201237603 六、發明說明： 【發明所屬之技術領域】 _]本發明涉及電腦領域，尤其涉及—種翻安裝於不同型 號主板並具較佳散熱效率的散熱裝置。 [先前技術】 [〇_在先前技術中，為解決_的散熱問題，通常於發熱元 件上安裝散_組，以將賴元件，如epu(巾央處理器） 所產生的熱量通過散熱模組導出。散熱模組通常由風扇 及散熱片組成，其中，風扇藉由螺釘固定在散熱片上， 散熱片底部與發熱元件相贴合，發熱元件工作時所產生 的熱量料至㈣;ί ’再通租騎散科界。在先前 技術中，為了利於散熱，即CPU所散發的熱量可快速地傳 導至散熱片上進行散熱’要求當散熱片固定在主板上時 ，該散熱片可以與CPU充分貼合，否則可能造成cpu散熱 不良，嚴重的話導致CPU因過熱而損壞。 剛目前的散熱4上通常開設有Μ孔，組裝時，利用固定 〇 元件，如螺釘等穿過固定孔並鎖緊在電路板，如電腦主 板（main board)的安裝孔内，從而將散熱片固定在主板 上。 [0004] 惟’對於不同型號的主板，例如具有不同尺寸大小及配 置的主板’其安裝孔的設置位置及數量也通常不同，在 這種情況下’為了使散熱片可以穩固在某一特定型號的 主板上且與該主板上的CPU充分貼合’通常需要對應設計 及製造一種與該主板相匹配的散熱片，具體要求係該散 熱片上的固定孔的設置位置及數量與主板上的安裝孔的 100108437 表單編號A0101 第5頁/共22頁 1002014309-0 201237603 設置位置及數量相對應且相匹配，因此造成同一散熱片 無法適用在不同型號的主板上，即不同型號主板無法兼 容同一散熱片，不同的主板需要更換不同的散熱片，造 成製造成本提高和資源的浪費。 【發明内容】 [0005] 有鑒於此，提供一種可適用安裝於不同型號主板並具較 佳散熱效率的散熱裝置實有必要。 [0006] —種散熱裝置，包括一散熱元件、至少一固持臂、至少 一固定單元、至少一第一固定元件、以及至少一第二固 定元件。該散熱元件設置在一電路板上，該電路板具有 一安裝面，該安裝面上開設至少一安裝孔。該至少一固 持臂固定在該散熱元件上，且該至少一固持臂開設一滑 槽及一與該滑槽相貫通的第一固定槽。該至少一固定單 元包括一滑臂及一與該滑臂相連接的固定臂，該滑臂上 開設一收容槽及一與該收容槽相貫通的第二固定槽，該 固定臂上開設一第三固定槽，該滑臂設置在該滑槽内且 可沿該滑槽滑動以使該第三固定槽與該至少一安裝孔相 對準並使該第一固定槽與該第二固定槽相連通。該至少 一第一固定元件穿過該第三固定槽並鎖入該至少一安裝 孔，以將該固定臂固定在該電路板上。該至少一第二固 定元件穿過該第一固定槽及該第二固定槽並固連該滑臂 與該固持臂。 [0007] 相對於先前技術，本發明所提供的散熱裝置設置有可固 持散熱片的固持臂，該固持臂上開設有滑槽，因此可沿 該滑槽滑動滑臂，通過滑臂帶動固定臂移動使得第三固 100108437 表單編號A0101 第6頁/共22頁 1002014309-0 201237603 ❹ [0008] [0009] O' [0010] 定槽與安裝孔相對準，並通過第一固定元件穿過第三固 定槽並鎖入安裝孔而將該固定臂固定在電路板上。另， 在滑動滑臂的過程中，該第一固定槽及該第二固定槽可 相連通，因此可通過第二固定元件穿過相連通的第二固 定槽及第三固定槽而固連該滑臂與該固持臂，從而達到 將散熱元件固定在電路板上的目的。應用時，可先固定 散熱元件的位置，使得散熱元件與電路板，如主板上的 發熱元件，如CPU充分貼合，再通過第一、第二固定元件 相結合將散熱元件固定在電路板上。所述散熱裝置可適 用安裝在不同型號的主板上，以充分地對CPU進行散熱， 從而防止CPU因過熱而損壞。 【實施方式】 下面將結合具體實施例，以對本發明作進一步詳細說明 〇 請參閱圖1及圖2，本發明實施例提供一種散熱裝置100， 其用於對一設置在電路板200上的發熱元件25進行散熱。 如圖1所示，該散熱裝置100包括一散熱元件10、兩個固 持臂30、兩個固定單元50、多個第一固定元件70、以及 多個第二固定元件90。 請一起參閱圖2及圖3，本實施例中，該電路板200可為一 電腦主板（main board)，且該電路板200具有一安裝面 200A，該發熱元件25設置在該安裝面200A的中心部分， 其可具體為一CPU。該電路板200具有四個開設在該安裝 面200A上的安裝孔20，該四個安裝孔20分佈在該發熱元 件25的相對兩侧。 100108437 表單編號A0101 第7頁/共22頁 1002014309-0 201237603 [0011] 如圖3所示’該散熱元件10設置在該發熱元件25上。具體 地’該散熱元件1〇包括一與該發熱元件25相貼合的基板 10A、以及多個由該基板10A向遠離該發熱元件25的一侧 延伸出來的散熱鰭片10B。本實施例中，該多個散熱鰭片 10B相互平行設置。 [0012] 該兩個固持臂30位於該散熱元件1〇相對的兩侧並固定在 該散熱元件10上。具體地，該兩個固持臂3〇可通過固定 元件，如螺釘等固定在散熱鰭片1抑上，也可通過膠水緊 貼在散熱鰭片10B上。當然，該兩個固持臂3〇也可與該散 熱元件10 —體成形，從而無需分開製造散熱元件1〇及固 持臂3 0，便於散熱裝置1 〇 〇的组裝。在其他變更實施例中 ，該固持臂30的個數也可為其他數目，如三個、四個等 ’並不局限於本實施例所示出的兩個的實施方式。 [0013] 本實施例中，該兩個固持臂30分別為長條狀且具有方形 截面’且分別包括一遠離該電路板2〇〇的第一頂面3〇A、 以及兩個連接該第一頂面3〇A且分別位於該固持臂3〇相對 兩側的端面30B (詳見圖1)、以及一連接該第一頂面3〇A 且遠離該散熱元件10的第一側面3〇c，其中’該第一側面 30C位於該兩個端面30B之間且分別連接該兩個端面3〇b 另^亥固持130具有一開設在該第一頂面3qa上的滑槽 31，該滑槽31遠離該散熱元件10的一側具有一第一側壁 310，該固持臂30的第一側壁310上開設—第一固定槽32 。其中，該滑槽31沿該固持臂30的長度方向延伸且貫穿 該固持臂30的兩個端面3〇b，該第一固定槽32貫穿該固持 臂30的第一側面30C。本實施例中，該兩個滑槽31相互平 100108437 表單編號A0101 第8頁/共22頁 1002014309-0 201237603 [0014] Ο201237603 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to the field of computers, and more particularly to a heat sink device that is mounted on different types of motherboards and has better heat dissipation efficiency. [Prior Art] [〇 In the prior art, in order to solve the problem of heat dissipation, a heat pack is usually mounted on a heat generating component to pass heat generated by a component such as an epu (heat sink) through a heat dissipation module. Export. The heat dissipation module is usually composed of a fan and a heat sink. The fan is fixed on the heat sink by screws, and the bottom of the heat sink is attached to the heat generating component, and the heat generated when the heat generating component works is (4); Scattered circles. In the prior art, in order to facilitate heat dissipation, the heat dissipated by the CPU can be quickly transmitted to the heat sink for heat dissipation. When the heat sink is fixed on the motherboard, the heat sink can be fully fitted with the CPU, otherwise the CPU may be cooled. Bad, serious, causing the CPU to be damaged due to overheating. The current heat sink 4 is usually provided with a boring hole. When assembling, the fixing 〇 element, such as a screw, is passed through the fixing hole and locked in a circuit board, such as a mounting hole of a main board, thereby dissipating the heat sink. Fixed to the motherboard. [0004] However, for different types of motherboards, such as motherboards with different sizes and configurations, the mounting positions and the number of mounting holes are usually different. In this case, 'in order to make the heat sink stable to a specific model. The motherboard is fully attached to the CPU on the motherboard. It is usually necessary to design and manufacture a heat sink that matches the motherboard. The specific requirements are the location and number of fixing holes on the heat sink and the mounting holes on the motherboard. 100108437 Form No. A0101 Page 5 of 22 1002014309-0 201237603 The setting position and quantity are corresponding and matched, so the same heat sink cannot be applied to different types of motherboards, that is, different models cannot be compatible with the same heat sink. Different motherboards need to be replaced with different heat sinks, resulting in increased manufacturing costs and waste of resources. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide a heat sink that can be installed on different types of motherboards and has better heat dissipation efficiency. A heat sink includes a heat dissipating component, at least one retaining arm, at least one securing unit, at least one first securing component, and at least one second securing component. The heat dissipating component is disposed on a circuit board having a mounting surface on which at least one mounting hole is defined. The at least one holding arm is fixed on the heat dissipating component, and the at least one retaining arm defines a sliding slot and a first fixing slot extending through the sliding slot. The at least one fixing unit includes a sliding arm and a fixing arm connected to the sliding arm. The sliding arm defines a receiving slot and a second fixing slot extending through the receiving slot. a fixing slot, the sliding arm is disposed in the sliding slot and slidable along the sliding slot to align the third fixing slot with the at least one mounting hole and connect the first fixing slot to the second fixing slot . The at least one first fixing member passes through the third fixing groove and is locked into the at least one mounting hole to fix the fixing arm to the circuit board. The at least one second fixing member passes through the first fixing groove and the second fixing groove and fixes the sliding arm and the holding arm. Compared with the prior art, the heat dissipating device provided by the present invention is provided with a holding arm capable of holding a heat sink, and the sliding arm is provided with a sliding slot, so that the sliding arm can be slid along the sliding slot, and the fixed arm is driven by the sliding arm Move makes the third solid 100108437 Form No. A0101 Page 6 / Total 22 Page 1002014309-0 201237603 ❹ [0008] [0009] O' [0010] The grooving is aligned with the mounting hole and passes through the third through the first fixing element Secure the slot and lock into the mounting hole to secure the mounting arm to the board. In addition, during the sliding of the sliding arm, the first fixing slot and the second fixing slot can communicate with each other, so that the second fixing component can be connected through the second fixing slot and the third fixing slot that are connected to each other. The sliding arm and the holding arm achieve the purpose of fixing the heat dissipating component on the circuit board. In application, the position of the heat dissipating component can be fixed first, so that the heat dissipating component and the circuit board, such as a heating component on the main board, such as a CPU, are fully fitted, and then the heat dissipating component is fixed on the circuit board by combining the first and second fixing components. . The heat sink can be installed on different types of motherboards to fully dissipate heat from the CPU, thereby preventing the CPU from being damaged due to overheating. The embodiments of the present invention will be further described in detail with reference to the specific embodiments. Referring to FIG. 1 and FIG. 2, an embodiment of the present invention provides a heat dissipating device 100 for heating a circuit board 200. Element 25 performs heat dissipation. As shown in Fig. 1, the heat sink 100 includes a heat dissipating member 10, two holding arms 30, two fixing units 50, a plurality of first fixing members 70, and a plurality of second fixing members 90. Referring to FIG. 2 and FIG. 3 together, in the embodiment, the circuit board 200 can be a main board, and the circuit board 200 has a mounting surface 200A. The heating element 25 is disposed on the mounting surface 200A. The central part, which may be specifically a CPU. The circuit board 200 has four mounting holes 20 formed in the mounting surface 200A, and the four mounting holes 20 are distributed on opposite sides of the heat generating component 25. 100108437 Form No. A0101 Page 7 of 22 1002014309-0 201237603 [0011] As shown in FIG. 3, the heat dissipating member 10 is disposed on the heat generating component 25. Specifically, the heat dissipating component 1 includes a substrate 10A that is bonded to the heat generating component 25, and a plurality of heat dissipating fins 10B extending from the substrate 10A toward a side away from the heat generating component 25. In this embodiment, the plurality of heat dissipation fins 10B are disposed in parallel with each other. [0012] The two holding arms 30 are located on opposite sides of the heat dissipating component 1 and are fixed on the heat dissipating component 10. Specifically, the two holding arms 3 can be fixed to the heat radiating fins 1 by fixing members such as screws, or can be adhered to the heat radiating fins 10B by glue. Of course, the two holding arms 3 can also be integrally formed with the heat dissipating member 10, so that it is not necessary to separately manufacture the heat dissipating member 1 and the holding arm 30 to facilitate the assembly of the heat dissipating device 1 . In other modified embodiments, the number of the holding arms 30 may be other numbers, such as three, four, etc., and is not limited to the two embodiments shown in the embodiment. [0013] In this embodiment, the two holding arms 30 are respectively elongated and have a square cross section 'and respectively include a first top surface 3A away from the circuit board 2〇〇, and two connecting the first An end surface 30B of a top surface 3A and opposite sides of the holding arm 3〇 (see FIG. 1 for details), and a first side surface 3 connected to the first top surface 3A and away from the heat dissipating component 10 c, wherein the first side 30C is located between the two end faces 30B and is respectively connected to the two end faces 3〇b. The other retaining body 130 has a sliding slot 31 opened on the first top surface 3qa, the sliding A first side wall 310 is defined on a side of the slot 31 away from the heat dissipating component 10. The first side wall 310 of the holding arm 30 defines a first fixing slot 32. The sliding slot 31 extends along the longitudinal direction of the holding arm 30 and penetrates the two end faces 3〇b of the holding arm 30. The first fixing slot 32 extends through the first side surface 30C of the holding arm 30. In this embodiment, the two chutes 31 are flat with each other. 100108437 Form No. A0101 Page 8 of 22 1002014309-0 201237603 [0014] Ο
[0015] 行，另，該滑槽31及該第一固定槽32分別為一方形槽。 在其他變更實施方式中，該滑槽31可為υ形槽等，該第_ 固疋槽32可為擴圓形槽等，該滑槽31與該第一固定样& 的形狀並不局限於具體實施例。 該兩個固定單元50分別包括一滑臂51、以及一與該滑臂 51相連接的固定臂52。該滑臂51為長條狀且具有方形戴 面，並與該滑槽31相適配，從而可設置在該滑槽31内並 沿該滑槽31滑動。本實施例中，該滑臂51包括一遠離該 電路板200的第二頂面51A、以及一連接該第二頂面51Α ，遠離該散熱鰭片10B且▲遞該第一側壁3l〇 (或與該第 一侧壁310松接觸）的第二侧面51〇另、如圖1所示，該 滑臂51具有一開設在該第二頂面ha上的收容槽511，該 收容槽511遠離該散熱元件1 〇的一侧具有，第二側壁 511 0，該第二側壁511 〇上開設一第二固定槽5 J 2，其中 ，該收容槽511沿該滑臂51的長度方向延伸但未貫穿該滑 臂51的兩個端面（未標示）？該第二囪定橹512貫穿該滑臂 51的第二側面51C。 該固定臂52的一端與該滑臂51的一端相連接，本實施例 中，該固定臂52與該滑臂51相垂直且相結合形成“l”型 結構。該滑臂51與該固定臂52分別平行於該電路板2〇〇的 安裝面200A，當該滑臂51沿該滑槽31滑動時，其帶動該 固定臂52沿靠近或遠離該散熱元件1〇的方向移動。可理 解’在其他變更實施方式中’該固定臂52可相對該滑臂 51傾斜並與該滑臂51形成銳角或鈍角，以使該滑臂51沿 該滑槽31滑動時可帶動該固定臂52沿靠近或遠離該散熱 100108437 表單編號A0101 第9頁/共22頁 1002014309-0 201237603 元件ίο的方向移動為宜，並不局限於具體實施例。另， 該固定單元50的數目以與該固持臂3〇相等為宜，本實施 例中，該兩個固定單元50的兩個滑臂51分別設置在該兩 個滑槽31内且分別沿該兩個滑槽3丨滑動，該兩個固定臂 5 2位於該散熱元件I 〇相對的兩側且分別與該電路板2 〇 〇上 的多個安裝孔20相對。在其他變更方式中，該固定單元 50與該固持臂30的個數也可為其他數目，如三個、四個 等’並不局限於具體實施例。 [0016]如圖3所示，該固定臂52包括一遠離該安裝面200A的第三 頂面52A及一鄰近該安裝面2〇〇A的底面52B，且該固定臂 52具有一開设在該第三頂面ha上的第三固定槽hi。該 第三固定槽521沿該固定臂52的長度方向延伸但未貫穿該 固定臂52的兩個端面（即該固定臂52的長度方向的兩端的 端面，未標示），且該第三固定槽521貫穿該固定臂52的 底面52B。 刪請進-步參閱圖4,該多個第-固定元件7()用於將該兩個 固定臂52分別固定在該電路板_上，該多個第二固定元 件9 0用於固連該兩個滑臂51與該兩個固持臂3 〇，其中， 該第-㈣元件7G包括-第-螺栓71及—與該第1螺栓 71相適配的第一螺母72(詳見圖3)，該第二固定元件⑽ 包括一第二螺栓91及一與該第二螺检91相適配的第二螺 母92 (詳見圖4)。 [0018] 100108437 本實施例中’該第一固定元件7〇及該第二固定元件⑽的 個數分別為四個，可理解，該第一固定元件7〇及該第二 固定元件90的個數可根據實際使用需要進行選擇，以可 表單編號A0101 第10頁/共22頁 ' 1002014309-0 201237603 將該兩個固定臂52穩固在該電路板200上，或仫雜 八1承穩定固、4 該兩個滑臂51與該兩個固持臂3〇為宜，並不局限' 哫 實施例。 、 體 [0019] 女裝忒散熱裝置100時，可先固定散熱元件1〇的位置 得散熱元件10的基板10Α與電路板200上的發熱元 使 分貼合，具體地，可在該發熱元件25上塗布導熱膠充 將該基板10Α設置在該發熱元件25，通過該導熱膠 發熱元件25與該基板ι〇Α。 接°亥 0 [0020] Ο 接著，滑動該滑臂51使其沿收容該滑臂51的滑槽3丨说動 ，通過滑臂51帶動固定臂52移動使得該固定臂52上的第 三固定槽521與該電路板2〇〇上的安裝孔2〇相對準。本 施例中，當該兩個滑臂51分別沿該兩個滑槽31滑動時實 其分別帶動該兩個固定臂5 2沿鄰近或遠離該散熱元件1 〇 的方向移動，在移動過程中，該兩個固定臂52上閉执的 兩個第三固定槽521可分別與該電路板2〇〇上的四個安裝 孔20相對準，且當該兩個竿三固定槽^21分別與該四個二 裝孔20相對準時，該兩個滑臂51上的兩個第二固定槽5 = 分別與該兩個固持臂30上的兩個第一固定槽32分別/目連 12 通（詳見圖4)。此時，可由垂直該安裝面2〇〇Α的方向將詼 四個第一螺栓71分別穿過該兩個第三固定槽521及該四2 安裝孔20並分別鎖緊在該四個第一螺母72 (該四個第一 蟫母72位於該電路板2〇〇遠離該兩個固定單元5〇的—侧） 上，從而將該兩個固定臂52分別固定在該電路板上。 本實施例中，如圖3所示，該散熱裝置1〇〇可進一步包括 一用於支撐該電路板2〇〇的支撐板94，該支撐板94為方妒 100108437 表單編號Α0101 第11頁/共22頁 ^02014309-0 201237603 中空板狀’具體包括一收容孔940(詳見圖5)及一環繞該 收容孔940的邊框942，該收容孔940可為方槽或圓槽， 該邊框942可為對應該凹槽形狀的方形邊框或圓形邊框。 使用時’將該支撐板94設置在該電路板200遠離該兩個固 定單元50 —側，該四個第一螺栓71可分別穿過該兩個第 二固定槽521及該四個安裝孔20，並暴露在該支撐板94的 收容孔9 4 0外。此時，該四個第一螺母7 2可分別鎖緊在該 支撐板94遠離該電路板2〇〇的一侧並沿鄰近該電路板2〇〇 的方向抵壓該支稽板94的方形邊框，從而使該支樓板94 抵靠在該電路板200上。通過該支撐板94可使得該第一固 定元件70的固持力分散作用在該電路板200上，防止該電 路板200因受力不均而發生翹曲變形。 [0021] 進一步地，如圖4及圖5所示，由平行該安裝面200A的方 向將該四個第二螺栓91分別穿過該兩個第一固定槽32及 與其對應的兩個第二固定槽512，並進一步分別鎖緊在該 四個笫二螺母92上，從而固連該兩個滑臂51與該兩個固 持臂30。本實施例中’該四僻第二螺母92可分別收容在 該兩個收容槽511内，每個收容槽511收容兩個第二螺母 [0022] 由於可先固定散熱元件1〇的位置，使得散熱元件10與電 路板200上的發熱元件25充分貼合後，通過在電路板2〇〇 上的鄰近或遠離散熱元件10的一定位置範圍内移動固定 臂52，並利用可沿第三固定槽521長度方向移動的第一固 定元件70將固定臂52固定在電路板200上，進而利用可沿 相連通的第一固定槽32及第二固定槽512的長度方向移動 100108437 表單編號A0101 第12頁/共22頁 1002014309-0 201237603 [0023] Ο [0024] Ο [0025] [0026] [0027] [0028] [0029] 的第二固定元件90將散熱元件1〇固定在電路板200上，因 此，该散熱裝置1〇〇可適用於安裝孔2〇在不同位置的不同 型號的主板，當該散熱裝置1〇〇安裝在該主板上時，其可 充分地對主板上的CPU進行散熱，從而防止CPU因過熱而 損壞。 另，如圖5所示，該散熱裝置1〇〇還可包括一風扇96 ,並 可將該風扇96鄰近該散熱元件1〇設置，以通過該風扇將 散熱鰭片10B表面上的熱量吹散至空氣中，從而提高散熱 裝置100的散熱效率。本實施例中，:如圖5所示，該風扇 96可通過四個第三固定元件98固定於散無鰭片ι〇Β上’該 四個第三固定元件98具體可分別為一鏍釘。 綜上所述，本發明確已符合發明專利的要件，遂依法提 出專利申請。惟’以上所述者僅為本發明的較佳實施方 式’自不能以此限制本案的申請專利範圍β舉凡熟悉本 案技藝的人士援依本發明的精神所作的等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明實施例提供的散熱裝置安裝於主板上的俯視 示意圖。 圖2係圖1所示的主板的俯視示意圖。 圖3係圖1所示散熱裝置及主板的正視示意圖。 圖4係圖1所示散熱裝置及主板的左視示意圖。 圖5係圖1所示散熱裝置及主板沿V-v線的剖面示意圖。 100108437 表單編號Α0101 第13頁/共22頁 1002014309-0 201237603 【主要元件符號說明】 [0030] 散熱裝置：100 [0031] 電路板：200 [0032] 散熱元件：10 [0033] 安裝孔：20 [0034] 發熱元件：25 [0035] 固持臂：30 [0036] 滑槽：31 [0037] 固定單元：50 [0038] 滑臂：51 [0039] 固定臂：52 [0040] 第一固定元件：70 [0041] 第二固定元件：90 [0042] 第三固定元件：98 [0043] 基板：10A [0044] 散熱鰭片：10B [0045] 第一頂面：30A [0046] 端面：30B [0047] 第一側面：30C [0048] 第一側壁：31 0 100108437 表單編號A0101 第14頁/共22頁 1002014309-0 201237603 [0049]第二側壁：5110 [0050] 第二頂面：51Α [0051] 第二侧面：51C [0052] 收容槽：511 [0053] 第三頂面：52Α [0054] 底面：52Β [0055] 第一固定槽：32 〇 [0056] 第二固定槽：512 [0057] 第三固定槽：521 [0058] 第一螺栓：71 [0059] 第一螺母：72 [0060] 第二螺栓：91 [0061] 第二螺母：92 [0062] 支撐板：94 [0063] 收容孔：940 [0064] 邊框：942 [0065] 風扇：9 6 100108437 表單編號Α0101 第15頁/共22頁 1002014309-0[0015] In addition, the sliding slot 31 and the first fixing slot 32 are respectively a square slot. In other modified embodiments, the chute 31 may be a serpentine groove or the like, and the first solid groove 32 may be an expanded circular groove or the like, and the shape of the sliding groove 31 and the first fixed sample & Limited to specific embodiments. The two fixing units 50 respectively include a sliding arm 51 and a fixing arm 52 connected to the sliding arm 51. The sliding arm 51 is elongated and has a square surface and is adapted to the sliding groove 31 so as to be disposed in the sliding groove 31 and slide along the sliding groove 31. In this embodiment, the sliding arm 51 includes a second top surface 51A away from the circuit board 200, and a second top surface 51A connected to the heat dissipation fin 10B and ▲ the first side wall 31b (or The second side 51 of the first side wall 310 is in contact with the first side wall 310. The sliding arm 51 has a receiving groove 511 formed on the second top surface ha. The receiving slot 511 is away from the second side surface 51. The second side wall 511 0 has a second side wall 511 0 . The second side wall 511 defines a second fixing groove 5 J 2 . The receiving groove 511 extends along the length of the sliding arm 51 but does not penetrate. The two end faces of the sliding arm 51 (not shown)? The second chimney 512 extends through the second side 51C of the slide arm 51. One end of the fixed arm 52 is connected to one end of the sliding arm 51. In this embodiment, the fixed arm 52 is perpendicular to the sliding arm 51 and combined to form an "l" type structure. The sliding arm 51 and the fixing arm 52 are respectively parallel to the mounting surface 200A of the circuit board 2 . When the sliding arm 51 slides along the sliding slot 31 , the sliding arm 51 drives the fixing arm 52 to move toward or away from the heat dissipating component 1 . Move in the direction of 〇. It can be understood that in other modified embodiments, the fixed arm 52 can be inclined with respect to the sliding arm 51 and form an acute or obtuse angle with the sliding arm 51 so that the sliding arm 51 can drive the fixed arm when sliding along the sliding slot 31. 52 moves along or away from the heat dissipation 100108437 Form No. A0101 Page 9 / Total 22 pages 1002014309-0 201237603 The direction of the element ίο is preferably not limited to the specific embodiment. In addition, the number of the fixing units 50 is equal to the holding arm 3〇. In this embodiment, the two sliding arms 51 of the two fixing units 50 are respectively disposed in the two sliding slots 31 and respectively along the The two sliding slots 3 are slid, and the two fixing arms 52 are located on opposite sides of the heat dissipating component I 且 and are respectively opposite to the plurality of mounting holes 20 on the circuit board 2 . In other variations, the number of the fixed unit 50 and the holding arm 30 may be other numbers, such as three, four, etc., and is not limited to the specific embodiment. As shown in FIG. 3, the fixing arm 52 includes a third top surface 52A away from the mounting surface 200A and a bottom surface 52B adjacent to the mounting surface 2A, and the fixing arm 52 has a a third fixing groove hi on the third top surface ha. The third fixing groove 521 extends along the longitudinal direction of the fixing arm 52 but does not penetrate the two end faces of the fixing arm 52 (ie, the end faces of the two ends of the fixing arm 52 in the longitudinal direction, not shown), and the third fixing groove The 521 extends through the bottom surface 52B of the fixed arm 52. Referring to FIG. 4, the plurality of first fixing members 7 () are used to fix the two fixing arms 52 to the circuit board, respectively, and the plurality of second fixing members 90 are used for fixing The two sliding arms 51 and the two holding arms 3 〇, wherein the first (four) element 7G includes a -th bolt 71 and a first nut 72 adapted to the first bolt 71 (see FIG. 3). The second fixing member (10) includes a second bolt 91 and a second nut 92 (see FIG. 4) adapted to the second screw 91. [0018] 100108437 In the present embodiment, the number of the first fixing element 7〇 and the second fixing element (10) is four, respectively, it can be understood that the first fixing element 7〇 and the second fixing element 90 are The number can be selected according to actual needs, and can be stabilized on the circuit board 200 by the form number A0101, page 10 / page 22 '1002014309-0 201237603, or the noisy eight 1 bearing stability, 4 The two sliding arms 51 and the two holding arms 3 are preferably not limited to the embodiment. When the heat sink 100 is fixed, the substrate 10 of the heat dissipating component 10 and the heat generating component on the circuit board 200 may be bonded to each other. Specifically, the heat generating component may be attached. The substrate 10 is placed on the heating element 25 by applying a thermal conductive adhesive on the 25, and the thermal conductive element 25 and the substrate are passed through the thermal conductive element. Next, the sliding arm 51 is slid to be moved along the sliding slot 3 accommodating the sliding arm 51, and the fixed arm 52 is moved by the sliding arm 51 to make the third fixing on the fixed arm 52. The slot 521 is aligned with the mounting hole 2'' on the circuit board 2''. In this embodiment, when the two sliding arms 51 respectively slide along the two sliding slots 31, they respectively drive the two fixing arms 52 to move in a direction adjacent to or away from the heat dissipating component 1 ,, during the movement. The two third fixing slots 521 that are closed on the two fixing arms 52 are respectively aligned with the four mounting holes 20 on the circuit board 2, and when the two third fixing slots 21 are respectively When the two second mounting holes 20 are relatively punctual, the two second fixing slots 5 on the two sliding arms 51 are respectively connected to the two first fixing slots 32 of the two holding arms 30. See Figure 4 for details. At this time, the four first bolts 71 can be respectively passed through the two third fixing slots 521 and the four 2 mounting holes 20 in the direction perpendicular to the mounting surface 2 并 and respectively locked to the four first A nut 72 (the four first females 72 are located on the side of the circuit board 2 away from the two fixed units 5A), thereby fixing the two fixed arms 52 to the circuit board, respectively. In this embodiment, as shown in FIG. 3, the heat sink device 1 further includes a support plate 94 for supporting the circuit board 2, the support plate 94 is square 100108437 Form No. 1010101 Page 11 / A total of 22 pages ^02014309-0 201237603 hollow plate shape 'specifically includes a receiving hole 940 (see FIG. 5) and a frame 942 surrounding the receiving hole 940, the receiving hole 940 can be a square groove or a circular groove, the frame 942 It can be a square border or a circular border that corresponds to the shape of the groove. The support plate 94 is disposed on the side of the circuit board 200 away from the two fixing units 50, and the four first bolts 71 can pass through the two second fixing slots 521 and the four mounting holes 20 respectively. And exposed to the receiving hole 94 of the support plate 94. At this time, the four first nuts 72 can be respectively locked on the side of the support plate 94 away from the circuit board 2 并 and press the square of the branch board 94 in the direction adjacent to the circuit board 2 〇〇. The frame is such that the slab 94 abuts against the circuit board 200. The support plate 94 allows the holding force of the first fixing member 70 to be dispersed on the circuit board 200, preventing the circuit board 200 from being warped and deformed due to uneven force. [0021] Further, as shown in FIG. 4 and FIG. 5, the four second bolts 91 are respectively passed through the two first fixing slots 32 and the two corresponding seconds thereof in a direction parallel to the mounting surface 200A. The fixing slots 512 are further locked to the four second nuts 92, thereby fixing the two sliding arms 51 and the two holding arms 30. In this embodiment, the four second nuts 92 can be respectively received in the two receiving slots 511, and each of the receiving slots 511 receives two second nuts. [0022] Because the position of the heat dissipating component 1 can be fixed first, After the heat dissipating component 10 is fully adhered to the heat generating component 25 on the circuit board 200, the fixing arm 52 is moved by a certain position on the circuit board 2A adjacent to or away from the heat dissipating component 10, and the third fixing slot can be utilized. The first fixing member 70 moving in the longitudinal direction 521 fixes the fixed arm 52 to the circuit board 200, and further moves 100108437 in the longitudinal direction of the first fixing groove 32 and the second fixing groove 512 which are in communication with each other. Form No. A0101 Page 12 [0023] [0028] [0029] [0029] The second fixing member 90 of the [0029] fixes the heat dissipating member 1A on the circuit board 200, thus The heat dissipating device 1 〇〇 can be applied to different types of motherboards with mounting holes 2 不同 in different positions. When the heat dissipating device 1 〇〇 is mounted on the main board, it can fully dissipate heat from the CPU on the main board, thereby Prevent the CPU from being damaged by overheatingIn addition, as shown in FIG. 5, the heat sink 1A may further include a fan 96, and the fan 96 may be disposed adjacent to the heat dissipating component 1 to blow away heat on the surface of the heat dissipating fin 10B by the fan. Into the air, thereby improving the heat dissipation efficiency of the heat sink 100. In this embodiment, as shown in FIG. 5, the fan 96 can be fixed on the non-fin sheet by four third fixing members 98. The four third fixing members 98 can be respectively a nail. . In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention. 'The patent application scope is not limited to the present invention. Any equivalent modifications or changes made by those skilled in the art to the spirit of the present invention should be covered. It is within the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top plan view showing a heat dissipating device provided on an embodiment of the present invention. 2 is a top plan view of the main board shown in FIG. 1. 3 is a front elevational view of the heat sink and the main board shown in FIG. 4 is a left side view of the heat sink and the main board shown in FIG. FIG. 5 is a cross-sectional view of the heat sink and the main board of FIG. 1 taken along line V-v. 100108437 Form No. 1010101 Page 13 of 22 1002014309-0 201237603 [Main component symbol description] [0030] Heat sink: 100 [0031] Board: 200 [0032] Heat sink: 10 [0033] Mounting hole: 20 [ 0034] Heating element: 25 [0035] Holding arm: 30 [0036] Chute: 31 [0037] Fixing unit: 50 [0038] Sliding arm: 51 [0039] Fixed arm: 52 [0040] First fixing element: 70 [0041] Second fixing element: 90 [0042] Third fixing element: 98 [0043] Substrate: 10A [0044] Heat sink fin: 10B [0045] First top surface: 30A [0046] End surface: 30B [0047] First side: 30C [0048] First side wall: 31 0 100108437 Form number A0101 Page 14 / Total 22 pages 1002014309-0 201237603 [0049] Second side wall: 5110 [0050] Second top surface: 51Α [0051] Two sides: 51C [0052] Storage groove: 511 [0053] Third top surface: 52 Α [0054] Bottom surface: 52 Β [0055] First fixing groove: 32 〇 [0056] Second fixing groove: 512 [0057] Third Fixing groove: 521 [0058] First bolt: 71 [0059] First nut: 72 [0060] Second bolt: 91 [0061] Second nut :92 [0062] Support plate: 94 [0063] Reception hole: 940 [0064] Frame: 942 [0065] Fan: 9 6 100108437 Form number Α 0101 Page 15 of 22 1002014309-0