201220997 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及電路板製作領域，尤其涉及一種具有凹槽結 構之電路板製作方法。 【先前技術】 [0002] 印刷電路板因具有裝配密度高等優點而得到了廣泛之應 用。關於電路板之應用請參見文獻Takahashi，A.201220997 VI. Description of the Invention: [Technical Field] The present invention relates to the field of circuit board manufacturing, and more particularly to a method of fabricating a circuit board having a groove structure. [Prior Art] [0002] Printed circuit boards have been widely used due to their high assembly density. For the application of the circuit board, please refer to the literature Takahashi, A.
Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880 ， IEEE Trans, on Components, Packaging， and Manufacturing Technology， 1992， 15(4): 418—425。 [0003] 軟硬結合電路板係同時包括有相互連接之軟板與硬板之 電路板結構，其既能夠具有軟硬電路板之撓折性，也可 以包括硬性電路板之硬度。於軟硬結合電路板之製作過 程中，通常採用於軟硬電路板上通過爭固化膠片壓合硬 性基板形成。於進行壓合之前，會释硬性基板及半固化 膠片對應軟板之彎折區域形成有開口，於壓合之後，於 軟板露出之彎折區域之表面形成可剝離之保護層以保護 軟板表面之導電線路於硬板之線路製作過程中不被藥水 腐蝕。然而，這樣之製作方法存於著如下不足：首先， 由於軟板之彎折區域與硬板之厚度差較大，於壓合時， 由於壓合不平整而容易折傷軟板上之線路 。其次，於進 行硬性基板之導電線路之製作過程中，藥水往往會侵蝕 半固化膠片與軟性電路板板結合處，從而使得軟硬結合 099138016 表單編號A0101 第4頁/共23頁 0992066231-0 201220997 電路板於後續制程中存於爆板之風險β 【發明内容】 [0004] [0005] [0006] Ο 〇 [0007] 099138016 有鑑於此，提供一種能夠有效避免於壓合過程中折傷軟 板中之導電線路，並防止軟板於硬板之線路製作過程中 被藥水侵钱之軟硬結合電路板之製作方法實屬必要。 以下將以實施例說明一種軟硬結合電路板製作方法。 一種軟硬結合電路板製作方法，包括步驟：提供軟性電 路板’所述軟性電路板包括相互連接之彎折區域和固定 區域，提供膠片及硬性之覆舞基板，所述膠片内形成有 與所述彎折區域相對應之開口，所述覆絲包括基板及 銅羯層，所述覆銅板具有開窗區域和產品區域，所述開 窗區域與所述彎折區域相對應；沿著所關窗區域之邊 界於所述基板内遠離銅箔層之一側形成有第一切口所 述第一切口未貫穿所述基板；依次堆疊並壓合覆銅基板 、膠片及所述軟性電路板，所述覆銅純之基板與所述 膠片相接觸，所述辦落層遠離所述膠片，所述開窗區域 與所述f折區域相重疊；將所述㈣層製作形成所述外 層導電線路；以及沿著所述職區域之邊界於基板内形 成第二切口，所述第二切口與所述第一切口相連通並 將所述開窗區域内之材料從基板去除。 相較於先前技術，本技術方案提供之軟硬結合電路板之 製作方法，於軟性電路板與硬性覆鋼基板壓合之前，於 硬性覆銅基板之基板令開設有與開窗區域對應之第一切 口’第-切σ並不貫穿基板，從而，於將軟性電路板與 硬性基板進行壓合時，沒_差結構，得狀壓合結構 表草編號Α0101 第5頁/共23頁 0992066231-0 201220997 平整。而且’由於基板之開窗區域沒有去除，於形成外 層線路時能夠防止藥水與軟性電路板之導電線路相接觸 【實施方式】 [0008] [0009] [0010] [0011] 下面結合附圖及實施例對本技術方案提供之軟硬結合電 路板製作方法作進一步說明。 本技術方案提供之軟硬結合電路板製作方法包括如下步 驟： 第一步，請參閱圖1，提供一個軟性電路板u〇。 軟性電路板110為製作有導電線路之電路板。軟性電路板 110可以為單面電路板也可以為雙面電路板。本實施例中 ，以軟性電路板110為雙面電路板為例進行說明。軟性電 路板110包括第一絕緣層111、第一導電線路112及第二 導電線峰113。第一絕緣層11丨包括相對之第一表面nil 和第二表面1U2’第-導電線路i! 2形成於第一絕緣層 111之第-表面1111 ’第二導電線路113形成於第一絕緣 層111之第二表面1112。軟㈣綠⑴包括弯折區域 114及連接於青折區域114相對兩側之固定區域⑴。彎 折區域114用於形成軟硬結合電路板板之f折區相對應。 固定區域115用於與硬性電路板 〜％得。於辔狀问Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans, on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] The hard-and-soft-bonding circuit board includes a circuit board structure of a flexible board and a hard board which are connected to each other, and can have both the flexibility of the hard and soft circuit board and the hardness of the rigid circuit board. In the manufacturing process of the hard and soft circuit board, it is usually formed on a soft and hard circuit board by pressing a hard film to form a rigid substrate. Before the pressing, the hardened substrate and the semi-cured film are formed with openings corresponding to the bending regions of the flexible plate, and after pressing, a peelable protective layer is formed on the surface of the bent region where the soft plate is exposed to protect the soft board. The conductive lines on the surface are not corroded by the syrup during the manufacturing process of the hard board. However, such a manufacturing method suffers from the following disadvantages: First, since the difference in thickness between the bent portion and the hard plate of the flexible sheet is large, it is easy to break the line on the flexible board due to uneven pressing during press-fitting. Secondly, in the process of making conductive lines of rigid substrates, the syrup tends to erode the junction of the semi-cured film and the flexible circuit board, thus making the combination of soft and hard 099138016 Form No. A0101 Page 4 / 23 Page 0992066231-0 201220997 Circuit The risk of the plate being deposited in the subsequent process in the subsequent process [Abstract] [0004] [0005] [0006] [0007] 099138016 In view of this, it is possible to effectively prevent the soft board from being damaged during the pressing process. It is necessary to make the conductive circuit and prevent the soft board from being invaded by the soft water in the process of making the hard board. A method of fabricating a soft and hard bonded circuit board will be described below by way of example. A method for manufacturing a soft and hard combined circuit board, comprising the steps of: providing a flexible circuit board, wherein the flexible circuit board comprises a bent portion and a fixed area connected to each other, and provides a film and a hard cover substrate, wherein the film is formed with a The corresponding opening of the bending region, the covering wire comprises a substrate and a copper layer, the copper clad plate has a window opening area and a product area, the window opening area corresponding to the bending area; a boundary of the window region is formed with a first slit in a side of the substrate away from the copper foil layer; the first slit does not penetrate the substrate; and the copper clad substrate, the film and the flexible circuit board are sequentially stacked and pressed And the copper-clad pure substrate is in contact with the film, the falling layer is away from the film, the window opening region overlaps with the f-fold region; and the (four) layer is formed to form the outer layer conductive And forming a second slit in the substrate along a boundary of the duty region, the second slit being in communication with the first slit and removing material in the windowed region from the substrate. Compared with the prior art, the soft and hard circuit board provided by the technical solution is configured to open a substrate corresponding to the window opening area on the substrate of the hard copper-clad substrate before the flexible circuit board and the hard steel-clad board are pressed together. A slit 'the first-cut σ does not penetrate the substrate, so that when the flexible circuit board and the rigid substrate are pressed together, there is no _ poor structure, and the embossed structure is Α0101, page 5 / 23 pages 0992066231 -0 201220997 Leveling. Moreover, since the window opening area of the substrate is not removed, the syrup can be prevented from coming into contact with the conductive line of the flexible circuit board when the outer layer line is formed. [Embodiment] [0010] [0011] [0011] For example, the method for manufacturing the soft and hard combined circuit board provided by the technical solution is further described. The soft and hard circuit board manufacturing method provided by the technical solution includes the following steps: In the first step, referring to FIG. 1, a flexible circuit board is provided. The flexible circuit board 110 is a circuit board on which conductive lines are formed. The flexible circuit board 110 can be a single-sided circuit board or a double-sided circuit board. In the present embodiment, the flexible circuit board 110 is taken as an example of a double-sided circuit board. The flexible circuit board 110 includes a first insulating layer 111, a first conductive line 112, and a second conductive line peak 113. The first insulating layer 11 includes an opposite first surface nil and a second surface 1U2'. The first conductive layer i! 2 is formed on the first surface 1111 of the first insulating layer 111. The second conductive line 113 is formed on the first insulating layer. The second surface 1112 of the 111. The soft (four) green (1) includes a bent region 114 and a fixed region (1) connected to opposite sides of the cyan region 114. The bent region 114 is used to form an f-fold region of the hard and soft bonded circuit board. The fixed area 115 is used with a hard board ~%. Asked in a question
域114内均分佈有第一導電線路112和第二 、考折L 。 〜等電線路113 第二步，請一併參閱圖2及圖3，提供第—膠片 覆銅基板130、第二膠片⑷及第二覆銅基拓120、第- 土攸1 5 〇，窜 099138016 表單煸號A0101 第6頁/共23頁 0992066231-0 [0012] 201220997 膠片120形成有與軟性電路板ho之彎折區域114相對應 之第一開口 121，所述第一覆銅基板丨3〇内形成有與彎折 區域114相對應之第一切口 131，第二膠片140内形成有 與軟性電路板11 0之彎折區域114相對應之第二開口 141 ’第二覆銅基板150内形成有與彎折區域U4相對應之第 三切口 151。 [0013] 本實施例中，第一膠片12〇為半固化膠片（prepreg，pp )。於第一膠片120内形成第一開口 121可以通過雷射切 割之方式形成。即通過雷射於第一膠片120中形成於彎折 區域114相對應之切口，從而將切口内與變折區域114相 對應之形狀之膠片之材料去療:，從而巧成第一開口 121。 [0014] 第一覆銅基板130為硬性銅箔-基板，其包括第一基板132 及第一銅箔層133。第一基板132由玻璃纖雄及膠組成。 所述玻璃纖維呈網狀，所述膠填充於玻璃纖維之空隙中 。第一覆銅基板130包括第一產品區域13〇1和第一開窗區 域1302。第一產品噚域1301與軟性電路板Η0之固定區 〇 域11 5相對應，用於與軟性寫路板110之固定區域115相 固定。第一開窗區域1302與軟性電路板110之彎折區域 114相對應’於後續制程中將其去除。於第一覆銅基板 1 30之第一基板1 32之一側沿著第一開窗區域丨3〇2和第一 產品區域1301之邊界形成第一切口 131，第一切口 131之 深度方向垂直於第一基板132所於之平面，且並不貫穿第 一基板132。第一切口 131也可以通過雷射切割之方式形 成。第一切口 131之深度為第一基板132之厚度之1/4至 1/2。優選地，第一切口 131之深度為第一基板丨32厚度 099138016 表單編號Α0101 第7頁/共23頁 0992066231-0 201220997 之1/3。第一切口 131之寬度為0.1毫米至0.4毫米。 [0015] 第二膠片140也為半固化膠片，第二膠片140内也通過雷 射切割之方式形成第二開口 141，第二開口 141也與脊折 區域114相對應。 [0016] 第二覆銅基板150也為硬性銅箔基板，其包括第二基板 152和第二銅箔層153。第二基板152之結構與第一基板 132相同。第二覆銅基板150包括第二產品區域15〇1和第 二開窗區域1502。第二產品區域1501與軟性電路板11〇 之固定區域115相對應，用於與軟性電路板11〇之固定區 - ... ： ' .丨 域115相固定。第二開窗區域1502與軟性電路板110之彎 折區域114相對應，於後續制程中將其去除β於第二覆銅 基板150之第二基板152之一側沿著第二開窗區域1502和 第二產品區域15 01之邊界形成第三切口 151，第三切口 151之深度方向垂直於第二基板152所於之平面，且並不 貫穿第二基板152。第三切ί口 151也可以通;過雷射切割之 方式形成。第三切口 151之深度為第二棊板i 52之厚度之 1/4至1/2。優選地’第三切口 15rl之深度為第二基板152 厚度之1/3。第三切口 151之寬度為〇·ι毫米至0. 4毫米。 [0017] 第二步，請參閱圖4，依次堆疊並壓合第一覆銅基板130 、第一膠片120、軟性電路板uo、第二膠片ι4〇及第二 覆銅基板150 ’並使得第一覆銅基板13〇之第一基板132 與第一膠片120相接觸，第二覆銅基板15〇之第二基板 152與第二膠片14〇相接觸’第一膠片ι2〇和第二膠片u〇 之開口均與軟性電路板110之彎折區域114相對應，第一 切口 131和第三切口 151均與彎折區域114與固定區域11 5 099138016 表單編號A0101 第8頁/共23頁 0992066231-0 201220997 [0018] [0019] Ο [0020] ❹ 之交界處相對應。 於本步驟中，由於第一覆銅基板130之第一開窗區域1302 和第二覆銅基板150之第二開窗區域1 502之基板並未被去 除，因此，於進行壓合時，能過防止損傷軟性電路板110 之第一導電線路112和第二導電線路113。 第四步，請參閱圖5，將第一銅箔層133製作形成第一外 層線路134，將第二銅箔層153製作形成第二外層線路 154。 將第一銅箔層133和第二銅箔層153製作形成導電線路可 以採用影像轉移工藝及蝕刻工藝。於此過程中，第一開 窗區域1 302對應之第一銅箔層133和第二開窗區域1502 對應之第二銅箔層153之材料也被蝕刻去除。由於第一切 口 131並未貫穿第一基板132，第三切口 151並未貫穿第 二基板152，於進行第一外層線路134和第二外層線路 154之製作過程中採用之藥水不透過第一基板132和第 二基板152，從而避免了藥水與軟性電路板110之導電線 路相接觸，防止軟性電路板110之彎折區域114處之導電 線路被腐餘。 [0021] 第五步，請一併參閱圖6及圖7，沿著第一開窗區域130.2 之邊界形成第二切口 135，所述第二切口 135與第一切口 131相互連通，從而將第一基板132之第一開窗區域1302 内之材料去除，沿著第二開窗區域1 502之邊界形成第四 切口 155，第四切口 155與第三切口 151相互連通，從而 將第二基板152之第二開窗區域1502内之材料去除。 099138016 表單編號A0101 第9頁/共23頁 0992066231-0 201220997 [0022] [0023] [0024] 本實施例中，採用雷射切割之方式形成第二切口 135和第 四切口 155。於形成第二切口 135和第四切口 155時，通 過設置雷射能量’使得第二切口 135之深度為第一基板 132厚度之1/2至3/4。優選為第一基板1 32深度之2/3， 第一切口 131和第二切口 135之深度之和等於第一基板 132之厚度，保證第一切口 131和第二切口 135相互連通 。第四切口 155之深度為第二基板152厚度之1/2至3/4。 優選為第二基板152深度之2/3，第二切口135和第四切 口 155之深度之和等於第二基板152之厚度，保證第三切 口 1 51與第四切口 155相互速壤。優選地，第二切口 j35 之寬度小於第一切口 131之寬，度，第四切口 1 $5之寬度小 於第三切口 151之寬度，以方便將第一開窗區域13〇2内之 第基板132和第一開窗區域1502内之第二基板152之材 料去除，從而可以得到通過彎折區域114進行彎折之軟硬 結合電路板。 . ：. 本步驟中，由於第一基板成有第一切口 131 , 第二基板152已經形成有第三切口 151，從而，於形成第 二切口 135和第四切口 155時，可以有效地避免由於能量 «^定過大損傷軟性電路板丨丨〇，或者能量設定過小由不能 將第一基板132或第二基板152貫穿之問題。 可以理解，本技術方案提供之軟硬結合電路板之製作方 法，也可以只於軟性電路板11〇之一側覆銅基板，即只於 第一導電線路112之一側形成第一膠月12〇和第—覆銅基 板130，而並不於第二導電線路113之一側形成第二膠片 140和第二覆銅基板15〇。 099138016 表單編號A0101 第10頁/共23頁 0992066231-0 201220997 [0025] 本技術方案提供之軟硬結合電路板之製作方法，於軟性 電路板與硬性覆銅基板壓合之前，於硬性覆銅基板之基 板中開設有與開窗區域對應之第一切口，第一切口並不 貫穿基板，從而，於將軟性電路板與硬性基板進行壓合 • 時，沒有斷差結構，得到之壓合結構平整。而且，由於 基板之開窗區域沒有去除，於形成外層線路時能夠防止 藥水與軟性電路板之導電線路相接觸。 [0026] 惟，以上所述者僅為本發明之較佳實施方式，自不能以 此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士 援依本發明之精神所作之等效修飾或變化，皆應涵蓋於 以下申請專利範圍内。 【圖式簡單說明】 [0027] 圖1係本技術方案實施例提供之軟性電路板之剖面示意圖 [0028] 圖2係本技術方案實施例提供之第一膠層和第二膠層示意 圖。 ^ [0029] 圖3係本技術方案實施例提供之第一覆銅基板和第二覆銅 基板之剖面示意圖。 [0030] 圖4係本技術方案實施例提供之依次壓合第一覆銅基板、 第一膠層、軟性電路板、第二膠層及第二覆銅基板後之 剖面示意圖。 [0031] 圖5係圖4形成外層導電線路後之剖面示意圖。 [0032] 圖6係圖5中之第一基板形成第二切口及第二基板形成第 四切口後之剖面示意圖。 099138016 表單編號 A0101 第 11 頁/共 23 頁 0992066231-0 201220997 [0033] 圖7係本技術方案實施例提供之將第一開窗區域和第二開 窗區域去除後之剖面示意圖。 【主要元件符號說明】 [0034] 軟性電路板：110 [0035] 絕緣層： 111 [0036] 第 一表面 ：1111 [0037] 第 二表面 ：1112 [0038] 第 一導電 線路： 112 [0039] 第 二導電線路： 113 [0040] 彎 折區域 ：114 [0041] 固 定區域 ：115 [0042] 第 一膠片 ：120 [0043] 第 一開口 ：121 [0044] 第 一覆銅基板： 130 [0045] 第 一產品 區域· 1301 [0046] 第 一開窗 區域. 1302 [0047] 第 一切口 ：131 [0048] 第 一基板 ：132 [0049] 第 一銅箔層：133 [0050] 第 一外層線路： 134 表單編號A0101 099138016 第12頁/共23頁 0992066231-0 201220997 [0051] %二 二切口 ：135 [0052] 第二 二膠片 ：140 [0053] % 二 二開口 ：141 [0054] 第二覆銅基板： 150 [0055] 第二 -產品 區域. 1501 [0056] 第二 二開窗 區域： 1502 [0057] 第三切口 ：151 [0058] 第二基板 ：152 [0059] 第二銅箔層：153 [0060] 第二外層線路： 154 [0061] 第四切口 ：155 099206623卜0 099138016 表單編號A0101 第13頁/共23頁The first conductive line 112 and the second, test fold L are distributed in the field 114. ~Isoelectric line 113 In the second step, please refer to FIG. 2 and FIG. 3 together to provide the first film copper-clad substrate 130, the second film (4) and the second copper-clad base 120, the first-soil 1 5 〇, 窜099138016 Form nickname A0101 Page 6 of 23 0992066231-0 [0012] 201220997 The film 120 is formed with a first opening 121 corresponding to the bending region 114 of the flexible circuit board ho, the first copper-clad substrate 丨3 A first slit 131 corresponding to the bending region 114 is formed in the crucible, and a second opening 141 ′ corresponding to the bending region 114 of the flexible circuit board 110 is formed in the second film 140. The second copper clad substrate 150 A third slit 151 corresponding to the bent region U4 is formed therein. [0013] In this embodiment, the first film 12 is a prepreg (pp). Forming the first opening 121 in the first film 120 can be formed by laser cutting. That is, by laser-forming the slit formed in the first film 120 corresponding to the bending region 114, the material of the film having the shape corresponding to the folding region 114 in the slit is de- conditioned: thereby forming the first opening 121. [0014] The first copper clad substrate 130 is a hard copper foil-substrate including a first substrate 132 and a first copper foil layer 133. The first substrate 132 is composed of glass fiber and rubber. The glass fibers are in the form of a mesh, and the glue is filled in the voids of the glass fibers. The first copper clad substrate 130 includes a first product region 13〇1 and a first window opening region 1302. The first product area 1301 corresponds to the fixed area 11 field 11 5 of the flexible circuit board Η0 for fixing to the fixed area 115 of the flexible write path board 110. The first fenestration region 1302 corresponds to the bend region 114 of the flexible circuit board 110 and is removed during subsequent processing. Forming a first slit 131 along a boundary of the first window opening region 丨3〇2 and the first product region 1301 on one side of the first substrate 1 32 of the first copper clad substrate 130, the depth of the first slit 131 The direction is perpendicular to the plane of the first substrate 132 and does not penetrate the first substrate 132. The first slit 131 can also be formed by laser cutting. The depth of the first slit 131 is 1/4 to 1/2 of the thickness of the first substrate 132. Preferably, the depth of the first slit 131 is the thickness of the first substrate 丨32 099138016 Form No. Α0101 Page 7/23 pages 0992066231-0 201220997 1/3. The width of the first slit 131 is 0.1 mm to 0.4 mm. [0015] The second film 140 is also a pre-cured film, and the second film 140 is also formed by laser cutting to form a second opening 141, and the second opening 141 also corresponds to the ridge folding region 114. [0016] The second copper clad substrate 150 is also a hard copper foil substrate including a second substrate 152 and a second copper foil layer 153. The structure of the second substrate 152 is the same as that of the first substrate 132. The second copper clad substrate 150 includes a second product region 15〇1 and a second window opening region 1502. The second product region 1501 corresponds to the fixed region 115 of the flexible circuit board 11A for fixing to the fixed area - ... : ' . . . region 115 of the flexible circuit board 11 . The second window opening region 1502 corresponds to the bending region 114 of the flexible circuit board 110, and is removed from the second substrate 152 side of the second copper-clad substrate 150 along the second window opening region 1502 in a subsequent process. A third slit 151 is formed at a boundary with the second product region 151. The depth direction of the third slit 151 is perpendicular to the plane of the second substrate 152 and does not penetrate the second substrate 152. The third cut 151 can also be passed; formed by laser cutting. The depth of the third slit 151 is 1/4 to 1/2 of the thickness of the second seesaw i 52 . Preferably, the depth of the 'third slit 15rl' is one third of the thickness of the second substrate 152. The width of the third slit 151 is 〇·ι mm to 0.4 mm. [0017] In the second step, referring to FIG. 4, the first copper clad substrate 130, the first film 120, the flexible circuit board uo, the second film ι4 〇, and the second copper clad substrate 150' are sequentially stacked and pressed. The first substrate 132 of the copper-clad substrate 13 is in contact with the first film 120, and the second substrate 152 of the second copper-clad substrate 15 is in contact with the second film 14'. The first film ι2 and the second film u The opening of the cymbal corresponds to the bending region 114 of the flexible circuit board 110, and the first slit 131 and the third slit 151 are both the bending region 114 and the fixing region 11 5 0 991 380. Form No. A0101 Page 8 / Total 23 Page 0992066231 -0 201220997 [0019] [0020] The intersection of ❹ corresponds. In this step, since the first window-opening region 1302 of the first copper-clad substrate 130 and the second window-opening region 1 502 of the second copper-clad substrate 150 are not removed, when the pressing is performed, The first conductive line 112 and the second conductive line 113 of the flexible circuit board 110 are prevented from being damaged. In the fourth step, referring to Fig. 5, the first copper foil layer 133 is formed into a first outer layer line 134, and the second copper foil layer 153 is formed into a second outer layer line 154. Forming the first copper foil layer 133 and the second copper foil layer 153 to form a conductive line may employ an image transfer process and an etching process. In this process, the materials of the first copper foil layer 133 corresponding to the first window region 1 302 and the second copper foil layer 153 corresponding to the second window opening region 1502 are also etched away. Since the first slit 131 does not penetrate the first substrate 132, the third slit 151 does not penetrate the second substrate 152, and the syrup used in the process of fabricating the first outer layer 134 and the second outer layer 154 is not transparent. The substrate 132 and the second substrate 152 prevent the syrup from contacting the conductive lines of the flexible circuit board 110, and prevent the conductive lines at the bent regions 114 of the flexible circuit board 110 from being rotted. [0021] In the fifth step, referring to FIG. 6 and FIG. 7, a second slit 135 is formed along the boundary of the first window opening region 130.2, and the second slit 135 and the first slit 131 communicate with each other, thereby The material in the first window opening region 1302 of the first substrate 132 is removed, and a fourth slit 155 is formed along the boundary of the second window opening region 1 502. The fourth slit 155 and the third slit 151 communicate with each other, thereby the second substrate. Material removal within the second fenestration region 1502 of 152. 099138016 Form No. A0101 Page 9 of 23 0992066231-0 201220997 [0024] In the present embodiment, the second slit 135 and the fourth slit 155 are formed by laser cutting. When the second slit 135 and the fourth slit 155 are formed, the depth of the second slit 135 is made 1/2 to 3/4 of the thickness of the first substrate 132 by setting the laser energy '. Preferably, the depth of the first substrate 1 32 is 2/3, and the sum of the depths of the first slit 131 and the second slit 135 is equal to the thickness of the first substrate 132, ensuring that the first slit 131 and the second slit 135 are in communication with each other. The depth of the fourth slit 155 is 1/2 to 3/4 of the thickness of the second substrate 152. Preferably, the second substrate 152 has a depth of 2/3, and the sum of the depths of the second slit 135 and the fourth slit 155 is equal to the thickness of the second substrate 152, so that the third slit 151 and the fourth slit 155 are mutually fast. Preferably, the width of the second slit j35 is smaller than the width of the first slit 131, and the width of the fourth slit 1 $5 is smaller than the width of the third slit 151 to facilitate the first substrate in the first window opening region 13〇2. The material of the second substrate 152 in the first window opening region 1502 is removed, so that a soft and hard bonded circuit board bent by the bending region 114 can be obtained. In this step, since the first substrate is formed with the first slit 131, the second substrate 152 has been formed with the third slit 151, thereby being effectively avoided when the second slit 135 and the fourth slit 155 are formed. Since the energy is too large to damage the flexible circuit board, or the energy setting is too small, the first substrate 132 or the second substrate 152 cannot be penetrated. It can be understood that the manufacturing method of the soft and hard combined circuit board provided by the technical solution can also cover the copper substrate only on one side of the flexible circuit board 11 , that is, the first rubber month 12 is formed only on one side of the first conductive line 112 . The second film 140 and the second copper clad substrate 15 are formed on one side of the second conductive line 113 without the copper-clad substrate 130. 099138016 Form No. A0101 Page 10 of 23 0992066231-0 201220997 [0025] The method for manufacturing a soft-hardened circuit board provided by the present invention is to form a hard copper-clad substrate before the flexible circuit board is pressed against the hard copper-clad substrate. a first slit corresponding to the window opening region is formed in the substrate, and the first slit does not penetrate the substrate, so that when the flexible circuit board and the rigid substrate are pressed together, there is no sectional structure, and the pressed structure is obtained. The structure is flat. Moreover, since the window opening area of the substrate is not removed, it is possible to prevent the syrup from coming into contact with the conductive lines of the flexible circuit board when forming the outer layer wiring. However, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention cannot be limited thereby. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0027] FIG. 1 is a schematic cross-sectional view of a flexible circuit board according to an embodiment of the present technical solution. [0028] FIG. 2 is a schematic view of a first adhesive layer and a second adhesive layer provided by an embodiment of the present technical solution. 3 is a schematic cross-sectional view showing a first copper clad substrate and a second copper clad substrate according to an embodiment of the present technical solution. 4 is a cross-sectional view showing the first copper-clad substrate, the first adhesive layer, the flexible circuit board, the second adhesive layer, and the second copper-clad substrate sequentially pressed in the embodiment of the present invention. [0031] FIG. 5 is a schematic cross-sectional view of FIG. 4 after forming an outer conductive line. 6 is a schematic cross-sectional view showing the first substrate in FIG. 5 forming a second slit and the second substrate forming a fourth slit. 099138016 Form No. A0101 Page 11 of 23 0992066231-0 201220997 [0033] FIG. 7 is a schematic cross-sectional view showing the first window opening area and the second window opening area removed by an embodiment of the present technical solution. [Main component symbol description] [0034] Flexible circuit board: 110 [0035] Insulation layer: 111 [0036] First surface: 1111 [0037] Second surface: 1112 [0038] First conductive line: 112 [0039] Two conductive lines: 113 [0040] Bending area: 114 [0041] Fixed area: 115 [0042] First film: 120 [0043] First opening: 121 [0044] First copper-clad substrate: 130 [0045] A product area · 1301 [0046] First window opening area. 1302 [0047] First slit: 131 [0048] First substrate: 132 [0049] First copper foil layer: 133 [0050] First outer layer line: 134 Form No. A0101 099138016 Page 12 of 23 0992066231-0 201220997 [0051] %22 slit: 135 [0052] Second two film: 140 [0053] % Two openings: 141 [0054] Second copper Substrate: 150 [0055] Second-product area. 1501 [0056] Second two-window area: 1502 [0057] Third slit: 151 [0058] Second substrate: 152 [0059] Second copper foil layer: 153 [0060] Second outer layer: 154 [0061] Fourth slit: 155 0992066 23卜0 099138016 Form No. A0101 Page 13 of 23