201229185 六、發明說明： 【發明所屬之技術領域】 技術領域 本發明涉及一種各向異性導電膜，更具體地，涉及一 種包括依次層疊在基膜上的第一絕緣黏合劑層、導電黏合 劑層和第二絕緣黏合劑層的各向異性導電膜，其中所述第二 絕緣黏合劑層在uot：的熔融黏度對所述第一絕緣黏合劑層 在150C的熔融黏度之比為i丨：1至1〇 : 1。本發明的各向異 性導電膜提供了良好的連接性能，並非常適於預壓制。 背景技術 各向異性導電膜是指其中分散有導電顆粒如金屬顆粒 或金屬塗覆的塑膠顆粒的膜狀黏合劑。各向異性導電膜廣 泛應用於各種應用領域，例如平板顯示器領域中的模組電 路連接以及半導體領域中的元件裝配。當各向異性導電膜 插入待連接的電路板之間，隨後在特定條件下熱壓制時， 電路板的電路端子通過導電顆粒電連接，並使絕緣黏合劑 樹脂填充相鄰的電路端子之間的空隙，以使得導電顆粒彼 此獨立，從而實現電路端子之間的高絕緣性能。 隨著液晶顯示器工業發展及最新增長，要求各向異眭 導電膜具有用於模組連續製造的可加工性和高電路連接性 能。因此，各向異性導電膜應對多種電路元件具有良好的 附著力，具有用於精細電路的高可靠性和用於後續工序的 適用性。 201229185 具有單層或雙層結構的各向異性導電膜在滿足以上要 求上受限。為了滿足它們的固有功能和對後續加工的適用 性，需要具有三層結構的各向異性導電膜。此外，為了實 現對預壓制中的加壓工序的適用性，控制各向異性導電膜 的組成層的熔融黏度是至關重要的。 具有三層結構的常規各向異性導電膜能同時保證相鄰 電路端子之間的絕緣性能和連接電路端子之間的導電性， 但它們在對加壓工序的適用性方面不令人滿意。 【發明内容】 發明概要 本發明的一方面提供了一種各向異性導電膜。在一個 實施方式巾，所述各向異性導_包括依次層疊在基膜上 的第-絕緣黏合劑層'導電黏合劑層和第二絕緣黏合劑層， 其中所述第二絕雜合騎在挪⑽紐純對所述第一 絕緣黏合劑層在15此的溶融黏度之比為hl: mi0:卜 個實施方式中’所述第二絕緣黏合劑層在^ 的 熔融黏度對所述第-絕_合劑層幻贼的熔融黏度之 比為 1.5 : 1 至3.5 : 1。 圖式簡單說明 由以下結合附圖的詳細說明，本發明的以上和其它方 面、特徵和優點將變得明顯，其中·· 第1圖不出了根據本發明示例性實施方式的各向異性 導電膜的結構。在第1圖中，標記1、2、3和4分別表示基膜、 第-絕緣黏合劑層、導電耐黏合劑層和第二絕緣黏合劑層。 201229185 第2圖示出了最終壓制後的連接部。 第3圖示出了預壓制前的各向異性導電膜。 C實施冷式j 較佳實施例之詳細說明 現將參照附圖詳細說明本發明的實施方式。 本發明的各方面提供了一種各向異性導電膜，所述各 向異性導電犋包括依次層疊在基膜上的第一絕緣黏合劑 層、導電黏合劑層和第二絕緣黏合劑層，其中所述第二絕 緣黏合劑層的在15(TC熔融黏度對所述第一絕緣黏合劑層 在150°c的熔融黏度之比為1.1 : 1至10 : 1。 如果炼融黏度比例中第二絕緣層的熔融黏度少於 ·>*· u ’會降低最終壓制後導電顆粒的殘留率。同時，如果熔 ，'- 融黏度比例中第二絕緣層的熔融黏度大於10，基本不能控 制流動性，導致外觀特性變差(例如氣泡形成）。優選地，第 二絕緣黏合劑層在15 〇 °c的熔融黏度對所述第一絕緣黏合 劑層在150 C的炫融黏度之比為1.5 : 1至3.5 : 1。 第一絕緣黏合劑層、第二絕緣黏合劑層和導電黏合劑 層中每一層的熔融黏度均可通過根據】15 K7210的流動性 測试法’用流動測試儀（High-Chemical Flow Tester CFT500A，Shimazu，平行板型）在9.8MPa的負荷、i(i/s)的 剪切速率和15〇 C的溫度下測定1〇〇至2〇〇pm厚的膜樣品層 的溶融黏度來確定。 上述各向異性導電膜的組成層的炼融點度可按以下順 序增加：導電黏合劑層>第二絕緣黏合劑層>第一絕緣黏合 5 201229185 劑層。優選地，第一絕緣黏合劑層在150。(3的熔融黏度：第 二絕緣黏合劑層在150°C的熔融黏度：導電黏合劑層在 150°C的熔融黏度可在1 : 1.1〜1〇 : ιι~20的範圍内。 第一絕緣黏合劑層在15(TC的熔融黏度可為1〇〇〇〇cps 或更小’導電黏合劑層在150°C的炫融黏度可為1〇〇〇〇至 lOOOOOcps，且第二絕緣黏合劑層在150。(：的熔融黏度可大 於10000cps。優選地，第一絕緣黏合劑層在150。(：的熔融黏 度可為5300至7500cps ’導電黏合劑層在i5〇t的熔融黏度 可為20000至80000cps，且第二絕緣黏合劑層在丨加它的熔 融黏度可為12000至18000cps。 各向異性導電膜的預壓制可使得第二絕緣黏合劑層與 第一電路端子如PCB端子接觸。在除去基膜後，可進行最 終壓制’使得第一絕緣黏合劑層與第二電路端子如c〇F端 子接觸。這些壓制能使第一電路端子與第二電路端子連接 以形成連接部。對於壓制條件沒有限制。例如，預壓制可 在1至2MPa、60至80°C"F進行1至2秒，且最終壓制可在2至 5MPa、180至190〇C下進行4至1〇秒。 在上述各向異性導電膜中，用等式丨計算導電顆粒的殘 留率可為至少10% : 導電顆粒殘留率（％) = (最終壓制後連接部單位面積 (mm2)的導電顆粒數量)/(預壓制前所述各向異性導電膜單 位面積(mm2)的導電顆粒數量） （1) 優選地，導電顆粒的殘留率為14至25 %。 第一絕緣黏合劑層可具有lpm或更小的厚度，導電黏 201229185 合劑層可具有4至8μιη的厚度，且第二絕緣黏合劑層可具有 8至14μηι的厚度。 以下將詳細解釋各向異性導電膜的組成層的組分。第 一和第二絕緣黏合劑層各自包括黏合劑體系、固化體系和 自由基引發劑，且導電黏合劑層包括黏合劑體系、固化體 系、自由基引發劑和導電顆粒。 (Α)黏合劑體系 熱塑性樹脂 黏合劑體系充當形成各向異性導電膜的必需基質。該 黏合劑體系可包括至少一種熱塑性樹脂。該熱塑性樹脂可 為選自由丙稀腈樹脂、苯氧基樹脂、丁二烯樹脂、丙稀酸 酯樹脂、胺甲酸酯、胺甲酸酯丙烯酸酯樹脂、聚醯胺樹脂、 烯烴樹脂、聚矽氧樹脂、腈丁二烯橡膠(NBR)樹脂以及它們 的混合物組成的組中的至少一種，但不限於此。 優選地，所述熱塑性樹脂的重均分子量為1000至 1000000g/mol。在此範圍内時，可得到適宜的膜強度，而 不發生相分離，並對被黏物保持良好附著力，從而防止黏 合強度的劣化。 聚胺甲酸酯丙烯酸酯樹脂 黏合劑體系可包括至少一種聚胺甲酸酯丙烯酸酯樹 脂。聚胺曱酸酯丙烯酸酯樹脂可通過共聚異氰酸酯、多元 醇和羥基（甲基）丙烯酸酯來製備。 上述異氰酸酯可為選自由芳族異氰酸酯、脂族異氰酸 酯、脂環族二異氰酸酯和它們的混合物組成的組中的至少 7 201229185 一種。這類異氰酸酯的實例包括四亞曱基―丨斗二異氰酸 酯、六亞甲基-1,6-二異氰酸酯、環亞己基二異氰酸酯、 亞曱基-雙(4-環己基異氰酸酯）、異佛酮二異氰酸酯、二苯 基曱烷二異氰酸酯和4,4’-亞曱基雙(環己基二異氰酸酯）。這 些異氰酸酯可單獨使用或以它們的兩種或更多種的混合物 使用。 所述多元醇可為選自由聚酯多元醇、聚醚多元醇、聚 碳酸酯多元醇和它們的混合物組成的組中的至少一種。該 多元醇可通過二羧酸化合物和二醇化合物的縮聚獲得。這 種一鼓酸的貫例包括但不限於破酸、戊二酸、間苯二曱 酸、己二酸、辛二酸、壬二酸、癸二酸(sebasic acid)、十二 烷二羧酸、六氫化鄰苯二甲酸、間苯二甲酸、對苯二甲酸、 鄰苯二曱酸、四氣鄰苯二甲酸、1>5_萘二羧酸、富馬酸、馬 來酸、衣康酸、檸康酸、曱基烏頭酸(methac〇nicacid)和四 氫化鄰苯二甲酸。這類二醇化合物的實例包括但不限於乙 二醇、丙二醇、1，3-丙二醇、ι，3-丁二醇、丨，4_丁二醇、込孓 戊二醇、1，6-己二醇、新戊二醇、二乙二醇、二丙二醇、三 乙一醇、一丁二醇、2-甲基-i，3-戍二醇、2,2,4-三甲基_l，3_ 戊二醇和l，4-環己烷二甲醇。適宜的聚醚多元醇的實例包括 仁不限於聚乙一醇、聚丙二醇、伸丁二醇和聚四乙二醇。 羥基（甲基）丙烯酸酯對異氰酸酯的摩爾比為〇 412 : 1。聚胺甲酸酯樹脂中多元醇的含量為7〇%或更低。聚胺曱 酸酯樹脂通過羥基（甲基）丙稀酸酯與聚胺甲酸酯的末端二 異氰酸酯基以0.M.2 ·· 1的摩爾比反應，並使醇與殘留的異 201229185 氰酸醋基反應來製備。 對於製備聚胺甲酸醋樹脂的聚合方法沒有特別限制。 加成4合通常能用作該聚合方法。適宜的催化劑如二月桂 酉文一丁錫可用於該聚合反應。該聚合反應可在7〇至⑺下 進行1至5小時。 (B)固化體系 固化體系被固化以保證各向異性導電膜的連接層之間 的黏合強度和連接可靠性。每種固化體系均可包括選自（甲 基）丙烯酸酯低聚物和（甲基）丙烯酸酯單體中的至少一種自 由基固化單元。 (甲基）丙烯酸酯低聚物 適用於固化體系的（曱基）丙烯酸酯低聚物的實例包括 但不限於環氧基（曱基）丙烯酸酯低聚物，其中間分子結構由 選自2- >臭鼠酿 '間本二盼、鄰苯二盼' 如雙紛a、雙紛ρ、 雙酚AD和雙酚S等雙酚、4,4’-二羥基聯苯和雙(4-羥基笨基) 醚中的骨架組成；和具有選自烷基、芳基、羥甲基、稀丙 基、脂環族基、鹵素（四溴雙酚A)和硝基中的至少一種基團 的（甲基）丙烯酸酯低聚物。 (甲基）丙烯酸酯單體 (甲基）丙烯酸酯單體可為選自由6-己二醇單（曱基）丙稀 酸酯、（曱基）丙烯酸-2-羥乙酯、（甲基）丙烯酸-2-羥丙酯、（甲 基）丙稀酸-2-經丁 S旨、2-輕基-3-本乳基丙基（甲基）丙稀酸酉盲 (2-hydroxy-3-phenyloxypropyl (meth)acrylate)、1,4-丁二醇 (曱基）丙稀酸醋、2-經基烧基（曱基）丙稀酿基鱗酸醋、4-經 9 201229185 基環己基（曱基）丙烯酸酯、新戊二醇單（甲基）丙烯酸酯、三 控曱基乙烧一（甲基）丙稀酸s旨、二經甲基丙烧二（曱基）丙稀 酸酯、季戊四醇三（甲基）丙烯酸酯、二季戊四醇五（甲基）丙 烯酸酯、季戊四醇六（曱基）丙烯酸酯、二季戊四醇六（曱基） 丙烯酸酯、甘油二（曱基）丙烯酸酯、四氫呋喃基（曱基）丙烯 酸酯、異癸基（甲基）丙烯酸酯、2-(2-乙氧基乙氧基）乙基（甲 基）丙烯酸酯、（甲基）丙烯酸十八烷酯 '(甲基）丙烯酸十二烷 酯、2-苯氧基乙基（曱基）丙烯酸酯、（曱基）丙烯酸異冰片酯、 (甲基）丙烯酸十三烷酯、乙氧基化的壬基笨酚（甲基）丙烯酸 酯、乙二醇二（甲基）丙烯酸酯、二乙二醇二（曱基）丙烯酸 酯、三乙二醇二（曱基）丙烯酸酯、四乙二醇二（甲基）丙烯酸 酯、聚乙二醇二（曱基）丙烯酸酯、1，3-丁二醇二（甲基）丙烯 酸酯、三丙二醇二（曱基）丙烯酸酯、乙氧基化的雙酚-A二（甲 基）丙烯酸酯、環己烷二曱醇二（曱基）丙烯酸酯、苯氧基四 乙二醇（曱基）丙烯酸酯、2-甲基丙烯醯氧基乙基磷酸酯、二 羥甲基三環癸烷二（甲基）丙烯酸酯、三羥甲基丙烷苯甲酸酯 丙烯酸酯、（曱基）丙烯酸二氧磷基乙酯（(meth)acrylic acid phosphoxy ethyl)、2-丙稀酿氧基乙基鄰苯二曱酸醋和它們 的組合組成的組中的至少一種，但不限於此。 (C)自由基引發劑 自由基引發劑可為選自光聚合引發劑、熱固化引發劑 和它們的組合中的至少一種。 這種光聚合引發劑的實例包括，但不限於二苯甲酮、 鄰苯甲醯苯曱酸曱酯、4-苯甲醯基-4-甲基二苯基硫醚、異 ⑧ 10 201229185 丙基噻噸酮、二乙基噻噸酮、4_二乙基苯曱酸乙酯、安息 香醚、安息香丙基醚、2-羥基-2-甲基_丨_苯基丙_丨_酮和二乙 氡基苯乙酮。這些光聚合引發劑可單獨使用或以它們的組 合使用。 這種熱固化引發劑的實例包括但不限於過氧化物和偶 氮引發劑。這些熱固化引發劑可單獨使用或以它們的組合 使用。作為過氧化物引發劑，可使用例如過氧化苯曱醯、 過氧化月桂醯、過氧化月桂酸叔丁酯和^ 3 四曱基丁基 過氧-2-乙基己酸醋。 (D)導電顆粒 導電顆粒用作填料’以賦予各向異性導電膜的導電黏 合劑層導電性能。 適用於導電黏合劑層的導電顆粒的實例包括但不限 於：金屬顆粒，如金、銀、鎳、銅、錫和焊料金屬顆粒； 石反顆粒；金屬塗覆的樹脂顆粒，如塗覆有金、举、鎳、銅、 錫和焊料金屬的苯代三聚氰胺、聚甲基丙烯酸曱醋 (PMMA)、丙烯酸類共聚物、聚苯乙烯或它們的改性樹脂的 顆粒；以及塗覆有絕緣顆粒或絕緣膜的導電顆粒。 導電顆粒可具有3至ΙΟμπι的平均粒徑(D50)。 .基於總固含里，第·-和弟一絕緣黏合劑層各自可包括 55至85wt%的黏合劑體系、9至43wt%的固化體系和！至 5wt%的自由基引發劑。 第一絕緣黏合劑層的黏合劑體系可包括上述的聚胺曱 酸酯丙稀酸酯和丙浠酸酯樹脂。第一絕緣黏合劑層的固化 11 201229185 體系可包括如上所述的（甲基）丙烯酸酯低聚物，如環氧基 (甲基）丙烯酸酷低聚物；和（甲基）丙烯酸醋單體。基於總固 含量’第一絕緣黏合劑層可包括55至80wt%的黏合劑體 系、9至43wt%的固化體系和1至5wt%的自由基引發劑。在 這些含量範圍内時，第一絕緣黏合劑層可具有理想的溶融 黏度和適宜的黏附性。 優選地，第一絕緣黏合劑層包括55至75wt%的黏合劑 體系、24至41wt%的固化體系和1至4wt%的自由基引發劑。 黏合劑體系的聚胺曱酸酯丙烯酸酯樹脂可如上所述通過多 元醇、經基（曱基）丙稀酸酯和異氰酸酯的聚合來製備。經基 (甲基）丙烯酸酯對異氰酸酯的摩爾比為0.4〜1.2 : 1 ^ 第一絕緣黏合劑層的黏合劑體系中聚胺曱酸g旨丙烯酸 酯樹脂對丙烯酸酯樹脂的含量之比可大於1 : 1，且優選為 1.2〜2.0 : 1。 導電黏合劑層包括如上所述的黏合劑體系、固化體 系、自由基引發劑和導電顆粒。黏合劑體系可包括選自丙 烯腈、丙烯酸酯和苯氧基樹脂中的至少一種樹脂。固化體 系可包括如上所述的（甲基）丙稀酸酯低聚物如環氧基（曱基) 丙稀酸酯低聚物；和（曱基）丙烯酸酯單體。基於總固含量， 導電黏合劑層可包括35至68wt%的黏合劑體系、30至5〇wt% 的固化體系、1至5wt%的自由基引發劑和1至l〇wt%的導電 顆粒。在這些範圍内時，可恰當地調整導電黏合劑層的成 膜性能和流動性。優選地，導電黏合劑層包括40至6〇wt% 的黏合劑體系、35至45wt%的固化體系、1至5wt%的自由基 ⑧ 12 201229185 引發劑和4至10wt%的導電顆粒。黏合劑體系可包括丙烯 腈、丙烯酸酯和苯氧基樹脂。在這種情況下，基於總固含 量，黏合劑體系可包括40至60wt%的丙烯腈樹脂、15至 25wt%的丙烯酸酯樹脂和25至35wt%的苯氧基樹脂。 第二絕緣黏合劑層包括如上所述的黏合劑體系、固化 體系和自由基引發劑。第二絕緣黏合劑層的黏合劑體系包 括上述的聚胺甲酸酯丙烯酸酯和丙烯酸酯樹脂。第二絕緣 黏合劑層的固化體系可包括如上所述的（甲基）丙稀酸酯低 聚物，如環氧基（甲基）丙烯酸酯低聚物；和（甲基）丙烯酸酯 單體。基於總固含量，第二絕緣黏合劑層可包括55至81糾％ 的黏合劑體系、9至40wt%的固化體系和1至5wt%的自由基 引發劑。在這些含量範圍内時，第二絕緣黏合劑層可具有 所欲的熔融黏度和適宜的黏附性。優選地，第二絕緣黏合 劑層包括60至81wt%的黏合劑體系、π至36wt%的固化體系 和1至4wt%的自由基引發劑。黏合劑體系的聚胺甲酸酯丙 烯酸酯樹脂可如上所述通過多元醇、異氰酸酯和羥基（曱基） 丙稀酸㈣聚合來製備。經基（曱基)丙稀酸醋對異氛酸 摩爾比為0.4〜12 : 1。 第一絕緣黏合劑層的黏合劑體系中丙烯酸酯樹脂對 月女甲酸略丙烯酸s旨樹脂的含量之比可大於1 : 1，且僖、/ 1.2〜2_0:1。 设選為 對於各向異性導電膜的基膜類型沒有特別限 prj 口J "T* 以聚烯烴為基礎之膜作為該基膜。適 為基礎之胳烯蛵 祺的材料實例包括聚乙烯、聚丙烯、乙烯/丙烯共 13 201229185 Λ 聚丁烯1、乙烯/乙酸乙稀酯共聚物、聚乙烯/苯乙婦 丁:歸橡膠混合物和聚氣乙稀。也可使用如聚對苯二甲酸 /«、聚％I酸能和聚（甲基丙婦酸甲酿）等聚合物，如聚胺 甲酉夂酉旨和聚醯胺·多元醇共聚物等熱塑性彈性體，以及它們 的展合物。 基膜的厚度可在適宜範圍内選擇，例如3〇至卿m的範 圍内。 絕緣層㈣融黏度範圍可根據黏合劑樹脂之間的含量 比或點合劑體系和固化體系之間的含量比控制。 各向異性導電膜的第_絕緣黏合劑層、導電黏合劑 、第二絕緣黏合劑層中的一個或多個可進一步包括二氧 矽顆粒和表面改性的反應性二氧化石夕顆粒。 向異2化石夕顆粒分佈在上述各向異性導電膜中以對該各 、導電膜提供良好的耐熱性 化矽顆粒的分佈由H ^等電膜中一氧 性導電膜的U 粒之間的相互作用及各向異 定。隨著二Γ冑脂與二氧化石夕顆粒之間的相互作用決 顆粒輿久—化石夕顆粒之間的相容性作用增大，二氧化矽 導就向異性導電膜中的組成樹脂的相容性變差，從而 ，各向異性導電膜物理性能變差。因 石夕顆粒之間的引力最小並增強_氧化砂㈣需要使-氧化 電臈的組成樹脂之間㈣力氧化夕顆粒和各向異性導 到控制::::::表面可以是改性的或未改性的。考慮 作為❹表㈣㈣二氧切顆粒。 為無機奈米顆粒的二氧化石夕顆粒的表面可用選自由 201229185 乙稀基、環氧基、（曱基）丙稀醯基((meth)acryloxy)和氨基石夕 烷偶聯劑組成的組中的至少一種矽烷偶聯劑改性，但不限 於此。優選用（曱基）丙烯醯基矽烷偶聯劑改性無機奈米顆粒 的表面。 對二氧化矽顆粒的尺寸沒有特別限制。二氧化矽顆粒 的粒徑可根據各組成層組合物的流動性適宜選擇。二氧化 石夕顆粒可具有lnm至5μηι的平均粒徑。 基於第一絕緣黏合劑層、導電黏合劑層和第二絕緣黏 合劑層各自的固含量（100重量份），二氧化矽顆粒的含量可 為1至30重量份。在此範圍内時，與各向異性導電膜的組成 樹脂的相容性會得到改善，而不犧牲其他物理性能。 參照以下實施例將提供本發明更詳細的說明。未包括 在本文中的公開對本領域技術人員來說是容易認識和理解 的，因此，省略其解釋。 製備例1:聚胺甲酸酯丙烯酸酯樹脂的製備 將64.97wt%的聚（丁二醇）和35wt%的二苯基甲烷二異 氰酸S旨（甲基丙稀酸經乙S旨/二異氰酸S旨的摩爾比=0.5)混合 在作為溶劑的曱乙酮中，並向其中加入〇.〇3wt%的二月桂酸 二丁錫作為催化劑。將該混合物在latm、90°C下加成聚合5 小時，提供重均分子量為27000g/mol的聚胺甲酸酯丙烯酸 酯樹脂。 製備例2:丙烯酸酯樹脂的製備 將25wt%的甲基丙烯酸甲酯、35wt%的曱基丙烯酸苄 酯、30wt%的曱基丙烯酸環己酯和5wt%的甲基丙烯酸羥乙 15 201229185 醋混合在作為溶劑的甲乙酮中，並向其中加入5wt%的二月 桂酸二丁錫作為催化劑。將該混合物在80。(：下共聚2小時， 提供重均分子量為100000g/m〇l的丙烯酸酯樹脂。 實施例1〜2和對比例1〜2中所用組分的明細如下： 1) 黏合劑體系 丙烯腈丁二烯樹脂：Nipol 1072 (Nippon Zeon Corp.) 聚胺曱酸酯丙烯酸酯樹脂：如製備例1中製備 丙烯酸酯樹脂：如製備例2中製備 苯氧基樹脂：E4275 ’ Japan Epoxy Resins Co.，Ltd. 2) 固化體系 環氧基（甲基）丙烯酸酯聚合物：SP1509，Showa Highpolymer 2-甲基丙稀醯氧基乙基鱗酸酯 季戊四醇三（曱基）丙烯酸酯 2-(曱基）丙稀酸經乙酯 3) 自由基引發劑 過乳化本甲醯和過氧化月桂醯(lauryl per〇xide) 4) 導電顆粒 平均粒徑(D50)為4.5μπι (23GNR5.0-MX)的鎳顆粒 實施例1 :各向異性導電膜的製備 (1)第一絕緣黏合劑層Ν1的形成 將25wt%製備例2中製得的丙烯酸酯樹脂、43糾％製備 例1中製彳于的聚胺甲酸酯丙稀酸酯樹脂、2〇wt%環氧基（甲烏) 丙烯酸酯低聚物、2wt%的2-甲基丙烯醯氧基乙基磷酸唣^ 16 201229185 5wt%的季戊四醇三（曱基）丙烯酸酯、3wt%的（甲基）丙烯酸 -2-矬乙酯和2wt%的過氧化笨曱醯共混以製備第一絕緣黏 合劑組合物◊將該第一絕緣黏合劑組合物塗布在作為離型 膜的聚對苯二甲酸乙二酯膜上，並在7〇t下用熱氣乾燥5分 鐘以形成在15(TC下具有750〇cps熔融黏度的第一絕緣黏合 劑層（19μπι厚）。 (2) 導電黏合劑層Α的形成 將25wt%的丙烯腈丁二烯樹脂、10wt%製備例2中製備 的丙烯酸酯樹脂、15wt%的笨氧基樹脂、3〇wt%的環氧基（甲 基）丙烯酸酯聚合物、2wt%的2·曱基丙烯醯氧基乙基磷酸 酯、8wt%的季戊四醇三（甲基）丙烯酸酯、2wt%的過氧化月 桂醯和8wt%的鎳顆粒共混以製備導電黏合劑組合物。將該 導電黏合劑組合物塗布在作為離型膜的聚對苯二曱酸乙二 酯膜上並在70°C下用熱氣乾燥5分鐘以形成具有ΙΟμπι厚的 導電黏合劑層。 (3) 第二絕緣黏合劑層Ν2的形成 將43wt%製備例2中製得的丙烯酸酯樹脂、25wt%製備 例1中製得的聚胺甲酸酯丙烯酸酯樹脂、20wt%環氧基（曱基) 丙稀酸醋聚合物、2wt%的2-曱基丙稀酿氧基乙基填酸醋、 5wt%的季戊四醇三（曱基）丙稀酸醋、3wt%的（曱基）丙稀酸 '2-經乙酿和2wt%的過氧化苯甲醢共混以製備第二絕緣黏 合劑組合物。將該第二絕緣黏合劑組合物塗布在作為離型 骐的聚對苯二甲酸乙二酯膜上，並在70°C下用熱氣乾燥5分 鐘以形成在150°C下具有UOOOcps熔融黏度的第二絕緣黏 17 201229185 合劑層（6μπι厚）。 (4)各向異性導電膜的製造 將第一絕緣黏合劑層Ν1、導電黏合劑層Α和第二絕緣 黏合劑層N2依次層疊在作為基膜的聚對苯二曱酸乙二酯膜 上以製造各向異性導電膜。將該各向異性導電膜切成2mm 寬的樣品。 實施例2 :各向異性導電膜的製造 用與實施例1相同的方法製造各向異性導電膜，區別在 於如表1所示改變各組分的含量。 對比例1〜2 :各向異性導電膜的製造 用與實施例1相同的方法製造各向異性導電膜，區別在 於如表2所示改變各組分的含量。 表1 實施例1 實施例2 Ν1 A N2 N1 A N2 丙烯腈丁二烯 - 25 - - 25 - 黏合劑體系 丙稀酸醋樹脂 25 10 43 20 10 48 (wt%) 聚胺甲酸酯丙烯酸酯樹脂 43 - 25 35 - 33 苯氧基樹脂 - 15 - - 15 - 環氧基(曱基)丙烯酸酯聚合 物 20 30 20 33 30 7 固化體系 2-曱基丙烯醯氧基乙基填酸酯 2 2 2 2 2 2 (wt%) 季戊四醇三（曱基)丙烯酸酯 5 8 5 5 8 5 (曱基)丙烯酸-2-羥乙酯 3 - 3 3 - 3 自由基引發劑 過氧化苯甲醯 2 - 2 2 - 2 (wt%) 過氧化月桂醯 - 2 - - 2 - 導電顆粒 鎳顆粒 - 8 - - 8 - 厚度（μπι) 19 6 10 19 6 10 150°C的熔融黏度（cps) 7,500 12,000 5,3〇〇 18,000 18 201229185 表2 對比例1 對比例2 Ν1 A N2 N1 A N2 丙烯腈丁二稀 - 25 - - 25 - 黏合劑體系 丙豨酸酯樹脂 43 10 25 48 10 20 (wt%) 聚胺甲酸酯丙烯酸酯樹脂 25 - 43 30 - 35 苯氧基樹脂 - 15 - - 15 - 環氧基(甲基)丙烯酸酯聚合物 20 30 20 10 30 33 固化體系 2-曱基丙烯醯氧基乙基填酸酯 2 2 2 2 2 2 (wt%) 季戊四醇三(甲基)丙烯酸酯 5 8 5 5 8 5 (甲基)丙稀酸-2-經乙S旨 3 - 3 3 墨 3 自由基引發劑 過氧化苯甲醯 2 - 2 2 - 2 (wt%) 過氧化月桂醯 - 2 - - 2 - 導電顆粒 (wt%) 録顆粒 - 8 - - 8 - 厚度（μιη) 19 10 6 19 10 6 150°C的熔融黏度（cps) 12,000 7,500 18,000 5,3〇〇 試驗例1 :各向異性導電膜的物理性能評價 用以下方法評價實施例1〜2和對比例1〜2製造的各向 異性導電膜的物理性能，且其結果示於表3中。 <物理性能的評價方法> 1)黏合強度和接線電阻(connection resistance):將實 施例1〜2和對比例1〜2中製備的每個各向異性導電膜在 25°C下放置1小時。用間距為50μιη的外部引線接合(〇LB) 的TEG、TiO玻璃、覆晶薄膜(COF)和帶載封裝(TCP)評價各 向異性導電膜的黏合強度和接線電阻。將上述各向異性導 電膜於lMPa、70°C下在OLB電路端子上預壓制i秒後，去 除離型膜。隨後，佈置COF電路端子與〇lb電路端子相對， 接著於3MPa、180°C下最終壓制5秒。 19 201229185 對各個膜製備7個樣品。根據ASTM F43-64T用4探針法 測定每個樣品的接線電阻和9〇。黏合強度。在將該樣品在 85°C和RH 85%下放置500小時後，根據ASTM D117評價樣 品接線電阻的可靠性。 2)導電顆粒殘留率的評價：在顯微鏡下觀察已黏合樣 品的黏合面積。計算連接部上導電顆粒的數量。用等式1計 鼻導電顆粒的殘留率： 導電顆粒殘留率（％) = (最終壓制後連接部單位面積 (mm2)的導電顆粒數量)/(預壓制前所述各向異性導電膜單 位面積(mm2)的導電顆粒數量）（1)。 第2圖示出了最終壓制後的連接部，且第3圖示出了預 壓制前的各向異性導電膜。 表3 實施例1 實施例2 對比例1 對比例2 黏合強度（gf/cm) 989 964 924 955 接線電阻（A) 初始 0.38 0.27 0.59 0.63 可靠性 0.47 0.41 0.69 0.85 導電顆粒的殘留率（％) 14 20 7 3 表3中的結果顯示出實施例1〜2中製造的每個各向異 性導電膜連接部的導電球有效數量上的增加，表明了改善 的連接性能和高接線電阻可靠性。相比而言，與實施例 2中製造的各向異性導電膜相比，對比例1〜2中製造的每個 各向異性導電膜具有較低的導電顆粒殘留率和較低的接線 電阻可靠性，在對比例1〜2中製造的每個各向異性導電膜 中的第一絕緣黏合劑層的溶融黏度比第二絕緣黏合劑層的 ⑧ 20 201229185 熔融黏度高。 儘管已結合附圖提供了一些實施方式，對本領域技術 人員明顯的是這些實施方式僅以說明方式提供，並可進行 各種修改、變更、替換和等效實施方式而不背離本發明的 精神和範圍。本發明的範圍應僅由所附申請專利範圍限定 【圖式簡單說明】 第1圖示出了根據本發明示例性實施方式的各向異性 導電膜的結構。在第1圖中，標記卜2、3和4分別表示基膜、 第一絕緣黏合劑層、導電咐黏合劑層和第二絕緣黏合劑層。 第2圖示出了最終壓制後的連接部。 第3圖示出了預壓制前的各向異性導電膜。 【主要元件符號說明】 1,2,3,4...基膜 21201229185 6. Technical Field The present invention relates to an anisotropic conductive film, and more particularly to a first insulating adhesive layer and a conductive adhesive layer which are sequentially laminated on a base film. And an anisotropic conductive film of the second insulating adhesive layer, wherein a ratio of a melt viscosity of the second insulating adhesive layer to a melt viscosity of the first insulating adhesive layer at 150 C is i丨:1 To 1〇: 1. The anisotropic conductive film of the present invention provides good bonding properties and is well suited for pre-compression. Background Art An anisotropic conductive film refers to a film-like adhesive in which conductive particles such as metal particles or metal-coated plastic particles are dispersed. Anisotropic conductive films are widely used in various applications, such as module circuit connections in the field of flat panel displays and component assembly in the semiconductor field. When the anisotropic conductive film is inserted between the boards to be connected, and then hot pressed under specific conditions, the circuit terminals of the board are electrically connected by the conductive particles, and the insulating adhesive resin is filled between the adjacent circuit terminals. The voids are such that the conductive particles are independent of each other, thereby achieving high insulation properties between the circuit terminals. With the development and recent growth of the liquid crystal display industry, an isotropic conductive film is required to have processability and high circuit connection performance for continuous manufacturing of a module. Therefore, the anisotropic conductive film should have good adhesion to various circuit elements, have high reliability for fine circuits, and suitability for subsequent processes. 201229185 An anisotropic conductive film having a single layer or a double layer structure is limited in meeting the above requirements. In order to satisfy their inherent functions and suitability for subsequent processing, an anisotropic conductive film having a three-layer structure is required. Further, in order to achieve applicability to the pressurization process in the pre-compaction, it is important to control the melt viscosity of the constituent layers of the anisotropic conductive film. The conventional anisotropic conductive film having a three-layer structure can simultaneously ensure insulation properties between adjacent circuit terminals and electrical conductivity between connection circuit terminals, but they are unsatisfactory in applicability to the pressurization process. SUMMARY OF THE INVENTION An aspect of the present invention provides an anisotropic conductive film. In one embodiment, the anisotropic guide includes a first insulating adhesive layer 'conductive adhesive layer and a second insulating adhesive layer sequentially laminated on the base film, wherein the second hybrid hybrid rides The ratio of the melting viscosity of the first insulating adhesive layer to 15 is hl: mi0: in one embodiment, the melting viscosity of the second insulating adhesive layer is the same as the first The ratio of the melt viscosity of the illusion layer is 1.5:1 to 3.5:1. BRIEF DESCRIPTION OF THE DRAWINGS The above and other aspects, features, and advantages of the present invention will become apparent from the following detailed description of the appended claims. The structure of the membrane. In Fig. 1, reference numerals 1, 2, 3 and 4 denote a base film, a first-insulating adhesive layer, a conductive anti-adhesive layer and a second insulating adhesive layer, respectively. 201229185 Figure 2 shows the joint after final pressing. Fig. 3 shows an anisotropic conductive film before pre-compression. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiment of the present invention will now be described in detail with reference to the accompanying drawings. Aspects of the present invention provide an anisotropic conductive film comprising a first insulating adhesive layer, a conductive adhesive layer and a second insulating adhesive layer which are sequentially laminated on a base film, wherein The ratio of the second insulating adhesive layer at 15 (the melt viscosity of the TC to the first insulating adhesive layer at 150 ° C is 1.1:1 to 10:1. If the second insulation is in the ratio of the smelting viscosity The melt viscosity of the layer is less than ····· u 'will reduce the residual ratio of the conductive particles after final pressing. Meanwhile, if the melt density, the melt viscosity of the second insulating layer in the ratio of the melt ratio is greater than 10, the fluidity cannot be basically controlled. The appearance characteristics are deteriorated (for example, bubble formation). Preferably, the ratio of the melt viscosity of the second insulating adhesive layer at 15 ° C to the first insulating adhesive layer at 150 C is 1.5: 1 to 3.5: 1. The melt viscosity of each of the first insulating adhesive layer, the second insulating adhesive layer and the conductive adhesive layer can be passed through the flow tester according to the [15 K7210] flow tester (High -Chemical Flow Tester CFT500A Shimazu, parallel plate type) was determined by measuring the melt viscosity of a film sample layer of 1 〇〇 to 2 〇〇 pm at a load of 9.8 MPa, a shear rate of i (i/s), and a temperature of 15 〇C. The melting point of the constituent layers of the anisotropic conductive film may be increased in the following order: conductive adhesive layer > second insulating adhesive layer > first insulating adhesive 5 201229185 agent layer. Preferably, the first insulating adhesive The layer is at 150. (The melt viscosity of 3: the melt viscosity of the second insulating adhesive layer at 150 ° C: the melt viscosity of the conductive adhesive layer at 150 ° C can be in the range of 1: 1.1~1〇: ιι~20 The first insulating adhesive layer may have a melt viscosity of 15 cps or less in the TC. The conductive adhesive layer may have a viscous viscosity of 1 〇〇〇〇 to 1000 cps at 150 ° C, and The second insulating adhesive layer is at 150. (: The melt viscosity may be greater than 10000 cps. Preferably, the first insulating adhesive layer is at 150. (: The melt viscosity may be 5300 to 7500 cps.) The conductive adhesive layer is melted at i5〇t The viscosity may be from 20,000 to 80,000 cps, and the second insulating adhesive layer may have a melt viscosity of 12,000. 18000 cps. Pre-compression of the anisotropic conductive film allows the second insulating adhesive layer to be in contact with the first circuit terminal such as the PCB terminal. After the base film is removed, final pressing can be performed 'to make the first insulating adhesive layer and the second circuit The terminals are in contact with the c〇F terminal. These pressing enables the first circuit terminal to be connected to the second circuit terminal to form a connection portion. There is no limitation on the pressing condition. For example, the pre-compression can be 1 to 2 MPa, 60 to 80 ° C " It is carried out for 1 to 2 seconds, and the final pressing can be carried out at 2 to 5 MPa, 180 to 190 ° C for 4 to 1 sec. In the above anisotropic conductive film, the residual ratio of the conductive particles calculated by the equation 丨 can be at least 10%: Residual ratio of conductive particles (%) = (the number of conductive particles per unit area (mm2) of the joint after final pressing) / (The number of conductive particles per unit area (mm2) of the anisotropic conductive film before pre-pressing) (1) Preferably, the residual ratio of the conductive particles is 14 to 25%. The first insulating adhesive layer may have a thickness of 1 nm or less, the conductive adhesive 201229185 mixture layer may have a thickness of 4 to 8 μm, and the second insulating adhesive layer may have a thickness of 8 to 14 μm. The composition of the constituent layers of the anisotropic conductive film will be explained in detail below. The first and second insulating adhesive layers each include a binder system, a curing system, and a radical initiator, and the conductive adhesive layer includes a binder system, a curing system, a radical initiator, and conductive particles. (Α) Binder System Thermoplastic Resin The binder system serves as an essential substrate for forming an anisotropic conductive film. The binder system can include at least one thermoplastic resin. The thermoplastic resin may be selected from the group consisting of acrylonitrile resin, phenoxy resin, butadiene resin, acrylate resin, urethane, urethane acrylate resin, polyamide resin, olefin resin, poly At least one of the group consisting of a silicone resin, a nitrile butadiene rubber (NBR) resin, and a mixture thereof, but is not limited thereto. Preferably, the thermoplastic resin has a weight average molecular weight of from 1,000 to 1,000,000 g/mol. Within this range, a suitable film strength can be obtained without phase separation, and good adhesion to the adherend can be maintained, thereby preventing deterioration of the adhesive strength. The polyurethane acrylate resin binder system can include at least one polyurethane acrylate resin. Polyamine phthalate acrylate resins can be prepared by copolymerizing isocyanates, polyols, and hydroxy (meth) acrylates. The above isocyanate may be at least one selected from the group consisting of aromatic isocyanates, aliphatic isocyanates, alicyclic diisocyanates, and mixtures thereof, at least 7 201229185. Examples of such isocyanates include tetradecyl-piperate diisocyanate, hexamethylene-1,6-diisocyanate, cyclohexylene diisocyanate, fluorenylene-bis(4-cyclohexyl isocyanate), isophorone Diisocyanate, diphenylnonane diisocyanate and 4,4'-fluorenylene bis(cyclohexyl diisocyanate). These isocyanates may be used singly or as a mixture of two or more of them. The polyol may be at least one selected from the group consisting of polyester polyols, polyether polyols, polycarbonate polyols, and mixtures thereof. The polyol can be obtained by polycondensation of a dicarboxylic acid compound and a diol compound. Examples of such acetonic acid include, but are not limited to, acid breaker, glutaric acid, isophthalic acid, adipic acid, suberic acid, azelaic acid, sebasic acid, dodecanedicarboxylate. Acid, hexahydrophthalic acid, isophthalic acid, terephthalic acid, phthalic acid, tetra-phthalic acid, 1> 5-naphthalenedicarboxylic acid, fumaric acid, maleic acid, clothing Kang acid, citraconic acid, methac〇nicacid and tetrahydrophthalic acid. Examples of such diol compounds include, but are not limited to, ethylene glycol, propylene glycol, 1,3-propanediol, iota, butanediol, hydrazine, 4-butanediol, decanediol, 1,6-hexyl Glycol, neopentyl glycol, diethylene glycol, dipropylene glycol, triethylene glycol, monobutylene glycol, 2-methyl-i, 3-decanediol, 2,2,4-trimethyl-l, 3_ pentanediol and 1,4-cyclohexanedimethanol. Examples of suitable polyether polyols include, but are not limited to, polyethylene glycol, polypropylene glycol, butylene glycol, and polytetraethylene glycol. The molar ratio of hydroxy(meth)acrylate to isocyanate is 412412:1. The content of the polyol in the polyurethane resin is 7% by weight or less. The polyamine phthalate resin reacts with a terminal diisocyanate group of a hydroxy (meth) acrylate and a polyurethane at a molar ratio of 0.M.2 ··1, and makes the alcohol and the residual iso 201229185 cyanide Prepared by acid vinegar reaction. There is no particular limitation on the polymerization method for preparing the polyurethane resin. Addition 4 can generally be used as the polymerization method. A suitable catalyst such as dilaurin can be used in the polymerization. The polymerization can be carried out at 7 to 5 hours for 1 to 5 hours. (B) Curing system The curing system is cured to ensure the bonding strength and the connection reliability between the connecting layers of the anisotropic conductive film. Each of the curing systems may include at least one free radical curing unit selected from the group consisting of (meth) acrylate oligomers and (meth) acrylate monomers. (Meth) acrylate oligomers Examples of (fluorenyl) acrylate oligomers suitable for use in the curing system include, but are not limited to, epoxy (indenyl) acrylate oligomers, wherein the molecular structure is selected from 2 - >Broken Rats, 'Benbi, Orthophenanthrene', such as bisphenol, bisphenol, bisphenol, AD and bisphenol S, etc., bisphenol, 4,4'-dihydroxybiphenyl and bis (4 -hydroxylphenyl) a skeleton composition in an ether; and having at least one selected from the group consisting of an alkyl group, an aryl group, a hydroxymethyl group, a dipropyl group, an alicyclic group, a halogen (tetrabromobisphenol A), and a nitro group Group of (meth) acrylate oligomers. The (meth) acrylate monomer (meth) acrylate monomer may be selected from the group consisting of 6-hexanediol mono(indenyl) acrylate, 2-hydroxyethyl (meth) acrylate, (methyl) ) 2-hydroxypropyl acrylate, (meth) acrylic acid-2- butyl sulfonate, 2-light-based-3-presentyl propyl (meth) acrylate bismuth (2-hydroxy-) 3-phenyloxypropyl (meth)acrylate), 1,4-butanediol (mercapto) acrylic acid vinegar, 2-pyringyl (mercapto) acrylic acid vinegar, 4-jing 9 201229185 base ring Hexyl (mercapto) acrylate, neopentyl glycol mono (meth) acrylate, trimethyl sulfonyl acetonide (methyl) acrylate, dimethyl propylene bis(mercapto) propylene Acid ester, pentaerythritol tri(meth) acrylate, dipentaerythritol penta (meth) acrylate, pentaerythritol hexakisyl acrylate, dipentaerythritol hexa(meth) acrylate, glycerol di(decyl) acrylate, Tetrahydrofuranyl (mercapto) acrylate, isodecyl (meth) acrylate, 2-(2-ethoxyethoxy)ethyl (meth) acrylate, octadecyl (meth) acrylate ( Dodecyl methacrylate, 2-phenoxyethyl (decyl) acrylate, isobornyl (meth) acrylate, tridecyl (meth) acrylate, ethoxylated fluorenyl stupid Phenol (meth) acrylate, ethylene glycol di(meth) acrylate, diethylene glycol bis(indenyl) acrylate, triethylene glycol bis(indenyl) acrylate, tetraethylene glycol di(a) Acrylate, polyethylene glycol bis(indenyl) acrylate, 1,3-butylene glycol di(meth) acrylate, tripropylene glycol bis(indenyl) acrylate, ethoxylated bisphenol - A di(meth)acrylate, cyclohexanedimyl di(indenyl)acrylate, phenoxytetraethylene glycol (decyl) acrylate, 2-methylpropenyloxyethyl phosphate, Dimethylol tricyclodecane di(meth)acrylate, trimethylolpropane benzoate acrylate, (meth)acrylic acid phosphoxy ethyl, 2 At least one of the group consisting of acryloxyethyl phthalic acid vinegar and a combination thereof, but is not limited thereto. (C) Free Radical Initiator The radical initiator may be at least one selected from the group consisting of a photopolymerization initiator, a heat curing initiator, and a combination thereof. Examples of such photopolymerization initiators include, but are not limited to, benzophenone, phthalic acid phthalic acid ester, 4-benzylidene-4-methyldiphenyl sulfide, iso 8 10 201229185 Thiophenone, diethyl thioxanthone, ethyl 4-diethylbenzoate, benzoin ether, benzoin propyl ether, 2-hydroxy-2-methyl-indole-phenylpropan- ketone Diethyl acetophenone. These photopolymerization initiators may be used singly or in combination of them. Examples of such heat curing initiators include, but are not limited to, peroxides and azo initiators. These heat curing initiators may be used singly or in combination of them. As the peroxide initiator, for example, benzoquinone peroxide, laurel peroxide, t-butyl laurate, and tetradecyl butyl peroxy-2-ethylhexanoic acid vinegar can be used. (D) Conductive particles Conductive particles are used as a filler ' to impart conductivity to the conductive adhesive layer of the anisotropic conductive film. Examples of conductive particles suitable for the conductive adhesive layer include, but are not limited to, metal particles such as gold, silver, nickel, copper, tin, and solder metal particles; stone inverse particles; metal coated resin particles such as gold coated , nickel, copper, tin and solder metal benzene melamine, polymethyl methacrylate vinegar (PMMA), acrylic copolymer, polystyrene or particles of their modified resin; and coated with insulating particles or Conductive particles of the insulating film. The conductive particles may have an average particle diameter (D50) of 3 to ΙΟμm. Based on the total solids, the first and the first insulating adhesive layers may each comprise 55 to 85 wt% of the binder system, 9 to 43 wt% of the curing system and! Up to 5 wt% of a free radical initiator. The adhesive system of the first insulating adhesive layer may include the above-described polyamine phthalate acrylate and propionate resin. Curing of the first insulating binder layer 11 201229185 The system may include a (meth) acrylate oligomer as described above, such as an epoxy (meth) acrylate cool oligomer; and a (meth) acrylate monomer . The first insulating binder layer may include 55 to 80% by weight of the binder system, 9 to 43% by weight of the curing system, and 1 to 5% by weight of the radical initiator based on the total solid content. Within these levels, the first insulating binder layer can have a desired melt viscosity and a suitable adhesion. Preferably, the first insulating adhesive layer comprises 55 to 75 wt% of a binder system, 24 to 41 wt% of a curing system, and 1 to 4 wt% of a radical initiator. The polyamine phthalate acrylate resin of the binder system can be prepared by polymerization of a polyol, a thiol-based acrylate, and an isocyanate as described above. The molar ratio of the base (meth) acrylate to isocyanate is 0.4 to 1.2: 1 ^ The ratio of the content of the acrylate resin to the acrylate resin in the adhesive system of the first insulating adhesive layer is greater than 1 : 1, and preferably 1.2 to 2.0 : 1. The conductive adhesive layer includes the binder system, the curing system, the radical initiator, and the conductive particles as described above. The binder system may include at least one resin selected from the group consisting of acrylonitrile, acrylate, and phenoxy resins. The curing system may include a (meth) acrylate oligomer such as an epoxy (mercapto) acrylate oligomer as described above; and a (fluorenyl) acrylate monomer. The conductive adhesive layer may include 35 to 68 wt% of the binder system, 30 to 5 wt% of the curing system, 1 to 5 wt% of the radical initiator, and 1 to 1 wt% of the conductive particles based on the total solid content. Within these ranges, the film forming properties and fluidity of the conductive adhesive layer can be appropriately adjusted. Preferably, the conductive adhesive layer comprises 40 to 6 wt% of the binder system, 35 to 45 wt% of the cure system, 1 to 5 wt% of the radicals 8 12 201229185 initiator, and 4 to 10 wt% of the conductive particles. The binder system can include acrylonitrile, acrylates, and phenoxy resins. In this case, the binder system may include 40 to 60% by weight of an acrylonitrile resin, 15 to 25% by weight of an acrylate resin, and 25 to 35% by weight of a phenoxy resin based on the total solid content. The second insulating binder layer includes the binder system, the curing system, and the radical initiator as described above. The adhesive system of the second insulating adhesive layer comprises the above-described polyurethane acrylate and acrylate resin. The curing system of the second insulating adhesive layer may include a (meth) acrylate oligomer as described above, such as an epoxy (meth) acrylate oligomer; and a (meth) acrylate monomer . The second insulating binder layer may include 55 to 81% by weight of the binder system, 9 to 40% by weight of the curing system, and 1 to 5% by weight of the radical initiator based on the total solid content. Within these levels, the second insulating binder layer can have the desired melt viscosity and suitable adhesion. Preferably, the second insulating adhesive layer comprises 60 to 81% by weight of a binder system, π to 36% by weight of a curing system, and 1 to 4% by weight of a radical initiator. The polyurethane acrylate resin of the binder system can be prepared by polymerizing a polyol, an isocyanate, and a hydroxy(indenyl)acrylic acid (tetra) as described above. The molar ratio of the thiocyanate to the isocyanic acid is 0.4 to 12:1. The ratio of the content of the acrylate resin to the resin of the virgin acid of the first insulating adhesive layer may be greater than 1:1, and 僖, /1.2~2_0:1. There is no particular limitation on the type of base film for an anisotropic conductive film. A polyolefin-based film is used as the base film. Examples of suitable materials for cermetene include polyethylene, polypropylene, ethylene/propylene total 13 201229185 Λ polybutene 1, ethylene/vinyl acetate copolymer, polyethylene/styrene: rubber mixture And gas gathering. It is also possible to use polymers such as polyterephthalic acid/«, poly% I acid and poly(methyl acetoacetate), such as polyamines and polyamine copolymers. Thermoplastic elastomers, and their exhibits. The thickness of the base film can be selected within a suitable range, for example, from 3 Å to Å. The thickness of the insulating layer (IV) can be controlled according to the content ratio between the binder resins or the content ratio between the point compound system and the curing system. One or more of the first insulating adhesive layer, the conductive adhesive, and the second insulating adhesive layer of the anisotropic conductive film may further include dioxin particles and surface-modified reactive SiO2 particles. The dispersing cation particles are distributed in the anisotropic conductive film to provide good heat resistance to the respective conductive films, and the distribution of the ruthenium particles is between the U particles of the oxy-conductive film in the H ^ isoelectric film. Interactions and anisotropy. As the interaction between the diterpene and the cerium dioxide particles is determined to be long-lasting, the compatibility between the fossil granules increases, and the cerium oxide leads to the phase of the constituent resin in the anisotropic conductive film. The capacitive properties are deteriorated, and thus, the physical properties of the anisotropic conductive film are deteriorated. Because the gravitational force between Shixi particles is minimal and enhanced _ oxidized sand (4) needs to be made between - oxidized electric enthalpy of the constituent resin (4) force oxidized granules and anisotropy guided to control:::::: surface can be modified Or unmodified. Consider the bismuth dicing particles as the enthalpy (iv) (iv). The surface of the silica dioxide particles which are inorganic nanoparticles may be selected from the group consisting of 201229185 ethylene, epoxy, (meth) acryloxy and amino alkane coupling agents. At least one of the decane coupling agents is modified, but is not limited thereto. It is preferred to modify the surface of the inorganic nanoparticles with a (fluorenyl) acrylonitrile decane coupling agent. There is no particular limitation on the size of the cerium oxide particles. The particle size of the cerium oxide particles can be appropriately selected depending on the fluidity of the composition of each constituent layer. The cerium oxide particles may have an average particle diameter of from 1 nm to 5 μm. The content of the cerium oxide particles may be 1 to 30 parts by weight based on the solid content (100 parts by weight) of each of the first insulating adhesive layer, the conductive adhesive layer and the second insulating adhesive layer. Within this range, the compatibility with the constituent resin of the anisotropic conductive film is improved without sacrificing other physical properties. A more detailed description of the invention will be provided by reference to the following examples. The disclosures not included herein are readily recognized and understood by those skilled in the art, and therefore, the explanations thereof are omitted. Preparation Example 1: Preparation of Polyurethane acrylate Resin 64.97 wt% of poly(butylene glycol) and 35 wt% of diphenylmethane diisocyanate S (methyl acrylate) The molar ratio of diisocyanate S = 0.5) was mixed in an ethyl ketone as a solvent, and 3 wt% of dibutyltin dilaurate was added thereto as a catalyst. The mixture was subjected to addition polymerization at 75 ° C for 5 hours to provide a polyurethane acrylate resin having a weight average molecular weight of 27,000 g/mol. Preparation Example 2: Preparation of acrylate resin 25 wt% of methyl methacrylate, 35 wt% of benzyl methacrylate, 30 wt% of cyclohexyl methacrylate, and 5 wt% of hydroxyethyl methacrylate 15 201229185 vinegar were mixed. In methyl ethyl ketone as a solvent, 5 wt% of dibutyltin dilaurate was added thereto as a catalyst. The mixture was at 80. (: copolymerization for 2 hours, providing an acrylate resin having a weight average molecular weight of 100,000 g/m〇. The details of the components used in Examples 1 to 2 and Comparative Examples 1 to 2 are as follows: 1) Acrylonitrile solution of the binder system Alkenyl resin: Nipol 1072 (Nippon Zeon Corp.) Polyamine phthalate acrylate resin: acrylate resin prepared as in Preparation Example 1: phenoxy resin prepared as in Preparation 2: E4275 'Japan Epoxy Resins Co., Ltd. 2) Curing system Epoxy (meth) acrylate polymer: SP1509, Showa Highpolymer 2-Methyl propyl methoxy ethoxylate pentaerythritol tris(decyl) acrylate 2-(indenyl) propyl Dilute acid via ethyl ester 3) Free radical initiator over-emulsified Benton and Lauryl per〇xide 4) Nickel particles with an average particle size (D50) of 4.5 μm (23GNR5.0-MX) Example 1: Preparation of an anisotropic conductive film (1) Formation of a first insulating adhesive layer Ν1 25 wt% of an acrylate resin prepared in Preparation Example 2, 43% of a polyamine prepared in Preparation Example 1 Formate acrylate resin, 2〇wt% epoxy (meth) acrylate oligomer, 2wt% 2-Methyl propylene methoxyethyl phosphate 唣 16 201229185 5 wt% pentaerythritol tris(fluorenyl) acrylate, 3 wt% -2-ethyl methacrylate and 2 wt% alum Blending to prepare a first insulating adhesive composition, coating the first insulating adhesive composition on a polyethylene terephthalate film as a release film, and drying with hot air at 7 Torr for 5 minutes To form a first insulating adhesive layer (19 μm thick) having a melt viscosity of 750 〇 cps at 15 (TC). (2) Formation of conductive adhesive layer 将 25 wt% of acrylonitrile butadiene resin, 10 wt% of preparation Acrylate resin prepared in 2, 15 wt% of phenoxy resin, 3 wt% of epoxy (meth) acrylate polymer, 2 wt% of 2 mercapto propylene oxyethyl phosphate, 8 wt % pentaerythritol tri(meth)acrylate, 2 wt% of lauricium laurate and 8 wt% of nickel particles are blended to prepare a conductive adhesive composition. The conductive adhesive composition is coated on a pair as a release film. On the ethylene phthalate film and dried with hot air at 70 ° C for 5 minutes to form a thick ΙΟμπι a conductive adhesive layer. (3) Formation of the second insulating adhesive layer 将2, 43 wt% of the acrylate resin prepared in Preparation Example 2, 25 wt% of the polyurethane acrylate resin obtained in Preparation Example 1, 20wt% epoxy (mercapto) acrylic acid vinegar polymer, 2wt% 2-mercaptopropyl ethoxylate acid vinegar, 5wt% pentaerythritol tris(decyl) acrylate vinegar, 3wt% The (indenyl) acrylic acid '2- was blended with 2% by weight of benzamidine peroxide to prepare a second insulating binder composition. The second insulating adhesive composition was coated on a polyethylene terephthalate film as a release crucible, and dried with hot air at 70 ° C for 5 minutes to form a melt viscosity of UOOOcps at 150 ° C. Second insulating adhesive 17 201229185 Mixing layer (6μπι thick). (4) Production of an anisotropic conductive film The first insulating adhesive layer Ν1, the conductive adhesive layer Α and the second insulating adhesive layer N2 are sequentially laminated on a polyethylene terephthalate film as a base film. To produce an anisotropic conductive film. The anisotropic conductive film was cut into a sample having a width of 2 mm. Example 2: Production of an anisotropic conductive film An anisotropic conductive film was produced in the same manner as in Example 1, except that the contents of the respective components were changed as shown in Table 1. Comparative Example 1 to 2: Production of an anisotropic conductive film An anisotropic conductive film was produced in the same manner as in Example 1, except that the content of each component was changed as shown in Table 2. Table 1 Example 1 Example 2 Ν1 A N2 N1 A N2 Acrylonitrile Butadiene - 25 - - 25 - Adhesive System Acrylic Acid Vinegar Resin 25 10 43 20 10 48 (wt%) Polyurethane acrylate Resin 43 - 25 35 - 33 Phenoxy Resin - 15 - - 15 - Epoxy (Mercapto) Acrylate Polymer 20 30 20 33 30 7 Curing System 2-Mercaptopropenyl Ethoxy Ethyl Ester 2 2 2 2 2 2 (wt%) pentaerythritol tris(fluorenyl) acrylate 5 8 5 5 8 5 (fluorenyl) 2-hydroxyethyl acrylate 3 - 3 3 - 3 free radical initiator benzammonium peroxide 2 - 2 2 - 2 (wt%) Permanganium laurate - 2 - - 2 - Conductive particles of nickel particles - 8 - - 8 - Thickness (μπι) 19 6 10 19 6 10 150 ° C melt viscosity (cps) 7,500 12,000 5,3〇〇18,000 18 201229185 Table 2 Comparative Example 1 Comparative Example 2 Ν1 A N2 N1 A N2 Acrylonitrile Butyrate - 25 - - 25 - Adhesive System Propionate Resin 43 10 25 48 10 20 (wt% Polyurethane acrylate resin 25 - 43 30 - 35 phenoxy resin - 15 - - 15 - epoxy (meth) acrylate polymer 20 30 20 10 30 33 Curing system 2-mercapto propylene oxime Base ethyl ester 2 2 2 2 2 2 (wt%) pentaerythritol tri(meth) acrylate 5 8 5 5 8 5 (methyl) acrylic acid-2- via B s 3 - 3 3 ink 3 Free Radical Initiator Benzoyl Peroxide 2 - 2 2 - 2 (wt%) Perovskite - 2 - - 2 - Conductive Particles (wt%) Recorded Particles - 8 - - 8 - Thickness (μιη) 19 10 6 19 10 6 Melt viscosity (cps) at 150 ° C 12,000 7,500 18,000 5,3 〇〇 Test Example 1 Physical property evaluation of anisotropic conductive film The following Examples were used to evaluate the production of Examples 1 to 2 and Comparative Examples 1 and 2. The physical properties of the anisotropic conductive film, and the results thereof are shown in Table 3. <Evaluation method of physical properties> 1) Adhesive strength and connection resistance: Each anisotropic conductive film prepared in Examples 1 to 2 and Comparative Examples 1 to 2 was placed at 25 ° C. hour. The adhesive strength and wiring resistance of the anisotropic conductive film were evaluated by external wire bonding (?LB) of TEG, TiO glass, flip chip (COF) and tape carrier package (TCP) with a pitch of 50 μm. The anisotropic conductive film was pre-pressed on the OLB circuit terminal at 1 MPa and 70 ° C for 1 second, and then the release film was removed. Subsequently, the COF circuit terminals were arranged to face the 〇 lb circuit terminals, and then finally pressed at 3 MPa, 180 ° C for 5 seconds. 19 201229185 Seven samples were prepared for each membrane. The wiring resistance and 9 Å of each sample were measured by a 4-probe method according to ASTM F43-64T. Bond strength. After the sample was allowed to stand at 85 ° C and RH 85% for 500 hours, the reliability of the sample wiring resistance was evaluated in accordance with ASTM D117. 2) Evaluation of residual rate of conductive particles: The adhesion area of the adhered sample was observed under a microscope. Calculate the number of conductive particles on the joint. Residual rate of nasal conductive particles by Equation 1: Residual rate of conductive particles (%) = (Number of conductive particles per unit area (mm2) of the joint after final pressing) / (Per unit area of the anisotropic conductive film before pre-pressing) (mm2) number of conductive particles) (1). Fig. 2 shows the connection portion after the final pressing, and Fig. 3 shows the anisotropic conductive film before the pre-pressing. Table 3 Example 1 Example 2 Comparative Example 1 Comparative Example 2 Adhesive strength (gf/cm) 989 964 924 955 Wiring resistance (A) Initial 0.38 0.27 0.59 0.63 Reliability 0.47 0.41 0.69 0.85 Residual ratio of conductive particles (%) 14 20 7 3 The results in Table 3 show an increase in the effective number of conductive balls of each of the anisotropic conductive film joints produced in Examples 1 to 2, indicating improved connection properties and high wiring resistance reliability. In contrast, each of the anisotropic conductive films produced in Comparative Examples 1 to 2 had a lower residual ratio of conductive particles and a lower wiring resistance than the anisotropic conductive film produced in Example 2. The first insulating adhesive layer in each anisotropic conductive film produced in Comparative Examples 1 to 2 has a higher melt viscosity than the second insulating adhesive layer 8 20 201229185. While the invention has been described with respect to the embodiments of the embodiments of the invention . The scope of the present invention should be limited only by the scope of the appended claims [Simplified Description of the Drawings] Fig. 1 shows the structure of an anisotropic conductive film according to an exemplary embodiment of the present invention. In Fig. 1, reference numerals 2, 3 and 4 denote a base film, a first insulating adhesive layer, a conductive ruthenium adhesive layer and a second insulating adhesive layer, respectively. Figure 2 shows the joint after final pressing. Fig. 3 shows an anisotropic conductive film before pre-compression. [Main component symbol description] 1,2,3,4...base film 21