201109677 六、發明說明： C發明所屬技術領成3 相關申請案 本申請案主張2009年6月3曰申請之美國臨時專利申 請案序號61/183,553的優先權，其併入此處作為參考。 發明領域 本發明關於用於測量電路之電氣特性的方法及系、统。 C先前技術3 發明背景 舉例而言’關於印刷電路板PCBs的測試，各個PCB 可包括多個測試接觸點，其中可以接觸件接觸許多測試接 觸點次群團（例如’對）而測試PCB，並以處理單元測量電 氣特性。因為具有許多測試接觸點，所以先前技藝的解決 方案包括必須相對於所偵測之P C B以緩慢過程機械性移動 的少數接觸件，或者設計為接觸PCBs#"之職接觸點 的許多接觸件，這是因為測試接觸點係位於每個pCB產品 的不同位置上。此種多個接觸件測試設備的設計及製造係 複雜、緩慢與昂貴的。 此外’先剛技藝方法測g式PCB s時所遭遇的另一問題為 不同測試接觸點（以及其他PCB的組件）的位置具有不同的 高度(例如，在多層電路中明顯地，就此種先前技藝技術 而言，接觸許多不同高度位置的測試接觸點進一步地創造 了額外的複雜性。 C發明内容：！ 201109677 發明概要 一種用於電氣測量的系統，包括：_第—支持構造； 連接至第支持構造之第—陣列的電氣中介物·其中，第 一陣列的各個電氣中介物具有連接至第—電路的第一端及 配置為當對著該測試裝置的點施力時接觸測試裝置之一點 :第二端；其中’第-陣列的多個電氣中介物配置為當對 著該測試裝置施力収變該第―陣狀㈣電氣中介物的 第二端及該第-支持構造之間的高度差異；其中該第一 陣列的電氣中介物的形狀設計為，不論該測試裝置㈣計 何均可接觸測試裝置之感興趣的點；及其中，該第一 電路配置為電氣_合該第—陣列的電氣中介物至配置為 測量測試裝置之至少-電氣參數的處理單元。 其中》玄第陣列之電氣中介物的密度為該測試褒置之 兩感興趣之點間距離的分數（二分之―、三分之_、四分之 一或更少）。 p各個電氣中介物包括-彈簧，其配置為一旦對著該測 成裝置施力該電氣中介物’則該電氣中介物接觸該測試裝 置的一點。 各個電氣中介物包括一彈性且導電元件，其配置為一 旦對著該測試衫施力該電氣中介物，則該電Ή介物接 觸該測試裝置的一點。 該第一陣列造形為，當對著該測試裝置施麼時，同時 地接觸遍佈全部測試裝置的測試裝置的點。 該測試袭置為-印刷電路板，及其中該第一陣列造形 4 201109677 ^當對著該印刷電路板施壓時，接觸遍佈該印刷電路板 大。卩分之印刷電路板的點。 電氣中’I物配置為以非垂直的方式接觸該測試裝 置的點。 該第-陣列的電氣中介物配置為接觸位在該測試裝置 弟—面之該測試裝置的點；其中，該系統更包括：-第二 4 支持構造；連接至該第二支持構造的第二_的電氣中介 勿，其中’該第二陣列的各個電氣中介物具有連接至第二 電路的第端與g&置為當對著該職裝置的雜力時接觸 位在該測試裝置第二面之卿試裝置之-點的苐二端；其 中n式裝置的第二面不同於該測試裝置的第一面；其 /第㈣的夕個電氣中介物配置為當對著該測試裝 置施力時改㈣第二陣狀多個钱巾介物之第二端及該 第-支持構造之間的高度差異；及其中，該第二電路配置 為電氣_合該第二陣列的電氣中介物至第二處理單元， «玄第-處理單疋配置為測量該測試裝置的至少一電氣參 數。 第一面與第二面相對。 該測試裝置為-印刷電路板及其中該第一面與該第二 面相對。 該第-及第二處理單元配置為藉由比較屬於不同面之 該測試裝置之闕纽㈣氣喊來評傾職裝置的一 電氣參數’該等不同面出自該測試裝置之第—及第二面。 系統可包括多個支持構造及多個陣列的電氣中介物， 201109677 各個陣列的電氣令介物連接 -陣列的各個電氣中介物具編至電：第其及該第 = :試裝置之點施力時接觸該測試裝置之一點的 施力砗、，各個電氣令介物配置為當對著該測試裝置 ⑽介物之該第二端及該第-支持構造之 電氣中二 其令該電路配置為電氣地耦合該陣列的 ::元中:物至配置為測量_置之至少-電氣參數的處 該測氣令介物配置為’反應對著該第二端施力的 時改二^之點之間的向度差異’ #對著該測試裝置施力 的高度差異。 &之第支持構造之間 =^種用於電氣測量的方法，該方法包括：對著測 Γ力於第一陣列的電氣中介物並引起該第-陣列的 夕個電就中介物接觸該測試裝置的多個點，以及改變該多 固電乳中介物之第二端及連接至該第一陣列之第一支持構 造之間的高度差異；其中’該第-陣列之電氣中介物的第 :端輕合至第一處理單元；其中該第一陣列的電氣中介物 構形為不論該測試裝置的設計如何，均可接觸測試裝置之 感興趣的t及⑽第-處理單元魏地職 圖式簡單說明 僅僅藉由參考圖式的實例，本發明的進一步細節、面 向及實施例將予以說明。在圖式中，相似元件編號用於指 %相似或功能類似的元件。圖式中的元件以簡化及清晰方 6 201109677 式顯示，而且不必然合比例。 第1圖顯示依據本發明一實施例的電氣測量系統； 第2A圖顯示依據本發明一實施例之系統的側視圖，及 依據本發明一實施例之具有數個測試點之PCB的側視圖； 第2B圖顯示依據本發明一實施例之系統的側視圖； 第3圖為依據本發明一實施例之系統的側視圖，； 第4圖顯示依據本發明一實施例的系統； 第5圖顯示依據本發明一實施例的系統； 第6圖顯示依據本發明一實施例的方法；及 第7圖顯示依據本發明一實施例的方法。 C實施方式3 本發明之詳細說明 當結合附隨圖式一起說明時，本發明的前述及其他目 標、特性及優點從下述的說明將更為明顯。在各個不同圖 式中，類似元件標號指示類似元件。 因為本發明顯示的實施例絕大多數係使用習於此藝者 所熟知的電子組件及電路實施，所以除非被認為是暸解及 明白本發明的概念所必要且為了不要模糊或偏離本發明教 示之故，否則細節將不再作進一步的解釋。 第1圖顯示依據本發明一實施例的電氣測量系統 100，其可用於測量諸如（雖然並不限於）印刷電路板(PCB) 電路的電氣特性。 電氣測量系統100包括一支持構造120,其上安裝有多 個電氣中介物110的陣列，其中當力量被施用於電氣中介 201109677 物110上時，久 度會改變。系氣中介物11G對於支持構造120的高 110連接到至少〜更包括將系'统100之各個電氣中介物 130，為了、主/自處理單元（未顯示）@電路(通常標為 100中咬在故僅部份顯示），處理單元可包括於系統 便例一或多個電氣介_)。 者連接？㈣、電礼中介物UG為至少部分彈性的，或 例 構造’而該等彈性構造連接至支持構造120。 ㈣氣中介物110可為彈簧構造，它本身具有彈 3疋k於馳構造(例㈣膠凸塊）上。根據另一實施 例電亂中介物110可為安裝在彈性或其他挽性材料上的 靜電導電轉。纽意、的是，根雜個本發日㈣實施例， 對於測試物件的連接可為垂直的或非垂直的。 除了其他用途之外，電氣測量系統100可用於電路(諸 如PCBs)的電氣測量及/或測試。如前所述，於此種電路中 (以下術語PCB指稱PCBs或其他型式的電路），不同電氣 接觸可位在不同高度上。電氣中介物110的彈性或各個電 氣中介物安裝於其上之構造的彈性可便利電氣中介物11〇 與各個PCB測試點的接觸《於進行使用系統1〇〇的測試 前’（作為測試床的）系統100可相對著PCB按壓。依據本 發明的一實施例，系統100對著PCB的按壓可藉由將系統 100壓向測試目標（例如PCB)而完成。依據本發明一實施 例，按壓可藉由將測試目標壓向電氣中介物110而實行。 可設置電氣中介物以接觸測試裝置上的感興趣之點， 而不論測試裝置的設計。這可例如藉由排列電氣中介物成 8 201109677 非常緊密的陣列而達成，其中兩相鄰電氣中介物之間的距 離為測試裝置中兩感興趣之點之間距離的一部分（一半、三 分之一、四分之一或更少）。 第2A圖顯示依據本發明一實施例之系統100的側視 圖’與具有數個測試點（標示為黑三角形）之PCB10的側視 圖。第2B圖顯示當接觸PCB10時系統100的側視圖。可 以看見，當力量施加至不同電氣中介物11〇上時，各個電 氣中介物110對於支持構造120的高度會改變，而且與 PCB10各個測試點的電氣接觸會因而建立。 第3圖為依據本發明一實施例之系統1〇〇的側面圖。 注意的是，電氣中介物110的數目可以比簡圖中所示者多 得多’而且電氣中介物11〇陣列可被充分地包裝以使得其 可與各式各樣PCBs的測試接觸點為良好的電氣接觸。注意 的是’電氣中介物110或是電氣中介物11〇安裝於其上之 構造的彈性可以來自製造它們的材料(例如矽膠構造、彈性 體構造等等）或來自結構設計(例如彈簧）或是兩者的組合。 依據本發明一實施例，電氣中介物11〇陣列的解析度 為400微米，但是其他解析度即使有顯著地不同，也可以 為良好的貫她。依據本發明一實施例，基於支持構造 的電氣中介物110陣列包括32x32(=1G24)個電氣中介物 110。注意的是’也可以使用其他數目的電氣中介物11〇, 而且電氣中介物110的排列可為其他構型（亦即，不是χ γ 格柵）。 第4圖顯不依據本發明一實施例的系統2〇〇。系統2〇〇 201109677 包括一或多個面板，各個面板包括系統100。面板（方便地 標為100)可以彼此連接，連接至共同物理構造，或不連接 至共同物理構造，而且可以或不得獨立地移動及/或控制。 例如，100個面板(例如10x10陣列）可以使用，各具有32x32 電氣中介物110,用於1〇6個電氣中介物110測試設備。系 統200可更包括一或多個處理單元250(其可或不可併入一 或多個系統100)，其等適於被電氣連接至兩個以上的電氣 中介物110,而用於執行電氣測量。注意的是，在各個系統 100或是這些解決方案的組合中，用於選擇兩個以上電氣中 介物110的轉換工具可包括於處理單元150,或者包括於連 接至處理單元的單元中。 注意的是，系統200可適於利用兩個以上來自不同面 板的電氣中介物110來進行電氣測量。 依據本發明一實施例，各個32x32單元為12.8mm乘 12.8mm大小。依據本發明一實施例，各個32X32單元的 大小由兩電氣中介物110之間的空間決定。因此，如果各 個單元的整體大小為12.8乘12.8毫米的話，32x32電氣中 介物中各對電氣中介物之間的距離約為0.4 mm。 因此，如果各個單元的整體大小為12.8乘12.8毫米 的話，32x32電氣中介物中各對電氣中介物之間的距離約為 0.4 mm。 至多個電氣中介物110或來自多個電氣中介物110的 電氣連接可為並聯連接或_聯連接。依據本發明一實施 例，系統100及/或系統200可包括電源(例如3.3v DC電源）。 10 201109677 第5圖顯示依據本發明一實施例的系統200。系統200 適於從雙側式PCB進行電氣測量。 參考系統100及系統200，注意的是，雖然圖中的支持 構造實質上為平面，但是它不必然是如此，而且支持構造 120的形狀可以不同，而且可根據本發明不同實施例而進 一步改變。 第6圖顯示依據本發明一實施例的方法600。 方法600由階段610開始，階段610為改變包括一或 多個模組之系統的至少一模組（諸如系統或面板100)的位 置，各個模組包括多個電氣中介物110陣列安裝於其上的 支持構造120。其中當力量被施加於電氣中介物110時， 各個電氣中介物110關於支持構造120的高度會改變。其 中至少一模組位置的改變導致多個電氣中介物110關於支 持構造120高度的改變，而且形成了多個電氣中介物110 之間的電氣接觸與電路不同點之間的電氣接觸。 注意的是，高度的改變方便地包括相對於電路施力於 至少一模組。 階段620接著階段610,階段620為選擇至少一模組中 的多個電氣中介物，用以參與電氣測量。選擇讓電氣中介 物的子集連接至處理單元。所選電氣中介物的數目根據處 理單元擁有用於測量電氣參數的埠的數量不同而不同。 階段630接著階段620,階段630為轉換電氣連接至所 選的電氣中介物。 階段640接著階段630,階段640藉由連接至多個電氣 11 201109677 中介物（例如那些所選擇及/或所轉換）的處理單元測量電路 的電氣參數。 測量可包括測量測試裝置的電容、測量測試裝置的電 導等等。 第7圖顯示依據本發明一實施例的方法700。 方法700由階段710開始，階段710為對著測試裝置 施力於第一陣列的電氣中介物且引起第一陣列的多個電氣 中介物接觸測試裝置的多個點並改變多個電氣中介物之第 二端與連接至第一陣列之第一支持構造之間的高度差異。 第一陣列電氣中介物的第一端耦合至第一處理單元。該施 力可包括將包括電氣中介物的系統推向測試裝置。 階段720接著階段710,階段720為以第一處理單元電 氣測試測試裝置。 階段710可包括對著測試裝置施力於第一陣列電氣中 介物的彈簣。彈簣為導電物且一旦對著測試裝置施力時接 觸測試裝置的點。彈簧連接至電路。 階段710可包括對著測試裝置施力於電氣中介物的彈 性及導電元件。一旦對著測試裝置施力，彈性及導電元件 接觸測試裝置的點。 階段710可包括當對著測試裝置施力時，同時地接觸 散佈於整個測試裝置上或至少散佈於大部分測試裝置上之 測試裝置的點。 測試裝置可為印刷電路板，階段710可包括藉由散佈 於大部分印刷電路板上之印刷電路板的第一陣列接觸點而 12 201109677 同時地接觸。 又710可包括藉由多數電氣中介物以非垂直的方式 接觸測試裝置的點。據此，當電氣中介物接觸測試裝置的 一點時，電氣中介物具有不與測試裝置之面垂直的縱轴。 依據本發明—實施例，階段？1〇包括接觸位於測試裝 置第面之測5式裝置的點以及方法700更包括階段730，階 段730為對於測試裝置施力第二陣列的電氣中介物並且引 起第二陣列的多個電氣中介物接觸多個屬於測試裝置第二 面之測試裝置的點，以及改變多個電氣中介物之第二端及 連接至第二陣列之第二支持構造之間的高度差異。第二陣 列之電氣中介物的第一端麵合至第二處理單元。第一面可 與第二面不同。或者，第—及第二面係、相同的面。 階段710及730可以平行、部份重疊或是接續的方式 執行。 第二處理單元與第一處理單元可以不同。或者，第一 及第一處理單元可為相同的處理單元。 階段接著階段頂，階段爾為以第二處理單元電 氣測試測試裝置。 第一面可與第二面相對。 測试裝置可為印刷電路板，且第—面可與第二面相對。 階& 740可包括藉由比較屬於來自測試裝置第一及第 二面之不同面之測試裝置的點所產生的電氣訊號來評估測 試裝置的電氣參數。此可包括評估印刷電路板兩側之間的 洩漏。 201109677 選擇耦合至處理單元的電氣中介物可包括於階段720 及740中或可在階段72〇及740之前。 第7圖顯示一對陣列的電氣測試。注意的是，陣列的 數目不限於二，而且可以超過兩個。例如第5圖中顯示包 括四個陣列的四個面板。據此，在方法700中可包括：（a) 對於測試裴置施力於多個陣列的電氣中介物並且引起多個 陣列的多個電氣中介物接觸測試裝置的多個點，而且改變 多個電氣中介物之第二端及連接至多個陣列之多個支持構 造之間的高度差異；其中電氣中介物的第一端耦合到至少 一處理單元；及(b)以至少一處理單元電氣測試測試裝置； 其中多個陣列&括第—陣列’且其中多個支持構造包括第 一支持構造。 此等工具、 本發明經由使用傳統工具、方法及組件而實行。據此， 。在前 方法及組件的細節將不在此處詳加說明。 特別記載的細節就可以實施。。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 FIELD OF THE INVENTION The present invention relates to methods and systems for measuring electrical characteristics of circuits. C Prior Art 3 Background of the Invention For example, regarding testing of printed circuit board PCBs, each PCB may include a plurality of test contacts, wherein the contacts may be tested by touching a plurality of test contact points (eg, 'pairs') and The electrical characteristics are measured by the processing unit. Because of the many test contact points, prior art solutions include a few contacts that must be mechanically moved with respect to the detected PCB in a slow process, or many contacts designed to contact the PCBs #" This is because the test contact points are located at different locations of each pCB product. The design and manufacture of such multiple contact test equipment is complex, slow and expensive. In addition, another problem encountered when measuring the g-type PCB s is that the positions of the different test contacts (and other PCB components) have different heights (for example, in a multi-layer circuit, such prior art) Technically, the contact with test contact points at many different height positions further creates additional complexity. C SUMMARY OF THE INVENTION: 201109677 SUMMARY OF THE INVENTION A system for electrical measurements, including: _--support construction; connection to support The first embodiment of the electrical interposer of the array, wherein each of the electrical interposers of the first array has a first end connected to the first circuit and a point of contact with the test device when the force is applied against the point of the test device: a second end; wherein the plurality of electrical intermediaries of the 'first array' are configured to bias the height between the second end of the first (four) electrical interposer and the first support structure when biased against the test device a difference; wherein the shape of the electrical interposer of the first array is designed to contact a point of interest of the test device regardless of the test device (four); The first circuit is configured to electrically-couple the electrical interposer of the first array to a processing unit configured to measure at least the electrical parameters of the test device. The density of the electrical interposer of the "Xuandi array" is the two senses of the test device The fraction of the distance between points of interest (two-, one-third, one-quarter or less) p Each electrical intermediary includes a spring configured to apply the electrical intermediary once against the measuring device The electrical interposer contacts a point of the test device. Each electrical interposer includes a resilient and electrically conductive element configured to contact the test device once the electrical interposer is applied to the test shirt. A point of the device. The first array is shaped to simultaneously contact a point of the test device throughout the test device when applied to the test device. The test is placed as a printed circuit board, and the first array thereof Shape 4 201109677 ^When pressing against the printed circuit board, the contact is large across the printed circuit board. The point of the printed circuit board is divided. The electrical 'I object is configured to be non-perpendicular a point of contact with the test device. The first array of electrical interposers is configured to contact a point of the test device at the test device; wherein the system further comprises: - a second 4 support structure; The second intermediary of the second support structure does not, wherein 'the respective electrical intermediaries of the second array have a first end connected to the second circuit and the g& is placed in contact with the device when the force is applied a second end of the point of the test device on the second side of the test device; wherein the second side of the n-type device is different from the first side of the test device; and the fourth electrical device of the fourth (fourth) is configured to be Changing the height difference between the second end of the plurality of money towel media and the first support structure in the second array when the force is applied to the test device; and wherein the second circuit is configured to be electrically The two arrays of electrical interposers to the second processing unit, the «the first-processing unit, is configured to measure at least one electrical parameter of the test device. The first side is opposite the second side. The test device is a printed circuit board and the first side thereof is opposite the second side. The first and second processing units are configured to evaluate an electrical parameter of the demotion device by comparing the slaps of the test device belonging to different faces, wherein the different faces are from the first and second of the test device surface. The system may include a plurality of support structures and a plurality of arrays of electrical intermediaries, 201109677 electrical array connection of each array - each electrical intermediary of the array is programmed to electricity: the first and the second =: the point of the test device When the contact point of the test device is contacted, each electrical wiring medium is configured to be configured to face the second end of the test device (10) and the electrical structure of the first support structure. Electrically coupling the :: element: to the point where the measurement is at least - the electrical parameter is set at the point where the gas measurement medium is configured to 'react to the second end when the force is applied The difference in the degree of difference between the #'s and the height of the force applied to the test device. Between the first support structures of & = a method for electrical measurement, the method comprising: facing an electrical interposer of the first array and causing the intervening of the first array to contact the interposer Testing a plurality of points of the device, and varying a height difference between the second end of the multi-solidified milk interposer and the first support structure coupled to the first array; wherein the first electrical array of the first array The end is lightly coupled to the first processing unit; wherein the electrical interposer of the first array is configured to contact the test device of interest t and (10) the first processing unit, regardless of the design of the test device BRIEF DESCRIPTION OF THE DRAWINGS Further details, aspects and embodiments of the present invention will be described by way of example only with reference to the drawings. In the drawings, similar component numbers are used to refer to components that are similar or functionally similar. The components in the drawing are shown in simplified and clear form, and are not necessarily proportional. 1 shows an electrical measurement system in accordance with an embodiment of the present invention; FIG. 2A shows a side view of a system in accordance with an embodiment of the present invention, and a side view of a PCB having a plurality of test points in accordance with an embodiment of the present invention; 2B is a side elevational view of the system in accordance with an embodiment of the present invention; FIG. 3 is a side elevational view of the system in accordance with an embodiment of the present invention; and FIG. 4 is a view of a system in accordance with an embodiment of the present invention; A system in accordance with an embodiment of the present invention; FIG. 6 shows a method in accordance with an embodiment of the present invention; and FIG. 7 shows a method in accordance with an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION The foregoing and other objects, features and advantages of the invention will be apparent from In the various figures, like reference numerals indicate like elements. Because the present invention is shown in the form of an electronic component and circuit that is well known to those skilled in the art, it is not necessary to obscure or deviate from the teachings of the present invention. Therefore, the details will not be further explained. 1 shows an electrical measurement system 100 in accordance with an embodiment of the present invention that can be used to measure electrical characteristics such as, although not limited to, printed circuit board (PCB) circuits. The electrical measurement system 100 includes a support structure 120 having an array of electrical interposers 110 mounted thereon, wherein the duration changes as power is applied to the electrical intermediaries 201109677. The air-intermediate medium 11G is connected to at least the higher 110 of the support structure 120 to include the electrical interposer 130 of the system 100, for the main/self-processing unit (not shown) @circuit (usually labeled as 100 bites) In some cases, the processing unit can be included in the system for one or more electrical interfaces. Connected? (d) The electronic ritual medium UG is at least partially elastic, or exemplified, and the elastic structures are coupled to the support structure 120. (4) The gas medium 110 may be a spring structure, which itself has a 3 疋 k 构造 structure (example (4) glue bump). According to another embodiment, the tamper-intermediate 110 can be an electrostatically conductive turn mounted on an elastic or other resilient material. The intention is that the connection to the test object can be vertical or non-vertical. Among other uses, electrical measurement system 100 can be used for electrical measurements and/or testing of circuits such as PCBs. As mentioned earlier, in such circuits (the term PCB refers to PCBs or other types of circuits), different electrical contacts can be placed at different heights. The elasticity of the electrical interposer 110 or the elasticity of the configuration on which the various electrical interposers are mounted facilitates the contact of the electrical interposer 11 with the respective PCB test points "before the test using the system 1" (as a test bed) The system 100 can be pressed against the PCB. In accordance with an embodiment of the invention, pressing of system 100 against a PCB can be accomplished by pressing system 100 against a test target (e.g., a PCB). In accordance with an embodiment of the invention, the pressing can be performed by pressing the test target against the electrical interposer 110. An electrical intermediary can be placed to contact the point of interest on the test device regardless of the design of the test device. This can be achieved, for example, by arranging the electrical interposer into a very tight array of 8 201109677, where the distance between two adjacent electrical intermediaries is part of the distance between the two points of interest in the test device (half, three-thirds) One, one quarter or less). Figure 2A shows a side view of system 100 and a side view of PCB 10 having a plurality of test points (labeled as black triangles) in accordance with an embodiment of the present invention. Figure 2B shows a side view of system 100 when contacting PCB 10. It can be seen that when force is applied to the different electrical mediators 11, the height of each of the electrical mediators 110 for the support structure 120 will change, and electrical contact with the various test points of the PCB 10 will thus be established. Figure 3 is a side elevational view of a system 1 依据 in accordance with an embodiment of the present invention. Note that the number of electrical interposers 110 can be much more than that shown in the diagram 'and the array of electrical interposers 11 can be adequately packaged so that it can be tested well with a wide variety of PCBs. Electrical contact. It is noted that the elasticity of the structure on which the electrical interposer 110 or the electrical interposer 11 is mounted may be derived from the materials from which they are made (eg, silicone structures, elastomeric constructions, etc.) or from structural designs (eg, springs) or a combination of the two. According to an embodiment of the invention, the resolution of the 11 电气 array of electrical interposers is 400 microns, but other resolutions may be good even if they are significantly different. In accordance with an embodiment of the invention, the array of electrical interposers 110 based on the support structure includes 32x32 (=1G24) electrical interposers 110. It is noted that other numbers of electrical intermediaries 11 can also be used, and the arrangement of electrical interposers 110 can be other configurations (i.e., not χ γ grids). Figure 4 shows a system 2 in accordance with an embodiment of the present invention. System 2〇〇 201109677 includes one or more panels, each panel including system 100. The panels (preferably designated 100) may be connected to each other, to a common physical configuration, or not to a common physical configuration, and may or may not be independently movable and/or controlled. For example, 100 panels (eg, 10x10 arrays) can be used, each having 32x32 electrical interposer 110 for 1 to 6 electrical interposer 110 test equipment. System 200 can further include one or more processing units 250 (which may or may not be incorporated into one or more systems 100) that are adapted to be electrically connected to more than two electrical interposers 110 for performing electrical measurements . It is noted that in each system 100 or a combination of these solutions, a conversion tool for selecting more than two electrical intermediates 110 can be included in the processing unit 150 or included in a unit connected to the processing unit. It is noted that system 200 can be adapted to utilize two or more electrical interposers 110 from different panels for electrical measurements. According to an embodiment of the invention, each 32x32 unit is 12.8 mm by 12.8 mm in size. In accordance with an embodiment of the invention, the size of each 32X32 unit is determined by the space between the two electrical interposers 110. Therefore, if the overall size of each unit is 12.8 by 12.8 mm, the distance between each pair of electrical interposers in the 32x32 electrical intermediate is about 0.4 mm. Therefore, if the overall size of each unit is 12.8 by 12.8 mm, the distance between each pair of electrical interposers in the 32x32 electrical interposer is about 0.4 mm. The electrical connections to the plurality of electrical interposers 110 or from the plurality of electrical interposers 110 can be parallel connections or _ joint connections. In accordance with an embodiment of the invention, system 100 and/or system 200 can include a power source (e.g., a 3.3v DC power source). 10 201109677 Figure 5 shows a system 200 in accordance with an embodiment of the present invention. System 200 is adapted for electrical measurements from a two-sided PCB. Referring to system 100 and system 200, it is noted that although the support structure in the figures is substantially planar, it is not necessarily so, and the shape of support structure 120 can vary and can be further modified in accordance with various embodiments of the present invention. Figure 6 shows a method 600 in accordance with an embodiment of the present invention. Method 600 begins with stage 610, which is to change the position of at least one module (such as system or panel 100) of a system including one or more modules, each module including an array of electrical interposers 110 mounted thereon Support structure 120. Where the force is applied to the electrical interposer 110, the height of each electrical interposer 110 with respect to the support structure 120 may change. The change in position of at least one of the modules results in a change in the height of the plurality of electrical interposers 110 with respect to the support structure 120 and also creates electrical contact between the electrical contacts between the plurality of electrical interposers 110 and different points of the circuit. It is noted that the change in height conveniently includes applying a force to the at least one module relative to the circuit. Stage 620 is followed by stage 610, which selects a plurality of electrical intermediaries in at least one of the modules for participating in electrical measurements. Select to have a subset of electrical intermediaries connected to the processing unit. The number of selected electrical intermediaries varies depending on the number of turns that the processing unit has to measure electrical parameters. Stage 630 is followed by stage 620, which is a switch electrical connection to the selected electrical intermediary. Stage 640 is followed by stage 630, which measures the electrical parameters of the circuit by a processing unit coupled to a plurality of electrical 11 201109677 intermediaries (e.g., those selected and/or converted). Measurements can include measuring the capacitance of the test device, measuring the conductance of the test device, and the like. FIG. 7 shows a method 700 in accordance with an embodiment of the present invention. Method 700 begins with stage 710, which applies an electrical intermediary to the first array of opposing test devices and causes a plurality of electrical intermediaries of the first array to contact a plurality of points of the test device and change a plurality of electrical intermediaries A difference in height between the second end and the first support structure connected to the first array. A first end of the first array of electrical interposers is coupled to the first processing unit. The applying can include pushing the system including the electrical intermediary to the test device. Stage 720 is followed by stage 710, which is to electrically test the test device with the first processing unit. Stage 710 can include applying a spring force to the first array of electrical mediators against the test device. The magazine is a conductive object and contacts the test device once it is applied to the test device. The spring is connected to the circuit. Stage 710 can include elastic and conductive elements that apply force to the electrical interposer against the test device. Once the force is applied to the test device, the resilient and conductive elements contact the point of the test device. Stage 710 can include simultaneously contacting a point of the test device that is spread over the entire test device or at least spread over most of the test devices when the force is applied to the test device. The test device can be a printed circuit board, and stage 710 can include simultaneous contact by a first array of contact points of a printed circuit board interspersed on a majority of the printed circuit board. Still another 710 can include a point that contacts the test device in a non-perpendicular manner by a plurality of electrical intermediaries. Accordingly, when the electrical intermediary contacts a point of the test device, the electrical intermediary has a longitudinal axis that is not perpendicular to the face of the test device. According to the invention - an embodiment, a stage? 1) includes contacting a point of the type 5 device located on the first side of the test device, and the method 700 further includes a stage 730 for applying a second array of electrical intermediaries to the test device and causing a plurality of electrical intermediaries of the second array Contacting a plurality of points belonging to the test device on the second side of the test device, and changing a difference in height between the second ends of the plurality of electrical mediators and the second support structure connected to the second array. The first end face of the second array of electrical interposers is coupled to the second processing unit. The first side can be different from the second side. Or, the first and second sides, the same face. Stages 710 and 730 can be executed in parallel, partially overlapping or successive manners. The second processing unit can be different from the first processing unit. Alternatively, the first and first processing units may be the same processing unit. The stage is followed by the stage top, which is an electrical test test device with a second processing unit. The first side can be opposite the second side. The test device can be a printed circuit board and the first face can be opposite the second face. The steps & 740 can include evaluating the electrical parameters of the test device by comparing electrical signals generated by points belonging to test devices from different faces of the first and second faces of the test device. This can include evaluating leaks between the sides of the printed circuit board. 201109677 Selecting an electrical intermediary coupled to the processing unit may be included in stages 720 and 740 or may be before stages 72 and 740. Figure 7 shows the electrical test of a pair of arrays. Note that the number of arrays is not limited to two, and may be more than two. For example, Figure 5 shows four panels including four arrays. Accordingly, in method 700, the method 700 can include: (a) applying a force to the plurality of arrays of electrical interposers for the test device and causing the plurality of electrical interposers of the plurality of arrays to contact the plurality of points of the test device, and changing the plurality of points a height difference between the second end of the electrical interposer and the plurality of support structures connected to the plurality of arrays; wherein the first end of the electrical interposer is coupled to the at least one processing unit; and (b) the electrical test is tested with the at least one processing unit A device; wherein the plurality of arrays & includes a first array' and wherein the plurality of support configurations comprises a first support configuration. These tools, the invention are practiced using conventional tools, methods, and components. According to this,. The details of the previous methods and components will not be explained in detail here. Specially documented details can be implemented.
【圖式簡單說明】 面的說明中記載著許多㈣的細節以提供對於本發明之完 整的了解。然而，應該被認定的是，本發明毋庸使用這: 在本揭露内容中僅顯示及說明本發_例示實施例及BRIEF DESCRIPTION OF THE DRAWINGS A number of (four) details are set forth in the description of the drawings to provide a complete understanding of the invention. However, it should be recognized that the present invention is not intended to be used: In the present disclosure, only the present embodiment is shown and described.
弟圖顯示依據本發明一 實施例的電氣測量系統； ~實施例之系統的側視圖，及 201109677 依據本發明一實施例之具有數個測試點之PCB的側視圖； 第2B圖顯示依據本發明一實施例之系統的側視圖； 第3圖為依據本發明一實施例之系統的側視圖，； 第4圖顯示依據本發明一實施例的系統； 第5圖顯示依據本發明一實施例的系統； 第6.圖顯示依據本發明一實施例的方法；及 第7圖顯示依據本發明一實施例的方法。 【主要元件符號說明】 10.. . PCB 100.. .電氣測量系統 110.. .電氣中介物 120.. .支持構造 130.. .電路 140.. .電氣介面 150.··處理單元 200.. .系統 600, 700…方法 610, 620, 630, 640, 710, 720.730.740.. .階段 15The figure shows a side view of an electrical measurement system in accordance with an embodiment of the present invention; a system of the embodiment, and 201109677 a side view of a PCB having a plurality of test points in accordance with an embodiment of the present invention; A side view of a system in accordance with an embodiment of the present invention; FIG. 4 is a side view of a system in accordance with an embodiment of the present invention; FIG. 4 is a view of a system in accordance with an embodiment of the present invention; System; Figure 6. shows a method in accordance with an embodiment of the present invention; and Figure 7 shows a method in accordance with an embodiment of the present invention. [Main component symbol description] 10.. . PCB 100.. . Electrical measurement system 110.. Electrical intermediaries 120.. Support structure 130.. Circuit 140.. . Electrical interface 150. · Processing unit 200. . System 600, 700... Method 610, 620, 630, 640, 710, 720.730.740.. . Stage 15