KR100664573B1 - Laser processing apparatus and method - Google Patents

Abstract

The present invention relates to a laser processing apparatus and method for improving the processing efficiency by reflecting the laser beam to the rotating mirror and repeatedly irradiating the object, the laser generating to emit a laser beam under the control of the control unit, the control unit storing the processing parameters A driver, a driver driven by the control of the controller, an actuator reciprocatingly rotated by the driver, a rotation mirror attached to the actuator, for collecting a laser beam reflected from the laser generation unit, and collecting a laser beam reflected from the rotation mirror The laser processing apparatus is controlled by a condenser lens and a control unit, and includes a conveying means for seating an object and maintaining a fixed state upon laser beam emission, and by processing the object by using the same, thereby reducing the cost of equipment and improving processing efficiency. Can be improved.

Laser, processing, multiple probe

Description

Laser Processing Apparatus and Method

1 is a structural diagram of a laser processing apparatus according to a first embodiment of the present invention,

2 is a flowchart for explaining a laser processing method according to the present invention;

3 and 4 are views for explaining the division processing method of a large-area workpiece by applying the present invention,

5 is a structural diagram of a laser machining apparatus according to a second embodiment of the present invention;

6 is a structural diagram of a laser machining apparatus according to a third embodiment of the present invention;

<Description of the symbols for the main parts of the drawings>

10: laser generating unit 20: beam scanner

30: stage 40: control unit

50: object 60: laser beam shielding means

110: light source 120: beam expander

130: first reflection mirror 210: second reflection mirror

220: actuator 230: rotating mirror

240: driver 250: condensing lens

260: shielding means 270: molded lens

The present invention relates to a laser processing apparatus, and more particularly, a laser for improving processing efficiency by multi-irradiating a laser beam to an object using a rotating mirror while the object is fixed while processing the object using the laser beam. It relates to a processing apparatus and a method.

In the semiconductor manufacturing process, the finished wafer is cut into chips. The cutting process of the wafer is divided into mechanical and laser methods.

The mechanical method applies the principle of cutting, and a cutting tool rotating at a high speed is applied to a wafer to perform a cutting process, and a predetermined force is essentially applied to the cutting tool. For thicker wafers, the cutting speed is faster and the chip is rarely broken. However, as the thickness of the wafer becomes thinner, the chip breaks due to the force applied during cutting and the vibration generated. In order to solve this problem, the cutting speed is lowered and the cutting process is performed. However, since the productivity is lowered, the non-contact laser processing is proposed as an alternative.

Laser processing is based on the principle that when the high-density laser beam is scanned on the material surface, the scanned portion is melted, vaporized, sublimed and removed, and various studies are currently being made.

First, US Pat. No. 5,902,499 describes a micro laser jet, and specifically, a laser beam is incident to a fine stream of water sprayed at high pressure so that the laser beam acts on the object together with water. According to this patent, there is an advantage that the cutting by-products generated during cutting are removed by water, but there is a limit to reducing the diameter of the water stream. In particular, a cutting width of 20 mu m or less is currently required, and it is not easy to reduce the diameter of the stream to this level. In addition, since water streams act as optical waveguides, water with extremely limited impurities should be used.

US Pat. No. 5,922,224 describes a cutting method using a plurality of laser beams. Since the patent uses a split laser beam, the density of the beam is lowered, and therefore, the molten component is increased, so that the melt is easily solidified on the cutting wall. In addition, as the material heated above the melting temperature solidifies on the cutting wall, the heat transferred is transferred into the material to raise the temperature of the cutting site, and such a temperature increase may negatively affect the performance of the chip.

On the other hand, international applications WO03 / 076,119 and WO03 / 076,120, which describe breaking methods through weakening of the internal structure, focus the laser beam inside the material to cause thermal damage of the material, thereby making the machine fragile. The method of inducing breakage has the advantage of fast cutting speed. However, there is a process inconvenience in that the laser beam must be irradiated to the back side of the wafer in order for the laser beam to penetrate into the material.

Laser beam irradiation using a biaxial galvanometer proposed in US Pat. No. 6,586,707 is a method of scanning a beam by using X-Y two galvanometers, which is capable of cutting not only straight lines but also curved lines. However, there are technical limitations in driving the two galvanometers to achieve the desired linear motion. That is, errors due to interpolation during processing occur, and telecentric errors due to the area-specific error of the telecentric lens and the position of the incident pupil between the X-Y mirrors during high-speed scanning increase.

In addition, the current laser processing apparatus adopts a method of transferring the object by the conveying device when processing the object while irradiating the laser beam, and accordingly, high movement precision is required in the design of the conveying device, thereby increasing the manufacturing cost. In addition, when a problem such as shaking of the transfer device occurs during processing, since the processing is made thicker than the desired line width, there is a problem that the processing efficiency, such as damage to the chip formed on the object is damaged.

The present invention has been made in order to solve the above problems and disadvantages, laser processing apparatus that can improve the processing quality by high-speed multi-scanning the laser beam to the processing site of the object through a rotating mirror while the object is fixed There is a technical challenge in providing it.

Another technical problem of the present invention is to precisely process an object by changing the scanning speed, frequency, number of irradiation, etc. of the laser beam while the machining is performed according to the object of processing the object.

In addition, the technical problem of the present invention is to change the laser processing apparatus by fixing the maximum scanning distance of the laser beam, by processing the processing part by dividing the processing part according to the size of the processing part of the object or by adjusting the rotation angle of the rotating mirror. It is to make it easy to process the object without replacement or replacement.

Laser processing apparatus of the present invention for achieving the above technical problem is a control unit for storing the processing parameters; A laser generator for emitting a laser beam under the control of the controller; A driver driven by the control of the controller; An actuator reciprocatingly rotated by the driver; A rotating mirror attached to the actuator and configured to reflect a laser beam emitted from the laser generator; A condenser lens for condensing a laser beam reflected from the rotating mirror; And transfer means controlled by the controller, the object being seated and maintaining a fixed state when the laser beam is emitted. The maximum scanning distance of the laser beam is determined by the rotation angle of the actuator, and the scanning distance is controlled to have a distance longer than the maximum machining schedule of the object.

The present invention also provides a method for processing an object using a laser, the method comprising: setting a parameter for processing the object; Mounting the object on a transfer device; Emitting a laser beam; Reflecting the laser beam using a rotating mirror attached to an actuator reciprocating the emitted laser beam, condensing the reflected beam and irradiating the object with an object; Determining whether the object processing is completed; Determining whether to transport the object when the object processing is completed; If the object needs to be transported, stopping the emission of the laser beam; And returning to the step of emitting the laser beam after transferring the object by the transfer device.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a structural diagram of a laser processing apparatus according to a first embodiment of the present invention.

As shown in the drawing, the laser processing apparatus according to the present embodiment multi-scans the laser generation unit 10 from which the laser beam is emitted and the laser beam emitted from the laser generation unit 10 to the processing site of the processing target object 50. The beam scanner 20, the transfer device 30 on which the processing target object 50 is placed, and the processing conditions of the target object 50 are set, and the laser generator 10, the beam scanner 20, and the transfer apparatus 30 are controlled. The control unit 40 is configured to include.

In more detail, the laser generator 10 may include a light source 110 for emitting a laser beam, a beam expander 120 and a beam expander for expanding the size of the laser beam emitted from the light source to refine the focus of the beam. And a first reflection mirror 130 for reflecting the beam extended at 120 and entering the beam scanner 20.

In addition, the beam scanner 20 may scan the beam reflected by the second reflection mirror 210 and the second reflection mirror 210 for reflecting the laser beam that is reflected by the first reflection mirror 130. Condensing to collect the laser beam reflected from the rotating mirror 230 for irradiating 50, the actuator 220 for rotating the rotating mirror 230, the driver 240 for driving the actuator and the rotating mirror 230 Lens 250. Herein, the actuator 220 may be implemented using any one of a galvanometer, a servo motor, and a stepping motor, and the condenser lens 250 may be implemented using a telecentric lens. In addition, the beam scanner 20 can be moved up and down, thereby adjusting the focus position of the laser beam according to the thickness of the workpiece.

In addition, the laser processing apparatus of the present invention prevents the laser beam from being irradiated to the non-processed region of the object in order to improve the processing accuracy when processing a large area of the object, and also lasers the object at the point of rotational return of the rotation mirror 230. At least one shielding means 60 may be further included to prevent the beam from being irradiated repeatedly.

For processing the object, the object 50 is seated in the transfer device 30, the laser beam having a frequency and size specified according to the processing parameters set in the controller 40 is emitted from the laser generator 10. At this time, the driver 240 drives the actuator according to a preset machining parameter, thereby driving the actuator at a specified rotation angle and rotation speed. Accordingly, the laser beam incident from the laser generator 10 to the beam scanner 20 is irradiated at a speed specified by the object 50 seated on the transfer device 30, and the scanning distance is rotated by the actuator 220. It will change according to the angle. In a preferred embodiment of the present invention, the rotation angle of the rotating mirror 230 that is rotated by the actuator is set to ± 15 °.

The object 50 installed in the transfer device 30 maintains a stationary state while performing processing by irradiating a laser beam, and when the portion to be processed remains, the emission of the laser beam is stopped for the next processing portion. In order to process, it is conveyed for a certain period in a designated direction (for example, in a longitudinal direction). For example, when the object 50 is a wafer in which the semiconductor chip is designed, the transfer section is the size of the chip.

In the present invention, the scanning distance determined according to the rotational angle of the actuator is determined to be larger than the length of the sawlane. The reason why the scan distance is set larger than the length of the machining schedule line is to exclude the region where the speed is zero (rotation return point of the rotating mirror) from the machining area during the rotary reciprocating motion of the actuator. That is, the speed appears as 0 at the part that changes the direction of the rotation mirror during the reciprocating motion of the rotation mirror by the actuator, and since the object is processed more in this area, the part where the rotation mirror changes the direction is It is to exclude. For example, in the case of a wafer having a diameter of 100 mm, the maximum scanning distance is set to include a constant speed section (100 mm) and an acceleration / deceleration section. It is preferable that the acceleration / deceleration section is, for example, less than 5% of the diameter of the object to be processed. Accordingly, in the case of a wafer having a diameter of 100 mm, the maximum scanning distance is preferably set to 106 mm.

As described above, in the present invention, when the scanning distance of the laser beam is set to cover the length of the maximum processing target line of the object to be processed, the machining can be performed without transferring the object when the processing target line is processed, and thus the object transfer. The device does not need to have high movement precision, which lowers the manufacturing cost.

If the length of the maximum machining line is larger than the scanning distance, that is, when processing a large area object, the part corresponding to the scanning distance is first processed, and then the emission of the laser beam is temporarily suspended and the transfer device 30 is processed. By moving the object 50 in the processing direction (for example, the horizontal direction) by the secondary processing for the remaining portion can be made. At this time, in the primary processing, the masked portion 60 is masked by the shielding means 60, and then the machining is performed. In the secondary processing, the pre-processed primary processing region is shielded by the shielding means 60. By performing processing after masking, it is possible to prevent the same processing site from being repeatedly processed.

Such division processing of the object can be divided into three or more times in consideration of the relationship between the size of the object and the laser beam scanning distance, the shielding means 60 for this purpose can be changed according to the size of the object Can be. In this divided processing method, the processing sequence is optimized according to the size of the object to be processed.

2 is a flowchart for explaining a laser processing method according to the present invention.

For laser processing according to the present invention, the operator must first determine the processing parameters according to the object to be processed and set them in the control unit 40 (S10). Machining parameters that need to be set include the output size, frequency of the laser beam, the angle of rotation of the actuator, the speed of rotation, the desired machining area, the machining length and the machining depth.

After setting the processing parameters, the object 50 is installed on the transfer device 30 (S20), and the laser beam is emitted from the light source 110 under the control of the control unit 40 (S30). The emitted laser beam is repeatedly irradiated at a predetermined scanning distance on the surface of the object 50 (S40), and the process of repeatedly irradiating the laser beam will be described in detail as follows.

The laser beam emitted from the light source 110 is incident to the first reflection mirror 130 after the focus is optimized through the beam expander 120. The laser beam reflected from the first reflection mirror 130 is incident to the rotation mirror 230 by the second reflection mirror 210, since the rotation mirror 230 rotates at the angle and speed specified by the actuator 220. The laser beam is incident to the condensing lens 250 in a straight line, and is then irradiated in a straight line form on the surface of the object 50 while the focus is kept constant. Since the laser beam is continuously emitted and the actuator 220 continues to rotate during the processing of the corresponding site, a result of repeatedly irradiating a straight laser beam to the processing site of the object. In addition, the scanning distance of the laser beam is set, for example, 3 to 5% longer than the maximum processing line size of the object.

In this way, the laser beam is repeatedly irradiated to the machining site in a straight line, and when the machining of the machining site is completed, the controller 40 determines whether the object should be transferred by the transfer device with reference to the preset parameter (S50). . If the object 50 is to be transported and continues to be machined, the maximum scanning distance is shorter than the length of the machined line. If the machined line is to be divided, the machining of the machined line is completed but other machined lines are machined. If you have to. In this case, the step of masking the unprocessed portion of the object with the shielding means after the object is seated in the transfer device and before starting the laser beam emission.

As a result of the determination of the control unit 40, when the transfer of the object 50 is necessary, the control unit 40 pauses the emission of the laser beam (S60) and transfers the transfer device 30 (S70). When the object 50 is transferred to the corresponding position, the laser is emitted again (S30), and the process of processing the object is repeatedly performed by repeatedly repeating irradiation of the laser beam (S40).

3 and 4 are views for explaining the division processing method of a large-area workpiece by applying the present invention.

First, FIG. 3 is a view for explaining the case where the object is divided twice when the machining schedule line is longer than twice the maximum scanning distance.

For example, when the object 50 is a semiconductor wafer having a diameter of 200 mm and the maximum scanning distance of the laser beam is 106 mm, the object 50 can be divided and processed twice as shown in FIG. 3. To this end, after the object 50 is installed on the transfer device 30, the shielding means 60 is positioned in the secondary processing region of the object 50. The position and movement of the shielding means 60, and the information (processing position, object type, etc.) on the object to be processed are controlled by the parameters preset in the control unit 40.

In this manner, after masking the secondary processing region of the object 50 with the shielding means 60, the laser beam is emitted, for example, processing starts from the portion a. Since the machining length of the portion a is shorter than the maximum scanning distance of the laser beam (for example, 106 mm), in this case, the scanning distance of the laser beam is adjusted by adjusting the rotation angle of the rotating mirror 230 by the actuator 220. Allow for short control. In this case, when the object is a structure in which a plurality of materials are laminated, processing may be performed by changing processing parameters during processing according to the type of material forming each laminated structure when processing the portion a.

When the machining of the part a is completed, the laser beam is temporarily suspended for processing the next machining portion, and the conveying means is driven to transfer the object in the corresponding direction (for example, the y direction). The scanning distance of the laser beam required according to the processing part of the object is varied within the maximum scanning distance range, for example, the maximum in the b part.

When the processing up to the c part is completed by the above method, the transfer means 30 is moved in the x-direction, for example, to mask the primary machining site and perform the machining on the secondary machining site in the same manner as described above. do. When the object is a structure in which a plurality of materials are laminated, the processing parameters may be changed according to the type of each material forming the laminated structure, as described in the processing method for the portion a during the processing of each processing site.

Next, FIGS. 4A and 4B are diagrams for explaining the case where the object is divided into three times when the machining schedule line is longer than three times the maximum scanning distance.

For example, when the object 50 is a semiconductor wafer having a diameter of 300 mm and the maximum scanning distance of the laser beam is 106 mm, the object 50 can be divided and processed three times as shown in FIGS. 4A and 4B. have. To this end, as shown in FIG. 4A, after the object 50 is installed on the transfer device 30, the shielding means 60 is positioned in the secondary and tertiary processing regions of the object 50. The position and movement of the shielding means 60, and the information (processing position, object type, etc.) on the object to be processed are controlled by the parameters preset in the control unit 40.

In this manner, after masking the secondary and tertiary processing regions of the object 50 with the shielding means 60, the laser beam is emitted, for example, processing starts from the portion d. Since the processing length of the portion d is shorter than the maximum scanning distance of the laser beam (for example, 106 mm), in this case, the scanning distance of the laser beam is adjusted by adjusting the rotation angle of the rotating mirror 230 by the actuator 220. Allow for short control. When the processing for the portion d is completed, the emission of the laser beam is temporarily suspended in order to process the next processing portion, and the conveying means is driven to transfer the object in the corresponding direction (for example, the y direction). The scanning distance of the laser beam required according to the processing part of the object is varied within the maximum scanning distance range, for example, the maximum at the e part.

When the processing up to the portion f is completed in the above manner, as shown in FIG. 4B, the transfer means 30 is moved in the x direction, for example, and the shielding means 60 is also moved, and the primary and third The secondary machining site is masked and the machining of the secondary machining site is carried out in the same manner as above. Subsequently, processing is also performed by the method similar to the above about a 3rd process site | part.

As described above, in the present invention, at least one shielding means 60 is required in order to divide and process a large-area object, and the shielding means 60 serves to prevent the laser beam from being irradiated to other machining portions, and a rotating mirror. It serves to prevent the laser beam from being repeatedly irradiated to the object at the return point of rotation of.

Thus, the reason and the advantage which divide and process a large area object are as follows. For example, in the case of cutting a 200 mm or 300 mm wafer, a beam scanner having a scanning distance of 200 mm or 300 mm can be processed, but as the maximum scanning distance increases, the focusing lens becomes longer in focus. The diameter of the lens increases and the focal size increases, which is not suitable for micromachining. In addition, there is a need to replace a corresponding condenser lens according to the size of the wafer. Dividing processing can be performed by dividing up to 2 times when processing 200mm wafer using scanner with maximum scanning distance of 106mm. Further, the further away from the center of the wafer, the more processing is possible without division. In this way, a 300mm wafer can be processed up to three divisions, two divisions as it moves away from the center line, and an outer part without division.

Through experiments, a UV laser beam with a wavelength of 355 nm was incident on a condenser lens with a diameter of 6 mm and a focal length of 110 mm, and a silicon wafer having a thickness of 125 µm was cut by a multi-irradiation method with a scanning distance of 100 mm. A cut width of up to 20 μm was obtained. In addition, it was confirmed that a silicon wafer having a diameter of 100 mm or less can obtain a sufficiently narrow cut width even when the wafer is cut by adjusting only the scanning angle without dividing.

According to the present invention described above, there is no need to improve the movement accuracy of the transfer device 30, because there is no transfer of the target object during object processing, there is an advantage that the manufacturing cost of the transfer device can be lowered. It is also possible to change the machining parameters in accordance with the machining depth during machining. That is, in the hybrid method for transferring the conveying device during the processing of the object, processing occurs in two places in the laser beam irradiation direction and the depth direction, but the machining parameters cannot be changed during the machining. Since the processing is performed at a constant depth in the section, it is possible to change the parameters such as the irradiation speed, laser output size, etc. according to the depth to be processed, or when the object to be processed has a laminated structure of a plurality of materials (type of oxide film, Parameters may be appropriately changed depending on the metal layer, surface coating layer, etc.).

According to the experimental results, it is preferable that the oxide film of the uppermost layer of the wafer is scanned at high speed with low laser power, and the metal layer is cut at low speed with high power, and cut by slow scanning at high power as the cutting depth of the object becomes deeper. It was confirmed that the quality is improved.

As described above, the present invention removes a portion of the laser beam by melting, vaporizing, and sublimating each time by irradiating the laser beam reciprocally using a scanner, that is, by multi-irradiation, and suitable for the depth to reach the desired depth. Can increase the number of surveys. The thickness of the layer removed at each irradiation can be adjusted by varying the laser power, frequency or scanning speed, and the depth adjustment can be precisely controlled by controlling the amount of removal removed.

In addition, when the object is a wafer, since the wafer may have a structure having different physical properties depending on the depth direction, the processing parameters may be changed to suit the corresponding layer, and thus efficient processing may be performed. In addition, if the volume removed during irradiation is small, residues can be efficiently removed to obtain good processing results with excellent cutting surface quality and no thermal damage.

5 is a structural diagram of a laser processing apparatus according to a second embodiment of the present invention.

In the present embodiment, the shielding means 260 for solving the processing nonuniformity of the object at the return point of rotation of the rotating mirror and preventing the laser beam from being irradiated to the non-processed area during the processing of the large-area object includes the rotating mirror 230 and the condenser lens. The case where it is installed between 250 is shown.

As shown in FIG. 5, the laser processing apparatus according to the present embodiment includes, in addition to the laser processing apparatus shown in FIG. 1, shielding provided between the rotating mirror 230 and the condenser lens 250 of the beam scanner 220. Means 260 are further included. The beam reflected from the rotating mirror 230 is shielded by the shielding means 260 in a non-constant interval, and only the beam of the constant speed section is incident on the condenser lens 250.

By introducing the shielding means, it is possible to prevent the laser beam from being excessively scanned at the object at the return point of rotation of the actuator, thereby improving processing uniformity.

6 is a structural diagram of a laser processing apparatus according to a third embodiment of the present invention.

In the present embodiment, when the laser beam is irradiated to the processing region of the object 50, the laser beam is formed into an elliptic shape and irradiated, and in particular, the laser beam is controlled so that the long axis and the processing direction of the elliptic laser beam coincide with each other. To this end, in addition to the laser processing apparatus shown in FIG. 1, the laser processing apparatus according to the present embodiment is provided between the rotating mirror 230 and the condenser lens 250 of the beam scanner 20, or the condenser lens 250 and the object ( It further comprises a shaping lens 270 provided between 50). The size of the laser beam molded into the ellipse shape by the shaping lens 270 can be changed by adjusting the height of the shaping lens 270.

In general, the frequency of the laser beam used for processing the object is 100 Hz or less, and the size of the focus is set to 10 µm or less to minimize the cutting width. In the case of processing the object in this way, the linear velocity irradiated without the focal point and the focal point is calculated as 1 m per second. If the laser beam is irradiated at a faster speed than this, the focal point and the focal point are discontinuous lines, so the maximum irradiation speed should be controlled not to exceed 1m per second. However, in order to reduce the amount of heat input and to increase the resolution of the cutting depth, it is desirable to process the object at a faster scanning speed. To this end, a method of forming the shape of a laser beam into an ellipse is proposed. At this time, the long axis of the ellipse is controlled to match the machining direction.

The shaping lens 270 may be implemented using a cylindrical lens, and in this case, a circular laser beam cross section is formed in an elliptical shape.

For example, when the long axis is enlarged to 20 μm, the scanning speed may be increased to 2 m per second. At this time, the amount of heat applied in each scan is halved, so that the processing depth is correspondingly reduced. Thereby, the resolution of cutting depth can be improved and it can prevent that a cut surface is processed into an uneven | corrugated shape.

As such, those skilled in the art will appreciate that the present invention can be implemented in other specific forms without changing the technical spirit or essential features thereof. Therefore, the above-described embodiments are to be understood as illustrative in all respects and not as restrictive. The scope of the present invention is shown by the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

According to the present invention, when processing various objects, that is, wafers, glass, polymers, and composites using a laser, such as cutting, grooving, etc., the laser beam can be multi-radiated in a straight line by a rotating mirror to improve processing quality. In addition, since the object is not transferred during the object processing, the manufacturing cost of the apparatus can be lowered, and the parameter can be changed according to the processing purpose even during the processing, so that the object can be processed more easily.

In addition, by irradiating the laser beam with the rotating mirror, by preventing the laser beam from being irradiated excessively at the rotational return point, processing uniformity can be improved, and when the laser beam is formed into an elliptical shape and processed at high speed with low energy Machining is possible and the resolution of the cutting depth can be improved.

Claims (15)

A control unit for storing processing parameters; A laser generator for emitting a laser beam under the control of the controller; A driver driven by the control of the controller; An actuator reciprocatingly rotated by the driver; A rotating mirror attached to the actuator and configured to reflect a laser beam emitted from the laser generator; A condenser lens for condensing a laser beam reflected from the rotating mirror; And A conveying means controlled by a controller, the object being seated and maintaining a fixed state when the laser beam is emitted; Wherein the maximum scanning distance of the laser beam is determined by the rotation angle of the actuator, and the scanning distance is controlled to have a distance longer than the maximum machining schedule of the object. The method of claim 1, The laser processing apparatus further includes at least one shielding means provided between the rotating mirror and the condenser lens or between the condenser lens and the object to mask a portion of the object to be processed by the laser beam. Laser processing device characterized in that. The method of claim 1, The laser processing apparatus further comprises a shaping lens provided between the rotating mirror and the condenser lens or between the condenser lens and the object. The method of claim 3, wherein The shaping lens is configured to shape the cross section of the laser beam into an elliptic shape, wherein the long axis of the ellipse is controlled to coincide with the processing direction of the object. The method of claim 1, The laser processing apparatus includes shielding means provided between the rotating mirror and the condenser lens or between the condenser lens and the object; And a shaping lens for shaping the shape of the laser beam passing through the shielding means. The method of claim 5, The shaping lens is configured to shape the cross section of the laser beam into an elliptic shape, wherein the long axis of the ellipse is controlled to coincide with the processing direction of the object. The method of claim 1, The control unit stores a processing parameter including a laser output size, frequency, irradiation speed, processing area, processing length, processing depth for processing the object, and wherein the parameter can be changed during processing of the object. Laser processing device. The method of claim 1, The laser processing apparatus is provided between the rotating mirror and the condensing lens or between the condensing lens and the object, and when the maximum scanning distance of the laser beam is smaller than the processing object length of the object, the unprocessed portion of the object Masking, After the exposed part of the object is first processed, while the emission of the laser beam is stopped, the object is transferred by the transfer device so that the first processed part is masked. And at least one shielding means for exposing the non-machined portion that has been masked so that secondary processing is performed by the laser beam. The method of claim 1, When there are a plurality of processing sites on the object, the transfer device temporarily stops the emission of the laser beam under the control of the controller to process another processing site of the object after the processing site of the object is processed. In the state, the laser processing apparatus, characterized in that for transporting the object so that the other processing portion of the object is exposed to the laser beam. The method of claim 1, And a beam scanner composed of the driver, the actuator, the rotation mirror, and the condenser lens is movable up and down. In the method of processing the object using a laser, Setting parameters for processing the object; Mounting the object on a transfer device; Emitting a laser beam; Reflecting the laser beam using a rotating mirror attached to an actuator reciprocating the emitted laser beam, condensing the reflected beam and irradiating the object with an object; Determining whether the object processing is completed; Determining whether to transport the object when the object processing is completed; Stopping emission of the laser beam when the object needs to be transferred; And Returning to the step of emitting the laser beam after transporting the object by the transport device; Laser processing method comprising a. The method of claim 11, The parameters include laser beam output size, frequency, actuator rotation angle, rotation speed, desired machining area, processing length, depth of processing. The method of claim 11, When the object transfer is necessary, the laser processing method characterized in that the scanning distance of the laser beam is smaller than the processing length of the object. The method of claim 11, When the object transfer is necessary, the laser processing method, characterized in that a plurality of processing sites exist in the object. The method of claim 11, If the maximum scanning distance of the laser beam is smaller than the processing object length of the object, the laser beam is emitted after masking the non-processed portion of the object before placing the object in a transport apparatus and emitting the laser beam. Primary processing the object, If transfer of the object is necessary, the laser beam is stopped and the object is transported by the transfer device, and then the unprocessed portion of the object is exposed before returning to the step of emitting the laser beam. And after masking the primary processing site, emitting the laser beam to perform secondary processing.

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