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TW201141935A - Organic EL element, organic EL display device, organic EL lighting device, and curing composition for sealing agent - Google Patents

Organic EL element, organic EL display device, organic EL lighting device, and curing composition for sealing agent Download PDF

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Publication number
TW201141935A
TW201141935A TW100105703A TW100105703A TW201141935A TW 201141935 A TW201141935 A TW 201141935A TW 100105703 A TW100105703 A TW 100105703A TW 100105703 A TW100105703 A TW 100105703A TW 201141935 A TW201141935 A TW 201141935A
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TW
Taiwan
Prior art keywords
organic
sealant
compound
curable composition
particles
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TW100105703A
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Chinese (zh)
Inventor
Naoyuki Makiuchi
Yasunobu Suzuki
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Jsr Corp
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Publication of TW201141935A publication Critical patent/TW201141935A/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The present invention is related to an organic EL element that has an organic lighting layer and is sealed by a curing composition for sealing agent, which is characterized in that the curing composition for sealing agent comprises [A] a compound having epoxy group, [B] photo-cationic polymerization initiator, and [C] inorganic particles having a diameter of 30 μ m and more, and mode value of distribution of particle diameter as 30 μ m and more and 1000 μ m and less.

Description

201141935 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種有機EL元件.、有機EL顯示裝置、 有機E L照明裝置及密封劑用硬化性組成物。 【先前技術】 有機電致發光（EL)元件係自我發光之元件，由於相當 於如液晶顯示器之背光板之部分爲不需要，顯示器之薄膜 化爲可能。另外，有機EL顯示器能夠發現省電、高速應答 性 '顏色再現性等超越液晶顯示器之性能。現在，有機EL 元件係於行動電話等已被商品化，適合下一代大型電視之 顯示元件已被探討。另外，有機EL元件作爲液晶顯示裝置 的背光板等照明裝置之活用也正被探討（參閱日本專利特 開2001-313163號公報及特開2007-227523號公報）。 由於構成有機EL元件一部分之有機發光材料係不耐 水分且在空氣中使有機EL元件驅動時，因空氣中之水分的 影響而使發光特性急遽劣化，今後進行廣泛有機EL元件應 用之際，必須抑制如此之不當情形。 因此，例如有機EL元件之一構造，有人提案藉由使已 配設有機發光材料之玻璃基板等與由玻璃或金屬等所構成 的基板相重疊，利用密封劑以密封其周邊而形成中空構 造，再將乾燥氮密封於此中空部分內之技術（參閱特開平 9- 1 48066 號公報）。 在用於如此有機EL元件之密封劑用組成物中，除了充 201141935 分的接著性之外，也尋求良好之塗布性。另外，從有機EL 元件之有機發光材料的耐熱性之觀點，由於作爲液晶密封 劑用之一般所使用的熱硬化型樹脂組成物之使用係困難， 正探討即使室溫下也能夠硬化的紫外線硬化型樹脂組成物 之應用（參閱特開2001-139933號公報）。 還有，於密封劑用組成物中尋求優異的單元間隙控制 性，其係用以精確度佳地將成爲基板間之間隔的接著層厚 度（單元間隙）保持於所期望的厚度。爲了確保此優異的單 元間隙控制性。也探討含有大粒徑之塑膠間隙物的密封劑 用組成物（日本專利特開2005-320404號公報）。 然而，雖然可用於此種之有機EL元件的密封劑用組成 物係具有某種程度之接著性及塗布性，但於硬化物之低透 濕性上仍具有改良之空間，依然未能解決有機E L元件在空 氣中之驅動的發光特性劣化。另外，於含有上述塑膠間隙 物之密封劑用組成物中，不能說充分滿足單元間隙控制性。 專利文獻1 ··日本特開2 0 0 1 - 3 1 3 1 6 3號公報 專利文獻2:日本特開2007-227523號公報 專利文獻3:日本特開平9-148066號公報 專利文獻4 :日本特開2 0 0 1 - 1 3 9 9 3 3號公報 專利文獻5:日本特開2005-320404號公報 【發明内容】 [發明所欲解決之問題] 本發明係基於如上述之事實所完成者，其目的係提供 一種密封劑用硬化性組成物，其係具備優異的接著性及塗 201141935 。 布性，並且所獲得之硬化物具有優異的低透濕性及單元間 隙控制性。並提供一種由依照該密封劑用硬化性組成物所 密封而成之有機EL元件、有機EL顯示裝置及有機EL照 明裝置。 [解決問題之手段] 爲了解決上述課題所完成之發明係一種有機EL元 件，其特徵爲具有有機發光層且藉由密封劑用硬化性組成 物所密封而成的有機EL元件，此密封劑用硬化性組成物係 含有： [A] 具有環氧基之化合物（以下，也稱爲「[A]化合物」）、 [B] 光陽離子聚合起始劑、及 [C] 粒徑爲30 μπι以上且粒徑分布頻率的最高値爲30 μηι以 上且1，000 μπι以下之無機粒子（以下，也稱爲「[C]無機粒 子」）。 由於本發明之有機EL元件中所使用的密封劑用硬化 性組成物能夠形成具有優異的低透濕性及單元間隙控制性 之硬化物，該有機EL元件中之有機發光層能夠防止來自空 氣中之水分或氧之混入。因而，與習知之有機EL元件作一 比較，該有機EL元件更抑制因吸濕所導致的發光特性之劣 化。另外，由於使用於本發明之有機EL元件的密封劑用硬 化性組成物係在室溫附近具有優異的硬化性，於硬.化之 際，無進行高溫加熱之必要，該有機EL元件中之有機發光 層不誘發因加熱所導致的劣化。 於本發明中，也適合含有具備該有機EL元件之有機 201141935 EL顯示裝置及具備該有機EL元件之有機EL照明裝置。與 如上所述之習知有機EL元件作一比較，由於該有機EL元 件達成優異的效果，於該有機EL顯示裝置及該有機EL照 明裝置中，該有機EL元件同樣具有優異的維持有機發光層 之發光特性。 本發明之密封劑用硬化性組成物，其係含有： [A] 具有環氧基之化合物、 [B] 光陽離子聚合起始劑、及 [C] 粒徑爲30 μτη以上且粒徑分布頻率的最高値爲30 μιη以 上且1，000 μπι以下之無機粒子。 除了 [Α]化合物及[Β]光陽離子聚合起始劑之外，該密 封劑用硬化性組成物也含有作爲[C]無機粒子之粒徑較大 的無機微粒。因此，於從該密封劑用硬化性組成物所形成 的硬化物中，此無機粒子能夠具有高的水蒸氣遮斷性且發 揮優異的低透濕性。另外，於該密封劑用硬化性組成物中， [C]無機粒子係藉由調整此粒徑而發揮作爲間隙物之機 能。還有’ [C]無機粒子係因元件製造程序中之熱附加等所 導致的粒徑變動小而具優越之單元間隙控制性。亦即，能 夠將基板間之單元間隙的厚度正確調整、控制成所期望的 厚度。除了此等之效果，根據該密封劑用硬化性組成物， 藉由具有上述各成分而能夠發揮優異的接著性及塗布性。 [C]無機粒子之粒徑分布頻率的最高値較佳爲3〇〇 μπ1 以上且600 μηι以下。藉由將[c]無機粒子之粒徑分布頻率 201141935 的最高値設爲上述範圍，組成物中之無機粒子的均句性將 提高，接著性及塗布性將更提高，同時也使所獲得之硬化； 物的低透濕性更提高。 該密封劑用硬化性組成物較佳爲進一步含有[D]粒徑 低於30 μιη之板狀金屬氧化物粒子（以下，也稱爲「[D]板 狀金屬氧化物粒子」）。根據該密封劑用硬化性組成物，藉 由使[D]板狀金屬氧化物粒子相重疊而形成積層構造，此積 層構造能夠防止水蒸氣等之硬化物中之透過。因而，根據 此密封劑用硬化性組成物，能夠形成具有更優異的低透濕 性之硬.化物。 [Β]光陽離子聚合起始劑較佳爲具有不含銻或砷之陰 離子的鑰鹽。藉由使用如此之光陽離子聚合起始劑，該密 封劑用硬化性組成物之硬化性將更提高。另外，由於該光 陽離子聚合起始劑不含銻或砷，對人體之毒性爲低且能夠 安全使用。 [Α]化合物之具有環氧基的化合物較佳爲含有： (Α-1)分子量500以下之具有環氧基的化合物（以下， 也稱爲「（Α-1)化合物」）；及 (Α-2)藉凝膠滲透層析儀而以聚苯乙烯換算所測出的 重量平均分子量（Mw)爲超過500且5,000以下之聚合物的 具有環氧基的化合物（以下，也稱爲「（A-2)化合物」）》 [A]化合物係藉由使用分子量不同的二種環氧化合 物，於使該密封劑用硬化性組成物硬化之際，在高分子量 201141935 環氧化合物之（A-2)化合物所形成的交聯網狀構造之間隙 中，由於使低分子量之環氧化合物（A-1)化合物充塡其間隙 的方式來予以聚合而形成緻密之交聯構造。因而，由該密 封劑用硬化性組成物所獲得之硬化物的低透濕性將特別提 闻。 於此，所謂「粒徑分布」係顯示粒子之粒徑與其個數 頻率的關係之直方圖。另外，所謂「板狀j粒子係指粒子 表面具有約略平行之二面的扁平狀粒子。但是，並非嚴格 地指此二面爲依照平面所形成，例如表面也可以有凹凸等。 [發明之效果] 根據本發明，能夠提供一種具備優異的接著性及塗布 性且所獲得之硬化物爲具有優異的低透濕性及單元間隙控 制性的密封劑用硬化性組成物，由該密封劑用硬化性組成 物所密封而成之有機EL元件、有機EL顯示裝置及有機EL 照明裝置。 【實施方式】 本發明係一種有機EL元件，其特徵爲具有有機發光層 之有機EL元件，以藉由密封劑用硬化性組成物所密封。另 外，於本發明中，也適合包含具備該有機EL元件之有機 EL顯示裝置及具備該有機EL元件之有機EL照明裝置。以 下，依序詳述該密封劑用硬化性組成物、該密封劑用硬化 性組成物之各成分、有機EL元件、具備有機EL元件之有 機EL顯示裝置、具備有機EL元件之有機EL照明裝置。 201141935 <密封劑用硬化性組成物> 本發明之密封劑用硬化性組成物係含有[A]化合物、[B] 光陽離子聚合起始劑及[C]無機粒子。另外，較佳的成分係 含有[D]板狀金屬氧化物粒子。還有，於不損害本發明效果 之範圍內’也可以含有其他之任意成分。以下，針對各成 分而詳加說明。 < [A]具有環氧基之化合物> [A]化合物係1分子中具有至少1個環氧基之化合物， 能夠使用習知者。[A]化合物係於常溫常壓下，可以爲液 狀’也可以爲固形。還有’於本發明中，所謂環氧基係具 有環狀醚構造者，環狀醚構造係具有三員環、四員環、五 員環等。本發明之組成物係藉由含有此[A]化合物而藉光照 射來予以硬化。 本發明所使用之化合物能夠分爲：分子量500以下之 具有環氧基之（A-1)化合物、藉凝膠滲透層析儀而以聚苯乙 烯換算所測出的Mw爲500以上且5,000以下之聚合物的 具有環氧基之（A-2)化合物、及Mw超過5,000之其他具有 環氧基之化合物。 [A]化合物能夠分別單獨使用（A-1)化合物、（A-2)化合 物、及其他具有環氧基之化合物，或組合二種而使用，較 佳爲含有（A-1)化合物與（A-2)化合物。如此方式，[A]化合 物係藉由使用分子量不同的二種環氧化合物，於使該密封 劑用硬化性組成物硬化之際，高分子量之環氧化合物（A-2) 201141935 所形成的交聯網狀構造之間隙中，由於使低分子量之環氧 化合物（A- 1 )化合物充塡其間隙的方式來予以聚合而形成 緻密之交聯構造。因而如上所述，藉由使用二種環氧化合 物而使利用該密封劑用硬化性組成物所獲得之硬化物的低 透濕性提高。使用如此具有二種環氧基之化合物的效果係 於分子運動變得活躍之高溫情形下，特別顯著地顯現.，在 高溫時之硬化物的低透濕性將特別有效地提高。還有，從 硬化後之低透濕性之觀點，相對於[A ]化合物之總量1 0 〇質 量份，（A-2)化合物之摻合比例較佳爲20至100質量份， 特佳爲30至60質量份。 (A-1)化合物可舉例：分子量500以下之具有三員環環 氧基（環氧乙烷基）之化合物、或具有四員環環氧基（環氧丙 烷基）之化合物等。此等之成分最好按照使用對應而適當選 擇，從反應性之觀點，較佳爲具有三員環環氧基之化合物； 從保存安定性之觀點，較佳爲具有四員環環氧基（環氧丙院 基）之化合物。 具有上述三員環環氧基之化合物，例如，可舉例：具 有三員環環氧基之脂肪族化合物、具有三員環環氧基之脂 舉、。舉 可等可 。，基醚， 等如丙基如 吣例ft丙例 合，環氧， 化物#-環品 疾合醇三售 香化一 一烷市 芳族-E丙的 之肪1,6基物 基脂'1甲合 氧之罾羥化 環基基三族 環氧丙、肪 員環氧醚脂 三環Ϊ1基之 有員二丙基 具三 醇氧氧 、 述一一環環 物上T二環 合有4-醇員 化具 1， 二三 族 ：戊有 環 例新具 -10- 201141935 例：SR-NPG、SR-ΤΜΡ(以上，阪本藥品工業製）等。 具有上述三員環環氧基之脂環族化合物，例如，可舉 例：3,4-環氧環己基甲基-3’，4’-環氧環己烷羧酸酯、2·(3,4-環氧環己基_5,5_螺-3,4-環氧）環己烷間二噚烷、雙（3,4-環 氧環己基甲基）己二酸酯、雙（3,4-環氧-6-甲基環己基甲基） 己二酸酯、3,4-環氧-6-甲基環己基-3’，4、環氧- 6’-甲基環己 烷羧酸酯、ε -己內酯改性-3,4 -環氧環己基甲基-3’，4’-環氧 環己烷羧酸酯、三甲基己內酯改性-3,4 -環氧環己基甲基 -3’，4’-環氧環己烷羧酸酯、β -甲基- δ-戊內酯改性-3,4 -環氧 環己基甲基-3’，4’-環氧環己烷羧酸酯、乙二醇之二（3,4-環 氧環已基甲基）醚、伸乙基雙（3,4·環氧環己烷羧酸酯）、環 氧環六氫化鄰苯二甲酸二辛酯、環氧環六氫化鄰苯二甲酸 二-2-乙基環己酯、亞甲基雙（3，4-環氧環己烷）等。具有三 員環環氧基之脂環族化合物的市售品，例如，可舉例： ADEKA RESIN EP-408 5S、ADEKA RESIN EP-408 8 S(以上， ADEKA 製）；Celoxide 202 1、Celoxide 202 1P ' Celoxide 208 1、Celoxide 208 3、Celoxide 2085、Epolead GT-3 00、 Epolead GT-301、Epolead GT-302、Epolead GT-400、Epolead GT-401、Epolead GT-403(以上，Dai cel 化學工業製）等。 具有三員環環氧基之芳香族化合物，例如，可舉例·· 骨架上具有芳香環構造’具有2個以上三員環環氧基之化 合物等。如此之化合物芳香環構造，例如，可舉例：雙酚 A型構造、雙酚F型構造、萘骨架等。具有三員環環氧基 •11· 201141935 之芳香族化合物，例如’可舉例··雙（4·環氧丙基苯氧基） 甲烷、雙（4_環氧丙基苯氧基）乙烷、雙（4-環氧丙基萘氧基） 甲烷、雙（4-環氧丙基萘氧基）乙烷等。具有三員環環氧基之 芳香族化合物的市售品，例如，可舉例：YL980、YL983U(以 上，Japan Epoxy Resiη 製）等。 具有四員環環氧基（環氧丙烷基）之化合物，例如，可 舉例：分子中具有1個或2個以上環氧丙烷基之化合物等。 具有1個環氧丙烷基之化合物，例如，可舉例：3 -乙基-3-羥甲基環氧丙烷、3-(甲基）丙烯醯氧甲基-3-乙基環氧丙 院、（3 -乙基-3-環氧丙院甲氧基）甲基苯、4 -氟-[1-(3 -乙基- 3-環氧丙烷甲氧基）甲基]苯、4-甲氧基- [1·(3-乙基-3-環氧丙 烷甲氧基）甲基]苯、[1-(3-乙基-3-環氧丙烷甲氧基）乙基]苯 基醚、異丁氧甲基（3-乙基-3-環氧丙烷甲基）醚、異莰烷氧 乙基（3-乙基-3-環氧丙烷甲基）醚、異莰烷基（3-乙基-3-環氧 丙烷甲基）醚、2·甲基己基（3-乙基-3-環氧丙烷甲基）醚、2-乙基己基（3-乙基-3-環氧丙烷甲基）醚、乙基二乙二醇（3-乙 基-3-環氧丙烷甲基）醚、二環戊二烯（3-乙基-3-環氧丙烷甲 基）醚、二環庚烯氧乙基（3-乙基-3-環氧丙烷甲基）醚、二環 庚烯基（3-乙基-3-環氧丙烷甲基）醚、四氫呋喃基（3-乙基- 3-環氧丙烷甲基）醚、四溴苯基（3-乙基-3-環氧丙烷甲基）醚、 2-四溴苯氧乙基（3-乙基-3-環氧丙烷甲基）醚、三溴苯基（3-乙基-3-環氧丙烷甲基）醚、2-三溴苯氧乙基（3-乙基-3-環氧 丙烷甲基）醚、2·羥乙基（3-乙基-3-環氧丙烷甲基）醚、2-羥 -12- 201141935 丙基（3 -乙基-3-環氧丙院甲基）醚、丁氧丙基（3_乙基_3_環氧 丙院甲基）酸、五氯苯基（3 -乙基-3 -環氧丙院甲基）酸、五溴 苯基（3 -乙基-3-環氧丙烷甲基）醚、莰烷基（3_乙基-3_環氧丙 烷甲基）醚等。 具有2個以上環氧丙院基之化合物，例如，可舉例·· 3,7-雙（3 -環氧丙院）-5-側氧-壬院、ι，4_雙[(3 -乙基-3-環氧 丙烷甲氧基）甲基]苯、1，2-雙[3-乙基環氧丙烷甲氧基） 甲基]乙烷、1,2-雙[3-乙基-3-環氧丙烷甲氧基）甲基]丙烷、 乙二醇雙（3-乙基-3-環氧丙烷甲基）醚、二環戊烯基雙（3_乙 基-3-環氧丙烷甲基）醚、三乙二醇雙（3_乙基-3_環氧丙烷甲 基）醚、四乙—醇雙（3 -乙基-3-環氧丙烷甲基）醚、三環癸烷 二基二亞甲基雙（3-乙基-3-環氧丙烷甲基）醚、z 基-3-環氧丙烷甲氧基）甲基]丁烷、1>6_雙[(3_乙基_3環氧 丙院甲氧基）甲基]己院、3-乙基-3_{[(3_乙基環氧丙烷-3_基） 甲氧基]甲基}環氧丙烷等。 (A-2)化合物能夠使用藉凝膠滲透層析儀而以聚苯乙 嫌換算所測出的Mw爲500以上且5, 〇〇〇以下之聚合物的 二員環、四員環、五員環等之具有環氧基之化合物。從與 (A - 1 )化α物同樣反應性之觀點’較佳爲具有三員環環氧基 之化合物；從保存安定性之觀點，較佳爲具有四員環環氧 基之化合物。[Technical Field] The present invention relates to an organic EL element, an organic EL display device, an organic EL illumination device, and a curable composition for a sealant. [Prior Art] An organic electroluminescence (EL) element is a self-luminous element, and since it is not required as a part of a backlight such as a liquid crystal display, thinning of the display is possible. In addition, the organic EL display can find power saving, high-speed responsiveness, and color reproducibility beyond the performance of a liquid crystal display. Nowadays, organic EL components have been commercialized in mobile phones and the like, and display elements suitable for the next generation of large-sized televisions have been discussed. In addition, the use of an organic EL device as an illumination device such as a backlight of a liquid crystal display device is also known (see Japanese Patent Laid-Open Publication No. 2001-313163 and JP-A-2007-227523). When the organic light-emitting material that is a part of the organic EL element is not resistant to moisture and the organic EL element is driven in the air, the light-emitting characteristics are rapidly deteriorated by the influence of moisture in the air, and it is necessary to apply a wide range of organic EL elements in the future. Suppress such an inappropriate situation. Therefore, for example, it is proposed to form a hollow structure by sealing a glass substrate or the like having a machine light-emitting material and a substrate made of glass or metal, and sealing the periphery thereof with a sealant. A technique of sealing dry nitrogen in this hollow portion is also known (refer to Japanese Laid-Open Patent Publication No. Hei 9-14886). In the composition for a sealant used in such an organic EL device, in addition to the adhesion of 201141935, good coating properties were also sought. In addition, from the viewpoint of the heat resistance of the organic light-emitting material of the organic EL device, it is difficult to use the thermosetting resin composition which is generally used for the liquid crystal sealing agent, and ultraviolet curing which can be cured even at room temperature is being investigated. Application of a resin composition (refer to Japanese Laid-Open Patent Publication No. 2001-139933). Further, excellent cell gap controllability is sought in the composition for a sealant, which is used to accurately maintain the thickness of the underlayer (cell gap) which is a space between the substrates at a desired thickness. In order to ensure this excellent unit gap control. A composition for a sealant containing a plastic spacer having a large particle size is also known (Japanese Patent Laid-Open Publication No. 2005-320404). However, although the composition for a sealant which can be used for such an organic EL element has a certain degree of adhesion and coating property, there is still room for improvement in the low moisture permeability of the cured product, and the organic solution is still not solved. The luminescence characteristics of the driving of the EL element in the air are deteriorated. Further, in the composition for a sealant containing the above-mentioned plastic spacer, it cannot be said that the cell gap control property is sufficiently satisfied. [Patent Document 1] Japanese Patent Laid-Open Publication No. JP-A-2007-227523 (Patent Document 3) JP-A-2000-320404 SUMMARY OF INVENTION [Technical Problem to be Solved by the Invention] The present invention is based on the facts as described above. The purpose is to provide a curable composition for a sealant which has excellent adhesion and is coated with 201141935. The cloth is obtained, and the obtained cured product has excellent low moisture permeability and cell gap controllability. Further, an organic EL device, an organic EL display device, and an organic EL illumination device which are sealed by a curable composition for a sealant are provided. [Means for Solving the Problem] An organic EL device having an organic light-emitting layer and sealed with a curable composition for a sealant, is an organic EL device having an organic light-emitting layer, and is used for the sealant. The curable composition contains: [A] a compound having an epoxy group (hereinafter also referred to as "[A] compound"), [B] a photocationic polymerization initiator, and [C] having a particle diameter of 30 μπ or more. The highest particle size distribution frequency is 30 μηι or more and 1,000 μπι or less of inorganic particles (hereinafter also referred to as "[C] inorganic particles"). The curable composition for a sealant used in the organic EL device of the present invention can form a cured product having excellent low moisture permeability and cell gap controllability, and the organic light-emitting layer in the organic EL device can be prevented from coming from the air. The incorporation of moisture or oxygen. Therefore, compared with the conventional organic EL device, the organic EL device further suppresses deterioration of luminescent characteristics due to moisture absorption. In addition, since the curable composition for a sealant used in the organic EL device of the present invention has excellent curability at room temperature, it is not necessary to perform high-temperature heating during hardening, and in the organic EL device. The organic light-emitting layer does not induce deterioration due to heating. In the present invention, an organic 201141935 EL display device including the organic EL element and an organic EL illumination device including the same are also suitable. In the organic EL display device and the organic EL illumination device, the organic EL device also has an excellent maintenance organic light-emitting layer in the organic EL display device and the organic EL illumination device, as compared with the above-described conventional organic EL device. Luminous characteristics. The curable composition for a sealant of the present invention, which comprises: [A] a compound having an epoxy group, [B] a photocationic polymerization initiator, and [C] having a particle diameter of 30 μτη or more and a particle diameter distribution frequency. The highest enthalpy is inorganic particles of 30 μm or more and 1,000 μm or less. In addition to the [Α] compound and the [Β] photocationic polymerization initiator, the curable composition for the sealant also contains inorganic fine particles having a large particle diameter as the [C] inorganic particles. Therefore, in the cured product formed of the curable composition for a sealant, the inorganic particles can have high water vapor barrier properties and exhibit excellent low moisture permeability. Further, in the curable composition for a sealant, the [C] inorganic particles exhibit a function as a spacer by adjusting the particle diameter. Further, the '[C] inorganic particles have excellent cell gap controllability due to small particle size variation due to heat addition in the device manufacturing process and the like. That is, the thickness of the cell gap between the substrates can be accurately adjusted and controlled to a desired thickness. In addition to the effects of the above, the curable composition for a sealant can exhibit excellent adhesion and coating properties by having the above respective components. The highest 値 of the particle size distribution frequency of the [C] inorganic particles is preferably 3 〇〇 μπ1 or more and 600 μηι or less. By setting the highest 値 of the particle size distribution frequency of the [c] inorganic particles to 201141935 as the above range, the uniformity of the inorganic particles in the composition will be improved, and the adhesion and coating properties will be further improved, and at the same time, the obtained Hardening; the low moisture permeability of the material is improved. The curable composition for a sealant preferably further contains plate-shaped metal oxide particles having a [D] particle diameter of less than 30 μm (hereinafter also referred to as "[D] plate-like metal oxide particles"). According to the curable composition for a sealant, the [D] plate-shaped metal oxide particles are superposed to form a laminated structure, and the laminated structure can prevent the permeation of water vapor or the like. Therefore, according to the curable composition for a sealant, it is possible to form a hard compound having more excellent low moisture permeability. [Β] The photocationic polymerization initiator is preferably a key salt having an anion free from ruthenium or arsenic. By using such a photocationic polymerization initiator, the hardenability of the curable composition for the sealant is further improved. Further, since the photocationic polymerization initiator does not contain barium or arsenic, it is low in toxicity to humans and can be used safely. The compound having an epoxy group of the compound preferably contains: (Α-1) a compound having an epoxy group having a molecular weight of 500 or less (hereinafter also referred to as "(Α-1) compound)"); -2) an epoxy group-containing compound having a weight average molecular weight (Mw) of more than 500 and 5,000 or less as measured by a gel permeation chromatography in terms of polystyrene (hereinafter, also referred to as "( A-2) Compound ")" [A] is a compound of high molecular weight 201141935 epoxy compound (A- when two kinds of epoxy compounds having different molecular weights are used to harden the sealant with a curable composition. 2) In the gap of the crosslinked network structure formed by the compound, a low molecular weight epoxy compound (A-1) compound is polymerized to form a dense crosslinked structure. Therefore, the low moisture permeability of the cured product obtained from the curable composition for the sealant is particularly noticeable. Here, the "particle size distribution" is a histogram showing the relationship between the particle diameter of the particles and the number of frequencies thereof. In addition, the term "plate-shaped j-particles" refers to flat-shaped particles having substantially parallel surfaces on the surface of the particles. However, it is not strictly assumed that the two surfaces are formed in accordance with a plane, and for example, the surface may have irregularities or the like. According to the present invention, it is possible to provide a curable composition for an encapsulant having excellent adhesion and coating properties and having a cured product having excellent low moisture permeability and cell gap control property, and hardened by the sealant. An organic EL device, an organic EL display device, and an organic EL illumination device, which are sealed by a composition. The present invention is an organic EL device characterized by an organic EL device having an organic light-emitting layer, which is sealed by In the present invention, an organic EL display device including the organic EL device and an organic EL illumination device including the organic EL device are also preferably used. Hereinafter, the encapsulant will be described in detail below. The curable composition, the components of the curable composition for the sealant, the organic EL device, and the organic EL display device including the organic EL device, An organic EL illuminating device for an organic EL device. 201141935 <The curable composition for a sealant> The curable composition for a sealant of the present invention contains [A] a compound, [B] a photocationic polymerization initiator, and [ C] Inorganic particles. The preferred component contains [D] plate-like metal oxide particles. Further, other components may be contained in the range which does not impair the effects of the present invention. [A] A compound having an epoxy group > [A] A compound having at least one epoxy group in one molecule, and a conventional compound can be used. [A] The compound is at normal temperature and pressure. In the present invention, the epoxy group has a cyclic ether structure, and the cyclic ether structure has a three-membered ring, a four-membered ring, a five-membered ring, and the like. The composition of the present invention is cured by irradiation with light by containing the compound [A]. The compound used in the present invention can be classified into a compound having an epoxy group (A-1) having a molecular weight of 500 or less. Gel permeation chromatography and polystyrene conversion The compound (A-2) having an epoxy group having a Mw of 500 or more and 5,000 or less and the other compound having an epoxy group having Mw exceeding 5,000 can be used alone (A-1). The compound, the compound (A-2), and other compounds having an epoxy group, or a combination of two, preferably contain the compound (A-1) and the compound (A-2). In this manner, [A] The compound is obtained by using two kinds of epoxy compounds having different molecular weights in the gap of the crosslinked network structure formed by the high molecular weight epoxy compound (A-2) 201141935 when the sealant is cured with the curable composition. The low molecular weight epoxy compound (A-1) compound is polymerized to form a dense crosslinked structure. Therefore, as described above, the low moisture permeability of the cured product obtained by using the curable composition for a sealant is improved by using two kinds of epoxidized compounds. The effect of using such a compound having two kinds of epoxy groups is particularly remarkable in the case of a high temperature in which molecular motion becomes active. The low moisture permeability of the cured product at a high temperature is particularly effectively enhanced. Further, from the viewpoint of low moisture permeability after hardening, the blending ratio of the compound (A-2) is preferably from 20 to 100 parts by mass, based on the total amount of the compound [A], 10 parts by mass, particularly preferably It is 30 to 60 parts by mass. The compound (A-1) is exemplified by a compound having a three-membered ring epoxy group (ethylene oxide group) having a molecular weight of 500 or less, or a compound having a four-membered epoxy group (glycidyl group). These components are preferably selected as appropriate according to the use, and from the viewpoint of reactivity, a compound having a three-membered epoxy group is preferred; from the viewpoint of preservation stability, it is preferred to have a four-membered epoxy group ( A compound of epoxy propylene. The compound having the above three-membered epoxy group may, for example, be an aliphatic compound having a three-membered epoxy group or a lipid having a three-membered epoxy group. Can wait for it. , alkyl ether, etc. such as propyl such as ft ft 例 , 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧'1 methoxy 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 、 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾 罾4-Alkene-manufacturing device 1, two-family group: pentyl-containing new article -10- 201141935 Example: SR-NPG, SR-ΤΜΡ (above, manufactured by Sakamoto Pharmaceutical Co., Ltd.). The alicyclic compound having the above three-membered epoxy group may, for example, be 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, 2 (3, 4-epoxycyclohexyl_5,5-spiro-3,4-epoxy) cyclohexane m-dioxane, bis(3,4-epoxycyclohexylmethyl) adipate, bis (3, 4-epoxy-6-methylcyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexyl-3',4, epoxy-6'-methylcyclohexanecarboxylate Acid ester, ε-caprolactone modified-3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, trimethylcaprolactone modified-3,4 - Epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, β-methyl-δ-valerolactone modified-3,4-epoxycyclohexylmethyl-3',4 '-epoxycyclohexane carboxylate, ethylene di(3,4-epoxycyclohexylmethyl) ether, ethyl bis(3,4·epoxycyclohexanecarboxylate), Epoxycyclohexahydrophthalic acid dioctyl ester, epoxycyclohexahydrophthalic acid di-2-ethylcyclohexyl ester, methylene bis(3,4-epoxycyclohexane) and the like. A commercially available product of a three-membered epoxy group alicyclic compound can be exemplified by: ADEKA RESIN EP-408 5S, ADEKA RESIN EP-408 8 S (above, manufactured by ADEKA); Celoxide 202 1, Celoxide 202 1P ' Celoxide 208 1, Celoxide 208 3, Celoxide 2085, Epolead GT-3 00, Epolead GT-301, Epolead GT-302, Epolead GT-400, Epolead GT-401, Epolead GT-403 (above, Dai cel Chemical Industry) )Wait. The aromatic compound having a three-membered epoxy group may, for example, be a compound having an aromatic ring structure in the skeleton and having two or more three-membered epoxy groups. The aromatic ring structure of such a compound may, for example, be a bisphenol A type structure, a bisphenol F type structure, a naphthalene skeleton or the like. An aromatic compound having a three-membered epoxy group • 11·201141935, for example, 'exemplified··bis(4·epoxypropylphenoxy)methane, bis(4-epoxypropylphenoxy)ethane , bis(4-epoxypropylnaphthyloxy)methane, bis(4-epoxypropylnaphthyloxy)ethane, and the like. A commercially available product of an aromatic compound having a three-membered epoxy group may, for example, be YL980 or YL983U (manufactured by Japan Epoxy Resi?) or the like. The compound having a four-membered epoxy group (epoxypropyl group) may, for example, be a compound having one or two or more propylene oxide groups in the molecule. A compound having one propylene oxide group, for example, may be exemplified by 3-ethyl-3-hydroxymethyl propylene oxide, 3-(methyl) propylene oxymethyl-3-ethyl epoxide, (3-ethyl-3-epoxypropyl methoxy)methylbenzene, 4-fluoro-[1-(3-ethyl-3-cyclopropanemethoxy)methyl]benzene, 4-methyl Oxy-[1·(3-ethyl-3-epoxypropanemethoxy)methyl]benzene, [1-(3-ethyl-3-epoxypropane methoxy)ethyl]phenyl ether , isobutoxymethyl (3-ethyl-3-epoxypropane methyl) ether, isodecyloxyethyl (3-ethyl-3-epoxypropane methyl) ether, isodecyl (3 -ethyl-3-epoxypropane methyl)ether, 2-methylhexyl (3-ethyl-3-epoxypropanemethyl)ether, 2-ethylhexyl (3-ethyl-3-epoxy) Propane methyl)ether, ethyldiethylene glycol (3-ethyl-3-epoxypropanemethyl)ether, dicyclopentadiene (3-ethyl-3-epoxypropanemethyl)ether, two Cycloheptene oxyethyl (3-ethyl-3-epoxypropane methyl) ether, dicycloheptenyl (3-ethyl-3-epoxypropane methyl) ether, tetrahydrofuranyl (3-ethyl - 3-epoxypropane methyl)ether, tetrabromophenyl (3-ethyl-3-epoxypropyl) Methyl)ether, 2-tetrabromophenoxyethyl (3-ethyl-3-epoxypropanemethyl)ether, tribromophenyl (3-ethyl-3-epoxypropanemethyl)ether, 2 -Tribromophenoxyethyl (3-ethyl-3-epoxypropane methyl) ether, 2. hydroxyethyl (3-ethyl-3-epoxypropane methyl) ether, 2-hydroxy-12- 201141935 Propyl (3-ethyl-3-epoxypropyl) methyl ether, butoxypropyl (3_ethyl_3_epoxypropyl methyl) acid, pentachlorophenyl (3-ethyl) -3 - epoxy propylene compound methyl) acid, pentabromophenyl (3-ethyl-3-epoxypropane methyl) ether, decyl (3_ethyl-3-propylene oxide methyl) ether Wait. A compound having two or more epoxy-propylene groups, for example, 3,7-bis(3-epoxypropyl)-5-side oxygen-壬院, ι,4_双[(3 - B) 3-Benzene oxide methoxy)methyl]benzene, 1,2-bis[3-ethyl epoxide methoxy)methyl]ethane, 1,2-bis[3-ethyl- 3-epoxypropane methoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-epoxypropanemethyl)ether, dicyclopentenyl bis(3_ethyl-3-epoxy) Propane methyl)ether, triethylene glycol bis(3_ethyl-3-propylene oxide methyl)ether, tetraethyl alcohol bis(3-ethyl-3-epoxypropanemethyl)ether, tricyclic Decanediyldimethylene bis(3-ethyl-3-epoxypropanemethyl)ether, z-yl-3-epoxypropane methoxy)methyl]butane, 1>6_double[( 3_Ethyl_3 epoxy propylene methoxy) methyl] hexanyl, 3-ethyl-3_{[(3_ethyl propylene oxide-3 yl) methoxy] methyl} epoxy Propane, etc. (A-2) The compound can be a two-membered ring, a four-membered ring, and a five-component polymer having a Mw of 500 or more and 5 or less by a gel permeation chromatograph. A compound having an epoxy group such as a ring. The compound having a three-membered ring epoxy group is preferred from the viewpoint of the same reactivity with the (A - 1 ) α substance; and a compound having a four-membered ring epoxy group is preferred from the viewpoint of preservation stability.

Mw爲500以上、5,000以下聚合物之具有三員環環氣 基之化合％’例如’可舉例：聚乙二醇二環氧丙基醚類； -13- 201141935 聚丙二醇二環氧丙基醚類；脂肪族長鏈二鹽基酸之二環氧 丙基酯類；脂肪族高級醇之單環氧丙基醚類；高級脂肪酸 之環氧丙基酯類；環氧化大豆油；環氧硬脂酸丁酯；環氧 硬脂酸辛酯；環氧化亞麻仁油；環氧化聚丁二烯：雙酚A 型環氧樹脂；雙酚F型環氧樹脂；雙酚A型酚醛型環氧樹 脂等之酚酚醛型環氧樹脂；甲酚酚醛型環氧樹脂；聚酚型 環氧樹脂；環狀脂肪族環氧樹脂；含有聯苯構造之環氧樹 脂；環氧化亞麻仁油等。此等之化合物之中，從具有高的 硬化性之觀點，較佳爲酚酚醛型環氧樹脂、聚酚型環氧樹 脂、環狀脂肪族環氧樹脂及含有聯苯構造之環氧樹脂。例 如，市售品可舉例：雙酚A型環氧樹脂之Epi coat 1001、 Epicoat 1002' Epicoat 1002、 Epicoat 1003、 Epicoat 1004 、 Epicoat 1007' Epicoat 1009、 Epicoat 1010、 Epicoat 828(以 上，Japan Epoxy Resin製）；雙酣F型環氧樹脂之Epicoat 807(Japan Epoxy Resin製）；酹酌酸型環氧樹脂（雙酣A酣 酸型環氧樹脂等）之 Epicoat 152、Epicoat 154、Epicoat 157S65(以上，Japan Epoxy Resin 製）；EPPN201、EPPN 20 2(以上，日本化藥製）；甲酚酚醛型環氧樹脂之 EOCN 102、EOCN 1 03 S ' EOCN104S、1020、1025、1027(以上， 日本化藥製）；Epicoat 180S75(Japan Epoxy Resin 製）；聚 酣型環氧樹脂之 Epicoat 1032H60、Epicoat XY-4000(以 上，Japan Epoxy Resin製）；環狀脂肪族環氧樹脂之 XD- 1 000(日本化藥製）；含有聯苯構造之環氧樹脂之 -14- 201141935 NC-3000、NC-3100(以上，日本化藥製）等。 另外，Mw爲500以上且5,000以下之聚合物的具有環 氧丙基之化合物，例如，可舉例：聚乙二醇雙（3 -乙基-3-環氧丙烷甲基）醚碳酸酯雙環氧丙烷、二甲苯雙環氧丙烷、 己二酸酯雙環氧丙烷、對苯二甲酸酯雙環氧丙烷、環己烷 二羧酸雙環氧丙烷等。例如，此等之市售品可舉例： OXT-121、〇XT-221(以上，東亞合成製）、OXBP(宇部興產 製）等。 < [Β]光陽離子聚合起始劑> 若[Β]光陽離子聚合起始劑爲藉光照射而使[Α]化合物 之陽離子聚合者的話，並無特別之限定，例如，鎗鹽或鐵-丙二烯錯合物、二茂鈦錯合物、芳基矽烷醇-鋁錯合物等之 有機金屬錯合物類等，能夠使用習知者，從硬化性之觀點， 適宜使用二苯基鎭鑰鹽、三苯基毓鹽、锍鹽、苯并噻唑鐵 鹽、銨鹽、鏑鹽、四氫噻吩鑰鹽、二苯基（4-(苯硫基）苯基） 銃鹽等之鎗鹽。鑰鹽係由源自鑰陽離子與路易士酸之陰離 子所構成。 鑰鹽之陰離子，較佳爲例如四氟硼酸鹽、參（2，6-二氟 苯基）硼酸鹽 '六氟膦酸鹽、氟化烷基氟磷酸陰離子、三氟 甲烷磺酸鹽、三氟醋酸鹽、對甲苯磺酸鹽、樟腦磺酸、三 氟參（五氟乙基）磷酸鹽等。 二苯基碘鹽可舉例：例如四氟硼酸二苯基鎮鹽、六氟 膦酸二苯基鎭鹽、三氟甲烷磺酸二苯基鐫鹽、三氟醋酸二 -15- 201141935 苯基鎭鹽、對甲苯磺酸二苯基錤鹽、丁基參（2,6-二氟苯基） 硼酸二苯基碘鹽、四氟硼酸-4-甲氧基苯基苯基錤鑰鹽、四 氟硼酸雙（4-三級丁基苯基）碘鹽、三氟甲烷磺酸雙（4-三級 丁基苯基）鎭鹽、三氟醋酸雙（4-三級丁基苯基）鎮鹽、對甲 苯磺酸雙（4_三級丁基苯基）鎭鹽、樟腦磺酸雙（4-三級丁基 苯基）鐄等。 三苯基鏑鹽可舉例：例如三氟甲烷磺酸三苯基锍鹽、 樟腦磺酸三苯基毓鹽、四氟硼酸三苯基鏡鹽、三氟醋酸三 苯基毓鹽、對甲苯磺酸三苯基錡鹽、丁基三（2,6-二氟苯基） 硼酸三苯基锍鹽等。 毓鹽可舉例：例如烷基锍鹽、苄基锍鹽、二苄基锍鹽、 取代苄基锍鹽等。 烷基錡鹽可舉例：例如六氟銻酸-4-乙醯苯基二甲基锍 鹽、六氟砷酸-4-乙醯氧苯基二甲基锍鹽、六氟銻酸二甲基 -4-(苄氧羰氧基）苯基锍鹽、六氟銻酸二甲基- 4-(苄氧基）苯 基锍鹽、六氟砷酸二甲基-4-(苄氧基）苯基锍鹽、六氟銻酸 二甲基-3-氯-4-乙醯氧苯基锍鹽等。 苄基噻唑鹽可舉例：例如六氟磷酸苄基-4-羥基苯基甲 基鏑鹽、六氟磷酸-4-甲氧苄基-4-羥基苯基甲基锍鹽等。 二苄基噻唑鹽可舉例：例如六氟磷酸二苄基-4-羥基苯 基锍鹽、六氟砷酸二苄基-3-氯-4-羥基苯基鏑鹽、六氟磷酸 苄基-4-甲氧苄基-4-羥基苯基锍鹽等。 取代苄基锍鹽可舉例：例如六氟銻酸-4-氯苄基-4-羥基 -16- 201141935 苯基锍鹽、六氟銻酸-4-硝基苄基-4-羥基苯基毓鹽、六氟磷 酸-4-氯苄基-4 -羥基苯基甲基錡鹽、六氟銻酸-4_硝基苄基 -3 -甲基-4-羥基苯基甲基毓鹽、六氟銻酸·3,5_二氯苄基_4_ 羥基苯基甲基锍鹽 '六氟銻酸-2-氯苄基-3-氯-4-羥基苯基 甲基锍鹽等。 苯并噻唑鑰鹽可舉例：例如六氟銻酸-3-苄基苯并噻唑 鑰鹽、六氟磷酸-3-苄基苯并噻唑鑰鹽、四氟硼酸-3_苄基苯 并噻唑鐵鹽、六氟銻酸-3-(4 -甲氧基苄基）苯并噻唑鑰鹽、A compound having a Mw of 500 or more and 5,000 or less having a three-membered ring-ring gas group, for example, may be exemplified by polyethylene glycol diepoxypropyl ether; -13- 201141935 Polypropylene glycol diepoxypropyl ether Classes; diepoxypropyl esters of aliphatic long-chain dibasic acids; monoepoxypropyl ethers of aliphatic higher alcohols; glycidyl esters of higher fatty acids; epoxidized soybean oil; epoxy stearin Butic acid ester; octyl epoxy stearate; epoxidized linseed oil; epoxidized polybutadiene: bisphenol A type epoxy resin; bisphenol F type epoxy resin; bisphenol A type phenolic epoxy resin Phenolic novolac type epoxy resin; cresol novolac type epoxy resin; polyphenol type epoxy resin; cyclic aliphatic epoxy resin; epoxy resin containing biphenyl structure; epoxidized linseed oil. Among these compounds, from the viewpoint of having high curability, a phenol novolak type epoxy resin, a polyphenol type epoxy resin, a cyclic aliphatic epoxy resin, and an epoxy resin containing a biphenyl structure are preferable. For example, commercially available products can be exemplified by Epicoat 1001, Epicoat 1002' Epicoat 1002, Epicoat 1003, Epicoat 1004, Epicoat 1007' Epicoat 1009, Epicoat 1010, Epicoat 828 (above, Japan Epoxy Resin) of bisphenol A type epoxy resin. ); Epicoat 807 (made by Japan Epoxy Resin) of double-type F-type epoxy resin; Epicoat 152, Epicoat 154, Epicoat 157S65 (above, depending on the acid type epoxy resin (double bismuth A phthalic acid type epoxy resin, etc.) Japan Epoxy Resin system; EPPN201, EPPN 20 2 (above, manufactured by Nippon Kasei Co., Ltd.); EOCN 102, EOCN 1 03 S ' EOCN104S, 1020, 1025, 1027 of cresol novolac type epoxy resin (above, manufactured by Nippon Kayaku Co., Ltd.) ); Epicoat 180S75 (manufactured by Japan Epoxy Resin); Epicoat 1032H60, Epicoat XY-4000 (above, manufactured by Japan Epoxy Resin) of polyfluorene epoxy resin; XD-1 000 of cyclic aliphatic epoxy resin (Japanese chemical) ()) - Epoxy resin containing biphenyl structure - 201141935 NC-3000, NC-3100 (above, manufactured by Nippon Kasei Co., Ltd.). Further, a compound having a glycidyl group of a polymer having a Mw of 500 or more and 5,000 or less, for example, a polyethylene glycol bis(3-ethyl-3-epoxypropanemethyl)ether carbonate double ring Oxypropane, xylene dipropylene oxide, adipate dipropylene oxide, terephthalate dipropylene oxide, cyclohexane dicarboxylic acid dipropylene oxide, and the like. For example, such commercially available products can be exemplified by OXT-121, 〇XT-221 (above, manufactured by Toagosei Co., Ltd.), OXBP (Ube Industries, Ltd.), and the like. <[Β] Photocationic polymerization initiator] If the [Β] photocationic polymerization initiator is a cationic polymerization of a [Α] compound by light irradiation, for example, a gun salt or An organic metal complex such as an iron-propadiene complex, a ferrocene complex, or an aryl stanol-aluminum complex can be used, and it is suitable to use two from the viewpoint of hardenability. Phenyl hydrazone salt, triphenyl sulfonium salt, sulfonium salt, benzothiazole iron salt, ammonium salt, sulfonium salt, tetrahydrothiophene key salt, diphenyl (4-(phenylthio)phenyl) sulfonium salt, etc. The gun salt. The key salt consists of an anion derived from a key cation and a Lewis acid. The anion of the key salt is preferably, for example, tetrafluoroborate, ginseng (2,6-difluorophenyl) borate 'hexafluorophosphonate, fluorinated alkyl fluorophosphate anion, trifluoromethanesulfonate, three Fluoroacetate, p-toluenesulfonate, camphorsulfonic acid, trifluoromethane (pentafluoroethyl) phosphate, and the like. The diphenyl iodide salt can be exemplified by, for example, diphenyl sulfonium tetrafluoroborate, diphenyl sulfonium hexafluorophosphonate, diphenyl sulfonium trifluoromethanesulfonate, difluoroacetic acid di-15-201141935 phenylhydrazine. Salt, diphenylsulfonium p-toluenesulfonate, diphenyliodonium salt of butyl ginate (2,6-difluorophenyl)borate, 4-methoxyphenylphenylphosphonium tetrafluoroborate, four Bis(4-tributylphenyl)iodonium fluoroborate, bis(4-tributylphenyl)phosphonium trifluoromethanesulfonate, bis(4-tert-butylphenyl)trifluoroacetate Salt, bis(4-tributylphenyl)phosphonium p-toluenesulfonate, bis(4-tributylphenyl)phosphonium camphorsulfonate, and the like. The triphenylsulfonium salt can be exemplified by, for example, triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium salt of camphorsulfonate, triphenylphosphonium tetrafluoroborate, triphenylsulfonium trifluoroacetate, p-toluenesulfonate. Triphenyl phosphonium salt, triphenylsulfonium butyl tris(2,6-difluorophenyl)borate, and the like. The onium salt can be exemplified by, for example, an alkyl phosphonium salt, a benzyl phosphonium salt, a dibenzyl phosphonium salt, a substituted benzyl phosphonium salt, or the like. The alkyl phosphonium salt can be exemplified by, for example, hexafluoroantimonate-4-ethenyl phenyl dimethyl sulfonium salt, hexafluoroarsenic acid-4-ethenyloxy phenyl dimethyl sulfonium salt, hexafluoroantimonic acid dimethyl -4-(Benzyloxycarbonyloxy)phenylphosphonium salt, dimethyl-4-(benzyloxy)phenylphosphonium hexafluoroantimonate, dimethyl-4-(benzyloxy) hexafluoroarsenate Phenyl sulfonium salt, dimethyl-3-chloro-4-ethenyloxyphenyl sulfonium hexafluoroantimonate or the like. The benzylthiazole salt can be exemplified by, for example, benzyl-4-hydroxyphenylmethylphosphonium hexafluorophosphate, 4-methoxybenzyl-4-hydroxyphenylmethylphosphonium hexafluorophosphate, and the like. The dibenzylthiazole salt can be exemplified by, for example, dibenzyl-4-hydroxyphenylphosphonium hexafluorophosphate, dibenzyl-3-chloro-4-hydroxyphenylphosphonium hexafluoroarsenate, benzyl hexafluorophosphate- 4-methoxybenzyl-4-hydroxyphenyl phosphonium salt and the like. The substituted benzyl sulfonium salt can be exemplified by, for example, hexafluoroantimonate-4-chlorobenzyl-4-hydroxy-16- 201141935 phenyl sulfonium salt, hexafluoroantimonate-4-nitrobenzyl-4-hydroxyphenyl hydrazine Salt, hexafluorobenzyl-4-chlorobenzyl-4-hydroxyphenylmethyl phosphonium salt, hexafluoroantimonic acid-4_nitrobenzyl-3-methyl-4-hydroxyphenylmethyl phosphonium salt, six Fluoric acid · 3,5-dichlorobenzyl_4_hydroxyphenylmethyl phosphonium salt hexafluoroantimonate-2-chlorobenzyl-3-chloro-4-hydroxyphenylmethyl phosphonium salt and the like. The benzothiazole salt can be exemplified by, for example, hexafluoroantimonate-3-benzylbenzothiazole salt, hexafluorophosphoric acid-3-benzylbenzothiazole salt, and tetrafluoroboric acid-3-benzylbenzothiazole iron. Salt, hexafluoroantimonate-3-(4-methoxybenzyl)benzothiazole key salt,

I 六氟銻酸-3-爷基-2-甲硫基苯并噻哩鎗鹽、六氟鍊酸-3_节 基-5-氯苯并噻唑鑰鹽等。 . 銨鹽可舉例：例如四氟硼酸四丁基銨鹽、六氟磷酸四 丁基銨鹽、硫酸氫四丁基銨鹽、四氟硼酸四乙基銨鹽、對 甲苯磺酸四乙基銨鹽、六氟銻酸-Ν，Ν_二甲基-N — 苄基苯銨 鹽、四氟硼酸-Ν,Ν-二甲基-Ν-苄基苯銨鹽、六氟銻酸-Ν,Ν_ 二甲基-Ν-苄基吡啶鑰鹽、三氟甲烷硫酸-Ν，Ν-二乙基-Ν-苄 基吡啶鑰鹽、六氟銻酸-Ν,Ν-二甲基-Ν-(4-甲氧基苄基）吡啶 鑰鹽、六氟銻酸-Ν，Ν-二乙基- Ν- (4 -甲氧基苄基）甲苯銨鹽 等。 锍鹽可舉例：例如六氟銻酸乙基三苯基毓鹽、六氟銻 酸四丁基锍鹽等。 四氫噻吩鎩鹽可舉例：例如三氟甲烷硫酸正丁氧 基萘-1-基）四氫噻吩鑰鹽、九氟正丁烷硫酸_丨_ (4-正丁氧基 萘-1-基）四氫噻吩鑰鹽、1，1，2,2 -四氟-2-(莰烷-2-基）乙烷硫 -17- 201141935 酸-1-(4-正丁氧基萘-1·基）四氫噻吩鑰鹽、2-(5 -三級丁氧基 羰氧基雙環[2.2.1]庚院-2-基）-1,1,2,2-四氟乙烷硫酸-1-(4- 正丁氧基萘-1-基）四氫噻吩鎗鹽、2-(5 -三級丁氧基羰氧基 雙環[2.2.1]庚院-2-基）-1，1，2,2-四氟乙院硫酸- 正丁氧 基萘-1-基）四氣噻吩鎩鹽、三氟甲院擴酸_1_(4,7-±1 丁氧基 -1-萘基）四氫噻吩鑰鹽等。 一苯基（4_(苯硫基）苯基）毓鹽可舉例：例如六氟膦酸二 苯基（4-(苯硫基）苯基）統鹽、三氟三（五氟乙基）隣酸二苯基 (4-(苯硫基）苯基）毓鹽、具有氟化烷基氟磷酸陰離子之二苯 基（4-(苯硫基）苯基）鏑鹽（CPI-210S、SanApro製）等。 從硬化性之觀點，於此等之光陽離子聚合起始劑中， 較佳爲三氟甲烷磺酸三苯基銃鹽、樟腦磺酸三苯基銃鹽、 六氟磷酸苄基_4·羥基苯基甲基毓鹽、三氟甲烷磺酸-1-(4，7_ 二丁氧基-1-萘基）四氫噻吩鑰鹽、六氟膦酸二苯基（4-(苯硫 基）苯基）锍鹽、三氟三（五氟乙基）磷酸二苯基（4-(苯硫基） 苯基）毓鹽、具有氟化烷基氟磷酸陰離子之二苯基（4-(苯硫 基）苯基）锍鹽（CPI-210S、SanApro 製）。 另外，從硬化特性之觀點，於習知之熱硬化型樹脂組 成物或光硬化組成物之感熱性或感放射線性聚合起始劑 中，大多數使用含有砷或銻之化合物。然而，由於含有砷 或銻之化合物對人體具有毒性而期望不使用。 [B]光陽離子聚合起始劑能夠單獨使用或混合二種以 上而使用。相對於[A]化合物100質量份，[B]光陽離子聚 -18 - 201141935 合起始劑之使用比例較佳爲〇 · 1至1 〇質量份，更_佳爲1至 5質量份。藉由將[Β]光陽離子聚合起始劑之使用比例設爲 上述範圍，能夠使該密封劑用硬化性組成物之硬化性提高。 < [C ]無機粒子〉 於該密封劑用硬化性組成物中所含有之[C]無機粒子 係粒徑爲3 Ο μιη以上，粒徑分布頻率的最高値爲3 Ο μπι以 上且1，000 μπι以下之無機粒子。於該密封劑用硬化性組成 物中，由於[C]無機粒子係含有具有較大粒徑的無機粒子， 於所獲得之硬化物中，此無機粒子具有高的水蒸氣遮斷 性，能夠發揮低透濕性。 另外’根據該密封劑用硬化性組成物，由於[C ]無機粒 子係含有無機粒子’能夠成爲密封此無機粒子之基板間的 間隙物。還有’由於作爲此間隙物之[C ]無機粒子係無機 物，與塑膠製之間隙物作一比較，因元件製造程序中之熱 附加等所造成的粒徑變動小，另外，具備優異的強度。因 而’根據該密封劑用硬化性組成物，於作爲基板間之密封 劑使用之際’能夠成爲所期望的單元間隙厚度的方式來正 確地控制單元間隙之厚度而密封。 [C]無機粒子能夠使用例如作爲無機塡料所用者，可舉 例：氧化物粒子、玻璃粒子、金屬粒子等。 上述氧化物粒子’例如，可舉例：氧化矽、氧化鋁' 氧化鉻、氧化鎂、氧化鈦、氧化錫、氧化铈、氧化鋅等之 粒子。 •19- 201141935I hexafluoroantimonate-3-aryl-2-methylthiobenzothiazide gun salt, hexafluorochain acid-3_pyringyl-5-chlorobenzothiazole key salt and the like. The ammonium salt can be exemplified by, for example, tetrabutylammonium tetrafluoroborate, tetrabutylammonium hexafluorophosphate, tetrabutylammonium hydrogen sulfate, tetraethylammonium tetrafluoroborate, tetraethylammonium p-toluenesulfonate. Salt, hexafluoroantimonic acid-hydrazine, hydrazine-dimethyl-N-benzyl benzoammonium salt, tetrafluoroboric acid-hydrazine, hydrazine-dimethyl-indole-benzyl benzoammonium salt, hexafluoroantimonic acid-hydrazine, Ν_Dimethyl-indole-benzyl pyridyl salt, trifluoromethanesulfate-ruthenium, Ν-diethyl-fluorene-benzyl pyridyl salt, hexafluoroantimonic acid-hydrazine, hydrazine-dimethyl-hydrazine-( 4-methoxybenzyl)pyridine salt, hexafluoroantimonic acid-hydrazine, hydrazine-diethyl-fluorene-(4-methoxybenzyl)toluene ammonium salt, and the like. The onium salt can be exemplified by, for example, ethyltriphenylphosphonium hexafluoroantimonate, tetrabutylphosphonium hexafluoroantimonate or the like. The tetrahydrothiophene sulfonium salt can be exemplified by, for example, n-butoxynaphthalene-1-yl)trifluorothiophene sulphate, nonafluorobutane sulphate _丨_(4-n-butoxynaphthalen-1-yl) Tetrahydrothiophene key salt, 1,1,2,2-tetrafluoro-2-(decane-2-yl)ethanesulfide-17- 201141935 Acid-1-(4-n-butoxynaphthalene-1· Tetrahydrothiophene key salt, 2-(5-tris-butoxycarbonyloxybicyclo[2.2.1]heptan-2-yl)-1,1,2,2-tetrafluoroethane sulfate-1 -(4-n-butoxynaphthalen-1-yl)tetrahydrothiophene gun salt, 2-(5-tris-butoxycarbonyloxybicyclo[2.2.1]heptan-2-yl)-1,1 , 2,2-tetrafluoroethane, sulfuric acid-n-butoxynaphthalen-1-yl) tetra-thiophene sulfonium salt, trifluoromethane, acid extension _1_(4,7-±1 butoxy-1-naphthyl ) tetrahydrothiophene key salt and the like. The monophenyl(4-(phenylthio)phenyl)phosphonium salt can be exemplified by, for example, diphenyl(4-(phenylthio)phenyl) hexafluorophosphonate, trifluorotris(pentafluoroethyl)o- Diphenyl (4-(phenylthio)phenyl)phosphonium salt, diphenyl (4-(phenylthio)phenyl)phosphonium salt with fluorinated alkyl fluorophosphate anion (CPI-210S, manufactured by SanApro) )Wait. From the viewpoint of hardenability, among these photocationic polymerization initiators, triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium salt of camphorsulfonate, and benzyl-4cyclohexyl phosphate are preferred. Phenylmethyl phosphonium salt, 1-(4,7-dibutoxy-1-naphthyl)tetrahydrothiophene key salt of trifluoromethanesulfonate, diphenyl (4-(phenylthio)) hexafluorophosphonate Phenyl) phosphonium salt, triphenyltris(pentafluoroethyl)phosphoric acid diphenyl(4-(phenylthio)phenyl)phosphonium salt, diphenyl (4-(benzene) with fluorinated alkyl fluorophosphate anion Thio)phenyl)phosphonium salt (CPI-210S, manufactured by SanApro). Further, from the viewpoint of the hardening property, most of the thermosensitive or radiation-sensitive polymerization initiators of the conventional thermosetting resin composition or photohardenable composition are compounds containing arsenic or antimony. However, since a compound containing arsenic or antimony is toxic to the human body, it is expected not to be used. [B] The photocationic polymerization initiator can be used singly or in combination of two or more. The use ratio of the [B] photocationic poly-18 - 201141935 starting agent is preferably 〇 1 to 1 〇 by mass, more preferably 1 to 5 parts by mass, based on 100 parts by mass of the [A] compound. By using the ratio of the use ratio of the [Β] photocationic polymerization initiator to the above range, the curability of the curable composition for the sealant can be improved. <[C] Inorganic particles> The particle size of the [C] inorganic particles contained in the curable composition for a sealant is 3 Ο μηη or more, and the highest 粒径 of the particle size distribution frequency is 3 Ο μπι or more and 1, Inorganic particles below 000 μπι. In the curable composition for a sealant, the [C] inorganic particles contain inorganic particles having a large particle diameter, and the inorganic particles have high water vapor barrier properties in the obtained cured product, and can exhibit Low moisture permeability. Further, according to the curable composition for a sealant, the [C] inorganic particle-containing inorganic particles can be used as a spacer between the substrates for sealing the inorganic particles. In addition, the [C] inorganic particle-based inorganic material as the spacer is compared with the spacer made of plastic, and the particle diameter variation due to heat addition in the component manufacturing process is small, and excellent strength is obtained. . Therefore, the thickness of the cell gap can be accurately controlled and sealed according to the thickness of the cell gap when the sealant for the sealant is used as a sealant between the substrates. The inorganic particles can be used, for example, as an inorganic pigment, and examples thereof include oxide particles, glass particles, and metal particles. The oxide particles 'for example, for example, particles such as cerium oxide, aluminum oxide chromic oxide, magnesium oxide, titanium oxide, tin oxide, cerium oxide, or zinc oxide. •19- 201141935

上述玻璃粒子， 例如， 可舉例：（l)Bi203-Zn0-B2 〇3系 (2)Bi2〇3-Si〇2-B2〇3 系、 (3)Bi2〇3-Si〇2-B2〇3-Li2〇 系、 (4)Bi2〇3-Si〇2-B2〇3- Na2 0 系、（5)Bi203 -Si02-B203 -K20 系 (6)Bi2〇3-Si〇2-Li2〇 系 、 (7)Bi203-Si〇2-Na20 系 、 (8)Bi2〇3-Si〇2-K2〇 系、 (9)Bi2〇3~Si〇2~B2〇3~ZnO 系.、 (1 0)SiO2-B2〇3-Li2〇 系 、 (1 1 )Si〇2-B2〇3-Na2〇 系 、 (12)Si02-B2〇3-K2〇 系、 (1 3)Si〇2~B2〇3~Zr〇2* M g 0 系、 (1 4)Si〇2_B2〇3_Zr〇2_CaO 系、（15)Si〇2-B2〇3_Zr〇2-MgO 系、 (1 6)Si〇2_B2〇3_Zr〇2_SrO 系、（17)Si〇2-B2〇3_Zr〇2_ Li2〇 系、（18)Si〇2-B2〇3-Zr02-Na2〇 系、（19)Si02-B203-Zr02 - K20 系 、 （20)Al2O3-B2O3-SiO2-BaO-CaO-Li2O-MgO -Na2〇-SrO-Ti〇2-ZnO 系、（21)A1203-B 203-Si02-Ba0-Ca0-Li2〇-MgO-Na2〇-Ti02-ZnO 系 、 （2 2) A12 O 3 - B 2 O 3 - S i O 2 -Ba0-Ca0-Li2〇-Mg0-Na20-Fe2〇3-Ti02-Zn0 系等之粒子》 上述金屬粒子，例如，可舉例：鐵、鋁、銅、鎳、錫 等之粒子。 從該密封劑用硬化性組成物光硬化性之觀點，此等無 機粒子之中，較佳爲透明之粒子。另外，從低透濕性、操 作性、均勻分散性等之觀點，更佳爲氧化物粒子及玻璃粒 子，特佳爲玻璃粒子。 [C]無機粒子之粒徑分布中的下限係3〇 μπ1，較佳爲1〇〇 μηι，更佳爲300 μιη’特佳爲400 μιη。另一方面，此粒徑 分布頻率的最高値爲1，〇〇〇 μπι ’較佳爲800 μιη，更佳爲 -20- 201141935 600 μιη，特佳爲500 μιη。若此粒徑分布頻率的最高値較上 述之下限爲小時，具有未發揮充分之低透濕性的不適當。 另一方面，若此粒徑分布頻率的最高値超過上述之上限 時，具有接著性將降低的不適當。還有，此無機粒子之粒 徑分布頻率的最高値係按照所期望的單元間隙之厚度而能 夠適當設定。另外，此[C]無機粒子之粒徑分布頻率的最高 値係按照所期望的單元間隙之厚度而能夠使用在既定範圍 內所分級者。 還有，無機粒子之粒徑的測定係使用電子顯微鏡所測 出之値（菲烈（Feret)直徑）。另外，粒徑分布係於丙酮中將 含有無機粒子之感放射線性組成物作爲電解質，利用 Coulter 計數器法（BECKMAN COULTER 製 Multisizer 4)且 以開口徑1，〇〇〇 μηι之條件而測出者。 [C]無機粒子之形狀，例如，可舉例：球狀、圓柱狀、 立體狀、針狀、紡錘狀、板狀、鱗片狀、纖維狀等。從作 爲間隙物的單元間隙控制性之觀點，較佳爲容易調整成所 期望的單元間隙厚度之球狀及圓柱狀，更佳爲球狀。 [C ]無機粒子能夠單獨使用或混合二種以上而使用。相 對於[Α]化合物100質量份而言，較佳爲01至10質量份， 更佳爲0.3至5質量份，藉由使[C ]無機粒子之使用比例成 爲上述範圍’能夠使優異的低透濕性及單元間隙控制性得 以發揮。 &lt; [D]板狀金屬氧化物粒子&gt; -21- 201141935 於該密封劑用硬化性組成物中，除了 [A]化合物、[B] 光陽離子聚合起始劑及[C]無機粒子，較佳爲進一步含有[D] 板狀金屬氧化物粒子。根據該密封劑用硬化性組成物，藉 由重疊[D]板狀金屬氧化物粒子而形成積層構造，此積層構 造能夠防止水蒸氣等之硬化物中的透過。因而，根據此密 封劑用硬化性組成物，進一步能夠形成具有優異的低透濕 性之硬化物。 [D]板狀金屬氧化物粒子，例如，可舉例：矽、鋁、锆、 鈦、鍺、鋅、銦、錫、銻、鈽等之金屬氧化物粒子。此等 之中，從所獲得之硬化物的低透濕性及對板狀的成形性之 觀點，較佳爲由二氧化矽、氧化鋁、氧化鈦、氧化锆及氧 化鈽所構成之族群中所選出的金屬氧化物粒子。[D ]板狀金 屬氧化物粒子係藉由使用金屬氧化物而能夠使對板狀的成 形成爲容易，使從該密封劑用硬化性組成物所獲得的硬化 物之低透濕性得以更提高。此等之中，從板狀薄膜化之加 工容易或氧化物之透濕度減低效果之觀點，更期望爲氧化 鋁系之板狀金屬氧化物粒子。市售品例如，可舉例： ALF02050、ALF05070、ALF10030(以上，kinsei Matec 製）。 [D]板狀金屬氧化物粒子之扁平度的下限較佳爲1.1， 更佳爲1.5，特佳爲5，最好爲10。另外，[D]板狀金屬氧 化物粒子之扁平度的下限較佳爲1,〇〇〇，更佳爲500。將具 有如此之扁平度的板狀金屬氧化物粒子應用於該密封劑用 硬化性組成物下，能夠更提高所形成的硬化物之低透濕性。 -22- 201141935 藉由使扁平度較上述之下限爲大，多層且有效地形成 因複數個該粒子所導致的積層構造，充分發揮低透濕性。 另外，藉由使扁平度較上述之上限爲小而於硬化之際的光 等之放射線照射中，由於因該粒子之存在而抑制遮斷放射 線之範圍擴大且不會殘留未硬化部分而能夠使其均勻地硬 化，能夠維持高的硬化性及低透濕性。 還有，所謂本發明中之[D]板狀金屬氧化物粒子之扁平 度係指相對於粒徑厚度之比。[D]板狀金屬氧化物粒子中之 粒徑係定義爲在平面上使粒子成爲穩定狀態之際，藉一定 方向之平行線夾住由與此平面垂直面之投影所產生的投影 像，所測得之間隔（菲烈直徑）。另外，厚度係定義爲從在 平面上使粒子成爲穩定狀態之際的平面起直到最高的部位 爲止之高度。 板狀金屬氧化物粒子之粒徑的上限較佳爲低於 30 μηι，更佳爲1〇 μπι。另一方面，此粒徑的下限較佳爲0.5 μιη，更佳爲1 μπι。藉由使板狀金屬氧化物粒子之平均粒徑 較0.5 μιη爲大，能夠於硬化物中，充分發揮因該粒子所導 致的水蒸氣等之遮斷機能，發揮充分之低透濕性。相反地， 藉由使板狀金屬氧化物粒子之平均粒徑較30 μιη爲小，能 夠維持硬化物之對基板的接著性或對基板的塗布性，同時 也藉由因粒子所造成的照射光之遮斷而抑制未硬化部分顯 著出現，且維持硬化性及低透濕性。 板狀金屬氧化物粒子之厚度較佳爲0.05 μιη以上且0.5 -23- 201141935 μιη以下，更佳爲0.08 μπι以上且0.2 μιη以下。藉由使板 狀金屬氧化物粒子之厚度較上述之下限爲大，由於使該粒 子均勻分散於該密封劑用硬化性組成物中而容易形成積層 構造，充分發揮因該粒子所導致的水蒸氣等之遮斷機能。 相反地，藉由使板狀金屬氧化物粒子之厚度較上述之上限 爲小，不會損害組成物對基板的塗布性，由於使均勻之塗 布成爲可能，能夠得到充分之透濕性減低效果。 [D]板狀金屬氧化物粒子能夠單獨使用或混合二種以 上而使用。相對於[Α]化合物100質量份，[D]板狀金屬氧 化物粒子之使用比例較佳爲1至9 0質量份，更佳爲3 0至 70質量份。藉由使[D]板狀金屬氧化物粒子之使用比例成爲 上述範圍，能夠使得從硬化性組成物所獲得之硬化物的透 濕度減低。 &lt;其他之任意成分&gt; 除了 [Α]至[D]成分’該密封劑用硬化性組成物係於不 損害本發明之效果的範圍，能夠含有表面改質劑、分散劑、 塡充劑等其他任意成分可以分別單獨使用，也可以倂用二 種以上。另外，其他任意成分之摻合量能夠按照其目的而 適當決定。 ‘ [表面改質劑] 表面改質劑能夠改質[C ]無機粒子及爲適合成分之[D ] 板狀金屬氧化物粒子的表面，能夠使組成物中之分散性得 以提高。 -24 - 201141935 表面改質劑能夠較佳使用矽烷耦合劑、鈦耦合劑、鋁 耦合劑。 上述矽烷耦合劑，例如，可舉例：甲基三甲氧基矽烷、 苯基三甲氧基矽烷、甲基苯基二甲氧基矽烷、二苯基二甲 氧基砂院等之院氧基砂院； 六甲基二矽氧烷等之矽氧烷； γ-氯丙基三甲氧基矽烷、乙烯基三氯矽烷、乙烯基三 甲氧基矽烷、乙烯基三乙氧基矽烷、γ-甲基丙烯氧丙基三 甲氧基矽烷、γ-環氧丙氧基丙基三甲氧基矽烷、γ-锍基丙基 三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、γ-胺基丙基三乙 氧基矽烷、γ-醯脲基丙基三乙氧基矽烷等。 上述烷氧基矽烷之市售品，例如，可舉例：Κ Β Μ - 3 1 0 3 ' ΚΒΜ-3 03、ΚΒΜ-846、ΚΒΜ-9007(以上，信越化學製）、 S Η-6 04 0( To ray Do w S i li con 製）等。 駄稱合劑之巾售品，例如，可舉例：TTS、38S、41B、 46B、55、138S、238S(味之素製）、A-l、B-l、TOT、TST、 TAA、TAL、TLA、TOG、TBSTA、A-10、TBT、B-2、B-4、 B-7、B-10、TBSTA-400、TTS、TOA-30、TSDMA、TTAB、 TTOP(曰本曹達製）等。 鋁耦合劑，例如，可舉例：Plenact AL-M(味之素製） 等。 [分散劑] 上述分散劑能夠使[C]無機粒子及適合成分之[D]板狀 -25- 201141935 金屬氧化物粒子的組成物中之分散性提高。 例如’分散劑可舉例：陽離子系、陰離子系、非離子 系或兩性等之適宜的分散劑，較佳爲由丙烯酸系或甲基丙 嫌酸系單體之聚合物或共聚物所構成的丙烯酸系分散劑。 此丙烯酸系分散之市售品，例如，可舉例：Flo wlen G-600、Flowlen G-700、Flowlen G-820、Flowlen TG-710、 Flowlen NC-500、Flowlen DOPA-15B、Flowlen DOPA-17、 Flowlen DOPA-22、Flowlen DOPA-33、Flowlen DOPA-44(協 榮社化學製）等。 [塡充劑] 上述塡充劑’例如’可舉例：苯乙烯系聚合物粒子、 二乙烯基苯系聚合物粒子、甲基丙烯酸酯系聚合物粒子、 乙烯系聚合物粒子、丙烯系聚合物粒子等。 &lt;密封劑用硬化性組成物之調製方法&gt; 該密封劑用硬化性組成物能夠藉由將例如[A]至[c]成 分及必要之其他任意成分置入容器中，使用行星式攪押機 等之攪拌機而充分混合之後，於真空下進行脫泡而製 '造。 該密封劑用硬化性組成物之黏度並未予以特別限定，從作 爲密封劑之際的塗布性或形狀保存性之觀點，較佳胃〇 〇1 Pa.s以上且l，000Pa.s以下，更佳爲〇.lpa.s以上且5〇〇 P a · s以下。 &lt;有機EL元件&gt; 由於本發明之有機EL元件中所使用的密封劑用硬化 -26- 201141935 性組成物能夠形成具有優異的低透濕性及單元間隙控制性 之硬化物，該有機EL元件中之有機發光層能夠防止來自空 氣中之水分或氧之混入。因而，與習知之有機EL元件作一 比較，該有機EL元件抑制了因吸濕所造成的發光特性之劣 化。另外，由於本發明之有機E L元件所使用的密封劑用硬 化性組成物係在室溫附近具有優異的硬化性，於硬化之際 無進行高溫加熱之必要，該有機EL元件中之有機發光層不 會誘發因加熱所導致的劣化。 本發明之有機EL元件係具有有機發光層。最好爲將有 機發光層作爲必須之發光層，可以爲單層，也可以爲多層 構造。如此之有機發光層進一步適合爲積層電洞輸送層而 構成，能夠更有效地使有機EL元件發光。另外，也能夠進 一步積層電荷注入層。積層如此有機層之情形的順序並未 予以特別限定。還有，有機EL元件也能夠使用習知者。 該有機E L元件之基板構造的型態可舉例下列之物： (i) 陽極/電洞輸送層/發光層/陰極 (ii) 陽極/電洞注入層/電洞輸送層/發光層/陰極 (iii) 陽極/發光層/電子輸送層/陰極 (iv) 陽極/發光層/電子輸送層/電洞注入層/陰極 (v) 陽極/電洞輸送層/發光層/電子輸送層/陰極 (vi) 陽極/電洞注入層/電洞輸送層/發光層/電子輸送 層/陰極 (vii) 陽極/電洞輸送層/發光層/電子輸送層/電洞注入 -27- 201141935 層/陰極 (viii)陽極/電洞注入層/電洞輸送層/發光$ 層/電子注入層/陰極 此等之有機EL元件係在基板上具有依序 示之構造者。還有’爲了作成顯示裝置，也可 偏光板之構造’另外’爲了遮斷水分或氧影響 密封基板，也可以藉密封基板而作成密封各層 爲形成基板、電極、發光層中所含有的發光材 入層及電洞輸送層之材料，例如，可舉例：在 開2 0 0 6 - 1 2 8 3 2 5號公報等所介紹者。 &lt;密封方法&gt; 將該密封劑用硬化性組成物作爲有機E L 劑使用之情形，該密封劑用硬化性組成物係保 層，同時也用以防止來自空氣中之水分或氧之 封劑用硬化性組成物係具有良好之耐濕性及接 在室溫附近也具有優異的硬化性。因而，由於 無進行高溫加熱之必要，不會誘發有機發光層 用於有機EL元件之製造。 密封方法係具有： (1) 將該密封劑用硬化性組成物塗布於被 驟；及 (2) 進行光照射之步驟。 以下，詳述各步驟。還有，被塗布物可舉 i /電子輸送 積層上述所 以作成具備 之密封膜、 之構造。作 料、電子注 曰本專利特 元件用密封 護有機發光 混入。該密 著性，同時 在硬化之際 之劣化而有 布物之步 例：由液晶 -28- 201141935 元件、有機EL元件等之平面面板所構成的單元；或由收納 C CD等半導體元件之盒子與導線所構成的半導體裝置等。 [步驟（1)] 於本步驟中，將該密封劑用硬化性組成物塗布、密封 於一對電極間。被塗布物係適合有機EL元件。只要爲塗布 方法能夠對被封止物均勻塗布組成物的話，並未予以特別 限定，能夠利用習知之方法，例如，可舉例：使用桿塗布 機或分配器之方法、或利用網板印刷而進行塗布之方法。 另外，也能夠利用玻璃基板、金屬基板等之密封基板、 密封周圍。通常，密封基板能夠利用有機EL元件中可用於 密封之材料、密封方法。還有，也可以將樹脂直接旋轉塗 布而覆蓋於對向電極上的方式來密封。 [步驟（2)] 藉由在上述步驟（1)塗布該密封劑用硬化性組成物 後’進行光照射而可以獲得硬化物。光之波長並未予以特 別限定，較佳爲3 00 nm以上且700 nm以下。另外，照射 線量較佳爲100 J/m2以上且5 00,000 J/m2以下，更佳爲 l，000J/m2以上且200,000J/m2以下。還有，較佳爲連續光 照射且利用潔淨烘箱等進行熱硬化。熱硬化之溫度較佳爲 4〇°C以上且150°C以下，更佳爲6(TC以上且120°C以下。另 外，硬化時間較佳爲1 〇分鐘以上且5小時以下，更佳爲 3 〇分鐘以上且2小時以下。 &lt;有機EL顯示裝置及有機EL照明裝置&gt; -29- 201141935 於本發明中，也適合包含具備該有機EL元件之有機 EL顯示裝置及具備該有機EL元件之有機EL照明裝置。如 上所述，與習知之有機EL元件作一比較，由於該有機EL 元件達成優異的效果，於該有機EL顯示裝置及該有機EL 照明裝置中，該有機EL元件也同樣地維持具有優異的有機 發光層之發光特性。 於本發明中，適合包含具備該有機EL元件之有機EL 顯示裝置。此有機EL顯示裝置之驅動方法能夠利用通常之 有機EL顯示裝置的驅動方法，並未予以特別限定，例如無 論被動矩陣驅動或主動矩陣驅動皆可。另外，能夠從本實 施形態之有機EL元件而形成作爲發光光源之各種照明裝 置。 另外，於本發明中，適合包含具備該有機EL元件之有 機EL照明裝置。該有機EL照明裝置係可用於家庭用照 明 '、車內照明、鐘錶或液晶用之背光板、廣告看板、號誌 機、光記憶媒體之光源、電子照相複印機之光源、光通訊 處理機之光源、光感測器之光源等。 [實施例] 以下，舉例實施例及比較例進一步具體說明本發明， ί旦是本發明並不受此等實施例所任何限定。 &lt;密封劑用硬化性組成物之調製&gt; 以下顯示在實施例及比較例所使用的各成分之詳細內 容。 -30- 201141935 [A] 化合物 A-l-1:雙（4-環氧丙基苯氧基）甲烷（Mw312)(YL983U、Japan Epoxy Resin 製） A-2-1 :酌酣醒型環氧樹脂（Mw800)(Epicoat 152、Japan Epoxy Resin 製） A-2-2:二甲苯雙環氧丙烷（Mw550)(〇XT-12卜東亞合成製） [B] 光陽離子聚合起始劑 B-l: B-2:六氟膦酸二苯基（4-(苯硫基）苯基）鏑鹽 [C] 無機粒子 C-1 :玻璃粒子、粒徑 50 pm(SPL-50、Unitika 製） 還有，所謂粒徑係指粒徑分布中，採取頻率最高値之 粒徑。在以下之[C]無機粒子、[D]板狀金屬氧化物粒子及 [C ’ ]成分中相同。 C-2 :玻璃粒子、粒徑 3 00 pm(SPL-300、Unitika 製） C-3 :玻璃粒子、粒徑 400 pm(SPL-400、Unitika 製） C-4:玻璃粒子、粒徑 500 Mm(SPL-500、Unitika 製） C-5 :玻璃粒子、粒徑 800 pm(SPL- 8 00、Unitika 製） [C’]成分（對應於用於比較例之[C]無機粒子的有機系樹脂 粒子） c’-l :有機系樹脂粒子、粒徑300 em(Micr〇pearl、積水化學製） C’-2 :有機系樹脂粒子、粒徑500 Mm(Micropearl、積水化學製） [D] 板狀金屬氧化物粒子 D-1 :板狀氧化鋁粒子（ALF02050、Kinsei Matec 製） -31- 201141935 扁平度=粒徑/平均厚度= 2.0 μπι/0.04 μπι=50 [Ε]成分（表面改質劑） E-1:烷氧基矽烷（KBM-3103、信越化學工業製） [實施例1] [A]化合物係於容器中稱取1〇〇質量份之作爲[A]化合 物的上述（A-2-1)、2質量份之作爲[B]光陽離子聚合起始劑 的上述（B-l)、1質量份之作爲[C]無機粒子的上述（C-2)，使 用行星式攪拌機（Awatori練太郎、Thinky製）而充分混合。 之後，於真空下進行脫泡而能夠製造密封劑用硬化性組成 物。 [實施例2至13及比較例1至3] 除了如表1之記載而作成各分之種類及摻合量以外， 與實施例1進行同樣之操作而製造作爲實施例2至1 3及比 較例1至3之密封劑用硬化性組成物。還有，表1中之「-」 係表示未使用符合之成分。 &lt;硬化物之形成&gt; 使用間隙尺寸135 μηι之桿塗布機（E-789、Yoshimitsu 精製機），在PET薄膜（厚度ΙΟΟμηι、三菱化學聚酯薄膜製、 Τ100-50)上，以塗布速度2cm/sec塗布實施例1至13及比 較例1至3所調製的密封劑用硬化性組成物而形成丨00 μπ1 之塗布膜。膜厚係利用Mitutoyo製、深度規547-25 1所測 得。藉由使用超高壓水銀燈（Cannon製、PLA-501F曝光機） 而對所獲得之塗布膜，使累積照射量成爲3 0,000 J/m2的方 -32- 201141935 式來進行曝光後，在潔淨烘箱內，於8 0 °C加熱1小時而在 PET薄膜上形成硬化物。 &lt;評估&gt; 針對在上述實施例及比較例所獲得之密封劑用硬化性 組成物及使其硬化之硬化物，評估下列之特性。將所獲得 之結果合倂顯示於表1中。 [黏度（Pa · s)] 於25°C，藉E型黏度計（東機產業製、RE_8 0)而測定密 封劑用硬化性組成物之黏度。使黏度成爲0 . 1 P a · s至5 0 0 Pa · s之範圍時，從塗布性（分配性）之觀點，判斷黏度係良 好。 [透濕度（g/m2.24h)] 按照JIS-Z0208，於濕度90%、溫度60°C之條件下， 測定硬化物（厚度100 μπ〇之透濕度》透濕度10 g/m2.24h 以下，判斷低透濕性係良好。 [接著性（MPa)] 將玻璃基板切割成25 mm&gt;&lt;75 mm，在交叉成十字狀之 玻璃片中央，夾住實施例1至1 3及比較例1至3所調製的 密封劑用硬化性組成物（在一側之玻璃片，以膜厚1 00 μηι 塗布）。使用超高壓水銀燈（Cannon製、PLA-501F曝光機）， 使累積照射量成爲3 0,000 J/m2的方式來進行曝光後，在潔 淨烘箱內，於8 0 °C加熱1小時而使其硬化，之後，上下地 剝離。此時，剝離速度係設爲1 50 mm/min，以預先測出的 -33- 201141935 接著劑塗布面積除以最大載重而設爲接著力（單位：MPa)。 接著力爲〇. 8 MP a以上之情形，判斷接著力係良好^ [單元間隙控制性（μπι)] 使用分配器而將樹脂組成物噴出於玻璃基板上之後， 從上部利用玻璃基板而夾住，使用高壓水銀燈而進行 3 0,000 J/m2的光照射，接著於80°C使其熱硬化1小時。硬 化後，剝離玻璃基板，測定密封劑部之膜厚。此時，所用 之粒子的粒徑與實測單元間隙之差爲1 Ο μιη以下之時，設 計時之單元間隙値與實測之單元間隙値接近，判斷單元間 隙控制性係良好。 &lt;有機EL元件之製造&gt; 在縱橫25 mm之玻璃上，以寬度2 mm之圖案形成膜 厚15nm之ITO的玻璃基板（旭硝子公司）上，以3,000 rpm 進行含有作爲正電洞注入材料的正電洞注入層形成用塗布 液之聚（3,4)伸乙二氧基噻吩/聚苯乙烯磺酸鹽（PEDOT/PSS) 的50秒鐘旋轉塗布而形成膜厚50nm之正電洞注入層後， 於高純度氮中、200°C，進行10分鐘之加熱/乾燥。於此， 正電洞注入層形成用塗布液係使用以固形物0.1質量％而 將PEDOT/PSS溶解於純水中者。形成正電洞注入層後，以 2,000 rprn進行含有發光材料聚莽衍生物之1.0質量％溶液 的50秒鐘旋轉塗布，形成膜厚70 nm之發光層後，於60°C 燒製10分鐘。接著’在發光層上，以l(T5Pa之壓力條件 下，以O.lnm/sec之蒸鍍速度而積層l〇nm之LiF、以0_1 -34- 201141935 nm/sec之蒸鍍速度而積層20nm之Ca，於其上以20nm/sec 之蒸鎪速度而積層l〇〇nm之A1後形成l〇〇nm陰極，製得 有機EL元件。 接著，在所獲得之完成成膜的玻璃基板邊緣部，利用 分配器等，使塗布厚度較間隙物粒徑約5 0 μτη至2 5 0 μπι爲 大的方式來塗布在實施例及比較例所調製的密封劑用硬化 性組成物。接著，使用真空貼合裝置而使對向玻璃基板貼 合於完成成膜的玻璃基板，使用超高壓水銀燈（3 65 nm下之 強度爲100 mW)而照射30秒鐘紫外光後，於80°C加熱30 分鐘而硬化。進行如上述之方式而製得有機EL元件。 &lt;有機EL元件之評估&gt; 針對此等之有機EL元件而利用以下之方法而評估耐 濕性。將評估結果合倂顯示於表1。 [耐濕性試驗（％ )] 於85°C、8 5RH%之條件下，測定進行所獲得之有機EL 元件的500小時通電之時所發生的暗點佔有機EL元件表面 積之比例（％ )。此比例爲5 %以下之情形’判斷耐濕性爲良 好（抑制暗點之發生）。 -35- 201141935 :匕較例 100 I (Ν 1 1 340 (Ν r*H 442 OO 卜 (N 100 (Ν 1 T-H s 340 o 1-H 258 Oj 卜 Η o (Ν 1 1 l33〇J in &lt;N cn 250 沄 謹例 ro 〇 i-H I ν〇 ^•Η s 340 CO ϊ—H s CO &lt;N ro CN o i—H CN r—^ 200 302 (Ν m τ-Η CN § 280 OO (N 297 m Ο r-H (Ν § 11!〇1 寸 cn 303 m &lt;Τ) Os Ο CN 1 340 t—H OO oo m oo ο &lt;Ν 1 § o m tn CN 492 oo m 卜 ο &lt;Ν 1 r-H 340 CO VO ο CN 1 r—Η § 340 l〇 &lt;N r—H OO 〇\ CN (N m yn ο Η (Ν s 340 &lt;N T-H σ\ »~H m 寸 ο CS 1 1 345 卜 H r-H g oo OO m ο r^H (Ν 1-Η 1 345 00 CM r·^ Os CN Ο (Ν 1 1 340 卜 CN r-H s 寸 m H 100 Γν| 1 1 340 卜 iN r-^ oo ON &lt;N CN τ—H &lt; Α-2-1 Α-2-2 I CQ (Ν CQ ό C-2 CO u ΰ ΰ u C-2 D-l ώ 黏度(Pa · s) 透濕度(g/m2 · 24h) 接着性(MPa) 單元間隙控制性(μπι) 銶 iH M N Φ 挝 u 51 % jj f i Si u呍 u gffif 耐濕性試験(％) 〔A〕化合物 1 〔β〕光陽離子聚合起始劑 _I 〔C〕無機粒子 〔c’〕成分 〔D〕板狀金属氧化物粒子 〔E〕成分(表面改質劑） 201141935 由表1之結果可明確得知：該有機el元件係具有優異 的耐濕性，在有機E L元件中之有機發光層內，能夠抑制來 自空氣中之水分或氧混入。另外也得知：與不含[C ]無機粒 子之比較例1至3之密封劑用硬化性組成物作一比較，該 密封劑用硬化性組成物係硬化後之透濕度爲低，亦即具有 優異的低透濕性。還有也得知：該密封劑用硬化性組成物 係[C]無機粒子之粒徑與單元間隙之差爲小，具有優異的單 元間隙控制性，亦即能夠正確地形成具有所期望的厚度之 單元間隙。另外，該密封劑用硬化性組成物係顯示由於具 有充分之黏度而塗布性佳，也具有充分之接著力》 [產業上利用之可能性] 根據本發明，能夠提供一種密封劑用硬化性組成物， 其係具備優異的接著性及塗布性，並且所獲得之硬化物具 有優異的低透濕性及單元間隙控制性。並提供一種由依照 該密封劑用硬化性組成物所密封而成之有機EL元件、有 機EL顯示裝置及有機EL照明裝置。 【圖式簡單說明】 無。 【主要元件符號說明】 無。 -37-The above glass particles may, for example, be: (1) Bi203-Zn0-B2 〇3 system (2) Bi2〇3-Si〇2-B2〇3 system, (3) Bi2〇3-Si〇2-B2〇3 -Li2 lanthanide, (4)Bi2〇3-Si〇2-B2〇3-Na2 0 system, (5)Bi203 -SiO 2 -B203 -K20 system (6)Bi2〇3-Si〇2-Li2 lanthanum, (7) Bi203-Si〇2-Na20 system, (8) Bi2〇3-Si〇2-K2 lanthanide system, (9) Bi2〇3~Si〇2~B2〇3~ZnO system, (1 0) SiO2-B2〇3-Li2〇, (1 1 )Si〇2-B2〇3-Na2〇, (12)Si02-B2〇3-K2〇, (1 3)Si〇2~B2〇3 ~Zr〇2* M g 0 system, (1 4)Si〇2_B2〇3_Zr〇2_CaO system, (15)Si〇2-B2〇3_Zr〇2-MgO system, (1 6)Si〇2_B2〇3_Zr〇2_SrO , (17) Si〇2-B2〇3_Zr〇2_ Li2〇, (18)Si〇2-B2〇3-Zr02-Na2〇, (19)Si02-B203-Zr02 - K20, (20) Al2O3-B2O3-SiO2-BaO-CaO-Li2O-MgO-Na2〇-SrO-Ti〇2-ZnO system, (21)A1203-B 203-Si02-Ba0-Ca0-Li2〇-MgO-Na2〇-Ti02- ZnO-based, (2 2) A12 O 3 - B 2 O 3 - S i O 2 -Ba0-Ca0-Li2〇-Mg0-Na20-Fe2〇3-Ti02-Zn0 system or the like particles" The above metal particles, for example, For example: iron, aluminum, copper, , Tin, etc. particles. From the viewpoint of photocurability of the curable composition for a sealant, among these inorganic particles, transparent particles are preferred. Further, from the viewpoints of low moisture permeability, workability, uniform dispersibility, and the like, oxide particles and glass particles are more preferable, and glass particles are particularly preferable. The lower limit of the particle size distribution of the [C] inorganic particles is 3 〇 μπ1, preferably 1 〇〇 μηι, more preferably 300 μηη, particularly preferably 400 μηη. On the other hand, the particle size distribution frequency has a maximum 値 of 1, 〇〇〇 μπι ′ is preferably 800 μηη, more preferably -20-201141935 600 μηη, and particularly preferably 500 μιη. If the highest value of the particle size distribution frequency is smaller than the lower limit described above, it is not appropriate to exhibit sufficient low moisture permeability. On the other hand, if the highest value of the particle size distribution frequency exceeds the above upper limit, the adhesion will be lowered. Further, the highest frequency of the particle diameter distribution of the inorganic particles can be appropriately set in accordance with the thickness of the desired cell gap. Further, the highest frequency of the particle size distribution frequency of the [C] inorganic particles can be used within a predetermined range in accordance with the thickness of the desired cell gap. Further, the measurement of the particle diameter of the inorganic particles was carried out using an electron microscope (Feret diameter). Further, the particle size distribution was measured by using a Coulter counter method (manufactured by BECKMAN COULTER Multisizer 4) and an opening diameter of 1, 〇〇〇 μηι in an acetone as a solvent. The shape of the inorganic particles [C] can be, for example, a spherical shape, a cylindrical shape, a three-dimensional shape, a needle shape, a spindle shape, a plate shape, a scale shape, a fiber shape or the like. From the viewpoint of the cell gap control property as the spacer, it is preferably a spherical shape or a cylindrical shape which is easily adjusted to a desired cell gap thickness, and more preferably a spherical shape. [C] The inorganic particles can be used singly or in combination of two or more. It is preferably from 01 to 10 parts by mass, more preferably from 0.3 to 5 parts by mass, based on 100 parts by mass of the [Α] compound, and that the ratio of use of the [C] inorganic particles is in the above range can be made excellent. Moisture permeability and cell gap control are exerted. &lt;[D] slab-shaped metal oxide particles&gt; -21-201141935 In the curable composition for a sealant, in addition to the [A] compound, [B] photocationic polymerization initiator, and [C] inorganic particles, It is preferred to further contain [D] plate-like metal oxide particles. According to the curable composition for a sealant, a laminated structure is formed by laminating [D] plate-like metal oxide particles, and the laminated structure can prevent permeation of a cured product such as steam. Therefore, according to the curable composition for a sealant, it is possible to further form a cured product having excellent low moisture permeability. [D] The plate-like metal oxide particles may, for example, be metal oxide particles of cerium, aluminum, zirconium, titanium, cerium, zinc, indium, tin, antimony or cerium. Among these, from the viewpoint of low moisture permeability and formability of the obtained cured product, it is preferably a group consisting of cerium oxide, aluminum oxide, titanium oxide, zirconium oxide and cerium oxide. Selected metal oxide particles. [D] The plate-shaped metal oxide particles can be easily formed into a plate shape by using a metal oxide, and the low moisture permeability of the cured product obtained from the curable composition for a sealant can be further improved. . Among these, aluminum oxide-based platy metal oxide particles are more desirable from the viewpoint of easy processing of the sheet-like film formation or an effect of reducing the moisture permeability of the oxide. Commercially available products are, for example, ALF02050, ALF05070, and ALF10030 (above, manufactured by Kinsei Matec). The lower limit of the flatness of the [D] plate-like metal oxide particles is preferably 1.1, more preferably 1.5, particularly preferably 5, and most preferably 10. Further, the lower limit of the flatness of the [D] plate-shaped metal oxide particles is preferably 1, 〇〇〇, more preferably 500. When the plate-like metal oxide particles having such flatness are applied to the curable composition for a sealant, the low moisture permeability of the formed cured product can be further improved. -22-201141935 By making the flatness larger than the lower limit described above, a multilayer structure is effectively formed in a plurality of layers, and the low moisture permeability is sufficiently exhibited. In addition, in the radiation irradiation of light or the like which is hardened when the flatness is smaller than the above-described upper limit, the range of the blocking radiation is prevented from increasing due to the presence of the particles, and the unhardened portion is not left. It is uniformly hardened and can maintain high hardenability and low moisture permeability. Further, the flatness of the [D] plate-like metal oxide particles in the present invention means the ratio with respect to the particle diameter. [D] The particle size in the plate-shaped metal oxide particles is defined as a projection image generated by a projection of a plane perpendicular to the plane by a parallel line of a certain direction when the particles are in a stable state on a plane. Measured interval (Philippine diameter). Further, the thickness is defined as the height from the plane from the plane on which the particles are in a stable state to the highest point. The upper limit of the particle diameter of the plate-like metal oxide particles is preferably less than 30 μη, more preferably 1 μm. On the other hand, the lower limit of the particle diameter is preferably 0.5 μηη, more preferably 1 μπι. By making the average particle diameter of the plate-like metal oxide particles larger than 0.5 μm, it is possible to sufficiently exhibit the shutdown function of water vapor or the like due to the particles in the cured product, and to exhibit sufficient low moisture permeability. On the other hand, by making the average particle diameter of the plate-like metal oxide particles smaller than 30 μm, it is possible to maintain the adhesion of the cured material to the substrate or the coating property to the substrate, and also by the irradiation light due to the particles. The rupture inhibits the occurrence of unhardened portions, and maintains hardenability and low moisture permeability. The thickness of the plate-like metal oxide particles is preferably 0.05 μm or more and 0.5 -23 to 201141935 μηη or less, more preferably 0.08 μπι or more and 0.2 μηη or less. By making the thickness of the plate-like metal oxide particles larger than the above-mentioned lower limit, the particles are uniformly dispersed in the curable composition for a sealant, and a layered structure is easily formed, and the water vapor due to the particles is sufficiently exhibited. Wait for the occlusion function. On the other hand, by making the thickness of the plate-like metal oxide particles smaller than the above upper limit, the coating property of the composition on the substrate is not impaired, and a uniform coating can be obtained, whereby a sufficient moisture permeability reducing effect can be obtained. The [D] platy metal oxide particles can be used singly or in combination of two or more. The use ratio of the [D] plate-like metal oxide particles is preferably from 1 to 90 parts by mass, more preferably from 30 to 70 parts by mass, per 100 parts by mass of the [Α] compound. By using the ratio of the use of the [D] plate-like metal oxide particles to the above range, the moisture permeability of the cured product obtained from the curable composition can be reduced. &lt;Other optional components&gt; The curable composition for a sealant can contain a surface modifier, a dispersant, and a chelating agent, in addition to the range of the effect of the present invention, from [Α] to [D] Other optional components may be used alone or in combination of two or more. Further, the blending amount of the other optional components can be appropriately determined depending on the purpose. The [surface modifier] surface modifier can modify the surface of the [C] inorganic particles and the [D] plate-like metal oxide particles which are suitable components, and the dispersibility in the composition can be improved. -24 - 201141935 The surface modifier can preferably use a decane coupling agent, a titanium coupling agent, and an aluminum coupling agent. Examples of the decane coupling agent include, for example, methyl trimethoxy decane, phenyl trimethoxy decane, methyl phenyl dimethoxy decane, and diphenyl dimethoxy sand. a phthalic acid such as hexamethyldioxane; γ-chloropropyltrimethoxydecane, vinyltrichlorodecane, vinyltrimethoxydecane, vinyltriethoxydecane, γ-methylpropene Oxypropyltrimethoxydecane, γ-glycidoxypropyltrimethoxydecane, γ-mercaptopropyltrimethoxydecane, γ-aminopropyltriethoxydecane, γ-aminopropyl Triethoxy decane, γ-ureidopropyltriethoxy decane, and the like. As a commercial item of the above alkoxy decane, for example, Κ Β Μ - 3 1 0 3 ' ΚΒΜ-3 03, ΚΒΜ-846, ΚΒΜ-9007 (above, Shin-Etsu Chemical Co., Ltd.), S Η-6 04 0 (To ray Do w S i li con system) and so on. For example, TTS, 38S, 41B, 46B, 55, 138S, 238S (made by Ajinomoto), Al, Bl, TOT, TST, TAA, TAL, TLA, TOG, TBSTA , A-10, TBT, B-2, B-4, B-7, B-10, TBSTA-400, TTS, TOA-30, TSDMA, TTAB, TTOP (Sakamoto Soda). The aluminum coupling agent can be, for example, Plenact AL-M (manufactured by Ajinomoto). [Dispersant] The dispersant described above can improve the dispersibility of the composition of the [C] inorganic particles and the [D] plate-like -25-201141935 metal oxide particles of a suitable component. For example, the dispersing agent can be exemplified by a suitable dispersing agent such as a cationic system, an anionic system, a nonionic system or an amphoteric group, and preferably an acrylic acid composed of a polymer or copolymer of an acrylic or methyl propylene acid monomer. Is a dispersant. Commercially available acrylic dispersions, for example, Flo wlen G-600, Flowlen G-700, Flowlen G-820, Flowlen TG-710, Flowlen NC-500, Flowlen DOPA-15B, Flowlen DOPA-17, Flowlen DOPA-22, Flowlen DOPA-33, Flowlen DOPA-44 (manufactured by Xierong Chemical Co., Ltd.), and the like. [Tanning agent] The above-mentioned sputum agent 'for example' may, for example, be styrene polymer particles, divinyl benzene polymer particles, methacrylate polymer particles, ethylene polymer particles, or propylene polymer. Particles, etc. &lt;Preparation method of curable composition for sealant&gt; The curable composition for sealant can be placed in a container by using, for example, [A] to [c] components and other optional components, and using a planetary stirrer After thoroughly mixing with a blender such as a cradle, defoaming is carried out under vacuum to make a product. The viscosity of the curable composition for the sealant is not particularly limited, and from the viewpoint of coatability or shape preservability as a sealant, it is preferable that the stomach sputum is 1 Pa.s or more and 1 000 Pa.s or less. More preferably 〇.lpa.s or more and 5 〇〇P a · s or less. &lt;Organic EL device&gt; The cured composition of the sealant for use in the organic EL device of the present invention can form a cured product having excellent low moisture permeability and cell gap controllability by the hardening of the composition -26-201141935. The organic light-emitting layer in the element can prevent the incorporation of moisture or oxygen from the air. Therefore, compared with the conventional organic EL device, the organic EL device suppresses deterioration of luminescent characteristics due to moisture absorption. In addition, the curable composition for a sealant used in the organic EL device of the present invention has excellent curability at room temperature, and is not required to be heated at a high temperature during curing, and the organic light-emitting layer in the organic EL device. Deterioration due to heating is not induced. The organic EL device of the present invention has an organic light-emitting layer. It is preferable to use an organic light-emitting layer as an essential light-emitting layer, and it may be a single layer or a multilayer structure. Such an organic light-emitting layer is further preferably configured as a laminated hole transport layer, and can more efficiently emit light to the organic EL element. In addition, the charge injection layer can be further laminated. The order in which the organic layers are laminated is not particularly limited. Further, the organic EL element can also be used by a conventional person. The type of the substrate structure of the organic EL element can be exemplified by the following: (i) anode/hole transport layer/light-emitting layer/cathode (ii) anode/hole injection layer/hole transport layer/light-emitting layer/cathode ( Iii) anode/light-emitting layer/electron transport layer/cathode (iv) anode/light-emitting layer/electron transport layer/hole injection layer/cathode (v) anode/hole transport layer/light-emitting layer/electron transport layer/cathode (vi Anode/hole injection layer/hole transport layer/light-emitting layer/electron transport layer/cathode (vii) anode/hole transport layer/light-emitting layer/electron transport layer/hole injection -27- 201141935 layer/cathode (viii Anode/hole injection layer/hole transport layer/light-emitting layer/layer/electron injection layer/cathode These organic EL elements have the structure shown on the substrate. In addition, in order to form a display device, a structure of a polarizing plate may be used, and in order to block moisture or oxygen from affecting the sealing substrate, the sealing substrate may be sealed to form a substrate, an electrode, and a light-emitting material contained in the light-emitting layer. The material of the intrusion layer and the hole transport layer can be exemplified, for example, in the publication of the Japanese Patent Publication No. 2000-128. &lt;Sealing Method&gt; When the sealant hardenable composition is used as an organic EL agent, the sealant is used as a curable composition and a sealant for preventing moisture or oxygen from the air. The curable composition has good moisture resistance and excellent hardenability in the vicinity of room temperature. Therefore, the organic light-emitting layer is not induced to be used for the production of the organic EL element because it is not necessary for high-temperature heating. The sealing method has the following steps: (1) applying the sealant with a curable composition to the substrate; and (2) performing a step of irradiating the light. Hereinafter, each step will be described in detail. Further, the object to be coated may have a structure in which the sealing film is provided as described above by i/electron transport. Preparation, electronic injection 曰 This patent special component is sealed with organic light. The adhesion is at the same time as the deterioration at the time of hardening, and there are examples of the cloth: a unit composed of a flat panel such as a liquid crystal-28-201141935 element or an organic EL element; or a box containing a semiconductor element such as a CCD. A semiconductor device or the like formed of a wire. [Step (1)] In this step, the sealant is applied with a curable composition and sealed between a pair of electrodes. The object to be coated is suitable for an organic EL element. The coating method is not particularly limited as long as it can uniformly apply the composition to the object to be sealed, and can be carried out by a conventional method, for example, by a method using a bar coater or a dispenser, or by screen printing. The method of coating. Further, it is also possible to use a sealing substrate such as a glass substrate or a metal substrate to seal the periphery. In general, the sealing substrate can utilize a material which can be used for sealing in an organic EL element, and a sealing method. Further, the resin may be directly rotated and coated to cover the counter electrode to be sealed. [Step (2)] A cured product can be obtained by applying light irradiation to the curable composition for a sealant in the above step (1). The wavelength of light is not particularly limited, and is preferably 300 sec or more and 700 nm or less. Further, the amount of the irradiation line is preferably 100 J/m2 or more and 5,000,000 J/m2 or less, more preferably 1,000 J/m2 or more and 200,000 J/m2 or less. Further, it is preferably continuous light irradiation and thermally hardened by a clean oven or the like. The temperature of the heat curing is preferably 4 〇 ° C or more and 150 ° C or less, more preferably 6 (TC or more and 120 ° C or less. Further, the curing time is preferably 1 〇 or more and 5 hours or less, more preferably 3 minutes or more and 2 hours or less. <Organic EL display device and organic EL illumination device> -29-201141935 In the present invention, an organic EL display device including the organic EL device and the organic EL device are also preferably included. As described above, in the organic EL display device and the organic EL illumination device, the organic EL device is the same as the conventional organic EL device. In the present invention, an organic EL display device including the organic EL device is preferably used. The driving method of the organic EL display device can utilize a driving method of a general organic EL display device. It is not particularly limited, and may be, for example, a passive matrix drive or an active matrix drive. Further, it can be formed as an illuminating light from the organic EL device of the present embodiment. In addition, in the present invention, an organic EL illumination device including the organic EL device is preferably used. The organic EL illumination device can be used for a home illumination, an interior illumination, a backlight for a timepiece or a liquid crystal, An advertising billboard, a phonograph, a light source of an optical memory medium, a light source of an electrophotographic copying machine, a light source of an optical communication processor, a light source of a photo sensor, etc. [Examples] Hereinafter, examples and comparative examples will be further described in detail. The present invention is not limited to these examples. <Preparation of Curable Composition for Sealant> The details of each component used in the examples and comparative examples are shown below. - 201141935 [A] Compound Al-1: bis(4-epoxypropylphenoxy)methane (Mw312) (manufactured by YL983U, Japan Epoxy Resin) A-2-1 : discreet epoxy resin (Mw800) (Epicoat 152, manufactured by Japan Epoxy Resin) A-2-2: xylene dipropylene oxide (Mw550) (〇XT-12, manufactured by Toago) [B] Photocationic polymerization initiator Bl: B-2: Diphenyl(4-(phenylthio)phenyl)phosphonium fluorophosphonate [C Inorganic particles C-1: glass particles, particle size 50 pm (SPL-50, manufactured by Unitika) Also, the particle size refers to the particle size distribution, and the particle size is the highest. The following [C] inorganic Particles, [D] plate-like metal oxide particles and [C ' ] components are the same. C-2: Glass particles, particle size 3 00 pm (SPL-300, manufactured by Unitika) C-3: Glass particles, particle size 400 Pm (SPL-400, manufactured by Unitika) C-4: Glass particles, particle size 500 Mm (SPL-500, manufactured by Unitika) C-5: Glass particles, particle size 800 pm (SPL-8 00, manufactured by Unitika) [C '] component (corresponding to the organic resin particles of the [C] inorganic particles used in the comparative example) c'-l: organic resin particles, particle size 300 em (Micr〇pearl, manufactured by Sekisui Chemical Co., Ltd.) C'-2: Organic resin particles, particle size: 500 Mm (Micropearl, manufactured by Sekisui Chemicals Co., Ltd.) [D] Plate-shaped metal oxide particles D-1: plate-shaped alumina particles (ALF02050, manufactured by Kinsei Matec) -31- 201141935 Flatness = particle size /Average thickness = 2.0 μπι/0.04 μπι=50 [Ε] component (surface modifier) E-1: alkoxydecane (KBM-3103, manufactured by Shin-Etsu Chemical Co., Ltd.) [Example 1] [A] The above (B1), 1 part by mass of the above-mentioned (A-2-1), 2 parts by mass of the [B] photocationic polymerization initiator as the [A] compound, weighed in a container. The above (C-2) which is [C] inorganic particles was sufficiently mixed using a planetary mixer (Awatori, Taro, manufactured by Thinky). Thereafter, defoaming is carried out under vacuum to produce a curable composition for a sealant. [Examples 2 to 13 and Comparative Examples 1 to 3] The same operations as in Example 1 were carried out except that the types and blending amounts of the respective components were prepared as described in Table 1, and Examples 2 to 13 were compared and compared. The hardening composition for the sealant of Examples 1 to 3. Also, the "-" in Table 1 indicates that the components that are not used are not used. &lt;Formation of hardened material&gt; Using a bar coater (E-789, Yoshimitsu refiner) having a gap size of 135 μηι, coating speed on a PET film (thickness ΙΟΟμηι, manufactured by Mitsubishi Chemical Polyester Film, Τ100-50) A coating film of 丨00 μπ1 was formed by applying the curable composition of the sealant prepared in Examples 1 to 13 and Comparative Examples 1 to 3 at 2 cm/sec. The film thickness was measured using a depth gauge 547-25 1 manufactured by Mitutoyo. By using an ultrahigh pressure mercury lamp (manufactured by Cannon, PLA-501F exposure machine), the obtained coating film was exposed to a total amount of 30,000 J/m 2 -32-201141935, and then exposed in a clean oven. It was heated at 80 ° C for 1 hour to form a cured product on the PET film. &lt;Evaluation&gt; The following properties were evaluated for the curable composition for a sealant obtained in the above Examples and Comparative Examples and the cured product which was cured. The results obtained are collectively shown in Table 1. [Viscosity (Pa · s)] The viscosity of the curable composition for a sealant was measured by an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., RE_800) at 25 °C. When the viscosity is in the range of from 0.1 P a · s to 50,000 Pa · s, the viscosity is judged to be good from the viewpoint of coatability (dispensability). [Moisture Permeability (g/m2.24h)] According to JIS-Z0208, the moisture content (thickness of 100 μπ〇) is measured under the conditions of humidity 90% and temperature 60 °C. The moisture permeability is 10 g/m 2.24 h or less. It was judged that the low moisture permeability was good. [Adhesiveness (MPa)] The glass substrate was cut into 25 mm &gt; 75 mm, and the centers of the glass sheets which were cross-shaped were sandwiched, and Examples 1 to 13 and Comparative Examples were sandwiched. The curable composition for the sealant prepared in the range of 1 to 3 (coated on one side of the glass sheet at a film thickness of 100 μηι). Using an ultra-high pressure mercury lamp (manufactured by Cannon, PLA-501F exposure machine), the cumulative irradiation amount becomes After exposure to a mode of 3,000 J/m2, it was heated in a clean oven at 80 ° C for 1 hour to be hardened, and then peeled up and down. At this time, the peeling speed was set to 150 mm/min. The pre-measured -33- 201141935 is used to divide the coated area by the maximum load and is set as the adhesion force (unit: MPa). Then the force is 〇. 8 MP a or more, and the adhesion force is judged to be good ^ [Unit gap control (μπι)] After spraying the resin composition onto the glass substrate using a dispenser, from the upper The glass substrate was sandwiched, and light irradiation of 3,000 J/m 2 was performed using a high-pressure mercury lamp, followed by thermal curing at 80 ° C for 1 hour. After curing, the glass substrate was peeled off, and the film thickness of the sealant portion was measured. When the difference between the particle size of the particles used and the gap between the measured cells is 1 Ο μηη or less, the cell gap 设计 at the design time is close to the measured cell gap ,, and the cell gap control property is judged to be good. &lt;Manufacture of organic EL device &gt; On a glass substrate having a thickness of 2 mm, a glass substrate of 15 nm thick ITO (Asahi Glass Co., Ltd.) was formed on a glass having a width of 25 mm, and a positive hole injection layer containing a positive hole injection material was formed at 3,000 rpm. The coating liquid was polymerized with poly(3,4) ethylenedioxythiophene/polystyrene sulfonate (PEDOT/PSS) for 50 seconds to form a positive hole injection layer with a thickness of 50 nm, followed by high purity nitrogen. In the case of the coating liquid for forming a positive hole injection layer, the PEDOT/PSS is dissolved in pure water at a mass ratio of 0.1% by mass. After injecting the layer, it is included in 2,000 rprn 50-second spin coating of a 1.0% by mass solution of a luminescent material polyfluorene derivative to form a light-emitting layer having a thickness of 70 nm, and then firing at 60 ° C for 10 minutes. Then 'on the light-emitting layer, 1 (T5Pa) Under pressure, a LiF of 10 nm was deposited at a vapor deposition rate of 0.1 nm/sec, and a Ca of 20 nm was deposited at a vapor deposition rate of 0-1 -34 to 201141935 nm/sec, and steamed at 20 nm/sec thereon. An organic EL element was obtained by forming a 10 nm cathode after laminating a 1 Å of a 〇〇 nm. Next, the edge portion of the obtained glass substrate obtained by the film formation is applied to the examples and the comparative examples by using a dispenser or the like so that the coating thickness is larger than the particle diameter of the spacer of about 50 μτη to 250 μm. A curable composition for the prepared sealant. Next, using a vacuum bonding apparatus, the opposite glass substrate was bonded to the glass substrate on which the film formation was completed, and an ultrahigh pressure mercury lamp (100 mW at 3 65 nm) was used to irradiate the ultraviolet light for 30 seconds, and then at 80°. C is heated for 30 minutes to harden. An organic EL device was produced as described above. &lt;Evaluation of Organic EL Element&gt; With respect to these organic EL elements, the following methods were used to evaluate the moisture resistance. The results of the evaluation are shown in Table 1. [Moisture resistance test (%)] The ratio of dark spots occurring on the surface area of the organic EL element at the time of performing the energization of the obtained organic EL element for 500 hours at 85 ° C and 85 RH% was measured. . In the case where the ratio is 5% or less, it is judged that the moisture resistance is good (the occurrence of dark spots is suppressed). -35- 201141935 : 匕Comparative example 100 I (Ν 1 1 340 (Ν r*H 442 OO 卜 (N 100 (Ν 1 TH s 340 o 1-H 258 Oj Η o (Ν 1 1 l33〇J in &lt ;N cn 250 沄 ro ro H iH I ν〇^•Η s 340 CO ϊ—H s CO &lt;N ro CN oi—H CN r—^ 200 302 (Ν m τ-Η CN § 280 OO (N 297 m Ο rH (Ν § 11!〇1 inch cn 303 m &lt;Τ) Os Ο CN 1 340 t—H OO oo m oo ο &lt;Ν 1 § om tn CN 492 oo m Bu ο &lt;Ν 1 rH 340 CO VO ο CN 1 r—Η § 340 l〇&lt;N r—H OO 〇\ CN (N m yn ο Η (Ν s 340 &lt;N TH σ\ »~H m inch ο CS 1 1 345 H rH g oo OO m ο r^H (Ν 1-Η 1 345 00 CM r·^ Os CN Ο (Ν 1 1 340 卜 CN rH s inch m H 100 Γν| 1 1 340 卜 iN r-^ oo ON &lt;N CN τ—H &lt; Α-2-1 Α-2-2 I CQ (Ν CQ ό C-2 CO u ΰ ΰ u C-2 Dl ώ Viscosity (Pa · s) Permeability (g/m2 · 24h) Subsequent (MPa) cell gap control Sex (μπι) 銶iH MN Φ 乌 u 51 % jj fi Si u呍u gffif moisture resistance test (%) [A] compound 1 [β] photocationic polymerization initiator _I [C] inorganic particles [c' [Component] [D] plate-shaped metal oxide particles [E] component (surface modifier) 201141935 It is clear from the results of Table 1 that the organic EL element has excellent moisture resistance and is in an organic EL device. In the organic light-emitting layer, it is possible to suppress the incorporation of moisture or oxygen from the air. Further, it was also found that, compared with the curable composition for the sealant of Comparative Examples 1 to 3 which does not contain the [C] inorganic particles, the moisture permeability of the sealant hardenable composition is low, that is, Has excellent low moisture permeability. Further, it has been found that the difference between the particle diameter of the curable composition [C] inorganic particles and the cell gap is small, and the cell gap control property is excellent, that is, the desired thickness can be accurately formed. The cell gap. In addition, the curable composition for a sealant exhibits good coatability and sufficient adhesion, and has sufficient adhesion. [Industrial Applicability] According to the present invention, it is possible to provide a hardenability composition for a sealant. The material has excellent adhesion and coating properties, and the obtained cured product has excellent low moisture permeability and cell gap controllability. Further, an organic EL device, an organic EL display device, and an organic EL illumination device which are sealed by a curable composition for a sealant are provided. [Simple description of the diagram] None. [Main component symbol description] None. -37-

Claims (1)

201141935 七、申請專利範圍： 1· 一種有機EL元件，其特徵爲其係具有有機發光層且藉由 密封劑用硬化性組成物所密封而成的有機EL元件，此密 封劑用硬化性組成物係含有·· [A] 具有環氧基之化合物、 [B] 光陽離子聚合起始劑、及 [C] 粒徑爲30 μιη以上且粒徑分布頻率的最高値爲30 μιη 以上且1,000 μιη以下之無機粒子。 2.—種有機EL顯示裝置，其係具備如申請專利範圍第1項 之有機E L元件。 3 · —種有機EL照明裝置，其係具備如申請專利範圍第1項 之有機EL元件。 4 ·—種密封劑用硬化性組成物，其係含有： [Α]具有環氧基之化合物、 [Β]光陽離子聚合起始劑、及 [C]粒徑爲30 μιη以上且粒徑分布頻率的最高値爲30 μπι 以上且1，000 μηι以下之無機粒子。 5 ·如申請專利範圍第4項之密封劑用硬化性組成物，其中 [C]無機粒子之粒徑分布頻率的最高値爲300 μηι以上且 600 μπι 以下。 6 ·如申請專利範圍第4項之密封劑用硬化性組成物，其進 —步含有·· [D]粒徑低於30 μιη之板狀金屬氧化物粒子。 7 _如申請專利範圍第4項之密封劑用硬化性組成物，其中 [Β]光陽離子聚合起始劑爲具有不含銻或砷之陰離子之 -38- 201141935 鑰鹽。 8 .如申請專利範圍第4至7項中任一項之密封劑用硬化性 組成物，其中[A]具有環氧基之化合物係含有： (A-1)分子量5 00以下之具有環氧基的化合物、及 (A-2)藉凝膠滲透層析儀而以聚苯乙嫌換算所 '測出的 重量平均分子量超過500且5，000以下之聚合物的具有環 氧基之化合物。 -39- 201141935 四、指定代表圖： (一） 本案指定代表圖為：無。 (二） 本代表圖之元件符號簡單說明： te。 j \ \\ 五、本案若有化學式時，請揭示最能顯示發明特徵的化學式： 無0201141935 VII. Patent application scope: 1. An organic EL device characterized in that it has an organic light-emitting layer and is sealed with a hardenable composition for a sealant, and the curable composition for the sealant is used. Contains ··· [A] an epoxy group-containing compound, [B] photocationic polymerization initiator, and [C] particle size of 30 μm or more and a maximum particle size distribution of 30 μm or more and 1,000 μm or less Inorganic particles. 2. An organic EL display device comprising an organic EL element as in the first aspect of the patent application. An organic EL illumination device comprising an organic EL device as claimed in claim 1 of the invention. 4 - a curable composition for a sealant, comprising: [Α] a compound having an epoxy group, a [Β] photocationic polymerization initiator, and [C] a particle size of 30 μm or more and a particle size distribution The highest frequency of the frequency is 30 μπι or more and 1,000 μηη or less of inorganic particles. 5. The hardenable composition for a sealant according to item 4 of the patent application, wherein the [C] inorganic particles have a maximum particle size distribution frequency of 300 μηι or more and 600 μπι or less. 6. The curable composition for a sealant according to the fourth aspect of the patent application, which further comprises: [D] platy metal oxide particles having a particle diameter of less than 30 μm. 7 _ The hardenable composition for a sealant according to claim 4, wherein the [Β] photocationic polymerization initiator is a -38-201141935 key salt having an anion which does not contain antimony or arsenic. The curable composition for a sealant according to any one of claims 4 to 7, wherein [A] the compound having an epoxy group contains: (A-1) an epoxy having a molecular weight of 500 or less The compound of the group and (A-2) a compound having an epoxy group of a polymer having a weight average molecular weight of more than 500 and 5,000 or less as measured by polystyrene in a gel permeation chromatograph. -39- 201141935 IV. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the component symbols of this representative figure: te. j \ \\ V. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention: No 0
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