201208512 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係關於一種印刷電路板。 【先前技4标】 [0002] 在習知的印刷電路板設計中，對於應用的彈性化要求愈 見頻繁，高速差分訊號的共存佈線應用也更加廣泛。共 存佈線即為以單一佈線實現兩種線路連接方式來針對不 同市場規格需求，擴充產品功能之彈性。對於三路以上 差分對的共存佈線設計往往會面臨走線交叉的困擾或因 連接的傳輸線無傳輸作用而造成繞線殘段。 【發明内容】 [〇〇〇3] 鑒於以上内容，有必要提供一種利用單一佈線來實現三 路以上線路連接方式的印刷電路板。 [0004] —種印刷電路板，包括： [0005] 一第一訊號層，該第一訊號層設有一耦接一第一電子元 器件的第一對知盤及一耗接一第二電手元器件的第二對 焊盤， [0006] -第二訊號層’該第二訊號層設有第三對至第八對焊盤 ’該第四對焊盤設置在該第三對焊盤與該第五對焊盤之 間’且該第三對焊盤與該第二對焊盤職接，該第七 對焊盤設置在該第六對焊盤與該^焊盤之間，且該 第七對焊盤與該第五對焊糾接，該六對焊盤”. 對焊盤對應耦接，該第八對焊盤純—第三電^ : 099126147 表單編號A0101 第4頁/共15頁 0992045863-0 201208512 闺-控制晶片，該控制晶片耦接該第 號對 四對焊盤U傳輪_訊 [0008] ❹ [0009] 〇 [0010] 當將該第三對焊盤及第四對焊盤 至該第二電子元器件；當將該第四及第五Z號對傳輸 且將該第六及第七對焊盤耗接時，二=_， 一電子元器件；當將該第四及第五對焊盤執接^至該第 I件第對焊細料，該訊號傳輸至該第三電子元術相比，本發明透過將該第三對焊盤及第四對 3㈣時，訊號對傳輸至該第二電子元器件，或將 該第四及第五對焊盤_，且將該第六及第七對焊 Z，觀號對傳輸至該第—電子元器件’或將該第四 …五對焊馳接，且將該第七及第人對谭盤轉接時， 號對傳輸至㈣三電子元器件，從而選擇性地將第 一至第三電子元器件中的-個耦接該控制亭片，從而避 免了該印刷電路板上走線蚊的問題及傳倾繞線殘段 的現象。 【實施方式】 請參考囷卜本發明印刷電路板100較佳實施方式包括一 第一訊號層10、一第：訊號層20、-設於該第-訊號層 10與該第二訊號層20之間的絕緣層（圖未示）、一第一對 埋孔40A、40B、一第二對埋孔41A、41B及一控制晶片4 。在本實施方式中，該印刷電路板1〇〇為一主機板。 099126147 [0011]該第一訊號層丨〇設有一第一對焊盤11A、11B及一第二對 焊盤12A、12B。該第一對焊盤nA、nB耦接一第一電子 0992045863-0 表單編號A0101 第5頁/共15頁 201208512 兀态件1。該第二對焊盤12A、12B耦接一第二電子元器件 2 〇 [0012] [0013] 該第二訊號層20設有一第三對焊盤23Α、23β、一第四對 焊盤24A、24B、一第五對焊盤25A、25B、一第六對焊盤 26A、26B、一第七對焊盤27A、27B及一第八對焊盤28八 、286。該第四對焊盤24儿、24&設置在該第三對焊盤23八 、23B與該第五對焊盤25A、25B之間，且該第三對焊盤 23A、23B與該第二對焊盤i2A、12B相互對應且透過該第 二埋孔41A、41B耦接。該第七對坪盤27人、27β設置在該 . ...： .. 第六對焊盤26Α、26Β與該第八對焊盤28Α、28Β之間，且 該第七對焊盤27Α、27Β與該第五對焊盤25Α、25Β耦接， 該六對焊盤26Α、26Β與該第一對焊盤ι1Α、11Β相互對應 且透過該第一埋孔4〇Α、40Β耦接。該第七對焊盤27Α、 27Β與該第五對焊盤25Α、25Β的耦接是透過在焊盤27Α與 25Α間佈設訊號線、在27Β與25Β間佈設訊號線實現的。 該第四對焊盤24Α、24Β耦锋該控制晶片4以接收該控制晶 .. ... 片4產生的一高速訊號對如广高速差分訊號對。該第八對 焊盤28A、28Β耦接一第三電子元器件3。 當需要使該第二電子元器件2接收該控制晶片4輸出的高 速訊號對時’將一第一被動元件21焊接在焊盤23A及焊盤 24A上以實現該兩焊盤23A及24A的耦接，將一第二被動 元件22焊接在焊盤23B及焊盤24B上以實現該兩焊盤23B 及24B的耦接。該控制晶片4輸出的高速訊號對分別透過 該第四對焊盤24A、24B、該第一及第二被動元件21、22 、該第三對焊盤23A、23B、該第二埋孔41A、41B及該第 099126147 表單編號A0101 第6頁/共15頁 0992045863-0 201208512 二對焊盤12Α、12Β傳輸至該第二電子元器件2。 [0014] ❹ 請參照圖2所示，當需要使該第一電子元器件丨接收該控 制晶片4輸出的高迷訊號對時，將該第一被動元件21焊接 在焊盤24Α及焊盤25Α上以實現該兩焊盤24Α及25Α的耦接 ’將該第二被動元件22焊接在焊盤24B及焊盤25B上以實 現該兩焊盤24B及25B的耦接；並將一第三被動元件31焊 接在焊盤26A及焊盤27A上以實現該兩焊盤26A及27A的耦 接’將一第四被動元件32焊接在焊盤26B及焊盤27B上以 實現該兩焊盤26B及27B的耦接。該控制晶片4輸出的高速 訊號對分別透過铱第卓對__24A、2_、讀第一及第二 被動元件21、22、該第五對焊盤25A、25B、該第七對焊 盤27A、27B、該第三及第四被動元件31、32、該第六對 焊盤26A、26B、該第一埋孔4〇A、40B及該第一對焊盤 11A ' 11B傳輸至該第一電子元器件1。 [0015] Ο 請參照圖3所示，當需要使該第三電子元器件3接收該控 制晶片4輸出的高速訊號對時，將該第一被動元件21焊接 在焊盤24A及焊盤25A_L以實現該兩焊盤24A及25A的耦接 ’將該第二被動元件22焊接在烊盤24B及焊盤25B上以實 現該兩焊盤24B及25B的耦接；並將該第三被動元件31焊 接在焊盤27A及焊盤28人上以實現該兩焊盤274及28八的耦 接，將該第四被動元件32焊接在焊盤27B及焊盤28B上以 實現該兩焊盤27B及28B的耦接。該控制晶片4輸出的高速 訊號對分別透過該第四對焊盤24A、24B、該第一及第二 被動元件21、22、該第五對焊盤25A、25B、該第七對焊 盤27A、27B、該第三及第四被動元件31、32及該第八對 099126147 表單編號A0101 第7頁/共15頁 0992045863-0 201208512 [0016] [0017] [0018] [0019] [0020] 焊盤28A、28B傳輸至該第三電子元器件3。該第一被動元 件21與該第二被動元件22及該第三被動元件31與該第四 被動元件32相互對應設置’且可為電容器或電阻器，在 此第一被動元件21與第二被動元件22及該第三被動元件 31與該第四被動元件32皆為一交流耦合電容器。 在其實施方式_，該印刷電路板還可以根據實際需要增 加耦接的電子元器件的數量，並按照上述相同的佈線方 式來增設複數焊盤及複數過孔來滿足與增加的複數電子 元器件的連接。 .. . . " .. ... ..... .... ... 本發明印刷電路板100透過單一的佈線方式，依據不同需 求改變第一被動元件21、第二被動元件22、第三及第四 被動元件31、32耦接的位置，選擇性地將所需電子元器 件連接至該控制晶片4上，從而避免了該印刷電路板1〇〇 上走線交又的問題及傳輸線繞線殘段的現象。 綜上所述’本發明符合發明專利要兼，爰瓶法提出專利 申清。惟，以上所述者僅爲未鲁蜗之較佳實施例，舉凡 热悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明印刷電路板較佳實施方式實現的第一種線路 連接方式的不意圖。 圖2係本發明印刷電路板較佳實施方式實現的第二種線路 連接方式的不意圖。 [0021] 099126147 圖3係本發明印刷電路板較佳實施方式實現的第三種線路 頁 表單編號A0101 0992045863-0 201208512 連接方式的示意圖。 【主要元件符號說明】201208512 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a printed circuit board. [Previous technique 4 standard] [0002] In the conventional printed circuit board design, the application flexibility is more frequent, and the coexistence wiring application of high-speed differential signals is also more extensive. Coexisting wiring is to achieve two types of line connections in a single wiring to meet the requirements of different market specifications and to expand the flexibility of product functions. For a three-way or more differential pair coexisting wiring design, it is often faced with the problem of crossover or the winding of the connected transmission line without transmission. SUMMARY OF THE INVENTION [〇〇〇3] In view of the above, it is necessary to provide a printed circuit board that realizes three or more line connection methods by using a single wiring. [0004] A printed circuit board, comprising: [0005] a first signal layer, the first signal layer is provided with a first pair of electronic disks coupled to a first electronic component and a second electronic device a second pair of pads of the device, [0006] a second signal layer 'the second signal layer is provided with a third pair to an eighth pair of pads', the fourth pair of pads being disposed on the third pair of pads a fifth pair of pads between the third pair of pads and the second pair of pads, the seventh pair of pads being disposed between the sixth pair of pads and the pads, and the Seven pairs of pads are aligned with the fifth butt weld, the six pairs of pads". The corresponding pads are coupled, the eighth pair of pads are pure - the third electrical ^: 099126147 Form No. A0101 Page 4 of 15 Page 0992045863-0 201208512 闺-control chip, the control chip is coupled to the first pair of four pairs of pads U transmission wheel_0008 [0008] 0009 [0009] 〇 [0010] When the third pair of pads and the fourth a pad to the second electronic component; when the fourth and fifth Z pairs are transmitted and the sixth and seventh pairs of pads are drained, two = _, an electronic component; Fourth and fifth pairs The disk is connected to the first piece of the butt weld fine material, and the signal is transmitted to the third electronic element. The present invention transmits the signal pair to the third pair of pads and the fourth pair of 3 (four) a second electronic component, or the fourth and fifth pairs of pads _, and the sixth and seventh butt welds Z, the pair of signs are transmitted to the first electronic component 'or the fourth... When the welding is engaged, and the seventh and the first person are transferred to the Tan disk, the pair is transmitted to the (four) three electronic components, thereby selectively coupling one of the first to third electronic components. The pavilion is controlled to avoid the problem of the mosquitoes on the printed circuit board and the phenomenon of the tilting of the wire. [Embodiment] Please refer to the printed circuit board 100 of the present invention. The preferred embodiment includes a first signal. The layer 10, the first signal layer 20, the insulating layer (not shown) disposed between the first signal layer 10 and the second signal layer 20, a first pair of buried vias 40A, 40B, and a second For the buried holes 41A, 41B and a control wafer 4. In the present embodiment, the printed circuit board 1 is a motherboard. 099126147 [0011] The signal layer is provided with a first pair of pads 11A, 11B and a second pair of pads 12A, 12B. The first pair of pads nA, nB are coupled to a first electron 0992045863-0 Form No. A0101 Page 5 / A total of 15 pages 201208512 兀 state piece 1. The second pair of pads 12A, 12B are coupled to a second electronic component 2 〇 [0012] [0013] The second signal layer 20 is provided with a third pair of pads 23 Α, 23 β a fourth pair of pads 24A, 24B, a fifth pair of pads 25A, 25B, a sixth pair of pads 26A, 26B, a seventh pair of pads 27A, 27B and an eighth pair of pads 28 286. The fourth pair of pads 24, 24& are disposed between the third pair of pads 23, 23B and the fifth pair of pads 25A, 25B, and the third pair of pads 23A, 23B and the second The pads i2A, 12B correspond to each other and are coupled through the second buried holes 41A, 41B. The seventh pair of pads 27, 27β are disposed between the sixth pair of pads 26Α, 26Β and the eighth pair of pads 28Α, 28Β, and the seventh pair of pads 27Α, 27Β is coupled to the fifth pair of pads 25Α, 25Β, and the six pairs of pads 26Α, 26Β are corresponding to the first pair of pads ι1Α, 11Β and coupled through the first buried vias 4〇Α, 40Β. The coupling of the seventh pair of pads 27A, 27A and the fifth pair of pads 25A, 25A is achieved by routing signal lines between pads 27A and 25A and routing signal lines between 27" and 25". The fourth pair of pads 24Α, 24Β are coupled to the control chip 4 to receive the high-speed signal pair generated by the control chip, such as the wide-speed differential signal pair. The eighth pair of pads 28A, 28A are coupled to a third electronic component 3. When the second electronic component 2 needs to receive the high-speed signal pair outputted by the control chip 4, a first passive component 21 is soldered on the pad 23A and the pad 24A to realize coupling of the two pads 23A and 24A. Then, a second passive component 22 is soldered on the pad 23B and the pad 24B to achieve coupling of the two pads 23B and 24B. The high-speed signal pair outputted by the control chip 4 passes through the fourth pair of pads 24A, 24B, the first and second passive components 21, 22, the third pair of pads 23A, 23B, the second buried via 41A, 41B and the 099126147 Form No. A0101 Page 6 of 15 0992045863-0 201208512 Two pairs of pads 12Α, 12Β are transferred to the second electronic component 2. [0014] Referring to FIG. 2, when the first electronic component is required to receive the high signal pair outputted by the control chip 4, the first passive component 21 is soldered to the pad 24A and the pad 25A. The second passive component 22 is soldered on the pad 24B and the pad 25B to achieve the coupling of the two pads 24B and 25B to realize the coupling of the two pads 24Α and 25Α; and a third passive The component 31 is soldered on the pad 26A and the pad 27A to achieve coupling of the two pads 26A and 27A. A fourth passive component 32 is soldered on the pad 26B and the pad 27B to implement the two pads 26B and 27B coupling. The high-speed signal pair outputted by the control chip 4 passes through the first pair __24A, 2_, the first and second passive elements 21, 22, the fifth pair of pads 25A, 25B, the seventh pair of pads 27A, 27B, the third and fourth passive components 31, 32, the sixth pair of pads 26A, 26B, the first buried vias 4A, 40B, and the first pair of pads 11A' 11B are transmitted to the first electron Component 1. [0015] Referring to FIG. 3, when the third electronic component 3 needs to receive the high-speed signal pair outputted by the control chip 4, the first passive component 21 is soldered to the pad 24A and the pad 25A_L. The coupling of the two pads 24A and 25A is implemented to solder the second passive component 22 to the pad 24B and the pad 25B to achieve coupling of the two pads 24B and 25B; and the third passive component 31 is Soldering on the pads 27A and the pads 28 to achieve the coupling of the two pads 274 and 28, and soldering the fourth passive component 32 to the pads 27B and 28B to realize the pads 27B and 28B coupling. The high-speed signal pair outputted by the control chip 4 passes through the fourth pair of pads 24A, 24B, the first and second passive components 21, 22, the fifth pair of pads 25A, 25B, and the seventh pair of pads 27A, respectively. 27B, the third and fourth passive components 31, 32 and the eighth pair 099126147 Form No. A0101 Page 7 / 15 pages 0992045863-0 201208512 [0016] [0018] [0020] [0020] The disks 28A, 28B are transferred to the third electronic component 3. The first passive component 21 and the second passive component 22 and the third passive component 31 and the fourth passive component 32 are disposed corresponding to each other and may be a capacitor or a resistor, where the first passive component 21 and the second passive component The component 22 and the third passive component 31 and the fourth passive component 32 are both AC coupling capacitors. In the embodiment thereof, the printed circuit board can also increase the number of coupled electronic components according to actual needs, and add a plurality of pads and a plurality of via holes to meet and increase the plurality of electronic components according to the same wiring manner as described above. Connection. . . . . . . . . . . . . . . . . . . . . . . . . The printed circuit board 100 of the present invention changes the first passive component 21 and the second passive component 22 according to different requirements through a single wiring manner. The third and fourth passive components 31, 32 are coupled to each other to selectively connect the required electronic components to the control wafer 4, thereby avoiding the problem of the printed circuit board 1 And the phenomenon that the transmission line is wound. In summary, the invention conforms to the invention patent and the patent application is filed by the bottle method. However, the above-mentioned ones are only preferred embodiments of the present invention, and those skilled in the art will be able to cover the equivalents of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic illustration of a first type of line connection implemented by a preferred embodiment of the printed circuit board of the present invention. Figure 2 is a schematic illustration of a second type of line connection implemented by a preferred embodiment of the printed circuit board of the present invention. [0021] FIG. 3 is a third line of a preferred embodiment of the printed circuit board of the present invention. Form No. A0101 0992045863-0 201208512 Schematic diagram of the connection method. [Main component symbol description]
[0022] 第 一電子元器 件：1 [0023] 第 一訊號層： 10 [0024] 第 一對焊盤： 11A、 11B [0025] 第 二對焊盤： 12A、 12B [0026] 第 二電子元器 件：2 [0027] 第 二訊號層： 20 [0028] 第 一被動元件 ：21 [0029] 第 二被動元件 ：22 [0030] 第 三對焊盤： 23A、 23B [0031] 第 四對焊盤： 24A、 24B [0032] 第五對焊盤： 25A、 25B [0033] 第 六對焊盤： 26A > 26B [0034] 第 七對焊盤： 27A、 27B [0035] 第八對焊盤： 28A、 28B [0036] 第 三電子元器 件：3 [0037] 第三被動元件 • ： 31 [0038] 第 四被動元科 -：32 [0039] 控制晶片· 4 表單編號A0101 099126147 第9頁/共15頁 0992045863-0 201208512[0022] First Electronic Component: 1 [0023] First Signal Layer: 10 [0024] First Pair of Pads: 11A, 11B [0025] Second Pair of Pads: 12A, 12B [0026] Second Electronic Element Device: 2 [0027] Second Signal Layer: 20 [0028] First Passive Component: 21 [0029] Second Passive Component: 22 [0030] Third Pair of Pads: 23A, 23B [0031] Fourth Pair of Pads : 24A, 24B [0032] Fifth Pair of Pads: 25A, 25B [0033] Sixth Pair of Pads: 26A > 26B [0034] Seventh Pair of Pads: 27A, 27B [0035] Eighth Pair of Pads: 28A, 28B [0036] Third electronic component: 3 [0037] Third passive component • : 31 [0038] Fourth passive meta--: 32 [0039] Control chip · 4 Form number A0101 099126147 Page 9 / total 15 pages 0992045863-0 201208512
[0040] 第一埋孔：40A、40B[0040] First buried hole: 40A, 40B
[0041] 第二埋孔：41 A、41 B[0041] Second buried hole: 41 A, 41 B
[0042] 印刷電路板：1 00 099126147 表單編號A0101 第10頁/共15頁 0992045863-0[0042] Printed Circuit Board: 1 00 099126147 Form No. A0101 Page 10 of 15 0992045863-0