201204215 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及電路板技術，特別涉及一種多層電路板製作 方法。 【先前技術】 [0002] 隨著電子產業之飛速發展，作為電子產品基本構件之電 路板之製作技術顯得愈來愈重要。電路板一般由覆銅基 板經裁切、錢孔、餘刻、曝光、顯影、壓合、成型等— 系列製程製作而成。具體可參閱C.H. Steer等人在Pro- ceedings of the ΙΕΕΐ，Vol.39、No.2 (2002年8 月）中發表之 “Dielectric…ch兹fa'ctirriz'ation of printed circuit board substrates” 文。 [0003] —般地，多層電路板可由第一覆銅板與第二覆銅板熱壓 合形成。第一覆銅板與第二覆銅板之間設置膠層，熱壓 合後第一覆銅板與第二覆銅板之間藉由膠層緊密黏著固 定，從而形成多層電路板。多層電路板在第二覆銅板與 第一覆銅板熱壓合過程存在瑪耀間題，且在各區域之漲 '：". ..201204215 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to circuit board technology, and more particularly to a method of fabricating a multilayer circuit board. [Prior Art] [0002] With the rapid development of the electronics industry, the fabrication technology of circuit boards, which are the basic components of electronic products, is becoming more and more important. The circuit board is generally made of a series of processes such as cutting, money hole, engraving, exposure, development, pressing, molding, etc. of the copper-clad substrate. For details, see "Dielectric...ch fa'ctirriz'ation of printed circuit board substrates" by C.H. Steer et al., Proceedings of the ΙΕΕΐ, Vol. 39, No. 2 (August 2002). [0003] Generally, a multilayer circuit board can be formed by thermal compression bonding of a first copper clad laminate and a second copper clad laminate. A glue layer is disposed between the first copper clad plate and the second copper clad plate. After the thermocompression bonding, the first copper clad plate and the second copper clad plate are closely adhered and fixed by the adhesive layer to form a multilayer circuit board. The multi-layer circuit board has a problem in the process of thermocompression bonding between the second copper clad laminate and the first copper clad laminate, and rises in each region ':". ..
縮程度亦可能不一致。在後續鑽導通孔時，可能會由於 多層電路板發生漲縮而導致導通孔之位置偏離預先設定 之位置，若導通孔偏位過大，還會使得導通孔無法與第 一覆銅板之線路連接導通’直接影響多層電路板之導通 品質。先前技術中，首先在第一覆銅板之成型區内之四 角位置分別製作一組成矩陣排列之檢測孔，其中，該檢 測孔之孔徑等於該多層電路板中需要製作之最小之導通 孔之孔徑；接著利用膠層熱壓合第二覆銅板；然後利用X 099121762 表單編號A0101 第4頁/共32頁 0992038304-0 201204215 射線照射觀察該 四組檢測孔之孔徑大小之改變情況以及The degree of contraction may also be inconsistent. When the through hole is drilled, the position of the via hole may be deviated from the preset position due to the expansion and contraction of the multilayer circuit board. If the via hole is excessively biased, the via hole may not be connected to the line of the first copper clad plate. 'Directly affects the continuity quality of multilayer boards. In the prior art, first, a detection hole composed of a matrix array is respectively formed at four corner positions in the molding region of the first copper clad plate, wherein the aperture of the detection hole is equal to the aperture of the minimum via hole to be fabricated in the multilayer circuit board; Then, the second copper clad laminate is thermally pressed by the adhesive layer; then, the change of the aperture size of the four detection holes is observed by X 099121762 Form No. A0101 Page 4 / Total 32 Page 0992038304-0 201204215
位置韻由於轉問題造成之導通孔偏位誤差。 然而Hi：無法準確獲得孔之偏位誤差之具體數值， 可能會由於估算錯誤而導致導通孔仍㈣在偏位誤差較 大之問題’從而可能導致電路板導通不良或短路，無法 估鼻之/張縮程度按照一 位置’從而補償由於、雁 Ο [0004] [0005] [0006]The positional rhyme is caused by the turning problem due to the turning problem. However, Hi: It is impossible to accurately obtain the specific value of the misalignment error of the hole. The conduction hole may still be caused by the estimation error. (4) The problem of large deviation error may cause the circuit board to be poorly connected or short-circuited. The degree of contraction is in accordance with a position 'to compensate for the stagnation, geese [0004] [0005] [0006]
[0008] [0009] 099121762 有效提向電路板之導通品質。 有鑑於此，針對上述問題，提供一種具有可較準確地獲 得孔之偏位誤差及電路板之漲縮程度之多層電路板掣作 方法，避免電路板導通不良或短路之問題，提高電路板 之導通品質實屬必要。 【發明内容】 下面將以具體實施例說明一種多層電路板製作方法。 一種多層電路板製作方法，其包括以下步驟： 提供第一覆銅板，該第一覆銅板具有成型區域以及包圍 § 亥成型區域之邊緣區域； 對該第一覆銅板之邊緣區域進行蝕刻以形成至少一同、 銅環組，其中，該至少一同心銅環組包括第一鋼環及與 該第一銅環同心且環繞第一銅環之第二銅環，將該第 銅環之圓心在該步驟中所在之位置定義為初始中心； ^供第二覆銅板與黏合層，並將該黏合層熱壓合於兮第 一覆銅板與第二覆銅板之間，從而形成多層基板； 表單編號A0101 , 第5頁/共32頁 _2038304-0 201204215 [0010] 以該初始中心為圓心製作貫穿該第一覆銅板、黏合層與 第二覆銅板之檢測孔； [0011] 利用光線照射該多層基板，從而獲得檢測孔與同心銅環 組之相對位置關係以確定該檢測孔偏離該初始中心之偏 位誤差；以及 [0012] 根據該偏位誤差確定該多層基板熱壓合後之漲縮比例， 並根據該漲縮比例確定該多層基板開設導通孔之位置。 [0013] 相較於先前技術，本技術方案之多層電路板製作方法中 ，可藉由第一銅箔層之同心銅環組與後續製作之貫穿第 一覆銅板、黏合層與第二覆銅板之檢測孔偏離初始中心 之程度確定檢測孔之偏位誤差，並由該檢測孔之偏位誤 差確定多層基板壓合後之漲縮比例，然後根據該漲縮比 例確定多層基板開設導通孔之位置，該方法可準確獲得 檢測孔之偏位誤差之具體數值，避免由於估算錯誤而導 致後續製作之導通孔仍然存在偏位誤差較大之問題，從 而減少多層電路板導通不良或短路之情形，有效提高多 層電路板之導通品質。 【實施方式】 [0014] 下面將結合附圖與實施例對本技術方案之多層電路板製 作方法作進一步詳細說明。 [0015] 請參閱圖1，本技術方案實施例提供一種多層電路板製作 方法，其包括以下步驟： [0016] 步驟110，請參閱圖2，提供第一覆銅板10。 [0017] 本實施例中，第一覆銅板10包括第一絕緣層11及第一銅 099121762 表單編號A0101 第6頁/共32頁 0992038304-0 201204215 /S層12。該第一絕緣層11具有相對之第—表面I〗〗與第二 表面112。該第一表面1U與第二表面112平行。該第一 表面111與第一表面112上各設置—層第一銅箔層12，即 該第一覆銅板10為雙面板。當然，該第一覆銅板1〇亦可 為僅具有一層第一銅箔層12之單面板。該第一覆銅板1〇 具有成型區域101以及包圍該成型區域1〇1之邊緣區域 102。亦即，該邊緣區域1〇2位於該成型區域ι〇1之外侧 。該成型區域101為最終形成電路板成品之區域，該邊緣 區域102為形成電路板成品時需切割去除之區域。 〇 [0018] 步驟120，請參閱圖3-4，對該第一覆銅板10之邊緣區域 10 2進行钮刻以形成至少一同.心銅環組。 [0019] 該第一覆銅板10之形狀大致為長方形^該邊緣區域1()2包 括依次相連之第一邊緣區1021、第二邊攀區1022、第三 邊緣區1023與第四邊緣區1〇24。該第一邊緣區1〇21與第 三邊緣區1023平行相對，該第二邊緣區1022與第四邊緣 區1 024平行相對。在第一覆銅板1〇之四角位置處之第一 〇 邊緣區1021、第二邊敵區1022、第三邊緣區1023與第四 邊緣區10 24處分別形成有複數等間距設置之同心銅環組 14。具體地，第一邊緣區1〇21與第二邊緣區1022相鄰之 一端、第二邊緣區1022與第三邊緣區1023相鄰之一端、 第三邊緣區1023與第四邊緣區1〇24相鄰之一端、以及第 四邊緣區1024與第一邊緣區1〇21相鄰之一端分別形成有 複數同心銅環組14。第一邊緣區1021、第二邊緣區1022 、第三邊緣區1023與第四邊緣區1024上之複數同心銅環 組14之初始中心之連線均為一直線。本實施例中，第一 099121762 表單編號A0101 第7頁/共32頁 0992038304-0 201204215 邊緣區1021、第二邊緣區1022、第三邊緣區1023與第四 邊緣區1024上之同心銅環組14之數目均為五個。等間距 設置之五個同心銅環組14中之相鄰兩個同心銅環組14之 中心距離可為預先設定之某一數值D。第一邊緣區1〇21與 第二邊緣£ 1 0 2 3上之五個同心銅組14之中心連線平行 ’第二邊緣區1022與第四邊緣區1 024上之五個同心銅環 組14之中心連線平行，第一邊緣區1〇21與第二邊緣區 1 0 2 2上之五個同心銅環組14之中心連線垂直。 [0020] 其中’每一個同心銅環組14包括第一銅環141與第二銅環 142。該第二銅環142與第一銅環141同心且環繞第一銅 環141。該第一銅環141之外徑小於該第二銅環142之内 徑。該第一銅環141之内徑大於該電路板中需要製作之最 小之導通孔之孔徑。優選地，該第一銅環141之内徑等於 第一銅環141與第二銅環142之間距及該多層電路板需開 設之導通孔（圖未示）之最小孔徑之加和。即，第一銅 環141之内徑隨著不同之電路板中所需要製作之最小之導 通孔之孔徑之變化而改變。本實施例中，當電路板之最 小之導通孔之孔徑為d，第一銅環141與第二銅環142之間 之距離為2mi 1時，第一銅環141之内徑為（d + 2 ) mi 1。 在此，將每一第一銅環141之圓心在步驟110中所在之位 置定義為一個初始中心。並且，該初始中心可藉由CCD攝 像頭進行讀取，並可進一步將該初始中心之位置座標記 錄在加工控製程式中以便於後續加工中進行讀取或比較 分析。 [0021] 本實施例中，該第一銅環141之線寬、第二銅環142之線 099121762 表單編號A0101 第8頁/共32頁 0992038304-0 201204215 寬以及第一銅環141與第二銅環14 2之間之距離均相等β 其中’第一銅環141之線寬、第二銅環142之線寬分別係 指第一銅環141、第二銅環142在其徑向上之寬度。例如 ’該第一銅環141之線寬、第二銅環142之線寬以及第一 銅環141與第二銅環142之間之距離可以均設置為2mi 1。 〇 當然，隨著製程能力之改進，該第一銅環141之線寬、第 二銅環142之線寬以及第一銅環141與第二銅環丨42之間 之距離可設計為lmil或者小於lmil。此時，每一同心鋼 環組14可進一步包括直徑依次增大之第三銅環與第四銅 環（圖未示）’該第三銅環之内輕滅於第二銅環14 2之外 徑，該第四銅環之内徑大於第三銅環之外徑。該第一銅 環141之線寬、第二銅環142之線寬彳:第三銅環之線寬、 第四銅環之線寬、以及相鄰.兩個銅環之間,,之距離均相等 ，例如，可以均為lmil。此外，第一銅瓖141與第二銅環 142之線寬、以及第一銅環hi與第二銅環142之間之距 離亦可以不相等，只需預先測出第一鋼環14丨與第二銅環 142之線寬、及第一銅環hi與第二銅環142之間之距離 即可。 [0022] 需要說明之是，本實施例中，第一覆銅板1〇兩側之第一 銅箔層12上蝕刻形成有對應之同心銅環組14。亦即，每 一第一銅箔層12上共有20個同心銅環組14，第—覆銅板 1 〇共形成有4 0個同心銅環組14。 [0023] 當然，同心銅環組14之設置位置並不僅限於上述圖3_4中 所不之方式，其還可以是包括以下圖5至圖8所示之設置 方式在内之複數設置方式。 099121762 表單編號A0101 第9頁/共32百 ' M 0992038304-0 201204215 [0024] 清參閱圖5 ’本技術方案之第二種同心銅環組24之設置方 式與上述第一種同心銅環組14之設置方式不同，其不同 之處在於’第一邊緣區2021與第二邊緣區2022鄰接之一 端上形成有複數等間距設置之同心銅環組24，第一邊緣 區2021與第四邊緣區2〇24鄰接之一端上亦形成有複數等 間距設置之同心銅環組24，第三邊緣區2023與第二邊緣 區2022鄰接之一端上形成有複數等間距設置之同心銅環 組24 ’第三邊緣區2023與第四邊緣區2024鄰接之一端上 亦形成有複數同心銅環組24。本實施例中，第一邊緣區 2 0 2 1之兩端分別形成有四個同心銅環組24且其初始中心 在同一直線上。第三邊緣區2023之兩端分別形成有四個 同心銅環组24且其初始中心在同一直線上。第一邊緣區 2 0 21之兩端分別形成之四個同心銅環組24之中心連線均 與第二邊緣區2 〇 2 3之兩端分別形成之四個同心銅環組2 4 之中心連線平行。優選地，第一邊緣區202 1之八個同心 銅環組24之中心共線。第三邊緣區2023之八個同心銅環 組24之中心共線。 [0025]請參閱圖6，本技術方案之第三種同心銅環組34之設置方 式與上述第二種同心銅環組24之設置方式不同，其不同 之處在於，第一邊緣區3021與第二邊緣區3022之鄰接處 、第二邊緣區3022與第三邊緣區3023之鄰接處、第三邊 緣區3023與第四邊緣區3024之鄰接處、以及第四邊緣區 3024與第一邊緣區3021之鄰接處分別形成有複數同心銅 環組34。第一邊緣區3021與第二邊緣區3022之鄰接處、 第二邊緣區3022與第三邊緣區3023之鄰接處、第三邊緣 099121762 表單編號A0101 第10頁/共32頁 0992038304-0 201204215 區3023與第四邊緣區3024之鄰接處以及第四邊緣區3024 與第一邊緣區3021之鄰接處之複數同心銅環組34之初始 中心之連線構成一個直角三角形。本實施例中，第一邊 緣區3021與第二邊緣區3022之鄰接處、第二邊緣區3022 與第三邊緣區3023之鄰接處、第三邊緣區3023與第四邊 緣區3024之鄰接處以及第四邊緣區3024與第一邊緣區 3021之鄰接處之同心銅環組34之數目均為三個。 [0026] Ο ο 請參閱圖7，本技術方案之第四種同心銅環組44之設置方 式與上述第三種同心銅環組34之設置方式不同，其不同 之處在於，第一邊緣區4021與第二邊緣區4022之鄰接處 、第二邊緣區4022與第三邊緣區4023之鄰接處、第三邊 緣區4023與第四邊緣區4024之鄰接處以及第四邊緣區 4024與第一邊緣區4021之鄰接處之分別形成有複數同心 銅環組44。並且，該第一邊緣區4021 ‘第二邊緣區4022 之鄰接處、第二邊緣區4022與第三邊緣區4023之鄰接處 、第三邊緣區4023與第四邊緣區4024之鄰接處以及第四 邊緣區4024與第一邊緣區4021之鄰接氳之複數同心銅環 組44之初始中心之連線與第一覆銅板410之對角線平行。 本實施例中，該第一邊緣區4021與第二邊緣區4022之鄰 接處、第二邊緣區4022與第三邊緣區4023之鄰接處、第 三邊緣區4023與第四邊緣區4024之鄰接處以及第四邊緣 區4024與第一邊緣區4021之鄰接處分別形成有兩個同心 銅環組44，且該第一邊緣區4021與第二邊緣區4022之鄰 接處、第二邊緣區4022與第三邊緣區4023之鄰接處、第 三邊緣區4023與第四邊緣區4024之鄰接處以及第四邊緣 099121762 表單編號Α0101 第Π頁/共32頁 0992038304-0 201204215 區4024與第一邊緣區4〇21之鄰接處之兩個同心銅環組44 之初始中心之連線與第一覆銅板410之對角線重合。 [0027] [0028] [0029] 請參閱圖8 ’本技術方案之第五種同心銅環組54之設置方 式與上述第四種同心銅環組44之設置方式不同，其不同 之處在於’第一邊緣區5021、第二邊緣區5〇22、第三邊 緣區5023及第四邊緣區5024中之至少兩個均形成有一個 或複數同心銅環組54。本實施例中，第一邊緣區5〇21與 第二邊緣區5022鄰接之一端之上形成有一個同心銅環組 54，第三邊緣區5023與第二邊緣區5022鄰接之一端上形 成有一個同心銅環組54，第四邊緣區5024與第一邊緣區 5021及第三邊緣區5023鄰接之兩端上分別蝕刻形成有一 個同心銅環組54。第四邊緣區5024之兩個同心銅環組54 之中心連線平行于第一邊緣區5〇21、第三邊緣區5023之 兩個同心銅環組5 4之中心連線。 步驟130，請參閱圖9，提供第二覆銅板2〇與黏合層30， 並將該黏合層3 0熱壓合於該第τ覆銅板1 〇與第二覆銅板 20之間，從而形成多層基板4〇。 本實施例中’第二覆銅板20僅包括第二銅箔層22。該第 二覆銅板20之尺寸大小與第一覆銅板之尺寸大小相匹 配。當然，該第二覆銅板20亦可為具有導電圖案之雙面 板。 s亥黏合層30用於黏合s亥第一覆銅板10與該第二覆銅板2〇 。該黏合層30之材質可選自環氧樹脂、聚酯或者丙烯酸 等。當然’該黏合層30亦可為預先設置在第二覆銅板2〇 099121762 表單編號A0101 第12頁/共32頁 0992038304-0 [0030] 201204215 之第二銅箔層22其中一個表面上之絕緣層。該黏合層30 之尺寸大小亦與第一覆銅板10之尺寸大小相匹配。 [0031] 將黏合層30放置在第一覆銅板10之第一銅箔層12與第二 覆銅板20之間，並利用壓合裝置（圖未示）熱壓合該第 一覆銅板10、黏合層30與第二覆銅板20。熱壓合後，該 黏合層30將第一覆銅板10與第二覆銅板20黏合固定形成 多層基板40。 [0032] 步驟140，請參閱圖10，以該第一銅環141之初始中心製 作貫穿該第一覆銅板10、黏合層30與第二覆銅板20之檢 測孔105。該檢測孔105之孔徑小於該第一銅環141之内 徑。優選地，該檢測孔105之孔徑等於該多層電路板中需 要製作之最小之導通孔之孔徑。具體地，可根據上述加 工控製程式中記錄之初始中心為圓心依次製作檢測孔105 。本實施例中，該檢測孔105是利用機械鑽孔之方式製作 形成之。當然，亦可以利用先前之鐳射燒蝕成孔技術製 作檢測孔10 5。 [0033] 步驟150，請參閱圖10及圖11，利用光線照射多層基板 40，並檢測每一個檢測孔1 05與對應之同心銅環組14之相 對位置關係以確定該檢測孔105偏離該初始中心之偏位誤 差。本實施例中，採用X射線強光對多層基板40進行照射 ，該X射線可透射過該多層基板40並獲得該同心銅環組14 與檢測孔105之位置關係之透視圖。由於第一絕緣層11與 黏合層30—般為樹脂材料，而第一銅箔層12與第二銅箔 層22為銅材料，其透光率不同，銅層愈厚之位置其穿透 率越低，因此，在該透視圖中，檢測孔105處最亮，同心 099121762 表單編號A0101 第13頁/共32頁 0992038304-0 201204215 銅環組1 4附近被蝕刻掉銅箔之位置比沒有被蝕刻掉之第 一銅環141及第二銅環142所在之位置亮度高，第一銅環 141、第二銅環142以及沒有被蝕刻掉銅箔之多層基板4〇 所在之位置最暗。因此，便可從該透視圖中得到檢測孔 105與同心銅環組14之相對位置關係。 [0034] [0035] 請參閱圖11，圖中所示為第二邊緣區1〇22與第三邊緣區 1023相鄰之一端上之五個同心銅環組μ之透視圖。在本 實施例中，由於檢測孔1〇5之孔徑等於電路板之最小之導 通孔之孔徑d ’第一銅環141之内徑為（d + 2) mil，第一 銅環141與第二銅環142之間之距離為2mil，第一銅環 141之線寬、第二銅環142之線寬亦為2mil，所以，根據 該五個同心銅環組14之透視圖可以得到：設定一個由第 一邊緣區1021指向第三邊緣區1〇23之箭頭，沿圖中箭頭 方向之第一個同心銅環組14中之檢測孔丨05無偏位誤差， 第二個同心銅環組14中之檢測孔1〇5之偏位誤差為2mi 1 ，第三個同心銅環組14中之檢測孔丨〇5之偏位誤差為 4mil，第四個同心銅環組14中之檢測孔1〇5之偏位誤差 為6mil ’第五個同心銅環組14中之檢測孔1〇5之偏位誤 差為8mil。由此可知，該多層基板4〇熱壓合後在第一個 同心銅環組14與多層基板4〇之垂直於箭頭方向之中線之 間之區域沒有發生漲縮，該多層基板4〇熱壓合後在靠近 第二邊緣區1022與第三邊緣區1023之區域沿圖中箭頭方 向之反方向收縮，而在垂直於箭頭方向並沒有發生漲縮 〇 當然’其他三個邊緣上之五個同心銅環組14亦可藉由對 099121762 表單編號A0101 第14頁/共32頁 0992038304-0 201204215 其透視圖之分析得到在該區域之漲縮情況。 [0036] 步驟160，根據上述檢測孔105之偏位誤差確定該多層基 板40熱壓合後之漲縮比例，並根據該漲縮比例確定該多 層基板40開設導通孔之位置。本實施例中，圖10及圖11 所示之相鄰兩個同心銅環組14之間之區域之收縮比例k= θ (相鄰兩個同心銅環組之間壓合前之中心距離-相鄰兩個 同心銅環組之間壓合後之中心距離）/相鄰兩個同心銅環 組之間壓合前之中心距離= 2mil/D。並且，可根據K值之 變化趨勢計算出該多層基板40在箭頭方向之反方向上之 收縮趨勢。由於圖10及圖11中鄰兩個同心銅環組14之間 之區域之收縮比例k均為2mil/D，所以該區域内多層基板 40之收縮比例K = k = 2rail/D。然後，根據該收縮比例K補 償修正導通孔之開設位置，從而確定該多層基板40開設 導通孔之位置。 [0037] ❹ [0038] 當然，藉由對其他三個邊緣上之五個同心銅環組14之偏 位誤差進行分析亦可得到對應區域之多層基板40之漲縮 比例0 進一步地，當多層基板40之兩侧還需要進一步壓合之外 層覆銅板進行增層時，可通過在與該外層覆銅板熱壓合 之第二覆銅板20上設置同心銅環組並參照上述步驟120至 步驟160確定該外層覆銅板中開設導通孔之位置。 此外，對於圖5至圖8中之同心銅環組之設置方式，亦可 藉由其透視圖獲得對應之偏位誤差，並可根據該偏位誤 差藉由數學統計分析計算得到多層基板之漲縮比例，從 099121762 表單編號A0101 第15頁/共32頁 0992038304-0 [0039] 201204215 而可確定多層基板開設導通孔之位置。 [0040] [0041] [0042] 相較於先前技術，本技術方案之多層電路板製作方法中 ，可藉由第一銅箱層之同心銅環組與後續製作之貫穿第 一覆銅板、黏合層與第二覆銅板之檢測孔偏離初始中心 之程度確定檢測孔之偏位誤差，並由該檢測孔之偏位誤 差確定多層絲壓合後之闕比例，然後根據該涨縮比 例確定Μ絲·導通狀位置，該枝可準確獲得 檢測孔之偏位誤差之具體數值，避免由於估算錯誤而導 致後續製作之導通孔仍然存在偏㈣差較大之問題，從 而減少多層電路板導料良輪路之·_，有效提高多 層電路板之導通品質。 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利中請。先前技術’以上所述者僅為本發明之較佳 實施方式’自不能以此限制本案之中請專利範圍。舉凡 熟悉本案技藝之人士援依本發明之精神所作之等效修飾 或變化’皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 系本技術方案實施例提供之多層電路板製作方法流程 [0043] 圖2係圖1之多層電路板製作方法中提供之第 示意圖。 覆銅板之 [0044] [0045] 099121762 圖^圖1之多層電路板製作方法中餘刻形成有第-心銅環組之第-覆鋼板之示意圖。 圖4係圖3中蝕刻形成有同, 表單編號Α0101 種同 〇銅環組之第一覆銅板之局部 第16頁/共32頁 0992038304-0 201204215 [0046] 放大圖。 圖5係圖1之多層電路板製作方法中蝕刻形成有第二種同 心銅環組之第一覆銅板之示意圖。 [0047] 圖6係圖1之多層電路板製作方法中蝕刻形成有第三種同 心銅環組之第一覆銅板之示意圖。 [0048] 圖7係圖1之多層電路板製作方法中蝕刻形成有第四種同 心銅環組之第一覆銅板之示意圖。 _ [0049] Ο 圖8係圖1之多層電路板製作方法中蝕刻形成有第五種同 心銅環組之第一覆銅板之示意圖。 [0050] 圖9係圖1之多層電路板製作方法中第一覆銅板、黏合層 及第二覆銅板熱壓合後之示意圖。 [0051] 圖1 0係圖9中在壓合後之電路板上製作有檢測孔之局部之 放大示意圖。 [0052] 圖11係圖10之電路板採用光線照射而形成之透視圖。 Ο [0053] 【主要元件符號說明】 第一覆銅板：10、410 [0054] 第一絕緣層：11 [0055] 第一銅箔層：12 [0056] 同心銅環組：14、2 4、3 4、4 4、5 4 [0057] 第一銅環：141 [0058] 第二銅環：142 099121762 表單編號Α0101 第17頁/共32頁 0992038304-0 201204215 [0059] 第一表面： 111 [0060] 第二表面： 112 [0061] 成型區域. 101 [0062] 邊緣區域： 102 [0063] 第一邊緣區 :1021 、 2021 、 3021 、 4021 、 502 1 [0064] 第二邊緣區 :1022 ' 2022 ' 3022 ' 4022 ' 5022 [0065] 第三邊緣區 :1023 、 2023 、 3023 、 4023 、 5023 [0066] 第四邊緣區 :1024 、 2024 、 3024 、 4024 、 5024 [0067] 第二覆銅板 ：20 [0068] 第二銅箔層 ：22 [0069] 黏合層：30 [0070] 檢測孔：105 [0071] 多層基板： 40 099121762 表單編號A0101 第18頁/共32頁 0992038304-0[0009] [99] 099121762 effectively improve the conduction quality of the circuit board. In view of the above, in order to solve the above problems, a multi-layer circuit board manufacturing method capable of accurately obtaining the offset error of the hole and the degree of shrinkage of the circuit board is provided, thereby avoiding the problem of poor conduction or short circuit of the circuit board, and improving the circuit board. The quality of conduction is necessary. SUMMARY OF THE INVENTION A method of fabricating a multilayer circuit board will now be described with reference to specific embodiments. A method of fabricating a multilayer circuit board, comprising the steps of: providing a first copper clad plate having a molding region and an edge region surrounding the dicing region; etching the edge region of the first copper clad plate to form at least a copper ring set, wherein the at least one concentric copper ring set comprises a first steel ring and a second copper ring concentric with the first copper ring and surrounding the first copper ring, the center of the second copper ring is at this step The position of the middle is defined as the initial center; ^ for the second copper clad plate and the adhesive layer, and the adhesive layer is thermocompression bonded between the first copper clad plate and the second copper clad plate to form a multi-layer substrate; Form No. A0101, 5th/32 pages _2038304-0 201204215 [0010] The detection hole penetrating through the first copper clad laminate, the adhesive layer and the second copper clad laminate is formed with the initial center as a center; [0011] irradiating the multi-layer substrate with light Thereby obtaining a relative positional relationship between the detection hole and the concentric copper ring group to determine a deviation error of the detection hole from the initial center; and [0012] determining, after the thermal compression of the multilayer substrate, the laminated substrate according to the deviation error The ratio of expansion and contraction is determined, and the position of the through hole of the multilayer substrate is determined according to the ratio of the expansion and contraction. [0013] Compared with the prior art, in the method for fabricating a multi-layer circuit board of the present technical solution, the concentric copper ring group of the first copper foil layer and the subsequent through-first copper clad laminate, the adhesive layer and the second copper clad laminate can be formed. The deviation of the detection hole from the initial center determines the deviation error of the detection hole, and the deviation ratio of the detection hole is determined by the deviation error of the detection hole, and then the position of the conduction hole of the multilayer substrate is determined according to the expansion ratio. The method can accurately obtain the specific value of the deviation error of the detection hole, and avoid the problem that the subsequent fabrication of the via hole still has a large deviation error due to the estimation error, thereby reducing the poor conduction or short circuit of the multilayer circuit board, and effectively Improve the continuity of multilayer boards. [Embodiment] The method for manufacturing a multilayer circuit board of the present technical solution will be further described in detail below with reference to the accompanying drawings and embodiments. Referring to FIG. 1, an embodiment of the present technical solution provides a method for fabricating a multi-layer circuit board, which includes the following steps: [0016] Step 110, referring to FIG. 2, a first copper clad laminate 10 is provided. [0017] In this embodiment, the first copper clad laminate 10 includes a first insulating layer 11 and a first copper 099121762 Form No. A0101 Page 6 / Total 32 pages 0992038304-0 201204215 / S layer 12. The first insulating layer 11 has a first surface I and a second surface 112. The first surface 1U is parallel to the second surface 112. The first surface 111 and the first surface 112 are each provided with a first copper foil layer 12, that is, the first copper clad laminate 10 is a double panel. Of course, the first copper clad laminate 1 can also be a single panel having only one layer of the first copper foil layer 12. The first copper clad laminate 1 has a molding region 101 and an edge region 102 surrounding the molding region 1〇1. That is, the edge region 1〇2 is located on the outer side of the molding region ι〇1. The molding area 101 is the area where the finished circuit board is finally formed, and the edge area 102 is an area to be cut and removed when forming a finished circuit board. [0018] Step 120, referring to FIG. 3-4, the edge region 10 2 of the first copper clad laminate 10 is buttoned to form at least one core copper ring set. [0019] The first copper clad plate 10 has a substantially rectangular shape. The edge region 1(2) includes a first edge region 1021, a second edge climbing region 1022, a third edge region 1023, and a fourth edge region 1 which are sequentially connected. 〇24. The first edge region 1〇21 is parallel to the third edge region 1023, and the second edge region 1022 is parallel to the fourth edge region 1 024. At the first corner edge region 1021, the second edge enemy region 1022, the third edge region 1023 and the fourth edge region 10 24 at the four corners of the first copper clad plate 1 are respectively formed with a plurality of concentric copper rings arranged at equal intervals. Group 14. Specifically, one end of the first edge region 1〇21 and the second edge region 1022, one end adjacent to the second edge region 1022 and the third edge region 1023, the third edge region 1023 and the fourth edge region 1〇24 A plurality of concentric copper ring sets 14 are respectively formed at adjacent one end, and the fourth edge area 1024 and one end adjacent to the first edge area 1〇21. The lines connecting the first edge region 1021, the second edge region 1022, the third edge region 1023, and the initial center of the plurality of concentric copper ring groups 14 on the fourth edge region 1024 are all in a straight line. In this embodiment, the first 099121762 form number A0101 page 7 / total 32 page 0992038304-0 201204215 edge region 1021, second edge region 1022, third edge region 1023 and concentric copper ring group 14 on the fourth edge region 1024 The number is five. The center distance of two adjacent concentric copper ring sets 14 of the five concentric copper ring sets 14 disposed at equal intervals may be a predetermined value D. The first edge region 1〇21 is parallel to the center line of the five concentric copper groups 14 on the second edge £1 0 2 3, and the second concentric copper ring group on the second edge region 1022 and the fourth edge region 1 024 The center line of 14 is parallel, and the first edge area 1〇21 is perpendicular to the center line of the five concentric copper ring groups 14 on the second edge area 1 0 2 2 . [0020] wherein each of the concentric copper ring sets 14 includes a first copper ring 141 and a second copper ring 142. The second copper ring 142 is concentric with the first copper ring 141 and surrounds the first copper ring 141. The outer diameter of the first copper ring 141 is smaller than the inner diameter of the second copper ring 142. The inner diameter of the first copper ring 141 is larger than the diameter of the smallest via hole to be fabricated in the circuit board. Preferably, the inner diameter of the first copper ring 141 is equal to the sum of the distance between the first copper ring 141 and the second copper ring 142 and the minimum aperture of the via hole (not shown) to be opened of the multilayer circuit board. That is, the inner diameter of the first copper ring 141 varies with the change in the aperture of the smallest via hole required in the different circuit boards. In this embodiment, when the aperture of the smallest via hole of the circuit board is d, and the distance between the first copper ring 141 and the second copper ring 142 is 2mi 1, the inner diameter of the first copper ring 141 is (d + 2) mi 1. Here, the position of the center of each of the first copper rings 141 at step 110 is defined as an initial center. Moreover, the initial center can be read by the CCD camera, and the position of the initial center can be further recorded in the machining control program for reading or comparative analysis in subsequent processing. [0021] In this embodiment, the line width of the first copper ring 141 and the line of the second copper ring 142 099121762 Form No. A0101 Page 8 / Total 32 pages 0992038304-0 201204215 Width and the first copper ring 141 and the second The distance between the copper rings 14 2 is equal to β. The line width of the first copper ring 141 and the line width of the second copper ring 142 respectively mean the width of the first copper ring 141 and the second copper ring 142 in the radial direction thereof. . For example, the line width of the first copper ring 141, the line width of the second copper ring 142, and the distance between the first copper ring 141 and the second copper ring 142 may both be set to 2 mi 1. 〇 Of course, as the process capability is improved, the line width of the first copper ring 141, the line width of the second copper ring 142, and the distance between the first copper ring 141 and the second copper ring 42 may be designed to be 1 mil or Less than lmil. At this time, each concentric steel ring group 14 may further include a third copper ring and a fourth copper ring (not shown) whose diameter is sequentially increased, and the third copper ring is lightly extinguished by the second copper ring 14 2 . The outer diameter of the fourth copper ring is larger than the outer diameter of the third copper ring. The line width of the first copper ring 141 and the line width of the second copper ring 142 are: the line width of the third copper ring, the line width of the fourth copper ring, and the distance between the adjacent two copper rings. They are all equal, for example, they can all be lmil. In addition, the line width of the first copper yoke 141 and the second copper ring 142 and the distance between the first copper ring hi and the second copper ring 142 may not be equal, and only the first steel ring 14 丨 is detected in advance. The line width of the second copper ring 142 and the distance between the first copper ring hi and the second copper ring 142 may be sufficient. [0022] It should be noted that, in this embodiment, the corresponding copper foil layer 12 on both sides of the first copper clad laminate 1 is etched to form a corresponding concentric copper ring group 14. That is, there are 20 concentric copper ring groups 14 on each of the first copper foil layers 12, and a total of 40 concentric copper ring groups 14 are formed in the first copper clad plate. [0023] Of course, the arrangement position of the concentric copper ring group 14 is not limited to the above-described manner in FIG. 3 to 4, and may be a plurality of setting modes including the setting modes shown in FIGS. 5 to 8 below. 099121762 Form No. A0101 Page 9 / Total 32' M 0992038304-0 201204215 [0024] Referring to FIG. 5 'The arrangement of the second concentric copper ring group 24 of the present technical solution and the first concentric copper ring group 14 described above The arrangement manner is different, and the difference is that a plurality of concentric copper ring groups 24 are formed on one end adjacent to the first edge region 2021 and the second edge region 2022, and the first edge region 2021 and the fourth edge region 2 are formed. A concentric copper ring group 24 having a plurality of equally spaced positions is also formed on one end of the 〇24, and a concentric copper ring group 24' is formed on the one end of the third edge region 2023 adjacent to the second edge region 2022. A plurality of concentric copper ring sets 24 are also formed on one end of the edge region 2023 adjacent to the fourth edge region 2024. In this embodiment, the two ends of the first edge region 2 0 2 1 are respectively formed with four concentric copper ring groups 24 and their initial centers are on the same straight line. The two ends of the third edge region 2023 are respectively formed with four concentric copper ring groups 24 and their initial centers are on the same straight line. The center line of the four concentric copper ring groups 24 respectively formed at the two ends of the first edge region 2 0 21 and the center of the four concentric copper ring groups 2 4 respectively formed at the two ends of the second edge region 2 〇 2 3 The lines are parallel. Preferably, the centers of the eight concentric copper ring sets 24 of the first edge region 202 1 are collinear. The centers of the eight concentric copper ring groups 24 of the third edge region 2023 are collinear. [0025] Please refer to FIG. 6, the third concentric copper ring group 34 of the present technical solution is arranged differently than the second concentric copper ring group 24, and the difference is that the first edge region 3021 is The abutment of the second edge region 3022, the abutment of the second edge region 3022 and the third edge region 3023, the abutment of the third edge region 3023 and the fourth edge region 3024, and the fourth edge region 3024 and the first edge region A plurality of concentric copper ring sets 34 are formed adjacent to each other at 3021. The abutment of the first edge region 3021 and the second edge region 3022, the abutment of the second edge region 3022 and the third edge region 3023, the third edge 099121762 Form No. A0101 Page 10 / Total 32 Page 0992038304-0 201204215 Area 3023 The line connecting the abutment of the fourth edge region 3024 and the initial center of the plurality of concentric copper ring groups 34 adjacent to the first edge region 3024 constitutes a right triangle. In this embodiment, the abutment of the first edge region 3021 and the second edge region 3022, the abutment of the second edge region 3022 and the third edge region 3023, the abutment of the third edge region 3023 and the fourth edge region 3024, and The number of concentric copper ring sets 34 adjacent the fourth edge zone 3024 and the first edge zone 3021 is three. Referring to FIG. 7, the fourth concentric copper ring group 44 of the present technical solution is arranged differently from the third concentric copper ring group 34, and the difference is that the first edge area is different. Adjacent to the second edge region 4022, the abutment of the second edge region 4022 and the third edge region 4023, the abutment of the third edge region 4023 and the fourth edge region 4024, and the fourth edge region 4024 and the first edge A plurality of concentric copper ring sets 44 are formed adjacent to the regions 4021. And, the abutment of the first edge region 4021 'the second edge region 4022, the abutment of the second edge region 4022 and the third edge region 4023, the abutment of the third edge region 4023 and the fourth edge region 4024, and the fourth The line connecting the edge region 4024 to the initial center of the plurality of concentric copper ring groups 44 adjacent to the first edge region 4021 is parallel to the diagonal of the first copper clad plate 410. In this embodiment, the abutment of the first edge region 4021 and the second edge region 4022, the abutment of the second edge region 4022 and the third edge region 4023, and the abutment of the third edge region 4023 and the fourth edge region 4024 And a concentric copper ring group 44 is formed adjacent to the fourth edge region 4024 and the first edge region 4021, and the first edge region 4021 and the second edge region 4022 are adjacent to each other, and the second edge region 4022 and the The abutment of the three edge regions 4023, the abutment of the third edge region 4023 and the fourth edge region 4024, and the fourth edge 099121762 Form No. 1010101 Page 3/32 pages 0992038304-0 201204215 Area 4024 and the first edge area 4〇 The line connecting the initial centers of the two concentric copper ring groups 44 at the abutment of 21 coincides with the diagonal of the first copper clad plate 410. [0029] Please refer to FIG. 8 'The fifth concentric copper ring group 54 of the present technical solution is arranged differently from the fourth concentric copper ring group 44, and the difference is that ' At least two of the first edge region 5021, the second edge region 5〇22, the third edge region 5023, and the fourth edge region 5024 are formed with one or a plurality of concentric copper ring sets 54. In this embodiment, a concentric copper ring group 54 is formed on one end of the first edge region 5〇21 and the second edge region 5022, and a third edge region 5023 and the second edge region 5022 are formed on one end of the adjacent edge region 5022. A concentric copper ring group 54 is formed on both ends of the fourth edge region 5024 adjacent to the first edge region 5021 and the third edge region 5023, respectively. The center line of the two concentric copper ring groups 54 of the fourth edge region 5024 is parallel to the center line of the two concentric copper ring groups 54 of the first edge region 5〇21 and the third edge region 5023. Step 130, referring to FIG. 9, a second copper clad laminate 2 and an adhesive layer 30 are provided, and the adhesive layer 30 is thermocompression bonded between the τ copper clad laminate 1 and the second copper clad laminate 20 to form a plurality of layers. The substrate 4 is. The second copper clad laminate 20 in the present embodiment includes only the second copper foil layer 22. The size of the second copper clad laminate 20 matches the size of the first copper clad laminate. Of course, the second copper clad laminate 20 can also be a double-sided sheet having a conductive pattern. The s-adhesive layer 30 is used for bonding the first copper clad laminate 10 and the second copper clad laminate. The material of the adhesive layer 30 may be selected from epoxy resin, polyester or acrylic. Of course, the adhesive layer 30 may also be an insulating layer disposed on one of the surfaces of the second copper foil layer 22 of the second copper clad layer 2 912 099121762 Form No. A0101 Page 12 / Total 32 Page 0992038304-0 [0030] 201204215 . The size of the adhesive layer 30 also matches the size of the first copper clad laminate 10. [0031] The adhesive layer 30 is placed between the first copper foil layer 12 of the first copper clad laminate 10 and the second copper clad laminate 20, and the first copper clad laminate 10 is thermally pressed by a pressing device (not shown). The adhesive layer 30 and the second copper clad laminate 20. After the thermocompression bonding, the adhesive layer 30 bonds the first copper clad laminate 10 and the second copper clad laminate 20 to form the multilayer substrate 40. [0032] Step 140, referring to FIG. 10, the detection hole 105 penetrating the first copper clad laminate 10, the adhesive layer 30 and the second copper clad laminate 20 is formed by the initial center of the first copper ring 141. The aperture of the detection hole 105 is smaller than the inner diameter of the first copper ring 141. Preferably, the aperture of the detection aperture 105 is equal to the aperture of the smallest via that needs to be fabricated in the multilayer circuit board. Specifically, the detecting hole 105 can be sequentially formed in accordance with the initial center recorded in the processing control program. In this embodiment, the detecting hole 105 is formed by mechanical drilling. Of course, the detection aperture 105 can also be made using the previous laser ablation porch technique. [0033] Step 150, referring to FIG. 10 and FIG. 11, the multi-layer substrate 40 is irradiated with light, and the relative positional relationship between each of the detecting holes 105 and the corresponding concentric copper ring group 14 is detected to determine that the detecting hole 105 deviates from the initial state. Center bias error. In this embodiment, the multi-layer substrate 40 is irradiated with X-ray intense light, and the X-rays can be transmitted through the multi-layer substrate 40 to obtain a perspective view of the positional relationship between the concentric copper ring group 14 and the detecting hole 105. Since the first insulating layer 11 and the adhesive layer 30 are generally made of a resin material, and the first copper foil layer 12 and the second copper foil layer 22 are made of a copper material, the light transmittance is different, and the thicker the copper layer is, the transmittance thereof is. The lower, therefore, in this perspective view, the detection hole 105 is the brightest, concentric 099121762 Form No. A0101 Page 13 / Total 32 Page 0992038304-0 201204215 Copper ring group 1 4 is etched off the copper foil position is not compared The position where the first copper ring 141 and the second copper ring 142 are etched is high in brightness, and the first copper ring 141, the second copper ring 142, and the multilayer substrate 4 that is not etched away from the copper foil are located at the darkest position. Therefore, the relative positional relationship between the detecting hole 105 and the concentric copper ring group 14 can be obtained from the perspective view. [0035] Referring to FIG. 11, there is shown a perspective view of five concentric copper ring sets μ on one end of the second edge region 1 22 and the third edge region 1023. In this embodiment, since the aperture of the detecting hole 1〇5 is equal to the aperture d′ of the smallest via hole of the circuit board, the inner diameter of the first copper ring 141 is (d + 2) mil, the first copper ring 141 and the second The distance between the copper rings 142 is 2 mils, the line width of the first copper ring 141 and the line width of the second copper ring 142 are also 2 mils. Therefore, according to the perspective view of the five concentric copper ring groups 14, it is possible to: set one The arrow from the first edge region 1021 to the third edge region 1〇23 has no offset error in the detection aperture 05 in the first concentric copper ring group 14 in the direction of the arrow in the figure, and the second concentric copper ring group 14 The deviation error of the detection hole 1〇5 is 2mi 1 , the deviation error of the detection hole 5 in the third concentric copper ring group 14 is 4 mil, and the detection hole 1 of the fourth concentric copper ring group 14 The offset error of 〇5 is 6 mil. The offset error of the detection hole 1〇5 in the fifth concentric copper ring group 14 is 8 mil. It can be seen that the multilayer substrate 4 is not subjected to shrinkage in the region between the first concentric copper ring group 14 and the multi-layer substrate 4 垂直 perpendicular to the direction of the arrow direction after the thermocompression bonding, and the multilayer substrate 4 is hot. After pressing, the area near the second edge area 1022 and the third edge area 1023 is contracted in the opposite direction of the arrow direction in the figure, and the vertical direction does not occur in the direction perpendicular to the arrow. Of course, five of the other three edges The concentric copper ring set 14 can also be obtained by analyzing the perspective of the 099121762 form number A0101 page 14/32 page 0992038304-0 201204215. [0036] Step 160, determining a scaling ratio of the multilayer substrate 40 after the thermal pressing according to the deviation error of the detecting hole 105, and determining a position at which the multi-layer substrate 40 opens the via hole according to the scaling ratio. In this embodiment, the contraction ratio k = θ of the region between the adjacent two concentric copper ring groups 14 shown in Figs. 10 and 11 (the center distance before the pressing between the adjacent two concentric copper ring groups - The center distance after pressing between two adjacent concentric copper ring groups) / the center distance before pressing between two adjacent concentric copper ring groups = 2 mil/D. Further, the shrinkage tendency of the multilayer substrate 40 in the opposite direction of the arrow direction can be calculated from the trend of the change in the K value. Since the contraction ratio k of the region between the adjacent two concentric copper ring groups 14 in Figs. 10 and 11 is 2 mil/D, the shrinkage ratio K = k = 2 rail/D of the multilayer substrate 40 in this region. Then, the opening position of the correction via hole is compensated based on the contraction ratio K, thereby determining the position at which the multilayer substrate 40 opens the via hole. [0037] Of course, by analyzing the offset errors of the five concentric copper ring groups 14 on the other three edges, the ratio of the expansion and contraction of the multi-layer substrate 40 of the corresponding region can also be obtained. Further, when When the two sides of the substrate 40 need to be further pressed to form an outer layer copper clad laminate, the concentric copper ring group may be disposed on the second copper clad laminate 20 which is thermocompression bonded to the outer copper clad laminate and refer to the above steps 120 to 160. The position of the through hole in the outer copper clad laminate is determined. In addition, for the arrangement of the concentric copper ring groups in FIG. 5 to FIG. 8, the corresponding offset error can also be obtained by the perspective view, and the rise of the multilayer substrate can be calculated by mathematical statistical analysis according to the offset error. The scale is reduced from 099121762 Form No. A0101 Page 15 / Total 32 Page 0992038304-0 [0039] 201204215 The position of the via hole in the multilayer substrate can be determined. [0042] Compared with the prior art, in the method for fabricating a multi-layer circuit board of the present technical solution, the concentric copper ring group of the first copper box layer and the subsequently fabricated through the first copper clad board can be bonded. The deviation of the detection hole of the layer and the second copper-clad board from the initial center determines the deviation error of the detection hole, and the deviation ratio of the multi-layer wire after the multi-layer wire is pressed is determined by the deviation error of the detection hole, and then the silk is determined according to the expansion ratio. ·Inductive position, the branch can accurately obtain the specific value of the deviation error of the detection hole, avoiding the problem that the subsequent fabrication of the via hole still has a large difference (4) due to the estimation error, thereby reducing the multilayer wheel board guide wheel Road _, effectively improve the continuity of the multilayer circuit board. In summary, the present invention has indeed met the requirements of the invention patent, and the patent is filed according to law. The prior art 'is described above is only a preferred embodiment of the present invention' and it is not possible to limit the scope of the patent in this case. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a first schematic diagram of a method for fabricating a multilayer circuit board of FIG. 1 according to a flow chart of a method for fabricating a multilayer circuit board according to an embodiment of the present invention. The copper-clad board is a schematic view of the first-clad steel plate in which the first-core copper ring group is formed in the multilayer circuit board manufacturing method of FIG. Figure 4 is a partial view of the first copper clad plate of the same copper ring group as shown in Figure 3, the form number Α0101 is the same as the first copper clad plate. Page 96 of 32 0992038304-0 201204215 [0046] Fig. 5 is a schematic view showing the etching of a first copper clad plate having a second concentric copper ring group formed in the method of fabricating the multilayer circuit board of Fig. 1. 6 is a schematic view showing a first copper clad plate in which a third concentric copper ring group is formed by etching in the method of fabricating the multilayer circuit board of FIG. 1. 7 is a schematic view showing a first copper clad plate in which a fourth concentric copper ring group is formed by etching in the method of fabricating the multilayer circuit board of FIG. 1. [0049] FIG. 8 is a schematic view showing the first copper clad laminate in which a fifth concentric copper ring group is formed by etching in the method of fabricating the multilayer circuit board of FIG. 1. 9 is a schematic view showing the first copper clad laminate, the adhesive layer and the second copper clad laminate after thermocompression bonding in the method for fabricating the multilayer circuit board of FIG. 1. [0051] FIG. 10 is an enlarged schematic view showing a portion of the detection board formed on the circuit board after pressing in FIG. [0052] FIG. 11 is a perspective view of the circuit board of FIG. 10 formed by light irradiation.主要 [0051] [Claim Description of Main Components] First Copper Clad: 10, 410 [0054] First Insulation: 11 [0055] First Copper Foil: 12 [0056] Concentric Copper Ring Group: 14, 2 4, 3 4, 4 4, 5 4 [0057] First copper ring: 141 [0058] Second copper ring: 142 099121762 Form number Α 0101 Page 17 / Total 32 page 0992038304-0 201204215 [0059] First surface: 111 [ 0060] Second surface: 112 [0061] Forming area. 101 [0062] Edge area: 102 [0063] First edge area: 1021, 2021, 3021, 4021, 502 1 [0064] Second edge area: 1022 ' 2022 ' 3022 ' 4022 ' 5022 [0065] Third edge zone: 1023, 2023, 3023, 4023, 5023 [0066] Fourth edge zone: 1024, 2024, 3024, 4024, 5024 [0067] Second copper clad: 20 [ 0068] Second copper foil layer: 22 [0069] Adhesive layer: 30 [0070] Detection hole: 105 [0071] Multilayer substrate: 40 099121762 Form number A0101 Page 18 of 32 0992038304-0