201146110 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種噴液裝置，特別係關於一種用於印刷 電路板之影像轉移製程中，於一銅箔基板上喷塗一層液體 膜，以增加銅箔基板與後續壓合於其上的乾膜光阻間之填 覆性的喷液裝置。 【先前技術】 印刷電路板（Printed Circuit Board簡稱PCB)是依電路設 計，將連接電路零件的電氣佈線繪製成佈線圖形，然後再 以設計所指定的機械加工、表面處理等方式，在絕緣體上 使電氣導體重現所構成的電路板而言；換言之，印刷電路 板疋搭配電子零件之前的基板。該類產品的作用是將各項 電子零件以電路板所形成的電子電路，發揮各項電子零組 件的功旎，以達到化號處理的目的。由於印刷電路板設計 品質的良窳，不但直接影響電子產品的可靠度，亦可左右 系統產品整體的性能及競爭力。而銅箔基板（c〇pper ciad Laminate簡稱CC1)則是製造印刷電路板之關鍵性基礎材 料，係利用絕緣紙、玻璃纖維布或其他纖維材料經樹脂含 浸的黏合片（Pdpreg)疊和而成的積層板，在高溫高壓下於 單面或雙面覆加銅箔而得名。而電路板的製造過程是應用 印刷、照相、蝕刻及電鍍等技術來製造精密的配線，做為 支撑電子零件及零件間電路相互接續的組褒基地。因此， 南密度化及多層化的配線形成技術成為印刷電路板製造業 發展的主流。 150188.doc 201146110 以下將概略說明印刷電路板上之線路圖案的製作方式。 首先’將銅箔基板裁切成適合加工生產的尺寸大小。接下 來，通常需先用刷磨、微餘將基板上之銅箔做適當的粗化 處理，以作為壓膜前的準備。接著，再以適當的溫度及壓 力以滾壓的方式使乾膜光阻密合貼附其上。之後，將貼好 乾膜光阻的銅箔基板送入紫外線曝光機中曝光，光阻在底 片透光區域受紫外線照射後會產生聚合反應（該區域的乾 膜在稍後的顯影、蝕銅步驟終將被保留下來當作蝕刻阻 劑），而將底片上的線路影像移轉到板面乾膜光阻上。撕 去膜面上的保護膠膜後，先以溶劑將膜面尚未受光 照的區域顯影去除，再用HCl/H2〇2混合溶劑將裸露出來的 銅箔腐餘去除，以形成所需之線路圖案。 其中，乾膜光阻為應用於印刷電路板線路之影像轉移製 程上重要的感光原料，其能將所設計的精密線路清楚地反 應在電路板上，以能夠生產出具有高密度及輕薄多層結構 之基板。然而，在滾壓乾膜光阻的過程中，有可能因外來 粉塵或是滾壓過程中所產生的微小空隙等因素而使得乾膜 光阻無法緊密地貼附於基板上❶此貼附性不佳的問題將會 影響到後續影像轉移製程之精準度，進而降低所製作而成 之印刷電路板的良率。 【發明内容】 有鑑於上述問題，本發明提供一種應用於印刷電路板之 影像轉移製程的喷液裝置。此噴液裝置係於一銅镇基板上 喷塗上一層液體膜，以增加銅箔基板與後續壓合於其上的 150188.doc 201146110 乾膜光阻間之填覆性 度。 進而提升後續影像轉移製程之精準 本發明提供一種單洁鍊+ ‘、 一印刷電路柘’丨液裝置。此喷液裝置係用於 印刷電路板之影像轉移製程， 頭。一單_流體係供應至 _ '、匕〃個噴液 ^ ^ 、心 噴液碩中，以藉由此等噴液頭 於-銅、泊基板上噴塗-層液體膜。 在本發明之一實施例中， 寺嗔液頭包括複數個第一咱· 液頭及與此等第-噴液是数個第喷 ^ ^ , 相對配置之複數個第二喷液頭， 此等第一喷液頭與第二 板可通過此算签疮 液碩之間相隔-距離’使銅落基 過此4第一噴液頭與第二噴液頭之間。 在本發明之一實施例中， „^ 认— 此4第—噴液頭與銅箔基板之 間的一距離貫質相等於此等 一距離。 等第-喷液頭與銅羯基板之間的 在本發明之一貫施例中，久势 τ 各第一噴液頭與銅箔基板之間 的一距離以及各第二喷液51命加# & 液碩與銅％基板之間的一距離係介 於10〜200毫米。 噴液裝置更包括一輔助滾 適於引導銅箔基板通過此 在本發明之一貫施例中，此 輪’設置於此等噴液頭之一側， 等喷液頭。 平均粒徑係介於100〜4〇〇微。 在本發明之一實施例中， 單元，設置於此等喷液頭之 在本發明之一實施例中， 在本發明之一實施例中， 此噴液裝置更包括一含水滾輪 另一側。 此液體膜係為一水膜。 由各喷液頭所噴出之液體的一 150188.doc 201146110 在本發明之一實施例中，由各該喑 夜碩所喷出之液體的 溫度係約為介於室溫至60°C之間。 在本發明之一實施例中’各噴液 只伙碩噴出液體的一壓力係 約為1〜5 kg/cm2。 在本發明之一實施例中，各喷液 貝’從碩噴出液體的壓力較佳 約為 2 kg/cm2。 本發明另提供-種雙流體之喷液裝置。此喷液裝置係用 於-印刷電路板之影像轉移製程，且其包括複數個喷液單 元。各喷液單元包含有一第一入口營执 β道、一第二入口管 道、以及與第一入口管道及第二 八口 Τ道連接之一喷液 頭。-流體及-氣體分別，皮導引入第—入口管道及第二入 口管道中，並經混合為複數個霧狀液珠且由此等喷液頭喷 出，以於一銅箔基板上喷塗一層液體膜。 在本發明之一實施例中，此裳哈V· -π & 此寺嘴液碩包括複數個第一喷 液頭以及與此等第一喷液頭相對配置之複數個第二噴液 j ’此等第一喷液頭與第二嘴液頭之間相隔一距離，使銅 箔基板可通過此等第一喷液頭與第二噴液頭之間。 在本發明之-實施例中，此等第—噴液頭與銅落基板之 間的-距離實質㈣於此等第二噴液頭與㈣基板之間的 一距離。 在本發明之-實施例中，各第—喷液頭以及各第二喷液 頭與銅箔基板之間的距離係介於1〇〜2〇〇微米。 在本發明之一實施例中，此喷液裝置更包括-輔助滚 輪’設置於此等噴液頭之—側’適於引導㈣基板通過此 150188.doc •6· 201146110 等喷液頭。 抑在本發明之—實施例中，此噴液裝置更包括-含水滚輪 單元’設置於此等喷液頭之另一側。 在本發明之一實施例t，此液體膜係為一水膜。在本發 明之一實施例中，由各喷液頭所嗔出之液體的平均粒徑係 介於20〜1〇〇微米。 在本發明之—實施财，由㈣嘴液頭所噴出之液體的 溫度係約為介於室溫與6(rc之間。 在本發明之一實施例中，液體係以虹吸方式供應至各嘴 液頭之第一入口管道。 在本發明之—實施例中，液體係以液壓方式供應至各嗔 液頭之第一入口管道。 在本發明之-實施例中，以液壓方式將液體供應入各喷 液頭之第一入口管道之壓力係約為丨〜5。 在本發明之—實施例中，將氣體供應人各噴液頭之第二 入口管道之壓力係約為 本發明之噴液裝置主要是應用於印刷電路板之影像轉移 製程中’藉由此噴液褒置於銅羯基板之表面上喷塗上一層 液體膜’以增加㈣基板與後續壓合於其上的乾膜光阻間 之真覆性’進而避免因鋼箔基板與乾膜之間貼附性不佳造 成印刷電路板的良率下降之問題。 除了單一流體的噴塗之外 混合而成之雙流體嘴塗，以 均勻之液體膜，進而達到銅 ’本發明亦提供由液體及氣體 於銅箔基板上形成更薄且更為 镇基板與乾膜之間更為緊密的 150188.doc 201146110 貼附性。 【實施方式】 圖1係為根據本發明之第一實施例的一種喷液裴置的立 體示意圖。此喷液裝置1〇〇係應用於一印刷電路板之影像 轉移製程中’且係用於提供單一流體之喷塗。在實際應用 時，主要是使一銅箔基板200通過此喷液裝置1 00，利用喷 液裝置100於銅箔基板200之表面上喷塗上一層液體膜，以 增加銅箔基板200與後續壓合於其上的乾膜光阻（圖中未示） 間之填覆性。 請參考圖1所示，此喷液裝置100包括複數個對此銅羯基 板200進行喷液程序之喷液頭11〇。在此實施例中，此等嘴 液頭110包括呈上下兩排之形式排列之複數個第—噴液頭 110a以及複數個第二噴液頭11〇15，此等第二喷液頭丨丨补與 此等第一喷液頭11 〇a係相對地配置’以同時對鋼笛基板 2〇〇之上下表面進行噴液程序。然而，使用者亦可根據其 使用需求而僅設置有一排喷液頭，以於銅箔基板之單一表 面上進行喷液程序。本發明對於喷液頭之數量及其排列方 式不作任何限制。 由圖中可知：此等第一喷液頭11〇a與此等第二噴液頭 ll〇b之間相隔一距離，使銅箔基板2〇〇可通過此等第—喷 液頭110a與此等第二喷液頭11〇b之間。基本上，此等第一 喷液頭110a與銅箔基板200之間的距離實質相等於此等第 二喷液頭110b與銅箔基板200之間的距離。更進—步 言，各第一喷液頭ll〇a以及各第二喷液頭u〇b與銅箱 150188.doc -8- 201146110 200之間的距離係介於1 〇〜200毫米，以達到較佳之嘴液*文 果。 在實際操作時，單一流體（例如：水）係供應至各噴液頭 Π〇中，以利用此等噴液頭η〇於銅箔基板2〇〇的表面上噴 塗一層液體膜（例如：水膜）。如此，在後續壓合乾膜時， 可藉由此液體膜增加銅箔基板2〇〇與乾膜之間的填覆性， 以解決因乾膜之貼附性不佳而影響到影像轉移製程之精準 度的問題。 一般而言，所供應至各喷液頭丨1〇之流體係為水。而在 本發明之一實施例中，由各喷液頭11〇所喷出之液體的較 佳溫度係約為6(TC。此外，由各喷液頭11〇所喷出之液體 的一平均粒徑係介於100〜400微米。在本發明之—實施例 中，各噴液頭11〇喷出液體的壓力係約為卜5 kg/cm2 ·更進 一步而言，各喷液頭110喷出液體的壓力較佳約為2 kg/cm。以上㈣條件為發明人經實驗後所得出之較佳操 作參數，然本發明不限於上述操作條件。 、 圖2A及圖2B分別為在圖i中所示之喷液裝置的不同側上 加裝-輔助滾輪與-含水滾輪單元之立體示意圖。在本發 明之1施例中’請參考圖2A所示，此喷液裝置_係於 此等喷液頭110之-側設置有-輔助滾輪心㈣基板 細會先通過此輔助滾輪12〇,並藉由此辅助滾輪綱導 而通過此等喷液頭1 1 0。 150188.doc -9- 201146110 130 ’且此含水滾輪單元13〇之表面係塗覆有水。銅箔基板 200會先通過此等噴液頭11〇，以於銅箔基板2〇〇之上下表 面上形成一液體膜，接著，再使銅箔基板2〇〇通過含水滾 輪單元130’以確保銅箔基板2〇〇之表面上完全塗佈有一液 體膜。使用者可根據其使用需求而在喷液裝置1〇〇中設置 輔助滾輪120(參圖2 A)及含水滾輪單元130中之一者或二 者，本發明對於辅助滾輪120及含水滚輪單元13〇之設置與 否不作任何限制。 圖3係為根據本發明之第二實施例的一種喷液裝置的立 體示意圖。請參考圖3所示，此喷液裝置300係用於雙流體 之喷塗’且其包含複數個喷液單元31〇。各該噴液單元31〇 包含有一第一入口管道312a、一第二入口管道312b、以及 與第一入口管道312a及第二入口管道312b連接之一喷液頭 314。一流體（例如：水）及一氣體（例如：空氣）分別被導引 入第一入口管道312a及第二入口管道312b中，且經混合以 形成複數個霧狀液珠並由各喷液頭314喷出，以於一銅箱 基板（圖中未示）上喷塗一層液體膜（例如：水膜）。由於液 體與氣體混合之後會形成粒徑更小之霧狀液珠，因此，所 形成之液體膜將更為均勻，且厚度會更薄，以進一步增加 銅_基板與後續壓合於其上的乾膜之間的貼附性。 在本發明之另一實施例中，由各喷液頭314所喷出之液 體溫度較佳約為60。(：。此外，由各喷液頭3 14所嘴出之液 體的平均粒徑係介於20〜100微米之間。該液體係以虹吸或 液壓方式供應至各噴液頭314之第一入口管道312a。當液 150188.doc •10- 201146110 體係以液壓方式供應入各噴液頭314之第一入口管道 3 12a ’該將液體供應入各噴液頭3丨4之第一入口管道312a 之壓力係約為1〜5 kg/cm2。在本發明之一實施例中，將液 體供應入各噴液頭3 14之第二入口管道3 12b之壓力係約為 〇· 1〜5 kg/cm2。上述操作條件係發明人經由實驗而獲得之 較佳操作參數；惟非用以限制本發明之操作條件。由於此 喷液裝置300之細部結構配置、操作參數及其可搭配使用 之輔助機構（例如：圖2A所示之輔助滾輪2〇〇)均與圖i中所 示之喷液裝置1〇〇相同，所以在此不再多作贅述。 此外，在本發明中’混合多種流體之喷液係可藉由在各 噴液頭設置複數個入口管道而體現達成。該技術思想並未 悖離上述之實施例，而其細節則無需於此重覆贅述。 知上所述’本發明之喷液裝置主要是應用於印刷電路板 之影像轉移製程中。藉由此喷液裝置於銅箔基板之表面上 喷塗上一層液體膜，以增加銅箔基板與後續壓合於其上的 乾膜光阻間之填覆性，進而避免因銅馆基板與乾膜之間貼 附性不佳所造成印刷電路板的良率下降之問題。 在本發明之喷液裝置中，除了單一流體（例如：水）的喷 塗之外’本發明亦將氣體與液體混合，以形成霧狀液珠， 並將其噴塗於銅箔基板上，以形成更均勻且更薄的液體 膜’進而達到更佳的填覆效果。 本發明之優點可藉由參考以下實例而更清晰地被理解。 實例1 在此實例中’將傳統濕層壓裝置（weMaminati〇n device) 150188.doc 201146110 與本發明之雙流體噴液裝置予以比較，便可看出光阻填覆 到具有不同凸塊高度的㈣基板之情況有多好。傳統濕層 壓裝置使用-對海綿滾輪以藉由接觸㈣基板之方式而將 一水層施加到銅箔基板的表面上。本發明 置則以如上文所陳述之方式操作。在此實例中，^ = 體供應到每一喷液頭314之第二入口管道312b中的壓力為2 kg/cm2 ，而水係以4〇厘米高度的重力供應模式供應到每 一喷液頭314的第一入口管道312a中。 在此實例中，將要處理的鋼箔基板在其表面上具有若干 凸塊。凸塊的高度分別為4微米、7微米及14微米。所述鋼 箔基板的饋送速度為1.5米/分鐘。在塗覆水之後，用乾膜 光阻層壓於所述銅箔基板，以便看出所述銅箔基板與所述 光阻之間的填覆性。 在測試之後’發現所述傳統濕層壓裝置及所述雙流體噴 液裝置兩者對於具有4微米及7微米凸塊高度的銅箔基板均 具有良好的表現。也就是說，在通過傳統濕層壓裝置或本 發明的雙流體喷液裝置用水臈塗覆銅箱基板之後’均可將 光阻密合貼附到具有4微米及7微米凸塊高度的銅箔基板 上。 然而’使用傳統濕層壓裝置，在水膜塗覆於銅落基板之 後’光阻係無法密合貼附到具有14微米凸塊高度的銅箔基 板上。相反地’通過本發明的雙流體喷液裝置，在水膜塗 覆於銅箔基板之後，仍可將光阻密合貼附到具有14微米凸 塊南度的銅猪基板上。 150188.doc •12. 201146110 實例2 在此貫例中’將傳統乾層壓裝置、傳統濕層壓裴置及本 發明的雙流體嘴液裝置比較便可看出光阻填覆到銅絲板 之情況有多好。 傳統乾層以置在*先施加水膜的情況下，將乾膜光阻 直接細力在銅，白基板上。傳統濕層星裝置及本發明的雙流 體喷液裝置之操作則如上文所陳述。 在此實例中，銅泪基板上形成具有凸塊的1〇條平行凸塊 線所述凸塊具有14微米凸塊高度。凸塊線垂直於銅羯基 板到層壓裝置或本發明的雙流體噴液裝置的饋送方向。首 先通過濕層壓裝置或本發明的雙流體喷液裝置，用水膜塗 覆於銅羯基板（用於乾層壓裝置的㈣基板不用水膜塗 覆）。在塗覆水膜之後，用乾膜光阻層壓於銅羯基板上且 接著對其進行曝光及顯影。最後，_所述mi基板，以 在其上形成1G條平行導電線。導電線為交叉的且垂直於所 述凸塊線。因A，所述導電線上存在關固交又點，其中 在所述導電線上檢查90個點以查看是否無缺陷地充分钱刻 了所述導電線。在導電線為75微米寬且凸塊為Μ微米寬 時’在通過傳統乾層壓裝置處理的㈣基板上發現9〇個檢 查點中有71個缺陷，在通過傳統濕層壓裝置處理的銅羯基 板上心現5個缺陷’而在通過本發明的雙流體喷液裝置處 理的㈣基板上則未發現任何缺陷。在導電線為85微米寬 且凸塊為75微米寬時’在通過傳統乾層壓裝置處理的銅箱 基板上發現90個檢查點中有46個缺陷，在通過傳統濕層壓 150188.doc 13 201146110 裝置處理的銅箔基板上發現1個缺陷，而在通過本發明的 又流體嘴液裝置處理的銅箔基板上則未發現任何缺陷。 【圖式簡單說明】 圖1係為根據本發明之第一實施例的—種喷液裝置的立 體不意圖。 圓2A及圖2B分別為在圖！中所示之喷液裝置的不同側上 加裝一輔助滚輪與一含水滾輪單元之立體示意圖。 圖3係為根據本發明之第二實施例的—種喷液裝置的立 體示意圖。 【主要元件符號說明】 100 喷液裝置 110 喷液頭 110a 第一喷液頭 110b 第二喷液頭 120 輔助滚輪 130 含水滾輪單元 200 銅基板 300 喷液裝置 310 喷液單元 312a 第一入口管道 312b 第二入口管道 314 喷液頭 150188.doc201146110 VI. Description of the Invention: [Technical Field] The present invention relates to a liquid ejecting apparatus, and more particularly to an image transfer process for a printed circuit board, which sprays a liquid film on a copper foil substrate to A liquid-filling device that increases the filling between the copper foil substrate and the dry film photoresist that is subsequently pressed onto it. [Prior Art] Printed Circuit Board (PCB) is a circuit design that draws the electrical wiring of the connected circuit components into a wiring pattern, and then makes the insulation on the insulator by the mechanical processing, surface treatment, etc. specified by the design. The electrical conductor is reproduced in the form of a circuit board; in other words, the printed circuit board is matched with the substrate before the electronic component. The function of this kind of product is to use the electronic circuit formed by the electronic components as the circuit board to play the role of various electronic components to achieve the purpose of processing. Due to the quality of printed circuit board design, it not only directly affects the reliability of electronic products, but also affects the overall performance and competitiveness of system products. The copper foil substrate (c〇pper ciad Laminate referred to as CC1) is a key basic material for manufacturing printed circuit boards, and is formed by stacking resin-impregnated adhesive sheets (Pdpreg) with insulating paper, glass fiber cloth or other fiber materials. The laminated board is named after adding copper foil on one or both sides under high temperature and high pressure. The manufacturing process of the board is to apply precision printing by means of printing, photography, etching and electroplating, and as a base for supporting the interconnection of electronic parts and circuits. Therefore, the south density and multi-layer wiring forming technology has become the mainstream of the development of the printed circuit board manufacturing industry. 150188.doc 201146110 The following is a brief description of how the circuit pattern on the printed circuit board is made. First, the copper foil substrate is cut to a size suitable for processing. Next, it is usually necessary to use a brush and a micro-remaining roughening of the copper foil on the substrate as a preparation before lamination. Then, the dry film photoresist is adhered to the film at a suitable temperature and pressure by rolling. Thereafter, the copper foil substrate to which the dry film photoresist is attached is sent to an ultraviolet exposure machine for exposure, and the photoresist is polymerized after being irradiated with ultraviolet rays in the light transmitting region of the negative film (the dry film of the region is later developed and copper is etched). The step will eventually be retained as an etch stop), and the line image on the film will be transferred to the dry film photoresist on the board. After tearing off the protective film on the film surface, the unexposed area of the film surface is developed and removed with a solvent, and the exposed copper foil residue is removed with a HCl/H2〇2 mixed solvent to form a desired line. pattern. Among them, the dry film photoresist is an important photosensitive material used in the image transfer process of printed circuit board lines, which can clearly reflect the designed precise circuit on the circuit board, so as to be able to produce a high density and light and thin multilayer structure. The substrate. However, in the process of rolling the dry film photoresist, there is a possibility that the dry film photoresist cannot be closely attached to the substrate due to external dust or minute voids generated during the rolling process. Poor problems will affect the accuracy of subsequent image transfer processes, which in turn will reduce the yield of printed circuit boards. SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a liquid ejecting apparatus applied to an image transfer process of a printed circuit board. The liquid ejecting apparatus is sprayed with a liquid film on a copper substrate to increase the filling property between the copper foil substrate and the dry film photoresist of 150188.doc 201146110 which is subsequently pressed thereon. Further improving the accuracy of the subsequent image transfer process The present invention provides a single clean chain + ', a printed circuit 柘' sputum device. This liquid discharge device is used for the image transfer process of the printed circuit board, head. A single-flow system is supplied to _ ', a liquid spray ^ ^, and a core spray to spray a liquid film on the copper-plated substrate. In one embodiment of the present invention, the temple head includes a plurality of first liquid heads and a plurality of second liquid discharge heads disposed opposite to the first spray liquid. The first liquid ejecting head and the second liquid plate can be separated from each other by the checker sore liquid-distance between the first liquid ejecting head and the second liquid ejecting head. In an embodiment of the present invention, the distance between the liquid discharge head and the copper foil substrate is equal to the distance of the distance between the liquid-jet head and the copper substrate. In a consistent embodiment of the present invention, a distance between each of the first liquid ejecting head and the copper foil substrate and a second liquid spray 51 between the liquid crystal and the copper substrate The distance is between 10 and 200 mm. The liquid ejecting apparatus further includes an auxiliary roller adapted to guide the copper foil substrate. In the consistent embodiment of the present invention, the wheel is disposed on one side of the liquid ejecting head, and the like. The liquid crystals have an average particle diameter of 100 to 4 micrometers. In one embodiment of the invention, the unit is disposed in the liquid jet head in an embodiment of the invention, and is embodied in one of the embodiments of the present invention. In an embodiment, the liquid discharge device further comprises a water-containing roller on the other side. The liquid film is a water film. A liquid of the liquid sprayed from each liquid spray head is 150188.doc 201146110. In an embodiment of the present invention, The temperature of the liquid ejected by each of the day and night is about between room temperature and 60 ° C. One of the inventions In the embodiment, the pressure of each of the liquid sprays is about 1 to 5 kg/cm 2 . In one embodiment of the present invention, the pressure of each of the spray liquids from the liquid is preferably about 2 Kg/cm2. The invention further provides a two-fluid liquid spraying device, which is used for an image transfer process of a printed circuit board, and includes a plurality of liquid discharging units. Each liquid discharging unit includes a first The entrance camp carries a beta channel, a second inlet duct, and a liquid jet head connected to the first inlet duct and the second eight port ramp. - Fluid and gas respectively, the skin guide is introduced into the first inlet duct and the second In the inlet pipe, and mixed into a plurality of misty liquid beads and thus ejected from the liquid discharge head to spray a liquid film on a copper foil substrate. In an embodiment of the invention, the skirt is V · -π & This temple mouth liquid includes a plurality of first liquid discharge heads and a plurality of second spray liquids disposed opposite to the first liquid discharge heads, such first liquid discharge heads and second liquid discharge liquids The heads are separated by a distance such that the copper foil substrate can pass between the first liquid discharge head and the second liquid discharge head. In the embodiment of the present invention, the distance between the first liquid ejecting head and the copper drop substrate is substantially (four) a distance between the second liquid ejecting head and the (four) substrate. In one embodiment, the distance between each of the first liquid ejecting heads and each of the second liquid ejecting heads and the copper foil substrate is between 1 and 2 μm. In an embodiment of the invention, the liquid ejecting apparatus further includes - the auxiliary roller 'set to the side of the liquid discharge head' is adapted to guide the (four) substrate through the liquid spray head such as 150188.doc • 6·201146110. In the embodiment of the invention, the liquid discharge device further comprises The aqueous roller unit is disposed on the other side of the liquid discharge head. In one embodiment of the invention, the liquid film is a water film. In one embodiment of the invention, the average particle size of the liquid drawn from each of the liquid jet heads is between 20 and 1 micron. In the practice of the present invention, the temperature of the liquid ejected by the (iv) mouthpiece is between about room temperature and 6 (rc. In one embodiment of the invention, the liquid system is supplied to each of the liquids by siphoning. The first inlet conduit of the nozzle head. In an embodiment of the invention, the liquid system is hydraulically supplied to the first inlet conduit of each of the liquid heads. In the embodiment of the invention, the liquid is supplied hydraulically The pressure of the first inlet conduit into each of the liquid jet heads is about 丨~5. In the embodiment of the present invention, the pressure of the second inlet conduit of each of the gas supply heads is about the spray of the present invention. The liquid device is mainly applied to the image transfer process of the printed circuit board, by spraying a liquid film on the surface of the copper ruthenium substrate by the spray 褒 to increase the (4) substrate and the dry film pressed thereon. The true coverage between the photoresists further avoids the problem of a decrease in the yield of the printed circuit board due to the poor adhesion between the steel foil substrate and the dry film. The two-fluid nozzle is mixed in addition to the single-fluid spraying. With a uniform liquid film to achieve The present invention also provides a 150188.doc 201146110 adhesion which is formed by a liquid and a gas on a copper foil substrate to be thinner and more closely between the inner substrate and the dry film. [Embodiment] FIG. 1 is a diagram according to the present invention. A schematic view of a liquid discharge device of the first embodiment. The liquid discharge device 1 is applied to an image transfer process of a printed circuit board and is used for providing a single fluid spray. Mainly, a copper foil substrate 200 is passed through the liquid ejecting apparatus 100, and a liquid film is sprayed on the surface of the copper foil substrate 200 by the liquid ejecting apparatus 100 to increase the copper foil substrate 200 and subsequently pressed thereon. The filling property between the dry film resists (not shown) is as shown in Fig. 1. The liquid ejecting apparatus 100 includes a plurality of liquid ejecting heads 11 for ejecting the copper crucible substrate 200. In this embodiment, the nozzle heads 110 include a plurality of first liquid discharge heads 110a arranged in the upper and lower rows and a plurality of second liquid discharge heads 11〇15, and the second liquid discharge heads are supplemented. Arranging 'with respect to the first liquid discharge heads 11 〇a' at the same time The upper surface of the steel whistle substrate 2 is subjected to a liquid discharge process. However, the user may also provide only one row of liquid discharge heads according to the use requirements thereof to perform a liquid discharge process on a single surface of the copper foil substrate. The number of the liquid discharge heads and the arrangement thereof are not limited. It can be seen from the figure that the first liquid discharge head 11〇a and the second liquid discharge heads 11b are separated by a distance to make the copper foil substrate 2 The crucible may pass between the first liquid ejecting head 110a and the second liquid ejecting heads 11b. Basically, the distance between the first liquid ejecting heads 110a and the copper foil substrate 200 is substantially equal to this. The distance between the second liquid ejecting head 110b and the copper foil substrate 200. Further, the first liquid ejecting head 11a and the second liquid ejecting head u〇b and the copper box 150188.doc -8 - 201146110 The distance between 200 is between 1 〇 and 200 mm to achieve better mouth liquid*. In actual operation, a single fluid (for example, water) is supplied to each of the liquid jet heads to spray a liquid film (for example, water) on the surface of the copper foil substrate 2 by using the liquid jet heads n? membrane). In this way, when the dry film is subsequently pressed, the filling property between the copper foil substrate 2 and the dry film can be increased by the liquid film to solve the image transfer process caused by the poor adhesion of the dry film. The problem of precision. In general, the flow system supplied to each of the liquid jet heads is water. In one embodiment of the present invention, the preferred temperature of the liquid ejected from each of the liquid ejecting heads 11 is about 6 (TC. Further, an average of the liquid ejected from each of the liquid ejecting heads 11 The particle size is in the range of 100 to 400 μm. In the embodiment of the present invention, the pressure of each of the liquid discharge heads 11 is about 5 kg/cm 2 · Further, each of the liquid discharge heads 110 is sprayed The pressure of the liquid is preferably about 2 kg/cm. The above (4) conditions are preferred operating parameters obtained by the inventors after the experiment, but the invention is not limited to the above operating conditions. Figure 2A and Figure 2B are respectively in Figure i In the first embodiment of the present invention, please refer to FIG. 2A, and the liquid ejecting apparatus is used for the same. The side of the liquid discharge head 110 is provided with an auxiliary roller core (4). The substrate is first passed through the auxiliary roller 12 〇, and through the auxiliary roller guide, the liquid discharge head 1 1 0 is passed. 150188.doc -9- 201146110 130 'and the surface of the water roller unit 13 is coated with water. The copper foil substrate 200 passes through the liquid discharge heads 11 first. A liquid film is formed on the upper surface of the copper foil substrate 2, and then the copper foil substrate 2 is passed through the water roller unit 130' to ensure that the surface of the copper foil substrate 2 is completely coated with a liquid film. The user can set one or both of the auxiliary roller 120 (refer to FIG. 2A) and the water-containing roller unit 130 in the liquid spraying device 1 according to the use requirements thereof. The present invention is directed to the auxiliary roller 120 and the water-containing roller unit. Figure 3 is a perspective view of a liquid ejecting apparatus according to a second embodiment of the present invention. Referring to Figure 3, the liquid ejecting apparatus 300 is used for a two-fluid spraying. The coating unit includes a plurality of liquid ejecting units 31. Each of the liquid ejecting units 31 includes a first inlet duct 312a, a second inlet duct 312b, and a first inlet duct 312a and a second inlet duct 312b. a liquid discharge head 314. A fluid (for example, water) and a gas (for example, air) are respectively introduced into the first inlet pipe 312a and the second inlet pipe 312b, and are mixed to form a plurality of mist beads. And by each spray The head 314 is ejected to spray a liquid film (for example, a water film) on a copper box substrate (not shown). Since the liquid and the gas mix to form a mist-like liquid droplet having a smaller particle size, The resulting liquid film will be more uniform and thinner to further increase the adhesion between the copper substrate and the dry film subsequently pressed thereto. In another embodiment of the invention, The temperature of the liquid ejected from each of the liquid ejecting heads 314 is preferably about 60. (In addition, the average particle diameter of the liquid discharged from each of the liquid ejecting heads 314 is between 20 and 100 μm. The system is supplied to the first inlet conduit 312a of each of the liquid discharge heads 314 in a siphon or hydraulic manner. When the liquid 150188.doc •10-201146110 system is hydraulically supplied into the first inlet pipe 3 12a of each liquid discharge head 314, the pressure system supplying the liquid into the first inlet pipe 312a of each liquid discharge head 3丨4 is about It is 1 to 5 kg/cm2. In an embodiment of the invention, the pressure of the liquid supplied to the second inlet conduit 3 12b of each of the liquid discharge heads 314 is about 〜 1 to 5 kg/cm 2 . The above operating conditions are preferred operating parameters obtained by the inventors through experimentation; they are not intended to limit the operating conditions of the present invention. Since the detailed structure configuration, operating parameters of the liquid ejecting apparatus 300 and the auxiliary mechanisms that can be used together (for example, the auxiliary roller 2〇〇 shown in FIG. 2A) are the same as the liquid ejecting apparatus 1 shown in FIG. So I won't go into details here. Further, in the present invention, the spraying of a plurality of fluids can be achieved by providing a plurality of inlet pipes in the respective liquid discharge heads. The technical idea is not deviated from the above embodiments, and the details thereof need not be repeated here. It is known that the liquid ejecting apparatus of the present invention is mainly applied to an image transfer process of a printed circuit board. Spraying a liquid film on the surface of the copper foil substrate by the liquid spraying device to increase the filling property between the copper foil substrate and the dry film photoresist which is subsequently pressed thereon, thereby avoiding the copper substrate and The problem of poor yield of printed circuit boards caused by poor adhesion between dry films. In the liquid discharge device of the present invention, in addition to spraying of a single fluid (for example, water), the present invention also mixes a gas with a liquid to form a misty liquid bead, and sprays it on a copper foil substrate to A more uniform and thinner liquid film is formed to achieve a better filling effect. The advantages of the present invention can be more clearly understood by reference to the following examples. Example 1 In this example, comparing a conventional wet laminating device (150).doc 201146110 with the two-fluid liquid ejecting device of the present invention, it can be seen that the photoresist is filled to have different bump heights (IV) How good is the substrate. Conventional wet layer press devices use a pair of sponge rollers to apply an aqueous layer to the surface of the copper foil substrate by contacting the (four) substrate. The invention operates in the manner as set forth above. In this example, the pressure supplied to the second inlet pipe 312b of each liquid discharge head 314 is 2 kg/cm2, and the water system is supplied to each liquid discharge head in a gravity supply mode of 4 cm height. The first inlet conduit 312a of 314. In this example, the steel foil substrate to be processed has a plurality of bumps on its surface. The height of the bumps is 4 microns, 7 microns and 14 microns, respectively. The foil substrate was fed at a speed of 1.5 m/min. After the water was applied, the copper foil substrate was laminated with a dry film photoresist to see the filling property between the copper foil substrate and the photoresist. Both the conventional wet lamination apparatus and the two-fluid liquid ejecting apparatus were found to have good performance for copper foil substrates having a bump height of 4 micrometers and 7 micrometers after the test. That is, after the copper box substrate is coated with water by a conventional wet lamination device or the two-fluid liquid ejecting apparatus of the present invention, the photoresist can be closely attached to the copper having a bump height of 4 μm and 7 μm. On the foil substrate. However, using a conventional wet lamination device, after the water film was applied to the copper drop substrate, the photoresist system could not be closely attached to the copper foil substrate having a bump height of 14 μm. Conversely, by the two-fluid liquid ejecting apparatus of the present invention, after the water film is coated on the copper foil substrate, the photoresist can be adhered to the copper pig substrate having a south bump of 14 μm. 150188.doc •12. 201146110 Example 2 In this example, comparing the conventional dry laminating device, the conventional wet laminating device and the two-fluid nozzle device of the present invention, it can be seen that the photoresist is filled to the copper wire plate. How good is the situation. The conventional dry layer is placed on the copper and white substrates by placing the dry film photoresist directly on the *first applied water film. The operation of the conventional wet layer star apparatus and the dual fluid discharge apparatus of the present invention is as set forth above. In this example, a 1 平行 parallel bump line having bumps is formed on the copper tear substrate, and the bump has a 14 micron bump height. The bump lines are perpendicular to the feed direction of the copper matte substrate to the laminating device or the two-fluid liquid ejecting device of the present invention. First, a copper film substrate is coated with a water film by a wet lamination device or a two-fluid liquid ejecting device of the present invention (the (4) substrate for the dry lamination device is not coated with a water film). After the water film was applied, it was laminated on a copper matte substrate with a dry film photoresist and then exposed and developed. Finally, the mi substrate is formed to form 1G parallel conductive lines thereon. The conductive lines are crossed and perpendicular to the bump lines. Because of A, there is a closed point on the conductive line, wherein 90 points are inspected on the conductive line to see if the conductive line is fully engraved without defects. When the conductive line is 75 microns wide and the bump is Μ micron wide, '71 out of 9 check points found on the (4) substrate processed by the conventional dry lamination device, copper treated by a conventional wet lamination device There were 5 defects on the substrate, and no defects were found on the (4) substrate treated by the two-fluid liquid discharge device of the present invention. When the conductive line is 85 microns wide and the bump is 75 microns wide, '46 of the 90 checkpoints found on the copper box substrate treated by the conventional dry lamination device are passed through the conventional wet lamination 150188.doc 13 A defect was found on the copper foil substrate treated by the device of 201146110, and no defects were found on the copper foil substrate treated by the fluid nozzle device of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a liquid discharge apparatus according to a first embodiment of the present invention. Circle 2A and Figure 2B are in the figure! A schematic view of an auxiliary roller and an aqueous roller unit is attached to different sides of the liquid ejecting apparatus shown therein. Fig. 3 is a schematic perspective view of a liquid ejecting apparatus according to a second embodiment of the present invention. [Main component symbol description] 100 liquid discharge device 110 liquid discharge head 110a first liquid discharge head 110b second liquid discharge head 120 auxiliary roller 130 water supply roller unit 200 copper substrate 300 liquid discharge device 310 liquid discharge unit 312a first inlet pipe 312b Second inlet pipe 314 spray head 150188.doc