201235573 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱器及其卡扣裝置。 【先前技秫Ϊ】 [0002] 電路板上常會需要用到散熱器來輔助散熱，散熱器的固 定方式一般只適用於一種安裝環境，而不能在其他安裝 環境中使用，這樣會使散熱器的使用環境受到限制。 【發明内容】 [0003] 鑒於以上内容，有必要提供一種具有多種固定方式的散 熱器及其卡扣裝置。 [0004] 一種散熱器，包括一底座、一固定於底座的固定件、一 枢設於固定件的枢轉件以及一設置於樞轉件上的卡扣件 ，卡扣件的兩端分別設置一第—^扣部及一第二卡扣部 ，該第一卡扣部及第二卡扣部分別用來將散熱器固定於 不同的電路板。 [0005] —種卡扣裝置，用於將散熱器卡扣於電路板，該卡扣裝 置包括一樞設於散熱器一侧的樞轉件以及一設置於樞轉 件上的卡扣件，卡扣件的兩端分別設置一第一卡扣部及 一第二卡扣部，該第一卡扣部及第二卡扣部分別用來將 散熱器固定於不同的電路板。 [0006] 相較習知技術，本發明散熱器的卡扣件透過樞轉件極接 於散熱器的底座進而可改變散熱器的固定方式，可以適 用於不同的電路板。 【實施方式】 100106575 表單編號A0101 第3頁/共14頁 1002011222-0 201235573 _7] 4參閱圖〗，本發明散熱器的較佳實施方式用於對固定於 —電路板上的電子元件進行散熱。該散熱器包括—底座 10，底座10上設有複數散熱鰭片12。底座10的相對的兩 側各設置一卡扣裝置，每一卡扣裝置包括一固定於底座 的固定件20、一樞轉件30、兩彈性元件40及—卡扣件 5〇。本實施方式中，彈性元件4〇為彈簧。 [〇〇〇8]该固定件20大致呈U形，其包括一固定於底座10的固定部 21及兩平行的臂部22，每一臂部22於相對的一側開設一 枢孔221。 [0009] 樞轉件30大致呈方形，其中央開設一通孔32。樞轉件3〇 的相對的兩側分別向外凸設一樞轴3 4。 [0010] 卡扣件50呈啞鈴狀，其包括一圓柱狀的桿部51及分別設 置於s亥桿部51兩端的一第·—^扣部52及一第二卡扣部54 。第一卡扣部52及第二卡扣部54與桿部51的兩端之間可 以透過螺紋鎖固或者黏接的:方;式進行固，定h可以理解， 第 ^扣部5 2及第二卡扣_ 5 4今毕的'一個可以和桿部51 一體形成，另外一個可以逸遶破k鎖固或者黏接的方式 與桿部51之間進行固定。第一卡扣部52的末端設有複數 傘骨狀發散的彈性卡榫522。第二卡扣部54的末端設置一 卡鉤542。 [0011] 組裝時，將卡扣件50的桿部51穿設於樞轉件3 0的通孔32 内’兩彈性元件40套設於卡扣件50的桿部51並分別位於 樞轉件30的兩側。樞轉件3〇的兩樞軸34分別枢設於固定 件2〇的兩樞孔221内以將樞轉件30樞轉連接於固定件2〇 100106575 表單編號A0101 第4頁/共14頁 1002011222-0 201235573 ο [0012] 請一併參閱圖2及圖3,需要將散熱器固定於一開設有固 定孔102的第一電路板1〇〇時，框轉樞轉件3〇使卡扣件 的第一卡扣部52朝向第一電路板1〇〇並穿入第—電路板 100的固定孔102内，彈性卡榫522穿過第一電路板1〇〇的 固定孔102後彈性回復卡擋於第一電路板1〇〇，進而將散 熱器固定於第一電路板1〇〇。 [0013] 請一併參閱圖4及圖5，需要將散熱器固定於—開設有鉤 〇 扣部202的第二電路板200時，板轉振轉件30使卡扣件5〇 的第二卡扣部54朝向第二電路板200並使第二卡扣部54的 卡鉤542鉤扣於第二電路板2〇〇的鉤扣却2〇2，進而將散 熱器固定於第二電路板2〇〇。 ·; [0014] 本發明散熱器的卡扣件透過樞轉件30樞接於散熱器的底 座10進而可改變散熱器的固定方式，可以適用於不同的 電路板。 Q [〇〇15]综上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施方式，舉 凡熟悉本案技藝之人士，在爰依本發明精神所作之等效 修飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0016] 圖1為本發明散熱器的較佳實施方式的立體分解圖。 [0017] 圖2為本發明散熱器固定於一第一電路板上的示意圖。 [0018] 圖3為圖2的局部剖視圖。 1002011222-0 100106575 表單編號Α0101 第5頁/共14頁 201235573 [0019] 圖4為本發明散熱器固定於一第二電路板上的示意圖 [0020] 圖5為圖4的局部剖視圖。 【主要元件符號說明】 [0021] 第一電路板：100 [0022] 固定孔：1 0 2 [0023] 第二電路板：200 [0024] 鉤扣部：202 [0025] 底座：10 [0026] 散熱鰭片：12 [0027] 固定件：20 [0028] 固定部：21 [0029] 臂部：22 [0030] 枢孔：221 [0031] 樞轉件：30 [0032] 通孔：32 [0033] 樞軸：34 [0034] 彈性元件：40 [0035] 卡扣件：5 0 [0036] 桿部：51 [0037] 第一卡扣部：5 2 100106575 表單編號A0101 第6頁/共14頁 1002011222-0 201235573 [0038] 彈性卡榫： [0039] 第二卡扣部 [0040] 卡鉤：542 522 ：54201235573 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a heat sink and a buckle device therefor. [Previous Technology] [0002] A heat sink is often required on the board to assist in heat dissipation. The way the heat sink is fixed is generally only suitable for one installation environment, and cannot be used in other installation environments. The use environment is limited. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide a heat sink having a plurality of fixing methods and a buckle device thereof. [0004] A heat sink includes a base, a fixing member fixed to the base, a pivoting member pivoted to the fixing member, and a latching member disposed on the pivoting member, the two ends of the latching member are respectively disposed A first fastening portion and a second fastening portion are respectively used for fixing the heat sink to different circuit boards. [0005] A buckle device for snapping a heat sink to a circuit board, the buckle device comprising a pivoting member pivoted on a side of the heat sink and a latching member disposed on the pivoting member A first fastening portion and a second fastening portion are respectively disposed on the two ends of the fastening component, and the first fastening component and the second fastening component are respectively used to fix the heat sink to different circuit boards. Compared with the prior art, the latching member of the heat sink of the present invention can be connected to the base of the heat sink through the pivoting member to change the fixing manner of the heat sink, and can be applied to different circuit boards. [Embodiment] 100106575 Form No. A0101 Page 3 of 14 1002011222-0 201235573 _7] 4 Referring to the drawings, a preferred embodiment of the heat sink of the present invention is for dissipating heat from electronic components fixed on a circuit board. The heat sink includes a base 10 on which a plurality of heat sink fins 12 are disposed. Each of the opposite sides of the base 10 is provided with a latching device. Each of the latching devices includes a fixing member 20 fixed to the base, a pivoting member 30, two elastic members 40 and a latching member. In the present embodiment, the elastic member 4 is a spring. [8] The fixing member 20 is substantially U-shaped and includes a fixing portion 21 fixed to the base 10 and two parallel arm portions 22, and each arm portion 22 defines a pivot hole 221 on the opposite side. [0009] The pivoting member 30 is substantially square and has a through hole 32 in the center thereof. A pivot shaft 34 is protruded outwardly from opposite sides of the pivoting member 3''. [0010] The latching member 50 is in the shape of a dumbbell, and includes a cylindrical rod portion 51 and a first button portion 52 and a second hook portion 54 respectively disposed at opposite ends of the shovel portion 51. The first fastening portion 52 and the second fastening portion 54 and the two ends of the rod portion 51 can be screwed or glued by means of a thread; the fixing method can be understood, and the second fastening portion 52 can be understood. The second buckle _ 5 4 can be formed integrally with the rod portion 51, and the other can be fixed between the rod portion 51 in a manner that can be locked or glued. The end of the first catching portion 52 is provided with a plurality of elastic ridges 522 which are bulging. A hook 542 is disposed at the end of the second latching portion 54. [0011] When assembling, the rod portion 51 of the latching member 50 is inserted into the through hole 32 of the pivoting member 30. The two elastic members 40 are sleeved on the rod portion 51 of the latching member 50 and respectively located at the pivoting member. 30 on both sides. The two pivots 34 of the pivoting member 3 are respectively pivoted in the two pivot holes 221 of the fixing member 2 to pivotally connect the pivoting member 30 to the fixing member 2100106575. Form No. A0101 Page 4 / Total 14 Pages 1002011222 -0 201235573 ο [0012] Please refer to FIG. 2 and FIG. 3 together, when the heat sink needs to be fixed to the first circuit board 1 with the fixing hole 102, the frame pivoting member 3 is used to make the fastening member The first fastening portion 52 faces the first circuit board 1 and penetrates into the fixing hole 102 of the first circuit board 100. The elastic card 522 passes through the fixing hole 102 of the first circuit board 1 and then elastically recovers the card. Blocked on the first circuit board 1〇〇, and then the heat sink is fixed to the first circuit board 1〇〇. [0013] Referring to FIG. 4 and FIG. 5 together, when the heat sink needs to be fixed to the second circuit board 200 with the hook and buckle portion 202, the plate rotating vibration member 30 makes the second fastening member 5 The latching portion 54 is opposite to the second circuit board 200 and the hook 542 of the second latching portion 54 is hooked to the hook of the second circuit board 2, but the heat sink is fixed to the second circuit board. 2〇〇. [0014] The latching member of the heat sink of the present invention is pivotally connected to the base 10 of the heat sink through the pivoting member 30 to change the fixing manner of the heat sink, and can be applied to different circuit boards. Q [〇〇15] In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0016] FIG. 1 is an exploded perspective view of a preferred embodiment of a heat sink of the present invention. 2 is a schematic view of the heat sink of the present invention fixed on a first circuit board. 3 is a partial cross-sectional view of FIG. 2. 1002011222-0100106575 Form No. Α0101 Page 5 of 14 201235573 [0019] FIG. 4 is a schematic view showing the heat sink of the present invention fixed on a second circuit board. [0020] FIG. 5 is a partial cross-sectional view of FIG. [Main component symbol description] [0021] First circuit board: 100 [0022] Fixed hole: 1 0 2 [0023] Second circuit board: 200 [0024] Hook portion: 202 [0025] Base: 10 [0026] Cooling fins: 12 [0027] Fixing parts: 20 [0028] Fixing part: 21 [0029] Arm part: 22 [0030] Pivot hole: 221 [0031] Pivoting part: 30 [0032] Through hole: 32 [0033 ] Pivot: 34 [0034] Elastic element: 40 [0035] Fastener: 5 0 [0036] Rod: 51 [0037] First snap: 5 2 100106575 Form No. A0101 Page 6 of 14 1002011222-0 201235573 [0038] Elastic cassette: [0039] Second buckle [0040] Hook: 542 522 : 54
100106575 表單編號A0101 第7頁/共14頁 1002011222-0100106575 Form No. A0101 Page 7 of 14 1002011222-0