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TW201340792A - 印刷電路板 - Google Patents

印刷電路板 Download PDF

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Publication number
TW201340792A
TW201340792A TW101110453A TW101110453A TW201340792A TW 201340792 A TW201340792 A TW 201340792A TW 101110453 A TW101110453 A TW 101110453A TW 101110453 A TW101110453 A TW 101110453A TW 201340792 A TW201340792 A TW 201340792A
Authority
TW
Taiwan
Prior art keywords
printed circuit
circuit board
pads
soldering
adjacent
Prior art date
Application number
TW101110453A
Other languages
English (en)
Inventor
Jie-Song Zhou
xing-hua Tang
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Publication of TW201340792A publication Critical patent/TW201340792A/zh

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09072Hole or recess under component or special relationship between hole and component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854Hole or via having special cross-section, e.g. elliptical

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一種印刷電路板,包括貫穿該印刷電路板的至少二個相鄰通孔、以及分別對應該至少兩個通孔的至少二個焊盤,每個焊盤圍繞該通孔且設置於該印刷電路板的表面,用以焊接穿孔元件,其中所述該至少二個焊盤的任意兩個相鄰焊盤中間的位置撈空形成一撈空部,以於焊接過程中防止焊錫溢流至相鄰的焊盤造成短路。

Description

印刷電路板
本發明涉一種印刷電路板,尤其涉及一種防止相鄰焊盤短路的印刷電路板。
雖然目前大多數的印刷電路板設計都採用雙面貼片的混合組裝技術,表面貼裝技術(Surface Mount Technology,SMT)成為印刷電路板設計技術的發展趨勢,但諸多電感線圈、大功率元件、電源模組等元件由於散熱、組織材質、可靠性等原因仍無法採用上述表面貼裝技術,而是在印刷電路板中開設通孔採用穿孔方式組裝,因此上述元件也稱為穿孔組式元件(Through Hole Component,THC),該類穿孔組式元件在印刷電路板中仍然佔有一定比例,而一般使用流動的手焊或波峰焊作業來完成該穿孔式元件與該印刷電路板之間的組裝。
在手焊或波峰焊作業過程中,常會出現熔融的焊錫溢流並融合於相鄰二焊盤之間,造成相鄰焊盤發生短路的問題。
有鑒於此,本發明提供一種印刷電路板,能夠有效的防止焊錫溢流至相鄰的焊盤造成短路。
一種印刷電路板,包括貫穿該印刷電路板的至少二個相鄰通孔、以及分別對應該至少兩個通孔的至少二個焊盤,每個焊盤圍繞該通孔且設置於該印刷電路板的表面,用以焊接穿孔元件,所述印刷電路板對應該至少二個焊盤的任意兩個相鄰焊盤中間的位置撈空形成一撈空部,以於焊接過程中防止焊錫溢流至相鄰的焊盤造成短路。
在本發明中的印刷電路板中,該穿孔式組件是以手焊或波峰焊作業焊接於每個所述焊盤。另外,所述撈空部的形狀可為長方形、橢圓形等,但不僅限於此。
利用本發明所提供的印刷電路板,能夠有效的防止焊接過程中防止焊錫溢流至相鄰的焊盤造成短路的問題,並且在焊接完成後易於檢查焊盤之間是否有溢焊,能有效提高生產效率。
下面結合附圖,對本發明中的鍍膜修正板作進一步的詳細描述。
請參閱圖1,為本發明印刷電路板一實施例示意圖。如圖所述,該印刷電路板1包括至少一焊接區10供對應的具有多個管腳(Pin)的穿孔式元件(Through Hole Component,THC)焊接,該焊接區10設置有貫穿該印刷電路板1以供所述管腳穿過的多個通孔11,以及設置於該印刷電路板1表面且分別圍繞對應的通孔11而設置的以供焊接該穿孔式元件的每個所述管腳的多個焊盤12,印刷電路板1上對應任意兩個相鄰焊盤12中間的位置設置一撈空部13,用於在進行焊接作業時,即使發生溢焊,焊錫會流至該撈空部13中而不會流至相鄰的焊盤12,從而防止焊錫溢流至相鄰的焊盤12造成短路。並且在焊盤12之間設置撈空部13,使得在焊接作業完成後檢查人員很容易通過檢查該撈空部13中是否有焊錫而檢查出相鄰焊盤12之間是否有溢焊。
例如,如圖1所示,設該印刷電路板1上準備焊接一個具有四個管腳的穿孔式元件,該印刷電路板焊接區10中對應設置四個通孔(分別為11a、11b、11c及11d)、以及四個焊盤(分別為12a、12b、12c及12d)。其中,焊盤12a和12b中間設置有撈空部13a,焊盤12b和12c中間設置有焊盤13b,焊盤12c和12d之間設置撈空部13c。
本實施例中,所述穿孔式元件是通過手焊或者波峰焊作業焊接於印刷電路板1上相應的焊接區10。撈空部13的形狀可為長方形,橢圓形等。
可以理解,以上所述實施方式僅供說明本發明之用,而並非對本發明的限制。有關技術領域的普通技術人員根據本發明在相應的技術領域做出的變化應屬於本發明的保護範疇。
1...印刷電路板
10...焊接區
11,11a~11d...通孔
12,12a~12d...焊盤
13,13a~13c...撈空部
圖1為本發明一實施例示意圖。
1...印刷電路板
10...焊接區
11,11a~11d...通孔
12,12a~12d...焊盤
13,13a~13c...撈空部

Claims (4)

  1. 一種印刷電路板,包括貫穿該印刷電路板的至少二個相鄰通孔、以及分別對應該至少兩個通孔的至少二個焊盤,每個焊盤圍繞該通孔且設置於該印刷電路板的表面,用以焊接穿孔式元件,其改良在於:所述印刷電路板對應該至少二個焊盤的任意兩個相鄰焊盤中間的位置撈空形成一撈空部。
  2. 如申請專利範圍第1項所述的印刷電路板,其中,該穿孔式組件是以手焊或波峰焊作業焊接於所述焊盤。
  3. 如申請專利範圍第1項所述的印刷電路板,其中,所述撈空部的形狀為長方形。
  4. 如申請專利範圍第1項所述的印刷電路板,其中,所述撈空部的形狀為橢圓形。
TW101110453A 2012-03-21 2012-03-26 印刷電路板 TW201340792A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012100753825A CN103327728A (zh) 2012-03-21 2012-03-21 印刷电路板

Publications (1)

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TW201340792A true TW201340792A (zh) 2013-10-01

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US (1) US20130248237A1 (zh)
CN (1) CN103327728A (zh)
TW (1) TW201340792A (zh)

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Publication number Priority date Publication date Assignee Title
CN104214729A (zh) * 2014-08-20 2014-12-17 合肥京东方光电科技有限公司 一种柔性电路板、背光模组及显示装置
CN107278047A (zh) * 2016-04-07 2017-10-20 塞舌尔商元鼎音讯股份有限公司 印刷电路板
CN106028648B (zh) * 2016-06-28 2019-03-01 北京中讯四方科技股份有限公司 一种使声表器件在高温条件下能正常工作的装置及方法
CN106255318A (zh) * 2016-08-25 2016-12-21 广东欧珀移动通信有限公司 印刷电路板及其波峰焊焊接方法
US11955396B2 (en) 2020-11-27 2024-04-09 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
US12159850B2 (en) 2020-12-25 2024-12-03 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
CN112802766A (zh) * 2021-01-04 2021-05-14 上海易卜半导体有限公司 半导体组件组装方法、半导体组件和电子设备
US12154884B2 (en) 2021-02-01 2024-11-26 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
US12500203B2 (en) 2021-02-22 2025-12-16 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly

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US20130248237A1 (en) 2013-09-26

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