TW201344091A - Lighting module and lamp - Google Patents

Abstract

Light-emitting module 100 comprises a substrate 110, LED chips 120 provided on the main surface 110a side of the substrate 110, a light scattering member 150 provided surrounding an arranging area AR1 including the whole area wherein the LED chips 120 provided on the main surface 110a side of the substrate 110 are arranged. In addition, in the direction orthogonal to the main surface 110a, the height of the light scattering member 150 from the main surface 110a is higher than that of a light-emitting layer 120a of an LED chip 120.

Description

Lighting module and lamp

The present invention relates to a light-emitting module and a luminaire using a semiconductor light-emitting element, and more particularly to an improvement in light distribution characteristics.

In the past, a luminaire using a semiconductor light-emitting element such as an LED (Light Emitting Diode) wafer which is more efficient and longer-lived than an incandescent bulb or a halogen bulb has been proposed (refer to Patent Document 1).

Such a lamp, for example, as shown in Fig. 24(a), generally includes a light-emitting module which is a plurality of sealing members 1130 containing a wavelength-converting material to be mounted on the substrate 1110 (the example of Fig. 24(a) is 16 The LED chip 1120 is sealed.

[Practical Technical Literature] [Patent Literature]

Patent Document 1: Japanese Laid-Open Patent Publication No. 2006-313717

From the viewpoint of improving the utilization efficiency of light, consider a light-emitting module, such as glass. The light-transmitting material forms the substrate 1110, and light emitted from the LED wafer 1120 from the surface (back surface) of the substrate 1110 opposite to the mounting surface of the LED chip 1120 can be utilized by the substrate 1110. As a lamp using the light-emitting module, for example, as shown in FIG. 25, a lamp in which the light-emitting module 1100 is disposed at a substantially central portion of the bulb case 1010 is provided. Here, the light emitting module 1100 is supported by the support member 1040.

However, the light-emitting module 1100 shown in FIG. 24(a), as shown by a dotted line S in FIG. 24(b), exhibits light distribution characteristics: light emitted toward the main surface of the substrate 1110 (toward) The amount of light of the light emitted by the area A2 in Fig. 24(b) is a light emitted from a direction intersecting the main surface of the substrate 1110 (for example, a direction in which the angle formed by the main surface is 30 to 90). The amount of light emitted by the area A1 of 24(b) is small compared to the amount of light. In this manner, when the lamp 1001 shown in FIG. 25 is used, the portion of the peripheral wall of the bulb case 1010 that intersects the imaginary plane including the main surface of the substrate 1110 at the time of lighting (the portion shown by hatching in FIG. 25) )darken. Therefore, it is required to use the light-emitting module 1100 of the lamp 1001 to improve the light distribution characteristics by increasing the amount of light radiated in the direction along the main surface of the substrate 1110.

In view of the above, it is an object of the present invention to provide a light-emitting module that improves light distribution characteristics.

The light-emitting module of the present invention includes: a substrate; at least one semiconductor light-emitting element disposed on a main surface side of the substrate; and a light-scattering member disposed on at least a part of an outer peripheral portion of the arrangement region, wherein the arrangement region includes a main surface of the substrate The entire area of the semiconductor light-emitting element is disposed; in the direction orthogonal to the main surface, the height of the autonomous surface of the light-scattering member is higher than the height of the autonomous surface of the light-emitting layer of the semiconductor light-emitting element.

According to this configuration, in the direction orthogonal to the main surface, since the height of the autonomous surface of the light-scattering member is higher than the height of the autonomous surface of the light-emitting layer, the self-luminous layer is radiated in a direction crossing the main surface of the substrate. a part of the light, which is incident on the autonomous surface of the light scattering member Since the layer is higher, part of the light incident on the portion is scattered and scattered toward the main surface of the substrate, so that the amount of light toward the main surface of the substrate increases. Thereby, the light distribution characteristics of the light-emitting module are improved.

1, 2, 1001, 2001, 3001, 4001, 5001, 6001, 7001, 8001, 9001‧‧‧ lamps

10, 1010, 9010‧‧‧ bulb shell

12‧‧‧wavelength conversion member

30, 930‧‧ ‧ ferrules

32, 64‧‧‧ male threaded parts

34‧‧‧ Female threaded parts

40‧‧‧heart column

40a‧‧‧One end

40b‧‧‧Other end

40b1, 40b2‧‧‧through holes

41a‧‧‧flat

41b‧‧‧ convex

50, 1040, 2050‧‧‧ Supporting components

52, 112, 114, 2150c1, 2150c2‧‧‧ through holes

53‧‧‧Departure

60‧‧‧ housing

61‧‧‧ Main Department

62‧‧‧Ring installation

70a, 70b‧‧‧ wire

80‧‧‧Power circuit

80a‧‧‧ circuit components

80b‧‧‧ circuit board

82a, 82b‧‧‧ power cord

90‧‧‧ Solder

100, 200, 300, 400, 500, 600, 700, 800, 900, 1100, 2000, 9100 ‧ ‧ lighting modules

101‧‧‧Lighting Department

110, 110A, 110B, 410, 710, 810, 910, 1110‧‧‧ substrates

110a, 810a‧‧‧ main faces

110b, 810b‧‧‧ back

120, 1120‧‧‧ LED chip

120a‧‧‧Lighting layer

130, 932, 1130‧‧‧ sealing components

140, 940‧‧‧ wiring pattern

140a‧‧‧Rings

140b‧‧‧foot

150, 250, 350, 450, 550, 650, 750, 850, 950, 1150, 2150, 2053, 3150, 4150, 5150, 6150, 7150, 8150, 9150‧‧‧ light scattering members

150a, 150b, 150c, 150d, 450a, 450b, 450c, 450d, 2051, 2052, 3150a1, 3150b1‧‧‧ flat members

151, 251‧‧‧ main side parts

152, 252‧‧‧ back side parts

410a, 410b, 410c, 410d, 451a, 451b, 451c, 451d‧ ‧ slit

551, 552, 651, 652, 751, 752‧‧‧ parts

851‧‧‧1st light scattering member

852‧‧‧2nd light scattering member

912‧‧‧Cylindrical members

931‧‧‧ ferrule pins

1150a, 2150a, 6150a‧‧‧ body parts

1150a2, 1150b2, 2150d, 6150b‧‧‧ Support Department

2150a2‧‧‧Part 1

2150b2‧‧‧2nd part

5150c, 7150e‧‧ ‧ cover

8150a‧‧‧1st building block

8150b‧‧‧2nd building block

AR1‧‧‧ configuration area

AR2‧‧‧ corresponding area

Fig. 1 shows a light-emitting module of the first embodiment, wherein (a) is a perspective view, (b) is a plan view, and (c) is a bottom view.

2(a) to (b) are cross-sectional views of the light-emitting module of the first embodiment

Fig. 3 is a schematic perspective view of the LED chip of the first embodiment

4(a) to 4(b) are diagrams for explaining the optical characteristics of the light-emitting module of the first embodiment.

Fig. 5 shows a lamp of the second embodiment, (a) is a partial sectional perspective view, and (b) is an arrow view of the A1-A1 section in (a).

Sectional view of the light-emitting module of the modification of Figs. 6(a) to (b)

Figure 7 is a perspective view of a light-emitting module of a modification

8(a) to 8(b) are diagrams for explaining a method of manufacturing a light-emitting module according to a modification

Fig. 9 shows a light-emitting module of a modification, (a) is a perspective view, and (b) is a sectional view

Top view of the light-emitting module of the modification of Figs. 10(a) to (b)

Fig. 11 shows a light-emitting module according to a modification, (a) and (b) are cross-sectional views, and (c) is a plan view.

Fig. 12 shows a lamp of a modification, (a) is a partial sectional perspective view, and (b) is an arrow view of the A2-A2 section in (a)

Figure 13 shows a luminaire of a modification, (a) is a partial cross-sectional perspective view, and (b) is an A3-A3 cross-sectional arrow view in (a)

Figure 14 is a plan view of a light-emitting module of a modification

Figure 15 shows a luminaire of a modification, (a) is a partial cross-sectional perspective view, and (b) is a B1-B1 cross-sectional arrow view in (a)

Figure 16 shows a luminaire of a modification, (a) is a partial cross-sectional perspective view, and (b) is a B2-B2 cross-sectional arrow view in (a)

Figure 17 shows a lamp of a modification, (a) is a partial sectional perspective view, and (b) is (a) B3-B3 section arrow view

Fig. 18 shows a lamp of a modification, (a) is a partial sectional perspective view, and (b) is an A4-A4 sectional arrow view in (a)

Fig. 19 shows a lamp of a modification, (a) is a partial sectional perspective view, and (b) is a B4-B4 sectional arrow view in (a)

Fig. 20 shows a lamp of a modification, (a) is a partial sectional perspective view, and (b) is an A5-A5 sectional arrow view in (a)

Fig. 21 shows a lamp of a modification, (a) is a perspective view, and (b) is an enlarged view of a portion surrounded by a chain of points in (a)

Figure 22 is a side view of a light-emitting module of a modification

Fig. 23 is a perspective view of the lamp of the modification of (a) to (b)

Fig. 24 shows a light-emitting module of a conventional example, (a) is a perspective view, and (b) is a diagram for explaining optical characteristics.

Figure 25 is a view for explaining the optical characteristics of a conventional light-emitting module

[Best Mode for Carrying Out the Invention] <Embodiment 1> <1> Overall composition

Fig. 1 is a perspective view of a light-emitting module 100 of the present embodiment.

The light-emitting module 100 includes a substrate 110, 18 LED chips 120 arranged in two rows on the substrate 110, a sealing member 130 for sealing together the nine LED chips 120, and a wiring pattern 140 for supplying power to each of the LED chips 120. And the light scattering member 150 is fixed to the end surface of the substrate 110. Here, the nine LED chips 120 and the sealing member 130 constitute one light-emitting portion 101.

<1-1> substrate

The substrate 110 is formed in a rectangular shape in a plan view, and has through holes 112 at both ends in the longitudinal direction for connecting wires for supplying electric power to the LED chips 120 from an external power supply circuit. Further, a through hole 114 having a rectangular shape in plan view is also formed at a substantially central portion of the substrate 110.

The substrate 110 is formed of a ceramic having high light transmittance and high thermal conductivity. As such a ceramic, there is alumina (Al ₂ O ₃ ) having light transmissivity. Here, although the LED chip 120 is mounted only on the main surface side of the substrate 110, white light is emitted from the back side of the substrate 110 to obtain omnidirectional light distribution characteristics. Further, the material of the substrate 110 is not limited to ceramics, and may be a light-transmitting material formed of a resin having high transparency or glass. Further, the shape of the substrate 110 is not limited to a rectangular shape in plan view, and may be other shapes such as an elliptical shape or a polygonal shape.

2(a) shows a cross section of the light emitting module 100 along the short side direction of the substrate 110, and FIG. 2(b) shows a cross section of the light emitting module 100 along the long side direction of the substrate 110.

Here, the thickness T1 of the substrate 110 is 1 mm in consideration of mechanical strength and transmittance of visible light when alumina is used as a material of the substrate 110. Thereby, the transmittance of the substrate 110 to the entire visible light region is slightly 96%.

<1-2> LED chip

As shown in FIG. 1, the LED chip 120 is configured as an element row in which nine LED chips 120 are arranged in a row along the longitudinal direction of the substrate 110. This element array is sandwiched in the short side direction of the substrate 110. Two rows are provided in such a manner that the through holes 114 are arranged in parallel. Further, the LED wafer 120 is mounted directly on the substrate 110 with an adhesive made of a silicone resin or the like. That is, as the mounting method of the LED wafer 120 to the substrate 110, a so-called COB (Chip On Board) type is employed. The LED chips 120 are electrically connected to each other via a metal wire (not shown). Further, the number of the LED chips 120 is not limited to 18, and may be appropriately changed in accordance with the use of the light-emitting module 100. Further, the number of elements may be set to one column, or three or more columns may be provided. In addition, the LED chip 120 is not limited to being mounted face up, and may be flip chip mounted.

The LED chip 120 is an LED formed of a blue-emitting GaN-based material, and emits light from an active layer made of a semiconductor. The active layer is interposed between a coating layer made of an N-type semiconductor and a coating layer made of a P-type semiconductor. between. This active layer corresponds to the light-emitting layer. This LED chip 120, for example, as shown in FIG. 3, is formed into a rectangular parallelepiped shape having a length of 400 μm × a width of 400 μm and a thickness T2 of about 50 μm in plan view. Here, the light-emitting layer 120a built in the inside of the LED wafer 120 has a thickness of about 10 nm. The height from the main surface of the substrate 110 to the light-emitting layer 120a is at least the thickness T2 (about 50 μm) of the LED wafer 120.

The light emitted from the light-emitting layer 120a is emitted not only from the top surface and the bottom surface of the LED wafer 120 but also from the four sides to the outside of the LED wafer 120. However, the area of the light-emitting layer 120a in plan view is parallel to the substrate. The area of the shape of the light-emitting layer 120a when viewed in the direction of 110 is extremely large. At this point, the amount of light emitted from the four side faces of the LED wafer 120 is relatively small compared to the amount of light emitted from the top surface and the bottom surface of the LED wafer 120 (see FIG. 2(b)).

<1-3> Sealing member

As shown in FIG. 1, the sealing member 130 is provided along the longitudinal direction of the substrate 110 so as to cover the element rows composed of the nine LED chips 120, respectively. The interval W2 of the two sealing members 130 (refer to FIG. 2(a)) is 2 mm.

The sealing member 130 is formed of a light transmissive resin material containing a fluorescent substance. The sealing member 130 functions as a wavelength converting member and is converted from the wavelength of light emitted from the LED wafer 120.

The light transmissive resin material is, for example, a phthalocyanine resin, a fluororesin, or a ruthenium oxygen. Epoxy mixed resin, urea resin, epoxy resin, amine ester resin, and the like. Further, the material of the sealing member 130 is not limited to a translucent resin material, and may be glass or the like having SiO ₂ or the like as a main component. Alternatively, an organic-inorganic hybrid light-transmitting material may be used as the material of the sealing member 130. The organic-inorganic hybrid light-transmitting material is a material composed of glass and a resin.

Further, as the fluorescent substance, for example, a YAG fluorescent substance ((Y, Gd) ₃ Al ₅ O ₁₂ : Ce ³⁺ ), a phthalate fluorescent substance ((Sr, Ba) ₂ SiO ₄ : Eu ^{2 can be used. +} ), a powder of a nitride phosphor ((Ca, Sr, Ba)AlSiN ₃ :Eu ²⁺ ), an oxynitride phosphor (Ba ₃ Si ₆ O ₁₂ N ₂ :Eu ²⁺ ). Thereby, the blue light emitted from each of the LED chips 120 is mixed with the yellow-green color which is converted by the fluorescent material and emitted by the fluorescent material to obtain white light. The blue light emitted from the LED chip 120 and the yellow light emitted from the self-sealing member 130 are also transmitted through the substrate 110 from the surface on which the LED wafer 120 is not mounted. In addition, the sealing member 130 does not have to contain a fluorescent substance. Further, the LED wafer 120 can be prevented from being deteriorated by corrosion by the sealing member 130.

<1-4> Wiring pattern

The wiring pattern 140 is formed at each of both ends in the longitudinal direction of the substrate 110. The wiring pattern 140 is composed of an annular portion 140a disposed on an outer peripheral portion of the through hole 112 of the substrate 110, and two leg portions 140b from the both sides of the annular portion 140a in the short side direction of the substrate 110. , extending along the adjacent two sides of the substrate 110. On the other hand, between the wiring patterns 140 formed at both end portions of the substrate 110, two rows of element rows are arranged. Here, the annular portion 140a of each of the wiring patterns 140 is electrically connected to the solder by the tip end portion of the lead wire penetrating through the through hole 112 of the substrate 110. The wiring pattern 140 is formed of, for example, a conductive material such as ITO (Indium Tin Oxide), silver (Ag), tungsten (W), or copper (Cu). Further, the foot portion 140b of each of the wiring patterns 140 and the LED wafer 120 are electrically connected via a metal wire (not shown).

Further, a plating treatment of nickel (Ni)/gold (Au) or the like is applied to the surface of the wiring pattern 140, and the other end opposite to the end portion of the annular portion 140a and the foot portion 140b which is connected to the annular portion 140a may be removed. The portion of the portion (the portion joined to the end portion of the metal wire) is applied by application of glass or the like.

<1-5> Light scattering member

The light-scattering member 150 is a diffusion processor that applies a coating of cerium oxide or the like to the surface of a light-transmitting material such as glass or ceramic. The light-scattering member 150 has a portion extending from the main surface 110a of the substrate 110 in a direction intersecting the main surface 110a (hereinafter referred to as "main surface side portion") 151, and a back surface 110b from the substrate 110. The portion that protrudes in a direction intersecting the back surface 110b (hereinafter referred to as "back side portion") 152. The main surface side portion 151 surrounds the arrangement area AR1 (the area surrounded by the one-dot chain line of FIGS. 1(a) and (b)) of the main surface 110a of the substrate 110. The back side portion 152 surrounds the corresponding region AR2 corresponding to the region AR1 in the back surface 110b of the substrate 110. That is, the main surface side portion of the light scattering member 150 151 has an annular wall structure and protrudes toward the main surface 110a side of the substrate 110. Further, the back side portion 152 of the light-scattering member 150 also has an annular wall structure and protrudes toward the back surface 110b side of the substrate 110.

Further, the light-scattering member 150 is composed of two pairs of flat members 150a and 150b; 150c and 150d which are fixed to the end faces of the substrate 110 by adhesive. As the adhesive, for example, an adhesive composed of a transparent epoxy resin having good thermal conductivity can be used. However, as the adhesive, it is not limited to being formed of a material having good thermal conductivity, and it may be formed of other materials if it is not transparent to heat conductivity compared with the epoxy resin.

Further, as shown in Fig. 2(a), the distance W4 from the light-emitting layer 120a to the front end surface of the main surface side portion 151, and the distance from the self-light-emitting layer 120a to the front end surface of the back side portion 152, as shown in Fig. 2(a) W5 is equal. Specifically, the width W1 of the light-scattering member 150 in the direction orthogonal to the main surface 110a of the substrate 110 is 5 mm, and the distance W4 and the distance W5 are both slightly 2.5 mm. The distances W31 and W32 between the light-scattering members 150 disposed at both end portions in the short-side direction of the substrate 110 and the sealing member 130 are both 1 mm. Further, in the light-scattering member 150, a portion located at both end portions in the short-side direction of the substrate 110 has a thickness T3 of 1 mm.

Further, as shown in FIG. 2(b), the distance W61 and W62 between the both ends of the sealing member 130 in the longitudinal direction and the light-scattering member 150 are both 5 mm. Further, in the light-scattering member 150, the thickness T4 of the portion located at both end portions in the longitudinal direction of the substrate 110 is also 1 mm.

Further, the material constituting the light-scattering member 150 is not limited to glass or ceramic, and may be, for example, a light-transmitting resin material.

<2> Optical characteristics of light scattering members

Next, the optical characteristics of the light scattering member 150 will be described.

4(a) and 4(b) show how light rays enter the light-scattering member 150 from the LED wafer 120 and are scattered by the light-scattering material 150. Here, FIG. 4(a) shows a state of light incident on a portion of the light-scattering member 150 which is located at both end portions in the short-side direction of the substrate 110; FIG. 4(b) The light is incident on the light-scattering member 150 at a position of the both end portions in the longitudinal direction of the substrate 110. As shown in FIGS. 4(a) and 4(b), a portion of the light that is incident on the light-scattering member 150 in a direction intersecting the principal surface 110a of the substrate 110 is guided by the light-scattering member 150 to the main body along the substrate 110. The direction of the face 110a is radiated (refer to the arrow L3).

As shown in FIG. 4(a), among the light beams emitted from the LED chip 120, the main surface 110a of the substrate 110 and the radiation direction are in a range of ±θ11 (refer to the arrow L11 in FIG. 4(a)). The light-scattering member 150 is incident on a portion of the substrate 110 at both end portions in the short-side direction. Further, among the light beams emitted from the other LED chip 120, the main surface 110a of the substrate 110 and the radiation direction are in a range of ±θ12 (see the arrow L12 in FIG. 4(a)), and are incident on the light. The scattering member 150 is located at a position of both end portions of the short-side direction of the substrate 110. That is, by appropriately determining the distance W32 between the sealing member 130 and the light-scattering member 150, the light emitted from the LED wafer 120 can be adjusted to be incident on the light-scattering member 150 at both ends in the short-side direction of the substrate 110. The amount of light in the location. For example, the distance W31, W32 between the sealing member 130 and the light-scattering member 150 in the short-side direction of the substrate 110 is 1 mm, and the shortest distance between the two sealing members 130 in the short-side direction of the substrate 110 is 2mm can be. At this time, θ11 is about 70° and θ12 is about 20°. As a result, a part of the light emitted from each of the LED chips 120 toward the short side of the substrate 110 is incident on the light scattering member 150.

Further, as shown in FIG. 4(b), in the light emitted from the LED wafer 120 closest to the light-scattering member 150 and radiated from the outer peripheral surface of the sealing member 130, the angle formed by the principal surface 110a of the substrate 110 and the radial direction is Light rays in the range of ± θ21 (refer to arrow L21 in FIG. 4(b)) are incident on the light scattering member 150 at positions at both end portions in the longitudinal direction of the substrate 110. Further, among the light beams emitted from the LED wafer 120 farthest from the light-scattering member 150 and radiated from the outer peripheral surface of the sealing member 130, the main surface 110a of the substrate 110 and the radiation direction are formed within an angle of ±θ22 ( Referring to the arrow L22) in FIG. 4(b), the light-scattering member 150 is incident on a position at both end portions in the longitudinal direction of the substrate 110. For example, when the distances W61 and W62 between the light-scattering member 150 and the sealing member 130 in the longitudinal direction of the substrate 110 are 5 mm, and the length of the element row composed of the nine LED wafers 120 is 20 mm, the angle is Θ21 is about 30° and the angle θ22 is about 6°. As a result, about 10% of the light emitted by the respective LED chips 120 is incident on the light scattering member 150. That is, compared with the light radiated from the LED chip 120 toward the short side direction of the substrate 110, the ratio of the light which is emitted from the LED wafer 120 toward the longitudinal direction of the substrate 110 is incident on the light-scattering member 150. small.

On the other hand, the amount of light radiated to the side of the substrate 110 in the longitudinal direction of the substrate 110 is larger than the amount of light radiated from the LED chip 120 as a whole toward the side of the substrate 110 in the short-side direction of the substrate 110. This is because the LED chips 120 are arranged in a column shape along the longitudinal direction of the substrate 110.

On the other hand, in the present embodiment, as described above, light emitted from the LED wafer 120 toward the longitudinal direction of the substrate 110 is incident on the light emitted from the LED wafer 120 in the short-side direction of the substrate 110. The proportion of the light of the light-scattering member 150 is reduced, whereby the balance of the light distribution to the side of the substrate 110 can be calculated.

As a result, in the light-emitting module 100 of the present embodiment, the height of the light-scattering member 150 from the main surface 110a of the substrate 110 and the self-substrate 110 of the light-emitting layer 120a in the direction orthogonal to the main surface 110a of the substrate 110 The height of the main surface 110a is relatively high. Thereby, a part of the light emitted from the light-emitting layer 120a in a direction intersecting the main surface 110a of the substrate 110 enters the light-scattering member 150, and the height of the autonomous surface 110a is higher than that of the light-emitting layer 120a. On the other hand, since a part of the light incident on the portion is scattered and scattered in the direction along the principal surface 110a of the substrate 110, the amount of light in the direction along the principal surface 110a of the substrate 110 increases. As a result, the light distribution characteristics of the light emitting module 100 are improved.

Further, by arranging the main surface side portion 151 around the arrangement area AR1, the omnidirectional image distribution characteristic along the main surface 110a of the substrate 110 can be improved.

By arranging the back surface side portion 152 of the outer peripheral portion of the corresponding region AR2 disposed on the back surface 110b of the substrate 110 around the corresponding region AR2, the light radiated toward the back surface 110b side of the substrate 110 may also be opposite to the back surface of the substrate 110. The omnidirectionality of 110b, the figure seeks to improve the light distribution characteristics.

<Embodiment 2>

The configuration of the lamp 1 of the second embodiment will be described.

Regarding the lamp 1, a partial cross-sectional perspective view is shown in Fig. 5(a), and an A1-A1 cross-sectional arrow view in Fig. 5(a) is shown in Fig. 5(b).

As shown in FIG. 5( a ), the lamp 1 includes a light-emitting module 100 that is a light source, a light-transmissive bulb shell 10 , a ferrule 30 that receives electric power, a stem 40 , a support member 50 , a housing 60 , and A pair of wires 70a, 70b. Further, as shown in FIG. 5(b), the lamp 1 includes a power supply circuit 80 housed inside the casing 60.

The light-emitting module 100 is a light source of the lamp 1, and is disposed in the bulb case 10 as shown in FIG. 5(a). Specifically, the light-emitting module 100 is disposed at a substantially central portion of the spherical portion in the bulb case 10. In this manner, by arranging the light-emitting module 100 at a substantially central position of the spherical portion of the bulb casing 10, the luminaire 1 can obtain an omnidirectional light distribution characteristic similar to that of a conventional white-light bulb using a filament coil. In addition, since the light-emitting module 100 has the same configuration as that of the first embodiment, detailed description thereof will be omitted.

Further, as shown in FIG. 5(b), the light-emitting module 100 receives power supply from the power supply circuit 80 via the two wires 70a and 70b. Here, as shown in FIG. 5(b), the front ends of the two lead wires 70a and 70b are in a state of being penetrated through the through holes 112 which are formed at both end portions in the longitudinal direction of the light-emitting module 100. The solder 90 is electrically connected to the annular portion 140a.

As shown in Fig. 5 (a), the bulb case 10 has a shape in which one of the bulb cases is closed and the other has an opening. That is, the bulb case 10 has a shape in which one portion of the hollow sphere extends in a direction away from the center portion of the sphere and is narrowed, and an opening portion is formed at a position away from the center portion of the sphere. That is, the shape of the bulb case 10 is the same as that of a general incandescent bulb (JIS C7710). The bulb shell 10 is formed of a light transmissive material such as ceria glass which is transparent to visible light. In addition, the shape of the bulb case 10 does not have to be A-shaped. For example, the shape of the bulb case 10 may be a G shape or an E shape or the like. Further, the bulb case 10 does not have to be transparent to visible light, and for example, a cerium oxide may be applied to form a milky white diffusion film or the like to perform diffusion treatment. In addition, it can be colored as A colored bulb shell such as red or yellow may be patterned or patterned, or a reflective bulb may be applied to the side of the ferrule as compared with the light source. Further, the material of the bulb case 10 does not have to be ceria glass, and may be a transparent resin such as acryl.

As shown in Fig. 5(b), the ferrule 30 receives power supplied from an external power source (not shown) to the power supply circuit 80, and the power received by the ferrule 30 is supplied to the power supply line 82a, 82b via the power supply lines 82a, 82b. Power circuit 80.

The ferrule 30 has a bottomed cylindrical shape, and a male screw portion 32 for screwing with a socket (not shown) of the lighting fixture is formed on the outer peripheral surface. Further, on the inner circumferential surface of the ferrule 30, a female screw portion 34 screwed to the casing 60 is formed. The set of rings 30 is formed of a conductive material such as metal. This set of rings 30 is an E26 shaped ferrule. In addition, the ferrule 30 does not have to be an E26-shaped ferrule, and may also be a ferrule of a different size such as an E17 shape. In addition, the ferrule 30 does not have to be a locking ferrule, for example, a ferrule of a different shape such as an insert shape.

As shown in FIG. 5(a), the stem 40 supports the light-emitting module 100; the stem 40 has a slightly rod shape and extends toward the inside of the bulb shell 10 from the vicinity of the opening of the bulb shell 10. Further, the stem 40 has a flat portion 41a for mounting the light-emitting module 100 on the one end portion 40a, and the one end portion 40a is disposed inside the bulb case 10 in the longitudinal direction; the central portion of the flat portion 41a is slightly A convex portion 41b that protrudes in the extending direction of the stem 40 is provided. The light-emitting module 100 is fixed to one end portion 40a of the stem 40 while the convex portion 41b is inserted through the through hole 114 provided in the substrate 110. Here, the surface of the substrate 110 of the light-emitting module 100 opposite to the surface side on which the LED chip 120 is mounted is in contact with the flat portion 41a of one end portion 40a of the stem 40.

Further, the stem 40 is formed of a metal material such as aluminum having a large thermal conductivity. Further, the material forming the stem 40 is not limited to a metal material, and may be a material having a large thermal conductivity such as ceramic. In this way, by forming the stem 40 with a material having a large thermal conductivity, the heat generated by the light emitting module 100 is easily dissipated through the stem 40 to the ferrule 30 and the bulb shell 10. As a result, it is possible to suppress a decrease in luminous efficiency and a shortened life of the LED wafer 120 due to an increase in temperature.

Further, the other end portion 40b of the longitudinal direction of the stem 40 is formed in a substantially conical shape, and two through holes 40b1, 40b2 for penetrating the wires 70a, 70b are formed inside the other end portion 40b.

In addition, the substrate 110 of the light-emitting module 100 and the stem 40 are fixed by an adhesive (not shown) made of a silicone resin. Further, as the binder, for example, an adhesive composed of a material which is obtained by dispersing metal fine particles in a silicone resin or the like to improve thermal conductivity can be used.

The support member 50 is disposed to close the opening of the bulb case 10. The support member 50 is fixed in a state of being fitted to the casing 60. Further, on the side of the bulb case 10 of the support member 50, the stem 40 is fixed. The support member 50 and the stem 40 are fixed by a screw. The support member 50 has a substantially disk-shaped shape, and its end surface abuts against the inner circumferential surface of the casing 60. Further, as shown in FIG. 5(b), a through hole 52 for penetrating the wires 70a and 70b is formed at a substantially central portion of the support member 50. The wires 70a and 70b which are led out from the power supply circuit 80 extend through the through holes 52 of the support member 50 and the through holes 40b1 and 40b2 formed in the other end portion 40b of the stem 40 to the light emitting module 100, and the light emitting module 100. The wiring pattern 140 is electrically connected.

Further, a step portion 53 is formed on the peripheral portion of the support member 50. The open end of the bulb case 10 is disposed in a region formed between the step portion 53 of the support member 50 and the casing 60, and is fixed to the support member 50 by an adhesive flowing into the region. The support member 50 is formed of a metal material such as aluminum. Further, the material forming the support member 50 is not limited to a metal material, and may be, for example, ceramics or the like. Further, as the above-mentioned binder, for example, an adhesive composed of a material formed by dispersing metal fine particles in a silicone resin can be used.

As described above, since the support member 50 is made of a material having a large thermal conductivity, the heat energy of the light-emitting module 100 thermally conducted to the stem 40 is efficiently conducted to the support member 50. Further, since the support member 50 is connected to the bulb case 10, the heat energy of the light-emitting module 100 conducted to the support member 50 is thermally conducted to the bulb case 10 and released from the outer surface of the bulb case 10 to the atmosphere. As a result, it is possible to suppress a decrease in luminous efficiency and a shortened life of the LED wafer 120 due to an increase in temperature. In addition, since the supporting member 50 is also connected to the housing 60, the light emitting module 100 is conducted to the supporting member 50. Thermal energy is also released from the outer surface of the casing 60 to the atmosphere.

The casing 60 is formed of a non-conductive resin material, is insulated from the stem 40 and the ferrule 30, and houses the power supply circuit 80. Examples of the non-conductive resin material include polybutylene terephthalate (PBT) containing glass fibers. As shown in FIG. 5(b), the casing 60 has a cylindrical main portion 61 disposed on the side of the stem 40, and a cylindrical ferrule disposed on the side of the ferrule 30 and having the ferrule 30 externally fitted. The mounting portion 62 is configured.

The main portion 61 has an inner diameter which is slightly the same as the outer diameter of the support member 50, and the support member 50 is fitted and fixed to the inner side thereof. In a state in which the support member 50 is fitted to the main portion 61, the inner peripheral surface of the main portion 61 is in contact with the support member 50. On the other hand, since the outer surface of the main portion 61 is exposed to the outside, the heat energy transmitted to the casing 60 is mainly discharged from the main portion 61 to the outside.

The ferrule mounting portion 62 has a male screw portion 64 formed on the outer peripheral surface thereof, and is screwed to the female screw portion 34 formed on the inner circumferential surface of the ferrule 30. By the male screw portion 64 screwing the female screw portion 34 of the ferrule 30, the ferrule 30 is externally fitted to the ferrule mounting portion 62, so that the ferrule 30 contacts the outer circumferential surface of the ferrule mounting portion 62. Therefore, the heat energy transmitted to the casing 60 is also conducted to the ferrule 30 via the ferrule mounting portion 62, and is released from the outer surface of the ferrule 30.

As shown in FIG. 5(b), the power supply circuit 80 is a circuit for supplying electric power to the light-emitting module 100, and is housed in the casing 60. Specifically, the power supply circuit 80 has a plurality of circuit elements 80a and a circuit board 80b on which the circuit elements 80a are mounted. The power supply circuit 80 converts the AC power received from the ferrule 30 via the two power supply lines 82a and 82b into DC power, and supplies DC power to the light-emitting module 100 via the two wires 70a and 70b.

<Modification>

(1) In the light-emitting module 100 of the first embodiment, the flat members 150a, 150b, 150c, and 150d constituting the light-scattering member 150 are formed into a rectangular plate shape, but the shape of the flat member is described. It is not limited to this.

For example, the light emitting module 200 shown in FIG. 6( a ) may be formed as a light scattering member 250 . The larger the main surface side portion 251 and the back side portion 252, the larger the amount of protrusion from the substrate 110 toward the inner side of the substrate 110.

Further, as in the light-emitting module 300 shown in FIG. 6(b), the light-scattering member 350 may be formed in a lens shape that protrudes toward the outer side of the substrate 110. Thereby, the light incident on the light scattering member 350 can be concentrated on the side of the substrate 110.

(2) The light-emitting module 100 of the first embodiment is described as an example in which the light-scattering member 150 is bonded to the substrate 110 by an adhesive made of a silicone resin, but the invention is not limited thereto.

For example, the light-emitting module 400 shown in FIG. 7 may be used to fix the light-scattering member 450 to the substrate 410 by an engaging structure.

Here, as shown in FIGS. 8(a) and 8(b), four slits 410a, 410b, 410c, and 410d as the engaging portions are formed on the substrate 410. Further, the light-scattering member 450 is composed of four rectangular plate-shaped flat members 450a, 450b, 450c, and 450d, and slits 451a, 451b, and 451c are formed in each of the flat members 450a, 450b, 450c, and 450d. 451d. Thereafter, as shown in FIG. 7, each of the flat members 450a, 450b, 450c, and 450d is engaged with the slits 410a, 410b, 410c, and 410d formed in the substrate 410 by slits 451a, 451b, 451c, and 451d. It is fixed to the substrate 410.

As shown in FIG. 8(a), the slits 410a and 410b are formed along the longitudinal direction of the substrate 410 from one of the short sides of the substrate 410. Further, the slits 410c and 410d are formed from the long side of one of the substrates 410 along the short side direction of the substrate 410. The widths of the slits 410a, 410b, 410c, and 410d are slightly equal to the thicknesses of the flat members 450a, 450b, 450c, and 450d. Further, the flat members 450a and 450b are formed in a rectangular plate shape, and the length in the longitudinal direction slightly matches the interval between the slits 410c and 410d. Further, in the flat members 450a and 450b, slits 451a and 451b as the engaged portions are formed along the longitudinal direction thereof. Further, as shown in FIG. 8(b), the flat members 450c and 450d are formed in a rectangular plate shape and have a length in the longitudinal direction and the substrate 410. The length in the short side direction is slightly uniform. Further, in the flat members 450c and 450d, slits 451c and 451d as the engaged portions are formed along the longitudinal direction thereof.

Next, a procedure of mounting the light-scattering member 450 on the substrate 410 in the method of manufacturing the light-emitting module 400 will be described with reference to FIGS. 8(a) and 8(b).

First, as shown in FIG. 8(a), the flat members 450a and 450b are inserted into the slits 410a and 410b formed in the substrate 410, respectively. At this time, the flat members 450a and 450b are inserted into the front ends of the slits 410a and 410b of the substrate 410 before the slits 451a and 451b are inserted. The flat members 450a and 450b are fixed to the substrate 410 in a state in which the flat members 450a and 450b are fitted to the slits 410a and 410b.

Next, as shown in FIG. 8(b), the flat members 450c and 450d are respectively inserted into the slits 410c and 410d formed in the substrate 410. At this time, the flat members 450c and 450d are inserted into the front ends of the slits 410c and 410d of the substrate 410 before the slits 451c and 451d are inserted. At this time, in a state in which the flat members 450c and 450d are fitted to the slits 410c and 410d, the flat members 450c and 450d are fixed to the substrate 410. Here, the flat members 450a and 450b are fixed to the substrate in a state in which one of the side faces in the thickness direction of the flat members 450c and 450d is in contact with both end faces of the flat members 450a and 450b in the longitudinal direction. In this manner, one of the side faces in the thickness direction of the flat members 450c and 450d is brought into contact with both end faces of the flat members 450a and 450b in the longitudinal direction to fix the flat members 450a and 450b, thereby restricting the flat member 450a. The movement of 450b toward the longitudinal direction of the substrate 410.

Through the above steps, the light-emitting module 400 shown in FIG. 7 is completed.

As a result, in the light-emitting module 400 of the present modification, since the flat members 450a, 450b, 450c, and 450d are fixed to the substrate 410 without using an adhesive, it is possible to improve the assembly workability and the component cost. .

(3) In the light-emitting module 100 of the first embodiment, the shape of the light-scattering member 150 is An example in which the position at the both end portions of the substrate 110 in the short-side direction and the position at the both end portions in the longitudinal direction of the substrate 110 are the same in the direction orthogonal to the main surface 110a of the substrate 110 will be described. However, it is not limited to this.

For example, as in the light-emitting module 500 shown in FIG. 9( a ), the light-scattering member 150 has a shape that is perpendicular to the main portion of the substrate 110 at a portion 551 located at both end positions in the short-side direction of the substrate 110 . The width of the direction of the surface 110a is narrower than the width of the portion 552 located at the both end portions in the longitudinal direction of the substrate 110 in the direction orthogonal to the main surface 110a of the substrate 110. As shown in FIG. 9(a), the LED chips 120 are arranged in two rows in a row along the longitudinal direction of the substrate 110. Therefore, the amount of light radiated in the longitudinal direction of the substrate 110 is smaller than the amount of light radiated in the short side direction of the substrate 110, whereby the amount of scattered light can be reduced, and thus two of the long sides in the substrate 110 are located. The width of the portion 552 at the end position in the direction orthogonal to the main surface 110a of the substrate 110 may be smaller than the portion 551 located at the both end positions in the short side direction of the substrate 110. Thereby, the material necessary for the light-scattering member 550 can be reduced, so that the cost of the member can be reduced.

For example, as shown in FIG. 9(b), the portion 551 of the light-scattering member 550 may be orthogonally disposed at both ends in the direction of the main surface 110a of the substrate 110, and the portion 552 may be orthogonal to the main surface 110a of the substrate 110. The distances W7 and W8 between the end portions in the direction are both 1 mm (that is, the portion 552 is orthogonal to the main body of the substrate 110 as compared with the width of the portion 551 which is orthogonal to the main surface 110a of the substrate 110. The width of the direction of the face 110a is reduced by a distance of 2 mm).

(4) The light-emitting module 100 according to the first embodiment describes the same example in which the thickness of the light-scattering member 150 is the same in the circumferential direction of the substrate 110, but the invention is not limited thereto.

For example, as in the light-emitting module 600 shown in FIG. 10( a ), the light-scattering member 650 may have a shape that is larger than the thickness of the portion 651 located at the both end positions in the short-side direction of the substrate 110 . The portion 652 located at the both end positions in the longitudinal direction of 110 is thin. As shown in FIG. 10(a), the LED chips 120 are arranged in two rows in a row along the longitudinal direction of the substrate 110. Therefore, the long side of the substrate 110 is compared with the amount of light radiated in the short side direction of the substrate 110. Since the amount of light radiated in the direction is small, the amount of scattered light can be reduced. Therefore, the width of the portion 652 located at both end portions in the longitudinal direction of the substrate 110 in the direction perpendicular to the main surface 110a of the substrate 110 can be made. It is a thin layer compared with the portion 651 located at the both end positions in the short side direction of the substrate 110. Thereby, the material necessary for the light-scattering member 650 can be reduced, so that the cost of the component can be reduced.

Alternatively, as shown in FIG. 10(b), the shape of the substrate 710 is elliptical in plan view, and the shape of the light-scattering member 750 is also elliptical in plan view; in the short-axis direction of the substrate 110. The thickness of the portion 751 at the both end portions is the largest, and the thickness of the portion 752 at the both end portions in the long axis direction of the substrate 110 is the smallest, and the thickness of each portion of the light scattering member 750 is from the portion 751 to the portion 752. It changes continuously.

(5) In the first embodiment, an example in which the light-scattering member 150 is fixed to the end surface of the substrate 110 will be described, but the invention is not limited thereto.

For example, as shown in FIGS. 11(a) to 11(c), the cylindrical first light-scattering member 851 fixed to the main surface 810a of the substrate 810 and the cylindrical portion 810b fixed to the back surface 810b of the substrate 810 may be used. 2 Light scattering member 852 is configured. Here, in the direction orthogonal to the main surface 810a, the height of the autonomous surface 810a of the first light-scattering member 851 is higher than the height of the autonomous surface 810a of the light-emitting layer 120a of the LED wafer 120.

(6) In the first embodiment, an example in which the light-scattering member 150 is fixed to the substrate 110 will be described. However, the fixed portion of the light-scattering member is not limited to the substrate.

In the lamp 1001 of the present modification, a partial cross-sectional perspective view is shown in Fig. 12(a), and an A2-A2 cross-sectional arrow view in Fig. 12(a) is shown in Fig. 12(b).

The lamp 1001 has a configuration similar to that of the second embodiment, and is different from the second embodiment in that the light-scattering member 1150 is fixed to the support member 2050. In FIG. 12, the same components as those in the second embodiment are denoted by the same reference numerals, and their description will be appropriately omitted.

The light scattering member 1150 has a body portion 1150a having a rectangular frame shape and two support portions 1150a2 and 1150b2 supporting the body portion 1150a. The end portions of the support portions 1150a2 and 1150b2 on the side opposite to the main body portion 1150a side are fixed to the support member 2050. Further, a gap is formed between the end surface of the substrate 110 of the light-emitting module 1100 and the inner circumferential surface of the main body portion 1150a. The main body portion 1150a and the support portions 1150a2 and 1150b2 are formed of a light transmissive resin material, glass, ceramics or the like.

Regarding the other lamp 2001 of the present modification, a partial cross-sectional perspective view is shown in Fig. 13 (a), and an A3-A3 cross-sectional arrow view in Fig. 13 (a) is shown in Fig. 13 (b).

The lamp 2001 has a configuration similar to that of the lamp 1001 of the configuration shown in Fig. 12, and the point at which the light-scattering member 2150 is fixed to the stem 40 is different from the lamp 1001 of the configuration shown in Fig. 12. In FIG. 13, the same components as those shown in FIG. 12 are denoted by the same reference numerals, and their description will be appropriately omitted.

The light scattering member 2150 has a rectangular frame-shaped main body portion 2150a and a rectangular plate-shaped support portion 2150d fixed to the stem 40 and supporting the main body portion 2150a. A through hole 2150c1 penetrating the stem 40 is formed in a central portion of the support portion 2150d, and a through hole 2150c2 penetrating the wires 70a and 70b is formed at two locations sandwiching the center portion.

The support unit 2150d can be divided into the first portion 2150a2 and the second portion 2150b2. A notch portion is formed in the opposite end faces of the first portion 2150a2 and the second portion 2150b2, and the end faces of the first portion 2150a2 and the second portion 2150b2 of the support portion 2150d are bonded to each other, and are formed corresponding to the respective notch portions. Through holes 2150c1, 2150c2. The support portion 2150d is fixed to the stem 40 by an adhesive interposed between the inner circumferential surface of the through hole 2150c1 and the stem 40. Here, a gap is formed between the end surface of the substrate 110 of the light-emitting module 1100 and the inner circumferential surface of the body portion 2150a of the light-scattering member 2150.

The main body portion 2150a and the support portion 2150d are formed of a light transmissive resin material, glass, ceramics, or the like.

(7) In the first embodiment, the light-emitting module 150 is described as an example in which the light-emitting module 100 is disposed so as to surround the arrangement area AR1 of the LED wafer 120 in the main surface 110a of the substrate 110. It is defined as the light scattering member surrounding the configuration area.

FIG. 14 is a plan view showing the light-emitting module 2000 of the present modification.

In the light-emitting module 2000, two rows of light-emitting element rows including a plurality of (nine in FIG. 14) LED chips 120 arranged in a line are provided on the substrate 110. The light-scattering member 2053 is composed of two light-transmissive flat members 2051 and 2052, and is disposed on both sides of the outer peripheral portion of the arrangement region AR1 in a direction orthogonal to the column direction of the light-emitting element row.

In the light-emitting module 2000, two rows of light-emitting element columns (9 in FIG. 14) arranged in a row are arranged along the longitudinal direction of the substrate 110, and thus the substrate 110 is formed as described above. The amount of light radiated in the longitudinal direction of the substrate 110 (the direction of the column of the light-emitting element rows) is larger than the amount of light radiated in the short-side direction (the direction orthogonal to the light-emitting element row). Therefore, even if the amount of light radiated from the side of the substrate 110 in the longitudinal direction of the substrate 110 from the light-emitting module 2000 is increased, the balance of the amount of light emitted from the light-emitting module 2000 toward the side of the substrate 110 can be obtained. Therefore, the light-emitting module 2000 does not have a light-scattering member disposed at both ends in the short-side direction of the substrate 110. As a result, the volume of the light-scattering member can be reduced, so that the weight of the light-emitting module 2000 and the material cost required for the light-scattering member can be reduced.

In the configuration shown in FIG. 14 , the light scattering member 2053 is composed of two light-transmissive flat members 2051 and 2052, and the flat members 2051 and 2052 are fixed to the substrate 110, respectively. The fixing of the light scattering member is not limited to the substrate 110.

In the other lamp 3001 of the present modification, a partial cross-sectional perspective view is shown in Fig. 15 (a), and a B1-B1 cross-sectional arrow view in Fig. 15 (a) is shown in Fig. 15 (b).

The luminaire 3001 is at a point where the light scattering member 3150 is fixed to the support member 2050 and FIG. 14 The composition shown is different. In FIG. 15, the same components as those in FIG. 12 are denoted by the same reference numerals, and their description will be appropriately omitted.

The light-scattering member 3150 is composed of rectangular plate-shaped flat members 3150a1 and 3150b1, and rod-shaped support portions 1150a2 and 1150b2 for supporting the flat members 3150a1 and 3150b1. Further, a gap is formed between the flat members 3150a1, 3150b1 and both end edges of the substrate 110 in the short-side direction. The flat members 3150a1 and 3150b1 and the support portions 1150a2 and 1150b2 are formed of a light transmissive resin material, glass, ceramics or the like.

In the other lamp 4001 of the present modification, a partial cross-sectional perspective view is shown in Fig. 16 (a), and a B2-B2 cross-sectional arrow view in Fig. 16 (a) is shown in Fig. 16 (b).

The lamp 4001 is different from the configuration shown in FIG. 15 in that the light-scattering member 4150 is fixed to the stem 40. It is noted that the same components as those in FIG. 15 are denoted by the same reference numerals in FIG.

The light scattering member 4150 has a rectangular plate-shaped support portion 2150d fixed to the stem 40 and supporting the flat members 3150a1, 3150b1.

(8) In the first embodiment, an example in which the light-scattering member 150 is not covered with the light-emitting module 100 on the main surface 110a of the substrate 110 in which the arrangement region AR1 of the LED wafer 120 is disposed is described, but the light scattering is performed. The member does not need to be limited to the upper side of the uncovered arrangement area AR1, and may be a light scattering member that covers the upper side of the arrangement area AR1.

In the other lamp 5001 of the present modification, a partial cross-sectional perspective view is shown in Fig. 17 (a), and a B3-B3 cross-sectional arrow view in Fig. 17 (a) is shown in Fig. 17 (b).

In the lamp 5001, the light-scattering member 5150 is fixed to the support member 2050 in a similar manner to the lamp 1001 having the configuration shown in FIG. 12, but the shape of the light-scattering member 5150 is different from that of the lamp 1001 having the configuration shown in FIG. In addition, in FIG. 17, the same symbol is attached to the same configuration as that shown in FIG. The number is omitted as appropriate.

The light-scattering member 5150 has a structure in which a rectangular plate-shaped lid portion 5150c is fixed to an end surface of each of the flat-plate-shaped members 3150a1 and 3150b1 on the side opposite to the end faces on the side of the connection supporting portions 1150a2 and 1150b2. The lid portion 5150c is formed of a light transmissive resin material, glass, ceramics, or the like.

In the other lamp 6001 of the present modification, a partial cross-sectional perspective view is shown in Fig. 18(a), and an A4-A4 cross-sectional arrow view in Fig. 18(a) is shown in Fig. 18(b).

In the lamp 6001, the light-scattering member 6150 is fixed to the supporting member 2050 in a slightly similar manner to the lamp 1001 shown in FIG. 12, but the shape of the light-scattering member 6150 is different from that of the lamp 1001 shown in FIG. In FIG. 18, the same components as those shown in FIG. 12 are denoted by the same reference numerals, and their description will be appropriately omitted.

The light-scattering member 6150 has a hollow spherical main body portion 6150a, a part of which forms an opening, and a support portion 6150b formed in a cylindrical shape and continuous with the outer peripheral portion of the opening of the main body portion 6150a. A light emitting module 1100 is disposed inside the main body portion 6150a. The support portion 6150b fixes the other end portion on the side opposite to one end portion of the main body portion 6150a side to the support member 2050 using an adhesive. Here, the light-emitting module 1100 is disposed in a state in which the substrate 110 does not contact the inner circumferential surface of the main body portion 6150a. The light-scattering member 6150 is formed by laminating two half members which are made of a light-transmitting resin material, glass, ceramics, or the like, and have a shape in which the light-scattering member 6150 is divided into two.

In the other lamp 7001 of the present modification, a partial cross-sectional perspective view is shown in Fig. 19 (a), and a B4-B4 cross-sectional arrow view in Fig. 19 (a) is shown in Fig. 19 (b).

In the lamp 7001, the light-scattering member 7150 is fixed to the stem 40 in the same manner as the lamp 2001 having the configuration shown in FIG. 13, but the shape of the light-scattering member 7150 is different from that of the lamp 2001 having the configuration shown in FIG. In FIG. 19, the same components as those in FIG. 13 are denoted by the same reference numerals, and their description will be appropriately omitted.

The light-scattering member 7150 has a structure in which a rectangular plate-shaped lid portion 7150e is fixed to an end surface of each of the flat-plate-shaped members 3150a1 and 3150b1 on the side opposite to the end surface on the side of the connection supporting portion 2150d. The lid portion 7150e is formed of a light transmissive resin material, glass, ceramics, or the like.

In the other lamp 8001 of the present modification, a partial cross-sectional perspective view is shown in Fig. 20 (a), and a cross-sectional arrow view broken away in the line A5-A5 in Fig. 20 (a) is shown in Fig. 20 (b).

In the lamp 8001, the light-scattering member 8150 is fixed to the stem 40 in the same manner as the lamp 2001 having the configuration shown in Fig. 13, but the shape of the light-scattering member 8150 is different from that of the lamp 2001 having the configuration shown in Fig. 13. In FIG. 20, the same components as those shown in FIG. 13 are denoted by the same reference numerals, and their description will be appropriately omitted.

The light scattering member 8150 is formed in a hollow spherical shape. The light-scattering member 8150 is formed by connecting the edge portions of the hollow hemispherical first member 8150a and the second member 8150b to each other. The light-scattering member 8150 is formed of a light-transmitting resin material, glass, ceramics, or the like.

(9) In the second embodiment, the bulb-shaped lamp is described, but the invention is not limited thereto.

For example, it may be a lamp 2 having the following elements as shown in Figs. 21(a) and (b): an elongated cylindrical member 912 formed of a light transmissive material such as glass; and two ferrules 930 mounted on a circle Both ends of the longitudinal direction of the tubular member 912; and the light-emitting module 900 are slightly the same as the length of the cylindrical member 912.

Here, the light-emitting module 900 includes an elongated substrate 910 which is slightly the same length as the cylindrical member 912, and a plurality of LED wafers 120 arranged on the substrate 910 in two rows along the longitudinal direction of the substrate 910; and a sealing member 932 The plurality of LED chips 120 are sealed together in each column; the light scattering member 950 is fixed to the end surface of the substrate 910 by an adhesive.

In addition, the ferrule 930 houses a power supply unit (not shown) therein, and is derived from the power supply unit. A wire (not shown) is electrically connected to the wiring pattern 940 formed on the substrate 910. Further, on the outer peripheral surface of each of the ferrules 930, two ferrule pins 931 projecting outward are provided. The set of pin 931 is inserted into the socket of the lighting fixture, so that the power supply unit is powered from the socket via the ferrule pin 931, and the power supply unit supplies power to the wiring pattern 940 via the wire.

(10) In the first embodiment, an example in which the substrate 110 and the light-scattering member 150 are separated from each other will be described. However, the present invention is not limited thereto. For example, when the substrate 110 and the light-scattering member 150 are separated by the same type, In the case of a material material, the substrate 110 and the light scattering member 150 may be integrally formed.

(11) In the first embodiment, the height of the front end surface of the main surface side portion 151 of the light-scattering member 150 from the light-emitting layer 120a of the LED wafer 120 in the direction orthogonal to the main surface 110a of the substrate 110, and the light The back surface side portion 152 of the scattering member 150 has an example in which the heights of the front end surface from the light-emitting layer 120a are equal, but the invention is not limited thereto.

In a direction orthogonal to the principal surface 110a of the substrate 110, the main surface side portion 151 of the light-scattering member 150 has a height from the light-emitting layer 120a of the LED wafer 120 on the front end surface thereof, and a back side portion 152 of the light-scattering member 150. The height of the front end surface from the light-emitting layer 120a may be different.

(12) In the first embodiment, an example of the light-emitting module 100 including only one substrate 110 in which the light-emitting portion 101 is provided on one surface side in the thickness direction will be described. However, for example, the light-emitting module having the following configuration may be used. In the group, two substrates provided with light-emitting portions on the main surface side are provided, and the back sides of the respective substrates on which the light-emitting portions are not provided are bonded to each other by an adhesive or the like.

A cross-sectional view of the light-emitting module 9100 of the present modification is shown in FIG.

The light-emitting module 9100 includes two substrates 110A and 110B on which the light-emitting portions 101 are provided on the main surface side, and the other surfaces of the substrates 110A and 110B on which the light-emitting portions 120 are not provided are bonded to each other by an adhesive or the like. Here, the substrate 110B corresponds to a sub-substrate attached to the back side of the substrate 110A. In other words, the two substrates 110A and 110B are mutually opposite to each other on the back side opposite to the main surface side. Relative state configuration. Thereafter, the light scattering member 9150 is fixed to the outer peripheral portions of the two substrates 110A and 110B. Further, the light-scattering member 9150 is not necessarily limited to being fixed to the outer periphery of the substrates 110A and 110B, and may be fixed to the supporting member 2150, for example, as described in the above (6). Here, the light-scattering member 9150 is provided on the outer peripheral portion of the entire arrangement region of the region in which the semiconductor light-emitting elements are disposed in the main surface of each of the substrates 110A and 110B. In the substrate 110A, 110B, the respective heights of the light-scattering members 9150 from the main surface in the direction orthogonal to the main surface are from the autonomous surface of the light-emitting layer 120a of the LED chip 120 constituting a part of the light-emitting portion 101. The height is higher.

In the configuration shown in FIG. 22, an example in which two substrates 110A and 110B are provided will be described. For example, a light-emitting module having a structure in which the light-emitting portions 101 are provided on both sides of one substrate may be used.

(13) In the first embodiment, an example in which the LED wafer 120 is mounted on the substrate 110 is a COB type. For example, an LED chip may be mounted on the substrate via a submount.

(14) In the second embodiment, the light-emitting module 100 including the light-scattering member 150 described in the first embodiment is disposed in the bulb case 10, that is, the light-scattering member 150 and the bulb case 10 are different. An example of the separate lamp 1 will be described, but is not limited to the case where the light scattering member 150 and the bulb case 10 are separated from each other. That is, the bulb case can also be operated as a light scattering member.

A lamp 9001 of the present modification is shown in FIG.

The lamp 9001 has a bulb case 9010 made of a material that scatters light. The light emitted from the light-emitting module 1100 disposed inside the bulb case 9010 is scattered toward the peripheral wall of the bulb shell 9010 and discharged to the outside. Examples of the material that scatters light constituting the bulb case 9010 include glass subjected to diffusion treatment such as blasting.

100‧‧‧Lighting module

101‧‧‧Lighting Department

110‧‧‧Substrate

110a‧‧‧ main face

110b‧‧‧Back

112, 114‧‧‧through holes

120‧‧‧LED chip

130‧‧‧ Sealing members

140‧‧‧Wiring pattern

140a‧‧‧Rings

140b‧‧‧foot

150‧‧‧Light scattering members

150a, 150b, 150c, 150d‧‧‧ flat members

151‧‧‧Main side parts

152‧‧‧Back side

AR1‧‧‧ configuration area

AR2‧‧‧ corresponding area

Claims (20)

A light-emitting module comprising: a substrate; at least one semiconductor light-emitting element disposed on a main surface side of the substrate; and a light-scattering member disposed on at least a portion of an outer peripheral portion of the arrangement region, wherein the arrangement region includes the main surface of the substrate a region of the surface in which the semiconductor light emitting element is disposed; wherein a height of the light scattering member from the main surface is higher than a light emitting layer of the semiconductor light emitting element in a direction orthogonal to the main surface The height from the main face. The light-emitting module of claim 1, wherein the light-scattering member is an annular wall plate structure surrounding the arrangement region. The light-emitting module of claim 1 or 2, wherein the substrate is made of a light-transmitting material. The light-emitting module of claim 3, wherein the light-scattering member further has at least a portion of an outer peripheral portion of a corresponding region corresponding to the arrangement region disposed on a back surface of the opposite side of the main surface of the substrate The part. The light-emitting module of claim 4, wherein the portion of the light-scattering member on the back surface of the substrate is an annular wall structure surrounding the corresponding region. The light-emitting module of claim 4, wherein, in a direction orthogonal to the main surface, a height of the front end portion of the light-scattering member from the light-emitting layer on the main surface side, and the light-scattering member The front end portion of the back side has the same height from the light-emitting layer. The light-emitting module of claim 1 or 2, wherein the plurality of semiconductor light-emitting elements comprise a plurality of light-emitting element columns arranged in a column shape; The light-scattering member is composed of two light-transmissive flat members which are disposed on both sides of a peripheral portion of the arrangement region which is orthogonal to the direction of the column of the light-emitting elements. The light-emitting module according to claim 1, further comprising: a sub-substrate; and at least one semiconductor light-emitting element disposed on a main surface side of the sub-substrate; and the sub-substrate and the sub-substrate The side of the opposite side is disposed opposite to each other; the light-scattering member is located at least a part of an outer peripheral portion of the entire region of the sub-substrate including the main surface of the semiconductor light-emitting element; In the direction in which the sub-substrate is orthogonal to the main surface, the height of the light-scattering member from the main surface of the sub-substrate is higher than the height of the light-emitting layer of the semiconductor light-emitting element from the main surface. The light-emitting module of claim 1 or 2, wherein the light-scattering member is fixed to the substrate by an adhesive made of a resin material. The light-emitting module according to claim 1 or 2, wherein the light-scattering member and the substrate are provided with an engaging portion on one side and an engaged portion on the other side, and the two portions are engaged and assembled. . The light-emitting module of claim 1 or 2, wherein the light-scattering member is made of any one of a resin, a ceramic, and a glass. A luminaire, comprising the illuminating module according to any one of claims 1 to 11. For example, the luminaire of claim 12, wherein: a bulb shell; The supporting member extends toward the inner side of the bulb shell and the front end portion is located at a central portion of the bulb shell; the light emitting module is mounted on the front end of the supporting member. A light fixture comprising: a light emitting module having a substrate and at least one semiconductor light emitting element disposed on a main surface side of the substrate; and a light scattering member having the light emitting module in an imaginary plane including a main surface of the substrate a portion of at least a portion of the outer peripheral portion having a gap between the light-emitting module and the portion; wherein the portion is from the imaginary surface in a direction orthogonal to an imaginary plane including the main surface of the substrate The height is higher than the height of the luminescent layer of the semiconductor light emitting element from the imaginary plane. A lamp according to claim 14, wherein a part of the portion protrudes toward a back side of the opposite side of the main surface of the substrate. The luminaire of claim 14 or 15, wherein the plurality of semiconductor light-emitting elements are configured as a column of light-emitting elements arranged in a column shape; and the light-scattering member is disposed at least in the imaginary plane The component columns are orthogonal to each other on both sides of the light emitting module. The luminaire of claim 14, wherein the illuminating module further includes a sub-substrate and at least one semiconductor light-emitting element disposed on a main surface side of the sub-substrate; and the substrate and the sub-substrate are arranged a state in which the back side opposite to the main surface side opposes each other; the height of the portion from the imaginary plane in a direction orthogonal to the imaginary plane including the main surface of the sub-substrate is higher than that of the semiconductor illuminating The height of the luminescent layer of the component from the imaginary plane. The luminaire of claim 14 or 15, wherein the illuminating module and the light scattering member are disposed inside the bulb shell. The luminaire of claim 14 or 15, wherein the light-scattering member is composed of any one of resin, ceramic, and glass. The luminaire of claim 14, wherein the light-scattering member is configured as a bulb shell in which the illuminating module is disposed.