[go: up one dir, main page]

TW201249597A - Method for grinding thin sheet-like workpiece and double-end surface grinder - Google Patents

Method for grinding thin sheet-like workpiece and double-end surface grinder Download PDF

Info

Publication number
TW201249597A
TW201249597A TW101108994A TW101108994A TW201249597A TW 201249597 A TW201249597 A TW 201249597A TW 101108994 A TW101108994 A TW 101108994A TW 101108994 A TW101108994 A TW 101108994A TW 201249597 A TW201249597 A TW 201249597A
Authority
TW
Taiwan
Prior art keywords
grinding
workpiece
polishing
difference
static pressure
Prior art date
Application number
TW101108994A
Other languages
Chinese (zh)
Other versions
TWI558503B (en
Inventor
Atsushi Shibanaka
Original Assignee
Koyo Machine Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koyo Machine Ind Co Ltd filed Critical Koyo Machine Ind Co Ltd
Publication of TW201249597A publication Critical patent/TW201249597A/en
Application granted granted Critical
Publication of TWI558503B publication Critical patent/TWI558503B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/06—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent requiring comparison of the workpiece with standard gauging plugs, rings or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H10P52/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

To minimize a difference in cutting sharpness between a pair of grinding wheels that grind both side surfaces of a workpiece. A double-end surface grinder according to the present invention includes a pair of static pressure pads 1 and 2 that hold a thin sheet-like workpiece W, a pair of grinding wheels 5 and 6 that grind both side surfaces of the workpiece W held between the pair of static pressure pads 1 and 2, a pair of measuring heads 9 and 10 that measure positions R1 and R2 of both side surfaces of the workpiece W being ground, a computing means 22 that calculates a relative position X of the workpiece W from measured values M1 and M2 of the measuring heads 9 and 10 measured when grinding precision of the workpiece W is within the reference precision, a position comparing means 24 that compares the relative position X with a grinding reference position X0 at which the workpiece W should be properly held between the static pressure pads 1 and 2 to obtain a difference between these, and a withdrawing end correcting means 25 that corrects grinding withdrawing ends of the grinding wheels 5 and 6 according to a difference between the relative position X and the grinding reference position X0 after grinding the workpiece W when the relative position X and the grinding reference position X0 are different from each other.

Description

201249597 六、發明說明： 【發明所屬之技術領域】 本發明係關於研磨矽晶圓等之薄板狀工件時所使用 的薄板狀工件之研磨方法及雙頭平面磨床。 【先前技術】 於使用雙頭平面磨床且藉由一對研磨砂輪對矽晶圓 等之薄板狀工件的兩側面進行研磨時，採製 寸控制研磨(專利文獻D，該製程中的尺寸： = :: 由具有一對量測頭之量測手段對研磨中之工件的厚度進 行量測，且以此量測值與研磨基準值一致之方式進行控 制’而精加工成既定之尺寸精度。 例如，若為研磨成與標準工件相同厚度之情況，首 先於標準工件之研磨時，藉由量測手段對標準工件之厚 度進行量測，並將此標準工件之厚度決定為此研磨環境 下之研磨基準值而進行歸零。然後，於實際之工件研磨 時，於研磨中藉由相同量測手段量測工件之厚度，並根 據此量測值與被歸零之研磨基準值達到一致時的零信號 移行至無火花研磨（Spark-〇ut)，於持續了 一定時間之無 火花研磨後，使研磨砂輪後退而結束研磨。 [先前技術文獻].[Technical Field] The present invention relates to a method of polishing a thin plate-shaped workpiece used for polishing a thin plate-like workpiece such as a tantalum wafer, and a double-head surface grinder. [Prior Art] In the case of using a double-head surface grinder and grinding both sides of a thin plate-like workpiece such as a wafer by a pair of grinding wheels, the inch-controlled grinding is performed (Patent Document D, the size in the process: =: : The thickness of the workpiece in the grinding is measured by a measuring method having a pair of measuring heads, and the measured value is controlled in a manner consistent with the grinding reference value to be finished to a predetermined dimensional accuracy. For example, If it is ground to the same thickness as the standard workpiece, the thickness of the standard workpiece is first measured by the measuring method during the grinding of the standard workpiece, and the thickness of the standard workpiece is determined as the grinding standard for the grinding environment. The value is zeroed. Then, when the actual workpiece is ground, the thickness of the workpiece is measured by the same measuring method in the grinding, and the zero signal is obtained according to the measured value and the grounding reference value that is zeroed. Transfer to Spark-〇ut, after the spark-free grinding for a certain period of time, the grinding wheel is retracted and the grinding is finished. [Prior Art].

[專利文獻] [專利文獻1]日本國特開2〇〇3-7171 3號公報 【發明内容】 [發明欲解決之課題] 若採用此種製程中的尺寸控制研磨，可在與標準工 201249597 件’所以’可將工件精加工 但是，从 ’右於兩研磨砂輪之切 會於工件兩側面之精加工狀 法長時間穩定地維持既定之 中’於藉由一對研磨砂輪自 壓保持之工件進行研磨時， 、中研磨及精研磨而將工件 情況下’於現今對研磨精度 時代，在工件之研磨中能將 始終保持為相同，變得極為 件相同之研磨環境下研磨工 成與標準工件相同的厚度。 削力表現上存在有差異，則 態上產生大的差異，而有無 研磨精度的缺點。 亦即’於雙頭平面磨床 兩側對藉由一對靜壓墊以靜 如第14圖所示，經過粗研磨 研磨成既定之研磨精度。此 之高精度化要求越來越高的 一對研磨砂輪的切削力表現 重要。 於一對研磨砂輪之切削力表現相等時，如第丨4圖中 之貫線所示，藉各研磨砂輪所研削之工件的研削量為相 同°然而’對實際之研磨砂輪而言，會於每個砂輪磨耗 量上存在有誤差’所以，若長時間地使用研磨砂輪，會 因研磨砂輪之砂輪磨耗量的差異而於研磨砂輪之切削力 表現上產生較大的差異。 於砂輪磨耗量大之研磨砂輪中，因砂粒之自生作用 持續使切削力表現好，所以，如第14圖中之一點鍵線所 示’研削量較多。相對於此，於砂輪磨耗量小之研磨砂 輪中，因砂粒間之氣孔堵塞等，其切削力表現差，所以 ’如第1 4圖中之二點鏈線所示，研削量變得較少。其結 果’即使工件之精加工尺寸相同，因研磨砂輪之切削力 表現不同’仍會於工件之兩側面的精加工狀態上產坐大 201249597 的差異。 成 之 面 狀 表 面 虞 進 9 力 因 準 墊 以 此 之 不 等 墊 表 以切削力表現好的研磨砂輪所研削的工件之表面 為粗面狀，以切削力表現差的研磨砂輪所研削的工件 表面成為接近於研磨之鏡面狀態等，而於工件之兩側 的精加工狀態上產生大的差異。另外，若將此種研磨 態之工件就地放置的話，因工件之粗面側與鏡面側的 面積之差異’恐有在表面積大之粗面側成為外側、表 積小之鏡面側成為内侧的狀態下於工件上產生翹曲之 〇 另外’於藉由切削力表現不同之研磨砂輪對工件 行研磨之情況下，即使工件本身為既定之精加工厚度 但因為於此工件之兩侧面作用有依此研削量之差的應 ’工件之兩側面受到依此研削量之差所造成之損害， 此右此應力或損害大的話，仍會有研磨精度超出基 值而成為不良品等的問題。 又，一對靜壓墊間之工件，通常係藉由從各靜壓 之保持面側所供給的保持水而被左右均等地保持，所 ，工件之理想的研磨位置係靜壓墊間的中央，期望將 作為研磨基準位置而予研磨。然而，於觀察實際 :=圓等工件之素材形狀時，會於側面產生翹曲等而 疋為凡全之平面，且厚度亦不一致，所以，平坦度 之研磨精度收在基準值内時的工件之位置未落在靜壓 間的中央’這點亦會影響到左右的研磨砂輪之切削力 現。 如此，不管因各研 磨砂輪之砂輪磨耗量的差異所引 201249597 起之切削力表現的好壞而對工件之研磨精度產生大的影 響如何，實際上，研磨砂輪之砂輪磨耗的要因很多，要 依此多種之輪磨耗的要因，以兩研磨砂輪之切削力表 現始终成為相同的方式調整兩研磨砂輪之研磨條件，非 常困難。因此，於習知之碎晶圓等的研磨中，因各研磨 ◊輪之砂輪磨耗量的差異所引起之切削力表現的誤差而 產生大量的不良品，其結果，會有招致製品成本增加、 良率惡化的問題。 本發明係鑒於此種習知問題而完成者，目的在於提 供一種可極力解消因各研磨砂輪之砂輪磨耗量的差異所 引起之切削力表現的差異，且可長時間穩定地維持既定 之研磨精度的薄板狀工件之研磨方法及雙頭平面磨床。 [解決課題之手段j 本發明之薄板狀工件之研磨方法，係於藉由一對研 磨砂輪對保持於—對靜壓塾間之薄板狀玉件的兩側面進 仃研磨時’計算研磨中之工件的相對位置，並對此相對 位置與應正確保持工件之研磨基準位置進行比較，於兩 者存在差分時，於該工件之研磨後根據兩者之差分修正 研磨砂輪之研磨德ώτ , a π熠俊退端，以於下一次研磨時使兩研磨 輪之研磨前進端一致。 亦可將研磨中之工件的研磨精度是收在基準精度内 時的工件之位置作為相對位置。亦可於事先之研磨中將 工件之研磨精度是收在基準精度内時的工彳之位置作為 研磨基準位置，A固定地設定此研磨基準位置。亦可於 事先之研磨中將自尺寸控制裝置接收到顯示工件之尺寸 201249597 控制的零信號時之工件之位 正式研磨中將自尺寸控制裝 位置作為相對位置。 亦可對相對位置與研磨 對位置相對於研磨基準位置 據此偏移量及偏移方向修正 可於事先之研磨中計算工件 内時的工件之兩靜壓墊間的 小於藉由研磨精度所決定之 〇 本發明之雙頭平面磨床 持於一對靜壓墊間之薄板狀 雙頭平面磨床具有：一對量 兩側面之位置進行量測；運 精度是收在基準精度内時的 之相對位置；位置比較手段 件正確地保持於靜壓墊間之 出差分；及後退端修正手段 該工件之研磨後，根據兩者 後退端。 [發明之效果] 根據本發明，計算研磨 此相對位置與應正確保持工 於兩者存在差分時，於該 差分修正研磨砂輪之研磨後 置作為研磨基準位置，且於 置接收到零信號時之工件0 基準位置進行比較，計算相 之偏移量及偏移方向，並根 研磨砂輪之研磨後退端，亦 之研磨精度是收在基準精度 絕對位置，且於此絕對位置 臨界值時設定研磨基準位置 ，係藉由一對研磨砂輪對保 工件的兩側面進行研磨，該 測頭，其對研磨中之工件的 算手段’其根據工件之研磨 量測頭之量測值，計算工件 ’其對此相對位置與應將工 研磨基準位置進行比較而求 ’其於兩者存在差分時，於 之差分修正研磨砂輪之研磨 中之工件的相對位置，並對 件之研磨基準位置進行比較 工件之研磨後，根據兩者之 退端，以於下一次研磨時使 201249597 兩研磨砂輪之研磨前進端一致，所以，可極力解消研磨 工件之兩側面的一對研磨砂輪之砂輪磨耗量的差異，可 長時間穩定地維持既定之研磨精度。藉此’具有可提高 工件之研磨精度，並實現削減製品成本、提高良率的優 點。 【實施方式】 [實施發明之形態] 以下’參照圖面，針對本發明之各實施形態詳細地 進行說明。第丨至第u圖例示採用本發明之认式雙頭平面 磨床。如第卜第2圖所示’此臥式雙頭平面磨床具有： 左右一對之靜壓塾卜2，其左右對向地配置且用以保持 溥板狀工件W ;左右一制夕κα # , ▲ 對之研磨砂輪5、6，其對應於各 靜壓墊卜2之凹部3、4而可繞左右方向之軸心旋轉自如 地配置，且用以研磨藉由靜壓墊i、2所保持之工件w的 左右兩側面；工件牽轉JL丨龙政囬_、 罕得八U略圖不），其使藉由靜壓墊1 、2所保持U件w繞m及左右—狀量測頭9 、10,其對應於靜錢卜2之缺口部7、8而配置於 W的左右兩側。 祙w Γ、垄墊1 2係以此於保持工件W之前進位置與自工 t避的退避位置之間沿左右方向自由移動，且於前 助供給於與工對向的保持面側之保持水等 的保持流體而靜壓保持工件w的方式所構成。 12支#:^輪5 6係呈杯形等’且設於藉由軸承箱11、 =『旋轉自如之妙輪轴13、14的前端，利用砂輪 動馬達15、16旋轉驅動。軸承箱U、12M過滑㈣ 201249597 導機構（省略圖示）而可沿左右方向移動自如地支撲，且 藉由切入轴驅動馬達（省略圖示）之驅動，透過切入轴（省 略圖示）、滑動引導機構等而可沿左右方向移動，使研磨 砂輪5、6於研磨前進端與研磨後退端之間沿左右方向移 動0 量測頭9、1 〇係量測工件w之兩側面的位置者，其建 構成：透過樞支部9a、i〇a而藉由固定側之支撐構件17支 撐成可擺動自如’且輸出在前端之探頭9b、1〇1?接觸於工 件W之側面時的根據量測頭9、丨〇之繞枢支部9 a、1 〇 &之 角度變位而得的電信號。又，量測頭9、丨〇亦可透過接觸 於靜壓墊1、2之工件W來量測靜壓墊1、2之位置。 各量測頭9、1 〇係構成製程中的尺寸控制研磨 寸控制裝置1 8的一部分者，其輸出端侧連接於放大器i 9 尺寸控制裝置1 8連接於研磨控制裝置2〇。尺寸控制裝 置“係建構成：於研磨中工件〜之研磨精度是收在基準 精度内時（例如，工件W成為既定厚度時）輸出零信號，並 藉由研磨控制裝置20之研磨動作控制手段21的控制而移 行至無火花研磨及其他既定之動作。 如第3圖所示，研磨控制裝置2〇係除了具有控制自工 2插入迄至取出為止的一系列研磨動作之以往周知的 I A :作控制手段21以外’還具備：位置運算手段22， :二= = Γ10之量測值M1、M2,對工件…之 件W之:即時運算；研磨基準位置設定手段23,其於工 之4研磨等的事先研磨中 在基準精度内時的工件w之相：=研磨精度是收 相對位置X決定成屬正式研 -10- .201249597 磨時之研磨目標料磨基準位置叫 =段位置比較手段24,其對在各工㈣之正二： 已^位置運算手段22所運算之工件w之相對位置X與 已圮憶之研磨基準位置X0進行比較，求取兩者之 兩者之位置偏移）；後退端修正手段25，其於工件％之刀( 對位置X與研磨基準位請存在差分之情況下，於 之：磨結束後，根據此差分修正研磨砂輪5、6之 :端’以於下—次研磨時兩研磨砂輪5、6之研磨前進端 仔以-致（前進至研磨砂輪5、6之研磨前進端時的各 頭9、1〇之量測值⑷、…與決定了研磨基準位置則時的 工件w之兩側面之基準值M i r、M 2卜致）；切削力表現比 較手段26 ’其對來自量測頭9、1〇之工件w的兩側面之 測值M1、M2與決定了研磨基準位請時的卫件％之兩側 面之基準值Mlr、M2r進行相減，計算工件w之兩側面的 位置R1、R2 ’藉由對此兩側面之位置R i、R2進行即時比 較而算出差分’計算兩研磨砂輪5、6之砂輪磨耗量的差 異，並根據此砂輪磨耗量之差異，求取兩研磨砂輪5、6 之切削力表現差異；研磨條件修正手段27，其於兩研磨 砂輪5、6存在有切削力表現差異的情況下，根據兩研磨 砂輪5、6之切削力表現差異對有關研磨砂輪5、6之切削 力表現的研磨條件進行修正，則吏兩研磨砂輪5、6之切 削力表現成為相同；及顯示手段28，其顯示工件w之相 對位置X相對於研磨基準位置χ〇的變化、工件w之兩側面 的位置IU、R2等；且研磨控制裝置2〇係由包含尺〇1^、RAM 、CPU等之微電腦等所構成。 -11- 201249597 又，藉由對工件w之兩侧面的位置R1、尺2進行即時 比較，除了可藉由此兩側面的位置R1、R2之差，計算兩 研磨砂輪5、6之砂輪磨耗量以外，還可計算兩研磨砂輪$ 、6對工件W之合計研削量。 如第4圖所示，顯示手段28具有：相對位置顯示部“ ，其以條形圖顯示工件W之相對位置χ ;及工件位置顯干 部30、31，其以條形圖顯示工件w之左右兩側面的位置 Rl、R2 ^相對位置顯示部29係左右方向長的橫長形狀， 此相對位置顯示部29上以被歸零之研磨基準位置χ〇為中 心的左右方向上標有既定之刻度，並藉由指針等之指示 部29a顯示工件W的相對位置χ對於此研磨基準位置 變化。 工件位置顯示部30、31係上下方向長的縱長形狀’ 且對應於工件W之左右兩側面而左右排列地配置。於各 工件位置顯示部30、3 1上，在上下方向標有既定之刻度 ，且藉由自下而上（或自上而下）延伸之指示部3〇a、3b ，示工件冒之兩侧面的位置R1、R2。又，相對位置顯示珏 4 29、工件位置顯示部3〇、3丨之方向為任意方向另外 ，相對位置顯示部29、工件位置顯示部30、3〗亦能以數 值顯不相對位置x、工件W之兩側面的位置Ri、R2。另 外，顯示手段28具有根據需要而顯示後述之各資訊 示部（省略圖示）。 '貝 於藉由雙頭平面磨床進行之矽晶圓等的工件w 磨中，成st m 〈研 又到因研磨砂輪5、6之砂輪磨耗所造成的微少 砂粒的脫落、工件W之微小的形狀差異、工件w與—對^ -12- 201249597 壓墊1、2之間的水膜之微妙變化等的影響、尤其研磨砂 輪5、6之砂輪磨耗量的誤差之影響，兩研磨砂輪$ ' 6之 切削力表現、工件W之相對位置x、工件w之兩側面的位 置IU、R2時時刻刻發生著變化。 但是’於顯示手段28設置相對位置顯示部29及工件 位置顯示部30 ' 3 1，以此相對位置顯示部29顯示工件w 之相對位置X，且以工件位置顯示部3〇、3丨顯示工件w之 兩側面的位置r丨、R2，藉此，可將兩研磨砂輪5、6之切 削力表現、工件W之相對位置X、工件’之兩側面的位置 Rl、R2的變化可視化。 位置運算手段22具有：夾入判斷部34，其根據砂輪 驅動馬達1 5、1 6之負載電流的上升、轉速之降低等，判 斷研磨砂輪5、6夹入工件W ;及位置運算部3 5，其於確 認夾入工件W後，取入來自各量測頭9、1〇之量測值mi 、M2而運算靜壓墊丨、2之間的工件贾之相對位置乂等。 夾入判斷部34亦可利用已知工件w之厚度τ的情況 ’依研磨條件適宜地設定工件W之位置監視的時序，於 研磨周期開始後，依此時序之到來，判斷研磨砂輪5、6 夾入工件W。位置運算部35係建構成：根據來自量測頭9 、10之量測值Ml、M2 ’對絕對位置Xabs(即工件％之相 對於靜壓墊1、2間之中心位置的絕對位置）、應將工件w 正確地保持於靜壓墊1、2間之研磨基準位置χ〇、保持於 靜壓墊1、2間之工件W的相對位置X隨時進行運算並予^己 憶。 研磨基準位置設定手段23具有：歸零部36，其對研 -13- 201249597 磨基準位置xo進行歸零；及基準位置判斷部37,其根據 ^對位置Xabs之絕對值丨Xabs|，判斷此研磨基準位置別 是否正；ε|。 知零部36係建構成：於試研磨等的事先研磨中工件 的研磨精度疋收在基準精度内時’於接收到例如尺寸 控制裝置18所輸出之零信號時，自位置運算部35讀出基 於此時間點之各量測頭9、10之量測值Μ1、Μ2κ運算之 相對位置X，並將此相對位置χ作為屬研磨目標之研磨基 準位置Χ〇而予歸零。藉此，相對位置顯示部29係將研磨 基準位置Χ0作為零，在相對於此研磨基準位置χ〇之工件 W的研磨利用指示部29a之左右方向的位置顯示相對 位置X之變化。 基準位置判斷部37係建構成：讀出藉由位置運算部 35所運算之研磨基準位置x〇歸零時之工件w的靜壓墊见 、2間之絕對位置Xabs，判斷此絕對位置之絕對值 |Xabs|是否小於依研磨精度而預先設定的臨界值，例如， 右絕對值|Xabs|小於臨界值，則於顯示手段28顯示位於研 磨基準位置設定範圍内之情況，完成研磨基準位置別之 歸零’另外，若絕對值丨xabs|為臨界值以上’則於顯示手 段28適宜地顯示位於研磨基準位置設定範圍外之情況， 促使作業者進行精度之確認及精度調整。 位置比較手段24係建構成：於正式研磨之每次研磨 中工件W的研磨精度是收在基準精度内時，於接收到例 如尺寸控制裝置18所輸出之零信號時，讀出基於此時間 點之各量測頭9、1 0之量測值Μ1、M2而由位置運算部3 5 -14 - .201249597 所運算之相對位置x，並對此相對位置χ與研磨基準位置 χο進行比較，判斷相對位置χ相對於研磨基準位置有[Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei 2-7-7171 No. 3 [Invention] [Problems to be Solved by the Invention] If the size is controlled by such a process, it can be used with Standards 201249597. The piece 'so' can finish the workpiece, but the 'finishing method from the right to the two grinding wheels on both sides of the workpiece can be stably maintained for a long time'. It is maintained by a pair of grinding wheels. When the workpiece is ground, the middle grinding and the fine grinding are used in the case of the workpiece. In the current era of grinding precision, the grinding process can be kept the same in the grinding of the workpiece, and the grinding process becomes the same in the grinding environment. The same thickness of the workpiece. There is a difference in the performance of the force, and there is a big difference in the state, and there is a disadvantage of the grinding accuracy. That is, the both sides of the double-headed surface grinder are ground to a predetermined grinding precision by rough grinding as shown in Fig. 14 by a pair of static pressure pads. The high precision requires an increasingly high cutting force for a pair of grinding wheels. When the cutting forces of a pair of grinding wheels are equal, as shown by the line in Figure 4, the grinding amount of the workpiece ground by each grinding wheel is the same. However, for the actual grinding wheel, There is an error in the wear amount of each grinding wheel. Therefore, if the grinding wheel is used for a long time, there will be a large difference in the cutting force performance of the grinding wheel due to the difference in the grinding wheel grinding amount. In the grinding wheel with a large amount of grinding wheel wear, since the self-generating action of the sand continues to make the cutting force perform well, the amount of grinding is more as shown by the one-point key line in Fig. 14. On the other hand, in the grinding wheel in which the grinding wheel wear amount is small, the cutting force is poor due to clogging of the pores between the sand grains, and the grinding amount is small as shown by the two-point chain line in Fig. 14. As a result, even if the finishing dimensions of the workpiece are the same, the cutting force of the grinding wheel behaves differently, and the difference in the finishing state of the two sides of the workpiece is greater than 201249597. The surface of the surface is broken into 9 forces. The surface of the workpiece ground by the grinding wheel with a good cutting force is a rough surface, and the workpiece is ground by a grinding wheel with poor cutting force. The surface becomes close to the mirror state of the polishing, and the like, and a large difference occurs in the finishing state on both sides of the workpiece. In addition, when the workpiece in the polished state is placed on the ground, the difference between the area of the rough side and the mirror side of the workpiece may be such that the rough side of the surface area becomes the outer side and the mirror side of the small area becomes the inner side. In the state of warpage on the workpiece, in addition, in the case of grinding the workpiece by the grinding wheel with different cutting force, even if the workpiece itself is a predetermined finishing thickness, because the two sides of the workpiece act The difference between the amount of grinding should be caused by the difference between the two sides of the workpiece due to the difference in the amount of grinding. If the stress or damage is large, the polishing accuracy may exceed the base value and become a defective product. Further, the workpiece between the pair of static pressure pads is normally held to the right and left by the holding water supplied from the holding surface side of each static pressure, and the ideal polishing position of the workpiece is the center between the static pressure pads. It is expected to be ground as a polishing reference position. However, when observing the actual material shape of a workpiece such as a circle, it will cause warpage on the side and become a flat surface, and the thickness is also inconsistent. Therefore, the workpiece with the flatness of the grinding accuracy is within the reference value. The position does not fall in the center of the static pressure. This also affects the cutting force of the left and right grinding wheels. In this way, regardless of the difference in the wear of the grinding wheel of each grinding wheel, the performance of the cutting force from 201249597 has a great influence on the grinding precision of the workpiece. In fact, the grinding wheel grinding wheel has many factors to be worn. The reason for the various wheel wear is that it is very difficult to adjust the grinding conditions of the two grinding wheels in the same way that the cutting force of the two grinding wheels is always the same. Therefore, in the polishing of a conventional chip or the like, a large number of defective products are generated due to an error in the cutting force performance caused by the difference in the grinding wheel wear amount of each of the grinding wheels, and as a result, the product cost is increased, and the product is good. The problem of deterioration in rate. The present invention has been made in view of such conventional problems, and an object thereof is to provide a difference in cutting force performance caused by a difference in wear amount of a grinding wheel of each grinding wheel, and to stably maintain a predetermined grinding precision for a long period of time. Method for grinding a thin plate-shaped workpiece and a double-head surface grinder. [Means for Solving the Problem] The method for polishing a thin plate-shaped workpiece according to the present invention is to perform a grinding process when a pair of grinding wheels are used to hold the two sides of the thin plate-shaped jade member between the static pressure turns. The relative position of the workpiece, and the relative position is compared with the grinding reference position where the workpiece should be properly maintained. When there is a difference between the two, the grinding grinding wheel τ, a π is corrected according to the difference between the two after grinding. Yan Jun retired, so that the grinding advancement end of the two grinding wheels coincided in the next grinding. It is also possible to use the position of the workpiece when the grinding accuracy of the workpiece in the grinding is within the reference accuracy as the relative position. In the prior grinding, the position where the grinding accuracy of the workpiece is within the reference accuracy is used as the polishing reference position, and A is fixedly set to the polishing reference position. It is also possible to receive the size of the workpiece from the size control device in the prior grinding. The position of the workpiece at the time of the zero signal controlled by 201249597 The position of the workpiece from the size control position in the actual grinding is used as the relative position. The relative position and the position of the polishing pair relative to the polishing reference position can be corrected according to the offset amount and the offset direction, and the difference between the two static pressure pads of the workpiece when the workpiece is calculated in the prior grinding is less than the grinding precision. The double-plate surface grinder of the double-head surface grinder of the present invention is held between a pair of static pressure pads, and has a position of two pairs of two sides; the accuracy is the relative position when the accuracy is within the reference accuracy. The position comparison means member correctly maintains the difference between the static pressure pads; and the back end correction means after the workpiece is ground, according to the two retracted ends. [Effects of the Invention] According to the present invention, when the relative position of the grinding is calculated and the difference between the two should be correctly maintained, the grinding of the differentially-corrected grinding wheel is set as the grinding reference position, and when the zero signal is received The workpiece 0 reference position is compared, the phase offset and the offset direction are calculated, and the grinding back end of the grinding wheel is ground, and the grinding precision is the absolute position of the reference precision, and the grinding reference is set at the absolute position critical value. The position is to grind the two sides of the workpiece by a pair of grinding wheels, and the measuring head of the workpiece is calculated by the measuring means of the workpiece in the grinding according to the measured value of the grinding head of the workpiece. The relative position is compared with the position of the grinding reference position, and when there is a difference between the two, the relative position of the workpiece in the grinding of the grinding wheel is corrected, and the grinding reference position of the piece is compared. After that, according to the retreat of the two, the grinding end of the 201249597 two grinding wheels is the same when the next grinding, so Differences in the amount of wear of the grinding wheel one pair of side surfaces of the grinding wheel Canceled abrading a workpiece, the long-term stability can be maintained given the polishing accuracy. This has the advantage of improving the polishing accuracy of the workpiece and reducing the cost of the product and improving the yield. [Embodiment] [Embodiment of the Invention] Hereinafter, each embodiment of the present invention will be described in detail with reference to the drawings. The first to the fourth figures illustrate a double-headed surface grinder using the present invention. As shown in Figure 2, the horizontal double-head surface grinder has: a pair of left and right static pressure clamps 2, which are arranged side by side and are used to hold the seesaw-shaped workpiece W; , ▲ the grinding wheels 5, 6 corresponding to the recesses 3, 4 of each static pressure pad 2, can be rotatably arranged around the axis of the left and right direction, and used for grinding by the static pressure pads i, 2 Keep the left and right sides of the workpiece w; the workpiece is pulled by JL 丨龙政回_, 罕得八U图图不), which keeps the U piece w around the static pressure pad 1 and 2 and the left and right shape measurement The heads 9 and 10 are disposed on the left and right sides of W corresponding to the notches 7 and 8 of the static money. The 祙w Γ and the ridge mat 1 2 are freely movable in the left-right direction between the forward position of the holding workpiece W and the retracted position of the self-working, and are supplied to the holding surface side opposite to the work. It is constituted by a method of holding a fluid such as water and holding the workpiece w by static pressure. The twelve #:^ wheels 5 6 are cup-shaped or the like and are provided by the front ends of the bearing housings 11 and = "rotating freewheel axles 13, 14 and are rotationally driven by the grinding wheel motors 15 and 16. The bearing housings U and 12M are over-slip (4) 201249597 guide mechanism (not shown), and can be freely moved in the left-right direction, and driven by a shaft drive motor (not shown), through the cutting shaft (not shown), The sliding guide mechanism or the like is movable in the left-right direction, and the grinding grinding wheels 5 and 6 are moved in the left-right direction between the grinding advance end and the grinding retreating end. The measuring heads 9 and 1 are measuring the positions of the two sides of the workpiece w. It is configured to support the amount of the probes 9b, 1〇1 which are output at the front end by the support members 17 on the fixed side through the pivotal portions 9a and i〇a and which are in contact with the side of the workpiece W. The electrical signal obtained by the displacement of the probe 9 and the pivotal branch 9 a, 1 〇 & Further, the measuring heads 9, 丨〇 can also measure the positions of the static pressure pads 1, 2 through the workpieces W contacting the static pressure pads 1, 2. Each of the measuring heads 9, 1 constitutes a part of the size control polishing control device 18 in the manufacturing process, and the output end side thereof is connected to the amplifier i9. The size control device 18 is connected to the polishing control device 2A. The size control device is configured to output a zero signal when the polishing accuracy of the workpiece during polishing is within the reference accuracy (for example, when the workpiece W is a predetermined thickness), and the polishing operation control means 21 by the polishing control device 20 The control is transferred to the non-sparking polishing and other predetermined operations. As shown in Fig. 3, the polishing control device 2 is a conventionally known IA that has a series of polishing operations for controlling the insertion and removal of the self-working 2; In addition to the control means 21, the position calculation means 22, the measurement value M1, M2 of the two == Γ10, and the workpiece W of the workpiece: the instantaneous calculation; the polishing reference position setting means 23, which grinds in the work 4 The phase of the workpiece w when the pre-grinding is within the reference accuracy: = the grinding accuracy is determined by the relative position X. The grinding target position is called the segment position comparison means 24 And comparing the relative position X of the workpiece w calculated by the position calculating means 22 with the corrected grinding reference position X0 in each of the work (4), and determining the positional offset of the two; The retracting correction means 25 is a tool for the workpiece % (when there is a difference between the position X and the polishing reference position, after the end of the grinding, the grinding wheel 5, 6 is corrected according to the difference: - the grinding advance end of the two grinding wheels 5, 6 at the time of the primary grinding (the measurement values (4), ... of the respective heads 9 to 1 when advancing to the grinding forward end of the grinding wheels 5, 6 and determining the grinding standard The reference value M ir, M 2 of the two sides of the workpiece w at the time position; the cutting force performance comparison means 26 'the measured values M1, M2 of the two sides of the workpiece w from the measuring head 9, 1 The reference values Mlr and M2r on the two sides of the guard member % when the grinding reference position is determined are subtracted, and the positions R1 and R2' of the two side faces of the workpiece w are calculated by the positions R i and R2 of the two side faces. Instantly calculate the difference 'calculate the difference in the grinding wheel wear amount of the two grinding wheels 5 and 6, and calculate the difference in the cutting force performance of the two grinding wheels 5 and 6 according to the difference in the grinding wheel wear amount; the grinding condition correction means 27, There are differences in the performance of the cutting force between the two grinding wheels 5 and 6. According to the difference in the cutting force between the two grinding wheels 5, 6, the grinding conditions of the cutting force of the grinding wheels 5, 6 are corrected, and the cutting forces of the two grinding wheels 5, 6 are identical; and the display means 28, It shows the change of the relative position X of the workpiece w with respect to the polishing reference position 、, the positions IU, R2 of the two sides of the workpiece w, and the like; and the polishing control device 2 is composed of a microcomputer including a ruler, a RAM, a CPU, and the like. -11- 201249597 Moreover, by instantaneously comparing the positions R1 and 2 of the two sides of the workpiece w, the two grinding wheels 5 and 6 can be calculated by the difference between the positions R1 and R2 of the two sides. In addition to the grinding wheel wear amount, the total grinding amount of the two grinding wheels $ and 6 to the workpiece W can also be calculated. As shown in Fig. 4, the display means 28 has a relative position display portion ", which displays the relative position 工件 of the workpiece W in a bar graph; and a workpiece position display portion 30, 31 which displays the workpiece w in a bar graph The position R1, R2^ of the both side surfaces is a horizontally long shape that is long in the left-right direction, and the relative position display portion 29 is marked with a predetermined scale in the left-right direction centering on the polishing reference position 归 that is zeroed. The relative position of the workpiece W is displayed by the pointing portion 29a of the pointer or the like, and the polishing reference position is changed. The workpiece position display portions 30 and 31 are longitudinally long in the vertical direction and correspond to the left and right sides of the workpiece W. Arranged on the left and right sides, on each of the workpiece position display portions 30, 31, a predetermined scale is marked in the vertical direction, and the indication portions 3a, 3b extending from the bottom up (or from top to bottom) are provided. The positions R1 and R2 of the two sides of the workpiece are shown. Further, the relative position display 珏4 29, the direction of the workpiece position display portions 3〇, 3丨 is an arbitrary direction, and the relative position display unit 29 and the workpiece position display unit 30, 3 〗 can also be numerical The display means 28 has a display unit (not shown) which will be described later as needed. The display means 28 has a display unit (not shown) which will be described later. When a workpiece such as a wafer is ground, it becomes st m. The grinding is caused by the grinding of the grinding wheel 5 and 6, and the slight difference in the shape of the workpiece W, the workpiece w and the pair of -12- 201249597 The influence of the subtle change of the water film between the pressure pads 1, 2, especially the influence of the grinding wheel grinding amount of the grinding wheel 5, 6, the cutting force of the two grinding wheels $'6, the relative position of the workpiece Wx The positions IU and R2 of the two side faces of the workpiece w are changed at all times. However, the relative position display portion 29 and the workpiece position display portion 30' 3 1 are provided on the display means 28, and the relative position display portion 29 displays the workpiece w. With respect to the position X, the positions r 丨 and R 2 of the two side faces of the workpiece w are displayed by the workpiece position display portions 3 〇 and 3 ,, whereby the cutting force of the two grinding wheels 5 and 6 and the relative position of the workpiece W can be obtained. X, the position of the two sides of the workpiece 'Rl The position calculating means 22 has a sandwiching determining unit 34 that determines that the grinding wheels 5 and 6 are sandwiched between the workpieces W based on the increase in the load current of the grinding wheel drive motors 15 and 16 and the decrease in the number of revolutions; The position calculating unit 35, after confirming that the workpiece W is sandwiched, takes in the measured values mi and M2 from the respective measuring heads 9, 1 and calculates the relative positions of the workpieces between the static pressure pads 22. The pinch determination unit 34 can also appropriately set the timing of the position monitoring of the workpiece W according to the polishing condition by using the thickness τ of the known workpiece w. After the start of the polishing cycle, the grinding wheel 5 is judged based on the arrival of the timing. , 6 is clamped into the workpiece W. The position calculating unit 35 is configured to determine the absolute position Xabs from the measured values M1 and M2' from the measuring heads 9 and 10 (i.e., the absolute position of the workpiece relative to the center position between the static pressure pads 1 and 2). The workpiece w is accurately held at the polishing reference position 间 between the static pressure pads 1 and 2, and the relative position X of the workpiece W held between the static pressure pads 1 and 2 is calculated and read at any time. The polishing reference position setting means 23 has a return-to-zero portion 36 that returns zero to the grind reference position xo, and a reference position judging portion 37 that judges this based on the absolute value 丨Xabs| of the position Xabs Whether the grinding reference position is positive or not; ε|. The zero-quantity unit 36 is configured to read from the position calculating unit 35 when the zero-signal output from the size control device 18 is received, for example, when the polishing accuracy of the workpiece during the preliminary polishing such as trial polishing is within the reference accuracy. Based on the measured position Μ1 of the respective measuring heads 9, 10 at this time point, the relative position X of the Μ2κ operation, and the relative position χ is returned to zero as the grinding reference position 属 of the grinding target. As a result, the relative position display unit 29 displays the relative position X in the position in the left-right direction of the polishing use instruction portion 29a of the workpiece W with respect to the polishing reference position 作为. The reference position determining unit 37 is configured to read the static pressure pad of the workpiece w when the polishing reference position x 运算 calculated by the position calculating unit 35 is zero, and the absolute position Xabs of the two, and determine the absolute position of the absolute position. Whether the value |Xabs| is smaller than a predetermined threshold value according to the polishing precision, for example, when the right absolute value |Xabs| is smaller than the critical value, the display means 28 displays the position within the polishing reference position setting range, and the polishing reference position is completed. In addition, when the absolute value 丨xabs| is equal to or greater than the critical value, the display means 28 appropriately displays the outside of the polishing reference position setting range, thereby prompting the operator to perform the accuracy check and the accuracy adjustment. The position comparison means 24 is constructed such that when the polishing accuracy of the workpiece W is within the reference accuracy during each polishing of the main polishing, when the zero signal output from the size control device 18 is received, for example, the reading is based on the time point. The measured positions Μ1 and M2 of the respective measuring heads 9 and 10 are compared with the relative position x calculated by the position calculating unit 3 5 -14 - .201249597, and the relative position χ is compared with the grinding reference position χο to determine Relative position χ relative to the grinding reference position

無差分（位置偏移卜又，位置比較手段24係以計算工件W 之相對位置X對於研磨基準位置χ〇的偏移方向及偏移量 的方式構成。 比較手段24之運算 位置Χ0之間存在有 至進行了一定時間 後退端修正手段2 5係於藉由位置 而於工件W之相對位置Χ與研磨基準 差分之情況下，在從接收零信號起迄 的無火花研磨結束後，根據工件w之相對位置χ的偏移方 向及偏移*，修正切入軸之研磨後退端、即研磨砂輪5 、6之研磨後退端’則吏下一次研磨時研磨砂輪5、6之研 磨前進端與研磨基準位置χ〇上之工件1的兩側面之基準 值 Μ 1 r、M2r—致。 又，自無火花研磨開始迄至結束為止的一定時間係 可根據研磨條件來決定。另外，研磨基準位置χ〇上之工 件W的兩側面之位置(基準龍卜殿〇係意味研磨砂輪5 、6之研磨前進端。切人軸之研磨後退端、即研磨砂輪$ 、6之研磨後退端的修正’係作為研磨砂輪5、6之切削力 表現控制之—的功能，所以，’m對研磨砂輪5、6 之一方為基準對另一方進行修正 向修正。 亦可將雙方朝相反方 紅切削力表現比較手段26建構成具有：工件位置運算 部41 ’其藉由來自各量測頭9、10之量測值Ml、M2與研 磨基準位置X〇上的工㈣之兩側面之基準值MU、M2r的 相減’計算工件~之兩側面的位置R1、R2;及切削力表 -15- 201249597 現判斷部42，JL藉由對工杜w令 _ 、錯由對件兩側面的位置Rl、R2進 :比較而予差分’計算兩研磨砂輪5 ' 6之砂輪磨耗量的 異，並根據此砂輪磨耗量之差異來判斷切削力表現差 異。切削力表現判斷部42係1母 巧可〜你以對兩研磨砂輪5、6之切削 力表現的不同以及修正方向谁 / 乃冋琨仃運算。又，以工件位置 運算部41所運算之1彳j.. π硬异之工件W之兩側面的位置ri、R2，係作 為工件位置顯示部3 0、3 1夕- *ιτ，λ 之才日不部3〇a、31a的變化而被 顯示。 研磨條件修正手段2 7具有：隨時修正部3 9，其以於 研磨中兩研磨砂輪5、6之切削力表現差異變得消失的方 式’於第-時間内隨時對研磨條件進行修正；及事後修 正部40’其於該工件w之研磨結束後，為了準備下一次 之研磨而以兩研磨砂輪5、6切削力表現差異變得消失的 方式，事後對研磨條件進行修正。 隨時修正部39係建構成根據藉由切削力表現比較手 段26而即時運算之兩研磨砂輪5、6的切削力表現差異， 控制對研磨精度無影響之研磨條件、例如自研磨砂輪5 、6之中央側供給於研磨砂輪5、6與靜壓墊丨、2之間的研 磨水（研削流體）的流量，以使兩研磨砂輪5、6之切削力 表現差異消失" 事後修正部40係於自接收以研磨條件所決定之零信 號起經過一定時間後結束之無火花研磨，之後，根據零 信號接收時之兩研磨砂輪5、6之切削力表現差異控制研 磨條件，以使兩研磨砂輪5、6之切削力表現之差異消失 。在此情況時之藉事後修正部4〇之研磨條件的修正，係 -16- 201249597 若於研磨中進行修正則會對研磨精度產生影響之研磨條 件、例如研磨砂輪5、6之轉速及/或研磨砂輪5、6之切入 速度的控制。又，研磨條件之修正係根據各研磨砂輪5 、6之切削力表現的不同、修正方向所進行相對地，由 隨時修正部39所即時進行之修正為不會對研磨精度產生 影響的研磨水之流量控制等。 接著，一面參照第5(a)至第5(〇圖，一面針對靜壓墊 1、2間之間隙D的計算、靜壓墊丨、2間之工件评的位置認 識進行說明。如第5(a)圖所示，於判斷插入於左右之靜 壓墊1、2間之間隙D的工件w是位於此間隙D之哪一位置 的情況，事先藉由量測頭9、1〇對靜壓墊丨' 2之位置進行 量測’並記憶此量測值A 1、B2。 於此情況下，量測頭9、1〇係於其構造上無法直接量 測各靜^、2之位4，所卩，以如下之方法進行量測 。例如，如第5(a)圖所示’將已知之厚度丁的工件w配置 於靜壓墊1、2間，讀取量測頭9、1〇之量測值⑷、M2。 接著，如第5(b)圖所示，讀取使工件w接觸於左靜壓塾1 時之量測頭9、H)之量測值…A2 ’再如第5⑷圖所示， 讀取使工件W接觸於右靜壓墊2時之量測頭9、10之量測 值 Bl、B2。 只要能把握左右之一的量測頭9、丨〇之量測值，即可 算出左右之靜壓墊卜2之位置。例如，於將右量測頭⑺ 之量測值M2作為基準之情況（以下’基準為右），如第5(c) 圖所示，當設使工件W接觸於右靜壓墊2時之量測頭1〇之 量測值為B2，且如第5(b)圖所示，設使工件w接觸於左 -17- 201249597 靜壓墊1時之六I :目,丨 <右里測碩10之量測值為A2時，因工件w之厚 度T已知，戶斤以，左靜壓塾i之位置成為Mi ,左右之靜 壓塾1 之間隙D ’可藉由運算式D = B2-(A2-T)所求得 此里測可於機械設置之後或靜壓墊1、2之交換後 進行，不Μ於每次之it常研磨中進行。 、 於運入及運出工件界時，於靜壓墊丨、2藉真空吸引 手段吸附工件W而予交接之情況下，只要利用此真空吸 引手段將工件W吸附於靜壓塾卜2上…但是，在一 對靜壓墊1、2内 '例如右靜壓墊2具有真空吸引手段，但 左靜壓塾1不具有真空吸引手段之情況下，可使用如第6 及=7圖所不構成之治具43，將已知厚度τ之板料安裝於 靜坚塾1使里測頭9、1〇之探頭9b、1〇b接觸於此板44 而予量測。 此⑺具43具有.板狀本體部45，其自徑向外側可裝 却自如地嵌合於靜壓塾以缺口部7;直立部46，其自本 體部45之内端側朝左靜壓墊丨之背面側站起；及支撐部 ，其自本體部45之外端側朝缺口部7的兩側突出。 於本體部45上透過一對安裝螺栓等之固定具48可裝 卸自如地固定有抵接於左靜壓墊丨之保持面^的板4‘於 直立邛46上設有抵接部49，此抵接部49係藉由彈簧等使 力2彈性地抵接於左靜壓墊丨之背面側。各支撐部47係透 過女裝螺栓等之固疋具5〇可裝卸自如地固定於本體部45 上。於此支撐部47之兩端設有藉由彈簧等使力而彈性地 抵接於右靜壓墊2之抵接部51。於本體部45上以探頭％ 、10b可接觸板44之方式設有開口 52。 -18- 201249597 於借助此治具43將板44安裝於左靜壓墊1之情況下 ’以板44之外周緣抵接或接近於左靜壓墊1之保持面五a 的方式，將本體部45插入左靜壓墊1之缺口部7。然後， 使直立部46之抵接部49抵接於靜壓墊1之背面，藉由其按 麼力將治具43、板44安裝於左靜壓墊1上。然後，當使兩 靜壓塾1、2接近時’支撐部47之抵接部51按壓於右靜壓 墊2’並且兩靜壓墊1、2夾住板44，所以，如第6及第7 圖所示，可沿左靜壓墊1之保持面丨a固定板44之外周緣。 如此，於左靜壓墊1上安裝了板44之後，如第6圖中 之二點鏈線所示’只要使探頭9b、l〇b接觸於板44之兩側 ’讀取量測頭9、10之量測值Ml、M2，即可針對無真空 吸引手段之左靜壓墊1 ’而容易地量測其位置。 靜壓墊1、2間之工件W的位置認識，係以如下方式 進行。在靜壓墊1、2間插入未研磨之工件w的情況下， 如第8(a)圖所示，此工件评被保持於靜壓墊丨、2間。此時 之工件W與右靜壓墊2之間的右側間隙D2，係可根據第 8(a)圖時之工件W的右側面之量測值M2、及如第圖所 示工件貨抵接於右靜壓墊2時之量測頭1〇的量測值B2，以 運算式D2 = B2-M2求得。 工件W與左靜壓墊1之間的左側間隙D1，亦同樣可根 據第8(a)圖時之工件w的左側面之量測值厘卜及如第8(c) 圖所示工件w抵接於左靜壓墊i時之量測頭9的量測值ai ，以運算式D1=A1-M1求得。 因此，可知悉自工件W至各靜壓墊丨、2之距離D1、 D2，所以，可監視各靜壓墊丨、2間之工件评的位置、例 -19- 201249597 如絕對位置Xabs、相對位置χ，若m=D2,則工件w位於 靜壓墊1、2間之中央。 接著，參照第9圖之流程圖，針對決定作為研磨目標 之研磨基準位置X0’且將此研磨基準位置χ〇歸零之方法 進行說明》首先，於試研磨中插入工件w(步驟s 1 )，開始 研磨周期（步驟S2)。藉由研磨周期之開始，於各靜壓墊^ 、2前進至既定位置且以靜壓保持工件w之後，各研磨砂 輪5、6前進而對工件w之兩側面進行研磨。然而，於兩 研磨砂輪5、6夾入工件W之前，工件w之位置並不穩定， 所以，於位置運算手段22之夾入判斷部34確認了研磨砂 輪5、6夾入工件W之後（步驟S3)，位置運算部35取入各量 /貝J頭9 1 〇之量測值Μ1、Μ 2，開始監視工件w之位置（步 驟 S4)。 虽開始監視工件W之位置時，首先，位置運算部3 5 運算工件貿對靜壓墊1、2間之中心位置的絕對位置Xabs( 步驟S5)，並將此絕對位置以心顯示於顯示手段28(步驟 S6)。又，工件w之絕對位置Xabs可藉由（D2 D"/2運算。 另外，位置運算部35還運算工件w之相對位置Χ(步驟S7) 若有之刖被歸零之基準值Μ 1 r、M2r(步驟S8)，則運算 相對於此基準值Μ1 r、M2r之相對位置X並予顯示（步驟 S9)。此相對位置χ可藉由運算式{(M1Mlr)_(M2_M2r)}/2 進行運算。於無被歸零之位置的情況下，則直接表示各 ϊ測頭9、1 〇之量測值μ 1、M2(步驟S8、S 1 0)。 若試研磨之工件W成為既定厚度，則因有來自尺寸 控制裝置1 8的零信號（步驟S 1丨），所以，根據此零信號開 -20- 201249597 始無火花研磨(步驟S12)。然後，若開始無火花研磨，則 :入軸停止’纟量測頭9、10自工件w之兩側面退避。另 方面，在開始無火花研磨的同時，讀入以位置運算部 35運算之零信號的接收時間點的工件w之相對位置x(步 驟⑴），歸零部36將此相對位置料為屬研磨目標之研磨 基準位置X0而予歸零（步驟S14)，另夕卜，顯示手段28將研 磨基準位置X0作為零而予顯示。 另外，在開始無火花研磨的同時，基準位置判斷部 37讀入以位置運算部35所運算 < 零信號的接收時(將研 磨基準位置X0歸零時）的靜壓墊卜2間之工 置加之絕對值叫對此絕對值丨Xabs丨與基 之研磨精度而預先設定的臨界值進行比較，判斷將研磨 基準位置X0作為歸零位置是否有誤（步驟S15)。然後若 工件W之絕對位置Xabs小#臨界#，貝"乍為研磨基準位 置設定範圍内而顯示於顯示手段28,完成歸零(步驟s㈧ 。另外，若絕對值丨Xabsl為臨界值以上，則作為研磨基準 位置設定範圍外而顯示於顯示手段28(步驟s 17)，促使作 業者進行精度之確認及精度調整。 …此研磨基準位置XG之歸零可與無火花研磨開始同時 進仃。無火化研磨係根據研磨條件而預先設定為一定時 間，當經過此一定時間而完成無火花研磨時（步驟S18、 S19)，切入軸朝研磨後退端移動（步驟S2〇)，結束研磨周 期（步驟S2D’所以，取出試研磨後之工件以（步驟如) ’並以人工對此研磨後之工件貿進行量測（步驟Μ”，以 進行研磨精度之判斷（步驟S 2 4)。 -21- 201249597 又’經研磨精度之判斷結果，於無法獲得既定之研 磨精度的情況、且被歸零之研磨基準位置X0處在研磨基 準位置範圍外的情況下，於以能獲得既定之研磨精度的 方式進行精度調整之後，再次從工件w之插入作業開始 重新進行，以決定正確之研磨基準位置χ〇並予歸零。 接著，一面參照第1 〇圖之流程圖，一面針對正式研 磨中之工件W的位置監視及研磨砂輪5、6的切削力表現 控制進行說明。首先，插入工件W(步驟S30)，開始研磨 周期（步驟S3 1)❶然後，當研磨周期開始時，於爽入判斷 部34確認了研磨砂輪5、6夾入工件W之後（步驟S32)，位 置運算部3 5 —面即時取入各量測頭9、10之量測值μ 1、 M2，一面監視工件w之位置（步驟S33)。 當取入量測頭9、1 0之量測值Μ1、M2時，位置運算 部35根據量測值]VH、M2運算現在之工件W的相對位置χ( 步驟S34) ’並藉由指針等之指示部29a即時顯示相對於被 歸零之研磨基準位置X0的現在位置（步驟S35)。 同時’切削力表現比較手段26對兩研磨砂輪5、6之 切削力表現的差異進行判斷。亦即，自記憶資料中讀入 決定了研磨基準位置X0時之工件W的兩側面之基準值 Mir、M2r(步驟S36)，工件位置運算部41藉由對此基準值 Mir、M2r及此時間點之量測值Ml、M2進行相減，而運 算相對於基準值Mir、M2r之工件W的兩側面之位置rj、 R2(步驟S37) ’然後切削力表現判斷部42對此兩側面之位 置反1、尺2進行比較’5十算兩研磨砂輪5、6之砂輪磨耗量 的差異’並根據此砂輪磨耗量之差異，判斷兩研磨砂輪5 -22- 201249597 、6有無切削力表現差異（步驟Mg)。 例如’於左研磨砂輪5之砂輪磨耗量比右研磨砂輪6 的砂輪磨耗量少’且左研磨砂輪5之切削力表現也比右研 磨砂輪6的切削力表現差的情況下，如第丨丨圖所示，研磨 中之工件W2成為被切削力表現差之研磨砂輪$朝右方向 按壓而朝切削力表現好之研磨砂輪6侧移動的狀態。 為此’若研磨中之工件貨2相對於研磨基準位置χ〇 決定時的工件W1成為如第丨丨圖所示之位置關係時，可根 據此工件W1之基準值Μ1 r、M2r、及現在時間點之工件 W2的量測值Ml、M2，藉由運算式R1=Ml-Mlr及運算式 R2 = M2-M2r分別運算工件W2之左位置R1及右位置R2。 然後’藉由求取工件W之兩側面的位置r 1、R2的左 右差ΔΚ·(=ίΠ-Κ·2) ’ 了解兩研磨砂輪5、6之切削力表現的 差異之大小，同時了解切削力表現差之一方究竟為兩研 磨砂輪5、6的哪一方。第11圖所示之情況為ar < 〇，表 示左研磨砂輪5為切削力表現不良^ ar = 〇，表示兩研磨 砂輪5、6之切削力表現相同。另外，ar > 〇，為與第i i 圖相反之情況’表示右研磨砂輪6為切削力表現不良。 若切削力表現之判斷結果為AR < 〇或AR > 〇(步驟 S38)，則由隨時修正部39即時修正不會影響研磨精度之 研磨水的流量，以使研磨中兩研磨砂輪5、6之切削力表 現之差異消失（步驟S39)。於此情況下，以預先作成研磨 水之流量根據左右差AR、修正方向（±)而發生變化的控制 圖，並根據此控制圖使研磨水之流量對應於左右差AR之 大小、正負而發生變化較為適宜。又，此研磨水之流量 -23- 201249597 的調整，可一直持續到兩研磨砂輪5、6之切削力表現達 到一致為止，亦可只根據控制圖進行控制。 顯示手段28之工件位置顯示部3〇、3丨，係於工件w 之研磨中，以在研磨基準位置X0之工件w的兩側面作為 基準，顯示此時之兩側面的位置Rl、R2。若左右之研磨 砂輪5、6之切削力表現大致相同’則顯示手段28之工件 位置顯示部30、31的表示’顯示大致相同位準，於兩研 磨砂輪5、6之切削力表現不同的情況下，如第斗圖所示， 顯示依照此切削力表現差異之位準。 例如，於第1 1圖所示之情況，根據兩研磨砂輪5、6 之切削力表現的差異，如第4圖所示’工件位置顯示部3〇 之指示部30a的位準較低’工件位置顯示部31之指示部 3 1&的位準變得較高。因此’由工件位置顯示部3〇、31 之表示可知，作為研磨中之工件霤的兩側面之位置ri、 R2的變化，可容易地把握兩研磨砂輪5、6之切削力表現 的差異。 如第11圖所示，於左研磨砂輪5之切削力表現差的情 況下，根據此切削力表現之程度，減少供給於左研磨砂 輪5與工件…之間的研磨水之流量。藉此，自研磨砂輪5 脫落之砂粒的排出變慢，在研磨砂輪5與工件貿之間的砂 粒之滞留時間變長’所以，此砂粒較顯著地發揮砂輪之 作用而促進砂輪磨耗’因此切削力表現變好。藉此，可 極力減少左右兩研磨砂輪5、6的士刀肖4力表現之差異。 =二亦可將切削力表現好之研磨砂輪5、6侧的研磨 水流量設為一定，且減少切削力表現差之研磨砂輪$、6 -24- 201249597 侧的研磨水流量，相反亦可將切削力表現差之研磨砂輪5 、6侧的研磨水流量設為—定，且減少切削力表現好之研 磨砂輪5、6側的研磨水流量。另外’亦可一面增加切削 力表現好之研磨砂輪5、6側的研磨水流量，一面減少切 削力表現差之研磨砂輪5、6側的研磨水流量等，以增減 雙方之研磨砂輪5 ' 6的研磨水流量。 若工件W達到目標厚度，則接收來自尺寸控制裝置 18之零信號（步驟S40)，於是切入軸停止，各量測頭9、 10退避而開始無火花研磨（步驟S41)。同時，位置比較手 段24對以位置運算手段22所運算之零信號的接收時間點 的工件W之相對位置X進行運算（步驟S42)，並將此相對 位置X與作為研磨目標之研磨基準位置χ〇比較，求得工 件W相對於研磨基準位置χ〇之偏移量及偏移方向（步驟 S43)。並同時根據接收零信號時的量測值M1、Μ2，運算 在此時間點之工件W的兩側面之位置R i、R2的左右差 △ R(步驟S44)，於工件W之研磨結束後，準備切入軸之研 磨後退端之修正。 無火花研磨係根據研磨條件而預先設定為一定時間 ，當經過此一定時間後完成無火花研磨（步驟S45、s46) ，釔束研磨周期而完成工件|之研磨時（步驟S47)，切入 軸朝研磨後退端移動（步驟S 4 8)。 於接收零信號時，若工件W之相對位置χ相對於研磨 基準位置X0存在有發生偏移的位置偏移時，作為研磨砂 輪5、6之切削力表現控制的一環，以後退端修正手段25 對研磨砂輪5、6之研磨後退端、即切入軸之研磨後退端 -25- 201249597 的位置進行修正，以使下一次之研磨時研磨前進端與研 磨基準位置xo 一致。藉此，於下一次之工件w的研磨時 ’於吸收了工件W之相對位置X的位置偏移的狀態下，兩 研磨砂輪5、6切入工件W，可使工件贾的兩側面之位置 Rl、R2返回至研磨基準位置χ〇。 同時’於工件W之兩侧面具有左右差的情況下， 事後修正部40為了準備下一次之研磨而對會影響研磨砂 輪5、6之切削力表現的研磨條件進行修正及更新（步驟 S49)。在此，可改變於研磨中無法改變之研磨條件、例 如研磨砂輪5、6之轉速及/或研磨砂輪5、6的切入速户。 此修正係根據左右差之大小及修正方向所進行。 只要對研磨砂輪5、6之轉速及/或研磨砂輪5、6的切 入速度進行修正’即可調整研磨砂輪5、6之切削力表玉 。例如’當減慢研磨砂輪5、6之轉速、或加快切入速产 時，研磨砂輪5、6對工件w進行研磨時之研磨負葡又 ,, 、取增大 ，砂粒進行脫落而又不斷出現新的砂粒，所 於切削 力表現差之研磨砂輪5、6中’亦可藉由此砂輪磨耗之、 行而達成良好之切削力表現。 進 另外，可根據工件W之相對位置X的位置偏移來修 研磨砂輪5、6之研磨後退端，並根據工件w之兩相 μ 1則面的 位置差ΔΚ·來修正兩研磨砂輪5、6之研磨條件，藉此 只修正兩研磨砂輪5、6之一方的研磨條件之情况比較與 可減少研磨後之工件W的損傷、翹曲等，可谁一 ’ 工件W之研磨精度。 ^ 然後’取出工件w，結束處理（步驟s 5 〇)。 -26- 201249597 根據上述步驟，將兩研磨砂輪5、6之砂輪磨耗量的 誤差所引起之切削力表現的不平衡給予數值化，並基於 此數據而能以兩研磨砂輪5、6之切削力表現成為相同的 方式自動地進行控制。又，於持續研磨多個工件W之情 況下，可反覆地進行相同步驟之操作、控制等。 第1 2圖例示本發明之第2實施形態。本第2實施形態 具有：切削力表現比較手段26，其對研磨中之工件w的 相對位置X與應將工件W正確地保持於靜壓墊1、2之研磨 基準位置X0進行比較’藉由兩者之差分即時運算兩研磨 砂輪5、6之切削力表現差異；及研磨條件修正手段2 7， 其基於兩研磨砂輪5、6之切削力表現差異，對控制供給 於兩研磨砂輪5、6與工件W之間的研磨水之流量等的研 磨砂輪5、6之研磨條件進行修正，以使兩研磨砂輪5、6 之切削力表現大致一致。 "^ 土 ”輪磨耗量 異時，即使兩研磨砂輪5、6之切入量相同，兩研磨 々輪5、6之研磨冑進端亦不^另一方面，於 量較大侧之研磨砂輪5、6中，因自生作用， 提高而研削量較大’所以，卫件讀砂輪磨托表現 之研磨砂輪5、6朝砂輪磨耗量較大側之研磨砂 堡，使得工件W之相對位置χ朝砂輪磨耗量大按 現好之研磨砂輪5、6側偏移。 刀削力表 為此，於工件W之研磨中， …，並於切削力表現比較手：二 研磨基準位置χο進行比較，藉由兩 、位置X與 ^產刀進行隨著兩 -27- 201249597 研磨砂 偏移的 然 具有位 兩研磨 大小、 之間的 切削力 順 移方向 ，例如 1 3圖所 以 但本發 實質範 對臥式 中亦同 5、aThere is no difference (position offset). The position comparing means 24 is configured to calculate the offset direction and the offset amount of the relative position X of the workpiece W with respect to the polishing reference position 。. The calculation position of the comparison means 24 exists between Χ0. When the back end correction means 25 is subjected to the positional difference between the relative position of the workpiece W and the polishing reference by the position, after the completion of the non-spark polishing from the reception of the zero signal, the workpiece w is The offset direction and offset* of the relative position ,, correcting the grinding back end of the cutting axis, that is, the grinding back end of the grinding wheels 5 and 6, and the grinding advance end and the grinding reference of the grinding wheels 5 and 6 at the next grinding The reference values Μ 1 r and M2r of the two sides of the workpiece 1 at the position of the workpiece 1 are constant. The predetermined time from the start of the spark-free polishing to the end can be determined according to the polishing conditions. The position of the two sides of the upper workpiece W (the reference dragon buddha means the grinding forward end of the grinding wheel 5, 6. The grinding back end of the cutting shaft, that is, the grinding back end of the grinding wheel $, 6 The positive function is the function of controlling the cutting force of the grinding wheels 5 and 6. Therefore, 'm corrects the other side against one of the grinding wheels 5 and 6. It is also possible to cut both sides toward the opposite side. The force performance comparison means 26 is constructed to have a workpiece position calculating unit 41' which uses the reference values MU from the measured values M1, M2 of the respective measuring heads 9, 10 and the sides (4) of the grinding reference position X , M2r subtraction 'calculate the position R1, R2 of the two sides of the workpiece ~; and the cutting force table -15- 201249597 now the judgment part 42, JL by the work of the wu, the wrong position of the opposite side of the piece Rl R2: Compare and calculate the difference between the wear amount of the grinding wheel of the two grinding wheels 5'6, and judge the difference in the cutting force performance according to the difference in the grinding wheel wear amount. The cutting force performance judgment unit 42 is a master. You perform the difference in the cutting force of the two grinding wheels 5, 6 and the correction direction. In addition, the workpiece W calculated by the workpiece position calculating unit 41 is 1彳j.. The positions ri and R2 on the side are used as the workpiece position display unit 3 0, 3 1 - *ιτ, λ is displayed on the day of the change of 3〇a, 31a. The polishing condition correction means 2 7 has an error correction unit 3 9 for performing the cutting force performance of the two grinding wheels 5 and 6 during polishing. The method in which the difference becomes disappeared is corrected at any time during the first time; and after the grinding of the workpiece w is completed, the grinding is performed by the two grinding wheels 5 and 6 in order to prepare for the next grinding. The grinding condition is corrected after the difference in the force performance is changed. The correction unit 39 is configured to perform the difference in the cutting force performance of the two grinding wheels 5 and 6 which are calculated instantaneously by the cutting force performance comparison means 26, and the control pair The grinding conditions in which the grinding accuracy is not affected, for example, the flow rate of the grinding water (grinding fluid) supplied between the grinding wheels 5, 6 and the static pressure pad 丨, 2 from the center side of the grinding wheels 5, 6 so that the two grinding wheels 5 , the difference in the cutting force performance of 6 disappears " The after-correction unit 40 is a non-spark grinding that ends after a certain period of time has elapsed since the reception of the zero signal determined by the grinding condition, and then, when received according to the zero signal 5,6 two grinding wheel cutting force of the differences in performance control grinding conditions, so that the two grinding wheel cutting force Ciyi the performance of 5,6 disappear. In this case, the correction of the polishing conditions by the correction unit 4 is a polishing condition that affects the polishing accuracy when the correction is performed during polishing, for example, the rotation speed of the grinding wheels 5 and 6, and/or Control of the cutting speed of the grinding wheels 5, 6. In addition, the correction of the polishing conditions is performed by the correction unit 39 in accordance with the difference in the cutting force expression of each of the grinding wheels 5 and 6, and the correction direction is corrected so that the polishing water does not affect the polishing accuracy. Flow control, etc. Next, referring to the fifth (a) to the fifth (in the figure, the calculation of the gap D between the static pressure pads 1 and 2, the static pressure pad, and the positional evaluation of the two workpieces will be described. (a) As shown in the figure, in the case where the workpiece w inserted in the gap D between the right and left static pressure pads 1 and 2 is located at the position of the gap D, the measuring head 9 and 1 are previously fixed. The position of the pressure pad 丨 ' 2 is measured ' and the measured values A 1 and B 2 are memorized. In this case, the measuring heads 9 and 1 are not directly able to measure the positions of the static and the 2 4. The measurement is performed in the following manner. For example, as shown in Fig. 5(a), a workpiece w having a known thickness is placed between the static pressure pads 1 and 2, and the measuring head 9 is read. The measured value (4), M2 of 1〇. Next, as shown in Fig. 5(b), the measured value of the measuring head 9, H) when the workpiece w is brought into contact with the left static pressure 塾 1 is read... A2 ' Further, as shown in Fig. 5(4), the measured values B1 and B2 of the measuring heads 9, 10 when the workpiece W is brought into contact with the right static pressure pad 2 are read. As long as the measurement value of one of the left and right measuring heads 9 and 丨〇 can be grasped, the position of the left and right static pressure pads 2 can be calculated. For example, when the measured value M2 of the right measuring head (7) is used as a reference (the following is 'the reference is right'), as shown in FIG. 5(c), when the workpiece W is brought into contact with the right static pressure pad 2 The measurement value of the measuring head 1〇 is B2, and as shown in Fig. 5(b), the workpiece w is placed in contact with the left -17-201249597 static pressure pad 1 when it is six I: mesh, 丨 < right When the measured value of the master 10 is A2, since the thickness T of the workpiece w is known, the position of the left static pressure 塾i becomes Mi, and the gap D of the left and right static pressure 塾1 can be calculated by the formula D. = B2-(A2-T) This measurement can be performed after the mechanical setting or after the exchange of the static pressure pads 1, 2, and it is not difficult to perform it every time. In the case of loading and unloading the workpiece boundary, in the case where the static pressure pad 丨 2 absorbs the workpiece W by the vacuum suction means and is handed over, the vacuum suction means is used to adsorb the workpiece W to the static pressure 2 2... However, in the pair of static pressure pads 1 and 2, for example, the right static pressure pad 2 has a vacuum suction means, but if the left static pressure pressure 不 1 does not have a vacuum suction means, the sixth and = 7 figures can be used. The jig 43 is constructed by attaching a sheet having a known thickness τ to the static tamper 1 so that the probes 9b and 1b of the probes 9 and 1 are in contact with the plate 44 for measurement. The (7) member 43 has a plate-like body portion 45 that is slidably fitted to the static pressure 塾 notch portion 7 from the radially outer side, and an upright portion 46 that is statically pressed from the inner end side of the body portion 45 toward the left side. The back side of the pad stands up; and the support portion protrudes from the outer end side of the body portion 45 toward both sides of the notch portion 7. A plate 4 ′ that is detachably fixed to the holding surface of the left static pressure pad 透过 is detachably fixed to the main body portion 45 via a pair of fixing bolts 48 such as a mounting bolt, and the abutment portion 49 is provided on the upright 邛 46. The abutting portion 49 elastically abuts against the back side of the left static pressure pad by a spring or the like. Each of the support portions 47 is detachably fixed to the main body portion 45 via a fixing device 5 such as a women's bolt. At both ends of the support portion 47, abutting portion 51 that elastically abuts against the right static pressure pad 2 by a spring or the like is provided. An opening 52 is provided in the body portion 45 such that the probes %, 10b can contact the plate 44. -18- 201249597 When the plate 44 is attached to the left static pressure pad 1 by means of the jig 43, 'the body is abutted or close to the holding surface 5a of the left static pressure pad 1 by the outer periphery of the plate 44 The portion 45 is inserted into the notch portion 7 of the left static pressure pad 1. Then, the abutting portion 49 of the upright portion 46 abuts against the back surface of the static pressure pad 1, and the jig 43 and the plate 44 are attached to the left static pressure pad 1 by the force thereof. Then, when the two static pressures 塾1 and 2 are approached, the abutting portion 51 of the support portion 47 is pressed against the right static pressure pad 2' and the two static pressure pads 1 and 2 sandwich the plate 44. Therefore, as in the sixth and the sixth As shown in Fig. 7, the outer periphery of the plate 44 can be fixed along the holding surface 丨a of the left static pressure pad 1. Thus, after the board 44 is mounted on the left static pressure pad 1, as shown by the two-dot chain line in Fig. 6, 'as long as the probes 9b, lb are in contact with both sides of the board 44' read the measuring head 9 The measured values M1 and M2 of 10 can easily measure the position of the left static pressure pad 1' without vacuum suction means. The positional recognition of the workpiece W between the static pressure pads 1 and 2 was carried out as follows. When the unpolished workpiece w is inserted between the static pressure pads 1 and 2, as shown in Fig. 8(a), the workpiece evaluation is held between the static pressure pad and the two. The right side gap D2 between the workpiece W and the right static pressure pad 2 at this time is a measurement value M2 of the right side surface of the workpiece W according to the eighth drawing (a), and the workpiece goods are abutted as shown in the figure. The measured value B2 of the measuring head 1 于 when the right static pressure pad 2 is obtained is obtained by the operation formula D2 = B2-M2. The left gap D1 between the workpiece W and the left static pressure pad 1 can also be measured according to the measurement of the left side surface of the workpiece w in the eighth (a) diagram and the workpiece w as shown in the eighth (c) diagram. The measured value ai of the measuring head 9 when it abuts against the left static pressure pad i is obtained by the arithmetic expression D1=A1-M1. Therefore, it is possible to know the distances D1 and D2 from the workpiece W to the static pressure pads 2 and 2, so that it is possible to monitor the position of each static pressure pad and the workpiece evaluation between the two, and example 19-201249597 such as absolute position Xabs, relative Position χ, if m=D2, the workpiece w is located in the center between the static pressure pads 1, 2. Next, a method of determining the polishing reference position X0' as the polishing target and zeroing the polishing reference position χ〇 will be described with reference to the flowchart of FIG. 9. First, the workpiece w is inserted in the trial polishing (step s 1 ) The polishing cycle is started (step S2). At the beginning of the polishing cycle, after each of the static pressure pads 2, 2 is advanced to a predetermined position and the workpiece w is held by static pressure, each of the grinding wheels 5, 6 advances to grind both sides of the workpiece w. However, the position of the workpiece w is not stable until the two grinding wheels 5, 6 are sandwiched between the workpieces W. Therefore, after the insertion determining unit 34 of the position calculating means 22 confirms that the grinding wheels 5, 6 are sandwiched between the workpieces W (steps) In S3), the position calculating unit 35 takes in the measured values Μ1 and Μ 2 of the respective amounts/Bay J 9 〇 and starts monitoring the position of the workpiece w (step S4). When the position of the workpiece W is monitored, first, the position calculating unit 35 calculates the absolute position Xabs of the center position between the static pressure pads 1 and 2 (step S5), and displays the absolute position on the display means. 28 (step S6). Further, the absolute position Xabs of the workpiece w can be calculated by (D2 D"/2. Further, the position calculating unit 35 also calculates the relative position 工件 of the workpiece w (step S7). If any, the reference value Μ 1 r is zeroed. And M2r (step S8), the relative position X of the reference values Μ1 r and M2r is calculated and displayed (step S9). The relative position χ can be calculated by the equation {(M1Mlr)_(M2_M2r)}/2 When the position is not zeroed, the measured values μ 1 and M2 of each of the measuring heads 9 and 1 are directly indicated (steps S8 and S 1 0). The thickness is due to the zero signal from the size control device 18 (step S1丨), so the spark-free grinding is started according to the zero signal -20-201249597 (step S12). Then, if the spark-free grinding is started, : The axis is stopped. The measurement heads 9 and 10 are retracted from both sides of the workpiece w. On the other hand, at the same time as the start of the non-spark polishing, the workpiece w at the reception time point of the zero signal calculated by the position calculation unit 35 is read. With respect to the position x (step (1)), the returning portion 36 feeds the relative position to the grinding reference position X0 of the grinding target. In addition, the display means 28 displays the polishing reference position X0 as zero. Further, the reference position determining unit 37 reads the position calculated by the position calculating unit 35 while starting the non-spark polishing. When the zero signal is received (when the grinding reference position X0 is reset to zero), the absolute value of the static pressure pad is added. The absolute value is compared with the preset critical value of the absolute value 丨Xabs丨 and the grinding accuracy of the base. It is judged whether or not the grinding reference position X0 is used as the return-to-zero position (step S15). Then, if the absolute position Xabs of the workpiece W is small #critical#, the shell "乍 is displayed within the polishing reference position setting range and displayed on the display means 28, When the absolute value 丨Xabs1 is equal to or greater than the critical value, the absolute value 丨Xabs1 is displayed outside the polishing reference position setting range on the display means 28 (step s 17), and the operator is prompted to perform the accuracy check and the accuracy adjustment. ...the zero return of the grinding reference position XG can be simultaneously started with the start of the non-sparking grinding. The non-cremation grinding is preset to a certain time according to the grinding conditions, and is completed after the lapse of the certain time. When the spark is not polished (steps S18 and S19), the cutting axis moves toward the polishing back end (step S2〇), and the polishing cycle is ended (step S2D', so the workpiece after the trial grinding is taken out (step:)' and artificially After the grinding, the workpiece is subjected to measurement (step Μ" to judge the polishing precision (step S 2 4). -21- 201249597 Further, the result of the determination of the grinding accuracy is that the predetermined grinding accuracy cannot be obtained, and When the zero-refining polishing reference position X0 is outside the polishing reference position range, the accuracy is adjusted so that a predetermined polishing accuracy can be obtained, and then the re-operation is performed again from the insertion operation of the workpiece w to determine the correct grinding. The reference position is χ〇 and is reset to zero. Next, the position monitoring of the workpiece W in the final grinding and the cutting force performance control of the grinding wheels 5 and 6 will be described with reference to the flowchart of Fig. 1 . First, the workpiece W is inserted (step S30), and the polishing cycle is started (step S3 1). Then, when the polishing cycle is started, after the cooling determination unit 34 confirms that the grinding wheels 5 and 6 are sandwiched between the workpieces W (step S32), The position calculating unit 3 5 picks up the measured values μ 1 and M2 of the respective measuring heads 9 and 10 and monitors the position of the workpiece w (step S33). When the measured values Μ1 and M2 of the measuring heads 9 and 10 are taken in, the position calculating unit 35 calculates the relative position 现在 (step S34) of the current workpiece W based on the measured values] VH and M2, and by means of a pointer or the like. The indication portion 29a instantly displays the current position with respect to the zero-graded polishing reference position X0 (step S35). At the same time, the cutting force performance comparison means 26 judges the difference in the cutting force performance of the two grinding wheels 5, 6. That is, the reference values Mir and M2r of the both side faces of the workpiece W when the polishing reference position X0 is determined are read from the memory data (step S36), and the workpiece position calculating unit 41 uses the reference values Mir, M2r and this time. The measured values M1 and M2 of the points are subtracted, and the positions rj and R2 of the both side faces of the workpiece W with respect to the reference values Mir and M2r are calculated (step S37). Then, the position of the cutting force expression determining portion 42 on both sides is Reverse 1, rule 2 to compare the difference between the wear of the grinding wheel 5 and 6 of the grinding wheel 5 and 6 and judge the difference in the cutting force between the two grinding wheels 5 -22- 201249597 and 6 according to the difference in the grinding wheel wear amount ( Step Mg). For example, if the grinding wheel of the left grinding wheel 5 wears less than the grinding wheel of the right grinding wheel 6 and the cutting force of the left grinding wheel 5 is also worse than the cutting force of the right grinding wheel 6, such as the third As shown in the figure, the workpiece W2 in the grinding process is in a state in which the grinding wheel $ which is poor in the cutting force is pressed in the right direction and moves toward the grinding wheel 6 side where the cutting force is good. For this reason, if the workpiece W1 in the grinding of the workpiece 2 relative to the grinding reference position 成为 is in the positional relationship as shown in the figure, the reference value Μ1 r, M2r, and now based on the workpiece W1 can be used. At the time point, the measured values M1 and M2 of the workpiece W2 are calculated by the arithmetic expressions R1=Ml-Mlr and the arithmetic expression R2=M2-M2r to calculate the left position R1 and the right position R2 of the workpiece W2, respectively. Then, by finding the left and right difference ΔΚ·(=ίΠ-Κ·2) of the positions r 1 and R2 of the two sides of the workpiece W, the difference in the cutting force performance of the two grinding wheels 5 and 6 is understood, and the cutting is understood. Which of the two grinding wheels 5, 6 is one of the poor performance of the force. The case shown in Fig. 11 is ar < 〇, indicating that the left grinding wheel 5 is defective in cutting force ^ ar = 〇, indicating that the cutting forces of the two grinding wheels 5 and 6 are the same. Further, ar > 〇, in the case of the opposite to the i i diagram, indicates that the right grinding wheel 6 is defective in cutting force. If the judgment result of the cutting force performance is AR < 〇 or AR > 〇 (step S38), the flow rate of the grinding water which does not affect the grinding precision is corrected by the correction unit 39 at any time so that the two grinding wheels 5 during the grinding are The difference in the cutting force performance of 6 disappears (step S39). In this case, a control map in which the flow rate of the polishing water is changed in accordance with the left-right difference AR and the correction direction (±) is performed in advance, and the flow rate of the polishing water is generated according to the magnitude of the left-right difference AR, positive and negative according to the control map. The change is more appropriate. Moreover, the adjustment of the flow rate of the grinding water -23-201249597 can be continued until the cutting force performance of the two grinding wheels 5 and 6 is consistent, and can be controlled only according to the control chart. The workpiece position display portions 3A and 3' of the display means 28 are used to display the positions R1 and R2 of the both side faces at the time of the polishing of the workpiece w by using the both side faces of the workpiece w at the polishing reference position X0 as a reference. When the cutting forces of the left and right grinding wheels 5 and 6 are substantially the same, the display of the workpiece position display units 30 and 31 of the display means 28 is displayed at substantially the same level, and the cutting forces of the two grinding wheels 5 and 6 are different. Next, as shown in the first bucket diagram, the level of the difference in performance according to this cutting force is displayed. For example, in the case shown in Fig. 1, according to the difference in the cutting force of the two grinding wheels 5, 6, as shown in Fig. 4, the position of the indication portion 30a of the workpiece position display portion 3 is lower. The level of the indication portion 3 1 & of the position display portion 31 becomes higher. Therefore, it can be seen from the representation of the workpiece position display portions 3A and 31 that the difference in the cutting force expression between the two grinding wheels 5 and 6 can be easily grasped as the change in the positions ri and R2 of the both side faces of the workpiece during the polishing. As shown in Fig. 11, in the case where the cutting force of the left grinding wheel 5 is poor, the flow rate of the grinding water supplied between the left grinding wheel 5 and the workpiece is reduced in accordance with the degree of the cutting force. As a result, the discharge of the sand which has fallen off from the grinding wheel 5 is slowed down, and the residence time of the sand between the grinding wheel 5 and the workpiece is prolonged. Therefore, the sand particles significantly play the role of the grinding wheel and promote the grinding of the grinding wheel. The performance is getting better. Thereby, the difference in the force performance of the left and right grinding wheels 5 and 6 can be reduced as much as possible. =2, the flow rate of the grinding water on the 5 and 6 sides of the grinding wheel with good cutting force can be set to a certain value, and the grinding water flow on the grinding wheel $, 6 -24 - 201249597 side with poor cutting force performance can be reduced, and vice versa. The flow rate of the grinding water on the grinding wheels 5 and 6 on which the cutting force is poor is set to be constant, and the flow rate of the grinding water on the grinding wheels 5 and 6 on which the cutting force is good is reduced. In addition, it is also possible to increase the flow rate of the grinding water on the grinding wheels 5 and 6 on the side of the grinding wheel, and reduce the flow rate of the grinding water on the grinding wheels 5 and 6 on the side of the grinding force, so as to increase or decrease the grinding wheel 5 ' 6 grinding water flow. When the workpiece W reaches the target thickness, the zero signal from the size control device 18 is received (step S40), and the cutting axis is stopped, and the respective measuring heads 9, 10 are retracted to start the spark-free polishing (step S41). At the same time, the position comparing means 24 calculates the relative position X of the workpiece W at the reception time point of the zero signal calculated by the position calculating means 22 (step S42), and the relative position X and the grinding reference position as the grinding target χ In contrast, the offset amount and the offset direction of the workpiece W with respect to the polishing reference position 求 are obtained (step S43). At the same time, according to the measured values M1 and Μ2 when the zero signal is received, the left-right difference ΔR between the positions R i and R2 of the two side faces of the workpiece W at this time point is calculated (step S44), after the grinding of the workpiece W is completed, Prepare the correction of the grinding back end of the cutting shaft. The non-sparking polishing is set in advance for a certain period of time according to the polishing conditions, and after the lapse of the predetermined time, the non-sparking polishing is completed (steps S45 and s46), and the grinding process is completed to complete the grinding of the workpiece (step S47). The grinding back end moves (step S 4 8). When the zero position is received, if the relative position 工件 of the workpiece W is offset from the polishing reference position X0, the cutting force correction means 25 is used as a part of the cutting force expression control of the grinding wheels 5 and 6. The position of the grinding retracting end of the grinding wheels 5, 6 and the grinding retracting end -25-201249597 of the cutting shaft is corrected so that the grinding advance end coincides with the grinding reference position xo at the next grinding. Thereby, in the state of the next grinding of the workpiece w, in the state where the position of the relative position X of the workpiece W is absorbed, the two grinding wheels 5, 6 are cut into the workpiece W, and the positions of the two sides of the workpiece J can be made. , R2 returns to the grinding reference position χ〇. At the same time, when the two sides of the workpiece W have left-right differences, the after-correction unit 40 corrects and updates the polishing conditions that affect the cutting force expression of the grinding wheels 5 and 6 in order to prepare for the next polishing (step S49). Here, the grinding conditions which cannot be changed during the grinding, for example, the rotational speed of the grinding wheels 5, 6 and/or the cutting speed of the grinding wheels 5, 6 can be changed. This correction is based on the size of the left and right differences and the correction direction. The cutting force table j of the grinding wheels 5, 6 can be adjusted by correcting the rotational speed of the grinding wheels 5, 6 and/or the cutting speed of the grinding wheels 5, 6. For example, when the rotation speed of the grinding wheels 5 and 6 is slowed down or the cutting speed is accelerated, the grinding wheels 5 and 6 grind the negative particles of the workpiece w, and the grinding is carried out, and the sand grains fall off and appear continuously. The new sand particles, in the grinding wheels 5 and 6 with poor cutting force performance, can also achieve good cutting force performance by the wear of the grinding wheel. Further, the grinding retracting end of the grinding wheels 5, 6 can be repaired according to the positional deviation of the relative position X of the workpiece W, and the two grinding wheels 5 can be corrected according to the position difference ΔΚ· of the two phases μ 1 of the workpiece w The polishing condition of 6 can be used to correct only the polishing conditions of one of the two grinding wheels 5 and 6, and it is possible to reduce the damage and warpage of the workpiece W after polishing, and the polishing precision of the workpiece W. ^ Then the workpiece w is taken out and the processing is terminated (step s 5 〇). -26- 201249597 According to the above steps, the imbalance of the cutting force performance caused by the error of the grinding wheel abrasion amount of the two grinding wheels 5, 6 is numerically determined, and based on this data, the cutting force of the two grinding wheels 5, 6 can be used. The performance is automatically controlled in the same way. Further, in the case where a plurality of workpieces W are continuously polished, the same steps of operation, control, and the like can be repeatedly performed. Fig. 1 is a view showing a second embodiment of the present invention. The second embodiment includes a cutting force performance comparison means 26 for comparing the relative position X of the workpiece w during polishing with the polishing reference position X0 at which the workpiece W should be correctly held by the static pressure pads 1 and 2 The difference between the two is the instantaneous calculation of the difference in the cutting force between the two grinding wheels 5 and 6; and the grinding condition correction means 2 7, based on the difference in the cutting force between the two grinding wheels 5, 6, and the control is supplied to the two grinding wheels 5, 6 The polishing conditions of the grinding wheels 5 and 6 such as the flow rate of the polishing water between the workpiece W and the workpiece W are corrected so that the cutting forces of the two grinding wheels 5 and 6 are substantially identical. When the amount of wear of the "^ soil wheel is different, even if the cutting amount of the two grinding wheels 5, 6 is the same, the grinding end of the two grinding wheels 5, 6 is not, on the other hand, the grinding wheel on the larger side In 5 and 6, due to the self-generated effect, the amount of grinding is increased. Therefore, the grinding wheel 5 and 6 of the grinding wheel grinding grinding machine are oriented toward the grinding sand for the larger grinding wheel side, so that the relative position of the workpiece W is χ The wear amount of the grinding wheel is larger than that of the existing grinding wheel 5 and 6. The cutting force table is for this purpose, in the grinding of the workpiece W, ..., and the comparison of the cutting force performance: the second grinding reference position χο, By the two positions X and ^ production knife with the two -27-201249597 grinding sand offset, there are two grinding sizes, the cutting force between the direction of the shift, such as 1 3 map, but the essence of this In the horizontal, it is also the same as 5, a

之切削力表現差異而形成的工件w之位晋 有叙、 I …、、位置偏移的大小、偏移方向之運算。 德 5 从 右工件W之相對位置X相對於研磨基準位置χ〇 置偏移的話，則藉由研磨條件修正手段27且根據 、6之切削力表現差異、即根據位置偏移的 移方向’控制供給於兩研磨砂輪5、6與工件w 研磨水之流量。藉此，可解消兩研磨砂輪5、6之 表現的差異。 便—提，於根據相對位置X之位置偏移的大小、偏 來控制兩研磨砂輪5、6之研磨水之流量的情況下 ’可—面考慮研磨條件等之諸多要因，—面以第 不之關係進行控制。 上，針對本發明之各實施形態進行了詳細說明， 明不侷限於這些實施形態，只要未超出本發明之 :’即可作各種之變更。例如，各實施形態係針 雙頭平面磨床給予例示，但於立式雙頭平面磨床 樣可實施。The position of the workpiece w formed by the difference in the cutting force is calculated by the magnitude of the displacement, the magnitude of the positional offset, and the direction of the offset. When the relative position X of the right workpiece W is offset from the polishing reference position, the grinding condition correction means 27 is used to control the difference in the cutting force according to (6), that is, according to the direction of movement of the positional shift. The flow rate of the grinding water supplied to the two grinding wheels 5, 6 and the workpiece w. Thereby, the difference in performance between the two grinding wheels 5, 6 can be eliminated. In the case of controlling the flow rate of the grinding water of the two grinding wheels 5 and 6 according to the magnitude of the offset of the position X of the relative position X, the factors of the grinding surface can be considered, and the surface is not The relationship is controlled. The embodiments of the present invention have been described in detail, and the present invention is not limited thereto, and various modifications may be made without departing from the invention. For example, the embodiment of the needle double-head surface grinder is exemplified, but it can be carried out in a vertical double-head surface grinder.

研磨砂輪5、6之切削力表現差異，具有計算研磨中 之工件W的兩側面之位置们、R2,並對此兩側面之位置 Ri、R2進行比較，計算兩研磨砂輪5、6之砂輪磨耗量的 差異，根據此兩研磨砂輪5、6之砂輪磨耗量的差異，判 斷兩研磨砂輪5、6之切削力表現差異之方法；及算研 磨中之工件W的相對位置χ，並對此相對位置又與應將工 件W正確地保持於靜壓墊1、2間之研磨基準位置進行 比較，藉由兩者之差分，判斷兩研磨砂輪5、6之切削I -28- 201249597 表現差異的方法，作甚炎料丄 u右為對研磨中之工件w的兩側面之 位置R1、R2進行量，、目丨丨 n加站 '’且根據此位置R 1、R2來判斷兩研 磨/輪 t切削力表現的方法，亦可採用其他方法。 卜於计t工件W之兩侧面的位置Ri、R2之左右 差AR來控制研磨铬杜Μ $、〇 磨條件的情況下，可根據左右差ΔΚ，判斷 研磨y輪5 6之切削力表現的差異，並以此切削力表現 大致相同的方式進行控#，亦可根據左右差AR，判斷研 磨y輪5 6之矽輪磨耗量的差異，並以此砂輪磨耗量大 致相同的方式進行控制。 於靜壓墊1、2間之間隙D的量測中，例如， 靜塵塾2具有真空吸引手段，而且也不具有治具之；= ’亦可使用市面販售之間隙量規直接進行量測。另外， 工件W之左位置Επ亦可根據右靜壓墊2之墊位置D2、以間 隙里規所把握之塾間隙D、及已知之工件w的厚度τ，以 下面之運算式D1=D-D2-T所求取。另外’若已知道工件 W之左位置d 1，則亦能以此值作為基準求得左墊位置A i ，左墊位置A1係根據此左墊位置A 1及左量測頭9之量測 值Ml、M2，以下面之運算式A1=D1 + M1所求取。 如零係最好於工件W成為精加工尺寸時基於研磨基 準位置X0所進行。但是，為了避免傷及工件W，於自尺 寸控制裝置1 8接收零信號，兩量測頭9、1 0自工件w退避 之後’亦只於以研磨條件所設定之無火花研磨時間内進 行工件W之研磨，所以，在精加工尺寸之歸零會有困難 。藉此，以在自尺寸控制裝置18接收零信號的時序進行 車父為適宜。 -29- 201249597 201249597 在 磨 以 藉 量 頭 可 側 j 零 外 只 問 的 對 防 之 定 被 於研磨中’-面藉由旋轉之研磨砂輪5、6自兩側對 利用靜壓塾卜2所保持之狀態下旋轉的工件w進行研 ，-面藉由量測頭9、10即時量測工件你之兩側面，所 ’於此兩側面之量測值M1 ' M2常存在有微小的誤差。 此，以工件〜之相對位置X係藉由對各量測頭9、、1〇之 測值Ml、M2進行移動平均處理而求得較為適宜。 另外’、於實施形態中’利用尺寸控制t置Η之量測 9、1〇 ’並利用來自此尺寸控制裝置18之零信號，但亦 利用具有量測頭9、1G之專用量測手段，對1件％之兩 面進行量浪i ’並取代來自此尺寸控制裝置以之零信號 =工件W達到既定之研磨精度時的信號為契機進行 #。 里測頭9、1〇除了為接觸於工件w之兩側面的接觸式 亦：使用雷射位移式、靜電電容式等之非接觸式， :可量測工件W之兩側面的位置者，Λ量測方式不是 通〇 〜 亦可利用量測頭9、10、位置運算手段22之對工件w ::Ϊ視’以實現研磨砂輪5、6之交換後的研磨位置 的自動化。藉此，可削減安排等之時間，並可 口人為因素所造成之研磨位置對準錯誤的發生。亦即 ^要不進行一對靜壓墊丨、2之對準調整，研磨砂輪$ 立父換前及研磨位置幾乎不變，所以，靜壓墊丨、2 ^對準’只要對準於與研磨砂輪5 ' 6之交換前的既 〜-之基準值内的工件w之位置即可，且因為此位置 a己憶於機械中，故而能容㈣實現自動化。 -30- 201249597 【圖式簡單說明】 第1圖為顯示本發明之第1實施形態的臥式雙頭平面 磨床之平面構成圖。 第2圖為該臥式雙頭平面磨床之側面圖。 第3圖為該臥式雙頭平面磨床之控制系統的方塊圖。 第4圖為該臥式雙頭平面磨床之顯示手段之說明圖。 第5圖為該臥式雙頭平面磨床之位置量測方法之說 明圖。 第6圖為該臥式雙頭平面磨床之位置量測用之治具 等的平面剖視圖。 第7圖為該臥式雙頭平面磨床之位置量測用之治具 等的側面圖。 第8圖為該臥式雙頭平面磨床之位置量測方法之說 明圖。 第9圖為該臥式雙頭平面磨床之試研磨時之流程圖。 第1 0圖為該臥式雙頭平面磨床之正式研磨時之流程 圖。 第1 1圖為該臥式雙頭平面磨床之切削力表現差異之 說明圖。 第1 2圖為顯示本發明之第2實施形態之方塊圖。 第1 3圖為該臥式雙頭平面磨床之研磨水之流量調整 之說明圖。 第1 4圖為因研磨砂輪之切削力表現的差異而產生的 研削量差之說明圖。 【主要元件符號說明】 -31 - 201249597 w 工件 Ml、M2 量測值 X 相對位置 xo 研磨基準位置 Mir、M2r 基準值 R1、R2 兩側面位置 Xabs 絕對位置 D 間隙 T 厚度 1、2 靜壓墊 la 保持面 3、4 凹部 5 ' 6 研磨砂輪 7、8 缺口部 9、10 量測頭 9a、 10a 框支部 9b 、 10b 探頭 1 1、12 軸承箱 13、14 砂輪軸 15、16 砂輪驅動馬達 17 支撐構件 18 尺寸控制裝置 19 放大器 20 研磨控制裝置 21 研磨動作控制手段 -32- 201249597 22 位 置 運 算 手 段 23 研 磨 基 準 位 置 設 定 手段 24 位 置 比 較 手 段 25 後 退 端 修 正 手 段 26 切 削 力 表 現 比 較 手 段 27 研 磨 條 件 修 正 手 段 28 顯 示 手 段 29 相 對 位 置 顯 示 部 29a 指 示 部 30、31 工 件 位 置 顯 示 部 30a' 31a 指 示 部 34 央 入 判 斷 部 35 位 置 運 算 部 36 歸 零 部 37 基 準 位 置 判 斷 部 39 隨 時修 正 部 40 事 後 修 正 部 41 工 件 位 置 運 算 部 42 切 削 力 表 現 判 斷 部 43 治 具 44 板 45 本 體 部 46 直 立 部 47 支 撐 部 48 固 定 具 -33- 201249597 49 抵接部 50 固定具 51 抵接部 52 開口 -34The difference in the cutting force between the grinding wheels 5 and 6 is calculated by calculating the positions of the two sides of the workpiece W in the grinding, R2, and comparing the positions Ri and R2 of the two sides to calculate the grinding wheel wear of the two grinding wheels 5 and 6. The difference in the amount, according to the difference in the grinding wheel wear of the two grinding wheels 5, 6, the method for judging the difference in the cutting force between the two grinding wheels 5, 6; and the relative position 工件 of the workpiece W in the grinding, and The position is compared with the grinding reference position where the workpiece W should be correctly held between the static pressure pads 1 and 2, and the difference between the two grinding wheels 5 and 6 is determined by the difference between the two. The stimuli 丄u right is the amount of the positions R1 and R2 of the two sides of the workpiece w in the grinding, and the target is added to the station '' and the two grindings/rounds are judged according to the positions R 1 and R2 Other methods can be used for the method of cutting force performance. When the left and right difference AR between the positions Ri and R2 of the two side faces of the workpiece W is controlled to control the grinding chrome cuckoo $ and the honing condition, the cutting force performance of the grinding y wheel 56 can be judged based on the left and right difference ΔΚ. The difference is controlled in such a way that the cutting force performance is substantially the same. It is also possible to judge the difference in the wear amount of the grinding wheel of the grinding wheel y wheel according to the right and left difference AR, and control the grinding wheel in the same manner. In the measurement of the gap D between the static pressure pads 1, 2, for example, the static dust hopper 2 has a vacuum suction means, and does not have a jig; = ' can also be directly used for volume measurement using a commercially available gap gauge Measurement. In addition, the left position Επ of the workpiece W may be based on the pad position D2 of the right static pressure pad 2, the 塾 gap D grasped by the gap gauge, and the thickness τ of the known workpiece w, with the following expression D1=D- D2-T is requested. In addition, if the left position d 1 of the workpiece W is known, the left pad position A i can be obtained by using this value as a reference, and the left pad position A1 is measured based on the left pad position A 1 and the left measuring head 9 . The values M1, M2 are obtained by the following expression A1 = D1 + M1. For example, the zero system is preferably performed based on the polishing reference position X0 when the workpiece W is finished. However, in order to avoid injuring the workpiece W, a zero signal is received from the size control device 18, and after the two measuring heads 9, 10 are retracted from the workpiece w, the workpiece is also performed only in the non-sparking grinding time set by the grinding condition. W grinding, so it is difficult to return to zero in the finishing dimensions. Thereby, it is appropriate to carry out the vehicle at the timing when the zero control signal is received from the size control device 18. -29- 201249597 201249597 In the grinding of the borrowing head, the side can only be judged by the side of the j-zero. The grinding is carried out in the '-surface by rotating the grinding wheel 5, 6 from both sides to use the static pressure. The workpiece w that is rotated while being held is ground, and the surface of the workpiece is measured by the measuring heads 9, 10 in real time, and the measured value M1 'M2 of the two sides often has a slight error. Therefore, it is preferable to perform the moving average processing on the relative values X of the workpieces to the measured values M1 and M2 of the respective measuring heads 9, 1 . In addition, in the embodiment, the measurement of the size control t is used, and the zero signal from the size control device 18 is utilized, but the dedicated measurement method with the measuring heads 9, 1G is also used. The wave is measured on both sides of 1% and replaces the signal from the size control device with zero signal = the workpiece W reaches the predetermined grinding accuracy. The probes 9 and 1 are in contact with the two sides of the workpiece w: non-contact type using laser displacement type or electrostatic capacitance type, and the position of the two sides of the workpiece W can be measured. The measurement method is not overnight. It is also possible to use the measuring heads 9, 10 and the position calculation means 22 for the workpiece w: Ϊ ' to automate the polishing position after the exchange of the grinding wheels 5, 6. In this way, it is possible to reduce the time of arrangement, etc., and the occurrence of misalignment of the grinding position caused by human factors. That is, ^ does not perform a pair of static pressure pad 丨, 2 alignment adjustment, the grinding wheel $ 立 前 before and the grinding position is almost unchanged, so the static pressure pad 2, 2 ^ alignment 'as long as the alignment The position of the workpiece w in the reference value of the ~- before the exchange of the grinding wheel 5'6 is sufficient, and since this position a has been recalled in the machine, it is possible to realize automation. -30-201249597 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing the configuration of a horizontal double-head plane grinder according to a first embodiment of the present invention. Figure 2 is a side view of the horizontal double-head surface grinder. Figure 3 is a block diagram of the control system of the horizontal double-head surface grinder. Fig. 4 is an explanatory view showing the display means of the horizontal double-head surface grinder. Fig. 5 is an explanatory view showing the method of measuring the position of the horizontal double-head surface grinder. Fig. 6 is a plan sectional view showing the jig for measuring the position of the horizontal double-head surface grinder. Fig. 7 is a side view showing the jig for measuring the position of the horizontal double-head surface grinder. Fig. 8 is an explanatory view showing a method of measuring the position of the horizontal double-head surface grinder. Figure 9 is a flow chart of the trial grinding of the horizontal double-head surface grinder. Figure 10 is a flow chart of the formal grinding of the horizontal double-head surface grinder. Figure 1 is an explanatory diagram showing the difference in the cutting force performance of the horizontal double-head surface grinder. Fig. 2 is a block diagram showing a second embodiment of the present invention. Fig. 1 is an explanatory view showing the flow rate adjustment of the grinding water of the horizontal double-head surface grinder. Fig. 14 is an explanatory diagram of the difference in the amount of grinding due to the difference in the cutting force of the grinding wheel. [Main component symbol description] -31 - 201249597 w Workpiece Ml, M2 Measured value X Relative position xo Grinding reference position Mir, M2r Reference value R1, R2 Both side positions Xabs Absolute position D Clearance T Thickness 1, 2 Static pressure pad la Holding surface 3, 4 recess 5' 6 grinding wheel 7, 8 notch 9, 10 measuring head 9a, 10a frame branch 9b, 10b probe 1 1, 12 bearing housing 13, 14 grinding wheel shaft 15, 16 grinding wheel drive motor 17 support Member 18 size control device 19 Amplifier 20 Grinding control device 21 Grinding operation control means - 32 - 201249597 22 Position calculating means 23 Grinding reference position setting means 24 Position comparing means 25 Retracting end correcting means 26 Cutting force performance comparing means 27 Grinding condition correcting means 28 display means 29 relative position display unit 29a instruction unit 30, 31 workpiece position display unit 30a' 31a instruction unit 34 central determination unit 35 position calculation unit 36 return unit 37 reference position determination unit 39 Temporary correction unit 40 After-correction unit 41 Work position calculation unit 42 Cutting force performance determination unit 43 Fixture 44 Plate 45 Main body portion 46 Upright portion 47 Support portion 48 Fixture-33- 201249597 49 Abutment portion 50 Fixture 51 Abut Part 52 opening -34

Claims (1)

201249597 七、申請專利範圍： 1. 一種薄板狀工件之研磨 /ar ’其特徽兔· 於藉由一對研麻& 订傲马. 柘肤工株的系如 保持於—對靜壓墊間之薄 相對位置，並對此相 =δ十舁研磨中之工件的 A ^ ^ ^ . ，、應正確保持工件之研磨 丞竿位置進打比較，於 m^m^ ^ ^ 、者存在差分時，於該工件研 磨後根據兩者之差分修正 蚀丁一 Am益士 研磨々輪之研磨後退端’以 使下一 ··人研磨時兩研磨砂 /柳疋研磨刖進端一致。 2. 如申請專利範圍第丨項薄 又，寻板狀工件之研磨方法，其中 將研磨中之工件的研磨 所厲精度疋收在基準精度内時的工 件位置作為相對位置。 3. 如申請專利範圍第丨或2項之镇 八^ <潯板狀工件之研磨方法， ,、中於事先之研磨中將工件之研磨精度是收在基準精 度内時的工件位置作為研磨基準位置，且固定地設定 此研磨基準位置。 4. 如申請專利範圍第丨至3項中任一項之薄板狀工件之研 磨方法，其中於事先之研磨中將自尺寸控制裝置接收 到顯示工件之尺寸控制的零信號時之工件之位置作為 研磨基準位置，且於正式研磨中將自尺寸控制裝置接 收到零信號時之工件的位置作為相對位置。 5, 如申明專利範圍第1至4項中任一項之薄板狀工件之研 磨方法，其中對相對位置與研磨基準位置進行比較， 計算相對位置相對於研磨基準位置之偏移量及偏移方 向，並根據此偏移量及偏移方向修正研磨砂輪之研磨 後退端。 -35- 201249597 專利範圍第3項之薄板狀工件之研磨方法，其中 内時的Π磨中計算工件之研磨精度是收在基準精度 =件之兩制墊㈣絕對位置，且於此絕對位 位^於藉由研磨精度所決定之臨界值時設定研磨基準 7·—種雙頭平面磨 對靜厂堅塾間之薄=狀ΓΓ 砂輪對保持於一 十面磨床之特徵為具有： 頌 對量測頭，^ #4 τττ π*τ _ι_ 進行量測；頌〃對研磨中之工件的兩側面之位置 運异手段，其根據工 度内時的量制確β 件之研磨精度疋收在基準精 =測碩之量測值’計算工件之相對位置； 位置比卓交丰fit λΛ. 正確地保掊工#又’ 此相對位置與於靜壓墊間應 ;^ 《研磨基準位置進行比較而求出差分 件研磨後，:艮’其於兩者存在差分時，於該工 端。 康兩者之差分修正研磨砂輪之研磨後退 -36-201249597 VII. The scope of application for patents: 1. Grinding of a thin plate-shaped workpiece / ar 'its special emblem rabbit · by a pair of hemp & set the proud horse. The system of the skin plant is kept in - static pressure pad The relative position between the thin and the A ^ ^ ^ . of the workpiece in this phase = δ ten 舁 grinding, should correctly maintain the position of the grinding 丞竿 of the workpiece, and compare it with m^m^ ^ ^ When the workpiece is ground, the grinding back end of the smelting-Am-Australian grinding wheel is corrected according to the difference between the two workpieces, so that the grinding sand/willow grinding end is consistent when the next one is ground. 2. In the case of the patent application, the method of polishing the slab-like workpiece, wherein the workpiece position in the grinding is accurately measured within the reference accuracy as the relative position. 3. For the grinding method of the 八 状 状 工件 ^ ^ 如 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 浔 浔 浔 浔 浔 浔 浔 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨The reference position and the grinding reference position is fixedly set. 4. The method of polishing a thin plate-like workpiece according to any one of the above-mentioned claims, wherein the position of the workpiece when the zero-signal indicating the size control of the workpiece is received from the size control device is used as a prior grinding The reference position is ground, and the position of the workpiece when the zero signal is received from the size control device is used as the relative position in the formal grinding. 5. The method of polishing a thin plate-shaped workpiece according to any one of claims 1 to 4, wherein the relative position and the grinding reference position are compared, and the offset and the offset direction of the relative position with respect to the grinding reference position are calculated. And correct the grinding back end of the grinding wheel according to the offset and the offset direction. -35- 201249597 The grinding method of the thin plate-shaped workpiece of the third item of the patent scope, wherein the grinding precision of the workpiece is calculated in the internal honing is the absolute position of the two pads (four) of the reference precision = and the absolute position ^ Set the grinding reference by the critical value determined by the grinding precision. ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ ─ The probe, ^ #4 τττ π*τ _ι_ is measured; 颂〃 the positional difference between the two sides of the workpiece in the grinding, and the grinding accuracy of the β piece is determined according to the amount within the working degree. Fine = measurement of the measured value of 'measure the relative position of the workpiece; position than Zhuo Jiaofeng fit λ Λ. Correctly protect the work #又' This relative position and the static pressure pad should be; ^ "grinding reference position for comparison After the difference piece is ground, it is: 艮 'when there is a difference between the two, at the working end. Kang's differential correction grinding wheel grinding back -36-
TW101108994A 2011-03-18 2012-03-16 Method for grinding thin plate-shaped workpiece and double-head surface grinder TWI558503B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011060520 2011-03-18
JP2011243137A JP5891010B2 (en) 2011-03-18 2011-11-07 Thin plate workpiece grinding method and double-head surface grinding machine

Publications (2)

Publication Number Publication Date
TW201249597A true TW201249597A (en) 2012-12-16
TWI558503B TWI558503B (en) 2016-11-21

Family

ID=46757087

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101108994A TWI558503B (en) 2011-03-18 2012-03-16 Method for grinding thin plate-shaped workpiece and double-head surface grinder

Country Status (4)

Country Link
JP (1) JP5891010B2 (en)
KR (1) KR101891344B1 (en)
DE (1) DE102012204089A1 (en)
TW (1) TWI558503B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI648130B (en) * 2015-02-17 2019-01-21 日商光洋機械工業股份有限公司 Double-head plane grinding device
CN110860998A (en) * 2019-12-09 2020-03-06 徐州鑫晶半导体科技有限公司 Apparatus and method for double-sided thinning
CN111390678A (en) * 2020-04-24 2020-07-10 山西潞安太阳能科技有限责任公司 Silicon wafer grinding machine and using method thereof

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104511814A (en) * 2014-12-20 2015-04-15 重庆尹氏天润套装门有限公司 Wood board processing table with two-side grinding function
CN107984360A (en) * 2017-11-20 2018-05-04 长沙市凤英机械科技有限公司 A kind of H profile steel multiaspect polishing derusting device
CN108687644A (en) * 2018-03-29 2018-10-23 芜湖凌梦电子商务有限公司 A kind of polishing pin of tablet computer production equipment easy to use
CN108747667B (en) * 2018-05-07 2019-10-25 徐州恒林木业有限公司 A kind of BMC injection mold plate surface burr remover
CN110181383A (en) * 2019-06-06 2019-08-30 扬州好管家科技信息咨询有限公司 A kind of high efficiency burnishing device of lift self-control self-suction type water pump mold processing
CN110539237B (en) * 2019-09-30 2021-06-04 南通海润机床有限公司 Liftable double-grinding-wheel structure for grinding machine
CN110883661A (en) * 2019-12-04 2020-03-17 浙江中慧厨房设备有限公司 Double-sided polishing machine for steel plate
JP7588494B2 (en) * 2020-11-04 2024-11-22 株式会社ディスコ Method for grinding a workpiece

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4524547A (en) * 1983-09-06 1985-06-25 Litton Industrial Products, Inc. Automatic double disc grinder control cycle
JP2005238444A (en) * 1999-05-07 2005-09-08 Shin Etsu Handotai Co Ltd Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method and double-sided simultaneous lapping machine
JP2003071713A (en) 2001-08-29 2003-03-12 Nippei Toyama Corp Grinding apparatus and wafer thickness management method
JP2003236748A (en) * 2002-02-14 2003-08-26 Sumitomo Heavy Ind Ltd Grinder
JP2004058175A (en) * 2002-07-25 2004-02-26 Sumitomo Heavy Ind Ltd Duplex-head grinding device
JP4319092B2 (en) * 2004-06-03 2009-08-26 住友重機械工業株式会社 Double-sided processing equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI648130B (en) * 2015-02-17 2019-01-21 日商光洋機械工業股份有限公司 Double-head plane grinding device
CN110860998A (en) * 2019-12-09 2020-03-06 徐州鑫晶半导体科技有限公司 Apparatus and method for double-sided thinning
CN111390678A (en) * 2020-04-24 2020-07-10 山西潞安太阳能科技有限责任公司 Silicon wafer grinding machine and using method thereof

Also Published As

Publication number Publication date
KR20120106576A (en) 2012-09-26
JP5891010B2 (en) 2016-03-22
KR101891344B1 (en) 2018-08-24
DE102012204089A1 (en) 2012-09-20
JP2012210697A (en) 2012-11-01
TWI558503B (en) 2016-11-21

Similar Documents

Publication Publication Date Title
TW201249597A (en) Method for grinding thin sheet-like workpiece and double-end surface grinder
TWI558507B (en) Method for grinding thin sheet-like workpiece and double-end surface grinder
JP5820329B2 (en) Double-head surface grinding method and double-head surface grinding machine
CN103313822B (en) Grinding anomaly monitoring method and grinding abnormality monitoring apparatus
TW201105461A (en) Device for chamfering glass substrate
CN104853880A (en) Grinding processing method
JP6133169B2 (en) Grinding device setup method
JP7068096B2 (en) Grinding method for workpieces
JP4911810B2 (en) Workpiece grinding apparatus and grinding method
KR101925009B1 (en) Method for trimming an ophthalmic lens
KR20160120237A (en) Thin plate-shaped workpiece manufacturing method and double-end surface grinding apparatus
JP3199627B2 (en) Automatic sizing device and method for double-headed grinding machine
JP2008279542A (en) Grinding machine and grinding method for non-circular or eccentric workpiece
JP2708351B2 (en) Rolling mill, roll grinding device, and rolling method with online roll grinding device
EP3334562B1 (en) Grinding error compensation
JP3627225B2 (en) Truing device for grinding wheel
JP2003071713A (en) Grinding apparatus and wafer thickness management method
JPH0521707B2 (en)
JP6163916B2 (en) Wheel wear measurement method
JPH0335064B2 (en)
JP2003311610A (en) Grinder, and grinding method using it
CN113396030A (en) Double-end grinding method
JPH04164568A (en) Correction method for grinding wheel of duplex head grinder
JPH03121775A (en) Automatic sizing method for grinder