之狀 態進行加工或搬送等,並且,使用上述發泡構件時,可抑制或防止泡體破壞而自載帶容易剝離發泡構件。 As described above, since the foamed member laminate system has a configuration in which the foam member is bonded to the adhesive surface of the carrier tape, the foam member can be bonded to the adhesive surface of the carrier tape. When the foam member is used, it is possible to suppress or prevent the foam from being broken, and the foam member can be easily peeled off from the carrier tape.

上述載帶並無特別限制,重要的是具有至少1個黏著劑層,對上述發泡構件發揮加工或搬送發泡構件時進行保持所需之充分程度之黏著力(接著力),另一方面,於剝離發泡構件時,可發揮不必破壞表面,便可容易剝離之程度之黏著力(接著力)。 The carrier tape is not particularly limited, and it is important to have at least one adhesive layer to exert a sufficient degree of adhesion (adhesion force) required for holding the foam member during processing or transport of the foam member. When the foamed member is peeled off, it is possible to exert an adhesive force (adhesion force) to the extent that it is easy to peel off without damaging the surface.

因此,作為上述載帶,可列舉具有利用黏著劑之黏著劑層之黏著膠帶(黏著膠帶或薄片)。尤其,就兼顧與上述發泡構件之接著性及剝離性之觀點而言,可較佳地列舉具有利用丙烯酸系黏著劑(尤其是將以(甲基)丙烯酸烷基酯為主單體成分之丙烯酸系聚合物設為基礎聚合物之丙烯酸系黏著劑)之黏著劑層(丙烯酸系黏著劑層)之丙烯酸系黏著膠帶。此種黏著膠帶係亦可具有在基材之至少一側面側形成有黏著劑層之構成之附帶基材之黏著膠帶、僅由黏著劑層所形成之構成之無基材黏著膠帶之任一種構成,但就操作性或作業性之方面而言,較佳為附帶基材之黏著膠帶。 Therefore, as the carrier tape, an adhesive tape (adhesive tape or sheet) having an adhesive layer using an adhesive can be cited. In particular, from the viewpoint of achieving both the adhesion to the foam member and the releasability, it is preferable to use an acrylic adhesive (particularly, an alkyl (meth)acrylate is used as a main monomer component. An acrylic adhesive tape in which an acrylic polymer is used as an adhesive layer (acrylic adhesive layer) of an acrylic adhesive of a base polymer. The adhesive tape may have any one of an adhesive tape with a base material formed on at least one side surface of the substrate, and a non-substrate adhesive tape formed of only an adhesive layer. However, in terms of workability or workability, an adhesive tape with a substrate is preferred.

再者,於形成黏著劑層之黏著劑中,作為除丙烯酸系黏著劑以外之黏著劑,例如可列舉橡膠系黏著劑(天然橡膠系黏著劑、合成橡膠系黏著劑等)、聚矽氧系黏著劑、聚酯系黏著劑、胺基甲酸酯系黏著劑、聚醯胺系黏著劑、環氧系黏著劑、乙烯基烷基醚系黏著劑、氟系黏著劑等。黏著劑係亦可單獨使用,或者將2種以上組合使用。再者,黏著劑亦可為乳膠系黏著劑、溶劑系黏著劑、熱熔型黏著劑、寡聚物系黏著劑、固系黏著劑等任一種形態之黏著劑。 In addition, examples of the adhesive other than the acrylic adhesive in the adhesive for forming the adhesive layer include a rubber-based adhesive (a natural rubber-based adhesive, a synthetic rubber-based adhesive, etc.), and a polyfluorene-based system. An adhesive, a polyester-based adhesive, a urethane-based adhesive, a polyamide-based adhesive, an epoxy-based adhesive, a vinyl alkyl ether-based adhesive, a fluorine-based adhesive, or the like. The adhesive system may be used alone or in combination of two or more. Further, the adhesive may be any one of a form of an adhesive such as a latex adhesive, a solvent adhesive, a hot melt adhesive, an oligomer adhesive, or a solid adhesive.

又,作為黏著膠帶中之基材,並無特別限定,例如可列舉塑膠之膜或薄片等塑膠系基材;紙等紙系基材;布、不織布、網狀物等纖維系基材;金屬箔、金屬板等金屬系基材;橡膠薄片等橡膠系基材;發泡薄片等發泡體或該等之積層體(尤其是塑膠系基材與其他基材之 積層體或塑膠膜(或薄片)彼此之積層體等)等適當之薄片體。 Moreover, the base material in the adhesive tape is not particularly limited, and examples thereof include a plastic base material such as a plastic film or a sheet; a paper base material such as paper; a fibrous base material such as a cloth, a nonwoven fabric, or a mesh; and a metal. a metal-based substrate such as a foil or a metal plate; a rubber-based substrate such as a rubber sheet; a foam such as a foamed sheet, or a laminate (especially a plastic substrate and other substrates) A suitable sheet such as a laminate or a plastic film (or sheet) laminated to each other.

再者,作為載帶之黏著膠帶中之基材或黏著劑層之厚度等並無特別限定。 Further, the thickness of the substrate or the adhesive layer in the adhesive tape as the carrier tape is not particularly limited.

根據上述發泡構件積層體,對發泡構件實施加工直至成為特定形狀後,自載帶剝離發泡構件,從而可獲得具有特定形狀之發泡構件。該發泡構件係於發泡構件與載帶之界面產生剝離,幾乎或完全不產生泡體破壞,保持良好之泡孔結構,並且加工成特定形狀。因此,使用發泡構件積層體進行加工後所獲得之發泡構件係可較佳地用作將各種構件或零件安裝(裝著)於特定部位時所使用之密封材、防塵材、緩衝材、減震材等。尤其,發泡構件係即便將小型之構件或零件安裝於薄型化之製品時,亦可較佳地使用。 According to the foamed member laminated body, the foamed member is processed until it has a specific shape, and then the foamed member is peeled off from the carrier tape, whereby a foamed member having a specific shape can be obtained. The foamed member is peeled off at the interface between the foamed member and the carrier tape, has little or no bubble breakage, maintains a good cell structure, and is processed into a specific shape. Therefore, the foamed member obtained by processing using the foamed member laminated body can be preferably used as a sealing material, a dustproof material, a cushioning material, and the like when the various members or components are mounted (mounted) on a specific portion. Shock absorbers, etc. In particular, the foam member can be preferably used even when a small member or component is attached to a thinned product.

(電氣或電子機器類) (electrical or electronic equipment)

本發明之電氣或電子機器類具有上述發泡構件(包含上述本發明之樹脂發泡體之構件)。即,本發明之電氣或電子機器類具有使用上述發泡構件之構成。於電氣或電子機器類中,上述發泡構件係例如用作防塵材、密封材、減震材、緩衝材等。此種電氣或電子機器類具有將電氣或電子機器用之構件或零件介隔上述發泡構件而安裝(裝著)於特定部位之構成。具體而言,作為電氣或電子機器類,可列舉具有介隔上述樹脂發泡體或發泡構件安裝有作為光學構件或零件之液晶顯示器、電致發光顯示器、電漿顯示器等圖像顯示裝置(尤其是安裝有小型之圖像顯示構件作為光學構件之圖像顯示裝置)、或者相機或透鏡(尤其是小型之相機或透鏡)之構成的電氣或電子機器類(例如,所謂「行動電話」或「行動資訊終端」等移動體通信之裝置等)。此種電氣或電子機器類亦可為較先前更薄型化之製品,其厚度或形狀等並無特別限定。 The electric or electronic device of the present invention has the above-described foam member (member including the above-described resin foam of the present invention). That is, the electric or electronic device of the present invention has a configuration in which the above-described foam member is used. In the electric or electronic equipment, the foaming member is used, for example, as a dustproof material, a sealing material, a vibration absorbing material, a cushioning material, or the like. Such an electric or electronic device has a configuration in which a member or a member for an electric or electronic device is attached (mounted) to a specific portion via the foam member. Specifically, examples of the electric or electronic device include an image display device such as a liquid crystal display, an electroluminescence display, or a plasma display in which an optical member or a component is interposed between the resin foam or the foam member. In particular, an image or display device having a small image display member as an optical member, or an electric or electronic device (for example, a "mobile phone" or a camera or a lens (especially a small camera or lens). "Mobile information communication device such as "action information terminal"). Such an electric or electronic device may be a product which is thinner than the prior art, and the thickness, shape, and the like are not particularly limited.

[實施例] [Examples]

以下,對本發明,列舉實施例及比較例進行更具體說明。本發明不受該等任何限定。 Hereinafter, the present invention will be more specifically described by way of examples and comparative examples. The invention is not limited by these.

(實施例1) (Example 1)

將作為硬鏈段之聚對苯二甲酸丁二酯與作為軟鏈段之聚醚之嵌段共聚物(商品名「Pelprene P-90BD」,東洋紡股份有限公司製造,230℃之熔融流動速率:3.0g/10min,熔點:204℃):100重量份、丙烯酸系潤滑劑(商品名「Metablen L-1000」,三菱麗陽股份有限公司製造):5重量份、利用矽烷偶合劑進行表面處理加工之硬黏土(商品名「ST-301」,白石鈣股份有限公司製造):1重量份、碳黑(商品名「旭#35」,Asahi Carbon股份有限公司製造):5重量份及環氧系改質劑(環氧改性丙烯酸系聚合物,重量平均分子量(Mw):50000,環氧當量:1200g/eq,黏度:2850mPa‧s):2重量份,利用雙軸混練機,在220℃之溫度下進行混練後,擠出成繩狀,水冷後切斷成顆粒狀而成形。 A block copolymer of polybutylene terephthalate as a hard segment and a polyether as a soft segment (trade name "Pelprene P-90BD", manufactured by Toyobo Co., Ltd., melt flow rate at 230 ° C: 3.0 g/10 min, melting point: 204 ° C): 100 parts by weight, an acrylic lubricant (trade name "Metablen L-1000", manufactured by Mitsubishi Rayon Co., Ltd.): 5 parts by weight, surface treatment with a decane coupling agent Hard clay (trade name "ST-301", manufactured by Shiraishi Calcium Co., Ltd.): 1 part by weight, carbon black (trade name "旭#35", manufactured by Asahi Carbon Co., Ltd.): 5 parts by weight and epoxy Modifier (epoxy modified acrylic polymer, weight average molecular weight (Mw): 50000, epoxy equivalent: 1200 g/eq, viscosity: 2850 mPa‧s): 2 parts by weight, using a biaxial kneading machine at 220 ° C After kneading at a temperature, it is extruded into a rope shape, and after water cooling, it is cut into pellets and formed.

將該顆粒物投入到單軸擠出機內,在240℃之環境中,以17(注入後13)MP之壓力注入二氧化碳氣體。使二氧化碳氣體充分飽和後,冷卻至適合於發泡之溫度為止後,自模頭擠出,獲得厚度為2.0mm之片狀之聚酯系彈性體發泡體。 The pellet was placed in a single-screw extruder, and carbon dioxide gas was injected at a pressure of 17 (13 after injection) MP in an environment of 240 °C. After the carbon dioxide gas was sufficiently saturated, it was cooled to a temperature suitable for foaming, and then extruded from a die to obtain a sheet-shaped polyester elastomer foam having a thickness of 2.0 mm.

(實施例2) (Example 2)

將實施例1中所製作之聚酯系彈性體發泡體,使用可調整輥間距之熱貼合機(裝置名「MRK-6504」,MCK股份有限公司製造),在間距:0.95mm、輥溫度:190℃、處理速度:12m/min之條件下,進行表面熱熔融處理,獲得具有表面層之聚酯系彈性體發泡體。 The polyester elastomer foam produced in Example 1 was heated at a pitch of 0.95 mm using a heat bonding machine (device name "MRK-6504", manufactured by MCK Co., Ltd.) with adjustable roll pitch. The surface thermal fusion treatment was carried out under the conditions of a temperature of 190 ° C and a treatment rate of 12 m / min to obtain a polyester elastomer foam having a surface layer.

(實施例3) (Example 3)

將作為硬鏈段之聚對苯二甲酸丁二酯與作為軟鏈段之聚醚之嵌段共聚物(商品名「Pelprene P-90BD」,東洋紡股份有限公司製造, 230℃之熔融流動速率:3.0g/10min,熔點:204℃):100重量份、丙烯酸系潤滑劑(商品名「Metablen L-1000」,三菱麗陽股份有限公司製造):1重量份、利用矽烷偶合劑進行表面處理加工之硬黏土(商品名「ST-301」,白石鈣股份有限公司製造):1重量份、碳黑(商品名「旭#35」,Asahi Carbon股份有限公司製造):5重量份及環氧系改質劑(環氧改性丙烯酸系聚合物,重量平均分子量(Mw):50000,環氧當量:1200g/eq,黏度:2850mPa‧s):2重量份,利用雙軸混練機,在220℃之溫度下進行混練後,擠出成繩狀,水冷後切斷成顆粒狀而成形。 A block copolymer of polybutylene terephthalate as a hard segment and a polyether as a soft segment (trade name "Pelprene P-90BD", manufactured by Toyobo Co., Ltd., Melt flow rate at 230 ° C: 3.0 g/10 min, melting point: 204 ° C): 100 parts by weight, an acrylic lubricant (trade name "Metablen L-1000", manufactured by Mitsubishi Rayon Co., Ltd.): 1 part by weight, utilized Hard clay (product name "ST-301", manufactured by Shiraishi Calcium Co., Ltd.) which is surface-treated with a decane coupling agent: 1 part by weight, carbon black (trade name "旭#35", manufactured by Asahi Carbon Co., Ltd.): 5 parts by weight and an epoxy-based modifier (epoxy-modified acrylic polymer, weight average molecular weight (Mw): 50,000, epoxy equivalent: 1200 g/eq, viscosity: 2850 mPa·s): 2 parts by weight, using double The shaft kneading machine was kneaded at a temperature of 220 ° C, and then extruded into a rope shape, and after water cooling, it was cut into pellets and formed.

將該顆粒物投入到單軸擠出機內,在240℃之環境中,以17(注入後13)MP之壓力注入二氧化碳氣體。使二氧化碳氣體充分飽和後,冷卻至適合於發泡之溫度為止後,自模頭擠出,獲得厚度為2.0mm之片狀之聚酯系彈性體發泡體。 The pellet was placed in a single-screw extruder, and carbon dioxide gas was injected at a pressure of 17 (13 after injection) MP in an environment of 240 °C. After the carbon dioxide gas was sufficiently saturated, it was cooled to a temperature suitable for foaming, and then extruded from a die to obtain a sheet-shaped polyester elastomer foam having a thickness of 2.0 mm.

(實施例4) (Example 4)

將作為硬鏈段之聚對苯二甲酸丁二酯與作為軟鏈段之聚醚之嵌段共聚物(商品名「Pelprene P-90BD」,東洋紡股份有限公司製造,230℃之熔融流動速率:3.0g/10min,熔點:204℃):100重量份、丙烯酸系潤滑劑(商品名「Metablen L-1000」,三菱麗陽股份有限公司製造):5重量份、利用矽烷偶合劑進行表面處理加工之硬黏土(商品名「ST-301」,白石鈣股份有限公司製造):3重量份、碳黑(商品名「旭#35」,Asahi Carbon股份有限公司製造):5重量份及環氧系改質劑(環氧改性丙烯酸系聚合物,重量平均分子量(Mw):50000,環氧當量:1200g/eq,黏度:2850mPa‧s):2重量份,利用雙軸混練機,在220℃之溫度下進行混練後,擠出成繩狀,水冷後切斷成顆粒狀而成形。將該顆粒物投入到單軸擠出機內,在240℃之環境中,以17(注入後13)MPa之壓力注入二氧化碳氣體。使二氧化碳氣體充分飽和後, 冷卻至適合於發泡之溫度為止後,自模頭擠出,獲得厚度為1.5mm之片狀之聚酯系彈性體發泡體。 A block copolymer of polybutylene terephthalate as a hard segment and a polyether as a soft segment (trade name "Pelprene P-90BD", manufactured by Toyobo Co., Ltd., melt flow rate at 230 ° C: 3.0 g/10 min, melting point: 204 ° C): 100 parts by weight, an acrylic lubricant (trade name "Metablen L-1000", manufactured by Mitsubishi Rayon Co., Ltd.): 5 parts by weight, surface treatment with a decane coupling agent Hard clay (trade name "ST-301", manufactured by Shiraishi Calcium Co., Ltd.): 3 parts by weight, carbon black (trade name "旭#35", manufactured by Asahi Carbon Co., Ltd.): 5 parts by weight and epoxy Modifier (epoxy modified acrylic polymer, weight average molecular weight (Mw): 50000, epoxy equivalent: 1200 g/eq, viscosity: 2850 mPa‧s): 2 parts by weight, using a biaxial kneading machine at 220 ° C After kneading at a temperature, it is extruded into a rope shape, and after water cooling, it is cut into pellets and formed. The pellet was placed in a single-screw extruder, and carbon dioxide gas was injected at a pressure of 17 (13 MPa after injection) in an environment of 240 °C. After fully saturating the carbon dioxide gas, After cooling to a temperature suitable for foaming, it was extruded from a die to obtain a sheet-like polyester elastomer foam having a thickness of 1.5 mm.

(比較例1) (Comparative Example 1)

將作為硬鏈段之聚對苯二甲酸丁二酯與作為軟鏈段之聚醚之嵌段共聚物(商品名「Hytrel 5577」,東麗杜邦(Du Pont Toray)股份有限公司製造,230℃之熔融流動速率:1.8g/10min,熔點208℃):100重量份、丙烯酸系潤滑劑(商品名「Metablen L-1000」,三菱麗陽股份有限公司製造):5重量份、聚丙烯(商品名「NEWSTREN SH9000」,日本聚丙烯(Japan Polypropylene)股份有限公司製造):1重量份、氫氧化鎂(平均粒徑:0.7μm):1重量份、碳黑(商品名「旭#35」,Asahi Carbon股份有限公司製造):5重量份及環氧系交聯劑(3官能環氧化合物,商品名「TEPIC-G」,日產化學工業股份有限公司製造):0.5重量份,利用雙軸混練機,在220℃之溫度下進行混練後,擠出成繩狀,水冷後切斷成顆粒狀而成形。 A block copolymer of polybutylene terephthalate as a hard segment and a polyether as a soft segment (trade name "Hytrel 5577", manufactured by Du Pont Toray Co., Ltd., 230 ° C Melt flow rate: 1.8 g/10 min, melting point 208 ° C): 100 parts by weight, acrylic lubricant (trade name "Metablen L-1000", manufactured by Mitsubishi Rayon Co., Ltd.): 5 parts by weight, polypropylene (product "NEWSTREN SH9000", manufactured by Japan Polypropylene Co., Ltd.): 1 part by weight, magnesium hydroxide (average particle diameter: 0.7 μm): 1 part by weight, carbon black (trade name "旭#35", Asahi Carbon Co., Ltd.): 5 parts by weight and an epoxy-based crosslinking agent (trifunctional epoxy compound, trade name "TEPIC-G", manufactured by Nissan Chemical Industries, Ltd.): 0.5 parts by weight, using biaxial kneading After kneading at a temperature of 220 ° C, the machine was extruded into a rope shape, and after water cooling, it was cut into pellets and formed.

將該顆粒物投入到單軸擠出機內,在240℃之環境中,以17(注入後13)MP之壓力注入二氧化碳氣體。使二氧化碳氣體充分飽和後,冷卻至適合於發泡之溫度為止後,自模頭擠出,獲得厚度為2.2mm之片狀之聚酯系彈性體發泡體。 The pellet was placed in a single-screw extruder, and carbon dioxide gas was injected at a pressure of 17 (13 after injection) MP in an environment of 240 °C. After the carbon dioxide gas was sufficiently saturated, it was cooled to a temperature suitable for foaming, and then extruded from a die to obtain a sheet-shaped polyester elastomer foam having a thickness of 2.2 mm.

(比較例2) (Comparative Example 2)

將聚丙烯(熔融流動速率(MFR):0.35g/10min):45重量份、聚烯烴系彈性體(熔融流動速率(MFR):6g/10min):55重量份、聚乙烯:10重量份、造核劑(氫氧化鎂,平均粒徑:0.7μm):10重量份及碳黑(商品名「旭#35」,Asahi Carbon股份有限公司製造):5重量份,利用雙軸混練機,在200℃之溫度下進行混練後,擠出成繩狀,水冷後切斷成顆粒狀,獲得顆粒物。 Polypropylene (melt flow rate (MFR): 0.35 g/10 min): 45 parts by weight, polyolefin-based elastomer (melt flow rate (MFR): 6 g/10 min): 55 parts by weight, polyethylene: 10 parts by weight, A nucleating agent (magnesium hydroxide, average particle diameter: 0.7 μm): 10 parts by weight and carbon black (trade name "Asahi #35", manufactured by Asahi Carbon Co., Ltd.): 5 parts by weight, using a biaxial kneading machine, After kneading at a temperature of 200 ° C, it was extruded into a rope shape, and after water cooling, it was cut into pellets to obtain a particulate matter.

將該顆粒物投入到日本製鋼所製造之單軸擠出機內,在220℃之 環境中,以13(注入後12)MP之壓力注入二氧化碳氣體。二氧化碳氣體係以相對於顆粒物總量為5重量%之比例注入。使二氧化碳氣體充分飽和後,冷卻至適合於發泡之溫度為止後,自模頭擠出,獲得厚度為2.3mm之片狀之樹脂發泡體。 The pellet was placed in a single-axis extruder manufactured by Nippon Steel Co., Ltd. at 220 ° C. In the environment, carbon dioxide gas is injected at a pressure of 13 (12 after injection) MP. The carbon dioxide gas system was injected at a ratio of 5% by weight based on the total amount of the particulate matter. After the carbon dioxide gas was sufficiently saturated, it was cooled to a temperature suitable for foaming, and then extruded from a die to obtain a sheet-like resin foam having a thickness of 2.3 mm.

(比較例3) (Comparative Example 3)

使用市售之以平均泡孔直徑為160μm、壓縮50%時之反彈應力(50%抗斥力負荷)為0.7N/cm2、視密度為0.15g/cm3之聚胺基甲酸酯為主成分之發泡體。 A commercially available polyurethane having an average cell diameter of 160 μm, a compression of 50%, a rebound stress (50% anti-repulsion load) of 0.7 N/cm 2 and an apparent density of 0.15 g/cm 3 was used. A foam of ingredients.

該發泡體係片狀,厚度為1.0mm。 The foaming system was in the form of a sheet having a thickness of 1.0 mm.

(評價) (Evaluation)

對實施例及比較例,進行下述測定或評價。繼而,將其結果示於表1。 The following measurements or evaluations were performed on the examples and comparative examples. Then, the results are shown in Table 1.

(視密度) (visual density)

將發泡體,利用寬度:20mm、長度:20mm尺寸之沖裁刀模進行沖裁,設為片狀之試驗片。利用游標卡尺測定該試驗片之尺寸。又,利用測定端子之直徑()為20mm之1/100針盤量規而測定試驗片之厚度。根據該等值算出試驗片之體積。其次,利用電子天秤測定試驗片之重量。根據試驗片之體積與試驗片之重量,利用次式算出發泡體之視密度(g/cm3)。 The foam was punched out by a punching die having a width of 20 mm and a length of 20 mm, and was set as a sheet-like test piece. The size of the test piece was measured using a vernier caliper. Also, using the diameter of the measuring terminal ( The thickness of the test piece was measured for a 1/100 dial gauge of 20 mm. The volume of the test piece was calculated from the equivalent values. Next, the weight of the test piece was measured using an electronic balance. The apparent density (g/cm 3 ) of the foam was calculated by the following formula based on the volume of the test piece and the weight of the test piece.

發泡體之視密度(g/cm3)=(試驗片之重量)/(試驗片之體積) The apparent density of the foam (g/cm 3 ) = (weight of the test piece) / (volume of the test piece)

(平均泡孔直徑、最大泡孔直徑) (average cell diameter, maximum cell diameter)

利用數位顯微鏡(商品名「VHX-500」,基恩斯(KEYENCE)股份有限公司製造),取得發泡體氣泡部之放大圖像,使用該計測機器之解析軟體進行圖像解析,由此求出各泡孔之氣泡徑(μm),且求出平均泡孔直徑(μm)及最大泡孔直徑(μm)。所取得之放大圖像之氣泡數為200個左右。再者,泡孔直徑係求出泡孔之面積,進行近似圓的直徑 換算而成者。 A magnifying microscope (trade name "VHX-500", manufactured by KEYENCE Co., Ltd.) was used to obtain an enlarged image of the bubble portion of the foam, and image analysis was performed using the analysis software of the measuring device. The cell diameter (μm) of the cells was determined, and the average cell diameter (μm) and the maximum cell diameter (μm) were determined. The number of bubbles of the enlarged image obtained is about 200. Furthermore, the cell diameter is determined by the area of the cell, and the diameter of the circle is approximated. Converted to the original.

(層間剝離強度) (interlayer peel strength)

自發泡體獲得寬度:20mm、長度:120mm之片狀之試驗片,將該試驗片在溫度:23±2℃、濕度:50±5%之環境下保存24小時。再者,前處理條件依據JIS Z 0237。 A test piece having a width of 20 mm and a length of 120 mm was obtained from the foam, and the test piece was stored in an environment of temperature: 23 ± 2 ° C and humidity: 50 ± 5% for 24 hours. Furthermore, the pretreatment conditions are based on JIS Z 0237.

將黏著膠帶(寬度:20mm,長度:120mm,商品名「No.5603」,日東電工股份有限公司製造,附帶基材之兩面黏著膠帶,基材:PET(Polyethylene terephthalate,對苯二甲酸乙二酯)基材)之一側黏著面貼附於SUS板(Steel Use Stainless,不鏽鋼板),並於SUS板上固定上述黏著膠帶。其次,於固定於SUS板上之上述黏著膠帶之另一側黏著面貼附試驗片,在2kg滾輪、1次往返之條件下進行壓接。 Adhesive tape (width: 20mm, length: 120mm, trade name "No.5603", manufactured by Nitto Denko Co., Ltd., with adhesive tape on both sides of the substrate, substrate: PET (Polyethylene terephthalate, ethylene terephthalate) One of the side adhesive faces of the substrate is attached to a SUS plate (Steel Use Stainless), and the above adhesive tape is fixed on the SUS plate. Next, the test piece was attached to the other adhesive side of the above-mentioned adhesive tape fixed to the SUS plate, and crimped under the condition of 2 kg of roller and one round trip.

壓接後,使用拉伸試驗機(裝置名「TCN-1kNB」,Minebea公司製造),將試驗片在剝離角度90°、拉伸速度0.3m/min之條件下自上述黏著膠帶剝離,測定此時之剝離強度(N/20mm)。將所測定之剝離強度設為層間剝離強度。 After the pressure bonding, a tensile tester (device name "TCN-1kNB", manufactured by Minebea Co., Ltd.) was used, and the test piece was peeled off from the adhesive tape under the conditions of a peeling angle of 90° and a tensile speed of 0.3 m/min. Peel strength (N/20mm). The measured peel strength was defined as the interlayer peel strength.

(壓縮50%時之反彈力(壓縮50%時之抗斥力負荷、壓縮50%負荷)) (Rebound force when compressing 50% (repulsive load at 50% compression, 50% load compression))

依據JIS K 6767所揭示之壓縮硬度測定法進行測定。 The measurement was carried out in accordance with the compression hardness measurement method disclosed in JIS K 6767.

將發泡體切割成寬度:30mm、長度:30mm,設為片狀之試驗片。其次,將該試驗片以壓縮速度:10mm/min,沿著厚度方向進行壓縮直至壓縮率成為50%為止時之應力(N)按單位面積(1cm2)進行換算而設為反彈力(N/cm2)。 The foam was cut into a test piece having a width of 30 mm and a length of 30 mm. Then, the test piece was compressed at a compression speed of 10 mm/min in the thickness direction until the compression ratio became 50%, and the stress (N) was converted into a rebound force (N/) in terms of a unit area (1 cm 2 ). Cm 2 ).

(拾取性) (pickup)

自發泡體獲得寬度:20mm、長度:120mm之片狀之試驗片,將該試驗片在溫度:23±2℃、濕度:50±5%之環境下保存24小時。再者,前處理條件依據JIS Z 0237。 A test piece having a width of 20 mm and a length of 120 mm was obtained from the foam, and the test piece was stored in an environment of temperature: 23 ± 2 ° C and humidity: 50 ± 5% for 24 hours. Furthermore, the pretreatment conditions are based on JIS Z 0237.

將試驗片之一側面,利用黏著膠帶A(寬度:20mm,長度:120mm,商品名「No.5603」,日東電工股份有限公司製造,附帶基材之兩面黏著膠帶,基材:PET基材)固定於利用聚矽氧系剝離劑進行處理之剝離紙。其次,於試驗片之另一側面,以試驗片與載帶之黏著劑層相接觸之形態貼合載帶(商品名「3164S」,Kern公司製造),在2kg滾輪、1次往返之條件下進行壓接,放置24小時,獲得評價用樣品。 One side of the test piece was made of adhesive tape A (width: 20 mm, length: 120 mm, trade name "No. 5603", manufactured by Nitto Denko Co., Ltd., adhesive tape on both sides of the substrate, substrate: PET substrate) It is fixed to a release paper which is treated with a polyfluorene-based release agent. Next, on the other side of the test piece, the carrier tape (trade name "3164S", manufactured by Kern Co., Ltd.) was attached in the form of contact between the test piece and the adhesive layer of the carrier tape, under the condition of 2 kg of roller and one round trip. The pressure was applied and left for 24 hours to obtain a sample for evaluation.

用手抬起評價用樣品之載帶之情形時,將評價用樣品中之剝離紙與黏著膠帶A之界面上產生剝離而可獲得載帶與試驗片與黏著膠帶A之積層物之情形評價為「良好」(○)。另一方面,用手抬起評價用樣品之載帶之情形時,將評價用樣品中之試驗片與載帶之界面上產生剝離而無法獲得載帶與試驗片與黏著膠帶之積層物之情形評價為「不良」(×)。 When the carrier tape of the evaluation sample is lifted by hand, the laminate between the release paper and the adhesive tape A in the evaluation sample is peeled off to obtain a laminate of the carrier tape and the test piece and the adhesive tape A. "Good" (○). On the other hand, when the carrier tape of the sample for evaluation is lifted by hand, the interface between the test piece and the carrier tape in the sample for evaluation is peeled off, and the laminate of the carrier tape and the test piece and the adhesive tape cannot be obtained. The evaluation was "bad" (×).

(泡體破壞抑制性) (foam destruction inhibition)

自發泡體獲得寬度:20mm、長度:120mm之片狀之試驗片,將該試驗片在溫度:23±2℃、濕度:50±5%之環境下保存24小時。再者,前處理條件依據JIS Z 0237。 A test piece having a width of 20 mm and a length of 120 mm was obtained from the foam, and the test piece was stored in an environment of temperature: 23 ± 2 ° C and humidity: 50 ± 5% for 24 hours. Furthermore, the pretreatment conditions are based on JIS Z 0237.

於試驗片之一側面貼附黏著膠帶A(寬度:20mm,長度:120mm,商品名「No.5603」,日東電工股份有限公司製造,附帶基材之兩面黏著膠帶,基材:PET基材),並將試驗片固定於SUS板(不鏽鋼板)。固定後,於SUS板上之試驗片,以試驗片與黏著劑層相接觸之形態貼合載帶(商品名「3164S」,Kern公司製造),在2kg滾輪、1次往返之條件下進行壓接,放置24小時,獲得評價用樣品。 Adhesive tape A was attached to one side of the test piece (width: 20 mm, length: 120 mm, trade name "No. 5603", manufactured by Nitto Denko Co., Ltd., adhesive tape on both sides of the substrate, substrate: PET substrate) And the test piece was fixed to a SUS plate (stainless steel plate). After the fixing, the test piece on the SUS plate was attached to the test piece in the form of contact with the adhesive layer (trade name "3164S", manufactured by Kern Co., Ltd.), and pressed under a condition of 2 kg of roller and one round trip. The sample was placed for 24 hours to obtain a sample for evaluation.

用手快速剝離評價用樣品之載帶,目測觀察剝離後之試驗片之狀態,並根據下述評價基準進行評價。 The carrier tape of the sample for evaluation was quickly peeled off by hand, and the state of the test piece after peeling was visually observed, and it evaluated based on the following evaluation criteria.

良好(○):不產生試驗片之表面破壞。 Good (○): No surface damage of the test piece was produced.

不良(×):產生試驗片之表面破壞。 Poor (x): Surface damage of the test piece was produced.

(返工性) (reworkability)

自發泡體獲得寬度:10mm、長度:120mm之片狀之試驗片,將該試驗片在溫度:23±2℃、濕度:50±5%之環境下保存24小時。再者,前處理條件依據JIS Z 0237。 A test piece having a width of 10 mm and a length of 120 mm was obtained from the foam, and the test piece was stored in an environment of temperature: 23 ± 2 ° C and humidity: 50 ± 5% for 24 hours. Furthermore, the pretreatment conditions are based on JIS Z 0237.

於試驗片之一側面貼附黏著膠帶A(寬度:10mm,長度:120mm,商品名「No.5603」,日東電工股份有限公司製造,附帶基材之兩面黏著膠帶,基材:PET基材),在2kg滾輪、1次往返之條件下進行壓接,並將該試驗片固定於SUS板(不鏽鋼板)。 Adhesive tape A was attached to one side of the test piece (width: 10 mm, length: 120 mm, trade name "No. 5603", manufactured by Nitto Denko Co., Ltd., adhesive tape on both sides with substrate, substrate: PET substrate) The pressure bonding was carried out under the condition of 2 kg of rollers and one round trip, and the test piece was fixed to a SUS plate (stainless steel plate).

自上述附帶黏著膠帶之發泡體用手剝離發泡體,目測確認剝離狀態,根據樹脂發泡體之層間是否產生破壞而評價返工性。 The foam was peeled off by hand from the foam with the adhesive tape described above, and the peeling state was visually confirmed, and the reworkability was evaluated based on whether or not the layers of the resin foam were broken.

良好(○):不產生發泡體之層間破壞。 Good (○): no interlayer damage of the foam was produced.

不良(×):產生發泡體之層間破壞。 Poor (X): The interlayer damage of the foam is produced.

(熔融張力) (melt tension)

於測定熔融張力時,使用Malvern公司製造之Capillary Extrusion Rheometer,自直徑為2mm、長度為20mm之毛細管,將以8.8mm/min之固定速度擠出之樹脂以2m/min之拉取速度拉取時之張力設為熔融張力。 For the measurement of the melt tension, a resin extruded at a fixed speed of 8.8 mm/min was pulled at a pulling speed of 2 m/min using a Capillary Extrusion Rheometer manufactured by Malvern Co., Ltd. from a capillary having a diameter of 2 mm and a length of 20 mm. The tension is set to the melt tension.

再者,於測定時,使用發泡成形前之顆粒物。又,使測定時之溫度為自樹脂之熔點向高溫側10±2℃之溫度。 Further, at the time of measurement, the particulate matter before foam molding was used. Further, the temperature at the time of measurement was a temperature of 10 ± 2 ° C from the melting point of the resin to the high temperature side.

(應變硬化度) (strain hardening degree)

於測定時,使用發泡成形前之顆粒物。將該顆粒物,使用經加熱之熱板加壓機,成形為厚度1mm之片狀,獲得薄片,自該薄片切割樣品(縱:10mm,橫:10mm,厚度:1mm)。 At the time of measurement, the particulate matter before foam molding was used. The pellet was formed into a sheet having a thickness of 1 mm using a heated hot plate press to obtain a sheet, and a sample was cut from the sheet (vertical: 10 mm, transverse: 10 mm, thickness: 1 mm).

自上述樣品,使用單軸伸長黏度計(TA Instruments公司製造),測定應變速度0.1[1/s]下之單軸伸長黏度。繼而,根據下述式,求出應變硬化度。 From the above samples, a uniaxial elongation viscosity at a strain rate of 0.1 [1/s] was measured using a uniaxial elongation viscometer (manufactured by TA Instruments). Then, the strain hardening degree was obtained according to the following formula.

應變硬化度=logηmax/logη0.2 Strain hardening degree = log η max / log η 0.2

(ηmax表示單軸伸長黏度中成為最高時之伸長黏度,η0.2表示應變ε為0.2時之伸長黏度)。 (ηmax represents the elongational viscosity at the highest uniaxial elongational viscosity, and η0.2 represents the elongational viscosity when the strain ε is 0.2).

再者,使測定時之溫度為樹脂之熔點。 Further, the temperature at the time of measurement was made the melting point of the resin.

於實施例中,由於發泡體之層間剝離強度為10N/20mm以上,不存在泡孔直徑為200μm以上之粗大泡孔,泡孔結構均勻,故而不產生可利用載帶進行拾取且產生泡體破壞之問題。另一方面,於比較例1之發泡體中,因含有粗大泡孔,故而發泡體表面之泡孔壁之比例減小,與載帶之密著性減弱,利用載帶之拾取較為困難。又,於比較例2及3之發泡體中,由於層間剝離強度較小,故而泡體破壞抑制性較差。因此,若比較例2及3之發泡體上貼附載帶後,剝離載帶,則產生發泡體之泡體破壞。 In the embodiment, since the interlayer peeling strength of the foam is 10 N/20 mm or more, there are no coarse cells having a cell diameter of 200 μm or more, and the cell structure is uniform, so that the carrier tape can be picked up and the bubble is generated. The problem of destruction. On the other hand, in the foam of Comparative Example 1, since the coarse cells were contained, the proportion of the cell walls on the surface of the foam was reduced, and the adhesion to the carrier tape was weakened, and it was difficult to pick up the carrier tape. . Further, in the foams of Comparative Examples 2 and 3, since the interlayer peeling strength was small, the foam damage suppressing property was inferior. Therefore, when the carrier tape was attached to the foams of Comparative Examples 2 and 3, the carrier tape was peeled off, and the foam of the foam was broken.

[產業上之可利用性] [Industrial availability]

本發明之樹脂發泡體係應用於電氣或電子機器(例如,行動電話、移動終端、智能手機、平板電腦(Tablet Personal Computer)、數 位相機、視訊攝影機、數位視訊攝影機、個人電腦、家電製品等)。 The resin foaming system of the present invention is applied to electrical or electronic machines (for example, mobile phones, mobile terminals, smart phones, tablet personal computers, digital Cameras, video cameras, digital video cameras, personal computers, home appliances, etc.).

Claims (16)

一種樹脂發泡體,其特徵在於:下述所定義之層間剝離強度為10N/20mm以上,壓縮50%時之反彈力為0.1~4.0N/cm2,平均泡孔直徑為10~200μm,最大泡孔直徑為300μm以下,層間剝離強度:將片狀之樹脂發泡體在23℃環境下貼附於黏著膠帶(商品名「No.5603」,日東電工股份有限公司製造)之黏著面,在2kg滾輪、1次往返之條件下進行壓接後,將上述樹脂發泡體在剝離角度90°、拉伸速度0.3m/min之條件下自上述黏著膠帶剝離時之剝離強度。 A resin foam characterized in that the interlaminar peel strength defined below is 10 N/20 mm or more, the rebound force at a compression of 50% is 0.1 to 4.0 N/cm 2 , and the average cell diameter is 10 to 200 μm. The cell diameter is 300 μm or less, and the interlaminar peeling strength is attached to the adhesive surface of the adhesive tape (trade name "No. 5603", manufactured by Nitto Denko Corporation) at 23 ° C in the sheet-like resin foam. After the pressure-bonding under the condition of 2 kg of the roller and one round trip, the peeling strength of the resin foam at the peeling angle of 90° and the tensile speed of 0.3 m/min was peeled off from the adhesive tape. 如請求項1之樹脂發泡體,其中進而視密度為0.01~0.20g/cm3The resin foam of claim 1, wherein the apparent density is from 0.01 to 0.20 g/cm 3 . 如請求項1或2之樹脂發泡體,其中構成上述樹脂發泡體之樹脂為熱塑性樹脂。 The resin foam of claim 1 or 2, wherein the resin constituting the resin foam is a thermoplastic resin. 如請求項3之樹脂發泡體,其中上述熱塑性樹脂為聚酯。 The resin foam of claim 3, wherein the thermoplastic resin is a polyester. 如請求項1至4中任一項之樹脂發泡體,其中上述樹脂發泡體係經過使高壓之氣體含浸於樹脂組合物後進行減壓之步驟而形成。 The resin foam according to any one of claims 1 to 4, wherein the resin foaming system is formed by a step of subjecting a high-pressure gas to a resin composition and then performing a pressure reduction. 如請求項5之樹脂發泡體,其中上述氣體為惰性氣體。 The resin foam of claim 5, wherein the gas is an inert gas. 如請求項5或6之樹脂發泡體,其中上述氣體為二氧化碳。 The resin foam of claim 5 or 6, wherein the gas is carbon dioxide. 如請求項5至7中任一項之樹脂發泡體,其中上述高壓之氣體為超臨界狀態。 The resin foam according to any one of claims 5 to 7, wherein the high-pressure gas is in a supercritical state. 一種發泡構件,其特徵在於:包含如請求項1至8中任一項之樹脂發泡體。 A foamed member comprising the resin foam according to any one of claims 1 to 8. 如請求項9之發泡構件,其中於上述樹脂發泡體上包含表面層。 The foam member according to claim 9, wherein the surface layer is contained on the resin foam. 如請求項10之發泡構件,其中上述表面層係藉由上述樹脂發泡 體表面之加熱熔融處理所形成之層。 The foam member of claim 10, wherein the surface layer is foamed by the resin The layer formed by the heat treatment of the surface of the body. 如請求項10之發泡構件,其中上述表面層為黏著劑層。 The foam member of claim 10, wherein the surface layer is an adhesive layer. 如請求項12之發泡構件,其中上述黏著劑層為丙烯酸系黏著劑層。 The foam member of claim 12, wherein the adhesive layer is an acrylic adhesive layer. 如請求項9至13中任一項之發泡構件,其係電氣或電子機器用。 A foamed member according to any one of claims 9 to 13, which is for use in an electrical or electronic machine. 一種發泡構件積層體,其特徵在於:具有利用在基材之至少單面側包含黏著劑層之載帶保持如請求項9至14中任一項之發泡構件之構成。 A foamed member laminate comprising a foam member having any one of claims 9 to 14 by a carrier tape comprising an adhesive layer on at least one side of the substrate. 一種電氣或電子機器類,其特徵在於:包含如請求項9至14中任一項之發泡構件。 An electrical or electronic machine characterized by comprising the foam member of any one of claims 9 to 14.
TW102118829A 2012-05-28 2013-05-28 Resin foam, foam member, foam member laminate, and electric or electronic devices TW201406835A (en)

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