201231203 六、發明說明： 【發明所屬之技術領域】 更特定 上將雷 射加工 方法及 割工作 光學系 改工作 的工作 言之， 射束轄 方法及 設備， 件或藉 統在空 件之内 件之熱 本發明係關於雷射加工方法及設備，且 係關於可藉由不在垂直方向而在傾斜角方向 射至工作件而有效地刻劃或切割工作件之雷 设備。更特定言之，本發明係關於雷射加工 其可使用高功率之雷射束來有效地刻劃或切 由以使得雷射束使用諸如掃描器或多邊鏡之 間及時間上恰當分配之方式掃描雷射束而修 部來切割工作件，藉此最小化由雷射束造成 變形。 【先前技術】 雷射束加工由於其易於將光能聚焦至非常小的面積而 可增強能量密度，提供良好直線傳播且使非接觸加工成為 可能’且因此，為對硬卫作件或脆性材料之切割處理或刻 劃處理非常有效的方法。此外，&來，雷射已廣泛用於各 種工業領域，此係由於其允許自由成形表面或複雜表面之 加工，亦允許歸因於小加工範圍之微加工，且較其他加工 方法引起由熱量造成的工作件之較小變形。用於雷射加工 中之雷射根據雷射束之波形而分成脈衝雷射及連續雷射。 脈衝雷射具有諸如奈秒、皮秒及飛秒單位之短雷射輕射週 期，由於具有大於幾十+瓦之峰值功率而適合於加工各種 材料，且較連續雷射引起較小的熱變形。近來，此雷射加 工已廣泛用於刻劃或切割石夕晶圓、化合物半導體晶圓、陶 3 201231203 究半導體晶圓、藍寶石板、金屬板、玻璃板等等。 雷射L二此雷射加工亦具有若干問題，該等問題在於在 … s ’至之工作件之部分處|生粒+，且工作件之 面歸因於工作件之緬攸 >文。p分之再凝固而變得粗趟且不 勻（如圖1中戶斤千、 „ , _ _ '、，且在於粒子妨礙刻劃以致在雷射束 經再輕:以使加工部分更深的狀況下阻止雷射束到達工作 件之更’木部分。為此，當不能保障足夠刻劃深度時，存在 工作件在不同於刻劃方向之方向上開裂的問題，且因此， 雷射加工方法之應用t存在限制。 此外隨著雷射製造技術之開發’已開發高功率之皮 秒雷射或飛秒雷射’但在此等雷射用於切割或刻劃之狀況 下，不規則微裂縫歸因於由對處理表面之熱影響造成之非 晶體化或歸因於由蒸發造成之體積膨脹而形成於板之表面 上’且使仵切割區之表面粗趁且使工作件之表面上所產生 之元件之特性劣化。 為了最J、化此等影響，近來，已知將相對弱脈衝之雷 射束重複輕射至工作件之表面之方法，但其在解決歸因於 再凝固之不均勻表面或微裂縫之問題中亦具有限制且不 提供使用高功率雷射之有效且快速的加工。此外，由於刻 劃方法中《纟使用雷射，因此存在藉由將雷射束收集至 工作件内部而修改工作件之内部組織之方法，但該方法亦 具有若干問題’該等問題在於’在將該方法應用於厚工作 件時存在限制’此係因為該方法藉由在垂直方向上將雷射 幸I射至工作件之表面而在工作件内部產生預先配置切割點 201231203 的或線j問題在於即使該方法適用於厚卫作件，亦必須 重複輪射雷射，因此加工速度慢。 【發明内容】 因此，已進行本發明以解決出現在先前技術中之以上 所提及之問題’且本發明之目標為提供雷射加工方法及設 =’其儘管在使用高功率之雷射束的情況τ亦可藉由以使 付在固疋區域中重複移動之方式使用掃描器或多邊鏡掃描 雷射束以相對於王作件之表面在垂直方向而在傾斜角方 向上將雷射束㈣至工作件來減少熱變形、藉由保障用於 在加工期間所產生之粒子之通道以最小化再凝固來增 強加工品質’且允許深加工。 此外’本發明之另一目標為提供雷射加工方法及設 備其可猎由以快速率在工作件内部形成預先配置切割面 而為厚卫作件提供改良之㈣品f，此係由於在傾斜角方 向上掃描之雷射束經收集至工作件之内部以產生修改面。 為了完成以上目標，根據本發明，提供兩種雷射加工 方法：第-雷射加工方法包括以下步驟：（A)掃描雷射束； 及（B)將經掃描雷射束輕射至卫作件，同時移動工作件， 其中在步驟（B)中’雷射束係在自垂直於工作件表面之方 向具有預定傾斜角之傾斜角方向上輕射至工作件，以使得 在工作件之深度方向上掃描之雷射束藉由穿透工作件來修 改工作件之深度方向之相應…第二雷射加工方法包括 細v驟’（A)掃描雷射束；及（B)將經掃描雷射束轄 ’至工作件，同時移動工作件，其中在步驟⑻中，雷射 201231203 束係以使得在平行於工作件表面 由穿透工作件來修改平行於工作件2上知描之雷射束藉 方式而在自垂直於工作件表面 ^方向之相應面之 斜角方向上輻射至工作件。 向”有預定傾斜角之傾 在第一雷射加工方法中，自工 作件或自工作件表面至工作件表面=表面至相對側之工 ..y. 表面與相對側之間的任一點 之乍件經移除或修改以待刻劃或切割。或者，在深/方 向上與工作件表面隔開預定距離且垂直於: :面、:修改以待稍後切割。此外，再次執行步驟(丄二弟 至少另一個平行面。 ^開預-距離之工作件之 工作雷射加工方法中，自工作件表面至預定深度之 工作件在平行於工作件表面 表面之方向上經移除且 深度方向上與工作件表面隔開預定距離且平行於工作= 面之第—面經修改。此外，再次執行步驟（A)及（B)， 以便修改在深度方向上與第一面隔開預定距離之工作件之 至:>、另一個平行面。 勺括在：：明之另一態樣中’存在一種雷射加工設備，其 :用於：Γ裝置，其用於產生雷射束；—第-光學系統， 描自雷射裝置所產生之雷射束且改變經掃描雷射 一第二光學系統，其用於收集自第一光學系統 發送之雷射束；及一載物 ㈣口，其用於固定工作件，其t經 由第:光學系統掃描且自第二光學系統發送之雷射束輕射 工件’同時載物台經輪送而以使得雷射束在自垂直於 201231203 工作件表面之方向具有預定傾斜角之傾斜角方向上輻射之 方式移動卫作件，以使得在工作件之深度方向上掃描或在 平行於工作件表面之方向上掃描之雷射束藉由穿透工作件 而修改工作件之深纟方向之相應面或平行於工作件表面之 方向之相應面。 根據本發明之雷射加工方法及設備可增強切割及刻劃 品質’此係因為在加工期間所產生之粒子可藉由在將於傾 斜角方向上掃描之雷射束輕射至工作件時保障用於排出粒 子之通道以防止再凝固而得以有效地移除。 此外，本發明由形成預&配置切割^容易地切 割即使為厚的工作件，此係因為在傾斜角方向上掃描之雷 射束收集至工作件内部以產生修改面。 【實施方式】 本發明之以上及其他目標、特徵及優點將自結合附圖 之本發明之較佳具體實例之以下詳細描述而顯而易見。 現將參看附圖詳細參考本發明之較佳具體實例，但本 發明並不受該等具體實例限定或限制。 圖2為用於描述根據本發明之較佳具體實例之雷射加 工設備100之視圖。 參看圖2’根據本發明之雷射加工設備⑽包括雷射裝 置m、具有第一鏡120a、第二鏡㈣及第三鏡咖之第 光子系統120、第二光學系統13〇及控制器。雷射加 工设備100進一步舍知用於田6 匕括用於固疋工作件之载物台，且根 據控制器14〇之控制信號輸送載物台以將工作件1〇移動至 201231203 作件之位置。圖式中未展示，但雷射加工設 可進-步包括用於增強加工品質或速度之額外裝置，諸 二二：吹出在加工期間所產生之粒子之鼓風機或用於收 果祖千之抽吸裝置。 μ工1()可為碎晶圓、化合物半導體晶圓、陶究半導 -石板、金屬及玻璃板，及含有各種有機物質 所有種類之實心體。 刃w之 雷射裝置m為可產生具有諸如奈秒、皮秒或飛秒單 立之短輻射週期之連續波雷射束或脈衝射束，具有大於幾 =千瓦之峰值功率。工作者可以使得雷射裝置1產生怜 s功率及波長之雷射束之方式控制控制器140。 。 =運行以掃描雷射束之驅動部分（例如，掃描器） :、雷射加工設備100之任何部分處。舉例而言，圖2 =一鏡咖、第二鏡1鹰或第三鏡㈣可為掃描器， 或如下所描述（見圖3)，第一 弟鏡12〇a、第二鏡120b或第 :兄2〇c可為由致動器賺或馬達驅動之多邊鏡咖。 器所需的鏡及多邊鏡可用其他光學系統替代， 路線之其他光學構件替代。右需要’以用於改變雷射束之 控制器“0產生控制信號以輸送載物台以使得 =可移動至將加U作件1G之位置，且控制安裝於工作件 方之支樓物上的光學系統載物台上之第一光學 120或第二光學系統13〇以 ” 置。此外，控制器14。可控制第::：工作…位 ^ ^ 先學系統12〇之鏡之角201231203 VI. Description of the invention: [Technical field to which the invention belongs] More specifically, the work of the laser processing method and the cutting work optical system is changed, the beam trajectory method and equipment, or the internal parts of the blanks are The present invention relates to a laser processing method and apparatus, and relates to a lightning device that can effectively scribe or cut a workpiece by not projecting it to the workpiece in a direction of inclination in a vertical direction. More particularly, the present invention relates to laser processing that can use high power laser beams to effectively scribe or cut such that the laser beam is used, such as between scanners or polygon mirrors, and in a timely manner. The laser beam is scanned and the trim is cut to cut the workpiece, thereby minimizing distortion caused by the laser beam. [Prior Art] Laser beam processing enhances energy density because it is easy to focus light energy to a very small area, providing good linear propagation and making non-contact processing possible'; and therefore, for hard-working or brittle materials A very efficient method of cutting or scoring. In addition, lasers have been widely used in various industrial fields because they allow the processing of freely formed surfaces or complex surfaces, and also allow micromachining due to small processing ranges, and are caused by heat other than other processing methods. The resulting small deformation of the work piece. Lasers used in laser processing are divided into pulsed lasers and continuous lasers depending on the waveform of the laser beam. Pulsed lasers have short laser light-period periods such as nanoseconds, picoseconds, and femtosecond units, are suitable for processing a variety of materials due to peak powers greater than tens of watts, and cause less thermal distortion than continuous lasers. . Recently, this laser processing has been widely used to scribe or cut Shi Xi wafers, compound semiconductor wafers, ceramics, semiconductor wafers, sapphire plates, metal plates, glass plates, and so on. Laser L This laser processing also has several problems. The problem lies in the part of the work piece from ... s '|granules +, and the face of the work piece is attributed to the work piece. The p-part re-solidifies and becomes rough and uneven (as shown in Figure 1, the households are thousands, „, _ _ ', and the particles hinder the scribe so that the laser beam is lighter: to make the processed part deeper In the situation, the laser beam is prevented from reaching the more 'wood portion of the work piece. For this reason, when the sufficient depth of scoring cannot be ensured, there is a problem that the work piece is cracked in a direction different from the scoring direction, and therefore, the laser processing method There is a limit to the application t. In addition, with the development of laser manufacturing technology, 'high-powered picosecond lasers or femtosecond lasers have been developed', but in the case of such lasers for cutting or scoring, irregular micro The crack is attributed to the amorphization caused by the thermal influence on the treated surface or on the surface of the plate due to the volume expansion caused by evaporation' and makes the surface of the enamel cutting zone rough and on the surface of the workpiece The characteristics of the generated components are degraded. For the most J, the effects of these, etc., recently, a method of repeatedly emitting a relatively weak pulsed laser beam to the surface of a workpiece is known, but it is solved due to re-solidification. In the case of uneven surfaces or micro-cracks It also has limitations and does not provide efficient and fast processing using high-power lasers. In addition, due to the use of lasers in the scribing method, there is a modification of the interior of the workpiece by collecting the laser beam into the interior of the workpiece. The method of organization, but the method also has several problems. 'The problem is that there is a limitation when applying the method to a thick work piece' because the method shoots the laser to the work piece by vertically in the vertical direction. The problem of the surface or the provision of the pre-configured cutting point 201231203 inside the workpiece is that even if the method is suitable for thick-lifting, the laser must be repeated, so the processing speed is slow. [Summary of the Invention] The invention solves the above-mentioned problems occurring in the prior art' and the object of the present invention is to provide a laser processing method and to provide a τ which can be used in the case of using a high power laser beam. Scanning the laser beam using a scanner or a polygon mirror in a manner that repeats the movement in the solid area to be perpendicular to the surface of the kingpiece in the oblique direction Beam (4) to the workpiece to reduce thermal deformation, to enhance processing quality by minimizing re-solidification by securing channels for particles generated during processing' and allowing deep processing. Further, another object of the present invention is to provide a mine The shooting method and equipment can be improved by forming a pre-configured cutting surface inside the workpiece at a rapid rate to provide an improved (four) product f, because the laser beam scanned in the oblique angle direction is collected to The inside of the workpiece is used to create a modified surface. In order to accomplish the above object, according to the present invention, two laser processing methods are provided: the first-laser processing method includes the following steps: (A) scanning a laser beam; and (B) Scanning the laser beam to lightly move to the guard while moving the workpiece, wherein in step (B), the laser beam is lightly directed to the work in a tilt angle direction having a predetermined tilt angle from the direction perpendicular to the surface of the workpiece a member such that the laser beam scanned in the depth direction of the workpiece modifies the depth direction of the workpiece by penetrating the workpiece. The second laser processing method includes a fine scan (A) scan And (B) moving the scanned laser beam to the workpiece while moving the workpiece, wherein in step (8), the laser 201231203 is tied so as to be modified by the penetrating workpiece parallel to the surface of the workpiece Parallel to the laser beam borrowing method on the workpiece 2, the workpiece is radiated in an oblique direction from a corresponding surface perpendicular to the surface of the workpiece. To "there is a predetermined tilt angle in the first laser processing method, from the workpiece or from the surface of the workpiece to the surface of the workpiece = surface to the opposite side.. y. Any point between the surface and the opposite side The piece is removed or modified to be scored or cut. Or, in the depth/direction, spaced apart from the surface of the workpiece by a predetermined distance and perpendicular to: : face, modified to be cut later. In addition, the steps are performed again ( At least another parallel surface of the second brother. ^In the working method of the pre-distance working piece, the working piece from the surface of the working piece to the predetermined depth is removed and the depth is parallel to the surface surface of the working piece. The direction is spaced apart from the surface of the workpiece by a predetermined distance and parallel to the first surface of the work surface. Further, steps (A) and (B) are performed again to modify the predetermined distance from the first surface in the depth direction. The working piece is: >, another parallel surface. The spoon is included in: another aspect of the 'there is a laser processing device, which is used for: a helium device for generating a laser beam; The first optical system, drawn from the laser device a laser beam and a modified scanning laser-second optical system for collecting a laser beam transmitted from the first optical system; and a carrier (four) port for fixing the working piece, the t- The laser beam scanned by the optical system and transmitted from the second optical system illuminates the workpiece 'at the same time as the stage is rotated such that the laser beam has a predetermined tilt angle in a direction perpendicular to the surface of the workpiece of 201231203 Radiating the moving member such that the laser beam scanned in the depth direction of the workpiece or in a direction parallel to the surface of the workpiece modifies the corresponding direction of the deep direction of the workpiece by penetrating the workpiece Or a corresponding surface parallel to the direction of the surface of the workpiece. The laser processing method and apparatus according to the present invention can enhance the cutting and scoring quality 'this is because the particles generated during processing can be in the direction of the oblique angle When the scanned laser beam is lightly incident on the workpiece, the passage for discharging the particles is secured to prevent re-solidification and is effectively removed. Further, the present invention is easily cut by forming a pre- & configuration cut ^ Even if it is a thick working piece, this is because the laser beam scanned in the oblique angle direction is collected into the inside of the working piece to produce a modified surface. [Embodiment] The above and other objects, features and advantages of the present invention will be obtained from the accompanying drawings. The preferred embodiments of the present invention will be described in detail with reference to the appended claims. A view of a laser processing apparatus 100 in accordance with a preferred embodiment of the present invention. Referring to Figure 2, a laser processing apparatus (10) according to the present invention includes a laser device m having a first mirror 120a, a second mirror (four), and a third mirror The photo-lighting subsystem 120, the second optical system 13A and the controller. The laser processing apparatus 100 further knows that the field 6 is used for the stage for fixing the workpiece, and according to the controller 14 The control signal is transported to the stage to move the workpiece 1〇 to the position of the 201231203 workpiece. Not shown in the drawings, but the laser processing can include additional means for enhancing the quality or speed of the process, and 22: blowing the blower of the particles produced during processing or for collecting the fruit Suction device. μ工1() can be used for shredded wafers, compound semiconductor wafers, ceramic semi-conductive slabs, metal and glass sheets, and solid bodies containing all kinds of organic materials. The laser device m of the blade w is a continuous wave laser beam or pulse beam capable of generating a short radiation period such as nanosecond, picosecond or femtosecond, with a peak power greater than a few megawatts. The worker can control the controller 140 in such a manner that the laser device 1 produces a laser beam of s power and wavelength. . = Run to scan the drive portion of the laser beam (eg, scanner): at any portion of the laser processing apparatus 100. For example, Figure 2 = a mirror coffee, a second mirror 1 eagle or a third mirror (four) can be a scanner, or as described below (see Figure 3), a first mirror 12a, a second mirror 120b or : Brother 2〇c can be a multilateral mirror coffee that is earned by an actuator or driven by a motor. The mirrors and polygon mirrors required for the device can be replaced by other optical systems, replacing other optical components of the route. Right need 'to control the laser beam controller "0" to generate a control signal to transport the stage so that = can be moved to the position where the U will be added 1G, and the control is installed on the work piece side of the building The first optical 120 or the second optical system 13 on the optical system stage is set. In addition, the controller 14. Controllable:::Work...bit ^ ^ First learn the corner of the system 12 〇 mirror
S 201231203 度或控制第二光學系統13〇之角度或焦點。 改變所Μ ’第—鏡12Ga、第二鏡12仙及第三鏡120c 學“ 13G《雷射束 學系統130收集入射雷鉍A ± 弟一九 朱八耵笛射束且輻射至工作件1〇。 控制器140可控制掃描器以使得掃描器鏡在-循環上 :預定角度往復運行，且控制致動器而或馬達以使得且 有複數個反射侧之多邊鏡⑵e以規則速度旋轉。因此，控 制器140可反射經由第—光學系統12〇入射之雷射束，以 使得雷射束可在職寬度範圍⑽重複掃減發送。第二 光學系統130收隼自容；喜你1/ΛΛ 邊鏡l^Oe入射之經掃描雷射束且將 其幸I射至工作件I 〇。，μμ _ ^ . Α 此處，多邊鏡I20e可呈具有幾個或幾 十或幾百個側面之^ ▲ &鏡之形式，或可為具有根據掃描寬 又而I化之側面數目之鏡。但是，本發明不限於上述情況， 且代替多邊鏡I20e，可採用藉由致動器mf或馬達垂直移 動之其他鏡射構件或其他光學系統。 如上所描述，在本發明中，當往復移動以藉由掃描器 或多邊鏡l2Ge掃描時，雷射束輻射至在載物台上移動之工 作件10以使得工作件I 〇經刻劃或切割。 舉例而言，如圖4 (A)中所示，在自左至右切割工作 中1 〇之狀况下，如圖4 ( B)中所示，載物台經輸送以自左 至右移動工作件丨0，且接著，經掃描雷射束經由第二光學 系統13G收集J_ ϋ射至卫作件1G。特定言之，第二光學系 統130之角度由控制器14〇恰當地設定，以使得自第二光 千系統13 0發送之雷射束在自垂直於工作件丨〇之表面之方 201231203 向的傾斜角方向上輻射至工作件 挪声方Α 〇以使侍在工作件10之 /木度方向上知描之自第二光學系 穿透工竹杜Μ “ m〇發送之雷射束藉由 穿“件H)之表面以刻劃或切割工作件 件ίο之深度方向之相應面，即 ，文作 ..^ . 側之表面至相對側啖— 側之表面與相對侧之間的任—點。工作#1〇可在下叫 製程令切割，此係因為在工作件 。裂 笛-丰與各从Μ Μ干之冰度方向上掃描且自 一 S送之雷射束藉由在深度方向上自一側 之表面至相對側修改工作件1G來刻劃工作件1G。或者4 使用較向功率之雷射束或擴大修改之範圍時，可在: 割裂製程的情況下藉由在深度方向上自一側之表面:㈣ 側之表面進行修改來直接切割工作# 10。如上所描述，在 深度方向上自—側之表面至相對側之表面修改工作件10之 ==合於相對薄工作件之加工，例如，具有在幾 百I卡之範圍内的厚度，諸如，石夕晶圓及化合物半導體曰 S] ° 日日 如上所描述，當雷射束在傾斜角方向上輕射至工作件 10以執行加工時，用於排出粒子之通道經保障以藉此防止 再;疑S]，以使得工作件1 Q可方| 卞件1〇 了在無任何不均勻表面或微裂縫 =情況下以良好加工品f加工。亦即，如圖4 ( B )中所示， 當雷射束在工作件10之深度方向上自工作件ίο之最Z側 耗射時’邊緣部分之一層首先經修改及切割，且下藉 由雷射束按次序修改及切割，且在此種情況下先前形成 之修改或切割部分之空間充當用於排出粒子之通道，以藉 此減少粒子之再凝固。在此種情況下，在工作件1〇之加2 10 201231203 期間’若以上所p、+, 自工鼓風機或抽吸裝置用於吹出或抽吸 自工作件1 0所產 人4柚吸 . 之粒子，則可更加防止再凝固。 作馮加工之另—杳4 , 乃實施例，參看圖5 ,者雪射击/ 6 Μ 切割之工作件表田雷射束在自將被 部之一部分時，工作件上收集至工作件内 雷射束不收集至表面 被雷射束修改’此係因為 r^^ 而收集雷射束之部分經修改，且哩 知描之雷射束可形 、，-i 配置切割面。與藉由習^件表面之切割位置之預先 、 σ加工方法所形成之切割線或點相 S明所开^之預先酉己置切害J面可增強加工品 ’此曰係因為當在加工之後藉由割裂製程來切割工作件 日，使得工作件能夠在所欲方向上良好地切割。特定言之， =加工方法對厚工作件更有效，且可根據工作件之厚度而 最佳修改寬度’同時改變掃描區之長 工作件的狀況下（如圖6中所示），可形成相互 數個預先配置切割面。 舉例而言’在控制11 140恰當地設定第二光學系統130 =焦點之後，自第二光學系統13〇發送之雷射束可修改在 又方向上與工作件丨〇之表面隔開預定距離之側面。如圖 7中所示，相互隔開預定距離且形成於工作件1〇内部之修 改面之數目可根據工作件10之厚度而變化。舉例而言，相 互隔開200微米之間隔之兩個修改面可形成於具有丨微 米之厚度之工作件1 〇内，且在此種情況下，修改面中之每 一者具有200微米之高度。 亦即，如圖5中所示，自第二光學系統13〇發送之雷 11 201231203 射束在自垂直於工作件l〇 傾斜角方hr/ 具有預定傾斜角之 方向上輪射至工作件1〇,且因此，在工作件 卢:方向上掃描且自第二光學系統⑽發送之雷射束藉由穿 之側面種情二=向:與工作“…S 201231203 degrees or control the angle or focus of the second optical system 13〇. Change the 'Μ-mirror 12Ga, the second mirror 12仙 and the third mirror 120c Learn" 13G "Laser Beam System 130 collects incident Thunder A ± Brother Jiu Jiubai flute beam and radiates to work piece 1 The controller 140 may control the scanner to cause the scanner mirror to reciprocate on a cycle: a predetermined angle, and control the actuator or the motor such that the plurality of reflective side polygon mirrors (2) e rotate at a regular speed. The controller 140 can reflect the laser beam incident through the first optical system 12, so that the laser beam can be repeatedly transmitted and removed in the working width range (10). The second optical system 130 is self-contained; The mirror l^Oe enters the scanned laser beam and shoots it to the working member I 〇., μμ _ ^ . Α Here, the polygonal mirror I20e can have several or tens or hundreds of sides ^ ▲ & the form of the mirror, or may be a mirror having a number of sides according to the width of the scan. However, the present invention is not limited to the above case, and instead of the polygon mirror I20e, it may be adopted by the actuator mf or the motor vertical Other mirroring members or other optical systems that move as described above In the present invention, when reciprocating to be scanned by the scanner or polygon mirror 12Ge, the laser beam is radiated to the workpiece 10 moving on the stage to cause the workpiece I to be scored or cut. As shown in Fig. 4 (A), in the case of 1 〇 from the left to the right cutting work, as shown in Fig. 4 (B), the stage is transported to move the work piece from left to right 丨0, and then, the scanned laser beam collects J_ to the guard 1G via the second optical system 13G. In particular, the angle of the second optical system 130 is appropriately set by the controller 14 so that The laser beam transmitted by the two-light system 130 is radiated to the working piece in the direction of the tilt angle from the side perpendicular to the surface of the workpiece 2012 201231203 to make the work piece 10 / wood In the direction of the second optical system penetrating the bamboo azalea "m〇 the transmitted laser beam by wearing the surface of the piece H to scribe or cut the corresponding surface of the workpiece ίο, ie ,文作..^ . The surface of the side to the opposite side 啖 - the point between the side of the side and the opposite side. Work #1 It can be cut in the lower process, because it is scanned in the direction of the ice of the workpiece, the rifle-bump and the Μ 且 dry, and the laser beam sent from one S is from the surface in the depth direction. Modifying the working piece 1G to the opposite side to scribe the working piece 1G. Or 4 using the laser beam of the comparative power or expanding the modified range, in the case of the splitting process, by the surface in the depth direction from the side (4) The surface of the side is modified to directly cut the work #10. As described above, the surface of the workpiece from the surface to the opposite side in the depth direction modifies the work piece 10 == in conjunction with the processing of the relatively thin workpiece, for example, Having a thickness in the range of a few hundred I cards, such as a stone wafer and a compound semiconductor 曰S] ° as described above, when the laser beam is lightly incident on the workpiece 10 in the oblique direction to perform processing , the passage for discharging the particles is secured to prevent further; suspect S], so that the work piece 1 Q can be square | the piece 1 is in the absence of any uneven surface or micro crack = case with a good processed product f machining. That is, as shown in FIG. 4(B), when the laser beam is consumed from the most Z side of the workpiece ίο in the depth direction of the workpiece 10, one layer of the edge portion is first modified and cut, and borrowed. The laser beam is modified and cut in order, and in this case the previously formed modified or cut portion space acts as a passage for the particles to be discharged, thereby reducing re-solidification of the particles. In this case, during the work piece 1 〇 2 10 201231203 'If the above p, +, self-operated blower or suction device is used to blow or suck from the work piece 10 produced by 4 people. The particles can prevent re-solidification. The other part of Feng processing - 杳 4, is an embodiment, see Figure 5, the snow shooting / 6 Μ cutting work piece surface field laser beam in the part of the will be part of the work, collected on the work piece to the work piece The beam is not collected to the surface and is modified by the laser beam. This part is modified because r^^ collects the portion of the laser beam, and the laser beam can be shaped, and -i configures the cutting surface. The cutting line or the point formed by the pre-, σ processing method by the cutting position of the surface of the workpiece can be used to enhance the processed product. This is because the processing is performed. The work piece date is then cut by the splitting process so that the work piece can be cut well in the desired direction. In particular, the = processing method is more effective for thick working parts, and the width can be optimally modified according to the thickness of the working piece. At the same time, changing the condition of the long working piece of the scanning area (as shown in Fig. 6) can form mutual Several pre-configured cut faces. For example, after the control 11 140 properly sets the second optical system 130 = focus, the laser beam transmitted from the second optical system 13 可 can be modified to be further spaced apart from the surface of the workpiece 预定 by a predetermined distance. side. As shown in Fig. 7, the number of the modified faces which are spaced apart from each other by a predetermined distance and formed inside the workpiece 1 can be varied depending on the thickness of the workpiece 10. For example, two modified faces spaced apart from each other by 200 microns may be formed in the workpiece 1 having a thickness of 丨 micron, and in this case, each of the modified faces has a height of 200 microns. . That is, as shown in FIG. 5, the beam 11 201231203 transmitted from the second optical system 13 is rotated to the workpiece 1 in a direction perpendicular to the tilt angle hr of the workpiece l / having a predetermined tilt angle. Oh, and therefore, the laser beam that is scanned in the direction of the work piece: direction and sent from the second optical system (10) by wearing the side of the pair of emotions = direction: and work "...
It况下在使用脈衝雷射的狀況下， 一雷射脈衝之修改f iI -Γ 丄± 小可藉由輻射至工作件内部之脈 ^ =之射束收集大小來判定。修改點在卫作件 脈衝雷射振動時在太^ ^ 吟在右上方向及右下方向上重複地形成，且 據雷射脈衝之掃描方法而在右上方向及右下方向上重複 =成’且在此種情況下，修改點之數目為至少兩個，且 4具有大於_個修改點之高度的高度之In the case of using a pulsed laser in the case of a pulse, the modification of a laser pulse, f iI - Γ 丄 ± small, can be determined by the beam collection size radiated to the inside of the workpiece ^ ^ . The modified point is repeatedly formed in the upper right direction and the lower right direction when the laser vibration of the guard is pulsed, and is repeated in the upper right direction and the lower right direction according to the scanning method of the laser pulse. In this case, the number of modification points is at least two, and 4 has a height greater than the height of the _ modification points.
Li件1〇内部（見圖”。如上所描述，本發明可= 工作件】〇内部形成修改，且在割裂製程期間獲得無 4何裂縫之良好加工品質，此# …、 功率而形成。 ㈣因為修改面藉由足夠雷射 根據本發明之加工方法可允許在平行於工作件 Π:向上的面加工以及在垂直於工作件1〇之表面之方向 的面加工’且在圖9及圖1〇中說明 例。在平行於工作件…面之方向上設定雷二： 後，當雷射束經收集以聚焦至工作件ι〇之表面或聚 叮距"作件1G表面之預定深度處之工作件Η)内部 福寬父成1订.於工作件10表面之具有預定寬度（雷射掃 j度）之加工面或修改面。在諸如陶究半導體板、藍寶 、金屬板及玻璃板之大於_微米之厚工作件的狀況 12 201231203 下’若此加工製程應用於工作件之整個表面，則其可代替 用於半導體或LED製造方法中之背面研磨製程而用作用於 控制工作件之厚度之製程。圖9及圖Π)說明加工製程，其 可替代背面研磨製帛，但本發明不限於上述情況，且根據 情況，如圖9或圖10中所示’至少_修改面可形成於工作 件之表面上或在距工作件1G表面之歡深度處之工作 件10之内部以刻劃或切割工作件1〇。 工 如上所描述，在工作件10之深度方向上掃描且自第二 光學系統發送之雷射束可在深度方向上自卫作件1〇之 表面修改卫作件1G或在平行於工作件1G之表面之方向上 修改工作件10(見圖4、圖5、圖6、圖9及圖⑷。或者， 通孔可形成於工作件10之區域處（見圖u (A))，或渠 溝可在卫作件1G之區域處形成至距卫作件U)之表面之預 定深度（見圖U⑻卜由於雷射之性質，通孔或渠溝之 最小直徑或寬度可形成為幾微米至幾十微米β X，在此種 隋况下’雷射束在傾斜角方向上㈣至卫作件1G以保障用 於排出粒子之通道以藉此防止再凝固，以使得卫作件10可 在無任何不均勾表面或微裂縫的情況下以良好加工品質加 雖然已參考特定說明性具體實例描述本發明，但本發 明不由具體實例而僅由隨附中請專利範圍限定。應瞭解， 熟習此項技術者可在不⑽離本發明之範嗨及精神的情況下 改變或修改具體實例。 【圖式簡單說明】 13 201231203 圖1為展示根據先前技術之雷射束在垂直方向上入射 至工作件表面之加工結果之像片； 圖2為展示根據本發明之較佳具體實例之雷射加工設 備之視圖； 圖3為用於解釋根據本發明之多邊鏡之用法之視圖； 圖4為用於解釋根據本發明之自工作件表面應用於深 度方向之雷射加工方法之視圖； 圖5為用於展示經由工作件在深度方向上之内部修改 而形成預先配置切割面之視圖； 圖6為用於展示經由工作件在深度方向上之内部修改 而形成多層切割面之視圖； 圖7為用於解釋當形成多層切割面時之刻劃結果之視 圖； 圖8為用於解釋根據本發明之形成於工作件内部之修 改面之大小的視圖； 圖9為用於解釋在平行於工作件表面之方向上之雷射 加工方法之視圖； 圖10為用於解釋在平行於工作件表面之方向上經由工 作件之内部修改而形成預先配置切割面之視圖；及 圖11為用於展示根據本發明之雷射加工方法之實施例 之視圖。 【主要元件符號說明】 10 :工作件 1 〇〇 :雷射加工設備 14 201231203 110 :雷射裝置 120 :第一光學系統 120a :第一鏡 120b :第二鏡 120c :第三鏡 120e :多邊鏡 120f :致動器 130:第二光學系統 140 :控制器The inside of the Li member 1 (see Fig.). As described above, the present invention can be used to form a modification of the inside of the workpiece, and a good processing quality without any cracks is obtained during the cutting process, which is formed by the power of .... Since the modified surface can be processed in a direction parallel to the workpiece Π: the upward surface and the surface perpendicular to the surface of the workpiece 1 by sufficient processing by the processing method according to the present invention, and in FIGS. 9 and 1 In the example, the Ray II is set in the direction parallel to the surface of the workpiece. After the laser beam is collected to focus on the surface of the workpiece or the distance between the workpieces and the 1G surface. The working piece Η) internal Fu Kuan Fu Cheng 1 set. The working surface or modified surface of the surface of the working piece 10 having a predetermined width (laser scanning j degree). In such as ceramic panel, sapphire, metal plate and glass The condition of a thick workpiece larger than _micron 12 201231203 lower 'If the processing process is applied to the entire surface of the workpiece, it can be used as a control workpiece instead of the back grinding process used in semiconductor or LED manufacturing methods Thickness FIG. 9 and FIG. 2 illustrate a processing process which can replace the back grinding process, but the present invention is not limited to the above case, and depending on the situation, as shown in FIG. 9 or FIG. 10, at least the modified surface can be formed. The workpiece 10 is scribed or cut on the surface of the workpiece or at the depth of the workpiece 10 from the surface of the workpiece 1G. As described above, the depth of the workpiece 10 is scanned and from the second The laser beam transmitted by the optical system can modify the workpiece 1G in the direction of the depth of the self-defense piece 1 or modify the workpiece 10 in the direction parallel to the surface of the workpiece 1G (see Fig. 4, Fig. 5, Fig. 6). Figure 9 and Figure (4). Alternatively, the through hole may be formed at the area of the work piece 10 (see Figure u (A)), or the groove may be formed at the area of the guard 1G to the distance U) The predetermined depth of the surface (see Figure U(8). Due to the nature of the laser, the minimum diameter or width of the via or trench can be formed from a few micrometers to tens of micrometers β X. Under such conditions, the laser beam is at an oblique angle. Directionally (4) to the guard 1G to secure the passage for discharging particles to thereby prevent re-solidification, The invention can be described in terms of a good processing quality without any uneven surface or micro-cracks. Although the invention has been described with reference to specific illustrative examples, the invention is not limited by the specific examples but only by the accompanying claims. It is to be understood that those skilled in the art can change or modify the specific examples without departing from the spirit and scope of the invention. [Simplified illustration] 13 201231203 FIG. 1 is a view showing a laser beam according to the prior art. Photograph of the processing result incident on the surface of the workpiece in the vertical direction; Fig. 2 is a view showing a laser processing apparatus according to a preferred embodiment of the present invention; Fig. 3 is a view for explaining the use of the polygon mirror according to the present invention 4 is a view for explaining a laser processing method for applying a surface from a workpiece to a depth direction according to the present invention; FIG. 5 is a view for forming a pre-configured cutting by internal modification of a workpiece in a depth direction; Figure 6 is a view for showing the formation of a multi-layered cutting surface by internal modification of the workpiece in the depth direction; Figure 7 is for explaining FIG. 8 is a view for explaining the size of a modified surface formed inside the workpiece according to the present invention; FIG. 9 is for explaining the direction parallel to the surface of the workpiece; View of the above-described laser processing method; FIG. 10 is a view for explaining the formation of a pre-configured cutting surface via internal modification of the workpiece in a direction parallel to the surface of the workpiece; and FIG. 11 is for showing the present invention according to the present invention. A view of an embodiment of a laser processing method. [Main component symbol description] 10: Workpiece 1 〇〇: Laser processing apparatus 14 201231203 110: Laser device 120: First optical system 120a: First mirror 120b: Second mirror 120c: Third mirror 120e: Polygon mirror 120f: actuator 130: second optical system 140: controller