201026211 九、發明說明： 【發明所屬之技術領域】 ^人本發明係關於一種散熱裝置、散熱系統及散熱方法， 尤係關於- _重電子元件用散熱裝置、散熱系統及散熱方法。 【先前技術】 有的電腦系統包含兩個CPU (如伺服器、工作站等設 備）’而系統廠商需要用種散熱裝置同時滿足兩個cpu的 β政熱要求，以增加散熱裝置的互換性，同時減少散熱裝置 料號，降低開發成本。 圖1不出了習知給上述電腦系統散熱的散熱系統2，該 散熱系統2包括兩個結構相同的習知散熱裝置5〇a、5〇b，分 別與上述電腦系統電路板6〇上的兩cpu (未圖示）對應設 置，該兩個散熱裝置50a、50b均包括與CPU導熱連接的導熱 基板51a、51b及複數間隔排列在導熱基板5U、51b上的散 驗熱鰭片52a、52b ’相鄰散熱鰭片52a、5北間形成熱交換通 道521a、521b，以供系統風穿過，從而散發導熱基板5U、 51b從上述兩CPU吸收的熱量。該兩個散熱裝置5〇a、5仳與 CPU的周邊元件70 —道組合成一系統風道8〇。工作過程 t，系統風沿箭頭方向在系統風道8〇中流過，先經過散熱 裝置50a ’再經過散熱裝置50b進行散熱。 然而，由於系統風先經過散熱裝置5〇a，其在與散熱裝 置50a熱交換過程中被預熱，而溫度上升，且風速由於散熱 鰭片52a的阻力也大大降低，如此，進入散熱裝置5〇b的系 201026211 統風溫度及風速等條件都比進入散㈣置5〇a的差 =狗散熱效率下降，導致麵置5〇a、心;: 了中的熱負何不均衡，當散熱裝置地的散熱性能剛剛好 4 ’散熱裝置5〇b的散熱性能勢必不足，於是 兩個cm的散熱要求了。 ^難滿足 ❺ ^對於上述散熱裝置50a、5〇b熱負荷不均的問題，目前 常用的解決方法是提高散熱裝置5〇a、5〇b的散熱性能，使 散熱裝置50b剛剛好滿足散熱要求，然而，這勢必導致散熱 裝置50a的散熱性能過剩，不能達到充分利用，並導致 裝置的製造成本顯著上升。 【發明内容】 有鑒於此，有必要提供一種能解決熱負荷不均衡問題 的散熱裝置、散熱系統及散熱方法。 一種散熱裝置，包括一導熱基板以及複數間隔排列在 該導熱基板上的散熱鰭片，相鄰散熱鰭片間形成有熱交換 ©通道，該散熱裝置還包括一與該熱交換通道並行的風通 道以及一用以控制該冷風通道通斷的導風板組件。 一種政熱系統，用來給兩熱源進行散熱，其包括分別 與該兩熱源對應的兩散熱裝置，該兩散熱裝置串聯在一系 統風道中，每一散熱裝置均包括一熱交換通道以及一與該 熱父換通道並行的冷風通道；其中，靠近所述系統風道入 風口的散熱裝置的冷風通道導通，而另一散熱裝置的冷風 通道關閉。 201026211 一種散熱方法，用來給兩熱源散熱，其包括如下步驟： (A)提供兩散熱裝置，每一散熱裝置均包含熱交換通 -道以及與邊熱交換通道並行的冷風通道； 真 (B )將上述兩散熱裝置分別安裝到所述兩發熱電子元 件上； (C) 將上述兩散熱裝置串聯到一系統風道中； (D) 將靠近所述系統風道入風口的散熱裝置的冷風通 ❹道開啟’另一散熱裝置的冷風通道關閉； (E) 提供系統風穿過所述系統風道，從而散發上述兩 熱源產生的熱量。 通過採用上述技術方案，可以利用同樣的散熱裝置來 滿足兩熱源的均衡散熱，能夠增加散熱裝置的互換性，同 時減少散熱裝置料號，降低開發成本。 【實施方式】 • 以下參照圖1至圖6，對本發明作進一步說明。 圖2及3示出了本發明一個較佳實施例中的散熱裝置 該散熱裝置10可用來散發一發熱電子元件（例:，伺 服器、工作站等設備的CPU)產生的熱量，其主要包括一 導熱基板11及複數間隔排列的散熱鰭片12。 導熱基板11呈矩形平板狀，其採用諸如鋼、鋁等導熱 性能良好的材料製成。散熱鰭片12也採用諸如銅 導、 熱性能良好的材料製成，其在本實施例中呈薄片 中安裝在導熱基板U頂面的大部分區域，另在導熱基板二 8 201026211 頂面位於散熱鰭片12的一側留出一空白區域（未標號）。 相鄰散熱鰭片12之間形成有熱交換通道121，以供冷卻風通 . 過並與散熱鰭片12進行熱交換，從而散發導熱基板11從發 .熱電子元件吸收的熱量。 導熱基板11頂面的空白區域形成一與上述熱交換通道 121並行的冷風通道122，其寬度遠大於單個熱交換通道121 的寬度，以供冷卻風在儘量少與散熱裝置10發生熱交換的 情況下通過，從而冷卻風在經過該冷風通道122之後溫度不 魯 上升或不明顯上升。 上述散熱裝置10還包括複數安裝在導熱基板11上的扣 具13，該扣具13用以實現散熱裝置10的固定，其在本實施 例中為一螺栓組件，包括一螺栓131、一套設在螺栓131上 的彈簧132以及一墊片133，螺栓131穿設在導熱基板11上的 穿孔111中。 上述散熱裝置10進一步包括一導風板組件15，該導風 ®板組件15安裝在冷風通道122中，用以控制冷風通道122的 通斷。在本實施例中，該導風板組件15是安裝在冷風通道 122内靠近入風側的扣具13上，當然，其也可以單獨安裝在 冷風通道122中的其他位置。 再參閱圖3，導風板組件15採用塑膠等具一定彈性的材 料製成，其包括一導風板151、一與導風板151連接一體的 轉軸152以及一固定在導熱基板11上與轉軸152配合的軸套 153 ° 9 201026211 導風板151在本實施例中呈矩形板狀，較佳地，其長度 與冷風通道122的寬度相等，高度與散熱鰭片12的高度相 . 等，其可在與冷風通道122垂直時，將冷風通道122關閉。 .轉轴152呈圓筒狀，其下端緣設有一接頭1521，接頭1521的 外周緣兩相對侧分別設有一倒鉤1522。軸套153也呈圓筒 狀，其由扣具13固定在導熱基板11上，使軸套153不會相對 導熱基板11轉動。軸套153的上端緣設有一套頭1531，用於 套接轉軸接頭1521。一同參照圖4，套頭1531的内壁面等間 ®距地分佈有四個與接頭倒鉤1522配合的V形卡槽1532,其中 兩個相鄰卡槽的夹角為鈍角，另兩個兩相鄰卡槽的夾角為 直角或銳角，以使轉軸152可相對軸套153在90度範圍内轉 動，並在轉動到預定位置後卡固，從而實現導風板151的擺 向設定。 可以理解的是，導風板151的作用主要是實現冷風通道 122的通斷，其並不局限於採用轉軸152與軸套153樞接的方 @式安裝在導熱基板11上，其他適合的方式也適用。 圖5示出了包括兩個散熱裝置10a、10b的散熱系統1， 該散熱系統1是用來給帶有雙發熱電子元件的電子裝置（諸 如帶有雙CPU的伺服器、工作站等設備）進行散熱，較佳 地，該兩個散熱裝置10性能參數及結構完全相同，其分別 與安裝在電子裝置電路板20上的雙發熱電子元件（未圖示） 導熱連接，並與發熱電子元件的周邊元件30—道組合成一 系統風道40。在該系統風道40中，該兩散熱裝置10a、10b 沿系統風的方向一前一後串聯，兩者的不同點是，靠近系 201026211 統風道40入風口的散熱裝置10a的導風板151a與冷風通道 122a平行，以使該冷風通道122a導通，而遠離入風口的散 - 熱裝置10b的導風板151b與冷風通道122b垂直，以使該冷風 .通道122b關閉。 一同參照圖6，上述散熱系統1在工作過程中，系統風 沿箭頭方向流動，首先進入散熱裝置l〇a，此時，由於冷風 通道122a導通，一部分系統風從該散熱裝置l〇a的熱交換通 ©道121a流過，與散熱鰭片12a進行熱交換，將散熱裝置10a 從其對應發熱電子元件上吸收的熱量帶走；而另一部分系 統風從冷風通道122a通過，並不帶走或很少帶走散熱裝置 l〇a的熱量。系統風經過散熱裝置10a以後，再進入散熱裝 置10b，此時，散熱裝置10b的冷風通道122b關閉，使系統 風全部經過其熱交換通道121b流過，與散熱鰭片12b進行熱 交換，將散熱裝置l〇b從其對應發熱電子元件上吸收的熱量 帶走，從而實現了上述電子裝置的兩個發熱電子元件的散 .熱。另外，為了提供散熱效率，可以將散熱裝置10a的冷風 通道122a正對散熱裝置10b的熱交換通道121b。 在上述散熱系統1中，由於系統風先經過散熱裝置10a 被預熱，導致進入散熱裝置10b的系統風溫度上升，系統風 的散熱性能有所下降，但由於散熱裝置10a的冷風通道122a 導通，而散熱裝置l〇b的冷風通道122b關閉，使流經散熱裝 置l〇a的熱交換通道121a的系統風之風量要小於流經散熱 裝置l〇b的熱交換通道121b的系統風之風量。如此，則可以 彌補流經散熱裝置10a的熱交換通道121 a系統風由於溫度 11 201026211 上升，在進入政熱裝置10b時散熱性能下降的問題，達到了 政熱裝置10a與散熱裝置的均衡散熱。 - 特別需要提出的是，在上述散熱系統，可以採用同 .樣的散熱裝置來滿足前後佈置的兩個發熱電子元件的均衡 散熱，能夠增加散熱裝置的互換性，同時減少散熱裝置料 號’降低開發成本。 β综上所述，本發明確已符合發明專利之要件，遂依法 ❿提出專利申請。.淮，以上所述者僅為本發明之較佳實施例， 自不此以此限制本案之中請專利範圍。舉凡熟悉本案技藝 j人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係^有驾知散熱裝置的電子裝置的立體組合圖。 圖2係本發明一個較佳實施例中散熱裝置的立體組合 圖。 _ 圖3係圖2中散熱裝置的立體分解圖。 圖4係圖2中導風板組件中轉軸與軸套結合時的斷面 圖。 圖5係帶有包含圖2中散熱裝置的散熱系統的電子裝置 的立體組合圖。 圖6係圖5所示電子裝置中的系統風走向圖。 【主要元件符號說明】 習知技術： 12 201026211201026211 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a heat dissipating device, a heat dissipating system, and a heat dissipating method, and more particularly to a heat dissipating device for a heavy electronic component, a heat dissipating system, and a heat dissipating method. [Prior Art] Some computer systems contain two CPUs (such as servers, workstations, etc.) and system manufacturers need to use a kind of heat sink to simultaneously meet the two political requirements of the CPU to increase the interchangeability of the heat sink. Reduce the number of heat sinks and reduce development costs. 1 is a conventional heat dissipation system 2 for dissipating heat to the above computer system. The heat dissipation system 2 includes two conventional heat dissipation devices 5〇a, 5〇b of the same structure, respectively, on the computer system board 6 Corresponding to the two cpus (not shown), the two heat dissipating devices 50a, 50b each include a heat-conducting substrate 51a, 51b thermally connected to the CPU, and a plurality of thermal fins 52a, 52b arranged at intervals on the heat-conducting substrate 5U, 51b. The adjacent heat radiating fins 52a, 5 form heat exchange passages 521a, 521b in the north to allow the system wind to pass therethrough, thereby dissipating the heat absorbed by the heat conductive substrates 5U, 51b from the above two CPUs. The two heat sinks 5A, 5A are combined with the peripheral components 70 of the CPU to form a system air duct 8A. Working process t, the system wind flows in the system air passage 8〇 in the direction of the arrow, and then passes through the heat dissipating device 50a' and then dissipates heat through the heat dissipating device 50b. However, since the system wind first passes through the heat sink 5〇a, it is preheated during the heat exchange with the heat sink 50a, and the temperature rises, and the wind speed is greatly reduced due to the resistance of the heat sink fin 52a, thus entering the heat sink 5 〇b's system 201026211 The temperature of the wind and the wind speed are lower than the difference of 5 〇a into the scatter (four) = the heat dissipation efficiency of the dog is reduced, resulting in 5 〇a, the heart is placed on the surface;: The heat in the middle is not balanced, when the heat sink The heat dissipation performance of the ground is just right 4' The heat dissipation performance of the heat sink 5〇b is bound to be insufficient, so the heat dissipation of two cm is required. ^ Difficult to meet ❺ ^ For the above-mentioned heat sink 50a, 5〇b heat load unevenness, the current common solution is to improve the heat dissipation performance of the heat sink 5〇a, 5〇b, so that the heat sink 50b just meets the heat dissipation requirements However, this inevitably leads to an excessive heat dissipation performance of the heat sink 50a, which cannot be fully utilized, and causes a significant increase in the manufacturing cost of the device. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink, a heat dissipation system, and a heat dissipation method that can solve the problem of thermal load imbalance. A heat dissipating device includes a heat-conducting substrate and a plurality of heat-dissipating fins arranged on the heat-conducting substrate; a heat exchange source channel is formed between the adjacent heat-dissipating fins, and the heat-dissipating device further includes a wind channel in parallel with the heat-exchange channel And a wind deflector assembly for controlling the opening and closing of the cold air passage. A thermal system for dissipating heat from two heat sources, comprising two heat dissipating devices respectively corresponding to the two heat sources, the two heat dissipating devices being connected in series in a system air duct, each heat dissipating device comprising a heat exchange channel and a The hot parent replaces the parallel cold air passage of the passage; wherein the cold air passage of the heat sink adjacent to the air inlet of the system duct is turned on, and the cold air passage of the other heat sink is closed. 201026211 A heat dissipation method for dissipating heat from two heat sources includes the following steps: (A) providing two heat dissipating devices, each of which includes a heat exchange passage and a cold air passage parallel to the side heat exchange passage; The two heat dissipating devices are respectively mounted on the two heat-generating electronic components; (C) the two heat dissipating devices are connected in series to a system air duct; (D) the cold air passing through the heat dissipating device near the air inlet of the system air duct The ramp opens "the cold air passage of the other heat sink is closed; (E) provides a system wind through the system air duct to dissipate the heat generated by the two heat sources. By adopting the above technical solution, the same heat dissipation device can be used to satisfy the balanced heat dissipation of the two heat sources, and the interchangeability of the heat dissipation device can be increased, and the heat sink device number can be reduced, and the development cost can be reduced. [Embodiment] The present invention will be further described below with reference to Figs. 1 to 6 . 2 and 3 illustrate a heat dissipating device in a preferred embodiment of the present invention. The heat dissipating device 10 can be used to dissipate heat generated by a heat generating electronic component (for example, a CPU of a server such as a server or a workstation), which mainly includes a heat. The heat conductive substrate 11 and the plurality of heat dissipation fins 12 are arranged at intervals. The heat-conductive substrate 11 has a rectangular flat plate shape and is made of a material having good thermal conductivity such as steel or aluminum. The heat dissipating fins 12 are also made of a material such as copper conductive and good thermal performance, which is mounted in a thin portion of the top surface of the heat conducting substrate U in the sheet in the embodiment, and is disposed on the top surface of the heat conducting substrate 2 201026211. A blank area (not numbered) is left on one side of the fin 12. A heat exchange passage 121 is formed between the adjacent heat dissipation fins 12 for cooling air to pass through and exchange heat with the heat dissipation fins 12 to dissipate heat absorbed by the heat conductive substrate 11 from the heat generating electronic components. The blank area on the top surface of the heat-conducting substrate 11 forms a cold air passage 122 parallel to the heat exchange passage 121, and the width thereof is much larger than the width of the single heat exchange passage 121 for the purpose of minimizing heat exchange with the heat sink 10 as much as possible. Passing down, so that the cooling air does not rise or rises significantly after passing through the cold air passage 122. The heat dissipating device 10 further includes a plurality of fasteners 13 mounted on the heat-conducting substrate 11. The fasteners 13 are used for fixing the heat-dissipating device 10. In this embodiment, the bolt assembly includes a bolt 131 and a set. A spring 132 on the bolt 131 and a gasket 133 are bored in the through hole 111 on the heat conductive substrate 11. The heat sink 10 further includes an air deflector assembly 15 mounted in the cold air passage 122 for controlling the on and off of the cold air passage 122. In the present embodiment, the wind deflector assembly 15 is mounted on the buckle 13 in the cold air passage 122 near the wind inlet side. Of course, it may be separately installed at other positions in the cold air passage 122. Referring to FIG. 3, the air deflector assembly 15 is made of a material having elasticity, such as plastic, and includes a wind deflector 151, a rotating shaft 152 integrally connected with the wind deflecting plate 151, and a rotating shaft 11 and a rotating shaft. 152 matched bushing 153 ° 9 201026211 wind deflector 151 is rectangular plate shape in this embodiment, preferably, its length is equal to the width of the cold air passage 122, the height is the height of the heat radiating fin 12, etc. The cold air passage 122 may be closed when it is perpendicular to the cold air passage 122. The rotating shaft 152 has a cylindrical shape, and a lower end edge thereof is provided with a joint 1521, and opposite sides of the outer peripheral edge of the joint 1521 are respectively provided with a barb 1522. The sleeve 153 is also cylindrical, and is fastened to the heat-conductive substrate 11 by the fastener 13, so that the sleeve 153 does not rotate relative to the heat-conductive substrate 11. The upper end edge of the sleeve 153 is provided with a set of heads 1531 for fitting the shaft joint 1521. Referring to FIG. 4 together, the inner wall surface of the socket head 1531 is equidistantly disposed with four V-shaped card slots 1532 that cooperate with the joint barbs 1522. The angle between two adjacent card slots is an obtuse angle, and the other two phases are The angle between the adjacent card slots is a right angle or an acute angle, so that the rotating shaft 152 can rotate relative to the sleeve 153 within a range of 90 degrees, and is locked after being rotated to a predetermined position, thereby achieving the swing setting of the wind deflector 151. It can be understood that the function of the air deflector 151 is mainly to realize the opening and closing of the cold air passage 122, which is not limited to being mounted on the heat conductive substrate 11 by the pivotal connection of the rotating shaft 152 and the sleeve 153, and other suitable manners. Also applies. Figure 5 shows a heat dissipation system 1 comprising two heat sinks 10a, 10b for carrying electronic devices with dual heat-generating electronic components (such as servers with dual CPUs, workstations, etc.) Preferably, the two heat dissipating devices 10 have the same performance parameters and structures, and are respectively thermally connected to the dual heat-generating electronic components (not shown) mounted on the electronic device circuit board 20, and to the periphery of the heat-generating electronic components. Element 30 is combined into a system air duct 40. In the air duct 40 of the system, the two heat dissipating devices 10a, 10b are connected in series in the direction of the system wind, and the difference between the two is that the air deflector of the heat dissipating device 10a of the air inlet of the system air duct 40 is connected to the 201026211 air duct 40. The 151a is parallel to the cold air passage 122a to electrically connect the cold air passage 122a, and the air deflector 151b of the heat radiating device 10b far from the air inlet is perpendicular to the cold air passage 122b to close the cold air passage 122b. Referring to FIG. 6 together, during the operation of the heat dissipation system 1 , the system wind flows in the direction of the arrow, first entering the heat dissipation device 10a. At this time, due to the conduction of the cold air passage 122a, a part of the system wind is heated from the heat dissipation device 10a. The exchange channel 121a flows through, exchanges heat with the heat dissipation fins 12a, and removes heat absorbed by the heat sink 10a from its corresponding heat-generating electronic component; and another part of the system wind passes through the cold air passage 122a without taking it away or Rarely take away the heat from the heat sink l〇a. After the system wind passes through the heat sink 10a, it enters the heat sink 10b. At this time, the cold air passage 122b of the heat sink 10b is closed, so that the system wind flows through the heat exchange passage 121b, and exchanges heat with the heat sink fin 12b to dissipate heat. The device 10b is carried away from the heat absorbed by its corresponding heat-generating electronic component, thereby realizing the heat dissipation of the two heat-generating electronic components of the above electronic device. Further, in order to provide heat dissipation efficiency, the cold air passage 122a of the heat sink 10a may be opposed to the heat exchange passage 121b of the heat sink 10b. In the heat dissipation system 1 described above, since the system wind is preheated by the heat sink 10a, the temperature of the system wind entering the heat sink 10b rises, and the heat dissipation performance of the system wind decreases, but since the cold air passage 122a of the heat sink 10a is turned on, The cold air passage 122b of the heat dissipating device 10b is closed, so that the air volume of the system wind flowing through the heat exchange passage 121a of the heat dissipating device 10a is smaller than the air volume of the system wind flowing through the heat exchange passage 121b of the heat dissipating device 10b. In this way, the heat exchange channel 121 a flowing through the heat dissipating device 10a can be compensated for. The system wind rises due to the temperature 11 201026211, and the heat dissipation performance decreases when entering the thermal device 10b, thereby achieving balanced heat dissipation of the thermal device 10a and the heat dissipating device. - It is particularly necessary to propose that in the above heat dissipation system, the same heat dissipation device can be used to satisfy the balanced heat dissipation of the two heat-generating electronic components arranged in front and rear, which can increase the interchangeability of the heat sink and reduce the number of the heat sink device. Development costs. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. The above description is only a preferred embodiment of the present invention, and the scope of the patent application in this case is not limited thereby. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the present invention are intended to be within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of an electronic device having a heat sink. Figure 2 is a perspective assembled view of a heat sink in accordance with a preferred embodiment of the present invention. Figure 3 is an exploded perspective view of the heat sink of Figure 2. Figure 4 is a cross-sectional view showing the combination of the rotating shaft and the sleeve in the wind deflector assembly of Figure 2; Figure 5 is a perspective assembled view of an electronic device with a heat dissipation system including the heat sink of Figure 2. FIG. 6 is a system wind trend diagram in the electronic device shown in FIG. 5. [Main component symbol description] Conventional technology: 12 201026211
糸統 2 散熱裝置 50a ' 50b 導熱基板 51a、51a 散熱鰭片 52a、52b 熱交換通道521a、521b 電路板 60 周邊元件 70 糸統風道 80 本發明： 散熱系統 1 散熱裝置 10,10a ' 10b 導熱基板 11 穿孔 111 散熱鰭片 12,12a,12b 熱交換通道 121,121a,121b 冷風通道 122,122a,122b 扣具 13 螺栓 131 彈簧 132 墊片 133 導風板 151,151a,151b 轉軸 152 接頭 1521 倒鉤 1522 軸套 153 套頭 1531 卡槽 1532 電路板 20 周邊元件 30 系統風道 40 13糸 2 heat sink 50a ' 50b heat transfer substrate 51a, 51a heat sink fins 52a, 52b heat exchange channels 521a, 521b circuit board 60 peripheral components 70 风 air duct 80 Substrate 11 Perforation 111 Heat sink fins 12, 12a, 12b Heat exchange channels 121, 121a, 121b Cold air passages 122, 122a, 122b Fasteners 13 Bolts 131 Springs 132 Gaskets 133 Air deflectors 151, 151a, 151b Shaft 152 Joints 1521 Barbs 1522 Shafts 153 sets of heads 1531 card slot 1532 circuit board 20 peripheral components 30 system air duct 40 13