HK1177965A - Exposure apparatus, substrate processing apparatus, and device manufacturing method - Google Patents

Description

Exposure apparatus, substrate processing apparatus, and device manufacturing method

Technical Field

The invention relates to an exposure apparatus, a substrate processing apparatus and a device manufacturing method.

This application claims priority based on U.S. provisional application No. 61/323514, filed on 13/4/2010, and the contents of which are incorporated herein by reference.

Background

As a display element constituting a display device such as a display device, for example, a liquid crystal display element and an organic electroluminescence (organic EL) element are known. Currently, among these display elements, active elements (active devices) in which Thin Film Transistors (TFTs) are formed on the surface of a substrate so as to correspond to respective pixels have been the mainstream.

In recent years, a technique of forming a display element on a flexible substrate (for example, a film member or the like) has been proposed. As such a technique, for example, a technique called Roll-to-Roll (hereinafter, simply referred to as "Roll") is known (for example, see patent document 1). In roll-to-roll, a strip-shaped substrate wound around a supply roller on the substrate supply side is sent out, and the sent-out substrate is wound around a recovery roller on the substrate recovery side and is conveyed.

Patent document 1: international publication No. 2008/129819

However, a display device is expected to have a large display screen, and even in the roll type, a technique capable of efficiently manufacturing a large display element on a belt-shaped substrate is strongly desired.

Disclosure of Invention

Accordingly, an object of an aspect of the present invention is to provide an exposure apparatus, a substrate processing apparatus, and a device manufacturing method, which can efficiently manufacture a display element on a strip-shaped substrate.

An exposure apparatus according to a first embodiment of the present invention transfers a pattern provided along a predetermined cylindrical surface to a substrate by rotating the pattern in a circumferential direction of the cylindrical surface, the exposure apparatus including: a first projection optical system that projects an image of a first partial pattern arranged in a first region of the cylindrical surface among the patterns onto a first projection region; a second projection optical system that projects an image of a second partial pattern, which is arranged in a second region different from the first region, of the patterns onto a second projection region different from the first projection region; and a guide device that guides the substrate to the first projection region and the second projection region in synchronization with rotation of the pattern in the circumferential direction.

A substrate processing apparatus according to a second embodiment of the present invention is a substrate processing apparatus for processing a strip-shaped substrate, including: a substrate conveying unit that conveys the substrate in a longitudinal direction of the substrate; and a substrate processing unit that is provided along a transport path along which the substrate is transported by the substrate transport unit and processes the substrate transported along the transport path, the substrate processing unit including the exposure device that transfers a pattern to the substrate.

A device manufacturing method according to a third embodiment of the present invention is a device manufacturing method for manufacturing a device by processing a substrate, including: transferring a pattern to the substrate using the exposure apparatus; and processing the substrate transferred with the pattern based on the pattern.

According to the embodiments of the present invention, it is possible to provide an exposure apparatus, a substrate processing apparatus, and a device manufacturing method capable of efficiently manufacturing a display element on a strip-shaped substrate.

Drawings

Fig. 1 is a schematic diagram showing a configuration of a substrate processing apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic diagram showing the configuration of the exposure apparatus according to the present embodiment.

Fig. 3 is a perspective view showing a partial configuration of the exposure apparatus according to the present embodiment.

Fig. 4A is a perspective view of a partial structure of the exposure apparatus according to the present embodiment.

Fig. 4B is a perspective view showing a partial configuration of the exposure apparatus according to the present embodiment.

Fig. 5 is a perspective view showing a partial configuration of the exposure apparatus according to the present embodiment.

Fig. 6 is a plan view showing a partial configuration of the exposure apparatus according to the present embodiment.

Fig. 7 is a schematic diagram showing a partial configuration of an exposure apparatus according to the present embodiment.

Fig. 8 is a plan view showing a partial configuration of the exposure apparatus according to the present embodiment.

Fig. 9 is a diagram showing an operation of the exposure apparatus according to the present embodiment.

Fig. 10 is a diagram showing another configuration of the exposure apparatus according to the present embodiment.

Fig. 11 is a diagram showing another configuration of the exposure apparatus according to the present embodiment.

Fig. 12 is a diagram showing another configuration of the exposure apparatus according to the present embodiment.

Fig. 13 is a diagram showing another configuration of the exposure apparatus according to the present embodiment.

Fig. 14 is a diagram showing another configuration of the exposure apparatus according to the present embodiment.

Fig. 15 is a diagram showing another configuration of the exposure apparatus according to the present embodiment.

Fig. 16 is a diagram showing another configuration of the exposure apparatus according to the present embodiment.

Fig. 17 is a diagram showing another configuration of the exposure apparatus according to the present embodiment.

Fig. 18 is a flowchart showing a part of a manufacturing process in manufacturing a semiconductor device.

Fig. 19 is a flowchart showing a part of the manufacturing process in manufacturing the liquid crystal display element.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Fig. 1 is a diagram showing a configuration of a substrate processing apparatus FPA according to an embodiment of the present invention.

As shown in fig. 1, the substrate processing apparatus FPA includes: a substrate supply unit SU that supplies a strip-shaped substrate (for example, a strip-shaped film member) FB; a substrate processing section PR for processing a surface (a surface to be processed) of the substrate FB; a substrate recovery unit CL for recovering the substrate FB; and a control unit CONT for controlling the above units.

In the present embodiment, an XYZ coordinate system is set as shown in fig. 1, and the XYZ coordinate system is appropriately used in the following description. The XYZ coordinate system has, for example, an X axis and a Y axis set along a horizontal plane, and a Z axis set upward along a vertical direction. The substrate processing apparatus FPA conveys the substrate FB from the negative side (-side) to the positive side (+ side) along the X axis as a whole. At this time, the width direction (short side direction) of the tape-shaped substrate FB is set to the Y-axis direction.

The substrate processing apparatus FPA is an apparatus that performs various processes on the surface of the substrate FB during a period from when the substrate FB is sent out from the substrate supply unit SU to when the substrate FB is collected by the substrate collection unit CL. The substrate processing apparatus FPA can be used in a case where a display element (electronic device) such as an organic EL element, a liquid crystal display element, or the like is formed on the substrate FB.

As the substrate FB to be processed in the substrate processing apparatus FPA, for example, a resin film or a foil (metal foil) of stainless steel can be used. For example, as the resin film, a material such as a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene-vinyl copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, a polycarbonate resin, a polystyrene resin, or a vinyl acetate resin can be used.

The substrate FB is preferably made of a material having a small thermal expansion coefficient which does not change even when subjected to a thermal dimension of about 200 ℃. For example, the inorganic filler can be mixed with the resin film sheet to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, and silicon oxide.

The substrate FB has a dimension in the width direction (short-side direction) of, for example, about 1 to 2m, and a dimension in the longitudinal direction (long-side direction) of, for example, 10m or more. Of course, this size is merely an example, and is not limited thereto. For example, the dimension of the substrate FB in the Y direction may be 50cm or less, or 2m or more. The dimension of the substrate FB in the X direction may be 10m or less.

The substrate FB is formed to have flexibility. Here, the flexibility means the following properties: even if a force of about its own weight is applied to the substrate, the substrate is not broken or cracked, and the substrate can be flexed. Further, the flexibility includes a property of bending due to a force of about its own weight. The flexibility varies depending on the material, size, thickness, temperature, and other circumstances of the substrate. Further, although one strip-shaped substrate can be used as the substrate FB, a plurality of unit substrates may be connected to each other to form a strip-shaped structure.

The substrate supply unit SU feeds out the substrate FB wound in a roll shape, for example, to the substrate processing unit PR and supplies the substrate. In this case, the substrate supply unit SU is provided with a shaft portion around which the substrate FB is wound, a rotation driving device for rotating the shaft portion, and the like. For example, a lid portion or the like may be provided to cover the substrate FB wound in a roll shape. The substrate supply unit SU is not limited to a mechanism for feeding out the substrate FB wound in a roll, and may include a mechanism for sequentially feeding out the substrate FB in a strip shape in the longitudinal direction.

The substrate recovery unit CL recovers the substrate FB from the substrate processing unit PR by winding the substrate FB in a roll shape, for example. The substrate recovery unit CL is provided with a shaft portion for winding up the substrate FB, a rotation driving device for rotating the shaft portion, a lid portion for covering the recovered substrate FB, and the like, similarly to the substrate supply unit SU. Further, when the substrate FB is cut into a plate shape in the substrate processing portion PR, the substrate FB may be recovered in a state different from a state of being wound into a roll, for example, by recovering the substrate FB in a state of being overlapped.

The substrate processing unit PR transports the substrate FB supplied from the substrate supply unit SU to the substrate recovery unit CL, and processes the surface Fp of the substrate FB to be processed during the transport. The substrate processing unit PR includes, for example, a processing apparatus 10, a transfer apparatus 30, and an alignment apparatus 50.

The processing apparatus 10 includes various devices for forming, for example, organic EL elements on the surface Fp of the substrate FB. Examples of such an apparatus include a partition wall forming apparatus for forming a partition wall on the surface to be processed Fp, an electrode forming apparatus for forming an electrode, and a light-emitting layer forming apparatus for forming a light-emitting layer. More specifically, the coating apparatus may include a droplet coating apparatus (e.g., an inkjet type coating apparatus or a spin coating type coating apparatus), a film forming apparatus (e.g., a vapor deposition apparatus or a sputtering apparatus), an exposure apparatus, a developing apparatus, a surface modification apparatus, and a cleaning apparatus. The above-described devices are appropriately provided along the conveyance path of the substrate FB. In the present embodiment, an exposure device is provided as the processing device 10.

The transport device 30 includes a roller device R that transports the substrate FB to the substrate recovery unit CL side in the substrate processing unit PR. The roller devices R are provided in plurality along the conveyance path of the substrate FB. A drive mechanism (not shown) is attached to at least some of the plurality of roller devices R. By rotating such a roller device R, the substrate FB is conveyed in the X-axis direction. Some of the plurality of roller devices R may be configured to be movable in a direction intersecting the surface of the substrate FB.

The alignment device 50 performs an alignment operation on the substrate FB. The alignment device 50 includes an alignment camera 51 for detecting the position of the substrate FB, and an adjustment device 52 for adjusting at least one of the position and the posture of the substrate FB based on the detection result of the alignment camera 51.

The alignment camera 51 detects, for example, an alignment mark formed on the substrate FB, and sends the detection result to the control part CONT. The control unit CONT obtains position information of the substrate FB based on the detection result, and controls the adjustment amount adjusted by the adjustment device 52 based on the position information.

Fig. 2 is a diagram showing the structure of an exposure apparatus EX used as the processing apparatus 10. The exposure apparatus EX projects an image of the pattern Pm formed on the mask M onto the substrate FB. As shown in fig. 2, the exposure apparatus EX includes: an illumination device IU that illuminates the mask M; a mask moving device MST that holds the mask M and is capable of moving and rotating; a projection unit PU for projecting the enlarged image of the pattern Pm on the substrate FB; and a substrate guide device FST for guiding the substrate FB.

The illumination unit IU irradiates the mask M with exposure light ELI. The illumination device IU has a light source device 20 and an illumination optical system 21. The exposure light ELI emitted from the light source device 20 irradiates the mask M from a plurality of directions via the irradiation optical system 21. In addition, although the irradiation optical system 21 is shown in fig. 2 in a simplified manner, the irradiation optical system 21 actually includes a plurality of optical elements for guiding the exposure light ELI.

The mask moving device MST includes a holding unit 40 and a driving device ACM. The holding portion 40 is formed in a substantially cylindrical shape, and is formed to hold the mask M along a cylindrical surface 40a corresponding to an outer peripheral surface thereof. The holding portion 40 is provided rotatably in the circumferential direction of the cylindrical surface 40a (i.e., about an axis C as the center axis of the cylindrical surface 40 a). The drive device ACM can drive the holding portion 40 to rotate along the cylindrical surface 40a, and move the holding portion 40 in the X direction, the Y direction, and the Z direction in the drawing.

The mask M is detachably held by the holding portion 40. As the mask M, for example, a transmissive mask formed in a sheet shape can be used. The mask M is held by the holding portion 40 in a state where the pattern surface on which the pattern Pm is formed faces the inside of the cylindrical surface 40a so that the pattern Pm is arranged along the cylindrical surface 40 a. Therefore, the pattern Pm is actually arranged on a plane coincident with the cylindrical surface 40 a.

The projection apparatus PU has a plurality of projection optical systems PL. A part of the plurality of projection optical systems PL is disposed on the upstream side (-X side) of the substrate FB with respect to the mask M, and projects an enlarged image of the pattern Pm disposed on the + X side of the holding unit 40 onto the substrate FB positioned on the-X side of the holding unit 40. The other part of the plurality of projection optical systems PL is disposed on the downstream side (+ X side) of the substrate FB with respect to the mask M, and thereby projects an enlarged image of the pattern Pm disposed on the-X side of the holding unit 40 onto the substrate FB located on the + X side with respect to the holding unit 40.

Each projection optical system PL has a first imaging section 60 and a second imaging section 61. The first image forming section 60 is provided in an area inside the cylindrical holding section 40 (hereinafter, the area inside is appropriately referred to as the inside of the holding section 40). The first image forming section 60 emits the exposure light that has entered the inside of the holding section 40 through the mask M to an area outside the cylindrical holding section 40 (hereinafter, this outside area is referred to as the outside of the holding section 40 as appropriate). The second imaging section 61 is provided outside the holding section 40. The second image forming unit 61 receives the exposure light from the first image forming unit 60 and irradiates the substrate FB. In the projection optical system PL, for example, the first imaging unit 60 has a projection magnification of equal magnification or substantially equal magnification, and the second imaging unit 61 has an enlarged projection magnification (magnification), so that an enlarged image of the pattern Pm is projected onto the substrate FB.

The substrate guide apparatus FST guides the substrate FB so that the substrate FB is projected through the projection area PA where the image of the pattern Pm is projected by the projection apparatus PU. The substrate guide apparatus FST includes: a guide portion 80; an upstream side roller 81; a downstream side roller 82; and a driving device ACF. The guide portions 80 are disposed at positions corresponding to the projection area PA of the projection optical system PL disposed on the + X side and the projection area PA of the projection optical system PL disposed on the-X side of the holding portion 40, respectively.

Each guide portion 80 has a support surface (support portion) 80a that supports the substrate FB. The guide portion 80 is provided with an air bearing mechanism, not shown, by which the substrate FB can be supported on the support surface 80a in a non-contact manner. The support surface 80a is disposed at a position optically conjugate to the cylindrical surface 40a with respect to the projection optical system PL. The support surface 80a has a curved portion 83. The curved portion 83 is curved in a direction optically corresponding to the curved direction of the mask M by the projection optical system PL. Specifically, the curved portion 83 is curved in a cylindrical surface shape protruding toward the projection optical system PL, corresponding to the mask M curved in a cylindrical surface shape recessed toward the projection optical system PL. The substrate FB guided by the guide portion 80 is bent and guided along the surface shape of the bent portion 83.

The position at which the bending portion 83 is disposed is not limited to the position optically conjugate with the mask M (cylindrical surface 40 a) as described above, and may be a position shifted from this position within a range of, for example, the depth of focus of the image of the pattern Pm formed by the projection optical system PL. The depth of focus δ is, for example, as:

－k·λ/NA²≤δ≤+k·λ/NA²

and (4) showing. Here, λ is a wavelength (center wavelength) of the exposure light ELI, NA is a numerical aperture on the image side of the projection optical system PL, and k is a process coefficient (constant determined based on conditions relating to imaging).

The curved portion 83 is curved with the same curvature (radius of curvature) as that of the mask M (radius of curvature of the cylindrical surface 40 a). Since the substrate FB is curved and guided with the same curvature as that of the mask M, the irradiation surface on which the mask M is irradiated with the exposure light has the same curvature (radius of curvature) as the irradiation surface on which the substrate FB is irradiated with the exposure light. In other words, the curvature (radius of curvature) of the mask M located in the field region of the projection optical system PL is equal to the curvature (radius of curvature) of the substrate FB located in the projection region of the projection optical system PL (i.e., the region in the field region where the pattern Pm is projected). Therefore, the mask M and the substrate FB both satisfy a conjugate relationship with each other over the entire field of view and the entire projection region of the projection optical system PL, and an enlarged image of the pattern Pm can be favorably projected onto the substrate FB over the entire projection region.

The support surface 80a is formed with second curved portions 84 on the upstream side and the downstream side of the curved portion 83, respectively. The second bending portion 84 is provided at a position corresponding to the carry-in portion and the carry-out portion of the substrate FB in the guide portion 80. The second curved portion 84 is curved in such a manner that the curvature thereof is larger than that of the curved portion 83 (i.e., the radius of curvature is small). Therefore, the substrate FB supported by the guide portion 80 can be prevented from contacting the upstream and downstream ends of the guide portion 80, and is not damaged by the ends. When the front end of the substrate FB is carried onto the support surface 80a, the substrate FB can be smoothly carried into the support surface without contacting the upstream end of the guide portion 80.

In the present embodiment, since the substrate FB guided by the guide portion 80 is guided while being bent along the surface shape of the bent portion 83 by providing the bent portion 83, wrinkles or slackness are less likely to occur in the substrate FB on the support surface 80a (projection area) than in the case where the substrate FB is guided while being kept flat. Therefore, the accuracy of alignment and focusing of the substrate FB can be improved. For example, it can be set as: the upstream roller 81, the downstream roller 82, and the driving device ACF are controlled to apply tension to the substrate FB to such an extent that the substrate FB does not stretch so as to follow the surface shape of the curved portion 83.

The upstream roller 81 carries the substrate FB into the guide portion 80. The downstream roller 82 carries the substrate FB out of the guide portion 80. The upstream roller 81 and the downstream roller 82 convey the substrate FB at a predetermined conveyance speed, for example. The driving device ACF adjusts the rotation speed of the upstream roller 81 and the downstream roller 82.

The drive device ACF adjusts the rotation speed of the upstream roller 81 and the downstream roller 82 based on the control signal from the control unit CONT, thereby adjusting the conveyance speed of the substrate FB. The control unit CONT controls the driving of the driving device ACM and the driving of the driving device ACF so that the substrate FB is conveyed at a conveyance speed corresponding to the rotation speed of the mask M. Specifically, the control part CONT controls the driving of the driving device ACM and the driving device ACF such that the ratio of the conveyance speed of the substrate FB in the longitudinal direction (i.e., the moving speed of the surface of the substrate FB) to the moving speed of the mask M along the cylindrical surface 40a (peripheral speed) is equal to the projection magnification (magnification) of the projection optical system PL.

Fig. 3 is a perspective view showing the structure of the mask transfer device MST. Fig. 3 shows a state in which a part of the projection device PU is disposed inside the holding unit 40. Fig. 4A is a perspective view showing the structure of the holding portion 40. Fig. 4B is a diagram showing the pattern Pm formed on the mask M.

As shown in fig. 2, 3, and 4A, the holding portion 40 of the mask transfer device MST is formed along a cylindrical surface 40 a. The holding portion 40 is provided to be rotatable about the axis C in the circumferential direction of the cylindrical surface 40 a. The holding unit 40 is detachably provided to the exposure apparatus EX by a fixing device not shown or the like.

The holding portion 40 includes a ring portion 43 and a coupling portion 44. Five ring portions 43 are arranged with the axis C as a common central axis. The connecting portion 44 is disposed at a position where these five ring portions 43 are connected. The coupling portion 44 is provided to couple two adjacent ring portions 43 at two positions in the circumferential direction. The two coupling portions 44 are disposed at positions symmetrical with respect to the axis C (positions facing each other across the axis C), for example. The connecting portions 44 are provided two by two in the circumferential direction at four positions between the five ring portions 43, and eight in total. The number of the ring portion 43 and the coupling portion 44 constituting the holding portion 40 is not limited to the above number. In particular, the number of the ring portions 43 is set corresponding to the number of the projection optical systems.

The holding portion 40 has a plurality of openings OP formed by the ring portion 43 and the coupling portion 44. The opening OP is formed to communicate the inside and the outside of the holding portion 40. The plurality of openings OP include a first opening 41 and a second opening 42. The first opening 41 and the second opening 42 are formed so that the exposure light ELI can pass therethrough.

The first opening 41 is provided in the holding portion 40 at a portion where the mask M is held. The first opening 41 is provided with four (first openings 41a to 41 d) along the axis C. The holding portion 40 has a mask suction portion SC in the ring portion 43 and the area around the first openings 41a to 41d in the connecting portion 44.

The mask suction unit SC includes, for example, a suction port, not shown, provided in the ring portion 43 and the connection portion 44, and a suction pump, not shown, connected to the suction port. The mask suction unit SC can suck the mask M to the holding unit 40 by sucking the mask M through the suction port. The mask suction unit SC can release the holding of the mask M by stopping the suction of the mask M. By adjusting the suction of the mask suction unit SC, the attachment and detachment of the mask M can be switched smoothly.

One mask M (Ma to Md) is held in each of the first openings 41a to 41 d. As shown in fig. 4B, the masks Ma to Md are formed with patterns Pa to Pd, respectively, so as to form a desired pattern Pm as a whole when joined to each other in a predetermined direction (direction corresponding to the axis C). In other words, the pattern Pm is formed by joining the patterns Pa to Pd formed on the masks Ma to Md in a predetermined direction. In addition, the same pattern is formed in the end regions (the portions joined to each other in fig. 4B) of the masks Ma and Mb adjacent to each other. Similarly, the same pattern is formed in the end regions of the masks Mb and Mc and the masks Mc and Md adjacent to each other.

The second openings 42 are provided in four (second openings 42a to 42 d) along the axis C, similarly to the first openings 41a to 41 d. The second opening 42 is provided at a position symmetrical to the first opening 41 with respect to the axis C (a position facing the first opening with the axis C interposed therebetween). The second openings 42a to 42d are formed to have the same dimensions in the circumferential direction and the axis C direction as the first openings 41a to 41d, respectively. The first openings 41a to 41d and the second openings 42a to 42d are arranged to be shifted from each other in the circumferential direction of the cylindrical surface 40 a.

At both ends of the holding portion 40 in the direction of the axis C, connected portions 43a connected to a rotation mechanism or the like, not shown, are formed. The rotation mechanism is part of the drive means ACM described above. The rotation mechanism may be, for example, a part of a gear mechanism that rotates the holding unit 40, or may be a movable element (a magnet unit or a coil unit) of a linear motor mechanism.

Fig. 5 is a diagram showing a configuration of a part of the illumination device IU and a configuration of a part of the projection device PU. Fig. 6 is a diagram schematically showing the configuration of the illumination device IU and the projection device PU.

As shown in fig. 3, 5, and 6, the illumination apparatus IU includes four illumination optical systems IL (illumination optical systems ILa to ILd) provided for each of the four masks M (Ma to Md) held by the holding unit 40. The illumination optical system ILa illuminates the mask Ma provided in the first opening 41 a. The illumination optical system ILb illuminates the mask Mb provided in the first opening 41 b. The illumination optical system ILc illuminates the mask Mc provided in the first opening 41 c. The illumination optical system ILd illuminates the mask Md provided in the first opening 41 d. The illumination optical systems ILa and ILc are disposed on the + X side of the holding unit 40, and illuminate the masks Ma and Mc from the outside to the inside of the holding unit 40, respectively. The illumination optical systems ILb and ILd are disposed on the-X side of the holding unit 40, and illuminate the masks Mb and Md from the outside to the inside of the holding unit 40, respectively. The illumination optical systems ILa to ILd are arranged in the Y direction at a pitch corresponding to the pitch (i.e., adjacent center-to-center distance) of the masks Ma to Md, for example.

Fig. 7 is a diagram schematically showing the configuration of the projection apparatus PU.

As shown in fig. 2, 3, and 5 to 7, the projection apparatus PU includes projection optical systems PL (PLa to PLd) corresponding to the four illumination optical systems ILa to ILd and the four masks Ma to Md, respectively. The projection optical system PLa is arranged corresponding to the illumination optical system ILa and the mask Ma, the projection optical system PLb is arranged corresponding to the illumination optical system ILb and the mask Mb, the projection optical system PLc is arranged corresponding to the illumination optical system ILc and the mask Mc, and the projection optical system PLd is arranged corresponding to the illumination optical system ILd and the mask Md.

The first image forming units 60 (60 a to 60 d) of the projection optical systems PLa to PLd are respectively disposed inside the holding unit 40. The first image forming unit 60a is disposed on the optical path of the exposure light ELI from the illumination optical system ILa through the mask Ma. The first image forming unit 60b is disposed on the optical path of the exposure light ELI from the illumination optical system ILb through the mask Mb. The first image forming section 60c is disposed on the optical path of the exposure light ELI from the illumination optical system ILc through the mask Mc. The first image forming section 60d is disposed on the optical path of the exposure light ELI from the illumination optical system ILd through the mask Md.

The first image forming portions 60a to 60d are held by a frame 62 (see fig. 5). The frame 62 is disposed along the axis C inside the holding portion 40. The frame 62 and the first image forming portions 60a to 60d arranged inside the holding portion 40 are held at positions not in contact with the holding portion 40.

As shown in fig. 6, the first image forming units 60a to 60d guide the exposure light ELI from the illumination optical systems ILa to ILd through the masks Ma to Md and the first openings 41a to 41d, respectively, so as to cross the axis line C inside the holding unit 40, and emit the light to the outside of the holding unit 40 through the second openings 42a to 42 d.

As shown in fig. 6 and 7, the first imaging portion 60 (60 a to 60 d) forms pupil planes 65 (65 a to 65 d) inside the holding portion 40. In the present embodiment, the pupil surfaces 65a to 65d are formed in the vicinity of the axis C (for example, in the vicinity of the incident surface side of the axis C). Aperture stops 63 (63 a to 63 d) are provided on the pupil planes 65a to 65 d. Here, the pupil plane includes a plane conjugate to an entrance pupil or an exit pupil of the optical system.

As shown in fig. 6 and 7, the first image forming portion 60 (60 a to 60 d) forms an intermediate image of the patterns Pm (Pa to Pd) in the vicinity of the second openings 42 (42 a to 42 d). In the present embodiment, the intermediate images 66 (66 a to 66 d) of the patterns Pm (Pa to Pd) are formed inside the holding portion 40 with respect to the second openings 42 (42 a to 42 d). In addition, openable and closable blinds (blinds) 64 (64 a to 64 d) are provided at positions where the intermediate images 66 (66 a to 66 d) are formed. The opening and closing of the blinds 64a to 64d are controlled by the control unit CONT.

On the other hand, the second image forming units 61 (61 a to 61 d) of the projection optical systems PLa to PLd are respectively disposed outside the holding unit 40. The second image forming units 61a to 61d receive the exposure light ELI emitted from the first image forming units 60a to 60d, respectively, and project the enlarged images of the intermediate images 66a to 66d and further the enlarged images of the patterns Pa to Pd on the predetermined projection areas PAa to PAd. Here, the projection areas PAa, PAc are provided on the-X side of the holding unit 40, and the projection areas PAb, padd are provided on the + X side of the holding unit 40. Further, the guide portions 80 located on the-X side of the holding portion 40 are disposed below the projection areas PAa, PAc, and the guide portions 80 located on the + X side of the holding portion 40 are disposed below the projection areas PAb, PAd.

Fig. 8 is a plan view showing a positional relationship between the mask moving device MST and the substrate FB.

As shown in fig. 8, the projection areas PAa to PAd projected by the projection optical systems PLa to PLd are formed in shapes where two sides are parallel to each other in the Y direction (in the present embodiment, in a parallelogram shape), for example. The projection regions PAa to PAd are formed such that the widths (dimensions in the X direction) of the ends in the Y direction gradually decrease. Hereinafter, the portion where the width is gradually reduced will be referred to as a tapered portion. The shapes of the projection areas PAa to PAd are not limited to the parallelogram shape, and may be, for example, a trapezoidal shape or a hexagonal shape having a tapered portion at an end in the Y direction. The shapes of the projection areas PAa to PAd are set by the blinds 64a to 64d, respectively.

The projection optical system PLa and the projection optical system PLb are configured to: so that the position in the Y direction of the tapered portion of the projection area PAa formed on the + Y side overlaps the position in the Y direction of the tapered portion of the projection area PAb formed on the-Y side. The projection optical system PLb and the projection optical system PLc are formed such that: so that the position in the Y direction of the tapered portion of the projection area PAb formed on the + Y side overlaps the position in the Y direction of the tapered portion of the projection area PAc formed on the-Y side. Further, the projection optical system PLc and the projection optical system PLd are formed such that: so that the position in the Y direction of the tapered portion of the projection area PAc formed on the + Y side overlaps the position in the Y direction of the tapered portion of the projection area padd formed on the-Y side.

Fig. 8 is a schematic view of the holding portion 40 viewed from the + Y direction. Here, when the amount of mutual displacement in the circumferential direction of two first openings adjacent to each other in the direction of the axis C among the first openings 41a to 41D (or the amount of mutual displacement in the circumferential direction of each pattern of the mask M provided in each of the two first openings adjacent to each other in the direction of the axis C) is set to S, the diameter of the holding portion 40 (cylindrical surface 40 a) is set to D, the pitch in the X-axis direction (usually, the pitch along the movement path of the substrate FB) between the projection region projected by the projection optical systems PLa and PLc (first projection optical system) and the projection region projected by the projection optical systems PLb and PLd (second projection optical system) is set to L, and the projection magnifications of the projection optical systems PLa to PLd are set to β, the amount of displacement S can be set so as to satisfy the following formula:

s = π × D/2-L/β (wherein L ≦ β × π × D/2).

In the present embodiment, the irradiation optical system 21 corresponding to the first projection optical system and the irradiation optical system 21 corresponding to the second projection optical system irradiate the exposure light ELI toward the mask M from directions facing each other, and the field of view region of the first projection optical system and the field of view region of the second projection optical system are located on opposite sides of the mask M with the axis C therebetween, but the present invention is not limited to the above configuration. In response to this, the shift amount S is set by the following equation using the pitch (center distance) N, pitch L, and projection magnification β from the field of view region of the first projection optical system to the field of view region of the second projection optical system in the circumferential direction of the cylindrical surface 40a in the rotational traveling direction of the mask M,

s = N-L/β (wherein L ≦ β × N).

Further, if the central angle Φ (radian) of the circular arc of the cylindrical surface 40a corresponding to the pitch N is used, the offset amount S can also be set by the following equation,

S=φ×D/2－L/β。

the pitch N may be a pitch from a field of view region of the projection optical system forming the projection region on the downstream side of the substrate FB to a field of view region of the projection optical system forming the projection region on the upstream side of the substrate FB in the circumferential direction of the cylindrical surface 40a in the rotational traveling direction of the mask M.

The substrate processing apparatus FPA configured as described above manufactures display elements (electronic devices) such as organic EL elements and liquid crystal display elements by roll-to-roll under the control of the control unit CONT. Hereinafter, a process of manufacturing a display device using the substrate processing apparatus FPA having the above-described structure will be described.

First, the belt-shaped substrate FB wound around a roller, not shown, is mounted on the substrate supply unit SU. The control unit CONT rotates a roller, not shown, to feed the substrate FB from the substrate supply unit SU in this state. The substrate FB passed through the substrate processing unit PR is wound by a roller, not shown, provided in the substrate recovery unit CL. By controlling the substrate supply unit SU and the substrate recovery unit CL, the surface to be processed Fp of the substrate FB can be continuously conveyed to the substrate processing unit PR.

The control unit CONT properly conveys the substrate FB within the substrate processing unit PR by the conveying device 30 of the substrate processing unit PR until the substrate FB is sent out from the substrate supply unit SU and wound up by the substrate collection unit CL, and sequentially forms the components of the display elements on the substrate FB by the processing device 10. In this step, when the exposure apparatus EX is used to perform the process, the masks Ma to Md are first attached to the holding unit 40.

Next, the control unit CONT irradiates the exposure light ELI on the pattern Pm of the mask M from the illumination apparatus IU. The projection optical system PL projects the enlarged image of the pattern Pm to the projection areas PAa to PAd.

As shown in fig. 9, the projection areas PAa to PAd are formed in the area of the substrate FB disposed on the curved portion 83 of the guide portion 80. The portion of the substrate FB is bent along the bent portion 83. The projection areas PAa to PAd are formed on the curved substrate FB.

The control unit CONT performs exposure processing first on the upstream side (-X side) of the holding unit 40. The control unit CONT irradiates the patterns Pa and Pc of the masks Ma and Mc with the exposure light ELI from the illumination optical systems ILa and ILc, respectively. The exposure light ELI sequentially passes through the masks Ma and Mc and the first openings 41a and 41c, and enters the first image forming portions 60a and 60c of the projection optical systems PLa and PLc, respectively, inside the holding portion 40.

The exposure light ELI having passed through the first image forming portions 60a and 60c is incident on the second image forming portions 61a and 61c through the second opening portions 42a and 42 c. The exposure light ELI after passing through the second image forming units 61a and 61c is irradiated to the projection areas PAa and PAc. By this operation, an enlarged image of the pattern Pa and an enlarged image of the pattern Pc are projected on the projection areas PAa and PAc, respectively. In this state, the controller CONT rotates the holding unit 40 by using the driving device ACM and moves the substrate FB in the + X direction. Thus, the enlarged images of the patterns Pa and Pc projected on the projection regions PAa and PAc in the two regions separated in the Y direction of the substrate FB are exposed in order from the + X side to the-X side, and band-shaped exposure regions PBa and PBc along the X axis direction are formed on the substrate FB. At this time, the control unit CONT adjusts the rotation speed of the holding unit 40 and the movement speed of the substrate FB so that the ratio of the movement speed of the substrate FB in the longitudinal direction to the movement speed of the mask M along the cylindrical surface 40a is equal to the projection magnification (magnification) of the projection optical system PL, and causes the drive device ACM and the drive device ACF to perform this operation.

Next, when the + X-side ends of the exposure regions PBa and PBc reach the X-direction positions equal to the projection regions PAb and PAd in accordance with the movement of the substrate FB, the controller CONT performs the exposure process on the downstream side (+ X side) of the holding unit 40. The control unit CONT irradiates the patterns Pb and Pd of the masks Mb and Md with the exposure light ELI from the illumination optical systems ILb and ILd, respectively.

The exposure light ELI having passed through the patterns Pb and Pd passes through the first openings 41b and 41d, the first image forming portions 60b and 60d, and the second openings 42b and 42d in this order, and enters the second image forming portions 61b and 61 d. The exposure light ELI after passing through the second image forming units 61b and 61d is irradiated to the projection areas PAb and PAd.

Enlarged images of the patterns Pb and Pd are projected on the projection areas PAb and PAd, respectively. Thus, the enlarged images of the patterns Pb and Pd projected on the projection areas PAb and padd in two areas separated in the Y direction on the substrate FB are exposed in order from the + X side to the-X side, and band-shaped exposure areas PBb and PBd are formed in the X axis direction on the substrate FB. At this time, the end portion on the-Y side and the end portion on the + Y side of the exposure region PBb are exposed in a state of overlapping with the end portion on the + Y side of the exposure region PBa and the end portion on the-Y side of the exposure region PBc, respectively, and the end portion on the-Y side of the exposure region PBd is exposed in a state of overlapping with the end portion on the + Y side of the exposure region PBc. Then, the control unit CONT continues to cause the driving device ACM and the driving device ACF to adjust the rotation speed of the holding unit 40 and the movement speed of the substrate FB so that the ratio of the movement speed of the substrate FB in the longitudinal direction to the movement speed of the mask M along the cylindrical surface 40a is equal to the projection magnification of the projection optical system PL.

In the present embodiment, on the substrate FB, there are formed: a portion exposed only by the individual images projected on the projection areas PAa to PAd; a portion exposed by a portion of the image projected on the projection area PAa and a portion of the image projected on the projection area PAb; a portion exposed by a portion of the image projected on the projection area PAb and a portion of the image projected on the projection area PAc; a portion exposed by a portion of the image projected on the projection area PAc and a portion of the image projected on the projection area padd. By performing the exposure operation in the above manner, an exposure pattern Pf corresponding to an enlarged image of the pattern Pm shown in fig. 4B is formed on the substrate FB.

As described above, according to the present embodiment, it is possible to provide a mask moving apparatus MST: the transfer device MST is a mask transfer device MST that holds a mask M having a pattern Pm and transfers the mask M, and includes a holding portion 40, the holding portion 40 being formed in a cylindrical shape and detachably holding the mask M along a cylindrical surface 40a so that the pattern Pm is arranged on the cylindrical surface 40a, and therefore, an image of the pattern Pm can be efficiently exposed to a belt-shaped substrate FB. This makes it possible to provide a mobile device MST capable of efficiently manufacturing a display element on the belt-shaped substrate FB.

Further, according to the present embodiment, since the exposure light having passed through the mask M is formed to pass through the inside of the holding portion 40, the space inside the holding portion 40 can be effectively used. This makes it possible to save space of the exposure apparatus EX. Further, since the drive device ACM that rotates the holding portion 40 in the circumferential direction of the cylindrical surface rotates the holding portion 40 via the end portion of the holding portion 40 in the axis C direction, the holding portion 40 can be rotated without blocking the exposure light that passes through the inside of the holding portion 40.

The technical scope of the present invention is not limited to the above-described embodiments, and can be modified as appropriate within a scope not departing from the gist of the present invention.

For example, although the substrate guide apparatus FST is configured to guide the substrate FB using the guide portion 80 supporting the substrate FB in the above embodiment, the present invention is not limited thereto. For example, as shown in fig. 10, a guide roller 140 having a cylindrical surface having the same diameter as the cylindrical surface 40a of the holding portion 40 may be used.

In this case, when the holding portion 40 and the guide roller 140 are rotated, the control portion CONT controls the driving device ACM of the holding portion 40 and the driving device (roller driving portion) ACF of the guide roller 140 to be synchronized. Specifically, the control part CONT controls the driving of the driving device ACM and the driving device ACF in such a manner that the ratio of the moving speed of the substrate FB along the surface of the guide roller 140 to the moving speed of the mask M along the cylindrical surface 40a is equal to the projection magnification (magnification) of the projection optical system PL.

In the above embodiment, the following configuration is adopted: the illumination device IU is disposed outside the mask transfer device MST (holding unit 40), the mask M is a transmissive mask, and the exposure light ELI is transmitted through the mask M from outside the holding unit 40 to enter inside the holding unit 40, but the invention is not limited thereto. For example, as shown in fig. 11, the following structure may be adopted: first, a reflective mask is used as the mask M, the exposure light ELI is made to enter the inside of the holding portion 40 from the illumination device IU through the end portion in the axis C direction of the holding portion 40, and the exposure light ELI is reflected by the mask M inside the holding portion 40, thereby passing the exposure light ELI through the inside of the holding portion 40.

In the above embodiment, the configuration of the substrate processing apparatus FPA using one exposure apparatus EX is described as an example, but the present invention is not limited thereto. For example, as shown in fig. 12, a plurality of (e.g., two) exposure apparatuses EX may be arranged. In this case, an exposure pattern Pf1 formed by the first exposure apparatus EX1 and an exposure pattern Pf2 formed by the second exposure apparatus EX2 are formed on the substrate FB.

Further, in the above embodiment, the four masks M are held by the holding unit 40, but the present invention is not limited to this, and for example, as shown in fig. 13, a configuration may be adopted in which one mask M in which four patterns Pa to Pd are formed is held by the holding unit 40. In this case, the patterns Pa to Pd are formed in advance at positions corresponding to the first openings 41a to 41d of the holding portion 40, and the openings Po are formed in advance at positions corresponding to the second openings 42a to 42 d. With this configuration, the mask M can be easily attached, detached, and replaced.

In the above embodiment, the one first opening 41 and the one second opening 42 are formed in the circumferential direction of the holding portion 40, but the present invention is not limited to this. For example, as shown in fig. 14, three first openings 141 and three second openings 142 may be formed in the circumferential direction of the holding portion 40, and masks M1, M2, and M3 corresponding to the first openings 141 may be formed. It is needless to say that two or four or more first openings and second openings may be formed in the circumferential direction of the holding portion 40.

In the above embodiment, the mask M is bent so that the peripheral edge portion of the mask M is along the shape of the ring portion 43 of the holding portion 40 when the mask M is held by the holding portion 40, but the present invention is not limited to this. For example, as shown in fig. 15, a gas may be supplied into the holding portion 40 by using a gas supply pump 90 or the like, and the pressure inside the holding portion 40 may be used to adjust the curvature of the mask M.

In addition to the configuration of the above embodiment, for example, as shown in fig. 16, a sensor (detection unit) 91 may be provided, and the sensor 91 may detect position information (for example, coordinates in the X direction, the Y direction, and the Z direction) of a predetermined position on the cylindrical surface 40a of the holding unit 40 disposed at the rotational position. According to this configuration, by detecting a change in the position coordinates of the cylindrical surface 40a, the eccentric rotation of the holding portion 40 can be detected. The sensor 91 may be configured to detect position information of a predetermined position of the mask M instead of position information of a fixed position of the cylindrical surface 40 a.

In addition, an adjustment unit for adjusting the imaging position of the exposure light ELI, for example, based on the detection result of the sensor 91 may be provided. As such a configuration, for example, as shown in fig. 16, a configuration may be mentioned in which a parallel plate glass 67, a focus adjustment lens 68, and the like are provided as a part of the first imaging section 60 or separately from the first imaging section 60. In this case, the parallel plate glass 67 can be tilted with respect to the optical axis 60x of the first imaging section 60, and the focus adjustment lens 68 can be moved (position-variable) along the optical axis 60 x. It is preferable that the parallel plate glass 67 intersect the optical axis 60x and be tiltable (rotatable) about an axis parallel to the axis C of the cylindrical surface 40 a.

In the above embodiment, the first image forming unit 60 is configured to form the pupil plane 65 at the position on the upstream side of the axis C of the holding unit 40 in the optical path and to form the intermediate image 66 of the pattern Pm in the holding unit 40, but the present invention is not limited to this. For example, as shown in fig. 17, the pupil plane 65 may be formed at a position downstream of the axis C of the holding portion 40 in the optical path. Further, the intermediate image 66 of the pattern Pm may be formed outside the holding portion 40. Further, the pupil plane 65 may be formed outside the holding portion 40.

In addition to the configuration of the above embodiment, as shown in fig. 17, for example, a blind 48 may be provided in the first opening 41. For example, the mask M may be held by a clamp mechanism 45. The clamp mechanism 45 can be disposed, for example, in the connection portion 44 of the holding portion 40. Of course, the clamp mechanism 45 may be provided in the ring portion 43 of the holding portion 40.

In the configuration of fig. 17, the second imaging unit 61 may be omitted and an image of the pattern Pm may be projected onto the substrate.

Next, an embodiment of a method for manufacturing a microdevice using an exposure apparatus according to an embodiment of the present invention in a photolithography process will be described. Fig. 18 is a flowchart showing a part of a manufacturing process in manufacturing a semiconductor device as a microdevice. First, in step S10 of fig. 18, a metal film is deposited on a tape-shaped substrate. In the next step S12, a photoresist is coated on the metal film of the substrate. Then, in step S14, the image of the pattern on the mask M is sequentially exposed and transferred to the respective imaging regions of the substrate by the exposure apparatus EX via the projection apparatus PU (projection optical systems PL1 to PL 4) (transfer step).

Then, after the photoresist of the substrate is developed (developing step) in step S16, the substrate is etched through a resist pattern in step S18, whereby a circuit pattern corresponding to the pattern on the mask is formed in each imaging region of the substrate. Then, a circuit pattern and the like are formed in an upper layer to manufacture a device such as a semiconductor element. According to the above semiconductor device manufacturing method, a semiconductor device having an extremely fine circuit pattern can be efficiently manufactured with good productivity.

In the exposure apparatus EX, a liquid crystal display element as a microdevice can be manufactured by forming a predetermined pattern (a circuit pattern, an electrode pattern, or the like) on a strip-shaped substrate. An example of the process at this time will be described below with reference to the flowchart of fig. 19. Fig. 19 is a flowchart showing a part of a manufacturing process in manufacturing a liquid crystal display element as a microdevice.

In the pattern forming step S20 in fig. 19, a so-called photolithography step is performed in which the pattern of the mask M is transferred and exposed to a photosensitive substrate (for example, a substrate made of glass or plastic coated with a resist) by using the exposure apparatus EX of the present embodiment. A predetermined pattern including a plurality of electrodes and the like is formed on the photosensitive substrate by the photolithography step. Then, the exposed substrate is subjected to various steps such as a developing step, an etching step, and a reticle peeling step to form a predetermined pattern on the substrate, and the process proceeds to the subsequent color filter forming step S22.

Next, in the color filter forming step S22, a color filter is formed in which a plurality of filter groups of three stripes corresponding to r (red), g (green), and b (blue) or a plurality of three stripes R, G, B are arranged in a horizontal scanning line direction, and a plurality of three dots are arranged in a matrix. Further, after the color filter forming process S22, a cell assembling process S24 is performed. In the cell assembling step S24, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern forming step S20, the color filter obtained in the color filter forming step S22, and the like.

In the cell assembling step S24, for example, a liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern forming step S20 and the color filter obtained in the color filter forming step S22, thereby manufacturing a liquid crystal panel (liquid crystal cell). Then, in the module assembling step S26, components such as a circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are mounted, thereby completing the liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, a liquid crystal display element having an extremely fine circuit pattern can be efficiently manufactured with good productivity.

Description of reference numerals:

EX … exposure apparatus; an M … mask; a Pm … pattern; IU … lighting fixture; MST … mask moving device; PU … projection device; FST … substrate guide; ELI … Exposure light; ACM, ACF … drive; PL … projection optics; PA … projection area; an FPA … substrate processing apparatus; a FB … substrate; an SU … substrate supply unit; a PR … substrate processing part; a CL … substrate recovery unit; a CONT … control unit.

Claims (20)

1. An exposure apparatus that rotates a pattern provided along a predetermined cylindrical surface in a circumferential direction of the cylindrical surface to transfer the pattern to a substrate, the exposure apparatus comprising:

a first projection optical system that projects an image of a first partial pattern arranged in a first region of the cylindrical surface among the patterns onto a first projection region;

a second projection optical system that projects an image of a second partial pattern arranged in a second region different from the first region among the patterns onto a second projection region different from the first projection region; and

a guide device that guides the substrate to the first projection region and the second projection region in synchronization with rotation of the pattern in the circumferential direction.

2. The exposure apparatus according to claim 1,

the first partial pattern and the second partial pattern are provided at a predetermined interval from each other along a central axis of the cylindrical surface and are provided at a predetermined amount from each other in a circumferential direction of the cylindrical surface,

a pitch N from the first region to the second region in a circumferential direction of the cylindrical surface in a rotational traveling direction of the pattern, a pitch L between the first projection region and the second projection region along a movement path along which the substrate is moved by the guide device, a projection magnification β of the first projection optical system and the second projection optical system, and the predetermined amount S satisfy a relationship of S = N-L/β and L ≦ β × N.

3. The exposure apparatus according to claim 1,

the first partial pattern and the second partial pattern are provided at a predetermined interval from each other along a central axis of the cylindrical surface and are provided at a predetermined amount from each other in a circumferential direction of the cylindrical surface,

a diameter D of the cylindrical surface, a distance L between the first projection area and the second projection area along a movement path along which the substrate is moved by the guide device, a projection magnification β of the first projection optical system and the second projection optical system, and the predetermined amount S satisfy a relationship of S = pi × D/2-L/β and L ≦ β × pi × D/2.

4. The exposure apparatus according to claim 2 or claim 3,

the predetermined interval is set to: so that the end position of the first projection area projected by the first projection optical system and the end position of the second projection area projected by the second projection optical system at least partially overlap on the moving path of the substrate.

5. The exposure apparatus according to any one of claims 1 to 4,

the guide device includes a first support portion and a second support portion that support the substrate positioned in the first projection region and the second projection region, respectively.

6. The exposure apparatus according to claim 5,

the first support portion has a first curved portion, the second support portion has a second curved portion, and the first curved portion and the second curved portion are curved in a direction optically corresponding to a curved direction of the cylindrical surface by the first projection optical system and the second projection optical system, and the substrate is curved along the first curved portion and the second curved portion to support the substrate.

7. The exposure apparatus according to claim 6,

the first curved portion and the second curved portion are curved convexly toward the first projection optical system and the second projection optical system, respectively.

8. The exposure apparatus according to claim 6 or claim 7,

the first curved portion and the second curved portion are curved with a curvature identical to that of the cylindrical surface.

9. The exposure apparatus according to any one of claims 6 to 8,

the first support portion and the second support portion each have: a guide roller that guides the substrate along a surface; and a roller driving section that rotates the guide roller in a circumferential direction of the surface,

the first curved portion and the second curved portion are provided on the surface portions of the guide rollers corresponding to each other.

10. The exposure apparatus according to claim 9,

the roller driving part rotates the guide roller in synchronization with the rotation of the pattern.

11. The exposure apparatus according to any one of claims 1 to 10,

the first projection optical system and the second projection optical system respectively include:

a first optical system which is disposed inside the cylindrical surface and emits light emitted from the pattern to the outside of the cylindrical surface; and

a second optical system that projects an image of the pattern by irradiating the light having passed through the first optical system to the first projection region or the second projection region.

12. The exposure apparatus according to claim 11,

the first optical system images an intermediate image of the pattern in the vicinity of the cylindrical surface.

13. The exposure apparatus according to claim 12,

the first optical system includes an adjusting portion that adjusts an imaging position of the intermediate image.

14. The exposure apparatus according to claim 13, comprising:

a detection section that detects position information of the pattern,

the adjusting section adjusts the imaging position of the intermediate image based on the detection result of the detecting section.

15. The exposure apparatus according to any one of claims 1 to 11,

the first projection optical system and the second projection optical system form a pupil plane of the first projection optical system and a pupil plane of the second projection optical system in the vicinity of the cylindrical surface, respectively.

16. An exposure apparatus that rotates a pattern provided along a predetermined cylindrical surface in a circumferential direction of the cylindrical surface to transfer the pattern to a substrate, the exposure apparatus comprising:

a projection optical system that projects an image of the pattern onto a projection area; and

a guide device having a curved portion that guides the substrate to the projection region in synchronization with the rotation of the pattern in the circumferential direction, and that bends the substrate located in the projection region to support the substrate.

17. The exposure apparatus according to claim 16,

the curved portion is curved convexly toward the projection optical system.

18. The exposure apparatus according to claim 16 or claim 17,

the curved portion is curved with a radius of curvature identical to that of the cylindrical surface.

19. A substrate processing apparatus for processing a strip-shaped substrate, comprising:

a substrate conveying unit that conveys the substrate in a longitudinal direction of the substrate; and

a substrate processing unit that is provided along a transport path along which the substrate is transported by the substrate transport unit and processes the substrate transported along the transport path,

the substrate processing section includes the exposure apparatus according to any one of claims 1 to 18 that transfers a pattern to the substrate.

20. A device manufacturing method for manufacturing a device by processing a substrate, comprising:

a step of transferring a pattern to the substrate using the exposure apparatus according to any one of claims 1 to 19, and

and processing the substrate transferred with the pattern based on the pattern.