TW201037004A - Curable film - Google Patents

Abstract

The invention relates to a curable film prepared from a resin composition. The resin composition contains a resin (A), a surfactant (B) and a solvent (C) and substantially does not contain polymerizable monomer and a coloring agent. The content of the surfactant (B) is 0.005 percent by mass to 0.5 percent by mass with respect to the solid content.

Description

201037004 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a cured film. [Prior Art] In recent years, in liquid crystal display panels and the like, the substrate size has gradually increased in size. Usually, on the substrate surface 0 on which color pixels, semiconductor elements, and the like are formed, the surface of the substrate is flattened in order to embed the unevenness of the surface. The curable resin composition is formed by a spin coating method, a slit, a spin method, or the like. On the other hand, from the viewpoints of improvement in productivity and response to a large screen, it is possible to save the composition of the curable resin. The liquid amount of the solution and the method of forming a high-quality uniform cured film are discussed. A method of forming a high-quality uniform cured film, for example, a method of forming a cured film by using a resin composition which uses methoxy-1-butanol with respect to a specific resin, and a method of forming a cured film A resin composition of 3-methoxybutyl acetate as a solvent (for example, Patent Document i). [Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-1996-A. When it is called a non-rotation type coating method or the like, when the solvent is contested, the microbubbles contained in the resin composition may be caused to boil, and thus the bubbles may appear on the surface of the coating film, which may cause a defect in the depression. -5- 201037004 The situation of trapping. It is an object of the present invention to provide a cured film which is capable of suppressing the occurrence of defects such as solvent boiling and which has excellent flatness. That is, the present invention provides the following [1] to [9]. [1] A cured film obtained from a resin composition containing a resin (A), a surfactant (B), and a solvent (C), and substantially free of a polymerizable monomer And the coloring agent, the content of the surfactant (B) is 0.005 mass% to 0.5 mass% with respect to the solid content. [2] The cured film according to [1], wherein the surfactant (B) is an interface agent containing at least one atom selected from the group consisting of a ruthenium atom and a fluorine atom. [3] The cured film of [1] or [2] wherein the resin (A) is at least an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride (A1), and a ring having a carbon number of 2 to 4. A copolymer composed of an ether-bonded monomer (A2) polymerized. [4] The cured film according to [3], wherein the monomer (A2) having a cyclic ether bond of 2 to 4 carbon atoms is a monomer having an oxiranyl group. [5] A cured film according to [3] or [4], wherein the monomer (A2) having a cyclic ether bond of 2 to 4 carbon atoms is a monomer having an aliphatic polycyclic epoxy group. [6] The cured film according to any one of [3] to [5] wherein the monomer (A2) having a cyclic ether bond of 2 to 4 carbon atoms is selected from the group consisting of the compound represented by the formula (1) and At least one compound of the group consisting of compounds represented by the formula (Π); -6 - 201037004

[In the formulae (I) and (II), R! and R2 each independently represent a hydrogen atom or a hydroxyl group having 1 to 4 carbon atoms which may be substituted; and X1 and X2 each independently represent a single bond and a carbon number of 1; ~6 alkyl or -((:112)5- and '-((:112)1-' and 'represents -3-❾, -〇· or -NH-, s and t are independent of each other The hardening film of any one of [1] to [6], wherein the solvent (C) contains diethylene glycol butyl ether acetate [8] The cured film according to [7], wherein the solvent (C) is a solvent having a content of 1 to 40% by mass based on the total amount of the diethylene glycol butyl ether acetate relative to the solvent. [9] A display device comprising the cured film according to any one of [1] to [8]. [Embodiment] The cured film of the present invention is obtained from a resin composition containing a resin ( A), a surfactant (B) and a solvent (C), and substantially free of a polymerizable monomer and a coloring agent, and the content of the surfactant (B) is 0.005% by mass to 5% by mass based on the solid content. Here, the solid amount refers to the removal of the solvent in the resin composition. The resin composition used in the present invention contains the resin (A), the surfactant (B), and the solvent (C). The resin (A) used in the present invention is not particularly limited. According to 201037004, the reactivity can be expressed by at least one of light and heat. The resin (A) is, for example, the following copolymers [K1] to [K4], etc. [K1] unsaturated carboxylic acid and/or The unsaturated carboxylic acid anhydride (A1) (hereinafter referred to as "(A1)") is a monomer (A2) bonded to a cyclic ether having 2 to 4 carbon atoms (hereinafter referred to as "(A2)" When it is a copolymer which is polymerized and formed. [K2] A copolymer obtained by polymerizing (A1) and (A2) with a monomer (A3). Here, the monomer (A3) (hereinafter only described as "(A3)") is a monomer which can be copolymerized with (A1) and/or (A2) and is not a monomer of (A1) and/or (A2). [K3] in (A1) and (A3) a copolymer obtained by reacting a part of a carboxyl group derived from (A1) with a cyclic ether having a carbon number of 2 to 4 derived from (A2). [K4] (A1) and (A3) Copolymer. Among these, resin (A) Preferably, [K1] a copolymer composed of (A1) and (A2) is polymerized. The unsaturated carboxylic acid and/or the unsaturated carboxylic anhydride (A 1 ), for example, an aliphatic unsaturated carboxylic acid and/or Examples of the saturated carboxylic acid anhydride, etc., for example, unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid; maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, and the like. Unsaturated dicarboxylic acids; and anhydrides of such unsaturated dicarboxylic acids; succinic acid mono [2-(methyl) propylene methoxyethyl] ester, phthalic acid mono [2-(methyl) Unsaturated mono[(methyl)propenyloxyalkyl]ester of polyvalent carboxylic acid 201037004 of two or more valences such as acryloxyethyl]ester; 5·carboxybicyclo[2.2.1]g-2 -ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-5.ethylbicyclo [2.2.1] Hept-2-ene, 5-carboxy-6-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-ethylbicyclo[2.2.1]hept-2-ene a bicyclo[2.2.1]hept-2-ene containing a carboxyl group or a carboxylic anhydride such as 5,6-dicarboxybicyclo[2.2.1]hept-2-ene anhydride (norbornene dianhydride) 0 A-(hydroxymethyl) acrylate or the like is an unsaturated acrylate having a hydroxyl group and a carboxyl group in the same molecule. Among them, acrylic acid, methacrylic acid or maleic anhydride is preferable from the viewpoint of copolymerization reactivity and alkali solubility. These may be used alone or in combination of two or more. In the present specification, the compound, the component, the agent, and the like which are exemplified may be used singly or in combination of two or more. In the present specification, "(meth)acrylic acid" means that at least one selected from the group consisting of acrylic acid and methacrylic acid is selected. The descriptions of "(meth)acryloyl) and "(meth)acrylate" have the same meanings. a monomer having a cyclic ether bond of 2 to 4 carbon atoms (Α2), for example, as long as it has a group selected from a cyclic ether having a carbon number of 2 to 4 (for example, an oxiranyl group, a butyl epoxide) At least one of the group consisting of an alkyl group and a tetrahydrofuranyl group may be used, and further, a monomer having an unsaturated bond is preferred. (Α2), for example, a monomer having an oxirane group, a monomer having a butylene oxide group, a monomer having a tetrahydrofuran group, or the like. -9 - 201037004 The monomer having an oxirane group, for example, a polymerizable compound having at least one group selected from the group consisting of an aliphatic epoxy group and an alicyclic epoxy group. The monomer having an oxirane group is preferably a compound having at least one group selected from the group consisting of an aliphatic epoxy group and an alicyclic epoxy group, and having an unsaturated bond. The aliphatic epoxy group means a group having a structure in which a chain olefin is epoxidized. A compound having an aliphatic epoxy group, specifically, for example, glycidyl (meth)acrylate, yS-methylglycidyl methacrylate, (meth)acrylic acid/3-ethylglycidyl ester And a compound represented by the following formula (III) described in Japanese Laid-Open Patent Publication No. Hei 7-248625.

(In the formula (III), 'R11 to R13' each independently represent a hydrogen atom or a group having a carbon number of 1 to 10, m is an integer of 1 to 5). Here, the alkyl group is, for example, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a secondary butyl group, a tertiary butyl group, a 1-methyl-n-propyl group, a 2-methyl-positive group. Propyl, tertiary butyl 'n-pentyl' 1-methyl-n-butyl, 2-methyl-n-butyl-10-201037004, 3-methyl-n-butyl, 1,dimethyl- N-propyl, hydrazine, 2-dimethyl-n-propyl, 2,2-dimethyl-n-propyl, n-hexyl, cyclohexyl and the like. In any of the chemical structural formulas, 'there is a difference in carbon number', but when it is not particularly limited, an example of a substituent or the like can be applied to the entire specification. In addition, either a straight chain or a branch may be employed, and any one of them may be included. The compound represented by the above formula (III) is, for example, o-vinylbenzyl-3-glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, α-methyl-o-ethylene Benzyl methyl glycidyl ether, α-methyl-m-vinylbenzyl glycidyl ether, α-methyl-p-vinylbenzyl glycidyl ether, 2,3-diglycidoxymethylbenzene Ethylene, 2,4-diglycidoxymethylstyrene, 2,5-diglycidoxymethylstyrene, 2,6-diglycidoxymethylstyrene, 2,3,4- Triglycidoxymethylstyrene, 2,3,5-triglycidoxymethylstyrene, 2,3,6-triglycidoxymethylstyrene, 3,4,5-tri-shrink Glyceroxymethyl hydrazine styrene, 2,4,6-triglycidoxymethyl styrene. The alicyclic epoxy group means a group having a structure in which a cyclic olefin is epoxidized. The compound having an alicyclic epoxy group may, for example, be a monomer having an aliphatic monocyclic epoxy group, a monomer having an aliphatic polycyclic epoxy group or the like. The monomer having an aliphatic monocyclic epoxy group is a polymerizable compound having a structure having a structure in which a monocyclic cyclic olefin is epoxidized. Further, the monomer having an aliphatic polycyclic epoxy group means a polymerizable compound having a structure having a structure in which a polycyclic cyclic olefin is epoxidized. These -11 - 201037004 monomers having an epoxy group, preferably having at least one ring selected from the group consisting of aliphatic monocyclic epoxy groups and aliphatic polycyclic epoxy groups a compound having an epoxy group and having an unsaturated bond, and particularly preferably having at least one selected from the group consisting of an aliphatic monocyclic epoxy group and an aliphatic polycyclic epoxy group, and having (a) a compound of a propylene oxime group. The monocyclic cyclic olefin may, for example, be cyclopentene, cyclohexene, cycloheptene or cyclooctene. Among them, a compound having 5 to 7 carbon atoms is preferred. a monomer having an aliphatic monocyclic epoxy group, specifically, for example, a vinylcyclohexene monooxide 1,2-epoxy-4-vinylcyclohexane (for example, Celloxide 2000; Daicel Chemical Industry) Company made), 3,4-epoxycyclohexyl methacrylate (for example, Cyclomer A400; manufactured by Daicel Chemical Industry Co., Ltd.), 3,4-epoxycyclohexyl methacrylate (for example, Cyclomer M100; Daicel Chemical Industrial company system). The polycyclic cyclic olefin, for example, dicyclopentene, tricyclodecene, norbornene 'isohalopene, bicyclooctene, bicyclononene, bicycloundecene, tricycloundecene, bicyclo Decadiene, tricyclododecene, and the like. Among them, a compound having 8 to 12 carbon atoms is preferred. a monomer having an aliphatic polycyclic epoxy group, specifically, for example, 3,4-epoxynorbornyl acrylate, 3,4-epoxynorbornyl methacrylate, selected from the formula (I) And at least one compound selected from the group consisting of the compound represented by the formula (II) and the compound represented by the formula (II).

-12- 201037004 In the formulae (I) and (II), R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms which may be substituted with a hydroxyl group. X1 and X2 each independently represent a single bond, an alkylene group having 1 to 6 carbon atoms or -(CH2)s-X'-(CH2)t- 'X' represents -S-, -〇- or -NH-, s and t each independently represent an integer of 0 to 6, but s + t = 6.

Ri and R2, specifically, for example, a hydrogen atom; an alkylhydroxymethyl group such as a methyl group, an ethyl group, a fluorenyl propyl group, an isopropyl group, a n-butyl group, a secondary butyl group or a tertiary butyl group; -hydroxyethyl, 2-hydroxyethyl, hydrazine-hydroxypropyl, 2-hydroxypropyl, 3-hydroxypropyl, 1-hydroxymethylethyl' 1-hydroxy-indole-methylethyl, hydrazine A hydroxy-substituted alkyl group such as hydroxybutyl, 2-hydroxybutyl, 3-hydroxybutyl, 4-hydroxybutyl or the like. Among them, a hydrogen atom 'methyl group, hydroxymethyl group, 1-hydroxyethyl group or 2-hydroxyethyl group is preferred. It is especially preferred to be a hydrogen atom or a methyl group. €) χ1 and X2' specifically include, for example, a single bond; an alkylene group such as a methylene group, an ethyl group, a propyl group, or the like; a sulfur alkyl group, an oxygen alkyl group, an imide alkyl group, etc. The alkyl group of a hetero atom. Specifically, for example, aerobic methylene, oxygen extended ethyl, oxygen extended propyl, thiomethylene, sulfur extended ethyl, sulfur extended propyl, imine methylene, imine extended ethyl, sublimb Prolonged propyl and so on. Among them, a single bond, a methylene group, an ethyl group, an oxymethylene group, and an oxygen ethyl group are preferred. Especially preferred is a single bond, oxygen extended ethyl. At least one compound selected from the group consisting of the compound represented by the formula U) and the compound represented by the formula (11): 201037004, preferably the following compound selected from the formula (Γ) and the formula (ΙΓ) At least one compound of the group consisting of the compounds represented.

In the formula (I') and the formula (ΙΓ), and R2' are synonymous with the above R1 and R2, respectively, the compound represented by the formula (I), for example, represented by the formula (1-1) to the formula (1-15). Compounds, etc. Preferably, it is a formula (1-1), a formula (1-3), a formula (1-5), a formula (1-7), a formula (1-9), a formula (1-11) to a formula (1-15). ), particularly preferred are formula (1-1), formula (1-7), formula (1-9), and formula (I-15). -14 - 201037004

Ο II 〇 It

〇 II

o II Ο ch3o I IIH2C = c — c — o H2C=CH — C-0 h2c=ch-co-ch2 h2c=ch-c—O-C2H4 h2c=ch-c—o-c2h4-o ch3 o I II H2c=c—c—o —ch2 ch3 o I II h2c=c—C—O—C2H4

ο II h2c=ch-co-c2h4-s ο II h2c=ch-co-c2h4-n Η ch3〇I II h2c=c—c—o—c2h4-s ch3o I II H2C—C—C—O—C2H4 One NH C2H50

H2c=c—c—o ch2oh o I II h2c=c-C-0

(1-10) CH3o I II Η2〇==0—C—O—C2H4—Ο C2H4OH o h2c=c-c—o (1-13)

(1-15) The compound represented by the formula (n) is, for example, a compound represented by the formula (II-1) to the formula (II-15). Preferably, it is a formula (11-1), a formula (11-3), a formula (11-5), a formula (11-7), a formula (II-9)', and a formula (11-11) to a formula (11-15). ), particularly preferred are formula (II-1), formula (II-7), formula (II-9), and formula (11-15). -15- 201037004 Η2〇= ch3 ch3 II H2C:CH—C—Ο II H2C:CH—C—O—CH2 h2c:ch_c—o—c2h4 Η2〇:ΟΗ—C—O—C2H4 — o CH3o I II h2c =c一c-o -CO-CH II Η2〇=ό—C—〇—C2H4 h2c=c—C—O—C2H4-〇

II h2c:ch—c*^o—C2H4—s ch2oh Η2〇=0~ C'〇c2H4OH h2c=cC—o (II-2) H2C=CH-C-O"02H4*N ch3o I II h2c=c —c—o—c2h4—s CH30 I II H H2C=C—c—O—C2H4 — N η2ο=Π-ο

At least one compound selected from the group consisting of the compound represented by the formula (I) and the compound represented by the formula (II) can be used alone. In addition, it can be mixed in any ratio. When mixing, the mixing ratio is preferably in the formula (I): the formula (II) is 5: 95 to 95: 5, and more preferably 10: 90 to 90: 10, more preferably 20: 80. ~80: 20. The monomer having a glycidyl group as described above is, for example, a polymerizable compound having a butylene oxide group. The monomer having a butylene oxide group is preferably a compound having a butylene oxide group and having an unsaturated bond, and particularly preferably a compound having a glycidyl group and having a (meth)acryloxy group. A monomer having a butylene oxide group, specifically, for example, 3-methyl--16-201037004 3-methacryloxymethylbutylene oxide, 3-methyl-3-acryloxymethyl Butylene oxide, 3-ethyl-3-methylpropenyloxymethylbutene oxide, 3·ethyl-3-actyloxymethylepoxybutane, 3-methyl-3-methyl Propenyloxyethylbutylene oxide, 3-methyl-3-propoxyethylepoxybutane, 3-ethyl-3-methacryloxyethylbutylene oxide or 3-B Alkyl-3-propenyloxybutylene oxide and the like. The monomer having a tetrahydrofuran group is, for example, a polymerizable compound having a tetrahydrofuran0 group. The monomer having a tetrahydrofuranyl group is preferably a compound having a tetrahydrofuranyl group and having an unsaturated bond, and particularly preferably a compound having a tetrahydrofuranyl group and having a (meth)acryloxy group. Specific examples of the monomer having a tetrahydrofuranyl group include tetrahydrofuran acrylate (e.g., Viscoat V#150, manufactured by Osaka Organic Chemical Co., Ltd.), tetrahydrofuran methacrylate, and the like. The monomer (A3) which can be copolymerized, for example: methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth) acrylate, or butyl (meth)acrylate , (meth)acrylic acid alkyl esters such as (meth)acrylic acid tert-butyl ester; cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, tricyclo(methyl)acrylate [5.2.1.02'6] decane-8-ester (in the technical field, the customary name is dicyclopentyl (meth)acrylate), dicyclopentyloxyethyl (meth)acrylate, (methyl) (meth)acrylic acid cyclic alkyl esters such as isodecyl acrylate; (meth)acrylic acid aryl esters such as phenyl (meth) acrylate or benzyl (meth) acrylate: -17- 201037004 Acrylic aryl vinegar such as phenyl acrylate or benzyl acrylate; dicarboxylic acid diester such as diethyl maleate, diethyl fumarate or diethyl itaconate; (meth)acrylic acid Hydroxyalkyl esters such as 2-hydroxyethyl ester, 2-hydroxypropyl acrylate (meth)acrylate; bicyclo[2.2.1]heptene, 5-methylbicyclo[2.21]hept-2-ene, 5- Bicyclo[2.2.1]hept-2-ene, 5-hydroxybicyclo[2·2.^heptane- olefin,5-hydroxymethylbicyclo[2.2.1]hept-2-ene, 5-(2, -hydroxyethyl)bicyclo[2.2 ^heptene·ene, 5-methoxybicyclo[2.2.1]hept-2-ene, 5-ethoxybicyclo[22.^heptene-ene, 5,6- Monobicyclo[2.2.1]hept-2-pyre,5,6-di(methyl)bicyclo[2.2.1]hept-2-ene, 5,6-bis(2,-hydroxyethyl)bicyclo [2·2丨]heptene-2-ene, 5,6-dimethoxybicyclo[2.2.1]hept-2-ene, 5,6-diethoxybicyclo[2.2.1]g-2 Alkene, 5-hydroxy-5-methylbicyclo[221]hept-2-ene, 5-hydroxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxymethyl-5-methyl Bicyclo[2.2.1]hept-2-ene, 5-tris-butoxycarbonylbicyclo[2·2.^heptene-ene, 5-cyclohexyloxycarbonylbicyclo[2.2.1]hept-2-ene, 5-phenoxycarbonylbicyclo[2.2.1]hept-2-ene, 5,6-di(tertiarybutoxycarbonyl)bicyclo[221]hept-2-ene, 5,6-di(cyclohexyloxy) Carbonyl)bicyclo[2.2.1]hept-2-ene and other bicyclic unsaturated compounds; N-methyl maleimide, N-ethyl maleimide, N-propyl cis N-hospital cis-butyl bis-imine N-cyclopentylm-butyleneimine' N-cyclohexyl cis-butane quinone imine, N-cycloalkyl maleimide, etc. N-cycloalkyl maleimide -18 - 201037004 N-adamantyl maleimide, N-norbornyl succinimide, N-crosslinked carbocyclic group substituted by maleimide N-arylalkyl succinimide, such as N-aryl cis-butyl diimide, N-arylalkyl succinimide, etc. Fee, N-Amber succinimide-3-methyleneimine benzoate, N-succinyl Q sulphonimine-4 _ succinimide butyrate, N-amber醯imino-6-m-butyleneimine hexanoate, N-succinimide-3-oxenimide propionate, N-(9-acridinyl) cis Dicarbonyl quinone imine derivatives such as ene diimine; styrene, α-methyl styrene, m-methyl styrene, p-methyl styrene, vinyl toluene, p-methoxy styrene, propylene Nitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, vinyl acetate, 1,3-butadiene, isoprene, 2,3 - dimethyl-1,3-butadiene or the like. Among the oxime, from the viewpoints of copolymerization reactivity and alkali solubility, styrene, fluorene-phenyl-butyleneimine, fluorene-cyclohexylmethyleneimine, fluorene-benzoic acid are preferred. A cis-butenylene imine, a bicyclo [2.2.1] hept-2-ene, and the like. For example, the resin (Α) can be referred to in the literature "Experimental method for polymer synthesis (experimental method for polymer synthesis)" (Otsutsu Ryokan, Institute of Chemicals, the first edition of the 1st edition of the 1st brush, issued on March 1, 1972 The method described, and the cited documents described in the literature, are produced. Specifically, a specific amount of the monomers (Α1) and (Α2) constituting the copolymer, arbitrary (A3), a polymerization initiator, and a solvent are placed in a reaction vessel, and the oxygen is replaced by nitrogen by -19-201037004. The polymer is obtained by stirring, heating, and holding in the absence of oxygen. The polymerization conditions such as the input method, the reaction temperature, and the time can be appropriately adjusted in consideration of the production equipment, the calorific value generated by the polymerization, and the like. The polymerization initiators and solvents used herein can be generally used by users in the field. For example, a polymerization initiator, a solvent (C) or the like described later can be used. The polymer obtained can be used as it is by directly using the solution after the reaction, or by using a concentrated or diluted solution, or by using a method such as reprecipitation to obtain a solid. In particular, when the polymerization is carried out, the solvent after the reaction can be used as it is by using the solvent (C) described later as a solvent, so that the process can be simplified. The copolymer [K1], the ratio of each monomer is preferably the total number of moles with respect to the monomers constituting the copolymer [K1], and is in the following range in terms of molar fraction. (Al) 5 to 95 mol% ‘preferably 1 〇 to 9 〇 mol. /. . (A2) 5 to 95% by mole, preferably 1 to 9 inches. /〇. When the molar fraction is in this range, the storage stability, developability, solvent resistance, heat resistance, and mechanical strength tend to be good. Further, the copolymer [K2], the ratio of each monomer is preferably a total number of moles with respect to the monomers constituting the copolymer [K2], and is in the following range in terms of molar fraction. (Al) 2 to 40% by mole, preferably 5 to 35 % by mole. (A2) 2 to 9 5 mol%, preferably 5 to 8 mol%. (A 3 ) 1 to 6 5 mol %, preferably i 〜 6 〇 mol %. -20- 201037004 When the molar fraction is within this range, the stability, developability, solvent resistance, heat resistance, and mechanical strength tend to be good. The copolymer [K3] can be produced via a two-stage process. First, (A1) and (A3) were copolymerized by the same method as the above method to obtain a copolymer. In this case, the ratio of each monomer is preferably in the following range with respect to the total number of moles of the monomers constituting the resin. ❹ (Al) 5 to 50 mol%, preferably 10 to 45 mol%. (A3) 50 to 95% by mole, preferably 55 to 90% by mole. Next, a part of the carboxylic acid and/or carboxylic acid anhydride of (A1) and (A1) of the copolymer of (A3) is reacted with an epoxy group, a butylene oxide group or a tetrahydrofuranyl group derived from (A2). Therefore, the ambient gas in the flask is then replaced with oxygen from nitrogen, and (A2), the reaction catalyst, and the polymerization are prohibited from entering the flask, for example, at 60 to 130 ° C for 1 time. ~10 hours of reaction. The reaction conditions such as the input method, the reaction 〇 temperature and the time can be appropriately adjusted in consideration of the production equipment, the calorific value generated by the polymerization, and the like. The molar number of (A2) at this time is preferably from 5 to 80 mol%, preferably from 10 to 75 mol%, and particularly preferably from 15 to 70 mol%, relative to the molar number of (A1). . When the ratio of each monomer is in this range, the balance between storage stability, developability, solvent resistance, heat resistance, mechanical strength, and sensitivity tends to be good. The reaction catalyst is preferably used as a reaction catalyst for a carboxyl group and an epoxy group, or a ring of -21 - 201037004 oxybutane or tetrahydrofuranyl. Specifically, there are tris(dimethylaminoethyl)phenol and the like. The amount of the reaction catalyst is, for example, 0.001 to 5% by mass based on the total mass of (A 1 ) to (A3 ). The polymerization inhibiting agent is, for example, hydroquinone. The amount of the polymerization inhibitor is, for example, 0.001 to 5% by mass based on the total mass of (A1) to (A3). The copolymer [K4], the ratio of each monomer is preferably the total number of moles with respect to the monomers constituting the copolymer [K4], and is in the following range in terms of molar fraction. (Al) 2 to 40 mol % ' is preferably 5 to 35 mol%. (A2) 60 to 98 mol%' is preferably 65 to 95 mol%. When the molar fraction is in this range, the storage stability, developability, solvent resistance, heat resistance, and mechanical strength tend to be good. The polystyrene-equivalent weight average molecular weight of the resin (A) is preferably 3,000 to 100,000, particularly preferably 5,000 to 50,000. When the weight average molecular weight of the resin (A) is in this range, the coating property tends to be good, and the degree of dispersion (molecular weight distribution) of the oxime resin (A) [weight average molecular weight (Mw) / number average molecular weight (?η)] Preferably, it is 1.1 to 6.0, and particularly preferably 1.2 to 4.0. When the degree of dispersion is in this range, the coatability tends to be excellent. The content of the resin (Α) which can be used in the resin composition of the present invention is preferably from 5 to 99% by mass, particularly preferably from 10 to 70% by mass, based on the mass fraction of the resin composition. When the content of the resin (Α) is in the range of -22 to 201037004, solvent resistance, heat resistance, and mechanical strength tend to be good. The surfactant (B) used in the present invention is not particularly limited, and examples thereof include a surfactant selected from at least one of a group consisting of a sand atom and a fluorine atom. Specifically, for example, a polyoxyalkylene-based surfactant, a fluorine-based surfactant, a polyoxyalkylene-based surfactant having a fluorine atom, or the like is used. Among them, a polyoxyalkylene-based surfactant having a fluorine atom is preferred. By using such a surfactant (B), it is possible to suppress the generation of minute bubbles contained in the composition by blending with other components in the resin composition and their contents. As a result, the sudden boiling of the solvent evaporation can be effectively suppressed. The polyoxyalkylene-based surfactant is, for example, an interface having a siloxane coupling. Specifically, for example, Toray Silicone DC3PA, the same SH7PA, the same DC11PA, the same SH21PA, the same SH28PA, the same SH29PA, the same SH30PA, the polyether modified oyster sauce SH8400 (trade name: Toray Silicone; Dow Corning T or ay company ), KP321, 〇KP3 22, KP3 23, KP324, KP 326, KP3 40, KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF-4446, TSF4452, TSF4460 (Momentive Performance Materials Joint Venture System)

The fluorine-based surfactant is, for example, a surfactant having a fluorocarbon chain. Specifically, for example, Fluorinert (registered trademark) FC430, FC431 (Sumitomo 3M), Megafac (registered trademark) F142D', F171, F172, F173, F177, F183, R3 0, F4 89 (DIC -23-201037004 company system), EF-ΤΟΡ (registered trademark) EF301, EF303, EF351, EF352 (Mitsubishi Material Electronic Co., Ltd.), Surflon (registered trademark) S381, same S3 82, same as SC101, It is the same as SC105 (made by Asahi Glass Co., Ltd.), E5844 (made by Daikin Fine Chemical Research Institute), BM-1000, and BM-1 100 (all are trade names: BM Chemie Co., Ltd.). The polyoxyalkylene-based surfactant having a fluorine atom is, for example, a surfactant having a siloxane coupling and a fluorocarbon chain. Specifically, for example, there are Megafac (registered trademark) R08, the same BL20, the same F475, and the same F443 (manufactured by DIC Corporation). It is preferably Megafac (registered trademark) F475. The amount of the surfactant (B) relative to the resin composition of the present invention is 0.005 to 0.5% by mass, preferably 0.01 to 0.2% by mass, particularly preferably 0.01 to 0.1% by mass, more preferably 〇.〇1 ~〇.〇7% by mass. By including the surfactant (B) in this range, not only the flatness can be made good, and as described above, the bumping can be effectively prevented. The solvent (C) used in the present invention is, for example, various organic solvents used in the field of the resin composition. Specific examples are: ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether and ethylene glycol monoether ether like ethylene glycol monoalkyl ether; diethylene glycol dimethyl ether, two Diethylene glycol dialkyl ethers such as diol diethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether; methyl cellosolve acetate, B Glycol alkyl ether acetate such as cellulose acetate, ethylene glycol monobutyl ether acetate, ethylene glycol monoethyl ether acetate, etc.-24- 201037004 Propylene glycol monomethyl ether acetate, propylene glycol single An alkylene glycol alkyl ether acetate such as diethyl ether acetate, propylene glycol monopropyl ether acetate, methoxybutyl acetate or methoxypentyl acetate; propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol Propylene glycol monoalkyl ethers such as monopropyl ether and propylene glycol monobutyl ether; propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol ethyl methyl ether, propylene glycol dipropyl ether, propylene glycol propyl methyl ether 'propylene glycol ethyl propyl ether, etc. Diol dialkyl ethers; propylene glycol methyl ether propionate, propylene glycol diethyl ether propionate, propylene glycol propyl ether propionate, propylene glycol dibutyl ether Propylene glycol alkane ether propionate such as propionate; butanediol monoalkyl ether such as methoxybutyl alcohol, ethoxybutyl alcohol, propoxy butyl alcohol butbutoxybutyl alcohol; methoxybutyl acetate Butanediol monoalkyl ether acetates such as ester, ethoxybutyl acetate, propoxybutyl acetate, butylene oxide, etc.; methoxybutyl propionate, ethoxybutyl propionate, propoxypropionate a butanediol monoalkyl ether propionate such as an ester or a butane oxybutyl acrylate; a dipropylene glycol dialkyl ether such as dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether or dipropylene glycol methyl ether; benzene, toluene An aromatic hydrocarbon such as xylene or trimethylbenzene; a ketone such as butanone, acetone, methylpentanone, methyl isobutyl ketone or cyclohexanone; ethanol, propanol, butanol, hexanol or cyclohexane Alcohols such as alcohol, ethylene glycol, glycerin, etc.; methyl acetate, ethyl acetate, propyl acetate, butyl acetate, 2-hydroxy-25-201037004 ethyl propionate, 2-hydroxy-2-methylpropionic acid Methyl ester, 2-hydroxy-2-methylpropionic acid ethyl ester, methyl acetate acetal, cumyl ethyl acetate, butyl butyl acetate, methyl lactate, ethyl lactate, propyl lactate, milk Butyl ester, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate, methyl 2-hydroxy-3-methylbutanoate, methoxy Methyl acetate, ethyl methoxyacetate, propyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl acetoacetate, acetoacetic acid propylene vinegar, acetoacetic acid butyl vinegar, propoxy oxyacetate Vinegar, propylacetate, propyl propyl acetate, propyl acetoacetate, methyl butoxyacetate, ethyl butoxyacetate, propyl butyrate, butyl butoxyacetate, 2 - methoxypropionate Ester, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, butyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, 2_B Propyl propyl propionate, butyl 2-ethoxypropionate, methyl 2-butoxypropionate, ethyl 2-butoxypropionate, propyl 2-butoxypropionate, butyl 2-butoxypropionate , 3-methyl methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3-ethoxyto Ethyl propionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, methyl 3-propoxypropionate, ethyl 3-propoxypropionate, 3- Propyl propionate, butyl 3-propoxypropionate, methyl 3-butoxypropionate, ethyl 3-butoxypropionate, propyl 3-butoxypropionate, butyl 3-butoxypropionate Esters such as esters; cyclic ether groups such as tetrahydrofuran and piperazine; and cyclic ethers such as r-butyrolactone. The solvent (c) is preferably a solvent containing diethylene glycol butyl ether acetate. Further, from the viewpoint of 'coatability' of drying property and anti-bumping, it is preferable to further contain an alkylene glycol ether-6-201037004 acid ester in addition to diethylene glycol butyl ether acetate; Alcohols such as methoxybutanol and ethoxybutanol; ketones such as cyclohexanone; ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, methyl 3-methoxyacetate, 3- An ester of ethyl ethoxyacetate, butyl 3-methoxyacetate or butyl 3-ethoxyacetate. The content of the solvent (C) is preferably 60 to 90% by mass, particularly preferably 65 to 85% by mass, based on the mass of the resin composition. When the content of the solvent (C) is in this range, when coating 0 is performed by various coating apparatuses described later, it is expected that the coatability can be improved. In particular, the content of diethylene glycol butyl ether acetate is preferably from 1 to 40% by mass, more preferably from 5 to 25 % by mass, based on the mass fraction. The resin composition used in the present invention contains substantially no polymerizable monomer. In the resin composition used in the present invention, the content of the polymerizable monomer relative to the entire composition is, for example, less than 1% by mass, preferably less than 5% by mass, based on the mass fraction. The polymerizable monomer is, for example, a fluorene monofunctional monomer having an unsaturated bond, a difunctional monomer or a trifunctional or higher polyfunctional monomer. The monofunctional monomer 'for example is decyl phenyl carbitol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 2-ethylhexyl carbaryl (meth) acrylate Alcohol ester, 2-hydroxyethyl (meth)acrylate, lauric acid (meth)acrylate, stearyl (meth)acrylate, 2-(2-ethoxyethoxy)ethyl (meth)acrylate, ( Methyl)tetrahydrofuran acrylate, (meth)acrylic acid caprolactone '(meth)acrylic acid epoxidized phenolate ester, (meth)acrylic acid cresyl phenolate ester or fluorene-vinyl rotidone. The difunctional monomer 'for example is U3_butylene glycol di(meth)acrylate, 1,3-butylene glycol (-27-201037004 methyl)acrylate, 1,6-hexane di(meth)acrylate Alcohol ester, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, Tetraethylene glycol di(meth)acrylate, polyethylene glycol diacrylate, bis(acryloxyethyl)ether of bisphenol A, epoxidized bisphenol A di(meth)acrylate, Methyl)acrylic acid propane oxide neopentyl glycol ester, di(meth)acrylic acid ethoxylated neopentyl glycol ester or di(methyl)acrylic acid 3-methylpentane glycol ester. A trifunctional or higher polyfunctional monomer such as trimethylolpropane tris(meth)acrylate, neopentyl tris(meth)acrylate, or tris(2-hydroxyethyl)tris(meth)acrylate Cyanurate, trimethylolpropane tris(meth)acrylate, trimethylolpropane tri(methyl)acrylate, pentaerythritol tetra(meth)acrylate, five (a) Di-n-pentaerythritol acrylate, di-n-pentaerythritol hexa(meth)acrylate, tripentenol tetra(meth)acrylate, tripentenol pentoxide (f), six Tri-n-pentaerythritol (meth)acrylate, triphenol octa(meth)acrylate, tripentenol octa(meth)acrylate, pentaerythritol tri(meth)acrylate a reactant of an acid anhydride, a reaction product of dipentaerythritol penta(meth)acrylate and an acid anhydride, a reaction product of an ampicillin hepta(meth)acrylate and an acid anhydride, and a modified by caprolactone ( Trimethylolpropane methyl methacrylate, trihexyl (meth) acrylate modified by caprolactone Tris(2-hydroxyethyl)isocyanurate modified by caprolactone, tetrakis(meth)acrylic acid neopentyl ester modified by caprolactone Ester-modified pentaerythritol (meth)acrylate, dipentaerythritol hexa(meth)acrylate modified by caprolactone-28- 201037004, modified by caprolactone Tri-n-pentaerythritol methyl methacrylate, tri pentaerythritol 5-(meth)acrylate modified with caprolactone, tri-pivalaerythritol hexa(meth)acrylate modified by caprolactone , heptaproxil modified heptaerythritol (meth) acrylate, neopentyl glycol ester, caprolactone modified octyl (meth) acrylate tripivalol ester, modified by caprolactone three ( a reaction of a neodymethylene glycol acrylate with an acid anhydride, a reaction of caprolactone-modified pentaerythritol pentoxide (meth) acrylate with an acid anhydride, or a modification with caprolactone ( A reaction product of methyl) propylene octanoate and an acid anhydride. The resin composition used in the present invention does not substantially contain a coloring agent such as a pigment or a dye. In the resin composition used in the present invention, the content of the colorant relative to the entire composition is generally less than 1% by mass, preferably less than 0.5% by mass, based on the mass fraction. The resin composition used in the present invention may contain at least one compound selected from the group consisting of a carboxylic anhydride and a compound having at least two carboxyl groups. The compound having two carboxyl groups may, for example, be a polyvalent carboxylic acid anhydride or a polyvalent carboxylic acid. The carboxylic acid anhydride' can also be suitably used as a commercially available epoxy resin hardener formed from a colorless acid anhydride. Specifically, for example, Adeka Hardner EH-700 (trade name (the same applies hereinafter), manufactured by Asahi Kasei Kogyo Co., Ltd.), Rikacid-HH, MH-700 (manufactured by Nippon Chemical and Chemical Co., Ltd.), EPIKINI YH-126, and YH- 3 06·, with DX-126 (manufactured by Yuka Shell Epoxy Co., Ltd.). The polyvalent carboxylic anhydrides are, for example, itaconic anhydride, succinic anhydride, citraconic anhydride, dodecenyl succinic anhydride, 1,2,3-propyltricarboxylic anhydride, maleic anhydride, hexahydrophthalic anhydride- 29-201037004, aliphatic dicarboxylic anhydride such as methyltetrahydrophthalic anhydride, norbornene dicarboxylic acid, norbornene dianhydride, etc., 1,2,3,4-butane tetracarboxylic dianhydride An aliphatic polyvalent carboxylic acid dianhydride such as cyclopentane tetracarboxylic acid or the like: aromatic aromatics such as phthalic anhydride, benzene tetracarboxylic dianhydride, trimellitic anhydride, and diphenyl ketone tetracarboxylic anhydride An carboxylic acid anhydride; an acid anhydride-containing acid anhydride such as ethylene glycol dipyridinate or glyceryl trimellitate. Among them, phthalic anhydride and trimellitic anhydride are preferred from the viewpoint of high transparency in the visible light region. The polyvalent carboxylic acid may, for example, be an aliphatic polyvalent carboxylic acid such as succinic acid, glutaric acid, adipic acid, butane tetracarboxylic acid, maleic acid or itaconic acid; hexahydrophthalic acid, Alicyclic polyvalent carboxylic acid such as 1,2-cyclohexanecarboxylic acid, 1,2,4-cyclohexanetricarboxylic acid, cyclopentanetetracarboxylic acid or the like; phthalic acid, isophthalic acid, An aromatic polyvalent carboxylic acid such as phthalic acid, trimellitic acid, benzotetracarboxylic acid 1,4,5,8-naphthalenetetracarboxylic acid or diphenylketonetetracarboxylic acid. Among them, phthalic acid and trimellitic acid are preferred from the viewpoint of high transparency in the visible light region. In the resin composition used in the present invention, the content of at least one compound selected from the group consisting of a carboxylic anhydride and a compound having at least two carboxyl groups is a mass fraction with respect to the total amount of the resin (A). The amount is preferably from 0.1 to 20% by mass, particularly preferably from 1 to 15% by mass. When the compound is in the range of -30-201037004, the reliability of the coating film can be improved. The resin composition used in the present invention may further contain a cationic polymerization initiator. As the cationic polymerization initiator, those composed of a key cation and an anion derived from a Lewis acid can also be used. Specific examples of the key cation include diphenyl phosphonium salt, bis(p-tolyl) phosphonium salt, bis(p-terinobutylphenyl) phosphonium salt, bis(p-octylphenyl) phosphonium salt, and 0 double (pair). Octadecylphenyl)iodonium salt, bis(p-octyloxyphenyl)phosphonium salt, bis(p-octadeoxyphenyl)phosphonium salt, phenyl(p-octadecyphenyl)phosphonium salt, Tolyl) (p-isopropylphenyl) sulphate, triphenylsulfonium salt, tris(p-tolyl) shovel salt, tris(p-isopropylphenyl)phosphonium salt, tris(2,6-dimethyl Phenyl) phosphonium salt, tris(p-butylene phenyl) phosphonium salt, tris(p-cyanoethyl) phosphonium salt, tris(p-chlorophenyl) phosphonium salt, or dimethyl (tris(trichloromethyl) Base) methyl) sulfonium salt and the like. Preferred gun cations are, for example, bis(p-tolyl) ore, (p-tolyl) (p-isopropylphenyl) iodide, bis(p-terphenyl) sulphate, triphenyl fluorenyl A phosphonium salt or a tris(p-tert-butylphenyl) phosphonium salt or the like. Specific examples of the aforementioned anion derived from a Lewis acid include hexafluorophosphate, hexafluoroarsenate, hexafluoroantimonate or tetrakis(pentafluorophenyl)borate. These key cations can be arbitrarily combined with an anion derived from a Lewis acid. Specific examples of the cationic polymerization initiator include diphenyliodonium hexafluorophosphate, bis(p-tolyl)phosphonium hexafluorophosphate, and bis(p-terphenyl)iodonium hexafluorophosphate. Bis(p-octylphenyl)iodide hexafluorophosphate, bis(p-octadecylphenyl)phosphonium hexafluorophosphate, bis(p-octyloxyphenyl)phosphonium hexafluorophosphate, double (pair) Octadecyloxyphenyl) phosphonium hexafluorophosphate, phenyl (for 201037004 octadecylphenyl) sulphate hexafluorophosphate, (p-tolyl) (p-propyl phenyl) iodide hexafluorophosphate Phosphate, methylnaphthyl iodide hexafluorophosphate, ethylnaphthyl sulfonium salt hexafluorophosphate, triphenylsulfonium salt hexafluorophosphate, H (p-tolyl) sulfonium salt hexafluorophosphate, three ( P-isopropylphenyl) phosphonium hexafluorodiate, tris(2,6-dimethylphenyl)phosphonium hexafluorophosphate, tris(p-terphenyl)phosphonium salt hexafluorophosphate , tris(p-cyanophenyl) phosphonium salt hexafluorophosphate, tris(p-chlorophenyl) phosphonium salt hexafluorophosphate, dimethylnaphthyl phosphonium salt hexafluorophosphate, diethyl naphthyl phosphonium salt hexafluorophosphate Phosphate, two Base (tris(trichloromethyl)methyl)phosphonium salt hexafluorophosphate; diphenylsulfonium salt hexafluoroarsenate, bis(p-tolyl)phosphonium salt hexafluoroarsenate, double (for tertiary butyl Phenyl phenyl) sulfonium hexafluoroarsenate, bis(p-octylphenyl) phosphonium hexafluoroarsenate, bis(p-octadecylphenyl)phosphonium hexafluoroarsenate, bis(octyloxy) Phenyl phenyl) sulfonium salt hexafluoroarsenate 'bis (p-octadeoxyphenyl) sulfonium salt hexafluoroarsenate, phenyl (p-octadecylphenyl) sulfonium salt hexafluoroarsenate, P-tolyl)(p-isopropylphenyl)phosphonium salt hexafluoroarsenate, methylnaphthyl iodide salt hexafluoroarsenate, ethylnaphthylsulfonium salt hexafluoroarsenate, triphenyl mirror salt Fluor arsenate, tris(p-tolyl)phosphonium hexafluoroarsenate, tris(p-isopropylphenyl)phosphonium hexafluoroarsenate, tris(2,6-dimethylphenyl)phosphonium salt Hexafluoroarsenate's tris(p-tert-butylphenyl)phosphonium salt hexafluoroarsenate, tris(p-cyanophenyl) mirror salt hexafluoroarsenate, tris(p-chlorophenyl)phosphonium salt hexafluoride Arsenate, dimethyl caffeine salt hexafluoroarsenate, diethyl naphthyl sulfonium salt hexafluoroarsenate Dimethyl (tris(trichloromethyl)methyl)phosphonium hexafluoroarsenate; diphenyl iodide hexafluoroantimonate, bis(p-tolyl) iodide hexaoxide, bis (pair) Tertiary butylphenyl) phosphonium hexafluoroantimonate, bis(p-octylphenyl-32-201037004) sulfonium hexafluoroantimonate, bis(p-octadecylphenyl)phosphonium hexafluoroantimonate Salt, bis(p-octyloxyphenyl) sulphate hexafluoroantimonate, bis(p-octadecylphenyl)phosphonium hexafluoroantimonate, phenyl (p-octadecylphenyl) salt Hexafluoroantimonate, (p-tolyl) (p-isopropylphenyl) phosphonium salt hexafluoroantimonate, methylnaphthyl phosphonium salt hexafluoroantimonate, ethylnaphthyl iodide salt hexafluoroantimonate , triphenylsulfonium salt hexafluoroantimonate, tris(p-tolyl)phosphonium salt hexafluoroantimonate, tris(p-isopropylphenyl)phosphonium salt hexafluoroantimonate, tris(2,6-di Methylphenyl) sulfonium salt hexafluoroantimonate, 0 tris(p-tert-butylphenyl) phosphonium salt hexafluoroantimonate, tris(p-cyanophenyl) phosphonium salt hexafluoroantimonate, three (pair) Chlorophenyl) sulfonium salt hexafluoroantimonate, dimethylnaphthyl sulfonium salt hexafluoroantimonate, diethyl naphthalene Bismuth hexafluoroantimonate, dimethyl (tris(trichloromethyl)methyl)phosphonium hexafluoroantimonate; diphenyl iodide tetrakis(pentafluorophenyl)borate, bis(p-tolyl) Zhenling tetrakis(pentafluorophenyl)borate, bis(p-tert-butylphenyl) phosphonium tetrakis(pentafluorophenyl)borate 'bis(p-octylphenyl)iodonium tetrakis(pentafluorobenzene) Borate, bis(p-octadecylphenyl)iodide tetrakis(pentafluorophenyl)borate, bis(p-octyloxyphenyl) iodide tetrakis(pentafluorophenyl)borate, bis( P-octadecylphenyl) phosphonium salt tetrakis(pentafluorophenyl)borate, phenyl (p-octadecylphenyl) phosphonium salt tetrakis(pentafluorophenyl)borate, (p-tolyl) (pair) Isopropyl phenyl) sulphate tetrakis(pentafluorophenyl) borate, methylnaphthyl sulfonium tetrakis(pentafluorophenyl)borate, ethylnaphthyl sulphate tetrakis(pentafluorophenyl)borate, Triphenylsulfonium salt tetrakis(pentafluorophenyl)borate, tris(p-tolyl)phosphonium tetrakis(pentafluorophenyl)borate, tris(p-isopropylphenyl)phosphonium salt tetrakis(pentafluorophenyl) Borate, tris(2,6-dimethylphenyl) Bismuth salt tetrakis(pentafluorophenyl)borate, tris(p-terphenyl)phosphonium tetrakis(pentafluorophenyl)borate, tris(p-cyanophenyl)phosphonium tetrakis(pentafluorophenyl) Borate, tris(p-chloro-33-201037004 phenyl) phosphonium salt tetrakis(pentafluorophenyl)borate, dimethylnaphthyl phosphonium salt tetrakis(pentaphenyl)borate, diethylnaphthyl sulfonium salt Tetrakis(pentafluorophenyl)borate, dimethyl(tris(trichloromethyl)methyl)phosphonium tetrakis(pentafluorophenyl)borate, and the like. Preferred is bis(p-tolyl)phosphonium salt hexafluorophosphate, (p-tolyl) (p-isopropylphenyl) sulphate hexafluorophosphate, bis(p-tert-butylphenyl) cone hexafluoro O-acid salt, triphenylsulfonium salt hexafluorophosphate, tris(p-tert-butylphenyl) phosphonium salt hexafluorophosphate, bis(p-tolyl) sulphate hexafluoroarsenate, (p-tolyl) (p-isopropylphenyl) sulphate hexafluoroarsenate, bis(p-tert-butylphenyl) iodide hexafluoroarsenate, triphenylsulfonium hexafluoroarsenate, three (for tertiary Butyl phenyl) sulfonium salt hexafluoroarsenate, bis(p-tolyl) iodide hexafluoroantimonate, (p-tolyl) (p-isopropylphenyl) sulfonium hexafluoroantimonate, double ( P-tert-butylphenyl) sulphate hexafluoroantimonate, triphenylsulfonium salt hexafluoroantimonate, tris(p-tert-butylphenyl) phosphonium hexafluoroantimonate, bis(p-tolyl) Iodine salt tetrakis(pentafluorophenyl)borate, (p-tolyl) (p-isopropylphenyl) sulphate tetrakis(pentafluorophenyl)borate, bis(p-terphenyl) nickel salt Four (five episodes of phenyl) borate, triphenylsulfonium salt Tetrakis(pentafluorophenyl)borate, tris(p-tert-butylphenyl)phosphonium tetrakis(pentafluorophenyl)borate, and the like. More preferably bis(p-tolyl)phosphonium hexafluoroantimonate, (p-tolyl-p-isopropylphenyl) sulphate hexafluoroantimonate, bis(p-terphenyl)phosphonium hexafluorophosphate Citrate, triphenylsulfonium salt hexafluoroantimonate, tris(p-tert-butylphenyl) phosphonium salt hexafluoroantimonate, bis(p-tolyl) sulphate tetrakis(pentafluorophenyl)borate (p-tolyl) (p-isopropylphenyl) phosphonium salt tetrakis(pentafluorophenyl)borate, bis(p-terphenyl) sulphate tetrakis(pentafluorophenyl)borate, triphenyl Base salt tetrakis(pentafluorophenyl)borate, tris(p-tert-butylphenyl) phosphonium salt tetrakis(pentafluoro-34-201037004 phenyl)borate, and the like. The content of the cationic polymerization initiator is preferably from 0.1 to 40% by mass, particularly preferably from 1 to 30% by mass, based on the mass fraction of the resin composition. When the total amount of the cationic polymerization initiator is in this range, there is a tendency to shorten the hardening time. The resin composition used in the present invention can be used as the "required" 塡0 filler, polymer compound other than the resin (A), adhesion promoter, antioxidant, ultraviolet absorber, light stabilizer, anti-agglomerating agent Additives such as chain transfer agents. The chelating agent is, for example, glass, cerium oxide, aluminum oxide or the like. The polymer compound other than the resin (A) is, for example, a curable resin such as an epoxy resin or a maleimide resin, or a polyvinyl alcohol polyacrylic acid, a polyethylene glycol monoalkyl ether or an acrylic polychloride. A thermoplastic resin such as an alkyl ester, a polyester or a polyurethane. The adhesion promoter is preferably a decane compound. Specific examples include vinyl trimethoxy decane, vinyl triethoxy decane, vinyl tris(2-methoxyethoxy) decane, and N-(2-aminoethyl)-3-aminopropylmethyl Methoxy decane, N-(2-aminoethyl)-3-aminopropyltrimethoxy decane, 3-aminopropyltrimethoxy decane, 3-glycidoxypropyltrimethoxy decane, 3-epoxypropyl Oxidylmethyldimethoxydecane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, 3-chloropropylmethyldimethoxydecane, 3-chloropropyltrimethoxydecane 3, methacryloxypropyltrimethoxy decane, 3-mercaptopropyltrimethoxy oxime, and the like. The antioxidant is, for example, 2-tributyl butyl-6 gas 3_tert-butyl-2-35-201037004 hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, 2-[l-acrylic acid -(2-hydroxy-3,5-di-triamylpentylphenyl)ethyl]-4,6-di-triamylphenyl ester, 6-[3·(3-tert-butyl-4- Hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldiphenyl[d,f][l,3,2]dioxaphosphane heptane, 3 ,9-bis[2-{3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoxy}-1,1-dimethylethyl]- 2,4, 8,10-tetraoxaspiro[5.5]undecane, 2,2,-methylenebis(6-tributyl-4-methylphenol), 4,4'-butylene bis (6 -tertiary butyl-3-methylphenol), 4,4,-thiobis(2-tert-butyl-5-methylphenol), 2,2'-thiobis(6-tertiary butyl- 4_methylphenol), dilauryl 3,3'·thiodipropionate, diterpenoid 3,3′-thiodipropionate, distearyl 3,3′-thiodipropionic acid Ester, neopentyl alcohol tetrakis(3·lauryl thiopropionate), hydrazine, 3,5-tris(3,5-di-tri-butyl-4-hydroxybenzyl)-1,3,5 -Triazabenzene-2,4,6(1H,3H,5H)-trione, 3,3',3",5,5',5"- Six-three-grade - Al,, a "-(trimethyl-2,4,6-triyl)tri-p-cresol'nepentaerythritol tetrakis[3-(3,5-di-tri-butyl-4-hydroxybenzene) Base) propionate], 2,6-di-tertiary butyl-4-methyl acid, etc. The ultraviolet absorber is, for example, 2-(2-hydroxy-5-tertiary butylphenyl)-2H-* j benzotriazole, octyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate, 2- [4-[(2-Hydroxy-3-dodecyloxy)oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl-1,3,5 -Triazabenzene, 2-[4-[(2-hydroxy-3-(2'-ethyl)hexyl)oxy]-2-hydroxyphenyl]-4,6-bis(2,4-di Methylphenyl-1,3,5-triazabenzene, 2,4-bis(2-hydroxy-4-butyloxyphenyl)-6-(2,4-bis-butyloxybenzene 1,3,5-triazabenzene, 2-U-hydroxy-4-[l-octyloxycarbonylethoxy]phenyl)4,6-bis(4-phenylphenyl)- 1,3,5-triazabenzene, 2-(211-benzotriazol-2-yl)-4,6-bis(1-carboindole--36-201037004 1-phenylethyl)phenol 2-(2H-benzotriazol-2-yl)-6-U-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2 -(3-tert-butyl-2-hydroxy-5-methylphenyl)- 5-Chlorobenzotriazole or alkoxydiphenyl ketone. The light stabilizer is, for example, a polymer formed of succinic acid and (4-hydroxy-2,2,6,6-tetramethylpiperidine-:1-yl)ethanol, N, N,, N", N m -tetrakis(4,6-bis(butyl-(N-methyl-2,2,6,6-tetramethylpiperidin-4-yl)amino)triazaphenyl-2-yl)-4 , 7-diazadecane_1,10-diamine, azelaic acid, and bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidyl) Reaction of ester with 1,1-dimethylethyl hydroperoxide 'bis(l,2,2,6,6-pentamethyl-4-piperidinyl)-[[3,5-double (l,:l-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate, 2,4-bis[N-butyl-N-(l-cyclohexyloxy)- 2,2,6,6-tetramethylpiperidin-4-yl)amino]-6-(2-hydroxyethylamine)-1,3,5-triazabenzene, bis(1,2,2 , 6,6-pentamethyl-4-piperidinyl) sebacate or methyl (1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate, etc. The coagulant is, for example, sodium polyacrylate or the like. The chain transfer agent is, for example, dodecyl mercaptan, 2,4-diphenyl-4-methyl-1-pentane or the like. The resin composition used in the present invention, The solid content is preferably from 10 to 30% by mass, particularly preferably 1 2 ～28质量%, more preferably 1 5 to 25% by mass. By setting this range, the reliability of the coating film can be improved. Various coating methods, even in the extrusion method, are less likely to cause defects, etc. Further, a flat cured film can be formed. Further, the resin composition used in the present invention is incorporated in a quartz single crucible having a light path length of 1 cm, and is measured using a spectrophotometer at a measurement wavelength of 400 to 700 nm. In the case of transmittance, the average transmittance is generally -37 to 201037004 7 〇% or more, preferably 80% or more. The resin composition used in the present invention, when the cured film is formed, the average transmittance of the film is generally 90%. The above is preferably a transmittance of 95% or more, which is a thickness of 3 μm after heat curing (for example, 1 00 to 250 ° C, 5 minutes 〜) at a measurement wavelength of 400 〜 using a spectrophotometer. The average thickness of the cured film is measured by providing a cured film excellent in transparency in the visible light region. The resin composition used in the present invention is a substrate, for example, a substrate such as glass, metal or plastic, as will be described later. Or formed with light A flat cured film is formed on a substrate such as various insulating or conductive films or a driver circuit. The cured film is usually dried or hardened, and the cured film may be formed as a part of a display device or the like. First, the resin composition used in the present invention is applied to a layer formed by a solid content of a resin composition formed previously. The coating method is not particularly limited, and for example, spin coating pressure can be used. And a spin coater, an extrusion coater (also known as a die coat curtain flow coater or a non-rotating coater), an inkjet coater, a dip coater, etc. Coating is carried out. From the viewpoints of solubility, anti-drying, and prevention of foreign matter, it is preferred to apply by extrusion coating, that is, extrusion and rotary machines, and extrusion coaters. Next, it is preferably dried or pre-baked to remove the solvent or the like and hardened. This is 7 0 0 nm for 3 hours. It can be applied to a color filter to form a polymer. The substrate or t of the part. Machine, extruder, machine, roller, see the volatile of the coating -38 - 201037004 composition. Thereby, a smooth uncured film can be obtained. It is especially suitable for decompression drying. The drying under reduced pressure here is carried out, for example, at a pressure of 50 to 150 Pa in a temperature range of 20 to 25 °C. The film thickness of the uncured film at this time is not particularly limited, and can be appropriately adjusted by using the material, the use, and the like, and is, for example, 0.1 to 30 μm, preferably 1 to 20 μm, and more preferably 1 to 6 μm. After drying, by post-baking, a cured film of a flattened film or the like can be obtained. The post-baking is preferably, for example, a temperature range of from 1 50 to 2300 ° C, and from 10 to 180 minutes. In particular, the resin composition used in the present invention can be formed by applying a film on a substrate by using an extrusion coater, and drying the film formed on the substrate to produce a flattened film or the like. Used for hardened film. According to the present invention, it is possible to form a cured film which is capable of suppressing the occurrence of defects such as solvent boiling and which has excellent flatness. Further, by using such a cured film, a high-quality display device can be obtained. The cured film of the present invention can be suitably used, for example, as a transparent film, particularly a transparent film constituting a part of a color filter or an array substrate. Further, such a transparent film can be used as a planarizing film, and can be applied to a color filter or an array substrate having a planarizing film or the like as a part of the constituent members, and a flattening film, a color filter, and/or For example, a display device such as an array substrate, such as a liquid crystal display device or an organic electroluminescence display device, can display a display device having a high-quality flattening film or the like at a high yield. -39-201037004 EXAMPLES Hereinafter, the resin composition of the present invention will be described in more detail by way of examples, but the present invention is not limited to the examples. Further, in the following examples and comparative examples, the % or the part of the content or the amount used is based on the mass unless otherwise specified. Synthesis of Resin Aa Nitrogen gas was introduced into a flask equipped with a reflux condenser, a dropping funnel, and a stirrer at a flow rate of 0.02 L/min to form a nitrogen atmosphere, and 59 parts by mass of 3-methoxy-1-butanol was added. 81 parts by mass of 3-methoxybutyl acetate was heated to 7 ° C while stirring. Next, 40 parts by mass of methacrylic acid, and 3,4-epoxytricyclo[5.2.1.02'6]decyl acrylate (the compound represented by the formula (1-1) and the formula (II-U) The compound was prepared by dissolving 360 parts by mass of a mixture of molar ratio of 50:50, 80 parts by mass of 3-methoxy-1-butanol, and 110 parts by mass of 3-methoxybutyl vinegar acetate. After pumping, the solution was dropped into a flask kept at 70 ° C for 4 hours.

On the other hand, using other dropping pumps, it will be dissolved in 101 parts by mass of 3-methoxy-1-butanol and 139 parts by mass of 3-methoxybutyl acetate. A solution of 36 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) of the agent was dropped into the flask for 5 hours. After the completion of the dropwise addition of the polymerization initiator solution, it was kept at 70 ° C for 4 hours, and then cooled to room temperature to obtain a copolymer having a solid content of 42.5 mass % and an acid value of 5611^-〖011/8 (resin 八3) )The solution. The obtained resin Aa had a weight average molecular weight (Mw) of 7.6 X 103 and a degree of dispersion of 2.01. Synthesis of the resin Resin Ab Nitrogen gas was flowed into a 1 L flask equipped with a reflux condenser, a dropping funnel, and a stirrer at a flow rate of 0.02 L/min to form a nitrogen atmosphere, and 56 parts by mass of 3-methoxy-1-butanol was added. And 84 parts by mass of 3-methoxybutyl acetate - heated to 701 while stirring. Next, 40 parts by mass of methacrylic acid, and 3,4-epoxytricyclo[5.2_1.02,6]decyl acrylate (presented by the compound represented by the formula (I) and the formula (π - U) The compound is prepared by dissolving 3 parts of 3-methoxy-1-butanol and 76 parts by mass of 3-methoxy-1-butanol in a mixture of 3, 60 parts by mass of a molar ratio of 50:50. The solution was taken out. Using a drop-in pump, the solution was dropped into a flask kept at 70 ° C for 4 hours. On the other hand 'using other drip pump, 3 - methoxy-butanol 96 parts by mass and 144 parts by mass of 3-methoxybutyl acetate, a solution of 14 parts by mass of 2,2,-azobis(2,4-dimethylvaleronitrile) as a polymerization initiator was dissolved in The mixture was dropped into the flask between 4 hours. After the completion of the dropwise addition of the polymerization initiator solution, it was kept at 7 (TC for 4 hours, then cooled to room temperature to obtain a solid fraction of 42.3% by mass, and an acid value of 57 mg- KOH/g (solid content conversion) of a total of -41 - 201037004 polymer (resin Ab) solution. The obtained resin Ab has a weight average molecular weight Mw of 1.9 x 10 4 and a dispersion of 2.65. The amount (Mw) and the number average molecular weight (?η) were measured by the GPC method under the following conditions. Apparatus: Κ2479 (manufactured by Shimadzu Corporation) Column: SHIMADZU Shim-pack GPC-80M Column temperature: 40 °C Solvent: THF (tetrahydrofuran)

Flow rate: 1 · OmL/min Detector: RI The ratio of the polystyrene-equivalent weight average molecular weight and the number average molecular weight obtained above was defined as the degree of dispersion (Mw/Mn). Example 1 25 parts of a resin solution (A) containing the obtained resin Aa (100 parts in terms of solid content) and Mefafac F-489 (manufactured by DIC Corporation) (0 parts) of a fluorine-based surfactant 0.8 parts by weight of Irganox 3114 (manufactured by Chiba Japan Co., Ltd.) and solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol): 1〇: The mixture of 45:45 was mixed to obtain a resin composition 1 having a solid content concentration of 19.3% by mass. Example 2 23 parts of a resin solution (A) containing the obtained resin Aa (100 parts in terms of solid content), 0.05 part of Megafac F-489 (manufactured by DIC Corporation), and Irganox-42-201037004 3 1 L4 (manufactured by Chiba Japan Co., Ltd.) 0.8 parts and solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol in a weight ratio of 10:45:45 The mixture was mixed to obtain a resin composition 2 having a solid content concentration of 19.3% by mass. Example 3 2 3 6 parts of a resin solution (A) containing the obtained resin Ab (100 parts in terms of solid content 0), 0.01 part of Megafac F-48 9 (manufactured by DIC Corporation), and Irganox 31 14 ( A mixture of 0.8 parts by weight of a solvent (diethylene glycol butyl ether acetate, 3, methoxybutyl acetate and 3-methoxy-1-butanol) of 20:40:40 The mixture was mixed to obtain a resin composition 3 having a solid content concentration of 19.3% by mass. Example 4 236 parts of resin solution (Α) containing resin Ab (100 parts by weight of solid content), 0.05 parts of MegafaC < F-489 (manufactured by DIC Corporation), and Irganox 3114 (manufactured by Chiba Japan Co., Ltd.) 8 parts and a solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol in a weight ratio of 10:45:45) are mixed, and Resin composition 4 having a solid content concentration of 19.3% by mass was obtained. Example 5 23 parts of a resin solution (A) containing the obtained resin Ab (100 parts in terms of solid content), Megafac F-489 (manufactured by DIC Corporation) (B) 0_05 parts, -43-201037004

Irganox 3114 (manufactured by Chiba Japan Co., Ltd.) 8 parts by weight and solvent (monobutyl butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol) are 20: The mixture of 4 0 : 40 was mixed to obtain a resin composition 5 having a solid content concentration of 19.3% by mass. Example 6 236 parts of a resin solution (A) containing the obtained resin Ab (100 parts in terms of solid content) and SH8400 (manufactured by Dow Corning Toray Co., Ltd.) (B) of a polyoxyalkylene-based surfactant were 0.05 parts, 0.8 parts by Irganox 3114 (manufactured by Chiba Japan Co., Ltd.) and a solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol) in a weight ratio of 1〇:45 The mixture of :45 was mixed to obtain a resin composition 6 having a solid content concentration of 19.3% by mass. Example 7 23 parts of a resin solution (A) containing the obtained resin Ab (100 parts in terms of solid content), 0.05 parts of Megafac F-489 (manufactured by DIC Corporation), and SH8400 (Dow Corning Toray) Company made) (Β)〇·〇5 parts, Irganox 3 1 14 (manufactured by Chiba Japan Co., Ltd.) 0·8 parts and solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate and 3 - The mixture of methoxy-1-butanol in a weight ratio of 10:45:45 was mixed to obtain a resin composition 7 having a solid content concentration of 19.3% by mass. Example 8 -44 - 201037004 Resin solution (A) containing the obtained resin Aa 2 3 5 parts (100 parts in solid form), Megafac F-489 (made in DIC) (B) 0.01 parts, Irganox 31 〖4 (manufactured by Chiba Japan Co., Ltd.) 〇·8 parts and solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol in a weight ratio of 1: 49.5: a mixture of 49.5) was mixed to obtain a resin composition 8. 0 Example 9 25 parts of resin solution (A) containing the obtained resin Aa (100 parts in solid form), 0.01 part of Megafac F-489 (made by DIC Corporation), and Irganox 3114 (Chiba Japan Co., Ltd. a mixture of 0.8 parts and a solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol in a weight ratio of 40:30:30) The mixture was mixed to obtain a resin composition 9. Comparative Example 1 Q 5 parts of resin solution (A) containing resin Aa (part 100 parts by solid content), 0.8 parts of Irganox 3114 (manufactured by Chiba Japan Co., Ltd.), and solvent (diethylene glycol butyl ether acetate, acetic acid 3) a mixture of -methoxybutyl ester and 3-methoxy-1-butanol in a weight ratio of 10:45:45) was mixed to obtain a resin composition having a solid content of 13.9% by mass. . The following evaluations were carried out for each of the resin compositions obtained in Examples 1 to 9 and Comparative Example 1. <Bump boiling evaluation> -45-201037004 A 5 cm x 5 cm glass substrate (Eagle 2000 manufactured by Corning Co., Ltd.) was washed with a neutral detergent, water and ethanol in this order, followed by drying. The resin compositions of Examples 1 to 9 and Comparative Example 1 were applied onto the glass substrate under the conditions of 60 rpm and 10 seconds using a spin coater. Then, the pressure was reduced to 130 Pa by a vacuum dryer (manufactured by VCD Microtek Co., Ltd.) and dried. After cooling, the surface of the coating film was observed with a reflection type optical microscope. The result is shown in the second table. When there is no sudden boiling, it is 〇, and when it is suddenly boiling, it is X. For the person who produced the bump, the step evaluation was aborted because a smooth convex film could not be obtained. <Step evaluation] Preparation of evaluation substrate Each component was mixed at a ratio shown in Table 1, and a colored resin composition 1 was obtained. [Table 1] CI Pigment Blue-15 : 6 5.48 parts CI Pigment Violet 23 0.35 parts _ Pigment Dispersant 2·04 parts Benzyl methacrylate/methacrylic acid copolymer (mass composition ratio 65/35, warp polymerization) The average molecular weight in terms of styrene is 25,000. 7.38 parts of dipentaerythritol hexaacrylate (KAY ARAD DPHA, manufactured by Nippon Kayaku Co., Ltd.) 7.38 parts of 2-benzyl-2·dimethylamino-1-(4-) Polinylphenyl)-butanone (1-369, manufactured by Chiba Japan Co., Ltd.) 1.77 parts of 4,4'-diethylaminodiphenyl ketone (EAB-F, manufactured by Hodogaya Chemical Co., Ltd.) 0.59 parts modified by polyacid Polyxide Institute (SH8400 manufactured by Dow Coming Toray Co., Ltd.) 0.01 parts __ 3_ethyl ethoxy propionate 15.00 parts propylene glycol monomethyl ether acetate 60.00 parts __ -46- 201037004 5cm x 5cm glass substrate (Corning The company made Eagle 2000), which was washed with neutral detergent, water and ethanol, and then dried. The colored resin composition 1 was applied onto the glass substrate by a spin coating method. This was followed by pre-baking at 90 ° C for 3 minutes in a clean oven. After cooling, the distance between the substrate coated with the colored resin composition 1 and the mask made of quartz glass was set to ΙΟΟμηη, and an exposure machine (TME-150RSK; Topcon Corporation, light source; ultrahigh pressure mercury lamp) was used in the atmosphere. Light irradiation was performed with an exposure amount of 100 mJ/cm 2 0 (3 65 nm reference). At this time, the irradiation of the colored resin composition was carried out by passing the radiation light from the ultrahigh pressure mercury lamp through an optical filter (UV-35; manufactured by Asahi Techno Glass Co., Ltd.). Further, the reticle is formed by using a mask having a pattern (interactively having a line pattern of a light-transmitting portion and a light-shielding portion of 1 μm) on the same plane. After the light irradiation, the coating film was immersed in an aqueous developing solution containing 0.12% of a nonionic surfactant and 0.04% of potassium hydroxide for 30 seconds in 23 t for development, and after washing with water, in an oven. After post-baking at 220 ° C for 20 minutes, an evaluation substrate in which the colored line portions of ΙΟΟμιη and the pitch portion of 1 ΟΟ μη were alternately formed were produced. The film thickness of the colored resin composition was 1 · 3 6 μηη. The resin compositions of Examples 1 to 9 were applied to the evaluation substrate at 60 ° C for 10 seconds using a spin coater. Then, the pressure was reduced to 1.0 Torror by a vacuum dryer (manufactured by Microtek Co., Ltd.), dried, and placed on a hot plate set at 95 ° C, and pre-baked on the top for 2 minutes to form a coating film. Then, it was heated at 23 ° C for 20 minutes to harden it. After cooling, the maximum film thickness and the minimum film thickness were measured using a probe type film thickness meter (manufactured by Veeco Co., Ltd. - 47-201037004 DEKTAK 6M), and the step (= maximum film thickness - minimum film thickness) was calculated. The result is shown in the second table. If the step is smaller than the film thickness of the underlayer, it is set to be good. <Average transmittance of film> A cured film was produced by the following method using each resin composition so that the film thickness after hardening became 3 μηι. The resin composition was diluted with diethylene glycol n-butyl ether acetate so as to be 20% by mass of the solid content. By spin coating, the film thickness after hardening was 3 μm, and after 10 (TC Χ 10 minutes of prebaking, it was heat-hardened at 220 ° C for 20 minutes. The cured film was measured for an average transmittance (%) of 400 to 700 nm using a microscopic spectrophotometer (OSP-SP200; manufactured by OLYMPUS Co., Ltd.) The higher the transmittance, the smaller the absorption. Table 2] EXAMPLES Comparative Example 1 2 3 4 5 6 7 8 9 1 Resin composition 1 2 3 4 5 6 7 8 9 10 Content of surfactant (% by mass) 0.01 0.05 0.01 0.05 0.05 0.05 0.10 0.01 0.01 0 Diethylene glycol butyl Ethyl acetate content (% by mass) 10 10 20 10 20 10 10 1 40 10 Swelling 〇〇〇〇〇〇〇〇〇 X Maximum film thickness (μηι) 3.36 3.16 3.97 3.74 3.83 3.86 3.84 3.20 4.01 Minimum film thickness ( Ηηι) 2.14 2.20 2.88 2.74 2.83 2.83 2.85 2.18 3.08 Step difference (μηι) 1.22 0.96 1.09 1.00 1.00 1.03 0.99 1.02 0.93 Average transmittance (%) 99.4 99.3 99.4 99.4 99.4 99.4 99.4 99.4 99.4 -48 - 201037004 In the second table, the interface Active agent content (%) 'for phase The content of the solid amount of the agent (%), diethylene glycol butyl ether mass%), relative to the total amount of solvent is diethylene glycol butyl ether acetate (mass%). Further, the average transmittance (%) is an average transmittance (%) in 700 nm of a film thickness of 3 μm. Industrial Applicability: The cured film of the present invention covers a large area of the entire surface, and hardly causes defects due to solvent boiling. Further, since the transmittance is high, it is preferably used for a film or the like in a display device such as a coating layer for bonding a protective or colored pattern. ❹ For the content of the interface active acid ester (the content of the acid ester, the wavelength of 400~ is flat, and due to the flattening of the film and the insulating film -49-

Claims (1)

201037004 VII. Patent application scope: 1. A cured film which is obtained from a resin composition containing a resin (A), a surfactant (b) and a solvent (c), and is substantially not The content of the surfactant (B) is from 0 to 5% by mass to 5% by mass based on the amount of the solid content of the polymerizable monomer and the coloring agent. 2. The cured film according to claim 1, wherein the surfactant (B) is a surfactant containing at least one atom selected from the group consisting of a ruthenium atom and a fluorine atom. 3. The cured film according to claim 1 or 2, wherein the resin (A) is at least an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride (A1) and a cyclic ether bond having a carbon number of 2 to 4. A copolymer in which the monomer (A2) is polymerized to form a copolymer. 4. The cured film according to claim 3, wherein the monomer (A2) having a cyclic ether bond of 2 to 4 carbon atoms is a monomer having an oxirane group. 5. The cured film according to claim 3 or 4, wherein the monomer (A2) having a cyclic ether bond of 2 to 4 carbon atoms is a monomer having an aliphatic polycyclic epoxy group. 6. The cured film according to any one of claims 3 to 5, wherein the monomer (A2) having a cyclic ether bond of 2 to 4 carbon atoms is selected from the group consisting of a compound represented by the formula (1) (Π) at least one compound of the group consisting of compounds; R1 Ο H2C=C—C—〇—X1 R2 Ο I II H2C=C—C—Ο (II) ο -50- (I) 201037004 [In the formulae (I) and (II), R1 and R2 each independently represent a hydrogen atom or a hydroxyl group having a carbon number of i to 4; Χ2 independently represents a single bond, an alkylene group having a carbon number of 1 to 6 or _((^2)3-乂'-((:112)1-, and 'for -3-, ·〇· or -ΝΗ - 'S and t respectively represent an integer of 〇~6, respectively, s + t = 6]. 7. A cured film according to any one of claims 1 to 6, wherein the solvent (C) A solvent containing diethylene glycol butyl ether acetate. 8. A cured film according to claim 7 wherein the solvent (c) is a total amount of diethylene glycol butyl ether acetate relative to the solvent. It is a solvent of 1% by mass. 9. A display device containing a cured film as disclosed in any one of claims 丨 to 8 ❹ -51 - 201037004 4 designated representatives 囷: (1) Representative of the case Pictured: No (2) Simple description of the symbol of the representative figure: No 201037004 If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention: none