TW201229666A - Radiation-sensitive resin composition, cured film, array substrate of liquid crystal display device, method for forming cured film and method for forming array substrate of liquid crystal display device - Google Patents
Radiation-sensitive resin composition, cured film, array substrate of liquid crystal display device, method for forming cured film and method for forming array substrate of liquid crystal display device Download PDFInfo
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- TW201229666A TW201229666A TW100137621A TW100137621A TW201229666A TW 201229666 A TW201229666 A TW 201229666A TW 100137621 A TW100137621 A TW 100137621A TW 100137621 A TW100137621 A TW 100137621A TW 201229666 A TW201229666 A TW 201229666A
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- 230000005855 radiation Effects 0.000 title claims abstract description 109
- 239000011342 resin composition Substances 0.000 title claims abstract description 74
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- 150000003871 sulfonates Chemical class 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 230000002889 sympathetic effect Effects 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- BZBMBZJUNPMEBD-UHFFFAOYSA-N tert-butyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OC(C)(C)C)CC1C=C2 BZBMBZJUNPMEBD-UHFFFAOYSA-N 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- CBXCPBUEXACCNR-UHFFFAOYSA-N tetraethylammonium Chemical compound CC[N+](CC)(CC)CC CBXCPBUEXACCNR-UHFFFAOYSA-N 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 125000001712 tetrahydronaphthyl group Chemical group C1(CCCC2=CC=CC=C12)* 0.000 description 1
- 125000004187 tetrahydropyran-2-yl group Chemical group [H]C1([H])OC([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000001412 tetrahydropyranyl group Chemical group 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- NJFUXFRJVIXVSG-UHFFFAOYSA-M tetramethylphosphanium;chloride Chemical compound [Cl-].C[P+](C)(C)C NJFUXFRJVIXVSG-UHFFFAOYSA-M 0.000 description 1
- GHPYAGKTTCKKDF-UHFFFAOYSA-M tetraphenylphosphanium;thiocyanate Chemical compound [S-]C#N.C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 GHPYAGKTTCKKDF-UHFFFAOYSA-M 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- 235000019529 tetraterpenoid Nutrition 0.000 description 1
- XDLNRRRJZOJTRW-UHFFFAOYSA-N thiohypochlorous acid Chemical compound ClS XDLNRRRJZOJTRW-UHFFFAOYSA-N 0.000 description 1
- 238000003971 tillage Methods 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- DQFBYFPFKXHELB-VAWYXSNFSA-N trans-chalcone Chemical compound C=1C=CC=CC=1C(=O)\C=C\C1=CC=CC=C1 DQFBYFPFKXHELB-VAWYXSNFSA-N 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- FRXCPDXZCDMUGX-UHFFFAOYSA-N tridecane-1,1-diamine Chemical compound CCCCCCCCCCCCC(N)N FRXCPDXZCDMUGX-UHFFFAOYSA-N 0.000 description 1
- KEROTHRUZYBWCY-UHFFFAOYSA-N tridecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C(C)=C KEROTHRUZYBWCY-UHFFFAOYSA-N 0.000 description 1
- XOALFFJGWSCQEO-UHFFFAOYSA-N tridecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C=C XOALFFJGWSCQEO-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 1
- 125000005591 trimellitate group Chemical group 0.000 description 1
- PHCPUBLHCIHBJG-UHFFFAOYSA-N trimethyl(sulfanyl)azanium Chemical compound C[N+](C)(C)S PHCPUBLHCIHBJG-UHFFFAOYSA-N 0.000 description 1
- CEYYIKYYFSTQRU-UHFFFAOYSA-M trimethyl(tetradecyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCC[N+](C)(C)C CEYYIKYYFSTQRU-UHFFFAOYSA-M 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- VSRBKQFNFZQRBM-UHFFFAOYSA-N tuaminoheptane Chemical compound CCCCCC(C)N VSRBKQFNFZQRBM-UHFFFAOYSA-N 0.000 description 1
- 229960003986 tuaminoheptane Drugs 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1313—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells specially adapted for a particular application
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
201229666 六、發明說明: 【發明所屬之技術領域】 本發明關於感放射線性樹脂組成物、硬化膜、曰 β 一一 日 θ ..,,員不凡件的陣列基板、硬化膜的形成方法及液晶顯示元 件的陣列基板的形成方法。 【先前技術】 近年來,電子紙等可撓性顯示器正在普及。就該可 撓性顯示器的基板而言’已研究了聚對苯二甲酸乙二隨 等塑膠基板。由於該基板在加熱時伸長或收縮,存在著 損:作為顯示器之功能的問題,因而有在研究可撓性顯 不态的製造程序的低溫化。製造可撓性顯示器時所需溫 度最高的程序之一是存在藉由加熱層間絕緣膜而進行燒 製的步驟,正在尋求該燒製步驟達到低溫化。 在目前情況下,就形成層間絕緣膜等硬化膜的材料 2言,用於獲得必需圖案形狀的步驟數少,並且可得到 问表面硬度的感放射線性樹脂組成物得到了廣泛使用。 就所述感放射線性樹脂組成物而言,已知的是含有:由 不飽和m酸和/或其酐、含環氧基的不飽和化合物等形成 的共聚物的感放射線性樹脂組成物,其構成使得可以藉 由叛基和環氧基的反應獲得作為硬化膜的表面硬度(參見 日本特開2001_354822號公報)。但是,就層間絕緣膜而言 ’為了將表面硬度提高至能夠達到實際商業上需要的水 準’需要超過200°C高溫的燒製步驟。因此,還考慮了藉 由添加作為環氧類材料的硬化劑使用的胺化合物,即使 在低溢下也能進行交聯反應的策略,其中,添加一般的 201229666 胺化a物時,可能會導致其與組成物中存在的環氧基之 隨時間進行而發生的反應,從而降低了儲存穩定性。 另外,已開發了含有即使進行低溫燒製也能夠進行 硬化的聚醯亞胺前驅物的可撓性顯示器的栅極絕緣膜用 塗布液的技術(參見日本特開2009 — 4394號公報)。但是, 忒塗布液不具有藉由曝光顯影而形成圖案的能力,因此 不可能形成微細圖案。而且,由於硬化反應性不充分, 燒製在1小時以上的時間,另外得到的層間絕緣膜等硬化 ,也達不到令人滿意的水準。而且,在可撓性顯示器的 1作工藝中’存在著在層間絕緣膜的上層形成積層物的 :形。在這種情況下’要求對於形成賦予層間絕緣膜以 向相對介電常數的積層物時使用的溶劑具有耐溶劑性。 基於這種情況,非常需要開發出適合於製造可撓性 顯不器用硬化膜的感放射線性樹脂組成物。 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2001_354822號公報 [專利文獻2]日本特開2〇〇9_4394號公報 【發明内容】 [發明所欲解決之課題] 供兼具低溫 性·的感放射 益的作為表 間絕緣膜、保護膜或 本發明疋基於以上i言接,浩、:兄品山201229666 6. TECHNOLOGICAL FIELD OF THE INVENTION [Technical Field] The present invention relates to a radiation sensitive linear resin composition, a cured film, an 曰β one-day θ.., an array substrate of a member, a method of forming a cured film, and a liquid crystal A method of forming an array substrate of a display element. [Prior Art] In recent years, flexible displays such as electronic paper have become widespread. For the substrate of the flexible display, a plastic substrate of polyethylene terephthalate has been studied. Since the substrate is elongated or contracted upon heating, there is a problem that it is a function of the display, and thus the temperature of the manufacturing process in which the flexibility is developed is lowered. One of the procedures requiring the highest temperature when manufacturing a flexible display is a step of firing by heating an interlayer insulating film, and the firing step is being sought to achieve a low temperature. In the present case, a material for forming a cured film such as an interlayer insulating film is used, and a number of steps for obtaining a necessary pattern shape is small, and a radiation-sensitive resin composition which can obtain a surface hardness is widely used. As the radiation sensitive resin composition, a radiation-sensitive resin composition containing a copolymer of an unsaturated m acid and/or an anhydride thereof, an epoxy group-containing unsaturated compound, or the like is known. The composition thereof makes it possible to obtain the surface hardness as a cured film by the reaction of a thiol group and an epoxy group (refer to Japanese Laid-Open Patent Publication No. 2001-354822). However, in the case of the interlayer insulating film, in order to increase the surface hardness to a level which can be practically required by the art, a firing step exceeding 200 ° C is required. Therefore, a strategy of crosslinking reaction by adding an amine compound used as a hardener for an epoxy-based material even under low overflow is also considered, and the addition of the general 201229666 aminated a substance may cause It reacts with the epoxy group present in the composition over time, thereby reducing storage stability. In addition, a technique of a coating liquid for a gate insulating film of a flexible display which can be cured by a polyimine precursor which can be cured by low-temperature firing has been developed (see Japanese Patent Laid-Open Publication No. 2009-4394). However, the ruthenium coating liquid does not have the ability to form a pattern by exposure and development, so that it is impossible to form a fine pattern. Further, since the curing reactivity is insufficient, the interlayer insulating film or the like obtained is hardened for a period of 1 hour or longer, and a satisfactory level is not obtained. Further, in the process of the flexible display, there is a shape in which a laminate is formed on the upper layer of the interlayer insulating film. In this case, it is required to have solvent resistance to a solvent used for forming a laminate in which an interlayer insulating film is applied to a relative dielectric constant. Based on this situation, it is highly desirable to develop a radiation sensitive resin composition suitable for producing a cured film for a flexible display. [PRIOR ART DOCUMENT] [Patent Document 1] JP-A-2001-354822 (Patent Document 2) JP-A-H07-4394 [Summary of the Invention] [Problems to be Solved by the Invention] Sense of radiation, as an inter-sheet insulating film, a protective film, or the present invention, based on the above i, 浩,: brother Pinshan
保護膜或隔離物的硬化膜。 器的你氐主 201229666 [解決課題之手段] 用於解決上述問題的發明為: 感放射線性樹脂組成物,其含有: [A]具有(A1)含有羧基的結構單元及含環氧基 的結構單元的共聚物(以下,也稱為「[A]共聚物」); [B ]酿一疊氮化合物;以及 [C]由i 3下述式(1)表示的化合物、下述式(2)表示 的化合物、三級胺化合物、胺鹽、鱗鹽、脒鹽、醯胺化 合物、酮亞胺化合物、封端型異氰酸酉旨化合物、含有, 坐%的化σ物及蘢合化合物的群組中選出的至少一種硬 化劑(以下,有時也稱為「[C]硬化劑」)。A cured film of a protective film or spacer. The object of the present invention is 201229666 [Means for Solving the Problem] The invention for solving the above problems is: a radiation sensitive resin composition containing: [A] having (A1) a structural unit having a carboxyl group and an epoxy group-containing structure a copolymer of a unit (hereinafter, also referred to as "[A] copolymer"); [B] an azide compound; and [C] a compound represented by the following formula (1): i, the following formula (2) a compound, a tertiary amine compound, an amine salt, a scale salt, a phosphonium salt, a guanamine compound, a ketimine compound, a blocked isocyanate compound, a compound, and a chelating compound. At least one hardener selected from the group (hereinafter sometimes referred to as "[C] hardener").
(式(1)中,〜汉6久 民各自獨立地為氫原子、 團或胺基。其中,Rlp6j; , 拉電子性基 ^ R中的至少—個為拉電 並且R丨〜R6中的至少.^ 电子性基團’ 丁巧主乂一個為胺基。另 1 上述胺基的全部 201229666 或部分氫原子可以被碳原子數1〜6的烷基取代。 式(2)中’ R7〜6各自獨立地為氫原子、拉電子性基 團或胺基。其中,R7〜R16中的至少一個為胺基。另外, 上述胺基的全部或部分氫原子可以被碳原子數1〜6的烷 基取代。A為單鍵、羰基、羰氧基、羰基亞甲基、亞磺醯 基、磺醯基、亞甲基或碳原子數2〜6的伸烷基。其中,上 述亞曱基及伸烷基的全部或部分氫原子可以被氰基、鹵 素原子或氟烷基取代。) 該感放射線性樹脂組成物,除了 [A]共聚物、[B]醌 二疊氮化合物外,藉由含有選自上述特定化合物的[C;] 硬化劑,在具有高放射線敏感度的同時,還對[A]共聚物 具有的環氧基等發生作為有效的硬化催化劑的作用,結 果兼具儲存穩定性和低溫燒製。另外,由該感放射線性 树月曰組成物形成的硬化膜的表面硬度、耐溶劑性及相對 介電常數優異,因此適宜被用作可撓性顯示器的層間絕 緣膜、保護膜或隔離物的形成材料。 較佳的[c]硬化劑是由包含上述式(1)及式(2)表示的(In the formula (1), ~ Han 6 Jiumin are each independently a hydrogen atom, a group or an amine group. Among them, Rlp6j;, at least one of the electron withdrawing groups R is a charge and R 丨 R R6 At least . ^ The electron group 'Ding Qiao is one amine group. The other 201229666 or part of the hydrogen atom of the above amine group may be substituted by an alkyl group having 1 to 6 carbon atoms. In the formula (2), each of 'R7~6 Independently, it is a hydrogen atom, an electron withdrawing group or an amine group, wherein at least one of R7 to R16 is an amine group. Further, all or a part of hydrogen atoms of the above amine group may be an alkyl group having 1 to 6 carbon atoms. Substituting A for a single bond, a carbonyl group, a carbonyloxy group, a carbonylmethylene group, a sulfinyl group, a sulfonyl group, a methylene group or an alkylene group having 2 to 6 carbon atoms. All or a part of the hydrogen atoms of the alkyl group may be substituted by a cyano group, a halogen atom or a fluoroalkyl group.) The radiation sensitive resin composition contains, in addition to the [A] copolymer, the [B] quinonediazide compound, [C;] hardener selected from the above specific compounds, while having high radiation sensitivity, also for [A] copolymer The epoxy group or the like which acts as an effective hardening catalyst has both storage stability and low-temperature firing. In addition, since the cured film formed of the radiation-sensitive linear mooncake composition is excellent in surface hardness, solvent resistance, and relative dielectric constant, it is suitably used as an interlayer insulating film, a protective film, or a separator of a flexible display. Form the material. A preferred [c] hardener is represented by the above formula (1) and formula (2).
對介電常數等。 了如上所述的效 保護膜或隔離物 由於該感放射線性樹脂組成物達到 果,因此適合於形成作為層間絕緣膜、 的硬化膜。 201229666 較佳的上述液晶配向劑是含有具光配向性基團的感 放射線性聚合物的液晶配向劑、或含有不具光配向性基 團的聚醯亞胺的液晶配向劑。 本發明的硬化膜的形成方法具有: (1) 在基板上形成該感放射線性樹脂組成物的塗膜 的步驟; (2) 對上述塗膜的至少一部分照射放射線的步驟; (3) 使經過上述放射線照射的塗膜顯影的步驟;及 (4) 對經過上述顯影的塗膜進行燒製的步驟。 使用S亥感放射線性樹脂組成物,藉由上述步驟形成 硬化膜時’由於是藉由利用感放射線性的曝光、顯影來 形成圖案,因而能夠容易地形成微細而精巧的圖案。另 外,使用S亥感放射線性樹脂組成物形成的硬化膜即使進 行低溫燒製也具有足夠的表面硬度等。 該形成方法中步驟(4)的燒製溫度較佳為20〇〇c以下 。除了利用感放射線性的微細圖案形成能力外,由於可 以進行這種低溫下的燒製,該形成方法適合被用於在可 撓性顯示器的塑膠基板上形成層間絕緣膜等硬化膜。 本發明還包含由该感放射線性樹脂組成物形成的作 為層間絕緣膜、保護膜或隔離物的硬化膜。 還有,本說明書中的所謂「燒製」是指對硬化膜加 熱至獲得所需要的強度。另外’曝光時照射的「放射線 」是包含可見光、紫外線、冑紫外線、χ放射線、帶電粒 子束等的概念。 [發明之效果] 201229666 根據本發明的感放射線性樹脂組成 具低溫燒製和儲存穩定性 ^ 兼 ι且具·有同感放射線性的戌 放射線性樹脂組成物、以及 支二過。作為可撓性顯示器用的 表面硬度、耐溶劑性及相對介 ;|电㊉數優異的層間絕緣膜 、作為保護膜或隔離物的硬化膜。 【實施方式】 [用以實施發明之形態] <感放射線性樹脂組成物> 本發明的感放射線性樹脂組成物含有[Α]共聚物、 [Β]醌二疊氮化合物及[c]硬化劑。另外,只要不損害本 發明的效果還可以含有任選的成分。以下,對各種成分 進行詳細說明。 77 < [Α]共聚物〉 [Α]共聚物是使(Ai)由包含不飽和羧酸及不飽和羧 酸針的群組中選出的至少一種單體(以下,有時也稱為「 (Α1)化合物」)和(Α2)含環氧基的不飽和化合物(以下,有 時也稱為「(Α2)化合物」)進行共聚形成的共聚物。 對於[Α]共聚物’例如可以藉由在溶劑中存在聚合弓丨 發劑的情況下,使提供含羧基結構單元的(A1)化合物和 提供含環氧基結構單元的(A 2)化合物進行共聚來製造。 另外’可以再加入(A3)提供含羥基結構單元的含羥基不 飽和化合物(以下,有時也稱為「(A3)化合物」),形成 共聚物。而且,在製造[A]共聚物時,可以與上述(A丨)化 合物、(A2)化合物及(A3)化合物一起,再加入(A4)化合 物(提供源自於上述(Al)、(A2)及(A3)化合物的結構單元 -10- 201229666 以外的結構單元的不飽和化合物),形成共聚物·。 [(Α1)化合物] 就(Α1)化合物而言,能夠列舉不飽和單羧酸、不飽 和二羧酸、不飽和二羧酸的酐、多元羧酸的單[(甲基)丙 烯醯氧基烷基]酯、兩個末端具有羧基和羥基的聚合物的 單(曱基)丙烯酸酯、具有羧基的不飽和多環式化合物及 其酐等。 就不飽和單羧酸而言,能夠列舉例如丙烯酸、甲基 丙烯酸、巴豆酸等; Α 列舉例如馬來酸、富馬 y 能夠列舉例如作為上述 就不飽和二叛酸而言,能夠 酸、檸康酸、中康酸、衣康酸等 就不飽和二叛酸的軒而言, 二缓酸例示的化合物的軒等; 二 就夕元缓酸的單[(甲基)丙稀醯氧基貌基]醋而士 夠列舉例如酸單[2_(甲基)㈣醯氧基乙。 甲酸單[2-(甲基)丙烯醯氧基乙蹄]等; 」η丨本 就兩個末端具有羧基和羥 的聚合物的單(甲其 烯酸酯而言,能夠列舉例如、丫丞)丙 婦酸醋等; ω竣基…醋單(甲基)丙 叭亿合物及其酐而 列舉例如5-羧基雙環[2.2 。此夠 -婦、5,6 -二幾其雔 [2.2.1]庚-2-烯、5_綾基巧 熳暴又% 7 丞又% [2.2.1]庚 _2_稀、 基·5·乙基雙環[2·2.1]庚·2·稀、4基.6.甲基雙環[2^ 庚-2-稀、5-竣基冬乙基雙環[2·2.] 雙環[2.2.1]庚-2·烯酐等。 ’—後基 •11- 201229666 在這些物質中,較佳係單羧酸、二羧酸酐,從共聚 反應性、對鹼水溶液的溶解性及獲得容易性上考慮更 佳係丙烯酸、甲基丙烯酸、馬來酸酐。這些(A 1)化合物 可以單獨使用,也可以混合使用兩種以上。 就(A 1)化合物的使用比例而言,基於(A 1)化合物及 (A2)化合物(必要時任選的(A3)化合物及(A4)化合物)的 合計’較佳為5質量%〜30質量。/。,更佳為1〇質量%〜25質 量% °藉由使(A 1)化合物的使用比例於上述範圍内,可以 得到[A]共聚物對鹼水溶液的溶解性達到最佳化,同時敏 感度優異的感放射線性樹脂組成物。 [(A2)化合物] (A2)化合物是含環氧基的不飽和化合物。就環氧基 而言’能夠列舉環氧乙烷基(1,2_環氧結構)、氧雜環丁烷 基(1,3 -環氧結構)。 就具有%氧乙烧基的不飽和化合物而言,能夠列舉 例如丙稀酸縮水甘油酯、甲基丙烯酸縮水甘油酯、曱基 丙稀酸2-曱基縮水甘油酯、α_乙基丙烯酸縮水甘油酯、α_ 正丙基丙烯酸縮水甘油酯、α_正丁基丙烯酸縮水甘油酯 '丙烯酸3,4-環氧丁酯、曱基丙烯酸3,心環氧丁酯、丙烯 酉文6,7 氧庚酯、甲基丙稀酸6,7_環氧庚酯、.α_乙基丙稀 酸-6,7-環氧庚酯、鄰乙烯基苄基縮水甘油醚、間乙烯基 苄基縮水甘油醚、對乙烯基苄基縮水甘油醚、甲基丙烯 酸3,4-環氧環己基甲酯等。在這些物質中,從提高共聚 反應性及硬化膜的耐溶劑性等方面考慮,較佳係曱基丙 烯酸縮水甘油酯、甲基丙烯酸2-曱基縮水甘油酯、曱基 -12- 201229666 丙烯酸-6,7-環氧庚 烯基苄基縮水甘、i θ '卩乙烯基苄基縮水甘油醚、間乙 丙烯酸3,4-if t 烯基苄基縮水甘油醚、曱基 衣礼%己酯。 就具有氡雜環丁 舉例如 "° 土的不飽和化合物而言,能夠列 夂(丙烯醯氧基甲 基甲基氧雜環丁 J %丁燒、3_(丙稀醢氧基甲 環丁烧、3 & 沉、3-(丙烯醯氧基曱基)-3-乙基氧雜 (丙烯醯氧基审I。 3-(丙稀醯氧基甲其 ^ —氟甲基氧雜環丁院、 氧基甲基)-2Γ策其二_2-五氟乙基氧雜環丁烷、3-(丙烯醯 二氟氧雜環丁 /『雜環丁烷、3_(丙烯醯氧基甲基)_2,2- 丁燒、3-(丙二 烯酿氧基甲基)-2,2,4·三氟氧雜環 (丙烯醯氧基甲其、η。 3-(2-丙烯醯氦 土)-2,2,4,4-四氟氧雜環丁烷、 π歸酿氧基乙基)氡 )-2-乙基義雜ρ )軋雜% 丁烷、3-(2-丙烯醯氧基乙基 番乳雜% 丁烷、3 環丁燒、3♦丙稀酿氧C乙基A乙基氧雜 丙氧基乙基二 丙烯醯氧基乙基)_2_裳其备 基氧雜衣丁烷、3-(2_ 乙基)-2 2 _ ϋ产 土雜% 丁烷、3-(2-丙烯醯氧基 ”,2,…一…環丁炫、3_(2_丙浠醢氧基乙基 四氟氧-( _丙烯醯氧基乙基)-2,2,4,4_ 乳雊王衣丁烷等丙烯酸酯; 3-(甲基丙烯醯氧基甲基 醯氧基甲基)_2_甲基氧雜"“院、3_(甲基丙婦 基)-3-乙其〃 氧雜%丁烷、3_(甲基丙烯醯氧基甲 乙基氧雜環丁烷、3 Τ 尹基氧雜产丁& (甲基丙烯醯氧基f基)-2•三氟 g ^烷、3_(甲基丙烯醯氧基甲;《0277盔 氧雜環丁烷、3 (甲美^ 軋暴甲基)·2-五氟乙基 3 (甲基丙歸酿氧基甲基)_2_苯基氧雜環丁 -13- 201229666 烧、3-(甲基丙烯醯氧基曱基)_2,2_二氟氧雜環丁烷、 甲基丙烯醯氧基甲基)_2,2,4-三氟氧雜環丁烷、3-(曱基呙 烯醯氧基甲基)-2,2,4,4-四氟氧雜環丁烷、3_(2_曱基丙烯 醯氧基乙基)氧雜環丁烷、3_(2_甲基丙烯醯氧基乙基 乙基氧雜環丁烷、3-(2 -曱基丙烯醯氧基乙基)_3_乙基氣 雜環丁烧、3-(2-甲基丙烯醯氧基乙基)_2_三氟甲基氧雜 環丁烷、3-(2-曱基丙烯醯氧基乙基)_2_五氟乙基氡雜環 丁烧、3-(2-曱基丙烯醯氧基乙基)_2_苯基氧雜環丁烷、 3-(2-曱基丙烯醯氧基乙基)_2,2_二氟氧雜環丁烷、3·(2_ 曱基丙烯醯氧基乙基)_2,2,4_三氟氧雜環丁烷、3 (2_甲基 丙烯醯氧基乙基)_2,2,4,4_四氟氧雜環丁烷等曱基丙烯酸 醋等。這些(Α2)化合物可以單獨使用,也可以混合使用 兩種以上。 就(Α2)化合物的使用比例而言,基於(Α1)化合物及 (Α2)化合物(必要時任選的(A3)化合物及(Α4)化合物)的 合計,較佳為5質量%〜6〇質量%,更佳為丨〇質量%〜5〇質 3: %。藉由使(Α2)化合物的使用比例於上述範圍内,能夠 形成具有優異的耐溶劑性等的硬化膜。 [(A3)化合物] ' 就(Α3)化合物而言,能夠列舉具有羥基的(曱基)丙 婦酉夂知、下述式(3)表示的含紛性m的不飽和化合物等 -14- 201229666For dielectric constants, etc. The protective film or separator as described above is suitable for forming a cured film as an interlayer insulating film because the radiation-sensitive resin composition has a desired effect. The liquid crystal alignment agent of the above-mentioned liquid crystal alignment agent is a liquid crystal alignment agent containing a radiation-sensitive polymer having a photo-alignment group, or a liquid crystal alignment agent containing a polyimide having no photo-alignment group. The method for forming a cured film of the present invention comprises: (1) a step of forming a coating film of the radiation sensitive resin composition on a substrate; (2) a step of irradiating at least a part of the coating film with radiation; (3) passing a step of developing the coating film by the radiation irradiation; and (4) a step of firing the coating film subjected to the above development. When the cured film is formed by the above-described steps using the S-ray radiation-reducing resin composition, the pattern is formed by exposure and development by sensitization, so that a fine and delicate pattern can be easily formed. Further, the cured film formed using the S-ray radiation-reducing resin composition has sufficient surface hardness or the like even if it is fired at a low temperature. The firing temperature in the step (4) in the forming method is preferably 20 〇〇c or less. In addition to the ability to form a fine pattern of radiation, since the firing at such a low temperature can be performed, the forming method is suitable for forming a cured film such as an interlayer insulating film on a plastic substrate of a flexible display. The present invention also encompasses a cured film formed of the radiation sensitive resin composition as an interlayer insulating film, a protective film or a separator. Further, "burning" in the present specification means heating the cured film to obtain the required strength. Further, "radiation" irradiated during exposure is a concept including visible light, ultraviolet light, ultraviolet light, xenon radiation, charged particle beam, and the like. [Effects of the Invention] 201229666 The radiation-sensitive resin composition according to the present invention has a low-temperature firing and storage stability, and has a radioactive linear resin composition and a conjugated radiation. It is an interlayer insulating film excellent in surface hardness, solvent resistance, and relative density for a flexible display, and a cured film as a protective film or a separator. [Embodiment] [Formation for Carrying Out the Invention] <Sensitive Radiation Resin Composition> The radiation sensitive resin composition of the present invention contains a [Α] copolymer, a [Β] quinonediazide compound, and [c] hardener. Further, optional components may be contained as long as the effects of the present invention are not impaired. Hereinafter, various components will be described in detail. 77 < [Α] copolymer> [Α] The copolymer is at least one monomer selected from the group consisting of unsaturated carboxylic acid and unsaturated carboxylic acid needle (Ai, hereinafter, sometimes referred to as " (Α1) a compound formed by copolymerization of an epoxy group-containing unsaturated compound (hereinafter sometimes referred to as "(Α2) compound)"). For the [Α] copolymer, for example, the compound (A1) which provides a carboxyl group-containing structural unit and the (A 2) compound which provides an epoxy group-containing structural unit can be subjected to the presence of a polymerization initiator in a solvent. Copolymerization to manufacture. Further, (A3) a hydroxyl group-containing unsaturated compound (hereinafter sometimes referred to as "(A3) compound") which provides a hydroxyl group-containing structural unit may be further added to form a copolymer. Further, in the production of the [A] copolymer, the compound (A4) may be further added together with the above (A丨) compound, (A2) compound and (A3) compound (provided from the above (Al), (A2) And (A3) a structural unit of the compound (A30), an unsaturated compound of a structural unit other than 201229666), forming a copolymer. [(Α1) compound] Examples of the (Α1) compound include an unsaturated monocarboxylic acid, an unsaturated dicarboxylic acid, an anhydride of an unsaturated dicarboxylic acid, and a mono[(meth)acryloxy group of a polyvalent carboxylic acid. Alkyl]ester, a mono(indenyl)acrylate of a polymer having a carboxyl group and a hydroxyl group at both ends, an unsaturated polycyclic compound having a carboxyl group, an anhydride thereof, and the like. Examples of the unsaturated monocarboxylic acid include acrylic acid, methacrylic acid, crotonic acid, and the like; Α For example, maleic acid and fumar y can be enumerated, for example, as the above-mentioned unsaturated ditinoic acid, which can be acid and lemon. Kang acid, mesaconic acid, itaconic acid, etc., in the case of unsaturated two-repulsive acid Xuan Xuan, the compound of the diacidic acid exemplified by Xuan et al; The appearance of vinegar is exemplified by, for example, acid mono[2_(methyl)(tetra)decyloxy. Formic acid mono [2-(methyl) propylene oxime oxime], etc.; η 丨 就 就 就 就 就 就 就 单 单 单 单 单 单 单 单 单 单 单 单 单 单 单 单 单 单 单 单 单 单 单 单Cyanine vinegar, etc.; omega fluorenyl... vinegar mono(methyl) propyl phenanthrene and its anhydride are exemplified by, for example, 5-carboxybicyclo[2.2. This is enough - women, 5,6 - two more 雔 [2.2.1] hept-2-ene, 5 绫 熳 熳 又 又 又 又 % % % % % 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 · Ethyl bicyclo [2 · 2.1] G · 2 · dilute, 4 base. 6. Methyl bicyclo [2 ^ hept-2-dilute, 5-nonyl winter ethyl bicyclo [2 · 2.] bicyclo [2.2. 1] Geng-2·enic anhydride and the like. '—Back group•11- 201229666 Among these, a monocarboxylic acid and a dicarboxylic acid anhydride are preferable, and acrylic acid and methacrylic acid are preferable from the viewpoints of copolymerization reactivity, solubility to an aqueous alkali solution, and ease of availability. maleic anhydride. These (A 1) compounds may be used singly or in combination of two or more. The total ratio of the (A 1) compound and the (A2) compound (optionally (A3) compound and (A4) compound) is preferably 5% by mass to 30% in terms of the ratio of use of the (A 1) compound. quality. /. More preferably, it is 1% by mass to 25% by mass. By using the ratio of the compound (A 1) in the above range, the solubility of the [A] copolymer in the aqueous alkali solution can be optimized, and the sensitivity is improved. Excellent radiation sensitive resin composition. [(A2) Compound] The compound (A2) is an epoxy group-containing unsaturated compound. The epoxy group can be exemplified by an oxiranyl group (1,2-epoxy structure) or an oxetane group (1,3-epoxy structure). Examples of the unsaturated compound having a % oxyethylene group include glycidyl acrylate, glycidyl methacrylate, 2-mercapto glycidyl thioglycolate, and α-ethyl acrylate shrinkage. Glyceride, α-glycidyl glycidyl ester, α_n-butyl acrylate glycidyl ester 3,4-epoxybutyl acrylate, methacrylic acid 3, butyl epoxide, propylene oxime 6,7 oxygen Heptyl ester, methacrylic acid 6,7-epoxyheptyl ester, .α-ethyl acrylate acid-6,7-epoxyheptyl ester, o-vinylbenzyl glycidyl ether, m-vinylbenzyl shrinkage Glycerol ether, p-vinylbenzyl glycidyl ether, 3,4-epoxycyclohexylmethyl methacrylate, and the like. Among these, from the viewpoint of improving copolymerization reactivity and solvent resistance of the cured film, etc., glycidyl methacrylate, 2-mercapto glycidyl methacrylate, thiol-12-201229666 acrylic acid- 6,7-epoxyheptenylbenzyl glycidyl, i θ '卩 vinyl benzyl glycidyl ether, m-acetyl 3,4-if t alkenyl benzyl glycidyl ether, decyl hexyl hexyl ester . In the case of an unsaturated compound having a heterocyclic ring, such as "°, it can be listed as a propylene oxymethyl methyl oxetane J % butadiene, 3 _ acetoxymethoxycyclobutane Sinter, 3 & s, 3-(acryloxycarbonyl)-3-ethyl oxa (propylene oxy oxime I. 3-( acetoxycarbonyl ketone) - fluoromethyl oxacyclohexane Dingyuan, oxymethyl)-2Γ2-2-pentafluoroethyl oxetane, 3-(propylene fluorene difluorooxetane/"heterocyclobutane, 3_(propylene oxime) Methyl) 2,2-butane, 3-(propadienyloxymethyl)-2,2,4·trifluorooxocyclo(propylene methoxymethyl, η 3-(2-propene) Bauxite)-2,2,4,4-tetrafluorooxetane, π-reduced oxyethyl) 氡)-2-ethyl-isomer ρ)-rolled % Butane, 3-(2- Propylene oxime ethyl acetonide % butane, 3 ring butyl sulphide, 3 ♦ propylene oxy-C-ethyl Aethyl oxapropoxyethyl propylene oxyethyl) _2 Oxyloxetane, 3-(2-ethyl)-2 2 _ ϋ 土 % 、, 3-(2-propenyl oxy), 2, ... a ring 炫, 3_(2_ Propyloxyethyltetrafluoro-(-propylene oxide) Ethyl ethyl)-2,2,4,4_ acrylates such as butyl ketone; 3-(methacryloxymethyloxymethyl)_2-methyl oxa " 3_(methylpropanyl)-3-acetonitrile oxaxane butane, 3_(methacryloxymethylethyloxetane, 3 尹 基 氧 氧 & amp & (methacryl醯oxyf-yl)-2•trifluoro-g^, 3_(methacryloxyl-methyl; “0277 helmet oxetane, 3 (methyl meth] rolling methyl) 2-fluoropenta Base 3 (methyl propyl ethoxymethyl) 2 _ phenyl oxetane-13- 201229666, 3-(methacryloxycarbonyl) 2,2-difluorooxetane , methacryloxymethyl) 2,2,4-trifluorooxetane, 3-(mercaptodecyloxymethyl)-2,2,4,4-tetrafluorooxa Cyclobutane, 3-(2- mercaptopropenyloxyethyl)oxetane, 3-(2-methacryloxyethylethyloxetane, 3-(2-indenyl) Propylene oxiranyl ethyl) _3_ethyl oxetane, 3-(2-methylpropenyloxyethyl)_2-trifluoromethyloxetane, 3-(2-mercapto Propylene oxiranyl ethyl) 2_pentafluoroethyl hydrazine, 3- (2-mercaptopropenyloxyethyl)_2_phenyloxetane, 3-(2-mercaptopropenyloxyethyl)_2,2-difluorooxetane, 3· (2_ mercaptopropenyloxyethyl)_2,2,4-trifluorooxetane, 3 (2-methacryloxyethyl)_2,2,4,4-tetrafluorooxa A thioglycolic acid vinegar such as cyclobutane. These (Α2) compounds may be used singly or in combination of two or more. The ratio of the (Α2) compound to be used is preferably 5% by mass based on the total of the (Α1) compound and the (Α2) compound (optionally (A3) compound and (Α4) compound). %, more preferably 丨〇 mass% ~ 5 〇 quality 3: %. By using the ratio of the (Α2) compound in the above range, a cured film having excellent solvent resistance and the like can be formed. [(A3) compound] In the case of the (Α3) compound, a (meth) group having a hydroxyl group, an unsaturated compound containing a condensed m represented by the following formula (3), and the like can be cited. 201229666
工迎式(3 )令,r 1 7 .知 R丨8〜R22各自獨立:風原子或碳原子數1〜4的烷基。 基。γ為單鍵、_c〇〇氧原子、羥基或碳原子數1〜4的烷 中,R18〜R22中认 或.C〇NH-°p為〇〜3的整數。其 ^ 、、的1少-個為羥基。 就上述具有羥基的 例如⑽)丙稀酸經基言,能夠列舉 、(甲基)丙烯酸,基曱基)丙稀酸-2_經基乙酿 ' t 7 - r r 曰(曱基)丙烯酸-4-羥基丁酯 -醇(n=2〜10)單(曱基)丙烯酸r曰、聚丙二醇 2〜丨〇)單(曱基)丙烯酸酯、(曱基)丙烯酸·2,3·二羥基丙酿 、2_甲基丙烯醯氧乙基糖苷等。 就上述式(3)表示的含有盼性羥基的不飽和化合物 而言,取決於Υ和Ρ的定義,能夠列舉例如下述式(3-1)〜 式U-5)表示的化合物等。 -15- 201229666 R 17 〇The formula (3), r 1 7 . Know that R丨8 to R22 are each independently: a wind atom or an alkyl group having 1 to 4 carbon atoms. base. γ is a single bond, a _c 〇〇 oxygen atom, a hydroxyl group or an alkane having 1 to 4 carbon atoms, and R18 to R22 or .C〇NH-°p is an integer of 〇3. One of the ^ and , one is a hydroxyl group. With respect to the above-mentioned (10)) acrylic acid having a hydroxyl group, it can be exemplified that (meth)acrylic acid, fluorenyl-acrylic acid-2_ thiophene-t 7 -rr 曰(fluorenyl)acrylic acid- 4-hydroxybutyl ester-alcohol (n=2~10) mono(indenyl)acrylic acid r曰, polypropylene glycol 2~丨〇)mono(indenyl)acrylate, (mercapto)acrylic acid·2,3·dihydroxy Acrylic, 2-methacryloxyethyl glucoside and the like. The unsaturated compound containing a desired hydroxyl group represented by the above formula (3), for example, a compound represented by the following formula (3-1) to formula (U-5), and the like, depending on the definition of hydrazine and hydrazine. -15- 201229666 R 17 〇
R20 上述式(3-1)中’ q為1〜3的整數。R1 中的含義相同。X/R17R20 In the above formula (3-1), 'q' is an integer of 1 to 3. The meaning in R1 is the same. X/R17
R 22 與上述式(3)R 22 and the above formula (3)
R17〜R22與上述式(3)中 含義相同。 上述式(3-2)中, R17R17 to R22 have the same meanings as in the above formula (3). In the above formula (3-2), R17
(3-3) 上述式(3-3)中,r為1〜3的整數。R17〜R22 中的含義相同。 與上述式(3) -16 - ZUlZZ^bbb X^R17(3-3) In the above formula (3-3), r is an integer of 1 to 3. The meanings in R17 to R22 are the same. With the above formula (3) -16 - ZUlZZ^bbb X^R17
R20 上述式(3-4)中,r:X/R17 R22 與上述式(3)中 的含義相同 r22nAv/r18R20 In the above formula (3-4), r:X/R17 R22 has the same meaning as in the above formula (3) r22nAv/r18
R1a R20 <^>5) 上返式(3-5)中 J\. ^ 在這些(A3)化合物令,與上述式(3)中的含義相同。 酯、曱基丙烯酸羥某_較佳係甲基丙烯酸-2-羥基乙 乙烯、α-甲基-對羥基笨乙 羥基苯乙烯、對羥基苯 使用,也可以混合使用兩種^這些(Α3)化合物可以單獨 1 至从上。 就(A3)化合物的使用比 人从n m、 λ 】而言,基於(Α1)化合物、 (A2)化合物及(/13)化合物 人呻 h从* 、要時任選的(A4)化合物)的 合计’較佳為5質量%〜3〇質蜃。/ θ 0/ — · 貝里/〇,更佳為10質量%~25質 罝/〇。稭由使(A3)化合物的使用^ , Κ用比例於上述範圍内,能夠 形成具有優異耐溶劑性等的硬化膜。 [(Α4)化合物] -17- 201229666 (A4)化合物,只要是上述的(A1)化合物、(A2)化合 物及(A 3 )化合物以外的不飽和化合物就沒有特別的限制 。就(A4)化合物而言’能夠列舉例如甲基丙烯酸鏈狀炫 基酯、甲基丙烯酸環狀烧基酯、丙烯酸鏈狀烧基酯、丙 烯酸環狀烷基酯、甲基丙烯酸芳基酯、丙烯酸芳基酯、 不飽和二羧酸二酯、雙環不飽和化合物、馬來醯亞胺化 合物、不飽和芳香族化合物、共軛二烯烴、含有四氫呋 喃骨架、呋喃骨架、四氫旅喃骨架、哌喃骨架、下述式 (4)表示的骨架的不飽和化合物及其它的不飽和化合物 等。R1a R20 <^>5) In the above formula (3-5), J\. ^ In these (A3) compound, the meaning is the same as in the above formula (3). Ester, mercapto hydroxy hydroxy _ preferably methacrylic acid 2-hydroxyethyl ethene, α-methyl-p-hydroxy stupid hydroxy styrene, p-hydroxybenzene, or a mixture of two ^ (3) Compounds can be isolated from 1 to above. The use of the (A3) compound is based on the (Α1) compound, the (A2) compound and the (/13) compound human 呻h from *, optionally the (A4) compound, as compared to humans from nm, λ] The total amount is preferably 5% by mass to 3 〇. / θ 0/ — · Berry / 〇, more preferably 10% by mass ~ 25 mass 罝 / 〇. The straw can be formed into a cured film having excellent solvent resistance and the like by using the compound (A3) in a ratio of the above. [(Α4) compound] -17-201229666 (A4) The compound is not particularly limited as long as it is an unsaturated compound other than the above (A1) compound, (A2) compound and (A3) compound. The (A4) compound can be exemplified by, for example, a chain styrene methacrylate, a carboxylic acid cyclic alkyl ester, an acrylic chain alkyl ester, a acryl cyclic alkyl acrylate, or an aryl methacrylate. Aryl acrylate, unsaturated dicarboxylic acid diester, bicyclic unsaturated compound, maleimide compound, unsaturated aromatic compound, conjugated diene, tetrahydrofuran skeleton, furan skeleton, tetrahydronane skeleton, piperazine An unsaturated structure of a skeleton, a skeleton represented by the following formula (4), and other unsaturated compounds.
上述式(4)中,R2為氫原子或曱基。s為1以上的整數 〇 就曱基丙烯酸鏈狀烷基酯而言,能夠列舉例如曱基 丙烯酸曱酯、曱基丙烯酸乙酯、曱基丙烯酸正丁 _ '甲 基丙烯酸第二丁酯、曱基丙烯酸第三丁酯、甲基丙稀酸 2 -乙基己g旨、甲基丙稀酸異癸鴨、甲基丙婦酸正月桂自旨' 甲基丙烯酸十三烷基酯、曱基内烯酸正十八院基酿等。 就甲基丙烯酸環狀烷基酯而言,能夠列舉例如甲基 丙烯酸環己酯、曱基丙烯酸2-甲基環己酯、曱基丙稀酸 三環[5.2.1.02’6]癸-8-酿、曱基丙烯酸三環[521〇26]癸 -8-基氧乙酯、曱基丙稀酸異冰片醋等。 -18- 201229666 就丙烯酸鏈狀烷基酯而言,能夠列舉例如丙烯酸甲 酯、丙烯酸乙酯、丙烯酸正丁酯、丙烯酸第二丁酯、丙 烯酸第三丁酯、丙烯酸2-乙基己酯、丙烯酸異癸酯、丙 烯酸正月桂醋、丙烯酸十三烧基S旨、丙浠酸正十八烧基 酯等。 就丙烯酸環狀烷基酯而言,能夠列舉例如丙烯酸環 己酯、丙烯酸2-甲基環己酯、丙烯酸三環[5.2.1.02’6]癸- 8-酯、丙烯酸三環[5.2.1.02’6]癸-8-基氧基乙酯、丙烯酸異 冰片酯等。 就甲基丙烯酸芳基酯而言,能夠列舉例如曱基丙烯 酸苯酯、甲基丙烯酸苄酯等。 就丙烯酸芳基S旨而言,能夠列舉例如丙烯酸苯S旨、 丙烯酸苄酯等。 就不飽和二羧酸二酯而言,能夠列舉例如馬來酸二 乙酯、富馬酸二乙酯、衣康酸二乙酯等。 就雙環不飽和化合物而言,能夠列舉例如雙環 [2.2.1] 庚-2-烯、5 -甲基雙環[2.2.1]庚-2-烯、5 -乙基雙環 [2.2.1] 庚-2-烯、5 -甲氧基雙環[2.2.1]庚-2-烯、5 -乙氧基 雙環[2.2.1]庚-2-烯、5,6-二甲氧基雙環[2.2.1]庚-2-烯、. 5,6-二乙氧基雙環[2.2.1]庚-2-烯、5-第三丁氧羰基雙環 [2.2.1] 庚-2-烯、5-環己氧羰基雙環[2.2.1]庚-2-烯、5-苯 氧羰基雙環[2.2.1]庚-2-烯、5,6-二(第三丁氧羰基)雙環 [2.2.1] 庚-2-烯、5,6-二(環己氧羰基)雙環[2.2.1]庚-2-烯 、5-(2’-羥基乙基)雙環[2.2.1]庚-2-烯、5,6-二羥基雙環 [2.2.1] 庚-2-烯、5,6-二(羥基甲基)雙環[2.2.1]庚-2-烯、 201229666 5,6-二(2,-羥基乙基)雙環[2.2.1]庚_2_烯、弘羥基_5_甲基 雙環[2.2.U庚-2-稀、5-經基-5_乙基雙環[2 2^庚-厂烯、 5-羥基甲基-5-甲基雙環[2.2.1]庚-2_歸等。 就馬來酿亞胺化合物而言,能夠列舉例如N_苯基馬 來酿亞胺、N-環己基馬來醯亞胺、N_节基、 N-(4-羥基苯基)馬來醯亞胺、N_(44f基节基)馬來醯亞胺 、N-琥雖醯亞胺基-3-馬來醯亞胺苯曱酸_、N —琥拍醯亞 胺基-4·馬來醯亞胺丁酸酯、琥珀醯亞胺基_6_馬來醯亞 胺己酸酯、N -琥珀醯亞胺基-3 -馬來酿亞胺丙酸醋、n _(9 _ 吖啶基)馬來醯亞胺等。 就不飽和芳香族化合物而言,能夠列舉例如苯乙稀 、α-甲基苯乙烯、間甲基苯乙烯、對甲基苯乙烯、乙烯 基甲苯、對甲氧基苯乙烯等。 就共輛二烯烴而言,能夠列舉例如丨,3_ 丁二烯、異 戊二烯、2,3-二甲基- i,3-丁二稀等。 就含有四氫呋喃骨架的不飽和化合物而言,能夠列 舉例如四氫糠基(甲基)丙烯酸酯、2_甲基丙烯醯氧基-丙 酉夂四氫糠基酯、3-(甲基)丙烯醯氧基四氫呋喃_2_酮等。 就含有呋喃骨架的不飽和化合物而言,能夠列舉例 如2_甲基-5-(3-吱喃基)小戊烯_3_酮、(甲基)丙烯酸糠酯 、1-呋喃-2-丁基-3-烯-2-酮、i •呋喃_2_ 丁基-3-甲氧基_3_ 烯-2-酮、6-(2-呋喃基)_2_〒基_丨_己烯_3_酮、6_呋喃_2_ 基-己-1-烯-3-酮、丙烯酸_2_呋喃_2_基-卜甲基-乙基酯、 6_(2-»夫喃基)-6-甲基-1-庚烯-3_酮等。 就含有四氫裉喃骨架的不飽和化合物而言,能夠列 -20- 201229666 舉例如曱基丙烯酸(四氫哌喃_2_基)甲酯、2 6_二甲基_8 ( 四氫終2-基氧)_辛]稀_3,、2_甲基丙稀酸四二底喃 -2·基酯、1_(四氫哌喃_2_氧)_ 丁基_3-烯_2_酮等。 就含有哌喃骨架的不飽和化合物而言,能夠列舉例 如4-(M-二氧雜_5_氧_6_庚烯基)_6_甲基_2_哌喃、4_(ι,5_ 二氧雜-6-氧辛烯基)_6_曱基_2_哌喃等。 就其它的不飽和化合物而言,能夠列舉例如丙稀腈 甲基丙稀腈、氣乙稀、偏氯乙稀、丙#酿 烯醯胺、醋酸乙烯酯等。 t在這些(A4)化合物中,較佳係曱基丙烯酸鏈狀烷基 面曰曱基丙烯酸環狀烧基酯、馬來醯亞胺化合物、含有 四氫呋喃骨架、呋喃骨架、四氫哌喃骨架、哌喃骨架、 上述式(4)表示的骨架的不飽和化合物、不飽和芳香族化 合物、丙婦酸環狀烧基§旨。在此等中,從共聚反應性對 驗水溶液的溶解性方面考慮,較佳係苯乙烯、曱基丙稀 酸曱酯、曱基丙烯酸第三丁酯、甲基丙烯酸正月桂酯、 甲基丙稀酸三環[5·2丄〇2’6]癸+醋、_曱氧基苯乙烯、 丙烯S文2 -曱基j衣己酯、Ν -苯基馬來醯亞胺、Ν_環己 來醯亞胺、四氫糠基(曱基)丙烯酸醋、聚乙二醇(η=2二㈧ 單(甲基)丙_醋、3-(曱基)丙烯酿氧基四氫咬喃·2,。 這些(Α4)化合物可以單獨使用,也可以混合使用兩種以 上。 就(Α4)化合物的使用比例而言,基於(Α1)化合物、 (Α2)化合物及(Α4)化合物(及任選的化合物)的合計 ’較佳為10質量%〜70質量%,更佳為2〇質量%〜6〇質量。/。 -21 - 201229666 5侖匕夠 。藉由使(A4)化合物的使用比例處於上述範園内 形成耐溶劑性等優異的硬化膜。 < [A ]共聚物的合成方法> 入《 51居务劑 [A]共聚物可以藉由例如在溶劑中存在聚&引 的情況下’使上述(A 1)化合物及(a 2)化合物(任選的( 化合物及(A 4)化合物)進行共聚來製造。 从,玄劍而 就用於製造[A]共聚物的聚合反應中使用的7分 言,能夠列舉例如醇、二醇峻、乙二醇炫基®^ ®曰& "0 二乙·一醉早院基_1、二乙二醇二烧基鍵、二丙·一 一烧 基醚、丙二醇單烷基醚、丙二醇烷基醚醋酸酯、丙二醇 單烷基醚丙酸酯、酮、酯等。 就酵而言,能夠列舉例如节醇等; 就二醇醚而言,能夠列舉例如乙二醇單曱基趟、乙 二醇單乙基醚等; 就乙二醇烷基醚醋酸酯而言,能夠列舉例如乙二醇 單丁基醚醋酸酯、二乙二醇單乙基醚醋酸酯等; 就二乙二醇單烷基醚而言,能夠列舉例如二乙二醇 單甲基醚、二乙二醇單乙基醚等; 就·一乙二醇二烧基謎而言,能夠列舉例如二乙二醇二 曱基醚、二乙二醇二乙基醚、二乙二醇乙基曱基趟等; 就一丙二醇二烧基而言,能夠列舉例如二丙二醇 二甲基醚、二丙二醇二乙基醚、二丙二醇乙基曱基喊等 9 就丙一醉单烧基謎而言,能夠列舉例如丙二醇甲基 醚、丙二醇乙基趟、丙二醇丙基醚、丙二醇丁基喊等; -22- 201229666 就丙二醇單烷基醚醋酸酯而言,能夠列舉例如丙二 醇單甲基醚醋酸酯、丙二醇單乙基醚醋酸酯等; 就丙二醇單烷基醚丙酸酯而言,能夠列舉例如丙二 醇甲基醚丙酸酯、丙二醇乙基醚丙酸酯、丙二醇丙基醚 丙酸酯等; 就酮而言,能夠列舉例如甲基乙基酮、環己酮、4-羥基-4-曱基-2-戊酮、甲基異戊酮等; 就酯而言,能夠列舉例如醋酸乙酯、醋酸丁酯、醋 酸3 -甲氧基丁酯、2-羥基丙酸乙酯、2-羥基-2-甲基丙酸 曱酯、2-羥基-2-曱基丙酸乙酯、羥基醋酸丁酯、乳酸甲 酯、乳酸乙酯、乳酸丙酯、乳酸丁酯、2 -乙氧基丙酸乙 酯、2-乙氧基丙酸丙酯、2-乙氧基丙酸丁酯、2-丁氧基丙 酸曱酯、2-丁氧基丙酸乙酯、2-丁氧基丙酸丙酯、2-丁氧 基丙酸丁酯、3 -曱氧基丙酸曱酯、3 -曱氧基丙酸乙酯、 3 -曱氧基丙酸丙酯、3 -甲氧基丙酸丁酯、3 -乙氧基丙酸曱 酯、3 -乙氧基丙酸乙酯、3 -乙氧基丙酸丙酯、3 -乙氧基丙 酸丁酯、3 -丙氧基丙酸曱酯等。 在這些溶劑中,較佳係醋酸3 -曱氧基丁酯、乙二醇 烷基醚醋酸酯、二乙二醇單烷基醚、二乙二醇二烷基醚 、丙二醇單烷基醚、丙二醇烷基醚醋酸酯,更佳係醋酸 3 -曱氧基丁酯、二乙二醇二甲基醚、二乙二醇甲基乙基 醚、丙二醇單甲基醚、丙二醇單曱基醚醋酸酯。 就用於製造[A]共聚物的聚合反應中使用的聚合引 發劑而言,可以使用一般作為自由基聚合引發劑公知的 物質。就自由基聚合引發劑而言,能夠列舉例如2,2’-偶 -23- 201229666 氮雙異丁腈(AIBN)、2,2’_偶氮雙 偶氣雙,甲氧基…甲基二;4等,曱基戍腈)n 化苯甲醯、過氧 偶氮化合物;過氧 雙(過氧化第二 過孔化新戊酸第三丁H " 環己烧等有機過氧化物及過氧化; 氧化物與還原劑同時使用作仏二劑時’也可以將過 于便用作為虱化還原型引發劑。 旦,=用於製造[Α]共聚物的聚合反應中,為了調節分子 Γ二以使用分子量調節劑。分子量調節劑能夠列舉例 如氣仿、四溴化碳等函化烴類;正己基硫醇、正辛基硫 醇、正十—烷基硫醇、第三一十二烷基硫醇、巯基乙酸 等硫醇類;二甲基硫化黃原酸、二異丙基二硫黃原酸等 黃原酸類;對蓋二烯、^曱基苯乙烯二聚體等。 就[A]共聚物的重量平均分子量(Mw)而言較佳為 1,000〜30,〇〇〇 ’更佳為5 〇〇〇〜2〇 〇〇〇。藉由使[A]共聚物 的Mw於上述範圍内,可以提高該感放射線性樹脂組成物 的敏感度及顯影性。還有,本說明書中聚合物的Mw及數 量平均分子量(Μη)是按下述的條件藉由凝膠滲透色譜 (GPC)測定的。 裝置:GPC-101(昭和電工公司) 管柱:連接 GPC-KF-8(H、GPC-KF-802、GPC-KF-803 及 GPC-KF-804 流動相:四氫咬喃 管柱溫度:40°C 流速:l.OmL/分 試樣濃度:1·0質量% -24- 201229666 試樣注入量:ΙΟΟμί 檢測器:差示折射儀 標準物質:單分散聚苯乙烯 < [B ]酿二疊氮化合物〉 本發明的感放射線性樹脂組成物中使用的[B]醌二 疊氮化合物是藉由放射線的照射而產生羧酸的1,2-醌二 疊氮化合物。就1,2-醌二疊氮化合物而言,可以使用酚 性化合物或醇性化合物(以下,稱為「母核」)和鹵化1,2-萘醌二疊氮化物磺酸的縮合物。 就上述母核而言,能夠列舉例如三羥基二苯曱酮、 四羥基二苯甲酮、五羥基二苯甲酮、六羥基二苯曱酮、( 多羥基苯基)烷烴、其它的母核等。 就三羥基二苯曱酮而言,能夠列舉例如2,3,4 -三羥基 二苯甲酮、2,4,6 -三羥基二苯曱酮等; 就四羥基二苯曱酮而言,能夠列舉例如2,2’,4,4’-四 羥基二苯曱酮、2,3,4,3’-四羥基二苯曱酮、2,3,4,4’-四羥 基二苯曱酮、2,3,4,2’-四羥基-4’ -曱基二苯甲酮、2,3,4,4’-四羥基-3’-曱氧基二苯甲酮等; 就五羥基二苯甲酮而言,能夠列舉例如2,3,4,2’,6’-五羥基二苯甲酮等; 就六羥基二苯甲酮而言,能夠列舉例如2,4,6,3’,4’, 5’-六羥基二苯甲酮、3,4,5,3’,4’,5’-六羥基二苯甲酮等; 就(多羥基苯基)烷烴而言,能夠列舉例如雙(2,4-二 羥基苯基)甲烷、雙(對羥基苯基)甲烷、三(對羥基苯基) 曱烷、1,1,1-三(對羥基苯基)乙烷、雙(2,3,4-三羥基苯基) -25- 201229666 甲烷、2,2-雙(2,3,4-三羥基苯基)丙烷、j ! 基-4-羥基苯基)·3·苯基丙烷、,3·二(2,5-二甲 ]-1_曱基乙基]苯基]乙叉基]雙酚、雙[4_羥基苯基 苯基)-2-羥基苯基甲烷、3,3,3,,3,_四子—甲基-4-羥基 -5,6,7,5,,6’,7’-己醇、2,2,4-三甲基_7,2,基 _1,1 ’ -螺雙茚 ; ,,4’、三羥基黃烷等 就其它的母核而言,能夠列舉例如2 羥基苯基)-4-(4 -羥基苯基)_7_羥基笨 '甲基-2'(2,4·二 1-[1-(3-{1-(4-羥基苯基)_卜甲基乙基}并氫化哌喃、 )-1-甲基乙基]_3-(1-(3-{1-(4-經基笨 一經基笨基 }-4,6 -—經基苯基)_ι_甲基乙基)苯、* 6 ) 1甲基乙基 基)-1-甲基乙基}-1,3-二羥基苯等。 羥基苯 在這些母核中,較佳係2,3 4 4, ,、四雜甘 1,1,1-三(對羥基苯基)乙烷、土二苯曱ig、 ]-ι-甲基乙基]苯基]乙又基]雙酚。 U't4-羥基苯基 肌m ig ^ IU Ψ/J ^ 萘醌二疊氮化物磺醯氣。就丨,2_萘輥二言,較佳係u 而言,能夠列舉例如1,2-萘醌二疊氮化〜疊氮化物磺醯I 萘醌二疊氮化物-5-磺醯氯等。在此等务4·磺醯氯、1,2 醌二疊氮化物-5 -續醯氣。 更佳為1,2 -筹 在酚性化合物或醇性化合 二疊氮化物續酸的縮合反應φ广核)和齒化萘酿 久應中’相對於酚性化合物或醇 性化合物中的OHA倉i·,& ^ 巷數車父佳為使用相當於30〜85莫耳% ’更佳為50〜7〇莫耳%沾占h 、 _化1,2 -萘酿二疊氮化物磺酸。 縮合反應可按公知的方法實^ -26- 201229666 上乂外沾就a醌二疊氮化合物而言,也適宜使用將 上述例不的母核的賴轉變為醯胺鍵 化物磺酸醯胺類,例如2飞4 ^ 丁 0昆—豎氮 — 妝頰,例如2,3,4-三胺基二苯甲酮-it萘靦二 疊氮化物-4 -項酸醯胺等。 k些[B]醌二疊氮化合物可以單獨使用或組合使用 兩種以上。就該感放射線性樹脂組成物中[B]醌二疊氮化 合物的使用比例而言,相對於[A]共聚物1〇〇質量份,較 佳為5質置份〜1〇〇質量份,更佳為1〇質量份〜5〇質量份。 藉由使[B]醌二疊氮化合物的使用比例於上述範圍内,可 以使照射放射線部分和未照射放射線部分 ,水溶液的溶解度之差變大、圖案化性能良好‘= 獲得的硬化膜的耐溶劑性良好。 < [C]硬化劑> 該感放射線性樹脂組成物含有的[c]硬化劑是由上 述式(1)表示的化合物、上述式(2)表示的化合物、三級胺 化合物、胺鹽、鱗鹽、脒鹽、醯胺化合物、酮亞胺化合 物封&型異氰酸s旨化合物、含'>米嗤環的化合物及籠合 化合物構成的群組中選出的至少一種物質。藉由使該感 放射線性樹脂組成物含有選自上述特定化合物的硬 化劑’可以兼具儲存穩定性和低溫燒製,以下,對各種 化合物進行詳細描述。 [上述式(1)及上述式(2)表示的化合物] [C]硬化劑較佳為由包含上述式(1)及式(2)表示的化 合物的群組中選出的至少一種。藉由選擇具有胺基和缺 電子基團的上述特定化合物作為[C]硬化劑,可以使該感 -27- 201229666 放射線性樹脂組成物兼具更高水準的儲存穩定性和低溫 燒製,而且可進一步提高所獲得的硬化膜的相對介電常 數等。 上述式(1)中’ R1〜R0各自獨立地為氫原子、拉電子 性基團或胺基。其中,Ri〜R6中的至少一個為拉電子性基 團,並且R1〜R6中的至少一個為胺基,上述胺基的全部或 为氮原子可以被碳原子數1〜6的院基取代。 上述式(2)中’ R7〜R1 6各自獨立地為氫原子 '拉電子 性基團或胺基。其中,R7〜R16中的至少一個為胺基。另 外’上述胺基的全部或部分氫原子可以被碳原子數1〜6 的烧基取代。Α為卓鍵、幾基、幾氧基、幾基亞曱基、亞 磺醯基、磺醯基、亞曱基或碳原子數2〜6的伸烷基。其中 ’上述亞甲基及伸烷基的全部或部分氫原子可以被氰基 、鹵素原子或氟烷基取代。 就上述R1〜R1 6表示的拉電子性基團而言,能夠列舉 .例如鹵素原子、氰基、硝基、三氟曱基、羧基、醯基、 烷基磺醯基、烷基氧磺醯基、二氰基乙烯基、三氰基乙 烯基、磺酿基等。在這些基團中,較佳係硝基、烷基氧 續酿基、三氟甲基。就A所示的基團而言,較佳係續醯基 、可以被氟烷基取代的亞曱基。 就上述式(1)及式(2)表示的化合物而言,較佳係2,2-雙(4-胺基苯基)六氟丙烷、2,3-雙(4-胺基苯基)丁二腈、 4,4’-二胺基二苯曱酮、4,4’-二胺基苯基苯曱酸酯、4,4’-二胺基二苯基颯、1,4-二胺基-2-氣苯、丨,4-二胺基-2-溴 苯、1,4 -二胺基-2-峨苯、1,4 -二胺基-2-;&肖基苯、1,4 -二胺 -28- 201229666 基-2-三氟曱基笨、2,5-二胺基苄腈、2,5_二胺基苯乙_、 2,5-二胺基苯曱酸、2,2’-二氣聯苯胺、2,2,_二溴聯笨胺 、2,2’-二碘聯苯胺、2’2,-二硝基聯苯胺、2,2,·雙(三氟曱 基)聯苯胺、3 -胺基苯磺酸乙酯、3,5雙三氟曱基_丨 胺基苯、4-胺基硝基苯、N,N_二甲基_4_硝基苯胺更佳 係4,4’-二胺基二苯基砜、2,2-雙(4-胺基苯基)六氟丙烷、 2,2’-雙(二氟甲基)聯苯胺、3_胺基苯磺酸乙酯、3,5-雙三 氟曱基-1,2-二胺基苯、4-胺基硝基苯、N,N_二曱基_4_硝 基苯胺。 上述式(1)及式(2)表示的化合物可以單獨使用或混 合兩種以上使用。就上述式(丨)及式(2)表示的化合物的含 有比例而言,相對於[A]共聚物1〇〇質量份,較佳為〇1質 量份〜20質量份,更佳為〇.2質量份〜1〇質量份。藉由使上 述式(1)及式(2)表示的化合物的含有比例於上述範圍内 ’可以使6玄感放射線性樹脂組成物兼具更高水準的儲广 穩定性和低溫燒製。 [三級胺化合物] 如果使反應性高的一般一級胺化合物及二纽 —、叹版化合 物與環氧化合物共存,則在組成物溶液的儲存φ •丁 T胺對環 氧基的親核動作導致硬化反應的進行,可能會損宝製 的品質。但是’使用三級胺時’由於反應性比妨 千乂低,即 使在組成物中與環氧化合物共存,也具有良好Μ 的儲存穩 定性。 式(5)表 就三級胺化合物而言,可以使用由包含下逃 示的化合物的群組中選出的至少一種物質。 -29- (5) 201229666 R24In the above formula (4), R2 is a hydrogen atom or a fluorenyl group. s is an integer 1 of 1 or more. The fluorenyl methacrylate chain alkyl ester may, for example, be decyl methacrylate, ethyl methacrylate or decyl methacrylate - 2 butyl methacrylate. Tert-butyl methacrylate, 2-ethylhexyl methacrylate, isopropyl methacrylate, methyl propyl acrylate, laurel, tridecyl methacrylate, hydrazine The base acid is in the thirteen yards and the like. The cycloalkyl methacrylate may, for example, be cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate or trimethyl sulfonate [5.2.1.02'6] 癸-8. - Stuffed, trimethoprimic [521〇26]癸-8-yloxyethyl ester, mercaptopropionic acid isobornyl vinegar, and the like. -18- 201229666 The acrylic chain alkyl ester may, for example, be methyl acrylate, ethyl acrylate, n-butyl acrylate, second butyl acrylate, tert-butyl acrylate or 2-ethylhexyl acrylate. Isodecyl acrylate, acrylic lauric vinegar, tridecyl acrylate, and octadecanoate. The cyclic alkyl acrylate may, for example, be cyclohexyl acrylate, 2-methylcyclohexyl acrylate, tricyclo[5.2.1.02'6] fluoren-8-ester, or tricyclohexyl acrylate [5.2.1.02]. '6] 癸-8-yloxyethyl ester, isobornyl acrylate, and the like. The aryl methacrylate may, for example, be phenyl methacrylate or benzyl methacrylate. The acryl aryl group S is exemplified by benzoic acid acrylate, benzyl acrylate or the like. The unsaturated dicarboxylic acid diester may, for example, be diethyl maleate, diethyl fumarate or diethyl itaconate. Examples of the bicyclic unsaturated compound include bicyclo [2.2.1] hept-2-ene, 5-methyl bicyclo [2.2.1] hept-2-ene, and 5-ethyl bicyclo [2.2.1] g. 2-ene, 5-methoxybicyclo[2.2.1]hept-2-ene, 5-ethoxybicyclo[2.2.1]hept-2-ene, 5,6-dimethoxybicyclo[2.2 .1]hept-2-ene, .5,6-diethoxybicyclo[2.2.1]hept-2-ene, 5-t-butoxycarbonylbicyclo[2.2.1]hept-2-ene, 5 - cyclohexyloxycarbonylbicyclo[2.2.1]hept-2-ene, 5-phenoxycarbonylbicyclo[2.2.1]hept-2-ene, 5,6-di(t-butoxycarbonyl)bicyclo[2.2. 1] Hept-2-ene, 5,6-di(cyclohexyloxycarbonyl)bicyclo[2.2.1]hept-2-ene, 5-(2'-hydroxyethyl)bicyclo[2.2.1]hept-2 -ene, 5,6-dihydroxybicyclo[2.2.1]hept-2-ene, 5,6-di(hydroxymethyl)bicyclo[2.2.1]hept-2-ene, 201229666 5,6-di ( 2,-Hydroxyethyl)bicyclo[2.2.1]hept-2-ene, hydroxy-5-methylbicyclo[2.2.Uhept-2-diene, 5-carbyl-5-ethylbicyclo[2 2 ^ Geng - olefin, 5-hydroxymethyl-5-methylbicyclo [2.2.1] g-2 - homing. Examples of the maleic imine compound include, for example, N-phenylmaleimine, N-cyclohexylmaleimide, N-based group, N-(4-hydroxyphenyl)malanium. Imine, N_(44f aryl) maleimide, N-saponin, iminoimide-3-maleimide, benzoic acid, _, N-sodium bromide, imine-4, Malay醯iminobutyrate, amber succinimide _6_maleimide caproate, N-succinimide-3 -maleimine propionic acid vinegar, n _(9 _ acridine Base) Maleidin and the like. The unsaturated aromatic compound may, for example, be styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyltoluene or p-methoxystyrene. Examples of the total amount of the dienes include hydrazine, 3-butadiene, isoprene, 2,3-dimethyl-i, 3-butadiene, and the like. Examples of the unsaturated compound containing a tetrahydrofuran skeleton include, for example, tetrahydroindenyl (meth) acrylate, 2-methacryloxy-propenyltetrahydrofurfuryl ester, and 3-(methyl) propylene.醯oxytetrahydrofuran-2-ketone and the like. Examples of the unsaturated compound containing a furan skeleton include, for example, 2-methyl-5-(3-indolyl)pentaene-3-enone, decyl (meth)acrylate, and 1-furan-2- Butyl-3-en-2-one, i • furan-2-butyl-3-methoxy-3-ene-2-one, 6-(2-furyl)_2_indolyl-丨-hexene_3 -ketone, 6-furan-2-yl-1-hex-1-en-3-one, 2-bromo-2-yl-ethyl-ethyl acrylate, 6-(2-»-furanyl)-6-methyl 1-heptene-3-one and the like. For the unsaturated compound containing a tetrahydrofuran skeleton, it can be listed as -20-201229666, such as methyl methacrylate (tetrahydropyran-2-yl) methyl ester, 2 6 dimethyl _8 (tetrahydrogen terminal) 2-yloxy)-octane] dilute _3, 2-methyl methic acid tetrahydropyran-2-yl ester, 1-(tetrahydropyran-2-yloxy)-butyl-3-ene-2- _ ketone and so on. The unsaturated compound containing a melane skeleton can, for example, be 4-(M-dioxa-5-oxy-6-heptenyl)_6-methyl-2-pyran, 4_(ι, 5_2 Oxa-6-oxyoctenyl)_6_mercapto-2-p-pyran. Examples of the other unsaturated compound include acrylonitrile methyl acrylonitrile, ethylene ethoxide, vinylidene chloride, propylene styrene, vinyl acetate and the like. t Among these (A4) compounds, preferred are mercaptoacrylic chain-chain alkyl fluorenyl carboxylic acid cyclic alkyl esters, maleimide compounds, tetrahydrofuran skeletons, furan skeletons, tetrahydropyranyl skeletons, The melane skeleton, the unsaturated compound of the skeleton represented by the above formula (4), the unsaturated aromatic compound, and the bupropion acid cyclic alkyl group. Among these, from the viewpoint of the solubility of the copolymerization reactivity to the aqueous solution, styrene, decyl methacrylate, butyl methacrylate, n-lauryl methacrylate, methyl propyl acrylate are preferred. Diluted tricyclo[5·2丄〇2'6]癸+vinegar, 曱methoxy styrene, propylene S 2 fluorenyl j-hexyl ester, Ν-phenyl maleimide, Ν_ring己iimide, tetrahydroindenyl (mercapto) acrylate vinegar, polyethylene glycol (η=2 bis(octa) mono(methyl) propyl vinegar, 3-(indenyl) propylene oxytetrahydroethylene (2) These (Α4) compounds may be used singly or in combination of two or more. In terms of the ratio of (Α4) compound, based on (Α1) compound, (Α2) compound, and (Α4) compound (and any The total of the selected compounds) is preferably from 10% by mass to 70% by mass, more preferably from 2% by mass to 6% by mass. - 21 - 201229666 5 ounces by means of the use of the compound (A4) The ratio is in the above-mentioned range, and a cured film excellent in solvent resistance and the like is formed. <Synthesis method of [A] copolymer> Into the "51 house agent [A] copolymer can be, for example, In the case where poly&in the presence of a solvent, the above (A1) compound and (a2) compound (optionally (compound and (A4) compound) are copolymerized to produce. 7 points used in the polymerization of the [A] copolymer can be exemplified by, for example, an alcohol, a glycol, a glycol thiol®^®&<2> , diethylene glycol dialkyl bond, dipropyl monopropyl ether, propylene glycol monoalkyl ether, propylene glycol alkyl ether acetate, propylene glycol monoalkyl ether propionate, ketone, ester, etc. For example, the glycol ether may, for example, be ethylene glycol monomethyl hydrazine or ethylene glycol monoethyl ether; and the ethylene glycol alkyl ether acetate may, for example, be mentioned. Ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, etc.; as the diethylene glycol monoalkyl ether, for example, diethylene glycol monomethyl ether or diethylene glycol can be cited. Monoethyl ether or the like; as far as the monoethylene glycol dialkyl radical is concerned, for example, diethylene glycol didecyl ether, diethylene glycol diethyl ether, and two a diol ethyl fluorenyl hydrazine or the like; and a propylene glycol dialkyl group, for example, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol ethyl fluorenyl group, etc. The basal mystery can be, for example, propylene glycol methyl ether, propylene glycol ethyl hydrazine, propylene glycol propyl ether, propylene glycol butyl sulfonate, etc.; -22- 201229666 propylene glycol monoalkyl ether acetate, for example, propylene glycol monomethyl Ethyl ether acetate, propylene glycol monoethyl ether acetate, etc.; as the propylene glycol monoalkyl ether propionate, for example, propylene glycol methyl ether propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether Examples of the ketone include methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-mercapto-2-pentanone, methyl isoamyl ketone, and the like; For example, ethyl acetate, butyl acetate, 3-methoxybutyl acetate, ethyl 2-hydroxypropionate, decyl 2-hydroxy-2-methylpropionate, and 2-hydroxy-2-mercaptopropionic acid Ester, butyl hydroxyacetate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, 2-ethoxyl Ethyl acetate, propyl 2-ethoxypropionate, butyl 2-ethoxypropionate, decyl 2-butoxypropionate, ethyl 2-butoxypropionate, 2-butoxypropane Acid propyl ester, butyl 2-butoxypropionate, decyl 3-methoxyoxypropionate, ethyl 3-methoxyoxypropionate, propyl 3-methoxypropionate, 3-methoxypropane Butyl acrylate, decyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, 3-propoxypropane曱 ester and the like. Among these solvents, preferred are 3-methoxy butyl acetate, ethylene glycol alkyl ether acetate, diethylene glycol monoalkyl ether, diethylene glycol dialkyl ether, propylene glycol monoalkyl ether, Propylene glycol alkyl ether acetate, more preferably 3-methoxybutyl acetate, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, propylene glycol monomethyl ether, propylene glycol monodecyl ether acetic acid ester. As the polymerization initiator used in the polymerization for producing the [A] copolymer, those generally known as radical polymerization initiators can be used. As the radical polymerization initiator, for example, 2,2'-even-23-201229666 nitrogen bisisobutyronitrile (AIBN), 2,2'-azobis gas double, methoxy group methyl group can be cited. 4, 曱 戍 戍 ) ) n n n n n ; ; ; ; ; ; ; ; ; ; ; 过 过 过 过 过 过 过 过 过 过 过 过 过 过 过 过 过 过 过 过 过 过 过 有机 有机 有机Peroxidation; when the oxide and reducing agent are used together as a two-agent, it can also be used as a deuterated reduction initiator. Once, for the polymerization of [Α] copolymer, in order to regulate the molecule The second aspect is to use a molecular weight modifier. The molecular weight modifier may, for example, be a functional hydrocarbon such as gas-like or carbon tetrabromide; n-hexyl mercaptan, n-octyl mercaptan, n-decyl mercaptan, and third tenth Mercaptans such as dialkyl mercaptan and mercaptoacetic acid; xanthogens such as dimethyl sulfide xanthogen and diisopropyl dithioxanthogen; and cappediene, dimercapto styrene dimer, and the like. The weight average molecular weight (Mw) of the [A] copolymer is preferably 1,000 to 30, and more preferably 5 Å to 2 Å. By making [A] a total The Mw of the substance is within the above range, and the sensitivity and developability of the radiation-sensitive resin composition can be improved. Further, the Mw and the number average molecular weight (?η) of the polymer in the present specification are condensed by the following conditions. GPC-101 (Showa Denko Co., Ltd.) Column: Connected to GPC-KF-8 (H, GPC-KF-802, GPC-KF-803 and GPC-KF-804 mobile phases) : tetrahydrogenation column temperature: 40 ° C flow rate: l.OmL / min sample concentration: 1 · 0 mass % -24- 201229666 sample injection amount: ΙΟΟμί detector: differential refractometer standard substance: monodisperse Polystyrene <[B] Studed Diazide Compound> The [B] quinonediazide compound used in the radiation sensitive resin composition of the present invention is 1,2-quinone which produces carboxylic acid by irradiation of radiation. a diazide compound. For the 1,2-quinonediazide compound, a phenolic compound or an alcoholic compound (hereinafter referred to as "mother core") and a halogenated 1,2-naphthoquinonediazide sulfonate may be used. The condensate of the acid. For the above-mentioned mother nucleus, for example, trihydroxybenzophenone, tetrahydroxybenzophenone can be cited. Pentahydroxybenzophenone, hexahydroxydibenzophenone, (polyhydroxyphenyl)alkane, other mother nucleus, etc. Examples of the trihydroxybenzophenone include, for example, 2,3,4-trihydroxy Benzene ketone, 2,4,6-trihydroxybenzophenone, etc.; as the tetrahydroxydibenzophenone, for example, 2,2',4,4'-tetrahydroxybenzophenone, 2, 3,4,3'-tetrahydroxydibenzophenone, 2,3,4,4'-tetrahydroxydibenzophenone, 2,3,4,2'-tetrahydroxy-4'-mercaptobenzophenone Ketone, 2,3,4,4'-tetrahydroxy-3'-nonyloxybenzophenone, etc.; as the pentahydroxybenzophenone, for example, 2, 3, 4, 2', 6' can be cited. - pentahydroxybenzophenone or the like; in the case of hexahydroxybenzophenone, for example, 2,4,6,3',4',5'-hexahydroxybenzophenone, 3,4,5, 3', 4', 5'-hexahydroxybenzophenone, etc.; as the (polyhydroxyphenyl)alkane, for example, bis(2,4-dihydroxyphenyl)methane or bis(p-hydroxyphenyl) Methane, tris(p-hydroxyphenyl)decane, 1,1,1-tris(p-hydroxyphenyl)ethane, bis(2,3,4-trihydroxyphenyl)-25- 201229666 methane, 2, 2-bis(2,3,4-trihydroxyphenyl)propane, j!-yl-4-hydroxyphenyl)·3·phenylpropane, 3·bis(2,5-dimethyl)-1曱Ethylethyl]phenyl]ethylidene]bisphenol, bis[4-hydroxyphenylphenyl]-2-hydroxyphenylmethane, 3,3,3,3,_tetra-methyl-4- Hydroxy-5,6,7,5,6',7'-hexanol, 2,2,4-trimethyl-7,2,yl-1,1'-spirobifluorene; ,, 4', For the other parent core, trihydroxyflavan or the like can be exemplified by, for example, 2 hydroxyphenyl)-4-(4-hydroxyphenyl)-7-hydroxy stupyl-methyl-2' (2,4·di-1-[ 1-(3-{1-(4-hydroxyphenyl)-p-methylethyl} and hydrogenated piper, )-1-methylethyl]_3-(1-(3-{1-(4-) Stupid one base base}-4,6--transphenylyl)_ι_methylethyl)benzene, * 6) 1 methyl ethyl)-1-methylethyl}-1,3- Hydroxybenzene and the like. Hydroxybenzene in these mother nucleuses, preferably 2,3 4 4 , , tetrahetero 1,1,1-tris(p-hydroxyphenyl)ethane, diphenyl hydrazine ig, ]-ι-methyl Ethyl]phenyl]ethyl keto]bisphenol. U't 4-hydroxyphenyl muscle m ig ^ IU J / J ^ naphthoquinone diazide sulfonium gas. In the case of the bismuth, the 2-naphthalene roller is preferably a 1,2-naphthoquinonediazide~azide sulfonium I naphthoquinonediazide-5-sulfonyl chloride, etc. . In this case, 4 sulfonium chloride, 1,2 quinone diazide-5 - continued helium. More preferably, the ratio of 1,2 - in the condensation reaction of phenolic compounds or alcoholic diazide continued acid φ nucleus) and dentate naphthalene brewing should be 'relative to OHA in phenolic compounds or alcoholic compounds仓i·, & ^ Lane number car father good use of the equivalent of 30~85 mol% 'better 50~7〇 Moer% dip h, _1,2-naphthalene diazide sulfonate acid. The condensation reaction can be carried out according to a known method. In the case of a bismuth azide compound, it is also suitable to convert the ruthenium of the above-mentioned nucleus to a guanamine sulfonate sulfonamide. For example, 2 fly 4 ^ Ding 0 Kun - vertical nitrogen - makeup cheek, such as 2,3,4-triaminobenzophenone-it naphthoquinone diazide-4 - acid decylamine and the like. k Some of the [B] quinonediazide compounds may be used alone or in combination of two or more. The ratio of use of the [B] quinone diazide compound in the radiation sensitive resin composition is preferably 5 parts by mass to 1 part by mass based on 1 part by mass of the [A] copolymer. More preferably, it is 1 part by mass to 5 parts by mass. When the ratio of use of the [B] quinone diazide compound is within the above range, the difference between the solubility of the aqueous solution and the unirradiated portion can be made large, and the patterning performance is good. Good solvent properties. <[C] Hardener> The [c] hardener contained in the radiation sensitive resin composition is a compound represented by the above formula (1), a compound represented by the above formula (2), a tertiary amine compound, and an amine salt. At least one selected from the group consisting of a squamous salt, a sulfonium salt, a guanamine compound, a ketimine compound, an ampho isocyanate compound, a compound containing a '> rice bran ring, and a cage compound. The hardening agent selected from the specific compound described above may contain both storage stability and low-temperature firing. Hereinafter, various compounds will be described in detail. [The compound represented by the above formula (1) and the above formula (2)] The [C] hardener is preferably at least one selected from the group consisting of the compounds represented by the above formulas (1) and (2). By selecting the above specific compound having an amine group and an electron-deficient group as the [C] hardener, the -27-201229666 radiation-linear resin composition can have a higher level of storage stability and low-temperature firing, and The relative dielectric constant and the like of the obtained cured film can be further improved. In the above formula (1), R1 to R0 are each independently a hydrogen atom, an electron withdrawing group or an amine group. Here, at least one of Ri to R6 is an electron withdrawing group, and at least one of R1 to R6 is an amine group, and all or a nitrogen atom of the above amine group may be substituted with a group having 1 to 6 carbon atoms. In the above formula (2), R7 to R16 are each independently a hydrogen atom-electron group or an amine group. Wherein at least one of R7 to R16 is an amine group. Further, all or a part of the hydrogen atoms of the above amine group may be substituted by a group having 1 to 6 carbon atoms. The hydrazine is a bond, a benzyl group, a oxy group, a benzylidene group, a sulfinyl group, a sulfonyl group, an anthranylene group or an alkylene group having 2 to 6 carbon atoms. Wherein all or part of the hydrogen atoms of the above methylene and alkylene groups may be substituted by a cyano group, a halogen atom or a fluoroalkyl group. The electron withdrawing group represented by the above R1 to R16 may, for example, be a halogen atom, a cyano group, a nitro group, a trifluoromethyl group, a carboxyl group, a decyl group, an alkylsulfonyl group or an alkyl oxysulfonate. Base, dicyanovinyl, tricyanovinyl, sulfonyl, and the like. Among these groups, a nitro group, an alkyloxy group, and a trifluoromethyl group are preferred. As the group represented by A, an anthracenyl group which may be substituted by a fluoroalkyl group is preferred. The compound represented by the above formula (1) and formula (2) is preferably 2,2-bis(4-aminophenyl)hexafluoropropane or 2,3-bis(4-aminophenyl). Succinonitrile, 4,4'-diaminodibenzophenone, 4,4'-diaminophenyl benzoate, 4,4'-diaminodiphenyl hydrazine, 1,4-two Amino-2-gasbenzene, anthracene, 4-diamino-2-bromobenzene, 1,4-diamino-2-indenebenzene, 1,4-diamino-2-; & Schottylbenzene 1,4 -Diamine-28- 201229666 Benz-2-trifluoromethyl stupid, 2,5-diaminobenzonitrile, 2,5-diaminophenylethyl, 2,5-diaminobenzene Citrate, 2,2'-di-diphenylaniline, 2,2,-dibromobenzamine, 2,2'-diiodobenzidine, 2'2,-dinitrobenzidine, 2,2, Bis(trifluoromethyl)benzidine, ethyl 3-aminobenzenesulfonate, 3,5-bistrifluorodecyl-nonylaminobenzene, 4-aminonitrobenzene, N,N-dimethyl 4_nitroaniline is more preferably 4,4'-diaminodiphenyl sulfone, 2,2-bis(4-aminophenyl)hexafluoropropane, 2,2'-bis(difluoromethyl) Benzidine, ethyl 3-aminobenzenesulfonate, 3,5-bistrifluorodecyl-1,2-diaminobenzene, 4-aminonitrobenzene, N,N-didecyl_4_ Nitroaniline. The compounds represented by the above formulas (1) and (2) may be used singly or in combination of two or more. The content ratio of the compound represented by the above formula (丨) and formula (2) is preferably from 1 part by mass to 20 parts by mass, more preferably from 1 part by mass to 1 part by mass of the [A] copolymer. 2 parts by mass to 1 part by mass. By making the content ratio of the compound represented by the above formulas (1) and (2) within the above range, the 6-sense radiation-sensitive linear resin composition can have a higher level of storage stability and low-temperature firing. [Tri-Amine Compound] If a general-purpose primary amine compound having a high reactivity and a bis-anthracene compound and an epoxy compound are coexistent, the nucleophilic action of the φ-butanamine on the epoxy group is stored in the composition solution. Leading to the hardening reaction may damage the quality of the treasure system. However, when the use of the tertiary amine is low in reactivity, even if it is present in the composition in combination with the epoxy compound, it has good storage stability. Formula (5) For the tertiary amine compound, at least one selected from the group consisting of compounds escaping may be used. -29- (5) 201229666 R24
I /N、 R25 XR26 上述式(5)中,R24〜R26各自獨立地為碳原子 的烷基、碳原子數6〜18的芳基或碳原子數7〜30的 。其中,汉24及R25也可以相互鍵結,與兩者鍵結 子一起形成環結構。上述烷基、芳基及芳烷基的 全部氫原子可以被取代。 就上述R24〜r26所示的上述碳原子數1〜20的 。,此夠列舉例如直鏈狀或支鏈狀的曱基、乙基 丁基戊基、己基、庚基、辛基、壬基、癸基 基、十一烷基、十三烷基、十四烷基十五烷基 元基十七烷基、十八烷基、十九烷基、二十烷 就上述R24〜R26所示的碳原子數6〜18的芳基而 夠列舉例如苯基、萘基等。 就上述R 4〜r20所示的碳原子數7〜30的芳 ,能夠列舉例如节基、苯乙基等。 就一級胺化合物而言,能夠列舉例如三甲 基胺N,N二甲基苄基胺、三笨基胺、三丁 辛基胺—(十二烧基)胺、三丁基节基胺、三 基-N·甲基苯胺、N,N_二乙基苯胺、苯』 苯月女N,N_—甲基-對曱苯胺、N,N_二曱基 N,N-二甲基_4_甲备甘_ 土外甲氧基苯胺、N-苯基哌啶、N-(4- 基)派°定、N -笼ι 土 -丨,2,3,4 -四氫異喹琳、6 -苄基肩 -7-曱氧 X 1 ) ·5 ^ ^ 土 ,么3,4-四氫異喹啉、Ν,Ν’-二甲基哌 數1〜20 方烧基 的氮原 部分或 燒基而 、丙基 、月桂 、十六 基等。 言,能 基而言 胺、三 胺、三 基胺、 Ν-甲基 苯胺、 氧基苯 Ν-苯基 、Ν,Ν- -30- 201229666 二曱基環己基胺、2-二甲基胺基甲基苯酚、6夂 甲基胺基曱基)苯酚等。 ’’ 一 在這些三級胺化合物中,較佳係三辛基胺、2-二甲 基胺基甲基苯紛。三級胺化合物可以單獨使用或混:兩 種以上使用。就該感放射線性樹脂k成物中三級胺化合 物的含有比例而言,相對於[A]共聚物1〇〇質量份,較^ 為0.1質量份~1〇質4份’更佳為〇.2質量份〜5質4份。藉 由使三級胺化合物的含有比例於上述特定範圍内,可: 使該感放射線性樹脂组成物兼具高水準的儲存穩定性 低溫燒製。 1 [胺鹽及鱗鹽] 可以使用由下述式(6)表示的化合物構成的群組中 選出的至少一種物質作為胺鹽及鱗鹽。 R27 1 + R28-A1—R30 Q- (6) R29 上述式(6)中,A1為氮原子或磷原子。R27〜r3g各自獨 立地為氫原子、碳原子數丨〜汕的烷基、碳原子數6〜18的 芳基或故原子數7〜30的芳炫基。其中,這些基團的部分 或全部氫原子可以被取代。q-為1價陰離子。 就上述R27〜所示的碳原子數>20的烷基而言,能 夠列舉例如直鏈狀或支鏈狀的曱基、乙基、丙基、丁基 、戊基、己基、庚基、辛基、壬基、癸基、月桂基、十 —烧基、十三烷基、十四烷基、十五烷基、十六烷基、 十七烧基 '十八烷基、十九烷基、二十烷基等。 -31 - 201229666 就上述R27〜R3〇所示的碳原子數6〜18的芳基而言,能 夠列舉例如苯基、萘基等。 就上述R27〜R30所示的碳原子數7〜3〇的芳烷基而言 ’能夠列舉例如苄基、苯乙基等。 就上述Q所示的1價陰離子而言,能夠列舉例如氯離 子、/臭離子、碘離子、氰離子、硝酸根、亞硝酸根、次 氯酸根、亞氣酸根、氣酸根'過氯酸根、過猛酸根、碳 酉文氫根、磷酸二氫根、硫化氫離子、硫氰酸根、羧酸根 尹' 酉夂根、笨氧陰離子、四氟硼酸根、四芳基硼酸根、 六氟録酸根等。 A為氮原子時,即就銨鹽而言,能夠列舉例如四甲 基氯化鉍、四丁基氣化銨、十二烷基二甲基苄基氯化銨 、辛基二甲基氣化銨、.癸基三甲基氣化銨、十二烷基三 甲基氯化鉍、十四烷基三甲基氯化銨、鯨蠟基三曱基氯 ,鈿⑨脂基二甲基氯化銨、十六烷基三甲基溴化銨、 节基三甲基氣化銨、节基三乙基氣化銨、氣化苯甲烴銨 f化苯甲烴銨、二癸基二曱基氣化銨、二硬脂基二甲 基氣化錢。 A〗為磷原子時,即就鱗鹽而言,能夠列舉例如四苯 基鱗•四苯基棚酸瞄、 ^ - 四本基鱗.四(對曱苯基)硼酸鹽 、四苯基鱗•四(對乙基笨基)硼酸鹽、四苯基鐫•四(對 :氧基笨基μ朋酸鹽、四苯基鱗·四(對乙氧基苯基)石朋酸 :、四苯基鱗•四(對第三丁氧基苯基)石朋酸鹽、四苯基 間-甲苯基)删酸鹽、四苯基鱗·四(間甲氧基苯基) 风二(對甲本基)苯基鱗.四(對甲苯基)硼酸鹽、四 -32- 201229666 (對甲苯基)鱗•四(對甲苯基)硼酸鹽、三(對甲氧基苯基) 苯基鎸.四(對曱苯基)硼酸鹽、四苯基鎸硫氰酸鹽、丁 基三苯基鱗硫氰酸鹽、甲基三苯基鱗硫氰酸鹽、對甲苯 基二苯基鱗硫氰酸鹽 '苄基三苯基鱗六氟銻酸鹽、對氣 苄基二苯基鐫六氟銻酸鹽、對甲基苄基三苯基鱗六氟銻 酉文鹽、對曱氧基苄基三苯基鎸六氟銻酸鹽、α_甲基苄基 三苯基鱗六氟銻酸鹽、肉桂基三苯基鱗六氟銻酸鹽、2_ 經基硝基苄基二苯基鱗六氟録酸鹽、ι_萘基甲基三苯 基鱗六氟銻酸鹽、3-三曱基甲矽烷基_4_三甲基曱矽烷氧 基苄基二本基鱗六氟錄酸鹽、對甲氧基节基三(對氯笨基 )鐫六氟銻酸鹽、對曱氧基节基三(對甲基苯基)鎮六氟ς Ss•鹽、肉桂基二(對氯笨基)鱗六氟錄酸鹽 '對曱氧基苄 基三苯基鱗六氟磷酸鹽、1_芘基曱基-三笨基鱗六氟銻酸 鹽、l-t£基曱基-丁基二苯基鱗六氟銻酸鹽、9_蒽基甲基· 三苯基鱗六氟銻酸鹽、四丁基鱗癸酸鹽、三(第三丁美) 鳞·四苯基硼酸鹽、二-第三丁基曱基鱗·四苯基硼酸鹽 、對曱苯基三苯基鱗•四(對甲笨基)硼酸鹽、四苯基鱗 •四氟硼酸鹽等。 在這些胺鹽及鳞鹽中 ,<*> 肌 Ίϋ 狱 j ^ 氣酸鹽。胺鹽及鱗鹽可以單獨使用或混合兩 苯基鎮硫 種以上使用。就該感放射線性樹脂組成物中胺鹽及鱗瞄 的含有比例而言,相對於[Α]共聚物100質量份:較佳= 0.1質量份〜10質量份,更佳為0.5質量份〜5質量份。藉由 使胺鹽及鱗鹽的含有比例於上述特定笳囹向 1心靶国内,可以使該 感放射線性樹脂組成物兼具更高水準的儲左 卞j 1of仔穩定性和低 溫燒製。 -33- 201229666 [脒鹽] (7)表示化合物 就脒鹽而&,可以使用由包含下迷式 的鹽的群組中選出的至少一種物質。I / N, R25 XR26 In the above formula (5), R24 to R26 are each independently an alkyl group of a carbon atom, an aryl group having 6 to 18 carbon atoms or a carbon number of 7 to 30. Among them, Han 24 and R25 can also be bonded to each other to form a ring structure together with the bond of the two. All of the hydrogen atoms of the above alkyl group, aryl group and aralkyl group may be substituted. The above-mentioned R24 to r26 have the above carbon atoms of 1 to 20. This exemplifies, for example, a linear or branched fluorenyl group, ethyl butyl amyl group, hexyl group, heptyl group, octyl group, decyl group, decyl group, undecyl group, tridecyl group, and fourteen. The alkylpentadecyl group heptadecyl group, octadecyl group, nonadecyl group, and eicosane are, for example, a phenyl group, and the aryl group having 6 to 18 carbon atoms represented by the above R24 to R26. Naphthyl and the like. The aryl group having 7 to 30 carbon atoms represented by the above R 4 to r20 may, for example, be a benzyl group or a phenethyl group. Examples of the primary amine compound include, for example, trimethylamine N,N dimethylbenzylamine, trisuccinylamine, tributyloctylamine-(dodecanyl)amine, tributyl sulfhydrylamine, Tris-N-methylaniline, N,N-diethylaniline, benzene Benzene N,N_-methyl-p-anisidine, N,N-didecyl N,N-dimethyl-4 _甲备甘_ Extraterrestrial methoxyaniline, N-phenylpiperidine, N-(4-yl)pyridine, N-branched soil-丨, 2,3,4-tetrahydroisoquineline, 6-Benzyl shoulder-7-oxime X 1 ) ·5 ^ ^ soil, 3,4-tetrahydroisoquinoline, hydrazine, Ν'-dimethylpiper number 1~20 Or base, propyl, laurel, hexadecane, etc. Amine, triamine, triamine, Ν-methylaniline, oxyphenyl hydrazine-phenyl, hydrazine, hydrazine - -30- 201229666 dimercaptocyclohexylamine, 2-dimethylamine Methyl phenol, 6 夂 methylamino fluorenyl phenol, and the like. Among these tertiary amine compounds, trioctylamine and 2-dimethylaminomethylbenzene are preferred. The tertiary amine compounds may be used singly or in combination of two or more. The content ratio of the tertiary amine compound in the radiation-sensitive resin k-form is more preferably 0.1 part by mass to 1 part by mass per part by mass of the [A] copolymer. .2 parts by mass to 5 parts of 4 parts. By setting the content ratio of the tertiary amine compound within the above specific range, the radiation sensitive resin composition can be combined at a high level of storage stability and fired at a low temperature. 1 [Amine salt and scaly salt] At least one selected from the group consisting of compounds represented by the following formula (6) can be used as the amine salt and the scaly salt. R27 1 + R28-A1—R30 Q- (6) R29 In the above formula (6), A1 is a nitrogen atom or a phosphorus atom. R27 to r3g are each independently a hydrogen atom, an alkyl group having a carbon number of 丨~汕, an aryl group having 6 to 18 carbon atoms or an aryl group having 7 to 30 atomic atoms. Among them, some or all of the hydrogen atoms of these groups may be substituted. Q- is a monovalent anion. The alkyl group having the number of carbon atoms > 20 represented by the above R27~, for example, a linear or branched fluorenyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group or a heptyl group, Octyl, fluorenyl, fluorenyl, lauryl, decyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecyl octadecyl, nonadecane Base, eicosyl and the like. -31 - 201229666 The aryl group having 6 to 18 carbon atoms represented by the above R27 to R3 is, for example, a phenyl group or a naphthyl group. The aralkyl group having 7 to 3 carbon atoms represented by the above R27 to R30 may, for example, be a benzyl group or a phenethyl group. The monovalent anion represented by Q above may, for example, be a chloride ion, a odor ion, an iodide ion, a cyanide ion, a nitrate, a nitrite, a hypochlorite, a sulphate, a sulphate 'perchlorate, or the like. Perchloric acid, carbon hydrazine, dihydrogen phosphate, hydrogen sulfide ion, thiocyanate, carboxylate ' 酉夂 root, oxyanion, tetrafluoroborate, tetraarylborate, hexafluoroate Wait. When A is a nitrogen atom, that is, in the case of an ammonium salt, for example, tetramethylphosphonium chloride, tetrabutylammonium vapor, dodecyldimethylbenzylammonium chloride, octyldimethylamine gasification can be cited. Ammonium, mercaptotrimethylammonium vapor, dodecyltrimethylphosphonium chloride, tetradecyltrimethylammonium chloride, cetyltrimethyl chloride, decyl 9-dimethyldimethyl chloride Ammonium, cetyltrimethylammonium bromide, thruyltrimethylammonium hydride, thoryltriethylammonium hydride, gasified benzalkonium hydride, benzalkonium Based on vaporized ammonium, distearyl dimethyl vaporized money. When A is a phosphorus atom, that is, in the case of a scale salt, for example, tetraphenyl scale • tetraphenyl sulphonate, ^ - tetradentyl scale, tetrakis (p-phenyl) borate, tetraphenyl scale • Tetrakis(p-ethylphenyl)borate, tetraphenylphosphonium·tetra(p-oxyphenyl), tetraphenylscale·tetra(p-ethoxyphenyl)-penic acid: four Phenyl sulphate • tetra (p-tert-butoxyphenyl) succinate, tetraphenyl m-tolyl), tetraphenyl sulphate tetrakis (m-methoxyphenyl) Benzyl) phenyl sulphate. Tetrakis(p-tolyl)borate, tetra-32-201229666 (p-tolyl) scaly • tetra(p-tolyl)borate, tris(p-methoxyphenyl)phenyl hydrazine . Tetrakis(p-phenylphenyl)borate, tetraphenylphosphonium thiocyanate, butyltriphenylsulfate, methyltriphenylsulfate, p-tolyldiphenylsulfonate Cyanate 'benzyltriphenyl hexafluoroantimonate, p-benzylbenzyldiphenylphosphonium hexafluoroantimonate, p-methylbenzyltriphenyl hexafluoroantimony salt, p-methoxyl Benzyltriphenylphosphonium hexafluoroantimonate, α-methylbenzyltriphenylphosphonium hexafluoride Citrate, cinnamyltriphenyl hexafluoroantimonate, 2_ nitrosobenzyldiphenyl hexafluoroantimonate, iota naphthylmethyltriphenyl hexafluoroantimonate, 3 - trimethyl carbazinoalkyl _4_ trimethyl decyloxy benzyl di-base hexafluoroantimonate, p-methoxyl III (p-chlorophenyl) hexafluoroantimonate,曱oxyl group tris(p-methylphenyl) town hexafluoroantimony Ss•salt, cinnamyl di(p-chlorophenyl) hexafluoroantimonate-p-oxybenzyltriphenyl hexafluorophosphate Salt, 1_mercapto-yl-trisyl hexafluoroantimonate, lt-based benzyl-butyl diphenyl hexafluoroantimonate, 9-fluorenylmethyl·triphenyl sulphate Citrate, tetrabutyl sulphate, tris(T3) squamous tetraphenyl borate, di-tert-butyl fluorenyl tetraphenyl borate, p-phenylphenyl triphenyl Scale • Four (p-toluene) borate, tetraphenyl scale • tetrafluoroborate. Among these amine salts and squama salts, <*> muscle sputum j ^ gas salt. The amine salt and the scaly salt may be used singly or in combination of two or more phenyl sulfonium species. The content ratio of the amine salt and the scale in the radiation-sensitive resin composition is preferably 0.1 part by mass to 10 parts by mass, more preferably 0.5 part by mass to 5 parts by mass based on 100 parts by mass of the [Α] copolymer. Parts by mass. By making the content ratio of the amine salt and the scaly salt to the above-mentioned specific 笳囹1 target, it is possible to make the radiation-sensitive resin composition have a higher level of stability and low-temperature firing. -33- 201229666 [脒 salt] (7) indicates a compound. For the sulfonium salt, at least one selected from the group consisting of the salts of the following formula can be used.
(7)(7)
上述式(7)中,m為2〜6的整數。其中,伸烷基具有的 部分或全部氫原子可以被有機基團取代。還有,上述伸 烧基是指四氫0密°定環中的伸院基及式(7)中(CH2)m表示的 伸院基二者。 就上述伸炫基可以作為取代基異有的有機基團而& ,能夠列舉例如 曱基、乙基、異丙基、正丁基、第三丁基、正己基 等碳原子數1〜6的烷基; 羥基曱基、2-羥基乙基、1-羥基兩基、2_羧基丙基、 3-羥基丙基、2-羥基異丙基、3-羥基-第三丁基、6_經基 己基等碳原子數1〜6的羥基烷基; 二甲基胺基、甲基乙基胺基、二乙基胺基、二異丙 基胺基、二丁基胺基、第三丁基甲基胺基、二正己基胺 基等碳原子數2〜12的二院基胺基等。 就上述式(7)表示的化合物而言,能夠列舉丨,5_二氮 雜雙環[4,3,〇]-壬烯_5(DBN)、1,5-二氮雜雙環[4,4,0]_癸 烯-5、1,8-二氮雜雙環[5,4,0]-十一烯-7(DBU)、5-羥基丙 -34- 201229666 基-1,8-一氮雜雙環[5,4,〇]-十一烯_7、5_二丁基胺基_ι,8_ 二氮雜雙環[5,4,0]-十一烯-7等。在這些物質中,較佳係 DBN及 DBU。 就用於使上述式(7)表示的化合物形成鹽的酸而言 ’能夠列舉有機酸及無機酸。 就有機酸而言,能夠列舉例如羧酸、單烷基碳酸、 芳香族經基化合物、績酸等。 就羧酸而言,能夠列舉例如 甲酸、醋酸、2-乙基己酸、異戊酸等飽和脂肪酸; 丙烯酸、巴豆酸、甲基丙烯酸、鄰苯二甲酸、間苯 一甲酉夂對笨一曱酸、富馬酸、馬來酸 '棕櫊油酸、油 酸、亞油酸、亞麻酸、異油酸、桐油酸、花生四烯酸、 桂皮酸、萘曱酸、苯曱酸、甲基苯甲酸等不飽和羧酸; 氣醋酸、氰基醋酸、二氯醋酸、三氯醋酸、三甲基 醋酸、氟醋酸、溴醋酸、曱氧基醋酸、巯基醋酸、碘^ 酸、乙烯基醋酸、草醯醋酸、苯基醋酸、苯氧基醋酸等L 取代醋酸; 草酸、丙二酸、琥珀酸、戊二酸、己二酸、壬二酸 、辛二酸、癸二酸等二羧酸; 夂 二醇酸、乳酸、擰檬酸、d_酒石酸、中酒石酸、抗 壞jk酸、扁桃酸等經基叛酸; 丙酮酸 '乙醯丙酸等酮羧酸; 2-氣丙酸、3-氣丙酸等函代羧酸。 就早烧基碳酸而士,处夕A X,丨谢,. 火夂叻δ ,此夠列舉例如甲基碳酸、乙 碳酸等。 -35- 201229666 就芳香族經基化合物而言,能夠列舉例如苯酚、曱 基苯酚、鄰苯二酚、萘酚等。 就磺酸而言,能夠列舉例如辛基苯磺酸、丁基苯磺 馱、曱笨磺酸、苯確酸、曱石黃酸等。 就無機酸而言’能夠列舉例如鹽酸、氟化氫酸、溴 酉文等齒酸,碳酸;及過氣酸、過溴酸等過鹵化氫酸等。In the above formula (7), m is an integer of 2 to 6. Among them, some or all of the hydrogen atoms which the alkylene group has may be substituted by an organic group. Further, the above-mentioned stretching group means both the stretching base in the tetrahydro 0 mil ring and the stretching base represented by (CH2) m in the formula (7). The above-mentioned exudyl group may be an organic group which may be a substituent, and examples thereof include a mercapto group, an ethyl group, an isopropyl group, a n-butyl group, a t-butyl group, a n-hexyl group and the like having 1 to 6 carbon atoms. Alkyl; hydroxyindenyl, 2-hydroxyethyl, 1-hydroxydiyl, 2-carboxypropyl, 3-hydroxypropyl, 2-hydroxyisopropyl, 3-hydroxy-t-butyl, 6_ a hydroxyalkyl group having 1 to 6 carbon atoms such as a hexyl group; a dimethylamino group, a methylethylamino group, a diethylamino group, a diisopropylamino group, a dibutylamino group, a third butyl group A diamine-based amino group having 2 to 12 carbon atoms such as a sulfhydryl group or a di-n-hexylamino group. The compound represented by the above formula (7) can be exemplified by 丨,5-diazabicyclo[4,3,〇]-nonene-5 (DBN), 1,5-diazabicyclo[4,4 ,0]_pinene-5,1,8-diazabicyclo[5,4,0]-undecene-7 (DBU), 5-hydroxypropan-34- 201229666 base-1,8-nitrogen Heterobicyclo[5,4,〇]-undecene_7,5-dibutylamino group_ι,8-diazabicyclo[5,4,0]-undecene-7 and the like. Among these, DBN and DBU are preferred. The acid used to form a salt of the compound represented by the above formula (7) can be exemplified by an organic acid and an inorganic acid. The organic acid may, for example, be a carboxylic acid, a monoalkyl carbonic acid, an aromatic transbasic compound, or a creatinic acid. Examples of the carboxylic acid include saturated fatty acids such as formic acid, acetic acid, 2-ethylhexanoic acid, and isovaleric acid; acrylic acid, crotonic acid, methacrylic acid, phthalic acid, and m-benzoic acid. Capric acid, fumaric acid, maleic acid 'palm oleic acid, oleic acid, linoleic acid, linolenic acid, isooleic acid, tung oil, arachidonic acid, cinnamic acid, naphthoic acid, benzoic acid, A Unsaturated carboxylic acid such as benzoic acid; gaseous acetic acid, cyanoacetic acid, dichloroacetic acid, trichloroacetic acid, trimethylacetic acid, fluoroacetic acid, bromoacetic acid, decyloxyacetic acid, thioglycolic acid, iodic acid, vinyl acetate L-substituted acetic acid such as acetic acid, phenylacetic acid or phenoxyacetic acid; dicarboxylic acid such as oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, sebacic acid, suberic acid or sebacic acid ; diolic acid, lactic acid, citric acid, d_tartaric acid, tartrate, anti-jk acid, mandelic acid, etc.; ketone carboxylic acid such as pyruvate, acetopropionate; 2-propionic acid, a carboxylic acid such as 3-propionic acid. As soon as the base is burned, it is A X, thank you, fire δ, which is enough to list, for example, methyl carbonate, ethylene carbonate, and the like. -35-201229666 The aromatic radical-based compound may, for example, be phenol, nonylphenol, catechol or naphthol. Examples of the sulfonic acid include octylbenzenesulfonic acid, butylbenzenesulfonate, anthracenesulfonic acid, benzoic acid, and fluorite. Examples of the inorganic acid include, for example, a tooth acid such as hydrochloric acid, hydrogen fluoride or bromine, carbonic acid; a perhydrohalogenated acid such as peroxy acid or perbromic acid; and the like.
在這些酸中’較佳係羧酸、芳香族羥基化合物、磺 i ’更佳係飽和脂肪酸、芳香族羥基化合物、磺酸,特 佳為作為強酸的磺酸’最佳為甲苯磺酸、甲磺酸、辛基 笨磺酸。就脒鹽而言,較佳係DBU和曱苯磺酸的鹽、DBU 和辛基苯磺酸的鹽、DBN和曱苯續酸的鹽、DBN和辛基 本確酸的鹽。 脒鹽可以單獨使用·或混合兩種以上使用。就該感放 射線性樹脂組成物中脒鹽的含有比例而言,相對於[A] 共聚物100質量份’較佳為〇」質量份〜10質量份,更佳為 5貝里伤〜5質罝份。藉由使脉鹽的含有比例於上述特定 範圍内,可以使該感放射線性樹脂組成物兼具更高水準 的儲存穩定性和低溫燒製。 [酿胺化合物] 就醯胺化合物而言,可以使用由包含下述式(8)〜(1〇) 表示的具有醯胺基的化合物的群組中選出的至少— 質。 0 r31 c 、N/、r32 <δ)Among these acids, 'preferably a carboxylic acid, an aromatic hydroxy compound, a sulfonium i' is a more preferred saturated fatty acid, an aromatic hydroxy compound, a sulfonic acid, and particularly preferably a sulfonic acid as a strong acid. Sulfonic acid, octyl sulfonic acid. As the onium salt, a salt of DBU and toluenesulfonic acid, a salt of DBU and octylbenzenesulfonic acid, a salt of DBN and nonylbenzene acid, a salt of DBN and octyl acid can be preferably used. The onium salt may be used singly or in combination of two or more. The content ratio of the onium salt in the radiation-sensitive resin composition is preferably from 10,000 parts by mass to 10 parts by mass, more preferably from 5 to 10 parts by mass, based on 100 parts by mass of the [A] copolymer. Backup. By making the content ratio of the pulse salt within the above specific range, the radiation sensitive resin composition can have a higher level of storage stability and low temperature firing. [Row Amine Compound] For the guanamine compound, at least one selected from the group consisting of compounds having a guanamine group represented by the following formulas (8) to (1 〇) can be used. 0 r31 c , N/, r32 < δ)
I Η -36- 201229666I Η -36- 201229666
上述式(8)中,R31及R32各自獨立地為氫原子、碳原 子數1~12的炫基、環己基、苯基、4基、乙稀基或2 -比 σ定基。其中,上述碳原子數1~12的炫基、笨基及萘基可 以被碳原子數1〜6的炫基、鹵素原子、羥基、叛基或乙酿 基取代。 上述式(9)中,R33及R34各自獨立地為氫原子、碳原 子數1〜12的烷基或環己基^ Α2為亞曱基、碳原子數2〜12 的伸烷基、伸苯基、伸萘基或伸乙烯基。其中,上述亞 甲基、碳原子數2〜1 2的伸烷基、伸苯基及伸萘基可以被 碳原子數1〜6的烷基、鹵素原子取代。 上述式(10)中,R35及R36各自獨立地為氫原子、碳原 子數1〜12的烷基或環己基^ a3為亞甲基、碳原子數2 的伸烧基、伸苯基、伸萘基或伸乙烯基。其中,上述亞 甲基、碳原子數2〜12的伸烷基、伸苯基及伸萘基可以被 碳·原子數1〜6的烷基、鹵素原子取代。· 上述式(8)表示的醯胺化合物是分子内具有一個醯 胺鍵的化合物。就其具體例子而言,能夠列舉例如乙醯 胺、Ν-曱基乙醯胺、Ν-乙基乙醯胺、Ν-正丙基乙醯胺、 -37- 201229666 N-異丙基乙醯胺、N-正丁基乙醯胺、N-異丁基 N-第三丁基乙醯胺、N-正己基乙醯胺、N-正辛 、N-正十二烷基乙醯胺、丙醯胺、丁醯胺、戊 戊醯胺、辛醯胺、乙醯苯胺、乙醯乙醯苯胺、 苯甲酸、間乙醯胺苯曱酸、對乙醯胺苯曱酸、 苯酚、間乙醯胺苯酚、對乙醯胺苯酚、乙醯胺 二甲醯胺酸、丙烯醯胺、苯甲醯胺、萘醯胺、 、異菸鹼醯胺等。 在這些物質中,從能夠提高室溫下的儲存 所獲得硬化膜的耐熱性、電壓保持率等方面考 係乙醯胺、N-曱基乙醯胺、鄰苯二曱醯胺酸。 上述式(9)及(10)表示的化合物是分子内中 醯胺鍵的化合物。就其具體例子而言,能夠列 苯二甲醯胺、間苯二曱醯胺、對苯二甲醯胺、 、琥珀醯胺、戊二醯胺、己二醯胺、庚二醯胺 胺、壬二醯胺、癸二醯胺、馬來醯胺、富馬醯, 二曱基-鄰苯二甲醯胺、Ν,Ν’-二甲基-間苯二 Ν,Ν’-二甲基·對苯二甲醯胺、Ν,Ν’-二乙醯基-粦丨 Ν,Ν’-二乙醯基-間苯二胺、Ν,Ν’-二乙醯基-對 Ν,Ν’-二丙醯基-鄰苯二胺、Ν,Ν’-二丙醯基-間 Ν,Ν’-二丙醯基-對苯二胺、Ν,Ν’-二乙醯基-伸乙 Ν,Ν’-二乙醯基-伸丙基二胺、Ν,Ν’-二乙醯基-亞 、Ν,Ν’-二乙醢基-六亞甲基二胺、Ν,Ν’-二乙醯· 基亞曱基二胺、Ν,Ν’-二苯曱醯基-伸乙基二胺 苯曱醯基-伸丙基二胺、Ν,Ν’-二苯甲醯基-亞丁 乙醯胺、 基乙醯胺 醯胺、異 鄰乙醯胺 鄰乙醯胺 萘、鄰苯 於驗醯胺 穩定性、 慮,較佳 具有兩個 舉例如鄰 丙二醯胺 、辛二酿 i安、Ν,Ν,-曱醯胺、 :苯二胺、 苯二胺、 苯二胺、 >基二胺、 丁基二胺 基-十二烷 、Ν,Ν,-二 基二胺、 -38- 201229666 ㈣二苯曱醯基-六亞甲基二 烧基亞甲基二胺、N,N、二萃 -本甲.酿基-十二 二萘甲醯基-伸丙美-俨 M 土-伸乙基二胺、N,N,- 、一萘:Γ基二…基-亞丁㈡ 十二烧基亞甲基二胺等。土Ν,Ν’-二萘曱醯基-在這些物質中, t 低溫燒製方面考慮,面水準的儲存穩定性和 N,…醯基二Γ 二甲酿胺、…胺、 姐签對伸苯基二胺、N N,_ 二胺。 妝乙醯基-六亞甲基 ,感:=合物可以單獨使用或混合兩種以上使用。就 :二:樹脂組成物中醯胺化合物的含有比例而言 量…圭聚曰物100質量份,較佳為❻·1質量份〜10質 : °’5質量份〜5質量。肖由使醯胺化合物的含有 比例於上述特宏鉻萌h 你I目s A 可以使該感放射線性樹脂組成 、π水準的儲存穩定性和低溫燒製。 [酮亞胺化合物] ,亞胺化合物可以藉由酮和胺的反應獲得。 就綱而言,能夠列舉例如乙基甲基嗣、異戍基f基 美里異丁基甲基酮、甲基第三丁基酮、乙基丁基酮、乙 暴吳丁基綱、田盆丄、《· 土戊基酮、二丙基酮、3 -曱基-2 -己酮、 綱、3_辛綱、4_辛酮、甲基環己基酮、甲基環己酮等 〇 就胺而言 薄荷烧二胺、 兩個末端的伸 ,能夠列舉例如2,5-二甲基·2,5·己二胺、 1’4_雙(2-胺基-2-甲基丙基)哌啡、在分子的 丙基分支碳上鍵結了胺基的聚丙二醇、乙 -39- 201229666 二胺、三亞曱基二胺、丙二胺、四亞甲基二胺、丁二 、五亞甲基二胺、六亞甲基二胺、七亞曱基二胺、八 曱基二胺、二伸乙基三胺、三伸乙基四胺、四伸乙基 胺、五伸乙基六胺、三甲基六亞曱基二胺、N-胺基乙 哌啩、亞胺基雙丙基胺、甲基亞胺基雙丙基胺、 h2n(ch2ch2o)2(ch2)2nh2般的在胺氮上鍵結了亞曱 的聚醚骨架的二胺、1,5-二胺基-2-甲基戊烷、聚乙二 、異佛爾酮二胺、1,3-雙胺基曱基環己烷(1,3BAC)、 環己基胺基-3-胺基丙烷、降莰烷骨架的二亞曱基 (NBDA)、下述式表示的化合物等。 胺 亞 五 基 如 基 胺 1- 胺In the above formula (8), R31 and R32 each independently represent a hydrogen atom, a shin group having a carbon number of 1 to 12, a cyclohexyl group, a phenyl group, a 4 group, an ethylene group or a 2 - σ group. Among them, the above-mentioned stilbene, stupid and naphthyl group having 1 to 12 carbon atoms may be substituted by a condensing group having 1 to 6 carbon atoms, a halogen atom, a hydroxyl group, a thiol group or an ethylene group. In the above formula (9), R33 and R34 are each independently a hydrogen atom, an alkyl group having 1 to 12 carbon atoms or a cyclohexyl group, an anthracene group, an alkylene group having 2 to 12 carbon atoms, and a phenyl group. , stretching naphthyl or vinyl. Here, the above methylene group, an alkylene group having 2 to 12 carbon atoms, a phenylene group and a stilbene group may be substituted by an alkyl group having 1 to 6 carbon atoms or a halogen atom. In the above formula (10), R35 and R36 are each independently a hydrogen atom, an alkyl group having 1 to 12 carbon atoms or a cyclohexyl group; a3 is a methylene group, a carbon atom having 2 alkyl groups, a phenyl group, and a stretching group. Naphthyl or vinyl. Here, the above methylene group, an alkylene group having 2 to 12 carbon atoms, a phenylene group and a stilbene group may be substituted by an alkyl group having 1 to 6 carbon atoms or a halogen atom. The guanamine compound represented by the above formula (8) is a compound having one guanamine bond in the molecule. Specific examples thereof include, for example, acetamide, decyl-mercaptoacetamide, hydrazine-ethylacetamide, hydrazine-n-propyl acetamide, -37-201229666 N-isopropylacetyl hydrazine. Amine, N-n-butylethylamine, N-isobutyl N-tert-butylacetamide, N-n-hexylacetamide, N-n-octyl, N-n-dodecylacetamide, Propylamine, butylamine, pentamidine, octadecylamine, acetophenone, acetophenone, benzoic acid, m-acetamide, p-acetamide, phenol, m-ethyl Amidoxime phenol, p-acetamide phenol, acetamide dimethyl glutamate, acrylamide, benzamide, naphthylamine, isoniaceine guanamine, and the like. Among these, acetamide, N-mercaptoacetamide, and phthalic acid are used in terms of heat resistance and voltage holding ratio of a cured film which can be obtained by storage at room temperature. The compound represented by the above formulas (9) and (10) is a compound having a guanamine bond in the molecule. For specific examples thereof, it is possible to classify phthalic acid, m-xylamine, p-xylamine, succinimide, glutamine, hexamethyleneamine, heptamine, Indoleamine, indoleamine, maleic amine, fumarate, dimercapto-o-phthalamide, anthracene, Ν'-dimethyl-m-benzoquinone, Ν'-dimethyl · p-xylguanamine, hydrazine, Ν'-diethyl fluorenyl-hydrazine, Ν'-diethyl decyl-m-phenylenediamine, hydrazine, Ν'-diethyl fluorenyl-p-quinone, Ν' -dipropenyl-o-phenylenediamine, anthracene, Ν'-dipropenyl-inter-hydrazine, Ν'-dipropenyl-p-phenylenediamine, anthracene, Ν'-diethyl fluorenyl-extension ,Ν'-diethyl fluorenyl-propyl propylamine, hydrazine, Ν'-diethyl fluorenyl-arylene, hydrazine, Ν'-diethylhydrazine-hexamethylenediamine, hydrazine, Ν'-two醯···························~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Indoleamine, acetoinamide, iso-o-acetamide o-acetamide naphthalene, o-benzene in the stability of the guanamine, preferably have two actions such as o-propionamide, sin Oh, Ν, - guanamine, : phenylenediamine, phenylenediamine, phenylenediamine, > bisdiamine, butyldiamine-dodecane, hydrazine, hydrazine, -diyldiamine, -38- 201229666 (4) Diphenyl fluorenyl-hexamethylene dialkyl methylene diamine, N, N, and two extracts - Benjia. Brewing base - docosaphthalene thiol-extension - 俨M soil - stretching Ethylenediamine, N,N,-, mononaphthalene: fluorenyldiyl-butylene (di), dodecylmethylenediamine, and the like. Earthworms, Ν'-naphthyl fluorenyl group - in these materials, t low temperature firing considerations, surface level storage stability and N, ... thiol diterpene dimethylamine, ... amine, sister sign Phenyldiamine, NN, _ diamine. The makeup ethyl-hexamethylene group, the sensation: = compound can be used alone or in combination of two or more. (2): The content of the guanamine compound in the resin composition is 100 parts by mass, preferably ❻·1 part by mass to 10 mass: °'5 parts by mass to 5 mass. The ratio of the content of the indoleamine compound to the above-mentioned special macrochrome can be made up of the radiation-sensitive resin composition, the storage stability of the π level, and the low-temperature firing. [Ketenimine compound], an imine compound can be obtained by a reaction of a ketone and an amine. For the sake of the scheme, for example, ethylmethyl hydrazine, isodecyl f methiriisobutyl methyl ketone, methyl tert-butyl ketone, ethyl butyl ketone, acetophenone butyl group, field basin 丄, "· Tertyl ketone, dipropyl ketone, 3-mercapto-2-hexanone, genus, 3-octyl, 4-octyl ketone, methylcyclohexyl ketone, methylcyclohexanone, etc. The diamine and the extension of both ends may, for example, be 2,5-dimethyl-2,5-hexanediamine or 1'4-bis(2-amino-2-methylpropyl) piperazine. Amino group-bound polypropylene glycol, B-39-201229666 diamine, tridecyldiamine, propylenediamine, tetramethylenediamine, dibutylene, pentamethylene two on the propyl branched carbon of the molecule Amine, hexamethylenediamine, heptadecyldiamine, octadecyldiamine, diethylidene triamine, tris-ethyltetramine, tetraethylamine, pentaethylhexamine, three Methylhexamethylenediamine, N-aminoethylpiperidinium, iminodipropylamine, methylimidopropylamine, h2n(ch2ch2o)2(ch2)2nh2 on amine nitrogen a diamine, 1,5-diamino-2-methylpentane, polyethylene , isophorone diamine, 1,3-diaminodecylcyclohexane (1,3BAC), cyclohexylamino-3-aminopropane, norbornane skeleton (NBDA), A compound represented by the following formula and the like. Amine subpenta group such as alkylamine 1-amine
-40- 201229666-40- 201229666
Η2Ν ΝΗ η2ν νη2 \^\ νη2 另外’可以使用胺基烷氧基矽烷作為胺。就胺基烷 氧基矽烷而言,能夠列舉例如下述式(丨i)表示的化合物 (R气 R38〜WU (11) 上述式中’ R37為碳原子數1〜6的烷基、碳原子數1〜6 的烷氧基或1價的矽氧烷衍生基團。尺38為可以含有氮原 子的伸烷基。R39為烷氧基。11為〇〜3的整數。 就尺37所示的碳原子數1〜6的烷基而言,較佳為曱基 '乙基、丙基。就R37所示的碳原子數i〜6的烷氧基而言 較佳係曱氧基 '乙氧基、丙氧基。就R37所示的1價矽 氧烷衍生基團而言,較佳係矽烷氧基。在這些物質中, 更佳係曱氧基、乙氧基。 就R所不的可以含氮原子的伸烷基之伸烷基而1 車土佳係碳原子數卜6的伸烷基。就不含氮原子的伸烷』 而:’較佳係亞甲基、伸乙基、伸丙基。就含氮原子ό 申烷基而δ,較佳係在上述不含氮原子的2價烴基中所^ 201229666 示的煙基上具有亞胺基(_nh_)的基團。在此等中,更佳 係亞甲基、伸丙基、-C2H4NH(:3H6_。Η2Ν ΝΗ η2ν νη2 \^\ νη2 Further, an amino alkoxydecane can be used as the amine. The amino alkoxy decane may, for example, be a compound represented by the following formula (丨i) (R gas R38 to WU (11). In the above formula, 'R37 is an alkyl group having 1 to 6 carbon atoms or a carbon atom. An alkoxy group having 1 to 6 or a monovalent decane-derived group. The caliper 38 is an alkylene group which may contain a nitrogen atom, and R39 is an alkoxy group. 11 is an integer of 〇~3. The alkyl group having 1 to 6 carbon atoms is preferably a fluorenyl 'ethyl group and a propyl group. The alkoxy group having 1 to 6 carbon atoms represented by R37 is preferably a methoxy group 'B. The oxy group and the propoxy group are preferably a decyloxy group in the case of the monovalent decane-derived group represented by R37. Among these, a decyloxy group and an ethoxy group are more preferred. The alkyl group which may contain a nitrogen atom, and the alkyl group of the alkyl group, and the alkyl group of the carbon atom, the alkyl group of the carbon atom, the alkyl group which does not contain a nitrogen atom, and the like: The propyl group is a group containing an imide group (_nh_) on a nicotine group represented by the above-mentioned nitrogen atom-free divalent hydrocarbon group in the above-mentioned nitrogen atom-free divalent hydrocarbon group. In this case, it is better to methylene and stretch. Propyl, -C2H4NH (: 3H6_.
Tk 3 9 — 就R所示的炫氧基而言’較佳係碳原子數1〜6的烷 氧基,更佳係曱氧基、乙氧基。 就藉由酮和胺基烷氧基矽烷的反應得到的含有矽的 酮亞胺而言’能夠列舉例如下述式(丨2)表示的化合物、 具有下述式(13)表示的結構單元的縮聚物等。 (R'Tk 3 9 - The alkoxy group represented by R is preferably an alkoxy group having 1 to 6 carbon atoms, more preferably a decyloxy group or an ethoxy group. The ketone imine containing oxime obtained by the reaction of a ketone and an amino alkoxy decane can be exemplified by a compound represented by the following formula (丨2) and a structural unit represented by the following formula (13). Polycondensate, etc. (R'
I (12) 'Si(R4Vv 上述式(12)中’ R4G及R41各自獨立地為部分或全部氫 原子可以被取代的1價烴基。其中,及也可以和它 們分別鍵結的碳原子一起形成環結構。R42為碳原子數 1〜6的烷基或碳原子數1〜6的烷氧基^ r43為可以含有氮原 子的伸烷基。R44為烷氧基。v為〇〜3的整數。 R48I (12) 'Si (R4Vv in the above formula (12), 'R4G and R41 are each independently a monovalent hydrocarbon group in which a part or all of hydrogen atoms may be substituted. Among them, and may also be formed together with the carbon atoms to which they are respectively bonded. Ring structure: R42 is an alkyl group having 1 to 6 carbon atoms or an alkoxy group having 1 to 6 carbon atoms; r43 is an alkylene group which may contain a nitrogen atom. R44 is an alkoxy group. v is an integer of 〇~3 R48
/ I./ I.
_____- si—〇 、I R47 (13) R45^^R46 上述式(13)中’ R45及R46各自獨立地為部分或全部氫 原子可以被取代的1價烴基。其中,R45及R46也可以和它 們分別鍵結的碳原子一起形成環結構。R47為可以含有氮 原子的伸烷基。R48為碳原子數i~6的烷基或碳原子數1〜6 的烷氧基。 -42- 201229666 具有上述式(13)表示的結構單元的縮聚物的末端可 以鍵結例如氫原子、曱基、乙基、丙基等碳原子數i〜6 的烷基;甲氧基、乙氧基、丙氧基等碳原子數1〜6的烷氧 基。 在這些胺中,較佳係具有脂環式結構或芳香環結構 的二胺。就適合的酮亞胺而言,能夠列舉下述式(14)表 示的化合物。_____- si-〇, I R47 (13) R45^^R46 In the above formula (13), R45 and R46 are each independently a monovalent hydrocarbon group in which a part or all of hydrogen atoms may be substituted. Among them, R45 and R46 may also form a ring structure together with the carbon atoms to which they are respectively bonded. R47 is an alkylene group which may contain a nitrogen atom. R48 is an alkyl group having 1 to 6 carbon atoms or an alkoxy group having 1 to 6 carbon atoms. -42-201229666 The terminal of the polycondensate having the structural unit represented by the above formula (13) may be bonded to an alkyl group having a carbon number of from 1 to 6 such as a hydrogen atom, a mercapto group, an ethyl group or a propyl group; methoxy group; An alkoxy group having 1 to 6 carbon atoms such as an oxy group or a propoxy group. Among these amines, a diamine having an alicyclic structure or an aromatic ring structure is preferred. As the suitable ketimine, a compound represented by the following formula (14) can be mentioned.
R50R50
(14) 上述式(14)中’ R49〜R52各自獨立地為部分或全部氫 原子可以被取代的1價烴基。其中,尺49及尺5〇也可以和它 們分別鍵結的碳原子一起形成環結構。另外,R5 !及R52 也可以和它們分別鍵結的碳原子一起形成環結構。R53 為可以被取代的2價烴基。 就R〜R所示的1價烴基而言,能夠列舉1價的脂肪 族烴基、1價的脂環式烴基、1價的芳香族烴基。就丨價的 脂肪族烴基而言,能夠列舉例如碳原子數丨〜2〇的烷基、 碳原子數2〜20的烯基、碳原子數2〜2〇的炔基。就i價的脂 環式烴基而言,能夠列舉例如碳原子數3〜2〇的環烷基。 就1價的^香私煙基而吕,能夠列舉例如碳原子數6〜2 〇 的芳基。 就上述奴原子數1〜2 0的烧基而言,較佳係碳原子數 1〜12的烷基’更佳係碳原子數;1〜6的烷基。就較佳的具體 例子而言,能夠列舉甲基、乙基、異丙基、丁基、異丁 -43- 201229666 基、第二丁基、第三丁基、戊基、^卜二曱基丙基、 甲基丁基、1,1 -二曱基丁基、己基。 就上述碳原子數2〜20的烯基而言,較佳係碳原子數 2〜10的烯基,更佳係碳原子數2〜6的烯基。就較佳的具體 例子而言,能夠列舉乙烯基、烯丙基、丁烯基、己烯基。 就上述碳原子數2〜2 0的炔基而言,較佳係碳原子數 2〜1 0的炔基,更佳係碳原子數2〜6的炔基。就較佳的具體 例子而言,能夠列舉乙炔基、丙炔基。 就上述碳原子數3〜20的環烷基而言,較佳係碳原子 數3〜12的環烷基,更佳係碳原子數3〜8的環烷基。就較佳 的具體例子而言,能夠列舉環丙基、環丁基、環戊基、 1 -曱基環戊基、1 -乙基環戊基、環己基。 就上述碳原子數6〜20的芳基而言,較佳係碳原子數 6〜14的芳基。就較佳的具體例子而言,能夠列舉苯基、 萘基、節基、蒽基,更佳係苯基、2·萘基,特佳係苯土基。 就R53所示的2價烴基而言,能夠列舉2價的脂肪族烴 基、2價的脂環式烴基、2價的芳香族烴基、伸烷基-伸環 烷基-伸烷基、伸環烷基-伸烷基_伸環烷基、伸烷基-伸芳 基-伸烧基。 就上述2價的脂肪族烴基而言,能夠列舉例如碳原子 數1〜20的伸烷基、碳原子數2〜2〇的伸烯基、碳原子數2〜2〇 的伸炔基。就2價的脂環式烴基而言,能夠列舉例如碳原 子數3〜20的伸環烷基、碳原子數3〜2〇的伸環烯基。就2 1賈的芳香族烴基而言,能夠列舉例如碳原子數6〜2〇的伸 芳基。 -44- 201229666 就上述奴原子數1〜2 0的伸烧基而言,較佳係碳原子 數1〜1 2的伸烧基’更佳係碳原子數1〜6的伸烧基。就較佳 的具體例子而言,能夠列舉亞甲基、伸乙基、甲基伸乙 基、三亞甲基、四亞甲基、五亞甲基、六亞甲基。 就上述碳原子數3〜20的伸環烷基而言,較佳係碳原 子數3〜1 2的伸環烧基’更佳係碳原子數3〜6的伸環院基。 就較佳的具體例子而言,能夠列舉伸環丙基、伸環丁基 、伸環戊基、伸環己基。另外,就碳原子數3〜2 〇的伸環 稀基而言’較佳係碳原子數3〜1 2的伸環婦基,更佳係碳 原子數3〜6的伸環烯基。就較佳的具體例子而言,能夠列 舉伸環丁浠基、伸環戊烯基、伸環己烯基。 就上述碳原子數6〜18的2價的芳香族烴基而言,能夠 列舉伸苯基、伸聯苯基、伸萘基、伸菲基、伸蒽基等伸 芳基等。 就伸烧基-伸環院基-伸烧基而言,較佳係碳原子數 1〜6的伸烷基-碳原子數3〜12的伸環烷基-碳原子數^6的 伸烧基’特佳係碳原子數1〜6的伸烷基-碳原子數3〜6的伸 %烷基-碳原子數1〜6的伸烷基。就伸環烷基_伸烷基_伸環 烧基而言,較佳係碳原子數3〜丨2的伸環烷基-碳原子數 1〜6的伸烧基-碳原子數3〜丨2的伸環烷基,特佳係碳原子 數3〜6的伸環烷基-碳原子數丨〜6的伸烷基_碳原子數3〜6 的伸環烷基。 就上述伸烧基-伸芳基-伸烧基而言,較佳係碳原子 數1〜6的伸院基-碳原子數6〜14的伸芳基-碳原子數1〜6的 伸烧基’特佳係碳原子數1〜6的伸烷基-碳原子數6〜丨〇的 -45- 201229666 伸芳基-碳原子數1〜6的伸烷基。 酮亞胺的製造方法勻右胜2丨& 宏,又有特別的限制,例如可以藉由 使酮和胺在室溫下岑 、 次加熱下進仃攪拌脫水反應來獲得。 就反應溫度而言,較伟盔〇 Λ 权佳為20C〜15(TC,更佳為5〇t:〜11(rc 。’y尤反應時間而言,私社& q t 較佳為2小時〜24小時,更佳為2小時 〜5小時。 酮亞胺可以從市售產品獲得,能夠列舉例如H_3、 H-30(以上,三菱化學公司生產)。 酮亞胺化合物可以單獨使用或混合兩種以上使用。 就該感放射線性樹脂組成物中酮亞胺化合物的含有比例 而1 ’相對於[A]共聚物1〇〇質量份’較佳為〇」質量份〜1〇 質$份,更佳為0.5質量份〜5質量份。藉由使酮亞胺化合 物的含有比例於上述特定範圍内,可以使該感放射線性 樹知、‘且成物兼具更咼水準的儲存穩定性和低溫燒製。 [封端型異氰酸酯化合物] 封端型多異氰酸酯化合物是使異氰酸酯基與含有活 性氮的化合物(封端劑)進行反應形成的常溫惰性的物質 。是具有一旦加熱,則封端劑離解而重新生成異氰酸酯 基的性質的物質。藉由使該感放射線性樹脂.組成物含有 封端型多異氰酸酯’可以作為有效的交聯劑而進行異氰 酸醋-經基交聯反應’可以使該感放射線性樹脂組成物兼 具高水準的儲存穩定性和低溫燒製。 封端型多異氰酸酯化合物可以由脂肪族或脂環族二 異氰酸酯衍生的多異氰酸酯和具有活性氫的化合物(封 端劑)藉由公知的反應獲得。 -46- 201229666 就二異氰酸δ旨而言,能夠列舉例如四亞曱基一異氰 酸酯、戊烷二異氰酸酯、六亞甲基二異氰酸酯(HDI)、 2,2,4-三曱基-1,6-二異氰酸酯基己烷、2,4,4-三曱基-1,6_ 二異氰酸酯基己烷、賴氨酸二異氰酸酯、異佛爾酮二異 氰酸酯(IPDI)、1,3-雙(異氰酸酯基甲基)環己烷、4,4_二 環己基甲烷二異氰酸酯、降冰片烯二異氰酸酉旨、曱苯二 異氰酸酯、4,4,-二苯基甲烷二異氰酸酯、丨,5·萘二異氰 酸酯、三哜二異氰酸酯 '二曱代苯胺異氰酸酯、1,4 -四亞 曱基二異氰酸酯、1,5-五亞甲基二異氰酸酯、丨,6·六亞曱 基二異氰酸酯、3-異氰酸酯甲基_3,5,5-三曱基環己基二 異氰酸酯等。 就市售產品而言,能夠列舉例如 就用曱基乙基酮的肟對異氰酸酯基進行封端而形成 者而言,能夠列舉 DURANATE TPA-B80E、TPA-B80X、 E402-B80T、MF-B60XN、MF-B60X、MF-B80M(以上, 旭化成Chemicals公司生產); 就用活性亞甲基對異氰酸酯基進行封端而形成者而 言,能夠列舉DURANATE MF-K60X(旭化成工業公司生 產); 就具有(甲基)丙烯醯基的異氰酸酯化合物的封端物 而言,能夠列舉 Karenz MOI-BP、Karenz MOI-BM(以上 ’昭和電工公司生產)。在這些物質中,使用DURANATE E4G2_B8 0T、MF-K60X時表現出高可撓性,藉由形成與 其它品種的混合系統,可以自由地控制其硬度,因此較 佳。 -47- 201229666 就由二異氰酸酯衍生的多異氰酸酯而言,能夠列舉 例如異氰脲酸酯型多異氰酸酯、縮二脲型多異氰酸酯、 胺基曱酸酯型多異氰酸酯、脲基曱酸酯型多異氰酸酯等 。從硬化性方面考慮,較佳係異氰脲酸酯型多異氰酸酯 0 就封端劑而言,能夠列舉例如醇類化合物、酌類化 合物、活性亞甲基類化合物、硫醇類化合物、酸醯胺類 化合物、酸酸亞胺類化合物、°米β坐類化合物、。比α坐類化 合物、尿素類化合物、將類化合物、胺類化合物、亞胺 類化合物、吡啶類化合物等。 就醇類化合物而言,能夠列舉例如甲醇、乙醇、丙 醇、丁醇、2-乙基己醇、曱基溶纖劑、丁基溶纖劑、甲 基卡必醇、苄醇、環己醇等; 就盼類化合物而言,能夠列舉例如苯盼、曱基苯紛 、乙基苯酚、丁基苯酚、壬基苯酚、二壬基苯酚、苯乙 烯化苯酚、羥基苯曱酸酯等; 就活性亞甲基類化合物而言,能夠列舉例如丙二酸 二甲酯、丙二酸二乙酯、乙醯乙酸甲酯、乙醯乙酸乙酯 、乙醯丙酮等; 就硫醇類化合物而言,能夠列舉例如丁基硫醇、十 二烷基硫醇等; 就酸醯胺類化合物而言,能夠列舉例如乙醯苯胺、 醋酸醯胺、ε-己内醯胺、δ-戊内醯胺、γ- 丁内醯胺等; 就酸醯亞胺類化合物而言,能夠列舉例如琥珀醯亞 胺、馬來醯亞胺等; -48- 201229666 就咪唑類化合物而言,能夠列舉例如咪唑、2_ 咪嗤等; 就吡唑類化合物而言,能夠列舉例如3_甲基吡 3,5 -二曱基η比吐、3,5 -乙基。比唾等;(14) In the above formula (14), R49 to R52 are each independently a monovalent hydrocarbon group in which a part or all of hydrogen atoms may be substituted. Among them, the ruler 49 and the ruler 5 can also form a ring structure together with the carbon atoms to which they are respectively bonded. In addition, R5! and R52 may form a ring structure together with the carbon atoms to which they are respectively bonded. R53 is a divalent hydrocarbon group which may be substituted. The monovalent hydrocarbon group represented by R to R may, for example, be a monovalent aliphatic hydrocarbon group, a monovalent alicyclic hydrocarbon group or a monovalent aromatic hydrocarbon group. The aliphatic hydrocarbon group at the valence of the valence may, for example, be an alkyl group having a carbon number of 丨2 to 2 fluorene, an alkenyl group having 2 to 20 carbon atoms, or an alkynyl group having 2 to 2 carbon atoms. The i-valent alicyclic hydrocarbon group may, for example, be a cycloalkyl group having 3 to 2 carbon atoms. For example, the aryl group having a carbon number of 6 to 2 Å can be cited. The alkyl group having 1 to 20 carbon atoms is preferably an alkyl group having 1 to 12 carbon atoms, more preferably a carbon number; and an alkyl group having 1 to 6 carbon atoms. Preferred examples thereof include a methyl group, an ethyl group, an isopropyl group, a butyl group, an isobutyl-43-201229666 group, a second butyl group, a tert-butyl group, a pentyl group, and a diterpene group. Propyl, methylbutyl, 1,1 -didecylbutyl, hexyl. The alkenyl group having 2 to 20 carbon atoms is preferably an alkenyl group having 2 to 10 carbon atoms, more preferably an alkenyl group having 2 to 6 carbon atoms. Preferable specific examples include a vinyl group, an allyl group, a butenyl group, and a hexenyl group. The alkynyl group having 2 to 20 carbon atoms is preferably an alkynyl group having 2 to 10 carbon atoms, more preferably an alkynyl group having 2 to 6 carbon atoms. A preferred specific example is an ethynyl group or a propynyl group. The cycloalkyl group having 3 to 20 carbon atoms is preferably a cycloalkyl group having 3 to 12 carbon atoms, more preferably a cycloalkyl group having 3 to 8 carbon atoms. Preferred specific examples include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a 1-decylcyclopentyl group, a 1-ethylcyclopentyl group, and a cyclohexyl group. The aryl group having 6 to 20 carbon atoms is preferably an aryl group having 6 to 14 carbon atoms. Preferable specific examples include a phenyl group, a naphthyl group, a sulfhydryl group, and a fluorenyl group. More preferably, it is a phenyl group or a 2-naphthyl group, and a particularly preferred benzoic acid group. Examples of the divalent hydrocarbon group represented by R53 include a divalent aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, a divalent aromatic hydrocarbon group, an alkylene-cycloalkylene group, an alkylene group, and a stretching ring. Alkyl-alkylene-cycloalkylene, alkylene-arylene-extended alkyl. The divalent aliphatic hydrocarbon group may, for example, be an alkylene group having 1 to 20 carbon atoms, an extended alkenyl group having 2 to 2 carbon atoms, or an extended alkynyl group having 2 to 2 carbon atoms. The divalent alicyclic hydrocarbon group may, for example, be a cycloalkylene group having 3 to 20 carbon atoms or a stretched cycloalkenyl group having 3 to 2 carbon atoms. The aromatic hydrocarbon group of 2 1 ja, for example, an aryl group having 6 to 2 carbon atoms may be mentioned. In the case of the above-mentioned alkyl group having 1 to 2 carbon atoms, the alkylene group having 1 to 12 carbon atoms is more preferably an alkyl group having 1 to 6 carbon atoms. Preferred specific examples include a methylene group, an ethyl group, a methyl group, a trimethylene group, a tetramethylene group, a pentamethylene group, and a hexamethylene group. In the case of the above-mentioned cycloalkylene group having 3 to 20 carbon atoms, a ring-shaped alkyl group having a carbon number of 3 to 12 is more preferably a ring-forming group having 3 to 6 carbon atoms. Preferred examples of the compound include a cyclopropyl group, a cyclopentene group, a cyclopentylene group, and a cyclohexylene group. Further, the ring-like base group having a carbon number of 3 to 2 Å is preferably a ring-opening group having 3 to 12 carbon atoms, more preferably a ring-opening alkenyl group having 3 to 6 carbon atoms. In a preferred specific example, a cyclobutenyl group, a cyclopentenyl group, and a cyclohexene group can be listed. The divalent aromatic hydrocarbon group having 6 to 18 carbon atoms may, for example, be an extended aryl group such as a stretched phenyl group, a stretched biphenyl group, an extended naphthyl group, a phenanthrenyl group or a fluorenyl group. In the case of a stretching base-extension ring base-extension base, it is preferably an alkyl group having 1 to 6 carbon atoms and a ring-opening alkyl group having 3 to 12 carbon atoms and having a carbon number of 6 The base is particularly preferably an alkylene group having 1 to 6 carbon atoms and an alkyl group having 3 to 6 carbon atoms and an alkylene group having 1 to 6 carbon atoms. In the case of a cycloalkyl-alkylene group, a cycloalkyl group is preferably a cycloalkyl group having a carbon number of from 3 to 2, and a carbon atom number of from 1 to 6 and a carbon atom number of from 3 to 丨. 2 is a cycloalkyl group, particularly preferably a cycloalkyl group having 3 to 6 carbon atoms - an alkyl group having a carbon number of 丨 1-6 and a ring-opening alkyl group having 3 to 6 carbon atoms. In the above-mentioned stretching group-extended aryl group-extension group, it is preferably a stretching group having a carbon number of 1 to 6 and an aryl group having 6 to 14 carbon atoms and having 1 to 6 carbon atoms. The base 'extra is a C 1 to 6 alkyl group-carbon number 6 to --45- 201229666 aryl group - an alkyl group having 1 to 6 carbon atoms. The method for producing a ketimine is particularly limited, and can be obtained, for example, by subjecting a ketone and an amine to a dehydration reaction under a sub heating condition at room temperature. As far as the reaction temperature is concerned, it is 20C~15 (TC, more preferably 5〇t:~11 (rc.'y in terms of reaction time, private society & qt is preferably 2 hours). ~24小时, more preferably 2 hours to 5 hours. The ketimine can be obtained from commercially available products, and examples thereof include H 3 and H-30 (above, manufactured by Mitsubishi Chemical Corporation). The ketimine compound can be used alone or in combination. The use ratio of the ketimine compound in the radiation-sensitive resin composition is preferably 1 part by mass relative to the [A] copolymer by 1 part by mass. More preferably, it is 0.5 parts by mass to 5 parts by mass, and by making the content ratio of the ketimine compound within the above specific range, the radiation can be linearly known, and the product has more excellent storage stability and [Capping-type isocyanate compound] The blocked polyisocyanate compound is a temperature-inert substance which is formed by reacting an isocyanate group with a compound containing a reactive nitrogen (blocking agent), and has a blocking agent once heated. Resolving and regenerating isocyanate groups a material of a nature. By making the radiation-sensitive resin composition contain a blocked polyisocyanate, which can be used as an effective crosslinking agent, isocyanate-base crosslinking reaction can make the radiation-sensitive resin composition The product has a high level of storage stability and low-temperature firing. The blocked polyisocyanate compound can be a reaction of a polyisocyanate derived from an aliphatic or alicyclic diisocyanate and a compound having an active hydrogen (blocking agent) by a known reaction. -46- 201229666 For the diisocyanate δ, for example, tetradecyl monoisocyanate, pentane diisocyanate, hexamethylene diisocyanate (HDI), 2,2,4-tridecyl group can be cited. -1,6-diisocyanate hexane, 2,4,4-trimethyl-1,6-diisocyanate hexane, lysine diisocyanate, isophorone diisocyanate (IPDI), 1,3- Bis(isocyanatemethyl)cyclohexane, 4,4-dicyclohexylmethane diisocyanate, norbornene diisocyanate, toluene diisocyanate, 4,4,-diphenylmethane diisocyanate, hydrazine ,5·naphthalene diisocyanate, triterpenoid diisocyanate 'Dioxophenylisocyanate, 1,4-tetradecyl diisocyanate, 1,5-pentamethylene diisocyanate, hydrazine, hexamethylene diisocyanate, 3-isocyanate methyl _3,5, 5-tridecylcyclohexyl diisocyanate, etc. The commercially available product may, for example, be formed by blocking the isocyanate group with hydrazine of mercaptoethyl ketone, and examples thereof include DURANATE TPA-B80E and TPA. -B80X, E402-B80T, MF-B60XN, MF-B60X, MF-B80M (above, manufactured by Asahi Kasei Chemicals Co., Ltd.); For the formation of an isocyanate group by an active methylene group, a DURANATE MF- K60X (produced by Asahi Kasei Kogyo Co., Ltd.); For the end of the isocyanate compound having a (meth) acrylonitrile group, Karenz MOI-BP and Karenz MOI-BM (above 'Showa Denko') can be cited. Among these, DURANATE E4G2_B8 0T and MF-K60X exhibit high flexibility, and it is preferable to form a mixing system with other varieties so that the hardness can be freely controlled. -47- 201229666 The polyisocyanate derived from a diisocyanate may, for example, be an isocyanurate type polyisocyanate, a biuret type polyisocyanate, an amino phthalate type polyisocyanate or a urea phthalate type. Isocyanate, etc. From the viewpoint of curability, the isocyanurate type polyisocyanate is preferred. Examples of the terminal blocking agent include, for example, an alcohol compound, a compound, an active methylene compound, a thiol compound, and an acid hydrazine. An amine compound, an acid imine compound, and a β-sodium compound. The ratio of the α-based compound, the urea compound, the compound, the amine compound, the imine compound, the pyridine compound, and the like. Examples of the alcohol compound include methanol, ethanol, propanol, butanol, 2-ethylhexanol, thiol cellosolve, butyl cellosolve, methyl carbitol, benzyl alcohol, cyclohexanol, and the like. Examples of the compound to be used include, for example, benzophenone, mercaptobenzene, ethylphenol, butylphenol, nonylphenol, dinonylphenol, styrenated phenol, hydroxybenzoic acid ester, and the like; Examples of the methylene-based compound include dimethyl malonate, diethyl malonate, ethyl acetoacetate, ethyl acetate, ethyl acetate, and the like; For example, butyl mercaptan, dodecyl mercaptan, and the like; and examples of the acid amide compound include, for example, acetanilide, decylamine, ε-caprolactam, and δ-valeroguanamine. Γ-butylidene or the like; and examples of the acid quinone imine compound include amber imine, maleimide, and the like; -48-201229666 For the imidazole compound, for example, imidazole, 2_ For the pyrazole compound, for example, 3-methylpyrazole 3,5 can be cited. - Diterpenoid η is more than spit, 3,5-ethyl. More than saliva;
就尿素類化合物而言,能夠列舉例如尿素、硫 伸乙基脲等; μ ;,L 就肟類化合物而言,能夠列舉例如甲醛肟、乙 、丙酮肟、甲基乙基酮肟、環己酮月亏等; 就胺類化合物而言,能夠列舉例如二笨基胺、 、°卡唑等; 就亞胺類化合物而言,能夠列舉例如乙亞胺、 亞胺等; 就吡啶類化合物而言,能夠列舉例如2_羥基吡 2 -輕基啥琳等。 封端型多異氰酸酿化合物可以單獨使用或混合 以上。就6亥感放射線性樹脂組成物中封端型多異氰 化合物的含有比例而言,相對於[A]共聚物1〇〇質量 較佳為1質量份~40質量份,更佳為3質量份〜2〇質量 藉由使封端型多異氰酸酯化合物的含有比例於上述 ,可以使该感放射線性樹脂組成物兼具更高水準的 穩定性和低溫燒製》 [含咪唑環的化合物] 就含咪唑環的化合物而言,可以使用由包含下 (15)表示的化合物的群組中選出的至少一種物質。 甲基 〇坐、 脲、 醛肟 苯胺 聚乙 咬、 兩種 酸酉旨 份, 份。 範圍 儲存 述式 -49-Examples of the urea-based compound include urea, sulfur-extension ethyl urea, and the like; μ; L, for the hydrazine-based compound, for example, formaldehyde oxime, ethyl acetate, acetone oxime, methyl ethyl ketone oxime, and cyclohexane Examples of the amine compound include, for example, dipyridylamine and °carbazole; and the imine compound may, for example, be an imine or imine; or a pyridyl compound; In other words, for example, 2_hydroxypyridin-2-light quinone may be mentioned. The blocked polyisocyanate compound can be used alone or in combination. The content ratio of the blocked polyisocyanate compound in the 6-ray radiation-sensitive linear resin composition is preferably 1 part by mass to 40 parts by mass, more preferably 3 mass, based on 1 〇〇 mass of the [A] copolymer. By making the content of the blocked polyisocyanate compound in the above ratio, the radiation-sensitive resin composition can have a higher level of stability and low-temperature firing [imidazole ring-containing compound]. For the imidazole ring-containing compound, at least one selected from the group consisting of compounds represented by the following (15) can be used. Methyl sputum, urea, aldoxime Aniline Polyethylene bite, two kinds of sour glutinous rice, part. Range Storage Statement -49-
201229666 A5 /R54201229666 A5 /R54
A6 上述式(15)中,A5、A6、A7及R54各自 子或可以具有取代基的碳原子數1〜20的直 或環狀的煙基。另外,A 6和A7可以相互連 就A5、A6、A7及R54所示的碳原子數1, 支鏈狀或環狀的烴基而言,能夠列舉例如 曱基、乙基、正丙基、異丙基、正丁 第二丁基、第三丁基、正戊基、正己基、 基、正壬基、正癸基、正十一烧基、正十 三烷基、正十四烷基、正十五烷基、正十 七烷基、正十八烷基、正十九烷基、正二 子數1〜20的烷基; 環丙基、環丁基、環戊基、環己基等 的環烷基; 苯基、曱苯基、苄基、甲基苄基、二 三甲笨基、萘基、蒽基等碳原子數6~20的 降莰烷基、三環癸烷基、四環十二烷 、甲基金剛烷基、乙基金剛烷基、丁基金 子數6〜20的脂環式橋烴基等。 上述烴基可以被取代,就該取代基的 ’能夠列舉 羥基; 獨立地為氫原 鏈狀、支鏈狀 接形成環。 -20的直鏈狀、 基、異丁基、 正庚基、正辛 关烷基、正十 六烷基、正十 十烷基等碳原 碳原子數3~20 f 苯基、2,4,6-芳基; 基、金剛烷基 剛烧基等碳原 具體例子而言 -50- 201229666 羧基; 經基曱基、1-經基乙基、2 -羥基乙基、1-羥基丙基、 2-羥基丙基、3-羥基丙基、1_羥基丁基、2-羥基丁基、3-羥基丁基、4-羥基丁基等碳原子數卜4的羥基烷基; 曱氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基 、2-甲基丙氧基、1_曱基丙氧基、第三丁氧基等碳原子 數1〜4的烷氧基; 氰基; 氰基曱基、2-氰基乙基、3·氰基丙基、4-氰基丁基等 碳原子數2〜5的氰基院基; 曱氧羰基、乙氧羰基、第三丁氧羰基等碳原子數2〜5 的烧氧鼓基; 甲氧羰基甲氧基、乙氧羰基甲氧基、第三丁氧羰基 曱氧基等碳原子數3〜6的烷氧羰基烷氧基; 氟、氣等鹵素原子; 氟曱基、三氟曱基、五氟乙基等氟烷基等。 就上述A6和A7相互連接形成的環而言,較佳可列舉 芳香環、碳原子數2〜20的飽和或不飽和的含氮雜環。就 A和A相互連接形成的環為苯環時的含。米。坐環的化合物 而言’能夠列舉下述式(16)表示的化合物。 RS5 R56A6 In the above formula (15), each of A5, A6, A7 and R54 or a straight or cyclic group of ketone having 1 to 20 carbon atoms which may have a substituent. Further, A 6 and A 7 may be bonded to each other. The hydrocarbon group having 1 or a branched or cyclic group represented by A5, A6, A7 and R54 may, for example, be a mercapto group, an ethyl group, a n-propyl group or a different group. Propyl, n-butyl t-butyl, tert-butyl, n-pentyl, n-hexyl, yl, n-decyl, n-decyl, n-decyl, n-tridecyl, n-tetradecyl, N-pentadecyl, n-heptadecyl, n-octadecyl, n-nonadecyl, an alkyl group having a dimer number of 1 to 20; a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group or the like a cycloalkyl group; a phenyl group, a fluorenylphenyl group, a benzyl group, a methylbenzyl group, a tricakisyl group, a naphthyl group, a fluorenyl group, a C 2 alkyl group having a carbon number of 6 to 20, a tricyclodecyl group, and a tetra Cyclododecane, methyladamantyl, ethyladamantyl, butyl gold having 6 to 20 butyl groups, and the like. The above hydrocarbon group may be substituted, and the substituent '' can be exemplified by a hydroxyl group; and independently a hydrogen original chain or a branched chain form a ring. -20 linear, benzyl, isobutyl, n-heptyl, n-octyl, n-hexadecyl, n-decene, etc. carbon atoms 3 to 20 f phenyl, 2, 4 , 6-aryl; base, adamantyl group, such as a carbon atom, a specific example -50-201229666 carboxyl group; a mercapto group, a 1-ethylidene group, a 2-hydroxyethyl group, a 1-hydroxypropyl group a 2-hydroxypropyl group, a 3-hydroxypropyl group, a 1-hydroxybutyl group, a 2-hydroxybutyl group, a 3-hydroxybutyl group, a 4-hydroxybutyl group, or the like, a hydroxyalkyl group having a carbon number of 4; An alkane having 1 to 4 carbon atoms such as ethoxy, n-propoxy, isopropoxy, n-butoxy, 2-methylpropoxy, 1-decylpropoxy or tert-butoxy Alkyl; cyano; 2-cyanoethyl, 3-cyanopropyl, 4-cyanobutyl, etc.; cyano group having 2 to 5 carbon atoms; oxime oxycarbonyl, ethoxy a oxyalkyl group having 2 to 5 carbon atoms such as a carbonyl group or a third butoxycarbonyl group; a carbon atom having 3 to 6 carbon atoms such as a methoxycarbonylmethoxy group, an ethoxycarbonylmethoxy group or a third butoxycarbonyloxy group; Alkoxycarbonylalkoxy; halogen atom such as fluorine or gas; fluoromethyl, trifluoromethyl, pentafluoroethyl Isofluoroalkyl and the like. The ring formed by the above-mentioned A6 and A7 being bonded to each other is preferably an aromatic ring or a saturated or unsaturated nitrogen-containing hetero ring having 2 to 20 carbon atoms. The ring formed when A and A are connected to each other is a benzene ring. Meter. The compound of the ring can be referred to as a compound represented by the following formula (16). RS5 R56
(16) R58 -51- 201229666 上述式(】6)中,R54及A5與上述式(】5)令的含義相同 。:R55〜R58各自獨立地為可以具有取代基的碳原子數卜2〇 的直鏈狀、支鏈狀或環狀的烴基。還有,就R55〜R58所示 的烴基而言,能夠列舉與上述式(15)令的烴基相同的基 團。 就3咪唑%的化合物而言,較佳係2-苯基聯咪唑、 2甲基米唑' 2-甲基聯咪哇。含咪唑環的化合物可以單 獨使用或邮σ兩種以上使用。就含坐環的化合物的含 ^彳】而。相對於[Α]共聚物1 〇 〇質量份’較佳為〇 · 1質 量份〜10質量份,更佳. •。坐環的化合物的含有為::2f里份〜5f量份… 該感放射線性樹於上述特定範園内,可以使 低溫燒製。^成物兼具更高水準的儲存穩定性和 [籠合化合物] 本說明書中所謂沾「 ± ^ 明的籠合化合物」是指在下述式(17) =的四酴類化合物、或式⑽表示的二叛酸類 中籠合味:t化合物或聯味唾化合物而形成的化合物。(16) R58 -51- 201229666 In the above formula (6), R54 and A5 have the same meanings as the above formula (5). Each of R55 to R58 is independently a linear, branched or cyclic hydrocarbon group having a carbon number which may have a substituent. Further, the hydrocarbon group represented by R55 to R58 may be the same as the hydrocarbon group of the above formula (15). In the case of the compound of 3 imidazole, 2-phenylbiimidazole and 2-methylmazole '2-methylbiimivir are preferred. The imidazole ring-containing compound can be used singly or in combination of two or more. The content of the compound containing the ring is as follows. The amount of the 〇 〇 mass portion relative to the [Α] copolymer is preferably 〇 · 1 part by mass to 10 parts by mass, more preferably. The content of the compound of the ring is: 2f parts to 5 parts by volume. The radiation-sensitive linear tree can be fired at a low temperature in the above specific garden. ^The product has a higher level of storage stability and [cage compound] The term "cage compound" in the present specification means a tetraterpenoid compound of the following formula (17) = or formula (10) The compound represented by the two cytotoxic acids is a compound formed by the t compound or the salivary compound.
OH R61 R66 (17)OH R61 R66 (17)
X (18)201229666X (18)201229666
COOHCOOH
COOH 上述式(17)中,χ為單鍵、亞甲基或碳原子數2〜6的 伸烷基〜R各自獨立地為氫原子、碳原子數丨〜丨2的 烷基、可以具有取代基的苯基、鹵素原子或碳原子數1〜12 的院氧基。 上述式(18)中’ R67為碳原子數丨〜12的烷基、碳原子 數1〜12的烷氧基、硝基或羥基。 較佳係上述式(1 7)表示的四酚類化合物是上述式 (17-1)表示的化合物。藉由形成上述式(17_丨)表示的四酚 類化合物’可以進一步提高儲存穩定性和促進低溫硬化COOH In the above formula (17), hydrazine is a single bond, a methylene group or an alkylene group having a carbon number of 2 to 6 and each of R is independently a hydrogen atom or an alkyl group having a carbon number of 丨 to 丨2, which may have a substitution. A phenyl group, a halogen atom or a hospitaloxy group having 1 to 12 carbon atoms. In the above formula (18), R67 is an alkyl group having a carbon number of 丨12 to 12, an alkoxy group having 1 to 12 carbon atoms, a nitro group or a hydroxyl group. The tetraphenol compound represented by the above formula (17) is preferably a compound represented by the above formula (17-1). By forming the tetraphenol compound represented by the above formula (17_丨), storage stability and low-temperature hardening can be further improved.
,X及R59〜R66與上述式(17)中 的含義 上述式(17_1)中 相同。 -53- 201229666 就四驗類化合物而古,σ I β 1ΝΦ 合物就沒有特別的限制二要疋上述式⑴-1)表示的化 w ^ 制’此夠列舉例如1,1,2,2-肆(4-羥基 本基)乙烷、1,1,2,2-肆〇田发, (3_甲基_4·羥基苯基)乙烷、1,1,2,2-肆(3,5-二曱基_4-羥基絮装、7 w 贫里w ^ 本基)乙烷、1,1,2,2-肆(3-氣-4-羥基 本基)乙烷、1,1,2,2_肆 坪(3,5_一虱-4-羥基苯基)乙烷、 1,1,2,2-肆(3-溴-4-羥其贫 1 w . w „ 基本基)乙烷、1,1,2,2-肆(3,5-二溴 罗工基本基)乙烧、1〗 7 , ,丨,2,2•肆(夂第三丁基-4-羥基苯基) 乙烷、1,1,2,2-肆(3,5_ _ 第一 ! ! . ^ —第二丁基-4-羥基苯基)乙烷、 1,1,2,2-肆(3-氟-4-羥* 芏其、 .^ w 土本基)乙烷、1,1,2,2-肆(3,5-二氟 _4-羥基苯基)乙烷、 虱 1 , ^ Λ ^ ,,’2_肆(3_甲氧基-4-羥基苯基)乙 坑、1,1,2,2-肆(3,5-二甲 g i ^ 肆 甲氧基_4-羥基苯基)乙烷、1,1,2,2- 砰U -氯-5-甲基-4-經某笑耸、,w Α 4 ,, Α ^ 基本基)乙烷、1,1,2,2-肆(3-溴_5-甲 基-4-鉍基苯基)乙烷、 其贫1、 ,l2,2-肆(3 -甲氧基-5-曱基-4-羥 基本基)乙烷、1,1,2,2_肆( & w ^ 1 , 坪(第二丁基-5-甲基-4-羥基苯基 )乙烷、1,1,2,2-肆(3-翕 ς 4 β 肆(3_1 氣_5-邊_4-羥基苯基)乙烷、1,1,2,2- 吁^風-5-本基-4_經某笑苴、 苯β 本基)乙烷、U’2,2-肆[(4-羥基_3_ 土)本基]乙烷、lsl 3 3·肆 肆Μ田甘μ 气^ &基本基)丙烷、1,1,3,3- 拜-甲基·4-羥基苯基) 羥本愚)丙烷、U,3,3-肆(3,5_二甲基_4_ 工暴本基)丙烷、1 1,1 3 3 Mf3 , ,,,3_肆(3-鼠-4-羥基苯基)丙烷、 ,夂扣肆(3,5-二氣_4_羥美 •4,基苯基)丙烷 土广:、1,1,3,3-肆(3-溴 、U,3,3.肆二漠·4七基苯基)丙烧 ^ ^^3,3^3Τ^,3^4(3^ { 9j —甲氧基-4·鄭其贫宜、工 1,1,3,3-肆(3_第三丁 | η… 包基本基)丙烷、 _羥基苯基)丙烷、1,1,3,3-肆(3,5· -54· 201229666 二第三丁基-4-羥基苯基)丙烷、^七心肆㈠—羥基苯基) 丁烷、1,1,4,4-肆(3-甲基-4-羥基笨基)丁烷、^4,4-肆 (3,5-二甲基-4-羥基苯基)丁烷、^,夂心肆㈠-氯·4_羥基苯 基)丁烷、1,1,4,4-肆(3,5-二氯-4-羥基苯基)丁烷、^4,4-肆(3 -曱氧基-4-羥基苯基)丁烷、丨^^肆㈠。·二甲氧基 _4-羥基苯基)丁烷、^,七肛肆(3_漠·4_羥基苯基)丁烷: 1,1,4,4-肆(3,5-二溴-4-羥基苯基)丁烷、Μ,4,4•肆(3_第三 丁基-4-羥基苯基)丁烷、^,宄扣肆^:二第三丁基-心羥 基苯基)丁烷、肆(4-羧基苯基)乙烷、肆(4_羧基苯基)乙烷 四甲基酯、肆(4-羧基苯基)乙烷四乙基酯、肆羧基苯 基)乙烷四正丙基酯、肆(4-羧基苯基)乙烷四节基酯、肆 (3,5-二曱基-4_叛基苯基)乙烷、肆(3,5_二甲基_4·竣基苯 基)乙烧四曱基醋、肆(3,5_二甲基_4_緩基苯基)乙烧四乙 基醋、肆(3,5-二甲基_4_叛基苯基)乙烧四正丙基醋、肆 (3,5-二甲基_4_羧基苯基)乙烷四节基酯、肆⑷羧基苯基) 乙烷四鈉鹽、肆(4_羧基苯基)乙烷四鉀鹽、肆(3_羧基苯 基)乙烷、肆(3_缓基苯基)乙烷四甲基醋、肆(3-缓基-4,5-二甲基苯基)乙烧、肆(3.缓基苯基)乙燒四乙基酿、肆(3· 幾基苯基)乙院四正丙基酉旨、肆(3-致基苯基)乙烧四节基 醋、肆(3-羧基-4,5_二甲基苯基)乙烷、肆(3·缓基_4,5_二 甲基苯基)乙燒四甲基醋、肆(3,基·4,5·二甲基苯基)乙 =四乙基醋、肆(3_缓基_4,5_二甲基苯基)乙烧四正丙基 ':肆(3,5-二甲基_4_羧基苯基)乙烷四苄基酯、肆(3_羧 基苯基)乙院四納鹽、肆(3_缓基苯基)乙院四鉀鹽等。 在此等中,使用以^,,以^肆…經基苯基^烧籠 -55- 201229666 合的咪唑化合你七 組成物在室…儲物:,該感放射線性樹脂 易釋放出硬化促:::性更優異’並且在加熱時容 π疋评丨,因此較佳。 就一緩酸類化合淑j &山 合物H枝 物而&,只要是上述式(2)表示的化 就,又有特別的限制’能夠列舉例如 酸、5-羥基鄰苯二甲 ^ Τ 5-甲基鄰苯二甲酸、5-曱氧基鄰 本一甲酸、4-石肖某郝岔 φ ^ ^ 自暴鄰本二甲酸、4-羥基鄰苯二甲酸、4_ V基鄰本二甲酸、4_甲 ^ 氣基鄰苯二甲酸等。在此等中, 較佳係5_硝基鄰笨二甲 甲k、5 -羥基鄰苯二甲酸。 由於味嗤化合物知 入仏 ^上述四酚類化合物或二羧酸類化 合物形成了穩定的籀a&人 ,,^. t 〇化合物’因此提高了該感放射線 性樹脂組成物室溫下的紗+ 的儲存穩定性。另外,由於咪唑化 δ物與環氧基的反應性優 ^ Λ 後異’因此有助於200 C以下的低 溫硬化。 丄米坐化0物而s ’能夠列舉在上述含0米。坐環的化 。物的項目中說明的上述式(15)表示的化合物等。 乍為具組的咪唑化合物’能夠列舉例如咪唑、2-甲 基D米唑」2-乙基咪唑、9 s i甘, 2 -異丙基咪。坐、2 -正丙基咪α坐、2- 燒& _1H_ 2_十七烧基-1Η-味唾、1,2-二曱基咪 2、2_乙基·4_甲基°米。坐、2-苯基-1Η·咪唾、4_甲基_2_苯 \1Η-味。坐、2_苯基_4_甲基味。坐、l节基_2_甲基咪唑、 ^氰基乙基-2-曱基咪唑、】@ A 7 * ^ 土下生、1._氰基乙基·2-乙基_4_曱基咪唑 1_亂基乙基-2-十一、Jt*- :Η· | , 、^ 烷基咪唑、1-氰基乙基_2-苯基咪唑And X and R59 to R66 have the same meanings as in the above formula (17) in the above formula (17_1). -53- 201229666 For the four test compounds, there is no particular limitation on the σ I β 1ΝΦ compound. The above formula (1)-1) represents the chemical formula, which is, for example, 1,1,2,2 - hydrazine (4-hydroxybenyl)ethane, 1,1,2,2-industrial, (3-methyl-4-hydroxyphenyl)ethane, 1,1,2,2-indole ( 3,5-dimercapto-4-hydroxy floc, 7 w lean w ^ base) ethane, 1,1,2,2-indole (3- gas-4-hydroxyl)ethane, 1 1,1,2,2_肆ping (3,5_-indol-4-hydroxyphenyl)ethane, 1,1,2,2-indole (3-bromo-4-hydroxy which is poor 1 w. w „ Basic group) ethane, 1,1,2,2-anthracene (3,5-dibromo-based basic group), Ethylene, 1 〖 7 , , 丨, 2, 2 • 肆 (夂 butyl -4- -hydroxyphenyl)ethane, 1,1,2,2-indole (3,5_ _ first! ! . ^ - second butyl-4-hydroxyphenyl)ethane, 1,1,2,2 - 肆 (3-fluoro-4-hydroxy* 芏, , ^ ^ soil base) ethane, 1,1,2,2-anthracene (3,5-difluoro-4-hydroxyphenyl)ethane,虱1 , ^ Λ ^ ,, '2_肆(3_methoxy-4-hydroxyphenyl)ethyl pit, 1,1,2,2-anthracene (3,5-dimethyl gi ^ methoxyl) _4-hydroxyphenyl) Alkane, 1,1,2,2-砰U-chloro-5-methyl-4- via a smile, w Α 4 ,, Α ^ basic group) ethane, 1,1,2,2-肆(3-Bromo-5-methyl-4-mercaptophenyl)ethane, which is depleted of 1, 1, 2, 2-indole (3-methoxy-5-mercapto-4-hydroxyl) ethane , 1,1,2,2_肆( & w ^ 1 , ping (t-butyl-5-methyl-4-hydroxyphenyl)ethane, 1,1,2,2-indole (3-翕ς 4 β 肆(3_1 gas _5-side _4-hydroxyphenyl)ethane, 1,1,2,2- ^风-5-benyl-4_ via a smile, benzene β base Ethane, U'2,2-肆[(4-hydroxy-3-3) base]ethane, lsl 3 3·肆肆Μ田甘μ gas ^ & base) propane, 1,1,3 , 3-By-methyl 4-hydroxyphenyl) hydroxybenzine) propane, U,3,3-indole (3,5-dimethyl_4_operated base) propane, 1,1,3 3 Mf3 , , , , 3_肆(3-mur-4-hydroxyphenyl)propane, 夂 肆 (3,5-digas _4_ hydroxymei • 4, phenyl) propane: 1: ,1,3,3-肆(3-bromo, U,3,3.肆二漠·四七基phenyl)propane burning ^ ^^3,3^3Τ^,3^4(3^ { 9j — Methoxy-4·Zhengqi is poor, work 1,1,3,3-肆 (3_third-but | η... package basic Propane, _hydroxyphenyl)propane, 1,1,3,3-indole (3,5·-54· 201229666 di-tert-butyl-4-hydroxyphenyl)propane, 七七心肆(一)-hydroxybenzene Butane, 1,1,4,4-anthracene (3-methyl-4-hydroxyphenyl)butane, ^4,4-anthracene (3,5-dimethyl-4-hydroxyphenyl) Butane, ^, 夂 heart 肆 (1)-chloro-4-hydroxyphenyl) butane, 1,1,4,4-anthracene (3,5-dichloro-4-hydroxyphenyl)butane, ^4, 4-肆(3-oxo-4-hydroxyphenyl)butane, 丨^^肆(1). Dimethoxy- 4-hydroxyphenyl)butane, ^, seven anal sputum (3_ desert · 4 hydroxyphenyl) butane: 1,1,4,4-anthracene (3,5-dibromo 4-hydroxyphenyl)butane, anthracene, 4,4•indole (3_t-butyl-4-hydroxyphenyl)butane, ^, 宄 肆^: di-tert-butyl-hydroxybenzene Butane, 肆(4-carboxyphenyl)ethane, 肆(4-carboxyphenyl)ethane tetramethyl ester, 肆(4-carboxyphenyl)ethane tetraethyl ester, 肆carboxyphenyl Tetra-n-propyl ethane, tetrakis(4-carboxyphenyl)ethane tetradecyl ester, ruthenium (3,5-diindenyl-4-destrophenyl)ethane, ruthenium (3,5_ Dimethyl-4(nonylphenyl)ethylidene tetraacetate vinegar, hydrazine (3,5-dimethyl-4-yl)phenylethyl ethene tetraethyl vinegar, hydrazine (3,5-dimethyl Base_4_ cytosylphenyl) Ethylene tetra-n-propyl vinegar, ruthenium (3,5-dimethyl-4-ylcarboxyphenyl)ethane tetra-n- ate, ruthenium (4) carboxyphenyl) ethane tetrasodium Salt, cerium (4_carboxyphenyl)ethane tetrapotassium salt, cerium (3_carboxyphenyl)ethane, hydrazine (3-hydrazolyl) ethane tetramethyl vinegar, hydrazine (3- slow-base) 4,5-Dimethylphenyl) Ethylene, bismuth (3. decyl phenyl), Ethylene, tetraethyl, (3· benzylidene phenyl) 乙院四正propyl 酉 肆, 肆 (3-aminophenyl) Ethylene four-base vinegar, 肆 (3-carboxy-4,5-dimethylphenyl) B Alkane, anthracene (3·buxos-4,5-dimethylphenyl)ethenetetramethyl vinegar, hydrazine (3, yl·4,5·dimethylphenyl)ethyl=tetraethyl vinegar, hydrazine (3_Very _4,5-dimethylphenyl) ethene tetra-n-propyl': hydrazine (3,5-dimethyl-4-ylcarboxyphenyl) ethane tetrabenzyl ester, hydrazine (3 _Carboxylphenyl) Siyuan four sodium salt, bismuth (3_ slow phenyl) B hospital tetrapotassium salt and the like. In this case, use the imidazole compound of ^,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, ::: is more excellent' and is better when it is heated. In the case of the compound represented by the above formula (2), there is a special limitation, for example, an acid, 5-hydroxyphthalic acid ^ Τ 5-methylphthalic acid, 5-decyloxy- ortho-carboxylic acid, 4-stone Xiaomou Hao岔φ ^ ^ self-violent ortho-dicarboxylic acid, 4-hydroxyphthalic acid, 4_ V-based Formic acid, 4_methythyl phthalic acid, etc. Among them, preferred is 5-nitro-o-zinomethyl k, 5-hydroxyphthalic acid. Since the miso compound knows that the above tetraphenolic compound or dicarboxylic acid compound forms a stable 籀a& human, ^. t 〇 compound' thus increases the yarn of the radiation-sensitive resin composition at room temperature + Storage stability. Further, since the reactivity of the imidazolyl δ substance with the epoxy group is excellent, it is suitable for low-temperature hardening of 200 C or less. The glutinous rice is singular and s ' can be enumerated in the above-mentioned 0 m. The ringing. The compound represented by the above formula (15) described in the item of the object. The imidazole compound which is a group can be exemplified by, for example, imidazole, 2-methyl D-mazole, 2-ethylimidazole, 9 s igan, 2-isopropylimidazole. Sit, 2 - n-propyl i-a sitting, 2-burning & _1H_ 2_heptacyl-1 - 唾 saliva, 1,2-dimercapto 2, 2_ethyl · 4 _ methyl ° m . Sitting, 2-phenyl-1 Η·Mimi, 4_methyl_2_benzene \1Η-flavor. Sitting, 2_phenyl_4_methyl taste. Sitting, l base 2_methylimidazole, ^ cyanoethyl-2-mercaptoimidazole, @@ 7 * ^ 土下生, 1._cyanoethyl·2-ethyl_4_曱Imidazole 1-disorganoethyl-2-11, Jt*- :Η· | , , ^ alkylimidazole, 1-cyanoethyl-2-phenylimidazole
1鼠基乙基-2 -乙基_ 4· ® ·«· ik I 土 4-甲基味唾偏苯三酸鹽、丨_氰基乙 土 -2 -十一烧基咪0坐偏笔_缺瞒 嗎本二酸鹽、1-氰基乙基-2-笨基咪唑 -56- 201229666 偏苯三酸鹽、2,4-二胺基-6-[2’-曱基咪唑基-(1,)]-乙基_s_ 二啡、2,4 - 一胺基-6-(2’ -十一烧基0米0坐基-)-乙基-s-三听 、2,4-二胺基-6- [2’ -乙基-4·咪嗤基- (1’)] -乙基-s-三听、 2,4-二胺基-6-[2’-甲基咪唑基—(丨’)]-乙基-s-三哜異氰脲 酸加成物、2 -本基味α坐異氰腺酸加成物、2 -曱基味η坐異 氰脲酸加成物、2-笨基-4,5-二羥基甲基咪唑、2-苯基_4_ 甲基-5-羥基曱基咪唑、丨_氰基乙基-2_苯基_4,5_二(2_氰 基乙氧基)甲基咪唑、1_十二烷基_2-甲基-3 -苄基咪唑氯 化物、1-苄基-2·苯基咪唑鹽酸鹽、丨_苄基_2_苯基咪唑偏 苯三酸鹽等。 較佳係上述咪唑化合物具有1個以上碳原子數i〜6的 取代基。由於這種咪唑化合物被穩定地籠合,因此不會 對该感放射線性樹脂組成物的儲存穩定性造成不良影響 ,並且立體障礙小,反應性優異,籠合崩解時可以發揮 低溫硬化性。 就上述具有1個以上碳原子數1〜6的取代基的咪唑化 合物而言’能夠列舉例如 2-曱基咪唑、2-苯基咪唑等具有丄個碳原子數的 取代基的咪唑化合物; 2-乙基-4-甲基咪唑、L2-二甲基咪唑、2苯基_4·甲 基-5-羥基曱基咪唑等碳原子數具有兩個卜6的取代基的 咪唑化合物等。 就用上述四盼類化合物或二錄缺相儿人& #人 Λ 羧酸類化合物籠合上述 咪唑化合物的方法而言,沒有特別的限制,能夠列舉例 如日本特開平丨卜⑺州號公報中記載的方法等。 -57- 201229666 在這些σ米β坐化合 存穩定性和硬化促進 -5 -經基曱基咪<7坐。 物中’從使組成物兼具高水準的儲 性方面考慮,較佳係2-苯基_4_甲基 就聯咪唾化合物品一 13物而言,能夠列舉在上述含咪 化合物的項目中說明 3 *坐J衣的 幻上述式(16)表不的化合物等。 就聯味。坐化合% t 1 而§ ,能夠列舉例如2 -曱基聯半 、"基聯咪唑、5_曱其… 甲暴聯味唑 _ , 甲基聯咪唑、6-曱基聯咪唑、7 聯咪唑、2-甲基-6-曱其_企k ^ T基 ? ^ 基駟味唑、2_甲基-6-甲基聯咪唑、 2-曱基-5·曱基聯咪唑 ^ 2 -曱基-5-甲基聯味唾、2_pr其 甲基聯〇米〇坐、2 -甲其< ^ 土 ~ 6 ~ 甲基_6-乙基聯咪唑、2_乙基巧 唑、2-曱基_5_乙基聯咪唑等。 土聯未 在此等中’從使組成物兼具高水準的儲存 硬化促進性方面老虐 . 、疋Γ生和 考慮,較佳係2-曱基聯咪唑、2 甲基聯咪唾、2-甲基_5_甲基聯喃嗤。 甲基+ 上述聯咪唑化合物較佳係具有丨個以上碳原子 二於這種味哇化合物被穩定地籠合,因此不 響:二立=mr穩定性造成… 可以發揮低溫硬化性。 鮮f 化八:上述具有1個以上碳原子數1〜6的取代基之聯咪唑 化合物而言,能夠列舉例 甲基如味唑等具有1個碳原 子數卜6的取代基之聯咪。坐化合物;2•甲基_6_甲基聯咪唾 、甲基-5-甲基聯味。坐等具有兩個碳原子數卜6的取代基 之聯味哇化合物等。 籠合化合物可以單獨使用或混合兩種以上使用。就 -58- 201229666 籠合化合物的含有比例而言’相對於[A]共聚物100質量 份,較佳為0.1質量份〜10質量份,更佳為0.5質量份〜5質 量份。藉由使籠合化合物的含有比例於上述特定範圍内 ’可以使該感放射線性樹脂組成物兼具更高水準的儲存 穩定性和低溫燒製。 <其它任意成分> 該感放射線性樹脂組成物,除了上述的[A]共聚物、 [B ] 二疊氮化合物、[c ]硬化劑外,必要時可以在不損 害本發明效果的範圍内含有界面活性劑、黏接助劑、耐 熱性增強劑、熱敏性酸產生劑等任意成分。這些任意成 分可以單獨使用’也可以混合使用兩種以上。以下,對 各種成分進行詳細描述。 [界面活性劑] 界面活丨生劑疋為了進—步提高感放射線性樹脂組成 物的覆膜形成性而使用的。就界面活性劑而言,能夠列 舉例如氟類界面活性劑、聚矽氧樹脂類界面活性劑及其 它的界面活性劑。 .就既類界面活性劑而言,較佳係末端、主鏈及側鏈 的中的至^ —個部位上具有氟烷基和/或伸氟烷基的化 合物,能夠列f 1。q a舉例如1,1,2,2-四氟.正辛基(u,2,2_w 正丙基)醚、备 ,1,2,2-四氟·正辛基(正己基)醚、六乙二 (1,1,2,2,3 3-*^ _ t a、A、 鼠-正戊基)醚、八乙二醇二(mh 氟-正丁基)醚、丄系—萨 ,、丙一醇—(1,1,2,2,3,3-六氟_正戊基)_ —(,丨,2,2-四齓正丁基)醚、全氟-正十二户 石黃酸納、]1 〇。1 ^ 、 ,,,2,3,3-六氟-正癸烷、1,1,2,2,8,8,9,9,10,10、 -59- 201229666 十氣-正十二烧、及氟烧基苯續酸鈉、氟烧基構酸納、氟 烷基羧酸鈉、二甘油四(氟烷基聚氧乙烯醚)、氟烷基碘 化銨、氟烷基甜菜鹼、其他氟烷基聚氧乙烯醚、全氟烷 基聚氧乙醇、全氟烷基烷氧化物、羧酸氟烷基酯等。 就氟類界面活性劑的市售產品而言,能夠列舉例如 BM-1000、BM-1100(以上,BM CHEMIE公司)、MEGAFAC F142D、MEGAFAC F172、MEGAFAC F173 ' MEGAFAC F183、MEGAFAC F178、MEGAFAC F191、MEGAFAC F471 、MEGAFAC F476(以上,大曰本油墨化學工業公司)、 Fluorad FC-170C、Fluorad FC-171、Fluorad FC-430、 Fluorad FC-431(以上,住友 3M公司)、surflon S-112、 surflon S-113、surflon S-131、surflon S-141、surflon S-145、surflon S-3 82、surflon SC-101、surflon SC-102 'surflon SC-103、surflon SC-104 'surflon SC-105 'surflon SC-106(以上,旭硝子公司)、EftopEF301、EftopEF303 、Eftop EF 352(以上,新秋田化成公司)、FTERGENT FT-100、FTERGENT FT-110、FTERGENT FT-140A、 FTERGENT FT-150、FTERGENT FT-250、FTERGENT FT-251、FTERGENT FT-300、FTERGENT FT-310、 FTERGENT FT-400S、FTERGENT FTX-218、FTERGENT FTX-251(以上,NEOS公司)等。1 murine ethyl-2-ethyl- 4· ® ·«· ik I soil 4-methyl-salt salicylate, 丨_cyanoethane-2 - eleven-burning microphone 0 sitting pen _ 瞒 瞒 本 本 本, 1-cyanoethyl-2-phenylimidazole-56- 201229666 trimellitate, 2,4-diamino-6-[2'-mercaptoimidazolyl- (1,)]-Ethyl_s_dimorphine, 2,4-amino--6-(2'-11-alkyl-based 0-square-s---ethyl-s-triple, 2,4 -diamino-6-[2'-ethyl-4.imidinyl-(1')]-ethyl-s-tripty, 2,4-diamino-6-[2'-methyl Imidazolyl-(丨')]-ethyl-s-triterpene isocyanurate adduct, 2-propenyl-flavored alpha-sodium isocyanate adduct, 2-mercapto-sodium-like isocyanuric acid Adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxyindenidazole, oxime-cyanoethyl-2-phenylene-4,5 _Bis(2-cyanoethoxy)methylimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 1-benzyl-2-phenylimidazolium hydrochloride, hydrazine Benzyl-2-phenylimidazole trimellitate and the like. Preferably, the imidazole compound has one or more substituents having from 1 to 6 carbon atoms. Since the imidazole compound is stably caged, it does not adversely affect the storage stability of the radiation sensitive resin composition, and has a small steric hindrance and excellent reactivity, and exhibits low-temperature curability at the time of cage disintegration. The imidazole compound having one or more substituents having 1 to 6 carbon atoms can be, for example, an imidazole compound having a substituent having one carbon atom number such as 2-mercaptoimidazole or 2-phenylimidazole; An imidazole compound having a carbon atom number of two substituents such as 6-methylimidazole, L2-dimethylimidazole, or 2phenyl-4-methyl-5-hydroxyindenidazole. There is no particular limitation on the method of cultivating the above imidazole compound by using the above-mentioned tetra-destination compound or the second-order nucleus &# human carboxylic acid compound, and for example, it is exemplified in Japanese Patent Publication No. 7 (7) The method described, etc. -57- 201229666 In these σ-m β sit-in stability and sclerosis-promoting -5 - via 曱基米米<7 sit. In view of the fact that the composition has a high level of storage, it is preferred that the 2-phenyl-4-methyl group is a compound of the above-mentioned imi-containing compound. In the case of the 3* sitting J, the compound represented by the above formula (16) and the like are described. Just like the taste. Sitting in combination with % t 1 and § can be exemplified by, for example, 2-indolyl half, "linked imidazole, 5_曱... A violent oxazole _, methylbiimidazole, 6-mercaptoimidazole, 7-linked Imidazole, 2-methyl-6-indole _ ke k ^ T-based? ^ carbazole, 2-methyl-6-methylbiimidazole, 2-indolyl-5-mercaptoimidazole ^ 2 - Indole-5-methyl-linked saliva, 2_pr its methyl-linked glutinous rice, 2-methyl-<^ soil~6~methyl_6-ethylbiimidazole, 2_ethyl azole, 2 - mercapto_5_ethylbiimidazole and the like. In this case, the Union has not been able to make a high level of storage hardening promotion from the composition. It is better to use 2-mercaptoimidazole, 2 methyl hydrazine, 2 -Methyl _5_methyl oxime. Methyl + the above biimidazole compound preferably has more than one carbon atom. Secondly, the tyrosine compound is stably caged, so that it does not ring: Erlic = mr stability... It can exhibit low temperature hardenability. The biimidazole compound having one or more substituents having 1 to 6 carbon atoms, and examples of the biimidazole compound having a substituent of one carbon atom, such as oxazole, may be exemplified. Sit compound; 2 • methyl _6_methyl carbamide, methyl-5-methyl odor. A compound such as a flavonoid having a substituent of two carbon atoms and having a number of 6 is used. The cage compound may be used singly or in combination of two or more. The content ratio of the -58-201229666 cage compound is preferably 0.1 parts by mass to 10 parts by mass, more preferably 0.5 parts by mass to 5 parts by mass, per 100 parts by mass of the [A] copolymer. The radiation-sensitive resin composition can have a higher level of storage stability and low-temperature firing by making the content ratio of the cage compound within the above specific range. <Other optional components> The radiation sensitive resin composition may be in a range that does not impair the effects of the present invention, if necessary, in addition to the above [A] copolymer, [B] diazide compound, and [c] hardener. It contains optional components such as a surfactant, an adhesion aid, a heat resistance enhancer, and a heat-sensitive acid generator. These optional components may be used singly or in combination of two or more. Hereinafter, various components will be described in detail. [Interacting Agent] The interface active agent is used to further improve the film formability of the radiation-sensitive resin composition. As the surfactant, for example, a fluorine-based surfactant, a polyoxymethylene-based surfactant, and other surfactants can be listed. In the case of a surfactant other than the surfactant, a compound having a fluoroalkyl group and/or a fluoroalkyl group at a terminal portion, a main chain and a side chain is preferred, and f 1 can be listed. Qa, for example, 1,1,2,2-tetrafluoro.n-octyl (u,2,2-w-propyl)ether, prepared, 1,2,2-tetrafluoro-n-octyl (n-hexyl) ether, six Ethylene (1,1,2,2,3 3-*^ _ ta, A, murine-n-pentyl) ether, octaethylene glycol di(mh fluoro-n-butyl) ether, hydrazine-sa, Propyl alcohol - (1,1,2,2,3,3-hexafluoro-n-pentyl)_-(,丨,2,2-tetra-n-butyl)ether, perfluoro-n-nine Yellow acid, 1 〇. 1 ^ , , , , 2,3,3-hexafluoro-n-decane, 1,1,2,2,8,8,9,9,10,10, -59- 201229666 ten gas - positive twelve burning And sodium fluoroalkyl benzoate, sodium fluorocarbonate, sodium fluoroalkylcarboxylate, diglycerol tetrakis(fluoroalkylpolyoxyethylene ether), fluoroalkyl ammonium iodide, fluoroalkyl betaine, Other fluoroalkyl polyoxyethylene ethers, perfluoroalkyl polyoxyethylenes, perfluoroalkyl alkoxides, fluoroalkyl carboxylates, and the like. Examples of commercially available products of the fluorine-based surfactant include BM-1000, BM-1100 (above, BM CHEMIE), MEGAFAC F142D, MEGAFAC F172, MEGAFAC F173 'MEGAFAC F183, MEGAFAC F178, MEGAFAC F191, MEGAFAC. F471, MEGAFAC F476 (above, Otsuka Ink Chemical Industry Co., Ltd.), Fluorad FC-170C, Fluorad FC-171, Fluorad FC-430, Fluorad FC-431 (above, Sumitomo 3M), surflon S-112, surflon S -113, surflon S-131, surflon S-141, surflon S-145, surflon S-3 82, surflon SC-101, surflon SC-102 'surflon SC-103, surflon SC-104 'surflon SC-105 'surflon SC-106 (above, Asahi Glass Co., Ltd.), EftopEF301, EftopEF303, Eftop EF 352 (above, New Akita Chemical Co., Ltd.), FTERGENT FT-100, FTERGENT FT-110, FTERGENT FT-140A, FTERGENT FT-150, FTERGENT FT-250 , FTERGENT FT-251, FTERGENT FT-300, FTERGENT FT-310, FTERGENT FT-400S, FTERGENT FTX-218, FTERGENT FTX-251 (above, NEOS).
就聚矽氧樹脂類界面活性劑的市售產品而言,能夠 列舉例如 TORAY SILICONE DC3PA、TORAY SILICONE DC7PA、TORAY SILICONE SH11PA、TORAY SILICONE SH21PA 'TORAY SILICONE SH28PA 'TORAY SILICONE -60- 201229666For a commercially available product of a polyoxyxene-based surfactant, for example, TORAY SILICONE DC3PA, TORAY SILICONE DC7PA, TORAY SILICONE SH11PA, TORAY SILICONE SH21PA 'TORAY SILICONE SH28PA 'TORAY SILICONE -60- 201229666
SH29PA、TORAY SILICONE SH30PA、TORAY SILICONE SH-190、TORAY SILICONE SH-193、TORAY SILICONE SZ-6032、TORAY SILICONE SF-8428、TORAY SILICONE DC-57、TORAY SILICONE DC-190(以上,TORAY · DOW CORNING · SILICONE公司)、TSF-4440、TSF-4300、 TSF-4445、TSF-4446、TSF-4460、TSF-4452(以上,GE Toshiba Silicones公司)、有機矽氧烷聚合物KP341(信越 化學工業公司)等。 就其它的界面活性劑而言,能夠列舉例如聚氧乙烯 月桂基醚、聚氧乙烯硬脂基醚、聚氧乙稀油基醚等聚氧 乙稀院基贼;聚氧乙稀-正辛基苯基縫、聚氧乙稀-正壬 基苯基_等聚氧乙烯芳基醚;聚氧乙稀二月桂酸醋、聚 氧乙烯二硬脂酸酯等聚氧乙烯二烷基酯等非離子類界面 活性劑、(甲基)丙烯酸類共聚物P〇LYFl〇w No.57、 POLYFLOW No.95(以上,共榮社化學公司)等。 就界面活性劑的使用量而言,相對於[A ]共聚物1 〇 〇 質量份,較佳為1.0質量份以下,更佳為〇·7質量份以下。 如果界面活性劑的使用量超過丨.〇質量份,則容易產生膜 不勻。 ' [黏接助劑] 黏接助劑是為了進一步提高所獲得的圖案和基板的 黏接性而使用的。就黏接助劑而言,較佳係具有羧基、 甲基丙烯醯基、乙烯基、異氰酸酯基、環氧乙烷基等具 有反應性官能基的官能性矽烷偶合劑,能夠列舉例如三 甲氧基甲矽烷基苯甲酸、γ_甲基丙烯醯氧丙基三曱氧基 -61 - 201229666 石夕烧、乙稀基三乙醯氧基錢、乙稀基2甲氧基石夕烧、丫一 異氰酸醋基丙基三乙氧基矽烷、γ_環氧丙氧基丙基三甲 氧基石夕烧' β-(3,4-環氧環己基)乙基三甲氧基石夕烧等。 作為黏接助劑的使用量,相對於[Α]共聚物1〇〇質量 份,較佳為20質量份以下,更佳為15質量份以下。如果 黏接助劑的使用量超過20質量份,則容易產生顯影殘留 〇 [耐熱性提高劑] 就耐熱性提高劑而言,能夠列舉例*Ν_(烷氧基甲基 )甘脲化合物、N_(院氧基甲基)三聚氛胺化合物等。 就N-(烷氧基曱基)甘脲化合物而言,能夠列舉例如 N’N’N ,N •四(甲氧基甲基)甘脲、N,N,N,,N,·四(乙氧 基甲基)甘脲、n,n,n’,n,_四(正丙氧基甲基)甘脲、 Ν’Ν,Ν,N _四(異丙氧基甲基)甘脲、N,N,N,,N,_四(正丁氧 基:基)甘脲、N,N,N,,N,.四(第三丁氧基曱基)甘腺等。 在适些!^(烷氧基甲基)甘脲化合物中,較佳係N,N,N,,N,_ 四(甲氧基甲基)甘脲。 就N-(烷氧基曱基)三聚氰胺化合物而言,能夠列舉 例如 N’n,N’,,n’,n",n’4(^^&)^u、n,n, N^N’N ,N _六(乙氧基甲基)三聚氰胺、N,N,N,,N,,N,,, N _=(正丙氧基甲基)三聚氰胺、N’N,N,,N,,N,,,N,,-A( 異丙乳基甲基)三聚氰胺、队队;^,,;^,;^,,,>1,,-六(正丁氧 基曱基)三聚氰胺、N,N,N,,N,,N,,,N,,-六(第三丁氧基甲 基)一聚氰胺等。在這*N_(烷氧基甲基)三聚氰胺化合物 中,較佳係N,N,N,,N’,N,’,N,’-六(甲氧基甲基)三聚氰胺 -62- 201229666 。就市售產品而言,能夠列舉例如NIKALAC N-2702、 NIKALAC MW-30M(以上,Sanwa Chemical公司)等。 就耐熱性提高劑的使用量而言,相對於[A]共聚物 100質量份’較佳為50質量份以下,更佳為3〇質量份以下 。如果耐熱性提高劑的摻合量超過5 〇質量份,則可能導 致敏感度下降,圖案形狀變差。 [熱敏性酸產生劑] 熱敏性酸產生劑被定義為藉由加熱使[A]共聚物硬 化時能夠釋放出起催化劑作用的酸性活性物質的化合物 。藉由使用這種熱敏性酸產生劑,可以在感放射線性組 成物的顯影後的加熱步驟中促進[A]共聚物的硬化反應 ’形成表面硬度及耐熱性優異的硬化膜。 熱敏性酸產生劑包含離子性化合物及非離子性化合 物。就離子性化合物而言’較佳係不含有重金屬及齒素 離子者。就離子性的熱敏性酸產生劑而言,能夠列舉例 如三苯基鏟、1 -二甲基硫萘、1 -二甲基硫-4-羥基萘、丄_ 二曱基硫-4,7-二羥基萘、4-羥基苯基二甲基銕、苄基_4_ 羥基苯基曱基銃、2-曱基苄基-4-羥基苯基甲基鎳、2-曱 基卞基-4 -乙酿基本基甲基疏、2 -曱基节基-4 -苯曱酿基氧 苯基曱基疏、它們的甲烧績酸鹽、三氟甲炫績酸鹽、樟 腦磺酸鹽、對曱苯磺酸鹽、六氟磷酸鹽等。另外,就节 基銃鹽的市售產品而言,能夠列舉例如SI-60、SI-80、 SI-10〇、SI-11〇、SI-145、SI-15〇、SI-80L、SI-1〇〇L、SI-11〇l 、SI-145L、SI-150L、SI-160L、SI-180L(以上,三新化 學工業公司)等。 -63- 201229666 就非離子性的熱敏性酸產生劑而言,能夠列舉例如 含鹵素化合物、重氮曱烧化合物、颯化合物、石黃酸醋化 合物、羧酸酯化合物、磷酸酯化合物、砜醯亞胺化合物 、颯苯并三唾化合物等。 就含鹵素化合物而言,能夠列舉例如含i烷基的烴 化合物、含鹵烷基的雜環狀化合物等。就較佳的含鹵素 化合物而言,能夠列舉1,1-雙(4-氯苯基)-2,2,2-三氣乙烷 、2-苯基-4,6-雙(三氯曱基)-s-三畊、2-萘基-4,6-雙(三氣 甲基)-s-三钟。 就重氮曱烷化合物而言,能夠列舉例如雙(三氟甲基 磺醯基)重氮甲烷、雙(環己基磺醯基)重氮曱烷、雙(苯基 磺醯基)重氮甲烷、雙(對甲苯基磺醯基)重氮曱烷、雙 (2,4-二甲苯磺醯基)重氮曱烷、雙(對氣苯基磺醯基)重氮 甲烷、曱基磺醯基-對曱苯磺醯基重氮甲烷、環己基磺醯 基(1,1-二甲基乙基磺醯基)重氮曱烷、雙(1,1-二甲基乙基 磺醯基)重氮甲烷、苯基磺醯基(苯曱醯基)重氮曱烷等。 就砜化合物而言,能夠列舉例如β-酮砜化合物、β-磺醯基砜化合物、二芳基二颯化合物等。就較佳的砜化 合物而言,能夠列舉4-三苯甲醯甲基砜.、2,4,6-三曱苯基 苯甲醯曱基颯、雙(苯基磺醯基)曱烷、4-氯苯基-4-曱基 苯基二硬化合物。 就確酸S旨化合物而言,能夠列舉例如烧基磺酸@旨、 鹵院基讀酸S旨、芳基續酸醋、亞胺基續酸S旨等。就較佳 的磺酸酯化合物而言,能夠列舉苯偶姻對甲苯磺酸酯、 焦酚三曱磺酸酯、硝基苄基-9,10-二乙氧基蒽-2-磺酸酯 -64 - 201229666 、2,6 -二确基苄基苯續酸酯。作為亞胺基續酸酯的市售 產品’能夠列舉例如PAI-101、ΡΑΙ-1〇6(以上,Midori Kagaku公司)、CGI-1311(Ciba Speciality Chemicals公司) 等。 就羧酸酯化合物而言,能夠列舉例如羧酸鄰硝基节 基酯等。 就碱醯亞胺化合物而言,能夠列舉例如N -(三敗甲基 石買酸氧基)破拍酸亞胺(商品名「SI-105」,Midori Kagaku 公司)、N -(樟腦續醯氧基)玻珀醯亞胺(商品名「s j _丨〇 6」 ,Midori Kagaku公司)、N-(4-曱基苯基磺醯氧基)琥珀醯 亞胺(商品名「SI-101」 ’Midori Kagaku公司)、N-(2 -三 氟甲基苯基確醯氧基)琥珀醯亞胺、N-(4 -氟苯基碌醢氧 基)琥珀醯亞胺、N-(三氟曱基磺醯氧基)鄰苯二曱醯亞胺 、N-(樟腦確酿氧基)鄰苯二曱酿亞胺、n-(2-三氟曱基苯 基磺醯氧基)鄰苯二曱醯亞胺、N-(2-氟苯基磺醯氧基)鄰 苯二曱醯亞胺、N-(三氟曱基磺醯氧基)二苯基馬來醯亞 胺(商品名「PI_ 105」,Midori Kagaku公司)、N-(樟腦石黃 醯氧基)二苯基馬來醯亞胺、4-曱基苯基磺醯氧基)二苯基 馬來醯亞胺、N-(2-三氟甲基苯基磺醯氧基)二苯基馬來 醯亞胺、N-(4-氟苯基續醯氧基)二苯基馬來醯亞胺、(4_ 氟苯基磺醯氧基)二苯基馬來醯亞胺、N_(苯基磺醯氧基) 雙環[2·2·l]庚-5-烯-2,3-二羧基醯亞胺(商品名ΓNDI·100 」,Midori Kagaku公司)、N_(4_甲基苯基磺醯氧基)雙環 [2.2.1]庚-5-烯-2,3-二羧基醯亞胺(商品名「]^〇1-1〇1」,SH29PA, TORAY SILICONE SH30PA, TORAY SILICONE SH-190, TORAY SILICONE SH-193, TORAY SILICONE SZ-6032, TORAY SILICONE SF-8428, TORAY SILICONE DC-57, TORAY SILICONE DC-190 (above, TORAY · DOW CORNING · SILICONE Company), TSF-4440, TSF-4300, TSF-4445, TSF-4446, TSF-4460, TSF-4452 (above, GE Toshiba Silicones), organic alkane polymer KP341 (Shin-Etsu Chemical Industries, Inc.) and the like. Examples of other surfactants include polyoxyethylene lauryl ether such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and polyoxyethylene oleyl ether; and polyoxyethylene-n-octane Polyphenylene oxide aryl ether, polyoxyethylene-n-decylphenyl phthalate, etc.; polyoxyethylene dialkyl ester such as polyoxyethylene dilaurate vinegar, polyoxyethylene distearate, etc. Nonionic surfactant, (meth)acrylic copolymer P〇LYFl〇w No. 57, POLYFLOW No. 95 (above, Kyoeisha Chemical Co., Ltd.) and the like. The amount of the surfactant to be used is preferably 1.0 part by mass or less, more preferably 〇·7 part by mass or less, based on 1 part by mass of the [A] copolymer. If the amount of the surfactant used exceeds 丨.〇 by mass, film unevenness is likely to occur. '[Adhesive Aid] The adhesion aid is used to further improve the adhesion between the obtained pattern and the substrate. The adhesive auxiliary agent is preferably a functional decane coupling agent having a reactive functional group such as a carboxyl group, a methacryloyl group, a vinyl group, an isocyanate group or an oxiranyl group, and examples thereof include trimethoxy group. Formyl benzoic acid, γ-methacryloxypropyltrimethoxy-61 - 201229666 Shi Xi, Ethylene, Ethylene, Ethyl, Ethyl, Ethylene, Ethyl Cyanic acid propyl triethoxy decane, γ-glycidoxypropyltrimethoxy sulphide 'β-(3,4-epoxycyclohexyl)ethyltrimethoxy sulphur and the like. The amount of the adhesion aid to be used is preferably 20 parts by mass or less, and more preferably 15 parts by mass or less based on 1 part by mass of the [Α] copolymer. When the amount of the adhesion aid used exceeds 20 parts by mass, development residue is likely to occur [heat resistance improving agent] Examples of the heat resistance improving agent include *Ν((alkoxymethyl)glycolide compound, N_ (homoyloxymethyl) trimeric amine compound and the like. As the N-(alkoxyindenyl) glycoluril compound, for example, N'N'N, N•tetrakis(methoxymethyl)glycoluril, N, N, N, N, · IV can be cited. Ethoxymethyl)glycoluril, n,n,n',n,_tetra(n-propoxymethyl)glycoluril, Ν'Ν, Ν, N _tetrakis(isopropoxymethyl) glycoluril , N, N, N,, N, _ tetra (n-butoxy: yl) glycoluril, N, N, N, N,. tetra (t-butoxy fluorenyl) gland and the like. In the right! Of the ^(alkoxymethyl)glycoluric compounds, preferably N,N,N,,N,-tetrakis(methoxymethyl)glycolil. As the N-(alkoxymethyl) melamine compound, for example, N'n, N', n', n", n'4(^^&)^u, n, n, N^ can be cited. N'N,N-hexa(ethoxymethyl)melamine, N,N,N,,N,,N,,,N _=(n-propoxymethyl)melamine, N'N,N,, N,,N,,,N,,-A(isopropyllactylmethyl)melamine, team; ^,,;^,;^,,,>1,,-hexa(n-butoxycarbonyl) Melamine, N, N, N, N, N,, N,, -hexa(t-butoxymethyl)-melamine, and the like. Among the *N_(alkoxymethyl)melamine compounds, preferred are N,N,N,,N',N,',N,'-hexa(methoxymethyl)melamine-62-201229666. For the commercially available product, for example, NIKALAC N-2702, NIKALAC MW-30M (above, Sanwa Chemical Co., Ltd.), and the like can be cited. The amount of use of the heat resistance improving agent is preferably 50 parts by mass or less, more preferably 3 parts by mass or less based on 100 parts by mass of the [A] copolymer. If the blending amount of the heat resistance improving agent exceeds 5 Å by mass, the sensitivity may be lowered and the pattern shape may be deteriorated. [Thermal acid generator] The heat-sensitive acid generator is defined as a compound capable of releasing an acidic active material which acts as a catalyst when the [A] copolymer is hardened by heating. By using such a heat-sensitive acid generator, it is possible to promote the hardening reaction of the [A] copolymer in the heating step after development of the radiation-sensitive composition to form a cured film excellent in surface hardness and heat resistance. The heat-sensitive acid generator contains an ionic compound and a nonionic compound. In the case of an ionic compound, it is preferred that it does not contain heavy metals or dentate ions. Examples of the ionic heat-sensitive acid generator include triphenyl shovel, 1-dimethylthionaphthalene, 1-dimethylthio-4-hydroxynaphthalene, and 丄_dimercaptosulfur-4,7-. Dihydroxynaphthalene, 4-hydroxyphenyldimethylhydrazine, benzyl-4-hydroxyphenylhydrazinium, 2-mercaptobenzyl-4-hydroxyphenylmethylnickel, 2-mercaptopurinyl-4 B-based basic methyl sparse, 2-mercapto-based 4-phenylene phenyloxyphenyl sulfhydryl, their methylated acid salt, trifluoromethyl acid salt, camphor sulfonate, Toluene benzene sulfonate, hexafluorophosphate, and the like. In addition, as a commercially available product of a sulfhydryl salt, for example, SI-60, SI-80, SI-10〇, SI-11〇, SI-145, SI-15〇, SI-80L, SI- can be cited. 1〇〇L, SI-11〇l, SI-145L, SI-150L, SI-160L, SI-180L (above, Sanxin Chemical Industry Co., Ltd.). -63-201229666 The nonionic heat-sensitive acid generator may, for example, be a halogen-containing compound, a diazonium-sintering compound, an anthraquinone compound, a rhein vinegar compound, a carboxylate compound, a phosphate compound, or a sulfone sulfonium. An amine compound, a quinone trisalt compound or the like. The halogen-containing compound may, for example, be an alkyl group-containing hydrocarbon compound or a haloalkyl group-containing heterocyclic compound. Preferred examples of the halogen-containing compound include 1,1-bis(4-chlorophenyl)-2,2,2-trisethane and 2-phenyl-4,6-bis(trichloroanthracene). Base)-s-three tillage, 2-naphthyl-4,6-bis(trismethyl)-s-three clocks. Examples of the diazonium compound include bis(trifluoromethylsulfonyl)diazomethane, bis(cyclohexylsulfonyl)diazononane, and bis(phenylsulfonyl)diazomethane. , bis(p-tolylsulfonyl)diazononane, bis(2,4-xylsulfonyl)diazononane, bis(p-phenylsulfonyl)diazomethane,nonylsulfonium Base-p-phenylenesulfonyl diazomethane, cyclohexylsulfonyl (1,1-dimethylethylsulfonyl)diazononane, bis(1,1-dimethylethylsulfonyl) Diazomethane, phenylsulfonyl (phenylhydrazine) diazonium, and the like. The sulfone compound may, for example, be a β-ketosulfone compound, a β-sulfonylsulfone compound or a diaryldifluorene compound. As a preferable sulfone compound, 4-trityl hydrazine methyl sulfone, 2,4,6-triphenyl phenyl fluorenyl hydrazine, bis(phenylsulfonyl) decane, 4-chlorophenyl-4-mercaptophenyl di hard compound. Examples of the acid-reducing compound include, for example, a sulfonic acid sulfonate, a halogen-based acid-reactive acid S, an aryl acid vinegar, and an imido acid S. Preferred sulfonate compounds include benzoin p-toluenesulfonate, pyrogallate trisulphonate, and nitrobenzyl-9,10-diethoxyindole-2-sulfonate. -64 - 201229666, 2,6-di-diylbenzyl benzoate. The commercially available product of the imido lactone can be, for example, PAI-101, ΡΑΙ-1〇6 (above, Midori Kagaku Co., Ltd.), CGI-1311 (Ciba Speciality Chemicals Co., Ltd.), or the like. The carboxylic acid ester compound may, for example, be a carboxylic acid o-nitrophenyl ester or the like. In the case of the alkali quinone imine compound, for example, N-(tri-methyl-methyl-purine acid-oxyl) can be used as a succinic acid imide (trade name "SI-105", Midori Kagaku Co., Ltd.), N-(樟脑醯) Oxygen) boporil imine (trade name "sj _丨〇6", Midori Kagaku), N-(4-mercaptophenylsulfonyloxy) amber imine (trade name "SI-101" 'Midori Kagaku Co., Ltd.), N-(2-trifluoromethylphenyl sulfenyloxy) amber quinone imine, N-(4-fluorophenylphosphoniumoxy) amber quinone imine, N-(trifluoro Mercaptosulfonyloxy) phthalimide, N-(camphoric oxy) phthalic acid imine, n-(2-trifluoromethylphenylsulfonyloxy) ortho-benzene Dimethyleneimine, N-(2-fluorophenylsulfonyloxy) phthalimide, N-(trifluoromethylsulfonyloxy)diphenylmaleimide (trade name) "PI_105", Midori Kagaku Company), N-(camphor sulphate) diphenylmaleimide, 4-nonylphenylsulfonyloxy)diphenylmaleimide, N -(2-trifluoromethylphenylsulfonyloxy)diphenylmaleimide, N-(4-fluorophenyl fluorenyloxy) Phenylmaleimide, (4-fluorophenylsulfonyloxy)diphenylmaleimide, N_(phenylsulfonyloxy)bicyclo[2·2·l]hept-5-ene- 2,3-Dicarboxyindenine (trade name: NDI·100), Midori Kagaku Co., Ltd., N_(4-methylphenylsulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3 -Dicarboxy quinone imine (trade name "]^〇1-1〇1",
Midori Kagaku公司)、N-(三氟曱烷磺醯氧基)雙環[2 21] -65- 201229666 庚-5-烯-2,3-二羧基醯亞胺(商品名「NDI-105」,Midori 1^^@3]<:11公司)、>1-(九氟丁烷磺醯氧基)雙環[2.2.1]庚-5-烯-2,3-二羧基醯亞胺(商品名「NDI-109」,Midori Kagaku 公司)、N-(樟腦磺醯氧基)雙環[2.2.1]庚-5-烯-2,3-二羧基 醯亞胺(商品名「NDI-106」,Midori Kagaku公司)、N-( 樟腦磺醯氧基)-7-氧雜雙環[2.2.1]庚-5-烯-2,3-二羧基醯 亞胺、N-(三氟曱基磺醯氧基)-7-氧雜雙環[2.2.1]庚-5-烯 -2,3-二羧基醯亞胺、N-(4 -曱基苯基磺醯氧基)雙環[2·2.1] 庚-5-烯-2,3-二羧基醯亞胺、Ν-(4-曱基苯基磺醯氧基)-7-氧雜雙環[2.2.1]庚-5-烯-2,3-二羧基醯亞胺、Ν-(2-三氟甲 基苯基磺醯氧基)雙環[2.2.1]庚-5-烯-2,3-二羧基醯亞胺 、Ν-(2-三氟曱基苯基磺醢氧基)-7-氧雜雙環[2.2.1]庚-5-烯-2,3-二羧基醯亞胺、Ν-(4-氟笨基磺醯氧基)雙環[2.2.1] 庚-5-烯-2,3-二羧基醯亞胺、Ν-(4-氟苯基磺醯氧基)-7-氧 雜雙環[2.2.1]庚-5-烯-2,3-二羧基醯亞胺、Ν-(三氟曱基磺 醯氧基)雙環[2·2·1]庚烷-5,6-氧-2,3-二羧基醯亞胺、Ν-( 樟腦磺醯氧基)雙環[2.2.1]庚烷-5,6-氧-2,3-二羧基醯亞 胺、Ν-(4-甲基苯基磺醯氧基)雙環[2.2· 1]庚烷-5,6-氧 _2,3·二羧基醯亞胺、Ν-(2-三氟曱基笨基磺醯氧基)雙環 [2.2.1]庚烷-5,6-氧-2,3-二羧基醯亞胺、Ν-(4-氟苯基磺醯 氧基)雙環[2.2.1]庚烷-5,6-氧-2,3-二羧基醢亞胺、Ν(三 氟曱基磺醯氧基)萘二甲醯亞胺(商品名「ΝΑΙ-105」, Midori Kagaku公司)、Ν-(樟腦磺醯氧基)萘二甲醯亞胺( 商品名「NAI-106」,Midori Kagaku公司)、N-(4 -甲基苯 基磺醯氧基)萘二曱.醯亞胺(商品名「NAI-101」’Midori -66 - 201229666Midori Kagaku Company), N-(trifluorodecanesulfonyloxy)bicyclo[2 21] -65- 201229666 hept-5-ene-2,3-dicarboxy quinone imine (trade name "NDI-105", Midori 1^^@3]<:11 company),>1-(nonafluorobutanesulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyarmine ( Trade name "NDI-109", Midori Kagaku Co., Ltd., N-(camphorsulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyarmine (trade name "NDI-106" "Midori Kagaku Company", N-(camphorsulfonyloxy)-7-oxabicyclo[2.2.1]hept-5-ene-2,3-dicarboxy quinone imine, N-(trifluoromethyl) Sulfomethoxy)-7-oxabicyclo[2.2.1]hept-5-ene-2,3-dicarboxyindolimine, N-(4-nonylphenylsulfonyloxy)bicyclo[2· 2.1] Hept-5-ene-2,3-dicarboxy quinone imine, Ν-(4-mercaptophenylsulfonyloxy)-7-oxabicyclo[2.2.1]hept-5-ene-2 , 3-dicarboxy quinone imine, Ν-(2-trifluoromethylphenylsulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxy quinone imine, Ν-( 2-Trifluorodecylphenylsulfonyloxy)-7-oxabicyclo[2.2.1]hept-5-ene-2,3-dicarboxyarminemine, fluorene-(4-fluorophenylsulfonyl) Oxy) double ring [2.2.1] H--5-ene-2,3-dicarboxy quinone imine, Ν-(4-fluorophenylsulfonyloxy)-7-oxabicyclo[2.2.1]hept-5-ene -2,3-dicarboxy quinone imine, Ν-(trifluoromethylsulfonyloxy)bicyclo[2·2·1]heptane-5,6-oxo-2,3-dicarboxy quinone imine, Ν-( camphorsulfonyloxy)bicyclo[2.2.1]heptane-5,6-oxo-2,3-dicarboxy quinone imine, Ν-(4-methylphenylsulfonyloxy)bicyclo[ 2.2· 1]heptane-5,6-oxo-2,3·dicarboxy quinone imine, Ν-(2-trifluoromethyl phenylsulfonyloxy)bicyclo[2.2.1]heptane-5, 6-oxo-2,3-dicarboxy quinone imine, Ν-(4-fluorophenylsulfonyloxy)bicyclo[2.2.1]heptane-5,6-oxo-2,3-dicarboxy fluorene Amine, hydrazine (trifluoromethylsulfonyloxy) naphthoquinone imine (trade name "ΝΑΙ-105", Midori Kagaku), Ν-(camphorsulfonyloxy)naphthoquinone imine (product "NAI-106", Midori Kagaku Co., Ltd.), N-(4-methylphenylsulfonyloxy)naphthalene dioxime. The trade name "NAI-101"'Midori -66 - 201229666
Kagaku公司)、N-(苯基磺醯氧基)萘二曱醯亞胺(商品名「 NAI-100」,Midori Kagaku公司)、N-(2-三氟甲基苯基磺 醯氧基)萘二曱醯亞胺、N-(4-氟苯基磺醯氧基)萘二曱醯 亞胺、N-(五氟乙基磺醯氧基)萘二曱醯亞胺、N-(七氟丙 基磺醯氧基)萘二甲醯亞胺、N-(九氟丁基磺醢氧基)萘二 甲醯亞胺(商品名「NAI·109」’ Midori Kagaku公司)、 N-(乙基磺醯氧基)萘二甲醯亞胺、N-(丙基磺醯氧基)萘二 甲醯亞胺、N-(丁基磺醯氧基)萘二曱醯亞胺(商品名「 NAI-1004」,Midori Kagaku公司)、N-(戊基磺醯氧基) 萘二曱醯亞胺、N-(己基確醯氧基)萘二甲醯亞胺、N-(庚 基磺醯氧基)萘二甲醯亞胺、N-(辛基磺醯氧基)萘二曱醢 亞胺、N-(壬基確醯氧基)萘二曱醯亞胺等。 就其它的熱敏性酸產生劑而言,能夠列舉例如1 _(4_ 正丁氧基萘-1-基)四氫°塞吩三敗曱烧績酸鹽、1-(4,7 -二丁 氧基-1-萘基)四氫售吩三氟曱烧績酸鹽等四氫嘆吩鹽。 在這些熱敏性酸產生劑中,從[A]共聚物硬化反應的 催化劑作用方面考慮,更佳係苄基-4-羥基苯基甲基锍六 氟磷酸鹽、1·(4,7·二丁氧基-1-萘基)四氫噻吩三氟甲烷磺 酸鹽、Ν-(三氟甲基磺醯氧基)萘二甲醯亞胺。 就熱敏性酸產生劑的使用量而言,相對於[Α]共聚物 100質量份,較佳為0.1質量份〜10質量份,更佳為i質量 份〜5質量份。藉由使熱敏性酸產生劑的使用量於上述範 圍内’可以使感放射線性組成物的敏感度達到最佳化, 形成在保持透明性的同時表面硬度高的硬化膜。 <感放射線性樹脂組成物的配製方法> -67- 201229666 本發明的感放射線性樹脂組成物是藉t 物、[B]醌二疊氮化合物、[C]硬化劑及必要 分進行均勻混合而配製的。該感放射線性樹 較佳係溶解在適當溶劑中在溶液狀下使用。 就在該感放射線性樹脂組成物的配製中 而言’可使用能均勻溶解必需成分及任意成 成分反應的溶劑。就這種溶劑而言,能夠列 為可被用於製造[A]共聚物的溶劑而例示的 溶劑。 在這種溶劑中, 應性、覆膜形成的容 —醉早甲基制1、乙二 乙二醇單正丁基鱗、 基醚、二乙二醇單正 乙一醇早甲基鍵、三 、丙二醇單乙基醚、 基鍵、二丙二醇單甲 醇單正丙基喊、二丙 醚、三丙二醇單乙基 醋酸乙二醇單甲 乙二醇單正丙基_、 一醇單曱基喊、錯酸 单正丙基鍵、醋酸_ 曱基&|、醋酸丙二醇 酸3-曱基-3-曱氧基丁 從各成分的溶解性、與 易性等方面考慮,能夠 醇單乙基醚、乙二醇單 二乙二醇單甲基醚、二 丙基醚、二乙二醇單正 乙二醇單乙基輕、丙二 丙二醇單正丙基醚、丙 基醚、二丙二醇單乙基 二醇單正丁基醚、三丙 峻等(聚)伸烷基二醇單3 基醚、醋酸乙二醇單乙 醋酸乙二醇單正丁基醚 二乙二醇單乙基醚、醋 乙二醇單正丁基醚、醋 單乙基醚、醋酸3 -甲氧 基等醋酸(聚)伸烷基二 ϊ將[A]共聚 時的任意成 月曰組成物, 使用的溶劑 分’不與各 舉與上述作 溶劑相同的 各成分的反 列舉例如乙 正丙基趟、 乙二醇單乙 丁基鱗、三 醇單甲基醚 二醇單正丁 醚、二丙二 二醇單甲基 完基醚類; 基醚、醋酸 、醋酸二乙 酸二乙二醇 酸丙二醇單 基丁基、醋 醇單烷基醚 -68- 201229666 類; 二乙二醇二甲基鱗、二乙二醇曱基乙基醚、二乙二 醇二乙基醚、四氫呋喃等其它醚類; 曱基乙基酮、環己酮、2-摩酮、3-庚酮、雙丙酮醇(4-羥基-4-曱基戊-2-酮)、4-羥基-4-甲基己烷-2-酮等酮類; 丙二醇二醋酸酯、1,3 -亞丁基二醇二醋酸酯、1,6 -己二醇二醋酸酯等二醋酸酯類; 乳酸曱酯、乳酸乙酯等乳酸烷基酯類; 醋酸乙酯、醋酸正丙酯、醋酸異丙酯、醋酸正丁酯 、醋酸異丁酯、甲酸正戊酯、醋酸異戊酯、丙酸正丁酯 、3 -曱基-3-甲氧基丁基丙酸酯、丁酸乙酯、丁酸正丙酯 、丁酸異丙酯、丁酸正丁酯、羥基醋酸乙酯、乙氧基醋 酸乙酯、3 -曱氧基丙酸甲酯、3 -曱氧基丙酸乙酯、3 -乙氧 基丙酸甲酯、3 -乙氧基丙酸乙酯、丙酮酸甲酯、丙酮酸 乙酯、丙酮酸正丙酯、乙醢乙酸甲S旨、乙醯乙酸乙酯、 2-羥基-2-甲基丙酸乙酯、2-羥基-3-曱基丁酸曱酯、2-氧 代丁酸乙酯等其它酯類; 甲苯、二甲苯等芳香族烴類; Ν-甲基吡咯烷酮、Ν,Ν-二曱基曱醯胺、Ν,Ν-二曱基 乙醯胺等醯胺類等。 在這些溶劑中,從溶解性、顏料分散性、塗布性等 方面考慮,較佳係丙二醇單曱基醚、丙二醇單乙基醚、 醋酸乙二醇單曱基醚、醋酸丙二醇單曱基醚、醋酸丙二 醇單乙基醚、醋酸3-曱氧基丁酯、二乙二醇二曱基醚、 二乙二醇甲基乙基醚、環己酮、2 -庚酮、3 -庚酮、1,3- -69- 201229666 亞丁基二醇二醋酸酯、1,6·己二醇二醋酸酯、乳酸乙酯 '3 -甲氧基丙酸乙酯、3_乙氧基丙酸甲酯、3_乙氧基丙酸 乙醋、3 -甲基-3 -甲氧基丁基丙酸酯、醋酸正丁酯、醋酸 異丁酯、甲酸正戊酯、醋酸異戊酯、丙酸正丁酯、丁萨 乙酯、丁酸異丙酯、丁酸正丁酯、丙酮酸乙酯。溶劑可 單獨使用或使用兩種以上。 另外,也可以與上述溶劑一起,同時使用苄基乙基 醚、二正己基醚、丙酮基丙酮、異佛爾酮、己酸、辛酸 、1 -辛醇、1 _壬醇、醋酸苄酯、苯曱酸乙酯、草酸二乙 酉曰、馬來酸二乙酯、γ _己内酯、碳酸亞乙酯、碳酸亞丙 醋、乙二醇單苯基醚醋酸酯等高沸點溶劑。上述高彿點 >谷劑可以單獨使用或使用兩種以上。 就溶劑的含有量而言沒有限制,其中從獲得的感放 射線性樹脂組成物的塗布性、穩定性等方面考慮,較佳 是使該感放射線性樹脂組成物中除溶劑以外的各種成分 的合計濃度為5質量%〜50質量%的量,更佳為使其為丄〇 質量%〜40質量%的量。將該感放射線性樹脂組成物配製 成溶液狀態時’固體含量濃度(組成物溶液中溶劑以外的 成分)可根據使用目的及預期的膜厚值等設定為任意的 濃度(例如5質量%〜50質量%)。更佳的固體含量濃度,根 據在基板上形成覆膜的方法而有所不同,下文對此進行 說明。使用孔徑0 · 5 μιη左右的微孔過濾器等對如此配製的 組成物溶液進行過濾後,可以進行使用。 <硬化膜的形成方法〉 該感放射線性樹脂組成物兼具低溫燒製和儲存穩定 -70- 201229666 性,並且具有高感放射線性,能夠形成適宜用作可撓性 顯示器的作為表面硬度、耐溶劑性及相對介電常數優異 的層間絕緣膜、保護膜或隔離物的硬化膜。 -本發明的硬化膜的形成方法具有: (1) 在基板上形成該感放射線性樹脂組成物的塗膜 的步驟; (2) 對上述塗膜的至少一部分照射放射線的步驟; (3) 使經過上述放射線照射的塗膜顯影的步驟;及 (4) 對經過上述顯影的塗膜進行燒製的步驟。 使用該感放射線性樹脂組成物,藉由上述步驟形成 硬化膜時’由於是藉由利用感放射線性的曝光、顯影來 形成圖案’因而能夠容易地形成微細而精巧的圖案。另 外’使用該感放射線性樹脂組成物形成的硬化膜即使進 行低溫燒製也具有足夠的表面硬度等。以下,對各個步 驟進行詳細說明。 [(1)步驟] 在本步驟中,在基板表面上塗布該感放射線性樹脂 組成物的溶液’較佳係藉由預烘焙而除去溶劑,形成感 放射線性樹脂組成物的塗膜。就能夠使用的基板的種類 而言’能夠列舉例如玻璃基板、矽片、塑膠基板 '及在 匕們的表面上形成各種金屬而得到的基板。作為上述塑 膠基板,能夠列舉由聚對苯二曱酸乙二酯(PET)、聚對苯 二曱酸丁二酯、聚喊碾、聚碳酸酯、聚醢亞胺等塑膠形 成的樹脂基板。 就塗布方法而言,可以採用例如喷塗法、輥塗法、 -71- 201229666 旋轉塗布法(旋塗法)、縫模塗布法、棒塗布法 等適當的方法。在這歧塗布方法巾 ^ , 、一1邛万忐中,較佳係旋塗法、棒 塗布法 '縫模塗布法。預烘培的條件根據各成分的種類 、使用比例等而有所不3,可設定為例如在6代〜9代下 進行30秒〜1G分鐘左右。就形成的塗膜膜厚而言,以預棋 後的值計’較佳為〇·1μηι〜8μιη,更佳為〇〜6㈣特佳 為 0.1 μπι~4μιη 〇 [(2)步驟] 在本步驟中,透過具有規定圖案的光罩對藉由(1)步 驟形成的塗膜照射放射線。就此時使用的放射線而言, 能夠列舉例如紫外線、遠紫外線、从射線、帶電粒 等。 就上述紫外線而言,能夠列舉例如g線(波長436nm) 、!線(波長365nm)等。就遠紫外線而言,能夠列舉例如Kagaku company), N-(phenylsulfonyloxy)naphthalene diimide (trade name "NAI-100", Midori Kagaku), N-(2-trifluoromethylphenylsulfonyloxy) Naphthyl imine, N-(4-fluorophenylsulfonyloxy)naphthalene diimide, N-(pentafluoroethylsulfonyloxy)naphthalene diimide, N-(seven Fluoropropylsulfonyloxy)naphthoquinone imine, N-(nonafluorobutoxysulfonyloxy)naphthoquinone imine (trade name "NAI·109"' Midori Kagaku), N-( Ethylsulfonyloxy)naphthoquinone imine, N-(propylsulfonyloxy)naphthoquinone imine, N-(butylsulfonyloxy)naphthalene diimide (trade name) "NAI-1004", Midori Kagaku Company), N-(pentylsulfonyloxy)naphthalene diimide, N-(hexyl decyloxy)naphthyldimethylimine, N-(heptylsulfonate)醯oxy)naphthyldimethylimine, N-(octylsulfonyloxy)naphthalene diimine, N-(fluorenyloxy)naphthalene diimine, and the like. Examples of other heat-sensitive acid generators include, for example, 1 _(4-n-butoxynaphthalen-1-yl)tetrahydro thiophene triacetate calcined acid salt, 1-(4,7-dibutoxygen). Tetrahydronaphthyl salt, such as 1,4-naphthyl)tetrahydrofuran. Among these heat-sensitive acid generators, from the viewpoint of the catalyst action of the [A] copolymer hardening reaction, it is more preferred to be benzyl-4-hydroxyphenylmethylphosphonium hexafluorophosphate, 1·(4,7·dibutyl) Oxy-1-naphthyl)tetrahydrothiophene trifluoromethanesulfonate, hydrazine-(trifluoromethylsulfonyloxy)naphthoquinone imine. The amount of the heat-sensitive acid generator to be used is preferably 0.1 part by mass to 10 parts by mass, more preferably 1 part by mass to 5 parts by mass, per 100 parts by mass of the [Α] copolymer. By using the amount of the heat-sensitive acid generator in the above range, the sensitivity of the radiation-sensitive composition can be optimized, and a cured film having high surface hardness while maintaining transparency can be formed. <Preparation method of radiation sensitive resin composition> -67- 201229666 The radiation sensitive resin composition of the present invention is uniformly obtained by using a substance, [B] quinonediazide compound, [C] hardener, and necessary components. Mixed and formulated. The radiation sensitive tree is preferably dissolved in a suitable solvent and used in the form of a solution. In the preparation of the radiation sensitive resin composition, a solvent which can uniformly dissolve the essential component and any component can be used. As such a solvent, a solvent exemplified as a solvent which can be used for producing the [A] copolymer can be listed. In this solvent, the formation of the film, the film formed by Rongxie early methyl 1, ethylene diethylene glycol mono-n-butyl scale, ether, diethylene glycol mono-n-ethyl alcohol early methyl bond, three , propylene glycol monoethyl ether, base bond, dipropylene glycol monomethanol mono-n-propyl propyl, dipropyl ether, tripropylene glycol monoethyl acetate ethylene glycol monomethyl glycol mono-n-propyl _, monool mono-hydrazine, Acidic mono-n-propyl bond, acetic acid _ thiol & |, propylene glycolic acid 3-mercapto-3- methoxy butyl can be considered from the solubility and workability of each component, can be alcohol monoethyl ether , ethylene glycol monodiethylene glycol monomethyl ether, dipropyl ether, diethylene glycol mono-ethylene glycol monoethyl light, propylene dipropylene glycol mono-n-propyl ether, propyl ether, dipropylene glycol single B Polyglycol mono-n-butyl ether, tripropylene or the like (poly) alkylene glycol mono-3-yl ether, ethylene glycol monoethyl acetate ethylene glycol mono-n-butyl ether diethylene glycol monoethyl ether, Acetate glycol mono-n-butyl ether, vinegar monoethyl ether, acetic acid 3-methoxy group, etc. Acetate (poly) alkyl diterpene [A] copolymerized into any composition of the composition of the moon, used dissolution The agent 'does not recite the same as each of the above-mentioned solvents, such as ethyl propyl hydrazine, ethylene glycol monobutyl butyl sulphate, triol monomethyl ether diol mono-n-butyl ether, dipropylene Glycol monomethyl complete ethers; base ethers, acetic acid, acetic acid diacetic acid diglycolic acid propylene glycol monobutyl butyl, acetal monoalkyl ether -68-201229666; diethylene glycol dimethyl scales, Other ethers such as diethylene glycol decyl ethyl ether, diethylene glycol diethyl ether, tetrahydrofuran; mercapto ethyl ketone, cyclohexanone, 2-miketone, 3-heptanone, diacetone alcohol (4 Ketones such as -hydroxy-4-mercapto-2-one) and 4-hydroxy-4-methylhexan-2-one; propylene glycol diacetate, 1,3-butylene glycol diacetate, 1 , diacetate such as 6-hexanediol diacetate; alkyl lactate such as decyl lactate or ethyl lactate; ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, acetic acid Butyl ester, n-amyl formate, isoamyl acetate, n-butyl propionate, 3-mercapto-3-methoxybutyl propionate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate Ester, n-butyl butyrate Ethyl hydroxyacetate, ethyl ethoxyacetate, methyl 3-methoxyoxypropionate, ethyl 3-methoxyoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate Ester, methyl pyruvate, ethyl pyruvate, n-propyl pyruvate, ethyl acetate, ethyl acetate, ethyl 2-hydroxy-2-methylpropionate, 2-hydroxy-3- Other esters such as decyl decanoate and ethyl 2-oxobutanoate; aromatic hydrocarbons such as toluene and xylene; Ν-methylpyrrolidone, hydrazine, hydrazine-dimercaptoamine, hydrazine, hydrazine - guanamines such as dimercaptoacetamide. Among these solvents, propylene glycol monodecyl ether, propylene glycol monoethyl ether, ethylene glycol monodecyl ether, propylene glycol monodecyl ether, and the like are preferable from the viewpoints of solubility, pigment dispersibility, and coatability. Propylene glycol monoethyl ether acetate, 3-decyloxybutyl acetate, diethylene glycol didecyl ether, diethylene glycol methyl ethyl ether, cyclohexanone, 2-heptanone, 3-heptanone, 1 , 3- -69- 201229666 Butylene glycol diacetate, 1,6·hexanediol diacetate, ethyl lactate '3-methoxypropionate ethyl ester, 3_ethoxypropionate methyl ester, 3_Ethyl ethoxypropionate, 3-methyl-3-methoxybutylpropionate, n-butyl acetate, isobutyl acetate, n-amyl formate, isoamyl acetate, n-butyl propionate Ester, butyl succinate, isopropyl butyrate, n-butyl butyrate, ethyl pyruvate. The solvent may be used singly or in combination of two or more. Further, together with the above solvent, benzyl ethyl ether, di-n-hexyl ether, acetone acetone, isophorone, hexanoic acid, octanoic acid, 1-octyl alcohol, 1-nonanol, benzyl acetate may be used together. High boiling point solvents such as ethyl benzoate, diethyl oxalate, diethyl maleate, γ-caprolactone, ethylene carbonate, propylene carbonate, and ethylene glycol monophenyl ether acetate. The above-mentioned high-folk point > granules may be used singly or in combination of two or more. The content of the solvent is not limited. From the viewpoint of coatability and stability of the radiation-sensitive resin composition to be obtained, it is preferred to add a total of various components other than the solvent to the radiation-sensitive resin composition. The concentration is from 5% by mass to 50% by mass, more preferably from 丄〇% by mass to 40% by mass. When the radiation-sensitive resin composition is formulated into a solution state, the solid content concentration (component other than the solvent in the composition solution) can be set to an arbitrary concentration depending on the purpose of use and the desired film thickness value (for example, 5% by mass). 50% by mass). A more preferable solid content concentration differs depending on the method of forming a film on the substrate, which will be described below. The thus-prepared composition solution is filtered using a micropore filter having a pore size of about 0.5 μm or the like, and then it can be used. <Method for Forming Cured Film> The radiation-sensitive resin composition has both low-temperature firing and storage stability, and has high-sensitivity radioactivity, and can be formed as a surface hardness suitable for use as a flexible display. An interlayer insulating film, a protective film or a cured film of a separator excellent in solvent resistance and relative dielectric constant. - a method of forming a cured film of the present invention, comprising: (1) a step of forming a coating film of the radiation sensitive resin composition on a substrate; (2) a step of irradiating at least a part of the coating film with radiation; (3) a step of developing a coating film irradiated with the above-described radiation; and (4) a step of firing the coating film subjected to the above development. When the cured resin film is formed by the above-described steps, the pattern is formed by exposure and development by sensitization, and a fine and delicate pattern can be easily formed. Further, the cured film formed using the radiation sensitive resin composition has sufficient surface hardness and the like even when it is fired at a low temperature. Hereinafter, each step will be described in detail. [(1) Step] In this step, the solution of the radiation-sensitive resin composition is applied onto the surface of the substrate. Preferably, the solvent is removed by prebaking to form a coating film of the radiation-sensitive resin composition. The type of the substrate that can be used is, for example, a glass substrate, a tantalum sheet, a plastic substrate, and a substrate obtained by forming various metals on the surfaces of the substrates. Examples of the plastic substrate include a resin substrate formed of a plastic such as polyethylene terephthalate (PET), polybutylene terephthalate, polybutylene, polycarbonate, or polyimide. As the coating method, for example, a suitable method such as a spray coating method, a roll coating method, a -71-201229666 spin coating method (spin coating method), a slit die coating method, or a bar coating method can be employed. Among the above-mentioned coating method towels, it is preferably a spin coating method or a bar coating method. The pre-baking conditions may vary depending on the type of the components, the ratio of use, and the like, and may be set to, for example, from about 6 to about 9 minutes for about 30 seconds to about 1 minute. In terms of the film thickness of the coating film, it is preferably 〇·1μηι 8μιη, more preferably 〇~6 (four), particularly preferably 0.1 μπι~4μιη 〇 [(2) step] in this step. In the middle, the coating film formed by the step (1) is irradiated with radiation through a mask having a predetermined pattern. Examples of the radiation used at this time include ultraviolet rays, far ultraviolet rays, incident rays, charged particles, and the like. The ultraviolet light can be, for example, a g line (wavelength: 436 nm), Line (wavelength 365 nm) and the like. In terms of far ultraviolet rays, for example,
KrF準分子雷射等。就x放射線而言,能夠列舉例如同步 加速器放射線等。就帶電粒子束而言,能夠列舉例如電 子束等。在這些放射線中,較佳係紫外線,特佳係紫外 線中含有g線和/或i線的放射線。曝光量較佳為3〇J/m2〜 l,50〇J/m2。 [(3)步驟] 在本步驟,對藉由(2)步驟照射了放射線的塗膜進行 顯影,除被放射線照射的部分,能夠形成預期的圖案。 作為顯影處理中使用的顯影液,可以使用例如氫氧化鈉 、氫氧化鉀、碳酸鈉、矽酸鈉、偏矽酸鈉、氨水、乙基 月女、正丙基胺、二乙胺、二乙基胺基乙醇、二正丙基胺 -72- 201229666 、二乙基胺、曱基二乙基胺、二曱基乙醇胺、三乙醇胺 、四甲基氫氧化銨、四乙基氫氧化銨、吡咯、哌σ定、丨8_ 二氮雜雙環[5,4,0]-7-十一烯、ι,5-二氮雜雙環[4,3,〇卜5_ 壬烷等鹼(鹼性化合物)的水溶液。另外,也可以使用在 上述驗的水溶液中加入適量甲醇、乙醇等水溶性有機容 劑 '界面活性劑後形成的水溶液、或含有少量能夠溶解 感放射線性樹脂組成物的各種有機溶劑的鹼水溶液作為 顯影液。另外,就顯影方法而言,可以利用例如盛液法( 旋覆浸沒法)、浸泡法、搖動浸潰法、喷啉法等適當方法 。就顯影時間而言,根據感放射線性樹脂組成物的組成 而有所不同,例如可設定為3 〇秒〜1 2 〇秒。 在該顯影步驟後,藉由流水洗滌對圖案化的塗膜進 订漂洗處理,接著,較佳係利用高壓水銀燈等進行全面 地放射線照射(後曝光),從而進行塗膜中殘留的[b]醌二 疊氮化合物的分解處理。 [(4)步驟] 在本步驟中,使用對經過(3)步驟顯影的塗膜進行燒 製的加熱板、烘箱等加熱裝置’對該塗膜進行加熱、: 製處理(後供培處理)’從而進行塗膜的硬化。上述後: 先中的曝光量較佳為2,0〇〇J/m2〜5,〇〇〇J/m2左右。另外, 本步驟中的燒製溫度較佳為扇。。除了利用感放射 線性形成微細圖案的能力外,由於可以在如這樣在低溫 :進行燒製,因而該形成方法適宜被用於在可撓性顯示 n :塑膠基板上形成層間絕緣膜等硬化膜。就燒製溫度 更佳為120(:〜180(:,特佳為12〇。(:〜15〇。(:。燒製時 -73- 201229666 間根據加熱設備的種類而有 , &上 斤+问’例如在加埶板上违 行加熱處理時設定為5分〜4〇分, ‘”、 蛑#宁& 1 Λ、 Ο 在上、相中進行加熱處理 寺》又疋為30为〜80分,特佳在加埶 3 0^4^ tv 如、 “,、扳上進仃加熱處理時為 3〇刀釦以内,在烘箱令進 ^ as - ^ …恩理時為60分鐘以内。 知:…这種方式’就可以在基板 έδ μ # & 敉的表面上形成與目標層間 絕緣膜#硬化膜對應的圖案狀塗膜。 <液晶顯示元件的陣列基板的形成方法〉 液晶顯示元件是藉由在貼合彩色滤光器和陣列基板 形成的液曰曰早凡令封入液晶而形成的。本發明的液晶 的陣列基板具備本發明的硬化膜、積層於該硬 骐上且由液晶配向劑形成的配向膜。 [步驟⑺] 本發明的陣列基板的形成方法具有上述該硬化膜形 曰方法的步驟⑴〜(4)、及(5)在經過燒製的塗膜上塗布液 。配向劑’並藉由在2〇〇。以下加熱而形成配向膜的步驟 :如果採用該陣列基板的形成方法,則能夠形成具備液 9曰配向用配向膜的陣列基板。 上述液晶配向劑較佳為含有具有光配向性基團的感 =射線性聚合物(以下,也稱為「感放射線性聚合物」) 7液晶配向劑、或含有不具光配向性基團的聚醯亞胺( 乂下,也稱為「聚醯亞胺」)的液晶配向劑。 就上述液晶配向劑的塗布方法而言,可以採用例如 嘴塗法、輥塗法、旋轉塗布法(旋塗法)、狹縫塗布法(縫 楔塗布法)、棒塗布法、喷墨法等適當的方法。在這些方 各中’較佳係旋塗法或狹縫塗布法。另外,塗布液晶配 -74- 201229666 向劑後’#由對塗布面加熱,能夠形成配向膜。 日日配向劑均可以在低溫(例如2〇〇<t以下)的加熱溫 成配向膜。另外,上述液晶配向齊|j,也可以在不 發明效果的情況下含有例如硬化劑、硬化催化劑 促進劑、m氧化合物、官能性矽烷化合物、界面 、光敏化劑等作為任咅忐八 々1 W成刀。以下,對感放射線 物及聚醯亞胺進行詳細說明。 <感放射線性聚合物> 感放射線ϋ聚合物具有的光配向性基團是藉 射可:予膜U各向同性的官能團’藉由光異構化 光二里化反應賦予膜久 ^ t 丁膜各向異性。就光配向性基團 能夠列舉源自於由 、由例如包含偶氮苯、二苯乙烯、 基-β-酮酯、螺哌 m 螺圬啩、桂皮酸、查耳酮、 基°比咬、亞苄基竿 M ^ 甲内醯胺、香豆素、二苯基乙 的群紕選出的至小 ^ 一種化合物的結構上具有的基 光配向性基團而令 ^ ^ m S ’較佳係源自於桂皮酸的結構 的基團。 a 就感放射線性取人 基團鍵結了光配向: S ’較佳係直接或藉 ^ ^ ^ - D丨生基團的聚合物。就這種感放 聚合物而S ,能权 .L μ ^ ^ 句列舉例如聚醯胺酸、聚醯亞胺 物上鍵結先配向 ^ e 玍基團而形成的聚合物等。另外 放射線性聚合物& & 而言,能夠列舉具有聚醯胺酸' 胺及其它聚合物, 並且該其它聚合物具有光配向 的聚合物。就政a贫 4 e ”匕聚合物的基本骨架而言,能夠 如聚(甲基)内说祕 賴、聚(甲基)丙稀醯胺、聚乙烯 上述液 度下形 損害本 、硬化 活性劑 性聚合 由光照 反應或 而言 , α-亞胺 苯乙烯 炔及蒽 團。就 上具有 由連接 射線性 等聚合 ,就感 聚醯亞 性基團 列舉例 基喊、 -75- 201229666 聚烯烴、聚有機矽氧烷等β 就感放射線性聚合物而言,較佳係以聚醯胺酸、聚 酿亞胺、聚有機矽氧烷作為基本骨架的聚合物,更佳係 聚有機石夕氧烷。感放射線性聚合物可以藉由例如國際公 開W02009/0253 86號中記載的方法進行合成。 <聚醯亞胺> 不具有光配向性基團的聚醯亞胺可以由不具有光配 向性基團的聚醯胺酸脫水閉環進行醯亞胺化來合成。上 述聚酿胺酸可以按照例如日本特開20 10-97 188號公報中 6己載的方法,使四羧酸二酐和二胺進行反應來合成。 聚酿亞胺可以是作為前驅物的聚醯胺酸具有的醯胺 酸結構全部脫水閉環形成的完全醯亞胺化物,也可以是 酿胺酸結構的僅一部分脫水閉環形成的同時存在醢胺酸 結構和酿亞胺環結構的部分醯亞胺化物。就聚醯亞胺的 醯亞胺化率而言,較佳為30%以上,更佳為50%以上990/〇 ’特佳為65%以上99%以下。醯亞胺化率表示相對於 2醯亞胺的醯胺酸結構的數量和醯亞胺環結構的數量的 α什,醯亞胺環結構的數量所占的比例用百分率表示者 本發明亦適合包含具備由液晶配向用配向膜形成的 膜的彩色據光器。該彩色濾光器的耐熱性、耐溶劑 :::電壓保持率等優異。就形成這種彩色濾光器使用的 2向膜的液晶配向劑而言,較佳係含有感放射線性聚合 [實施例] -76- 201229666 以下,基於實施例對本發明進行詳細説明,但本發 明並不能被解釋為局限於該實施例。 < [A]共聚物的合成〉 [合成例1 ] 在裝備了冷凝管及攪拌器的燒瓶十,加入7質量份 2,2’-偶氮雙(2,4-二甲基戊腈)及22.0質量份二乙二醇甲基 乙基醚。接著,加入16質量份作為(A1)化合物的曱基丙 烯酸、40質量份作為(A2)化合物的曱基丙烯酸縮水甘油 酯、1 0質量份作為(A4)化合物的苯乙烯、1 4質量份甲基 丙烯酸三環[5.2.1.〇2’6]癸-8-酯、20質量份2-曱基環己基 丙稀酸醋,進行氮氣置換,一邊緩慢攪拌,一邊將溶液 的溫度升高到7 0 °C,在該溫度下保持4小時進行聚合,從 而得到含有共聚物(A_丨)的溶液。得到的聚合物溶液的固 體含量濃度為34.4%,共聚物(八-1)的]^\¥為8,〇〇〇’分子量 分佈(Mw/Mn)為 2.3。 [合成例2] 在裝備了冷凝管及攪拌器的燒瓶中,加入8質量份 2,2’-偶氮雙(2,4-二甲基戊腈)及220質量份二乙二醇甲基 乙基驗。接著,加入1 3質量份作為(A 1)化合物的甲基丙 稀酸、40質量份作為(A2)化合物的曱基丙烯酸縮水甘油 S日貝里份作為(A3)化合物的a -甲基-對經基笨乙稀、 10質里份作為(A4)化合物的苯乙烯、12質量份四氫糠基 甲基丙稀酸酿、1 5質量份N-環己基馬來醯亞胺及1 〇質量 伤正月桂基甲基丙烯酸酯,進行氮氣置換後,一邊缓慢 攪拌’一邊將溶液的溫度升高到70。(:,在該溫度下保持5 •77- 201229666 小時進行聚合,從而得到含有共聚物(A_2)的溶液。得到 的聚合物溶液的固體含量濃度為31.9%,共聚物(A_2)的 M w為8,0 0 0,为子量分佈(μ w / Μ η)為2.3。 [比較合成例1 ] 在裝備了冷凝管及攪拌器的燒瓶中,加入5質量份 ΑΙΒΝ及220質量份丙二醇單曱基醚醋酸醋。接著加入8〇 質量份甲基丙稀酸稀丙酿、20質量份作為(Α1)化合物的 甲基丙烯酸’ -邊緩慢攪拌,一邊將溶液的溫度升高到 80°C,在該溫度下保持5小時進行聚合,從而得到含有共 聚物(CA-1)的溶液。得到的聚合物溶液的固體含量濃度 為3 1.0% ’共聚物(CA-1)的河评為1〇,〇〇〇,分子量分佈 (Mw/Mn)為 2.3 〇 <感放射線性樹脂組成物的配製> [實施例1] \叫瓶言1:)的重的含 共聚物(A-1)的溶液、30質量份作為破一 # e F馬LB]醌一疊氮化合物 的(B-1)、及0.5質量份(c-l),再禾‘ 1 * )丹添加作為溶劑的二乙二 醇甲基乙基醚使固體含量濃度為3 ~ J u貝量%,然後用孔徑 0.2 μπι的膜過濾器進行過濾,從而 /此灰成感放射線性樹脂 組成物。 [實施例2〜1 3及比較例1〜2] 合表1所示種類、配合量的久絲Λ、、 刃各種成分,添加作為溶 混 —比从’刀,艰加作為 劑的二乙二醇曱基乙基醚使固體合县 歷s $濃度為30質量%, 然後,用孔徑0.2μηι的膜過濾器進杆 咚仃過濾,從而配製各感 放射線性樹脂組成物。還有,棚φ + 的_」表示不使用該 -78- 201229666 成分。 表1所示的感放射線性樹脂組成 各種成分的詳細情況如以下所示。 < [B]醌二疊氮化合物〉 :—羥基笨基 基]雙盼(1.0莫耳)和1,2_萘職二疊氮4 耳)的縮合物 Β-2: 1,1,1-三(對羥基苯基)乙烷和] -5-磺醯氯(2.0莫耳)的縮合物 < [C]硬化劑> C-1 :三辛胺 C - 2 . 2 ·本基聯σ米〇坐 C-3:氯化四甲基敍 C-4. 丁基三苯基鱗硫氰酸鹽 C-5: 1,8-二氮雜雙環[5,4,0]-十一烯 鹽 C-6 : Ν,Ν’-二乙醯基-對苯二胺 C-7 : Ν,Ν-雙(1,3-二甲基丁叉基)二甲 C-8 : ΤΡΑ-Β80Ε(旭化成 Chemicals 公 氰酸酯,固體含量80%,有效異氰酸 C-9 : 4,4’-二胺基二苯基石風 C-10 : 3-胺基苯磺酸乙酯 C-1 1 : 5-硝基鄰苯二甲酸和2-苯基-4- 唑按2:1混合形成的籠合化合物 c-1 :辛基胺 物的配製中使用的 f基乙基]笨基]乙叉 匕物-5-磺醯氯(2.〇莫 丨,2 -禮酿一疊氮化物 -7(DBU)的甲苯續酸 苯二胺 司,H DI類封端型異 酯含量12.3°/〇) 甲基· 5 -羥基曱基咪 -79- 201229666KrF excimer laser and so on. Examples of the x-ray radiation include a synchrotron radiation and the like. The charged particle beam can be, for example, an electron beam or the like. Among these radiations, ultraviolet rays are preferred, and ultraviolet rays of the g-line and/or i-line are particularly preferred in the ultraviolet rays. The exposure amount is preferably 3 〇 J/m 2 〜 l, 50 〇 J/m 2 . [(3) Step] In this step, the coating film irradiated with radiation by the step (2) is developed, and a portion irradiated with the radiation is irradiated to form a desired pattern. As the developer used in the development treatment, for example, sodium hydroxide, potassium hydroxide, sodium carbonate, sodium citrate, sodium metasilicate, aqueous ammonia, ethyl virgin, n-propylamine, diethylamine, and diethyl ether can be used. Aminoethanol, di-n-propylamine-72- 201229666, diethylamine, decyldiethylamine, dimethylethanolamine, triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, pyrrole , oxetidine, 丨8_diazabicyclo[5,4,0]-7-undecene, iota, 5-diazabicyclo[4,3, indole-5-decane, etc. (basic compound) Aqueous solution. Further, an aqueous solution formed by adding an appropriate amount of a water-soluble organic solvent such as methanol or ethanol to the surfactant, or an aqueous alkali solution containing a small amount of various organic solvents capable of dissolving the radiation-sensitive resin composition may be used as the aqueous solution. Developer solution. Further, as the developing method, an appropriate method such as a liquid-filling method (spin-on immersion method), a immersion method, a shaking impregnation method, or a spray method can be used. The development time varies depending on the composition of the radiation sensitive resin composition, and can be set, for example, to 3 sec to 1 2 sec. After the development step, the patterned coating film is subjected to a finishing rinsing treatment by running water washing, and then, it is preferable to perform total radiation irradiation (post exposure) using a high-pressure mercury lamp or the like to carry out residual film [b]. Decomposition treatment of quinonediazide compound. [(4) Step] In this step, the coating film is heated by a heating device such as a heating plate or an oven which is fired by the coating film developed in the step (3), and is subjected to a treatment (post-culture treatment). 'There is thus hardening of the coating film. After the above: The exposure amount in the first is preferably 2,0 〇〇J/m2 to 5, and 〇〇〇J/m2 or so. Further, the firing temperature in this step is preferably a fan. . In addition to the ability to form a fine pattern by radiation, the firing method can be suitably used at a low temperature to form a cured film such as an interlayer insulating film on a flexible display n: a plastic substrate. The firing temperature is preferably 120 (: ~ 180 (:, especially good for 12 〇. (: ~ 15 〇. (:. -73-201229666 during firing according to the type of heating equipment, & + Ask 'For example, when the heat treatment is applied to the twisting plate, set it to 5 minutes to 4 minutes, '", 蛑#宁& 1 Λ, Ο Heat the temple in the upper and middle phases, and then change to 30 ~80 points, especially good in the crowning 3 0^4^ tv such as, ",, the upper 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 , , , ^ ^ ^ ^ ^ ^ It is known that: [This method can form a pattern-like coating film corresponding to the target interlayer insulating film # cured film on the surface of the substrate έδ μ # & 。. <Formation method of array substrate of liquid crystal display element> Liquid crystal The display element is formed by sealing a liquid crystal formed by bonding a color filter and an array substrate, and the liquid crystal array substrate of the present invention comprises the cured film of the present invention and laminated on the hard An alignment film formed of a liquid crystal alignment agent. [Step (7)] The method for forming an array substrate of the present invention has the above Steps (1) to (4), and (5) of the method for forming a cured film, the coating liquid is applied to the fired coating film, and the alignment agent is formed by heating at a temperature of 2 Å or less: if In the method of forming the array substrate, the array substrate including the alignment film for the liquid iridium alignment can be formed. The liquid crystal alignment agent preferably contains a radiation-sensitive polymer having a photo-alignment group (hereinafter, also referred to as " Radiation-sensitive linear polymer") a liquid crystal alignment agent or a liquid crystal alignment agent containing a polyimine (not known as "polyimine") having no photo-alignment group. As the coating method, for example, a suitable method such as a nozzle coating method, a roll coating method, a spin coating method (spin coating method), a slit coating method (slit coating method), a bar coating method, or an inkjet method can be employed. In each case, the coating is preferably a spin coating method or a slit coating method. Further, after coating the liquid crystal with -74-201229666, the coating surface is heated to form an alignment film. The daily alignment agent can be used at a low temperature ( For example, 2 〇〇 < t or less) heating temperature In addition, the liquid crystal alignment may contain, for example, a curing agent, a curing catalyst promoter, an m-oxygen compound, a functional decane compound, an interface, a photosensitizer, etc. as a task. Eight 々 1 W is formed into a knife. Hereinafter, the radiation sensitive substance and the polyimine will be described in detail. <Sense Radiation Polymer> The photo-alignment group of the radiation-sensitive ruthenium polymer can be borrowed from the film: The U isotropic functional group' imparts anisotropy to the film by photoisomerization, and the photo-alignment group can be exemplified by, for example, containing azobenzene or diphenyl. Ethylene, keto-β-ketoester, spirulina m-spiroquinone, cinnamic acid, chalcone, basal bite, benzylidene 竿M ^ indanamide, coumarin, diphenyl group The selected photo-alignment group having a structure of at least one compound is such that ^^ m S ' is preferably derived from a group of the structure of cinnamic acid. a The radioactive alignment of the sensory group is bonded to the optical alignment: S ' is preferably a polymer which directly or by the ^ ^ ^ - D is a group. In the case of such a sensory polymer, S, the energy L L ^ ^ sentence exemplifies, for example, a polymer formed by bonding a poly(ortho) acid or a polyfluorene imide to a ^ e fluorene group. Further, as the radiation linear polymer &&&>, a polymer having a poly-proline acid 'amine and other polymers, and the other polymer having a photoalignment can be cited. In terms of the basic skeleton of the 贫 4 4 e 匕 polymer, it can be as described in the poly(methyl), the poly(methyl) acrylamide, the polyethylene, the above-mentioned liquidity, the hardening activity, and the hardening activity. The agent polymerization is carried out by light reaction or, in terms of α-imine styrene acetylene and oxime group. It is polymerized by tyrosine or the like, and is exemplified by a group of stimulating subgroups, -75- 201229666 polyolefin For the β-sensitive radioactive polymer such as polyorganosiloxane, it is preferably a polymer having a poly-proline, a poly-imine, or a polyorganosiloxane as a basic skeleton, and more preferably a polyorganism. The siloxane may be synthesized by a method as described in, for example, International Publication No. WO2009/0253 86. <Polyimine> Polyimine having no photo-alignment group may not have The polyamino acid dehydration ring closure of the photo-alignment group is synthesized by ruthenium imidization. The above-mentioned poly-branched acid can be made into a tetracarboxylic acid according to, for example, the method described in JP-A No. 20 10-97 188. The anhydride and the diamine are reacted to synthesize. The proguanilic acid as a precursor has a complete ruthenium imide formed by dehydration ring closure of the proline structure, and may also be a part of the structure of the tyrosine acid which is formed by dehydration and ring closure, and has a proline structure and a diamine ring. The quinone imide of the structure is preferably 30% or more, more preferably 50% or more, and 990/〇' is particularly preferably 65% or more and 99% or less. The imidization ratio indicates the amount of the proline structure relative to the amount of the quinone imine and the number of the quinone imine ring structure. The ratio of the number of the quinone imine ring structure is expressed by a percentage. The present invention is also suitable for inclusion. A color light ray having a film formed of an alignment film for liquid crystal alignment. The color filter is excellent in heat resistance, solvent resistance, voltage holding ratio, etc., and forms a two-dimensional film for use in such a color filter. The liquid crystal alignment agent preferably contains a radiation-sensitive polymerization [Example] -76 - 201229666 Hereinafter, the present invention will be described in detail based on examples, but the present invention is not construed as being limited to the embodiment. A] Synthesis of Copolymers > [Synthesis 1 ] In a flask equipped with a condenser and a stirrer, 7 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 22.0 parts by mass of diethylene glycol methyl ethyl ether were added. Then, 16 parts by mass of methacrylic acid as the compound (A1), 40 parts by mass of glycidyl methacrylate as the compound (A2), 10 parts by mass of styrene as the compound (A4), and 14 parts by mass are added. Tricyclo[meth] methacrylate [5.2.1.〇2'6]癸-8-ester, 20 parts by mass of 2-mercaptocyclohexyl acrylate vinegar, nitrogen substitution, while stirring slowly, the temperature of the solution is raised The polymerization was carried out at 70 ° C for 4 hours at this temperature to obtain a solution containing the copolymer (A_丨). The obtained polymer solution had a solid content concentration of 34.4%, a copolymer (eight-1) of ??\¥ of 8, and a 〇〇〇' molecular weight distribution (Mw/Mn) of 2.3. [Synthesis Example 2] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 220 parts by mass of diethylene glycol methyl group were added. Ethyl test. Next, 13 parts by mass of methyl methic acid as the (A 1) compound, and 40 parts by mass of glycidyl thioglycolate S, which is a compound of (A2), are added as a-methyl group of the (A3) compound. Styrene, 12 parts by mass of styrene as a compound of (A4), 12 parts by mass of tetrahydrofurfurylmethyl acrylate, 15 parts by mass of N-cyclohexylmaleimide and 1 〇 The mass was killed by lauryl methacrylate, and after nitrogen substitution, the temperature of the solution was raised to 70 while stirring slowly. (:, at this temperature, 5:77 - 201229666 hours, polymerization was carried out to obtain a solution containing the copolymer (A_2). The obtained polymer solution had a solid content concentration of 31.9%, and the Mw of the copolymer (A_2) was 8,0 0 0, the sub-quantity distribution (μ w / η η) was 2.3. [Comparative Synthesis Example 1] In a flask equipped with a condenser and a stirrer, 5 parts by mass of hydrazine and 220 parts by mass of propylene glycol monoterpene were added. Acetate vinegar, followed by adding 8 parts by mass of methyl methacrylate dilute broth, 20 parts by mass of methacrylic acid as (Α1) compound, while slowly stirring, raising the temperature of the solution to 80 ° C, The polymerization was carried out at this temperature for 5 hours to obtain a solution containing the copolymer (CA-1). The obtained polymer solution had a solid content concentration of 3 1.0%. The copolymer (CA-1) of the river was rated as 1〇. , 〇〇〇, molecular weight distribution (Mw / Mn) is 2.3 〇 <Preparation of radiation sensitive resin composition > [Example 1] Heavy polymer-containing copolymer (A-1) The solution, 30 parts by mass of (B-1), and 0.5 parts by mass (cl) of the azide compound Dihe '1*) Dan is added as a solvent of diethylene glycol methyl ethyl ether to a solid content concentration of 3 ~ J u by volume, and then filtered with a membrane filter having a pore size of 0.2 μm, thereby ashing A radiation sensitive resin composition. [Examples 2 to 13 and Comparative Examples 1 to 2] The various types and amounts of the long-term wire and the various components of the blade shown in Table 1 were added as the solvent-mixing ratio from the 'knife, and the hardener was used as the agent. The diol thiol ethyl ether was used to make a solid concentration of s$ 30% by mass, and then filtered through a membrane filter having a pore size of 0.2 μm to prepare respective radiation-sensitive resin compositions. Also, the _" of the shed φ + indicates that the -78-201229666 component is not used. The radiation-sensitive resin composition shown in Table 1 The details of the various components are shown below. <[B] quinone diazide compound: :-hydroxyl stylyl] bis (1.0 mol) and 1,2-naphthyl diazide 4 condensate Β-2: 1,1,1 a condensate of tris(p-hydroxyphenyl)ethane and]-5-sulfonyl chloride (2.0 mol) <[C] hardener> C-1 : trioctylamine C - 2 . σ 〇米〇 sit C-3: tetramethyl chloride C-4. butyl triphenyl thiocyanate C-5: 1,8-diazabicyclo[5,4,0]-ten Monoethyl salt C-6 : Ν, Ν'-diethyl fluorenyl-p-phenylenediamine C-7 : Ν, Ν-bis(1,3-dimethylbutylidene) dimethyl C-8 : ΤΡΑ- Β80Ε (Asahi Kasei Chemicals cyanate, solid content 80%, effective isocyanic acid C-9: 4,4'-diaminodiphenyl stone C-10: ethyl 3-aminobenzenesulfonate C-1 1 : Cage compound c-1 formed by mixing 2:1 nitrophthalic acid and 2-phenyl-4-oxazole: f-ethyl group] used in the preparation of octylamine Ethyl bromide-5-sulfonyl chloride (2. 〇 Mo丨, 2 - Litchi azide-7 (DBU) toluene benzoic acid phenyl diamine, H DI type blocked isoester content 12.3 ° /〇) Methyl·5-hydroxyindolyl-79- 201229666
201229666 <評價> 對於配製的感放射線性樹脂組成物及後述形成的硬 化物,進行下述評價《結果—起列於表丨中。 [儲存穩定性] 將得到的感放射線性樹脂組成物在4〇<t的烘箱中放 置1週,測定加熱前後的黏度,求出黏度變化率。此 時’將黏度變化率作為儲存穩定性,纟為5%以下時判定 為儲存穩定性良好’超過5%時判定為儲存穩錢不良。 黏度是使用E型黏度計(VISC0NIC ELD R,東機產業公司 )在25°C下進行測定。 [敏感度] 使用旋塗機在矽基板上塗布作為實施例及比較例配 製的所有感放射線性樹脂組成物,然後在加熱板上於 9〇t預烘焙2分鐘’形成膜厚3 〇,的塗㈣。在得到的塗 膜上,透過具有寬ΙΟμπι的線空比圖案的光罩,用水銀 照射規^量的紫外線。’然後使用由四甲基氫氧化錢^ 質量%水溶液組成的顯影液,在25它下進行6〇秒顯影處8 ,然後用超純水進行丨分鐘的流水洗滌。此時,測定萨理 形成寬1〇μΐη的線空比圖案的最小紫外線照射i。該:夠 足850J/m2時,判定為敏感度良好。 不 [耐溶劑性] 使用旋塗機在矽基板上塗布作為實施例及比較例 製的所有感放射線性樹脂組成物,然後在加熱板上配 90°C預烘焙2分鐘,形成膜厚3 〇μιη的塗膜。在得到的2 膜上,用水銀燈按照累積照射量達到3,〇〇〇J/m2的阳龛 里狀射 -81- 201229666 紫外線。然後, 對於該矽基板’就實施例i201229666 <Evaluation> The following evaluations were carried out on the prepared radiation sensitive resin composition and the carbide formed later, and the results are shown in Table 。. [Storage stability] The obtained radiation sensitive resin composition was placed in an oven at 4 Torr for 1 week, and the viscosity before and after heating was measured to determine the viscosity change rate. At this time, the viscosity change rate was taken as the storage stability, and when the 纟 was 5% or less, it was judged that the storage stability was good. When it exceeded 5%, it was judged that the storage stability was poor. The viscosity was measured at 25 ° C using an E-type viscometer (VISC0NIC ELD R, Toki Sangyo Co., Ltd.). [Sensitivity] All of the radiation-sensitive resin compositions prepared as the examples and the comparative examples were coated on a ruthenium substrate using a spin coater, and then prebaked on a hot plate at 9 〇t for 2 minutes to form a film thickness of 3 Å. Tu (four). On the obtained coating film, a predetermined amount of ultraviolet rays was irradiated with mercury through a mask having a line-to-space ratio pattern of a width of ΙΟμπι. Then, a developing solution consisting of tetramethylammonium hydroxide (% by mass) aqueous solution was used, and under 6 seconds, it was subjected to development at 8 seconds, and then washed with ultrapure water for 丨 minute water washing. At this time, the minimum ultraviolet ray irradiation i of the line-to-space ratio pattern in which Sauli was formed to have a width of 1 〇 μΐη was measured. When the amount is 850 J/m2, the sensitivity is judged to be good. No [solvent resistance] All of the radiation sensitive resin compositions prepared in the examples and comparative examples were coated on a tantalum substrate by a spin coater, and then prebaked on a hot plate at 90 ° C for 2 minutes to form a film thickness of 3 〇. The coating of μιη. On the obtained 2 membranes, the mercury-based lamp was used to achieve a cumulative exposure of 3, and the 〇〇〇J/m2 of the impotence was shot at -81-201229666. Then, for the germanium substrate', the example i
膜厚(ti),由下式計算膜厚變化率, 然後測定該硬化膜的 將其作為财溶劑性。 膜厚變化率={(tl-Tl)/Tl}xl〇〇(%)該值的絕對值不足5%時,判定為耐溶劑性優良The film thickness (ti) was calculated from the following formula, and the cured film was measured for its solvent property. Film thickness change rate = {(tl - Tl) / Tl} xl 〇〇 (%) When the absolute value of the value is less than 5%, it is judged that the solvent resistance is excellent
膜的感放射線性樹脂組成物具有充足的硬化性。 [相對介電常數] 使用旋塗機在SUS基板上塗布作為實施例及比較例 配製的所有感放射線性樹脂組成物,然後在加熱板上於 90 C預烘焙2分鐘,形成膜厚3 〇μπι的塗膜。使用can〇n 公司的MPA-600FA曝光機,按累積照射量達到9,〇〇〇J/m2 的量使得到的塗膜曝光,將該基板在無塵烘箱内於! 5〇t: 下加熱30分鐘,從而在SUS基板上形成硬化膜。利用蒸 鍍法在該硬化膜上形成Pt/Pd電極圖案,製成介電常數測 定用試樣。對於具有該電極圖案的基板,使用橫河.The radiation sensitive linear resin composition of the film has sufficient hardenability. [Relative dielectric constant] All the radiation-sensitive resin compositions prepared as the examples and the comparative examples were coated on a SUS substrate by a spin coater, and then prebaked on a hot plate at 90 C for 2 minutes to form a film thickness of 3 〇μπι. Coating film. Using the MPA-600FA exposure machine of Can〇n Company, the cumulative exposure amount reached 9, 〇〇〇J/m2, and the obtained coating film was exposed, and the substrate was placed in a dust-free oven! 5 〇 t: Heating was performed for 30 minutes to form a cured film on the SUS substrate. A Pt/Pd electrode pattern was formed on the cured film by a vapor deposition method to prepare a sample for dielectric constant measurement. For the substrate with the electrode pattern, use Yokogawa.
Hewlett-Packard 公司的 HP1 645 1B 電極及 HP4284A 精密 LCR測試儀(Precision LCR meter),在 l〇kHz頻率下藉由 201229666 cv法測定相對介電常數。該值為39以下時,判定為介電 常數良好。 由表1的結果可知,本發明的感放射線性樹脂組成物 具有高放射線敏感度,藉由低溫和短時間的加熱就可以 得到具有高表面硬度的硬化膜’同時該硬化膜兼具優異 的耐溶劑性及相對介電常數。 ' [產業上之可利用性] 根據本發明的感放射線性樹脂細&仏 曰、,且成物,可以提供兼 具低溫燒製和儲存穩定性,並且且古古, 震 ,、虿同感放射線,w 放射線性樹脂組成物、及適宜用於玎短k 、、’的感 ' 視性顯示你* 表面硬度、耐溶劑性及相對介電常叙 。9作為 双慢吳的層p 、保護膜或隔離物的硬化膜。 s、息緣膜 【圖式簡單說明】 無。 【主要元件符號說明】 無0 -83-Hewlett-Packard's HP1 645 1B electrode and HP4284A precision LCR meter (Precision LCR meter) measure the relative permittivity at the l〇kHz frequency by the 201229666 cv method. When the value is 39 or less, it is judged that the dielectric constant is good. As is apparent from the results of Table 1, the radiation sensitive resin composition of the present invention has high radiation sensitivity, and a cured film having high surface hardness can be obtained by heating at a low temperature and for a short period of time, and the cured film has excellent resistance. Solvent and relative dielectric constant. '[Industrial Applicability] According to the radiation sensitive resin of the present invention, it is possible to provide both low-temperature firing and storage stability, and the ancient, seismic, and sympathetic feelings. Radiation, w radiation linear resin composition, and suitable for shortening k, 'feeling' visual display of your * surface hardness, solvent resistance and relative dielectric constant. 9 as a hardened film of layer p, protective film or separator of double slow. s, interest film [simplified description] None. [Main component symbol description] No 0 -83-
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| TWI622856B (en) * | 2012-09-03 | 2018-05-01 | 富士軟片股份有限公司 | Photo-sensitive resin composition, method for manufacturing cured film, cured film, organic el display device, and liquid crystal display device |
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| JP6093438B2 (en) * | 2013-03-27 | 2017-03-08 | 富士フイルム株式会社 | Photosensitive resin composition, method for producing cured film, cured film, organic EL display device and liquid crystal display device |
| KR20150039551A (en) * | 2013-10-02 | 2015-04-10 | 제이에스알 가부시끼가이샤 | Curable composition, cured film and process for forming the same, and compound |
| JP6318742B2 (en) * | 2014-03-18 | 2018-05-09 | Jsr株式会社 | Positive photosensitive resin composition |
| TWI710839B (en) * | 2015-02-17 | 2020-11-21 | 日商富士軟片股份有限公司 | Method for manufacturing thin film transistor substrate, organic electroluminescence display device and manufacturing method thereof, liquid crystal display device and manufacturing method thereof |
| JP6911323B2 (en) * | 2016-10-17 | 2021-07-28 | Hdマイクロシステムズ株式会社 | Photosensitive resin composition, cured film, pattern cured film manufacturing method and electronic components |
| KR101973192B1 (en) * | 2017-06-29 | 2019-04-26 | 주식회사 엘지화학 | Liquid crystal alignment composition, method of preparing liquid crystal alignment film, and liquid crystal alignment film using the same |
| KR20200022473A (en) * | 2017-08-03 | 2020-03-03 | 쇼와 덴코 가부시키가이샤 | Photosensitive resin composition for copolymer and color filter |
| CN113195585A (en) * | 2019-02-21 | 2021-07-30 | 昭和电工材料株式会社 | Curable resin composition and electronic component device |
| CN110597016B (en) * | 2019-09-29 | 2022-10-14 | 北京北旭电子材料有限公司 | A kind of photoresist composition, preparation method and patterning method |
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| TWI622856B (en) * | 2012-09-03 | 2018-05-01 | 富士軟片股份有限公司 | Photo-sensitive resin composition, method for manufacturing cured film, cured film, organic el display device, and liquid crystal display device |
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