201109676 六、發明說明： 【發明所屬之技術領域】 本發明係與電性檢_之探針設備有關，更詳而言之是指 一種高頻探針卡。 【先前技術】 按’電子產品馳過多道檢測程序通過以雜品質後始得 流通於市面。檢測項目之-的通電測試即是為了驗證電子產品 之各精密電子元件間的電性連接是否確實、功能是否符合驗收 規格。在進行通電測試時’是以探針卡作為檢測機與待測電子 物件之間的測試訊號傳輸介面。 基此，已知的探針卡，如曰本公開專利犯裏⑽^係 將PCB電路板（又稱「印刷電路板」）電性連接一軟性印刷電 路板與複數撕之撕卡，如第—圖卿岐，梅針卡】包 括一 PCB電路板2、-軟性印刷電路板3與複數探針4，軟性 印刷電路板3藉由複數螺栓5而鎖固於pCB電路板2下方， 且藉由複數金屬銲墊6及導電孔2a而與PCB電路板2之配線 2b電性_。前述探針卡！雖可達到預設效果與目的，惟， 其具備尚成本且硬質屬性的PCB電路板，將造成探針卡成本 增加，尤其是在高層數、高頻率及多傳輸路徑的pcB電路板 逐漸被大量應用的情況下’更將造成整個探針卡成本倍增；其 次’軟性印刷電路板3與PCB電路板2之間的電性連接結構 201109676 包括金屬銲墊6與導電孔2a ’該搭配方式不僅因金屬銲墊6 所構成的節點數過多（PCB電路板2的上、下表面皆具備）， 更惡化測試訊號傳輸路控之品質’遂降低了傳輸測試訊號的能 力’尤其是傳輸高頻率之測試訊號時，如3GHz以上，該探針 卡的傳輸路徑品質更是被嚴格要求；甚者，使用PCB電路板 將導致的另一惡化傳輸路徑之問題，就是導電孔2a是不具電 性阻抗匹配的傳輸路徑，將使高頻測試訊號通過導電孔2a時 嚴重衰減，如中華民國發明專利公告第124833〇號便是為了解 決此問題而提出之技術。 再者，PCB電路板一般使用高分子材料來製作，當探針卡 使用於高溫的晶圓測試環境時，將因為膨脹率較大而影響探針 卡的穩定性。 【發明内容】 有鑑於此，本發明之主要目的在於提供1高頻探， 係可提升電性傳輸能力，並可降低成本支出。 本發明之次要目的在於提供-種高頻探針卡，具有一金屬 框架以強化探針卡的機械強度。 本發明之另-目的在於提供一種高頻探針卡，其軟性印刷 電路板獲得良好支撐效果，增強探針卡的穩定性。 緣以達成上述目的，本發明所提供之高頻^ 性印刷電路板…金屬框架、複數個金屬塾與複數根探針，^ 201109676 中，金屬框架係用以固定支撐該軟性印刷電路板，金屬墊作為 軟性印刷電路板與-檢測機之間的電性直接連接結構，探針盘 該軟性印刷電路板電性連接，且具有—針尖_觸-剌電 子物件之受測雜。藉此，俾達_試訊號的傳輸。 另為維持軟性印猶路板的展_狀，本發明所提供之高 頻探針卡可包括—與該金屬框_接之支禮裘置。 本發明所提供之高雜針卡可再設置__彈_整器，用以 確保探針之針尖確實點觸待測電子物件之受測部位。 本發明所提供之高親針卡可再設置—緩賊置，用以吸 收來自檢測機接觸金屬墊時的作用力。 本發明所提供之高頻探針卡可於軟性印刷電路板與探針 之間增設-空_換n，用以提供探針佈局的靈活性。 【實施方式】 為能更清楚地說明本發明，兹舉數個較佳實施例並配合圖 不詳細說明如后。 第二、三圖所示為本發明高雜針卡之第—較佳實施例， 該高頻探針卡1〇包括-軟性印刷電路板12、複數個金屬墊 14、複數根探針16、-金屬框_與複數螺栓19，立中： 軟性印刷電路板12在本實施例中是由數扇形導電片121 間隔排列呈_，且相鄰扇形導電片121之間構成一間隙區 仏’前述複數扇形導電片⑵可為一體成形或為個別組合而 201109676 成’該軟性印刷電路板12定義有相對之一上表面12a與一下 表面12b ’以及從内、外圍區分出一探針區12c與一接觸區 12d，另有複數條導線122佈設於各扇形導電片121，且導線 122兩端分別位於探針區12c與接觸區I2d範圍内，數個穿孔 123則分設於各扇形導電片121。 該些金屬墊14設置於軟性印刷電路板12之上表面i2a， 且位於該接觸區12d範圍内，各金屬墊14分別與軟性印刷電 路板12之導線122電性連接。 該些探針16在本實施例中係直接設置於軟性印刷電路板 12之下表面12b，且位於該探針區12c範圍内，各探針16 一 端與軟性印刷電路板12之導線122電性連接，另一端則形成 一針尖16卜 該金屬框架18為一具有錐度之本體181及一自本體181 頂緣循徑向朝外延伸的環框182構成之圓盤體，另有複數個貫 孔183穿透環框182之頂、底面，以及複數個螺孔184設於環 框182上，金屬框架18之底面則構成一支撐面18a。 該些螺栓19穿過軟性印刷電路板12之穿孔123再鎖入金 屬框架18之螺孔184 ’於旋緊螺栓19後，將使得軟性印刷電 路板12固設於金屬框架18，且軟性印刷電路板12之上表面 12a與金屬框架18之支撐面收密貼而維持軟性印刷電路板 12的展開形狀’此時，軟性_電路板12上的各金屬墊14 對應容置於金屬框架18之貫孔183 t。 201109676 以上所述即為本發明第一較佳實施例高頻探針卡1〇之結 構說明’其應用於電子產品檢測時，設於軟性印刷電路板12 上表面12a之該些金屬墊14恰為一檢測機100之複數個導電 彈簧針（pogo pin) 101所對應接觸，設於軟性印刷電路板12 下表面12b之該些探針16的針尖161則點觸一待測電子物件 2〇〇之受測部位2(U ’藉此’俾於檢測機1〇〇、高頻探針卡1〇 與待測電子物件2GG之卿成—導電通路，該高麵針卡1〇 並得有效地將檢測機1〇〇之測試訊號傳輸至待測電子物件2〇〇 以進行電性檢測。 歸納上述高頻探針卡10結構所帶來之效益有： 1. 檢測機100與待測電子物件2〇〇之間的測試訊號傳輸路 徑，是由金屬墊14、軟性印刷電路板12之導線122及探針％ 電性連接轉成，㈣搭配方朗減少導麟接關設置數 量，使得高頻探針卡10之電性傳輸能力獲得提升。 2. 高頻探針卡1〇主要以成本較低的金屬框架18與軟性印 刷電路板12結合的方式取代成本較高的pcB冑路板，故可降 低成本支出。 3. 高頻探針卡1〇{以具備良好剛性的金屬框架18作為強 化整體結構之機鋪度制’使得高雜針卡1()不因反覆測 試使用而損壞。 4. 承上’金屬框架18之鱗脹係數(以疏㈣〇f 丁^聰】 Expansion ’ CTE)遠低於習用技藝以有機材料製成電路板之 201109676 〜十卡目此本發明之局頻探針卡更有利於高溫環境使用。 5.軟性印刷電路板12獲得金屬框架18支撑面收的良好 支擇效果，料破損且便於組裝。 於後再說明本發明高頻探針卡之其他實施例，其中： 第四圖所不為本發明第二較佳實制之高麵針卡其 具有與上述第-較佳實施例之高縣針卡⑺相職構，不同 處在於.同頻探針卡2〇更包括一與軟性印刷電路板η電性連 接的工間轉換器（spaeetransfo_) 22，該空間轉換器η位 ;探針區12c的外側’而探針16則是改設於空間轉換器μ的 底面22a，因空間轉換器22具有變換電性傳輸路徑的功用， 使侍探針16的佈局方式更具靈活性。 第五圖所示為本發明第三較佳實施例之高頻探針卡24,其 包括有軟性印刷電路板26、金麟28、探針3〇與金屬框架 32’以及一由支撐塊34且與金屬框架％固接而構成之支撐裝 置，其中： 軟性印刷電路板26具有相對之一上表面26a與一下表面 26b，及疋義有一探針區26c、一延伸區26d與一接觸區; 金屬墊28電性連接於該上表面26a且位於接觸區範圍内； 探針30電性連接於該下表面26b且位於探針區26c範圍内； 而該金屬框架32具有一鏤空部321，鏤空部321具有一環錐 面321a及於金屬框架32之底面32a形成一開口 321b，金屬框 201109676 架32之頂面（包括該環錐面321a)則構成一支撐面32b。 在軟性印刷電路板26與金屬框架32固接，且支撐塊34 之壓貼面34a壓抵軟性印刷電路板26之探針區之上表面 26a的情形下’如該第五圖所示，軟性印刷電路板％之下表 面26b貼抵金屬框架32之支樓面32b，軟性印刷電路板26之 探針區26c對應鏤空部321之開口 321b，且探針邓之針尖3〇1 突露於該開π 32lb外侧。前述高頻探針卡％具備與前述實施 例相同之功效，於此不再贅述。 第✓、圖所示則為本發明第四較佳實施例之高頻探針卡 36，其具有相同第三較佳實施例之高頻探針卡％的所有構 件，不同的疋，本實施例之高頻探針卡36更具有該空間轉換 器22，且探針30是改設於空間轉換器22的底面瓜。 第七圖所示為本發明第五較佳實施例之高頻探針卡38,其 具有相同上料三較佳實關之紐_電路板26、金屬塾 28、探針30與金屬框架32等構件及配置，不同的是·· 高頻探針卡38之支撐裝置40是藉由螺栓41穿經軟性印 刷電路板26之間隙區i2e再鎖入金屬框架32而獲得固定，該 支撐裝置40包括一剛性體4〇1與一軟墊4〇2，其中，剛性體 401之外型與金屬框架32之鏤空部321配合而呈錐形體，剛 性體401底面構成一壓貼面4〇ia可觸壓軟性印刷電路板26探 針區26c之上表面26a，而該軟墊402係設置於剛性體401與 軟性印刷電路板26之延伸區26d之間，避免該處之軟性印刷 201109676 電路板26受磨損。 包含上㈣示林判第增_狀高_針卡42,其 =五較佳實施例之高酬卡38的所 ，疋，該_探針切更具有_職器22，且探㈣ 疋改设於空間轉換器22的底面22a。 第九_福本發明第增編狀高雜針卡44，其 相同上述第三較佳實施例之軟性印刷電路板％、金屬塾 28、探針30與金屬框架32等構件及配置，不同的是： 高頻探針卡44之支稽裝置46同樣藉由螺检（圖未示）穿 經軟性印刷電路板26之間隙區12e再鎖人金屬框㈣而與金 屬框架32固接，該支樓裝置46包括一結合座461、一環框 啦、-彈性調整器463、一剛性體464與一軟塾465 ,其中， 結合座461下方固接有該環框462、彈性調整器如與剛性體 464 ’該彈性調整器463具有充份的彈性而可提供剛性體你 適度上、下移動裕度’此功能可滿足不同測試環境對探針卡之 需求，藉以確保該些探針30之針尖3〇1確實地點觸待測電子 物件200之受測部位201，俾達良好電性接觸效果，前述彈性 調整器463可選擇一適當彈性係數之彈簧、或多數小型彈簧並 排、或以彈性橡膠等方式而構成，當然，更可進一步對螺絲 466或螺絲467進行旋進或旋退以微調剛性體464的位置；而 於環框462與軟性印刷電路板26之間則設有該軟墊465。 第十圖所示為本發明第八較佳實施例之高頻探針卡48，其 201109676 包f上料七較佳實施例之高雜針卡44的所有構件’不同 的疋，該向頻探針卡48更具有該空間轉換器22，且 是改設於空間轉換器22的底面22a。 針 上述各實施麵林侧高鑛針卡之__，惟並不 以此為限。茲再說明以上述各實施例為基礎架構之可衍生結構 變化如下： 第十-圖所不為本發明第九較佳實施例之高頻探針卡 5〇，其以上述第-較佳實施例之高雜針卡1〇為基礎結構而 增設有-緩衝裝置52，該緩衝裝置52包括一緩衝墊521與一 硬質背板522 ’緩衝塾切設於軟性印刷電路板u之接觸區 ⑶與背板522之間，在檢_ 1〇〇之導電彈普針ι〇ι接觸金 屬墊14時，緩衝墊52卜及收來自導電彈簧針1〇1的觸壓作用 • 力，據此以確保導電彈簧針101與金 Μ維持良好接觸及 導電效果。同樣地，緩衝裝置52亦適用於第四圖所示之高頻 探針卡20。 第十二圖所示為本發明第十較佳實施例之高頻探針卡 54，其以上述第三較佳實施例之高頻探針卡％為基礎結構再 増設有一緩衝裝置56，該緩衝裝置56為一整面設置於該軟性 印刷電路板26之接觸區26e與金屬框架32支撐面32b之間的 緩衝墊，用以吸收來自檢測機100之導電彈簧針1〇1的觸壓作 用力，據以確保導電彈簧針101與金屬墊28維持良好接觸及 201109676 導電效果，4強化預防軟性印刷冑路板26的滑動，本實施例 結構更可增設複數根^錄322，該較位柱322可佈設於金 屬框架32之支撑面32b或支撐塊34的壓貼面3乜或於該二處 皆有佈設，再於軟性印刷電路板26上設有定位孔26f供定位 柱322對應穿設’俾達抑制軟性印刷電路板％滑動之目的。 同樣地，緩衝裝置56亦適用於第六至十圖所示之高頻探針卡 36、38、42、44及48，且定位柱322與定位孔26f的配合得 為選擇被應用。 第十一圖所示為本發明第十一較佳實施例之高頻探針卡 t同樣是以第三較佳實施例之高頻探針卡％縣礎結構， 不同的疋.本實麵高縣針卡58之金屬㈣32具有複數個 凹槽322，該些凹槽奶係自該支樓面奶凹陷且對應各該金 2塾28而叹置’凹槽322提供軟性印刷電路板26適當的變形 工間，藉以因應檢測機1〇〇之導電彈簧針1〇1觸壓金屬墊Μ 夺的微里變形’據以確保導轉簧針丨⑴與金屬塾Μ維持良 好接觸及導電效果。同樣地’前述凹槽322結構得為第六至十 圖所示之高頻探針卡36、38'42、44及48所應用。 第十四圖所示為本發明第十二較佳實施例之高頻探針卡 —系在第十二圖所不之第十—較佳實施例之高頻探針卡％ 的母凹槽322結構中’各別填入有一緩衝墊62，用以提高 :收^測機1〇〇之導電彈簧針ι〇ι觸壓作用力的效果。同樣 別述四槽322與緩衝墊62配合之技術特徵亦得為第六至 201109676 十圖所示之馬頻探針卡36、38、42、44及48所應用。 第十五圖所示為本發明第十三較佳實施例之高頻探針卡 64，其以第三較佳實施例之高頻探針卡24為基礎結構，不同 處在於：本實施例高鱗針卡64之支魏66具有至少一空 間，且該軟性印刷電路板26之上表面26a更電性連接有一或 數個可執行不同功能的電子元件68或模組化電子元件7〇或同 時設置’前述空耻本實施财包括貫穿的透孔661與凹部 662 ’其料應電子元件68及模組化電子元件7〇，目的在於 避免抽壞電子元件。囉地，前述增體_概亦得應用於 第’、圖之支擇塊34、第七圖與第八圖之剛性體·、第九圖與 第十圖之剛性體464。 以下再說a林發明③頻探針卡之軟性印刷電路板的強化 固設方式，其中： 第十六圖所示之高雜針卡72細第三紐實施例之高 麵針卡24為基核構，本實補之高繼肝72包括有一 壓合板74 ’該壓合板74賴該軟性印刷電路板26之接觸區 ’且屬合板74具有複數個透孔741供各該金屬塾28容置 其中以便接觸導電。 第十七、十八圖所示之軟性印刷電路板76為複合結構， 其包括複數扇形導電片761與一為該些扇形導電片761包覆之 硬質基板762 ’該基板762呈環狀且主要分佈於該軟性印刷電 13 201109676 路板76之接觸區76a，基板762具有數個局部裸露區762a， 各裸路區762a没有螺孔762b供螺松77穿設並鎖入金屬框年 78而為固接。 第十九圖所示之軟性印刷電路板80具有類似上述扇形導 電片801與硬質基板802結構’不同的是更包括有複數根穩樁 803，該些穩樁803穿插該硬質基板8〇2與金屬框架81以固定 軟性印刷電路板80，或，穩樁8〇3直接設置於硬質基板8〇2 上，穩樁803 —端並插入金屬框架81以固定軟性印刷電路板 80，如此可防止軟性印刷電路板8〇被侧向扯動。 第二十圖所示之軟性印刷電路板82亦為複合結構，其在 不干擾導線（圖未示）的情形下，内置至少一磁性件幻，該 磁性件82用以吸附於金屬框架84，俾達夾壓固定軟性印刷電 路板82之目的，且取代—般機細結方式。 以上所述僅為本細之數錄佳可行實施綱已，舉凡應 用本發綠a轉及巾請專利範圍所為之等效結構及製作方法 變化’理應包含在本發明之專纖圍内。 201109676 【圖式簡單說明】 第圖為習用結合軟性印刷電路板與pCB電路板之探針卡剖 視圖。 第二圖為本發明高麵針卡第—較佳實施例之剖視圖。 第二圖為上述第-難實施例之軟性_電路板示意圖。 第四圖為本發明高麵針卡第二較佳實施例之剖視圖。 第五圖為本發明高雜針卡第三較佳實施例之剖視圖。 第”圖為本發明南頻探針卡第四較佳實施例之剖視圖。 第七圖為本發明㈣探針卡第五較佳實補之剖視圖。 第八圖為本發明*雜針卡第六較佳實補之剖視圖。 第九圖為本發明确探針卡第七較佳實施例之剖視圖。 第十圖為本發明减探針卡第八較佳實施例之剖視圖。 第十-圖為本發明高頻探針卡第九較佳實施例之剖視圖。 第十二圖為本發明高頻探針卡第十較佳實施例之剖視圖。 第十三圖為本發明高頻探針卡第十一較佳實施例之剖視圖。 第十四圖為本發明南頻探針卡第十二較佳實施例之剖視圖。 第十五圖為本發明高雜針卡第十三較佳實施例之剖視圖。 第十六圖為-剖視圖’糊軟性印刷電路板受—壓合板壓制。 第十七圖為另-軟性印刷電路板之示意圖。 第十八圖為一局部放大剖視圖，說明軟性印刷電路板藉由螺栓 穿過基板而為固接。 第十九圖為-局部放大剖視圖，說明軟性印刷電路板利用穩樁 15 201109676 插設而為固接。 第二十圖為一局部放大剖視圖，說明軟性印刷電路板内置磁性 件而以磁吸方式達成固設。 201109676 【主要元件符號說明】 10、20高頻探針卡 12軟性印刷電路板201109676 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a probe device for electrical inspection, and more particularly to a high frequency probe card. [Prior Art] According to the 'Electronic Product', a lot of inspection procedures passed through the market after passing through the quality. The power-on test of the test item is to verify whether the electrical connection between the precision electronic components of the electronic product is true and whether the function meets the acceptance specifications. When performing the power-on test, the probe card is used as the test signal transmission interface between the detector and the electronic object to be tested. Therefore, the known probe card, such as the patent disclosure of the patent (10) ^ is a PCB circuit board (also known as "printed circuit board") electrically connected to a flexible printed circuit board and a plurality of tearing cards, such as - Tuqing 岐, Mei Pin Card] includes a PCB circuit board 2, a flexible printed circuit board 3 and a plurality of probes 4, and the flexible printed circuit board 3 is locked under the pCB circuit board 2 by a plurality of bolts 5, and borrowed The wiring 2b of the PCB circuit board 2 is electrically connected by the plurality of metal pads 6 and the conductive holes 2a. The aforementioned probe card! Although the preset effect and purpose can be achieved, the PCB board with cost and hard attributes will increase the cost of the probe card, especially in the high-level, high-frequency and multi-transmission path pcB boards. In the case of application, the cost of the entire probe card will be doubled. Secondly, the electrical connection structure between the flexible printed circuit board 3 and the PCB circuit board 2, 201109676 includes the metal pad 6 and the conductive hole 2a. The number of nodes formed by the metal pad 6 is too large (both on the upper and lower surfaces of the PCB board 2), which worsens the quality of the test signal transmission path. 'The ability to transmit test signals is reduced', especially the test for transmitting high frequencies. When the signal is above 3 GHz, the quality of the transmission path of the probe card is strictly required; otherwise, the problem of using another PCB circuit board to deteriorate the transmission path is that the conductive hole 2a is not electrically impedance matched. The transmission path will cause the high-frequency test signal to be seriously attenuated when passing through the conductive hole 2a. For example, the Republic of China Invention Patent Notice No. 124833 is to solve this problem. Of technology. Furthermore, PCB boards are generally fabricated using polymer materials. When the probe card is used in a high temperature wafer test environment, the stability of the probe card is affected by the large expansion ratio. SUMMARY OF THE INVENTION In view of the above, the main object of the present invention is to provide a high frequency probe that can improve electrical transmission capability and reduce cost. A secondary object of the present invention is to provide a high frequency probe card having a metal frame to enhance the mechanical strength of the probe card. Another object of the present invention is to provide a high frequency probe card whose soft printed circuit board achieves a good supporting effect and enhances the stability of the probe card. In order to achieve the above object, the present invention provides a high-frequency printed circuit board, a metal frame, a plurality of metal iridium and a plurality of probes, and in 201109676, a metal frame is used to securely support the flexible printed circuit board, metal. The pad serves as an electrical direct connection structure between the flexible printed circuit board and the detecting machine, and the flexible printed circuit board of the probe disk is electrically connected, and has a measured impurity of the tip-touch-e-electron electronic object. In this way, the transmission of the _ test signal. In addition, in order to maintain the appearance of the flexible printed circuit board, the high frequency probe card provided by the present invention may include a binding device with the metal frame. The high needle card provided by the invention can be further provided with a __ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The high-push card provided by the present invention can be re-set to absorb the force from the detector when it contacts the metal pad. The high frequency probe card provided by the present invention can add a space-to-nap between the flexible printed circuit board and the probe to provide flexibility in probe layout. [Embodiment] In order to explain the present invention more clearly, several preferred embodiments are described in detail with reference to the accompanying drawings. The second and third figures show a preferred embodiment of the high-pliers card of the present invention. The high-frequency probe card 1 includes a flexible printed circuit board 12, a plurality of metal pads 14, and a plurality of probes 16. - metal frame _ and plurality of bolts 19, center: The flexible printed circuit board 12 is arranged by the number of sector-shaped conductive sheets 121 in the present embodiment, and a gap region is formed between the adjacent sector-shaped conductive sheets 121. The plurality of sector-shaped conductive sheets (2) may be integrally formed or individually combined, and the flexible printed circuit board 12 defines a relatively upper surface 12a and a lower surface 12b', and a probe region 12c and a portion are distinguished from the inner and outer portions. In the contact region 12d, a plurality of wires 122 are disposed on the sector-shaped conductive sheets 121, and the two ends of the wires 122 are respectively located in the range of the probe region 12c and the contact region I2d, and the plurality of through holes 123 are respectively disposed on the sector-shaped conductive sheets 121. The metal pads 14 are disposed on the upper surface i2a of the flexible printed circuit board 12 and are located in the contact area 12d. The metal pads 14 are electrically connected to the wires 122 of the flexible printed circuit board 12, respectively. In the present embodiment, the probes 16 are directly disposed on the lower surface 12b of the flexible printed circuit board 12, and are located in the range of the probe region 12c, and the ends of the probes 16 and the wires 122 of the flexible printed circuit board 12 are electrically connected. The other end is formed with a needle tip 16 and the metal frame 18 is a tapered body 181 and a ring body 182 extending radially outward from the top edge of the body 181, and a plurality of through holes 183 penetrates the top and bottom surfaces of the ring frame 182, and a plurality of screw holes 184 are disposed on the ring frame 182, and the bottom surface of the metal frame 18 constitutes a support surface 18a. The bolts 19 pass through the through holes 123 of the flexible printed circuit board 12 and are locked into the screw holes 184 ′ of the metal frame 18 to tighten the bolts 19, so that the flexible printed circuit board 12 is fixed to the metal frame 18, and the flexible printed circuit The upper surface 12a of the board 12 is adhered to the supporting surface of the metal frame 18 to maintain the expanded shape of the flexible printed circuit board 12. At this time, the metal pads 14 on the flexible board 12 are correspondingly accommodated in the metal frame 18. Hole 183 t. 201109676 The above is the structure description of the high-frequency probe card 1 of the first preferred embodiment of the present invention. When it is applied to electronic product detection, the metal pads 14 provided on the upper surface 12a of the flexible printed circuit board 12 are just For the corresponding contact of the plurality of conductive pogo pins 101 of the detecting machine 100, the needle tips 161 of the probes 16 disposed on the lower surface 12b of the flexible printed circuit board 12 are in contact with an electronic object to be tested. The part 2 to be tested (U 'by the 'detection machine 1〇〇, the high-frequency probe card 1〇 and the electronic object to be tested 2GG into a conductive path, the high-face needle card 1〇 and effectively The test signal of the detector 1 is transmitted to the electronic object to be tested 2 to perform electrical detection. The advantages of the structure of the high-frequency probe card 10 are summarized as follows: 1. The detector 100 and the electronic object to be tested The test signal transmission path between the two turns is made up of the metal pad 14, the wire 122 of the flexible printed circuit board 12, and the probe's electrical connection. (4) With the square to reduce the number of guides, the high frequency The electrical transmission capability of the probe card 10 is improved. 2. High-frequency probe card 1 The costly expenditure is reduced by replacing the costly PCB board with the lower cost metal frame 18 and the flexible printed circuit board 12. 3. The high frequency probe card 1〇{for a metal with good rigidity The frame 18 acts as a machine for strengthening the overall structure' so that the high-powder card 1() is not damaged by the repeated test. 4. The squash expansion coefficient of the metal frame 18 (to Shu (4) 〇f Ding ^ Cong] Expansion 'CTE) is much lower than the conventional technology of circuit board made of organic material 201109676 ~ ten card. The local frequency probe card of the present invention is more favorable for high temperature environment. 5. The flexible printed circuit board 12 is supported by the metal frame 18 The invention has the advantages of good selection, material damage and easy assembly. Hereinafter, other embodiments of the high-frequency probe card of the present invention will be described, wherein: the fourth figure is not the second preferred embodiment of the present invention. The khaki has the same structure as the Gaoxian needle card (7) of the above-described first preferred embodiment, and the difference is that the same frequency probe card 2 〇 further includes an inter-mechanical converter (spaeetransfo_) electrically connected to the flexible printed circuit board η. 22, the space converter η bit; The outer side of the needle region 12c' and the probe 16 are modified to the bottom surface 22a of the space transformer μ. Since the space transformer 22 has the function of changing the electrical transmission path, the layout of the probe 16 is more flexible. The fifth embodiment shows a high frequency probe card 24 according to a third preferred embodiment of the present invention, which includes a flexible printed circuit board 26, a Jinlin 28, a probe 3〇 and a metal frame 32', and a support block 34. And a supporting device formed by fixing the metal frame %, wherein: the flexible printed circuit board 26 has a pair of upper surface 26a and a lower surface 26b, and a probe region 26c, an extension region 26d and a contact region; The metal pad 28 is electrically connected to the upper surface 26a and located in the contact area; the probe 30 is electrically connected to the lower surface 26b and located in the range of the probe area 26c; and the metal frame 32 has a hollow portion 321 The portion 321 has a ring-shaped tapered surface 321a and an opening 321b formed in the bottom surface 32a of the metal frame 32. The top surface of the metal frame 201109676 frame 32 (including the annular tapered surface 321a) constitutes a supporting surface 32b. In the case where the flexible printed circuit board 26 is fixed to the metal frame 32, and the pressing surface 34a of the support block 34 is pressed against the upper surface 26a of the probe region of the flexible printed circuit board 26, as shown in the fifth figure, the softness The lower surface 26b of the printed circuit board is attached to the support surface 32b of the metal frame 32, and the probe area 26c of the flexible printed circuit board 26 corresponds to the opening 321b of the hollow portion 321 , and the probe tip 3 〇 1 is exposed in the Open π 32lb outside. The aforementioned high-frequency probe card % has the same functions as those of the foregoing embodiment, and will not be described again. The present invention is a high-frequency probe card 36 according to a fourth preferred embodiment of the present invention, which has all the components of the high-frequency probe card % of the third preferred embodiment, different configurations, and the present embodiment. The high frequency probe card 36 of the example further has the space transformer 22, and the probe 30 is modified on the bottom surface of the space transformer 22. The seventh embodiment shows a high-frequency probe card 38 according to a fifth preferred embodiment of the present invention, which has the same loading material, a circuit board 26, a metal raft 28, a probe 30 and a metal frame 32. The components and the arrangement are different. The support device 40 of the high-frequency probe card 38 is fixed by the bolt 41 passing through the gap region i2e of the flexible printed circuit board 26 and then locked into the metal frame 32. The support device 40 is fixed. The utility model comprises a rigid body 4〇1 and a cushion 4〇2, wherein the outer shape of the rigid body 401 cooperates with the hollow portion 321 of the metal frame 32 to form a cone, and the bottom surface of the rigid body 401 forms a pressing surface. Touching the flexible printed circuit board 26 on the upper surface 26a of the probe region 26c, and the pad 402 is disposed between the rigid body 401 and the extended region 26d of the flexible printed circuit board 26, avoiding the soft printing of the circuit 201109676 circuit board 26 Subject to wear and tear. Including the above (4) indicating the increase of the number _ high _ pin card 42, which = the high-paid card 38 of the preferred embodiment, 疋, the _ probe cut has _ _ _ 22, and Detect (4) tampering It is provided on the bottom surface 22a of the space transformer 22. The ninth invention is an addendum type high-stitch card 44 of the present invention, which is different from the components and arrangements of the flexible printed circuit board %, the metal cymbal 28, the probe 30 and the metal frame 32 of the third preferred embodiment. The branching device 46 of the high-frequency probe card 44 is also fixed to the metal frame 32 by threading (not shown) through the gap region 12e of the flexible printed circuit board 26 and then locking the metal frame (4). The device 46 includes a joint 461, a ring frame, an elastic adjuster 463, a rigid body 464 and a soft dam 465. The ring frame 462, the elastic adjuster and the rigid body 464 are fixed under the joint 461. 'The elastic adjuster 463 has sufficient elasticity to provide a rigid body with a moderate up and down movement margin'. This function can meet the needs of the probe card in different test environments, thereby ensuring the tip of the probe 30. 1 The location of the measured object 201 of the electronic object 200 is determined to be good, and the elastic adjuster 463 can select a spring with a suitable elastic coefficient, or a plurality of small springs side by side, or elastic rubber. Composition, of course, more The screw 466 or the screw 467 is screwed in or out in a step to finely adjust the position of the rigid body 464; and the cushion 465 is provided between the ring frame 462 and the flexible printed circuit board 26. The tenth embodiment shows a high-frequency probe card 48 according to an eighth preferred embodiment of the present invention. The 201109676 package is loaded with all the components of the high-powder card 44 of the preferred embodiment. The probe card 48 further has the space transformer 22 and is reconfigured on the bottom surface 22a of the space transformer 22. Needle __ on the forest side high-grade needle card for each of the above implementations, but not limited to this. Further, the derivable structure change based on the above embodiments is as follows: The tenth-figure is not the high frequency probe card 5 of the ninth preferred embodiment of the present invention, which is in the above-described preferred embodiment. For example, the high-stitch card 1 is provided with a buffer device 52, and the buffer device 52 includes a cushion 521 and a hard back plate 522 'buffered and cut into the contact area (3) of the flexible printed circuit board u. Between the back plates 522, when the conductive pin ι〇ι of the test _ 1 接触 contacts the metal pad 14, the cushion 52 receives the contact force from the conductive spring pin 1〇1, thereby ensuring The conductive spring pin 101 maintains good contact and electrical conduction with the metal enamel. Similarly, the buffer device 52 is also applicable to the high frequency probe card 20 shown in the fourth figure. Figure 12 is a view showing a high-frequency probe card 54 according to a tenth preferred embodiment of the present invention, which is further provided with a buffer device 56 based on the high-frequency probe card % of the third preferred embodiment. The buffer device 56 is a cushion disposed on the entire surface between the contact region 26e of the flexible printed circuit board 26 and the support surface 32b of the metal frame 32 for absorbing the contact pressure of the conductive spring pin 1〇1 from the detector 100. The force is ensured that the conductive spring pin 101 and the metal pad 28 maintain good contact and the conductive effect of the 201109676, 4 strengthens the prevention of the sliding of the soft printed circuit board 26, and the structure of the embodiment can further add a plurality of roots 322, the positional column The 322 can be disposed on the supporting surface 32b of the metal frame 32 or the pressing surface 3 of the supporting block 34 or disposed at the two places, and the positioning hole 26f is disposed on the flexible printed circuit board 26 for the positioning post 322 to be correspondingly disposed. '俾达 inhibits the smooth sliding of flexible printed circuit boards. Similarly, the buffering device 56 is also applicable to the high frequency probe cards 36, 38, 42, 44 and 48 shown in Figures 6 to 10, and the cooperation of the positioning post 322 and the positioning hole 26f is selected for application. 11 is a high-frequency probe card t according to an eleventh preferred embodiment of the present invention, which is also a high-frequency probe card according to a third preferred embodiment, and has a different structure. The metal (four) 32 of the Gaoxian needle card 58 has a plurality of grooves 322 which are recessed from the branch floor milk and correspond to the respective gold 2塾28 and sigh 'the groove 322 provides the flexible printed circuit board 26 appropriately In the deformation chamber, the conductive spring pin 1〇1 in response to the detector 1 touches the micro-deformation of the metal pad to ensure that the conductive spring pin (1) maintains good contact and electrical conduction with the metal crucible. Similarly, the aforementioned recess 322 is configured to be applied to the high frequency probe cards 36, 38'42, 44 and 48 shown in Figs. Figure 14 is a view showing a high frequency probe card according to a twelfth preferred embodiment of the present invention, which is a female groove of a high frequency probe card of the tenth preferred embodiment of the twelfth embodiment. In the 322 structure, each of them is filled with a cushion 62 for improving the effect of the pressing force of the conductive spring pin ι〇ι of the measuring machine. Similarly, the technical features of the four slots 322 and the cushion 62 are also applied to the horse frequency probe cards 36, 38, 42, 44 and 48 shown in the sixth to 201109676. The fifteenth embodiment shows a high-frequency probe card 64 according to the thirteenth preferred embodiment of the present invention, which is based on the high-frequency probe card 24 of the third preferred embodiment. The difference is that the embodiment The WE 66 of the high-scale needle card 64 has at least one space, and the upper surface 26a of the flexible printed circuit board 26 is electrically connected to one or more electronic components 68 or modular electronic components 7 that can perform different functions or At the same time, it is provided that the aforementioned through-hole 661 and the recessed portion 662' are disposed in the through-hole 661 and the recessed portion 662', and the purpose is to avoid smashing the electronic component. Alternatively, the aforementioned augmentation _ is also applied to the rigid body 464 of the rigid body of the first, eighth, and eighth figures, and the rigid body 464 of the ninth and tenth figures. The following is a description of the intensive mounting method of the soft printed circuit board of the invention of the 3-band probe card, wherein: the high-pitched card 72 shown in the sixteenth embodiment is the base of the high-side needle card 24 of the third embodiment. The high-heeled liver 72 includes a pressure plate 74' which is adjacent to the contact area of the flexible printed circuit board 26, and the hinge plate 74 has a plurality of through holes 741 for the metal files 28 to accommodate therein. In order to contact the conductive. The flexible printed circuit board 76 shown in FIGS. 17 and 18 is a composite structure including a plurality of sector-shaped conductive sheets 761 and a rigid substrate 762 covered by the sector-shaped conductive sheets 761. The substrate 762 is annular and mainly Distributed in the contact area 76a of the flexible printed circuit 13 201109676, the substrate 762 has a plurality of partial exposed areas 762a, and each bare area 762a has no screw holes 762b for the screw 77 to be inserted and locked into the metal frame year 78. Secured. The flexible printed circuit board 80 shown in FIG. 19 has a structure similar to that of the above-described sector-shaped conductive sheet 801 and the rigid substrate 802. Further, a plurality of stabilizing piles 803 are further included, and the stabilizing piles 803 are inserted through the rigid substrate 8〇2. The metal frame 81 is fixed to the flexible printed circuit board 80, or the stable pile 8〇3 is directly disposed on the rigid substrate 8〇2, and the end of the stable post 803 is inserted into the metal frame 81 to fix the flexible printed circuit board 80, thereby preventing softness. The printed circuit board 8 is pulled sideways. The flexible printed circuit board 82 shown in FIG. 20 is also a composite structure, and is embedded with at least one magnetic component, and the magnetic member 82 is used for adsorbing to the metal frame 84 without disturbing the wires (not shown). The purpose of clamping the flexible printed circuit board 82 is to replace the general machine. The above is only a good example of the implementation of this book. The equivalent structure and manufacturing method change of the application of the present invention should be included in the special fiber package of the present invention. 201109676 [Simple description of the diagram] The figure is a cross-sectional view of a probe card used in combination with a flexible printed circuit board and a pCB circuit board. The second figure is a cross-sectional view of a high face needle card of the present invention. The second figure is a schematic diagram of the soft_circuit board of the above-mentioned first-difficult embodiment. Figure 4 is a cross-sectional view showing a second preferred embodiment of the high face needle card of the present invention. Figure 5 is a cross-sectional view showing a third preferred embodiment of the high needle card of the present invention. The figure is a cross-sectional view of a fourth preferred embodiment of the south frequency probe card of the present invention. The seventh figure is a cross-sectional view of the fifth preferred embodiment of the probe card of the fourth invention of the present invention. Figure VII is a cross-sectional view showing a seventh preferred embodiment of the probe card of the present invention. The tenth embodiment is a cross-sectional view of the eighth preferred embodiment of the probe card of the present invention. A cross-sectional view of a ninth preferred embodiment of the high-frequency probe card of the present invention. Fig. 12 is a cross-sectional view showing a tenth preferred embodiment of the high-frequency probe card of the present invention. A cross-sectional view of a twelfth preferred embodiment of the present invention is a cross-sectional view of a twelfth preferred embodiment of the present invention. Figure 16 is a cross-sectional view of a soft-baked printed circuit board pressed by a press plate. Figure 17 is a schematic view of another flexible printed circuit board. Figure 18 is a partially enlarged cross-sectional view showing a flexible printed circuit The plate is fixed by bolts passing through the substrate. The nineteenth figure is - partial enlargement The cross-sectional view shows that the flexible printed circuit board is fixed by the stable pile 15 201109676. The twenty-first part is a partially enlarged cross-sectional view showing that the flexible printed circuit board has magnetic components built therein and is magnetically fixed. 201109676 [Main components Symbol Description] 10, 20 high frequency probe card 12 flexible printed circuit board
12a上表面 12b下表面 12d接觸區 121扇形導電片 123穿孔 14金屬墊 16探針 18金屬框架 18a支樓面 181本體 183貫孔 184螺孔 22空間轉換器 22a底面 24、36、38、42、44、 48高頻探針卡 26軟性印刷電路板 26a上表面 26b下表面 26d延伸區 26e接觸區 28金屬墊 30探針 32金屬框架 32a底面 32b支撐面 321a環錐面 321b 開口 34支撐塊 34a壓貼面 40支撐裝置 401剛性體 401a壓貼面 12c探針區 122導線 161針尖 182環框 19螺栓 26c探針區 26f定位孔 301針尖 321鏤空部 322定位柱 402軟墊 17 201109676 41螺栓 46支撐裝置 461結合座 462環框 463彈性調整器 464剛性體 465軟墊 466螺絲 467螺絲 50、54、58、60、64高頻探針卡 52緩衝裝置 522背板12a upper surface 12b lower surface 12d contact area 121 sector-shaped conductive sheet 123 perforation 14 metal pad 16 probe 18 metal frame 18a support floor 181 body 183 through hole 184 screw hole 22 space converter 22a bottom surface 24, 36, 38, 42, 44, 48 high frequency probe card 26 flexible printed circuit board 26a upper surface 26b lower surface 26d extension 26e contact area 28 metal pad 30 probe 32 metal frame 32a bottom surface 32b support surface 321a annular cone surface 321b opening 34 support block 34a pressure Veneer 40 support device 401 rigid body 401a pressure surface 12c probe area 122 wire 161 needle tip 182 ring frame 19 bolt 26c probe area 26f positioning hole 301 needle tip 321 hollow portion 322 positioning column 402 cushion 17 201109676 41 bolt 46 support device 461 joint seat 462 ring frame 463 elastic adjuster 464 rigid body 465 cushion 466 screw 467 screw 50, 54, 58, 60, 64 high frequency probe card 52 buffer device 522 back plate
662凹部 70模組化電子元件 741透孔 761扇形導電片 762基板 762b螺孔 78金屬框架 802基板 803穩樁662 recess 70 modular electronic components 741 through hole 761 sector conductive sheet 762 substrate 762b screw hole 78 metal frame 802 substrate 803 stable pile
521缓衝墊 56緩衝裝置 62緩衝墊 66支撐塊 661透孔 68電子元件 72高頻探針卡 74壓合板 76軟性印刷電路板 76a接觸區 762a裸露區 77螺栓 80軟性印刷電路板 801扇形導電片 81金屬框架 18 201109676 101導電彈簧針 201受測部位 82軟性印刷電路板 83磁性件 84金屬框架 100檢測機 200待測電子物件521 cushion 56 buffer device 62 cushion 66 support block 661 through hole 68 electronic component 72 high frequency probe card 74 plywood 76 flexible printed circuit board 76a contact area 762a bare area 77 bolt 80 flexible printed circuit board 801 sector conductive sheet 81 metal frame 18 201109676 101 conductive spring pin 201 tested part 82 flexible printed circuit board 83 magnetic piece 84 metal frame 100 inspection machine 200 electronic object to be tested