JP2006282889A - Radiation-sensitive resin composition, protrusions and spacers formed therefrom, and liquid crystal display device comprising the same - Google Patents

Abstract

To provide a radiation-sensitive resin composition suitably used for simultaneously forming protrusions and spacers of a vertical alignment type liquid crystal display element.
[Solution]
[A] (a1) unsaturated carboxylic acid and / or unsaturated carboxylic acid anhydride,
(A2) containing an oxetanyl group-containing unsaturated compound, (a3) a copolymer of an olefinic unsaturated compound other than (a1) and (a2), and [B] 1,2-quinonediazide compound A radiation-sensitive resin composition for simultaneously forming protrusions and spacers of a vertical alignment type liquid crystal display element.
[Selection figure] None

Description

  The present invention relates to a radiation-sensitive resin composition for forming protrusions and / or spacers for vertical alignment type liquid crystal display elements, protrusions and spacers for vertical alignment type liquid crystal display elements formed therefrom, the protrusions and / or The present invention relates to a vertical alignment type liquid crystal display device provided with the spacer, and a method for forming the protrusion and / or the spacer.

  Liquid crystal display elements are most widely used in flat panel displays. With the recent spread of OA equipment such as personal computers and word processors and liquid crystal televisions, TFT (thin film transistor) type liquid crystal displays (TFT-LCD) The required performance for display quality is becoming stricter. The most widely used method among TFT-LCDs is a TN (Twisted Nematic) type LCD, which is a substrate having two transparent electrodes (hereinafter referred to as “transparent electrode substrate”). A polarizing film having a different orientation direction by 90 degrees is disposed on the outside, an alignment film is disposed on the inner side of the two transparent electrode substrates, and a nematic liquid crystal is disposed between the two alignment films. This is twisted 90 degrees from one electrode side to the other electrode side. When non-polarized light is incident in this state, the linearly polarized light transmitted through one polarizing plate is transmitted through the liquid crystal while the polarization direction is shifted, so that it can be transmitted through the other polarizing plate, resulting in a bright state. Next, when a voltage is applied to both the electrodes to make the liquid crystal molecules stand upright, the linearly polarized light reaching the liquid crystal is transmitted as it is, so that it cannot be transmitted through the other polarizing plate, resulting in a dark state. Thereafter, when the voltage is not applied again, the light state is restored.

Such a TN-type LCD has the same or better contrast and color reproducibility in the front than the cathode ray tube (CRT) due to recent technological improvements. However, the TN type LCD has a big problem that the viewing angle is narrow. As a solution to such a problem, an MVA (Multi-domain Vertically Aligned) type LCD (vertical alignment type liquid crystal display) has been developed. As described in Non-Patent Document 1 and Patent Document 1, this MVA-type LCD has a negative-type liquid crystal having negative dielectric anisotropy and a vertical alignment film instead of the optical rotation mode of TN-type LCD. Combined birefringence mode is used, and even when no voltage is applied, the alignment direction of the liquid crystal located near the alignment film is maintained almost vertical, so it has excellent contrast, viewing angle, etc. It is also excellent in terms of the manufacturing process, such as not having to perform a rubbing treatment for aligning the liquid crystal.

In the MVA type LCD, as a domain regulating means for allowing the liquid crystal to take a plurality of orientation directions in one pixel region, a display-side electrode has a slit in one pixel region, and light A projection (for example, a triangular pyramid shape, a semi-convex lens shape, etc.) having a slope at a position different from the slit of the electrode is formed in the same pixel region on the incident side electrode substrate. In general, in a conventional liquid crystal display, a spherical or rod-shaped spacer such as a resin or ceramic is used in order to maintain a constant gap (cell gap) between two transparent electrode substrates. When the two transparent electrode substrates are bonded to each other, the spacer is dispersed on one of the substrates, and the cell gap is determined by the spacer diameter.
Further, in order to avoid the occurrence of problems such as cell gap non-uniformity due to variation in spacer diameter, Patent Document 2 proposes a method of forming protrusions and spacers using a photoresist. Has the advantage that fine processing is possible and the shape can be easily controlled. However, Patent Document 2 does not specifically describe the composition of the photoresist, and the performance of the formed protrusions and spacers is not clear.

Arihiro Takeda, Liquid Crystal, Japanese Liquid Crystal Society, April 25, 1999, Vol. 3, No. 2, 117 Japanese Patent Laid-Open No. 11-258605 JP 2001-201750 A

Examples of the performance required for the photoresist used for forming the protrusions and spacers for the vertical alignment type liquid crystal display element include the following items. In other words, the protrusions and spacers have appropriate cross-sectional shapes, resistance to solvents used in the subsequent alignment film forming process, resistance to heat applied in the alignment film forming process, transparency, resolution, and remaining. High performance is required for film ratio and the like. In addition, the obtained vertical alignment type liquid crystal display element is required to be excellent in orientation, voltage holding ratio, and the like. The present applicant has already [A] (a1) unsaturated carboxylic acid and / or unsaturated carboxylic acid anhydride, (a2) an epoxy group-containing unsaturated compound, and (a3) a copolymer of other unsaturated compounds. , [B] an unsaturated polymerizable compound, and [C] a radiation-sensitive polymerization initiator, a radiation-sensitive resin composition for simultaneously forming protrusions and spacers, protrusions and spacers formed therefrom, and the protrusions and A liquid crystal display element having a spacer has been proposed (see Patent Document 3). However, the development of radiation-sensitive resin compositions useful for the formation of protrusions and spacers in vertical alignment liquid crystal display elements has just begun, and in response to the rapid spread of TFT-LCD and increasingly demanding performance requirements. Development of a new radiation-sensitive resin composition capable of forming protrusions and spacers having excellent performance has become an important technical issue.

JP 2003-29405 A

The present invention has been made in view of the above circumstances, and its problem is that a radiation-sensitive resin composition for forming protrusions and / or spacers for a vertical alignment type liquid crystal display element, more specifically, photo Vertical alignment liquid crystal display with excellent resolution and residual film ratio as resist, and can form protrusions and spacers with excellent pattern shape, heat resistance, solvent resistance, transparency, etc., and excellent alignment, voltage holding ratio, etc. An object of the present invention is to provide a radiation-sensitive resin composition capable of providing an element, and a method of forming protrusions and / or spacers for a vertical alignment type liquid crystal display element using the radiation-sensitive resin composition.

According to the present invention, the above objects and advantages of the present invention are firstly
[A] (a1) unsaturated carboxylic acid and / or unsaturated carboxylic acid anhydride (hereinafter also referred to as “compound (a1)”),
(A2) a compound represented by general formula (I) or general formula (II) (hereinafter also referred to as “compound (a2)”),

Wherein R is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R ¹ is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R ² , R ³ , R ⁴ and R ⁵ are each It is independently a hydrogen atom, a fluorine atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group, or a perfluoroalkyl group having 1 to 4 carbon atoms, and n is an integer of 1 to 6. ]
And (a3) an olefinically unsaturated compound other than (a1) and (a2) (hereinafter also referred to as “compound (a3)”).
A copolymer obtained by copolymerizing (hereinafter also referred to as “copolymer [A]”),
[B] It is achieved by a radiation-sensitive resin composition for forming protrusions and / or spacers for a vertical alignment type liquid crystal display device, comprising a 1,2-quinonediazide compound.

Secondly, the objects and advantages of the present invention are:
This is achieved by a protrusion for a vertical alignment type liquid crystal display element formed from the radiation sensitive resin composition.

Third, the objects and advantages of the present invention are:
This is achieved by a spacer for a vertical alignment type liquid crystal display element formed from the radiation sensitive resin composition.

The objects and advantages of the present invention are fourth.
This is achieved by a vertical alignment type liquid crystal display device including the protrusion and / or the spacer.

The purpose and advantage of the present invention are fifthly.
This is achieved by a method for forming protrusions and / or spacers characterized by including at least the following steps.
(1) The process of forming the coating film of the radiation sensitive composition of Claim 1 on a board | substrate.
(2) A step of irradiating at least a part of the coating film with radiation.
(3) Development process.
(4) Heating process.

Below, the detail of each component of the radiation sensitive resin composition in this invention is demonstrated.
Copolymer [A]
Copolymer [A] can be synthesized by radical polymerization of compound (a1), compound (a2), and compound (a3) in the presence of a polymerization initiator in a solvent.

The copolymer [A] used in the present invention preferably contains 5 to 40% by weight, particularly preferably 10 to 35% by weight, of structural units derived from the compound (a1). Copolymers whose constituent units are less than 5% by weight are difficult to dissolve in an alkaline aqueous solution, whereas copolymers exceeding 40% by weight tend to be too soluble in an alkaline aqueous solution.
Examples of the compound (a1) include monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid;
Dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid; and anhydrides of these dicarboxylic acids;
Mono [(meth) acryloyloxyalkyl] of divalent or higher polyvalent carboxylic acids such as succinic acid mono [2- (meth) acryloyloxyethyl] and phthalic acid mono [2- (meth) acryloyloxyethyl] Esters;
Examples thereof include mono (meth) acrylates of polymers having a carboxyl group and a hydroxyl group at both ends, such as ω-carboxypolycaprolactone mono (meth) acrylate. Of these, acrylic acid, methacrylic acid, maleic anhydride and the like are preferably used from the viewpoints of copolymerization reactivity, solubility in an aqueous alkali solution, and availability. These may be used alone or in combination.

  The copolymer [A] used in the present invention preferably contains 5 to 60% by weight, particularly preferably 10 to 50% by weight, of structural units derived from the compound (a2). When this structural unit is less than 5% by weight, the heat resistance of the resulting coating film tends to decrease, whereas when it exceeds 60% by weight, the storage stability of the copolymer tends to decrease.

  Examples of the compound (a2) represented by the general formula (I) include 3- (methacryloyloxymethyl) oxetane, 3- (methacryloyloxymethyl) -3-ethyloxetane, and 3- (methacryloyloxymethyl) -3-methyloxetane. 3- (methacryloyloxymethyl) -2-methyloxetane, 3- (methacryloyloxymethyl) -2-trifluoromethyloxetane, 3- (methacryloyloxymethyl) -2-pentafluoroethyloxetane, 3- (methacryloyloxymethyl) ) -2-phenyloxetane, 3- (methacryloyloxymethyl) -2,2-difluorooxetane, 3- (methacryloyloxymethyl) -2,2,4-trifluorooxetane, 3- (methacryloyloxymethyl) -2 , 2,4,4-Tetraflo Oxetane, 3- (methacryloyloxyethyl) oxetane, 3- (methacryloyloxyethyl) -3-ethyloxetane, 2-ethyl-3- (methacryloyloxyethyl) oxetane, 3- (methacryloyloxyethyl) -2-trifluoromethyl Oxetane, 3- (methacryloyloxyethyl) -2-pentafluoroethyloxetane, 3- (methacryloyloxyethyl) -2-phenyloxetane, 2,2-difluoro-3- (methacryloyloxyethyl) oxetane, 3- (methacryloyloxy) Methacrylic acid esters such as ethyl) -2,2,4-trifluorooxetane, 3- (methacryloyloxyethyl) -2,2,4,4-tetrafluorooxetane;

3- (acryloyloxymethyl) oxetane, 3- (acryloyloxymethyl) -3-ethyloxetane, 3- (acryloyloxymethyl) -3-methyloxetane, 3- (acryloyloxymethyl) -2-methyloxetane, 3- (Acryloyloxymethyl) -2-trifluoromethyloxetane, 3- (acryloyloxymethyl) -2-pentafluoroethyloxetane, 3- (acryloyloxymethyl) -2-phenyloxetane, 3- (acryloyloxymethyl) -2 , 2-Difluorooxetane, 3- (acryloyloxymethyl) -2,2,4-trifluorooxetane, 3- (acryloyloxymethyl) -2,2,4,4-tetrafluorooxetane, 3- (acryloyloxy) Ethyl) oxetane, 3- (acrylo Ruoxyethyl) -3-ethyloxetane, 2-ethyl-3- (acryloyloxyethyl) oxetane, 3- (acryloyloxyethyl) -2-trifluoromethyloxetane, 3- (acryloyloxyethyl) -2-pentafluoroethyloxetane 3- (acryloyloxyethyl) -2-phenyloxetane, 2,2-difluoro-3- (acryloyloxyethyl) oxetane, 3- (acryloyloxyethyl) -2,2,4-trifluorooxetane, 3- ( And acrylic acid esters such as (acryloyloxyethyl) -2,2,4,4-tetrafluorooxetane.

  Examples of the compound (a2) represented by the general formula (II) include 2- (methacryloyloxymethyl) oxetane, 2-methyl-2- (methacryloyloxymethyl) oxetane, and 3-methyl-2- (methacryloyloxymethyl) oxetane. 4-methyl-2- (methacryloyloxymethyl) oxetane, 2- (methacryloyloxymethyl) -2-trifluoromethyloxetane, 2- (methacryloyloxymethyl) -3-trifluoromethyloxetane, 2- (methacryloyloxymethyl) ) -4-Trifluoromethyloxetane, 2- (methacryloyloxymethyl) -2-pentafluoroethyl oxetane, 2- (methacryloyloxymethyl) -3-pentafluoroethyloxetane, 2- (methacryloyloxymethyl) -4-pentafluoro Ethyl oxetane, 2- (methacryloyloxymethyl) -2-phenyloxetane, 2- (methacryloyloxymethyl) -3-phenyloxetane, 2- (methacryloyloxymethyl) -4-phenyloxetane, 2,3-difluoro-2- (Methacryloyloxymethyl) oxetane, 2,4-difluoro-2- (methacryloyloxymethyl) oxetane, 3,3-difluoro-2- (methacryloyloxymethyl) oxetane, 3,4-difluoro-2- (methacryloyloxymethyl) Oxetane, 4,4-difluoro-2- (methacryloyloxymethyl) oxetane, 2- (methacryloyloxymethyl) -3,3,4-trifluorooxetane, 2- (methacryloyloxymethyl) -3,4,4-tri Fluoroxetane, 2- (me Tacriroyloxymethyl) -3,3,4,4-tetrafluorooxetane,

2- (methacryloyloxyethyl) oxetane, 2- (2- (2-methyloxetanyl)) ethyl methacrylate, 2- (2- (3-methyloxetanyl)) ethyl methacrylate, 2- (methacryloyloxyethyl) -2-methyl Oxetane, 2- (methacryloyloxyethyl) -4-methyloxetane, 2- (methacryloyloxyethyl) -2-trifluoromethyloxetane, 2- (methacryloyloxyethyl) -3-trifluoromethyloxetane, 2- (methacryloyloxy) Ethyl) -4-trifluoromethyloxetane, 2- (methacryloyloxyethyl) -2-pentafluoroethyloxetane, 2- (methacryloyloxyethyl) -3-pentafluoroethyloxetane, 2- (methacryloyloxyethyl) -4- N-tafluoroethyloxetane, 2- (methacryloyloxyethyl) -2-phenyloxetane, 2- (methacryloyloxyethyl) -3-phenyloxetane, 2- (methacryloyloxyethyl) -4-phenyloxetane, 2,3-difluoro- 2- (methacryloyloxyethyl) oxetane, 2,4-difluoro-2- (methacryloyloxyethyl) oxetane, 3,3-difluoro-2- (methacryloyloxyethyl) oxetane, 3,4-difluoro-2- (methacryloyloxy) Ethyl) oxetane, 4,4-difluoro-2- (methacryloyloxyethyl) oxetane, 2- (methacryloyloxyethyl) -3,3,4-trifluorooxetane, 2- (methacryloyloxyethyl) -3,4,4 -Trifluorooxeta , 2- (methacryloyloxyethyl) 3,3,4,4 methacrylic acid esters of tetrafluoroethane oxetane, and the like;

2- (acryloyloxymethyl) oxetane, 2-methyl-2- (acryloyloxymethyl) oxetane, 3-methyl-2- (acryloyloxymethyl) oxetane, 4-methyl-2- (acryloyloxymethyl) oxetane, 2- (Acryloyloxymethyl) -2-trifluoromethyloxetane, 2- (acryloyloxymethyl) -3-trifluoromethyloxetane, 2- (acryloyloxymethyl) -4-trifluoromethyloxetane, 2- (acryloyloxymethyl) 2-Pentafluoroethyl oxetane, 2- (acryloyloxymethyl) -3-pentafluoroethyl oxetane, 2- (acryloyloxymethyl) -4-pentafluoroethyl oxetane, 2- (acryloyloxymethyl) -2-phenyloxet 2- (acryloyloxymethyl) -3-phenyloxetane, 2- (acryloyloxymethyl) -4-phenyloxetane, 2,3-difluoro-2- (acryloyloxymethyl) oxetane, 2,4-difluoro-2 -(Acryloyloxymethyl) oxetane, 3,3-difluoro-2- (acryloyloxymethyl) oxetane, 3,4-difluoro-2- (acryloyloxymethyl) oxetane, 4,4-difluoro-2- (acryloyloxymethyl) ) Oxetane, 2- (acryloyloxymethyl) -3,3,4-trifluorooxetane, 2- (acryloyloxymethyl) -3,4,4-trifluorooxetane, 2- (acryloyloxymethyl) -3,3 , 4,4-tetrafluorooxetane,

2- (acryloyloxyethyl) oxetane, 2- (2- (2-methyloxetanyl)) ethyl methacrylate, 2- (2- (3-methyloxetanyl)) ethyl methacrylate, 2- (acryloyloxyethyl) -2-methyl Oxetane, 2- (acryloyloxyethyl) -4-methyloxetane, 2- (acryloyloxyethyl) -2-trifluoromethyloxetane, 2- (acryloyloxyethyl) -3-trifluoromethyloxetane, 2- (acryloyloxy) Ethyl) -4-trifluoromethyloxetane, 2- (acryloyloxyethyl) -2-pentafluoroethyloxetane, 2- (acryloyloxyethyl) -3-pentafluoroethyloxetane, 2- (acryloyloxyethyl) -4- Pentafluoroethyl Xetane, 2- (acryloyloxyethyl) -2-phenyloxetane, 2- (acryloyloxyethyl) -3-phenyloxetane, 2- (acryloyloxyethyl) -4-phenyloxetane, 2,3-difluoro-2- ( Acryloyloxyethyl) oxetane, 2,4-difluoro-2- (acryloyloxyethyl) oxetane, 3,3-difluoro-2- (acryloyloxyethyl) oxetane, 3,4-difluoro-2- (acryloyloxyethyl) oxetane 4,4-Difluoro-2- (acryloyloxyethyl) oxetane, 2- (acryloyloxyethyl) -3,3,4-trifluorooxetane, 2- (acryloyloxyethyl) -3,4,4-trifluoro Oxetane, 2- (acryloyloxyethyl)- , 3,4,4 acrylic acid esters such as tetrafluoroethane oxetane and the like.

  Among these, 3- (methacryloyloxymethyl) oxetane, 3- (methacryloyloxymethyl) -2-trifluoromethyloxetane, 3- (methacryloyloxymethyl) -2-phenyloxetane, 2- (methacryloyloxymethyl) oxetane, 2- (methacryloyloxymethyl) -4-trifluoromethyloxetane, 3- (methacryloyloxymethyl) -3-ethyloxetane, 3- (methacryloyloxymethyl) -3-methyloxetane, 3- (acryloyloxymethyl) -3 A photosensitive resin composition from which ethyl oxetane, 3- (acryloyloxymethyl) -3-methyl oxetane, and the like can be obtained is used because it has a wide process margin and improves the chemical resistance of the resulting protrusions and spacers. . These may be used alone or in combination.

  The copolymer [A] used in the present invention preferably contains 10 to 80% by weight, particularly preferably 20 to 70% by weight, of structural units derived from the compound (a3). When this structural unit is less than 10% by weight, the storage stability of the copolymer [A] tends to be lowered, whereas when it exceeds 80% by weight, the copolymer [A] is hardly dissolved in an alkaline aqueous solution. Become.

Examples of the compound (a3) include methacrylic acid alkyl esters such as methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, and t-butyl methacrylate; acrylic acid alkyl esters such as methyl acrylate and isopropyl acrylate; cyclohexyl Methacrylate, 2-methylcyclohexyl methacrylate, tricyclo [5.2.1.0 ^2,6 ] decan-8-yl methacrylate (referred to in the art as dicyclopentanyl methacrylate), dicyclopentanyl Methacrylic acid cyclic alkyl esters such as oxyethyl methacrylate and isobornyl methacrylate; cyclohexyl acrylate, 2-methylcyclohexyl acrylate, tri Black [5.2.1.0 ^2,6] decan-8-yl acrylate (in the art are said to dicyclopentanyl acrylate as trivial name), dicyclopentanyl oxyethyl acrylate, isobornyl acrylate Acrylic acid cyclic alkyl esters such as phenyl methacrylate and benzyl methacrylate; aryl acrylates such as phenyl acrylate and benzyl acrylate; dicarboxylic acids such as diethyl maleate, diethyl fumarate and diethyl itaconate Diesters; hydroxyalkyl esters such as 2-hydroxyethyl methacrylate and 2-hydroxypropyl methacrylate;

Bicyclo [2.2.1] hept-2-ene,
5-methylbicyclo [2.2.1] hept-2-ene,
5-ethylbicyclo [2.2.1] hept-2-ene,
5-hydroxybicyclo [2.2.1] hept-2-ene,
5-carboxybicyclo [2.2.1] hept-2-ene,
5-hydroxymethylbicyclo [2.2.1] hept-2-ene,
5- (2′-hydroxyethyl) bicyclo [2.2.1] hept-2-ene,
5-methoxybicyclo [2.2.1] hept-2-ene,
5-ethoxybicyclo [2.2.1] hept-2-ene,
5,6-dihydroxybicyclo [2.2.1] hept-2-ene,
5,6-dicarboxybicyclo [2.2.1] hept-2-ene,
5,6-di (hydroxymethyl) bicyclo [2.2.1] hept-2-ene,
5,6-di (2′-hydroxyethyl) bicyclo [2.2.1] hept-2-ene,
5,6-dimethoxybicyclo [2.2.1] hept-2-ene,
5,6-diethoxybicyclo [2.2.1] hept-2-ene,
5-hydroxy-5-methylbicyclo [2.2.1] hept-2-ene,
5-hydroxy-5-ethylbicyclo [2.2.1] hept-2-ene,
5-carboxy-5-methylbicyclo [2.2.1] hept-2-ene,
5-carboxy-5-ethylbicyclo [2.2.1] hept-2-ene,
5-hydroxymethyl-5-methylbicyclo [2.2.1] hept-2-ene,
5-carboxy-6-methylbicyclo [2.2.1] hept-2-ene,
5-carboxy-6-ethylbicyclo [2.2.1] hept-2-ene,
5,6-dicarboxybicyclo [2.2.1] hept-2-ene anhydride (hymic acid anhydride),
5-t-butoxycarbonylbicyclo [2.2.1] hept-2-ene,
5-cyclohexyloxycarbonylbicyclo [2.2.1] hept-2-ene,
5-phenoxycarbonylbicyclo [2.2.1] hept-2-ene,
5,6-di (t-butoxycarbonyl) bicyclo [2.2.1] hept-2-ene,
Bicyclounsaturated compounds such as 5,6-di (cyclohexyloxycarbonyl) bicyclo [2.2.1] hept-2-ene;

Phenylmaleimide, cyclohexylmaleimide, benzylmaleimide, N-succinimidyl-3-maleimidobenzoate, N-succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidocaproate, N-succinimidyl-3-maleimidopropionate, Dicarbonylimide derivatives such as N- (9-acridinyl) maleimide;

Styrene, α-methyl styrene, m-methyl styrene, p-methyl styrene, vinyl toluene, p-methoxy styrene, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, 1,3-butadiene , Isoprene, 2,3-dimethyl-1,3-butadiene, glycidyl acrylate, glycidyl methacrylate, glycidyl α-ethyl acrylate, glycidyl α-n-propyl acrylate, glycidyl α-n-butyl acrylate, acrylic acid -3,4-epoxybutyl, methacrylic acid-3,4-epoxybutyl, acrylic acid-6,7-epoxyheptyl, methacrylic acid-6,7-epoxyheptyl, α-ethylacrylic acid-6,7-epoxyheptyl O-Vinylbenzylglycidylate , M- vinylbenzyl glycidyl ether, p- vinylbenzyl glycidyl ether.

  Of these, styrene, t-butyl methacrylate, dicyclopentanyl methacrylate, p-methoxystyrene, 2-methylcyclohexyl acrylate, 1,3-butadiene, glycidyl methacrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl Ether, p-vinylbenzylglycidyl ether, phenylmaleimide, cyclohexylmaleimide, bicyclo [2.2.1] hept-2-ene and the like are preferable from the viewpoint of copolymerization reactivity and solubility in an aqueous alkali solution. These may be used alone or in combination.

As described above, the copolymer [A] used in the present invention has a carboxyl group and / or a carboxylic anhydride group and an oxetanyl group, and has appropriate solubility in an alkaline aqueous solution, It can be easily cured by heating without using a special curing agent.
The radiation-sensitive resin composition containing the copolymer [A] can easily form a coating film having a predetermined pattern without causing a development residue during film development and without causing film slippage.

  Specific examples of the solvent used for the synthesis of the copolymer [A] include alcohols such as methanol and ethanol; ethers such as tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether. Ethylene glycol alkyl ether acetates such as methyl cellosolve acetate and ethyl cellosolve acetate; diethylene glycols such as diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether and diethylene glycol ethyl methyl ether; propylene glycol methyl ether and propylene glycol ethyl Ether, propylene glycol Propylene glycol monoalkyl ethers such as rupropyl ether and propylene glycol butyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate propylene glycol butyl ether acetate; propylene glycol methyl Propylene glycol alkyl ether acetates such as ether propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionate, propylene glycol butyl ether propionate; aromatic hydrocarbons such as toluene and xylene;

Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone; methyl acetate, ethyl acetate, propyl acetate, butyl acetate, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, Ethyl 2-hydroxy-2-methylpropionate, methyl hydroxyacetate, ethyl hydroxyacetate, butyl hydroxyacetate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, 3 -Protyl hydroxypropionate, butyl 3-hydroxypropionate, methyl 2-hydroxy-3-methylbutanoate, methyl methoxyacetate, ethyl methoxyacetate, propyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate , Ethyl ethoxy acetate, propyl ethoxy acetate, butyl ethoxy acetate, methyl propoxyacetate, ethyl propoxyacetate, propyl propoxyacetate, butyl propoxyacetate, methyl butoxyacetate, ethyl butoxyacetate, propyl butoxyacetate, butylbutoxyacetate, 2-methoxypropionic acid Methyl, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, butyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, propyl 2-ethoxypropionate, butyl 2-ethoxypropionate Methyl 2-butoxypropionate, ethyl 2-butoxypropionate, propyl 2-butoxypropionate, butyl 2-butoxypropionate, methyl 3-methoxypropionate, 3-methyl Ethyl xylpropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, 3-propoxy Methyl propionate, ethyl 3-propoxypropionate, propyl 3-propoxypropionate, butyl 3-propoxypropionate, methyl 3-butoxypropionate, ethyl 3-butoxypropionate, propyl 3-butoxypropionate, 3-butoxypropion And esters such as butyl acid.

  As the polymerization initiator used for the production of the copolymer [A], those generally known as radical polymerization initiators can be used. For example, 2,2′-azobisisobutyronitrile, 2,2 Azo compounds such as' -azobis- (2,4-dimethylvaleronitrile), 2,2'-azobis- (4-methoxy-2,4-dimethylvaleronitrile); benzoyl peroxide, lauroyl peroxide, t-butylperoxypi Organic peroxides such as barate, 1,1'-bis- (t-butylperoxy) cyclohexane; and hydrogen peroxide. When a peroxide is used as the radical polymerization initiator, it may be a redox initiator using the peroxide together with a reducing agent.

  In the production of the copolymer [A], a molecular weight modifier can be used to adjust the molecular weight. Specific examples thereof include halogenated hydrocarbons such as chloroform and carbon tetrabromide; mercaptans such as n-hexyl mercaptan, n-octyl mercaptan, n-dodecyl mercaptan, tert-dodecyl mercaptan and thioglycolic acid; dimethylxanthogen Xanthogens such as sulfide and diisopropylxanthogen disulfide; terpinolene, α-methylstyrene dimer and the like.

  The copolymer [A] used in the present invention has a polystyrene-equivalent weight average molecular weight (hereinafter referred to as “Mw”) usually 2 × 10 3 to 5 × 10 5, preferably 5 × 10 3 to 1 × 10 5. Is desirable. If the Mw is less than 2 × 10 3, the remaining film ratio after development tends to be low, whereas if it exceeds 5 × 10 5, the undeveloped residue may occur.

1,2-quinonediazide compound [B]
As the 1,2-quinonediazide compound [B] used in the present invention, as the 1,2-quinonediazide compound, 1,2-benzoquinonediazidesulfonic acid ester, 1,2-naphthoquinonediazidesulfonic acid ester, 1,2- Examples thereof include benzoquinone diazide sulfonic acid amide and 1,2-naphthoquinone diazide sulfonic acid amide.

  Specific examples thereof include 2,3,4-trihydroxybenzophenone-1,2-naphthoquinone azide-4-sulfonic acid ester, 2,3,4-trihydroxybenzophenone-1,2-naphthoquinonediazide-5-sulfone. Acid ester, 2,3,4-trihydroxybenzophenone-1,2-naphthoquinonediazide-6-sulfonic acid ester, 2,3,4-trihydroxybenzophenone-1,2-naphthoquinonediazide-7-sulfonic acid ester, 2 , 3,4-Trihydroxybenzophenone-1,2-naphthoquinonediazide-8-sulfonic acid ester, 2,4,6-trihydroxybenzophenone-1,2-naphthoquinonediazide-4-sulfonic acid ester, 2,4,6 -Trihydroxybenzophenone-1,2-naphthoquinone diazi -5-sulfonic acid ester, 2,4,6-trihydroxybenzophenone-1,2-naphthoquinonediazide-6-sulfonic acid ester, 2,4,6-trihydroxybenzophenone-1,2-naphthoquinonediazide-7-sulfone 1,2-naphthoquinone diazide sulfonic acid esters of trihydroxybenzophenone such as acid esters, 2,4,6-trihydroxybenzophenone-1,2-naphthoquinone diazide-8-sulfonic acid ester;

2,2 ′, 4,4′-tetrahydroxybenzophenone-1,2-naphthoquinonediazide-4-sulfonic acid ester, 2,2 ′, 4,4′-tetrahydroxybenzophenone-1,2-naphthoquinonediazide-5 Sulfonic acid ester, 2,2 ′, 4,4′-tetrahydroxybenzophenone-1,2-naphthoquinonediazide-6-sulfonic acid ester, 2,2 ′, 4,4′-tetrahydroxybenzophenone-1,2-naphtho Quinonediazide-7-sulfonic acid ester, 2,2 ′, 4,4′-tetrahydroxybenzophenone-1,2-naphthoquinonediazide-8-sulfonic acid ester, 2,3,4,3′-tetrahydroxybenzophenone-1, 2-naphthoquinonediazide-4-sulfonic acid ester, 2,3,4,3′-tetrahydroxyl Benzophenone-1,2-naphthoquinonediazide-5-sulfonic acid ester, 2,3,4,3′-tetrahydroxybenzophenone-1,2-naphthoquinonediazide-6-sulfonic acid ester, 2,3,4,3′- Tetrahydroxybenzophenone-1,2-naphthoquinonediazide-7-sulfonic acid ester, 2,3,4,3′-tetrahydroxybenzophenone-1,2-naphthoquinonediazide-8-sulfonic acid ester, 2,3,4,4 '-Tetrahydroxybenzophenone-1,2-naphthoquinonediazide-4-sulfonic acid ester, 2,3,4,4'-tetrahydroxybenzophenone-1,2-naphthoquinonediazide-5-sulfonic acid ester, 2,3,4 , 4'-Tetrahydroxybenzophenone-1,2-naphthoquinonedia Do-6-sulfonic acid ester, 2,3,4,4′-tetrahydroxybenzophenone-1,2-naphthoquinonediazide-7-sulfonic acid ester, 2,3,4,4′-tetrahydroxybenzophenone-1,2 -Naphthoquinonediazide-8-sulfonic acid ester, 2,3,4,2'-tetrahydroxy-4'-methylbenzophenone-1,2-naphthoquinonediazide-4-sulfonic acid ester, 2,3,4,2'- Tetrahydroxy-4'-methylbenzophenone-1,2-naphthoquinonediazide-5-sulfonic acid ester, 2,3,4,2'-tetrahydroxy-4'-methylbenzophenone-1,2-naphthoquinonediazide-6-sulfone Acid ester, 2,3,4,2′-tetrahydroxy-4′-methylbenzophenone-1,2-naphth Toquinonediazide-7-sulfonic acid ester, 2,3,4,2′-tetrahydroxy-4′-methylbenzophenone-1,2-naphthoquinonediazide-8-sulfonic acid ester, 2,3,4,4′-tetra Hydroxy-3'-methoxybenzophenone-1,2-naphthoquinonediazide-4-sulfonic acid ester, 2,3,4,4'-tetrahydroxy-3'-methoxybenzophenone-1,2-naphthoquinonediazide-5-sulfonic acid Ester, 2,3,4,4′-tetrahydroxy-3′-methoxybenzophenone-1,2-naphthoquinonediazide-6-sulfonic acid ester, 2,3,4,4′-tetrahydroxy-3′-methoxybenzophenone -1,2-naphthoquinonediazide-7-sulfonic acid ester, 2,3,4,4′-tetrahi 1,2-naphthoquinonediazide sulfonic acid esters of tetrahydroxybenzophenone such as proxy-3'-methoxybenzophenone-1,2-naphthoquinonediazide-8-sulfonic acid esters;

2,3,4,2 ′, 6′-pentahydroxybenzophenone-1,2-naphthoquinonediazide-4-sulfonic acid ester, 2,3,4,2 ′, 6′-pentahydroxybenzophenone-1,2-naphtho Quinonediazide-5-sulfonic acid ester, 2,3,4,2 ′, 6′-pentahydroxybenzophenone-1,2-naphthoquinonediazide-6-sulfonic acid ester, 2,3,4,2 ′, 6′-penta Of pentahydroxybenzophenone such as hydroxybenzophenone-1,2-naphthoquinonediazide-7-sulfonic acid ester, 2,3,4,2 ′, 6′-pentahydroxybenzophenone-1,2-naphthoquinonediazide-8-sulfonic acid ester, etc. 1,2-naphthoquinonediazide sulfonic acid esters;

2,4,6,3 ′, 4 ′, 5′-hexahydroxybenzophenone-1,2-naphthoquinonediazide-4-sulfonic acid ester, 2,4,6,3 ′, 4 ′, 5′-hexahydroxybenzophenone -1,2-naphthoquinonediazide-5-sulfonic acid ester, 2,4,6,3 ′, 4 ′, 5′-hexahydroxybenzophenone-1,2-naphthoquinonediazide-6-sulfonic acid ester, 2,4, 6,3 ′, 4 ′, 5′-hexahydroxybenzophenone-1,2-naphthoquinonediazide-7-sulfonic acid ester, 2,4,6,3 ′, 4 ′, 5′-hexahydroxybenzophenone-1,2 -Naphthoquinonediazide-8-sulfonic acid ester, 3,4,5,3 ', 4', 5'-hexahydroxybenzophenone-1,2-naphthoquinonedia Do-4-sulfonic acid ester, 3,4,5,3 ′, 4 ′, 5′-hexahydroxybenzophenone-1,2-naphthoquinonediazide-5-sulfonic acid ester, 3,4,5,3 ′, 4 ', 5'-Hexahydroxybenzophenone-1,2-naphthoquinonediazide-6-sulfonic acid ester, 3,4,5,3', 4 ', 5'-hexahydroxybenzophenone-1,2-naphthoquinonediazide-7- 1,2-naphthoquinone diazide sulfonic acid ester of hexahydroxybenzophenone such as sulfonic acid ester, 3,4,5,3 ′, 4 ′, 5′-hexahydroxybenzophenone-1,2-naphthoquinonediazide-8-sulfonic acid ester Kind;

Bis (2,4-dihydroxyphenyl) methane-1,2-naphthoquinonediazide-4-sulfonic acid ester, bis (2,4-dihydroxyphenyl) methane-1,2-naphthoquinonediazide-5-sulfonic acid ester, bis ( 2,4-dihydroxyphenyl) methane-1,2-naphthoquinonediazide-6-sulfonic acid ester, bis (2,4-dihydroxyphenyl) methane-1,2-naphthoquinonediazide-7-sulfonic acid ester, bis (2, 4-dihydroxyphenyl) methane-1,2-naphthoquinonediazide-8-sulfonic acid ester, bis (p-hydroxyphenyl) methane-1,2-naphthoquinonediazide-4-sulfonic acid ester, bis (p-hydroxyphenyl) methane -1,2-naphthoquinonediazide-5-sulfonic acid Tellurium, bis (p-hydroxyphenyl) methane-1,2-naphthoquinonediazide-6-sulfonic acid ester, bis (p-hydroxyphenyl) methane-1,2-naphthoquinonediazide-7-sulfonic acid ester, bis (p- Hydroxyphenyl) methane-1,2-naphthoquinonediazide-8-sulfonic acid ester, tri (p-hydroxyphenyl) methane-1,2-naphthoquinonediazide-4-sulfonic acid ester, tri (p-hydroxyphenyl) methane-1 , 2-Naphthoquinonediazide-5-sulfonic acid ester, tri (p-hydroxyphenyl) methane-1,2-naphthoquinonediazide-6-sulfonic acid ester, tri (p-hydroxyphenyl) methane-1,2-naphthoquinonediazide- 7-sulfonic acid ester, tri (p-hydride Kishifeniru) methane-1,2-naphthoquinonediazide-8-sulfonic acid ester,

1,1,1-tri (p-hydroxyphenyl) ethane-1,2-naphthoquinonediazide-4-sulfonic acid ester, 1,1,1-tri (p-hydroxyphenyl) ethane-1,2-naphthoquinonediazide- 5-sulfonic acid ester, 1,1,1-tri (p-hydroxyphenyl) ethane-1,2-naphthoquinonediazide-6-sulfonic acid ester, 1,1,1-tri (p-hydroxyphenyl) ethane-1 , 2-Naphthoquinonediazide-7-sulfonic acid ester, 1,1,1-tri (p-hydroxyphenyl) ethane-1,2-naphthoquinonediazide-8-sulfonic acid ester, bis (2,3,4-trihydroxy) Phenyl) methane-1,2-naphthoquinonediazide-4-sulfonic acid ester, bis (2,3,4-trihydroxyphenyl) Tan-1,2-naphthoquinonediazide-5-sulfonic acid ester, bis (2,3,4-trihydroxyphenyl) methane-1,2-naphthoquinonediazide-6-sulfonic acid ester, bis (2,3,4- Trihydroxyphenyl) methane-1,2-naphthoquinonediazide-7-sulfonic acid ester, bis (2,3,4-trihydroxyphenyl) methane-1,2-naphthoquinonediazide-8-sulfonic acid ester, 2,2- Bis (2,3,4-trihydroxyphenyl) propane-1,2-naphthoquinonediazide-4-sulfonic acid ester, 2,2-bis (2,3,4-trihydroxyphenyl) propane-1,2-naphtho Quinonediazide-5-sulfonic acid ester, 2,2-bis (2,3,4-trihydroxyphenyl) propane-1, -Naphthoquinonediazide-6-sulfonic acid ester, 2,2-bis (2,3,4-trihydroxyphenyl) propane-1,2-naphthoquinonediazide-7-sulfonic acid ester, 2,2-bis (2,3 , 4-trihydroxyphenyl) propane-1,2-naphthoquinonediazide-8-sulfonic acid ester,

1,1,3-tris (2,5-dimethyl-4-hydroxyphenyl) -3-phenylpropane-1,2-naphthoquinonediazide-4-sulfonic acid ester, 1,1,3-tris (2,5- Dimethyl-4-hydroxyphenyl) -3-phenylpropane-1,2-naphthoquinonediazide-5-sulfonic acid ester, 1,1,3-tris (2,5-dimethyl-4-hydroxyphenyl) -3-phenylpropane -1,2-naphthoquinonediazide-6-sulfonic acid ester, 1,1,3-tris (2,5-dimethyl-4-hydroxyphenyl) -3-phenylpropane-1,2-naphthoquinonediazide-7-sulfonic acid Ester, 1,1,3-tris (2,5-dimethyl-4-hydroxyphenyl) -3-phenylpropane-1,2-naphthoquinone Azido-8-sulfonic acid ester, 4,4 ′-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol-1,2-naphthoquinonediazide-4-sulfone Acid ester, 4,4 ′-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol-1,2-naphthoquinonediazide-5-sulfonic acid ester, 4, 4 ′-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol-1,2-naphthoquinonediazide-6-sulfonic acid ester, 4,4 ′-[1 -[4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol-1,2-naphthoquinone di- Dido-7-sulfonic acid ester, 4,4 ′-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol-1,2-naphthoquinonediazide-8-sulfone Acid esters,

Bis (2,5-dimethyl-4-hydroxyphenyl) -2-hydroxyphenylmethane-1,2-naphthoquinonediazide-4-sulfonic acid ester, bis (2,5-dimethyl-4-hydroxyphenyl) -2-hydroxy Phenylmethane-1,2-naphthoquinonediazide-5-sulfonic acid ester, bis (2,5-dimethyl-4-hydroxyphenyl) -2-hydroxyphenylmethane-1,2-naphthoquinonediazide-6-sulfonic acid ester, bis (2,5-Dimethyl-4-hydroxyphenyl) -2-hydroxyphenylmethane-1,2-naphthoquinonediazide-7-sulfonic acid ester, bis (2,5-dimethyl-4-hydroxyphenyl) -2-hydroxyphenyl Methane-1,2-naphthoquinonediazide-8-sulfonic acid ester 3,3,3 ′, 3′-tetramethyl-1,1′-spirobiindene-5,6,7,5 ′, 6 ′, 7′-hexanol-1,2-naphthoquinonediazide-4-sulfone Acid ester 3,3,3 ′, 3′-tetramethyl-1,1′-spirobiindene-5,6,7,5 ′, 6 ′, 7′-hexanol-1,2-naphthoquinonediazide-5 -Sulfonate ester, 3,3,3 ', 3'-tetramethyl-1,1'-spirobiindene-5,6,7,5', 6 ', 7'-hexanol-1,2-naphthoquinonediazide -6-sulfonic acid ester, 3,3,3 ', 3'-tetramethyl-1,1'-spirobiindene-5,6,7,5', 6 ', 7'-hexanol-1,2- Naphthoquinonediazide-7-sulfonic acid ester, 3,3,3 ′, 3′-tetramethyl-1,1′-spirobiinde -5,6,7,5 ', 6', 7'-hexanol-1,2-naphthoquinonediazide-8-sulfonic acid ester, 2,2,4-trimethyl-7,2 ', 4'-trihydroxyflavan -1,2-naphthoquinonediazide-4-sulfonic acid ester, 2,2,4-trimethyl-7,2 ′, 4′-trihydroxyflavan-1,2-naphthoquinonediazide-5-sulfonic acid, 2,2, 4-trimethyl-7,2 ′, 4′-trihydroxyflavan-1,2-naphthoquinonediazide-6-sulfonic acid ester, 2,2,4-trimethyl-7,2 ′, 4′-trihydroxyflavan-1 2,2-naphthoquinonediazide-7-sulfonic acid, 2,2,4-trimethyl-7,2 ′, 4′-trihydroxyflavan-1,2-naphthoquinonediazide-8-sulfonic acid, etc. Phenyl) include 1,2-naphthoquinonediazide sulfonic acid esters of alkanoic.
These 1,2-quinonediazide compounds can be used alone or in combination of two or more.

[B] The usage-amount of a component is 5-100 weight part with respect to 100 weight part of copolymers [A], Preferably it is 10-50 weight part.
When this ratio is less than 5 parts by weight, the amount of acid generated by irradiation with radiation is small, so the difference in solubility in an alkaline aqueous solution that is a developer between the irradiated part and the unirradiated part is small, and patterning is difficult. Tend to be. In addition, since the amount of acid involved in the reaction with the copolymer [A] decreases, sufficient heat resistance and solvent resistance may not be obtained. On the other hand, if this ratio exceeds 100 parts by weight, a large amount of unreacted [B] component remains after irradiation for a short time, so that the effect of insolubilization in the alkaline aqueous solution is too high and development is performed. Tend to be difficult.

Polyhydric phenol compound [C]
In the radiation sensitive resin composition of this invention, a polyhydric phenol compound can be further contained as [C] component. The polyhydric phenol compound [C] is a compound having two or more phenolic hydroxyl groups in the molecule.
The polyhydric phenol compound [C] in the present invention is not particularly limited as long as it has the above structure, but is a homopolymer of a radical polymerizable monomer having a phenolic hydroxyl group, or a radical polymerizability having a phenolic hydroxyl group. A copolymer of a monomer and other radical polymerizable monomer is preferred.

As a radical polymerizable monomer having a phenolic hydroxyl group, for example,
o-hydroxystyrene, m-hydroxystyrene, p-hydroxystyrene, o-hydroxy-α-methylstyrene, m-hydroxy-α-methylstyrene, p-hydroxy-α-methylstyrene, and benzene rings in these compounds Are a carboxyl group, a linear or branched alkyl group having 1 to 4 carbon atoms, a linear or branched alkoxyl group having 1 to 4 carbon atoms, a linear or branched halogen atom having 1 to 4 carbon atoms. One or more of an alkyl group, a halogen atom, a nitro group, a cyano group, a linear or branched amide group having 1 to 4 carbon atoms, or a linear or branched ester group having 2 to 8 carbon atoms, or 1 Examples thereof include hydroxystyrenes (derivatives) such as derivatives substituted with more than one species.

Of these radically polymerizable monomers having a phenolic hydroxyl group, m-hydroxystyrene, p-hydroxystyrene and the like are preferable.
The radical polymerizable monomer having a phenolic hydroxyl group can be used alone or in admixture of two or more.

  Preferred polyhydric phenol compounds [C] in the present invention include, for example, poly (p-hydroxystyrene), p-hydroxystyrene / p-hydroxy-α-methylstyrene copolymer, p-hydroxystyrene / styrene copolymer. Coalescence can be mentioned.

  The polystyrene-reduced weight average molecular weight (hereinafter referred to as “Mw”) of the polyhydric phenol compound [C] is preferably 2,000 to 100,000, more preferably 2,000 to 50,000, particularly preferably 2. 000-30,000. By using the polyhydric phenol compound [C] having Mw within this range, a radiation sensitive resin composition excellent in resolution, developability and sensitivity can be obtained, and protrusions and spacers excellent in shape and heat resistance can be obtained. Can be formed.

Moreover, in this invention, as polyhydric phenol compound [C], it is a brand name, for example, Marka linker M, the same PHM-C (above, Maruzen Petrochemical Co., Ltd. product), VP-2500, VP-15000 ( As described above, commercially available products such as hydroxystyrene (co) polymers such as Nippon Soda Co., Ltd. or partially hydrogenated products thereof can also be used.
In this invention, polyhydric phenol compound [C] can be used individually or in mixture of 2 or more types.

The proportion of component [C] used is 50 parts by weight or less, preferably 0.1 to 50 parts by weight, particularly preferably 1 to 40 parts by weight, based on 100 parts by weight of copolymer [A].
When this proportion exceeds 50 parts by weight, the developability tends to be lowered.

Other components The radiation-sensitive resin composition of the present invention contains the above-mentioned copolymer [A] and [B] components or [C] components as essential components, but [D] heat sensitive as necessary. Acid generating compound, [E] polymerizable compound having at least one ethylenically unsaturated double bond, epoxy resin other than [F] copolymer [A], [G] adhesion assistant, [H] interface An activator or [I] crosslinker can be included.
[D] The heat-sensitive acid generating compound can be used to improve heat resistance and hardness. Specific examples thereof include onium salts such as sulfonium salts, benzothiazonium salts, ammonium salts, and phosphonium salts.
Specific examples of the sulfonium salt include alkylsulfonium salts, benzylsulfonium salts, dibenzylsulfonium salts, substituted benzylsulfonium salts and the like.
Specific examples thereof include, for example, 4-acetophenyldimethylsulfonium hexafluoroantimonate, 4-acetoxyphenyldimethylsulfonium hexafluoroarsenate, dimethyl-4- (benzyloxycarbonyloxy) phenylsulfonium hexafluoroantimony as alkylsulfonium salts. Dimethyl-4- (benzoyloxy) phenylsulfonium hexafluoroantimonate, dimethyl-4- (benzoyloxy) phenylsulfonium hexafluoroarsenate, dimethyl-3-chloro-4-acetoxyphenylsulfonium hexafluoroantimonate, etc .;
Benzyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, benzyl-4-hydroxyphenylmethylsulfonium hexafluorophosphate, 4-acetoxyphenylbenzylmethylsulfonium hexafluoroantimonate, benzyl-4-methoxyphenylmethylsulfonium hexanium as benzylsulfonium salts Fluoroantimonate, benzyl-2-methyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, benzyl-3-chloro-4-hydroxyphenylmethylsulfonium hexafluoroarsenate, 4-methoxybenzyl-4-hydroxyphenylmethylsulfonium hexa Fluorophosphate, etc .;

Dibenzyl-4-hydroxyphenylsulfonium hexafluoroantimonate, dibenzyl-4-hydroxyphenylsulfonium hexafluoroantimonate, 4-acetoxyphenyldibenzylsulfonium hexafluoroantimonate, dibenzyl-4-methoxyphenylsulfonium hexafluoroantimonate as dibenzylsulfonium salts Dibenzyl-3-chloro-4-hydroxyphenylsulfonium hexafluoroarsenate, dibenzyl-3-methyl-4-hydroxy-5-tert-butylphenylsulfonium hexafluoroantimonate, benzyl-4-methoxybenzyl-4-hydroxy Phenylsulfonium hexafluorophosphate, etc .;
P-Chlorobenzyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, p-nitrobenzyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, p-chlorobenzyl-4-hydroxyphenylmethylsulfonium hexafluoro as substituted benzylsulfonium salts Phosphate, p-nitrobenzyl-3-methyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, 3,5-dichlorobenzyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, o-chlorobenzyl-3-chloro-4 -Hydroxyphenylmethylsulfonium hexafluoroantimonate etc. can be mentioned, respectively.

Specific examples of the benzothiazonium salt include 3-benzylbenzothiazonium hexafluoroantimonate, 3-benzylbenzothiazonium hexafluorophosphate, 3-benzylbenzothiazonium tetrafluoroborate, 3- (p- Benzylbenzothiazonium such as methoxybenzyl) benzothiazonium hexafluoroantimonate, 3-benzyl-2-methylthiobenzothiazonium hexafluoroantimonate, 3-benzyl-5-chlorobenzothiazonium hexafluoroantimonate Salt.
Of these, sulfonium salts and benzothiazonium salts are preferably used, particularly 4-acetoxyphenyldimethylsulfonium hexafluoroarsenate, benzyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, 4-acetoxyphenylbenzylmethylsulfonium hexanium. Fluoroantimonate, dibenzyl-4-hydroxyphenylsulfonium hexafluoroantimonate, 4-acetoxyphenylbenzylsulfonium hexafluoroantimonate, and 3-benzylbenzothiazolium hexafluoroantimonate are preferably used.
Examples of these commercially available products include Sun-Aid SI-L85, SI-L110, SI-L145, SI-L150, SI-L160 (manufactured by Sanshin Chemical Industry Co., Ltd.).
The proportion of the component [D] used is preferably 20 parts by weight or less, more preferably 5 parts by weight or less with respect to 100 parts by weight of the copolymer [A]. When the amount used exceeds 20 parts by weight, precipitates may be deposited in the coating film forming step, which may hinder the coating film formation.

Examples of the polymerizable compound [E] having at least one ethylenically unsaturated double bond (hereinafter sometimes referred to as “E component”) include monofunctional (meth) acrylate and bifunctional (meth) acrylate. Alternatively, trifunctional or higher functional (meth) acrylates can be preferably exemplified.
Examples of the monofunctional (meth) acrylate include 2-hydroxyethyl (meth) acrylate, carbitol (meth) acrylate, isobornyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, and 2- (meth) acryloyloxyethyl. And 2-hydroxypropyl phthalate. As these commercial products, for example, Aronix M-101, M-111, M-114 (above, manufactured by Toagosei Co., Ltd.), KAYARAD TC-110S, TC-120S (above, Nippon Kayaku Co., Ltd.) ) Co., Ltd.), Biscoat 158, 2311 (above, manufactured by Osaka Organic Chemical Industry Co., Ltd.).

  Examples of the bifunctional (meth) acrylate include ethylene glycol (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, polypropylene glycol di (meth) acrylate, Examples include tetraethylene glycol di (meth) acrylate, bisphenoxyethanol full orange acrylate, and bisphenoxyethanol full orange acrylate. As these commercial products, for example, Aronix M-210, M-240, M-6200 (above, manufactured by Toagosei Co., Ltd.), KAYARAD HDDA, HX-220, R-604 (above, Nippon Kayaku) Medicine Co., Ltd.), Viscoat 260, 312 and 335HP (above, Osaka Organic Chemical Industries, Ltd.).

  Examples of the trifunctional or higher functional (meth) acrylate include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tri ((meth) acryloyloxyethyl) phosphate, and pentaerythritol tetra (meth) acrylate. , Dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate and the like, and as commercially available products thereof, for example, Aronix M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060 (above, manufactured by Toagosei Co., Ltd.), KAYARAD TMPTA, DPHA, DPCA-20, DPCA-30, DPCA-60, DPCA-120 (Nippon Kayaku Co., Ltd.), screw Over DOO 295, the 300, the 360, the GPT, said 3PA, the 400 (manufactured by Osaka Organic Chemical Industry Ltd.) and the like.

Of these, a tri- or higher functional (meth) acrylate is preferably used, and among them, trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, and dipentaerythritol hexa (meth) acrylate are particularly preferable.
These monofunctional, bifunctional, or trifunctional or higher (meth) acrylates are used alone or in combination. [E] The use ratio of the component is preferably 50 parts by weight or less, more preferably 30 parts by weight or less with respect to 100 parts by weight of the copolymer [A].
By containing the component [E] at such a ratio, the heat resistance and surface hardness of the protrusions and / or spacers obtained from the radiation-sensitive resin composition of the present invention can be improved. If the amount used exceeds 50 parts by weight, film roughening may occur in the step of forming a coating film of the radiation-sensitive resin composition on the substrate.

The epoxy resin other than the above [F] copolymer [A] (hereinafter sometimes referred to as “F component”) is not limited as long as the compatibility is not affected, but is preferably a bisphenol A type. Epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, cycloaliphatic epoxy resins, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, heterocyclic epoxy resins, resins obtained by (co) polymerization of glycidyl methacrylate, etc. Can be mentioned. Of these, bisphenol A type epoxy resin, cresol novolac type epoxy resin, glycidyl ester type epoxy resin and the like are preferable.
The proportion of the component [F] used is preferably 30 parts by weight or less with respect to 100 parts by weight of the copolymer [A]. By containing the component [F] at such a ratio, the heat resistance and surface hardness of the protrusions and / or spacers obtained from the radiation-sensitive resin composition of the present invention can be further improved. When this ratio exceeds 30 parts by weight, the film thickness uniformity of the coating film may be insufficient when a coating film of the radiation sensitive resin composition is formed on the substrate.
The copolymer [A] can also be referred to as an “epoxy resin”, but differs from the [F] component in that it has alkali solubility.

In the radiation-sensitive resin composition of the present invention, the above [G] surfactant can be used in order to further improve the coating property. As the [G] surfactant that can be used here, fluorine-based surfactants, silicone-based surfactants, and nonionic surfactants can be suitably used.
Specific examples of the fluorosurfactant include 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether. , Octaethylene glycol di (1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol (1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di (1,1 , 2,2-tetrafluorobutyl) ether, hexapropylene glycol di (1,1,2,2,3,3-hexafluoropentyl) ether, sodium perfluorododecyl sulfonate, 1,1,2,2,8 , 8,9,9,10,10-decafluorododecane, 1,1,2,2,3,3-hexafluorodecane, etc. Sodium sulfonates; fluoroalkyloxyethylene ethers; fluoroalkylammonium iodides, fluoroalkylpolyoxyethylene ethers, perfluoroalkylpolyoxyethanols; perfluoroalkylalkoxylates; fluorinated alkyl esters be able to. These commercial products include BM-1000, BM-1100 (manufactured by BM Chemie), MegaFuck F142D, F172, F173, F183, F178, F191, F191 (and above, Dainippon Ink). Chemical Industries, Ltd.), Fluorad FC-170C, FC-171, FC-430, FC-431 (above, manufactured by Sumitomo 3M), Surflon S-112, S-113, S-131, S-141, S-145, S-382, SC-101, SC-102, SC-103, SC-104, SC-105, SC-106 (manufactured by Asahi Glass Co., Ltd.) ), F-top EF301, 303, 352 (manufactured by Shin-Akita Kasei Co., Ltd.), SH-28PA, SH-190, SH-193, SZ-6032, SF-8428, D -57, DC-190 (manufactured by Toray Silicone Co., Ltd.), and the like.

  Examples of the silicone surfactant include Toray Silicone DC3PA, DC7PA, SH11PA, SH21PA, SH28PA, SH29PA, SH30PA, SH30PA, FS-1265-300 (above, Toray Dow Corning Silicone Co., Ltd.) ), TSF-4440, TSF-4300, TSF-4445, TSF-4446, TSF-4460, TSF-4442 (above, manufactured by GE Toshiba Silicone Co., Ltd.) and the like. Can do.

Examples of the nonionic surfactant include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and polyoxyethylene oleyl ether; polyoxyethylene octyl phenyl ether, polyoxyethylene nonyl phenyl ether Polyoxyethylene aryl ethers such as polyoxyethylene dilaurate, polyoxyethylene dialkyl esters such as polyoxyethylene distearate, etc .; (meth) acrylic acid copolymer polyflow Nos. 57 and 95 (Kyoeisha Chemical Co., Ltd.) ))) Can be used.
These surfactants can be used alone or in combination of two or more.
These [G] surfactants are preferably used in an amount of 5 parts by weight or less, more preferably 2 parts by weight or less based on 100 parts by weight of the copolymer [A]. [G] If the amount of the surfactant used exceeds 5 parts by weight, the coating film may be easily formed when the coating film is formed on the substrate.

  In the radiation-sensitive resin composition of the present invention, [H] adhesion assistant can also be used to improve the adhesion to the substrate. As such [H] adhesion assistant, a functional silane coupling agent is preferably used, and examples thereof include a silane coupling agent having a reactive substituent such as a carboxyl group, a methacryloyl group, an isocyanate group, and an epoxy group. . Specifically, trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane and the like. Such [H] adhesion assistant is preferably used in an amount of 20 parts by weight or less, more preferably 10 parts by weight or less, based on 100 parts by weight of the copolymer [A]. In the case where the amount of the adhesion assistant exceeds 20 parts by weight, there may be a case where a development residue is likely to occur in the development process.

The [I] crosslinking agent forms a crosslinked structure between molecules of the specific alkali-soluble resin that is the component [A]. Examples of such crosslinking agents include condensation products of urea and formaldehyde (hereinafter also referred to as “urea-formaldehyde condensation products”), condensation products of melamine and formaldehyde (hereinafter referred to as “melamine-formaldehyde condensation products”). Also, methylol urea alkyl ethers and methylol melamine alkyl ethers obtained from these condensation products and alcohols can be used.
Specific examples of the urea-formaldehyde condensation product include monomethylol urea and dimethylol urea.
Specific examples of the melamine-formaldehyde condensation product include hexamethylol melamine. In addition to this, a product in which melamine and formaldehyde are partially condensed may be used.
The methylol urea alkyl ethers are obtained by reacting alcohols with some or all of the methylol groups in the urea-formaldehyde condensation product. Specific examples thereof include monomethylol urea methyl ether and dimethylol urea methyl. Examples include ether.
The methylol melamine alkyl ethers are obtained by reacting alcohols such as methyl alcohol and n-butyl alcohol with some or all of hydroxymethyl groups in the melamine-formaldehyde condensation product. Hexamethylol melamine hexamethyl ether, hexamethylol melamine hexa n-butyl ether, a compound having a structure in which the hydrogen atom of the amino group of melamine is substituted with a hydroxymethyl group and a methoxymethyl group, and the hydrogen atom of the amino group of melamine is butoxy Examples thereof include compounds having a structure substituted with a methyl group and a methoxymethyl group.
Among these, methylol melamine alkyl ethers are preferably used, and as commercially available products of such methylol melamine alkyl ethers, “Cymel 300”, “Cymel 370”, “Cymel 232” manufactured by Mitsui Cytec Co., Ltd. , “My Coat 505” and the like.
The proportion of component [I] used is preferably 50 parts by weight or less, more preferably 30 parts by weight or less, relative to 100 parts by weight of component [A].
When this ratio exceeds 50 parts by weight, the thickness of the unirradiated portion of the coating film in the development process may be significantly reduced, and the transparency of the resulting coating film may be reduced.

Radiation-sensitive resin composition The radiation-sensitive resin composition of the present invention is prepared by uniformly mixing the above-mentioned copolymer [A] and [B] components and other components optionally added as described above. Is done. Usually, the radiation sensitive resin composition of the present invention is dissolved in a suitable solvent and used in a solution state. For example, the radiation sensitive resin composition in a solution state can be prepared by mixing the copolymer [A] and [B] components and other optionally added components in a predetermined ratio.
As a solvent used for the preparation of the radiation sensitive resin composition of the present invention, each component of the copolymer [A] and [B] components and other components optionally blended is uniformly dissolved, and each component Those that do not react with.

As such a solvent, the thing similar to what was illustrated as a solvent which can be used in order to manufacture copolymer [A] mentioned above can be mentioned.
Of these solvents, glycol ethers, ethylene glycol alkyl ether acetates, esters and diethylene glycols are preferred from the viewpoints of solubility of each component, reactivity with each component, ease of film formation, and the like. Used. Of these, diethylene glycol ethyl methyl ether, diethylene glycol dimethyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, methyl methoxypropionate, and ethyl ethoxypropionate can be particularly preferably used.

When the radiation-sensitive resin composition of the present invention is prepared in a solution state, components other than the solvent in the solution (that is, the total of the copolymer [A] and [B] components and other components optionally added) The ratio of (amount) can be arbitrarily set depending on the purpose of use, the value of the desired film thickness, etc., but is usually 5 to 50% by weight, preferably 10 to 40% by weight, more preferably 15 to 35% by weight. %.
The composition solution thus prepared can be used after being filtered using a Millipore filter having a pore size of about 0.2 μm.

Formation of protrusions and / or spacers Next, a method for forming the protrusions and / or spacers of the present invention using the radiation-sensitive resin composition of the present invention will be described. The method for forming protrusions and / or spacers of the present invention includes at least the following steps.
(1) The process of forming the coating film of the radiation sensitive composition of this invention on a board | substrate.
(2) A step of irradiating at least a part of the coating film with radiation.
(3) Development process.
(4) Heating process.

(1) Step of forming a coating film of the radiation-sensitive composition of the present invention on a substrate In the step of (1) above, the solvent is removed by applying the composition solution of the present invention to the substrate surface and performing pre-baking. The coating of the radiation sensitive resin composition is formed by removing.
Examples of the substrate that can be used in the present invention include a glass substrate, a silicon wafer, and a substrate on which various metals are formed.
The method of applying the composition solution is not particularly limited, and an appropriate method such as a spray method, a roll coating method, a spin coating method (spin coating method), a slit die coating method, a bar coating method, an ink jet method, or the like is employed. In particular, spin coating and slit die coating are preferred. Prebaking conditions vary depending on the type of each component, the proportion of use, and the like. For example, it can be set at 60 to 110 ° C. for about 30 seconds to 15 minutes.

(2) Step of irradiating at least a part of the coating film In the step (2), the developer is irradiated with radiation through a mask having a predetermined pattern on the formed coating film. The patterning is performed by removing the irradiated portion using the development process. Examples of the radiation used at this time include ultraviolet rays, far ultraviolet rays, X-rays, and charged particle beams.
Examples of the ultraviolet rays include g-line (wavelength 436 nm), i-line (wavelength 365 nm), and the like. Examples of the far ultraviolet rays include KrF excimer laser. Examples of X-rays include synchrotron radiation. Examples of the charged particle beam include an electron beam.
Among these, ultraviolet rays are preferable, and radiation including g-line and / or i-line is particularly preferable.
As a pattern mask used for exposure and an exposure operation, (a) a method of performing exposure once using one type of photomask having both patterns of a protruding portion and a spacer portion (the smaller the portion to be masked, the more light leaks) (B) A difference in height is formed in combination with the melt flow during baking.) (B) A photomask having only a protruding portion and a photomask having only a spacer portion. Any of the methods of using and exposing twice may be used. In addition, as the pattern mask used in the method (A), it is possible to use a mask having different transmittances between the protruding portion and the spacer portion. However, in the present invention, depending on circumstances, only one of the protrusion and the spacer may be formed on the substrate. In this case, (c) a photomask having only the protrusion and a photomask having only the spacer. A method of performing exposure once using either one is employed. In this case, the remaining protrusions or spacers necessary for the vertical alignment type liquid crystal display element are formed by a conventionally known method.

(3) Development process Developers used in the development process include sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, ammonia, ethylamine, n-propylamine, diethylamine, diethylaminoethanol, di- n-propylamine, triethylamine, methyldiethylamine, dimethylethanolamine, triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, pyrrole, piperidine, 1,8-diazabicyclo [5,4,0] -7-undecene, An aqueous solution of an alkali such as 1,5-diazabicyclo [4,3,0] -5-nonane can be used. Further, an aqueous solution obtained by adding an appropriate amount of a water-soluble organic solvent such as methanol or ethanol or a surfactant to the alkaline aqueous solution described above, or various organic solvents that dissolve the composition of the present invention can be used as a developing solution. . Furthermore, as a developing method, an appropriate method such as a liquid piling method, a dipping method, a rocking dipping method, a shower method, or the like can be used. The development time at this time is usually 30 to 180 seconds, although it varies depending on the composition of the composition.

(4) Heating step (3) Performed as described above (3) After the development step, the patterned thin film is preferably rinsed, for example, by washing with running water, and more preferably irradiated with radiation from a high-pressure mercury lamp or the like. (After post-exposure), the 1,2-quinonediadito compound remaining in the thin film is decomposed, and then the thin film is heated (post-baked) with a heating device such as a hot plate or an oven. Then, the thin film is cured. The exposure amount in the post-exposure step is preferably about 2,000 to 5,000 J / m ² . Moreover, the baking temperature in this hardening process is 120-250 degreeC, for example. Although heating time changes with kinds of heating apparatus, for example, when performing heat processing on a hotplate, it can be set to 30 to 90 minutes when performing heat processing in oven, for example. At this time, a step baking method or the like in which a heating process is performed twice or more can be used.
In this way, a patterned thin film corresponding to the target protrusion and / or spacer can be formed on the surface of the substrate.

  The height of the protrusions thus formed is usually 0.1 to 3.0 μm, preferably 0.5 to 2.0 μm, particularly preferably 1.0 to 1.5 μm, and the height of the spacer The thickness is usually 1 to 10 μm, preferably 2 to 8 μm, particularly preferably 3 to 5 μm.

  According to the method for forming protrusions and / or spacers for the vertical alignment type liquid crystal display element of the present invention, fine processing is possible, and the shape and size (height and bottom dimensions) can be easily controlled, and the pattern shape A vertical alignment type liquid crystal display element capable of stably forming fine protrusions and spacers excellent in heat resistance, solvent resistance, transparency, etc. with good productivity and excellent in orientation, voltage holding ratio, etc. Can bring.

  The radiation-sensitive resin composition for forming protrusions and / or spacers for the vertical alignment type liquid crystal display element of the present invention has excellent resolution and residual film ratio, and has a pattern shape, heat resistance, solvent resistance, and transparency. Thus, it is possible to form a vertical alignment type liquid crystal display element having excellent alignment and voltage holding ratio. In addition, the method for forming the protrusions and / or spacers for the vertical alignment type liquid crystal display element of the present invention can be finely processed, and the shape and size (height, bottom dimension, etc.) can be easily controlled. Fine projections and spacers excellent in heat resistance, solvent resistance, transparency, etc. can be stably formed with good productivity, and a vertical alignment type liquid crystal display element excellent in orientation, voltage holding ratio, etc. is provided. be able to.

The present invention will be described more specifically with reference to synthesis examples and examples. However, the present invention is not limited to the following examples.
Synthesis example of copolymer [A]

Synthesis example 1
A flask equipped with a condenser and a stirrer was charged with 7 parts by weight of 2,2′-azobis (2,4-dimethylvaleronitrile) and 220 parts by weight of propylene glycol monomethyl ether acetate. Subsequently, 22 parts by weight of methacrylic acid, 38 parts of dicyclopentanyl methacrylate, 40 parts by weight of 3- (methacryloyloxymethyl) -2-phenyloxetane and 1.5 parts of α-methylstyrene dimer were charged and gently stirred while substituting nitrogen. I started. The temperature of the solution was raised to 70 ° C. and heated at this temperature for 5 hours to obtain a polymer solution containing the copolymer [A-1]. The obtained polymer solution had a solid content concentration of 31.2%, a weight average molecular weight of the polymer of 18500, and a molecular weight distribution (ratio of weight average molecular weight / number average molecular weight) of 1.8. In addition, a weight average molecular weight and a number average molecular weight are polystyrene conversion average molecular weights measured using GPC (Gel permeation chromatography (HLC-8020 manufactured by Tosoh Corporation)).

Synthesis example 2
A flask equipped with a condenser and a stirrer was charged with 7 parts by weight of 2,2′-azobis (2,4-dimethylvaleronitrile) and 220 parts by weight of propylene glycol monomethyl ether acetate. Subsequently, 20 parts by weight of styrene, 25 parts by weight of methacrylic acid, 20 parts of phenylmaleimide, 35 parts by weight of 3- (methacryloyloxymethyl) -3-ethyloxetane, and 1.5 parts of α-methylstyrene dimer were charged slowly while replacing with nitrogen. Stirring started. The temperature of the solution was raised to 70 ° C. and heated at this temperature for 5 hours to obtain a polymer solution containing the copolymer [A-2]. The resulting polymer solution had a solid content concentration of 31.0%, the polymer had a weight average molecular weight of 21,000 and a molecular weight distribution of 2.1.

Synthesis example 3
A flask equipped with a condenser and a stirrer was charged with 7 parts by weight of 2,2′-azobis (2,4-dimethylvaleronitrile) and 220 parts by weight of propylene glycol monomethyl ether acetate. Subsequently, 28 parts by weight of styrene, 18 parts by weight of methacrylic acid, and 54 parts by weight of 3- (methacryloyloxymethyl) -3-ethyloxetane were charged, and gently stirring was started while replacing with nitrogen. The temperature of the solution was raised to 70 ° C. and heated at this temperature for 5 hours to obtain a polymer solution containing the copolymer [A-3]. The obtained polymer solution had a solid content concentration of 31.2%, a weight average molecular weight of 23,000, and a molecular weight distribution of 2.6.

Example 1
[Preparation of radiation-sensitive resin composition]
The solution containing the polymer [A-1] as the [A] component synthesized in Synthesis Example 1 above, as the amount corresponding to 100 parts by weight (solid content) of the polymer [A-1], and the component [B] 4,4 ′-[1- [4- [1- [4-Hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol (1.0 mol) and 1,2-naphthoquinonediazide-5-sulfonic acid chloride (2.0 mol) of a condensate (B-1) (30 parts by weight) was mixed and dissolved in diethylene glycol ethyl methyl ether so that the solid content concentration was 30% by weight, and then a membrane filter having a diameter of 0.2 μm. The solution (S-1) of the radiation sensitive resin composition was prepared by filtration.

Examples 2-3
In Example 1, it carried out similarly to Example 1 except having used the kind and quantity as described in Table 1 as [A] component, and [B] component and [C] component, and was sensitive to radiation. Solutions (S-2) to (S-3) of the conductive resin composition were prepared.
In Table 1, the abbreviations of the components indicate the following compounds.
(B-1): 4,4 ′-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol (1.0 mol) and 1,2-naphthoquinonediazide Condensate (B-2) of -5-sulfonic acid chloride (2.0 mol): 4,4 ′-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene ] Condensate (C-1) of bisphenol (1.0 mol) and 1,2-naphthoquinonediazide-5-sulfonic acid chloride (1.0 mol): poly (p-hydroxystyrene) (Nippon Soda Co., Ltd.) “VP-2500”)

Using the radiation-sensitive resin composition prepared as described above, protrusions and spacers were formed as follows, and various characteristics were evaluated.
[Formation of protrusions and spacers]
The composition was applied onto a silicon substrate using a spinner and then pre-baked on a hot plate at 90 ° C. for 2 minutes to form a coating film having a thickness of 4.0 μm. After that, exposure is performed with a PLA-501F exposure machine (extra-high pressure mercury lamp) manufactured by Canon Inc. through a photomask having a remaining pattern of 5 μm width corresponding to the protruding portion and a remaining pattern of 30 μm dots corresponding to the spacer portion. Exposure was carried out by changing the time. Thereafter, development was carried out for 100 seconds using the developer type, developer concentration, and development method described in the table, followed by washing with pure water for 1 minute and drying to form a pattern on the wafer. At this time, the exposure amount required to form a 5 μm-width remaining pattern corresponding to the protruding portion and a 30 μm-dot remaining pattern corresponding to the spacer portion was measured. This value is shown in the table as sensitivity. It can be said that the sensitivity is good when this value is 3500 J / m ² or less.

[Evaluation of remaining film ratio before and after development]
The composition was applied on a silicon substrate using a spinner and then pre-baked on a hot plate at 90 ° C. for 2 minutes to form a coating film having a thickness of 3.0 μm. The obtained coating film was exposed with a PLA-501F exposure machine (extra-high pressure mercury lamp) manufactured by Canon Inc. so that the integrated irradiation amount was 3,000 J / m ^2, and the film thickness of the obtained film was measured. . Thereafter, development was performed for 100 seconds at 25 ° C. by a liquid piling method using a TMAH 0.4 wt% developer. The film thickness of the film obtained by washing with pure water for 1 minute and drying was measured, and the remaining film ratio was calculated from the film thickness ratio before and after development. The results are shown in Table 2. When this value is 88% or more, the remaining film rate can be said to be good.

(Evaluation of cross-sectional shape of protrusions)
When the cross-sectional shape A, B or C of the protrusion is defined as follows, the cross-sectional shape of the formed protrusion is observed with a scanning electron microscope, and the case of A or B is “good” and the case of C is “ “Bad”. The cross-sectional shapes A, B and C of the protrusions are typically as illustrated in FIG.
A: When the dimension of the bottom is more than 5 μm and 7 μm or less,
B: When the bottom dimension exceeds 7 μm,
C: A trapezoidal shape regardless of the size of the bottom.

[Evaluation of spacer cross-section]
When the cross-sectional shapes A, B and C of the spacer are defined as follows, the cross-sectional shape of the formed spacer is observed with a scanning electron microscope, and the case of A or C is “good” and the case of B is “ “Bad”. The cross-sectional shapes A, B and C of the spacer are schematically as illustrated in FIG.
A: When the dimension of the bottom is more than 30 μm and not more than 36 μm,
B: When the bottom dimension exceeds 36 μm,
C: A trapezoidal shape regardless of the size of the bottom.

[Evaluation of solvent resistance]
The composition was applied on a silicon substrate using a spinner and then pre-baked on a hot plate at 90 ° C. for 2 minutes to form a coating film having a thickness of 3.0 μm. The obtained coating film was exposed to a cumulative irradiation amount of 3,000 J / m ² with a PLA-501F exposure machine (extra-high pressure mercury lamp) manufactured by Canon Inc., and this silicon substrate was exposed to 220 in a clean oven. A cured film was obtained by heating at 0 ° C. for 1 hour. The film thickness (T1) of the obtained cured film was measured. And after immersing the silicon substrate in which this cured film was formed in dimethyl sulfoxide temperature-controlled at 70 degreeC for 20 minutes, the film thickness (t1) of the said cured film was measured, and the film thickness change rate by immersion { | T1-T1 | / T1} × 100 [%] was calculated. The results are shown in Table 2. When this value is 5% or less, the solvent resistance is good.
In the evaluation of solvent resistance, since the patterning of the film to be formed is unnecessary, the radiation irradiation process and the development process were omitted, and only the coating film forming process, the post-baking process, and the heating process were performed for evaluation.

[Evaluation of heat resistance]
A cured film was formed in the same manner as the evaluation of the solvent resistance, and the film thickness (T2) of the obtained cured film was measured. Next, this cured film substrate was additionally baked in a clean oven at 240 ° C. for 1 hour, and then the film thickness (t2) of the cured film was measured, and the film thickness change rate {| t2-T2 | / T2 due to the additional baking. } × 100 [%] was calculated. The results are shown in Table 2. When this value is 5% or less, the heat resistance is good.

[Evaluation of transparency]
In the evaluation of the solvent resistance, a cured film was formed on the glass substrate in the same manner except that a glass substrate “Corning 7059 (manufactured by Corning)” was used instead of the silicon substrate. The light transmittance of the glass substrate having this cured film was measured at a wavelength in the range of 400 to 800 nm using a spectrophotometer “150-20 type double beam (manufactured by Hitachi, Ltd.)”. Table 2 shows the values of the minimum light transmittance at that time. When this value is 90% or more, it can be said that the transparency is good.

[Evaluation of orientation and voltage holding ratio]
Using the composition solution, protrusions and spacers were formed on the electrode surface of a glass substrate having an ITO (tin-doped indium oxide) film as an electrode in the same manner as described above. Thereafter, AL1H659 (trade name, manufactured by JSR Co., Ltd.) as a liquid crystal alignment agent was applied to a glass substrate on which protrusions and spacers were formed with a liquid crystal alignment film coating printer, and then dried at 180 ° C. for 1 hour. A film having a thickness of 0.05 μm was formed. Moreover, AL1H659 as a liquid crystal aligning agent is apply | coated to the electrode surface of another glass substrate which has an ITO film | membrane with a printer for liquid crystal aligning film application | coating, and it dries at 180 degreeC for 1 hour, and forms a 0.05-micrometer-thick film. Formed.
Next, an epoxy resin adhesive with a glass fiber having a diameter of 5 μm is applied to the outer surfaces of the liquid crystal alignment films of both substrates obtained by screen printing, and the substrates are stacked and bonded so that the liquid crystal alignment film surfaces face each other. After that, the adhesive was cured. Then, after filling the liquid crystal MLC-6608 (trade name) manufactured by Merck Co., Ltd. between both substrates from the liquid crystal injection port, and sealing the liquid crystal injection port with an epoxy-based adhesive, a polarizing plate is placed on the outer surfaces of both substrates. The vertically aligned liquid crystal display elements were manufactured by pasting them so that their deflection directions were orthogonal. FIG. 2 schematically shows a longitudinal sectional view of the obtained vertical alignment type liquid crystal display element.
Next, the orientation and voltage holding ratio of the obtained vertical alignment type liquid crystal display element were evaluated as follows.

In the evaluation of the orientation, when a voltage was turned on / off, whether or not an abnormal domain was generated in the liquid crystal cell was observed with a polarizing microscope. In evaluating the voltage holding ratio, a voltage of 5 V was applied to the liquid crystal display element, the circuit was opened, the holding voltage after 16.7 milliseconds was measured, and the ratio to the applied voltage (5 V). Was calculated. When the value is 98% or more, it can be said that it is good.

It is a schematic diagram which illustrates the cross-sectional shape of protrusion and a spacer.

It is a schematic diagram which illustrates the cross-sectional shape of the vertical alignment type liquid crystal display element which has a processus | protrusion and a spacer. 1 spacer, 2 protrusions, 3 liquid crystal, 4 liquid crystal alignment film, 5 color filter, 6 glass substrate

Claims (6)

[A] (a1) unsaturated carboxylic acid and / or unsaturated carboxylic acid anhydride,
(A2) a compound represented by general formula (I) or general formula (II),

Wherein R is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R ¹ is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R ² , R ³ , R ⁴ and R ⁵ are each It is independently a hydrogen atom, a fluorine atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group, or a perfluoroalkyl group having 1 to 4 carbon atoms, and n is an integer of 1 to 6. ]
And (a3) a copolymer obtained by copolymerizing an olefinically unsaturated compound other than (a1) and (a2),
[B] A radiation-sensitive resin composition for forming protrusions and / or spacers for a vertical alignment type liquid crystal display device, comprising a 1,2-quinonediazide compound. The radiation-sensitive resin composition for forming protrusions and / or spacers for a vertical alignment type liquid crystal display device according to claim 1, further comprising [C] a polyphenol compound. A protrusion for a vertical alignment type liquid crystal display element formed from the radiation-sensitive resin composition according to claim 1. A spacer for a vertical alignment type liquid crystal display element formed from the radiation-sensitive resin composition according to claim 1. A vertical alignment type liquid crystal display device comprising the protrusion according to claim 3 and / or the spacer according to claim 4. A method for forming protrusions and / or spacers, comprising at least the following steps.
(1) The process of forming the coating film of the radiation sensitive composition of Claim 1 on a board | substrate.
(2) A step of irradiating at least a part of the coating film with radiation.
(3) Development process.
(4) Heating process.

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