201207980 六、發明說明： 【發明所屬之技術領域】 本發明係關於基板處理裝置。 【先前技術】 作為構成顯示器裝置等顯.示裝置之顯示元件，例如有 液晶顯示元件、有機電機發光（有機EL)元件、用於電子紙 之電冰凡件等。目前，此等顯示元件係以在基板表面形成 被稱為薄膜電晶體之開關元件（™n Film Transistor : TFT) 後，於其上形成各自之顯示元件的主動元件（八^㈣⑻ 漸為主流。 近年來S出了一種在片狀基板（例如薄膜構件等）上形 成顯示元件之技術。作為此種技術，例如有一種被稱為捲 對捲⑽ltoroll)方式（以下，簡記為「捲繞方式」）者廣為人 知（例如，參照專利文獻υ。捲繞方式，係將捲繞在基板供 應側之供應用捲筒之-片片狀基板(例如，帶狀之薄膜構件) 送出、並-邊將送出之基板以基板回收側之回收用捲筒加 以捲繞來搬送基板。 在基板送出至被捲繞為止之期間，例如一邊使用複數 個搬送滾筒等搬送基板、—邊使用複數個處理裝置來形成 構成TFT之閉極、閘氧化膜、半導體膜、源^極等，在基 板之被處理面上依序形成顯示元件之構成要件。例如，^ 形成有機EL元件之情形時’係於基板上依序形成發發光 層、陽極、陰極、電機電路等。近年來，由於大型顯示元 201207980 件之要求日益增加，因此產生了使用更大尺寸之基板之需 要0 先行技術文獻 [專利文獻1]國際公開第2006/ 100868號 【發明内容】 然而，在與基板搬送方向正交方向（基板之方向）之基板 尺寸變大時’即有例如在搬送中於該寬度方向基板產生脊 曲之虞。此種基板…，即係導致例如於基板被處理面 形成之顯示元件之各構成要件位置對準精度降低等的原 因。 而能 置。 f發明之態樣’其目的在提供—衫受基板尺寸限制 兩精度的進行對該基板被處理面之處理的基板處理裝 巾以解決課題 本發明態樣之基板處理展置，具備：用以將帶狀之 =板搬：於第—方向的搬送部；對該片材基板中、與該 方向父叉之第二方向之複數個區間分別進行 =處理部；以及對應複數個該處理部之各個設置、用以 支承遠片材基板的載台裝置。 發明效果 能不受基板尺寸之限制、於該基 根據本發明之態樣 板上向精度的進行處理 4 201207980 【實施方式】 以下’參照圖式說明本發明之實施形態。 圖1係顯不實施形態之基板處理裝置Fp A之構成的圖。 如圖1所示，基板處理裝置FPA具有供應片材基板（例 如帶狀之薄膜構件）FB之基板供應部su、對片材基板 之表面（被處理面）進行處理之基板處理部pR、回收片材基 板FB之基板回收部CL、以及控制此等各部之控制部 CONT。基板處理裝置FPA例如係設置在工場等。 基板處理裝置FPA，係在從基板供應部su送出片材基 板FB後、至以基板回收部CL回收片材基板fb為止之期 間，對片材基板FB之表面施以各種處理之捲對捲（r〇u⑺ roll)方式（以下，簡記為「捲繞方式」）之裝置。基板處理裝 置FPA "7在片材基板fb上形成例如有機EL元件、液晶顯 不兀件等顯示元件（電子元件）之場合使用。當然，處理裝置 FPA亦能在形成此等元件以外之元件之場合使用。 在基板處理裝置FP A作為處理對象之片材基板FB .，可 使用例如樹脂薄膜及不鏽鋼等之箱（膜）。樹脂薄膜可使用例 如聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯乙烯共聚物 (Ethylene vinyl copolymer)樹脂、聚氯乙烯樹脂、纖維素樹 脂、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙 烯樹脂、聚乙烯乙酯樹脂等材料。 片材基板FB之Y方向（短邊方向）尺寸係形成為例如！爪 〜2m程度、X方向（長邊方向）尺寸則形成為例如1〇爪以上。 當然，此尺寸僅為一例，並不限於此例。例如片材基板fb 201207980 之γ方向尺寸為lm以下或50cm以下、亦可為2m以上。 本實施形態，即使是Y古h p P便疋Y方向尺寸超過2m之片材基板FB， 亦非常適合使用。又，片材基板FB…向尺寸亦可在 10m以下》 社 片材基板FB係形成為例如具有可撓性。此處，所謂可 撓性’係指例如對基板施以至少自重程度之既定力亦不會 斷裂或破裂 '.而能將該基板加以脊折之性卜此外，例如 因上述既定力而f折之性質亦包含於所指之可挽性。又， 上述可換性會隨著該基板材質、大小、厚度、以及温度等 之環境專而改變。再者，#好其此c ^ 有片材基板FB可使用一片帶狀之基 板、亦可使用將複數個單 之構成。 ㈣之基板加以連接而形成為帶狀 片材基板FB，以承受較高溫（例如2〇〇t程度）之献立尺 寸亦實質上無變化（熱變形小）之熱膨漲係數較小者較佳1 如可將無機填料混於樹脂薄臈以降低熱膨 機填料，例如有氧化欽、氧化辞、氧化紹、氧化石夕等乍為無 基板供應部SU係將例如捲成輕狀之片材基板fb送出 供應至基板處理部PR。於基板供應部如，設有用以例如捲 繞片材基板FB之轴部及使該軸部旋轉之旋轉驅動源等。當 然’亦可以取代及/或追加方式，於基板供應部如設置例 如用以覆蓋捲成輥狀狀態之片材基板FB的覆蓋部等。 基板回收部CL係將來自基板處理部pR之片°材基板FB 例如捲繞成輥狀加以回收。於基板回收部c ㈣同樣的’設有用以捲繞片材基—=: 201207980 部旋轉之旋轉I區動源、丨、；πβ '、以及覆蓋回收之片材基板FB的覆蓋 π等’亦可取代及/或追加方式，在基板處理部叹將片材 基板FB {列如切成平板（panel)狀之場合等時，基板回收部 CL亦可構成為例如將片材基板回收成重疊狀態等與捲 繞成輥狀之狀態不同之狀態回收片材基板fb之構成。 基板處理部PR，將從基板供應部SU供應之片材基板 FB搬送至基板回收部CL、並在搬送過程對片材基板FB之 被處理面Fp進行處理。基板處理部pR具有例如處理裝置 10、搬送裝置30及對準裝置5〇等。 處理裝置1〇具有用以對片材基板FB之被處理面_ 成例如有機EL元件之各種裝置。作為此種裝置，例如有用 以在被處理面Fp上形成間隔壁之間隔壁形成裝置、用以形 成用來驅動有機EL元件之電極的電極形成裝置、以及用以 形成發光層之發光層形成裝置等。具體而t，有液滴塗布 裝置（例如喷墨型塗布裝置、旋轉塗布型塗布裝置等）、蒸鑛 裝置、濺鍍裝置等之成膜裝置、及曝光裝置、顯影裝置、 表面改質裝置、洗淨裝置等。此等之各裝置，係適當的設 在例如片材基板FB之搬送路徑上，如可將二個以上之處 理裝置沿搬送方向配置。 搬送裝置30’具有在基板處理部pR内例如將片材基板 FB朝基板回收部CL搬送之滾筒裝置R、與夾著處理裝置 H)配置在該處理裝置1G之上流側及下流側之導引滾筒 滾筒裝置&沿著片材基板FB之搬送路徑例如設有複數個。 於複數個滾筒裝置R中之至少一部分之滾筒裝置r安裝有 7 201207980 驅動機構（未圖示）。藉由此種滾筒裝置R之旋轉，片材基板 FB即被往X軸方向搬送。亦可構成為將複數個滾筒裝置& 中之例如-部分滚筒裝f R設置成能在與搬送方向正交之 方向移動。此外，本實施形態，於片材基板FB之搬送方向， 在處理裝置10之下流側設有—對滾筒裝置R。此—對滚筒 裝置R係與片材基板FB之表面及背面接觸、並夾持片材基 板FB之至少一部分。 對準裝置50係檢測設‘ ^{材基板FB㈣部之對準標 記（基板標記）’並根據該檢測結果進行片材基板fb相對^ 理裝置1G之對準動作。對準裝置5〇具有檢測設於片材基 板FB之對準標記的對準攝影機51、與根據該對準攝影機 51之檢測結果將片材基板FB微調整於例如χ方向、γ方 向、Ζ方向、0Χ方向、方向、方向中至少—方向 之調整機構5 2。 本實施形態，以作為對片材基板FB之被處理面進行處 理之處理裝置1〇,例如使用曝光裝置10Α及曝光裝置10Β 之情形為例來進行説明。本實施形態中，於片材基板FB之 表面（被處理面）側之空間配置處理裝置10(曝光裝置l〇A及 10B) ’於片材基板FB之背面側空間設有載台裝置fst。本 實施形態中’載台裝置FST係支承片材基板㈤之背面以 導引破曝光裝置1〇Α及1〇B處理之片材基板FB之被處理 面。 圖2係顯示載台裝置FST之構成的立體圖。 如圖2所示，載台裝置FST具有本體部70、凹面.滾筒 201207980 71及72、吸附滾筒73及 m ^ Jiw- - ^ ^ 支承口 75。本體部7〇具有 回疋在搬运裝置3〇夕_ η 土 (未圖示）之矩形下層部70a、隔著 ,, 屬。卩7〇a上面之一對柱狀部70b、以及固定在 柱狀部70b上之卜展加^ 上層。卩70c。而下層部7〇a上面與上層部7〇c 與—對柱狀部7〇b之π形士、士 + b之間形成有空間70d。凹面滾筒71及72、 吸附滾筒73及74以月士孓y 支承〇 75之各個係設在本體部7〇 之上層部70C上。又， ^ 囬來两71及72、吸附滾筒73及 支承〇 75係於片材基板FB之搬送方向，以凹面滾筒 71、吸附滾筒73、古蚤a ^ Λ 支承D 75、吸附滾筒74、凹面滾筒72 之順序配置。亦gp，± l y y P支承σ 75係配置在吸附滾筒73與吸 附滾筒74之間。 / 凹面滾筒71及72配置在上層部70c上之例如X方向 兩端部。凹面滚筒71及72被設置成例如能以”由為中心 =轉於6» Y方向。凹面滾筒71及72㈣成為例如其直徑 著從#向之兩端部往中央部漸小。藉由此種於旋轉軸 方向开/成直杈分布，片材基板FB之皺摺不易形成。 支承台75配置在上層部70c上之例如X方向中央部。 支承。75形成為例如從一 Z方向觀察呈矩形。此支承台75 於片材基板 之寬度方向（γ方向）被分割為例如三個支承 面 75a 〜75c〇 久± 7 — _ _ 合叉承面75a〜75c，係例如形成為平坦、與 例如XY平面平行。，於此等三個支承® 75a〜75c支承片材 基板FB。 支承面75a與支承面75b之間、支承面75b與支承面 75C之間’刀別為露出上層部70c之+ Z側之面的狀態。於 9 201207980 上層部70c之該S出部》75d之各個，設有載台基準標記（基 準標記)SFM。此二個載台基準標記廳係配置成例如X方 向之位置一致。 又，圖”雖僅顯示了二個載台基準標記SFM，但亦 可於各支承面75a'75b、75c ’亦即以在丫方向夾著各支承 面之方式設置-對載台基準標記贿。此場合，亦可將設 在支承面75a與支承面75b之間之載台基準標記㈣作為 支承面75a及支承面75b之共用標記、將設在支承面w 與支承面75c之間之載台基準標記SFM作為支承面w及 支承面7 5 c之共用標記。 在以上層部70c與下層部7〇a與柱狀部鳥形成之空間 顺，設有檢測該载台基準標記㈣之檢測攝影機I檢 測攝影機DC係設在於2方向觀察，例如分別與載台基準標 :己SFM重疊之位置。上層部7〇c中、至少設置載台基準標 。己SFM之硭分之_ z側，設有檢測攝影機之檢測光可 通過之開口。各檢測攝影機％之檢測結果被送至例如控制 部CONT加以處理。 '吸附滾筒73係配置在上層部7〇c上、支承台75與凹面 袞筒71之間。吸附滾筒73及74與凹面滾筒？!及π同樣 的，係設置成例如能以γ軸為中心軸旋轉。 吸附滚筒73及74,分別具有分割構造，於旋轉轴方向 (Υ方向）被分割為複數個。本實施形態中，吸附滾筒乃具 有被刀。丨為—個的滾筒部分73a〜73c。同樣的吸附滾筒 74具有被分割為三個的滾筒部分74卜A。吸附滾筒乃 10 201207980 之滾筒部分73a〜73。、 以及吸附滾筒74之滾筒部分74a〜 W係分別以可裝拆之方式彼此連結，以各滾筒部分 之方式設置。 亦即，可將此等滾筒部分一個一個從上層部7〇c上拆下 而換裝為另外的滾筒部分。因此，可更換為例# γ方向尺 寸：同之滾筒部分、或更換為例如形狀不同之滾筒部分、 直仅：同之滾筒部分等。此外，亦可更換吸附滾筒73或吸 附滾靖7 4中之所有步符都八+ 有滾荀邛刀、亦可僅更換部分（此處為—個 或二個）之滾筒部分。 本實施形態中，如圖3所示，於吸附滾筒73中、例如 #、方向中央部之滾筒部分73c表面，於圓周方向形 有冓Ρ 76及77。溝部76係分別形成在滾筒部分73c之 Y方向兩端部。溝部77係在滚筒部分73C中之二個溝部76 之間形成有複數條。 溝部76及溝部77分別形成於滾筒部分 部76與溝部π 毒寬係以不同尺寸形成。例如，溝部76 :丫方向尺寸係形成為數咖以上而溝部77之γ方向尺 寸則形成為數以m# 邱八π 王&。▲片材基板FB之背面接觸於滾筒 口Μ刀73c之情形時， 76而形成彎曲部八：板之一部分即進入例如溝部 形成彎曲，心 藉由在片材基板FB<Y方向兩端 。刀Fa ’於該彎曲部分Fa間 FB即被拉向溝 丨刀片材基板 亦即位於溝部76間之此’ f曲部分h之間之部分、 片材基板FB之平^ 板叩之張力即増加而提升了 —丨生，使片材基板FB與滾筒部分73c間 201207980 之吸附性提升。此外，溝部77在滾筒 |刀73c以γ軸為中 心旋轉時，成為片材基板FB與滚筒部分 ‘ earn, 刀/3C間之空氣的釋 放道。因此，片材基板FB與滾筒部分7 ^ . 处緊貼，不易分離。 圖4係從搬送裝置3〇之側方（+ 万向）觀察時之處理 裝置10(曝光裝置10A及曝光裝置1〇 J久戟台裝置FST之 構成的圖。圖5係從上方（+ z方向）觀 务夺之處理裝置⑺ 及载台裝置FST之構成的圖。 如圖4所示’曝光裝置·及曝光Μι〇β，分科 備可保持具有既定圖案之光罩Μ一邊移動的光罩載台 MST、以曝光用光EL照明光罩Μ之照明光學系、以及 將被曝光用光EL照明之光罩M之既定照明區域内之圖案 之像投影至片材基板FB之被處理面的投影光學系pL。此 投影光學系PL係透過兩側（或片材基板FB之單側）遠心之 投影光學系PL，以既定投影倍率（例如等倍、丨/ 4倍、上/ 5倍等）投影於片材基板FB之被處理面内之曝光區域。光罩 載台MST、照明光學系IL及投影光學系PL之動作係以例 如控制部CONT加以控制。 照明光學系IL以均一照度分布之曝光用光EL照明光 罩Μ上之既定照明區域。從照明光學系il射出之曝光用光 EL ’係使用例如從水銀燈射出之輝線（g線、h線、i線）等。 光罩載台MST被設置成可藉由載台驅動部U在未圖示之光 罩基座上面（與χγ平面平行之面）於X方向以一定速度移 動 且至少能移動於Y方向、Z方向、βζ方向。 光罩載台MST之2維位置係以未圖示之雷射干涉儀加 12 201207980 以測量，根據此測量資訊由控制部CONT透過載台驅動部 Π控制光罩載台MST之位置及速度β投影光學系Pl配置 在照明光學系IL與支承台75之間、亦即配置在光罩載台 M S Τ之一Ζ側。投影光學系P L被固定在例如未圖示之固定 構件。投影光學系PL係配置成將光罩]y[之圖案之像投影至 例如載台裝置FST中之支承台75上之片材基板FB之被處 理面。 曝光裝置10A及1 0B，可藉由一邊將使用從照明光學 系IL射出之曝光用光EL藉投影光學系pl形成之光罩μ 之部分圖案之像投影至片材基板FB上、一邊使光罩載台 MS T與片材基板FB以投影倍率為速度比同步移動於X方 向，.而能使片材基板FB之被處理區域Fp中之曝光區域曝 光。 本實施形態中，在對片材基板FB表面（被處理面）中之 一個被處理區域Fp之光罩μ之圖案之曝光結束後、至進行 次一被處理區域之曝光前，使光皋載台MST往一X方向移 動。並再次使光罩載台MST與片材基板FB同步移動於X 方向以進行次一被處理區域中之曝光區域之曝光。 以此方式反覆進行相對連續搬送於X方向之片材基板 FB使光罩μ同步移動於X方向，並在一個被處理區域結束 後使光罩Μ往一X方向移動之動作，即能將光罩Μ之圖案 像曝光至片材基板FB之複數個被處理區域。 此外’如圖5所示，曝光裝置10 Α具有二個投影光學 系PL1及PL2。曝光裝置1〇A之二個投影光學系PL1及 13 201207980 PL2 ’例如係於γ方向隔著間隔配置。曝光裝置丨〇A可將 圖案之像投影至片材基板FB之被處理面中、於寬度方向（γ 方向）分離之二個投影區域EA1及投影區域EA2。又，本實 施形態中’此二個投影區域EA1及EA2之形狀係形成為梯 形。本實施形態，係以曝光裝置1〇A使片材基板FB之被處 理面中、於寬度方向除中央部（中央區間）以外之兩端部（二 個橫區間）曝光。又，投影光學系PL1及pL2係配置成χ方 向之位置對齊。因此，投影光學系PL1及PL2係沿γ方向 配置。 另一方面，曝光裝置10Β具有一個投影光學系PL3。 曝光裝置10B之投影光學系PL3，係於γ方向配置在曝光 裝置10A之二個投影光學系PL1與投影光學系pL2之間之 位置。因此’曝光裝置丨〇B之投影區域EA3即係設在上述 曝光裝置10A之投影區域EA1與投影區域EA2之間。又， 本實施形態中，投影區域EA3係形成為梯形。本實施形態 中’係以曝光裝置10B使片材基板Fb之被處理面中、於寬 度方向之中央部曝光。 又，如圖5所示，與曝光裝置10A對應之在載台裝置 FST之吸附滾筒73及74之滚筒部分，係構成為對片材基板 FB之被處理面中之投影區域EA1及投影區域eA2,使片材 基板FB平坦。此構成，與圖2所示之吸附滾筒73及之 滾筒部分之構成不同。 具體而言，吸附滾筒73與圖3所示之滾筒部分73c同 樣的’具有形成有溝部76及77之滾筒部分73d及吸 14 201207980 附滾筒73具備之此二個滾筒部分73d及73e係在γ方向彼 此連結之狀態。滾筒部分73d在將投影區域ΕΑ1於γ方向 包夾之位置設有-對溝部76。X，滚筒部A 73e則在將投 〜區域EA2於γ方向包夾之位置設有一對溝部％。 同樣的，吸附滾筒74與圖3所示之滾筒部分73c同樣 的’具備形成有溝部76及77之滾筒部分74d及74e。吸附 滾筒74具備之此二滾筒部分74d及74e係於γ方向彼此連 、”σ之狀態。滾琦部分74d在將投影區域Εα 1於γ方向包夾 之位置設有一對溝部76。滚筒部分74e則在將投影區域EA2 於Y方向包夾之位置設有一對溝部76。又，如圖5所示， 與曝光裝置10B對應之載台裝置FST之構成由於與圖2為 相同構成’因此省略其説明。 載台基準標記（載台位置檢測用基準標記、基準標 記）SFM係分別與投影光學系pL丨〜pL3對向設置。例如， 載台基準標記SFM係於片材基板FB之搬送方向設置在曝 光裝置10A及ι〇Β之投影光學系Pl之照明區域之上流側。 又，如圖4所示，於對應曝光裝置丨〇A之載台裝置FST， 設有用以檢測片材基板FB中之投影區域EA1及EA2下流 側之曝光狀態的檢測攝影機12。檢測攝影機12之檢測結果 被送至例如控制部CONT。 以上述方式構成之基板處理裝置FP a，在控制部c〇NT 之控制下’以捲繞方式製造有機EL元件、液晶顯示元件等 之顯示元件（電子元件）。以下’說明使用上述構成之基板處 理裝置FPA製造顯示元件之製程。 15 201207980 首先，將捲繞於捲筒之帶狀片材基板fb安裝於基板供 應部SU〇控制部CONT使捲筒旋轉’以從此狀態從基板供 應部SU送出該片材基板FB。並將通過基板處理部PR之該 片材基板FB捲繞於基板回收部CL之捲筒。藉由控制此基 板供應部SU及基板回收部Cl，可對基板處理部pR連續的 搬送片材基板FB之被處理面ρρ。 控制部CONT在片材基板FB從基板供應部su被送出 至以基板回收部CL加以捲繞之期間，以基板處理部pR之 搬送裝置30將片材基板FB在該基板處理部pR内適當的加 以搬送、一邊藉由處理裝置1〇將顯示元件之構成要件依序 形成在片材基板FB上。 於此製程中，以曝光裝置1〇A及1〇B進行處理之情形 時’例如圖6所示，投影光學系pL1之投影區域心之— 之錐形部分中之一方）、與 之+ Y側端部（梯形形狀之 Y側端部（梯形形狀之照明區域中 投影光學系PL3之投影區域EA3 照明區域中之錐形部分中之另-方)重疊。此外，投影光名 系PL2之投影區域EA2之+ γ側端部（梯形形狀之照明區七 中之錐形部分令之-方)' 與投影光學系PL3之投影區无 EA3之-γ側端部(梯形形狀之照明區域中之錐形部分中々 另一方）重疊。 藉由以上述方式構成之曝光裝置10A及10B之使用， 如圖6所不’例如片材基板fb之被處理面即被分割為 個，處理區域(複數個區間、曝光區域）fi〜f5進行處理。 此处’曝光區域F1係僅被投影至投影區域EA1之像所曝光 16 201207980 之部分（區間）。曝光區域^則係被投影至投影區域Μ之 像之-部分與被投影至投影區域EA3之像之_部分所曝光 之部分(區間）。曝光區域F3係僅被投影至投影區域M3之 像所曝光之部分（區間）。曝光區域F4則係被投影至投影區 域EA2之像之一部分與被投影至投影區域ea3之像之一邛 分所曝光之部分(區間)。曝光區域F5係僅被投影至投影： 域EA2之像所曝光之部分（區間）。 如上所述，由於在各載台裝置FST，以和各個投影區域 對應之方式於吸附滾筒73及74形成有—對溝部％，因此 例如在被溝部76所夾部分，能在片材基板FB之平面度被 高精度度維持之狀態下進行曝光處理。因此，本實施=態 中，無須於Y方向維持片材基板FB全體之平坦度，而係例 如於片材基板FB之一部分形成高平坦度之部分，對該部分 進行曝光並將曝光區域加以重疊。如&，即能對片材基板 FB之Y方向全體向精度的施以曝光處理。 其次，說明在曝光裝置1〇A及曝光裝置1〇B、與對應 之各個載台裝置FST、與片材基板FB之間進行對準之動作 此動作，首先係在以曝光裝置丨〇 A進行片材基板fb之 曝光之前，進行載台裝置FST與片材基板FB間之對準動 作，其次，進行載台裝置FST與曝光裝置1〇A間之對準動 作。此外，在使用曝光裝置丨〇 A之曝光動作結束後、至以 曝光裝置10B進行片材基板FB之曝光前，進行載台裝置 FST與片材基板FB間之對準動作、並進行載台裝置FST與 曝光裝置10B間之對準動作。以下，以曝光裝置1 〇B之情 17 201207980 形為例，說明對準動作。 又，本實施形態，可使對準裝置50與載台裝置FST之 對準精度不同，以使用對準裝置50進行片材基板fb對曝 光裝置10A之粗對準、使用載台裝置FST進行對曝光裝置 1 〇A或曝光裝置1 〇B之精對準。 本實施形態，係以載台裝置FST、片材基板FB及曝光 裝置1 0B間之對準動作為例進行説明。 圖7係顯示載台裝置FST、片材基板FB及曝光裝置i〇b 間之位置關係的立體圖。如圖7所示，例如於片材基板fb 預先形成基板基準標記（基板位置檢測用基準標記、第丨基 準標記、基板標記）FF]V^此基板基準標記FFM係於片材基 板FB之寬度方向與例如載台裝置FST之載台基準標記sfm 之間隔對應形成。 又’設在曝光裝置10B之光罩Μ之一對光罩基準標記 (處理位置檢測用基準標記、第2基準標記）MFM之像，透 過投影光學系PL3投影至片材基板FB上。本實施形態中之 一對基準標記’係在光罩Μ之Y方向端部、以光罩基準標 記MFM之像之投影位置在例如載台裝置FST之載台基準標 記SFM之近旁之方式，形成該光罩基準標記Mfm。 又，亦可於曝光裝置10A所使用之二個光罩M，在γ 方向之端部、以光罩基準標記MFM之像之投影位置在例如 載台裝置FST之載台基準標記SFM之近旁之方式形成該光 罩基準標記MFM。此場合，如前所述，在支承面75a之γ 方向側及支承面75c之—γ方向側設置載台基準標記sfm 18 201207980 即可 的圖 圖8係顯示載台裝置FST與片材基板fB間之對準動作 如圖8所示，片材基板FB於其表面（被處理面）中、具 有例如形成顯示元件之被處理區域Fpa<)基板基準標記ffm 係形成在片材基板FB中、例如從該被處理區域Fpa離開之 區域Fpb。控制部c〇NT於例如曝光裝置i〇b之曝光處理 未進行之時序（例如曝光裝置l〇A之曝光處理結束、至以曝 光裝置10B開始曝光處理前之期間）使檢測攝影機作 =，以檢測載台基準標記SFM與基板基準標記FFM。控制 部CONT根據該檢測結果求出載台基準標記sfm與基^基 準‘ 5己FFM間之偏移量及其方向（第一位置關係）。控制部 C〇NT根據載台基準標記SFM與基板基準標記之第一 2置關係，使片材基板FB往X方向或γ方向移動。此場 合，可使用例如調整機構52來移動吸附滾筒乃、74等， 以可使載台裝置FST本身移動。 又，亦可藉由在片材基板FB背面中之與載台基準標記 SFM對應之部分形成例如基準標尺等 此場合，由於，連續的檢測片材基㈣之位置能 例如配合片材基板FB之搬送速度調整光罩m之位置及移 動速度、或照明光學系^之照度等。此外，亦能個別的調 整曝光裝4 10A所具備之投影光學系pu及投影光學系 PL2、曝光裝i _所具備之投影光學系扛各個之成：特 性。 、 19 201207980 例如’即使是在片材基板FB之搬送速度非固定之情带 時，亦能藉由調整光罩M之位置及移動速度、或照明光學 :系IL之照度、投影光學系之成像特性(像位置、像面 等，而在不調整片材基板叩之搬送速度之情形下，進行「气 精度之曝光。又’作為檢測片材基板FB之位置之構成，： 不限於上述構成’亦.可另行設置位置檢測感測器等。 圖9係顯示载台裝置FST與曝光裝置刚間之對準動 作的圖。如圖9所示，控制部c〇NT使檢測攝影機DC作動， 以檢測載台基準標記SFM與光罩基準標言己聰。控制部 CONT根據該檢測結果，求出載台基準標記㈣與基板基 準標記随間之偏移量及其方向（第二位置關係）。控制部 CONT根據載台基準標記SFM與光罩基準標記mfm之第二 位置關係，例如使光罩載台MST移動於χ方向或Y方向。 又，於曝光動作中重疊曝光區域F1〜F5之情形時例 如在曝光裝置10A進行曝光處理後，控制部c〇NT可藉由 檢測攝影機12檢測片材基板FB上之令之投影區域—及 EA2之下流側之曝光狀態，使用該檢測結果使曝光裝置 進行曝光處理。此場合，可將使用檢測攝影機12之檢測結 果反映於對準結果後來使光罩載台MST移動。 如以上所述，本實施形態，由於具備將片材基板FB搬 送於X方向的搬送裝置30、對片材基板FB中被分割於與χ 方向交叉之Υ方向之複數個被處理區域（曝光區域、複數個 區間）F1〜F5之各個個別進行處理的複數個曝光裝置1〇Α 及10Β、以及與該曝光裝置10Α及1〇Β之各個對應設置用 201207980 以支承片材基板FB的载台裝置，因此能在片材基板FB之 搬送中片材基板FB不會彎向該γ方向之情形下，高精度的 對该片材基板FB上進行處理。 又，根據本貧施形態，由於可在以曝光裝置1 〇 A進行 被處理區域之曝光處理後、以曝光裝置1〇B進行被處理區 域之曝光之前，進行載台裝置FST與片材基板FB間之對 準、以及載台裝置FST與曝光裝置1 間之對準，因此即 使是在曝光裝置10A與曝光裝置10B間之片材基板FB之 搬送中，片材基板FB之搬送方向產生偏移、或往γ方向彎 曲，亦能在降低該等之影響的狀態下進行曝光處理。 本發明之技術範圍不限於上述實施形態，在不脫離本 發明趣旨之範圍内可加以適當變化。 上述實施形態’雖係作成在載台裝置FST中、具有與 XY平面平行之平坦面的支承台75支承片材基板FB之構 成，但不限於此。例如圖1〇所示，作為對應曝光裝置i〇A 及10B之載台，亦可使用滾筒載台RST。此滾筒載台 可一邊搬送片材基板FB —邊加以引導。 又，上述實施形態中若係使用凹面滚筒71、72及吸附 滾筒73、74等滾筒之情形時，亦可使該滾筒之部分直徑變 化。例如圖11所示，在滾筒RR係被分割為複數個滾筒部 分Ra〜Rc之情形時（具有複數個分割周面之情形），可作成 為就各該滾筒部分Ra〜Rc變形之構成。此外，亦可以是滾 筒RR整體越往中央部直徑越大之方式變形的構成。、 使滾筒RR或滾筒部分Ra〜Rc變形之構成，例如可於 21 201207980 滚筒表面（引導片材基板FB之弓丨導面）使用例如可挽性構件 以作成該滾筒表面可變形之構成。除此之外，亦可藉由調 整滾筒内部之例如熱、油壓、空壓等以使滾筒表面變形。 如此，即能使滾筒RR或滾筒部分“〜以變形為所欲之形 狀。藉由此方式使滾筒RR及滾筒部分Ra〜Rc變形，即能 拉開例如於片材基板FB之局部形成之皺摺、或變更片材基 板FB之引導速度，以調整該片材基板FB之行進方向及位 置偏移。 又’亦可在將片材基板FB之背面支承於載台裝置FST 之支承面75a、75b、75c之前，於片材基板fB之搬送方向 使吸附滾筒73及吸附滾筒74間之間隔彼此接近，以使片 材基板FB鬆弛。使片材基板FB鬆弛，即能在片材基板FB 無張力之狀態下，將其支承於載台裝置FST之支承面75a' 75b、75c。此外，支承面75a、75b、75c亦可以吸附片材美 板FB之背面的構成。 又’上述實施形態中’雖係例如曝光裝置丨〇 A具備二 個投影光學系PL 1及PL2之構成，但不限於此，亦可以是 於於一曝光裝置具有一個投影光學系（1個投影區域EA)之 構成。例如，圖12中顯示了曝光裝置1 〇A〜1 〇D分別各具 有一個投影光學系PL，而此等投影光學系pL於γ方向錯 開配置之構成。圖12中，係配置成各投影光學系pl之投 影區域EL4〜EL7中、相鄰的二個於Y方向端部彼此重疊。 又，例如圖13所示，曝光裝置10 A、1 0B之投影區域 ΕΑΠ、12、2卜22與曝光裝置10C、10D之投影區域EA31 ' 22 201207980 32、41、42係重疊。如前所述，亦可以是配置在片材基板 FB之搬送方向上流側之曝光裝置之投影區域與配置在下流 側之曝光裝置之投影區域重疊之構成。 又’上述實施形態中，吸附滾筒73、74之溝部76雖 係例如一投影區域設置一對之構成，但不過限於此。可取 代及/或以追加方式，例如圖14所示，以夾著複數個投影 區域EA之方式設置一對溝部76。 又，上述説明中，雖係以複數個曝光裝置之投影區域 於X方向錯開之態樣為例作了説明，但不限於此。可取代 及/或以追加方式，適用例如複數個曝光裝置之投影區域 於X方向對齊、亦即於γ方向排成一列之態樣。 又，上述説.明中，雖係作成於對應複數個曝光裝置配 置之所有載。裝置FST設置第—檢測機構及第二檢測機構 之構成，但+限於。可取代及/或以追加彳4，作成僅 於。P刀載台裝i FST設置第—檢測機構及第二檢測機構之 構成。 又，上述説明中，雖係以處理裝置10為曝光裝置之例 了 A月i_不限於此。處理裝置！ G亦可以是上述實施形 態所列舉之其他裝置、例如間隔壁形成裝置、電極形成裝 發光層形成裝置。此外，本實施形態中對準裝置 :檢測設在片材基板FB兩端部之對準標記。但可取代及/ 或以追加方式，使對準奘荖 &、 半裒置5〇檢測基板基準標記FFM，或 寺双測片材基板FB中之盘讲狂+丄 他 x、也运方向平行之兩邊（基板FB之 緣）。亦可取代及/啖以诘 飞乂追加方式，將對準標記（基板標記 23 201207980 於每複數個被處理區域（複數個區間）設置、或設置成與複數 個區間中之一個或二個以上對應。 【圖式簡單說明】 圖1係顯示本實施形態之基板處理裝置之構成的圖。 圖2係顯示本實施形態之載台裝置之構成的圖。 圖3係顯示本實施形態之曝光裝置及載台裝置之構成 的圖。 圖4係顯示本實施形態之曝光裝置及載台褒置之構成 的圖。 圖 係顯示本貫施形態之曝光裝置及載台褒置之構成 的圖。 圖6係顯示曝光裝置之曝光動作的圖。 圖7係顯示·曝光裝置及載台裝置之對準動作的圖。 圖8係顯示載台裝置與片材基板間之對準動作的圖。 ® 9係顯示載台裝置與曝光裝置間之對準動作的圖。 圖10係顯示本實施形態之基板處理裝置之其他構成的 圖。 圖11係顯示本實施形態之基板處理裝置之其他構成的 圖。 圖。012係顯示本實施形態之基板處理裝置之其他構成的 圖13係顯示本實施形態之基板處理裝置之其他構成的 24 201207980 圖1 4係顯示本實施形態之基板處理裝置之其他構成的 圖。 【主要元件代表符號】 10 處理裝置 10A〜10D曝光裝置 11 載台驅動部 30 搬送裝置 50 對準裝置 52 調整機構 70 載台裝置之本體部 70a 矩形下層部 70b 柱狀部 70c 上層部 70d 空間 71、72 凹面滾筒 73、74 吸附滾筒 73a〜73e 、74a〜74e、Ra〜Rc 滾筒部分 75 支承台 75a〜75c 支承面 75d 露出部分 76 ' 77 溝部 CA 檢測攝影機 CL 基板回收部 25 201207980 CONT 控制部 DC 檢測攝影機 EA(EA1 〜EA42) 投影H FI 〜F5 曝光區域 Fa 彎曲部分 FB 片材基板 FFM 基板基準標記 Fp 被處理面 FPA 基板處理裝置 FST 載台裝置 IL 照明光學系 M 光罩 MFM 光罩基準標記 MST 光罩載台 PL(PLL· -PL3) 投影光學 PR 基板處理部 R 滾筒裝置 RR 滾筒 RST 滚筒載台 SFM 載台基準標記 SU 基板供應部 26201207980 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a substrate processing apparatus. [Prior Art] As the display elements constituting the display device such as a display device, there are, for example, a liquid crystal display element, an organic motor light-emitting (organic EL) element, an electric ice-made article for electronic paper, and the like. At present, these display elements are formed by forming a switching element (TMn Film Transistor: TFT) called a thin film transistor on the surface of the substrate, and an active element (eight) (8) (8) on which respective display elements are formed is gradually becoming mainstream. In recent years, a technique of forming a display element on a sheet substrate (for example, a film member or the like) has been developed. As such a technique, for example, a roll-to-roll (10) ltoroll method is known (hereinafter, simply referred to as "winding method"). It is widely known (for example, refer to the patent document υ. The winding method is to feed a sheet-like substrate (for example, a strip-shaped film member) of a supply roll wound on a substrate supply side, and to send out The substrate is wound by a recovery roll on the substrate collection side to transport the substrate. The substrate is transported to the substrate by a plurality of transfer rollers, for example, while the substrate is being conveyed, and a plurality of processing devices are used to form the substrate. The closed electrode of the TFT, the gate oxide film, the semiconductor film, the source electrode, and the like, sequentially form constituent elements of the display element on the surface to be processed of the substrate. For example, ^ forms an organic EL In the case of a piece, the luminescent layer, the anode, the cathode, the motor circuit, etc. are sequentially formed on the substrate. In recent years, due to the increasing requirements of the large display element 201207980, the need to use a larger-sized substrate has arisen. [Patent Document 1] International Publication No. 2006/100868 [Summary of the Invention] However, when the substrate size in the direction orthogonal to the substrate transport direction (the direction of the substrate) is increased, that is, for example, during transport, the width is increased. The directional substrate generates a ridge of curvature. Such a substrate is a cause of, for example, a decrease in the alignment accuracy of the constituent elements of the display element formed on the substrate-treated surface. OBJECTS OF THE INVENTION The present invention provides a substrate processing apparatus for performing processing on a substrate to be processed by a substrate having a two-precision substrate size. a conveying unit in the first direction; a plurality of sections in the second direction of the sheet substrate and the direction of the parent fork; and a processing unit; and corresponding A plurality of the processing units are provided, and a stage device for supporting the far-sheet substrate is provided. The effect of the invention can be processed in accordance with the aspect of the invention in accordance with the size of the substrate. 4 201207980 Embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a view showing a configuration of a substrate processing apparatus Fp A according to an embodiment. As shown in Fig. 1, a substrate processing apparatus FPA has a supply sheet substrate (for example, a belt). Substrate supply unit su of FB, substrate processing unit pR for processing the surface (processed surface) of the sheet substrate, substrate recovery unit CL for collecting sheet substrate FB, and control unit for controlling each of these units CONT. The substrate processing apparatus FPA is provided, for example, in a factory or the like. In the substrate processing apparatus FPA, the sheet substrate FB is sent from the substrate supply unit su to the sheet substrate fb until the substrate recovery unit CL collects the sheet substrate fb, and the surface of the sheet substrate FB is subjected to various processes. R〇u(7) roll) (hereinafter, simply referred to as "winding method"). The substrate processing apparatus FPA "7 is used for forming a display element (electronic element) such as an organic EL element or a liquid crystal display on the sheet substrate fb. Of course, the processing device FPA can also be used in the case of forming components other than such components. In the sheet substrate FB to which the substrate processing apparatus FP A is to be processed, a box (film) such as a resin film or stainless steel can be used. As the resin film, for example, a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene vinyl copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, a polycarbonate may be used. Materials such as ester resin, polystyrene resin, and polyvinyl ethyl ester resin. The Y-direction (short-side direction) dimension of the sheet substrate FB is formed, for example, as! The claws are about 2 m in length and the X-direction (long-side direction) dimensions are formed, for example, by one paw or more. Of course, this size is only an example and is not limited to this example. For example, the y-direction dimension of the sheet substrate fb 201207980 is lm or less or 50 cm or less, and may be 2 m or more. In the present embodiment, even the sheet substrate FB having a size of more than 2 m in the Y direction is particularly suitable for use. Further, the sheet substrate FB can be formed to have flexibility, for example, in a size of 10 m or less. Here, the term "flexibility" means, for example, the fact that the substrate is subjected to a predetermined force of at least its own weight, and is not broken or broken, and the substrate can be ridged. Further, for example, the above-mentioned predetermined force is f-folded. The nature is also included in the referability of the term. Further, the above-mentioned interchangeability changes depending on the environment of the substrate material, size, thickness, and temperature. Further, #好其其其^ The sheet substrate FB may be a strip-shaped substrate, or a plurality of sheets may be used. (4) The substrate is connected to form a strip-shaped sheet substrate FB, which is preferably subjected to a relatively high temperature (for example, a degree of 2 〇〇t), and has substantially no change in thermal expansion coefficient (small thermal deformation). 1 If the inorganic filler can be mixed with the resin thinner to reduce the thermal expansion filler, for example, there are oxidized osmium, oxidized, oxidized, oxidized stone, etc., which is a substrate-free supply unit SU, for example, rolled into a light sheet substrate. The fb is sent out to the substrate processing unit PR. For example, a shaft portion for winding the sheet substrate FB, a rotary drive source for rotating the shaft portion, and the like are provided in the substrate supply portion. In other words, the substrate supply unit may be provided with a cover portion for covering the sheet substrate FB wound in a roll state, for example. The substrate collecting portion CL is obtained by winding the sheet material substrate FB from the substrate processing portion pR, for example, in a roll shape. In the same manner as in the substrate recovery unit c (4), the same is provided with a rotating I-zone source for winding the sheet base—=: 201207980, 丨β, πβ′, and a cover π covering the recovered sheet substrate FB. In the case where the substrate processing unit sighs that the sheet substrate FB {column is formed into a panel shape, the substrate collecting portion CL may be configured to be, for example, to collect the sheet substrate in an overlapping state. The composition of the sheet substrate fb is recovered in a state different from the state of being wound into a roll. The substrate processing unit PR transports the sheet substrate FB supplied from the substrate supply unit SU to the substrate collection unit CL, and processes the processed surface Fp of the sheet substrate FB in the transfer process. The substrate processing unit pR includes, for example, a processing device 10, a transfer device 30, an alignment device 5, and the like. The processing apparatus 1 has various means for forming a processed surface of the sheet substrate FB into, for example, an organic EL element. As such a device, for example, a partition wall forming device for forming a partition wall on the surface Fp to be processed, an electrode forming device for forming an electrode for driving the organic EL element, and a light-emitting layer forming device for forming a light-emitting layer Wait. Specifically, there are a film forming device such as a droplet applying device (for example, an inkjet coating device or a spin coating coating device), a vapor deposition device, and a sputtering device, and an exposure device, a developing device, and a surface modifying device. Washing device, etc. Each of these devices is suitably disposed, for example, on the transport path of the sheet substrate FB. For example, two or more of the devices can be disposed in the transport direction. The conveying device 30' has a roller device R that conveys the sheet substrate FB to the substrate collecting portion CL in the substrate processing portion pR, and a guide device that is disposed on the upstream side and the downstream side of the processing device 1G. A plurality of transport paths along the sheet substrate FB are provided, for example, in a plurality of rollers. A drive mechanism (not shown) is installed in the drum unit r of at least a part of the plurality of drum units R. By the rotation of the roller device R, the sheet substrate FB is conveyed in the X-axis direction. It is also possible to arrange, for example, the partial roller unit f R of the plurality of roller devices & to be movable in a direction orthogonal to the conveying direction. Further, in the present embodiment, the pair of roller devices R are provided on the downstream side of the processing apparatus 10 in the conveyance direction of the sheet substrate FB. This is to bring the roller device R into contact with the front and back surfaces of the sheet substrate FB and to hold at least a part of the sheet substrate FB. The alignment device 50 detects the alignment mark (substrate mark) of the "substrate FB (four) portion" and performs an alignment operation of the sheet substrate fb with respect to the processing device 1G based on the detection result. The alignment device 5 has an alignment camera 51 that detects an alignment mark provided on the sheet substrate FB, and finely adjusts the sheet substrate FB to, for example, the χ direction, the γ direction, and the Ζ direction according to the detection result of the alignment camera 51. At least one of the direction, direction, and direction adjustment mechanism 52. In the present embodiment, a processing apparatus 1 for processing a surface to be processed of the sheet substrate FB, for example, an exposure apparatus 10A and an exposure apparatus 10A will be described as an example. In the present embodiment, the space arrangement processing device 10 (exposure devices 10A and 10B) on the surface (processed surface) side of the sheet substrate FB is provided with a stage device fst on the back side space of the sheet substrate FB. In the present embodiment, the stage device FST supports the back surface of the sheet substrate (5) to guide the processed surface of the sheet substrate FB processed by the exposure apparatus 1A and 1B. Fig. 2 is a perspective view showing the configuration of the stage device FST. As shown in Fig. 2, the stage device FST has a body portion 70, a concave surface, rollers 201207980 71 and 72, an adsorption roller 73, and a m ^ Jiw- - ^ ^ support port 75. The main body portion 7b has a rectangular lower layer portion 70a which is returned to the transporting device 3, η η soil (not shown), and is interposed. One of the upper sides of the 卩7〇a pair of the columnar portion 70b and the upper portion fixed to the columnar portion 70b.卩70c. A space 70d is formed between the upper layer portion 7〇a and the upper layer portion 7〇c and the pair of the π-shaped members and the +b of the columnar portion 7〇b. The concave rollers 71 and 72, and the suction rollers 73 and 74 are each provided on the upper portion 70C of the main body portion 7A with the yoke y y support yoke 75. Further, ^ returning both 71 and 72, the adsorption roller 73 and the support cylinder 75 are in the conveying direction of the sheet substrate FB, and the concave roller 71, the adsorption roller 73, the ancient crucible a ^ 支承 support D 75, the adsorption roller 74, and the concave surface The rollers 72 are arranged in sequence. Also, gp, ± l y y P support σ 75 is disposed between the adsorption roller 73 and the suction roller 74. The concave rollers 71 and 72 are disposed on the upper layer portion 70c, for example, at both end portions in the X direction. The concave rollers 71 and 72 are provided, for example, in a direction of "centering = turning to 6» Y. The concave rollers 71 and 72 (four) become, for example, their diameters gradually decreasing from the both ends toward the center portion. The wrinkle of the sheet substrate FB is not easily formed in the direction of the rotation axis. The support table 75 is disposed on the upper portion 70c, for example, in the central portion in the X direction. The support 75 is formed, for example, as a rectangle from a Z direction. The support stand 75 is divided into, for example, three support faces 75a to 75c in the width direction (γ direction) of the sheet substrate, for example, the length of the sheet substrate 75a to 75c, which is formed, for example, flat, and for example The XY planes are parallel. The three support members 75a to 75c support the sheet substrate FB. Between the support surface 75a and the support surface 75b, between the support surface 75b and the support surface 75C, the blade is exposed to the upper layer portion 70c. The state of the surface on the Z side is provided with a stage reference mark (reference mark) SFM at each of the S output portions 75d of the upper layer portion 70c of 9 201207980. The two stage reference mark halls are arranged, for example, in the X direction. The position is the same. Again, the figure shows only two stage references. Note SFM, but also to the respective supporting surface may 75a'75b, 75c 'i.e. to sandwich each supporting surface in the direction Ah - A stage reference mark bribe. In this case, the stage reference mark (4) provided between the support surface 75a and the support surface 75b may be used as a common mark between the support surface 75a and the support surface 75b, and the stage provided between the support surface w and the support surface 75c. The reference mark SFM serves as a common mark for the support surface w and the support surface 7 5 c. The space formed by the upper layer portion 70c and the lower layer portion 7a and the columnar bird is provided, and the detection camera 1 for detecting the stage reference mark (4) is provided. The camera DC is detected in the two directions, for example, with the stage reference. Mark: The position where the SFM overlaps. At least the stage reference mark is provided in the upper layer portion 7〇c. The _Z side of the SFM has an opening through which the detection light of the camera can pass. The detection result of each detection camera % is sent to, for example, the control unit CONT for processing. The suction roller 73 is disposed between the upper stage 7c and the support stage 75 and the concave cylinder 71. Adsorption rollers 73 and 74 and concave rollers? Similarly to π, it is set to be, for example, rotatable about the γ axis. Each of the adsorption rolls 73 and 74 has a divided structure and is divided into a plurality of pieces in the rotation axis direction (Υ direction). In the present embodiment, the adsorption roller has a knife. It is a plurality of drum portions 73a to 73c. The same adsorption roller 74 has a roller portion 74 that is divided into three. The adsorption roller is the roller portions 73a to 73 of 10201207980. And the drum portions 74a to W of the suction drum 74 are detachably coupled to each other, and are provided in the form of respective drum portions. That is, the roller portions can be detached one by one from the upper portion 7c and replaced with another roller portion. Therefore, it can be replaced with the example # γ direction size: the same as the drum portion, or replaced with, for example, a drum portion having a different shape, straight: the same drum portion, and the like. Further, it is also possible to replace all of the steps in the suction roller 73 or the suction roller 74 with a trowel, or only a portion of the roller (here, one or two). In the present embodiment, as shown in Fig. 3, in the adsorption roller 73, for example, the surface of the roller portion 73c at the center portion of the direction is formed with ridges 76 and 77 in the circumferential direction. The groove portions 76 are formed at both end portions of the drum portion 73c in the Y direction. The groove portion 77 is formed with a plurality of strips between the two groove portions 76 of the drum portion 73C. The groove portion 76 and the groove portion 77 are formed in the drum portion portion 76 and the groove portion π toxic width to be formed in different sizes. For example, the groove portion 76 is formed in the 丫 direction dimension by several tens or more, and the γ direction dimension of the groove portion 77 is formed in the number m# 邱八π王 & ▲ When the back surface of the sheet substrate FB is in contact with the roller trowel 73c, the curved portion is formed 76. One of the plates enters, for example, the groove portion to form a curve, and the core is formed on the sheet substrate FB. < Both ends of the Y direction. The knives Fa' between the curved portions Fa are pulled toward the gully blade substrate, that is, the portion between the 'f curved portions h between the groove portions 76, and the tension of the sheet substrate FB is increased. On the other hand, the adsorption is improved, and the adsorption property of the 201207980 between the sheet substrate FB and the drum portion 73c is improved. Further, when the drum|knife 73c is rotated centering on the γ-axis, the groove portion 77 serves as a release passage for the air between the sheet substrate FB and the drum portion 'ear, knife/3C. Therefore, the sheet substrate FB is in close contact with the drum portion 7^, and is not easily separated. Fig. 4 is a view showing the configuration of the processing apparatus 10 (the exposure apparatus 10A and the exposure apparatus 1〇J long-station apparatus FST) when viewed from the side (+ direction) of the transport apparatus 3 (Fig. 5) from above (+z Directional view of the configuration of the processing device (7) and the stage device FST. As shown in Fig. 4, the 'exposure device and the exposure Μι〇β are used to keep the mask with a predetermined pattern and move the mask. The stage MST, the illumination optical system of the exposure light EL illumination mask, and the image of the pattern in the predetermined illumination area of the mask M illuminated by the exposure light EL are projected onto the processed surface of the sheet substrate FB. Projection optical system pL. This projection optical system PL transmits a telecentric projection optical system PL on both sides (or one side of the sheet substrate FB) at a predetermined projection magnification (for example, equal magnification, 丨 / 4 times, upper / 5 times, etc.) The exposure area projected on the processed surface of the sheet substrate FB. The operation of the mask stage MST, the illumination optical system IL, and the projection optical system PL is controlled by, for example, the control unit CONT. The illumination optical system IL is uniformly distributed. The exposure light EL illumination illuminates the predetermined illumination area on the mask The exposure light EL' emitted from the illumination optical system il uses, for example, a glow line (g line, h line, i line) emitted from a mercury lamp, etc. The mask stage MST is provided to be supported by the stage driving unit U. The upper surface of the mask base (the surface parallel to the χγ plane), which is not shown, moves at a constant speed in the X direction and can move at least in the Y direction, the Z direction, and the βζ direction. The 2-dimensional position of the mask stage MST is not The laser interferometer shown in the figure adds 12 201207980 to measure, according to the measurement information, the control unit CONT transmits the position and speed of the mask stage MST through the stage driving unit β. The projection optical system P1 is disposed in the illumination optical system IL and the support. The stage 75 is disposed on one side of the mask stage MS 。. The projection optical system PL is fixed to a fixing member (not shown), for example, and the projection optical system PL is arranged such that the mask y [pattern] The image is projected onto the processed surface of the sheet substrate FB on the support table 75 in the stage device FST, for example. The exposure devices 10A and 10B can be borrowed by the exposure light EL emitted from the illumination optical system IL. The image of the partial pattern of the mask μ formed by the projection optical system pl The mask stage MS T and the sheet substrate FB are simultaneously moved in the X direction at a projection magnification ratio on the sheet substrate FB, and the exposure region in the processed region Fp of the sheet substrate FB can be exposed. In the present embodiment, after the exposure of the pattern of the mask μ of one of the surface of the sheet substrate FB (the surface to be processed) of the processed region Fp is completed, the exposure is performed until the exposure of the next processed region is performed. The stage MST is moved in an X direction, and the mask stage MST and the sheet substrate FB are again moved in the X direction to perform exposure of the exposure area in the next processed area. In this way, the relatively continuous transfer is performed in this manner. The sheet substrate FB in the X direction moves the mask μ in the X direction synchronously, and moves the mask to an X direction after the end of one processed region, thereby exposing the pattern image of the mask to the sheet. A plurality of processed regions of the substrate FB. Further, as shown in Fig. 5, the exposure device 10 has two projection optical systems PL1 and PL2. The two projection optical systems PL1 and 13 201207980 PL2' of the exposure device 1A are disposed, for example, at intervals in the γ direction. The exposure device 丨〇A can project the image of the pattern onto the processed surface of the sheet substrate FB, the two projection regions EA1 and the projection region EA2 separated in the width direction (γ direction). Further, in the present embodiment, the shapes of the two projection areas EA1 and EA2 are formed in a trapezoidal shape. In the present embodiment, the exposure apparatus 1A exposes both end portions (two horizontal sections) of the sheet substrate FB on the processed surface except the center portion (center portion) in the width direction. Further, the projection optical systems PL1 and pL2 are arranged in alignment in the χ direction. Therefore, the projection optical systems PL1 and PL2 are arranged in the γ direction. On the other hand, the exposure device 10A has one projection optical system PL3. The projection optical system PL3 of the exposure device 10B is disposed at a position between the two projection optical systems PL1 and the projection optical system pL2 of the exposure device 10A in the γ direction. Therefore, the projection area EA3 of the exposure unit 丨〇B is disposed between the projection area EA1 of the exposure apparatus 10A and the projection area EA2. Further, in the present embodiment, the projection area EA3 is formed in a trapezoidal shape. In the present embodiment, the exposure apparatus 10B exposes the central portion of the processed surface of the sheet substrate Fb in the width direction. Further, as shown in FIG. 5, the roller portions of the adsorption rollers 73 and 74 of the stage device FST corresponding to the exposure device 10A are configured to project the projection area EA1 and the projection area eA2 on the processed surface of the sheet substrate FB. The sheet substrate FB is made flat. This configuration is different from the configuration of the suction drum 73 and the drum portion shown in Fig. 2 . Specifically, the adsorption roller 73 is the same as the drum portion 73c shown in Fig. 3, and has two roller portions 73d and 73e which are provided with the groove portions 76d and 77 formed with the groove portions 76 and 77 and the suction roller. The state in which the directions are connected to each other. The drum portion 73d is provided with a pair of groove portions 76 at a position where the projection region ΕΑ1 is sandwiched in the γ direction. X, the roller portion A 73e is provided with a pair of groove portions % at a position where the throwing region EA2 is sandwiched in the γ direction. Similarly, the suction roller 74 has the same roller portions 74d and 74e in which the grooves 76 and 77 are formed, similarly to the roller portion 73c shown in Fig. 3 . The adsorption roller 74 is provided with the two roller portions 74d and 74e in a state of "σ" in the γ direction. The roller portion 74d is provided with a pair of groove portions 76 at a position where the projection region Εα 1 is sandwiched in the γ direction. The roller portion 74e Then, a pair of groove portions 76 are provided at a position where the projection area EA2 is sandwiched in the Y direction. Further, as shown in FIG. 5, the configuration of the stage device FST corresponding to the exposure device 10B is the same as that of FIG. 2, and thus the description thereof is omitted. The stage reference mark (reference mark for the stage position detection, the reference mark) SFM is provided opposite to the projection optical systems pL丨 to pL3. For example, the stage reference mark SFM is set in the conveyance direction of the sheet substrate FB. On the flow side of the illumination area of the exposure apparatus 10A and the projection optical system P1 of the ITO, as shown in FIG. 4, the stage apparatus FST corresponding to the exposure apparatus 丨〇A is provided for detecting the sheet substrate FB. The detection camera 12 of the exposure state on the downstream side of the projection areas EA1 and EA2. The detection result of the detection camera 12 is sent to, for example, the control unit CONT. The substrate processing apparatus FPa configured as described above is in the control unit c〇NT A display element (electronic element) such as an organic EL element or a liquid crystal display element is manufactured by a winding method. Hereinafter, a process of manufacturing a display element using the substrate processing apparatus FPA having the above configuration will be described. 15 201207980 First, it will be wound on a roll. The strip-shaped sheet substrate fb of the cartridge is attached to the substrate supply unit SU, and the control unit CONT rotates the reel to eject the sheet substrate FB from the substrate supply unit SU from this state. The sheet substrate that passes through the substrate processing unit PR The FB is wound around the reel of the substrate collection unit CL. By controlling the substrate supply unit SU and the substrate collection unit C1, the processed surface ρρ of the sheet substrate FB can be continuously conveyed to the substrate processing unit pR. When the substrate FB is fed from the substrate supply unit su to the substrate recovery unit CL, the substrate processing unit 30 transfers the sheet substrate FB appropriately in the substrate processing unit pR. The constituent elements of the display elements are sequentially formed on the sheet substrate FB by the processing device 1. In the case where the exposure devices 1A and 1B are processed in this process, for example, as shown in FIG. , one of the tapered portions of the projection area of the projection optical system pL1, and the Y-side end portion (the Y-side end of the trapezoidal shape (the projection area EA3 of the projection optical system PL3 in the trapezoidal illumination region) The other side of the tapered portion of the illumination area overlaps. In addition, the + γ side end of the projection area EA2 of the projection light name PL2 (the tapered portion of the trapezoidal illumination area 7 is -) The projection area of the projection optical system PL3 is not overlapped with the γ-side end portion of the EA3 (the other of the tapered portions in the trapezoidal illumination region). By using the exposure devices 10A and 10B configured as described above, For example, the processed surface of the sheet substrate fb is divided into individual, and the processing region (a plurality of sections and exposure regions) fi to f5 is processed. Here, the exposure area F1 is only projected to a portion (section) of the exposure of the image of the projection area EA1 16 201207980. The exposure area ^ is projected to a portion (section) of the portion of the image of the projection area 与 and the portion of the image projected to the projection area EA3. The exposure area F3 is projected only to a portion (section) to which the image of the projection area M3 is exposed. The exposure area F4 is a portion (section) in which one of the images projected to the projection area EA2 and the image projected to the projection area ea3 are exposed. The exposure area F5 is projected only to the portion (section) in which the image is exposed by the image of the field EA2. As described above, in each of the stage devices FST, since the groove portions are formed in the suction rolls 73 and 74 so as to correspond to the respective projection areas, for example, the portion sandwiched by the groove portions 76 can be formed on the sheet substrate FB. The flatness is subjected to exposure processing while being maintained with high precision. Therefore, in the present embodiment, it is not necessary to maintain the flatness of the entire sheet substrate FB in the Y direction, but for example, a portion of the sheet substrate FB is formed to have a high degree of flatness, and the portion is exposed and the exposure regions are overlapped. . For example, &, the exposure processing can be performed on the entire Y direction of the sheet substrate FB. Next, an operation of aligning the exposure apparatus 1A and the exposure apparatus 1B with the corresponding stage apparatus FST and the sheet substrate FB will be described. First, the operation is performed by the exposure apparatus 丨〇A. Before the exposure of the sheet substrate fb, the alignment operation between the stage device FST and the sheet substrate FB is performed, and secondly, the alignment operation between the stage device FST and the exposure device 1A is performed. Further, after the exposure operation using the exposure device 丨〇A is completed, and before the exposure of the sheet substrate FB by the exposure device 10B, the alignment operation between the stage device FST and the sheet substrate FB is performed, and the stage device is mounted. The alignment between the FST and the exposure device 10B. Hereinafter, the alignment operation will be described by taking the shape of the exposure apparatus 1 〇B 17 201207980 as an example. Further, in the present embodiment, the alignment accuracy between the alignment device 50 and the stage device FST can be made different, and the alignment of the sheet substrate fb to the exposure device 10A by the alignment device 50 can be performed, and the stage device FST can be used. The alignment of the exposure device 1 〇A or the exposure device 1 〇B. In the present embodiment, an alignment operation between the stage device FST, the sheet substrate FB, and the exposure device 10B will be described as an example. Fig. 7 is a perspective view showing the positional relationship between the stage device FST, the sheet substrate FB, and the exposure device i〇b. As shown in FIG. 7, for example, a substrate reference mark (a substrate position detecting reference mark, a second reference mark, and a substrate mark) FF is formed on the sheet substrate fb. The substrate reference mark FFM is based on the width of the sheet substrate FB. The direction is formed corresponding to, for example, the interval between the stage reference marks sfm of the stage device FST. Further, the image of one of the masks of the exposure apparatus 10B, the image of the mask reference mark (the reference mark for processing position detection, and the second reference mark) MFM, is projected onto the sheet substrate FB through the projection optical system PL3. In the present embodiment, the reference mark ' is formed in the Y-direction end portion of the mask Μ, and the projection position of the image of the mask reference mark MFM is formed, for example, in the vicinity of the stage reference mark SFM of the stage device FST. The reticle reference mark Mfm. Further, in the two masks M used in the exposure apparatus 10A, the projection position of the image of the mask reference mark MFM in the end portion in the γ direction is, for example, in the vicinity of the stage reference mark SFM of the stage device FST. The reticle reference mark MFM is formed in a manner. In this case, as described above, the stage reference mark sfm 18 201207980 is provided on the γ direction side of the support surface 75a and the γ direction side of the support surface 75c. FIG. 8 shows the stage device FST and the sheet substrate fB. As shown in FIG. 8, the sheet substrate FB has, for example, a processed region Fpa on which a display element is formed in the surface (processed surface). <) The substrate reference mark ffm is formed in the sheet substrate FB, for example, a region Fpb that is separated from the processed region Fpa. The control unit c〇NT causes the detection camera to perform a timing at which the exposure processing of the exposure device i〇b is not performed (for example, the exposure processing of the exposure device 100A ends until the exposure device 10B starts the exposure processing). The stage reference mark SFM and the substrate reference mark FFM are detected. Based on the detection result, the control unit CONT obtains the offset between the stage reference mark sfm and the basis "5" FFM and the direction (first positional relationship). The control unit C〇NT moves the sheet substrate FB in the X direction or the γ direction in accordance with the first relationship between the stage reference mark SFM and the substrate reference mark. In this case, for example, the adjustment mechanism 52 can be used to move the adsorption roller, 74, etc., so that the stage device FST itself can be moved. Further, by forming a reference scale or the like on a portion corresponding to the stage reference mark SFM on the back surface of the sheet substrate FB, the position of the continuous detection sheet base (4) can be, for example, matched with the sheet substrate FB. The transport speed adjusts the position and moving speed of the mask m, or the illumination of the illumination optical system. Further, it is also possible to individually adjust the projection optical system pu and the projection optical system PL2 of the exposure apparatus 4 10A, and the projection optical system of the exposure apparatus i _. 19 201207980 For example, even when the transport speed of the sheet substrate FB is not fixed, the position and moving speed of the mask M can be adjusted, or the illumination optics: the illumination of the IL, and the imaging of the projection optical system. In the case where the transport speed of the sheet substrate is not adjusted, the image is subjected to "air-precision exposure, and the configuration of the position of the sheet substrate FB is not limited to the above configuration". A position detecting sensor or the like may be separately provided. Fig. 9 is a view showing an alignment operation between the stage device FST and the exposure device. As shown in Fig. 9, the control unit c〇NT causes the detecting camera DC to operate. The detection stage reference mark SFM and the reticle reference mark are written. The control unit CONT obtains the offset amount of the stage reference mark (4) and the substrate reference mark and the direction (second positional relationship) based on the detection result. The control unit CONT moves the mask stage MST in the x direction or the Y direction, for example, according to the second positional relationship between the stage reference mark SFM and the mask reference mark mfm. Further, the exposure areas F1 to F5 are overlapped in the exposure operation. Time After the exposure processing by the exposure apparatus 10A, the control unit c〇NT can detect the exposure state of the projection area on the sheet substrate FB and the downstream side of the EA2 by the detection camera 12, and use the detection result to cause the exposure apparatus to perform the exposure apparatus. Exposure processing. In this case, the detection result of the detection camera 12 can be reflected in the alignment result, and then the mask stage MST can be moved. As described above, in the present embodiment, the sheet substrate FB is conveyed in the X direction. The transport apparatus 30 and a plurality of exposure apparatuses 1 for processing each of a plurality of processed areas (exposure areas, a plurality of sections) F1 to F5 divided into a plurality of processed areas intersecting the χ direction in the sheet substrate FB. In addition, and the stage device for supporting the sheet substrate FB with the 201207980 corresponding to each of the exposure apparatuses 10A and 1B, the sheet substrate FB can be bent toward the γ during the conveyance of the sheet substrate FB. In the case of the direction, the sheet substrate FB is processed with high precision. Further, according to the present embodiment, the exposure area of the processed region can be performed by the exposure device 1A. After that, the exposure between the stage device FST and the sheet substrate FB and the alignment between the stage device FST and the exposure device 1 are performed before the exposure of the region to be processed by the exposure device 1A, so that even the exposure is performed. In the conveyance of the sheet substrate FB between the apparatus 10A and the exposure apparatus 10B, the conveyance direction of the sheet substrate FB is shifted or curved in the γ direction, and the exposure processing can be performed in a state where the influence of the sheet substrate FB is reduced. The technical scope is not limited to the above-described embodiment, and can be appropriately changed without departing from the scope of the present invention. The above-described embodiment is configured to support the support table 75 having a flat surface parallel to the XY plane in the stage device FST. The configuration of the sheet substrate FB is not limited thereto. For example, as shown in FIG. 1A, the drum stage RST may be used as a stage corresponding to the exposure apparatuses i〇A and 10B. This roller stage can be guided while conveying the sheet substrate FB. Further, in the case of the above-described embodiment, when the rollers of the concave rollers 71 and 72 and the suction rollers 73 and 74 are used, the diameter of the portion of the roller may be changed. For example, as shown in Fig. 11, when the drum RR is divided into a plurality of roller portions Ra to Rc (when there are a plurality of divided circumferential surfaces), the roller portions Ra to Rc can be deformed. Further, the entire drum RR may be deformed so as to have a larger diameter toward the center portion. For the configuration in which the drum RR or the drum portions Ra to Rc are deformed, for example, the surface of the drum (the guide surface of the guide sheet substrate FB) can be used, for example, on the surface of the drum (guide bowing surface of the sheet substrate FB), for example, a shape in which the surface of the drum can be deformed is used. In addition to this, the surface of the drum can be deformed by adjusting, for example, heat, oil pressure, air pressure, or the like inside the drum. In this way, the drum RR or the drum portion can be deformed into a desired shape. By deforming the drum RR and the drum portions Ra to Rc in this manner, the wrinkles formed, for example, in the partial portion of the sheet substrate FB can be pulled apart. Folding or changing the guiding speed of the sheet substrate FB to adjust the traveling direction and positional deviation of the sheet substrate FB. Further, the back surface of the sheet substrate FB may be supported by the supporting surface 75a of the stage device FST, Before the 75b and 75c, the interval between the adsorption roller 73 and the adsorption roller 74 is brought closer to each other in the conveyance direction of the sheet substrate fB to loosen the sheet substrate FB. The sheet substrate FB is loosened, that is, the sheet substrate FB can be eliminated. In the state of tension, it is supported by the support surfaces 75a' 75b and 75c of the stage device FST. Further, the support surfaces 75a, 75b, and 75c can also adsorb the back surface of the sheet metal plate FB. In the exposure apparatus 丨〇 A, for example, the two projection optical systems PL 1 and PL2 are provided, but the configuration is not limited thereto, and the exposure apparatus may have one projection optical system (one projection area EA). For example, Figure 12 shows the exposure Each of the optical devices 1 〇A1 to 〇D has one projection optical system PL, and these projection optical systems pL are arranged in the γ direction. In Fig. 12, the projection regions EL4 of the projection optical systems pl are arranged. In the EL 7 , the adjacent two ends in the Y direction overlap each other. Further, for example, as shown in FIG. 13 , the projection areas 曝光, 12, 2 of the exposure apparatuses 10 A and 10B and the projection areas of the exposure apparatuses 10C and 10D EA31 ' 22 201207980 32, 41, 42 are overlapped. As described above, the projection area of the exposure apparatus disposed on the upstream side in the transport direction of the sheet substrate FB may overlap with the projection area of the exposure apparatus disposed on the downstream side. Further, in the above-described embodiment, the groove portions 76 of the suction drums 73 and 74 are configured such that a pair of projection regions are provided, but the present invention is not limited thereto. Instead, or in an additional manner, for example, as shown in FIG. A pair of groove portions 76 are provided so as to sandwich a plurality of projection regions EA. In the above description, the projection regions of the plurality of exposure devices are shifted in the X direction as an example, but the invention is not limited thereto. Replace and/or In the additional method, for example, the projection areas of the plurality of exposure devices are aligned in the X direction, that is, in the γ direction. In addition, the above description is made for all the loads corresponding to the plurality of exposure devices. The device FST sets the configuration of the first detecting means and the second detecting means, but is limited to +. It can be replaced by and/or by adding 彳4, and can be made only. The P-tool mounting stage i FST sets the first detecting means and the second detecting Further, in the above description, the processing device 10 is an example of the exposure device, and the month i_ is not limited thereto. The processing device! G may be formed by other devices such as the partition walls described in the above embodiments. The device and the electrode form a light-emitting layer forming device. Further, in the present embodiment, the alignment device detects the alignment marks provided at both end portions of the sheet substrate FB. However, it is possible to replace and/or additionally align the 奘荖&, half-turn 5 〇 detection substrate reference mark FFM, or the disc in the temple double-measurement sheet substrate FB + 丄 x x, also direction Parallel sides (edge of substrate FB). It is also possible to replace or/or set the alignment mark (substrate mark 23 201207980 in each of the plurality of processed areas (plural intervals) or to one or more of the plurality of sections) BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a configuration of a substrate processing apparatus according to the present embodiment. Fig. 2 is a view showing a configuration of a stage device according to the embodiment. Fig. 3 is a view showing an exposure apparatus of the embodiment. Fig. 4 is a view showing the configuration of the exposure apparatus and the stage device of the embodiment. Fig. 4 is a view showing the configuration of the exposure apparatus and the stage arrangement of the present embodiment. Fig. 7 is a view showing the alignment operation of the exposure device and the stage device. Fig. 8 is a view showing the alignment operation between the stage device and the sheet substrate. Fig. 10 is a view showing another configuration of the substrate processing apparatus of the embodiment. Fig. 11 is a view showing another configuration of the substrate processing apparatus according to the embodiment. Fig. 13 shows another configuration of the substrate processing apparatus of the present embodiment. Fig. 13 shows another configuration of the substrate processing apparatus according to the present embodiment. 24 201207980 FIG. 14 shows another substrate processing apparatus according to the present embodiment. Fig. [Main component representative symbol] 10 Processing device 10A to 10D Exposure device 11 Stage drive unit 30 Transfer device 50 Alignment device 52 Adjustment mechanism 70 Main body portion 70a of the stage device Rectangular lower layer portion 70b Column portion 70c Upper layer Part 70d Space 71, 72 Concavity Rollers 73, 74 Adsorption Rollers 73a to 73e, 74a to 74e, Ra to Rc Roller Portion 75 Supporting Tables 75a to 75c Supporting Surface 75d Exposed Portion 76' 77 Groove Portion CA Detection Camera CL Substrate Recycling Section 25 201207980 CONT control unit DC detection camera EA (EA1 to EA42) projection H FI to F5 exposure area Fa bending part FB sheet substrate FFM substrate reference mark Fp processed surface FPA substrate processing apparatus FST stage apparatus IL illumination optical system M mask MFM Mask reference mark MST mask stage PL (PLL·-PL3) Projection optical PR substrate Processing section R Roller unit RR Roller RST Roller stage SFM Stage reference mark SU Substrate supply part 26