201104734 六、發明說明： C 明戶斤軒々貝3 發明領域 本發明係有關於一種適合於切削QFN基板而分割成晶 片尺寸封裝體(CSP)之切削裴置。 L· jtu~ Zl 發明背景 近年來，彳亍動電§舌或個人電腦等電子儀器被要求更輕 量化、小型化，作成適合於該小型化之元件，開發出一種 將半導體晶片進行封裝而形成元件之稱作晶片尺寸封裝體 (CSP)的技術並供實用。 CSP係藉由將例如QFN(四面扁平無引腳封裝體，Quad Flat Non-Lead Package)基板分割成個別的元件而形成。 QFN基板係由以下構件所構成，即：複數半導體晶片，係 以預疋間隔配置者；電極框，係形成為格子狀以劃分各半 導體晶片者；電極端子，係從電極框朝内侧配置成如魚骨 般，且與形成於各半導體晶片之表面的接合墊連接者；及 樹脂層，係模製成包入各半導體晶片與電極框者。 在將QFN基板分割成個別的csp時，會藉由包含有可旋 轉之切削刀片的切削裝置將qFN基板之電極框切斷，並將 如魚骨般的電極端子分離成每個個別的元件而形成csp(例 如參照日本專利公開公報特開2004-259936號公報）。 先行技術文獻 [專利文獻] 201104734 [專利文獻1]特開2004-259936號公報 【發明内容】 發明概要 發明欲解決之課題 然而’若藉由切削刀片將QFN基板之電極框切斷而將 如魚骨般的電極端子分離成每個個別的元件，則鄰接之電 極彼此會因電極之延性而短路，且會有使元件之電特性明 顯地降低之問題。 本發明係有鑑於此種問題，其目的在提供一種切削裝 置，且该切削裝置係即使藉由切削刀片將電極框切斷而將 電極端子分離成每個元件，鄰接之電極彼此亦不會因延性 而短路’且可發揮切削能力。 用以欲解決課題之手段 若藉由本發明，則可提供一種切削袈置，其係包含有： 夾頭台，係保持被加工物者；及切削機構，係將圓形之切 削刀片支持於凸緣而裝設於^軸，且前述切削刀片係切削 業已保持於該炎頭台之被加工物者，χ，該切削機構係含 有由第1外罩鮮2外罩所構成之刀片外罩，且該幻外罩係 掩蔽該切削刀片之切刃的第1側面，而該第2外罩係掩蔽該 切刃的第2侧面，又，於該第1外罩及該第2外罩 火“ 刃之圓周形成複數切削水喷射孔，且該切削水:射;= 切削水喷射至從前述凸緣之外周突出的該 月1彳刀片之切刃 的根基部分。 η ” 較為理想的是切削刀片之切刀僅以被 工物之切削所 4 201104734 必須之量從刀片外罩之下端部突出，且較為理想的是切削 水係以2公升/分至5公升/分之比例從切削水嘴射孔喷射。 發明效果 依據本發明’由於供給至從凸緣之外周突出的切刃根 基部之切财係於業已附著於切狀㈣下藉由離心力而 達到切刀之前端，且進—步地跟著繞行，藉此，可充分地 供給至被加工物之切削點，因此可抑制因電極端子之延性 所造成的拉伸，且電極端子彼此不會短路而可形成電特性 良好之元件(CSP)。 圖式簡單說明 第1圖係QFN基板之平面圖。 第2圖係第1圖之II-II線截面圖。 第3圖係切削裝置之外觀立體圖。 第4圖係顯示將樹脂刀片（墊圈刀片）裴設於心軸之情形 之分解立體圖。 第5圖係樹脂刀片業已裝設於心軸之狀態之立體圖。 第6圖係刀片外罩之分解立體圖。 第7(A)圖係業已安裝於心軸外殼之刀片外罩之分解立 體圖，第7(B)圖係業已安裝於心轴外殼之刀片外罩之立體 圖。 第8圖係刀片外罩之縱截面圖。 第9圖係藉由切削刀片切削電極框之狀態之QFN基板 之截面圖。 第10圖係内建有半導體晶片之CSP(元件）之平面圖。 201104734 C實方包方式;j 用以實施發明之最佳形態 以下參照圖式詳細說明本發明之實施形態。參照第i 圖’顯示適合於藉由本發明之切削裝置來切削的QFN基板 之一例之平面圖。QFN基板2係具有例如矩形狀之金屬框 4，且於藉由金屬框4之外周剩餘領域5及非元件領域5a所圍 繞之領域’存在有於圖示例中為三個的元件領域6a、元件 領域6b、元件領域6c。 於各元件領域6a、元件領域牝、元件領域6(；中，形成 業已藉由縱橫地設置成相互呈正交之第丨電極框8a及第2電 極框8b所劃分的複數元件形成部丨〇，且與各半導體晶片 14(參照第2圖）之接合墊連接的電極端子12係從各電極框 8a、電極框8b如魚骨般朝電極框8a、電極框处之兩側伸長。 電極框8a、電極框8b及電極端子12係與金屬框14一體 地形成，且各電極端子12彼此係藉由於金屬框4鑄模之樹脂 層16來絕緣。如第2圖所示，於各元件形成部1〇之内面配置 有半導體晶片14，且半導體晶片14係藉由樹脂層16來鑄模 封裝。 參照第3圖，顯示適合於切削第1圖所示之qFN基板2的 切削裝置22之外觀立體圖。於切削裝置22之前面側設置有 操作者用以輸人加工條件等對裝置之指示_作機構24， 且於裝置上部設置有CRT等之顯示機構26，其侧示對操 作者之引導晝面或藉由後述攝影機構所拍攝的影像。 為切削對象之QFN基板2係黏貼於為黏著膠帶之切割 201104734 _ 膠帶τ ’且切割膠帶T之外周緣部係黏貼於環狀框架F，藉 此’ QFN基板2係構成透過切割膠帶T支持於框架F之狀態， 且於第3圖所示之卡匣28中收納複數片之QFN基板2。卡匣 28係載置於可上下運動之卡匣升降機29上。 於卡匣28之後方配置有搬出入機構30，且該搬出入機 構3 0係從卡匣2 8搬出切削前之Q F N基板2，同時將切削後之 QFN基板2搬入卡匣28。 於卡H28與搬出入機構30間設置有暫置領域32 ,且該 暫置領域32係暫時地載置搬出入對象之qfn基板2之領 域’又，於暫置領域32配置有將QFN基板2定位在一定位置 之定位機構34。 於暫置領域32附近配置有搬送機構36，且該搬送機構 . 36係具有吸附與QFN基板2構成一體之框架F而進行搬送之 旋繞臂，又，於暫置領域32搬出之QFN基板2係藉由搬送機 構36吸附而搬送至夾頭台38上，且吸引保持於夾頭台死， 同時藉由複數夾具39使框架F制動並固定。 夾頭台38係構成為可旋轉且可於χ軸方向往復運動， 又’於夹頭台38之X軸方向之移動路徑上方配置有對準機構 40，且忒對準機構4〇係檢測qFN基板2之應切削之電極框 8a、電極框8b。 對準機構40係包含有拍攝QFN基板2之表面的攝影機 構42，且可根據藉由拍攝所取得之影像，利用型樣匹配等 之處理檢測應切削之電極框8a、電極框沾。藉由攝影機構 42所取得之影像係顯示於顯示機構26。 201104734 於對準機構40之左側配置有切削機構(切削單元)44，其 係對業已保持於夾頭台38之QFN基板2施行切削加工。切削 單元44係與對準機構40—體地構成，且兩者連動而於γ轴方 向及Z轴方向移動。 切削單元44係構成為於可旋轉之心軸46前端裝設業已 藉由樹脂穩固鑽石磨料之切削刀片48，且構成可於γ轴方向 及z軸方向移動。切削刀片48係位於攝影機構42之乂軸方向 之延長線上。 45係將業已結束切削之qFn基板2搬送至洗淨裝置^ 讀送機構，且於洗淨裝置47中洗淨_基板2，同時從空 氣喷嘴噴出空氣而將QFN基板2乾燥。 > ’展第4圖顯不分解立體圖，丨該分解立體圖係顯示將 墊圈狀之切削刀片48裝設於心軸46之情形。切肖彳刀片料係 業已藉由樹脂結合來固定鑽石磨料之樹脂刀片，且全體係 由刀刀所構成。切削刀片48係具有⑽_之厚 度。 ^ 裝凸，、彖52係由輪轂部54及與輪轂部54一體形成之固 ^ y 6所構成，且於輪轂部54形成外螺紋58。安裝凸緣 %:安裝凸緣5 2之裝設孔插入心軸4 6之未圖示的前端小 Z及錐形部’且將螺帽⑼與業已形成於心轴46之前端小 仏螺紋螺合而擰緊，藉此，絲於心㈣之前端部。 H ；安裝凸緣52之輪轂部54插入切削刀片（樹脂刀 64Μ ，將裝卸凸緣62插入輪轂部54，且將固定螺帽 ^螺紋58螺合而擰緊，藉此，如第5圖所示，切削刀片 8 201104734 48係藉由固定凸緣56與裝卸凸緣62從兩側夾持而安裝於心 軸46。 參和、第6圖，顯不刀片外罩66之分解立體圖。刀片外罩 66係由如第7⑷圖所示般裝設於心轴外殼％之第ι外罩68 及第2外罩70所構成。 第1外罩68係具有包圍切削刀片48之圓弧狀内周面 72’且於内周面72形成於圓周方向分隔預定間隔之複數切 削水噴射孔74。各切削水噴射孔74係透過第8圖所示之切削 水路75與連接管76連接，且於連接管％連接業已與切削水 供給源連接之未圖示的軟管。於第^外罩68更形成-對突起 部78與螺紋孔8〇。 。與第2外罩68相同，第2外罩7()亦具有包圍切削刀片的 —圓弧狀内周面82，且於内周面_成於圓周方向分隔預 ^間隔之複數切削水喷射孔84。各切削水噴射孔_透過 第8圖所示之切削水路85與連接_連接，且於連接管_ 業已與切削水供給源連接之未圖示的軟管。第2外罩更 具有可插人締結用螺检之圓謂，·及可插 起物之未圖示的―對凹部。 卜罩68之大 罩7〇t^(A)圖所示’將第1外罩⑹之突起部％插入第2外 70之凹部，且透過第2外罩7〇之圓孔抑將螺栓卯與第】外 罩68之螺紋孔8〇螺合而擰緊，藉此’如第7(B)圖所示，第2 外罩7〇係安裝於第1外罩68而完成刀片外罩66。 、下根據第3圖，說明依此所構成的切削裝置2之作 用。業已收納於卡_中的QFN基板2係藉由搬出入機構3〇 201104734 夾持框架F ’且㈣人機卿係於γ軸方向移動，並於暫置 領域32解除其夾持，藉此，可载置於暫置領域^。又，定 位機構34係朝相互接近之方向移動，藉此，qfn基板2係定 位在一定位置。 其次，藉由搬送機構36吸附框針，且藉由使搬送機構 36旋繞，與框钟構成一體之卿練2會搬送至夹頭㈣ 而藉由爽頭台38吸引保持，同時框架F係藉由夾具39固定。 又’炎頭台38係於X軸方向移動，且QFN基板2毅位在對 準機構40之正下方。 於對準機構4G中，拍攝qfn基板2之應切削之電極框 8a’並使用—般所熟知的型樣匹配等之方法實施使切削 刀片48排列在應_之電極餘之對準。若結束縱向之電 純化所有之對準，則將夾頭台38旋轉90度，且亦同樣地 實施朝橫向伸長之電極框扑之對準。 若於業已進行欲切削之電極框8a與切削刀片48之定位 續態下，使夾頭台38歡轴方向移動，同時使切削刀片48 高速旋轉並使切削單元44下降，則如第9圖所示，業經定位 之電極框8a會被切削’且鄰接之半導體晶片14之電極端子 12會分開。 於該切削時，從如第8圖所示般形成於刀片外罩％之切 削水噴射額、㈣水魏⑽，難㈣％、凸緣似 外周部突出的切削刀片48之切刃根基部分喷射切削水並 執行QFN基板2之切削。 換言之，從切削水喷射孔74、切削水喷射孔科朝凸緣 10 201104734201104734 VI. INSTRUCTIONS: C Minghu Jinxuan Mubei 3 Field of the Invention The present invention relates to a cutting device suitable for cutting a QFN substrate and dividing into a wafer size package (CSP). L·jtu~ Zl BACKGROUND OF THE INVENTION In recent years, an electronic device such as a tongue-and-shoulder or a personal computer has been required to be lighter and smaller, and a component suitable for the miniaturization has been developed, and a semiconductor wafer has been developed to be packaged. The component is called a chip size package (CSP) and is practical. The CSP is formed by dividing a substrate such as a QFN (Quad Flat Non-Lead Package) into individual elements. The QFN substrate is composed of a plurality of semiconductor wafers arranged at a predetermined interval, and an electrode frame formed in a lattice shape to divide each semiconductor wafer; and the electrode terminals are arranged from the electrode frame toward the inside. The fish bone is connected to the bonding pad formed on the surface of each semiconductor wafer; and the resin layer is molded into each of the semiconductor wafer and the electrode frame. When the QFN substrate is divided into individual csps, the electrode frame of the qFN substrate is cut by a cutting device including a rotatable cutting insert, and the electrode terminals like fish bones are separated into individual components. Csp is formed (for example, refer to Japanese Laid-Open Patent Publication No. 2004-259936). [Patent Document] JP-A-2004-259936 [Patent Document 1] JP-A-2004-259936 SUMMARY OF INVENTION Technical Problem However, the problem of the invention is to solve the problem. When the bone electrode terminals are separated into individual elements, the adjacent electrodes are short-circuited by the ductility of the electrodes, and there is a problem that the electrical characteristics of the elements are remarkably lowered. The present invention has been made in view of such a problem, and an object thereof is to provide a cutting apparatus which separates an electrode terminal into each element even if the electrode frame is cut by a cutting blade, and the adjacent electrodes are not separated from each other. Ductile and short-circuited 'and can play the cutting ability. Means for Solving the Problems According to the present invention, a cutting device can be provided which includes: a chuck table for holding a workpiece; and a cutting mechanism for supporting a circular cutting blade The cutting edge is mounted on the shaft, and the cutting insert is held by the workpiece of the head, and the cutting mechanism includes a blade cover formed by the first outer cover and the outer cover. The cover covers the first side surface of the cutting edge of the cutting insert, and the second outer cover shields the second side surface of the cutting edge, and forms a plurality of cutting water on the circumference of the first outer cover and the second outer cover fire "blade" The hole is sprayed, and the cutting water is sprayed; = the cutting water is sprayed to the root portion of the cutting edge of the month 1 彳 blade protruding from the outer periphery of the aforementioned flange. η ” It is preferable that the cutting blade cutter is only used The cutting part of the object 4 201104734 must be protruded from the lower end of the blade cover, and it is desirable that the cutting water system is sprayed from the cutting nozzle perforation in a ratio of 2 liters/min to 5 liters/min. Advantageous Effects of Invention According to the present invention, the cutting system which is supplied to the base of the cutting edge which protrudes from the outer periphery of the flange is attached to the cut shape (four) and reaches the front end of the cutter by centrifugal force, and follows the bypass step by step. Thereby, the cutting point can be sufficiently supplied to the workpiece, so that stretching due to the ductility of the electrode terminal can be suppressed, and the electrode terminals can be formed without short-circuiting, and an element (CSP) having good electrical characteristics can be formed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view of a QFN substrate. Fig. 2 is a sectional view taken along line II-II of Fig. 1. Fig. 3 is a perspective view showing the appearance of the cutting device. Fig. 4 is an exploded perspective view showing a state in which a resin blade (washer blade) is placed on a mandrel. Fig. 5 is a perspective view showing the state in which the resin blade has been mounted on the mandrel. Figure 6 is an exploded perspective view of the blade cover. Fig. 7(A) is an exploded perspective view of the blade cover that has been mounted on the mandrel housing, and Fig. 7(B) is a perspective view of the blade cover that has been mounted to the mandrel housing. Figure 8 is a longitudinal sectional view of the blade cover. Fig. 9 is a cross-sectional view showing the QFN substrate in a state in which the electrode frame is cut by a cutting insert. Figure 10 is a plan view of a CSP (element) incorporating a semiconductor wafer. 201104734 C. The embodiment of the present invention will be described in detail with reference to the drawings. A plan view showing an example of a QFN substrate suitable for cutting by the cutting device of the present invention is shown with reference to Fig. The QFN substrate 2 has, for example, a rectangular metal frame 4, and in the field surrounded by the remaining area 5 of the metal frame 4 and the non-element field 5a, there are three element fields 6a in the illustrated example. Component field 6b, component field 6c. In the element field 6a, the element field, and the element field 6 (a plurality of element forming portions which are divided by the second electrode frame 8a and the second electrode frame 8b which are arranged perpendicularly to each other) The electrode terminals 12 connected to the bonding pads of the respective semiconductor wafers 14 (see FIG. 2) are elongated from the electrode frames 8a and the electrode frames 8b toward the electrode frame 8a and the electrode frame at the both sides of the electrode frame 8a. 8a, the electrode frame 8b, and the electrode terminal 12 are integrally formed with the metal frame 14, and the electrode terminals 12 are insulated from each other by the resin layer 16 molded by the metal frame 4. As shown in Fig. 2, in each element forming portion The semiconductor wafer 14 is disposed on the inner surface of the crucible, and the semiconductor wafer 14 is molded by the resin layer 16. Referring to Fig. 3, an external perspective view of the cutting device 22 suitable for cutting the qFN substrate 2 shown in Fig. 1 is shown. The front side of the cutting device 22 is provided with an instruction for the device to input a processing condition, etc., and a display mechanism 26 such as a CRT is provided on the upper portion of the device, the side of which is directed to the operator. Or by the camera described later The QFN substrate 2 to be cut is adhered to the cutting tape 201104734 _ tape τ ', and the peripheral edge portion of the dicing tape T is adhered to the annular frame F, whereby the QFN substrate 2 is permeable. The dicing tape T is supported by the frame F, and a plurality of QFN substrates 2 are housed in the cassette 28 shown in Fig. 3. The cassette 28 is placed on the cassette lifter 29 which is movable up and down. After the 28th, the loading and unloading mechanism 30 is disposed, and the loading and unloading mechanism 30 carries out the QFN substrate 2 before cutting from the cassette 28, and carries the QFN substrate 2 after cutting into the cassette 28. The card H28 and the loading and unloading The temporary field 32 is provided in the mechanism 30, and the temporary field 32 is temporarily placed in the field of the qfn substrate 2 for loading and unloading. Further, the positioning of the QFN substrate 2 at a certain position is disposed in the temporary field 32. The mechanism 34 is provided with a transport mechanism 36 in the vicinity of the temporary field 32, and the transport mechanism 36 has a wrap arm that sucks and transports the frame F integrated with the QFN substrate 2, and the QFN that is carried out in the temporary field 32 The substrate 2 is adsorbed by the transport mechanism 36 It is transported to the chuck table 38, and is attracted and held by the chuck table, and the frame F is braked and fixed by a plurality of clamps 39. The chuck table 38 is configured to be rotatable and reciprocable in the x-axis direction, and An alignment mechanism 40 is disposed above the movement path of the chuck table 38 in the X-axis direction, and the 忒 alignment mechanism 4 detects the electrode frame 8a and the electrode frame 8b to be cut of the qFN substrate 2. The alignment mechanism 40 includes There is a photographing mechanism 42 that photographs the surface of the QFN substrate 2, and the electrode frame 8a to be cut and the electrode frame are detected by a process such as pattern matching based on the image obtained by photographing. The image obtained by the photographing unit 42 is displayed on the display unit 26. 201104734 A cutting mechanism (cutting unit) 44 is disposed on the left side of the alignment mechanism 40, and the QFN substrate 2 that has been held by the chuck table 38 is subjected to cutting processing. The cutting unit 44 is integrally formed with the alignment mechanism 40, and moves in the γ-axis direction and the Z-axis direction in conjunction with each other. The cutting unit 44 is configured to mount a cutting insert 48 having a resin-stabilized diamond abrasive at the tip end of the rotatable mandrel 46, and is configured to be movable in the γ-axis direction and the z-axis direction. The cutting insert 48 is located on an extension of the yoke axis direction of the photographing mechanism 42. In the 45th system, the qFn substrate 2, which has been cut, is transported to the cleaning device, the reading mechanism, and the substrate 2 is washed in the cleaning device 47, and the air is ejected from the air nozzle to dry the QFN substrate 2. > Fig. 4 shows an exploded perspective view showing the case where the washer-shaped cutting insert 48 is attached to the mandrel 46. The cutting blade system has been fixed by resin bonding to fix the diamond abrasive resin blade, and the whole system is composed of a knife. The cutting insert 48 has a thickness of (10). The convex portion 52 is composed of a hub portion 54 and a solid portion y 6 integrally formed with the hub portion 54, and an external thread 58 is formed in the hub portion 54. Mounting flange %: The mounting hole of the mounting flange 5 2 is inserted into the front end small Z and the tapered portion 'not shown in the mandrel 46 and the nut (9) is formed at the front end of the mandrel 46. Tightly tighten, whereby the wire is at the end of the heart (4). H; The hub portion 54 of the mounting flange 52 is inserted into the cutting insert (resin knife 64A, the loading flange 62 is inserted into the hub portion 54, and the fixing nut screw 58 is screwed and screwed, whereby, as shown in Fig. 5 The cutting insert 8 201104734 48 is attached to the mandrel 46 by being clamped from both sides by the fixing flange 56 and the loading and unloading flange 62. Referring to Fig. 6, an exploded perspective view of the blade outer cover 66 is shown. The first outer cover 68 has an arcuate inner peripheral surface 72' that surrounds the cutting insert 48 and is formed by the first outer cover 68 and the second outer cover 70 which are mounted on the mandrel housing as shown in Fig. 7(4). The peripheral surface 72 is formed in a plurality of cutting water injection holes 74 spaced apart by a predetermined interval in the circumferential direction. Each of the cutting water injection holes 74 is connected to the connecting pipe 76 through the cutting water path 75 shown in Fig. 8, and is connected to the connecting pipe %. A hose (not shown) connected to the water supply source is formed in the outer cover 68. The pair of protrusions 78 and the screw holes 8 are formed. Like the second outer cover 68, the second outer cover 7 () also has a surrounding outer periphery of the cutting insert. - an arc-shaped inner peripheral surface 82, and is separated from the inner peripheral surface by a circumferential interval The number of cutting water injection holes 84. Each of the cutting water injection holes _ is connected to the connection _ through the cutting water passage 85 shown in Fig. 8, and is connected to the cutting water supply source (not shown). The cover also has a thread for inserting a screw for threading, and a pair of recesses that are not shown in the insert. The cover of the cover 68 is 7〇t^(A), and the first cover is shown. (6) The projections % are inserted into the recesses of the second outer 70, and are passed through the round holes of the second outer cover 7 to screw the bolts 卯 and the screw holes 8 of the outer cover 68, thereby being screwed, thereby being '7' (B) As shown in the figure, the second outer cover 7 is attached to the first outer cover 68 to complete the blade outer cover 66. The function of the cutting device 2 configured as described above will be described with reference to Fig. 3. The QFN already stored in the card_ The substrate 2 is held by the loading and unloading mechanism 3〇201104734, and (4) the human-machine is moved in the γ-axis direction, and the clamping is released in the temporary field 32, thereby being placed in the temporary field. Further, the positioning mechanism 34 moves in a direction in which they approach each other, whereby the qfn substrate 2 is positioned at a certain position. Second, the adsorption mechanism 36 adsorbs. The needle is rotated by the conveying mechanism 36, and the pair 2, which is integrated with the frame clock, is conveyed to the chuck (4) and sucked and held by the headboard 38, while the frame F is fixed by the clamp 39. The stage 38 is moved in the X-axis direction, and the QFN substrate 2 is positioned directly below the alignment mechanism 40. In the alignment mechanism 4G, the electrode frame 8a' to be cut of the qfn substrate 2 is photographed and used as commonly known. The method of pattern matching or the like is performed such that the cutting inserts 48 are aligned in the remaining positions of the electrodes. If the vertical electrical cleaning is completed, all the alignments are performed, the chuck table 38 is rotated by 90 degrees, and the lateral direction is also similarly implemented. The elongated electrode frame is aligned. If the positioning of the electrode frame 8a and the cutting insert 48 to be cut is performed, the chuck table 38 is moved in the direction of the shaft, and the cutting insert 48 is rotated at a high speed and the cutting unit 44 is lowered, as shown in Fig. 9. It is shown that the positioned electrode frame 8a is cut 'and the electrode terminals 12 of the adjacent semiconductor wafer 14 are separated. At the time of this cutting, the cutting water injection amount of the insert outer cover is shown in Fig. 8 from the cutting water spray amount, (4) water Wei (10), hard (four)%, and the flange-like outer peripheral portion of the cutting insert 48 is cut by the cutting edge portion. Water and perform cutting of the QFN substrate 2. In other words, from the cutting water injection hole 74, the cutting water injection hole to the flange 10 201104734
56、凸緣62與切削刀片48之切刃的邊界部噴射切削水並執 ㈣肖'卜⑬為理想的是切削時切削水係以2公升/分至5公升 /分之比例從切財嘴射孔74、切麻嘴射孔％喷射。A 供給至全體由切刀所構成的切削刀片料之從凸緣％、 凸緣62之外周部突出的㈣根基部分之切削水係於業已附 著於切刃48之狀態下藉由離心力而達到㈣48之前端，且 進一步地跟著繞行，藉此，可充分地供給至qFN基板2之切 削點，因此可抑制因電極端子12之延性所造成的拉伸，刀 可防止電極端子12彼此短路。 藉由以每個記憶於記憶體之電極框8a之間距，將切削 單元44於Y軸方向分度進給並進行切削，而可切削所有同方 向之電極框8a。再者，若使夾頭台38旋轉90度後進行與吁 述相同之切削’則亦可切削所有電極框8b，並分割成第 圖所示之CSP(晶片尺寸封裝體）15。 孔 數 又’形成於第1外罩68及第2外罩70之切削水嘴射 74、切削水嘴射孔84未必要形成於内周面72、内周面& 全周’亦可作成於内周面72、内周面82之一部分形成複 【圖式簡單說明】 第1圖係QFN基板之平面圖。 第2圖係第1圖之II-II線截面圖。 第3圖係切削裝置之外觀立體圖。 第4圖係顯示將樹脂刀片（墊圈刀片）裝設於心軸之情步 之分解立體圖。 > 11 201104734 第5圖係樹脂刀片業已裝設於心軸之狀態之立體圖。 第6圖係刀片外罩之分解立體圖。 第7(A)圖係業已安裝於心軸外殼之刀片外罩之分解立 體圖，第7(B)圖係業已安裝於心軸外殼之刀片外罩之立體 圖。 第8圖係刀片外罩之縱截面圖。 第9圖係藉由切削刀片切削電極框之狀態之QFN基板 之截面圖。 第10圖係内建有半導體晶片之CSP(元件）之平面圖。 【主要元件符號說明】 2...QFN 基板 26…顯示機構 4...金屬框 28...卡匣 5...外周剩餘領域 29...卡匣升降機 5a...非元件領域 30...搬出入機構 6a，6b，6c...元件領域 32...暫置領域 8a...第1電極框 34...定位機構 8b…第2電極框 36，45...搬送機構 10...元件形成部 38...夾頭台 12...電極端子 39…夾具 14…半導體晶片 40...對準機構 15...CSP(晶片尺寸封裝體） 42...攝影機構 16...樹脂層 44…切削機構(切削單元) 22...切削裝置 46…心軸 24...操作機構 47…洗淨裝置 12 201104734 48··.切削刀片（樹脂刀片） 50.. .心軸外殼 52.. .安裝凸緣 54.··輪轂部 56.. .固定凸緣 58.. .外螺紋 60.. .螺帽 62.. .裝卸凸緣 64.. .固定螺帽 66.. .刀片外罩 68.. .第1外罩 70.. .第2外罩 72，82...内周面 74，84...切削水噴射孔 75，85...切削水路 76，86...連接管 78.. .突起部 80.. .螺紋孔 88.. .圓孔 90.. .螺栓 F...環狀框架 T...切割膠帶 1356. The boundary between the flange 62 and the cutting edge of the cutting insert 48 is sprayed with cutting water and is carried out. (4) Shaw's 13 is ideal for cutting the water system at a ratio of 2 liters/min to 5 liters/min. Perforation 74, cutting perforation perforation % injection. A. The cutting water supplied to the entire cutting edge portion of the cutting insert formed by the cutter from the flange portion % and the outer peripheral portion of the flange 62 is attached to the cutting edge 48 by centrifugal force (four) 48 The front end is further bypassed, whereby the cutting point of the qFN substrate 2 can be sufficiently supplied, so that stretching due to the ductility of the electrode terminal 12 can be suppressed, and the blade can prevent the electrode terminals 12 from being short-circuited with each other. The cutting unit 44 is indexed and fed in the Y-axis direction by the distance between the electrode frames 8a stored in the memory, so that all the electrode frames 8a in the same direction can be cut. Further, when the chuck table 38 is rotated by 90 degrees and the same cutting as that described is performed, all the electrode frames 8b can be cut and divided into CSP (wafer size package) 15 shown in the figure. The number of holes is further 'the cutting nozzle projection 74 formed in the first outer cover 68 and the second outer cover 70, and the cutting nozzle perforation 84 are not necessarily formed on the inner circumferential surface 72, and the inner circumferential surface & A part of the circumferential surface 72 and the inner circumferential surface 82 is formed. [Simplified description of the drawing] Fig. 1 is a plan view of the QFN substrate. Fig. 2 is a sectional view taken along line II-II of Fig. 1. Fig. 3 is a perspective view showing the appearance of the cutting device. Fig. 4 is an exploded perspective view showing the state in which a resin blade (washer blade) is attached to a mandrel. > 11 201104734 Fig. 5 is a perspective view of the state in which the resin blade has been mounted on the mandrel. Figure 6 is an exploded perspective view of the blade cover. Fig. 7(A) is an exploded perspective view of the blade cover that has been mounted on the mandrel housing, and Fig. 7(B) is a perspective view of the blade cover that has been mounted to the mandrel housing. Figure 8 is a longitudinal sectional view of the blade cover. Fig. 9 is a cross-sectional view showing the QFN substrate in a state in which the electrode frame is cut by a cutting insert. Figure 10 is a plan view of a CSP (element) incorporating a semiconductor wafer. [Description of main component symbols] 2...QFN Substrate 26...Display mechanism 4...Metal frame 28...Cartoon 5...External remaining area 29...Cart lift 5a...Non-component field 30 ... carry-in mechanism 6a, 6b, 6c... component area 32... temporary area 8a... first electrode frame 34... positioning mechanism 8b... second electrode frame 36, 45... transport Mechanism 10: Element forming portion 38... Chuck table 12... Electrode terminal 39... Jig 14... Semiconductor wafer 40: Alignment mechanism 15... CSP (Chip size package) 42... Photographic mechanism 16...resin layer 44...cutting mechanism (cutting unit) 22...cutting device 46...mandrel 24...operating mechanism 47...cleaning device 12 201104734 48··. cutting insert (resin blade) 50 .. . mandrel housing 52.. mounting flange 54. · hub portion 56.. fixing flange 58.. external thread 60.. . nut 62.. loading flange 64.. fixed Nut 66.. . Blade cover 68.. . 1st outer cover 70.. 2nd outer cover 72, 82... inner peripheral surface 74, 84... cutting water injection hole 75, 85... cutting water path 76 , 86... connecting pipe 78.. protrusion 80.. threaded hole 88.. round hole 90.. bolt F... ring frame T... Cutting tape 13