201135903 六、發明說明： 【發明所屬之技術領域】 本發明係關於自含有複數個積體電路單元（ICU)之一爲 板使該等單元成形《特定言之’根據本發明之成形方法係 關於一壓印或衝壓製程並可特別適於QFN(四面扁平無引 線）單元。 【先前技術】 含有積體電路單元的基板在輸送至終端使用者之前需要 成形。自基板將單元成形的方法包含鋸切、水刀、雷射及 衝壓。使用何種成形方法將視所需的處理速率、基2本質 及個別單元的本質而定。譬如對於QFN單元，自一基板衝 壓該等單元係對於處理速率有益且適合的普遍技術:因為 對於QFN而言無需通常用於其他單元類型上的塑膠成型。 【發明内容】 在一第-態樣巾，本發明提供—㈣於統單元成形之 方法’、其包括下列步驟：輸送一基板至一衝壓總成；將該 基板成形為該等1C單元；提供具有用於容置該等單元之至 少一部分的若干凹部之一. 疋轉載體，在一鉍轉載體上於該 弟一位置處容置該等單亓. u第一位置旋轉該旋轉 載 以—位置載送該等單元至-第二位置。 衝U 一 中’本發明提供一種用於將ic單元成形之 ^…。括：-衝壓總成，其經配置以容置一美板 並將該基板成形為該_ 丞板 寺c早兀，一旋轉載體，其 一位置旋棘至一笛^ ^ 一位置’該旋轉載體經配置以在該第一 151204.doc 201135903 位置處容置該等單元並透過旋轉載送該等單元至該第二位 置；其中該旋轉載體包含用於容置該等單元之至少一部分 的若干凹部。 相應地，併入該旋轉載體之該衝壓系統提供許多優點。 譬如，具有複數個凹部容許待自該衝壓總成傳送至下游製 程之單元之一緩衝。此外，此容許撓性在若該製程是線性 則該旋轉載體應與該衝壓總成呈直接線性來容置該等單 元，或若該旋轉載體以適於該衝壓總成的直角容置該單元 則更緊湊。 在又一實施例中，該衝壓總成可係一二階段製程，藉此 基板經歷沿著一弟一軸線之各個邊緣之一衝壓階段，繼 之以沿著正交軸線衝壓各個邊緣之一第二階段。該衝壓總 成可具有一壓機及安裝至該壓機的一凸輪軸使得各個階段 同步。 此外，該旋轉載體之旋轉亦可與該等衝壓階段之一者戋 兩者同步。為此目的，該旋轉載體可與該凸輪軸連通以達 成此同步。 在此實施例中，對於基板的處理而言，一基板可進入該 第一軸線衝壓（譬如X軸）繼之以該正交軸線（諸如一 y軸）衝 壓並接著將該等經成形單元輸送至該旋轉載體。該旋轉載 體壬現容置該等經成形單元之一空凹部之時序可與該X軸 及該y軸之衝壓衝程同步。 邊衝壓系統可進一步包含一裝載站。在一實施例中，該 裝載站可具有一堆疊裝載機，其具有基板之一堆疊。在此 151204.doc 201135903 情況下，該堆疊裝載機上之該最上基板可經提升至一入口 執道且隨後使該基板輸送至該第一階段衝壓。 一翻轉器可位於該堆疊裝载機與該入口軌道之間，該翻 轉咨用於容置該基板及繞著一水平軸線翻轉該基板以便使 該基板具有在上表面上的焊點。 在又一實施例中，該衝壓系統可包含一分類站，其可基 於預定準則自該旋轉載體輸送該等經成形Ic單元至各別儲 箱。該等預定準則可自各種檢驗點接收。 一第一檢驗點可經定位鄰近分度送料器以便檢查基板類 型及其定向以確保預防不對準。 一第二站可位於該旋轉載體上方並可用於檢查該ic單元 之一頂面，其係同時在該旋轉載體内的各個經成形單元之 引線側。 一第二檢驗點可位於該旋轉載體與一梭子之間並定位在 輸送裝置下方，自該旋轉載體取得該等經成形單元至該梭 子。此-第三檢驗可確認標記及基準標記以檢查該ic單元 的該底面。 因此，提供一衝壓總成藉以模塊包含可選擇替換嵌件可 容許重新組態該衝壓總成以適應一不$封裝大小之一有效 方法。 > 在一實施例中，該預定1C封裝配置可係一 3x3、4x4等 等。 因此’藉由提供嵌件以適應不同封裝大小及不同基板大 小，則相較於當改變-基板大小時更換—完全的模，可節 151204.doc 201135903 省-大筆資本費用，更不必提及此一實質變化所需的停機 時間及因此使該衝壓總成離線之經濟損失。 【實施方式】 合宜的是參考繪示本發明之可能配置之隨附圖式來進— 步描述本發明。本發明之其他配置為可能且因此該等隨附 圖式的特殊性不應理解為取代本發明之先前描述之一般 性。 圖1顯示用於自一基板將IC單元成形之一衝壓系統5。對 於QFN封裝而言衝壓係一較佳選項且圖丨中顯示的該配置 特別適於此等QFN封裝之處理。 基板係經裝載進入一堆疊裝載機2〇内，使得該等基板彼 此堆：a：。圖2 A及圖2B顯示包含該堆疊裝載機2〇之該裝載 站7。一升降機120向上推動該基板堆疊使得一最上基板 110可由一基板拾取器1〇5接合。 6玄拾取器1〇5提升該基板110並將該基板放置於翻轉該基 板之一翻轉器115上且使之降落至一入口軌道23上。該翻 轉器115具有一真空接合配置以將該基板固持於適當位 置’其中該基板透過真空之釋放而被釋放。自該翻轉器 115至遠入口轨道2 3之小降落係充分低以便避免損壞。該 入口軌道23進一步包含為該基板提供一充分緊密公差以便 確保該基板正確定向之導引器24a、24b。 δ亥入口軌道23輸送該基板至包含位於該分度送料器上的 一照相機之一第一檢驗點。第一檢驗的目的係確保該基板 正確定向且亦根據大小及單元類型識別基板的類型。 151204.doc • 6 · 201135903 接著’該基板係由接合該基板並透過衝壓之該等各種階 段容許移動之一分度送料裝置30接合。 該衝塵總成10涉及在二衝塵塊45、5〇上操作之一塵機， 該二塊用於首先在該基板之該乂方向衝壓且其次在該丫方向 切割。 應意識到本發明並不限於衝壓該基板之順序。因此，雖 然在此實施例中該X衝壓接著繼之以該γ衝壓，但事實上 該Υ衝壓可在該X衝壓之前1特別順序對本發明及^著 該等單元隨後如何向下游輸送並不重要的。 此外’㈣在此實施例中一單一線的單元對應於一單一 線的衝壓’但事實上如圖5所示，多於一線的衝壓可併入 該衝壓總成内。此外’雖然圖5顯示可衝壓一第二線的單 兀之-衝壓塊’但事實上多個線可經衝壓，其受制於併入 該衝壓塊内之衝壓之線的數目。 該壓機係透過-凸輪轴連接至該等塊，該凸輪軸容許衝 壓在該二塊之間同步並因此容許該分度送料與該壓機之間 之一「衝壓-移動-衝壓」順序。 沿著該y軸衝壓該基板使該等單元與該等基板分離，形 成複數個經成形IC單元。自該y軸衝壓，該等單元係運輸 至一紋轉載體15。該旋轉载體15包含複數個凹部56，該等 1C單元可放置於该等凹部内。在此實施例中，該旋轉載體 15包含四個凹部’該旋轉載體在四階段中朝一逆時針方向 57旋轉以對應於該四個凹部。圖丨顯示鄰近於該丫軸衝壓之 凹。卩56，其在此情況下準備容置接著由一線拾取器（未 151204.doc 201135903 顯不）運輸之一排經成形單元。該線拾取器接合來自該基 板之一排單元並將其等放置於該凹部中。放置之後，該旋 轉載體旋轉直到下一凹部鄰近於該y衝壓。 ★該X衝壓45、y衝壓50及旋轉載體15之同步係透過連接此 等站至一凸輪軸使得該三裝置之每一者同時執行相關動作 7達成。亦即，該x衝壓45及3^衝壓5〇在該旋轉載體自凹部 旋轉至凹部下同時衝壓穿過該基板。 该旋轉載體〗5之一特別優點係對準該等凹部之—者與一 <系相機55以便建立—檢驗點之能力。在此實施例中，該檢 驗^係經配置以檢驗在此點處向上導引之該等QFN單^之 /谭點#著此資訊可進一步向下游傳輸以便根據品 徵化該等單元。 、’ —然該旋轉載體15對於運輸該等單元至開槽站有效，但 忒旋轉載體亦提供用於另一檢驗點而無須作出針對該等單 兀之特別配置以便經歷所需檢驗。另一實施例 :元之特徵化需要進-步資訊，則亦可將-第二檢驗I: 一該,轉載體15在其下一旋轉上定位鄰近於該分類站以 _ ^59。此處另—線拾取器（未顯示）輸送該複數㈣單 梭子70。該等1(：單元越過—第三檢驗秘，其檢驗 '•亥早元之底側且特定古 其他故障。 針對檢驗標記、基準標記及任何 :第三檢驗站亦可包含一25叫此一檢驗站包含一 列，其經配置以透過降低該等單元進人由該陣列界定 I5J204.doc 201135903 的一空間内而包圍該㈣單元。提供該等鏡容許該照相機 f有水平檢查弓丨線或該等單元之垂直對準之一視點。此亦 容許檢查該等單元的側品質，即透過-滲透材料來沿著該 側識別任何故障（諸如短路）。相應地，藉言亥直接仰視圖及 來自四個包圍鏡之4個側視圖，該等單元之5個分離視圖為 可能。 一旦在該梭子7G中之後，單元拾取H9G、95在該梭子70 上接合該等單元以用於輸送至個別儲箱75、80、85。 基於自”亥一檢驗站35、55、65接收的資訊，該等單元係 經堆放入「良好」、「重新加工」或「退件」儲箱中。 々放置於該良好儲箱」中之一替代，亦提供一離管裝 載機100，其受到該終端使用者的偏好。 圖3、圖4A顯示用於一 名丨+ ^ ,201135903 VI. Description of the Invention: [Technical Field] The present invention relates to forming a unit from a panel containing one of a plurality of integrated circuit units (ICUs), which is specifically described in terms of a forming method according to the present invention. An embossing or stamping process and can be especially adapted to QFN (four-sided flat no-lead) units. [Prior Art] The substrate containing the integrated circuit unit needs to be formed before being conveyed to the end user. The method of forming the unit from the substrate includes sawing, water jet, laser, and stamping. Which forming method is used will depend on the desired processing rate, the nature of the base 2, and the nature of the individual units. For example, for a QFN unit, the pressing of such units from a substrate is a common and useful technique for processing rates: because there is no need for QFN to be used for plastic molding on other unit types. SUMMARY OF THE INVENTION In an aspect-form sample, the present invention provides a method of forming a fourth unit, which includes the steps of: transporting a substrate to a stamping assembly; forming the substrate into the 1C units; providing Having one of a plurality of recesses for receiving at least a portion of the units. The carrier is mounted on a transfer carrier at the position of the younger one. The first position rotates the rotation to - The position carries the units to the -second position. The present invention provides a method for forming an ic unit. Included: a stamping assembly configured to receive a slab and form the substrate into the _ 寺 寺 c 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 旋转 旋转 旋转 旋转 旋转 旋转 旋转The carrier is configured to receive the units at the first 151204.doc 201135903 location and to transport the units to the second position by rotation; wherein the rotating carrier includes a plurality of portions for accommodating at least a portion of the units Concave. Accordingly, the stamping system incorporating the rotating carrier provides a number of advantages. For example, having a plurality of recesses allows one of the cells to be transferred from the stamping assembly to the downstream process to buffer. In addition, the allowable flexibility is such that the rotating carrier should be linear with the stamping assembly to accommodate the unit if the process is linear, or if the rotating carrier accommodates the unit at a right angle to the stamping assembly. It is more compact. In still another embodiment, the stamping assembly can be in a two-stage process whereby the substrate undergoes a stamping phase along one of the edges of the one-axis, followed by stamping each of the edges along the orthogonal axis. Two stages. The stamping assembly can have a press and a camshaft mounted to the press to synchronize the various stages. In addition, the rotation of the rotating carrier can also be synchronized with one of the stamping stages. For this purpose, the rotating carrier can communicate with the camshaft to achieve this synchronization. In this embodiment, for processing of the substrate, a substrate can be stamped into the first axis (such as the X-axis) followed by the orthogonal axis (such as a y-axis) and then conveyed to the shaped unit. To the rotating carrier. The timing at which the rotating carrier accommodates one of the shaped recessed portions of the shaped unit can be synchronized with the stamping stroke of the X-axis and the y-axis. The edge stamping system can further include a loading station. In an embodiment, the loading station can have a stack loader having a stack of one of the substrates. In the case of 151204.doc 201135903, the uppermost substrate on the stacker can be lifted to an inlet and then the substrate is conveyed to the first stage of stamping. A flipper can be located between the stacker and the inlet track for accommodating the substrate and flipping the substrate about a horizontal axis to provide the substrate with solder joints on the upper surface. In yet another embodiment, the stamping system can include a sorting station that can transport the shaped Ic units from the rotating carrier to the respective bins based on predetermined criteria. The predetermined criteria can be received from various checkpoints. A first checkpoint can be positioned adjacent to the indexing feeder to check the type of substrate and its orientation to ensure prevention of misalignment. A second station can be located above the rotating carrier and can be used to inspect the top surface of one of the ic units simultaneously on the lead side of each shaped unit within the rotating carrier. A second checkpoint can be located between the rotating carrier and a shuttle and positioned below the conveyor, from which the warp forming unit is taken to the shuttle. This - third test verifies the mark and the fiducial mark to check the bottom surface of the ic unit. Therefore, providing a stamping assembly whereby the module includes an optional replacement insert allows for reconfiguration of the stamping assembly to accommodate an unquantified package size. > In an embodiment, the predetermined 1C package configuration may be a 3x3, 4x4, etc. Therefore, 'providing inserts to accommodate different package sizes and different substrate sizes, compared to when changing - substrate size - complete mold, can be 151204.doc 201135903 province - large capital costs, not to mention The downtime required for this substantial change and thus the economic loss of the stamping assembly off-line. [Embodiment] It is convenient to describe the present invention in a step-by-step manner with reference to the possible configurations of the present invention. Other configurations of the invention are possible and therefore the specificity of the appended drawings should not be construed as a substitute for the general description of the invention described herein. Figure 1 shows a stamping system 5 for forming an IC unit from a substrate. Stamping is a preferred option for QFN packages and the configuration shown in Figure 特别 is particularly well suited for the processing of such QFN packages. The substrate is loaded into a stacker 2, such that the substrates are stacked one another: a:. 2A and 2B show the loading station 7 including the stacker. An elevator 120 pushes the stack of substrates upward so that an uppermost substrate 110 can be joined by a substrate picker 1〇5. The 6-ply picker 1 〇 5 lifts the substrate 110 and places the substrate on the flipper 115 which flips the substrate and drops it onto an entrance rail 23. The flipper 115 has a vacuum engagement configuration to hold the substrate in place where the substrate is released through the release of vacuum. The small drop from the flipper 115 to the far inlet track 23 is sufficiently low to avoid damage. The inlet track 23 further includes introducers 24a, 24b that provide the substrate with a tight tolerance to ensure proper orientation of the substrate. The δHig entrance track 23 transports the substrate to a first checkpoint containing one of the cameras located on the indexing feeder. The purpose of the first test is to ensure that the substrate is properly oriented and also to identify the type of substrate based on size and cell type. 151204.doc • 6 · 201135903 Next, the substrate is allowed to be moved by one of the various stages of the bonding of the substrate and through the stamping. The dusting assembly 10 involves operating a dust machine on the two dust blocks 45, 5, which are used to first punch in the direction of the substrate and secondly in the direction of the weir. It will be appreciated that the invention is not limited to the order in which the substrate is stamped. Thus, although in this embodiment the X stamping is followed by the gamma stamping, in fact the stamping can be prior to the X stamping 1 in a particular order to the invention and how the units are subsequently transported downstream is not important of. Further, (d) in this embodiment a single line of cells corresponds to a single line of stamping' but in fact, as shown in Fig. 5, more than one line of stamping may be incorporated into the stamping assembly. Further, although Figure 5 shows a stamped block of a second line that can be stamped, in reality a plurality of wires can be stamped, subject to the number of stamped wires incorporated into the stamping block. The press is coupled to the blocks via a camshaft that allows the punch to be synchronized between the two blocks and thus allows for a "stamp-move-stamp" sequence between the index feed and the press. The substrate is stamped along the y-axis to separate the cells from the substrates to form a plurality of shaped IC units. From the y-axis stamping, the units are transported to a grain transfer carrier 15. The rotating carrier 15 includes a plurality of recesses 56 in which the 1C cells can be placed. In this embodiment, the rotary carrier 15 includes four recesses. The rotary carrier rotates in a counterclockwise direction 57 in four stages to correspond to the four recesses. The figure shows the concave adjacent to the boring of the boring shaft.卩 56, which in this case is ready to be accommodated and then transported by a line picker (not shown in 151204.doc 201135903) to the forming unit. The line picker engages a row of cells from the substrate and places them in the recess. After placement, the rotating carrier rotates until the next recess is stamped adjacent to the y. ★ The synchronization of the X stamp 45, the y stamp 50, and the rotating carrier 15 is achieved by connecting the stations to a camshaft such that each of the three devices simultaneously performs the associated action 7. That is, the x stamping 45 and the stamping 5 are punched through the substrate while the rotating carrier is rotated from the recess to the recess. One of the particular advantages of the rotating carrier is the ability to align the recesses with a camera 55 to establish a checkpoint. In this embodiment, the test is configured to verify that the QFNs/Tan points that are directed upward at this point can be further transmitted downstream to characterize the units. The rotating carrier 15 is effective for transporting the units to the slotting station, but the rotating carrier is also provided for another checkpoint without having to make a special configuration for the ones to undergo the required inspection. Another embodiment: the characterization of the element requires further information, and the second test I can also be: the transfer carrier 15 is positioned adjacent to the sorting station with _ ^ 59 on its next rotation. Here, a line pickup (not shown) conveys the plural (four) single shuttle 70. The 1 (: unit crossed - the third test secret, which tests 'the bottom side of the Hai early element and the other ancient faults. For the inspection mark, the reference mark and any: the third checkpoint can also contain a 25 called this one The inspection station includes a column that is configured to surround the (4) unit by lowering the units into a space defined by the array defining I5J204.doc 201135903. Providing the mirrors allows the camera f to have a horizontal inspection bow line or The vertical alignment of the cells is one of the viewpoints. This also allows inspection of the side quality of the cells, ie, the permeation material is used to identify any faults (such as short circuits) along the side. Accordingly, the direct view and the Four side views of the four surrounding mirrors, five separate views of the units are possible. Once in the shuttle 7G, the unit picks H9G, 95 to engage the units on the shuttle 70 for transport to individual stores. Boxes 75, 80, 85. Based on information received from the Haiyi Inspection Stations 35, 55, 65, the units are placed in a "good", "reworked" or "returned" storage box. In the good tank In one alternative, also provides a pipe from the loading machine 100, by which the end user's preference. FIG. 3, FIG. 4A shows a ^ + a Shu,
、Y切割之一杈塊總成123，而圖4B 顯示該相對應X切割。此等切割係用於一基板之衝壓、由 该基板將1C單元成形。如先前提到，衝壓係充分適於qfn 封裝的一製程。 模總成包含安裝於一衝塵座上的一衝麼背板125及固 定器130。此耦合至一剝離器座135，該固定器包含衝頭 133。 該等衝頭係經配置以通過一剝離器14〇，當該衝頭撞擊 於文裝於模座145及模背板1 50内的一模丨42時，該剝離 器提供該衝頭之該完全衝程之導引及控制。為控制及支 撐，該模142係一模板嵌件55。 本土明之特徵係使用經調適以放置於該模座及模背板 151204.doc -9- 201135903 内之該等模嵌件142。而先前技術依賴於與該模座、背板 模一體形成的該模之一固定配置。在此情況下，當基板類 型經改變以適應該封裝時必須更換該整個總成。根據本發 明，使用杈嵌件142容許該嵌件根據被成形的封裝類型而 交換。相應地，當適應可應用之若干不同基板大小時一模 塊總成123的成本相較於先前技術的成本明顯更低廉。為 了改變為一不同基板大小必須更換該模座及模背板之資本 成本相當大。此外，改變該模座及背板所需要的時間量相 較於僅改變該等嵌件之時間量亦明顯更大，導致該整個衝 壓製程之較少停機時間。 如先前所論述，多個單元列可經受併入該塊内的許多衝 壓組而成形。類似地，圖4B顯示具有衝頭134、144及模嵌 件147之該相對應X切割模組148。 圖5顯示具有多列衝壓機18〇之一多列塊16〇。應意識到 經丈在本發明之範圍内之該終端使用者的要求亦可使用三 個、四個或更多列。此處，衝頭165、180裝配於剝離器内 以適應多列以便與該等模嵌件17〇對準。亦併入使用模嵌 件之本發明之又一態樣之一多列衝壓總成之一特別優點容 許多列衝壓總成根據特別批次而組態。因此，與具有一完 全組之模以適應一單一列及具有另一組以適應多列不同， 該等模嵌件可根據一特別應用使用及切換，因此一單一列 之換肷件視需要可由多列交換及取代。 【圖式簡單說明】 圖1係根據本發明之一實施例之一衝壓系統之一平面 151204.doc •10- 201135903 圖， 圖2A及圖2B係根據本發明之一實施例之一裝載站之正 視圖； 圖3係根據本發明之—實施例之一衝壓模塊之一分解等 角視圖； 圖4A及圖4B係根據本發明之一實施例之一模塊之該等χ 及Υ衝頭及模配置之分解等角視圖；及 圖5係根據本發明之又—實施例之該衝頭及模之一分解 等角視圖。 【主要元件符號說明】 5 衝壓系統 7 裝載站 10 衝壓總成 15 旋轉載體 17 分類站 20 堆疊裝載機 23 入口軌道 24a 導引器 24b 導引器 30 分度送料裝置 35 檢驗站 45 衝壓塊 50 衝壓塊 55 檢驗站, Y cuts one of the block assemblies 123, and Figure 4B shows the corresponding X cut. These cuts are used for stamping a substrate, and the 1C unit is formed from the substrate. As mentioned previously, the stamping system is well suited for a process of qfn packaging. The die assembly includes a punch back plate 125 and a fixture 130 mounted on a dust chamber. This is coupled to a stripper mount 135 that includes a punch 133. The punches are configured to pass through a stripper 14 that provides the punch when the punch strikes a die 42 mounted in the die holder 145 and the backsheet 150 Guide and control of full stroke. For control and support, the mold 142 is a template insert 55. The native features are those inserts 142 that are adapted to be placed in the mold base and backing plate 151204.doc -9- 201135903. The prior art relies on a fixed configuration of the mold integrally formed with the mold base and the back plate mold. In this case, the entire assembly must be replaced when the substrate type is changed to accommodate the package. In accordance with the present invention, the use of a weir insert 142 allows the insert to be exchanged according to the type of package being formed. Accordingly, the cost of a modular assembly 123 is significantly less expensive than prior art when adapting to a number of different substrate sizes that are applicable. The capital cost of having to replace the mold base and the mold backsheet in order to change to a different substrate size is considerable. In addition, the amount of time required to change the mold base and backing plate is significantly greater than the amount of time to change only the inserts, resulting in less downtime for the entire press cycle. As previously discussed, a plurality of cell columns can be shaped by subjecting to a plurality of stamping sets incorporated within the block. Similarly, Figure 4B shows the corresponding X-cut module 148 having punches 134, 144 and die inserts 147. Figure 5 shows a multi-column block 16 of one of a plurality of rows of presses. It will be appreciated that three, four or more columns may also be used by the end user of the present invention within the scope of the present invention. Here, the punches 165, 180 are fitted within the stripper to accommodate multiple rows for alignment with the mold inserts 17A. One of the multi-row stamping assemblies of one of the aspects of the present invention that also incorporates a mold insert is also advantageous in that many column stamping assemblies are configured in accordance with a particular batch. Therefore, unlike having a complete set of modules to accommodate a single column and having another set to accommodate multiple columns, the modular inserts can be used and switched according to a particular application, so that a single column of replacements can be Multi-column exchange and replacement. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of a stamping system according to an embodiment of the present invention, 151204.doc •10-201135903, FIG. 2A and FIG. 2B are diagrams of a loading station according to an embodiment of the present invention. 3 is an exploded isometric view of one of the stamping modules in accordance with one embodiment of the present invention; FIGS. 4A and 4B are diagrams of the stamps and stamps of one of the modules in accordance with an embodiment of the present invention; An exploded isometric view of the configuration; and FIG. 5 is an exploded isometric view of the punch and die in accordance with yet another embodiment of the present invention. [Main component symbol description] 5 Stamping system 7 Loading station 10 Stamping assembly 15 Rotating carrier 17 Sorting station 20 Stacking loader 23 Entrance rail 24a Introducer 24b Introducer 30 Indexing feeder 35 Inspection station 45 Stamping block 50 Stamping Block 55 inspection station
S 151204.doc -11· 201135903 56 凹部 57 逆時針方向 59 凹部 65 檢驗站 70 梭子 75 儲箱 80 儲箱 85 儲箱 90 單元拾取器 95 單元拾取器 100 離管裝載機 105 基板拾取器 110 基板 115 翻轉器 120 升降機 123 模塊總成 125 衝壓背板 130 固定器 133 衝壓機 134 衝壓機 135 剝離器座 140 剝離器 142 模 144 衝頭 151204.doc -12- 201135903 145 147 148 150 160 165 170 180 模座 模嵌件 切割模組 模背板 多列塊 衝頭 模 衝頭 151204.docS 151204.doc -11· 201135903 56 Recess 57 57 counterclockwise 59 Concave 65 Inspection station 70 Shuttle 75 Storage tank 80 Storage tank 85 Storage tank 90 Unit pickup 95 Unit pickup 100 Off-pipe loader 105 Substrate pickup 110 Substrate 115 Flipper 120 Lift 123 Module assembly 125 Stamped back plate 130 Holder 133 Punch 134 Press 135 Stripper seat 140 Stripper 142 Die 144 Punch 151204.doc -12- 201135903 145 147 148 150 160 165 170 180 Mold base Die insert cutting module die back plate multi-column punch punch punch 151204.doc