TW201204801A - Adhesion film for connecting circuit and usage thereof, circuit connection structure and manufacturing method thereof, and connecting method of circuit member - Google Patents

Abstract

The present invention provides an adhesion film for connecting circuit. The adhesion film for connecting circuit includes: a conductive adhesive layer including an adhesive composition and conductive particles, and an insulative adhesive layer including an adhesive composition and excluding conductive particles. The adhesive composition contained in the insulative adhesive layer includes (a) film formation material, (b) epoxy resin, (c) latent curing agent, and (d) organic microparticles. The organic microparticles are particles consisting of at least one copolymer or complex selected from (meth)acrylic acid alkyl ester-butadiene-styrene copolymer or complex, (meth)acrylic acid alkyl ester-silicone copolymer or complex and silicone-(meth)acrylic acid copolymer or complex.

Description

[Technical Field] The present invention relates to an adhesive film for circuit connection, a use thereof, a circuit connection structure, a method of manufacturing the same, and a method of connecting circuit members. [Prior Art] Conventionally, in order to connect a semiconductor element to a substrate, in particular, a glass (giass) substrate for a flat panel display (FPD) such as a liquid crystal, a thermosetting adhesive film which is cured by heating is used. As a thermosetting adhesive film, an adhesive film containing an epoxy resin, which is a thermosetting resin, is widely used. Since the epoxy resin is cured by heating, it becomes a polymer having high mechanical strength. The film is used to firmly connect the semiconductor element to a liquid crystal display, and a highly reliable electric device can be obtained. In recent years, an adhesive film containing an acrylic resin capable of curing at a lower temperature than an epoxy resin has been gradually used. 9 However, in the case where an adhesive film is used to connect the glass substrate and the semiconductor element, when the adhesive film is heated, since the semiconductor element is sometimes heated by heat conduction and then thermally expanded, the semiconductor element is stretched. . Therefore, when the whole is cooled after the completion of the heating, the stretched semiconductor element shrinks, and the glass substrate constituting the FPD may be deformed by warpage or the like. If the glass substrate is deformed, the display image of the display located in the deformed portion may be disordered. Heretofore, various methods have been known for suppressing deformation such as warpage. For example, it has been proposed to connect the film to the heating and pressing tool (t〇〇1) 4 201204801 it:: f : the connection method between the pieces (曰本专利--2006-229124 special;;= money for heating In the method of the Japanese Patent Application No. 3477367, the force of the Japanese plate is suppressed (4) to suppress the glass base = deformation, but there is a problem that the connection reliability is lowered. In particular, there is a tendency that the thickness of the broken piece becomes thinner, and it is easy to produce (4) glass. [Inventive content] Therefore, the present invention aims to provide the following electric# ==^_Circuit_Next_Circuit connection = With the adhesive film, even when used for thickness ratio first]: Convict and can inhibit the deformation of the glass substrate, and film formation] = even two = force rain, Therefore, the circuit member is deformed; and the reliability of the portion where the modulus of elasticity is too low is caused by the adhesive film for the circuit connection after the installation of the lower =. It is also known that the elastic modulus is locally too low.

201204801. It is difficult for the electrodes facing each other at 'U-times' to keep the conductive particles flat, and therefore the connection reliability tends to be lowered. The inventors of the present invention have found that the organic fine particles having a specific configuration are used for the bonding film for circuit connection, thereby maintaining high connection reliability and suppressing deformation of the substrate, thereby completing the above research. The invention has been made. In other words, the present invention provides an adhesive film for circuit connection, comprising: a conductive adhesive layer containing an adhesive composition and conductive particles, and an insulating layer containing an adhesive agent and containing conductive particles; The adhesive composition contained in the adhesive layer 'insulating adhesive layer> comprises (a) a film forming material, (b) an epoxy resin, (c) a latent curing agent and = fine particles, and (4) the organic fine particles are selected from the group consisting of Containing (meth)acrylic acid it Γ 埽 埽 ( 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四a particle composed of a polymer or a composite, and a barrier film for using a first circuit member and a second circuit state, wherein the first circuit member and the second circuit member are placed in a thickness of the first circuit member The first circuit electrode is formed on the main surface of the second ray 2 substrate, and the upper surface of the second main circuit board having the thickness of G.3 or less has the second surface. Circuit electrode. Subsequently, the film is adhered to, because of the insulating property, the towel causes the specific (4) organic fine particles to have a good elastic modulus. As a result, even when the bonding film for circuit connection is used, the circuit members of the circuit board are deformed by a degree of two or less, and good connection reliability can be obtained. The adhesive composition in the primer layer contains the above (d) organic y-bonded (a) film-forming material and (b) epoxy resin, and therefore, it can produce heat and adhesion, and film formability. Reliable for the superior... 'Because the connecting film for the circuit connection includes the conductive insulating adhesive layer, the two layers, so the relative electric = this capacity: foot:: particles, so that the connection is reliable: good connection reliability. j is satisfied with the good = soil: the circuit connection of the Ming with the film, the lead can contain more insulating particles. Therefore, it is possible to maintain a more excellent connection. The circuit connection structure is provided, and the circuit is connected to the structure member, and the first circuit electrode is formed on the first main surface having a thickness of 〇·3 mm or less; a circuit member, wherein a second second circuit electrode is disposed on a main surface of the second circuit board, and a second circuit electrode is disposed to face the first circuit electrode, wherein the L t electrode is electrically connected to the first circuit electrode; and a connection portion and a dielectric member The connection portion between the second circuit member and the second circuit member is a cured product of the adhesive film for circuit connection of the present invention. Shi Gong = the connection frequency of the circuit made as described above, because the cured portion of the film for the connection of the circuit included in the connection portion

The internal stress in the structure of the joint is controlled to a low internal stress, so that U 201204801 can produce a portion with a low modulus of elasticity. Therefore, deformation of the circuit member can be suppressed, and excellent connection reliability can be achieved. Further, the present invention provides a method of manufacturing a circuit connection structure, and the method for manufacturing a circuit connection structure includes the steps of: forming a laminate layer between the pair of circuit members by the above-described bonding film for circuit connection of the present invention Body 'above-to-circuit components include the first! Circuit member and second circuit member The first circuit member has an i-th circuit electrode formed on a main surface of a first circuit board having a thickness of mm or less, and the second circuit member has a second circuit board having a thickness of 0.3 mm or less. a second circuit electrode is formed on the main surface; the connection layer is heated and the film is cured, thereby forming a connection portion, and the connection portion is interposed between the one-way members and is disposed opposite to each other 1 The circuit of the circuit electrode is connected to the m-path, and the following circuit can be manufactured. The circuit connection structure can suppress deformation of the circuit member and achieve excellent connection reliability. Provided as a method of connecting a circuit member, the circuit structure == a first U-shaped member, a second circuit member, and a matching member in a state in which the first circuit electrode and the second circuit electrode are opposed to each other The circuit of the present invention between the second circuit members is electrically charged, and the second electrode and the second circuit are electrically aged, and the first circuit member has a thickness of G.3 mm. The first circuit electrode is formed on the main surface of the substrate, and the second circuit electrode is formed on the main surface of the second circuit board 8 201204801 having a thickness of 0.3 Å or less. In the connection method of the circuit member as described above, since the circuit member is connected by using the (four) cured product for circuit connection according to the present invention, i can be sufficiently controlled even if the internal stress in the cured product is controlled to a low internal stress. The ground ensures the electrical conductivity between the opposing electrodes. Therefore, a circuit connection structure which can suppress deformation of the circuit member and which has good connection reliability can be formed. Further, the present invention provides use of a bonding film for circuit connection, the film comprising: an electrical conductivity comprising an adhesive composition and conductive particles, followed by a layer, and a composition containing a conductive material and containing no conductive particles. Next, _, the adhesive layer + the adhesive composition contained in the package 3, the film forming material, (b) epoxy resin, (c) latent curing agent and (d) organic, particles '(d) organic fine particles It is selected from the group consisting of (meth)propanoid = vinegar-butadiene-styrene copolymer or composite, (alkyl) acrylate-polyoxan copolymer or composite and poly-wei ( a group of at least one polymer or composite of a group of acrylic acid copolymers or a combination of acrylic acid copolymers, or a combination of a film and a circuit, for use in connecting the first circuit electrode and the second circuit electrode In the state of the first circuit member, the first circuit member is connected to the second circuit member, and the first circuit member has the first circuit electrode formed on the main surface of the first circuit board having a thickness of 〇3 mm or less. The second circuit member is on the second circuit board having a thickness of 0.3 mm or less There are formed on the surface of the second circuit electrodes. By using the above-mentioned adhesive film for circuit connection, even when the connecting film is used, a circuit member including a circuit substrate having a thickness of 〇·3 mm or less can be suppressed, and deformation of the circuit member can be suppressed, and good results can be obtained. When the above-mentioned adhesive film is used for the circuit, it may further contain insulating particles. In this way, it is possible to maintain the use of the film, and to provide a circuit connection structure for the circuit connection, a circuit connection structure for the a method, a method for the use of the film, and a method for connecting the circuit member. Two::: When the thickness is thinner than the thickness of the previous circuit board, and the body member can be connected, the excellent connection reliability can be maintained and the film formation property is also excellent. In particular, this is the case where the following circuit connection is used, and the circuit connection is connected to each other with a circuit member having a thickness of 〇·3 mm or less. The above and other objects, features, and advantages of the present invention will be apparent from the description of the appended claims appended claims The preferred embodiment of the present invention will be described in detail, and the present invention is not limited to the following embodiments. <Continuous film for circuit connection> First, the bonding film for circuit connection of the present embodiment will be described first with reference to Fig. 1 . Fig. 1 is a schematic cross-sectional view showing a circuit-connecting adhesive film according to an embodiment of the present invention. The circuit-connecting adhesive film 10 includes a conductive composition of the composition 04b and the conductive particles 5, and a conductive adhesive layer 3b and a second insulating adhesive layer W, and 4 (Insulating adhesive layer) The adhesive layer % may include (a) a film forming material (hereinafter, 3 Uf) and (8) an epoxy resin (hereinafter, sometimes referred to as

The voltaic curing agent (referred to as "(4) becomes" in τ, _) and (d) organic fine particles (hereinafter, sometimes referred to as the adhesive composition 4^(4)& J as the component (a), the film-forming material is a polymer (4) Bribes, the polymer has a liquid-like deuterated resin composition, and the film-forming material is contained in the curable resin composition, whereby the curable resin composition is formed into a film shape. An adhesive film which is not easily cleaved, is not easily broken, and which is not easily adhered and which is easy to use can be obtained. As the film forming material as described above, for example, it is selected from the group consisting of a phenoxy resin, a ethoxylated lyophile, and a poly At least one polymer of a group of styrene resin, polyethyl butyl sulfonate, poly lysine, polyamide resin, xylene resin, and polyurethane resin. Among these resins, phenoxy resin, polyamine It is preferable that the eucalyptus eucalyptus and the polyacetic acid butyric acid resin are excellent in compatibility between the resin and the component (b), and it is possible to produce excellent adhesion, heat resistance, and the like for the film-bonding adhesive film 10 after curing. Mechanical strength. Make the double g sb and the epihalohydrin (epiha) I〇hydrin) reacts until a high molecular weight is reached, or an addition polymerization reaction of a bifunctional epoxy resin with a difunctional phenol is carried out to obtain a phenoxy resin. Specifically, 11 2012048 (^ and L, in the presence of a base) Under the conditions of a catalyst such as a metal hydroxide, in a non-reverse solvent, the temperature of the U-~12 CTC is used to make the bifunctional benzoate of the oxime with 0.985 mol to 1.015 mol of epihalohydrin. A reaction occurs, whereby the above phenoxy resin can be obtained. # Preferably, the ratio of the equivalence ratio of the (4) Newwei resin to the difunctional silk is set to be epoxy/phenol hydroxy ruthenium (7)"~丨/丨丨The addition polymerization reaction of the phenoxy resin is carried out, whereby the mechanical properties and thermal properties of the subsequent film-attaching film 10 can be improved. Further, it is preferred to have an alkali metal compound, an organophosphorus compound, and In the organic solvent such as a ketone-based system, an internal fluorene-based system, or an alcohol-based compound, the raw material has a solid content of 50 parts by mass, and is heated to 耽~fine c to carry out the above-mentioned addition polymerization reaction. Oxygenated difunctional epoxy The fat may, for example, be a double-aged A-type epoxy resin, a double-aged F-type epoxy resin, a double-aged ad-type epoxy resin, a _S-type decanted fat, a fresh bis-dihydrate, and a methyl-substituted biphenyl-diene. As a bifunctional benzoic acid, a substance having two benzoindol groups may be mentioned, for example, p-benzoic acid, double diversified A, and double dimer; F, double disentrant AD, double expectant S, double dimer, and a bisphenol such as a methyl-substituted bisphenol, a monohydroxybiphenyl or a methyl-substituted dihydroxybiphenyl. A phenol-reducing lion can also be obtained by a radical polymerizable functional group or other reactive compound. The above various phenoxy resins may be used in combination or two or more kinds of the above various phenoxy resins may be used in combination. The polyurethane resin is an elastic bond having an amino formate urethane bond in a molecular chain. 12 20120480 丄f body 'and usually in an equivalent amount to make the active hydrogen group of the saturated polyester resin, and the diisocyanate compound (nonyl diisocyanate, diisocyanate diphenyl sulfonium, hexamethylene diisocyanate, benzene Two of a fluorenylene diisocyanate, a diisocyanate, a cyclohexyl decane, etc. a linear polymer obtained by reacting an isocyanate group, wherein the saturated polyester resin is a polybasic acid (terephthalic acid, isophthalic acid, phthalic acid, succinic acid, adipic acid, sebacic acid, and Sebacic acid, etc.), and glycol (ethylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, diethylene glycol, triethylene glycol, polyethylene) A diol, a propylene glycol or the like is obtained by a condensation reaction and has a terminal hydroxyl group. The polyurethane resin is easily dissolved in an organic solvent such as an ester system (ethyl acetate, butyl acetate, etc.), a ketone system (mercaptoethyl ketone, cyclohexanone, and acetone), and an aromatic system (anthracene, diphenyl). And solvents such as benzene, etc. and gas systems (three-gas ethylene, dioxane, etc.). The polyvinyl butyral resin is an elastomer having an ethylene acetal unit in a molecular chain, and is usually polymerized with acetic acid, and then subjected to a test treatment, and then it is brewed (return, jun, secret, and turn). a linear polymer obtained by a reaction. In the polyethylene acetonate resin used in the present embodiment, the degree of polymerization is preferably ～25 GG, and the degree of cleavage is preferably 65 mol% or more. When the degree of polymerization is less than 7 GG, the cohesive strength of the polyethylene butyl sulphate is insufficient, resulting in a decrease in film formability. When the degree of polymerization exceeds 25 (9), the fluidity of the resin when the resin is pressure-bonded is insufficient, and the conductive particles cannot be smoothly interposed between the electrodes of the bonded body, so that it is difficult to obtain sufficient connection reliability. Moreover, if the enthalpy is less than 65 mGl%, the ratio of the hard base or the county 増 201204801 and -----jn makes it difficult to obtain sufficient connection reliability. The glass transition temperature of the film-forming material of the T component (hereinafter referred to as gJ is not particularly limited, but is preferably 4〇〇c to 7〇ΐ, more preferably 'and more preferably 5叱 to 7th generation). In the case of a film-forming material having such a Tg, the internal stress generated in the solid is absorbed by the elastic deformation, so that the electricity is less than :, so that the connection reliability can be more reliably improved. The amount of the film-forming material is such that the total amount of the film-forming material is 100 parts by mass, and the amount of the film-forming material is more than 10 parts by mass. In the above range, the deformation (warpage amount) of the substrate can be further suppressed, and the adhesive film for circuit connection 10 which is more excellent in electrical connection property can be provided. The larger the molecular weight of the film formation material, the easier the film formation can be obtained. Further, the melt viscosity which affects the fluidity of the adhesive composition 4a can be set in a wide range. The weight average molecular weight (Mw) of the film-forming material is preferably ～150,000, particularly preferably 10,000 to 8 Å. When the value is 5 〇〇〇 ' or more, there is a tendency to obtain good film formability. On the other hand, when the value is 150,000 or less, the compatibility with the other components tends to be easily obtained. The above-mentioned "weight average molecular weight" means according to Table 1 below. The conditions shown and according to gel permeation chromatography (Gel Permeation

Chromatography, GPC), the value obtained by measurement using a standard polystyrene calibration curve. 201204801 [Table 1] Device--Dongcao Co., Ltd. manufactures GPC-8020 A detector--Dongcao Co., Ltd. manufactures RI_8〇2〇Pipe column Hitachi Chemical Co., Ltd. manufactures Gelpack ------- -------- - ----------------- Sample concentration---________ 120 mg/3 ml One/Valley W ---~______ Tetrahydrofuran injection Pressure---60 μΐ ———__ 30 kgf/cm Flow--~~~___ 1.00ml/min As a (complex epoxy resin), it can be used alone or in combination of two or more. Containing a group of double-awaiting A, double-finged F, and double-distributed AD, at least a pair of twin bis (tetra) epoxy resins, self-evaporating alcohols, and thorns and 33 towels - derived from arbor or miscellaneous An inspection epoxy tree, a naphthalene pure oxygen resin having a skeleton containing a naphthalene ring, and glycidylamine, glycidyl ether, biphenyl, and alicyclic, etc. having two or more glycidyl groups in one molecule Various epoxy compounds, etc.. Roots = mass ions (i°n) (Na+, cm or hydrolyzable chlorine, etc., which are reduced to 300 ppm or less. Among the above epoxy resins, they are widely available. The molecular weight is different grade ' and can be arbitrarily carried out on the adhesion or the reverse, etc., so the '(four) type resin is better ^ double _ epoxy resin, ^ type epoxy resin is particularly good. The viscosity of the resin is low = the oxy resin is used in combination, and the fluidity of the film 10 can be easily and widely used. Further, the Wei F type epoxy resin ^

S 15 201204801 10 is good. There is an advantage that the adhesion of the adhesive film for circuit connection is easy. The amount of the epoxy resin to be added is preferably 5 parts by mass to 5 parts by mass, more preferably 2 parts by mass to 40 parts by mass, based on 100 parts by mass of the total of the adhesive composition 4a. When the amount of the epoxy resin is less than 5 parts by mass, when the circuit members are pressure-bonded to each other, the fluidity of the film for the connection film tends to decrease, and the amount of the epoxy resin is more than 5 enamel. In the case of the portion, when the long-term storage is performed, the film connecting film 10 tends to be deformed. Examples of the latent curing agent which is the component (C) include, for example, saliva, anthraquinone, an amine imide, and dicyandiamide. The latent curing agent may be used alone or in combination of two or more kinds. The above latent curing agent. Moreover, the sputum ID agent can be combined with decomposition, catalysis, deletion, and the like. In addition, 'A' has a prolonged usable time, and it is preferable to use a polyamine vinegar type, a polymer material of a polystyrene system, etc., and to implement a latent hardening agent, and it is latent with respect to 100 mass part of epoxy resin. The amount of the curing agent is preferably from 10 parts by mass to 10,000 parts by mass, more preferably from 50 parts by mass. By this, the curing reaction towel can be sufficiently reacted. When the amount of the latent curing agent is less than 1 part by mass, a sufficient reaction rate cannot be obtained, and it is difficult to obtain good adhesion strength and connection resistance. When the amount of the latent curing agent is more than 2 parts by mass, there is a case where the T-direction 'for example, the fluidity of the circuit-connecting material fine G is lowered', the connection resistance is increased, and the application period of the film-attaching film 1G is used (pot 201204801) Life) shortened. The machine microparticles are particles composed of at least one polymer or composite selected from the group consisting of __ based vinegar-poly valence copolymer or composite, (mercapto) acrylonitrile: ^ The solubility is low, and there are two or six kinds of organic microparticles or eight one-dimensional parent-linked structures for the curable composition, and the dispersibility of the material is wrong. For the curability composition 槿: Λ编. Further, the "three-dimensionally crosslinked ruthenium" ruthenium chain has a three-form structure, for example, a cross-linker having a functional group bonded to a reaction point of a polymer: The polymer having the reaction site is treated to obtain the organic fine particles of the configuration as described above. When the molecular weight is (10) or more, the fine particles and the general particles having the three comparative structures are preferably low in solubility to the solvent. In the case of the above-mentioned effect I obtain the above effect more effectively, it is preferable to use a molecular weight of 1,000,000 or more or a three-dimensional crosslinked structure. Alkyl-polyoxyalkylene copolymer, polyfluorene-(meth)acrylic acid copolymer or organic fine particles of a composite of these polymers. Further, a core shell type structure may be used and The organic fine particles having different composition of the branch layer and the composition of the shell layer are (d) into eight as the core-shell type organic fine particles, and specifically,

201204801, 'X-acid rubber is a particle obtained by grafting an acrylic resin as a core, and particles obtained by grafting an acrylic resin with an acrylic acid copolymer as a core. Further, a core-type polyoxyl microparticle disclosed in the pamphlet of International Patent Publication No. 2009/051067, such as an alkyl (meth)acrylate butadiene disclosed in International Patent Publication No. 2009/020005, may also be used. - styrene copolymer or composite, (meth)acrylic acid alkyl ester _ polyoxetoxy copolymer or composite and polyfluorene-(meth)acrylic acid copolymer or composite organic fine particles, such as The core-shell structure polymer particles disclosed in Japanese Laid-Open Patent Publication No. 2002-256037, and the rubber particles of the core-shell structure disclosed in Japanese Laid-Open Patent Publication No. 2004-18803. One type of the core-shell type insulating particles may be used singly, or two or more types of the above-mentioned core type insulating particles may be used in combination. Further, the average particle diameter of the (d) organic fine particles is preferably about 0 1 μm to about 2 μm. In addition, the above "average particle diameter" means a value measured as follows. In other words, the primary particles of the organic fine particles selected for the ground were observed by a scanning electron microscope (SEM (Scanning Ε1_〇η = i_cope) 'manufactured by Hitachi, Ltd., product name: s_8〇〇) (magnification: 5000) =) 'Measure the maximum and minimum diameters of the primary particles. The square root of the product of the maximum ^ and the minimum diameter is defined as the primary particle diameter of the above particles. In the case of 50 randomly selected organic fine particles, the particle diameter was measured in the above manner, and the average value of the primary particle diameters was defined as the average particle diameter. In the same manner, you can measure the average particle size of the conductive particles and the insulating particles described later. With respect to the adhesive composition having a total mass of 100 parts by mass, for example, the compounding amount of the composition of 201204801 - -. _.rll (d) is preferably 60 parts by mass or less, more preferably 4 parts by mass or less. When the amount of the organic fine particles is more than 6 parts by mass, the film forming property and the adhesion of the conductive particles 5 to the electrode tend to decrease. Further, depending on the application, the adhesive composition 4a may further contain, for example, a softener, an anti-aging agent, a flame retardant, a coloring matter, a thixotropic agent (thi age age age age 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 si si si si si si si si si si si si si si si si si (Electrically Conductive Adhesive Layer) The adhesive composition contained in the conductive adhesive layer 3b can be formed into a film shape and can suppress deformation of the circuit member when the circuit member is connected. The material 4b may be the same as the adhesive group 4a contained in the insulating adhesives a', and may be different from the subsequent listener. However, it is preferable that the fluidity of the insulating adhesive layer 3a is greater than that of the conductive material. The surface of the above-mentioned component is adjusted in the manner of the adhesive layer 3b (10). The conductive particles 5 are dispersed in the adhesive composition 4b. Since the circuit-attached film 1G contains the conductive particles 5, the position of the circuit electrode The unevenness of the south or the south is absorbed by the deformation of the conductive particles 5, and the contact area is increased to obtain a more stable electrical connection. X, since the circuit 10 for the circuit connection contains the conductive particles 5, the guide The electric particles 5 may be more stable in the case where the oxygen (4) or the passive layer on the surface of the circuit electrode is broken. The conductive particles 5 as described above may be, for example, Au, Ag, Ni, Cu, or solder. From the viewpoint of obtaining a sufficient pot life, the outermost layer of the conductive particles 5 is not 201204801 of Ni, Cu, etc., if transition metals, preferably AU, Ag, and precious metals of a face metal. In addition, the conductive particles 5 may be conductive particles obtained by coating a fine gold-plated surface such as Νι with a noble metal such as & or the like, or by coating or the like. A conductive layer such as a metal is formed of a non-conductive glass, a ceramic, a plastic, or the like, and the outermost layer is a noble metal-based conductive particle. It is preferable to form a conductive layer by coating or the like. The particles formed of plastic or the hot molten metal particles are used as the conductive particles 5. The particles are deformed by addition and pressurization, so that the contact area with the circuit electrode during connection can be increased, or Circuit The thickness of the circuit terminals of the device is absorbed unevenly, and the reliability of the circuit connection can be improved. The thickness of the cladding layer of the noble metal provided on the outermost layer of the conductive particles 5 is preferably 1 GGA or more. The electric resistance between the connected circuits is reduced. However, when a noble cladding layer is provided on a transition metal such as Ni, the thickness of the cladding layer is preferably 3 or more. The reason is that the transition gold of Ni and the like which is generated when the conductive particles 5 are mixed and dispersed is depleted, and the transition gold (IV) such as Ni is released to the next step, so that the transition metal is free due to the redox action of the transition metal. The free radicals lower the storage stability of the circuit-connecting adhesive film 1G. On the other hand, the upper limit of the thickness of the cladding layer of the noble metal is not limited, but it is preferably less than or equal to μηι from the viewpoint of production cost. . It is preferable that the average particle diameter of the conductive particles 5 is smaller than the minimum interval of the adjacent electrodes of the circuit member connected by the circuit subsequent film 10, and the conductive layer is uneven when the height of the circuit electrode is uneven.

201204801 - The average grain size of II 5 is at this height. The average particle diameter of the guide vane 5 is preferably 1 pm to l 〇 ^ Λ _ μιη more preferably 2 μιη to 5 μιη. If the average particle size ij ij has a tendency that the conductivity of the non-red circuit electrode which cannot correspond to the height of the circuit electrode is likely to decrease, if the average exceeds 1 G μm domain between the adjacent circuit electrodes The insulation tends to be lowered. The amount of the particles 5 to be added is preferably 0.1 parts by mass to 3 parts by mass, more preferably 0.1 parts by mass to 20 parts by mass, based on 100 parts by mass of the total mass of the adhesive composition. # this, it is possible to prevent a short circuit or the like of the adjacent circuit caused by the excessive conductive particles 5. The conductive adhesive layer 3b may further contain insulating particles. Thereby, the internal stress in the conductive adhesive layer after the film is cured is further alleviated. VIII As the insulating particles as described above, the same components as those of the component (d) described above may be used. However, for example, acrylic resin, polyester, polyurethane, polyethylene butadiene, polyaryl vinegar, or the like may be used. Polystyrene, Nitrile Butadiene Rubber 'NBR, Styrene Butadiene Rubber (SBR), polyfluorene-modified resin, etc. or organic containing a copolymer containing these substances as a component particle. Further, for example, inorganic particles such as alumina or alumina can also be used. When the conductive adhesive layer 3b contains insulating particles, (d) the organic fine particles, the insulating filaments, and the conductive phase 5 are compared with respect to the total mass of 100 parts by mass of the adhesive composition 4b. Preferably, it is 8 parts by mass or less, and more preferably 60 parts by mass or less. When the amount of the insulating particles and the conductive particles is more than 8 parts by mass, it is difficult to deposit the conductive particles. 21 201204801 . . . - The tendency of the pir 5 to decrease the adhesion of the electrodes. ^ The edge of the _ 3a thickness is preferably 12 Qing ~ 2 () Qing, ^ = 14 handsome ~ 16 handsome. Further, the conductive adhesive layer =: two is more preferably 5, 〜1 - since each layer = two is good = good: this can make workability, conductive particles capture and read; the thickness of the circuit connecting adhesive film 1G is higher Good for lGjLim~4〇μηι. If the thickness is less than 1 〇, there is a tendency that the benefit method completely reduces the space between the bonded bodies. If the thickness exceeds 4 〇 beer, there is a tendency that: When crimped, the resin will overflow and contaminate surrounding parts. The mixture containing the adhesive composition, such as a mixture of the adhesive composition layer, and the conductive adhesive layer 3b, including the adhesive composition 4b and the conductive particles 5, is divided into a solution or a residual organic solvent. See the liquid solution. The coating liquid is prepared in a week, and the coating liquid is applied, for example, to a substrate (support film), and the solvent is removed at a temperature lower than the activation temperature of the curing agent. The insulating adhesive layer 3a and the conductive adhesive layer 3b can be formed. As another method of forming the insulating adhesive layer 3a and the conductive adhesive layer 3b, a method of heating the constituent components of the insulating adhesive layer 3a and the conductive adhesive layer 3b to ensure flow is exemplified. After the addition, a solvent is added to form a coating liquid, and the coating liquid is applied onto the release substrate, and the solvent is removed at a temperature equal to or lower than the activation temperature of the curing agent. 22 201204801 ' v / ^ vplj The solvent used at this time is preferably a mixed solvent of an aromatic hydrocarbon solvent disk containing an oxonium solvent, from the viewpoint of the solubility of the money 4b. X ' as the exfoliating substrate, for example, a polymer having a hybrid and solvent resistance such as (polyethylene Terephthalate &gt; 7), polypropylene, polyethylene, and polyester, etc. Membrane and the like. The thickness of the peelable substrate | New is 2 〇 μιη to 75 μιη. If the thickness is less than 20/μηι, there is a tendency that it is difficult to perform the temporary pressure bonding, and if the thickness exceeds 75 μm, it is present in the film-attached film F) There is a tendency to wind up. As a method of manufacturing the bonding film 10 for circuit connection, for example, a method of laminating the conductive adhesive layer 4b and the insulating adhesive layer formed as described above, or sequentially coating each layer may be employed. Well-known methods such as methods. The bonding film for circuit connection of the present embodiment can be used as an anisotropic conductive bonding agent for bonding a relatively hard substrate such as glass to a semiconductor element during mounting of a flip-chip glass (Chlp〇n Glass, c0c}). For example, heating and pressurization are performed in a state in which a film for connecting a connection film is interposed between circuit members such as a glass substrate and a semiconductor element, and the circuit electrodes of the two are electrically connected to each other. Here, when a circuit member having a thickness of the substrate of 0.3 mm or less is used, warpage is particularly problematic. In particular, in this case, the bonding film for circuit connection of the present embodiment can be used effectively. 23 201204801 . ...——^iir red 卩 谓 谓 谓 谓 谓 谓 谓 谓 谓 谓 谓 谓 谓 谓 谓 顾 顾 顾 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路Insulating Adhesive Film: The adhesive composition contained in the adhesive layer of the filler is composed of (a) as = 枓, (5) epoxy resin, (4) latent curing agent, and (4) organic micro-f organic recording is selected from Package base) _ acid yard based vinegar _ ethylene copolymer or composite, (meth) acrylic acid burning base ^ (four) 5, =: complex, and money side acrylic copolymer or composite road, "The particles of the vehicle polymer n polymer or composite" are used for the upper side of the first circuit electrode and the second circuit electrode, and the right side of the first circuit board having a thickness of 0.3 mm or less. The surface circuit electrode (four) 1 circuit member and the remaining thickness μ are electrically connected to the second circuit member on which the second circuit electrode is formed on the main surface of the second lightning circuit board. The road structure = two: = the lower limit of the thickness of the circuit board of the film is only required; the dimension: the degree of each is not problematic, and the lower limit is preferably. 〇5 coffee 1 main von 0.08 mm or more. The two or two ports of the circuit electrode of the circuit member disposed oppositely are placed in a state in which the gate is disposed oppositely to the ground, and the pressure is applied, whereby the electricity of the 24 201204801 can be arranged to face each other. Connected to obtain a circuit connection structure. 2 pairs of circuit electrodes arranged in the ground are: and a contact type or a contact mode in direct contact = &lt;circuit connection structure&gt; Fig. 2 shows a 1-way connection in a pair of circuit member states The enamel film % = the mode phase of the body _, and FIG. 3 is a schematic cross-sectional view of the circuit-connected 0 structure body 1UU of the present embodiment obtained by the wire embossing of the lion of FIG. The circuit-connected structure i (8) shown in FIG. 3 includes a substrate 丨 (i-th circuit member) in which a wiring pattern (a ray circuit electrode) is formed on a main surface of a glass substrate ia 乂 1 circuit substrate a semiconductor element 2 (second circuit member) in which a bump electrode 2b (second circuit electrode) is formed on a main surface of an integrated circuit (IC) chip (") 2a (second circuit board), And a cured product 6& and a cured product 6b (connecting portion) of the bonding film 1〇 between the substrate 丨 and the semi-guide boat element 2. In the circuit connection structure 1A, the wiring pattern 讣 and the bump electrode 2b are electrically connected in a state of being disposed opposite to each other. Here, the wiring pattern 1b is preferably formed of a transparent conductive material. I type and use 'Indiurn Tin Oxide (ITO) as a conductive material. Further, the bump electrode 2b is made of a conductive material having a function as an electrode (preferably selected from the group consisting of gold, silver, tin, 25 201204801, a metal of a platinum group, and an IT group). At least one material is formed). In the circuit connection structure 100, the opposing bump electrodes 2b and the wiring patterns 1b are electrically connected to each other via the conductive particles 5. That is, the conductive particles 5 are in direct contact with the bump electrodes 2b and the wiring pattern lb, whereby the bump electrodes 2b and the wiring patterns 1b are electrically connected. In the circuit-connecting structure 1A, the substrate 丨 and the semiconductor element 2 are bonded by the cured product 6a and the cured product 6b of the bonding film 10 for the circuit connection. Therefore, even if the thickness of the #circuit member is thin (〇 When the duty is 3 or less, the distortion of the substrate 1 can be sufficiently suppressed, and excellent connection reliability can be obtained. λ The circuit connection structure 100 as described above can be manufactured via the following step 3. That is, the manufacturing method of the above-mentioned circuit connection 4 GG ' can be manufactured by the following manufacturing method including the following steps: the circuit of the present embodiment is turned over and then the (four) body of a pair of circuit members is obtained. The pair of circuit members includes a substrate 1 (first circuit member) in which a wiring pattern second electrode is formed on a main surface of a board 1a (first circuit board) having a thickness of G3 or less, and a thickness of 〇3 m. The following K: The semiconductor element 2 (second electric) in which the bump electrode 2b (帛2 circuit electrode) is formed on the main surface of the wafer 2a (the second circuit board), and the heating and pressurization of the product ship The connection is formed to form a connection portion which is interposed between the circuit and the wiring _ lb (the second electrode electrode 2b (the second circuit electrode) electrically connected to each other) 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 In the opposite state, the shape of the main surface of the glass substrate la The substrate i having the wiring pattern 1b, the semiconductor element 2 having the bump electrode 2b formed on the main surface of the 1C-day wafer 2a, and the circuit between the substrate 1 and the semiconductor element 2 are connected to the film 1 Heating and pressurizing, electrically connecting the wiring pattern 1b and the bump electrode 2b. The above method can prepare a layered body which is formed in the following manner, that is, 'applied to the circuit connecting surface formed on the substrate Heating and pressurization are performed on the substrate 1, and the connection film for circuit connection 10 is temporarily pressure-bonded to peel off the peelable substrate, and then the semiconductor element 2 is placed on the circuit of the quasi-circuit electrode '-plane The electrode is then heated and pressurized, and the substrate film W and the semiconductor element 2 are sequentially laminated. The adhesion of the substrate and the adhesive composition 4b in the film 1G is connected. By appropriately modulating the above-mentioned laminated body to heat and reduce the secrets, the Weilian flip-over crane 1 () is cured to obtain a sufficient adhesive strength. The connection of the circuit member using the bonding film for circuit connection according to the present embodiment is used. Method The thickness of the circuit member is thin (〇3 mm to suppress the circuit member _, and good connection reliability can be obtained [Example] 27 201204801 Hereinafter, the present invention will be described more specifically by way of examples. However, the present invention is not limited thereto. These examples are as follows: (1) Preparation of an adhesive film for circuit connection is as follows. 'Prepare each material for forming a conductive adhesive layer and an insulating adhesive layer. Further, about 10 mg of a film-forming material is weighed, The Tg of the film-forming material was measured by a DSC apparatus (product name: q1000) manufactured by TA Instruments and in accordance with the regulations of JIS K7121-1987. (a) Ingredients: Film-forming material "FX-316" (manufactured by Tohto Kasei, product name): Phenoxy resin (Tg: 66 °C) (b) Composition: Epoxy resin "EXA-4850- 150" (Manufactured by DIC, product name) "YL-980" (manufactured by Yuka-ShellEpoxy, product name) (c): latent curing agent "Novacure" (manufactured by Asahi Kasei Chemicals, product name) (d) = Organic microparticle "X-52-7030" (manufactured by Shin-Etsu Slicone, product name): poly-oxygenated compound (composite of polyoxyxene rubber and polyoxyl resin) "BTA751" (Solomon) Manufactured by Rohm and Haas, product name): MBS compound "EXL-2655" (manufactured by Rohm and Haas, product name): MBS composite 28 201204801〆(d),: Insulating particles other than (d) "MSP-N〇5〇" ("Nikko Rica" product name). Lean soil complex "R805" (manufactured by Sakamoto Aerosil, product name): Shiki soil (conductive particles) "Micropearl AU" (Sekisui Chemical Manufacturing, Product Name) (Additive) "SH6040" (Toray Dow Corn) (ing) Manufactured product name): decane coupling agent (Example 1) &lt;Electrically conductive adhesive layer&gt; 30 parts by mass of phenoxy resin "fx_316", respectively, 10 parts by mass of epoxy resin "EXA-4850- 150" and "YL-980", 30 parts by mass of latent curing agent "Novacure" and 1 part by mass of Shishi sinter coupling agent "SH6040" dissolved in 1 part by mass of toluene, and then added 19 parts by mass of conductive The particle "Micropearl AU" was prepared to prepare a coating liquid for forming a conductive adhesive layer. The coating liquid was applied to one side using a coating set (manufactured by Kane Seiki Co., Ltd., product name: fine: coater) (PE coated with a coating liquid was subjected to demolding) The film having a thickness of 50 Å in the treatment (intermediate release treatment) was dried by hot air for 1 minute, whereby a conductive adhesive layer having a thickness of 10 μm was formed on the crucible. <Insulating adhesive layer> 29 201204801 , , ιχ The oxy-resin "FX-316" with 28 cases of direct damage, 28 parts by mass of epoxy resin "YL-980", 18 parts by mass of latent curing agent "N〇vacure" and 1 mass After the decane coupling agent "SH6040" was dissolved in 1 part by mass of toluene as a solvent, 15 parts by mass of fine particles "X-52-7030" containing a polyfluorene oxide compound were added to prepare an insulating adhesive. In the same manner as described above, the coating liquid is applied to one side of the coating liquid using a coating device (manufactured by Kane Seiki Co., Ltd., product name: precision coating machine). Molded PET film with a thickness of 50 μm, dried at 7 (TC for 1 minute), borrowed Thus, an insulating adhesive layer having a thickness of 15 (four) was formed on the PET film. <The film for connecting the film> The edge of the bonding layer was bonded with the laminat and heated, and the roll laminator was used. (roller followed by film lamination, obtaining a circuit connection of 25 divisions, (Example 2 to Example 5, and Comparative Example 1 and Comparative Example 2) to prepare a ratio (parts by mass) to add each component, and adjust the same In addition to the coating liquid for forming, it is known as Example 1 to produce an adhesive film for circuit connection.

201204801 . w * w Λ X

[Table 2] Inorganic Insulating Adhesive Layer Conductive Adhesive Layer Example Comparative Example 1 2 3 4 5 1 2 (a) FX-316 38 38 38 38 38 38 38 ---^ 30 (b) EXA-4850- 150 - - - - - - - - 10 YL-980 28 28 28 23 18 28 28 __10 (c) Novacure 18 18 18 18 18 18 18 30 (d) X-52-7030 15 - BTA751 - 15 - - - - EXL-2655 - - 15 - - - - - - - 20 - - - - - - - 30 - - • (4)' MSP-N050 15 - • R805 - 15 Scale Micropearl AU - - 19 SH6040 1 1 1 1 1 1 1 1 (2) Fabrication of circuit connection structure &lt;Preparation of substrate and semiconductor element&gt; ITO (Indium Tin) was formed on the surface of a glass substrate (Corning #1737, 38 mm x 28 mm '0.3 mm thick) Oxide ) The wiring pattern (the pattern width is 50 μηη, and the space between the electrodes is 5 μηη). A 1C wafer (having an outer shape of 17 mm x 17 mm and a thickness of 0.3 mm ′ was used, and the size of the bump was 50 μηι&gt;&lt; 50 μm, and the space between the bumps was 5 μm μ', and the height of the bump was 15 μm) was used as the semiconductor element. &lt;Connection of Substrate and Semiconductor Element&gt; Using the bonding film for circuit connection produced in the above examples and comparative examples, the 1C wafer and the glass substrate were connected as follows. Further, a heating 31 pif 201204801 crimping member composed of a stage (150 mm x 150 mm) and a tool (3 mm x 20 mm) including a ceramic heater was used for connection. The circuit was connected with a conductive film tf/2 of the adhesive film (1.5 mm x 2i) mm, and the PET film was peeled off, and heated and dusted for 2 seconds under the conditions of 80 ° C and 0.98 MPa (10 g 2 ). Thereby, the continuity of the conductive film is attached to: the glass substrate. Then 'connect the circuit with the 凸 以 以 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The conversion pressure is 70 MPa. Then, 1 G seconds of heating and pressurization is performed on the top of the wafer, and the insulating connector layer is attached to the Ic wafer wafer and the Lang substrate for main connection i is made of an electric material to form a film. 3) Evaluation (film formation property) 臈. 2: = "System: connection, followed by formation (4), not - connection: formation A: film formation B: film formation (distortion) Figure 4 is a glass substrate The circuit connection structure shown in Fig. 4, the Mohs cross-section element 2, and the substrate 丨 and the semiconductor element 2 = conductor path connection film UM are extinguished. L indicates when the semiconductor element 2 is to be used. 2 32 201204801 ^ υ / ^uplf The height of the lower surface of the substrate 1 is set to G, the maximum value of the height of the lower surface of the substrate i up to 12.5 mm from the center of the semiconductor element 2 = center. The index is used to evaluate the composition. The smaller the value of L, the smaller the distortion is. The case where the value of L is less than 15 μηη "A", the situation is more than 15 μηι L is set to "Β" to be evaluated in two stages. The evaluation results of the Xuqu are shown in Table 3. Further, the thicknesses of the glass substrate and the 1C wafer in the process of manufacturing the circuit-connected structure were changed from 33 mm to 〇5 mm, respectively, and the circuit connection was made using the above-described examples and comparative examples in the same order as described above. The film is joined to make a joint. After the warpage of the obtained joined body was evaluated, the warpage of the joined body was less than 15 μm. (Connection reliability) The resistance value between the circuit of the glass substrate and the electrode of the semiconductor element was measured using the fabricated circuit connection structure. The measurement was carried out using a multimeter (device name: MLR2, manufactured by ETAC Co., Ltd.) at a temperature of 85 t: and a humidity of 85% RH for 1000 hours of Thermal Humidity Test (THT). Based on the resistance values after the THT test and based on the following criteria, the connection reliability was evaluated in two stages, A or B. The measurement results of the respective circuit connection structures are shown in Table 3. A : less than 10 Ω B : 10 Ω or more 33 201204801 , • μ· w r

[Table 3] Microparticle type film-forming distortion (μιη) Thickness of 0.3 mm, a certain example 1 Polyoxygenated complex _ AA Example 2 MBS complex AA ^~~~~^ Example 3 MBS complex AA Example 4 Mbs composite Γ AA Example 5 MBS composite Γ AAA Comparative Example 1 矽 composite AB Comparative Example 2 AB AB AB The lining AB for circuit connection of the present invention is used even when used to connect thin-thickness path members to each other. Excellent properties are exhibited by film properties, warpage and connection reliability. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. [Brief Description of the Drawings] Fig. 1 is a schematic cross-sectional view showing a film for circuit connection according to an embodiment of the present invention. Fig. 2 is a schematic cross-sectional view showing a laminate in which a bonding film for circuit connection of the present embodiment is inserted between a pair of circuit members. &quot;&quot; Fig. 3 is a schematic view showing a circuit connection structure of the embodiment. 4 is a mode 34 showing a method of evaluating warpage of a glass substrate. 201204801. t */upll [Description of main components] 1 : Substrate la : Glass substrate lb : Wiring pattern 2 : Semiconductor element 2a : 1C Wafer 2b : Convex Block electrode 3a: Insulating adhesive layer 3b: Conductive adhesive layer 4a, 4b: Adhesive composition 5: Conductive particles 6a, 6b: Cured material 10: Connecting film for circuit connection 100: Circuit connection structure 200: Laminated Body L: the maximum height

Claims (1)

201204801 VII. Patent application scope: L A bonding film for circuit connection, comprising: a conductive adhesive layer containing an adhesive composition and conductive particles; a sub-insulating adhesive layer containing an adhesive composition and not containing conductive The above-mentioned adhesive composition package 3 (a) a film-forming material, an epoxy resin, and (c) latent-cured organic fine particles, which are contained in the above-mentioned insulating adhesive layer, are selected from the group consisting of (A) organic fine particles. Acrylic acid ϋ 乙烯 vinyl wire or composite, (?) propylene parentyl ester - complex ruthenium or complex and polymethylene methacrylate copolymer or at least one polymer or complex The constituting particles are electrically connected to the circuit, and the bonding film is used to electrically connect the first circuit and the second electrode in a state in which the ith circuit substrate is below the 丨m path The main surface mu is a type of circuit connection structure, including the first circuit member, and the first surface of the thick plate is formed! In the first circuit-based second circuit member below Li, the second circuit-based circuit electrode of the second d〇3__ is formed on the main surface of the thick 'plate, and the second circuit electrode is provided with 36 201204801 circuit electrode The second circuit electrode is electrically connected to the upper C first circuit electrode; and the connection portion 'between the first circuit member and the second circuit member (four) ΐΪΐ 部 is part of the patent scope 1 or The circuit described in item 2 is connected to a cured product of the adhesive film. Step: 4. A method for manufacturing a circuit-connecting structure, comprising the steps of: obtaining a laminated body between the circuit connecting path and the path member according to the first or second aspect of the patent scope, the above-mentioned Ϊϊϊίϊϊϊ 1st member and second circuit member, the main electrode of the first circuit board of the first circuit Cmm or less, the second circuit member has a thickness of 0.3 = , 2, and the second main surface of the circuit board is formed with a second surface a circuit electrode; and the film is heated and pressurized to connect the circuit to the horn; and the connecting portion is interposed between the pair of the first circuit electrodes disposed opposite to the m. The method of electrically connecting the electrodes to the above-described circuit configuration includes a "electric" f-circuit member in which the electrodes are disposed opposite to the second circuit electrode, The second circuit member and the bonding film for circuit connection disposed between the above-mentioned ί ^ V and the second circuit member are added to the US, and the second circuit member is in the thickness. The following materials 37 2012 04801, u, the first circuit electrode is formed on the main surface of the board, and the second circuit electrode is formed on the main surface of the second circuit board having a thickness of 0.3 mm or less. In the use of the film for circuit connection, the adhesive film includes: a conductive adhesive layer containing an adhesive composition and conductive particles; and an insulating adhesive layer containing an adhesive composition and containing no conductive particles. The adhesive composition contained in the adhesive layer comprises (a film-forming material, (b) an epoxy resin, a latent curing agent, and organic fine particles, and the organic fine particles are selected from the group consisting of (indenyl)acrylic acid-containing rL. At least one polymer or composite of a group of olefinic styrene copolymers or composites, (meth)acrylic acid groups, or complexes, and polyfluorene-(meth)acrylic acid copolymers The constituting particles are electrically connected to the first circuit member and the electric member, and the first imaginary circuit member is electrically connected to the first circuit 2 in a state in which the i34 is connected to the circuit (4). The second circuit member is formed on the main surface of the ith circuit board, and the second circuit electrode is formed on the main surface of the λ circuit board having a thickness of G.3 mm or less. The conductivity is further covered with insulating particles.