TW201224440A - Inspection device - Google Patents

Abstract

The invention provides an inspection device that can obtain correct information on a transparent inspection object adhered to a tape by using a transmitted illumination. The inspection device (10) includes: an observation optical system (11) for configuring the specified location of the observation optical axis (Oa) as an observation plane (Fp); a reflection lighting mechanism (12) for illuminating the observation plane (Fp) from the side of the observation optical system; and a transmission illumination mechanism (14) for illuminating the observation plane (Fp) from the reverse side of the observation optical system. The transmission illumination mechanism (14) includes: an emission part (53) for emitting the transmission light guided from a light source (51); and a scattering part (35b) for scattering the transmission light from the emission part (53). The scattering part is arranged with a prescribed interval from the observation plane (Fp) when being viewed in a direction of a transmission optical axis (Pa) of the transmission illumination mechanism (14), in order to make the transmission light at the observation plane (Fp) to be a prescribed scattering state.

Description

201224440 SUMMARY OF THE INVENTION Technical Field of the Invention The present invention relates to an inspection apparatus for inspecting a semiconductor element as an inspection object. [Prior Art] It is known that an semiconductor element such as an LED chip is inspected by observing the semiconductor element with an observation optical system while irradiating various kinds of illumination light, and the semiconductor element is inspected as an inspection object (for example, refer to the patent) Document 1). In the inspection apparatus, as the illumination light, the transmission illumination from the transmission illumination mechanism that illuminates the inspection object from the opposite side of the observation optical system from the inspection object is used. Here, it is common that the semiconductor element is cut out from the wafer while being adhered to the tape (film), and is processed while the tape is held by the ring member. Therefore, in the inspection apparatus, a cylindrical holding table provided on the inner side of the annular member from the opposite side of the observation optical system is considered in order to perform the inspection while maintaining the state. In the state in which the tape is held by the holding table, depending on the material of the tape, the weight of the inspection object, or the like, the tape may be deflected, and it may be difficult to perform appropriate observation by the observation optical system. Therefore, in the conventional inspection apparatus, it is considered that an output portion having a long rod shape and a flat front end surface as an emission surface is provided in the transmission illumination unit, and is lifted by the holding table by the emission surface of the injection portion. With this, the inspection object is placed at an appropriate observation position (observation surface) of the observation optical system to perform inspection.

S-5-201224440 [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2010-107254. SUMMARY OF THE INVENTION (Problems to be Solved by the Invention) However, in an emitting portion as a transmissive illumination mechanism, it is necessary to provide an optical element for emitting transmitted light and an outer frame portion for protecting and holding the optical element. Therefore, due to the interference of the outer frame portion and the inner wall of the holding table, the irradiation region of the belt held by the holding table can be appropriately irradiated by the transmitted light, that is, the effective inspection region using the transmitted illumination is larger than the inner portion of the holding table. small. In other words, the inside of the holding table cannot be used as the effective inspection area to the utmost extent, and the work efficiency of the inspection is lowered by the holding table of the holding belt. The present invention has been made in view of the above circumstances, and an object thereof is to provide an inspection apparatus capable of efficiently and appropriately inspecting an inspection object attached to a belt held by a ring-shaped member by using transmission illumination. (Means for Solving the Problem) The invention of claim 1 is an inspection apparatus including: an observation optical system that sets a predetermined position on an observation optical axis as an observation surface; and a reflection illumination mechanism from which the observation optical system a side of the observation surface; illumination; a transmission illumination mechanism that illuminates the observation surface from the opposite side of the observation optical system; and a holding table that can hold the loop of the tape to which the inspection object -6-201224440 is adhered The inside of the member is held by the side of the transmissive illumination means, and the inspection apparatus is characterized in that the transmissive illumination means has an emission portion that is sourced from the outside of the holding table, and the holding table has a transmissive member a plate-shaped* having a flat surface defining a plane along the observation surface on the side of the observation optical system, and a transmission* and a fil adjustment mechanism for transmitting light emitted from the injection portion, which are in front of each other The invention in which the transmissive member is held in a manner in which the position of the stomach is adjusted in the direction of the direction is the inspection device of claim 1, Characterized in that, related to the observation optical axis direction position adjusting means in the optical axis direction of the observation position and inclined with respect to the observation optical axis direction. The invention of claim 3, wherein the position adjusting mechanism is capable of viewing the flat surface in comparison with the aforementioned belt in the holding table by observing in the direction of the observation optical axis The invention of the present invention, wherein the inspection device of any one of claims 1 to 3 is further characterized in that the inspection device of the present invention is further provided at an outer position of the transmissive member. The pressing mechanism that presses the side of the emitting portion toward the optical axis direction is observed. The invention of claim 4 is the inspection device according to claim 4, wherein the pressing mechanism presses the ring-shaped member at an outer position of the holding table. The invention of claim 6 is the inspection device of claim 4, wherein the pressing mechanism is in the holding table to surround the transmissive member

The S 201224440 method draws between the transmissive member and the portion holding the band. The inspection apparatus according to any one of claims 1 to 6, wherein the injection unit has a collecting optical member that reduces diffusion of transmitted light of the guided light so as to be oriented at a predetermined dot area. The transmissive member is incident on the transmitted light. The invention of claim 7 is characterized in that the concentrating optical member is a rod integrator having a function of uniformizing a light amount distribution observed in a cross section orthogonal to a transmitted optical axis. Optical member 〇 According to the inspection apparatus of the present invention, since the emitting portion of the transmissive illumination unit is configured to illuminate the observation surface from the outside of the holding stage, it is possible to reliably prevent the injection unit and the holding stage from interfering with each other. Therefore, since the entire area on the inner side of the holding table can be irradiated with the transmitted light, the inner side of the holding table can be set as the effective inspection area over the entire area, and the effective inspection area can be ensured to the utmost. Further, in the inspection apparatus, the belt held by the holding table is flattened by the flat surface of the transmission member provided on the holding table, so that the inspection object attached thereto can be positioned on the observation surface, and therefore, even the transmission illumination The emitting portion of the mechanism is configured to illuminate the observation surface from the outside of the holding table, and can also be appropriately observed by the observation optical system. Further, in the inspection apparatus, since the position adjustment mechanism can adjust the position of the observation optical axis with respect to the holding stage by the position adjustment mechanism, the inspection object attached to the belt can be made more according to the amount and state of the deflection of the belt. Properly located on the viewing surface. -8 - 201224440 In addition to the above configuration, when the position adjustment regarding the direction of the observation optical axis refers to the position in the direction of the optical axis and the inclination in the direction of the observation optical axis, the amount of deflection of the belt can be varied. And the state is such that the inspection object attached to the belt is more appropriately positioned on the observation surface. In addition to the above configuration, the position adjustment mechanism can position the transmission so that the flat surface is positioned closer to the observation optical system side than the holding position of the belt in the holding stage in the observation of the optical axis direction. In the case of the member, the inspection object attached to the belt can be positioned more appropriately on the observation surface. In addition to the above-described configuration, when the pressing mechanism that presses the belt toward the emission portion side in the direction of the observation optical axis is provided at the outer position of the transmissive member, the pressing of the pressing mechanism can be used to simulate the flat surface of the transmissive member. The tape is flattened and fixed at the same time. Therefore, the inspection object attached to the tape can be appropriately inspected. In the above configuration, when the pressing means presses the annular member at the outer position of the holding table, the belt can be reliably flattened and fixed simultaneously by the pressing of the pressing mechanism in accordance with the flat surface of the transmitting member. In addition to the above configuration, when the pressing means sucks between the transmitting member and the portion holding the belt so that the holding means surrounds the transmitting member, the remaining amount of the flexural deformation of the belt can be introduced. Therefore, the inspection object attached to the belt can be appropriately positioned on the observation surface, and the above-described injection portion can have a light guide.

S -9-201224440 A concentrating optical member having a reduced diffusion of transmitted light, so that when a transmitted light is incident on the transmitting member at a predetermined dot area, an appropriate region of the observation surface with respect to the observation optical system can be irradiated, It is possible to perform an appropriate observation of the observation optical system more efficiently. In addition to the above configuration, when the concentrating optical member further has a rod integrator optical member that functions to uniformize the light amount distribution observed in a cross section perpendicular to the transmitted optical axis, the observation optical system can be performed. More appropriate observation. [Embodiment] Hereinafter, each embodiment of the inspection apparatus of the present invention will be described with reference to the drawings. [Embodiment 1] First, a schematic configuration of an inspection apparatus 10 according to Embodiment 1 of the present invention will be described. Fig. 1 is an explanatory view showing a configuration of an inspection apparatus 10 as an example of an inspection apparatus according to the present invention. Fig. 2 is a block diagram showing the functional configuration of the inspection apparatus 10. In addition, in FIG. 5, for the sake of easy understanding, the wafer 41 and the tape 42 in the inspection target workpiece 40 are omitted and displayed. As shown in FIG. 1 and FIG. 2, the inspection apparatus 1 is substantially constituted by the observation mechanism u and the reflection illumination mechanism 12. The holding mechanism 13 and the transmission illumination unit 14 and the control unit 15 are configured. As shown in Fig. 1, the inspection apparatus 10 has a main body portion 21. The main body portion 21 is provided with a relay lens (not shown) and a turntable portion of the loop type -10-201224440, and a plurality of objective lens barrels 22 are provided in the turntable portion. An objective lens 23 is provided on each of the objective lens barrels 22. A camera 24 is attached to the upper portion of the main body portion 21. The camera 24 can acquire image data of a predetermined position on the optical axis (observation optical axis 〇a) via the objective lens 23 and the main body portion 21 (relay lens) at a magnification determined by the set objective lens 23. Therefore, the camera 24, the main body portion 21, the objective lens barrels 22, and the objective lens 23 function as observation optical systems in the observation mechanism, and the optical axis thereof is the observation optical axis Oa. Further, the position including the position at which the camera 24 on the observation optical axis 〇a can obtain an appropriate image, that is, the focus position in the observation optical system and orthogonal to the observation optical axis 〇a (the imaging surface on the object side) is observed. Face Fp. In the following, the direction in which the optical axis Oa is observed is referred to as the Z-axis direction, and the plane orthogonal thereto is defined as the X-Y plane. The image data acquired by the camera 24 is appropriately analyzed by an image control unit 61 described later, and can be displayed on the monitor 39 (see FIG. 2). ^ Inside the main body portion 21, the optical axis is observed. A reflecting member 25 composed of a translucent mirror or a prism is provided on a. In the main body portion 21, the light guiding fibers 27 are attached via the connector portion 26 in the reflection direction from the observation optical axis 0a by the reflection member 25. The light guiding fiber 27 can guide the irradiation light emitted from the coaxial light source 28 to the reflecting member 25. As shown in Fig. 2, the coaxial light source 28 selectively illuminates both the halogen lamp 28 8 a and the flash discharge tube 28 8b, and either of the light beams can be emitted toward the optical fiber 27 . As shown in Fig. 1, the illumination light emitted from the coaxial light source 28 can travel on the observation optical axis Oa via the light guiding fiber 27 and the reflection member 25, and the objective lens 23 of each objective lens barrel 22 is on the observation optical axis 〇a. Observation surface Fp

S -11 - 201224440 Lighting. Therefore, the coaxial light source 28, the light guiding fiber 27, and the reflecting member 25 are used in the coaxial direction for generating the inspection object (44) to be described later to the observation optical system by cooperation with the objective lens 23 of each objective lens barrel 22. The reflected illumination mechanism 1 2, that is, the coaxial epi-illumination mechanism 29 functions. The main body portion 21 is movable in the direction of the observation optical axis 〇 a (Z-axis direction) by a Z-axis drive mechanism 66 (see Fig. 2) to be described later. Therefore, the observation optical system and the coaxial epi-illumination mechanism 29 in the observation mechanism 1 1 can integrally move in the observation optical axis Oa direction (Z-axis direction). Further, as shown in Fig. 1, an annular disk 30 for illuminating light is provided on the main body portion 21 so as to surround the outer circumference of the objective lens barrel 22. Although the illuminating light retracting annular disk 30 is not shown, a plurality of light emitting portions are provided so as to surround the observation optical axis Oa at a predetermined interval from the observation optical axis Oa, and each of the light emitting portions can be viewed from the opposite optical axis. The direction in which Oa is tilted is irradiated toward the observation surface Fp. The light guiding fiber 31 is attached to the annular disk 30 for illumination light retracting. The light guiding fiber 3 1 can guide the light emitted from the ring light source 3 2 to the respective light emitting portions (not shown) of the circular ring 30 for illumination light. As shown in Fig. 2, the circular light source 32 selectively emits both the halogen lamp 32a and the flash discharge tube 32b, and either of the light beams can be emitted toward the optical fiber 31. As shown in Fig. 1, the irradiation light emitted from the circular light source 3 2 can be inclined from the light-emitting portions (not shown) of the circular disk 30 for illumination light extraction through the light guiding fibers 31 with respect to the observation optical axis Oa. The direction illuminates the observation surface Fp. Therefore, the annular light source 32, the light guide fiber 31, and the illumination light retracting annular disk 30 (the respective light-emitting portions) are used to generate an inspection object (44) to be described later with respect to the observation optical system-12-201224440. The reflected illumination means 2, that is, the oblique illumination means 33, which reflects the reflected light in the direction in which the optical axis 0a is inclined, functions. The illuminating light retracting annular disk 3 can be moved in the observation optical axis 〇 a direction (Z-axis direction) by a Z-axis driving mechanism 66 (see Fig. 2) which will be described later. The movement in the direction of the observation optical axis 〇a may be integral with the main body portion 21 or may be independent of each other. A holding mechanism 13 is provided below the main body portion 21 and the annular disk 3 for illuminating light. This holding mechanism 13 has a holding table 34. As shown in Fig. 3, the holding table 34 has a cylindrical shape with a step, and the annular front end portion 34a constitutes a holding portion of an inspection object (44) to be described later. An annular annular groove 34b is provided in the front end portion 34a, and an intake hole 34c for evacuating is provided in the groove. Therefore, the holding belt 34 can be sucked and held by the front end portion 34a as will be described later (see Fig. 4 and the like). A transmission table 35 is provided inside the holding table 34 on the inner side thereof. As shown in FIG. 1 , FIG. 3 , FIG. 5 and FIG. 6 , the upper end surface 35 5 a of the upper surface (viewing optical system side) of the transmission plate 35 in the shape of a disk is a flat surface, and the lower side (transmission illumination mechanism 14) The lower end surface 35b of the irradiation mechanism unit 丨6 side to be described later is a scattering surface. In the first embodiment, the upper end surface 35& is a honed flat surface, and the lower end surface 35b is set in consideration of a diffusion ratio or the like from the viewpoint of obtaining a scattering effect as will be described later. The transmission table 35 is formed of a transparent member (transmission member) that allows transmission of at least the transmitted light emitted from the illumination mechanism portion 16 (the emission portion 5 3 ) of the transmission illumination unit 14 to be described later. In the first embodiment, Glass is formed. The lower end of the peripheral portion of the transmission table 35 is supported from below via a support frame 36 (see Fig. 6). As shown in FIG. 13-201224440, the support frame 36 has an annular shape and is supported from below by a plurality of z-axis screws 37 (only one is shown in FIG. 6), and a plurality of orthogonal axes are screwed. The member 38 (only one movement in the upper side in the Z-axis direction (observing the optical system side) is shown in Fig. 6. The respective joining members 37 are provided to penetrate the holding table 34 in the Z-axis direction, and can be positioned in the Z-axis direction by the 37a. The Z-axis screwing member 37 is three or more less than a predetermined interval when viewed in the direction of rotation about the Z-axis. The front end of each of the orthogonal-axis screw members 38 has a conical shape and an upper end position of the support frame 36. Therefore, in the table 34, the position (height position) of the body viewed in the Z-axis direction, that is, the direction of the observation optical axis 〇a can be adjusted by appropriately changing the support of each of the Z-axis screw members 37, and the relative observation The transmission table 35 is provided on both sides of the transmission ΐ upper end surface 35a) of the optical axis Oa. Therefore, the shaft screwing member 37 and each of the orthogonal-axis screwing members 38 are kept transparent with respect to the positional adjustment with respect to the observation optical axis 〇a with respect to 34! The position adjustment mechanism functions. The thickness dimension of the transmission stage 35, that is, the interval between the upper end surface 35a and the lower end is set by the following three points depending on the optical characteristics and hardness of the transmission table 35. In the first embodiment, the transmission table has a 3 degree dimension of 5 cm to 15 cm, and the first uniform size is the first point which is emitted from the illumination unit 16 of the transmissive illumination unit 14 and is incident on the lower end surface 35b. The predetermined amount of light can be secured by the light emitted from the upper end surface 35a. This is because, in the transmissive image, the image taken by the camera 24 through the observation optical system is combined and passed through) the Z-axis screw nut is pressed to set it to the shape, and the holding position is f 35 35 35 ( Each Z holding table time table 3 5 surface 3 5b side 5 thick 〇 机构 出 观察 观察 观察 观察 观察 观察 观察 观察 观察 观察 观察 观察 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - The upper limit of the thickness dimension of 35. The second point is that since the lower end of the peripheral portion is supported from below, the amount of deformation of the deflection due to the central position is within a predetermined range. As will be described later, in the transmission table 35, since the upper end surface 35a has a function of positioning an inspection object (44) to be described later on the observation surface Fp which is an appropriate position in the observation optical system, it is necessary to spread the upper end surface 35a over the entire surface. The observation surface Fp is observed. Therefore, the predetermined range among the above-described deformation amounts is the depth of field in the observation optical system at most. This mainly affects the lower limit 厚度 of the thickness dimension of the transmission stage 35. The third point is that The transmitted light emitted from the end surface 35a sufficiently obtains the scattering effect by the lower end surface 35b which becomes the scattering surface. Specifically, the transmitted light that is emitted from the belt 42 on the observation surface Fp, that is, the transmitted light emitted from the upper end surface 35a is provided. The degree (roughness) of the scattering surface of the lower end surface 35b is set in a predetermined manner for the predetermined scattering state. Here, the predetermined scattering state means that a plurality of shadows of the strip 42 in the image data from the camera 24 are prevented. The portion is generated, that is, when the belt 42 on the observation surface Fp of the transmitted light from the transmissive illumination unit 14 is received by the camera 24 through the observation optical system, the strip 42 is uniformly bright in the image data. As shown in Fig. 1, the holding table 34 holding the transmission table 35 is movable on the XY plane orthogonal thereto by the XY drive mechanism 64 (see Fig. 2), which will be described later, with respect to the observation optical axis 0a (observation optical system). The holding table 34 is rotatable about the z-axis by a rotation drive mechanism 65 (see FIG. 2) to be described later. The inspection target 34 is sucked and held by the holding table 34.

As shown in Fig. 4, a tape (film) 42 to which a wafer 4 1 (including a glass substrate or the like) is attached is held inside the annular member 43 to constitute an inspection target workpiece 40. In the inspection target workpiece 40, a plurality of semiconductor elements 44 formed of the wafer 41 as shown in (a) have a state of being cut (cut) at each boundary surface while being held by the tape 42, and as in (b) The state in which the tape 42 is stretched after being attached to the tape 42 and cut, and each is cut (expanded). Here, the annular member 43 is set to have a larger diameter than the front end portion 34a of the holding table 34 (refer to Fig. 1) regardless of the state difference (the type of the inspection target workpiece 40). In the inspection apparatus 10, it is possible to check whether or not the respective semiconductor elements 44 are properly formed in any of these states. Therefore, each of the semiconductor elements 44 is used as an inspection object, and the inspection object can be inspected while maintaining the state in which the inspection target workpiece 4 is maintained. As shown in Fig. 1, Fig. 5, and Fig. 6, in the inspection target workpiece 40, the holding table 34 is located inside the annular member 43, and the annular groove is used in a state where the tape 42 is placed on the front end portion 34a. The action of 34b and the suction hole 34c sucks and holds the belt 42 at the front end portion 34a. At this time, in the holding table 34, when the upper end surface 35a of the transmission table 35 is located above the front end portion 34a (adsorption holding position) (observing the optical system side), the belt 42 is located inside the portion where the suction is held. Since the region is stretched by the upper end surface 35a of the transmission table 35, it is flattened so as to be attached to the upper end surface 35a (see Fig. 1). Therefore, by adjusting the position of the transmission table 35 with respect to the observation optical axis 〇a, the inspection object (each semiconductor element 44) attached to the tape 42 can be positioned on the observation surface Fp in an appropriate state. Below the holding table 34, an irradiation unit -16 - 201224440 mechanism portion 16 (see Fig. 1) as the transmission illumination unit 14 is provided. As shown in Fig. 1, the transmission illumination unit 14 illuminates the transmitted light from the opposite side of the observation optical observation mechanism 1 1 to the inspection object (each semiconductor element 44) held by the holding stage 34. The transmissive illumination has an illumination mechanism unit 16. The irradiation mechanism unit 16 can guide the transmitted light emitted from the transmission light source 51 via the later-described portion 52 to a light emission to be described later. As shown in Fig. 2, the transmission light source 51 selectively emits light from both the lamp 51a and the flash discharge tube 51b, and either of the light-emitting uniform portions 52 is emitted. As shown in Figs. 5 and 6, the illumination mechanism unit 16 further includes a light guide portion 53 and a support portion 54 in addition to the light source 51 (see Fig. 2). The light guide portion 52 is not shown, but the incident surface on the side is provided so as to be incident on the side of the light (transmitted light) that is emitted from the light source 51a (see FIG. 2) and the flash lamp 51b. The transmitted light from the transmission light source incident on the incident surface as shown in Fig. 2) is guided to the exit surface 52a (6) provided on the other end side. This light guiding portion 52 is formed of an optical fiber in the first embodiment. The emitting portion 53a of the portion 52 is connected to the emitting portion 53 (see Fig. 6). The injection portion 53 is configured by accommodating at least one or more optical elements in the cylindrical casing 53a. The optical element 53b constitutes an incident surface 53c that faces the light guiding window emitting surface 52a, and an incident surface 53d that is incident thereon. The optical element 538b has a characteristic characteristic such that the incident light from the incident surface 53c is emitted from the exit surface 53d as a desired state. A spin-adsorption system that is a central axis position of the optical element 533b (the light-guiding portion 53 of the hairspring 14 allows the halogen-transmissive transmission 52 to be incident on one end of the halogen type 51 (refer to the figure in the light guide) 53b; 52 of the transmitted light of the fixed light symmetry

S -17- 201224440 The axis is the transmission optical axis Pa (see Fig. 1) of the illumination mechanism unit 16 (transmission illumination unit 14 (transmission illumination system)). In the irradiation mechanism unit 16, when the transmitted light is incident from the light guiding unit 52 to the emitting unit 53, the transmitted light along the transmitted optical axis Pa is emitted from the emitting unit 53. The predetermined optical characteristic of the optical element 53b is such that the light amount distribution observed in the cross section orthogonal to the transmitted optical axis Pa in the traveling direction is made uniform, and the expansion (diffusion) of the irradiation area is suppressed. The optical element 53b is composed of an optical element having the above-described predetermined optical characteristics (integrator function and anti-diffusion (concentrating) function). In the first embodiment, the optical element 53b is composed of a rod integrator optical member. Further, in the first embodiment, the lower end portion 53e of the casing 53a located below the incident surface 53c of the optical element 53b is formed into a tubular shape, and the other end portion of the light guiding portion 52 (the emitting surface 52a is provided) The end of one side is embedded inside. Therefore, the emitting portion 53 and the light guiding portion 52 are connected to the lower end portion 53e of the emitting portion 53 by the other end portion of the light guiding portion 52, and the emitting surface 52a of the light guiding portion 52 and the incident surface 53c of the emitting portion 53 are butted to each other ( connection). In this state, the light guiding portion 52 and the emitting portion 53 are fixedly supported by the support portion 54. Therefore, in the irradiation mechanism unit 16, the transmitted light emitted from the transmission light source 5 1 can be made to travel toward the emission unit 53 via the light guiding unit 52, and the substantially parallel light which is a uniform light amount distribution is directed from the emitting portion 53 toward the transmitted light. The axis Pa (see Fig. 1) is emitted in the direction of the lower end surface 35b of the transmission table 35. This transmitted light passes through the lower end surface 35b of the scattering surface to become scattered light, and illuminates the observation surface Fp from the back side. The transmitted light transmits at least the tape 42 adsorbed and held by the inspection target workpiece 40 of the holding table 34, and can be observed by the observation optical system (photograph -18-201224440 camera 24) (refer to Fig. 1). Therefore, the irradiation mechanism unit 16 (the transmission light source 51, the light guiding unit 52, and the emission unit 53) cooperates with the lower end surface 35b of the transmission table 35 that serves as the scattering surface, and generates the observation surface Fp as the opposite side of the observation optical system. The transmitted light illuminating mechanism 14 of the object (semiconductor element 44)) functions. In the first embodiment, the transmission optical axis Pa is set in parallel with the Z-axis direction, and the position of the illumination mechanism portion 16 with respect to the observation optical system is set such that the transmission optical axis Pa and the observation optical axis Oa are coincident. Further, the 'transmission illumination mechanism 14 can satisfy the observation range of the transmitted light viewed on the observation surface Fp by the optical element 53b of the illumination mechanism portion 16 composed of the rod integrator optical member, which is observable by the observation optical system (camera 24). The way to observe the area is set. In the inspection apparatus 1A, the observation mechanism 1 1 , the reflection illumination mechanism 1 2, the Bao 1 temple mechanism 13 and the transmission illumination mechanism 14 configured as above are collectively controlled under the control of the control unit 15 (see Fig. 2). As shown in Fig. 2, the control mechanism 15 has an image control unit 61, an illumination control unit 62, and a drive control unit 63. The image control unit 61 appropriately analyzes the image data acquired by the camera 24. This analysis includes identifying the contour lines of the plurality of inspection objects (semiconductor elements 44) attached to the tape 42, determining the focus state of the observation points, identifying defects in the respective inspection objects, and identifying the electrodes provided in the respective inspection objects. There are disadvantages such as wiring and the like, and it is possible to recognize that each inspection object (semiconductor element 44) is cut out from the wafer 41 or the like. Further, the image control unit 61 displays an image based on the image data acquired by the camera 24 on the monitor 39. The illumination control unit 62 pairs the coaxial light source 28, the ring light source 32, and

S -19- 201224440 The transmission light source 51 is appropriately subjected to the lighting-off control. That is, in the coaxial light source 28, the circular light source 32, and the transmission light source 51, the illumination control unit 62 selectively makes the halogen lamps (28a, 32a, 51a) or the flash discharges (2 8b, 3 2b, 51b) suitable locations. The light is turned off, and the coaxial light 28, the circular light source 32, and the transmission light source 51 are turned on or off individually or individually. The halogen lamps (28a, 32a, 51a) are used as illumination for observation, and the flash discharge tubes (28b, 32b, 51b) are used as illumination for inspection. The illumination control unit 62 can be incorporated in each of the light sources (28, 32, 51). Bright adjustment of the flash discharge tubes (28b, 32b, 51b) as illumination for inspection. This brightness adjustment can be realized, for example, by appropriately selecting any one of a plurality of ND screening processes. The drive control unit 63 is adapted to drive and control the XY drive mechanism 64, the rotary drive mechanism 65, and the Z-axis drive mechanism 66. In other words, the drive control unit 63 overdrives and controls the Z-axis drive mechanism 66, and can appropriately move the optical system and the coaxial epi-illumination mechanism 29 in the observation mechanism 1 in the Z-axis direction in the direction of the observation optical axis 〇a). The oblique illumination mechanism 3 3 is appropriately moved in the direction of the optical axis 〇a (z-axis direction). Thereby, the inspection object (each semiconductor element 44) adsorbed and held by the inspection object 40 of the holding stage 34 can be appropriately observed under appropriate illumination. Further, the drive unit 63 controls the XY drive unit 64 and the rotation drive mechanism to drive the holding unit 34, that is, the inspection target workpiece 40, to the observation optical axis Oa (observation optical system) and the transmission optical axis Pa. The mechanism portion 16) is suitably moved on the 丫-plane orthogonal thereto, and can be used to make a tube-passing source and a tweeting-type view around the observation optical axis 〇a (transmission optical axis Pa (z-axis direction)) (When the industrial control 65 phase shoot) -20- 201224440 should be rotated. Thereby, the inspection object (semiconductor element 44) that is adsorbed and held at any position in the inspection dance workpiece 40 of the holding table 34 can be inspected in the control mechanism 15, and the adsorption operation in the above-described holding 34 can be performed. Control, etc., and comparison of map materials for inspection and the like can be performed. In the inspection apparatus 10, first, the position adjustment of the inspection axis 〇a of the transmission table 35 is performed based on the workpiece 40 to be inspected to which the inspection object to be inspected is attached. This is because of the following reasons. In the inspection device 10, the belt 42 is held at the inner end position of the annular member at the distal end portion 34a of the holding table 34. Therefore, the peripheral portion of the belt 42 is supported from the lower side, and thus the central portion may be trapped. The way the deflection is deformed. Therefore, due to the deflection, it is feared that the semiconductor elements 44 on the tape 42 are separated from the observation surface Fp and cannot be properly observed by the observation optical system (camera 24). The amount and state of the deflection of the belt 42 differ depending on the material of the belt 42 or the position and number of the semiconductor elements 44 to be bonded, and therefore, depending on the type of the workpiece 40 to be inspected. Therefore, the holding target 34 is sucked and held in the form of the inspection target workpiece 40 so that the semiconductor elements 44 on the belt 42 are positioned on the observation surface Fp, and the transmission is adjusted according to the amount and state of the deflection of the belt 42. The Z axis of the stage is the position (height position) observed in the direction of the optical axis Oa and the inclination of the stage 35 (upper end surface 35a) with respect to the observation optical axis Oa. At this time, the greater the flexural deformation of the belt 42, the more the upper surface 35a of the transmission table 35 is located at the front end portion 34a of the holding table 34 (the suction holding position is like the state of the image of the slanting image 43) Double-ended)

S -21 - 201224440 More above (observing the optical system side). This is because of the following reasons. When the upper end surface 35a of the transmission table 35 is located above the front end portion 34a of the holding table 34, the region of the belt 42 located further inside than the portion to be adsorbed and held is upward by the upper end surface 35a of the transmission table 35. Since it is stretched, it is flattened so that the tape 42 may be attached to the upper end surface 35a. Therefore, according to the flexural deformation of the belt 42, by positioning the upper end surface 35a of the transmission table 35, the inspection object (each semiconductor element 44) attached to the belt 42 can be positioned on the observation surface Fp in a more appropriate state. At this time, needless to say, the observation mechanism 1 1 , the reflection illumination mechanism 12 , and the illumination mechanism portion 16 of the transmission illumination mechanism 14 are appropriately moved in the Z-axis direction in accordance with the height position on the upper end surface 35 a of the transmission table 35 . The amount and state of the deflection of the belt 42 can be obtained, for example, by analyzing the image data from the camera 24 in the image control unit 61. Then, in the inspection apparatus 10, the inspection target workpiece 40 is sucked and held by the holding table 34 to perform wafer scanning. In the wafer scanning, the drive control unit 63 is driven by the drive control unit 63 so that the inner position of the front end portion 34a of the holding table 34, that is, the inner position of the inspection target workpiece 40 (the belt 42) is located inside the suction holding portion. The holding table 34 is moved relative to the observation optical axis 〇a. In this scanning, an image obtained by the camera 24 is obtained while irradiating the transmitted light from the transmissive illumination unit 14. Next, the wafer pattern is produced. This wafer map shows the position and posture of each inspection object (semiconductor element 44) in the inspection target workpiece 4 (band 42). In the control unit 15 , the image control unit 6 丨 analyzes the image data from the camera 24 scanned by the wafer, and recognizes the contour -22-201224440 line, thereby discriminating the plurality of inspection objects attached to the belt 42. (Semiconductor element 44) 'and' the position and posture of each inspection object (semiconductor element 44) are acquired by the movement position information of the drive control unit 63. Next, the inspection object (semiconductor element 44) is determined. In this determination, the observation position of the observation optical system is determined based on the created wafer map, and the holding table 34 is moved by the drive control unit 63 in accordance with the determination. Then, the inspection target object (semiconductor element 44) at the observation position is compared with the data of the qualified product of the inspection object, and it is judged whether or not the inspection object (semiconductor element 44) is excellent. Whether or not this is excellent is determined by analyzing the image data from the camera 24 by the image control unit 61. All the inspection objects (semiconductors) on the inspection target workpiece 40 (tape 42) are produced by the wafer map created. The element 44) sequentially determines the inspection target object (semiconductor element 44), and ends the inspection of the inspection target workpiece 40. Further, the inspection may be performed by visually displaying an image of the image data obtained by the camera 24 on the monitor 39 under the control of the image control unit 61. (Technical Problem) Next, a technical problem will be described with reference to Figs. 7 to 9 . Fig. 7 is an explanatory view showing a configuration of a holding mechanism 13' and a transmission illumination mechanism 14' of the inspection apparatus 10' for explaining the technical problem. The inspection device 10' is such that the inspection device 10 of the embodiment 1 is not provided with transmission on the holding table 34'.

S -23- 201224440 The stage 35 and the transmission illumination mechanism 14' (the illumination mechanism unit 16') are used in different ways and functions. The basic configuration of the inspection device 10' is the same as that of the above-described inspection device 1A. Therefore, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted. First, in the semiconductor element to be inspected, the inspection target workpiece 40 (see FIG. 4) in a state in which the tape (film) 42 to which the wafer 41 is attached is held inside the annular member 43 is usually directly processed. Therefore, it is preferable that the inspection of the plurality of semiconductor elements 44 directly processes the workpiece (40) to be inspected. Therefore, in the inspection apparatus 10', as described above, the belt 42 holding the inner position of the annular member 43 is sucked by the front end portion 34a of the holding table 34', and the observation mechanism 1 1 and the reflection illumination mechanism 12 are used (refer to FIG. 1). And the transmission illumination mechanism 14' performs inspection of the respective semiconductor elements 44 attached to the tape 42. In this case, in order to position the semiconductor element 44 as the inspection target object on the observation surface Fp which is an appropriate portion of the observation mechanism 11 (the observation optical system (the camera 24 (see FIG. 1))), it is necessary to attach the respective semiconductors. The belt 42 of the element 44 is held while being in a flat state. This is because the belt 42 that holds the inner position of the annular member 43 is sucked by the distal end portion 34a of the holding table 34'. Therefore, the peripheral portion of the belt 42 is supported from below, and thus the central portion may be recessed. The flexural deformation occurs, and due to the flexural deformation, the semiconductor elements 44 on the strip 42 sometimes deviate from the viewing surface Fp. However, in the inspection apparatus 10', the transmission stage 35 is not provided on the holding table 34'. Therefore, the method of using the transmissive illumination mechanism 14' (the illumination mechanism portion 16') and its function are the same as those of the inspection apparatus 10 not -24-201224440. Specifically, as shown in FIG. 7, in the inspection apparatus 10, the exit surface 5 of the upper side (observation optical system side) of the optical element 53b of the emission part 53' of the irradiation mechanism part 16' of the transmission illumination mechanism 14' is transmitted. 3 d, flat surface. In the inspection apparatus 10', when the belt 42 at the inner side of the annular member 43 is suction-held by the front end portion 34a of the holding table 34', as shown in Fig. 7 and Fig. 8, the irradiation of the irradiation mechanism portion 16' is performed. The emitting surface 53d' of the portion 53 is pushed onto the back surface of the belt 42 (the surface on the side of the irradiation mechanism portion 16') and lifts the abutting portion ', so that the inspection object is positioned in the observation optical system (camera 24 (refer to FIG. 1)) The appropriate position in the middle is the observation surface Fp. As described above, in the inspection device 10', the emission surface 53d' of the emission portion 53' of the irradiation mechanism portion 16' as the transmission illumination unit 14 has an appropriate position for the inspection object to be positioned in the observation optical system (camera 24). That is, the function on the surface Fp is observed. However, since the emitting portion 53' of the irradiation mechanism portion 16 is configured by accommodating the optical element 53b' in the cylindrical casing 53a', the illuminable region and the emitting surface 53d' of the optical element 53b' (the area thereof) ) roughly equal. On the other hand, the relatively movable region of the irradiation mechanism portion 1.6 of the inside of the holding table 34 is observed in the direction orthogonal to the transmitted optical axis Pa (Z-axis direction) by the frame 53a' and the holding table. 34, the interference of the inner peripheral wall surface is restricted (refer to FIG. 9). Therefore, in the irradiation mechanism unit 16 (transmission illumination unit 14'), as shown in FIG. 9, the frame 53a' is in contact with the inner peripheral wall surface inside the holding table 34 (correctly The position of the optical element 53b' under the position just before the contact is the outermost position becomes

S - 25 - 201224440 can effectively illuminate the area of the transmitted light (effective inspection area Sa'), and the transmitted area cannot be irradiated to the entire area inside the front end portion 34a of the adsorption holding belt 42 on the holding table 34'. In other words, the inside of the front end portion 344a of the holding table 34 cannot be utilized as the inspection area to the utmost extent, and there is a fear that the inspection work efficiency of the belt 42 is lowered. (Operation of Transmission Illumination Mechanism 14 and Transmission Table 35) In the inspection apparatus 100, the irradiation mechanism unit 16 (the injection portion 53) of the transmission illumination unit 14 is at a position away from the holding stage 34 (holding stage 34) The outer side is configured to illuminate the object to be inspected (each semiconductor element 44) held by the holding stage 34 (see FIG. 5 and the like). Therefore, even if the holding table 34 and the irradiation mechanism portion 16 (the emitting portion 53) are relatively moved in the direction orthogonal to the transmission optical axis Pa, the holding table 34 and the irradiation mechanism portion 16 (the injection portion 53 thereof) do not interfere. (Refer to Figure 1〇). Therefore, as shown in FIG. 10, although the housing portion 53a is provided in the emission portion 53 of the illumination mechanism portion 16, the transmitted light emitted from the optical element 53b can be irradiated to be orthogonal to the transmission optical axis Pa. Since the direction of the inner peripheral wall surface of the holding base 34 is observed in the direction, the transmitted light can be irradiated to the entire area (reference symbol Sa) inside the front end portion 34a of the holding holder 42 in the holding table 34. Therefore, the inner side of the holding table 34 can be used as the effective inspection area Sa throughout the entire area, and the inner side area can be utilized to the utmost extent. At this time, the upper end surface 35a of the transmission table 35 of the holding table 34 is in a state in which the tape 42 (inspection target workpiece 40) sucked and held by the holding table 34 is flat, and the inspection object attached thereto (each semiconductor) Element -26- 201224440 44 ) is located on the observation surface Fp (refer to FIGS. 1 and 6 ). Therefore, the inspection object (each semiconductor element 44) can be appropriately observed by the observation mechanism 11 (observation optical system (camera 24)). As described above, in the inspection apparatus 10 of the present invention, the irradiation mechanism unit 16 (the injection portion 5 3 ) of the transmission illumination unit 14 is irradiated and held at the position away from the holding stage 34 (the outside of the holding stage 34). Since the configuration of the inspection object (each semiconductor element 44) of the stage 34 is maintained, it is possible to reliably prevent the irradiation mechanism unit 16 (the injection portion 53) from interfering with the holding stage 34. Therefore, although the housing 53a is provided in the emitting portion 53 of the illumination mechanism portion 16, the transmitted light emitted from the optical element 53b can be irradiated to the holding table in the direction orthogonal to the transmitted optical axis Pa. Since the position of the inner peripheral wall surface of 34 is 34, the transmitted light can be irradiated to the entire area (reference symbol Sa) inside the front end portion 34a of the holding holder 42 in the holding table 34. Thereby, the inside of the holding table 34 can be used as the effective inspection area Sa' over the entire area to ensure an effective inspection area to the utmost. Further, in the inspection apparatus 10, the belt 42 (inspection target workpiece 40) sucked and held by the holding table 34 can be made flat by the upper end surface 35a' of the transmission table 35 provided in the holding table 34, and can be attached to Since the inspection object (each semiconductor element 44) thereon is located on the observation surface Fp, even if the irradiation mechanism portion 16 (the emission portion 5 3 ) of the transmission illumination unit 14 is irradiated from the position away from the holding stage 34, the inspection is performed. The configuration of the object (each semiconductor element 44) can also be appropriately observed by the observation mechanism 1 1 (observation optical system (camera 24)). Further, in the inspection apparatus 10, the inspection is performed by the holding stage 34.

When the target workpiece 40 (the belt 42) is inspected, the upper end 35a of the transmission table 35 can be positioned above the front end portion 34a (adsorption holding position) of the holding table 34 (observing the optical system side), and therefore, The object to be inspected (each semiconductor element 44) attached to the tape 42 can be more appropriately positioned on the observation surface. In the inspection apparatus 10, the position adjustment of the observation optical axis Oa can be performed by the position adjustment mechanism holding stage 34. Therefore, the amount and state of deflection of the root belt 42 can be more appropriately adhered to the inspection of the belt. The object (each semiconductor element 44) is located on the observation surface Fp. In the inspection apparatus 10, the irradiation mechanism 16 (the emitting portion 53) of the transmission illumination mechanism 14 has an expansion (diffusion) optical performance (integrator function) for suppressing the irradiation region, and therefore, the observation surface Fp can be irradiated with respect to the observation optical system. The appropriate area of the (camera 24) makes it possible to observe the observation of the optical system (camera 24) more efficiently. In the inspection apparatus 10, the irradiation means 16 (the injection part 53) of the transmissive illumination means 14 has the optical property which uniformizes the light quantity distribution observed from the cross section orthogonal to the transmitted light Pa of the advancing direction (Dissipation (concentration) ))) Therefore, a more appropriate observation according to the observation optical system camera 24) can be performed. In the inspection apparatus 1A, since the lower end surface 351 of the transmission table 35 is a projection surface, it is possible to prevent transmission from the observation optical system (the image data of the camera 24 is irradiated from the transmission illumination mechanism 14 (from the illumination) The Fp of the surface that the mechanism unit 16 emits and transmits the light transmitted through the scattering surface is diffused according to the upper part of the 42-part axis.) The multiple shaded parts of Gwangju b-28 - 201224440 42 are used. Therefore, transmission is used. The illumination unit 14 can accurately obtain information of the inspection object (the semiconductor element 44 in the first embodiment) attached to the belt 42. This is due to the following reasons. In the belt 42, when the state of the transmitted illumination is observed with the image from the observation optical system (camera 24), even if it is a state in which no member is pasted, it is not a uniform bright state, but a line exists. Partially dark part of the shape or point (the shaded part above). The portion of the shadow is considered to be caused by the adhesion of dust or the like to the belt 42 or the occurrence of spots of the adhesive. The portion of the shadow acts as a noise component when the inspection object (each semiconductor element 44) adhered to the tape 42 is inspected by the transmission illumination mechanism 14, and there is a concern that the inspection accuracy of the inspection object is lowered. On the other hand, in the inspection device 10, in the transmission illumination unit 14, the transmitted light from the illumination mechanism unit 16 (the emission unit 53) passes through the lower end surface 35b of the transmission table 35 as the scattering surface, and becomes scattered light. When the tape 42 on the observation surface Fp irradiated with the transmitted light from the transmissive illumination mechanism 14 is taken by the camera 24 through the observation optical system, a plurality of shaded portions of the tape 42 can be hardly recognized in the image data. This is considered to be caused by the irradiation of the scattered dust or the like of the belt 42 or the spots of the adhesive in various angular directions. In this way, since the noise component in the image data from the observation optical system (camera 24) can be removed, the transmission illumination mechanism 14 can accurately obtain the inspection object (each semiconductor element 44) attached to the tape 42. News. In the inspection apparatus 10, the lower end surface 35b formed as a scattering surface is formed on the transmission table 35 of the predetermined observation surface Fp as viewed in the direction of the transmitted optical axis Pa.

S -29- 201224440 The end face 3 5a is provided at a predetermined interval. Therefore, the scattering effect caused by the scattering surface can be reliably obtained. Therefore, it is reliable in the image data from the observation optical system (camera 24). It is prevented that a plurality of shaded portions in the belt 42 that illuminate the transmitted light from the transmissive illumination mechanism 14 are generated. In addition, the upper end surface 35a of the transmission table 35 formed of glass is the observation surface Fp and the lower end surface 35b is the scattering surface. As a result of the test, the interval between the observation surface Fp and the scattering surface was set to 3 cm or more, whereby a desired scattering effect was obtained. In the inspection apparatus 10, the lower end surface 35b of the transmission table 35 in which the inspection target is located on the upper end surface 35a of the observation surface Fp is configured as a scattering surface of the transmission illumination unit 14 so that the relative position can be easily and reliably set. The position of the scattering surface (lower end surface 35b) of the observation surface Fp (upper end surface 35a) which is an appropriate observation point in the observation optical system (observation mechanism 11) in the direction of the transmission optical axis Pa, that is, the transmission optical axis Pa The interval between the observation surface Fp and the scattering surface observed in the direction. In the inspection apparatus 1A, the lower end surface 35b of the transmission table 35 provided with the upper end surface 35a constitutes a scattering surface as the transmission illumination means 14, and therefore, the inspection object can be positioned on the observation surface Fp by providing only the transmission stage 35. The above function and the function of removing the noise component on the image data can be made into a simple configuration. In the inspection apparatus 1A, the upper end surface 35a and the lower end surface 35b viewed in the direction of the transmitted optical axis Pa are set in consideration of the amount of transmitted light that has passed through the transmission table 35 after being emitted from the irradiation mechanism unit 16 (the emission portion 53). Since the interval (the thickness dimension of the transmission table 35) is such that the inspection object on the inspection surface Fp can be irradiated with the transmitted light with a predetermined amount of light, the transmission illumination mechanism 14 can be used to obtain the inspection object more accurately. Information on the respective semiconductor elements 44 in the first embodiment. In the inspection apparatus 10, the interval between the upper end surface 35a and the lower end surface 35b (the thickness dimension of the transmission stage 35) as viewed in the direction of the transmission optical axis Pa is also set so that the amount of deformation of the deflection deformation of the transmission stage 35 is within a predetermined range. This, therefore, can be properly observed by the observation optical system (camera 24). Therefore, in the inspection apparatus 10 of the present invention, the inspection object (each semiconductor element 44) attached to the belt 42 held by the annular member 43 can be efficiently and appropriately inspected using the transmission illumination. [Embodiment 2] Next, an inspection apparatus 10A according to Embodiment 2 of the present invention will be described with reference to Fig. 11 . This embodiment 2 is different from the inspection apparatus 1 of the first embodiment in the configuration of the position adjustment mechanism in the holding stage 34A (holding mechanism 13A). The basic configuration of the inspection apparatus 10A of the second embodiment is the same as that of the inspection apparatus 10 of the first embodiment. Therefore, the same components are denoted by the same reference numerals, and the detailed description thereof will be omitted. As shown in Fig. 11, in the inspection apparatus 100A, a plurality of Z-axis adjustment mechanisms 71 are provided instead of the respective Z-axis screw members 37 as position adjustment mechanisms in the holding table 34A of the holding mechanism 13A. The Z-axis adjustment mechanism 71 is the same as the Z-axis screw member 37, and is provided at least three or more (only two are shown in Fig. 11). Each Z-axis adjustment mechanism 71 has a drive motor 72

S -31 - 201224440, a cam member 73 attached to the rotation shaft 723a, and a Z-axis support portion 74 that is moved by the cam member 73. The drive motor 72 is a drive source in the Z-axis adjustment mechanism 71, and outputs a rotational driving force through the rotary shaft 72a. A cam member 73 is connected to the rotating shaft 72a. The cam member 73 is in the shape of a disk "connected to the rotating shaft 72a at a position eccentric from the axis. The cam member 73 can abut against the Z-axis support portion 74 on the outer side. The Z-axis support portion 74 is formed in a rod shape as viewed in the Z-axis direction, and is provided on the upper side (the side of the transmission table 35) of the cam member 73 so as to penetrate the holding table 34A in the Z-axis direction, and is movable in the Z-axis direction. One end of the upper side (viewing optical system side) of the Z-axis support portion 74 is supported by the support frame 36 from below, and the other end of the lower side abuts against the outer surface of the cam member 73. In the Z-axis adjustment mechanism 71, the Z-axis support portion 74 can be moved in the Z-axis direction in accordance with the rotational posture of the cam member 73 about the rotation shaft 72a by appropriately driving and controlling the drive motor 72. Therefore, the transmission table 35 is provided in the holding table 34A, that is, by appropriately driving the respective Z-axis adjustment mechanisms 71 and appropriately changing the support positions of the respective Z-axis support portions 74, the observation optical axis Oa in the Z-axis direction can be adjusted. The position (height position) of the transmission table 35 in the direction and the inclination of the transmission table 35 (the upper end surface 35〇 with respect to the observation optical axis 〇a. Thereby, each Z-axis screwing member 37 serves as a relative holding table The position adjustment mechanism that holds the transmission table 35 with respect to the position adjustment of the observation optical axis Oa functions. The inspection device 10A can drive and control the respective Z-axis adjustment mechanism 71, that is, the drive. In the inspection apparatus 10A, in the state in which the inspection target workpiece 40 is held by the holding table 34A and held in the range of -32 to 201224440, the image data from the camera 24 is shown in the control mechanism 15. The image control unit 61 analyzes the amount and state of the deflection of the belt 42. Then, based on the amount and state of the deflection of the belt 42, the drive control unit 63 of the control unit 15 causes the belt 42 to be used. The respective semiconductor elements 44 are positioned on the observation surface Fp so as to appropriately drive and drive the drive motor 72 of each of the Z-axis adjustment mechanisms 71, thereby adjusting the position (height position) of the transmission stage 35 viewed in the Z-axis direction, that is, the direction of the observation optical axis 〇a. And the inclination of the transmission table 35 (upper end surface 35a) with respect to the observation optical axis 〇a. Next, the upper end surface 35a of the transmission table 35 for adjusting the position of the observation optical axis Oa is attached to the belt 42. The inspection object (each semiconductor element 44) is located on the observation surface Fp. The drive control unit 63 of the control unit 15 causes the observation mechanism 1 1 , the reflection illumination mechanism 1 2 , and the transmission illumination mechanism 1 4 (the illumination mechanism unit 丨 6 In the inspection apparatus 10A, the inspection object 10A is appropriately moved in the Z-axis direction. The inspection object (each semiconductor element 44) can be inspected in the same manner as the inspection apparatus 1A of the first embodiment, and basically the same configuration as the inspection apparatus 1A of the first embodiment is provided. In the inspection apparatus 10A of the second embodiment, the inspection object on the belt 42 of the inspection target workpiece 40 can be made (in the second embodiment, each semiconductor element 44 is used). ) automatically positioned on the observation surface Fp. Therefore, it is possible to quickly and appropriately inspect the inspection object (in the second embodiment,

S -33- 201224440 Each semiconductor element 44). Therefore, in the inspection apparatus 10 of the present invention, it is possible to efficiently and appropriately inspect the inspection object (each semiconductor element 44) held by the belt 42 of the annular member 43. Further, in the second embodiment, each of the Z-axis adjustment mechanisms 71 is composed of the motor 72 (rotation shaft 72a) and the cam member 73' Z-axis. However, the drive control unit 63 of the control unit 15 can be used. The position of the observation axis 34A with respect to the observation optical axis Oa can be adjusted, and is not limited to the configuration of the second embodiment. [Embodiment 3] Next, an inspection apparatus according to Embodiment 3 of the present invention will be described with reference to Fig. 12 . This third embodiment is an example in which the configuration of the inspection apparatus holding mechanism 13B of the second embodiment is different. The basic configuration of the inspection 10B of the third embodiment is the same as that of the inspection apparatus 10A of the second embodiment, and the same components are denoted by the same reference numerals, and the description thereof will be omitted. As shown in Fig. 12, in the inspection apparatus 10B, a pressing mechanism 81 is provided in the holding machine. The pressing mechanism 81 can hold the workpiece to be inspected placed on the transmission table 35 (upper end surface 35a) of the 34A, and the pressing mechanism 81 holds the front end portion 34a of the table 34A on the upper end surface 35a of the transmission table 35. Maintaining the position) above the optical system side), adjusting the transmission table 35 with respect to the position held in the Z-axis direction, passing through the transmission table 35 (the upper end of which transmits the driving power; the structure drives the control table 35) Set 10B 1 0A, check the device, and explain the 1 3B holding table 40 in detail. It is located in cooperation with (observation table 34A ί surface 3 5 a -34- 201224440), and can be attached to the inspection object attached to the belt 42. The semiconductor element 44 is placed on the observation surface Fp while holding the inspection target workpiece 40. In the third embodiment, the pressing mechanism 81 has an outer position provided on the holding table 34A as viewed in a direction orthogonal to the Z-axis. The sliding support portion 82 and the pressing arm portion 83 that is movably held in the Z-axis direction by the sliding support portion 82. The pressing mechanism 81 is provided at least two or more (two in the figure shown in Fig. 12). The portion 83 is inward from the sliding support portion 82 The side is extended, and the annular member 43 of the inspection target workpiece 40 can be pressed from above (the viewing optical system side) around the holding table 34A. In other words, each pressing arm portion 83 observes at least the front end portion and the inspection in the Z-axis direction. The annular member 43 of the target workpiece 40 is provided so as to overlap. In the inspection apparatus 10B, the belt 42 of the inspection target workpiece 40 is sucked and held substantially at the front end portion 34a of the holding table 34A. Here, the transmission table 35 is used. The upper end surface 35a is located above the front end portion 34a (adsorption holding position) of the holding table 34A (observing the optical system side), and may not be placed when the position of the transmission table 35 in the Z-axis direction is adjusted with respect to the holding table 34A. The belt 42 on the upper end surface 35a is sucked and held at the front end portion 34a of the holding table 34A. This is because the flexural deformation of the belt 42 is limited, and the position of the upper end surface 35a and the position of the front end portion 34a are observed in the Z-axis direction. In the inspection device 10B, the pressing arm portion 83 provided in each of the sliding support portions 82 is pressed by the respective pressing mechanism 81 (to the irradiation mechanism portion 16 side (refer to the figure). 11 etc.) mobile , Each with its handle portion 83 by a workpiece inspection object 43 from the annular member 40 upward (viewing

S -35- 201224440 Check the optical system side (see Fig. 11 and so on)) and press it down. Then, since the inspection target workpiece 40 is pushed up by the upper end surface 35a of the transmission table 35 at the center of the belt 42, the upper end surface 35a is fixed in a state of being flattened by the adhesive tape 42. Therefore, the pressing position (height position) of each pressing arm portion 83 is individually set in accordance with the inclination of the transmission table 35 (the upper end surface 35a thereof) with respect to the observation optical axis Oa. Further, the pressing position of each of the pressing arm portions 83 may be the same height position (the position of the opposing transmission table 35 as viewed in the Z-axis direction). Therefore, the inspection object (each semiconductor element 44) is appropriately placed on the observation surface Fp which is an appropriate position in the observation optical system. The movement of the position of the pressing arm portion 83 on each of the sliding support portions 82 is performed under the control of the control mechanism 15 (the drive control portion 63). Further, the movement of the position of the pressing arm portion 83 on each of the sliding support portions 82 can also be performed manually. In the case where the annular member 43 of the inspection target workpiece 40 is not pressed, the respective pressing means 81 is used so as not to interfere with the placement of the inspection target workpiece 40 on the holding table 34A (transmission stage 35). The slide support portion 82 retracts the pressing arm portion 83 to the upper position. Further, the pressing arm portion 83 may be configured to be expandable and contractible in the extending direction for the retraction, or may be configured to be rotatable around the sliding support portion 82. In the inspection apparatus 10B of the third embodiment, since it basically has the same configuration as that of the inspection apparatus 10A of the second embodiment, substantially the same effects as those of the second embodiment can be obtained. In addition, in the inspection apparatus 10B of the third embodiment, the inspection object (the respective semiconductor elements 44) attached to the belt 42 is positioned on the viewing surface Fp as it is located on the viewing surface Fp. The position of the transmission table 35 is adjusted in the Z-axis direction. Therefore, even if the inspection target workpiece 40 cannot be held by the front end portion 34a of the holding table 34A, the upper end surface of the transmission table 35 can be modeled by the pressing of the pressing mechanism 81. When the belt 42 is flattened, the belt 42 is fixed, and the inspection object (each semiconductor element 44) attached to the belt 42 can be appropriately inspected. In addition, in the inspection apparatus 10B, the pressing mechanism 81 presses the annular member 43 of the inspection target workpiece 40, and therefore, it is possible to suppress the tape 42 attached to the inspection target workpiece 40 or the inspection target object (each semiconductor element 44) attached thereto. At the same time as the load, the tape 42 (inspection object (each semiconductor element 44)) is pushed to the upper end surface 35a of the transmission table 35. Therefore, in the inspection apparatus 10B of the present invention, the inspection object (each semiconductor element 44) attached to the belt 42 held by the annular member 43 can be inspected efficiently and appropriately using the transmission illumination. Further, in the third embodiment, the inspection apparatus 10B in which the pressing mechanism 81 is provided in the inspection apparatus 10A of the second embodiment is shown. However, the pressing mechanism 81 may be applied to the inspection apparatus 1 of the first embodiment, without being limited to the above. The constitution of the third embodiment. In addition, in the third embodiment, the pressing mechanism 81 is configured to have the sliding support portion 82 and the pressing arm portion 83, but the transmission table 35 (upper end surface) that is placed on the holding table (34A) can be held. The inspection target workpiece 40 on 35a) may be placed on the observation surface Fp as appropriate, and the inspection target object (each semiconductor element 44) attached to the tape 42 may be appropriately positioned on the observation surface Fp, and is not limited to the configuration of the above-described third embodiment. For example, the pressing mechanism can also be constructed as follows

S-37-201224440 is realized, that is, in the holding table (34A), the inner position of the front end portion (34a) and the transmitting member (35) and the support frame (36) are sealed, and can be replaced by the front end portion ( The inner position of 34a) and the annular groove formed by the transmissive member (35) and the support frame (36) are evacuated. In the case of such a configuration, the belt 42 of the inspection target workpiece 40 placed on the upper end surface (35a) of the transmissive member (35) can be adsorbed over the entire circumference at a position surrounding the upper end surface (35a). Therefore, regardless of whether or not the holding band 42 can be sucked by the distal end portion 34a of the holding table 34A, the excess portion of the band 42 can be introduced into the annular groove portion, so that the object to be inspected by the tape 42 can be attached. The objects (each semiconductor element 44) are suitably located on the observation surface Fp. Further, in the third embodiment, the pressing arm portion 83 of the pressing mechanism 81 is configured to press the annular member 43 of the inspection target workpiece 40 from above (the viewing optical system side), but the belt 42 may be pressed instead of It is limited to the configuration of the above-described embodiment 3. Further, each of the examples of the inspection apparatus of the present invention has been described in the above embodiments. However, the invention is not limited to the above-described embodiments, and an inspection apparatus may be provided as long as it is an observation apparatus including an observation optical system. a predetermined position on the observation optical axis is an observation surface; a reflection illumination mechanism that illuminates the observation surface from the observation optical system side; and a transmission illumination mechanism that illuminates the observation surface from an opposite side of the observation optical system And a holding table capable of holding the tape from the side of the transmissive illumination mechanism inside the annular member holding the tape to which the object to be inspected is attached, wherein the transmissive illumination device has the above-described holding device - 38-201224440 The outer side emits the transmitted portion of the transmitted light guided from the light source to the observation surface, and the holding table has a transmissive member having a flat surface defining a plane along the observation surface on the observation optical system side. a plate shape and allowing transmission of transmitted light emitted from the above-mentioned emitting portion; and a position adjusting mechanism, In the position adjustment can be performed about the observation optical axis direction with respect to the holding table holding the transmission member embodiment. Further, in each of the above embodiments, the diffusing portion (diffusion surface) is provided in the transmissive illumination means. However, the diffusing portion may not be provided, and is not limited to the above embodiments. Furthermore, in each of the above-described embodiments, the holding table (34 or the like) has a configuration in which the holding tape 42 is sucked by the tip end portion 34a. However, the semiconductor element 44 is used as an inspection object to maintain the inspection target. The inspection target workpiece 40 is held in the state of the state of the workpiece 40, and is not limited to the above embodiments. In the above, the inspection apparatus of the present invention has been described based on the respective embodiments. However, the specific configuration is not limited to these examples and the respective embodiments, and design changes and additions are allowed without departing from the gist of the present invention. [Brief Description of the Drawings] Fig. 1 is an explanatory view showing a configuration of an inspection apparatus 10 according to a first embodiment of the present invention. FIG. 2 is a block diagram showing the functional configuration of the inspection apparatus 10. Figure 3 is a perspective view schematically showing the holding table 34 of the inspection device 1A

S-39-201224440 FIG. 4 is an explanatory view for explaining the type of the workpiece 40 to be inspected, and (a) shows a state in which each of the semiconductor elements 44 is attached to the belt 42 and is cut by each boundary surface. The state in which the tape 42 is stretched and each of the semiconductor elements 44 is cut off is shown. Fig. 5 is a perspective view schematically showing the holding mechanism 13 and the transmissive illumination mechanism 14 of the inspection apparatus 10. Fig. 6 is an explanatory view showing a portion along the I-Ι line shown in Fig. 5 in a partial cross section. Fig. 7 is an explanatory view schematically showing the configuration of the holding mechanism 13 and the transmission illumination mechanism 14' of the inspection apparatus 10' as a comparative example for explaining the technical problem. Fig. 8 is an explanatory diagram for explaining a state in which the inspection object is placed on the observation surface Fp in the inspection apparatus 10'. FIG. 9 is an explanatory view for explaining the narrowing of the effective inspection region Sa' in the inspection apparatus 10', and shows the case where the holding table 34' is viewed from the observation optical system side above, and is displayed on the upper III-III line below. FIG. 10 is an explanatory view for explaining an enlargement of the effective inspection region Sa in the inspection apparatus 10, and shows a case where the holding table 34 is viewed from the observation optical system side above, and is displayed on the upper III-III line below. section. Fig. 11 is an explanatory view schematically showing the configuration of an inspection apparatus 10A of the second embodiment. Fig. 12 is an explanatory view schematically showing the configuration of the holding mechanism 13B of the inspection apparatus 10B of the third embodiment. -40- 201224440 [Description of main component symbols] 10, 10A' 10B, 10': Inspection device 11: (as observation optical system) Observation mechanism 1 2: Reflective illumination mechanism 1 3: Holding mechanism 13A: Holding mechanism 13B: Hold Mechanism 1 3 C : Holding mechanism 1 3 ' : Holding mechanism 1 4 : Transmission illumination mechanism 1 4 ' · Transmission illumination mechanism 1 5 : Control mechanism 1 6 : Irradiation mechanism portion 16C : Irradiation mechanism portion 1 6 ' : Illumination mechanism portion 21: main body portion 22: objective lens barrel 2 3: objective lens 24: (as observation optical system) camera 25: reflection member 26: connector portion 27: light guiding fiber 2 8 : coaxial light source 2 8 a : halogen lamp

S -41 - 201224440 28b : Flash discharge tube 29 : Coaxial epi-illumination mechanism 30 : Optical retracting annular disk 31 : Light guiding fiber 32 : Ring light source 32a : Halogen lamp 32b : Flash discharge tube 3 3 : Oblique lighting mechanism 34, 34A, 34': holding table 34a: (the holding position of the belt) front end portion 34b: annular groove 3 4c: suction hole 3 5 : (transmission member) transmission table 3 5 a : (as Upper end surface 36 of flat surface: support frame 37: Z-axis screwing member (as position adjustment mechanism) 3: (as position adjustment mechanism) orthogonal shaft screwing member 42: belt 43: annular member 44: (the object to be inspected) semiconductor element 44a: glass substrate 44b: electrode 5 1 : transmission light source 5 1 a : halogen lamp - 42 - 201224440 5 1 b : flash discharge tube 52 : light guiding portion 5 2a : emission surface 5 3: the emitting portion 5 3 ' : the emitting portion 53 a ′ : the frame 5 3 b : the optical element 5 3 b ' : the optical element 5 3 c : the incident surface 5 3 d : the emitting surface 5 3 d, the emitting surface 53 e : the lower end Portion 54 : support portion 6 1 : image control portion 62 : control portion 63 : drive control portion 64 : XY drive mechanism 65 : rotary drive mechanism 66 : Z axis :( adjusting mechanism 71 as a member) Z-axis position adjustment mechanism 72: drive motor 72a:. 73 rotation shaft: the cam member 74: Z shaft support portion

S -43- 201224440 81 : Pressing mechanism 8 2 : Sliding support portion 83 : Pressing arm portion Fp : Observation surface 〇 a : Observation optical axis P a : Transmission optical axis. -44

Claims (1)

201224440 VII. Patent application scope: 1. An inspection device comprising: an observation optical system, wherein a predetermined position on a sightseeing axis is an observation surface; and a reflection illumination mechanism that illuminates the observation surface from the optical system side; The transmissive illumination unit illuminates the observation surface from the side opposite to the observation optical system, and the cylindrical holding table that holds the aforementioned side of the transmissive illumination mechanism from the side of the member that holds the tape to which the inspection object is attached In the above-described transmission illumination mechanism, the transmission illumination unit has an emission unit that emits transmitted light that is guided from the light source to the observation surface from the outside of the holding stage, and the holding stage has a transmissive member that is disposed on the observation optical system side. a plate shape defining a flat surface along a plane of the observation surface, and allowing transmission of transmitted light emitted from the emitting portion; and a position adjustment mechanism capable of adjusting an optical axis direction with respect to the holding stage The manner of maintaining the aforementioned transmissive member. 2. The inspection apparatus according to the first aspect of the invention, wherein the positional adjustment in the direction of the observation optical axis refers to a position in the direction of the observation optical axis and an inclination in the direction of the observation optical axis. 3. The inspection apparatus according to the first or second aspect of the invention, wherein the position adjustment mechanism can view the flat surface in front of the holding position of the belt of the holding table by observing in the direction of the observation optical axis. The aforementioned transmissive member is positioned in such a manner as to observe the optical system side. In the inspection apparatus according to any one of the first to third aspects of the invention, the inspection apparatus of the above-mentioned transmissive member is further provided. The outer position is a pressing mechanism that presses the side of the emitting portion toward the optical axis direction. The inspection apparatus according to claim 4, wherein the pressing mechanism presses the annular member at an outer position of the holding table. 6. The inspection apparatus according to claim 4, wherein the pressing means J attracts between the transmissive member and a portion holding the belt in a manner that the holding table surrounds the transmissive member. 7. The inspection apparatus according to any one of the first to sixth aspect, wherein the injection unit has a concentrating optical member that reduces diffusion of transmitted light of the guided light so as to face the predetermined dot area. The inspection device according to the seventh aspect of the invention, wherein the concentrating optical member further has a function of uniformizing a light amount distribution observed in a cross section orthogonal to a transmission optical axis. Shape integrator optical member. -46 -