201203616 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種封裝結構，且特別是有關於一種發光 二極體(Light Emitting Diode, LED)的封裝結構。 【先前技術】 發光二極體為一種半導體元件，具有效率高、壽命長、不 易破損等傳統光源無法與之比較的優點。目前多應用於指示燈 、顯示板等，在交通號誌與路燈照明上的應用則最為普遍。隨 著白光發光一極體的出現，發光二極體被視為21世紀的新型 光源。 由於發光二極體的體積小、切換速度快，因此逐漸取代電 子裝置的光源，例如行動電話、液晶螢幕與LED印表機等。 LED印表機疋利用LED作為光源來進行成像，相較於傳統的 雷射印表機具有體積小、列印速度快等優點。此外，LED光源 也可以應祕域應切表機巾，雜域麟印表機中需要 設置特殊的光學印表顧產生特定波長的光線，目前這種光學 印表頭可發光二極體陣列來作為光源，織湘透鏡來傳 遞光線與聚焦。然而’目前的光學印表頭的光學機構過於複雜 ’體積較大且容易造成絲精度過低，並不利於量產。 在白知的光學印表頭中，LED與驅動晶片是採用個別封裝 後再整合至印刷電路板巾，因此其體雜大，製造成本也 較尚。此外’ LED的細、是採贱鏡等光學獅元件來聚焦光 ^由於LED、的部分光線會散射至鏡片以外的區域，因此光偶 3率，f。高光源能量’可利用較高的驅動電流來驅動 仁疋在提咼驅動電流的同時，將使發光二極體溫度上 曰k成額外的散熱問題與降低發光二極體的壽命。 4/11 201203616 【發明内容】 本發明提供-種發光二極體的封裝結構 凹槽中，軸、整體的封裝體積。驅動晶片 遮罩件可取代光學被動元件以簡化發光的光線’ 降低設計成本。 姉的封裝結構與 、-出—種發光二極體的封裝結構，包括—驅動晶片 :’第-發光二極體元件設置於第—凹槽中。遮罩^一 遮軍件設置於驅動晶片之上且第一透光區對應於 ，本發明-實施例中’上述遮罩件與上述驅動晶片之間呈 有—間隙’其寬度介於16微米()至20微米(_)之間。八 <在本發明-實施例中，上述驅動晶片更具有—第二凹种以 二發光二極體树，上述遮罩件更具有—第二透光區 上述第二透光區對應於上述第二凹槽。 透光$發明-實施例中，上述第—細包括_透光孔或一 在本發明-實施例中，上述發光二極體的封裂結構更 ;印刷電路板，用以設置上述驅動晶片，上述驅動晶片位於上 電路板與上述料件之間，其中上述鶴晶片更具有至 夕貝穿孔’上述印刷電路板經由上述貫穿孔電性連接至上诚 :動晶片上的電路元件。’其中上述貫穿孔係利用直通石夕 孔封裝技術形成。 才 -在本發明-實施例中，上述驅動晶片具有一第一面與一第 -面’上述第-凹槽位於上述驅動晶片的第一面，上述遮罩件 5/11 201203616 面向第一面，印刷電路板面向驅動晶月的第二面。 綜合上述’本發明所提出發光二極體的封I結構，利用驅 動晶片的凹槽來設置發光m件以簡化並縮小封裝結構 ’同時省略封裝基板。另外，本發明利用遮罩件的微孔取代光 學被動元件以控制錄出量，此，本發明之發光二極體的封 裝結構具有簡化難結構、縮小結龍積崎低設計成本的功 效。 為讓本發明之上述特徵和優點能更明顯易懂，下文特舉較 佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖]為根據本發明一實施例的發光二極體的封裝結構示 思圖。發光二極體的封裝結構包括印刷電路板n〇、驅動晶片 120與遮罩件130。驅動晶片]20設置於遮罩件13()與印刷電 路板1】〇之間，遮罩件130上具有複數個透光區132，圖工中 以6個透光區為例，但本實施例並不受限。驅動晶片12〇上具 有凹槽以设置發光一極體元件，遮罩件]上的透光區132則 對應於一個凹槽，讓LED所發出的光線可以透過透光區132 發出。在本貫施例中，遮罩件130上的透光區個數可依照設計 需求，如LED個數為定，本實施例並不受限。 接下來，請同時參照圖2，圖2為根據圖1的剖面線AA， 的封裝結構剖面示意圖。驅動晶片！2〇具有複數個凹槽以分別 設置發光二極體元件。以凹槽126為例說明，發光二極體元件 142設置於凹槽126之中，遮罩件13〇上的透光區132位於凹 槽126的正上方以讓發光二極體元件142的光線通過。值得注 6/11 201203616 意的是’鶴W 12G的電路元件與凹槽可形成於驅動晶片 120的同一面上，讓驅動晶片12〇可直接連接至對應的發光二 極體几件142以提供驅動電源。當驅動晶片12〇設置有不同波 長的LED陣列(例如紅、綠、藍三種LED陣列）時，驅動晶片 Π0可控制不同LED陣列’使其混合為所需顏色的光源。曰曰 •、、鮮件130例如為石夕或玻璃材質形成，在透光區以外的區 、域為不透光區域，可用來阻擔光線的散射。在本實施例中，若 遮罩件130是以玻璃形成，則在透光區132以外的區域可塗佈 鲁不透光材貝（例如黑色塗料)以防止光線散射。若遮罩件是 时材料形成，則透光區132可·開孔方式來形成。當透光 區132為一開孔時’其開孔的内側面為光滑的反射面以減少光 的能量損耗。本實施例並不限制遮罩件13〇的材料與透光區 132的結構，只要可以讓咖所發出的光線穿過透光區⑶ 即可。遮罩件130上的其餘透光區的結構與透光區132相同， 在此不加累述。 *遮罩件130與驅動晶片12〇之間具有一間隙15〇，間隙15〇 _的見度Η係根據光線波長而定以降低光線繞射現象發生，寬 又Η例如為；|於μ微米(um)至2〇微米(um)之間，但本實施例 並不又限。遮罩件130與驅動晶片120之間可利用黏著材料 170黏貼並決定其間隙120的大小。由於遮罩件13〇與驅動晶 片120之間具有間隙15〇，所以透光區132與凹槽126之間會 具有適當的距離以降低繞射現象的發生。 曰 印刷電路板U〇用來設置驅動晶片12〇，印刷電路板11〇 位於驅動晶片！2〇的背面。換言之，遮罩件13〇面向驅動晶月 的第一面’而印刷電路板110則面向驅動晶片12〇的第二 面。驅動晶片120具有複數個貫穿孔，用來電性連接位於驅動201203616 VI. Description of the Invention: [Technical Field] The present invention relates to a package structure, and more particularly to a package structure of a Light Emitting Diode (LED). [Prior Art] A light-emitting diode is a semiconductor element, and has the advantages of high efficiency, long life, and inability to be broken by conventional light sources such as damage. At present, it is mostly used in indicator lights, display panels, etc., and is most commonly used in traffic signs and street lighting. With the advent of white light, the light-emitting diode is regarded as a new light source in the 21st century. Since the size of the light-emitting diode is small and the switching speed is fast, the light source of the electronic device, such as a mobile phone, a liquid crystal screen, and an LED printer, is gradually replaced. The LED printer uses LED as a light source for imaging. Compared with the traditional laser printer, it has the advantages of small size and fast printing speed. In addition, the LED light source can also be used to cut the table towel in the secret domain. In the miscellaneous printing machine, a special optical printing plate is required to generate light of a specific wavelength. Currently, the optical printing head can emit a diode array. As a light source, a lens is used to transmit light and focus. However, the optical mechanism of the current optical printer is too complicated. The volume is large and the wire accuracy is too low, which is not conducive to mass production. In the optical printer head of Baizhi, the LED and the driver chip are integrated into the printed circuit board towel after being individually packaged, so that the body is large and the manufacturing cost is also high. In addition, the thinness of the LED is an optical lion element such as a pick-up mirror to focus the light. Since part of the light from the LED is scattered to a region other than the lens, the light couple rate, f. The high light source energy can use a higher driving current to drive the core to increase the temperature of the light-emitting diode while reducing the lifetime of the light-emitting diode. 4/11 201203616 SUMMARY OF THE INVENTION The present invention provides a package structure of a light-emitting diode, a package volume of a shaft and an entire body. The drive wafer mask replaces the optical passive components to simplify the illuminating light', reducing design costs. The encapsulation structure of the crucible and the package structure of the light-emitting diode include a driving chip: the first-light emitting diode element is disposed in the first groove. The mask is disposed on the driving wafer and the first light transmitting region corresponds to, in the embodiment of the present invention, the gap between the mask member and the driving wafer has a gap of 16 micrometers. () to between 20 microns (_). In the embodiment of the present invention, the driving chip further has a second concave type to the two light emitting diode trees, and the masking member further has a second light transmitting region, wherein the second light transmitting region corresponds to the above The second groove. In the light-transmissive invention, in the embodiment, the first thin portion includes a light-transmitting hole or, in the embodiment of the invention, the cracking structure of the light-emitting diode is further; and the printed circuit board is configured to set the driving chip, The driving chip is located between the upper circuit board and the material, wherein the crane chip further has a through-hole perforation. The printed circuit board is electrically connected to the circuit component on the moving wafer via the through hole. The above-mentioned through-holes are formed by a through-through-hole packaging technique. In the embodiment of the present invention, the driving wafer has a first surface and a first surface. The first groove is located on the first surface of the driving wafer, and the mask member 5/11 201203616 faces the first surface. The printed circuit board faces the second side of the driving crystal. In combination with the above-described structure of the light-emitting diode of the present invention, the light-emitting m member is provided by the groove for driving the wafer to simplify and reduce the package structure' while omitting the package substrate. Further, the present invention utilizes the micropores of the mask member instead of the optical passive components to control the amount of recording. Therefore, the package structure of the light-emitting diode of the present invention has the effects of simplifying the difficult structure and reducing the design cost of the knot. The above features and advantages of the present invention will be more apparent from the following description. [Embodiment] FIG. 1 is a view showing a package structure of a light-emitting diode according to an embodiment of the present invention. The package structure of the light emitting diode includes a printed circuit board n, a driving wafer 120 and a mask member 130. The driving chip 20 is disposed between the mask member 13 () and the printed circuit board 1 ,, the mask member 130 has a plurality of transparent regions 132, and 6 light-transmissive regions are taken as an example in the drawing, but the implementation The example is not limited. The driving wafer 12 has a recess for disposing a light emitting body element, and the light transmitting portion 132 on the mask member corresponds to a recess, so that light emitted from the LED can be transmitted through the light transmitting portion 132. In the present embodiment, the number of light-transmissive areas on the mask member 130 can be determined according to design requirements, such as the number of LEDs, and the embodiment is not limited. Next, please refer to FIG. 2 at the same time. FIG. 2 is a schematic cross-sectional view of the package structure according to the section line AA of FIG. Drive the chip! 2〇 has a plurality of grooves to respectively set the light emitting diode elements. Taking the recess 126 as an example, the light emitting diode element 142 is disposed in the recess 126, and the light transmissive area 132 on the mask 13 is located directly above the recess 126 to allow the light of the LED element 142 to be lighted. by. It is worth noting that 6/11 201203616 means that the circuit components and recesses of the crane W 12G can be formed on the same side of the driving wafer 120, so that the driving wafer 12 can be directly connected to the corresponding light-emitting diode pieces 142 to provide Drive power. When the driver wafer 12 is provided with LED arrays of different wavelengths (e.g., three LED arrays of red, green, and blue), the driving wafer Π0 can control different LED arrays to be mixed into a light source of a desired color.曰曰 •, fresh material 130 is formed, for example, by Shi Xi or glass material, and the area outside the light transmitting area and the field are opaque areas, which can be used to block the scattering of light. In the present embodiment, if the mask member 130 is formed of glass, a region other than the light-transmitting region 132 may be coated with a opaque material (e.g., black paint) to prevent light from scattering. If the mask member is formed of a material, the light transmitting region 132 can be formed by opening. When the light transmitting region 132 is an opening, the inner side surface of the opening is a smooth reflecting surface to reduce the energy loss of light. This embodiment does not limit the material of the mask member 13A and the structure of the light-transmitting region 132 as long as the light emitted by the coffee bean can pass through the light-transmitting region (3). The structure of the remaining light-transmissive regions on the mask member 130 is the same as that of the light-transmitting region 132, and will not be described here. * There is a gap 15 〇 between the mask member 130 and the driving wafer 12〇, and the visibility of the gap 15〇_ is determined according to the wavelength of the light to reduce the phenomenon of light diffraction, such as: μ μ μ (um) to between 2 〇 micrometers (um), but this embodiment is not limited. The gap between the mask member 130 and the driving wafer 120 can be adhered by the adhesive material 170 and the size of the gap 120 can be determined. Since there is a gap 15 之间 between the mask member 13 〇 and the driving wafer 120, there is a proper distance between the light transmitting region 132 and the recess 126 to reduce the occurrence of diffraction.印刷 The printed circuit board U〇 is used to set the driver chip 12〇, and the printed circuit board 11〇 is located on the driver chip! 2 〇 on the back. In other words, the mask member 13A faces the first side of the driving crystal, and the printed circuit board 110 faces the second side of the driving wafer 12A. The driving wafer 120 has a plurality of through holes for electrically connecting the driving
7/N 201203616 晶片120第一面的電路元件與印刷電路板u〇。以貫穿孔122 為例，印刷電路板丨10可以透過貫穿孔122電性連接至驅動晶 片120中的電路元件以傳遞信號或電源。驅動晶片】2〇中的貫 穿孔122例如疋利用直通石夕晶穿孔封裝技術(Through-Silicon Via, Via)形成。貫穿孔].22與凹槽126的形成方式可利用半導 體製程或微機電(microelectromechanical system，MEMS)製程 來實現，本實施例並不受限。在經由上述實施例之說明後，本 技術領域具有通常知識者應可推知其他實施方式，在此不加累 述。 在本實施例中’發光二極體元件142是直接設置於驅動晶 片120的凹槽126中，因此可縮小封裝體積。遮罩件13〇的透 光區132可用來引導發光二極體元件142的光線以便成像於所 需的影像面，因此遮罩件]30可用來取代習知技術中的光學被 動元件(例如透鏡)以簡化光學模組的複雜度與設計成本。印刷 電路板1 ]0與驅動晶片120中的電路直接利用直通石夕晶穿孔封 裝技術所形成貫穿孔122以進行f性連接。這樣的結構可以進 :步縮小整體封裝結構的體積，同時可提高電氣信號傳輸的穩 定度。再者，由於本實施例中的遮罩件13〇、驅動晶片盥 ㈣i電路板110可採用堆，㈣方式進行封裝與整合，因此可以 簡化封裝流程與降低成本，更有利於量產與應用。 本發明之發光二極體的封1纟#構可制於光學印表機的 印表頭元件中做為絲使用，12G可依照印表頭元件 =的解析絲設置_式⑽以容置發光二極體元件，其陣 的设置方式並不受限於圖i與圖2之結構。在經由上述實施 :之，明後’本技術領域具有通常知識者應可 式，在此不加累述。 ^7/N 201203616 The circuit components on the first side of the wafer 120 are printed on the printed circuit board. Taking the through hole 122 as an example, the printed circuit board 10 can be electrically connected to the circuit components in the driving wafer 120 through the through holes 122 to transmit signals or power. The drive wafer is formed by a through-hole perforation 122 (Through-Silicon Via, Via). The formation of the through holes 22.22 and the recesses 126 can be realized by a semiconductor process or a microelectromechanical system (MEMS) process, and the embodiment is not limited. After the description of the above embodiments, those skilled in the art should be able to deduce other embodiments, which are not described herein. In the present embodiment, the light-emitting diode element 142 is disposed directly in the recess 126 of the driving wafer 120, so that the package volume can be reduced. The light transmissive region 132 of the mask member 13 can be used to guide the light of the LED body 142 for imaging on a desired image surface, so that the mask member 30 can be used to replace the optical passive component (such as a lens in the prior art). ) to simplify the complexity and design cost of the optical module. The printed circuit board 1]0 and the circuit in the drive wafer 120 are directly formed by the through-holes 122 formed by the through-through lithography perforation sealing technique. Such a structure can further reduce the volume of the overall package structure and improve the stability of electrical signal transmission. Moreover, since the mask member 13〇 and the driving chip 盥(4) i circuit board 110 in the embodiment can be packaged and integrated by using the stack, the package can be simplified and the cost can be reduced, which is more advantageous for mass production and application. The sealing structure of the light-emitting diode of the invention can be used as a wire in the printing head component of the optical printer, and the 12G can be arranged according to the analytical wire setting of the printing head component = (10) to accommodate the light. The arrangement of the diode elements and their arrays is not limited to the structures of Figures i and 2. Through the above-mentioned implementation: the following is a general knowledge of the technical field, and will not be described here. ^
8/U 2012036168/U 201203616
雖然本發明'較㈣_j已揭露如上 於上述實施例’任何關技術領域中具有』 離本發明所揭露之範圍内，當可作些許之 發明之保護範U應當以後附之中請專 如上，然本發明並不受限Although the present invention has been disclosed in the above-mentioned embodiment of the "in the technical field of any of the above-mentioned embodiments", it is within the scope of the present invention, and the protection of the invention may be stipulated in the following. The invention is not limited
識者，在不脫 調整，因此本 利範圍所界定者為準。 【圖式簡單說明】 圖1為根據本發明一實施例的發光二極體的封袈垆Those who know are not subject to adjustment, so the scope defined by the scope of this benefit shall prevail. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram of a package of a light-emitting diode according to an embodiment of the invention
圖。 、、、· 口再不W 圖2為根據圖1的剖面線AA’的封裝結構剖面示旁圖。 【主要元件符號說明】 110:印刷電路板 120 :驅動晶片 122 :貫穿孔 126 :凹槽 130 :遮罩件 132 :透光區 142 :發光二極體元件 150 :間隙 170 :黏著材料 AA’ ：剖面線 Η :寬度 9/11Figure. Fig. 2 is a side cross-sectional view showing a package structure according to the section line AA' of Fig. 1. [Main component symbol description] 110: Printed circuit board 120: Driving wafer 122: Through hole 126: Groove 130: Mask member 132: Light-transmitting region 142: Light-emitting diode element 150: Gap 170: Adhesive material AA': Section line Η : width 9/11