TW201318988A - Glass substrate cutting device, glass substrate cutting method, and glass substrate manufacturing method - Google Patents

Abstract

To provide a glass cutting device capable of cutting a glass substrate even when the force applied in the direction of the thickness of a glass substrate is relatively weak. A glass substrate cutting device (100) according to the present solution provides a cutting member (10) for applying force to a main surface (Ga) of a glass substrate (G) having the main surface (Ga) and a main surface (Gb) on which a scribe line (S) has been formed, and a tensile-stress-applying member for applying tensile stress to the glass substrate (G). The cutting member (10) cuts the glass substrate (G) by applying force to the main surface (Ga) of the glass substrate (G) while tensile stress is applied to the glass substrate (G) by the tensile-stress-applying member.

Description

Glass substrate cutting device, glass substrate cutting method, and glass substrate manufacturing method

The present invention relates to a glass substrate cutting device, a glass substrate cutting method, and a glass substrate manufacturing method.

The glass substrate is suitably applied to a flat panel display such as a liquid crystal panel or a plasma display panel. Such a glass substrate is produced by cutting a large glass substrate (also referred to as a "mother glass substrate") into a predetermined size, and the large glass substrate is formed by a floating method or an overflow method. . After the dicing line (dividing line) is formed on the glass substrate, or the dicing line is formed on the glass substrate, the glass substrate is cut off by supplying an impact or bending stress along the scribe line, which is representative (for example, refer to the patent document) 1).

Patent Document 1 discloses a blade unit that divides a glass substrate by two blades. In the blade unit of Patent Document 1, in order to divide the glass substrate, the blade is used as a starting point to bend both ends of the glass substrate. Further, in the blade unit of Patent Document 1, an upper sparging duct and a lower ducting duct are provided, and by attracting the glass powder (glass scrap) generated by the division, the deterioration of the quality of the glass substrate is suppressed.

[prior art]

[Patent Document 1] Japanese Patent Laid-Open No. 2011-026136

However, in the cutting (segmentation) method disclosed in Patent Document 1, in order to cut the glass substrate, it is necessary to supply a strong force in the thickness direction of the glass substrate. In this case, the glass powder (glass crumb) is violently scattered, and the quality of the glass substrate to be produced may be deteriorated. In addition, when the cutting is performed with a strong force, there is a case where the quality of the glass substrate is deteriorated or the cutting failure is caused by the poorness of the cut surface of the glass substrate.

The present invention has been made in view of the above-described problems, and an object of the invention is to provide a glass substrate cutting device capable of cutting a glass substrate even when the force in the thickness direction of the glass substrate is weak. Glass substrate cutting method and glass substrate manufacturing method.

The glass substrate cutting device according to the present invention includes: a breaking member that supplies a force to the first main surface of the glass substrate having the first main surface and the second main surface on which the scribe line is formed; and the tensile stress supply member And supplying a tensile stress to the glass substrate; the breaking member supplies the tensile stress to the glass substrate by the tensile stress supply member, and supplies the tensile force to the first main surface of the glass substrate, thereby cutting off The glass substrate.

In one embodiment, the tensile stress supply member includes at least one pressing member having a first side portion and a second side portion, and the at least one pressing member faces the first main surface or the second main surface of the glass substrate Supply tensile stress.

In still another embodiment, the first side portion and the second side portion of the at least one pressing member are in contact with the first main surface or the second main surface of the glass substrate at an acute angle.

In still another embodiment, the breaking member is coupled to the at least one pressing member.

In still another embodiment, the at least one pressing member includes: a first pressing member, wherein the first side portion and the second side portion are in contact with the first main surface of the glass substrate at an acute angle; and the second In the pressing member, the first side portion and the second side portion are in contact with the second main surface of the glass substrate at an acute angle.

In still another embodiment, a suction port is attached to the second pressing member.

In still another embodiment, the breaking member biases the two main regions of the glass substrate sandwiching the line corresponding to the scribe line.

The glass substrate cutting method of the present invention includes a step of preparing a glass substrate having a first main surface and a second main surface on which a scribe line is formed, and a step of supplying a tensile stress to the glass substrate; The step of cutting the glass substrate by supplying the tensile stress to the glass substrate and supplying the first main surface of the glass substrate.

A method for producing a glass substrate according to the present invention is a method for producing a glass substrate by cutting a mother glass substrate, the method for producing a glass substrate comprising the step of preparing a mother glass substrate having a first main surface and a scribe line a second main surface; a step of supplying a tensile stress to the mother glass substrate; and a step of taking out the glass substrate, the glass substrate being supplied to the mother glass substrate by supplying the tensile stress to the mother glass substrate Cutting the mother glass by the first main surface The substrate is produced.

According to the invention, even if the force applied to the thickness direction of the glass substrate is weak, the glass substrate can be cut. Therefore, it is possible to suppress deterioration in quality of the glass substrate due to scattering of glass powder (glass debris), poor cut surface, or poor cutting.

Hereinafter, embodiments of the glass substrate cutting device, the glass substrate cutting method, and the glass substrate manufacturing method of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments.

Fig. 1 is a schematic view showing a glass substrate cutting device 100 of the present embodiment. The glass substrate cutting device 100 has a breaking member 10 and a tensile stress supply member 20. The glass substrate cutting device 100 is for cutting the glass substrate G having the main surfaces Ga and Gb. A groove extending substantially linearly is formed on the main surface Gb of the glass substrate G, and the groove is used as a scribe line S. The scribe line S is shown by a chain line in Fig. 1 . In the case where the cross section orthogonal to the extending direction of the scribe line S is observed, the scribe line S has a V shape or a U shape and is representative.

Further, in Fig. 1, a line S' corresponding to (opposite) the scribe line S among the main faces Ga of the glass substrate G is indicated by a broken line. Further, the groove S is formed with respect to the scribe line S, and no groove is provided for the line S'. In the present specification, the main surface Ga is described as the first main surface Ga, and the main surface Gb is described as the second main surface Gb.

The breaking member 10 supplies a force to the first main surface Ga of the glass substrate G. The breaking member 10 is biased toward or on the line S' of the first main surface Ga of the glass substrate G, and is more representative. By the breaking member 10 supplying a force to the main surface Ga of the glass substrate G, a bending stress is generated in the vicinity of the scribe line S.

Further, the tensile stress supply member 20 supplies a tensile stress that stretches the glass substrate G in the surface direction. The tensile stress supply member 20 supplies a tensile stress acting in a plane direction orthogonal to the extending direction of the scribe line S to the glass substrate G, which is more representative.

In the glass substrate cutting device 100 of the present embodiment, the fracture member 10 is biased to the main surface Ga of the glass substrate G in a state where the tensile stress supply member 20 stretches the glass substrate G. When the breaking member 10 supplies a force to the main surface Ga of the glass substrate G and generates a bending stress in the vicinity of the scribe line S, the tensile stress acting on the surface direction is supplied to the glass substrate G, and therefore, even if The force applied to the glass substrate G in the thickness direction by the breaking member 10 is weak, and the glass substrate G can be cut. Therefore, it is possible to suppress the scattering of the glass powder generated when the glass substrate G is cut, and it is possible to improve the quality of the cut surface and suppress the cutting failure.

In addition, in the first view, the tensile stressor member 20 is disposed on the second main surface Gb side of the glass substrate G, and the fracture member 10 is disposed on the first main surface Ga side of the glass substrate G. The tensile stress supply member 20 may be disposed on the main surface Ga side of the glass substrate G, or the tensile stress supply member 20 may be disposed on both sides of the main surfaces Ga and Gb of the glass substrate G. For example, the tensile stress supply member 20 is in contact with at least one surface of the principal surfaces Ga and Gb of the glass substrate G, and supplies tensile stress in a plane direction orthogonal to the extending direction of the scribe line S. Alternatively, the tensile stress supply member 20 may be disposed at an end portion of the side surface of the glass substrate G.

Here, a glass substrate cutting method of the present embodiment will be described with reference to Fig. 2 .

First, as shown in Fig. 2(a), a glass substrate G is prepared. The glass substrate G has main faces Ga and Gb, and a scribe line S is formed on the main surface Gb.

Next, as shown in FIG. 2(b), tensile stress is supplied in the surface direction of the glass substrate G. At this time, it is preferable that the tensile stress is substantially uniformly applied to the line S' or the scribe line S or the vicinity of the lines on the glass substrate G in a plane direction substantially orthogonal to the extending direction of the scribe line S.

Then, as shown in FIG. 2(c), the main surface Ga of the glass substrate G is supplied by the breaking member 10 in a state where the tensile stress is supplied to the glass substrate G. Thereby, a bending stress is generated in the vicinity of the scribe line S of the glass substrate G, whereby the glass substrate G is cut. Further, in the present embodiment, the glass substrate G is used as the mother glass substrate, and the glass substrate smaller than the mother glass substrate G can be taken out from the mother glass substrate G by cutting the mother glass substrate G.

Further, the tensile stress supply member 20 may supply tensile stress to the entire line S' or the scribe line S provided on the glass substrate G. Alternatively, the tensile stress supply member 20 may supply tensile stress to a portion of the line S' or the scribe line S provided on the glass substrate G. However, it is preferable that the tensile stress is supplied to the entire line S' or the scribe line S of the glass substrate G by the tensile stress supply member 20.

An example of the tensile stress supply member used in the glass substrate cutting device 100 of the present embodiment will be described with reference to Fig. 3 . Here, the pressing member 22 is employed as the tensile stress supply member 20. Fig. 3(a) shows a schematic perspective view of the pressing member 22, and Fig. 3(b) shows a schematic sectional view of the pressing member 22. The pressing member 22 has a shape that extends in the longitudinal direction. It is preferable that the pressing member 22 is formed of a material having a high modulus of elasticity.

The pressing member 22 has a bottom portion 22s0, and a side portion 22s1 and a side portion 22s2 which are continuously provided from the bottom portion 22s0. In the present specification, the side portion 22s1 is described as the first side portion 22s1, and the side portion 22s2 is referred to as the second side portion 22s2.

When the cross section in the direction orthogonal to the longitudinal direction of the pressing member 22 is observed, the angle θ1 formed by the bottom portion 22s0 and the first side portion 22s1 is an obtuse angle, and the angle θ2 formed by the bottom portion 22s0 and the second side portion 22s2 is Obtuse angle. Therefore, the distance between the side portion 22s1 of the pressing member 22 and the side portion 22s2 increases as moving away from the bottom portion 22s0.

For example, the pressing member 22 shown in FIG. 3 supplies tensile stress to the main surface Gb of the glass substrate G. Hereinafter, a glass substrate cutting method using the pressing member 22 shown in Fig. 3 will be described with reference to Fig. 4 .

As shown in FIG. 4( a ), the breaking member 10 is disposed to face the pressing member 22 with the glass substrate G interposed therebetween. The breaking member 10 is disposed on the main surface Ga side of the glass substrate G, and the pressing member 22 is disposed on the main surface Gb side of the glass substrate G. Here, the breaking member 10 is shown in a bar shape.

As shown in FIG. 4(b), the pressing member 22 is straight (moved) toward the glass substrate G to be in contact with the main surface Gb of the glass substrate G. The pressing member 22 is disposed such that the longitudinal direction of the pressing member 22 is parallel to the scribe line S with respect to the glass substrate G. The side portions 22s1, 22s2 of the pressing member 22 are disposed on both sides of the scribe line S, and the pressing member 22 straddles the scribe line S. The side portion 22s1 of the pressing member 22 is in contact with the main surface Gb of the glass substrate G at an acute angle Φ1, and the side portion 22s2 of the pressing member 22 is in contact with the main surface Gb of the glass substrate G at an acute angle Φ2. By pressing the pressing member 22 toward the glass substrate G, the side portions 22s1 and 22s2 are deformed in an expanded manner, whereby tensile stress can be supplied to the glass substrate G in the surface direction.

Next, as shown in FIG. 4(c), in a state where the pressing member 22 is supplied with tensile stress to the glass substrate G, the breaking member 10 is biased to the main surface Ga of the glass substrate G. Thereby, the cutting of the glass substrate G is performed. In addition, the pressing member 22 presses the glass substrate G so as to be in contact with the main surface Gb of the glass substrate G, whereby the pressing member 22 can supply the tensile stress in the surface direction and also supply the direction in which the scribe line S is expanded. Force.

Further, the pressing member 22 shown in Figs. 3 and 4 is provided with a bottom portion 22s0, and the side portions 22s1 and 22s2 are connected by the bottom portion 22s0. However, the embodiment is not limited thereto. The bottom portions 22s0 may not be provided on the pressing member 22, and the side portions 22s1 and 22s2 may be directly coupled.

Further, in FIGS. 3 and 4, the pressing member 22 performs the main surface Gb of the glass substrate G. The pressing member 22 is separately provided from the breaking member 10 that supplies the force to the main surface Ga of the glass substrate G, but the embodiment is not limited thereto. The pressing member 22 can also be coupled to the breaking member 10.

Here, the pressing member 22 connected to the breaking member 10 will be described with reference to Fig. 5 . Fig. 5(a) is a schematic perspective view showing the pressing member 22 used in the glass substrate cutting device 100 of the present embodiment, and Fig. 5(b) is a schematic cross-sectional view showing the pressing member 22. The pressing member 22 has a bottom portion 22s0, and a side portion 22s1 and a side portion 22s2 which are continuously provided from the bottom portion 22s0. Here, the pressing member 22 is coupled to the breaking member 10. For example, the breaking member 10 is attached to the bottom portion 22s0 of the pressing member 22. Further, the breaking member 10 and the pressing member 22 may be integrally formed. In the pressing member 22, the height from the bottom portion 22s0 to the front ends of the side portions 22s1 and the side portions 22s2 is higher than the height from the bottom portion 22s0 to the front end of the breaking member 10.

For example, the pressing member 22 shown in FIG. 5 supplies tensile stress to the main surface Ga of the glass substrate G. Here, a glass substrate cutting method using the pressing member 22 shown in Fig. 5 will be described with reference to Fig. 6 .

As shown in FIG. 6( a ), the connected breaking member 10 and the pressing member 22 are disposed on the main surface Ga side of the glass substrate G. Moreover, it is preferable to supply the force substantially uniformly to the entire surface of the main surface Gb of the glass substrate G. For example, although not shown in the figure, the main surface Gb of the glass substrate G is in contact with a substantially flat surface (wall or floor) that extends substantially parallel to the main surface Gb, and the flat surface corresponds to the scribe line. It is preferable to provide a recess or a hole in the vicinity of S.

As shown in FIG. 6(b), the pressing member 22 is advanced (moved) toward the glass substrate G to be in contact with the main surface Ga of the glass substrate G. The moving direction is, for example, the normal direction of the main surface of the bottom portion 22s0 of the pressing member 22. The side portions 22s1, 22s2 of the pressing member 22 are located on both sides of the line S' of the glass substrate G, and the pressing member 22 is placed on the line S'. The side portion 22s1 of the pressing member 22 is in contact with the main surface Ga of the glass substrate G at an acute angle Φ1, and the side portion 22s2 of the pressing member 22 is in contact with the main surface Ga of the glass substrate G at an acute angle Φ2. Moreover, at this time, the breaking member 10 does not come into contact with the main surface Ga of the glass substrate G. By the contact of the pressing member 22 with the main surface Ga of the glass substrate G, the tensile stress in the surface direction is supplied to the main surface Ga of the glass substrate G.

Next, as shown in FIG. 6(c), when the pressing member 22 is further advanced, the side portions 22s1 and 22s2 of the pressing member 22 are deformed, and with this deformation, the breaking member 10 coupled to the pressing member 22 is bonded to the glass. The substrate G is in contact. In a state in which the tensile stress is applied to the glass substrate G in the surface direction by the pressing member 22, the breaking member 10 is biased to the main surface Ga of the glass substrate G, thereby The cutting of the glass substrate G is performed.

Further, the pressing member 22 shown in FIGS. 5 and 6 is connected to the breaking member 10, but the embodiment is not limited thereto. The pressing member 22 may also be provided separately from the breaking member 10. For example, a hole may be provided in the bottom portion 22s0 of the pressing member 22, and the breaking member 10 may be disposed to penetrate the hole of the bottom portion 22s0 of the pressing member 22. In this case, the force applied to the glass substrate G by the breaking member 10 and the pressing member 22 can be individually controlled.

In the glass substrate cutting device 100 described above, the pressing member 22 presses one of the main faces Ga and Gb of the glass substrate G, but the embodiment is not limited thereto. The pressing member 22 can also press both of the main faces Ga and Gb of the glass substrate G.

A glass substrate dividing method executed by the glass substrate cutting device 100 of the present embodiment will be described with reference to Fig. 7 . The glass substrate cutting device 100 has a pressing member 22A that supplies tensile stress to the main surface Ga of the glass substrate G, and a pressing member 22B that supplies tensile stress to the main surface Gb of the glass substrate G, and these are used as tensile stresses. The member 20 is supplied. Here, the breaking member 10 is also connected to the pressing member 22A.

As shown in FIG. 7( a ), the breaking member 10 and the pressing member 22A that are connected to each other are disposed to face the pressing member 22B with the glass substrate G interposed therebetween. The breaking member 10 and the pressing member 22A are disposed on the main surface Ga side of the glass substrate G, and the pressing member 22B is disposed on the main surface Gb side of the glass substrate G.

As shown in FIG. 7(b), the pressing member 22A is advanced (moved) toward the glass substrate G to be in contact with the main surface Ga of the glass substrate G, and the pressing member 22B is advanced (moved) toward the glass substrate G to be in contact with the glass substrate. The main surface G of G is in contact. The side portions 22as1, 22as2 of the pressing member 22 are located on both sides of the line S' of the glass substrate G, and the pressing member 22A straddles the line S'. Moreover, at this time, the breaking member 10 does not come into contact with the main surface Ga of the glass substrate G. By the contact of the pressing member 22A with the main surface Ga of the glass substrate G, the tensile stress in the surface direction is supplied to the main surface Ga of the glass substrate G. Further, the side portions 22bs1, 22bs2 of the pressing member 22B are located on both sides of the scribe line S of the glass substrate G, and the pressing member 22B straddles the scribe line S. By the contact of the pressing member 22B with the main surface Gb of the glass substrate G, the tensile stress in the surface direction is supplied to the main surface Gb of the glass substrate G.

As shown in Fig. 7(c), when the pressing member 22A further advances, the side portions 22as1, 22as2 of the pressing member 22A are deformed, and with this deformation, the breaking member 10 coupled to the pressing member 22A is bonded to the glass substrate G. contact. The tensile stress in the direction of the supply surface of the glass substrate G In this state, the breaking member 10 is supplied to the main surface Ga of the glass substrate G, whereby the glass substrate G is cut.

Further, in the glass substrate cutting device 100 shown in Fig. 7, the pressing members 22A and 22B have the same shape, and the pressing members 22A and 22B supply substantially the same tensile stress to the principal faces Ga and Gb of the glass substrate G. However, the embodiment is not limited to this. The tensile stresses of the main faces Ga and Gb supplied to the glass substrate may also differ.

Further, the pressing member 22 shown in FIGS. 3 to 7 is composed of a single member, but the pressing member 22 may be composed of a plurality of members.

The pressing member 22 of the glass substrate cutting device 100 of the present embodiment will be described with reference to Fig. 8 . Fig. 8(a) shows a schematic cross-sectional view of the pressing member 22. The pressing member 22 has a supporting member 22t and elastic members 22u1, 22u2 attached to the supporting member 22t. The support member 22t has a bottom portion 22t0 and side portions 22t1, 22t2. An elastic member 22u1 is attached to the side portion 22t1, and an elastic member 22u2 is attached to the side portion 22t2. For example, the support member 22t is formed of a relatively hard material.

The side portion 22s1 of the pressing member 22 is constituted by the side portion 22t1 of the supporting member 22t and the elastic member 22u1. Further, the side portion 22s2 of the pressing member 22 is constituted by the side portion 22t2 of the supporting member 22t and the elastic member 22u2. In this manner, since the elastic members 22u1 and 22u2 are disposed at the distal ends of the side portions 22s1 and 22s2 of the pressing member 22, the material of the supporting member 22t can be relatively freely selected. Further, although the pressing member 22 is shown in Fig. 8(a), the breaking member 10 may be coupled to the pressing member 22 having the supporting member 22t and the elastic members 22u1, 22u2 as shown in Fig. 8(b).

Further, a suction port may be attached to the pressing member 22 to attract the glass powder generated when the glass substrate G is cut.

Fig. 9 is a schematic view showing the pressing member 22 used in the glass substrate cutting device 100 of the present embodiment. For example, the suction port 22v is provided at the bottom portion 22s0 of the pressing member 22. Although not shown here, the suction port 22v is connected to the suction member by a flexible hose. By providing the suction port 22v in the pressing member 22, the suction of the glass powder generated when the glass substrate G is cut is performed, and the deterioration in quality can be further suppressed.

Further, in the glass substrate cutting device 100 shown in FIG. 7, the pressing member 22A that supplies the tensile stress to the main surface Ga of the glass substrate G and the tensile stress that supplies the tensile stress to the main surface Gb of the glass substrate G may be used. The suction port 22v shown in Fig. 9 is attached to the pressing member 22B. When the tensile stress is supplied to both the main surfaces Ga and Gb of the glass substrate G, the glass substrate is applied to the glass substrate. It is preferable that the glass powder is particularly likely to be scattered on the main surface Gb side of G. Therefore, it is preferable to attach the suction port 22v to the pressing member 22B that supplies tensile stress to the main surface Gb of the glass substrate G.

Further, in FIGS. 3 to 9 , the pressing member 22 is shown in a state in which the side surface of the end portion along the longitudinal direction thereof is open, but the embodiment is not limited thereto.

Fig. 10(a) is a schematic view showing the pressing member 22 used in the glass substrate cutting device 100 of the present embodiment. The pressing member 22 has a bottom portion 22s0, side portions 22s1, 22s2, and further has side portions 22s3, 22s4 located at ends along the longitudinal direction of the pressing member 22. Among them, the pressing member 22 is composed of five faces defined by the bottom portion 22s0, the side portions 22s1, 22s2, 22s3, and 22s4.

The side members 22s1, 22s2, 22s3, and 22s4 are provided on the pressing member 22 shown in Fig. 10(a) so as to surround the bottom portion 22s0. As such, the pressing member 22 may have a casing shape with the bottom portion 22s0 as a base.

It is preferable that the side portions 22s3 and 22s4 are formed of a material having a high modulus of elasticity. Here, the heights of the side portions 22s3 and 22s4 based on the bottom portion 22s0 of the pressing member 22 are substantially equal to the heights of the side portions 22s1 and 22s2.

Further, on the pressing member 22 shown in Fig. 10(a), a suction port 22v is provided in the bottom portion 22s0. When the pressing member 22 presses the glass substrate G, a space that is isolated from the outside is formed by the pressing member 22 and the glass substrate G, whereby the suction efficiency can be improved.

It is preferable that the length of the pressing member 22 in the longitudinal direction is longer than the length of the glass substrate G. However, the length of the pressing member 22 in the longitudinal direction may be shorter than the length of the glass substrate G. In this case, as shown in FIG. 10(b), the heights of the side portions 22s3 and 22s4 based on the bottom portion 22s0 of the pressing member 22 are lower than the heights of the side portions 22s1 and 22s2, and are on the side of the pressing member 22. When the portions 22s1 and 22s2 are in contact with the glass substrate G, it is preferable that the side portions 22s3 and 22s4 of the pressing member 2 are not in contact with the glass substrate G. Further, although only the pressing member 22 is illustrated in FIGS. 10(a) and 10(b), the breaking member 10 may be coupled to the pressing member 22.

As described above, the breaking member 10 supplies a force to the line S' in the main surface Ga of the glass substrate G and its vicinity. However, the breaking member 10 may not supply a force to the line S' in the main surface Ga of the glass substrate G, but may supply a force to the vicinity thereof.

Fig. 11(a) is a schematic view showing the breaking member 10 used in the glass substrate cutting device 100 of the present embodiment. The breaking member 10 has protrusions 10a1, 10a2.

Fig. 11(b) is a schematic view showing the glass substrate cutting device 100 including the breaking member 10 shown in Fig. 11(a). Although not shown in Fig. 11(b), the projections 10a1 and 10a2 extend in parallel with the extending direction of the line S'. In this case, the protruding portions 10a1 and 10a2 of the breaking member 10 are in contact with the two regions of the main surface Ga of the glass substrate G sandwiching the line S', and the breaking member 10 is sandwiched by the line S of the main surface Ga of the glass substrate G. 'The two areas are powered. As described above, when the breaking member 10 has the protruding portions 10a1 and 10a2, even if the contact point between the breaking member 10 and the glass substrate G is slightly shifted, the force in the direction in which the scribe line S is extended can be supplied substantially uniformly.

The cutting of the glass substrate G can also be performed in a state of being held by the holding member. For example, the holding member may hold the glass substrate G in the horizontal direction or may remain in the vertical direction. Hereinafter, a more specific example of the glass substrate cutting device 100 of the present embodiment will be described with reference to FIGS. 12 and 13 .

Fig. 12 is a schematic view showing the glass substrate cutting device 100 of the embodiment. The glass substrate cutting device 100 shown in Fig. 12 has a breaking member 10, a pressing member 22A, and a pressing member 22B. The pressing members 22A and 22B are disposed to face each other across the glass substrate G, and the breaking member 10 is coupled to the pressing member 22A.

The pressing members 22A and 22B each have a housing-shaped support member 22t and an elastic member 22u. Further, in Fig. 12, in order to prevent the drawing from being too complicated, the side portions of the end portions along the longitudinal direction of the pressing members 22A and 22B are omitted.

The elastic member 22u is attached to the front ends of the side portions 22s1 and 22s2 of the pressing members 22A and 22B. For example, a rubber lip having a hardness of 90 degrees and a thickness of 1 to 3 mm is used as the elastic member 22u. For example, the rubber lip 22u is screwed to the support member 22t.

On the pressing member 22A, the distance between the front end of the side portion 22s1 and the front end of the side portion 22s2 is approximately 60 mm to 80 mm. The width of the bottom portion 22s0 of the pressing member 22A (the length in the direction orthogonal to the direction in which the line S' or the scribe line S extends) is 30 mm to 40 mm. In addition, the height of the front end (elastic member 22u) of the side portions 22s1, 22s2 of the pressing member 22A with the bottom portion 22s0 of the pressing member 22A as a reference is 100 mm, and the height of the side portions 22s1, 22s2 of the pressing member 22A is higher than the height of the breaking member 10. About 2mm. Further, a suction port 22v is provided in the pressing member 22A. Here, the pressing members 22A and 22B have the same shape.

The pressing members 22A and 22B are supported by the straight guide to be movable in the normal direction of the main faces Ga and Gb of the glass substrate G. The pressing force of the pressing members 22A, 22B by the moving member 40 And move. The pressing members 22A, 22B are moved in the linear direction by the moving member 40. For example, the moving member 40 may also be a pneumatic cylinder or a drive unit composed of a combination of a motor and a ball screw. Alternatively, the moving member 40 may be a composite of a pneumatic cylinder and a motor and a ball screw drive unit. For example, when the moving member 40 is a combination of a pneumatic cylinder and a driving unit of a motor and a ball screw, the pressing members 22A and 22B can be moved by the pneumatic cylinder until the elastic member 22u comes into contact with the glass substrate G, and then borrowed. Pressed by the motor. Alternatively, the pressing members 22A and 22B may be first moved by the motor until the elastic member 22u comes into contact with the glass substrate G, and then the pressing members 22A and 22B are moved by the pneumatic cylinder.

In the glass substrate cutting device 100 shown in FIG. 12, the glass substrate G is held by the holding member 30. For example, the holding member 30 holds the glass substrate G in a hanging manner by clamping the vicinity of the upper end of the glass substrate G. The glass substrate G is conveyed in a state of being suspended in the vertical (vertical) direction.

For example, one side of the glass substrate G exceeds 2 m. The length of the pressing members 22A and 22B in the longitudinal direction is longer than that of the glass substrate G. Thereby, it is possible to suppress the deviation of the cut surface from the scribe line S at the time of cutting the glass substrate G.

The cutting of the glass substrate G was performed in the following manner. First, the glass substrate G on which the scribe line S is formed is transported to the glass substrate cutting device 100. For example, the glass substrate G is formed by the scribing device (not shown), and then transported to the glass substrate cutting device 100 by the transport device while being held by the holding member 30.

Next, the positions of the breaking member 10 and the glass substrate G are aligned so as to match the line S' (not shown in Fig. 12) corresponding to the scribe line S of the glass substrate G. Then, the pressing members 22A and 22B are advanced toward the glass substrate G until the elastic members 22u of the pressing members 22A and 22B are in contact with the glass substrate G. When the elastic member 22u of the pressing members 22A and 22B contacts the glass substrate G, the breaking member 10 does not come into contact with the glass substrate G. Then, the pressing members 22A and 22B are further advanced toward the glass substrate G, and tensile stress is generated in a plane direction orthogonal to the line S' of the glass substrate G and the scribe line S. After the pressing members 22A and 22B are brought into contact with the glass substrate G by the urging force of the moving member 40, the elastic member 22u is deformed so as to be developed in the outward direction, whereby stretching is generated in the vicinity of the scribe line S of the glass substrate G. stress.

Then, when the pressing members 22A, 22B are further moved in proximity to the glass substrate G, the breaking member 10 is in contact with the glass substrate G at the line S' of the main surface Ga of the glass substrate G and its vicinity. A force is applied to the main surface Ga of the glass substrate G along the line S'. At this time, the tensile stress is supplied to the glass substrate G by the pressing members 22A and 22B, whereby the glass substrate G can be cut with a weak force.

Moreover, at least at the time of cutting, the space covered by the pressing members 22A and 22B is sucked through the suction port 22v, whereby scattering of the glass powder generated when the glass substrate G is cut can be suppressed.

Further, in the glass substrate cutting device 100 shown in Fig. 12, the glass substrate G is held and transported in a suspended state, but the embodiment is not limited thereto. It is also possible to hold and transport the glass substrate G in the vertical direction by the normal line of the main surfaces Ga and Gb.

Fig. 13 is a schematic view showing the glass substrate cutting device 100 of the embodiment. The glass substrate cutting device 100 shown in FIG. 13 has the same configuration as the glass substrate cutting device 100 described with reference to FIG. 12 except for the surface of the glass substrate G and the configuration related thereto, in order to avoid complication. The description is omitted.

In the glass substrate cutting apparatus 100 shown in FIG. 13, the normal directions of the main surfaces Ga and Gb of the glass substrate G are parallel to the vertical direction, and the glass substrate G is conveyed in the horizontal direction. Here, as the holding member 30 that holds the glass substrate G, a roller belt is used, and the roller belt 30 can hold the glass substrate G while being used for transportation of the glass substrate G.

Here, before the glass substrate G is transported to the glass substrate cutting device 100, a scribe line S is formed on the scribe line forming device (not shown), and a scribe line S is formed on the lower surface of the glass substrate G, which is representative. Therefore, the main surface Ga of the glass substrate G faces upward, and the main surface Gb of the glass substrate G faces downward.

Moreover, in the glass substrate cutting apparatus 100 shown in FIG. 12 and FIG. 13, the length of the pressing members 22A and 22B is longer than the length of the glass substrate G, and the glass substrate G is cut at once, but this embodiment does not Limited to this. The cutting of the glass substrate G can also be gradually performed along the scribe line S (or the line S'). In addition, when the glass substrate G is gradually cut, the tensile stress supply member 20 may supply tensile stress to the vicinity of the region of the glass substrate G that is biased by the breaking member 10. However, in the case where the glass substrate G is large, it is preferable that the cutting of the glass substrate G is performed not once in each region but in one operation.

In addition, in the above description described with reference to FIGS. 12 and 13 , the glass substrate G is cut while being held in a state capable of being transported, but the embodiment is not limited thereto. The cutting of the glass substrate G may be performed without being held by the holding member. For example, the glass substrate G may be cut in a state of being disposed on a flat surface, and after being cut, may be transported by a separately provided transport mechanism.

In the above description described with reference to FIGS. 3 to 13 , the pressing member 22 has been described as an example of the tensile stress supply member 20, but the embodiment is not limited thereto. For example, the tensile stress supply member 20 can also be supplied with tensile stress by stretching the end portion of the glass substrate G. For example, the tensile stress supply member 20 may be stretched on the glass substrate G by tightening one side and the other side of the glass substrate G with respect to the extending direction of the scribe line S, respectively, and pulling in the surface direction. Extensive stress.

Further, in the above description, the breaking member 10 is shown in a bar shape, but the embodiment is not limited to this. The breaking member 10 can also be in the shape of a roll. For example, the main surface Gb of the glass substrate G may be moved in parallel with the line S while facing the main surface Gb of the glass substrate G by two rolls arranged across the line S, and on the glass substrate. The main surface Ga of G is moved along the line S' by a roller facing the main surface Ga of the glass substrate G.

[Industrial Applicability]

According to the invention, it is possible to suppress scattering of the glass powder generated when the glass substrate is cut. As described above, the glass substrate obtained by cutting the mother glass substrate is suitably applied to a flat panel display such as a liquid crystal panel or a plasma display panel.

10‧‧‧Fracture components

10a1, 10a2‧‧‧ protrusion

20‧‧‧ tensile stress supply member

22, 22A, 22B‧‧‧ Pressing members

22s0‧‧‧ bottom

22s1, 22s2, 22s3, 22s4‧‧‧ side

22as1, 22as2‧‧‧ side

22bs1, 22bs2‧‧‧ side

22t‧‧‧Support members

22t0‧‧‧ bottom

22t1, 22t2‧‧‧ side

22u1, 22u2‧‧‧ elastic members

22v‧‧‧ attracting mouth

30‧‧‧Roller conveyor belt

40‧‧‧Mobile components

100‧‧‧ glass substrate cutting device

Ga‧‧‧ main face

Gb‧‧‧ main face

G‧‧‧glass substrate

S‧‧ slash line

S’‧‧‧ line

Fig. 1 is a schematic view showing an embodiment of a glass substrate cutting device according to the present invention; and Figs. 2(a) to 2(c) are views showing an embodiment of a method for cutting a glass substrate of the present invention; Fig. 3(a) and (Fig. 3) b) is a schematic perspective view and a cross-sectional view of the pressing member in the glass substrate cutting device of the embodiment; and FIGS. 4(a) to 4(c) are views showing the glass substrate of the embodiment including the pressing member shown in FIG. Fig. 5 (a) and (b) are respectively a schematic perspective view and a cross-sectional view of a pressing member in the glass substrate cutting device of the embodiment; Fig. 6 (a) (c) is a schematic view for explaining a glass substrate cutting method used in the glass substrate cutting device of the embodiment including the pressing member shown in Fig. 5; Fig. 7 (a) to (c) A schematic view for explaining a method of cutting a glass substrate used in the glass substrate cutting device of the embodiment; 8(a) and 8(b) are schematic views showing a pressing member in the glass substrate cutting device of the embodiment; and Fig. 9 is a schematic perspective view of the pressing member in the glass substrate cutting device of the embodiment; Fig. 10(a) And (b) is a schematic perspective view of a pressing member in the glass substrate cutting device of the present embodiment. FIG. 11(a) is a schematic view showing a breaking member in the glass substrate cutting device of the embodiment, and FIG. 11(b) is a view 11(a) is a schematic view showing a glass substrate cutting device of the breaking member; Fig. 12 is a schematic view showing the glass substrate cutting device of the embodiment; and Fig. 13 is a schematic view showing the glass substrate cutting device of the embodiment.

10‧‧‧Fracture components

20‧‧‧ tensile stress supply member

100‧‧‧ glass substrate cutting device

Ga‧‧‧ main face

Gb‧‧‧ main face

G‧‧‧glass substrate

S‧‧ slash line

S’‧‧‧ line

Claims (9)

A glass substrate cutting device comprising: a breaking member that supplies a first main surface to a glass substrate having a first main surface and a second main surface on which a scribe line is formed; and a tensile stress supply member; Supplying a tensile stress to the glass substrate; wherein the breaking member supplies the tensile stress to the glass substrate by the tensile stress supply member, and supplies the tensile force to the first main surface of the glass substrate, thereby cutting off The glass substrate. The glass substrate cutting device according to claim 1, wherein the tensile stress supply member includes at least one pressing member having a first side portion and a second side portion; the at least one pressing member facing the glass substrate The first main surface or the second main surface is supplied with tensile stress. The glass substrate cutting device according to the second aspect of the invention, wherein the first side portion and the second side portion of the at least one pressing member are in contact with the first main surface of the glass substrate at an acute angle or The second main face. The glass substrate cutting device according to the second aspect of the invention, wherein the breaking member is coupled to the at least one pressing member. The glass substrate cutting device according to claim 2, wherein the at least one pressing member has a first pressing member, wherein the first side portion and the second side portion are in contact with the glass substrate at an acute angle And the second pressing member, wherein the first side portion and the second side portion are in contact with the second main surface of the glass substrate at an acute angle. The glass substrate cutting device according to claim 5, wherein a suction port is attached to the second pressing member. The glass substrate cutting device according to the first aspect of the invention, wherein the breaking member supplies a force to two regions of the first main surface of the glass substrate sandwiching a line corresponding to the scribe line. A glass substrate cutting method includes the steps of: preparing a glass substrate having a first main surface and a second main surface on which a scribe line is formed; a step of supplying tensile stress to the glass substrate; and a step of cutting the glass substrate by supplying the first main surface of the glass substrate in a state where the tensile stress is supplied to the glass substrate. A method for producing a glass substrate, which is a method for producing a glass substrate by cutting a mother glass substrate, the method for producing a glass substrate comprising the step of preparing a mother glass substrate having a first main surface and a scribed line a second main surface; a step of supplying a tensile stress to the mother glass substrate; and a step of taking out the glass substrate, wherein the glass substrate is supplied to the mother glass substrate by supplying the tensile stress to the mother glass substrate The mother glass substrate is cut by the first main surface to be produced.