201217737 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種使用冷卻流體之散熱模組，尤其是 指一種可使冷卻流體流經散熱鰭片後所形成之氣泡較易排 出散熱鰭片間之液態冷卻流體熱交換室。 【先前技術】 伺服器等大型電腦設備運作時，散熱不良而使設備故 障之問題，係目前各界亟欲解決之議題，除此之外，以典 型資料中心的伺服器在運算所使用的電力為例，通常散熱 系統需要消耗相當於一倍的電力，因此當伺服器高密度集 中於雲端資料中心，機房甚至需要高達兩倍的額外散熱系 統。由此可見，雲端高密度伺服器若未妥善處理散熱問題， 將造成伺服器工作不穩定甚至無法運轉、耗費能源、機房 無法維持維運品質、增加機房管理成本等議題。 在處理散熱的方式中，部分伺服器之散熱方式，僅使 用風扇來降低伺服器之溫度，但此方式仍需搭配較低的室 内溫度，由風扇將較低溫空氣送入伺服器來進行熱交換， 故以此方式散熱相當消耗冷氣資源；此外，亦會在發熱元 件上會加裝金屬散熱鰭片，透過鰭片來放大散熱面積以及 比熱較空氣低的金屬來使熱量排散；而使用液態冷卻流體 熱交換室亦為伺服器散熱之一種習知的作法，一般習知之 液態冷卻流體熱交換室，係利用冷卻流體注入後，流經其 中的散熱裝置，進行熱交換來將熱量帶走，以此降低系統 201217737 熱量。但當冷卻流體注入習知之液態冷卻流體熱交換室， 冷卻流體吸收熱量氣化成氣泡時，氣泡可能堵塞於鰭片 間，而增加其後的冷卻流體流經鰭片來進行散熱之難度， 進而影響散熱效率。 綜合上述，因此亟需一種可使冷卻流體流經散熱鰭片 後所形成之氣泡較易排出散熱鰭片間之液態冷卻流體熱交 換室來解決習用技術所產生之問題。 • 【發明内容】 本發明係為一種可使冷卻流體流經散熱鰭片後所形成 之氣泡較易排出散熱鰭片間之液態冷卻流體熱交換室。 本發明提供一種液態冷卻流體熱交換室，其係包含： 一種液態冷卻流體熱交換室，其係包含：一殼體，具有一 腔體，該殼體包含一入口管路及一出口管路，該入口管路 用以提供一冷卻流體進入該腔體，該出口管路用以提供該 冷卻流體流出該腔體，該冷卻流體沿一流動方向流經該腔 • 體；以及一散熱裝置，其係設置於該腔體，該散熱裝置包 . 含一板體以及形成於該板體上之複數個散熱鰭片，該散熱 裝置包含至少一溝槽，部分冷卻流體流經該複數個散熱鰭 片後會吸熱汽化而形成許多氣泡，該溝槽可使該冷卻流體 汽化後所形成之氣泡排出於該複數個散熱鰭片。在一較佳 實施例中， 【實施方式】 為使貴審查委員能對本發明之特徵、目的及功能有 201217737 更進一步的認知與瞭解，下文特將本發明之系統的相關細 部結構以及設計的理念原由進行說明，以使得審查委員可 以了解本發明之特點，詳細說明陳述如下： 請參閱圖一 A以及圖一 B，圖一 A以及圖一 B係為本 發明之液態冷卻流體熱交換室示意圖。本發明提供一種液 態冷卻流體熱交換室，其係包含：一殼體丨以及一散熱裝 置2’該殼體1具有一腔體1〇，該殼體1包含一入口管路 11及一出口管路12，該入口管路11用以提供一冷卻流體 〇進入該腔體10,該出口管路丨2用以提供該冷卻流體〇流 出該腔體10，本實施例中，該出口管路12之口徑大於該 入口管路11之口徑，以避免過多氣體積壓在該腔體1〇内， 進而提高該腔體1〇内的壓力，以及冷卻流體〇的沸點，而 減弱散熱效果的狀況。該冷卻流體〇沿一流動方向〇〇流經 該腔體10;該散熱裝置2設置於該腔體1〇，該散熱裝置2 包含一板體20以及形成於該板體2〇上之複數個散^鱗片 21，該散熱裝置2包含至少一溝槽22，部分冷卻流體〇流 經該複數嗰散熱鰭片21後會吸熱汽化而形成許多氣泡，ς 溝槽22可使該冷卻流體〇汽化後所形成之氣泡排出於該複 數個散_>1 21 ’㈣免了氣泡被卡在該魏個散熱續片 21之間’而阻撓了該冷卻流體〇之流動，進而使散^ 下降的狀況。 …、干 圖二A係為第一實施例之散熱裝置示意圖，圖二a 中’該散熱裝置4包含複數個溝槽42，本實施财， 槽42由該，朗片41中具有高度糾所形成之下陷二且 圖一 A之每散熱鯖片41因高度變化而形成之該溝槽& 201217737 ^置一致，此外，該溝槽22方向垂直於該流動方向〇〇， 遠溝槽22之長度特該散絲置2上#直該流動方向⑼ 之長度’’目二^係為第二實施例之散熱裝置示意圖，圖二 β中’每一散熱韓片41之高度相同，而圖二B之溝槽42 係為任兩個同—平面且相鄰之散熱韓片41具有之間距θ，且 该溝槽22之長度小於該散熱|置2上垂直韻動方向〇〇 之長，，但該溝槽42形成之方式不以上述為限；圖三係為 實施例之散熱裝置示意圖，圖三中，該散熱裝置4之 °Ρ分散熱，鰭片41於不同位置有高度變化，使得該溝槽42 ，成於該散熱裝置4中之不同位置；目四Α係為第四實施 散熱I置示意圖’由圖四A中可見，該溝槽42形成於 ，散熱裝置4上之位置為综合圖二A以及圖三之情形，該 ^熱裝置4包含複數個整體—致之溝槽42，以及因部分散 熱續片41於不同位置有高度變化’而於該散熱裝置4中之 =位^上形成之溝槽42;圖四為第五實施例之散熱 置f不思圖，由圖四B中可見，該溝槽42形成於該散熱裝 人上之位置為綜合圖二B以及圖三之情形，該溝槽42包 二因任兩個同-平面且相鄰之散熱則41具有—間距形 =溝槽42’以及因部分散熱則41於不同位置有高度 但溝槽散熱裝置4中之不同位置上形成之溝槽42, 择〜的位置、方向與形狀不以上述為限。 鱼一本實施例中，該殼體1更包含一底件13,該底件13 一一發熱源3熱接觸，該發熱源3之熱量藉由與該底件13 =觸：傳至該液態冷卻流體熱交換室，該發熱源可是 、处里單元或是晶片模組，但不以上述為限，且該散熱 201217737 裝置2亦與該底件13熱接觸，而將熱量傳到該散熱裝置2。 此外’該殼體1之該入口管路11的形狀可為圓形或是 摘圓形’而於本實施例中，該腔體1〇的截面積為矩形，因 此當該冷卻流體〇從該入口管路11流入該腔體0後，為了 使冷卻流體〇能均勻的與該散熱裝置2接觸，因此在該腔 體〇靠近該入口管路11的地方設置了一流阻部14，在本 貫靶例中，該流阻部14是設於該殼體丨内靠近該入口管路 Η處的向下凸塊，該流阻部14的設置使得該腔體〇中靠 近攻入口管路1 1處形成一狹隘部，當該冷卻流體〇通過該 狹隘部時會均勻地從該散熱裝置2之該複數個散入鰭片20 所形成之该複數個通道中通過，而避免了該冷卻流體〇僅 集中於中間的通道而減弱了散熱效果，但該流阻部l4的形 式不以上述為限。 唯以上所述者，僅為本發明之較佳實施例，當不能以 之:艮制本發明範IU。即大凡依本發明中請專利範圍所做之 =等變化及修飾，仍將不失本發明之要義所在，故都應視 為本發明的進一步實施狀況。 201217737 【圖式簡單說明】 圖一 A係為本發明之液態冷卻流體熱交換室示意圖。 . 圖一B係為本發明之液態冷卻流體熱交換室示意圖。 . 圖二A係為第一實施例之散熱裝置示意圖。 圖二B係為第二實施例之散熱裝置示意圖。 圖三係為第三實施例之散熱裝置示意圖。 圖四A係為第四實施例之散熱裝置示意圖。 圖四B係為第五實施例之散熱裝置示意圖。 參 【主要元件符號說明】 0- 冷卻流體 0 0 _流動方向 1- 殼體 10-腔體 . 11-入口管路 Φ 12-出口管路 13- 底件 14- 流阻部 2- -散熱裝置 20- 板體 21- 散熱鰭片 22-溝槽 3-發熱源201217737 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module using a cooling fluid, and more particularly to a bubble formed by allowing a cooling fluid to flow through a heat dissipation fin to easily discharge a heat dissipation fin A liquid cooling fluid heat exchange chamber. [Prior Art] When large computer equipment such as servers are operating, the problem of poor heat dissipation and equipment failure is a problem that is currently being solved by all walks of life. In addition, the power used by the server in the typical data center is calculated. For example, a cooling system typically consumes twice as much power, so when the server is densely concentrated in the cloud data center, the room can even require up to twice as much additional cooling system. It can be seen that if the cloud high-density server does not properly handle the heat dissipation problem, it will cause the server to work unstable or even unable to operate, consume energy, the machine room can not maintain the quality of maintenance, and increase the management cost of the equipment room. In the way of dissipating heat, some of the heat dissipation methods of the server use only a fan to reduce the temperature of the server, but this mode still needs to be matched with a lower indoor temperature, and the fan sends the lower temperature air to the server for heat exchange. Therefore, heat dissipation in this way consumes a lot of air-conditioning resources; in addition, metal heat-dissipating fins are added to the heat-generating components, and the fins are used to amplify the heat-dissipating area and the metal having a lower heat than the air to dissipate the heat; The cooling fluid heat exchange chamber is also a conventional method for dissipating heat from the server. The conventional liquid cooling fluid heat exchange chamber is a heat sink that is injected through the cooling fluid and exchanges heat to carry the heat away. This reduces the heat of the system 201217737. However, when the cooling fluid is injected into the conventional liquid cooling fluid heat exchange chamber, and the cooling fluid absorbs heat and vaporizes into bubbles, the bubbles may block between the fins, and the subsequent cooling fluid flows through the fins to dissipate heat, thereby affecting Cooling efficiency. In summary, there is a need for a liquid cooling fluid heat exchange chamber in which bubbles formed by the cooling fluid flowing through the fins are more easily discharged between the fins to solve the problems caused by conventional techniques. SUMMARY OF THE INVENTION The present invention is a liquid cooling fluid heat exchange chamber in which bubbles formed by flowing a cooling fluid through a heat dissipating fin are more easily discharged between fins. The present invention provides a liquid cooling fluid heat exchange chamber comprising: a liquid cooling fluid heat exchange chamber comprising: a housing having a cavity, the housing comprising an inlet line and an outlet line, The inlet conduit is for providing a cooling fluid into the cavity, the outlet conduit is for providing the cooling fluid to flow out of the cavity, the cooling fluid flows through the cavity in a flow direction; and a heat sink The heat dissipating device comprises a plate body and a plurality of heat dissipating fins formed on the plate body, the heat dissipating device comprises at least one groove, and a part of the cooling fluid flows through the plurality of heat dissipating fins After that, it will absorb heat and vaporize to form a plurality of bubbles, and the grooves can discharge bubbles formed by vaporization of the cooling fluid to the plurality of heat dissipation fins. In a preferred embodiment, in order to enable the reviewing committee to further understand and understand the features, objects and functions of the present invention, the related detailed structure and design concept of the system of the present invention will be described hereinafter. The description is made so that the reviewer can understand the characteristics of the present invention. The detailed description is as follows: Please refer to FIG. 1A and FIG. 1B. FIG. 1A and FIG. 1B are schematic diagrams of the liquid cooling fluid heat exchange chamber of the present invention. The present invention provides a liquid cooling fluid heat exchange chamber comprising: a casing 丨 and a heat sink 2 ′. The casing 1 has a cavity 1 , the casing 1 includes an inlet pipe 11 and an outlet pipe The inlet pipe 11 is configured to provide a cooling fluid to enter the cavity 10, and the outlet pipe 2 is configured to provide the cooling fluid to flow out of the cavity 10. In the embodiment, the outlet pipe 12 The caliber is larger than the diameter of the inlet pipe 11 to prevent excessive gas volume from being pressed into the cavity 1 , thereby increasing the pressure in the cavity 1 and the boiling point of the cooling fluid to weaken the heat dissipation effect. The cooling fluid 〇〇 flows through the cavity 10 in a flow direction; the heat sink 2 is disposed in the cavity 1 , and the heat sink 2 includes a plate 20 and a plurality of plates formed on the plate 2 The heat sink 2 includes at least one trench 22, and a portion of the cooling fluid 〇 flows through the plurality of fins 21 to absorb heat and vaporize to form a plurality of bubbles, and the trench 22 can vaporize the cooling fluid. The formed bubble is discharged to the plurality of _>1 21 '(4) to prevent the bubble from being caught between the heat-dissipating fins 21', thereby obstructing the flow of the cooling fluid, thereby causing the dispersion to drop. . The dry heat is a schematic diagram of the heat sink of the first embodiment. In the second embodiment, the heat sink 4 includes a plurality of grooves 42. In this embodiment, the slot 42 is used, and the square 41 has a high degree of correction. The groove & 201217737 is formed to be inferior to each of the heat dissipating fins 41 of FIG. 1A, and the groove 22 is perpendicular to the flow direction, and the far trench 22 is The length of the filament is set to 2, and the length of the flow direction (9) is the schematic diagram of the heat sink of the second embodiment. In Figure 2, the height of each of the heat sinks 41 is the same, and FIG. The groove 42 of B is any two of the same planes and the adjacent heat dissipating fins 41 have a distance θ, and the length of the groove 22 is smaller than the length of the vertical pulsation direction of the heat dissipation|set 2, However, the manner in which the trenches 42 are formed is not limited to the above; FIG. 3 is a schematic diagram of the heat dissipating device of the embodiment. In FIG. 3, the heat dissipating device 4 disperses heat, and the fins 41 have height changes at different positions, so that The trenches 42 are formed at different positions in the heat sink 4; A schematic diagram of the heat I is shown in Fig. 4A. The groove 42 is formed on the heat dissipating device 4 in the same manner as in the case of Fig. 2A and Fig. 3. The heat device 4 comprises a plurality of grooves. 42 and a groove 42 formed on the = position of the heat sink 4 due to a height change of the portion of the heat sink 41 at different positions; FIG. 4 is a heat dissipation of the fifth embodiment, As can be seen from FIG. 4B, the position of the trench 42 formed on the heat sink is shown in FIG. 2B and FIG. 3, and the trench 42 includes two of the same-plane and adjacent heat dissipation. The groove 42 having a groove-shaped shape and a shape formed at a different position in the groove heat-dissipating device 4 due to the partial heat dissipation 41 and the partial heat dissipation 41 is not limited to the above. . In the embodiment of the present invention, the housing 1 further includes a bottom member 13 which is in thermal contact with the heat source 3, and the heat of the heat source 3 is transferred to the liquid state by the contact with the bottom member 13 a cooling fluid heat exchange chamber, which may be a unit or a wafer module, but not limited to the above, and the heat sink 201217737 device 2 is also in thermal contact with the bottom member 13 to transfer heat to the heat sink 2. In addition, the shape of the inlet pipe 11 of the casing 1 may be circular or rounded. In the present embodiment, the cross-sectional area of the cavity 1 is rectangular, so when the cooling fluid flows from the After the inlet pipe 11 flows into the cavity 0, in order to make the cooling fluid 均匀 uniformly contact with the heat sink 2, a first-class resistance portion 14 is disposed at a position close to the inlet pipe 11 of the cavity ,, in the present In the target example, the flow resistance portion 14 is a downward convex portion disposed in the casing 靠近 near the inlet pipe ,, and the flow resistance portion 14 is disposed such that the cavity 〇 is close to the attack inlet pipe 1 1 Forming a narrow portion that uniformly passes through the plurality of channels formed by the plurality of fins 20 of the heat sink 2 when the cooling fluid passes through the narrow portion, thereby avoiding the cooling fluid Focusing only on the intermediate passage reduces the heat dissipation effect, but the form of the flow resistance portion 14 is not limited to the above. The above is only the preferred embodiment of the present invention, and it is not possible to: modulate the invention. That is, the changes and modifications made by the scope of the patent in the present invention will remain without departing from the scope of the present invention, and therefore should be considered as further implementation of the present invention. 201217737 [Simplified illustration of the drawings] Figure 1 is a schematic diagram of the liquid cooling fluid heat exchange chamber of the present invention. Figure 1B is a schematic view of a liquid cooling fluid heat exchange chamber of the present invention. Figure 2A is a schematic view of the heat sink of the first embodiment. Figure 2B is a schematic view of the heat sink of the second embodiment. Figure 3 is a schematic view of the heat sink of the third embodiment. Figure 4A is a schematic view of the heat sink of the fourth embodiment. Figure 4B is a schematic view of the heat sink of the fifth embodiment. Reference [Main component symbol description] 0- Cooling fluid 0 0 _ Flow direction 1 - Housing 10 - Cavity. 11 - Inlet line Φ 12 - Outlet line 13 - Base member 14 - Flow resistance part 2 - Heat sink 20- Plate 21 - Heat sink fin 22 - Groove 3 - Heat source