200536618 九、發明說明： (一） 發明所屬之技術領域 本發明涉及基板材的表面處理裝置。即，涉及使用在 撓性印刷配線基板等的極薄的電路用基板的製造工程中、 一邊輸送基板材一邊對其噴射處理液進行表面處理的處理 裝置。 (二） 先前技術 隨著電子設備的高性能化、高功能化、小型輕量化， 其電路用的基板，例如撓性印刷配線基板也朝著高精度化 、精密化、極薄化、多樣化進展，形成的電路也是以微米 單位的高密度化、微細化極爲顯著。 對於這種基板的製造工程，在各工程中分別使用表面 處理裝置，對於輸送的基板材分別噴射各種處理液，對於 基板材進行各種的藥液處理和洗滌處理。 例如，對於基板材依次噴射顯像液—腐蝕液·-剝 離液和洗滌液等的處理液，因此，依次進行顯像-> 腐鈾 — 剝膜等的表面處理，製造形成了電路的基板。又例如，對 於基板材依次進行化學鍍銅—顯像—電解銅電鍍 — 剝離液的噴射和洗滌液的噴射等處理液噴射，依次進行表 面處理，製造形成了電路的基板。 第8 (a)圖是說明這種以往例的側視圖。對於顯像裝置 、腐蝕裝置、剝離裝置、洗滌裝置等的這種表面處理裝置1 ，用輸送機2的輸送輥3輸送基板材A，同時從噴嘴4噴 射處理液B，因此，進行規定的藥液處理和洗滌處理，製 200536618 造形成了電路的基板。 作爲輸送機2的輸送輥3，代表地使用直輥，其直輥 上下配置的同時在前後的輸送方向C有多個配置，因此， 夾住基板材A接觸旋轉、水平輸送。而且噴嘴4與輸送的 基板材A對向放置，從上下噴射處理液B。 作爲這樣的以往例的基板材A的表面處理裝置1，例 如可舉出以下的專利文獻1和專利文獻2中所公開的。 (專利文獻1)日本發明專利第3 4796 3 6號公報 (專利文獻2)日本發明專利公開第2002 — 009420號公 報 (三）發明內容 可是，對於這樣的以往例的基板材A的表面處理裝置 1，存在以下的問題。即， a. 該種電路用的基板材 A，如上所述，極薄化、柔軟 化顯著。特別是撓性印刷配線基板材進行極薄化的同時， 強度弱且軟，富於柔軟性。例如，也出現絕緣層（芯材）部 分的壁厚是l〇#ni左右，電路（銅箔）部分的壁厚是10#m 左右的。 b. 這樣的基板材A在乾燥狀態下容易帶靜電，且噴射 處理液B時潤濕，因此具有附著性和粘結性。 c. 這樣的基板材A容易受到處理液B的噴射壓和重量 的影響。 d. 由於被輸送輥3夾住而接觸旋轉，也作用著加壓力 200536618 因此，由於a、b、c ' d所構成的原因，這樣的基板材 A —邊用表面處理裝置1的輸送_ 3水平輸送，一邊從噴 射嘴4噴射處理液B時，發生了各種輸送上的麻煩j)，成 爲問題。 即，常常發生附著、捲繞、捲進、吸附、鍾尾、起皺 、彎曲、折彎、折斷、掛上、掉下等的輸送上的麻煩D， 難以穩定輸送，急切希望實現圓滑地輸送。 例如，發生被輸送的基板材A緊緊地貼附而卷附在剛 從其前端部通過的輸送輥3的外周面，或發生從輸送輥3 間掉下的事故。 本發明的基板材的表面處理裝置，鑒於上述的實際情 況，爲了解決上述以往課題，發明者進行銳意地硏究結果 而完成的。 對於輸送輥和其中間部件，其特徵是形成溝槽等的凹 凸以減少接觸面積。進而，對於上側的輸送輥，其特徵是 作成細溝槽，或溝槽不重合地錯開，將中間部件的突狀端 部嵌入到輸送輥的溝槽內，進而，在上側的輸送輥上鄰接 附設剝離部件等。 因此，本發明的目的在於提供，即能消除輸送上的麻 煩，實現基板材在圓滑穩定輸送的同時，又能抑制基板材 上的處理液的亂流發生，保持處理精度的基板材的表面處 理裝置。 爲解決上述課題，本發明的技術手段如下所述。 本發明第1方案的基板材的表面處理裝置，是在電路 200536618 用基板的製造工程中使用，在基板材上噴射處理液進行表 面處理。其具有輸送該基板材的輸送輥、在基板材上噴射 該處理液的噴嘴和配置在該輸送輥間的中間部件。 而且，該輸送輥，其特徵是在外表面形成凹凸，與該 基板材的接觸面積變小。 本發明第2方案的基板材的表面處理裝置，其特徵是 在本發明的第1方案中，該中間部件其外表面形成凹凸， 與該基板材的接觸面積變小。 本發明第3方案的基板的表面處理裝置，其特徵是在 本發明的第2方案中，該輸送輥由直輥狀構成，且上下配 置的词時，在前後的輸送方向配置有多個，該輸送輥夾住 該基板材而進行接觸旋轉，由此實現水平輸送。 該中間部件，其特徵是在該輸送輥的水平輸送面稍微 上下引入高度上配置著，將基板材接觸導向到輸送方向。 另外，該噴嘴與輸送的該基板材對向放置，從上下噴射該 處理液。 本發明第4方案的基板材的表面處理裝置，其特徵是 在本發明的第3方案中，該輸送輥及該中間部件分別用溝 槽形成凹凸。而且，該溝槽在左右的寬度方向隔以間隔作 配置，且沿著前後的輸送方向形成多個。 本發明第5方案的基板材的表面處理裝置，其特徵是 在本發明的第4方案中，上側的該輸送輥的溝槽由窄的細 溝槽構成。下側的該輸送輥的溝槽由寬的寬溝槽構成。 本發明第6方案的基板材的表面處理裝置，其特徵是 200536618 在本發明的第4方案中，配置在該噴嘴的前後附近的上側 的該輸送輥’該溝槽由窄的細溝槽構成。其以外的上側的 該輸送輥及下側的該輸送輥的各個溝槽由寬的寬溝槽構成 〇 本發明第7方案的基板材的表面處理裝置，其特徵是 在本發明的第4方案中，上側的該輸送輥，該溝槽在寬度 方向以等間距形成的同時，在輸送方向的前後相互間以該 溝槽不重合方式錯開間距地配置。 本發明第8方案的基板材的表面處理裝置，其特徵是 在本發明的第4方案中，該中間部件朝向輸送方向具有多 個延伸出的突狀端部。而且，該突狀端部從前後咬合地嵌 入到對應的該輸送輥的該溝槽中，滑動接觸著。 本發明第9方案的基板材的表面處理裝置，其特徵是 在本發明的第4方案中，上述該輸送輥鄰接附設多個剝離 部件。 而且，該剝離部件位於該輸送輥的下游側，上端部被 前後的輸送方向可搖動地由軸所支承，同時下端部從上側 咬合地嵌入到該輸送輥的該溝槽中，滑動接觸著。 本發明第10方案的基板材的表面處理裝置，其特徵是 在本發明第5、6、7、8或9的方案中，撓性印刷配線基板 的製造工程中，在藥液處理工程和洗滌工程使用。而且， 該基板材極薄且強度弱、柔軟富於可撓性。該噴嘴噴射作 爲該處理液的顯像液、腐蝕液、剝離液或洗滌液。 本發明的基板材的表面處理裝置的作用描述如下。 200536618 (1) 該表面處理裝置是在撓性印刷配線基板、其他的電 路用基板的製造工程中，使用於藥液處理工程和洗滌工程 ，其裝置具有輸送輥、噴嘴和中間部件等。 (2) 輸送輥夾住基板材進行接觸旋轉，由此進行水平輸 送。噴嘴從上下對基板材噴射顯像液、腐蝕液、剝離液、 洗·液等的處理液。中間部件分別配置在輸送輥間，接觸 導向基板材。 (3) 在此，表面處理裝置邊輸送基板材邊對其噴射處理 液進行表面處理。處理液沿左右的寬度方向流過基板材的 外表面後從兩側流下。 (4) 但是，a·電路用基板材，極薄化、柔軟化顯著， 強度弱、柔軟。而且，b ·這樣的基板材在靜電或處理液中 潤濕，帶有附著性和粘結性，進而，c ·容易受到處理液的 噴射壓和重量的影響，d.夾在輸送輥上也受到加壓力作用 〇 (5) 於是，對於該表面處理裝置，作爲其對策1，在輸 送$昆間配置中間部件的同時，在輸送輕和中間部件的外表 面上沿著輸送方向形成溝槽等的凹凸，與基板材的接觸面 積變少。 因此，儘管在a、b、c、d的條件下，基板材也不會貼 附、附著、捲繞在輸送輕和中間部件上，進而，也不會掉 下，可防止捲進、吸附、翹尾、起皺、彎曲、折彎、折斷 、掛上等的麻煩，可穩定地輸送。 此外，中間部件的配置進而發揮以下優點。即，處理 -11- 200536618 ' 液停留在上下的中間部件間，特別是下側的中間部件上形 成貯液部，在這樣的處理液的貯液部的液體中輸送極薄而 柔軟的基板材。因此，通過在這樣的處理液的貯液部中輸 送，使基板材失去附著性和粘結性的同時，即使是稍微的 輸送力也可進行確實的輸送，從這些方面看，可實現穩定 的輸送。 (6) 進而，作爲對策2，對於該表面處理裝置，在中間 部件上附設凹凸梳狀突狀端部，在對應的輸送輥的溝槽中 從前後咬合地嵌入、滑動接觸著。因此，從這方面也可防 止麻煩的發生，確實穩定地輸送基板材。 (7) 進而，作爲對策3，在上側的輸送輥的下游側鄰接 附設可前後搖動的凹凸梳狀剝離部件，從上側咬合地嵌入 到輸送輥的溝槽中、滑動接觸。因此，也可以將要貼附、 附著、捲繞的基板材剝離。從這方面也可防止麻煩的發生 ，理想地穩定地實現輸送。 (8) 但是，對於該表面處理裝置，如上所述，在前後的 輸送方向形成多個溝槽。因此，對於該表面處理裝置，作 爲對它的對策1是配置在上側的輸送輥或噴嘴的前後附近 的上側的輸送輥的溝槽是由寬度窄的細溝槽構成的。作爲 對策2，上述輸送輥，是在其溝槽不重疊地在輸送方向錯開 配置的。 即，噴射了的處理液，如上所述，預定在基板材的外 表面左右的寬度方向流動，沿著溝槽在前後的輸送方向形 成大量亂流是不理想的。因此，通過採用流量少的細溝槽 -12- 200536618 ^ ’錯開溝槽，最小限度地抑制亂流發生。 (9)與此相反，從下側噴射到基板材的外表面的處理液 ，由於表面處理後立即重力掉下，所以不必擔心亂流發生 。因此，下側的輸送輥作爲溝槽採用寬溝槽，另外，也不 需要以不重疊的方式錯開。 本發明涉及的基板材的表面處理裝置，如上所述，其 特徵是對於輸送輥和中間部件，形成溝槽等的凹凸減少接 觸面積。進而，對於上側的各輸送輥，其特徵是作成細溝 槽或使溝槽不重疊地錯開，和將中間部件的突狀端部嵌入 到輸送輥的溝槽中，進而在上側的輸送輥鄰接附設剝離部 件等。 因此，本發明的基板的表面處理裝置發揮如下的效果 〇 第1，消除輸送上的麻煩，可實現基板材的圓滑穩定 的輸送。即，本發明的基板材的表面處理裝置，在接觸輸 送基板材的輸送輥間配置接觸導向基板材的中間部件，同 時，在輸送輥和中間部件的外表面形成溝槽等的凹凸，減 少與基板材的接觸面積。 進而在中間部件上附設突狀端部，從前後嵌入到對應 的輸送輥的溝槽中，與其滑動接觸或者在上側的輸送輥上 鄰接附設剝離部件，嵌入到輸送輥的溝槽中，與其滑動接 觸著。 由此，可實現基板材的穩定輸送。即，在基板材是a.極 薄化、柔軟化顯著，b.在靜電或處理液中帶有附著性和粘 -13- 200536618 結性，進而，c.也受到處理液的噴射壓和重量的影響，d ·也 容易受到輸送輥加壓力作用的條件下，也可無麻煩地輸送 〇 可確實消除基板材的附著、捲繞、捲進、吸附、翹尾 、起皺、彎曲、折彎、折斷、掛上，進而掉下等的麻煩。 此外，中間部件的配置進而發揮以下的效果。即，處 理液停留在上下的中間部件間，特別是下側的中間部件上 形成貯液部，在這樣形成的處理液的貯液部的液體中，輸 送極薄而柔軟之帶有附著性和粘結性的基板材。 Φ 而且，通過在這樣的貯液部的液體輸送，使基板材失 去附著性和粘結性的同時，即使是稍微的輸送力也可進行 確實的輸送，從這些方面看，可實現穩定的輸送。 第2，抑制基板材上的處理液的亂流發生，保持處理 精度。 即，本發明的基板材的表面處理裝置，採用沿著輸送 方向的溝槽，但對於上側的各輸送輥，將溝槽作成細溝槽 ，在輸送方向溝槽是錯開的。 · 由此，噴射在基板材上的處理液沿著溝槽前後流動成 爲最小限度，抑制亂流的發生。由此，可以防止由於亂流 的原因在基板上發生縱橫花紋等的處理斑痕，可以確保藥 液處理和洗滌處理的精確度。 這樣，這種以往例所存在的問題都能得到解決，本發 明所發揮的效果是極其顯著的。 (四）實施方式 -14- 200536618 以下’根據附圖所顯示的實施本發明的最佳方式，詳 細地說明本發明的基板材的表面處理裝置。第1圖、第2 (a) 〜2(c)圖、弟3(a)和第3(b)圖、第4(a)和4(b)圖、第5(a)〜 5(c)等圖是用於說明本發明的最佳方式的圖。 第1圖是側視圖、第2 ( a )圖是要部的側視圖、第2 (b ) 圖是圖2(a)的上側的輸送輥等的放大圖、第2(c)圖是第2(a) 圖的下側的輸送輥等的放大圖、第3 (a)圖是上側的輸送輥 等的要部的俯視圖，第3 (b)圖是下側的輸送輥等的要部的 俯視圖。 籲 第4(a)圖是表示上下輸送輥的要部的主視圖，第4(b) 圖是表示上下輸送輥的其他例的要部的主視圖。第5(a)圖 是表示上側的各個輸送輥的俯視圖，第5 (b)圖是用於說明 剝離部件的要部的主視圖。第5 ( c)圖是用於說明該剝離部 件的要部的側視圖。 第6圖是表面處理裝置的全體的側視圖。第7圖是表 面處理裝置的全體的主視圖。第8(b)圖是基板（基板材）的 模式化了的俯視圖。 0 該基板材A的表面處理裝置5，在電路E用的基板F 的製造工程中使用。在此，首先參照第8(b)圖，槪略地說 明基板F。 電路E用的基板F在AV儀器、個人電腦、行動電話 、數位相機以及其他的各種電子設備中作爲電連接用被廣 泛地使用著，在絕緣層的外表面和內部形成用於連接各個 部件間的電路E圖形。 •15- 200536618 而且，作爲這樣電路E用的基板f有單面基板、兩面 基板、多層基板（包括最近的組裝法的）等各種基板，可分 爲硬質的剛性類的和膜狀的柔軟類的。 作爲這樣的基板F的一環，出現有I c、L SI元件、被 動部件、驅動部件、電容器等的半導體部件與電路E —起 組裝成模組基板（半導體一體型的插件基板）或在玻璃基體 上與電路E —起埋入半導體部件的玻璃基板，即等離子顯 示PDP用的玻璃基板或液晶LCD用的玻璃基板或CSP、 PBGA等。當然，本說明書中所說的基板f，除了包括以往 的印刷配線基板外，也廣泛包括上述的。 這樣的電路E用的基板F，伴隨著電子設備的高性能 化、高功能化、小型輕量化，向著高精度化、微細化、極 薄化、柔軟化，進而多層化、多樣化等方面發展，在外表 面（即上面、表面和下面、裏面的一方或雙方）形成電路E， 進而在內部形成的電路E的高密度化、微細化也是很顯著 〇 基板F，例如印刷配線基板的長寬切割尺寸，例如是 5 00mm X 5 00mm左右。壁厚，絕緣層（芯材）部分從以往的 1.6mm極薄化成1.0mm〜60//m左右，近來，從50//m極薄 化成1 0 // m左右。 電路E部分（銅箔部分）的壁厚也極薄化在75//m〜 35//m，近來，極薄化到16//m〜10//m左右。即使是多層 基板時，總壁厚也極薄化在1.0mm〜〇.4mm左右。電路E 寬度和電路E間的間隔也微細化成3 0 // m〜1 5 // m左右，近 -16- 200536618 來’有微細化到1 0 // m左右的傾向。 以下’對於使用該基板材A的表面處理裝置5的基板 F的製造方法’爹照圖第8 (b )，進而圖第6、7圖等進行說 明。 首先，說明第1例的製造方法。在該第i例的製造方 法中’基板F，例如印刷配線基板是按照以下步驟製造的 〇 最初，在玻璃布製、陶瓷製或聚醯亞胺等的薄膜狀樹 脂製的絕緣層（芯材）的外表面，通過熱壓等貼附了銅箔， 得到敷銅層壓的基板材A。 然後，對於這樣準備了的基板材A，對貼附了的銅箔 表面進行表面粗化處理（軟浸鈾）後，切斷成短邊的工件。 表面粗化處理，以往是通過機械硏磨進行的，但最近大多 通過處理液B的噴射進行的。 而且，大多場合是使用鐳射等進行穿孔用的孔加工。 穿孔是由基板材A(基板F)的兩外表面間的微細的貫通孔構 成，對於1張，大多形成數百個以上的極小直徑的孔，其 直徑大多是〇.5mm〜0.2 mm。穿孔是用於兩外表面的電路E( 銅箔）間或多層基板的電路E(銅箔）間的層間導通連接或裝 在電路E的半導體部件的安裝用的。 最近，代替需要孔加工的穿孔，也開發著形成小凸起 狀、略圓錐台狀的接點的凸點，對於多層基板等，通過凸 點能實現與穿孔相同的功能的技術。另外，凸點根據電路 E，在顯像工程、腐蝕工程、剝離工程製造。 -17- 200536618 然後，將感光性抗蝕劑膜狀地塗覆或貼覆在基板材A 的銅箔的外表面（上面、表面和下面、裏面的一方或雙方） 上。接著，對作爲電路E的負片的預先設計成電路E的電 路E照片進行曝光，由此，外表面的感光性抗蝕劑殘留被 曝光而固化的電路E形成部分，其他不需要的部分通過處 理液B的顯像液的噴射溶解除去。 然後，這樣的基板材A的銅箔將感光性抗蝕劑硬化而 被覆的電路E形成部分殘留下來，通過顯像而溶解除去感 光性抗蝕劑露出的不需要的部分，通過處理液B的腐鈾液（ 氯化銅、氯化鐵、其他的腐蝕液）的噴射而溶解除去和腐鈾 掉。 接著，剩下的電路E形成部分的感光性抗蝕劑，通過 處理液B的剝離液的噴射剝離除去，用剩下的電路E形成 部分的銅箔在基板材A的外表面上形成規定導體圖形的電 路E，由此製造基板F。 另外’在上述的顯像工程、腐飩工程、剝膜工程，在 各個後處理用或者剝膜工程後彙集的後處理用中，附設噴 射作爲處理液B的水洗液、中和劑液、其他的洗滌液的洗 滌工程，因此，洗滌除去附著在基板材A的外表面的顯像 液、腐蝕液、剝離液等的處理液B。 第1例的製造方法由這樣的濕工藝法構成。第1例的 製造方法就是這樣的。 以下，說明第2例的製造方法。作爲基板F例如印刷 配線基板的製造方法，上述第i例的濕工藝法是代表例， -18- 200536618 ' 但第2例的半添加法也常使用。 對於該半添加法，首先，在預先形成穿孔的基板材A 的外表面上進行化學鍍銅。然後，將感光性抗蝕劑膜狀 地塗覆或貼覆在該化學鍍銅上後—對作爲電路E膠片的 電路E照片進行曝光。—而後感光性抗蝕劑曝光、剩下曝 光而固化了的部分，其他部分也就是電路E形成部分通過 噴射作爲處理液B的顯像液溶解除去。 然後，-對於電路E形成部分，即通過顯像溶解除去 感光性抗蝕劑的鍍層的圖形部分，即化學鍍銅露出的部分 ’進行電解鍍銅—形成電路E。—另外，通過噴射作爲 處理液B的剝離液剝離除去剩下的固化了的電路e形成部 分以外的感光性抗蝕劑，—露出的非電解鍍銅，通過噴射 作爲處理液B的腐蝕液快速腐蝕、熔解除去。—另外，作 爲各工程的後處理用，按照上述的部位附設洗滌工程，將 洗滌液作爲處理液B。 對於第2例的半添加法，用電解鍍銅形成電路E，製 造基板F。第2例的製造方法就是這樣的。 可是，印刷配線基板其他的電路E用的基板F的製造 方法最近越來越多樣化，即使上述的第1例、第2例以外 也正在開發使用各種方法。當然，本發明也適用於這樣的 各種基板F的製造方法。 以下，參照第1圖、第2(a)〜2(c)圖 '第3(a)和3(b) 圖、第4(a)和4(b)圖、第5(a)〜5(c)圖、第6、7圖等詳細 地說明本發明的基板材A的表面處理裝置5。 -19- 200536618 在上述表面處理裝置5，是在上述的基板F的製造工 程中使用，對於輸送的基板材A噴射處理液b，將基板材 A進行表面處理。 即’表面處理裝置5，在基板F的製造方法的各工程 ’例如顯像工程、腐蝕工程或剝膜工程或者洗滌工程等中 ’作爲顯像裝置、腐蝕裝置或剝離裝置或者洗滌裝置使用 ，對於輸送的基板材A，分別噴射顯像液、腐鈾液、剝離 液或洗液等的處理液B，進行基板材A的藥液處理、洗 滌處理等的表面處理。 而且，這樣的各表面處理裝置5任何一個都是共同地 ，在處理室6內具有輸送機7、噴嘴4、中間部件8等。即 ，具有水平輸送基板材A的輸送機7和、在輸送的基板材 A上噴射處理液B的噴嘴4和、在輸送機7的上下的輸送 輥9，1 0之間分別配置的中間部件8。 而且，該表面處理裝置5，特別是在柔軟的印刷配線 基板等極薄的基板F的製造工程中，在藥液處理工程和洗 滌工程使用，該基板材A極薄且強度低而軟，富於可撓性 〇 下麵參照第.1圖、第2(a)〜2(c)圖、第6、第7圖等對 該表面處理裝置5的輸送機7進行說明。 該輸送機7配置在處理室6內，具有由直輥構成的輸 送輥9、1 0，輸送輥9、10，配置在上下，而且，在前後的 輸送方向C上配置著多個，夾著基板材A進行接觸轉動由 此進行水平輸送。 -20- 200536618 對於這樣的輸送機7進一步詳細地說明。輸送機7具 有水平的上側的輸送輥9組和、同樣水平的下側的輸送輥1 0 組，上下的兩個輸送輥9、1 0都是由長圓柱形的直輥構成 的。而且，將輥軸11、1 2朝向左右寬度方向的同時，沿著 前後的輸送方向，分別保持若干前後的間隔Η配置著多根（ 在第6圖中省略了前後間隔Η)。 而且，上下的輸送輥9，10，除了更上位或下位的與 噴嘴4相對放置的處理液Β噴射用的寬的間隔空間J，夾 住輸送物件的基板材Α上下成對地配置著。另外，在上側 的輸送輥9組和下側的輸送輥1 0組的途中，分別間歇地形 成間隔空間J的同時，在輸送方向C上下錯開形成位置。 輸送輥9，1 0分別從上下被壓接在輸送物件的基板材 A上，至少旋轉下側的輸送輥1 〇，使基板材A在處理室6 內沿著輸送方向C從上游側水平輸送到下游側。 對於該表面處理裝置5的輸送輥9，10的凹凸13，14 ’參照第2(a)〜2(c)圖、第3(a)和3(b)圖、第4(a)和第4(b) 圖等進行說明。 上下的輸送輥9，10在外表面同時形成凹凸13，14， 因此與基板材A的接觸面積減少。這些凹凸1 3，1 4，例如 是用溝槽15，16形成的，該溝槽15，16在左右的寬度方 向G上隔以間隔，沿著前後的輸送方向c形成多個。 對於這樣的凹凸1 3，1 4，進一步詳細地說明。首先， 作爲輸送輥9，10的外表面的凹凸13，14，溝槽15，16是 代表性的，但是，此外用其他方法使與基板材A的接觸面 -21- 200536618 積比全面接觸，減少的各種手段、形狀也是可能的。例如 ，也可能形成多個孔，進行滾花加工等的粗面加工。 代表例的溝槽1 5，1 6，對於每1根輸送輥9或1 0，在 其外表面上形成有多個，這些溝槽在寬度方向G上隔開等 間隔距離，且朝向前後的輸送方向形成。即，在輸送輥9， 1 〇的外周面在寬度方向G交替地形成溝槽〗5，1 6的凹部 分和溝槽1 5，1 6間的間隔的凸部分。 僅是凸部分與輸送物件的基板材A接觸輸送，因此溝 槽1 5，1 6的凹部分的量，與基板材A的接觸面積減少。 在圖例中，如第3(a)圖的俯視圖和第4(a)、4(b)圖的 主視圖所示，上側的輸送輕9的溝槽1 5由窄的細溝槽構成 ，如第3(b)圖的俯視圖和第4(a)、4(b)圖的主視圖所示， 下側的輸送輥1 〇的溝槽1 6由寬的寬溝槽構成。 另外，配置在噴嘴4的前後附近的上側的輸送輥9的 溝槽1 5由窄的細溝槽構成，其餘的上側的輸送輥9及輸送 輥1 0的各個的溝槽1 5，1 6由寬的寬溝槽構成。 即，作爲下側的輸送輥1 〇的溝槽1 6，在左右寬度方 向G都採用寬度尺寸大的寬溝槽。與此相反，對於上側的 輸送輥9，至少噴嘴4的前後附近，即處理室6中央部的溝 槽15，在左右寬度方向G都採用寬度尺寸小的窄溝槽，但 作爲處理室6入口附近和出口附近的溝槽1 5，未必是窄溝 槽，寬溝槽也可以。 另外，不限於此，對於上側的輸送輥9的溝槽1 5和下 側的輸送輥1 〇的溝槽1 6，可以採用相同寬度，也可以都採 -22- 200536618 用窄溝槽或寬溝槽。此時，有成本降低的優點。 另外，如第5 U)圖的俯視圖所示，在圖例中，在寬度 方向G以等間距形成上側的輸送輥9的溝槽1 5的同時，在 寬度方向G溝槽1 5不重疊地使溝槽1 5的間距在前後的輸 送方向C相互間錯開。 即，對於上側的輸送輥9組，分別以等間距形成的溝 槽1 5，在各輸送輥9相互間在輸送方向C不是直線地重合 ，左右的寬度方向G稍微錯開配置著。 另外，對於下側的輸送輥1 〇組，也按照上側的輸送輥 9組相同地分別以等間距形成的溝槽1 5，在各輸送輥1 〇相 互間在輸送方向C不是直線地重合，左右的寬度方向G稍 微錯開配置著。此時的優點，與上側的輸送輥9組相同， 在後面進行描述。 以下，對於該表面處理裝置5的輸送輥9，1 0的溝槽 1 5，1 6的形成方法進行說明。 首先，對於第3(a)、3(b)圖和第4(a)圖所示的例子， 對於輥軸1 1，1 2，外嵌合、固定預先刻設形成溝槽1 5，1 6 的輸送輥9，1 0。即，在帶溝槽1 5，1 6的輸送輥9，10的 軸孔中，分別嵌插固定軸11，12。 與此相反，對於第4(b)圖所示的例子，對於上側的輸 送輥9，使用短柱狀的多個輥部件1 7和溝槽1 5間隔形成用 的軸環1 8。而且，對於輥軸1 1，1 2，通過依次交替外嵌合 帶軸孔的輥部件1 7和軸環1 8，可用輥部件1 7的集合體形 成輸送輥9，軸環1 8部分成爲溝槽1 5。 -23- 200536618 即，通過將輥軸11交替嵌插在帶軸孔的各輥部件和軸 環1 8上，形成帶溝槽1 5的輸送輥9。 另外，在該第4(b)圖時，也可以固定在輥軸1 1和輥部 件1 7間，但也可轉動地安裝，若爲後者，上側的輸送輥9 則成爲自由輥。 另外，下側的輸送輥1 〇也可利用這樣的輥部件1 7和 軸環1 8形成，但下側的輸送輥1 〇是驅動輥的，所以在輥 軸1 2和輥部件1 7等之間作成固定的固定輥。 與此相反’將上側的輸送輥9作成自由輥時，具有上 側的輸送輥9的安裝精度有餘量的優點。即，將上側的輸 送輥9作成從動輥、自由輥時，與將上側的輸送輥9作成 固定輥時比較，對於與下側的固定輥的輸送輥1 〇的位置關 係等，不要求嚴密，具有成本低的優點。 以下，對於該表面處理裝置5的剝離部件1 9，參照第 5(b)、5(c)圖進行說明。 對於表示在這些附圖的表面處理裝置5，在上側的輸 送輕9上鄰接附設多個剝離部件1 9。剝離部件1 9，位於輸 送輥9的下游側，其上端部在前後的輸送方向^上可搖動 地被軸支承著’其下端部從上側咬合地嵌入輸送輥9的溝 槽1 5中，與該溝槽滑動接觸著。 對於追樣的剝離部件1 9 ’進一步詳細地說明。在所有 的上側的輸迭f比9組的各輸迭輕9或噴嘴4的前後附近， 即處理室6中央的各輸送輥9上分別鄰接附設剝離部件19 200536618 剝離部件1 9位於相對方向的輸送輥9的輸送方向C 下游側，成爲大致縱細棒狀，在左右的寬度方向G上並歹〇 設置有多個。各剝離部件1 9的各個上端部通過托架20而 支承在左右的寬度方向G的軸21上，在輸送方向C可前後 搖動。 各剝離部件1 9的下端部從上側嵌入到在下位置對應的 輸送輥9的溝槽15內，與其滑動接觸，因此，在輸送輥9 ，即溝槽1 5的下游側頂端附近咬合著。然後，各剝離部件 1 9的下端部，沿著左右的寬度方向G與溝槽1 5相同寬度 和間距進行並列設置。 在圖示例中，對於鄰接附設上側的剝離部件1 9的輸送 輥9的前後間隔Η，省略中間部件8的圖示，但配置中間 部件8的例子、不配置中間部件8的例子都有可能。即， 對於上側的輸送輥9，剝離部件1 9也可以與相同功能的中 間部件8同時使用，另外，也可以不使用中間部件8而單 獨使用。 以下參照第1、6、7圖等說明該表面處理裝置5的噴 嘴4。 噴嘴4配置在處理室6內，與輸送的基板材Α相對放 置，從上下噴射顯像液、腐蝕液、剝離液或洗滌液等的處 理液B。 對於這樣的噴嘴4進而詳細地說明。噴嘴4，在用輸 送機7的輸送輥9，1 〇以水平姿勢輸送的基板材A的正上 方或正下方上，上下有間隔地配置，面向配置在上述的輸 -25- 200536618 送輥9，1 〇的間隔空間j。 噴嘴4 ’在前後的輸送方向C和左右的寬度方向G， 以規疋間距配置’且夾著基板材A在上下配置有多個。 因此’處理液B，從液槽22通過泵2 3和配管2 4壓送 到各噴嘴4中，噴射在基板材a上。然後，沿基板材a的 外表面朝向左方向或右方向流動進行表面處理後，從基板 材A的左右兩側流下，再回到液溝槽2 2中，然後迴圈使用 〇 以下’參照弟1圖、第2(a)〜2(c)圖、第3(a)和3(b) 圖等說明該表面處理裝置5的中間部件8。 中間部件8，在上側的各輸送輥9間和下側的輸送輥j 〇 間分別配置的同時，比由輸送輥9，1 〇輸送的基板材A的 水平輸送面稍微上下引入的高度上下配置，在輸送方向c 接觸導向基板材A。 對於這樣的中間部件8，進而詳細地說明。將中間部 件8作成置板狀或敷板狀或梳棒狀，分別可拆卸地配置在 各輸送輥9間的前後間隔Η和各輸送輥1 〇間的前後間隔Η 上。進而，對於輸送輥1 0間的間隔空間J間和輸送輥1 0 間的間隔空間J間，在中央留有處理液Β的噴射空間，配 置在其前後。 而且，中間部件8沿著左右的寬度方向G作成長的長 板狀或長棒狀，從基板材Α的輸送面，例如以基板材Α的 壁厚程度上下離開的位置儀係上下進行配置著。 即，上側的中間部件8的下面比同樣配置在上側的輸 -26- 200536618 送輥9的外周下面稍微高的位置進行配置，因此從上面接 觸、保持、導向輸送的基板材 A表面。相對於此，下側的 中間部件8的上面比同樣配置在上側的輸送輥1 0的外周上 面稍微低的位置進行配置，因此從下面接觸、保持 '導向 輸送的基板材A裏面。 另外，這樣的中間部件8的在處理室6內的定位保持 方式可有各種。對於圖示例子，可採用上下縱向的保持部 件25，但也可左右橫向地保持，在採用後者時，由於各中 間部件8以橫的端緣連接固定，所有整個成爲大致梳狀。 以下，參照第2(a)〜2(c)圖、第3(a)和3(b)圖等說明 該表面處理裝置5的中間部件8的凹凸26。 上下的中間部件8是在各個的外表面形成凹凸2 6，與 基板材A的接觸面積變小，例如用溝槽27形成該凹凸26 。而且，溝槽2 7在左右寬度方向G間隔配置，且沿著前後 的輸送方向C形成多個。 進而詳細說明這樣的凹凸2 6。對於形成在該中間部件 8的外表面的溝槽2 7等的凹凸2 6，基本上是按照上述所說 的作爲輸送輥9，1 0的溝槽1 5，1 6等的凹凸1 3，14形成 。在此僅說明其要點。 在上側的中間部件8的下面及下側的中間部件8的上 面形成凹凸2 6，該凹凸使得與基板材A的接觸面積比全面 接觸減少，凹凸26的代表例的溝槽27是在左右的寬度方 向G上隔開等間隔’且朝向前後的輸送方向c直線地形成 的。因此，由於僅是溝槽27間的凸部與基板材a接觸，所 -27- 200536618 ’ 以凹部分的溝槽2 7部分量是減少與基板材A的接觸面積。 另外，按照上述輸送輥9，1 0的場合，作爲上側的中 間部件8的溝槽2 7，可採用窄的細溝槽，作爲下側的中間 部件8的溝槽2 7可採用寬溝槽，但不限於此，對於上下的 中間部件8，也可採用相同寬度的溝槽27，也可同時採用 窄溝槽或寬溝槽，進而，也可部分地分開使用寬溝槽和窄 溝槽。 以下，參照第2(a)〜2(c)圖、第3(a)和3(b)圖說明該 表面處理裝置5的中間部件8的突狀端部28。 上下的中間部件8具備向著輸送方向C在多個處所延 伸的突狀端部28，該突狀端部28，對於對應的輸送輥9，1 0 的溝槽1 5、1 6，從前後咬合地嵌入、滑動接觸著。 對於這樣的突狀端部2 8，進而詳細地說明。上側的中 間部件8下面附近的前後端部和下側的中間部件8上面附 近的前後端部，分別沿著輸送方向C，成爲前後突出成細 棒狀或杆狀的多個突狀端部28。 即，從平面看時，各突狀端部28沿著左右的寬度方向 G，與溝槽1 5，1 6相同寬度和間距並列設置著。上側的中 間部件8的突狀端部2 8，以上側的輸送輥9的溝槽1 5相同 寬度和間距並列設置成凹凸狀，下側的中間部件8的突狀 端部2 8，以下側的輸送輥1 〇的溝槽1 6相同寬度和間距列 設成幅度寬的平面凹凸狀。 這樣的前後各突狀端部28，對於前後鄰接的輸送輥9 、1 0的溝槽1 5、1 6，沿著輸送方向C嵌入、滑動接觸，因 -28- 200536618 此，咬合著輸送輥9、1 〇溝槽1 5、1 6，即溝槽1 5、1 6的頂 端（上端和下端）° 另外，對於配置在輸送輥9、1 〇的前後間隔η的中間 部件8，在前後形成著這樣的突狀端部2 8。相對於此，對 於鄰接配置在輸送輥9、1 0的間隔空間J的中間部件8，前 後端部的一方沒有形成突狀端部2 8，或者即使形成也不對 溝槽1 5、16嵌入、滑動接觸、咬合，成爲自由狀態。對於 處理室6的入口和出口側的輸送輥9、1 〇的中間部件8也 與上述同樣。 本發明的基板材Α的表面處理裝置5如以上說明地構 成，其內容如下。 (1) 該基板材A的表面處理裝置5在撓性印刷配線基板 、其他的電路E用基板F的製造工程中的，各種藥液處理 工程和洗滌工程等的表面處理工程中，作爲顯像裝置、腐 蝕裝置、剝離裝置或洗滌裝置使用。 而且，在處理室6內具有輸送輥9，10、噴嘴4、中間 部件8等。 (2) 輸送輥9，10由直輥組成，是上下配置的同時在前 後的輸送方向C配置有多個，夾住基板材A進行接觸旋轉 ，由此進行水平輸送。 噴嘴4與這樣的輸送的基板材A相對放置，對於基板 材A從上下噴射顯像液、腐蝕液、剝離液或洗滌液等的處 理液B。 中間部件8分別配置在上側和下側的輸送輥9，1 0間 -29- 200536618 ，以比輸送輥9，1 〇水平輸送面稍微上下的進去高度上下 配置，在輸送方向C接觸導向基板材A。 (3) 因此，表面處理裝置5，在輸送的基板材A噴射處 理液B，對基板材A進行表面處理。（參照第1、6、7圖） 〇 即，基板材A通過在上下接觸旋轉的輸送輥9，1 0和 上下接觸導向的中間部件8，在輸送方向C上被水平輸送 。與此同時，從噴嘴4噴射的處理液B，在基板材A的外 表面上沿左右的寬度方向G流動，進行表面處理。然後， 處理液B從基板材A的左右兩側流下、回收。 (4) 可是，a.撓性印刷配線基板、其他的電路E用的 基板材A極薄化、柔軟化的進展顯著，極薄而強度弱、柔 軟，富於可撓性。撓性印刷配線基板的芯材的聚醯亞胺樹 脂特別柔軟而容易彎曲。 b ·這樣極薄的柔軟的基板材A在乾燥狀態下容易帶 靜電，噴射處理液B時被潤濕，因此帶有附著性、粘結性 〇 C.這樣極薄的柔軟的基板材A受到處理液B的噴射 壓力和從上側噴射的處理液B的重量等的影響，因壓力和 重量而容易彎曲。 d.由於被上下的輸送輥9，1 0夾住而接觸輸送，所以 也受到加壓力作用而容易彎曲。 (5) 因此，在該表面處理裝置5中，鑒於這些a、b、c 、d，採用對策1 '對策.2、對策3。 -30- 200536618 ; 首先，作爲最基本的對策1，在該表面處理裝置5中 ，在輸送輥9，1 0間配置導向用的中間部件8，同時，在輸 送輥9，1 0及配部件8的外表面形成凹凸1 3、1 4，因此， 與輸送的基板材A的接觸面積減少。凹凸1 3、1 4代表地用 溝槽1 5、1 6形成，在左右的寬度方向G隔以間隔地且沿著 前後的輸送方向C形成多個溝槽15、16(參照第2(a)〜2(c) 圖、第3(a)和3(b)圖、第4(a)和4(b)圖）。 接觸導向的中間部件8的存在和、顯示削減貼附和粘 結對象的接觸面積的減少成爲本發明的要點，儘管在上述 的a、b、c、d的條件下，基板材A對於輸送輥9，10進而 中間部件8，都不會完全貼附或者捲曲，也不從輸送輥9， 10間掉下，按照要求穩定地輸送。 即，a.雖然是極薄、而富於柔軟性、帶有附著性、粘 結性的基板材A，但不受處理液B的噴射壓和重量的影響 和加壓力的作用，能夠穩定地輸送。此時，下側的中間部 件8特別具有防止掉下作用的功能，接觸面積少特別具有 防止貼附、附著、卷附用的功能。 這樣，通過採用對策1，使用該表面處理裝置5時， 可以預先防止基板材A發生附著、卷附、捲進、吸附、翹 尾、折皺、彎曲、折曲、強度降低' 掛上進而掉下等各種 麻煩（參照第8(a)圖），穩定地輸送。 此外，中間部件8的配置進而發揮以下的優點。即， Ιλίι噴嘴4噴射在基板材A的處理液B，與基板材a —起被 輸送，附著在上下的中間部件8間停留，形成貯液。特別 -31- 200536618 是停留在下側的中間邰件8上，形成貯液。 在這樣形成在中間部件8間的處理液B的貯液中輸送 極薄而富於柔軟性帶有附著性、粘結性的基板材A，但通 過在這樣的貯液的輸送，使基板材A失去附著性、粘結性 的同時，即使是稍微的輸送力也可確實完成輸送。因此， 迫些方面看’也可貫現基板材A的穩定輸送。 (6) 進而，此外作爲對策2，在該表面處理裝置5中， 在中間部件8上附設多個突狀端部28，該突狀端部28在向 著輸送方向C單獨地延伸。而且，該突狀端部2 8，對於對 應的輸送輥9，1 0的溝槽1 5、1 6，從前後咬合地嵌入、滑 動接觸著（參照第2(a)〜2(c)圖、第3(a)和第3(b)圖）。 因此，基板材 A，從此方面，也可防止上述各種麻煩 發生，更確實地穩定輸送。 即，對於表面處理裝置5，由於該對策2，構成中間部 件8的凹凸梳狀的突狀端部2 8，對於輸送輥9，1 0的溝槽 1 5、1 6，堵塞平面前後間隙地咬合，所以基板材A向輸送 輥9，1 0的貼附、附著、卷附和從輸送輥9，1 0間掉下等， 在發生之前通過突狀端部2 8就可以阻止。 (7) 進而，作爲對策3，在這樣的表面處理裝置5中， 可考慮在上側的輸送輥9上鄰接附設多個剝離部件1 9。該 剝離部件1 9，位於輸送輥9的下游側，其上端部可在前後 的輸送方向上搖動地被軸支承的同時，其下端部對於輸送 輥9的溝槽15，從上側咬合地嵌入、滑動接觸（參照第5(b) 、5 (c)圖）。 200536618 基板材A，從該方面看，可防止上述各種麻煩D的發 生，理想地且穩定地被輸送。 即，對於這樣的表面處理裝置5，用該對策3，構成凹 凸梳狀的剝離部件1 9的下端部從上側咬合到輸送輥9的溝 槽1 5中，所以基板材A的頂端部，即使從下側要貼附、附 著、卷附在輸送輥9上，也可從上側用剝離部件1 9立即剝 離。因此，可預先地防止基板材A的貼附、附著、卷附。 (8)可是，對於該表面處理裝置5，如上所述，爲了減 少接觸面積，沿著前後的輸送方向C形成多個溝槽1 5是其 代表的例子。 因此，對於表面處理裝置5，採用與其對應的對策1、 對策2。首先，作爲對策1，配置在上側的輸送輥9或配置 在上側的噴嘴4前後附近的上側的輸送輥9的各個溝槽1 5 由窄的細溝槽構成（參照第3(a)、4(a)、4(b)圖）。 進而，作爲對策2，上側的輸送輥9，使溝槽1 5以等 間距地在寬度方向G上形成，同時，在前後的輸送方向C 鄰接位置的輸送輥9相互間溝槽1 5不重合地錯開地配置（ 參照第5(a)圖）。 通過採用追樣的對策1、對策2，該表面處理裝置5， 儘管在前後的輸送方向C上形成溝槽1 5，也可將亂流的發 生抑制到最小限度。 即，可預計從噴嘴4噴射出的處理液B，如上所述， 在基板材A的外表面的左右的寬度方向G上流動，由此進 行表面處理，然後，從基板材A的左右兩側流下、回收。 -33- 200536618 因此，噴射在基板材A的外表面的處理液B沿著前後輸送 方向C的溝槽1 5，前後直線地大量流動，即，向前後發生 亂流是不理想的。 因此，對於該表面處理裝置5，作爲對它的對策1，對 於上側的輸送輥9等，作爲溝槽1 5採用將這樣液流限制在 少量的細溝槽，同時作爲對策2，在上側的各輸送輥9相互 間錯開溝槽1 5，不讓在輸送方向C上呈直線重合。因此， 用這樣的對策1、2，確實阻止處理液B在前後的輸送方向 C直線地大量流動。 對於該表面處理裝置5，儘管採用沿著前後的溝槽15 ，也將從上側噴射在基板材A的外表面（上面）的處理液B 沿著溝槽1 5在前後流動抑制在最小限度，抑制了向前後的 亂流的發生。因此，也防止了亂流發生對於表面處理的壞 影響。 另外，雖然作爲溝槽1 5採用窄溝槽，由此比寬溝槽增 加了與基板材A的接觸面積，但只不過是程度的問題，作 爲溝槽1 5維持防止基板材A的貼附、附著、卷附等功能。 (9)相對於此，對於基板材A的外表面（下面），由於從 下側噴射的處理液B在表面處理後立即因重力掉下，所以 不必擔心上述的亂流發生。 因此，對於下側的輸送輥1 0，與上側的輸送輥9，在 上述地方不同，作爲溝槽16，可採用接觸面積更寬的寬溝 槽。另外，也不需要在輸送方向C錯開溝槽1 6的間距，該 錯開是爲了在前後的輸送輥1 0相互間不讓溝槽1 6重合。 -34- 200536618 _ * (五）圖式簡單說明 第1圖是本發明的基板材的表面處理裝置的、用於說 明實施發明的最佳方式的側視圖。 第2(a)〜2(c)圖用於說明實施該發明的最佳方式，其 中，第2 (a)是要部的側視圖；第2 (b)圖是第2 ( a)圖的上側 的輸送輥等的放大圖；第2(c)是第2(a)圖的下側的輸送輥 等的放大圖。 第3(a)和3(b)圖用於說明實施該發明的最佳方式，其 中第3(a)圖是上側的輸送輥等的要部的俯視圖；第3(b)圖 φ 是下側的輸送輥等的要部的俯視圖。 第4(a)和4(b)圖用於說明實施該發明的最佳方式，其 中第4(a)圖表示上下的輸送輥的要部的主視圖；第4(b)圖 表示上下的輸送輥的另外一個例子的要部的主視圖。 第5(a)〜5(c)是說明實施該發明的最佳的方式，其中 第5(a)圖是表示上側的各輸送輥的俯視圖；第5(b)圖是用 於說明剝離部件的要部的主視圖；第5 (〇圖是用於說明該 剝離部件的要部的側視圖。 # 第6圖是表面處理裝置的整體的側視圖。 第7圖是表面處理裝置的整體的主視圖。 第8(a)圖是以往例的側視圖，第8(b)圖是基板（基板材） 的模式化了的俯視圖。 主要元件符號表 1 表面處理裝置（先行技術） 2 輸送機（先行技術） -35- 200536618 3 輸送輥（先行技術） 4 噴嘴 5 即，對於這樣的表面處理裝置（本發明） 6 處理室 7 輸送機（本發明） 8 中間部件 9 輸送輥（本發明） 10 輸送輥（本發明）200536618 IX. Description of the invention: (1) Technical field to which the invention belongs The invention relates to a surface treatment device for a base plate. That is, the present invention relates to a processing device used in a manufacturing process of an extremely thin circuit board such as a flexible printed wiring board, in which a substrate is sprayed with a processing solution while the substrate is being conveyed. (2) In the prior art, along with the high performance, high functionality, miniaturization and weight reduction of electronic equipment, the circuit substrates, such as flexible printed wiring substrates, have also become more precise, precise, extremely thin, and diversified. With the advancement of circuits, the density and miniaturization of micrometer units have become extremely remarkable. For the manufacturing process of such a substrate, a surface treatment device is used in each process, and various processing liquids are sprayed on the base material being conveyed, and various chemical liquid treatments and washing treatments are performed on the base material. For example, the substrate is sprayed with a processing liquid such as a developing solution, a corrosive solution, a stripping solution, and a cleaning solution in order. Therefore, surface development such as uranium decay and peeling is sequentially performed to manufacture a circuit board. . For another example, the base plate is sequentially subjected to a treatment liquid such as electroless copper plating—development—electrolytic copper plating—spraying liquid spraying and washing liquid spraying, followed by surface treatment to manufacture a circuit board. Fig. 8 (a) is a side view illustrating such a conventional example. Regarding such a surface treatment device 1 as a developing device, an etching device, a peeling device, a washing device, etc., the base plate A is conveyed by the conveying roller 3 of the conveyor 2 and the treatment liquid B is ejected from the nozzle 4. Liquid processing and washing processing, manufacturing 200536618 The circuit board is formed. As the conveying roller 3 of the conveyor 2, straight rollers are typically used. The straight rollers are arranged up and down, and there are multiple arrangements in the forward and backward conveying directions C. Therefore, the base plate A is sandwiched and rotated while being conveyed horizontally. The nozzle 4 is placed opposite to the substrate A to be conveyed, and the treatment liquid B is ejected from above and below. Examples of the surface treatment device 1 for the base material A of such a conventional example are disclosed in Patent Literature 1 and Patent Literature 2 below. (Patent Literature 1) Japanese Invention Patent No. 3 4796 36 (Patent Literature 2) Japanese Invention Patent Publication No. 2002-009420 (3) Summary of Invention However, the surface treatment device for the base plate A of such a conventional example 1. There are the following problems. That is, a. As described above, the base material A for such a circuit is extremely thin and flexible. In particular, the flexible printed wiring board is extremely thin, and is weak, soft, and flexible. For example, the wall thickness of the insulating layer (core material) part is about 10 # ni, and the wall thickness of the circuit (copper foil) part is about 10 # m. b. Such a base plate A is liable to be electrostatically charged in a dry state and wetted when the treatment liquid B is sprayed, and thus has adhesion and adhesion. c. Such a base plate A is easily affected by the spray pressure and weight of the treatment liquid B. d. Because it is pinched by the conveying roller 3 and rotates in contact, it also acts on the pressure 200536618. Therefore, due to the reasons of a, b, c 'd, such a base plate A — the conveyance by the surface treatment device 1 — 3 horizontal conveyance When the processing liquid B is sprayed from the spray nozzle 4, various troubles j) occur during transportation, which becomes a problem. That is, troubles in transportation such as attachment, winding, rolling, adsorption, bell tail, wrinkling, bending, bending, breaking, hanging, falling, etc. often occur. It is difficult to stabilize the transportation, and it is anxious to achieve smooth transportation. . For example, the conveyed base sheet A closely adheres and is wound around the outer peripheral surface of the conveyance roller 3 which has just passed through the front end portion thereof, or an accident has occurred in which it fell from the conveyance roller 3. In view of the above-mentioned actual situation, in order to solve the above-mentioned conventional problems, the inventors of the surface treatment device for a base material according to the present invention have intensively studied the results and completed it. The conveying roller and the intermediate member are characterized by forming grooves and the like to reduce the contact area. Furthermore, the upper conveying roller is characterized in that it is formed with fine grooves, or the grooves are staggered without overlapping, and the protruding end portion of the intermediate member is embedded in the groove of the conveying roller, and is further adjacent to the upper conveying roller. A peeling member is attached. Therefore, an object of the present invention is to provide a surface treatment of the base plate that can eliminate the troubles in transportation, realize smooth and stable transportation of the base plate, and at the same time suppress the occurrence of turbulent flow of the processing liquid on the base plate, and maintain the processing accuracy. Device. To solve the above problems, the technical means of the present invention are as follows. The surface treatment device for a base plate according to the first aspect of the present invention is used in the manufacturing process of a circuit board for 200536618, and a treatment liquid is sprayed on the base plate for surface treatment. It has a conveying roller that conveys the base plate, a nozzle that sprays the processing liquid on the base plate, and an intermediate member that is arranged between the conveying rollers. The conveying roller is characterized in that unevenness is formed on the outer surface, and the contact area with the base material is reduced. A surface treatment device for a base material according to a second aspect of the present invention is characterized in that, in the first aspect of the present invention, an outer surface of the intermediate member is uneven, and a contact area with the base material is reduced. According to a third aspect of the present invention, there is a substrate surface treatment device, wherein in the second aspect of the present invention, the conveying roller is formed in a straight roll shape, and when the words are arranged vertically, a plurality of the conveying rollers are arranged in the forward and backward conveying directions. The conveying roller grips the base plate and performs contact rotation, thereby realizing horizontal conveyance. The intermediate member is characterized in that it is arranged on the horizontal conveying surface of the conveying roller at a slight introduction height, and guides the base plate to the conveying direction. In addition, the nozzle is placed opposite to the conveyed base plate, and the treatment liquid is sprayed from above and below. According to a fourth aspect of the present invention, there is provided a surface treatment device for a base material, wherein in the third aspect of the present invention, the conveying roller and the intermediate member are formed with grooves and grooves, respectively. Further, the grooves are arranged at intervals in the left and right width directions, and a plurality of the grooves are formed along the front and rear conveyance directions. According to a fifth aspect of the present invention, in the surface treatment device for a base material, in the fourth aspect of the present invention, the grooves of the conveying roller on the upper side are formed by narrow narrow grooves. The groove of the conveying roller on the lower side is constituted by a wide wide groove. According to a sixth aspect of the present invention, the surface treatment device for a base plate is characterized by 200536618. In the fourth aspect of the present invention, the conveying roller is disposed on the upper side near the front and rear of the nozzle. The groove is formed by a narrow fine groove. . Each of the grooves of the upper conveyance roller and the lower conveyance roller is constituted by a wide wide groove. The surface treatment device for a base plate according to the seventh aspect of the present invention is characterized by the fourth aspect of the present invention. In the middle of the conveying roller, the grooves are formed at equal intervals in the width direction, and the grooves are arranged so as to be staggered from each other in the conveying direction so that the grooves do not overlap each other. According to a fourth aspect of the present invention, there is provided a surface treatment device for a base material according to the eighth aspect of the present invention, wherein the intermediate member has a plurality of protruding end portions extending toward the conveying direction. Furthermore, the protruding end portions are fitted into the grooves of the corresponding conveying rollers from the front and back, and are brought into sliding contact. According to a ninth aspect of the present invention, in the surface treatment device for a base material, in the fourth aspect of the present invention, the transport roller is provided with a plurality of peeling members adjacent to each other. Further, the peeling member is located on the downstream side of the conveying roller, and the upper end portion is rotatably supported by the shaft in the forward and backward conveying directions, while the lower end portion is fitted into the groove of the conveying roller from the upper side to be engaged with the sliding contact. According to a tenth aspect of the present invention, the surface treatment device for a base plate is characterized in that, in the fifth, sixth, seventh, eighth, or ninth aspect of the present invention, in the manufacturing process of the flexible printed wiring board, in the chemical liquid treatment process and washing Works for use. In addition, the base material is extremely thin, weak, soft and flexible. The nozzle sprays a developing solution, an etching solution, a peeling solution, or a washing solution as the processing solution. The function of the surface treatment device for a base material of the present invention is described below. 200536618 (1) This surface treatment device is used in the manufacturing process of flexible printed wiring boards and other circuit substrates, and is used in chemical solution treatment processes and washing processes. The surface treatment apparatus includes conveying rollers, nozzles, and intermediate components. (2) The base roller is rotated by contact between the base roller and the conveying roller to perform horizontal conveyance. The nozzle sprays processing liquids such as a developing liquid, an etching liquid, a peeling liquid, and a washing liquid on the base plate from above and below. The intermediate members are respectively arranged between the conveying rollers and contact the guide base plate. (3) Here, the surface treatment device performs surface treatment on the sprayed treatment liquid while conveying the base material. The treatment liquid flows through the outer surface of the base plate in the left-right width direction and then flows down from both sides. (4) However, the base material for a circuit is extremely thin and softened significantly, and the strength is weak and soft. Moreover, b. Such a base plate is wetted in static electricity or a treatment liquid, with adhesion and cohesion, and furthermore, c. Is easily affected by the spray pressure and weight of the treatment liquid, d. Clamped on the conveying roller is also subjected to the pressure. (5) Therefore, as the countermeasure 1 of this surface treatment device, while the intermediate component is being conveyed, the conveying light and the outer surface of the intermediate component are moved along the outer surface. Concavities and convexities, such as grooves, are formed in the conveying direction, and the contact area with the base material is reduced. Therefore, even under the conditions of a, b, c, and d, the base plate will not be attached, adhered, wound on the conveying light and intermediate parts, and will not fall off, which can prevent rolling, adsorption, Trouble such as warping, wrinkling, bending, bending, breaking, hanging, etc. can be conveyed stably. In addition, the arrangement of the intermediate members further exhibits the following advantages. That is, process-11-200536618 'The liquid stays between the upper and lower intermediate members, especially the lower intermediate member forms a liquid storage part, and the ultra-thin and soft base material is transported in the liquid in the liquid storage part of such a processing liquid. . Therefore, by conveying in the liquid storage part of such a treatment liquid, the base sheet can lose its adhesion and cohesiveness, and at the same time, it can be reliably conveyed even with a slight conveying force. From these aspects, stable conveyance can be achieved. . (6) Furthermore, as a countermeasure 2, in this surface treatment device, a concave-convex comb-like protruding end portion is attached to the intermediate member, and the grooves of the corresponding conveying rollers are fitted and slid into contact with each other from front to back. Therefore, trouble can be prevented from this aspect, and the base plate material can be surely and stably conveyed. (7) Furthermore, as a countermeasure 3, a concave-convex comb-like peeling member which can be swung back and forth is provided adjacent to the downstream side of the upper conveying roller, and is fitted into the groove of the conveying roller from the upper side to make sliding contact. Therefore, the base material to be attached, adhered, and wound may be peeled off. From this aspect, troubles can also be prevented, and ideally and stably realize conveying. (8) However, with this surface treatment apparatus, as described above, a plurality of grooves are formed in the forward and backward transport directions. Therefore, as the countermeasure 1 of this surface treatment apparatus, the grooves of the upper conveyance roller arranged near the upper conveyance roller or near and behind the nozzle are formed by narrow grooves having a narrow width. As a countermeasure 2, the conveying rollers are arranged staggered in the conveying direction without overlapping the grooves. That is, as described above, it is not desirable that the sprayed treatment liquid flows in the width direction of the outer surface of the base plate, and that a large number of turbulent flows are formed along the grooves in the forward and backward transport directions. Therefore, by using fine grooves with a small flow rate -12- 200536618 ^ 'staggered grooves, the occurrence of turbulence is minimized. (9) On the contrary, the treatment liquid sprayed from the lower side to the outer surface of the base plate falls off immediately after the surface treatment, so there is no need to worry about turbulence. Therefore, a wide groove is adopted as the groove on the lower conveying roller, and it is not necessary to stagger it in a non-overlapping manner. As described above, the surface treatment device for a base material according to the present invention is characterized in that grooves and the like formed in the conveying roller and the intermediate member reduce the contact area. Furthermore, each of the upper conveying rollers is characterized by being formed with fine grooves or staggering the grooves without overlapping, and the protruding end portion of the intermediate member is inserted into the groove of the conveying roller, and is further adjacent to the upper conveying roller. A peeling member is attached. Therefore, the surface treatment apparatus for a substrate of the present invention exhibits the following effects. First, it eliminates troubles in transportation, and realizes smooth and stable transportation of the base material. That is, the surface treatment device for a base material of the present invention arranges an intermediate member contacting the guide base material between the conveying rollers contacting the base material, and at the same time, forms irregularities such as grooves on the outer surfaces of the conveying roller and the intermediate member, thereby reducing Contact area of base plate. Furthermore, a protruding end portion is attached to the intermediate member, and it is embedded into the groove of the corresponding conveying roller from front to back, slidingly contacts it, or a peeling member is attached adjacent to the upper conveying roller, and is inserted into the groove of the conveying roller and slides therewith. Touched. Thereby, stable conveyance of the base material can be achieved. That is, the base plate is a. Extremely thin and soft, b. Adhesion and stickiness in static electricity or treatment liquid -13- 200536618 Condensation, furthermore, c. It is also affected by the spray pressure and weight of the processing liquid. D. It can also be conveyed without any trouble under the condition that it is easily affected by the pressure of the conveying roller. It can reliably eliminate the adhesion, winding, rolling, adsorption, warping Trouble of tail, wrinkling, bending, bending, breaking, hanging, and then falling. In addition, the arrangement of the intermediate members further exhibits the following effects. That is, the processing liquid stays between the upper and lower intermediate members, especially the lower intermediate member forms a liquid storage portion. The liquid in the liquid storage portion of the processing liquid thus formed is transported extremely thin and soft with adhesion and Adhesive base plate. Φ In addition, the liquid can be transported in such a liquid storage unit, so that the base material can lose its adhesion and cohesiveness, and can be reliably transported even with a slight transport force. From these aspects, stable transport can be achieved. Second, turbulent flow of the processing liquid on the base plate is suppressed, and the processing accuracy is maintained. That is, the surface treatment device for a base material of the present invention uses grooves along the conveyance direction, but the grooves are made into fine grooves for each of the upper conveyance rollers, and the grooves are staggered in the conveyance direction. · As a result, the processing liquid sprayed on the base plate flows back and forth along the grooves to a minimum, and the occurrence of turbulence is suppressed. Thereby, it is possible to prevent processing marks such as crisscross patterns from occurring on the substrate due to turbulent flow, and it is possible to ensure the accuracy of the chemical liquid processing and the washing processing. In this way, the problems existing in such conventional examples can be solved, and the effect exerted by the present invention is extremely significant. (IV) Embodiment -14-200536618 The following describes the surface treatment device of the base plate of the present invention in detail based on the best mode for carrying out the present invention shown in the drawings. Figure 1, Figures 2 (a) to 2 (c), Figures 3 (a) and 3 (b), Figures 4 (a) and 4 (b), and Figures 5 (a) to 5 (c ) And so on are diagrams for explaining the best mode of the present invention. Fig. 1 is a side view, Fig. 2 (a) is a side view of a main part, Fig. 2 (b) is an enlarged view of an upper conveying roller, etc. in Fig. 2 (a), and Fig. 2 (c) is a view 2 (a) is an enlarged view of a lower conveying roller and the like, and FIG. 3 (a) is a plan view of a main portion of the upper conveying roller and the like, and FIG. 3 (b) is a main portion of the lower conveying roller and the like Top view. Fig. 4 (a) is a front view showing the main part of the vertical conveying roller, and Fig. 4 (b) is a front view showing the main part of another example of the vertical conveying roller. Fig. 5 (a) is a plan view showing each of the conveying rollers on the upper side, and Fig. 5 (b) is a front view for explaining a main part of the peeling member. Fig. 5 (c) is a side view for explaining the main part of the peeling member. Fig. 6 is a side view of the entire surface treatment apparatus. Fig. 7 is a front view of the entire surface processing apparatus. Fig. 8 (b) is a schematic plan view of a substrate (base material). 0 The surface treatment device 5 of the base plate A is used in a manufacturing process of a substrate F for a circuit E. Here, the substrate F will be briefly described with reference to Fig. 8 (b). The substrate F for the circuit E is widely used as an electrical connection in AV equipment, personal computers, mobile phones, digital cameras, and various other electronic devices. The outer surface and the inside of the insulating layer are formed to connect various components. Circuit E graphics. • 15- 200536618 In addition, as the substrate f for the circuit E, there are various substrates such as single-sided substrates, double-sided substrates, and multilayer substrates (including the recent assembly method), which can be divided into rigid rigid and film-like flexible types. of. As part of such a substrate F, semiconductor components such as I c, L SI elements, passive components, drive components, capacitors, and the circuit E appear together as a module substrate (semiconductor-integrated plug-in substrate) or on a glass substrate. The upper circuit E is a glass substrate in which semiconductor components are embedded, that is, a glass substrate for a plasma display PDP or a glass substrate for a liquid crystal LCD, or CSP, PBGA, and the like. Of course, the substrate f referred to in this specification includes the above-mentioned ones in addition to the conventional printed wiring boards. The substrate F for such a circuit E has been developed in terms of high accuracy, miniaturization, thinning, softening, and further multi-layering and diversification along with the increase in performance, functionality, and miniaturization of electronic equipment. The circuit E is formed on the outer surface (that is, one or both of the top, the surface and the bottom, and the inside), and the density and miniaturization of the circuit E formed inside is also significant. The substrate F, such as the length and width cutting of the printed wiring substrate The size is, for example, about 5 00mm X 5 00mm. Wall thickness, insulation layer (core material) part from the previous 1. 6mm extremely thin into 1. It is about 0mm to 60 // m. Recently, it has been extremely thinned from 50 // m to about 10 / m. The wall thickness of the E part (copper foil part) of the circuit has also been extremely reduced to 75 // m to 35 // m. Recently, the thickness has been extremely reduced to approximately 16 // m to 10 // m. Even for multi-layer substrates, the total wall thickness is extremely reduced to 1. 0mm ~ 〇. About 4mm. The width of the circuit E and the interval between the circuits E are also miniaturized to about 3 0 // m to 1 5 // m. Nearly -16- 200536618 ’there is a tendency to miniaturize to about 1 0 // m. Hereinafter, a method for manufacturing the substrate F using the surface treatment device 5 of the base plate A will be described with reference to Fig. 8 (b), and Figs. 6 and 7 and the like. First, a manufacturing method of the first example will be described. In the manufacturing method of the i-th example, the 'substrate F, for example, a printed wiring board is manufactured according to the following procedure. Initially, a film-like resin insulating layer (core material) made of glass cloth, ceramic, or polyimide is used. A copper foil was attached to the outer surface of the substrate by hot pressing or the like to obtain a copper-clad laminated base plate A. Then, the base plate A prepared in this manner was subjected to surface roughening treatment (soft leaching uranium) on the surface of the attached copper foil, and then cut into short pieces. The surface roughening treatment has been conventionally performed by mechanical honing, but recently, the surface roughening treatment is often performed by spraying the treatment liquid B. Moreover, in many cases, laser processing is used to perform hole processing. The perforations are formed by fine through holes between the two outer surfaces of the base plate A (substrate F). For one sheet, hundreds of holes with extremely small diameters are mostly formed, and their diameters are mostly 0. 5mm ~ 0. 2 mm. Perforations are used for interlayer conductive connection between circuits E (copper foil) on both outer surfaces or between circuits E (copper foil) on a multilayer substrate or mounting of semiconductor components mounted on circuit E. Recently, instead of a perforation that requires hole processing, a bump that forms a small bump-like, slightly conical frustum-shaped contact has also been developed. For multilayer substrates, a technology that can achieve the same function as a perforation by a bump. In addition, the bumps are manufactured in the development process, corrosion process, and peeling process based on the circuit E. -17- 200536618 Then, a photosensitive resist is coated or adhered to the outer surface (one or both of the upper surface, the lower surface and the lower surface, the inner surface) of the copper foil of the base plate A in a film form. Next, a photo of Circuit E, which is predesigned as Circuit E, which is a negative of Circuit E, is exposed. As a result, the photosensitive resist remains on the outer surface are exposed and cured to form a portion of Circuit E, and other unnecessary portions are processed. The developing solution of the liquid B is sprayed, dissolved and removed. Then, the copper foil of such a base plate A hardens and forms a portion of the circuit E covered by the photoresist, and dissolves and removes unnecessary portions exposed by the photoresist by development. Uranium decay solution (copper chloride, ferric chloride, other corrosive solutions) is sprayed to dissolve and remove uranium decay. Next, the remaining photoresist of the circuit E forming portion is removed by spraying and peeling off the stripping solution of the processing solution B, and a predetermined conductor is formed on the outer surface of the base plate A by the copper foil of the remaining circuit E forming portion. A patterned circuit E, thereby manufacturing a substrate F. In addition, in the above-mentioned development process, decay process, and peeling process, in each post-processing process or post-processing process collected after the peeling process, a water washing liquid, a neutralizing agent liquid, and others sprayed as a treatment liquid B are attached. Therefore, the cleaning solution B, which is a cleaning solution, a corrosive solution, a peeling solution, and the like attached to the outer surface of the base plate A, is washed and removed. The manufacturing method of the first example is constituted by such a wet process method. This is the manufacturing method of the first example. The manufacturing method of the second example will be described below. As the manufacturing method of the substrate F, for example, a printed wiring board, the wet process method of the i-th example is a representative example, but the semi-additive method of the second example is also often used. With this semi-additive method, first, electroless copper plating is performed on the outer surface of the base plate A in which perforations are formed in advance. Then, a photosensitive resist is coated or pasted on the electroless copper plating in a film-like form—exposing a photograph of a circuit E as a circuit E film. -Then, the exposed portion of the photosensitive resist is left to cure and the remaining portion, that is, the circuit E forming portion is dissolved and removed by spraying the developing solution as the processing solution B. Then, electrolytic copper plating is performed on the circuit E forming portion, that is, the pattern portion of the plating layer where the photoresist is removed by development dissolution, that is, the portion exposed by electroless copper plating, to form the circuit E. — In addition, the photoresist other than the solidified circuit e forming portion is peeled off by spraying the stripping liquid as the processing liquid B, and the exposed non-electrolytic copper plating is quickly sprayed by the etching liquid as the processing liquid B. Corrosion and melting. -In addition, for post-processing of each process, a washing process is attached in accordance with the above-mentioned parts, and the washing liquid is used as the processing liquid B. In the semi-additive method of the second example, a circuit E is formed by electrolytic copper plating, and a substrate F is produced. This is the manufacturing method of the second example. However, the manufacturing method of the substrate F for other circuits E of the printed wiring board has recently been diversified, and various methods are being developed and used in addition to the first and second examples described above. Of course, the present invention is also applicable to such various manufacturing methods of the substrate F. In the following, reference is made to Figs. 1, 2 (a) to 2 (c), Figs. 3 (a) and 3 (b), Figs. 4 (a) and 4 (b), and 5 (a) to 5 (c) FIG., FIG. 6, FIG. 7, etc. are used and the surface treatment apparatus 5 of the base material A of this invention is demonstrated in detail. -19- 200536618 The surface treatment device 5 is used in the above-mentioned manufacturing process of the substrate F, and the substrate A is sprayed with the treatment liquid b, and the substrate A is subjected to surface treatment. That is, the “surface treatment device 5 is used as a developing device, an etching device, a peeling device, or a cleaning device in each process of the manufacturing method of the substrate F, such as a development process, an etching process, a peeling process, or a washing process.” The transported base plate A is sprayed with a treatment liquid B such as a developing liquid, a uranium rot solution, a stripping liquid, or a washing liquid, and is subjected to a surface treatment such as a chemical liquid treatment and a washing treatment of the base plate A. In addition, each of these surface treatment devices 5 is common, and includes a conveyor 7, a nozzle 4, an intermediate member 8, and the like in the treatment chamber 6. That is, the conveyor 7 has a conveyor 7 for horizontally conveying the base material A, a nozzle 4 for spraying the processing liquid B on the conveyed base material A, and intermediate members arranged between the upper and lower conveying rollers 9, 10 of the conveyor 7. 8. In addition, the surface treatment device 5 is used in a manufacturing process of extremely thin substrate F such as a flexible printed wiring board, a chemical liquid treatment process and a washing process. The base material A is extremely thin and has low strength, softness, and richness. For flexibility, refer to the following. The conveyor 7 of the surface treatment apparatus 5 will be described with reference to FIGS. 1, 2 (a) to 2 (c), 6 and 7. The conveyor 7 is disposed in the processing chamber 6 and includes conveying rollers 9 and 10 composed of straight rollers. The conveying rollers 9 and 10 are disposed above and below, and a plurality of them are disposed in the forward and backward conveying direction C and sandwiched therebetween. The base plate A is rotated horizontally by contact rotation. -20- 200536618 This conveyor 7 is described in further detail. The conveyor 7 has 9 sets of horizontal upper conveying rollers and 10 sets of lower conveying rollers of the same level. The upper and lower conveying rollers 9 and 10 are each composed of a long cylindrical straight roller. In addition, while the roller shafts 11 and 12 are oriented in the left-right width direction, a plurality of front-back intervals are arranged along the front-rear conveyance direction (a plurality of front-back intervals are omitted in FIG. 6). Further, the upper and lower conveying rollers 9, 10 are arranged in pairs above and below the base plate A sandwiching the conveyed article, except for a wide space J for ejecting the processing liquid B positioned higher or lower than the nozzle 4. In the middle of the 9 sets of the upper conveying rollers and the 10 sets of the lower conveying rollers, the space J is intermittently formed, and the forming positions are shifted up and down in the conveying direction C. The conveying rollers 9 and 10 are respectively crimped from above and below to the base plate A of the conveyed object, and at least the lower conveying roller 10 is rotated so that the base plate A is horizontally conveyed in the processing chamber 6 from the upstream side along the conveying direction C. To the downstream side. Concavities and convexities 13 and 14 ′ of the conveying rollers 9 and 10 of the surface treatment apparatus 5 are referred to FIGS. 2 (a) to 2 (c), FIGS. 3 (a) and 3 (b), 4 (a), and 4 (b). The upper and lower conveying rollers 9 and 10 simultaneously form irregularities 13 and 14 on the outer surface, so the contact area with the base plate A is reduced. These unevennesses 1 3, 1 4 are formed by, for example, grooves 15, 16 which are spaced apart from each other in the left-right width direction G and formed in a plurality of directions along the forward and backward conveying directions c. Such concavities and convexities 1 3 and 1 4 will be described in more detail. First of all, the concaves and convexes 13, 14, and the grooves 15, 16 on the outer surfaces of the conveying rollers 9, 10 are representative, but in addition, the contact surface of the base plate A with a total area of 21-200536618 is fully contacted by other methods. Various means and shapes of reduction are also possible. For example, a plurality of holes may be formed and rough-surface processing such as knurling may be performed. Representative grooves 15 and 16 are formed on the outer surface of each of the conveying rollers 9 and 10, and these grooves are spaced at equal intervals in the width direction G and face forward and backward. The conveying direction is formed. That is, grooves 5 and 16 are concavely formed on the outer peripheral surface of the conveying rollers 9 and 10 in the width direction G, and convex portions at intervals between the grooves 15 and 16 are formed. Only the convex portion is conveyed in contact with the base plate A to be conveyed, so the amount of the concave portion of the grooves 15 and 16 decreases with the contact area with the base plate A. In the illustration, as shown in the top view of FIG. 3 (a) and the front view of FIGS. 4 (a) and 4 (b), the upper grooves 15 for conveying light 9 are formed by narrow thin grooves, such as As shown in the top view of FIG. 3 (b) and the front view of FIGS. 4 (a) and 4 (b), the grooves 16 of the lower conveying roller 10 are formed by wide wide grooves. In addition, the grooves 15 of the upper conveying roller 9 arranged near the front and back of the nozzle 4 are formed by narrow narrow grooves, and the remaining grooves 15 and 16 of the upper conveying roller 9 and the conveying roller 10 are each formed. Consists of a wide, wide trench. That is, as the grooves 16 of the lower conveying roller 10, wide grooves having a large width dimension are used in the left-right width direction G. In contrast, for the upper conveying roller 9, at least the vicinity of the nozzle 4, that is, the groove 15 in the central portion of the processing chamber 6, uses narrow grooves having a small width in the left-right width direction G, but serves as the entrance to the processing chamber 6 The trenches 15 near and near the exit are not necessarily narrow trenches, and wide trenches are also possible. In addition, it is not limited to this. The grooves 15 of the upper conveying roller 9 and the grooves 16 of the lower conveying roller 10 can be the same width, or both can be adopted. Trench. In this case, there is an advantage that the cost is reduced. In addition, as shown in the top view in FIG. 5U), in the legend, the grooves 15 of the upper conveying roller 9 are formed at equal intervals in the width direction G, and the grooves 15 in the width direction G are not overlapped. The pitches of the grooves 15 are shifted from each other in the forward and backward transport directions C. That is to say, the grooves 15 formed at equal intervals in the upper conveying roller groups 9 are not overlapped with each other in the conveying direction C, and the left and right width directions G are slightly shifted. In addition, for the lower group 10 of the transport rollers, the grooves 15 formed at equal intervals are also formed in accordance with the nine groups of the upper transport rollers, and the respective transport rollers 10 do not overlap with each other linearly in the transport direction C. The left and right width directions G are slightly shifted. The advantages in this case are the same as those of the upper 9 sets of conveying rollers, which will be described later. Hereinafter, a method for forming the grooves 15 and 16 of the conveying rollers 9 and 10 of the surface treatment apparatus 5 will be described. First, for the examples shown in FIGS. 3 (a), 3 (b), and 4 (a), for the roller shafts 1 and 12, external fitting and fixing are preformed to form grooves 1 and 5 and 1 6 of the conveying rollers 9, 10. That is, the shafts 11 and 12 are fixedly inserted into the shaft holes of the conveying rollers 9 and 10 with the grooves 15 and 16 respectively. In contrast, for the example shown in Fig. 4 (b), a plurality of short columnar roller members 17 and grooves 15 for forming a gap 15 are used for the upper feed roller 9. In addition, for the roller shafts 1 and 12, by alternately externally fitting the roller member 17 with the shaft hole and the collar 18 in turn, the assembly of the roller member 17 can be used to form the conveying roller 9, and the collar 18 partially becomes Trench 1 5. -23- 200536618 That is, the roller shaft 11 is alternately inserted into each roller member with a shaft hole and the collar 18 to form a conveying roller 9 with a groove 15. In addition, in FIG. 4 (b), it may be fixed between the roller shaft 11 and the roller member 17 but may be rotatably mounted. In the latter case, the upper conveying roller 9 becomes a free roller. In addition, the lower conveying roller 10 can also be formed by using such a roller member 17 and the collar 18, but the lower conveying roller 10 is a driving roller, so the roller 12 and the roller member 17 etc. Make fixed rollers between them. On the contrary, when the upper conveying roller 9 is made into a free roller, there is an advantage in that the mounting accuracy of the upper conveying roller 9 has a margin. That is, when the upper conveyance roller 9 is used as a driven roller or a free roller, compared with the case where the upper conveyance roller 9 is used as a fixed roller, the positional relationship with the lower conveyance roller 10 is not strictly required. , Has the advantage of low cost. Hereinafter, the peeling member 19 of the surface treatment apparatus 5 will be described with reference to Figs. 5 (b) and 5 (c). In the surface treatment apparatus 5 shown in these drawings, a plurality of peeling members 19 are attached adjacent to the upper conveyance light 9. The peeling member 19 is located on the downstream side of the conveying roller 9, and its upper end portion is pivotally supported in the forward and backward conveying direction ^, and its lower end portion is fitted into the groove 15 of the conveying roller 9 from the upper side, and The groove is in sliding contact. The follow-up sample release member 19 'will be described in more detail. All the upper-side feed f is lighter than each of the 9 sets of feed 9 or near the front and back of the nozzle 4, that is, each of the conveying rollers 9 in the center of the processing chamber 6 is provided with a peeling member 19 200536618. The peeling member 19 is located in the opposite direction. A downstream side in the conveying direction C of the conveying roller 9 is formed into a substantially vertical thin rod shape, and a plurality of them are provided in the left-right width direction G. Each upper end portion of each peeling member 19 is supported on a shaft 21 in the left-right width direction G by a bracket 20, and can swing back and forth in the conveying direction C. The lower end portion of each peeling member 19 is inserted from the upper side into the groove 15 of the conveying roller 9 corresponding to the lower position, and is in sliding contact therewith. Therefore, the conveying roller 9 is engaged near the top end of the groove 15 on the downstream side. The lower end portions of the respective peeling members 19 are arranged side by side with the same width and pitch as the grooves 15 in the left-right width direction G. In the example shown in the figure, the intermediate member 8 is omitted for the front and rear intervals Η of the conveying rollers 9 adjacent to the peeling member 19 with the upper side attached thereto. However, an example in which the intermediate member 8 is disposed and an example in which the intermediate member 8 is not disposed are possible. . That is, the peeling member 19 may be used simultaneously with the intermediate member 8 having the same function with respect to the upper conveying roller 9, or it may be used alone without using the intermediate member 8. Hereinafter, the nozzle 4 of the surface treatment apparatus 5 will be described with reference to Figs. The nozzle 4 is disposed in the processing chamber 6 and is placed opposite to the conveyed base plate A, and sprays a processing liquid B such as a developing liquid, an etching liquid, a peeling liquid, or a washing liquid from above and below. Such a nozzle 4 will be described in more detail. The nozzles 4 are arranged above and below the base plate A conveyed by the conveyer 7 of the conveyor 7 in a horizontal position at intervals of up and down, facing the above-mentioned conveying rollers 25-200536618. , 1 〇 interval space j. A plurality of nozzles 4 'are arranged at regular intervals in the front-rear conveyance direction C and the left-right width direction G', and a plurality of the nozzles 4 'are arranged up and down with the base plate A interposed therebetween. Therefore, the 'treatment liquid B is pressure-fed from the liquid tank 22 to the nozzles 4 through the pump 23 and the piping 24, and is sprayed onto the base plate a. Then, after flowing along the outer surface of the base plate a to the left or right for surface treatment, it flows down from the left and right sides of the base plate A, and then returns to the liquid groove 22, and then loops back to use 0 or less. 1, 2 (a) to 2 (c), 3 (a) and 3 (b) and the like illustrate the intermediate member 8 of the surface treatment apparatus 5. The intermediate member 8 is disposed above each of the upper conveying rollers 9 and the lower conveying rollers j 〇, and is arranged vertically above the level of the horizontal conveying surface of the base plate A conveyed by the conveying rollers 9, 10. , Contact the guide base plate A in the conveying direction c. The intermediate member 8 will be described in more detail. The intermediate member 8 is formed in a plate-like shape, a plate-like shape, or a comb-like shape, and is detachably arranged on the front-to-back space Η between each conveying roller 9 and the front-to-back space 间 between each conveying roller 10, respectively. Furthermore, the ejection space for the treatment liquid B is left in the center of the space J between the transport rollers 10 and the space J between the transport rollers 10, and is arranged before and after. In addition, the intermediate member 8 is formed in a long plate shape or a long rod shape that grows along the left and right width direction G, and is arranged up and down from the conveying surface of the base plate A, for example, a positioner system that is separated up and down by the wall thickness of the base plate A. . That is, the lower surface of the upper intermediate member 8 is arranged slightly higher than the lower surface of the outer periphery of the feed roller 9 which is also disposed on the upper side. Therefore, the surface of the base plate A is contacted, held, and guided from above. On the other hand, since the upper surface of the lower intermediate member 8 is arranged slightly lower than the upper surface of the outer periphery of the upper conveying roller 10, the lower intermediate member 8 is also placed in contact with and held in the “base material A” guided from below. In addition, there are various ways of positioning and holding the intermediate member 8 in the processing chamber 6. In the example shown in the figure, the vertical and vertical holding members 25 may be used, but they may also be held horizontally. When the latter is adopted, the intermediate members 8 are connected and fixed by horizontal ends, so that the entire members are approximately comb-shaped. Hereinafter, the unevenness 26 of the intermediate member 8 of the surface treatment apparatus 5 will be described with reference to Figs. 2 (a) to 2 (c), Figs. 3 (a) and 3 (b), and the like. The upper and lower intermediate members 8 are formed with irregularities 26 on the respective outer surfaces, and the contact area with the base plate A is reduced. The irregularities 26 are formed by, for example, grooves 27. Further, the grooves 27 are arranged at intervals in the left-right width direction G, and a plurality of grooves 27 are formed along the front-rear conveyance direction C. Further, such unevennesses 26 will be described in detail. The grooves 2 7 and the like formed on the outer surface of the intermediate member 8 are basically the grooves 1 3 and the like as the grooves 15 and 16 of the conveying roller 9 and 10 described above. 14formation. Only the main points are explained here. The unevenness 26 is formed on the lower surface of the upper intermediate member 8 and the upper surface of the lower intermediate member 8. The unevenness reduces the overall contact area ratio with the base plate A. The grooves 27, which are representative examples of the unevenness 26, are left and right The width direction G is formed in a straight line at equal intervals ′ and faces the forward and backward conveying direction c. Therefore, since only the convex portion between the grooves 27 is in contact with the base plate a, the amount of the groove 27 in the concave portion is to reduce the contact area with the base plate A. In addition, according to the above-mentioned conveying rollers 9, 10, narrow grooves can be used as the grooves 27 of the upper intermediate member 8, and wide grooves can be used as the grooves 27 of the lower intermediate member 8. However, it is not limited to this. For the upper and lower intermediate members 8, grooves 27 having the same width may also be used, and narrow grooves or wide grooves may also be used at the same time. Furthermore, the wide grooves and the narrow grooves may be used separately. . Hereinafter, the protruding end portions 28 of the intermediate member 8 of the surface treatment apparatus 5 will be described with reference to Figs. 2 (a) to 2 (c) and Figs. 3 (a) and 3 (b). The upper and lower intermediate members 8 are provided with protruding end portions 28 extending in a plurality of places toward the conveying direction C. The protruding end portions 28 engage the grooves 15 and 16 of the corresponding conveying rollers 9 and 10 from the front and rear. The ground is embedded and slides into contact. Such a protruding end portion 28 will be described in more detail. The front and rear end portions near the lower surface of the upper intermediate member 8 and the front and rear end portions near the upper surface of the lower intermediate member 8 are respectively a plurality of protruding end portions 28 protruding forward and backward into a thin rod or rod shape along the conveying direction C. . That is, when viewed from a plane, each of the protruding end portions 28 is arranged side by side in the left and right width direction G with the same width and pitch as the grooves 15 and 16. The protruding ends 2 8 of the upper intermediate member 8 and the grooves 15 of the upper conveying roller 9 are arranged side by side in an uneven shape with the same width and pitch, and the protruding ends 2 8 of the lower intermediate member 8 are arranged side by side. The grooves 16 of the conveying roller 10 are arranged in a flat uneven shape with a wide width and pitch. Each of these front and rear protruding end portions 28 engages and slides along the conveying direction C with respect to the grooves 15 and 16 of the conveying rollers 9 and 10 adjacent to the front and rear. 9, 1 〇 Grooves 1, 5, 16, that is, the top ends (upper and lower ends) of the grooves 15 and 16 ° In addition, for the intermediate member 8 arranged at the front and rear intervals η of the conveying rollers 9, 10, Such protruding end portions 28 are formed. On the other hand, for the intermediate member 8 adjacent to the space J disposed between the conveying rollers 9 and 10, one of the front and rear end portions does not have a protruding end portion 2 8 or the grooves 1 5 and 16 are not fitted even if formed. Sliding contact and occlusion become free. The same applies to the intermediate members 8 of the transfer rollers 9 and 10 on the inlet and outlet sides of the processing chamber 6. The surface treatment device 5 of the base plate A of the present invention is constructed as described above, and its contents are as follows. (1) The surface treatment device 5 of the base plate A is used as a display in the manufacturing process of flexible printed wiring boards and other circuit boards F for circuit E, and in various surface treatment processes such as chemical treatment processes and washing processes. Equipment, corrosion equipment, peeling equipment or washing equipment. Further, the processing chamber 6 includes conveying rollers 9, 10, a nozzle 4, an intermediate member 8, and the like. (2) Conveying rollers 9 and 10 are composed of straight rollers. They are arranged up and down, and a plurality of conveying directions C are arranged at the same time. The base plate A is clamped and rotated to make horizontal conveyance. The nozzle 4 is placed opposite to the base material A thus conveyed, and the substrate material A sprays a processing liquid B such as a developing liquid, an etching liquid, a peeling liquid, or a washing liquid from above and below. The intermediate members 8 are respectively arranged on the upper and lower conveying rollers 9, 10-29-29-200536618, and are arranged up and down slightly above the horizontal conveying surface of the conveying rollers 9, 10, and contact the guide base plate in the conveying direction C A. (3) Therefore, the surface treatment device 5 sprays the treatment liquid B on the conveyed base plate A to perform surface treatment on the base plate A. (Refer to Figs. 1, 6, and 7) 〇 That is, the base plate A is conveyed horizontally in the conveying direction C by the conveying rollers 9, 10 rotating in the up and down contact and the intermediate member 8 guided in the up and down contact. At the same time, the treatment liquid B sprayed from the nozzle 4 flows on the outer surface of the base plate A in the left-right width direction G to perform surface treatment. Then, the processing liquid B flows down from the left and right sides of the base plate A and is recovered. (4) However, a. The flexible printed wiring board and other base materials A for circuit E have been extremely thinned and softened, and are extremely thin, weak, soft, and flexible. Polyimide resin, which is a core material of a flexible printed wiring board, is particularly soft and easily bent. b. Such a very thin and soft base plate A is easily charged with static electricity in a dry state, and is wetted when the treatment liquid B is sprayed, so it has adhesion and cohesiveness. 〇 C. The extremely thin and soft base plate A is easily affected by the pressure of the treatment liquid B and the weight of the treatment liquid B ejected from the upper side, and is easily bent by the pressure and weight. d. Since it is pinched by the upper and lower conveying rollers 9, 10 and comes into contact with the conveying roller, it is also easily bent due to the pressing force. (5) Therefore, in the surface treatment device 5, in view of these a, b, c, d, the countermeasure 1 'countermeasure is adopted. 2. Countermeasure 3. -30- 200536618; First, as the most basic countermeasure 1, in this surface treatment device 5, a guide intermediate member 8 is arranged between the conveying rollers 9 and 10, and at the same time, the conveying rollers 9, 10 and the matching members are arranged. The outer surface of 8 is formed with irregularities 1 3, 1 and 4, therefore, the contact area with the substrate A to be transported is reduced. The concavities and convexities 1 3, 1 4 are representatively formed by the grooves 15 and 16 and a plurality of grooves 15 and 16 are formed in the left and right width directions G at intervals and along the forward and backward conveying directions C (see 2 (a) ) ~ 2 (c), 3 (a) and 3 (b), 4 (a) and 4 (b)). The presence of the contact-guided intermediate member 8 and the reduction of the contact area showing the reduction of the attached and adhered objects become the gist of the present invention, although under the conditions of a, b, c, and d described above, the base plate A for the transport roller 9 10, 10 and the intermediate member 8 will not be completely attached or curled, nor will they fall off between the transport rollers 9, 10, and be transported stably as required. That is, a. Although it is an extremely thin base material A with rich flexibility, adhesion, and adhesion, it can be transported stably without being affected by the spray pressure and weight of the treatment liquid B and the effect of the pressure. At this time, the lower intermediate member 8 particularly has a function of preventing dropping, and has a small contact area, and particularly has a function of preventing attachment, adhesion, and rolling. In this way, by adopting the countermeasure 1, when the surface treatment device 5 is used, it is possible to prevent the base plate A from adhering, rolling, rolling, attracting, tailing, wrinkling, bending, bending, and reducing the strength. Wait for all kinds of troubles (refer to Figure 8 (a)), and transport them stably. In addition, the arrangement of the intermediate member 8 further exhibits the following advantages. That is, the Ill nozzle 4 sprays the treatment liquid B on the base plate A, is transported together with the base plate a, and stays between the upper and lower intermediate members 8 to form a storage liquid. Special -31- 200536618 stays on the lower middle cymbal 8 to form a liquid storage. An extremely thin and flexible base sheet A with adhesion and adhesion is transported in the storage solution of the treatment liquid B formed between the intermediate members 8 in this manner. However, the base sheet A is transported by such a storage solution. At the same time that A loses its adhesion and adhesiveness, it can surely complete the conveyance even with a slight conveying force. Therefore, in some respects, the stable transportation of the base plate A can also be realized. (6) Furthermore, as a countermeasure 2, in the surface treatment device 5, a plurality of projecting end portions 28 are attached to the intermediate member 8, and the projecting end portions 28 individually extend in the conveying direction C. Furthermore, the protruding end portions 28 are fitted into the sliding grooves 15 and 16 of the corresponding conveying rollers 9 and 10 from the front and back, and are brought into sliding contact (see FIGS. 2 (a) to 2 (c)). , Figures 3 (a) and 3 (b)). Therefore, the base sheet A can prevent the above-mentioned various troubles from this aspect, and can more reliably and stably convey. That is, with regard to the surface treatment device 5, as a result of the countermeasure 2, the convex and concave comb-like protruding end portions 28 of the intermediate member 8 are formed, and the grooves 15 and 16 of the conveying rollers 9 and 10 block the front and rear gaps of the plane. It is occluded, so the sticking, attachment, rolling of the base plate A to the conveying roller 9, 10, and falling from the conveying roller 9, 10, etc. can be prevented by the protruding end portion 28 before it occurs. (7) Furthermore, as a countermeasure 3, in such a surface treatment apparatus 5, it is conceivable that a plurality of peeling members 19 are attached to the upper conveying roller 9 adjacently. The peeling member 19 is located on the downstream side of the conveying roller 9 and its upper end portion is supported by the shaft in a swinging manner in the forward and backward conveying directions. At the same time, its lower end portion engages with the groove 15 of the conveying roller 9 from the upper side. Sliding contact (see Figures 5 (b) and 5 (c)). 200536618 The base plate A can prevent the above-mentioned various troubles D from this aspect, and can be conveyed ideally and stably. That is, in the surface treatment device 5 of this kind, with the countermeasure 3, the lower end portion of the peeling member 19 constituting the concave-convex comb is engaged from the upper side into the groove 15 of the conveying roller 9. The transfer roller 9 is attached, adhered, and wound from the lower side, and may be immediately peeled from the upper side with a peeling member 19. Therefore, it is possible to prevent the base sheet A from being attached, adhered, or rolled in advance. (8) In the surface treatment apparatus 5, as described above, in order to reduce the contact area, a plurality of grooves 15 are formed along the front and rear conveyance direction C as a typical example. Therefore, the surface treatment apparatus 5 adopts the countermeasure 1 and the countermeasure 2 corresponding to it. First, as a countermeasure 1, each groove 15 of the upper conveyance roller 9 arranged on the upper conveyance roller 9 or the upper conveyance roller 9 arranged near the front and rear of the nozzle 4 on the upper side is formed of a narrow fine groove (see 3 (a), 4 (a), 4 (b)). Further, as a countermeasure 2, the upper transport rollers 9 are formed with grooves 15 in the width direction G at equal intervals, and at the same time, the transport rollers 9 adjacent to each other in the forward and backward transport directions C do not overlap with each other. The ground is staggered (see Figure 5 (a)). By adopting the countermeasure 1 and the countermeasure 2, the surface treatment device 5 can suppress the occurrence of turbulence to a minimum even though the grooves 15 are formed in the forward and backward conveying direction C. That is, the processing liquid B ejected from the nozzle 4 can be expected to flow in the width direction G of the outer surface of the base plate A, as described above, to perform surface treatment, and then, from the left and right sides of the base plate A Drain and recycle. -33- 200536618 Therefore, the treatment liquid B sprayed on the outer surface of the base plate A flows along the grooves 15 in the forward and backward conveying direction C, and flows linearly in large numbers, that is, turbulent flow is not ideal. Therefore, for the surface treatment device 5, as the countermeasure 1 for it, for the upper conveying roller 9 and the like, as the grooves 15, a fine groove that restricts such a liquid flow to a small number is adopted, and as a countermeasure 2, the upper side of the The conveying rollers 9 are staggered from each other by the grooves 15 so as not to coincide with each other in a straight line in the conveying direction C. Therefore, with such countermeasures 1 and 2, it is surely prevented that the processing liquid B flows linearly in a large amount in the forward and backward conveying direction C. In this surface treatment device 5, although the grooves 15 along the front and rear are used, the treatment liquid B sprayed from the upper side on the outer surface (upper surface) of the base plate A is suppressed to flow along the grooves 15 in the front and back to a minimum, The occurrence of forward and backward turbulence is suppressed. Therefore, the adverse effect of the turbulence on the surface treatment is also prevented. In addition, although the narrow grooves are used as the grooves 15, the contact area with the base plate A is increased as compared with the wide grooves, but it is only a matter of degree. The grooves 15 are maintained to prevent the adhesion of the base plate A. , Attach, roll up and other functions. (9) On the other hand, since the treatment liquid B sprayed from the lower side of the outer surface (lower surface) of the base material A immediately drops due to gravity immediately after the surface treatment, there is no need to worry about the above-mentioned turbulence. Therefore, the lower conveying roller 10 is different from the upper conveying roller 9 in the above-mentioned place. As the groove 16, a wide groove having a wider contact area can be used. In addition, it is not necessary to stagger the pitch of the grooves 16 in the conveying direction C, and the shift is to prevent the grooves 16 from overlapping with each other in the front and rear conveying rollers 10. -34- 200536618 _ * (V) Brief Description of Drawings Fig. 1 is a side view of the surface treatment device for a base plate of the present invention, illustrating the best mode for carrying out the invention. Figures 2 (a) to 2 (c) are used to illustrate the best way to implement the invention, where 2 (a) is a side view of the main part; Figure 2 (b) is a view of Figure 2 (a) An enlarged view of an upper conveyance roller and the like; and 2 (c) is an enlarged view of a lower conveyance roller and the like in FIG. 2 (a). Figures 3 (a) and 3 (b) are used to illustrate the best mode for carrying out the invention. Figure 3 (a) is a plan view of the main part of the upper conveying roller and the like; Figure 3 (b) is A plan view of a main part of a side transport roller or the like. Figures 4 (a) and 4 (b) are used to illustrate the best mode for carrying out the invention, wherein Figure 4 (a) shows the front view of the main part of the upper and lower conveying rollers; Figure 4 (b) shows the upper and lower parts Front view of the main part of another example of the transport roller. Figures 5 (a) to 5 (c) are the best ways to explain the implementation of the invention. Figure 5 (a) is a plan view showing the conveying rollers on the upper side. Figure 5 (b) is a diagram illustrating the peeling member. The front view of the main part of Fig. 5 (0) is a side view for explaining the main part of the peeling member. # Fig. 6 is a side view of the entire surface treatment apparatus. Fig. 7 is an entire view of the surface treatment apparatus. Front view. Fig. 8 (a) is a side view of a conventional example, and Fig. 8 (b) is a schematic plan view of a substrate (base plate). Symbols of main components 1 Surface treatment device (advanced technology) 2 Conveyor (Advanced technology) -35- 200536618 3 Conveying roller (prior technology) 4 Nozzle 5 That is, for such a surface treatment apparatus (the present invention) 6 Processing chamber 7 Conveyor (the present invention) 8 Intermediate member 9 Conveying roller (the present invention) 10 Conveying roller (invention)
11 輥軸 12 輥軸 13 凹凸 14 凹凸 15 溝槽 16 溝槽 17 輥部件 18 軸環11 Roller 12 Roller 13 Concavo-convex 14 Concave-convex 15 Groove 16 Groove 17 Roller part 18 Collar
19 剝離部件 20 托架 2 1 軸 22 軸液槽 23 泵 2 4 配管 25 保持部件 26 凹凸 -36- 200536618 27 溝 槽 28 突 狀 端 部 A 基 板 原 材基板材 B 處 理 液 C 輸 送 方 向 E 電 路 F 基 板 G 寬 度 方 向 H 刖 後 間 隔 J 間 隔 空 間 -37-19 Peeling member 20 Bracket 2 1 Shaft 22 Shaft tank 23 Pump 2 4 Pipe 25 Holding member 26 Concave-36- 200536618 27 Groove 28 Protruded end A Substrate base plate B Processing liquid C Transport direction E Circuit F Substrate G width direction H 刖 back space J space -37-