TW201016799A - Ink for inkjet and curing film formed form the ink - Google Patents
Ink for inkjet and curing film formed form the ink Download PDFInfo
- Publication number
- TW201016799A TW201016799A TW98129444A TW98129444A TW201016799A TW 201016799 A TW201016799 A TW 201016799A TW 98129444 A TW98129444 A TW 98129444A TW 98129444 A TW98129444 A TW 98129444A TW 201016799 A TW201016799 A TW 201016799A
- Authority
- TW
- Taiwan
- Prior art keywords
- ink
- inkjet
- acrylate
- cured film
- methyl
- Prior art date
Links
- 239000000178 monomer Substances 0.000 claims abstract description 167
- 125000000524 functional group Chemical group 0.000 claims abstract description 75
- 239000007788 liquid Substances 0.000 claims abstract description 60
- 238000007747 plating Methods 0.000 claims abstract description 51
- 229920005989 resin Polymers 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 45
- 150000004292 cyclic ethers Chemical class 0.000 claims abstract description 30
- 239000003999 initiator Substances 0.000 claims abstract description 21
- 238000005530 etching Methods 0.000 claims abstract description 15
- 230000009257 reactivity Effects 0.000 claims abstract description 12
- 239000000976 ink Substances 0.000 claims description 460
- -1 (fluorenyl)-propyl Chemical group 0.000 claims description 144
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 120
- 239000000052 vinegar Substances 0.000 claims description 91
- 235000021419 vinegar Nutrition 0.000 claims description 91
- 239000000758 substrate Substances 0.000 claims description 85
- 150000003254 radicals Chemical class 0.000 claims description 75
- 150000001875 compounds Chemical class 0.000 claims description 68
- 239000000243 solution Substances 0.000 claims description 57
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 51
- 229910052799 carbon Chemical group 0.000 claims description 46
- 230000000052 comparative effect Effects 0.000 claims description 45
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 44
- 238000003860 storage Methods 0.000 claims description 43
- 238000012360 testing method Methods 0.000 claims description 42
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 37
- 238000000576 coating method Methods 0.000 claims description 37
- 238000006116 polymerization reaction Methods 0.000 claims description 35
- 239000002904 solvent Substances 0.000 claims description 33
- 239000003112 inhibitor Substances 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000007983 Tris buffer Substances 0.000 claims description 29
- 239000007864 aqueous solution Substances 0.000 claims description 29
- 230000008859 change Effects 0.000 claims description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 28
- 238000011156 evaluation Methods 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 26
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 26
- 239000001257 hydrogen Substances 0.000 claims description 25
- 229910052739 hydrogen Inorganic materials 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 24
- 239000003063 flame retardant Substances 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 22
- 239000004094 surface-active agent Substances 0.000 claims description 22
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 21
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 20
- 239000002253 acid Substances 0.000 claims description 20
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 20
- 125000004122 cyclic group Chemical group 0.000 claims description 19
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 18
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 18
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 17
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 17
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 17
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 16
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 16
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 15
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Natural products C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 claims description 14
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 14
- 239000003085 diluting agent Substances 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 14
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 14
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 14
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 13
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 13
- 239000003086 colorant Substances 0.000 claims description 13
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 claims description 13
- 239000002216 antistatic agent Substances 0.000 claims description 12
- 239000007789 gas Substances 0.000 claims description 11
- 239000010410 layer Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 11
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 11
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 11
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 10
- 229920000877 Melamine resin Polymers 0.000 claims description 10
- 150000002148 esters Chemical class 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 239000001301 oxygen Substances 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 9
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 9
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims description 9
- 239000004640 Melamine resin Substances 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 claims description 8
- 239000005011 phenolic resin Substances 0.000 claims description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 7
- IBPADELTPKRSCQ-UHFFFAOYSA-N 9h-fluoren-1-yl prop-2-enoate Chemical compound C1C2=CC=CC=C2C2=C1C(OC(=O)C=C)=CC=C2 IBPADELTPKRSCQ-UHFFFAOYSA-N 0.000 claims description 7
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 7
- 229930185605 Bisphenol Natural products 0.000 claims description 7
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 229910044991 metal oxide Inorganic materials 0.000 claims description 7
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 7
- 239000007921 spray Substances 0.000 claims description 7
- 238000011282 treatment Methods 0.000 claims description 7
- 238000012795 verification Methods 0.000 claims description 7
- DAWJJMYZJQJLPZ-UHFFFAOYSA-N 2-sulfanylprop-2-enoic acid Chemical compound OC(=O)C(S)=C DAWJJMYZJQJLPZ-UHFFFAOYSA-N 0.000 claims description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- NUPSHWCALHZGOV-UHFFFAOYSA-N acetic acid n-decyl ester Natural products CCCCCCCCCCOC(C)=O NUPSHWCALHZGOV-UHFFFAOYSA-N 0.000 claims description 6
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000009835 boiling Methods 0.000 claims description 6
- 238000004132 cross linking Methods 0.000 claims description 6
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 6
- 150000004706 metal oxides Chemical class 0.000 claims description 6
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 229920000573 polyethylene Polymers 0.000 claims description 6
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 6
- 238000010526 radical polymerization reaction Methods 0.000 claims description 6
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 claims description 6
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 5
- 229920001665 Poly-4-vinylphenol Polymers 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 5
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 5
- 239000012965 benzophenone Substances 0.000 claims description 5
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 5
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 5
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 5
- 239000011707 mineral Substances 0.000 claims description 5
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 5
- 230000035945 sensitivity Effects 0.000 claims description 5
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 5
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 claims description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 4
- 229910019142 PO4 Inorganic materials 0.000 claims description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 4
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 4
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 4
- 229910000071 diazene Inorganic materials 0.000 claims description 4
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims description 4
- 238000002845 discoloration Methods 0.000 claims description 4
- 239000000975 dye Substances 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 150000002923 oximes Chemical class 0.000 claims description 4
- 239000000123 paper Substances 0.000 claims description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 4
- 239000010452 phosphate Substances 0.000 claims description 4
- 238000000206 photolithography Methods 0.000 claims description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 4
- YBQZXXMEJHZYMB-UHFFFAOYSA-N 1,2-diphenylhydrazine Chemical compound C=1C=CC=CC=1NNC1=CC=CC=C1 YBQZXXMEJHZYMB-UHFFFAOYSA-N 0.000 claims description 3
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical compound C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 claims description 3
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 claims description 3
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 claims description 3
- LLQHSBBZNDXTIV-UHFFFAOYSA-N 6-[5-[[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]methyl]-4,5-dihydro-1,2-oxazol-3-yl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC1CC(=NO1)C1=CC2=C(NC(O2)=O)C=C1 LLQHSBBZNDXTIV-UHFFFAOYSA-N 0.000 claims description 3
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 3
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 claims description 3
- GQGXOUSZTYDZRS-UHFFFAOYSA-N OCCC=C(C(=O)O)C.C(C=1C(C(=O)O)=CC=CC1)(=O)O Chemical compound OCCC=C(C(=O)O)C.C(C=1C(C(=O)O)=CC=CC1)(=O)O GQGXOUSZTYDZRS-UHFFFAOYSA-N 0.000 claims description 3
- HMFBUYDRWWCEGK-UHFFFAOYSA-N OCCCCCCCCCCNC1=NC(=NC(=N1)N)N Chemical compound OCCCCCCCCCCNC1=NC(=NC(=N1)N)N HMFBUYDRWWCEGK-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 3
- KVXNKFYSHAUJIA-UHFFFAOYSA-N acetic acid;ethoxyethane Chemical compound CC(O)=O.CCOCC KVXNKFYSHAUJIA-UHFFFAOYSA-N 0.000 claims description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 230000000172 allergic effect Effects 0.000 claims description 3
- 208000010668 atopic eczema Diseases 0.000 claims description 3
- CJDPJFRMHVXWPT-UHFFFAOYSA-N barium sulfide Chemical compound [S-2].[Ba+2] CJDPJFRMHVXWPT-UHFFFAOYSA-N 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 3
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims description 3
- 239000008112 carboxymethyl-cellulose Substances 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 3
- 238000009792 diffusion process Methods 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 238000005242 forging Methods 0.000 claims description 3
- 239000004615 ingredient Substances 0.000 claims description 3
- 239000012948 isocyanate Substances 0.000 claims description 3
- 150000002513 isocyanates Chemical class 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 239000011976 maleic acid Substances 0.000 claims description 3
- 230000005499 meniscus Effects 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- YNXCGLKMOXLBOD-UHFFFAOYSA-N oxolan-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCCO1 YNXCGLKMOXLBOD-UHFFFAOYSA-N 0.000 claims description 3
- 229950000688 phenothiazine Drugs 0.000 claims description 3
- OJNNAJJFLWBPRS-UHFFFAOYSA-N phenyl-[(2,4,6-trimethylphenyl)methyl]-[(2,4,6-trimethylphenyl)methylidene]phosphanium Chemical compound CC1=C(C=P(C2=CC=CC=C2)=CC2=C(C=C(C=C2C)C)C)C(=CC(=C1)C)C OJNNAJJFLWBPRS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000001294 propane Substances 0.000 claims description 3
- 230000002940 repellent Effects 0.000 claims description 3
- 239000005871 repellent Substances 0.000 claims description 3
- 239000002689 soil Substances 0.000 claims description 3
- 239000001384 succinic acid Substances 0.000 claims description 3
- 238000003786 synthesis reaction Methods 0.000 claims description 3
- 238000001029 thermal curing Methods 0.000 claims description 3
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 claims description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 claims description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 claims description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 2
- GNIJLZHYBVVHMA-UHFFFAOYSA-N 1-decoxypropan-2-ol Chemical compound CCCCCCCCCCOCC(C)O GNIJLZHYBVVHMA-UHFFFAOYSA-N 0.000 claims description 2
- LOLANUHFGPZTLQ-UHFFFAOYSA-N 1-ethoxydecane Chemical compound CCCCCCCCCCOCC LOLANUHFGPZTLQ-UHFFFAOYSA-N 0.000 claims description 2
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 claims description 2
- HFZLSTDPRQSZCQ-UHFFFAOYSA-N 1-pyrrolidin-3-ylpyrrolidine Chemical compound C1CCCN1C1CNCC1 HFZLSTDPRQSZCQ-UHFFFAOYSA-N 0.000 claims description 2
- VEPOHXYIFQMVHW-XOZOLZJESA-N 2,3-dihydroxybutanedioic acid (2S,3S)-3,4-dimethyl-2-phenylmorpholine Chemical compound OC(C(O)C(O)=O)C(O)=O.C[C@H]1[C@@H](OCCN1C)c1ccccc1 VEPOHXYIFQMVHW-XOZOLZJESA-N 0.000 claims description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims description 2
- SZTBMYHIYNGYIA-UHFFFAOYSA-N 2-chloroacrylic acid Chemical compound OC(=O)C(Cl)=C SZTBMYHIYNGYIA-UHFFFAOYSA-N 0.000 claims description 2
- WVRHNZGZWMKMNE-UHFFFAOYSA-N 2-hydroxy-1-[2-(2-methylpropyl)phenyl]-2-phenylethanone Chemical compound CC(C)CC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 WVRHNZGZWMKMNE-UHFFFAOYSA-N 0.000 claims description 2
- NACPTFCBIGBTSJ-UHFFFAOYSA-N 2-hydroxy-2-phenyl-1-(2-propan-2-ylphenyl)ethanone Chemical compound CC(C)C1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 NACPTFCBIGBTSJ-UHFFFAOYSA-N 0.000 claims description 2
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical compound CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 claims description 2
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 claims description 2
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 claims description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 claims description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 2
- IXQBMTJJADIMOS-UHFFFAOYSA-N C(C)(=O)OC(COCCCCCCCCCC)C Chemical compound C(C)(=O)OC(COCCCCCCCCCC)C IXQBMTJJADIMOS-UHFFFAOYSA-N 0.000 claims description 2
- YWKSYOCTPDEBEM-UHFFFAOYSA-N C(C)(=O)OCC(OCC(C)OCCCCCCCCCC)C Chemical compound C(C)(=O)OCC(OCC(C)OCCCCCCCCCC)C YWKSYOCTPDEBEM-UHFFFAOYSA-N 0.000 claims description 2
- DKRNVZNHKMQHAO-UHFFFAOYSA-N C1(=CC=CC=C1)P(C1=CC=CC=C1)=O.CC1=C(C(=CC(=C1)C)C)NN Chemical compound C1(=CC=CC=C1)P(C1=CC=CC=C1)=O.CC1=C(C(=CC(=C1)C)C)NN DKRNVZNHKMQHAO-UHFFFAOYSA-N 0.000 claims description 2
- 229920000298 Cellophane Polymers 0.000 claims description 2
- 229910052684 Cerium Inorganic materials 0.000 claims description 2
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 claims description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 2
- XXRCUYVCPSWGCC-UHFFFAOYSA-N Ethyl pyruvate Chemical compound CCOC(=O)C(C)=O XXRCUYVCPSWGCC-UHFFFAOYSA-N 0.000 claims description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 2
- VDEVQQJXGDBTLB-UHFFFAOYSA-N OC1(CCCCC1)N(N)C1=CC=CC=C1 Chemical compound OC1(CCCCC1)N(N)C1=CC=CC=C1 VDEVQQJXGDBTLB-UHFFFAOYSA-N 0.000 claims description 2
- OFSAUHSCHWRZKM-UHFFFAOYSA-N Padimate A Chemical compound CC(C)CCOC(=O)C1=CC=C(N(C)C)C=C1 OFSAUHSCHWRZKM-UHFFFAOYSA-N 0.000 claims description 2
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 claims description 2
- 206010034960 Photophobia Diseases 0.000 claims description 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229920002472 Starch Polymers 0.000 claims description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000002411 adverse Effects 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 125000006267 biphenyl group Chemical group 0.000 claims description 2
- VFGRALUHHHDIQI-UHFFFAOYSA-N butyl 2-hydroxyacetate Chemical compound CCCCOC(=O)CO VFGRALUHHHDIQI-UHFFFAOYSA-N 0.000 claims description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229930016911 cinnamic acid Natural products 0.000 claims description 2
- 235000013985 cinnamic acid Nutrition 0.000 claims description 2
- 239000004927 clay Substances 0.000 claims description 2
- 238000002485 combustion reaction Methods 0.000 claims description 2
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- 238000003851 corona treatment Methods 0.000 claims description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 claims description 2
- FUGCGCXGFWNOSY-UHFFFAOYSA-N decyl 2-hydroxypropanoate Chemical compound CCCCCCCCCCOC(=O)C(C)O FUGCGCXGFWNOSY-UHFFFAOYSA-N 0.000 claims description 2
- MASUWWUXFOSASS-UHFFFAOYSA-N decyl 2-oxopropanoate Chemical compound CCCCCCCCCCOC(=O)C(C)=O MASUWWUXFOSASS-UHFFFAOYSA-N 0.000 claims description 2
- LCKBBXMOUHMAGA-UHFFFAOYSA-N decyl 3-hydroxypropanoate Chemical compound CCCCCCCCCCOC(=O)CCO LCKBBXMOUHMAGA-UHFFFAOYSA-N 0.000 claims description 2
- RAABOESOVLLHRU-UHFFFAOYSA-N diazene Chemical compound N=N RAABOESOVLLHRU-UHFFFAOYSA-N 0.000 claims description 2
- 238000010790 dilution Methods 0.000 claims description 2
- 239000012895 dilution Substances 0.000 claims description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 claims description 2
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 claims description 2
- GFUIDHWFLMPAGY-UHFFFAOYSA-N ethyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)O GFUIDHWFLMPAGY-UHFFFAOYSA-N 0.000 claims description 2
- ZANNOFHADGWOLI-UHFFFAOYSA-N ethyl 2-hydroxyacetate Chemical compound CCOC(=O)CO ZANNOFHADGWOLI-UHFFFAOYSA-N 0.000 claims description 2
- JLEKJZUYWFJPMB-UHFFFAOYSA-N ethyl 2-methoxyacetate Chemical compound CCOC(=O)COC JLEKJZUYWFJPMB-UHFFFAOYSA-N 0.000 claims description 2
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 claims description 2
- FJAKCEHATXBFJT-UHFFFAOYSA-N ethyl 2-oxobutanoate Chemical compound CCOC(=O)C(=O)CC FJAKCEHATXBFJT-UHFFFAOYSA-N 0.000 claims description 2
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 claims description 2
- UKDLORMZNPQILV-UHFFFAOYSA-N ethyl 3-hydroxypropanoate Chemical compound CCOC(=O)CCO UKDLORMZNPQILV-UHFFFAOYSA-N 0.000 claims description 2
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 claims description 2
- 229940116333 ethyl lactate Drugs 0.000 claims description 2
- 229940117360 ethyl pyruvate Drugs 0.000 claims description 2
- WHRIKZCFRVTHJH-UHFFFAOYSA-N ethylhydrazine Chemical compound CCNN WHRIKZCFRVTHJH-UHFFFAOYSA-N 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 230000004907 flux Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 2
- 208000013469 light sensitivity Diseases 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 claims description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 2
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 claims description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 2
- 235000013336 milk Nutrition 0.000 claims description 2
- 239000008267 milk Substances 0.000 claims description 2
- 210000004080 milk Anatomy 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 239000011088 parchment paper Substances 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- 229920006255 plastic film Polymers 0.000 claims description 2
- 239000002985 plastic film Substances 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000003505 polymerization initiator Substances 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229920001451 polypropylene glycol Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 239000004800 polyvinyl chloride Substances 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 239000002243 precursor Substances 0.000 claims description 2
- QVKOLZOAOSNSHQ-UHFFFAOYSA-N prop-1-ene;prop-2-enoic acid Chemical compound CC=C.OC(=O)C=C QVKOLZOAOSNSHQ-UHFFFAOYSA-N 0.000 claims description 2
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 claims description 2
- ILVGAIQLOCKNQA-UHFFFAOYSA-N propyl 2-hydroxypropanoate Chemical compound CCCOC(=O)C(C)O ILVGAIQLOCKNQA-UHFFFAOYSA-N 0.000 claims description 2
- CYIRLFJPTCUCJB-UHFFFAOYSA-N propyl 2-methoxypropanoate Chemical compound CCCOC(=O)C(C)OC CYIRLFJPTCUCJB-UHFFFAOYSA-N 0.000 claims description 2
- ILPVOWZUBFRIAX-UHFFFAOYSA-N propyl 2-oxopropanoate Chemical compound CCCOC(=O)C(C)=O ILPVOWZUBFRIAX-UHFFFAOYSA-N 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 230000007261 regionalization Effects 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000008107 starch Substances 0.000 claims description 2
- 235000019698 starch Nutrition 0.000 claims description 2
- 125000001424 substituent group Chemical group 0.000 claims description 2
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 claims description 2
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 claims description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 2
- 125000006839 xylylene group Chemical group 0.000 claims description 2
- 239000002585 base Substances 0.000 claims 14
- 235000019441 ethanol Nutrition 0.000 claims 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 8
- 238000001914 filtration Methods 0.000 claims 5
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 claims 4
- BWLBGMIXKSTLSX-UHFFFAOYSA-N 2-hydroxyisobutyric acid Chemical compound CC(C)(O)C(O)=O BWLBGMIXKSTLSX-UHFFFAOYSA-N 0.000 claims 3
- 206010036790 Productive cough Diseases 0.000 claims 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 3
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims 3
- 238000012986 modification Methods 0.000 claims 3
- 230000004048 modification Effects 0.000 claims 3
- XXRMWTWYBZRJCB-UHFFFAOYSA-N oxetane Chemical compound C1COC1.C1COC1 XXRMWTWYBZRJCB-UHFFFAOYSA-N 0.000 claims 3
- WKGDNXBDNLZSKC-UHFFFAOYSA-N oxido(phenyl)phosphanium Chemical compound O=[PH2]c1ccccc1 WKGDNXBDNLZSKC-UHFFFAOYSA-N 0.000 claims 3
- 229910052707 ruthenium Inorganic materials 0.000 claims 3
- 210000003802 sputum Anatomy 0.000 claims 3
- 208000024794 sputum Diseases 0.000 claims 3
- PUNXVEAWLAVABA-UHFFFAOYSA-N 1,2,3,4-tetrahydroanthracene;1,2,5,6-tetrahydroanthracene Chemical compound C1=CC=C2C=C(CCCC3)C3=CC2=C1.C1=CCCC2=C1C=C1CCC=CC1=C2 PUNXVEAWLAVABA-UHFFFAOYSA-N 0.000 claims 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims 2
- YFPJFKYCVYXDJK-UHFFFAOYSA-N Diphenylphosphine oxide Chemical compound C=1C=CC=CC=1[P+](=O)C1=CC=CC=C1 YFPJFKYCVYXDJK-UHFFFAOYSA-N 0.000 claims 2
- 229960000583 acetic acid Drugs 0.000 claims 2
- JEPDZBRVKMGYPR-UHFFFAOYSA-N acetic acid;1-decoxydecane Chemical compound CC(O)=O.CCCCCCCCCCOCCCCCCCCCC JEPDZBRVKMGYPR-UHFFFAOYSA-N 0.000 claims 2
- 125000003158 alcohol group Chemical group 0.000 claims 2
- 125000005577 anthracene group Chemical group 0.000 claims 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims 2
- 239000000460 chlorine Substances 0.000 claims 2
- 238000012937 correction Methods 0.000 claims 2
- 238000001723 curing Methods 0.000 claims 2
- 125000004494 ethyl ester group Chemical group 0.000 claims 2
- 239000004744 fabric Substances 0.000 claims 2
- 239000012530 fluid Substances 0.000 claims 2
- 235000011187 glycerol Nutrition 0.000 claims 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 claims 2
- 238000002347 injection Methods 0.000 claims 2
- 239000007924 injection Substances 0.000 claims 2
- 125000003566 oxetanyl group Chemical group 0.000 claims 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 claims 2
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 claims 2
- BFDRQZUBFIOWOF-UHFFFAOYSA-N tridecane-1,1,1-triol Chemical compound CCCCCCCCCCCCC(O)(O)O BFDRQZUBFIOWOF-UHFFFAOYSA-N 0.000 claims 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 claims 1
- PVKZANLHDRKRQR-UHFFFAOYSA-N (2,4,6-trimethylphenyl)hydrazine Chemical compound CC1=CC(C)=C(NN)C(C)=C1 PVKZANLHDRKRQR-UHFFFAOYSA-N 0.000 claims 1
- PCLLJCFJFOBGDE-UHFFFAOYSA-N (5-bromo-2-chlorophenyl)methanamine Chemical compound NCC1=CC(Br)=CC=C1Cl PCLLJCFJFOBGDE-UHFFFAOYSA-N 0.000 claims 1
- SEPPVOUBHWNCAW-FNORWQNLSA-N (E)-4-oxonon-2-enal Chemical compound CCCCCC(=O)\C=C\C=O SEPPVOUBHWNCAW-FNORWQNLSA-N 0.000 claims 1
- PAAZPARNPHGIKF-UHFFFAOYSA-N 1,2-dibromoethane Chemical compound BrCCBr PAAZPARNPHGIKF-UHFFFAOYSA-N 0.000 claims 1
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical compound C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 claims 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 claims 1
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 claims 1
- MUQYPLLTMWVNSU-UHFFFAOYSA-N 1,6-dimethylcyclohexa-2,4-diene-1-carboxylic acid Chemical compound CC1C=CC=CC1(C)C(O)=O MUQYPLLTMWVNSU-UHFFFAOYSA-N 0.000 claims 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 claims 1
- HUQTUHKXMAKTEH-UHFFFAOYSA-N 1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C(C)C)C=C1 HUQTUHKXMAKTEH-UHFFFAOYSA-N 0.000 claims 1
- IVNRVKTXCZZQHR-UHFFFAOYSA-N 1-[2-(2-ethoxyethoxy)ethoxy]decane Chemical compound CCCCCCCCCCOCCOCCOCC IVNRVKTXCZZQHR-UHFFFAOYSA-N 0.000 claims 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 claims 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 claims 1
- KCPLWWMMVXVWEO-UHFFFAOYSA-N 1h-inden-1-yl prop-2-enoate Chemical compound C1=CC=C2C(OC(=O)C=C)C=CC2=C1 KCPLWWMMVXVWEO-UHFFFAOYSA-N 0.000 claims 1
- GZBSIABKXVPBFY-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GZBSIABKXVPBFY-UHFFFAOYSA-N 0.000 claims 1
- HGUFODBRKLSHSI-UHFFFAOYSA-N 2,3,7,8-tetrachloro-dibenzo-p-dioxin Chemical compound O1C2=CC(Cl)=C(Cl)C=C2OC2=C1C=C(Cl)C(Cl)=C2 HGUFODBRKLSHSI-UHFFFAOYSA-N 0.000 claims 1
- XCBBNTFYSLADTO-UHFFFAOYSA-N 2,3-Octanedione Chemical compound CCCCCC(=O)C(C)=O XCBBNTFYSLADTO-UHFFFAOYSA-N 0.000 claims 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 claims 1
- FRWZCZGRCTVLKW-UHFFFAOYSA-N 2-(1H-inden-1-yl)prop-2-enoic acid Chemical compound C1(C=CC2=CC=CC=C12)C(C(=O)O)=C FRWZCZGRCTVLKW-UHFFFAOYSA-N 0.000 claims 1
- VOHCYMYYOKWUTM-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethanol 3-methylbut-2-enoic acid Chemical compound CC(=CC(=O)O)C.C(COCCO)O VOHCYMYYOKWUTM-UHFFFAOYSA-N 0.000 claims 1
- WRXUDTWIWKJXGI-UHFFFAOYSA-N 2-(but-1-enoxymethyl)oxetane Chemical compound CCC=COCC1OCC1 WRXUDTWIWKJXGI-UHFFFAOYSA-N 0.000 claims 1
- 125000004182 2-chlorophenyl group Chemical group [H]C1=C([H])C(Cl)=C(*)C([H])=C1[H] 0.000 claims 1
- XGAAUANKDSTWFH-UHFFFAOYSA-N 2-hydroxy-1-phenyl-2-sulfanylpropan-1-one Chemical compound OC(C(=O)C1=CC=CC=C1)(C)S XGAAUANKDSTWFH-UHFFFAOYSA-N 0.000 claims 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 claims 1
- BKOOMYPCSUNDGP-UHFFFAOYSA-N 2-methylbut-2-ene Chemical group CC=C(C)C BKOOMYPCSUNDGP-UHFFFAOYSA-N 0.000 claims 1
- WNORZIRJJLYFFF-UHFFFAOYSA-N 2-methylcyclopropan-1-one Chemical compound CC1CC1=O WNORZIRJJLYFFF-UHFFFAOYSA-N 0.000 claims 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 claims 1
- GADSJKKDLMALGL-UHFFFAOYSA-N 2-propylbenzoic acid Chemical compound CCCC1=CC=CC=C1C(O)=O GADSJKKDLMALGL-UHFFFAOYSA-N 0.000 claims 1
- IOZOJWNUKLCDML-UHFFFAOYSA-N 3-bromohexane Chemical compound CCCC(Br)CC IOZOJWNUKLCDML-UHFFFAOYSA-N 0.000 claims 1
- 125000004080 3-carboxypropanoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C(O[H])=O 0.000 claims 1
- CGRJJOYCFCCGPX-UHFFFAOYSA-N 3-ethyloxetane Chemical compound CCC1COC1 CGRJJOYCFCCGPX-UHFFFAOYSA-N 0.000 claims 1
- KXEAZJHCOWBLLF-UHFFFAOYSA-N 3-methyl-3-(3-methylpentan-3-yloxy)pentane Chemical compound CCC(C)(CC)OC(C)(CC)CC KXEAZJHCOWBLLF-UHFFFAOYSA-N 0.000 claims 1
- ZDNPYZVVXJKFNU-UHFFFAOYSA-N 3-methylbut-2-enoic acid propane-1,2-diol Chemical compound CC(=CC(=O)O)C.C(C(C)O)O ZDNPYZVVXJKFNU-UHFFFAOYSA-N 0.000 claims 1
- LLBZPESJRQGYMB-UHFFFAOYSA-N 4-one Natural products O1C(C(=O)CC)CC(C)C11C2(C)CCC(C3(C)C(C(C)(CO)C(OC4C(C(O)C(O)C(COC5C(C(O)C(O)CO5)OC5C(C(OC6C(C(O)C(O)C(CO)O6)O)C(O)C(CO)O5)OC5C(C(O)C(O)C(C)O5)O)O4)O)CC3)CC3)=C3C2(C)CC1 LLBZPESJRQGYMB-UHFFFAOYSA-N 0.000 claims 1
- WDUAYVHCYGZARQ-UHFFFAOYSA-N 4-prop-1-enylmorpholine Chemical compound CC=CN1CCOCC1 WDUAYVHCYGZARQ-UHFFFAOYSA-N 0.000 claims 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 claims 1
- 241001674808 Biastes Species 0.000 claims 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 claims 1
- ZQDMXSUBEAPXMB-UHFFFAOYSA-N C(C(C)C)(=O)C1=CC=CC=2C3=CC=CC=C3CC1=2 Chemical compound C(C(C)C)(=O)C1=CC=CC=2C3=CC=CC=C3CC1=2 ZQDMXSUBEAPXMB-UHFFFAOYSA-N 0.000 claims 1
- OAMKIGMRWWDPTA-UHFFFAOYSA-N C(C)CC#N.C(C(C)O)O Chemical compound C(C)CC#N.C(C(C)O)O OAMKIGMRWWDPTA-UHFFFAOYSA-N 0.000 claims 1
- RDGKVKHUGZVJLZ-UHFFFAOYSA-N C(C)OCC(=O)OCCCCCCCCCC Chemical compound C(C)OCC(=O)OCCCCCCCCCC RDGKVKHUGZVJLZ-UHFFFAOYSA-N 0.000 claims 1
- ZOGLCAJXTCUJEO-UHFFFAOYSA-N C(C=C)(=O)O.C(C1=CC(C(=O)O)=CC=C1)(=O)O Chemical compound C(C=C)(=O)O.C(C1=CC(C(=O)O)=CC=C1)(=O)O ZOGLCAJXTCUJEO-UHFFFAOYSA-N 0.000 claims 1
- DMUBKBNOPIHSOA-UHFFFAOYSA-N C(C=C)(=O)OC1C=CC2=CC=CC=C12.OCC(O)CO Chemical compound C(C=C)(=O)OC1C=CC2=CC=CC=C12.OCC(O)CO DMUBKBNOPIHSOA-UHFFFAOYSA-N 0.000 claims 1
- GHOSPOJBZHBLKS-UHFFFAOYSA-N C(CCCCCCCCC)N(C1=CC=C(C=CC=2SC3=C(N2)C=CC=C3)C=C1)CCCCCCCCCC Chemical compound C(CCCCCCCCC)N(C1=CC=C(C=CC=2SC3=C(N2)C=CC=C3)C=C1)CCCCCCCCCC GHOSPOJBZHBLKS-UHFFFAOYSA-N 0.000 claims 1
- FVKZGRYZRNAQKG-UHFFFAOYSA-N C(CCCCCCCCC)OC(C(=O)OC)(C)C Chemical compound C(CCCCCCCCC)OC(C(=O)OC)(C)C FVKZGRYZRNAQKG-UHFFFAOYSA-N 0.000 claims 1
- NZNDOXNJUYYHTG-UHFFFAOYSA-N CC1=C(C(=CC(=C1)C)C)NNP(C1=CC=CC=C1)(NNC1=C(C=C(C=C1C)C)C)=O Chemical compound CC1=C(C(=CC(=C1)C)C)NNP(C1=CC=CC=C1)(NNC1=C(C=C(C=C1C)C)C)=O NZNDOXNJUYYHTG-UHFFFAOYSA-N 0.000 claims 1
- SSDWNUGUTYAICX-UHFFFAOYSA-N COC(C(=O)OCCCCCCCCCC)C Chemical compound COC(C(=O)OCCCCCCCCCC)C SSDWNUGUTYAICX-UHFFFAOYSA-N 0.000 claims 1
- OAMMJORSYFZNFW-UHFFFAOYSA-N COCC1OCC1.CC=CC Chemical compound COCC1OCC1.CC=CC OAMMJORSYFZNFW-UHFFFAOYSA-N 0.000 claims 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 claims 1
- UJOBWOGCFQCDNV-UHFFFAOYSA-N Carbazole Natural products C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 claims 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 claims 1
- AEMRFAOFKBGASW-UHFFFAOYSA-M Glycolate Chemical compound OCC([O-])=O AEMRFAOFKBGASW-UHFFFAOYSA-M 0.000 claims 1
- 101100537948 Mus musculus Trir gene Proteins 0.000 claims 1
- DOSHUVQQHZHRGQ-UHFFFAOYSA-N OC(=O)C=C.OC(=O)CCC(O)=O.OC(=O)CCC(O)=O Chemical compound OC(=O)C=C.OC(=O)CCC(O)=O.OC(=O)CCC(O)=O DOSHUVQQHZHRGQ-UHFFFAOYSA-N 0.000 claims 1
- CGSLYBDCEGBZCG-UHFFFAOYSA-N Octicizer Chemical compound C=1C=CC=CC=1OP(=O)(OCC(CC)CCCC)OC1=CC=CC=C1 CGSLYBDCEGBZCG-UHFFFAOYSA-N 0.000 claims 1
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- OQMBBFQZGJFLBU-UHFFFAOYSA-N Oxyfluorfen Chemical group C1=C([N+]([O-])=O)C(OCC)=CC(OC=2C(=CC(=CC=2)C(F)(F)F)Cl)=C1 OQMBBFQZGJFLBU-UHFFFAOYSA-N 0.000 claims 1
- VVPSRKQGUXMDDZ-UHFFFAOYSA-N SC(=C(C(=O)O)S)S Chemical compound SC(=C(C(=O)O)S)S VVPSRKQGUXMDDZ-UHFFFAOYSA-N 0.000 claims 1
- DASDMQBESIAPNU-UHFFFAOYSA-N SC(C(=O)O)=C.NC(=O)OCC Chemical compound SC(C(=O)O)=C.NC(=O)OCC DASDMQBESIAPNU-UHFFFAOYSA-N 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- XBDYBAVJXHJMNQ-UHFFFAOYSA-N Tetrahydroanthracene Natural products C1=CC=C2C=C(CCCC3)C3=CC2=C1 XBDYBAVJXHJMNQ-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims 1
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 claims 1
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 1
- 239000003513 alkali Substances 0.000 claims 1
- 150000003863 ammonium salts Chemical class 0.000 claims 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 claims 1
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 claims 1
- 230000033558 biomineral tissue development Effects 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical group [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 239000010866 blackwater Substances 0.000 claims 1
- 229930006711 bornane-2,3-dione Natural products 0.000 claims 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical group CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 claims 1
- XKLVLDXNZDIDKQ-UHFFFAOYSA-N butylhydrazine Chemical compound CCCCNN XKLVLDXNZDIDKQ-UHFFFAOYSA-N 0.000 claims 1
- 229930188620 butyrolactone Natural products 0.000 claims 1
- BKRRPNHAJPONSH-UHFFFAOYSA-N carbazole Chemical compound C1=CC=C2[C]3C=CC=CC3=NC2=C1 BKRRPNHAJPONSH-UHFFFAOYSA-N 0.000 claims 1
- 239000011045 chalcedony Substances 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 125000001309 chloro group Chemical group Cl* 0.000 claims 1
- 235000009508 confectionery Nutrition 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 230000001186 cumulative effect Effects 0.000 claims 1
- IJXOTFQNCKFWBH-UHFFFAOYSA-N cyanic acid;phenol Chemical compound OC#N.OC1=CC=CC=C1.OC1=CC=CC=C1 IJXOTFQNCKFWBH-UHFFFAOYSA-N 0.000 claims 1
- 229940109275 cyclamate Drugs 0.000 claims 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 claims 1
- BMFYCFSWWDXEPB-UHFFFAOYSA-N cyclohexyl(phenyl)methanone Chemical compound C=1C=CC=CC=1C(=O)C1CCCCC1 BMFYCFSWWDXEPB-UHFFFAOYSA-N 0.000 claims 1
- HCAJEUSONLESMK-UHFFFAOYSA-N cyclohexylsulfamic acid Chemical compound OS(=O)(=O)NC1CCCCC1 HCAJEUSONLESMK-UHFFFAOYSA-N 0.000 claims 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 claims 1
- INSRQEMEVAMETL-UHFFFAOYSA-N decane-1,1-diol Chemical compound CCCCCCCCCC(O)O INSRQEMEVAMETL-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 claims 1
- 235000014113 dietary fatty acids Nutrition 0.000 claims 1
- 229940105990 diglycerin Drugs 0.000 claims 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 claims 1
- 150000002009 diols Chemical class 0.000 claims 1
- 238000007598 dipping method Methods 0.000 claims 1
- 229930004069 diterpene Natural products 0.000 claims 1
- 150000004141 diterpene derivatives Chemical class 0.000 claims 1
- 239000012776 electronic material Substances 0.000 claims 1
- XSQNOFMFKVYSNL-UHFFFAOYSA-N ethene;toluene Chemical group C=C.CC1=CC=CC=C1 XSQNOFMFKVYSNL-UHFFFAOYSA-N 0.000 claims 1
- 125000001033 ether group Chemical group 0.000 claims 1
- WNIHNYUROPJCLW-UHFFFAOYSA-N ethyl 2-ethoxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)OCC WNIHNYUROPJCLW-UHFFFAOYSA-N 0.000 claims 1
- 239000000194 fatty acid Substances 0.000 claims 1
- 229930195729 fatty acid Natural products 0.000 claims 1
- 239000006260 foam Substances 0.000 claims 1
- 150000002314 glycerols Chemical class 0.000 claims 1
- 125000005842 heteroatom Chemical group 0.000 claims 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- 229910003437 indium oxide Inorganic materials 0.000 claims 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims 1
- 238000011835 investigation Methods 0.000 claims 1
- 125000000468 ketone group Chemical group 0.000 claims 1
- 210000003127 knee Anatomy 0.000 claims 1
- 238000002372 labelling Methods 0.000 claims 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims 1
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 claims 1
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 claims 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 claims 1
- GRVDJDISBSALJP-UHFFFAOYSA-N methyloxidanyl Chemical group [O]C GRVDJDISBSALJP-UHFFFAOYSA-N 0.000 claims 1
- SWHDGPGIOJSZEX-UHFFFAOYSA-N n-(4,6-diamino-1,3,5-triazin-2-yl)thiohydroxylamine Chemical compound NC1=NC(N)=NC(NS)=N1 SWHDGPGIOJSZEX-UHFFFAOYSA-N 0.000 claims 1
- BHFJQXAFTZBCCB-UHFFFAOYSA-N n-[2-[(2-amino-2-oxoethyl)-(3,3-diphenylpropyl)amino]-2-oxoethyl]-n-(3,3-diphenylpropyl)-2-(oxolan-2-ylmethylamino)acetamide Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)CCN(C(=O)CNCC1OCCC1)CC(=O)N(CC(=O)N)CCC(C=1C=CC=CC=1)C1=CC=CC=C1 BHFJQXAFTZBCCB-UHFFFAOYSA-N 0.000 claims 1
- AFFLGGQVNFXPEV-UHFFFAOYSA-N n-decene Natural products CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 claims 1
- BHYJMUFNVQBDRC-UHFFFAOYSA-N n-sulfanylprop-2-enamide Chemical compound SNC(=O)C=C BHYJMUFNVQBDRC-UHFFFAOYSA-N 0.000 claims 1
- OEDAJYOQELMMFC-UHFFFAOYSA-N octadecanoic acid;prop-2-enoic acid Chemical compound OC(=O)C=C.CCCCCCCCCCCCCCCCCC(O)=O OEDAJYOQELMMFC-UHFFFAOYSA-N 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 125000000466 oxiranyl group Chemical group 0.000 claims 1
- 150000002926 oxygen Chemical class 0.000 claims 1
- IWQPFENGXVKSDO-UHFFFAOYSA-N phenol;2h-thiazine Chemical compound N1SC=CC=C1.OC1=CC=CC=C1 IWQPFENGXVKSDO-UHFFFAOYSA-N 0.000 claims 1
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 claims 1
- 238000004321 preservation Methods 0.000 claims 1
- GMSYQCGRYWQGHA-UHFFFAOYSA-N prop-1-ene-2-thiol Chemical compound CC(S)=C GMSYQCGRYWQGHA-UHFFFAOYSA-N 0.000 claims 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 claims 1
- FAIDIRVMPHBRLT-UHFFFAOYSA-N propane-1,2,3-triol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OCC(O)CO FAIDIRVMPHBRLT-UHFFFAOYSA-N 0.000 claims 1
- LYNBNVDYPNEWHG-UHFFFAOYSA-N propanesulfenic acid Chemical compound CCCSO LYNBNVDYPNEWHG-UHFFFAOYSA-N 0.000 claims 1
- DHGFMVMDBNLMKT-UHFFFAOYSA-N propyl 3-oxobutanoate Chemical compound CCCOC(=O)CC(C)=O DHGFMVMDBNLMKT-UHFFFAOYSA-N 0.000 claims 1
- TYRGSDXYMNTMML-UHFFFAOYSA-N propyl hydrogen sulfate Chemical compound CCCOS(O)(=O)=O TYRGSDXYMNTMML-UHFFFAOYSA-N 0.000 claims 1
- WHFQAROQMWLMEY-UHFFFAOYSA-N propylene dimer Chemical group CC=C.CC=C WHFQAROQMWLMEY-UHFFFAOYSA-N 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 241000894007 species Species 0.000 claims 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- 239000012085 test solution Substances 0.000 claims 1
- XOALFFJGWSCQEO-UHFFFAOYSA-N tridecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C=C XOALFFJGWSCQEO-UHFFFAOYSA-N 0.000 claims 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000001117 sulphuric acid Substances 0.000 description 6
- 235000011149 sulphuric acid Nutrition 0.000 description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 150000002576 ketones Chemical class 0.000 description 3
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 3
- OWPUOLBODXJOKH-UHFFFAOYSA-N 2,3-dihydroxypropyl prop-2-enoate Chemical compound OCC(O)COC(=O)C=C OWPUOLBODXJOKH-UHFFFAOYSA-N 0.000 description 2
- ZDJPTLICZYRDQA-UHFFFAOYSA-N 2,3-diphenylfluoren-1-one Chemical compound O=C1C2=CC3=CC=CC=C3C2=CC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 ZDJPTLICZYRDQA-UHFFFAOYSA-N 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- KXDAEFPNCMNJSK-UHFFFAOYSA-N Benzamide Chemical compound NC(=O)C1=CC=CC=C1 KXDAEFPNCMNJSK-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 150000001241 acetals Chemical class 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 2
- 229940018557 citraconic acid Drugs 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N sec-butylidene Natural products CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 2
- VTRHYFDNOLMPHD-UHFFFAOYSA-N (1-prop-2-enoyloxycyclohexyl) prop-2-enoate Chemical compound C=CC(=O)OC1(OC(=O)C=C)CCCCC1 VTRHYFDNOLMPHD-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- DSSYKIVIOFKYAU-XCBNKYQSSA-N (R)-camphor Chemical compound C1C[C@@]2(C)C(=O)C[C@@H]1C2(C)C DSSYKIVIOFKYAU-XCBNKYQSSA-N 0.000 description 1
- OTBHDFWQZHPNPU-UHFFFAOYSA-N 1,2,3,4-tetrahydroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1CCCC2 OTBHDFWQZHPNPU-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- JWTGRKUQJXIWCV-UHFFFAOYSA-N 1,2,3-trihydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(O)C(O)CO JWTGRKUQJXIWCV-UHFFFAOYSA-N 0.000 description 1
- YQBKVGJYMFZJRZ-UHFFFAOYSA-N 1-(9h-carbazol-3-yl)-2-(dimethylamino)-2-methylpropan-1-one Chemical compound C1=CC=C2C3=CC(C(=O)C(C)(C)N(C)C)=CC=C3NC2=C1 YQBKVGJYMFZJRZ-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- LDJNYVFOXUBIIF-UHFFFAOYSA-N 1-prop-1-enyl-9H-fluorene Chemical group C(=CC)C1=CC=CC=2C3=CC=CC=C3CC12 LDJNYVFOXUBIIF-UHFFFAOYSA-N 0.000 description 1
- HGWZSJBCZYDDHY-UHFFFAOYSA-N 1-prop-2-enoyloxydecyl prop-2-enoate Chemical compound CCCCCCCCCC(OC(=O)C=C)OC(=O)C=C HGWZSJBCZYDDHY-UHFFFAOYSA-N 0.000 description 1
- UGKBGCHAJWVQTL-UHFFFAOYSA-N 1-propan-2-yl-1,3,5-triazinane-2,4,6-trione Chemical compound CC(C)N1C(=O)NC(=O)NC1=O UGKBGCHAJWVQTL-UHFFFAOYSA-N 0.000 description 1
- GKZPEYIPJQHPNC-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GKZPEYIPJQHPNC-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 1
- NTKHHJVTDRZJCL-UHFFFAOYSA-N 2,4-diethylthiazine 1-oxide Chemical compound C(C)N1S(C=CC(=C1)CC)=O NTKHHJVTDRZJCL-UHFFFAOYSA-N 0.000 description 1
- JONNRYNDZVEZFH-UHFFFAOYSA-N 2-(2-butoxypropoxy)propyl acetate Chemical compound CCCCOC(C)COC(C)COC(C)=O JONNRYNDZVEZFH-UHFFFAOYSA-N 0.000 description 1
- ASRPERSRLFXPEG-UHFFFAOYSA-N 2-(2-decoxyethoxy)ethyl acetate Chemical compound CCCCCCCCCCOCCOCCOC(C)=O ASRPERSRLFXPEG-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- GDHROTCPZLVPJT-UHFFFAOYSA-N 2-ethyloxetane Chemical compound CCC1CCO1 GDHROTCPZLVPJT-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- MUZDXNQOSGWMJJ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(=C)C(O)=O MUZDXNQOSGWMJJ-UHFFFAOYSA-N 0.000 description 1
- LHBIDSSFXMLROF-UHFFFAOYSA-N 2-n-decyl-1,3,5-triazine-2,4,6-triamine Chemical compound CCCCCCCCCCNC1=NC(N)=NC(N)=N1 LHBIDSSFXMLROF-UHFFFAOYSA-N 0.000 description 1
- QJVYRYDARHKQAF-UHFFFAOYSA-N 3,3-dimethyl-2-methylidenebutanoic acid Chemical compound CC(C)(C)C(=C)C(O)=O QJVYRYDARHKQAF-UHFFFAOYSA-N 0.000 description 1
- PKXHXOTZMFCXSH-UHFFFAOYSA-N 3,3-dimethylbut-1-ene Chemical compound CC(C)(C)C=C PKXHXOTZMFCXSH-UHFFFAOYSA-N 0.000 description 1
- 125000004207 3-methoxyphenyl group Chemical group [H]C1=C([H])C(*)=C([H])C(OC([H])([H])[H])=C1[H] 0.000 description 1
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 1
- VNPACAZBLCBWJB-UHFFFAOYSA-N 4-hydroxy-2-methylidenebutanoic acid;phthalic acid Chemical group OCCC(=C)C(O)=O.OC(=O)C1=CC=CC=C1C(O)=O VNPACAZBLCBWJB-UHFFFAOYSA-N 0.000 description 1
- LRTYITKCGRCETJ-UHFFFAOYSA-N 4-propan-2-yl-4H-oxazin-3-one Chemical compound C(C)(C)C1C(NOC=C1)=O LRTYITKCGRCETJ-UHFFFAOYSA-N 0.000 description 1
- YYVYAPXYZVYDHN-UHFFFAOYSA-N 9,10-phenanthroquinone Chemical compound C1=CC=C2C(=O)C(=O)C3=CC=CC=C3C2=C1 YYVYAPXYZVYDHN-UHFFFAOYSA-N 0.000 description 1
- BZSIWYJQHRXAHQ-UHFFFAOYSA-N C(C)C=C(C(=O)O)C.C(C(=C)C)(=O)OC Chemical compound C(C)C=C(C(=O)O)C.C(C(=C)C)(=O)OC BZSIWYJQHRXAHQ-UHFFFAOYSA-N 0.000 description 1
- HEEVKFAEPROORV-UHFFFAOYSA-N C1(=CC=CC=C1)P(=CC1=C(C=C(C=C1S)S)S)C1=CC=CC=C1 Chemical compound C1(=CC=CC=C1)P(=CC1=C(C=C(C=C1S)S)S)C1=CC=CC=C1 HEEVKFAEPROORV-UHFFFAOYSA-N 0.000 description 1
- CXPCBDKAKRUACH-UHFFFAOYSA-N C1=CC=CC2=NC3=CC=CC=C3N=C12.S1NC=CC=C1 Chemical compound C1=CC=CC2=NC3=CC=CC=C3N=C12.S1NC=CC=C1 CXPCBDKAKRUACH-UHFFFAOYSA-N 0.000 description 1
- ACFZWYXIENXRMX-UHFFFAOYSA-N COCC1OCC1.C=CC Chemical compound COCC1OCC1.C=CC ACFZWYXIENXRMX-UHFFFAOYSA-N 0.000 description 1
- 241000723346 Cinnamomum camphora Species 0.000 description 1
- 244000241257 Cucumis melo Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 1
- 239000005947 Dimethoate Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- XOBKSJJDNFUZPF-UHFFFAOYSA-N Methoxyethane Chemical compound CCOC XOBKSJJDNFUZPF-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- AONSXJNYYZLWGK-UHFFFAOYSA-N N-propan-2-yl-N-sulfanylprop-2-enamide Chemical compound CC(C)N(C(=O)C=C)S AONSXJNYYZLWGK-UHFFFAOYSA-N 0.000 description 1
- FASHSUGJNGEDIX-JEDNCBNOSA-N N[C@@H](CCCCN)C(=O)O.N1=C(N)N=C(N)N=C1N Chemical compound N[C@@H](CCCCN)C(=O)O.N1=C(N)N=C(N)N=C1N FASHSUGJNGEDIX-JEDNCBNOSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- OJVLLMVMIQGQOU-UHFFFAOYSA-N OC(C(=O)OCCCCCCCCCC)(C)S Chemical compound OC(C(=O)OCCCCCCCCCC)(C)S OJVLLMVMIQGQOU-UHFFFAOYSA-N 0.000 description 1
- RDNVHQZCLORQEI-UHFFFAOYSA-N OS(O)(=O)=O.C1CCCCC1 Chemical compound OS(O)(=O)=O.C1CCCCC1 RDNVHQZCLORQEI-UHFFFAOYSA-N 0.000 description 1
- 241000283973 Oryctolagus cuniculus Species 0.000 description 1
- QVHMSMOUDQXMRS-UHFFFAOYSA-N PPG n4 Chemical compound CC(O)COC(C)COC(C)COC(C)CO QVHMSMOUDQXMRS-UHFFFAOYSA-N 0.000 description 1
- RMUCZJUITONUFY-UHFFFAOYSA-N Phenelzine Chemical compound NNCCC1=CC=CC=C1 RMUCZJUITONUFY-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- HPIRLDFEOOMFQW-UHFFFAOYSA-N S(=O)(=O)(OCCCC)OCCOCCO Chemical compound S(=O)(=O)(OCCCC)OCCOCCO HPIRLDFEOOMFQW-UHFFFAOYSA-N 0.000 description 1
- 229930182558 Sterol Natural products 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- ZZAGLMPBQOKGGT-UHFFFAOYSA-N [4-[4-(4-prop-2-enoyloxybutoxy)benzoyl]oxyphenyl] 4-(4-prop-2-enoyloxybutoxy)benzoate Chemical compound C1=CC(OCCCCOC(=O)C=C)=CC=C1C(=O)OC(C=C1)=CC=C1OC(=O)C1=CC=C(OCCCCOC(=O)C=C)C=C1 ZZAGLMPBQOKGGT-UHFFFAOYSA-N 0.000 description 1
- DVDFZRWPGZSAJU-UHFFFAOYSA-M [H]O[Er] Chemical group [H]O[Er] DVDFZRWPGZSAJU-UHFFFAOYSA-M 0.000 description 1
- OHBRHBQMHLEELN-UHFFFAOYSA-N acetic acid;1-butoxybutane Chemical compound CC(O)=O.CCCCOCCCC OHBRHBQMHLEELN-UHFFFAOYSA-N 0.000 description 1
- PFLUPZGCTVGDLV-UHFFFAOYSA-N acetone azine Chemical compound CC(C)=NN=C(C)C PFLUPZGCTVGDLV-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229930013930 alkaloid Natural products 0.000 description 1
- 150000003797 alkaloid derivatives Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000004653 anthracenylene group Chemical group 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- DVQGYGDSAGBRSZ-UHFFFAOYSA-N bis(1-cyclohexylcyclohexa-2,4-dien-1-yl)methanone Chemical compound C1C=CC=CC1(C1CCCCC1)C(=O)C1(C2CCCCC2)CC=CC=C1 DVQGYGDSAGBRSZ-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical group CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- KJSBSGZUHNSSHP-UHFFFAOYSA-N butanedioic acid hex-1-ene Chemical compound C(CCC(=O)O)(=O)O.C=CCCCC KJSBSGZUHNSSHP-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 229960000846 camphor Drugs 0.000 description 1
- 229930008380 camphor Natural products 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 235000001671 coumarin Nutrition 0.000 description 1
- 229960000956 coumarin Drugs 0.000 description 1
- SGVUUNQVSWNFJH-UHFFFAOYSA-N cyclohexane;ethane Chemical compound CC.C1CCCCC1 SGVUUNQVSWNFJH-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- KLHUXPWKQXDWMU-UHFFFAOYSA-N decyl 2-ethoxypropanoate Chemical compound C(C)OC(C(=O)OCCCCCCCCCC)C KLHUXPWKQXDWMU-UHFFFAOYSA-N 0.000 description 1
- GTIPOIHUAWNHMQ-UHFFFAOYSA-N decyl 2-hydroxyacetate Chemical compound CCCCCCCCCCOC(=O)CO GTIPOIHUAWNHMQ-UHFFFAOYSA-N 0.000 description 1
- GTBGXKPAKVYEKJ-UHFFFAOYSA-N decyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C(C)=C GTBGXKPAKVYEKJ-UHFFFAOYSA-N 0.000 description 1
- BLXHQQJXEQQIHE-UHFFFAOYSA-N decyl 3-ethoxypropanoate Chemical compound CCCCCCCCCCOC(=O)CCOCC BLXHQQJXEQQIHE-UHFFFAOYSA-N 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 125000006612 decyloxy group Chemical group 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- MCWXGJITAZMZEV-UHFFFAOYSA-N dimethoate Chemical compound CNC(=O)CSP(=S)(OC)OC MCWXGJITAZMZEV-UHFFFAOYSA-N 0.000 description 1
- 229940113088 dimethylacetamide Drugs 0.000 description 1
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- DBLVXHJTZIDGHE-UHFFFAOYSA-N ethyl acetate;2-(2-hydroxyethoxy)ethanol Chemical compound CCOC(C)=O.OCCOCCO DBLVXHJTZIDGHE-UHFFFAOYSA-N 0.000 description 1
- CNEKKZXYBHKSDC-UHFFFAOYSA-N ethyl acetate;propane-1,2-diol Chemical compound CC(O)CO.CCOC(C)=O CNEKKZXYBHKSDC-UHFFFAOYSA-N 0.000 description 1
- MHCLJIVVJQQNKQ-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical compound CCOC(N)=O.CC(=C)C(O)=O MHCLJIVVJQQNKQ-UHFFFAOYSA-N 0.000 description 1
- 230000004992 fission Effects 0.000 description 1
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000005456 glyceride group Chemical group 0.000 description 1
- 229940075529 glyceryl stearate Drugs 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 125000001041 indolyl group Chemical group 0.000 description 1
- 235000013847 iso-butane Nutrition 0.000 description 1
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- PPFNAOBWGRMDLL-UHFFFAOYSA-N methyl 2-ethoxyacetate Chemical compound CCOCC(=O)OC PPFNAOBWGRMDLL-UHFFFAOYSA-N 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 1
- 230000001089 mineralizing effect Effects 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- HDZGCSFEDULWCS-UHFFFAOYSA-N monomethylhydrazine Chemical compound CNN HDZGCSFEDULWCS-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229960000964 phenelzine Drugs 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- WNCPVNLMXSZBLP-UHFFFAOYSA-H phthalate ruthenium(3+) Chemical compound C(C=1C(C(=O)[O-])=CC=CC1)(=O)[O-].[Ru+3].C(C=1C(C(=O)[O-])=CC=CC1)(=O)[O-].C(C=1C(C(=O)[O-])=CC=CC1)(=O)[O-].[Ru+3] WNCPVNLMXSZBLP-UHFFFAOYSA-H 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- SUVIGLJNEAMWEG-UHFFFAOYSA-N propane-1-thiol Chemical compound CCCS SUVIGLJNEAMWEG-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 150000003180 prostaglandins Chemical class 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003304 ruthenium compounds Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 235000003702 sterols Nutrition 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- AGNPPWAGEICIGZ-UHFFFAOYSA-N strontium tin Chemical compound [Sr].[Sn] AGNPPWAGEICIGZ-UHFFFAOYSA-N 0.000 description 1
- SEEPANYCNGTZFQ-UHFFFAOYSA-N sulfadiazine Chemical compound C1=CC(N)=CC=C1S(=O)(=O)NC1=NC=CC=N1 SEEPANYCNGTZFQ-UHFFFAOYSA-N 0.000 description 1
- BGKZULDOBMANRY-UHFFFAOYSA-N sulfanyl prop-2-enoate Chemical compound SOC(=O)C=C BGKZULDOBMANRY-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 150000003648 triterpenes Chemical class 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
Description
201016799 六、發明說明: 【發明所屬之技術領域】 本發明是關於一種用於製造液晶顯示元件、el (Electro-Luminescence,電致發光)顯示元件、印刷配線 基板(printed circuit board )等的噴墨(ink jet)用墨水。 而且本發明是關於一種由該喷墨用墨水所得的硬化膜(包 括經圖案化的硬化膜)、硬化膜形成方法、及形成有硬化膜 的電子電路基板、電子零件、顯示元件。 馨 【先前技術】 與光微影(photolithography)法相比,利用喷墨法的 圖案形成不但步驟變得簡單,而且亦可期待減少材料的使 用量,因此提出用於製造電子設備中所使用的印刷配線版 等(例如參照日本專利特開2〇〇3_3〇2642號公報(專利文 獻1 )、日本專利特開2005-68280號公報(專利文獻2))。 近年來,往電子設備的小型化發展,使用輕量且可撓 性(flexible)的印刷配線板的電子電路基板得到較多使 > 用。上述電子電路基板例如藉由抗_ (etching , ❹ 形成具有特定電路圖案的金屬配線部,其後經過利用抗鍍 敷劑的錄敷圖案製作、及對作為保護金屬層表面的保護膜 的覆蓋層(c〇veriay)進行塗佈(c〇ating)的步驟而製作。 —藉由噴墨法實施這些步驟時,要求噴墨用墨水的保存 穩定f·生’並要求穩定的墨水喷出性。而且,由喷墨用墨水 所形成的硬化赚據各墨水㈣而要求各種性能。 例如對於形成用於抗蝕用途的喷墨用墨水的硬化膜 4 201016799 •My43pll |要求對剝離液的剝離 而吕’要求對金屬餘刻液的耐性, 性。 ,對於形成用於抗鑛敷用途的嘴墨用墨水的硬化 = 鍍敷液的雜’且絲對_㈣剝離性。 =如對於形於覆蓋層用途㈣㈣墨水的硬化 膜而5,要求雜敷㈣耐性,且要求焊錫耐轨性。201016799 6. Technical Field of the Invention The present invention relates to an inkjet for manufacturing a liquid crystal display element, an el (Electro-Luminescence) display element, a printed circuit board, or the like. (ink jet) with ink. Further, the present invention relates to a cured film (including a patterned cured film) obtained by the inkjet ink, a cured film forming method, and an electronic circuit board, an electronic component, and a display element on which a cured film is formed.馨 [Prior Art] Compared with the photolithography method, the pattern formation by the inkjet method is not only simple, but also expected to reduce the amount of material used, and thus it is proposed to be used for manufacturing electronic equipment. For example, Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. 2005-68280 (Patent Document 2). In recent years, the development of miniaturization of electronic devices has led to the use of electronic circuit boards using lightweight and flexible printed wiring boards. The electronic circuit board is formed by, for example, etching a metal wiring portion having a specific circuit pattern, and then forming a coating layer using a plating resist and a protective layer as a protective film on the surface of the protective metal layer. (c〇veriay) is produced by the step of coating. When these steps are carried out by the inkjet method, storage of the ink for inkjet is required to be stable and a stable ink discharge property is required. Further, the hardening by the inkjet ink yields various properties depending on the ink (4). For example, a cured film 4 for forming an inkjet ink for resist use 201016799 • My43pll | requires peeling of the peeling liquid 'Requires resistance to metal remnant, properties. For the formation of ink for nozzle ink for anti-mineral application, the hardness of the plating solution = the miscellaneous of the plating solution and the wire-to-four peelability. Use (4) (4) Hardened film of ink 5, requires hybrid (4) resistance, and requires solder resistance.
一上而接先=噴墨用墨水的硬化膜由於上述性能的任 :夕不充刀’因此僅為不適於實際應用的硬化膜。 [專利文獻1]日本專利特開2003_302642號公報 [專利文獻2]日本專利特開2〇〇5_6828〇號公報 [專利文獻3]曰本專利特開2〇〇8 5〇6〇1號公報 [專利文獻4]日本專利特開平9_183929號公 【發明内容】 [發明所欲解決之問題] 於上述狀況下’例如要求墨水的保存穩定性優異的喷 墨用墨水。而且,例如要求可實現穩定喷出的喷墨用墨水: 於是’於將噴墨用墨水製成硬化膜時,要求如下噴墨用墨 水例如於抗蚀用途時,具有對金屬钱刻液的耐性及對剝 離液的剝雜^且,例如於紐敷麟時,具有對鍍敷 ^的耐性及對___性;此外,例如於覆蓋層用途 時’具有雜敷液的耐性及烊錫_性。另外,要求可靠 性較高的可撓性配線板。 [解決問題之手段] 本發明者等人發現,若於喷墨用墨水中使用具有特定 5 201016799 ^Ι^Η^ριι 了構的自由基聚合性單體(A),則可有效地處理上述問 基於該見解而完成了本發明,即本發明是關於一種包 二1由ΐ聚合性單體(A)、具有熱反應性官能基的自由基 =性單體(Β)、光聚合起始劑⑹、及熱反應性樹脂⑼ 墨用墨水。本發明提供如下的喷墨用墨水、由喷墨用 墨水所得的硬化歧其形成方法等。 環狀^噴㈣墨水,其包含:含有大於等於5員環的 自由美平Ah ^聚合性單體(Α)、具有減應性官能基的 樹脂3)°。·生單體(B)、光聚合起始劑(〇、及熱反應性 ]如上述[1]所述之喷墨用墨水苴 員環的環狀_自由基聚合^3 於專於5 表示的化合物:叫體⑷是以通式⑷所 R1 H2C==C—C—〇__R2__r3The cured film of the inkjet ink is only a hardened film which is not suitable for practical use because of the above properties. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-302642 [Patent Document 2] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. [Problem to be Solved by the Invention] Under the above circumstances, for example, an inkjet ink excellent in storage stability of ink is required. Further, for example, an inkjet ink that can stably eject is required: Thus, when the inkjet ink is made into a cured film, the following inkjet ink is required to have resistance to metal money, for example, when used for resisting. And the stripping of the stripping liquid, and, for example, in the case of New Zealand Lin, has resistance to plating and ___ property; in addition, for example, in the case of a coating layer, 'having resistance to a mixed liquid and tin strontium _ Sex. In addition, a flexible wiring board with high reliability is required. [Means for Solving the Problem] The present inventors have found that the use of the radical polymerizable monomer (A) having a specific 5 201016799 ^Ι^Η^ριι structure in the ink for inkjet can effectively handle the above The present invention has been completed on the basis of this finding, that is, the present invention relates to a package of a polymerizable monomer (A), a radical having a thermally reactive functional group (a), a photopolymerization initiation. Agent (6), and heat-reactive resin (9) Ink ink. The present invention provides the following inkjet ink, a method of forming a hardened ink obtained by using the inkjet ink, and the like. The ring-shaped (four) ink comprises: a freemethine Ah ^ polymerizable monomer (Α) having a ring of 5 or more members, and a resin having an allergic functional group 3) °. - Raw monomer (B), photopolymerization initiator (〇, and thermal reactivity) The cyclic-radical polymerization of the inkjet ink employee ring of the above [1] is specified for 5 Compound: (4) is R1 H2C==C—C—〇__R2__r3 according to formula (4)
A (A)A (A)
(於通式(A)中,RU r為可具有分支結構的碳數為二的燒基, 支結構的碳數為2〜5的 3的伸料或可具有分 烧基取代的氧數為丨或2的大於為可被,數為1〜3的 [3]如上述[2]所述之噴墨用、里於5員環的環狀鰱)。 R1為氫、曱基或乙基,R2為其中於通式(A)中, 可被魏為1〜3的燒基取代的^ 1〜3 _燒基,¥為 員環的環狀醚。 、氣數為1或2的5員環或6 201016799 [4]如上述[2]所述之噴墨用墨水,其 ,為氫或曱基,R2為亞曱基,R3為氧數為二;匕)1, 狀驗。 的5貝%的環 [5]如上述[2]所述之喷墨用墨水,其 W為氫或甲基,R、亞甲基,r3為被碳數為通;=)中其 取代的氧數為2的ό員環的環狀醚。 ’、、、 、、元基(In the general formula (A), RU r is a carbon group having a branched structure and having a carbon number of 2, and a branch having a carbon number of 2 to 5 in the branched structure or an oxygen having a divided alkyl group may be [3] [3] The inkjet for the inkjet according to the above [2], and the ring-shaped crucible of the 5-membered ring). R1 is hydrogen, a mercapto group or an ethyl group, and R2 is a cyclic ether in which a group of the formula (A) which can be substituted with a group of 1 to 3, and a ring of a ring of a ring. The ink for inkjet according to the above [2], which is hydrogen or a mercapto group, R2 is an anthracenylene group, and R3 is an oxygen number of two;匕) 1, test. The ink of the inkjet according to the above [2], wherein W is hydrogen or methyl, R, methylene, and r3 are carbon atoms; A cyclic ether of the oxime ring having an oxygen number of 2. ',,,,, yuan base
目^Λ6]如上述[1]至[5]中任—項所述之喷墨用墨水,其中 /、有,、,、反應性官能基的自由基聚合性單體(Β)具有選自 由羥基、縣、環氧乙⑥(Gxi_ )及氧雜環丁烧(。諭狀) 所組成族群中的熱反應性官能基。 [7]如上述[1]至[5]中任一項所述之噴墨用墨水,其中 具有熱反應性官能基的自由基聚合性單體(B)具有經基 或羧基的熱交聯性官能基。 [8] 如上述[1]至[7]中任一項所述之噴墨用墨水,其中 具有熱反應性官能基的自由基聚合性單體(B)具有1個 熱反應性官能基。 [9] 如上述[1]至[8]中任一項所述之喷墨用墨水,其中 具有熱反應性官能基的自由基聚合性單體(B)是以通式 (B-1)或(B-2)所表示的化合物: 201016799The inkjet ink according to any one of the above-mentioned [1], wherein the radically polymerizable monomer (/) having a reactive functional group is selected from the group consisting of A thermally reactive functional group in the group consisting of hydroxy, county, epoxy 6 (Gxi_), and oxetane (?). [7] The inkjet ink according to any one of [1] to [5] wherein the radically polymerizable monomer (B) having a thermally reactive functional group has a thermal crosslinking of a base group or a carboxyl group. Sex functional group. [8] The inkjet ink according to any one of [1] to [7] wherein the radically polymerizable monomer (B) having a thermally reactive functional group has one thermally reactive functional group. [9] The inkjet ink according to any one of [1] to [8] wherein the radically polymerizable monomer (B) having a thermally reactive functional group is a formula (B-1) Or the compound represented by (B-2): 201016799
r5-〇 (B-1) h2c=c—c—〇R5-〇 (B-1) h2c=c-c-〇
II oII o
H2C——c—H2C——c-
COOH (B-2) (於通式(B-1)及(B-2)巾,R4分別獨立地為氮或 碳數為1〜3眺基,Μ分翻立地為可具有環狀結構的 碳數為2〜12的伸烷基,n為丨〜3〇的整數)。 [10]如上述[1]至[5]中任一項所述之噴墨用墨水,其中 具有熱反應性官能基的自由基聚合性單體(B)為選自由(甲 基)丙烯酸-2-羥基乙酯、(曱基)丙烯酸_2_羥基丙酯、(曱基) 丙烯酸-2-羥基丁酯、(曱基)丙烯酸_4_羥基丁酯、14•環己 烷二曱醇單(甲基)丙烯酸酯、鄰苯二甲酸單[(甲基)丙烯酸 羥基乙酯]、及鄰苯二甲酸單-[2_(2·甲基丙烯醯氧基)_乙基] 醋所組成族群中的大於等於1種。 [11] 如上述[1]至[10]中任一項所述之噴墨用墨水,其 中光聚合起始劑(C)為雙(2,4,6-三甲基苯甲醯基)苯基氧 化膦、或2,4,6-三甲基苯甲醯基二苯基氧化膦。 [12] 如上述[1]至pi]中任一項所述之喷墨用墨水,其 中熱反應性樹脂(D)為三聚氰胺樹脂(melamine resin ) 0 [13] 如上述[1]至[u]中任一項所述之噴墨用墨水,其 中熱反應性樹脂(D)為齡·樹脂。 [14] 如上述[1]至[12]中任一項所述之喷墨用墨水,其 201016799 中進一步含有阻燃劑(E)。 [15] 如上述[1]至[14]中任一項所述之喷墨用墨水,其 中進一步含有多官能(甲基)丙烯酸酯(F)。 、 [16] 種硬化膜形成方法,其是藉由喷墨法而塗佈如 上述[1]至[15]十任一項所述之噴墨用墨水,並對所塗佈的 墨水照射光’藉此形成硬化膜。 [17] —種硬化膜形成方法,其是藉由喷墨法而塗佈如 〇 上述[1]至[15]中任一項所述之喷墨用墨水,並對所塗佈的 墨水同時進行光照射及加熱,或者依序進行〇光照射、2) 加熱’藉此形成硬化膜。 [18] —種硬化膜,其是利用如上述[16]或[17]所述之方 法而獲得。 [19] 如上述[18]所述之硬化膜,其是以特定的圖案而形 成。 [20] —種電子電路基板’其是於基板上形成有如上述 ' [18]或[19]所述之硬化膜。 ® [21]—種電子零件,其具有如上述[2〇]所述之電子電路 基板。 [22]—種顯示元件,其具有如上述[2〇]所述之電子電路 基板或如上述[21]所述之電子零件。 另外’於本說明書中,為了表示丙烯酸酯與甲基丙烯 酸酯兩者,有以「(曱基)丙稀酸酯」的方式進行標記的情 形。 [發明之效果] 9 201016799 。1 ynopii 本發明的較好態樣的喷墨用墨水例如墨水的保存穩 疋性優異,並可實現穩定地喷出。而且,由該喷墨用墨水 所得的硬化膜例如具有對金屬蝕刻液的耐性及對剝離液的 剝離性。例如由該喷墨用墨水所得的硬化膜具有對鍍敷液 的耐性及對剝離液的剝離性。例如由喷墨用墨水所得的硬 化膜具有對鍍敷液的耐性或焊錫耐熱性。而且,藉由使用 本發明的較好態樣的喷墨用墨水,可縮短電子電路基板的 製造中形成保護膜所花費的工夫及時間,亦可減少消耗品。 為讓本發明之上述特徵和優點能更明顯易懂,下文特 舉實施例,並配合所附圖式作詳細說明如下。 【實施方式】 1.本發明的喷墨用墨水 本發明的喷墨用墨水包含:含有大於等於5員環的環 狀_自由絲合性單體⑷、具有熱反應性官能基的自 t基聚合性單體⑻、絲合賴劑⑻、及熱反應性樹 月曰⑻。另外’所謂「熱反應性」,例如是指藉由熱而產 生交聯反應的性質,但並不限定於此。本發日㈣噴墨用墨 水可為無色,亦可為有色。 φ另外,本發明的噴墨用墨水除了包含含有大於等於5 =的環_的自由基聚合性單體(Α)、具有熱反應性官 此基的自由基聚合性單體(Β)、光聚合起始劑(c)、及熱 =性樹脂(D)以外’亦可任意地含有阻燃劑⑻、多 基)丙稀酸醋(F),。另外,可根據需要而進一步 含有/谷劑、添加劑、聚合抑制劑、著色劑等。 201016799 體(A) 有大於等於5員環的環狀醚的自由基聚合性單 含有大於等於5員戸认 ⑷若為自由絲纽狀醚的自由絲合性單體 的環狀ϋ,則並無特觀=,且含有A於等於5員環 藉由利用照射光所產生的自所11「自由絲合性」,是指 合的性質。 由基(free radical)而開始聚 ❹ 魯 用以使自由基聚合性罩 官能基可列舉··丙職 ()具有自由基聚合性的 丙烯酿胺等的官能基。白^丙婦基、丙婦酿腔、或甲基 這些官能基的健可為多彳性單體(A) _所含的 的是!個〜2個,進而好^是^。岐1㈣個,更好 <自由基聚合性單體> 含有大於等於5員環的& 如上所述,為自由基聚二^性單體 以下物質。 處自由基聚錢單_如可列舉 性單=二基時聚合二單二如為異具,的多 二(甲基)丙烯酸酯、季戊四醇二申f聚氰酸環氣乙烷改質 二(甲基)丙稀酸醋單硬脂酸賴—1)丙烯酸略、季戊四醇 酷、三經甲基丙烧二(曱基)兩烯_旨、甲基)丙稀酸 丙埽酸醋、二季戊四醇三(甲基)丙歸^季戍四醇二(甲基) (曱基)丙烯酸酯、或二季戊四 日一季戊四醇四 1甲基)内埽酸醋等。 201016799 3iy^pu 、自由基聚“生單體例 合性單體的情形時,例如 不基的早“匕聚 醋、(曱基)丙稀酸-3,4-環氣产p砂(曱基)丙稀酸縮水甘油 甘油酯、3-甲基-3-(甲曰、(甲基)丙烯酸甲基縮水 乙基3 (甲幻而膝歸酿氧基曱基氧雜環丁烧、3_ 乙基-3·(曱基)丙稀醯氧基甲基氧雜環丁^ 丙烯酿氧基乙基氧雜環丁、ρ 土 (土) 乙基氧雜環丁烧、對乙;^^乙基a3-(甲基)丙稀酿氧基 A醚、2笑美席基基基虱雜環丁烷-3-基曱 ί甲其烯醢氧基曱基氧雜環丁烧、2-三 氟曱基-3-(曱基)丙稀醯氧基甲基氧雜環丁院、*三氟曱基 =(甲基)丙婦酿氧基甲基氧雜環丁燒、(甲基)丙婦酸 基)丙烯酸曱醋、(曱基)丙稀酸乙醋、(甲基)丙稀酸異丙醋、 (甲基)丙烯酸丁醋、(甲基)丙歸酸異丁醋、(甲基)丙稀酸第 二丁醋、(曱基)丙烯酸環己酿、(甲基)丙蝉酸节醋、苯乙稀、 :基苯乙烯、氣甲基苯乙烯、(甲基)丙烯酸(3•乙基_3氧雜 裱丁基)甲酯、N-環己基順丁烯二醯亞胺、N苯基順丁烯二 醯亞胺、乙烯基甲苯、(甲基)丙烯酸三環[5 21 〇2,6]癸酯、 ❹ (曱基)丙烯酸二環戊烯氧基乙酯、(甲基)丙烯酸異冰片酯、 (甲基)丙烯酸苯酯、甘油單(甲基)丙烯酸酯、聚苯乙烯巨單 體、聚甲基丙烯酸甲酯巨單體、(甲基)丙烯酸_5_四氫糠氧 基羰基戊酯、月桂醇的環氧乙烷加成物的(曱基)丙烯酸 酯、(甲基)丙烯酸、丁烯酸、氯丙烯酸、肉桂酸、順丁 稀二酸、反丁烯二酸、衣康酸(itaconic acid)、檸康酸 (citraconicacid)、甲基反丁烯二酸(mesaconicacid)、ω -羧基聚己内酯單(甲基)丙烯酸酯、琥珀酸單[2-(甲基)丙烯 12 201016799 iiy45pil 醯氧基乙基]酯、順丁烯二酸單[2-(甲基)丙烯醯氧基乙基] 酯、環己烯-3,4-二甲酸單〇(甲基)丙烯醯氧基乙基;|酯、(甲 基)丙烯醢胺、N,N-二甲基(曱基)丙烯醯胺、N,N_二乙基(甲 基)丙烯醯胺、N,N-二甲基胺基丙基(甲基)丙烯醯胺、N—異 丙基(曱基)丙稀醢胺、N-丙烯醯基嗎琳、N-苯基順丁烯二 醯亞胺、或N-環己基順丁稀二醢亞胺等。 於自由基聚合性單體例如為不具有羥基的多官能聚 ⑩ 合性單體的情形時,例如可列舉:雙酚F型環氧乙烷改質 二丙烯酸酯、雙酚A型環氧乙烷改質二丙烯酸酯、聚乙二 醇一丙烯酸g旨、聚丙一醇二丙烯酸醋、1,4_丁二醇二丙稀 酸酯、1,6-己二醇二丙烯酸醋、a壬二醇二丙烯酸酯、M_ 環己烷二曱醇二丙烯酸酯、2-正丁基_2_乙基·L3-丙二醇^ 丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、環氧乙烷改 質三羥曱基丙烷三(甲基)丙烯酸酯、環氧丙烷改質三羥曱 基丙烧三(曱基)丙烯酸酯、表氯醇(epichl〇r〇hydrin) ^質 二羥曱基丙烷三(甲基)丙烯酸酯、二(三羥甲基丙烷)四(甲 ® 基)丙烯酸酯、甘油三(甲基)丙烯酸酯、表氣醇改質甘油三 (甲基)丙烯酸酯、二甘油四(曱基)丙烯酸酯、季戊四醇四 基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、己内酯 (capr〇iact〇ne)改質二季戊四醇六(甲基)丙烯酸酯、環 乙燒改質鱗酸三(甲基)丙稀酸醋、三[(甲基)丙稀醜氧基乙 基]異三聚氰酸醋、己内醋改質三[(甲基)丙_氧基乙 異二聚氰酸酯、或(甲基)丙稀酸胺基甲酸酯等。 <大於等於5員環的環狀醚> 13 201016799COOH (B-2) (in the formulae (B-1) and (B-2), R4 is independently nitrogen or a carbon number of 1 to 3 fluorenyl groups, and the enthalpy is inverted to have a cyclic structure. The alkyl group having a carbon number of 2 to 12 and n is an integer of 丨~3〇). [10] The inkjet ink according to any one of [1] to [5] wherein the radically polymerizable monomer (B) having a thermally reactive functional group is selected from (meth)acrylic acid- 2-hydroxyethyl ester, 2-hydroxypropyl (meth)acrylic acid ester, 2-hydroxybutyl (meth) acrylate, _4-hydroxybutyl (meth) acrylate, 14 • cyclohexane decyl alcohol Mono (meth) acrylate, phthalic acid mono [(meth) hydroxyethyl methacrylate], and phthalic acid mono-[2_(2·methacryloxy)-ethyl] vinegar One or more of the ethnic groups. [11] The ink for inkjet according to any one of [1] to [10] wherein the photopolymerization initiator (C) is bis(2,4,6-trimethylbenzylidene) Phenylphosphine oxide or 2,4,6-trimethylbenzimidyldiphenylphosphine oxide. [12] The ink for inkjet according to any one of the above [1] to [pi], wherein the thermally reactive resin (D) is a melamine resin 0 [13] as described above [1] to [u] The inkjet ink according to any one of the invention, wherein the thermally reactive resin (D) is an age resin. [14] The inkjet ink according to any one of [1] to [12] further comprising a flame retardant (E) in 201016799. [15] The inkjet ink according to any one of [1] to [14] further comprising a polyfunctional (meth) acrylate (F). [16] A method of forming a cured film by coating the ink according to any one of the above [1] to [15] by an inkjet method, and irradiating the applied ink with light. 'Thereby forming a cured film. [17] A method of forming a cured film, which is an inkjet ink according to any one of the above [1] to [15], which is simultaneously applied to the applied ink by an inkjet method. Light irradiation and heating are performed, or calendering is sequentially performed, and 2) heating is performed to form a cured film. [18] A cured film obtained by the method described in [16] or [17] above. [19] The cured film according to the above [18], which is formed in a specific pattern. [20] An electronic circuit board which is formed with a cured film as described in the above [18] or [19]. ® [21] An electronic component having the electronic circuit substrate as described in [2〇] above. [22] A display element comprising the electronic circuit substrate according to [2] above or the electronic component according to [21] above. Further, in the present specification, in order to indicate both the acrylate and the methacrylate, there is a case where "(mercapto) acrylate) is labeled. [Effects of the Invention] 9 201016799. 1 ynopii The inkjet ink of the preferred embodiment of the present invention, for example, ink, is excellent in storage stability and can be stably ejected. Further, the cured film obtained from the inkjet ink has, for example, resistance to a metal etching solution and peeling property to a peeling liquid. For example, the cured film obtained from the inkjet ink has resistance to a plating solution and peeling property to a peeling liquid. For example, a hardened film obtained from an inkjet ink has resistance to a plating solution or solder heat resistance. Further, by using the inkjet ink of the preferred embodiment of the present invention, the labor and time required to form the protective film in the production of the electronic circuit board can be shortened, and consumables can be reduced. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] 1. Inkjet ink of the present invention The inkjet ink of the present invention comprises a cyclic-free-filable monomer (4) having a ring of 5 or more members and a self-t-group having a thermally reactive functional group. A polymerizable monomer (8), a silk compound (8), and a heat-reactive tree (8). Further, the term "thermal reactivity" means, for example, a property of causing a crosslinking reaction by heat, but is not limited thereto. This inkjet ink can be colorless or colored. In addition, the inkjet ink of the present invention contains a radical polymerizable monomer (Α) having a ring of 5 = 5 or more, a radically polymerizable monomer (Β) having a heat-reactive group, and light. The polymerization initiator (c) and the heat-reactive resin (D) may optionally contain a flame retardant (8) or a polybasic acrylic acid (F). Further, a granule, an additive, a polymerization inhibitor, a colorant or the like may be further contained as needed. 201016799 体 (A) The radically polymerizable monomer having a cyclic ether of 5 or more members has a ring-like enthalpy of 5 or more members, and (4) if it is a free-filament-forming monomer of free silk-like ether, There is no special =, and the inclusion of A is equal to the nature of the "free silk fission" produced by the irradiation of the light of the 5-member ring. Starting from the free radical, the functional group for the radical polymerizable capping functional group is exemplified by a radical polymerizable acrylamide. The white propylene base, the propylene brewing chamber, or the methyl group can be a multifunctional monomer (A) _ contained! ~ 2, and then ^ is ^.岐1 (four), more <radical polymerizable monomer>&> containing 5 or more members of the ring & as described above, it is a radical polydiphenyl monomer. Free radical money list _ such as enumeratable single = two-base polymerization, two single two, such as a heterogeneous, poly-di (meth) acrylate, pentaerythritol di-f-c-cyanate cyclohexane ethane modified two ( Methyl) acetoacetic acid monostearic acid lysine 1) acrylic acid slightly, pentaerythritol cool, trimethyl methacrylic acid bis(indenyl) alkene, methyl, acrylic acid propylene vinegar, dipentaerythritol Tris(methyl)propene quaternary tetraol di(methyl)(indenyl) acrylate, or diquaternary four-day pentaerythritol tetra-methyl phthalic acid vinegar. 201016799 3iy^pu, free radicals in the case of "monomeric monomer", such as non-based early "匕 醋 vinegar, (mercapto) acrylic acid -3,4-ring gas production sand (曱Glycol glyceryl acrylate, 3-methyl-3-(methyl hydrazine, methyl methacrylate (ethyl methacrylate) 3 (methyl phantom and oxoloxy oxetane, 3_ Ethyl-3·(fluorenyl) propylene methoxymethyl oxetane propylene oxyethyl oxetane, ρ soil (earth) ethyl oxetane, bis; ^^ Ethyl a3-(methyl) propylene oxide oxy A ether, 2 sylmethicyl 虱 heterocyclobutane-3-yl 曱 甲 其 醢 醢 醢 氧 氧 、, 2- Trifluoromethyl-3-(indenyl) propylene sulfoxymethyl oxetane, *trifluoromethyl = (methyl) propyl methoxymethyl oxetane, (methyl ) acetophenate acrylate vinegar, (mercapto) acrylic acid vinegar, (meth) isopropyl isopropyl vinegar, (meth) butyl vinegar, (meth) acrylic acid isobutyl vinegar, (Methyl)acrylic acid second vinegar, (mercapto)acrylic acid ring, (meth)propionic acid vinegar, styrene, styrene, gas methyl benzene , (meth)acrylic acid (3•ethyl_3oxaindole butyl) methyl ester, N-cyclohexyl maleimide, N-phenyl maleimide, vinyl toluene, ( Trimethyl [5 21 〇 2,6] decyl methacrylate, dicyclopentenyloxyethyl decyl acrylate, isobornyl (meth) acrylate, phenyl (meth) acrylate, glycerol Mono (meth) acrylate, polystyrene macromonomer, polymethyl methacrylate macromonomer, (meth)acrylic acid _5_tetrahydrofurfuryloxycarbonyl pentyl ester, lauryl alcohol ethylene oxide plus Compound (mercapto) acrylate, (meth)acrylic acid, crotonic acid, chloroacrylic acid, cinnamic acid, cis-butane diacid, fumaric acid, itaconic acid, citraconic acid ( Citraconicacid), mesaconic acid, ω-carboxypolycaprolactone mono(meth)acrylate, succinic acid mono[2-(methyl)propene 12 201016799 iiy45pil oxiranylethyl ester , maleic acid mono [2-(methyl) propylene methoxyethyl] ester, cyclohexene-3,4-dicarboxylic acid mono-(methyl) propylene oxiranyl ethyl group; Methyl) acrylamide, N, N-dimethyl(fluorenyl) acrylamide, N,N-diethyl(meth) acrylamide, N,N-dimethylaminopropyl (meth) decylamine, N-iso Propyl (mercapto) acrylamide, N-propylene hydrazinyl, N-phenyl maleimide, or N-cyclohexyl cis-butane diimide, etc. When the monomer is, for example, a polyfunctional poly 10 monomer having no hydroxyl group, for example, bisphenol F type ethylene oxide modified diacrylate, bisphenol A type ethylene oxide modified diacrylic acid Ester, polyethylene glycol-acrylic acid, polypropanol diacrylate vinegar, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate vinegar, a decanediol diacrylate, M_cyclohexanediol diacrylate, 2-n-butyl-2- 2·ethyl·L3-propanediol acrylate, trimethylolpropane tri(meth) acrylate, ethylene oxide modified tris Mercaptopropane tri(meth)acrylate, propylene oxide modified trishydroxypropylpropane tris(decyl) acrylate, epichlorohydrin (epichl〇r〇hydrin) dihydroxy hydrazinopropane Acrylate, bis(trihydroxyl) Methylpropane) tetrakis(meth)acrylate, glycerol tri(meth)acrylate, surface alcohol modified glycerol tri(meth)acrylate, diglyceryl tetra(decyl)acrylate, pentaerythritol tetrayl) Acrylate, dipentaerythritol hexa(meth) acrylate, caprolactam (capr〇iact〇ne) modified dipentaerythritol hexa(meth) acrylate, cyclohexane sulphuric acid tris(methyl) acrylate Vinegar, tris[(methyl)propyl ugly oxyethyl]iso-cyanuric acid vinegar, caprolactone modified tris[(methyl)propenyloxyisocyanurate, or (methyl Acrylic acid urethane and the like. <cyclic ether of 5 or more members> 13 201016799
Jiywpii 含有大於等於5員環的環狀驗的自由 „上所述,是自由基聚合性單體具有乂二口於“ 早二二處大於等於5員環的環狀,列如 驗等,環中所含_鍵的個數例如可列舉丨個員【個=3 個等。另外,㈣環_可觀絲代,較被 數為1〜3的絲,更好的是可被?基或 代疋 =T:代基數可為多個,較好的是I個:, 更好的疋1個。自由基聚合性單和士 狀醚的個數可為多個,較好二:)中所含的這些環 個。 夕1固較好的疋1個〜2個,更好的是i 環狀^於等於5 S賴雜⑽频可轉具扣下結構的Jiywpii contains a ring test with a ring of 5 or more members. As described above, the radical polymerizable monomer has a ring-shaped ring at the early two or two points of 5 or more rings. The number of _ keys included in the middle can be exemplified by a single member [ etc.]. In addition, (4) ring _ observable silk generation, more than the number of 1 to 3 silk, better can be? Base or generation = T: The base number can be multiple, preferably one:, and the better one. The number of the radically polymerizable mono- and ether-like ethers may be plural, and it is preferred that these rings are contained in two:).夕1 solid is better 疋1~2, more preferably i ring^ is equal to 5 S 赖(10) frequency convertible buckle structure
Ό、 Ό、 ,〇、 Ό, 〇 \^° … v — (αΛ'ΑΓ等於5 M環的環狀_自由Q基聚合性單體 ^5疋_^^絲合性單财的任—種具有上述大於 的所有财的任單體,其中包括可考慮 自由基聚合性單體 =的疋以上速通式(A)所表示的化合物。 可列裹、:(A) _,Rl為氫或碳數為1〜3 基,具體 謂.&、甲基、乙基、正丙基、異丙基,較好的是氫 〇、 .0 ❹ 14 201016799 3iy4^pit 或甲基。 _3iU)t,R2為可具有分支結構的碳數& 3 的伸烷基或可具有分支結構的碳數為2〜 數為 為1〜3的伸烷基具體為亞甲基、伸 ’ 一醇_。碳數 些伸烧基上鍵結例如減取代基^可於f :形::=。另外,可具有分二:碳數為1二 ❹ 或新戊二_。 ㈣Hth ^通式⑷中,R3為可被碳數為Μ的烧基取代的 二數為1或2的大於等於5員環的環_。該環狀_具 體例例如可列舉上述環狀醚。 以通式(A)所表示㈣合料體(A)的具體例可 =舉.(甲基)丙騎四氫糠醋、環狀三Μ基丙錢甲搭 (甲,)丙稀酸醋、烧氧基化(曱基)丙烯酸四氫糠醋、己内醋 改質(甲基)丙烯酸四氫糠酯等。 社這些聚合性單體中’較好的是丙烯酸四氮糠醋(下述 、、’。構式(al-Ι))、甲基丙烯酸四氫糠酯(下述結構式 jal-2))、壤狀二經曱基丙烧縮曱㈣缚酸自旨(下述結構 式U2-1))、或環狀三經曱基丙燒縮甲搭甲基丙稀酸醋(下 述結構式(a2-2))。 15Ό, Ό, 〇, Ό, 〇\^° ... v — (αΛ'ΑΓ is equal to 5 M ring ring _ free Q-based polymerizable monomer ^5疋_^^ silky property Any of the above-mentioned monomers which are larger than the above, including a compound represented by the above formula (A) which can be considered as a radical polymerizable monomer = can be listed, : (A) _, Rl is hydrogen or The carbon number is 1 to 3 groups, specifically, &, methyl, ethyl, n-propyl, isopropyl, preferably hydroquinone, .0 ❹ 14 201016799 3iy4^pit or methyl. _3iU)t R2 is an alkylene group having a carbon number & 3 of a branched structure or a branched alkyl group having a carbon number of 2 to several 1 to 3, specifically a methylene group or a mercapto group. Carbon number Some extension groups, for example, a substituent group, can be used in f: shape::=. In addition, it may have a fraction of two: the carbon number is 1 ❹ or neopenta _. (4) Hth In the formula (4), R3 is a ring _ of 5 or more rings which may be substituted by a group having a carbon number of fluorene. Examples of the cyclic form include the above cyclic ether. The specific example of the (4) mixture (A) represented by the general formula (A) can be as follows: (meth) propyl riding tetrahydroanthraquinone vinegar, cyclic triterpene propyl ketone (a, acrylic acid vinegar) , alkoxylated (fluorenyl) methacrylate tetrahydroanthracene vinegar, caprolactone modified tetramethyl methacrylate (meth) acrylate, and the like. Among these polymerizable monomers, 'the preferred one is tetraammine vinegar acrylate (hereinafter, '.' (al-Ι)), tetrahydrofurfuryl methacrylate (the following structural formula jal-2)) , the second structural formula of the sulphuric acid, the sulphuric acid, the sulphuric acid, the sulphuric acid, the sulphuric acid, the sulphuric acid (the following structural formula U2-1) (a2-2)). 15
201016799 Jiy4DplI201016799 Jiy4DplI
丙烯酸四氫糠酯以Sartomer公司製造的SR285、共榮 社化學股份有限公司製造的Ught Acrylate THF-A的形式 市售,甲基丙烯酸四氫糠酯以Sartomer公司製造的 SR203、共榮社化學股份有限公司製造的Light Ester THF 的形式市售。另外,環狀三羥甲基丙烷縮甲醛丙烯酸酯以 Sartlmer:司製造的奶31的形式市售。 喷墨用墨水中所含的聚合性單體(A)可為選自上述 化合物的1種化舍物,另外,亦可為這些化合物的大於等 於2種的混合物° 若於噴墨用墨水中含有1 Wt%〜7〇wt%(重量百分比) 的自由基聚合性單體(A) ’則於噴墨時,自噴嘴的噴出穩 定性變得良好,因此較好,若含有10 wt0/〇〜65 wt%的自由 基聚合性單體(A) ’則更好,若含有20 wt%〜60 wt%的 201016799 D I yHDpil 自由基聚合性單體(a),則進而更好。 1.2具有熱反應性官能基的自由基聚合性單體(b) 具有熱反應性宫能基的自由基聚合性單體(B)若為 自由基聚合性化合物,且具有熱反應性官能基,則並無斗寺 別限定。另外,所謂「熱反應性」,例如是指藉由產、 交聯反應的性質,但並不限定於此。 ‘,、、產生 熱反應性官能基若為藉由熱而產生反應(較好的是交 ❹聯反應)的官能基,則並無特別限定,例如可列舉: ,基、環氧乙燒及氧雜環了烧等,這些官能基中尤其=的 是羥基、羧基。另外,自由基聚合性單體(B)中所含的 熱反應性官能基的個數可為多個,較好的是丨個〜3個,、 更好的是1個〜2個,進而好的是丨個。 β,由基聚合性單體(B)中所含的熱反應性官能基具 有提而與噴墨用墨水巾所含的其他成分的相容性的效果。 尤其是於熱反應性官能基為羥基的情形時,提高與噴墨用 義 墨水巾所含的其他成分_容_效紐大。另外,於執 f應性官能基為竣基的情形時,具有提高由喷墨用墨水^ 得的硬化膜對鹼性水溶液的剝離性的效果。 <熱反應性官能基為羥基的自由基聚合性單體(Β) 主於自由基聚合性單體(Β)的熱反應性官能基為羥基 „時’較好例可列舉:具有羥基與1個自由基聚合: 碳碳雙鍵的聚合性單體、具有經基與2個自由基聚合 炭雙鍵的5^合性單體、或具有經基與大於等於3個自由基 17 201016799 ^ιν^ριι 聚合性碳碳雙鍵的聚合性單體。 的且=祕Γ個自由絲合性碳碳韻㈣合性單體 的具體例可列舉:(甲基)丙烯酸_2_祕乙自旨、(甲 ==:(甲基)峨,基丁醋、或W環己烧 一曱醇早(曱基)丙烯酸酯等。 〇 具有減與2個自由基聚合性碳碳雙鍵的聚合性 =體=可列舉:異三聚氰酸環氧乙烧改質二(甲基)丙稀 曰:甘油一丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、 戊四醇二(曱基)丙烯酸g旨單硬脂酸冑、三經甲基丙烧 基)丙烯酸酯、或二季戊四醇二(甲基)丙烯酸酯等。一 人降於等於3個自由基聚合性碳碳雙鍵的聚 1早體的具體例可列舉:季戊四醇三(甲基)丙稀酸醋、 :季戊畴五(甲基)丙_sl、絲改f二季戊四醇五(甲 f丙婦㈣、二季戊四醇四(甲基)丙稀酸醋、絲改質二 =戊四醇四(甲基旨、二季戊四醇三(甲基)丙稀酸 S曰、或絲改質二季戊四醇三(甲基)丙稀酸醋等。 ❹ 這些聚合性單體巾,於應麟光硬傾喷墨用墨水的 月形時’就自喷嘴的噴出穩定性的觀點而言,具有經基作 為熱反應性官能基的自由絲合性單體⑻,較好的是具 有經基與1個自&絲纽碳碳雙賴聚合性單體,尤其 好的是曱基丙烯酸·2·經基乙g旨、甲基丙烯酸_2_祕丙醋、 丙婦酸·4·祕丁g旨、或1>4_環己烧二甲醇單丙烯酸醋。 另外’具有熱反應性官能基的自由基聚合性單體(B) 較好的是以上述通式(^1;)所表示的化合物。於通式(B1) 18 201016799 :>iy〇pii 中,R4分別獨立地為氫或碳數為 舉:氫、甲基、乙基、正丙基、異丙武的^,具體可列 基。於通式(B-1)中,R5分別獨立二^ ^疋氫或甲 的碳數為2〜12的伸烧基,這此:可/、有環狀結構 基、伸丙基、伸丁基或以如下結中^好的是伸乙 於通式(Β-υ中,η為!〜30的整數°另外, 更好的是1〜3,進而好的是i。 較好的疋1〜10, -ch2- -ch2- 〉〈熱反應性官能基為縣的自由基聚合性單體⑻ 的:由較基能基繼 ❹ 碳碳雙鍵的聚合性單體、且有:、㈤自由基聚合性 碳雙鍵的聚合性單體、或2古斑2個自由基聚合性碳 聚合性碳碳雙鍵的聚^單體。、切等於3個自由基 的具=^^\個甲^基^合性碳碳雙鍵的聚合性單體 反丁歸二酸反严酸、順丁稀二酸、 酸單[(甲基)丙烯酸^基乙= 酯早⑽_、或鄰苯二甲 的具體:羧;基聚合性碳碳雙鍵的聚合性單體 具有減_四醇二丙稀酸醋等。 、;3個自由基聚合性碳碳雙鍵的聚 19 201016799 ^ly^Dpir 5性單體的具_,可尊伽酸改質季細醇三(甲基) 丙稀,編酸改質二季戊四醇五(甲基)丙烯酸醋等。 攻些聚合性單體中,於應用於光硬化性喷墨用墨水的 情形時,就自喷嘴时出穩定性、及㈣墨用墨水所得的 硬化膜對m水溶液㈣^性峨點❿言具有缓基作為 熱反應性官能基的自由基聚合性單體(B),較好的是具有 幾基與1個自由基聚合性碳碳雙鍵的聚合性單體,尤其好Tetrahydrofurfuryl acrylate is commercially available as SR285 manufactured by Sartomer Co., Ltd. and Ught Acrylate THF-A manufactured by Kyoeisha Chemical Co., Ltd., and tetrahydrofurfuryl methacrylate is manufactured by Sartomer Corporation as SR203 and Kyoritsu Chemical Co., Ltd. The company is manufactured in the form of Light Ester THF. Further, cyclic trimethylolpropane formal acrylate is commercially available as Milk 31 manufactured by Sartlmer: Division. The polymerizable monomer (A) contained in the inkjet ink may be one type of compound selected from the above compounds, or may be a mixture of two or more of these compounds. The radically polymerizable monomer (A) having 1 Wt% to 7 〇wt% (% by weight) is excellent in discharge stability from the nozzle when ink is ejected, and therefore it is preferably 10 wt0/〇. ~65 wt% of the radical polymerizable monomer (A)' is more preferable, and if it contains 20 wt% to 60 wt% of 201016799 DI yHDpil radical polymerizable monomer (a), it is further preferable. 1.2 Radical polymerizable monomer having a thermally reactive functional group (b) The radically polymerizable monomer (B) having a thermally reactive functional group (B) is a radically polymerizable compound and has a thermally reactive functional group, There is no limit to the temple. In addition, the term "thermal reactivity" means, for example, the nature of the reaction by the production and crosslinking, but is not limited thereto. The functional group which generates a heat-reactive functional group by heat (preferably, a cross-linking reaction) is not particularly limited, and examples thereof include a group, an epoxy group, and an epoxy group. The oxygen heterocyclic ring is burned or the like, and among these functional groups, in particular, a hydroxyl group or a carboxyl group is used. Further, the number of the thermally reactive functional groups contained in the radically polymerizable monomer (B) may be plural, preferably from 3,000 to 1, more preferably from one to two, and further Ok, it’s one. β has an effect of improving the compatibility with the other components contained in the ink jet ink towel by the heat-reactive functional group contained in the base polymerizable monomer (B). In particular, when the thermally reactive functional group is a hydroxyl group, the other components contained in the ink jet ink towel are improved. Further, when the functional group is a fluorenyl group, the effect of improving the peeling property of the cured film obtained from the inkjet ink to the alkaline aqueous solution is obtained. <Radically polymerizable monomer having a thermoreactive functional group as a hydroxyl group (Β) The thermoreactive functional group of the radically polymerizable monomer (Β) is a hydroxyl group, and a preferred example thereof is a hydroxyl group and a hydroxyl group. Radical polymerization: a polymerizable monomer having a carbon-carbon double bond, a 5^-bonding monomer having a double bond of a radical and 2 radically polymerized carbons, or having a radical and 3 radicals or more 17 201016799 ^ιν ^ριι A polymerizable monomer having a polymerizable carbon-carbon double bond. The specific example of the free-filamentous carbon-carbon rhyme (4)-complex monomer can be exemplified by (meth)acrylic acid _2 , (A ==: (methyl) hydrazine, butyl vinegar, or W ring hexanone sterol early (mercapto) acrylate, etc. 〇 has reduced polymerizability with two radical polymerizable carbon-carbon double bonds = body = can be exemplified: iso-cyanuric acid Ethylene-oxygen bromide modified di(methyl) acrylonitrile: glycerol monoacrylate, pentaerythritol di (meth) acrylate, pentaerythritol bis(indenyl) acrylate A single glyceryl stearate, a trimethyl methacrylate acrylate, or a dipentaerythritol di (meth) acrylate, etc. One person falls to equal three radicals Specific examples of the poly 1 precursor of the carbon-carbon double bond include pentaerythritol tris(meth)acrylic acid vinegar, pentavalent domain penta (methyl) propyl ssl, and silk modified f dipentaerythritol five (a f-propyl group) Women (4), dipentaerythritol tetrakis (meth) acrylate vinegar, silk modified bis = pentaerythritol tetra (methyl, dipentaerythritol tris(methyl) acrylate S 曰, or silk modified dipentaerythritol III ( Methyl) acrylic acid vinegar, etc. ❹ These polymerizable monomer sheets have a warp group as a thermal reaction from the viewpoint of the discharge stability of the nozzle when the film is formed in the shape of the ink of the ink film The free functional group-free free-synthesis monomer (8) preferably has a mercapto group and a self-fractional carbon-carbon double-polymerizable monomer, and particularly preferably a mercaptoacrylic acid·2· Or, methacrylic acid _2 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The monomer (B) is preferably a compound represented by the above formula (^1;). In the formula (B1) 18 201016799 :>iy〇pii, R4 is independently hydrogen or The number is: hydrogen, methyl, ethyl, n-propyl, isopropanol ^, specifically can be listed. In the general formula (B-1), R5 is independent of two ^ ^ hydrogen or carbon number of A It is a stretching base of 2 to 12, which is: / can have a cyclic structural group, a propyl group, a butyl group or a condensed butyl group as follows: in the formula (Β-υ, η is In addition, it is more preferably 1 to 3, and further preferably i. Preferably, 疋1 to 10, -ch2- -ch2->Reactive reactive functional group is a free radical polymerizable property of the prefecture Monomer (8): a polymerizable monomer which is followed by a carbon-carbon double bond with a more basic group, and has: (5) a polymerizable monomer of a radical polymerizable carbon double bond, or 2 radical polymerization of 2 ancient spots A monomer of a carbon-polymerizable carbon-carbon double bond. , a polymerizable monomer with a chemo-carbon double bond, which is equivalent to 3 radicals, is a compound of the same carbon-carbon double bond, anti-succinic acid, cis-butane diacid, acid mono[(methyl Acrylate; ethyl acrylate = ester early (10) _, or phthalate specific: carboxy; polymerizable monomer having a base polymerizable carbon-carbon double bond having 1,4-tetraol diacrylic acid vinegar or the like. , 3 polyradical polymerizable carbon-carbon double bond poly 19 201016799 ^ ly ^ Dpir 5 monomer with _, can be changed to quaternary acid fine quaternary alcohol tris (methyl) propylene, acid-modified two Pentaerythritol penta (meth) acrylate vinegar and the like. Among the polymerizable monomers, when applied to a photocurable inkjet ink, the stability of the nozzle is obtained, and (4) the cured film obtained by the ink for ink has a m-solution (m) The radically polymerizable monomer (B) having a heat-reactive functional group as a heat-reactive functional group is preferably a polymerizable monomer having a radical of several radicals and one radical polymerizable carbon-carbon double bond, particularly preferably
的是鄰苯二曱酸單(丙烯酸羥基乙酯)、或鄰苯二曱酸單(曱 基丙烯酸羥基乙酯)(新中村化學工業股份有限公司製造的 CB-1 (商品名))。It is phthalic acid mono(hydroxyethyl acrylate) or phthalic acid mono(hydroxyethyl methacrylate) (CB-1 (trade name) manufactured by Shin-Nakamura Chemical Co., Ltd.).
而且,具有熱反應性官能基的自由基聚合性單體(B) 較好的是以上述通式(B_2)所表示的化合物。於通式(B_2) 中,R4分別獨立地為氫或碳數為1〜3的烧基,具體可列 舉:氫、甲基、乙基、正丙基、異丙基,較好的是氮或甲 基。於通式(B-2)中,R5分別獨立地為可具有環狀結構 的碳數為2〜12的伸烧基(較好例與上述通式(B_〗)中的 R5的說明相同)’ η為1〜30的整數,較好的是1〜1〇,更 好的是1〜3,進而好的是1。 喷墨用墨水中所含的自由基聚合性單體(Β)可為選 自上述化合物的1種化合物,另外,亦可為這些化合物的 大於等於2種的混.合物。 若於喷墨用墨水中含有1 wt%〜80 wt%的自由基聚合 性單體(B),則於製成光硬化性喷墨用墨水的情形時,自 喷墨噴嘴的喷出穩定’因此較好,若含有3 wt〇/〇〜75 wt% 20 201016799 的自由基聚合性單體(B),則更好,若含有5wt%〜70 wt% 的自由基聚合性單體(B),則進而更好。 13光聚合起始劑(C) 光聚合起始劑(C)若為可藉由紫外線或可見光線的 照射而產生自由基的化合物,則並無特別限定。光聚合起 始齊丨(C )的具體例可列舉:二苯甲酮(benzophenone )、 米其勒酮(Michler's ketone)、4,4i-雙(二乙基胺基)二苯曱 ^ 綱氣雜蒽酮(thioxanthone )、硫雜蒽酮(thioxanthone )、 異丙基氧雜蒽酮、2,4-二乙基硫雜蒽酮、2-乙基蒽醌、苯乙 嗣、2-經基-2-甲基苯丙酮、2-羥基-2-曱基-4,-異丙基苯丙 酮、1-羥基環己基苯基酮、異丙基安息香醚、異丁基安息 香謎、2,2-二乙氧基苯乙酮、2,2-二曱氧基-2-苯基苯乙酮、 樟腦醌(camph〇r〇qUinone)、苯幷蒽酮(benzanthr〇ne)、 2-甲基_1-[4_(曱硫基)苯基]嗎琳基丙烧_1_酮、2_苄基_2_ 二甲基胺基-1-(4-嗎啉基苯基)_丁酮心、4_二甲基胺基苯甲 酸乙酯、4-二甲基胺基苯曱酸異戊酯、4,4,_二(第三丁基過 ® 氧基羰基)二苯曱酮、3,4,4’-三(第三丁基過氧基羰基)二苯 甲嗣、3,3,4,4 -四(第二丁基過氧基幾基)二苯甲酮、H4,4,_ 四(第三己基過氧基羰基)二苯曱酮、3,3,_二(曱氧基幾 基M,4·-二(第三丁基過氧基幾基)二苯甲_、3,4'_二(曱氧基 羰基)-4,3’-二(第二丁基過氧基幾基)二苯曱_、七心工(曱氧 基羰基)-3,3’-二(第三丁基過氧基羰基)二苯曱酮、i,2-辛二 酮,1-[4-(苯硫基)苯基]-,2·(鄰苯甲醯基將)、2_(4,_甲氧基笨 乙婦基)-4,6-雙(二乳曱基)·均三β秦、2-(3’,4’-二甲氧基苯乙 21 201016799 ^iy4Dplt 雙(二氯曱基)-均三嗪、2-(2’,4,-二甲氧基苯乙烯 二(三氣甲基)·均三嗪、2-(2,-曱氧基笨乙婦基)-4,6· )'均三°秦、2-(4’-戍氧基苯乙婦基)♦雙(三氯 =)句二嗪、4_[對N,N-二(乙氧基羰基甲基)]_2 6·二(三氯 ^^^^力令三氣曱基⑼广氣苯私均三嗅、1,3- 甲氧基苯基)-均三嗓、2-(對二甲基胺基 焊基)本幷°惡哇、2-(對二甲基胺基苯乙烯基)苯幷噻 嗤、2= 基笨幷嗔唾、3,3,幾基雙(7_二乙基胺基香豆素)、 2-(鄰氣笨基)'4,4,,5,5,-四苯基-1,2,·聯味唾、2,2,·雙(2-氣苯 ❹ 基)_4,4’,5,5’-四(4-乙氧基羰基苯基)-1,2,-聯咪唑、2,2,-雙 (2,4_二氣苯基)-4,4,,5,5,-四苯基-1,2,-聯咪唑、2,2,-雙(2,4-二 溴苯基)-4,4’,5,5’-四苯基_1,2|_聯咪唑、2,2,-雙(2,4,6-三氣苯 基)-4,4,5,5’_四苯基-1,2'-聯咪嗤、3-(2-甲基-2-二曱基胺基 丙醯基)咔唑、3,6_雙(2-曱基-2-嗎啉基丙醯基)_9_正十二烷 基十坐、1-經基環己基苯基酮、雙(7? 5-2,4_環戊二晞+基)· 雙(2,6-—氟-3-(1Η-η比洛-1-基)-苯基)鈦、雙(2,4,6-三甲基苯 曱醯基)苯基氧化膦、或2,4,6-三曱基苯曱醯基二苯基氧化 ❹ 膦。 其中,雙(2,4,6-三甲基苯甲醯基)苯基氧化膦(Ciba Japan股份有限公司製造的IRGACURE 819 (商品名))或 2,4,6-三甲基苯曱醯基二苯基氧化膦(Ciba Japan股份有限 公司製造的DAR〇CURTPO (商品名))、及1-羥基環己基 苯基鲷(Ciba Japan股份有限公司製造的IRGACURE I84 (商品名))等’與喷墨用墨水中所含的其他成分的相容性 22 201016799 :高因=噴墨用墨水能以較少的紫外線照射量進行硬 光聚合起始劑⑹可為1#化 於2種不同化合物的混合物。若於H為大於等 wt%〜2〇wt%的光聚合起㈣(c 製射7有0.2 =2為i Wt%〜2〇Wt% ’則更好4光聚合起“Further, the radically polymerizable monomer (B) having a thermally reactive functional group is preferably a compound represented by the above formula (B_2). In the formula (B_2), R4 is each independently hydrogen or a carbon group having 1 to 3 carbon atoms, and specific examples thereof include hydrogen, methyl, ethyl, n-propyl and isopropyl groups, preferably nitrogen. Or methyl. In the formula (B-2), R5 is each independently a stretching group having a cyclic structure and having a carbon number of 2 to 12 (a preferred example is the same as the description of R5 in the above formula (B_)) η is an integer of 1 to 30, preferably 1 to 1 Torr, more preferably 1 to 3, and further preferably 1. The radical polymerizable monomer (Β) contained in the inkjet ink may be one compound selected from the above compounds, or may be a mixture of two or more of these compounds. When the inkjet ink contains 1 wt% to 80 wt% of the radical polymerizable monomer (B), when the photocurable inkjet ink is used, the ejection from the inkjet nozzle is stable. Therefore, it is more preferable to contain a radical polymerizable monomer (B) of 3 wt%/〇 to 75 wt% 20 201016799, and if it contains 5 wt% to 70 wt% of a radical polymerizable monomer (B) , then better. (13) Photopolymerization initiator (C) The photopolymerization initiator (C) is not particularly limited as long as it is a compound capable of generating a radical by irradiation with ultraviolet rays or visible light. Specific examples of the photopolymerization initiation (C) include benzophenone, Michler's ketone, and 4,4i-bis(diethylamino)diphenyl hydrazine. Thioxanthone, thioxanthone, isopropyl oxazinone, 2,4-diethylthiazinone, 2-ethyl hydrazine, phenelzine, 2-perylene -2-methylpropiophenone, 2-hydroxy-2-mercapto-4,-isopropylpropiophenone, 1-hydroxycyclohexyl phenyl ketone, isopropyl benzoin ether, isobutyl benzoin, 2,2 -diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, camphor (camph〇r〇qUinone), benzophenone (benzanthr〇ne), 2-methyl _1-[4_(indolyl)phenyl]morphinylpropan-1-ol, 2-benzyl-2-1-dimethylamino-1-(4-morpholinylphenyl)-butanone , 4-dimethylaminobenzoic acid ethyl ester, 4-dimethylaminobenzoic acid isoamyl ester, 4,4,-di(t-butylperoxycarbonyl)benzophenone, 3 , 4,4'-tris(t-butylperoxycarbonyl)benzamide, 3,3,4,4-tetrakis(t-butylperoxymethyl)benzophenone, H4,4 , _ four (third hexylperoxy) Diphenyl fluorenone, 3,3,_di(decyloxy) M,4·-di(t-butylperoxymethyl)diphenyl-, 3,4'-di(oxyl) Benzyl)-4,3'-di(t-butylperoxy)diphenylhydrazine-, seven-ply (nonyloxycarbonyl)-3,3'-di(t-butylperoxy) Carbonyl)diphenyl fluorenone, i,2-octanedione, 1-[4-(phenylthio)phenyl]-, 2·(o-benzylidene), 2_(4,_methoxy)乙妇基)-4,6-bis(di-mercapto-based)·s-tris-β, 2-(3',4'-dimethoxyphenylethyl 21 201016799 ^iy4Dplt bis(dichloroindenyl)-all Triazine, 2-(2',4,-dimethoxystyrene bis(trismethyl)·s-triazine, 2-(2,-decyloxyphenyl)-4,6· ) 'Equivalent three ° Qin, 2-(4'-decyloxyphenethyl) ♦ bis (trichloro =) sentence diazine, 4_[p-N,N-bis(ethoxycarbonylmethyl)]_2 6 ·Two (trichloro)^^^^ force three gas sulfhydryl groups (9) wide gas benzene private average tristimulus, 1,3-methoxyphenyl)-homo-trimium, 2-(p-dimethylamino base ) 幷 幷 恶 、, 2- (p-dimethylaminostyryl) benzoquinone, 2 = alkaloid, 3,3, a few bis (7-diethylamine coumarin Prime), 2- (contiguous) Stupid base) '4,4,,5,5,-tetraphenyl-1,2,· 联 唾, 2,2,· bis (2-p-benzophenyl)_4,4',5,5' -tetrakis(4-ethoxycarbonylphenyl)-1,2,-biimidazole, 2,2,-bis(2,4-diphenyl)-4,4,5,5,-tetraphenyl Base-1,2,-biimidazole, 2,2,-bis(2,4-dibromophenyl)-4,4',5,5'-tetraphenyl-1,2|-biimidazole, 2 ,2,-bis(2,4,6-trisylphenyl)-4,4,5,5'-tetraphenyl-1,2'-biimidine, 3-(2-methyl-2- Dimethylaminopropionyl)carbazole, 3,6-bis(2-mercapto-2-morpholinylpropanyl)-9-n-dodecyldecane, 1-cyclohexylphenyl Ketone, bis(7? 5-2,4_cyclopentadienyl)-bis(2,6--fluoro-3-(1Η-η-pyr-1-yl)-phenyl)titanium, double 2,4,6-Trimethylphenylhydrazino)phenylphosphine oxide or 2,4,6-trimercaptophenylindenylphosphonium phosphine. Among them, bis(2,4,6-trimethylbenzylidene)phenylphosphine oxide (IRGACURE 819 (trade name) manufactured by Ciba Japan Co., Ltd.) or 2,4,6-trimethylphenylhydrazine Diphenylphosphine oxide (DAR〇CURTPO (trade name) manufactured by Ciba Japan Co., Ltd.), and 1-hydroxycyclohexylphenyl hydrazine (IRGACURE I84 (trade name) manufactured by Ciba Japan Co., Ltd.), etc. Compatibility of other components contained in inkjet inks 22 201016799 : High cause = inkjet ink can be hard photopolymerization initiator with less ultraviolet radiation (6) can be 1# in 2 different compounds mixture. If H is greater than the equivalent wt%~2〇wt% of photopolymerization (4) (c is 7 and 0.2 = 2 is i Wt%~2〇Wt% ’, then better 4 photopolymerization”
的含篁為1 wt%〜15 wt%,則進而更好。 () 1.4熱反應性樹脂(D) 熱反應性樹脂(D)例如可列舉:環氧樹脂、三 =樹脂、「具有熱反應性官能基的自由絲合性單體;聚人 物(例如_脂)」、或「具有熱反應性官能基的自由^ 合性單體與其他自由絲合性單_狀物」《。這 脂就雜性、耐化學藥品㈣觀點而言,較好的是使 用三聚氰胺賴’就硬化騎錄水溶液賴離性、耐酸 性水溶液的觀誠言,較好的是使用「具有減應性官能 基的自由基聚合性單體的聚合物(例如酴樹脂)」。 三聚氰胺樹脂的具體例可列舉:三聚氰胺、羥曱基三 聚氰胺、醚化經曱基三聚氰胺、苯幷胍胺 (benzoguanamine)、羥甲基笨幷胍胺、醚化羥曱基苯幷胍 胺、及這些的縮合物。其中就耐化學藥品性良好的方面而 言,較好的是醚化羥曱基三聚氰胺,而且下述化合物(dq) 及其縮合物的混合物以Sanwa Chemical股份有限公司製造 的NikalacMW-30 (商品名)的形式市售。 23 201016799The yttrium content is from 1 wt% to 15 wt%, and thus further. () 1.4 Thermally Reactive Resin (D) Examples of the thermally reactive resin (D) include an epoxy resin, a tri-resin, a "free-filable monomer having a thermally reactive functional group, and a poly-human (for example, _lipid) "", or "free-reactive monomer having a thermally reactive functional group and other free-filament-single". In terms of impurities and chemical resistance (4), it is better to use melamine lysine to harden the aqueous solution of aqueous solution and acid-resistant aqueous solution. It is better to use "allergic functional". A polymer of a radical polymerizable monomer (for example, an anthracene resin). Specific examples of the melamine resin include melamine, hydroxydecyl melamine, etherified decyl melamine, benzoguanamine, hydroxymethyl cumylamine, etherified hydroxydecyl benzoguanamine, and the like. Condensate. Among them, in terms of good chemical resistance, etherified hydroxydecyl melamine is preferred, and a mixture of the following compound (dq) and its condensate is Nikalac MW-30 (trade name) manufactured by Sanwa Chemical Co., Ltd. The form is commercially available. 23 201016799
H3COH2Cn /N H3COH2C /CH2〇CH3J^ch2〇ch3 CH20CH3 'CH20CH3H3COH2Cn /N H3COH2C /CH2〇CH3J^ch2〇ch3 CH20CH3 'CH20CH3
(d-1) N N、 「具有熱反應性官能基的自由基聚合性單體的聚合 物」的具體例可列舉:聚乙烯醇、聚乙烯苯酚等酚樹脂、 聚((曱基)丙烯酸縮水甘油酯)、聚((甲基)丙烯酸-3,4-環氧環 己酯)、聚((甲基)丙稀酸甲基縮水甘油酯)、聚(3_曱基_3•(甲 基)丙烯醯氧基甲基氧雜環丁烷)、聚(3_乙基_3_(甲基)丙稀 ® 酿氧基甲基氧雜ί衣丁炫>)、1(3-甲基-3-(甲基)丙稀酿氧基乙 基氧雜環丁燒)、聚(3-乙基-3-(曱基)丙烯酿氧基乙基氧雜環 丁烧)、聚(對乙烯基苯基-3-乙基氧雜環丁烧_3·基甲基驗)、 聚(2_苯基-3·(甲基)丙烯醯氧基曱基氧雜環丁烷)、聚(2-三 氟甲基-3-(甲基)丙烯醯氧基甲基氧雜環丁烷)、聚(4_三氟甲 基-2-(甲基)丙烯醯氧基曱基氧雜環丁烷)、聚(甲基)丙烯酸 等。其中,就提高硬化膜對鹼性水溶液的剝離性而言,較 . 好的是聚乙烯苯酚等酚樹脂,其以丸善石油化學股份有限 ❹ 公司製造的MarukaLyncurMS-2P (商品名)的形式市售。 匕若於噴墨用墨水中含有0.1 wt〇/〇〜30 wt0/〇的熱反應性 樹月曰(D),則所得的墨水的硬化膜的耐化學藥品性變高, 故較好*含有〇 5 wt〇/❶〜25 的熱反應性樹脂(D), 則更好若含有1 wt%〜2〇 «的熱反應性樹脂(D),則 進而更好。 15阻燃劑(E) 24 201016799(d-1) Specific examples of the NN and the "polymer of a radically polymerizable monomer having a heat-reactive functional group" include a phenol resin such as polyvinyl alcohol or polyvinylphenol, and poly((mercapto)acrylic acid shrinkage. Glyceride), poly((meth)acrylic acid-3,4-epoxycyclohexyl ester), poly((methyl)acrylic acid methylglycidyl ester), poly(3_mercapto_3•(A) Base) propylene methoxymethyl oxetane), poly(3_ethyl_3_(methyl) propylene® ethoxymethyl oxalate & 炫 >), 1 (3- Benzyl-3-(methyl) propylene oxide ethoxyethyl oxetane), poly(3-ethyl-3-(indenyl) propylene ethoxyethyl oxetane), poly( P-vinylphenyl-3-ethyloxetane _3·methyl group), poly(2-phenyl-3·(meth) propylene fluorenyloxy oxetane), Poly(2-trifluoromethyl-3-(methyl)propenyloxymethyloxetane), poly(4-trifluoromethyl-2-(methyl)acryloxycarbonyloxyl Heterocyclic butane), poly(meth)acrylic acid, and the like. Among them, in order to improve the peeling property of the cured film to the alkaline aqueous solution, a phenol resin such as polyvinyl phenol is commercially available, and it is commercially available as MarukaLyncur MS-2P (trade name) manufactured by Maruzen Petrochemical Co., Ltd. . When the inkjet ink contains a thermal reactivity tree 曰 (D) of 0.1 wt% / 〇 30 30 Å / 〇, the chemical resistance of the cured film of the obtained ink becomes high, so it is preferable to contain Further, the thermally reactive resin (D) of 〇5 wt〇/❶~25 is more preferably further contained in the heat-reactive resin (D) of 1 wt% to 2 Å. 15 flame retardant (E) 24 201016799
^iy4^piT 為了對喷墨用墨水賦予阻燃性,而可含有阻燃劑 (E)。該阻燃劑(E)中磷系化合物對環境造成的影響較 少,故較好。 構系化合物的阻燃劑(E )的具體例可列舉:鱗酸三 苯酯、磷酸三甲苯酯、磷酸三(二甲苯)酯、磷酸甲苯基苯 酯、填酸2-乙基己基二苯酯、9,1〇_二氫_9_氛雜_1〇_磷雜菲 -10-氧化物、10-(2,5-二羥基苯基)_ι〇Η_9_氧雜·ι〇_磷雜菲 ❹ -10-氧化物、縮合9,10-二氫-9-氧雜_ι〇_磷雜菲_ι〇_氧化物 等。 這些阻燃劑中’若使用以下述式(e-Ι)所表示的化合 物即縮合9,10-二氫-9-氧雜-10-磷雜菲-10-氧化物(昭和高 分子股份有限公司製造的HFA-3003(商品名)),則即便於 將由喷墨用墨水所得的硬化膜曝露於高溫狀態下的情形 下,亦不會有隊燃劑的滲出(bleed out) ’故較好。^iy4^piT A flame retardant (E) may be contained in order to impart flame retardancy to the ink for inkjet. The phosphorus-based compound in the flame retardant (E) has less influence on the environment, and is therefore preferred. Specific examples of the flame retardant (E) of the structural compound include triphenyl phthalate, tricresyl phosphate, tris(xylylene) phosphate, tolylphenyl phosphate, and 2-ethylhexyl diphenyl acid. Ester, 9,1〇_dihydro_9_azepine_1〇_phosphaphenanthrene-10-oxide, 10-(2,5-dihydroxyphenyl)_ι〇Η_9_oxa·ι〇_phosphine Phenanthrenequinone -10-oxide, condensed 9,10-dihydro-9-oxa-am〇_phosphonium phenanthrene_oxide. Among these flame retardants, 'the compound represented by the following formula (e-Ι) is a condensed 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (Showa Polymer Co., Ltd. HFA-3003 (trade name) manufactured by the company, even if the cured film obtained from the inkjet ink is exposed to a high temperature state, there is no bleed out of the group fuel. .
25 20101679925 201016799
—u (e-1) (CH2)2—u (e-1) (CH2)2
阻燃劑(E)可為選自上述化合物的丨種化合物另 外亦可為這些化合物的大於等於2種的混合物。若於噴墨 用墨水中含l〇wt%〜50wt〇/〇的阻燃劑(E),則由噴墨用墨 水所得的硬化膜表現出較高的阻燃性(相當於ul (Underwriter Laboratories)燃燒試驗法 v_〇 標準田),、因此 較好。 1-6多官能(甲基)丙烯酸酯(f) 就提高光敏感度的觀點而言,可於喷墨用墨水 能(曱基)丙烯酸酯(F),尤其是若為不具有羥基二夕 官能(甲基)丙烯酸酯則較好。此處,即便於不具^二 多官能(甲基)丙烯酸g旨中含有製造時所混人的 :、 的、或作為未反應物的具有羥基的多官能(曱美 醋’上述情形下的含量亦極少,故仍可看作不^烯峻 、,趣基的 26 201016799 J 1 jpil 多官能(曱基)丙烯酸酯(F)。多官能(甲基)丙烯酸酯(F) 可為選自以下所列舉的化合物的1種化合物,另外,亦可 為這些化合物的大於等於2種的混合物。 不具有經基的多官能(曱基)丙烯酸酯(F)的具體例可 列舉:乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸 酯、二乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸 酯、聚乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸 參 酯、二丙二醇二(曱基)丙烯酸酯、三丙二醇二(甲基)丙烯酸 酯、四丙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸 酯、雙酚A型環氧乙烷改質二(甲基)丙烯酸酯、雙酚F型 環氧乙烷改質二(曱基)丙烯酸酯、三羥曱基丙烷三(曱基) 丙烯酸酯、環氧乙烷改質三羥甲基丙烷三(曱基)丙烯酸 酯、環氧丙烷改質三羥甲基丙烷三(甲基)丙烯酸酯、二(三 羥甲基丙烷)四(甲基)丙烯酸酯、甘油三(曱基)丙烯酸酯、 1,6-己二醇二(曱基)丙烯酸酯、甲氧基化二(甲基)丙烯酸環 =酯、新戊二醇二(甲基)丙烯酸酯、二甘油四(曱基)丙烯酸 酉曰、季戊四醇四(甲基)丙烯酸酯、二季戊四酵六(曱基)丙烯 酸醋、己内S旨改質二季戊四醇六(甲基)丙稀酸醋、M_ 丁二 醇二(曱基)丙烯酸醋、以丁二醇二(甲基)丙稀酸醋、二(甲 基)丙烯酸二環戊醋、三[(曱基)丙稀酿氧基乙基]異三聚氮 曰、及己内酯改質三曱基)丙烯醯氧基乙基]異三聚氰酸 曰盼酸月漆型環氧丙烯酸S旨、雙紛a型環氧丙烯酸醋、 雙紛I型環氧丙婦酸g旨、間苯二㈣環氧丙_酸醋等。 這些多官能(甲基)丙稀酸酯中,若含有選自雙盼F型 27 201016799 3W:>pit 環氧乙院改質二(曱基)丙烯酸酯、季戊四醇四丙稀酸酯、 一季戊四醇六丙烯酸酯、己内酯改質二季戊四醇六(曱基) 丙烯酸酯、三[(甲基)丙烯醯氧基乙基]異三聚氰酸酯、及己 内酯改質三[(甲基)丙烯醯氧基乙基]異三聚氰酸酯、雙酚F 型環氧丙烯酸酯的大於等於1種,則硬化膜的耐化學藥品 性變高,因此更好。 於雙酚F型環氧丙烯酸酯中,市售有日本化藥股份有 限公司製造的ZFR 1122、1401H、1491H(商品名),Japan U-pica股份有限公司製造的NE0P0L 8477 (商品名)等。 若於喷墨用墨水中含有5 wt%〜80 wt%的多官能(甲 基)丙烯酸酯(F)’則於製成喷墨用墨水的情形時,對光成 尚感光度,另外,硬化膜的鑛敷液耐性變高,故較好,若 多官能(曱基)丙烯酸酯(F)的含量為i〇wt〇/^〜7〇wt〇/。, 則更好。 1.7其他成分 為了提咼保存穩定性、或所形成的膜的耐久性、所形 成的膜的膜面均勻性、所形成的膜的阻燃性、墨水的噴出 特性、墨水的塗佈性等,噴墨用墨水可含有溶劑、反應性 稀釋劑、聚合抑制劑、界面活性劑、著色劑、抗靜電劑等。 這些成分可為1種化合物’亦可為大於等於2種化合物的 混合物。 另外,喷墨用墨水中的水分量並無特別限定,較好的 是小於等於1_0 ppm ’更好的是小於等於5,_解。 若為這些水分量,則喷墨用墨水_度變化較少,且保存 28 201016799The flame retardant (E) may be a ruthenium compound selected from the above compounds or a mixture of two or more of these compounds. If the inkjet ink contains 1% by weight to 50% by weight of the flame retardant (E), the cured film obtained from the inkjet ink exhibits high flame retardancy (equivalent to ul (Underwriter Laboratories) ) The combustion test method v_〇 standard field), so it is better. 1-6 polyfunctional (meth) acrylate (f) In terms of improving light sensitivity, it can be used in inkjet inks (fluorenyl) acrylate (F), especially if it has no hydroxy erbium function (Meth) acrylate is preferred. Here, even in the case where the non-difunctional (meth)acrylic acid g is contained, the polyfunctional (combined vinegar) having a hydroxyl group which is mixed at the time of production or as an unreacted product is contained in the above case. It is also rare, so it can still be regarded as a non-olefinic, funky 26 201016799 J 1 jpil polyfunctional (fluorenyl) acrylate (F). The polyfunctional (meth) acrylate (F) can be selected from the following The compound of the above-mentioned compound may be a mixture of two or more of these compounds. Specific examples of the polyfunctional (fluorenyl) acrylate (F) having no trans group may be exemplified by ethylene glycol. (Meth)acrylate, diethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol di(a) Acrylate, propylene glycol di(meth) acrylate, dipropylene glycol di(decyl) acrylate, tripropylene glycol di(meth) acrylate, tetrapropylene glycol di(meth) acrylate, polypropylene glycol di(a) Acrylate, bisphenol A type ethylene oxide modified II Acrylate, bisphenol F-type ethylene oxide modified bis(indenyl) acrylate, trishydroxypropyl propane tris(indenyl) acrylate, ethylene oxide modified trimethylolpropane tris(fluorenyl) Acrylate, propylene oxide modified trimethylolpropane tri(meth)acrylate, bis(trimethylolpropane)tetra(meth)acrylate, glycerol tris(meth)acrylate, 1,6 - hexanediol di(decyl) acrylate, methoxylated di(meth)acrylic acid ring = ester, neopentyl glycol di(meth) acrylate, diglyceryl tetrakis(meth) ruthenium phthalate, pentaerythritol Tetrakis (meth) acrylate, dipentaerythra hexahydrate (mercapto) acryl vinegar, hexene succinate, dipentaerythritol hexa(methyl) acrylate vinegar, M-butanediol bis(indenyl) acrylate vinegar, Modified with butanediol di(meth)acrylic acid vinegar, di(pentameth)acrylic acid dicyclopentanacetic acid, tris[(indenyl)propyl oxyethyl]isotriazole, and caprolactone曱三曱) propylene methoxyethyl] isopropyl cyanuric acid lacquer type epoxy acrylate S, double a type epoxy acrylate vinegar, double sulphide type I epoxy glycerol , Isophthalic iv epoxypropyl _ vinegar and the like. Among these polyfunctional (meth) acrylates, if it contains a compound selected from the group consisting of double-prepared F type 27 201016799 3W: > pit epoxy epoxide modified bis(indenyl) acrylate, pentaerythritol tetrapropyl acrylate, Pentaerythritol hexaacrylate, caprolactone modified dipentaerythritol hexa(indenyl) acrylate, tris[(methyl)acryloxyethyl)isocyanate, and caprolactone modified three [(A) When one or more of the propylene oxyethylidene]isophthalocyanate and the bisphenol F-type epoxy acrylate are used, the chemical resistance of the cured film becomes high, which is preferable. Among the bisphenol F-type epoxy acrylates, ZFR 1122, 1401H, 1491H (trade name) manufactured by Nippon Chemical Co., Ltd., and NE0P0L 8477 (trade name) manufactured by Japan U-pica Co., Ltd., and the like are commercially available. When the inkjet ink contains 5 wt% to 80 wt% of a polyfunctional (meth)acrylate (F)', when it is used in an inkjet ink, sensitivity to light is formed, and hardening is performed. The mineralizing solution of the film becomes high in resistance, so it is preferred if the content of the polyfunctional (fluorenyl) acrylate (F) is i〇wt〇/^~7〇wt〇/. , it is better. 1.7 Other components In order to improve the storage stability, the durability of the formed film, the film surface uniformity of the formed film, the flame retardancy of the formed film, the discharge characteristics of the ink, and the coatability of the ink, etc., The ink for inkjet may contain a solvent, a reactive diluent, a polymerization inhibitor, a surfactant, a colorant, an antistatic agent, and the like. These components may be one compound' or a mixture of two or more compounds. Further, the amount of water in the ink for inkjet is not particularly limited, but is preferably 1_0 ppm or less, more preferably 5 or less. If it is these moisture content, the inkjet ink _ degree changes less, and saves 28 201016799
Jiy4^pit 穩定性優異,故較好。 1.7.1溶劑⑹ 為了提高墨水的喷出特性,喷墨用墨水可含有溶劑 (G)。該溶劑較好的是沸點大於等於100°C的溶劑。於室 温下的喷墨用墨水的黏度大於等於50 mPa‘s的情形時,較 好的是提高喷射溫度,於該情形下,所含的溶劑的沸點較 好的是大於等於200°C。 ©沸點大於等於100°C的溶劑的具體例可列舉:乙酸丁 酯、丙酸丁酯、乳酸乙酯、羥基乙酸曱酯、羥基乙酸乙酯、 羥基乙酸丁酯、曱氧基乙酸曱酯、甲氧基乙酸乙酯、曱氧 基乙酸丁酯、乙氧基乙酸甲酯、乙氧基乙酸乙酯、3-羥基 丙酸曱酯、3-羥基丙酸乙酯、3-甲氧基丙酸曱酯、3-甲氧 基丙酸乙酯、3-乙氧基丙酸曱酯、3-乙氧基丙酸乙酯、2-羥基丙酸曱酯、2-羥基丙酸乙酯、2-羥基丙酸丙酯、2-曱 • 氧基丙酸曱酯、2-曱氧基丙酸乙酯、2-甲氧基丙酸丙酯、 2-乙氧基丙酸曱酯、2-乙氧基丙酸乙酯、2-羥基-2-曱基丙 Ο 酸曱酯、2-羥基-2-甲基丙酸乙酯、2-曱氧基-2-曱基丙酸曱 酯、2-乙氧基-2-曱基丙酸乙酯、丙酮酸曱酯、丙酮酸乙酯、 丙酮酸丙酯、乙醯乙酸曱酯、乙醯乙酸乙酯、2-側氧丁酸 曱酯、2-側氧丁酸乙酯、二氧陸圜(dioxane )、乙二醇、 二乙二醇、三乙二醇、丙二醇、二丙二醇、三丙二醇、1,4-丁二醇、乙二醇單異丙基醚、乙二醇單丁基醚、丙二醇單 曱基醚、丙二醇單曱基醚乙酸酯、丙二醇單乙基醚乙酸酯、 丙二醇單丙基醚乙酸酯、二丙二醇單曱基醚乙酸酯、二丙 29 201016799 iiy4!)pit 二醇單乙基醚乙酸酯、二丙二醇單丁基醚乙酸酯、乙 單丁基醚乙酸酯、環己酮、環戊酮、二乙二醇單甲基醚、 二乙二醇單曱基醚乙酸酯、二乙二醇單乙基醚、二乙二醇 單乙基謎乙酸醋、二乙二醇單丁基喊、二乙二醇單丁美醚 乙酸酯、二乙二醇二曱基醚、二乙二醇二乙基醚、二^二 醇曱基乙基醚、甲笨、二甲苯、苯㈣、r丁内醋、^_ 二曱基乙醯胺、Ν·甲基_2_料咬酮、二f基_嗤㈣ (dimethyl imidaZ〇lidinone)。這些溶劑中的水分量較理相 的是以喷卵墨水中的水分量成為上述範圍的方式進行g ⑩ 整。 β 這些溶劑中’若使用二丙二醇單甲基謎乙酸醋、 二醇單乙基醚乙酸醋、二丙二醇單丁基喊乙酸醋、丙二 單曱細乙酸醋、丙二醇單乙細乙酸醋、3_甲氧基丙酸 甲醋、3·乙氧基丙酸乙酯、二乙二醇單乙細乙酸醋、二 乙二醇單丁基醚乙酸酯、二乙二醇二甲基醚、二乙 · 基乙基_等’則墨水的喷出穩定,故較好。 若於喷墨用墨水中含有〇wt%〜5〇加%的溶劑, 則製成光硬化性喷墨用墨水的情形時的噴出穩定, 好,更好的是0 wt%〜20 wt%。 而且’由於墨水的表面張力會對喷墨用墨水的塗佈性 產生較大影響’因此較好的是將墨水的表面張力調整為2〇 mN/m〜45 mN/m,更好的是調整為”她〜仏_/m, 進而好的是調整為30mN/m〜4〇mN/m。若表面張力為2〇 mN/m〜4 5 mN/m的範圍’則墨水噴出口的墨水彎液面(址 30 201016799 meniscus)變得穩定,並且墨水的噴出變得良好。 為將表面張力調整為20mN/m〜45 mN/m的範圍,重 要的是溶劑選擇。可使用表面張力處於2〇 mN/m〜45 mN/m的範圍的1種溶劑,若混合使用表面張力較大的溶 劑(例如r -丁内酯:43 mN/m)及表面張力較小的溶劑(例 如二乙二醇甲基乙基醚:24 mN/m、或乙二醇單丁基醚: 32 mN/m),則能以溶劑組成對表面張力進行微調整,故較 好。 ❹ 1.7.2反應性稀釋劑(H) 為了調整墨水的黏度或控制硬化膜的交聯度,嘴墨用 墨水可含有反應性稀釋劑(H)。若使用反應性稀釋劑(η) 替代溶劑或置換溶劑的一部分,則墨水的固體成分濃度變 同,故可形成厚膜。反應性稀釋劑(H)表示與含有大於 等於5員環的環狀醚的自由基聚合性單體(a)、具有熱反 應性官能基的自由基聚合性單體(B)、多官能(曱基)丙烯 " 酸醋(F)不同的化合物。 ® 反應性稀釋劑(H)的具體例可列舉:(甲基)丙稀酸 正丁酯、(曱基)丙烯酸硬脂酯、(曱基)丙烯酸月桂酯、(甲 基)丙烯酸異癸醋、(甲基)丙烯酸十三烧g旨、(曱基)丙稀酸 -2-(2-乙氧基乙氧基)乙醋、(甲基)丙烯酸環己g旨、(曱基)丙 烯酸異冰片酯、丙烯酸-2-苯氧基乙酯等。 這些反應性稀釋劑中’(曱基)丙烯酸正丁酯、(甲基) 丙烯酸環己酯藉由使用較少的量,便可較大地降低噴墨用 墨水的黏度,故較好。 31 201016799 Jiy45pil 若於嗔墨用墨水中含有5 wt%〜⑹wt%的反應性稀釋 劑H) ’則於製成光硬化性噴墨用墨水的情形時,利用E 型黏度計所败的坑下的黏度成為 2 mPa.s〜500 mPa. s的範圍,故較好,更好的是1〇wt%〜5〇wt%。 H3聚合抑制劑(I) 為了提高保存穩定性’喷墨用墨水可含有聚合抑制 劑。聚合抑制劑的具體例可列舉4甲氧基苯酚、對苯二酚 〇iydr0quinone)、紛噻嗪(phen〇thiazine)等這些聚合 抑制劑中,就使喷射時加熱嘴墨喷頭的情形下的墨水轉 © 度變化為最小的觀點而言,較好的是使用盼嗟嗪作為聚合 抑制劑。 就使喷墨用墨水的保存穩定性與對光的高感光度性 並存的觀點而言,較好的是於噴墨用墨水中含有⑶lwt% 〜1 wt%的聚合抑制劑。 1.7.4界面活性劑⑴ 為了提咼由喷墨用墨水所得的膜面的均勻性,噴墨用 墨水可含有界面活性劑。界面活性劑可使用矽(siHc〇n) ❿ 系界面活性劑、丙烯酸系界面活性劑、及氟系界面活性劑 等。具體可列舉:Byk-300、Byk-306、Byk-335、Byk-310、Jiy4^pit is excellent in stability, so it is better. 1.7.1 Solvent (6) In order to improve the discharge characteristics of the ink, the ink for inkjet may contain a solvent (G). The solvent is preferably a solvent having a boiling point of 100 ° C or higher. When the viscosity of the ink for ink jet at room temperature is 50 mPa or more, it is preferable to increase the ejection temperature. In this case, the boiling point of the solvent contained is preferably 200 ° C or more. Specific examples of the solvent having a boiling point of 100 ° C or more include butyl acetate, butyl propionate, ethyl lactate, decyl hydroxyacetate, ethyl hydroxyacetate, butyl hydroxyacetate, decyl decyl acetate, Ethyl methoxyacetate, butyl oxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, decyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, 3-methoxypropane Hydrate ester, ethyl 3-methoxypropionate, decyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, decyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, Propyl 2-hydroxypropionate, decyl 2-oxoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, decyl 2-ethoxypropionate, 2 -ethyl ethoxypropionate, decyl 2-hydroxy-2-mercaptopropionate, ethyl 2-hydroxy-2-methylpropionate, decyl 2-methoxy-2-mercaptopropionate Ethyl 2-ethoxy-2-mercaptopropionate, decyl pyruvate, ethyl pyruvate, propyl pyruvate, decyl acetate, ethyl acetate, bismuth 2-oxobutanoate Ester, ethyl 2-oxobutanoate, dioxane, ethylene glycol, diethylene glycol, triethylene glycol, Propylene glycol, dipropylene glycol, tripropylene glycol, 1,4-butanediol, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, propylene glycol monodecyl ether, propylene glycol monodecyl ether acetate, propylene glycol single Ethyl ether acetate, propylene glycol monopropyl ether acetate, dipropylene glycol monodecyl ether acetate, dipropylene 29 201016799 iiy4!) pit diol monoethyl ether acetate, dipropylene glycol monobutyl ether Acetate, ethylene monobutyl ether acetate, cyclohexanone, cyclopentanone, diethylene glycol monomethyl ether, diethylene glycol monodecyl ether acetate, diethylene glycol monoethyl ether , diethylene glycol monoethyl acetal acetate, diethylene glycol monobutyl sulphate, diethylene glycol monobutyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol diethyl ether , di-glycol decyl ethyl ether, methyl benzene, xylene, benzene (tetra), r butyl vinegar, ^ dimethyl acetamide, hydrazine methyl _2 ketone, bis ke ketone (iv) (dimethyl imidaZ〇lidinone). The amount of water in these solvents is relatively uniform in such a manner that the amount of water in the sprayed ink reaches the above range. β In these solvents, use dipropylene glycol monomethyl mycoacetic acid vinegar, diol monoethyl ether acetate vinegar, dipropylene glycol monobutyl ketone acetic acid vinegar, propylene dimethoate acetic acid vinegar, propylene glycol monoethyl acetate vinegar, 3 _Methoxypropionic acid methyl vinegar, 3 · ethoxy propionate ethyl ester, diethylene glycol monoethyl acetate vinegar, diethylene glycol monobutyl ether acetate, diethylene glycol dimethyl ether, It is preferable that the ejection of the ink is stable, such as diethylidyl ethyl _ et al. When the ink for inkjet ink contains 5% by weight to 5% by weight of the solvent, the discharge is stable in the case of producing a photocurable inkjet ink, and more preferably 0 wt% to 20 wt%. Moreover, 'because the surface tension of the ink has a large influence on the coatability of the ink for inkjet ink', it is preferable to adjust the surface tension of the ink to 2 〇 mN/m to 45 mN/m, and more preferably to adjust It is "she ~ 仏 _ / m, and further preferably adjusted to 30 mN / m ~ 4 〇 mN / m. If the surface tension is in the range of 2 〇 mN / m ~ 4 5 mN / m ' then the ink jet of the ink jet The liquid level (address 30 201016799 meniscus) becomes stable and the ejection of the ink becomes good. To adjust the surface tension to the range of 20 mN/m to 45 mN/m, it is important to select the solvent. The surface tension can be used at 2〇. a solvent having a range of mN/m to 45 mN/m, if a solvent having a large surface tension (for example, r-butyrolactone: 43 mN/m) and a solvent having a small surface tension (for example, diethylene glycol) Methyl ethyl ether: 24 mN/m, or ethylene glycol monobutyl ether: 32 mN/m), it is better to finely adjust the surface tension with solvent composition. ❹ 1.7.2 Reactive diluent (H) In order to adjust the viscosity of the ink or to control the degree of crosslinking of the cured film, the ink for the nozzle ink may contain a reactive diluent (H). If reactive dilution is used. (η) In place of a part of the solvent or the replacement solvent, the solid content of the ink becomes the same, so that a thick film can be formed. The reactive diluent (H) represents a radical polymerizable property with a cyclic ether having a ring of 5 or more members. Monomer (a), a radically polymerizable monomer having a thermally reactive functional group (B), a polyfunctional (fluorenyl) propylene " vinegar (F) different compound. ® Reactive diluent (H) Specific examples thereof include (meth) n-butyl acrylate, stearyl (decyl) acrylate, lauryl (meth) acrylate, isophthalic acid (meth) acrylate, and tridecyl (meth) acrylate. g, (mercapto) acrylic acid-2-(2-ethoxyethoxy) ethyl acetonate, (meth)acrylic acid cyclohexyl, (fluorenyl) isobornyl acrylate, acrylic acid-2-benzene Ethyl ethoxide, etc. In these reactive diluents, n-butyl (meth) acrylate and cyclohexyl (meth) acrylate can greatly reduce the viscosity of the ink for inkjet by using a small amount. Therefore, it is better. 31 201016799 Jiy45pil If the ink used in the ink contains 5 wt% ~ (6) wt% of reactive diluent H) ' When the photocurable inkjet ink is used, the viscosity under the pit which is lost by the E-type viscometer is in the range of 2 mPa·s to 500 mPa·s, so it is better, and more preferably 1 〇wt. %〜5〇wt% H3 polymerization inhibitor (I) In order to improve storage stability, the inkjet ink may contain a polymerization inhibitor. Specific examples of the polymerization inhibitor include 4-methoxyphenol and hydroquinone 〇iydr0quinone. Among these polymerization inhibitors such as phenazine and phenazine thiazine, it is preferred to use the prostaglandin from the viewpoint of minimizing the change in the degree of change in the ink in the case of the nozzle nozzle during the ejection. As a polymerization inhibitor. From the viewpoint of coexisting the storage stability of the ink for inkjet and the high sensitivity to light, it is preferred that the inkjet ink contains (3) 1% by weight to 1% by weight of a polymerization inhibitor. 1.7.4 Surfactant (1) In order to improve the uniformity of the film surface obtained from the inkjet ink, the inkjet ink may contain a surfactant. As the surfactant, a cerium (siHc〇n) lanthanum surfactant, an acrylic surfactant, a fluorine-based surfactant, or the like can be used. Specific examples include: Byk-300, Byk-306, Byk-335, Byk-310,
Byk-341、Byk-344、或 Byk-370(分別為商品名;Byk_chemie 股份有限公司製造)等矽系界面活性劑;Byk_354、Byk-341, Byk-344, or Byk-370 (commercial name; manufactured by Byk_chemie Co., Ltd.) and other lanthanide surfactants; Byk_354,
Byk-358、或Byk_361 (分別為商品名;Byk Chemie股份 有限公司製造)4丙烯酸系界面活性劑;DFX_18、Ftergent 250、或Ftergent251 (分別為商品名;Ne〇s股份有限公司 32 201016799 31945pit 製造),Megafac F_410、Megafac F_443、他科趾 F 445、Byk-358, or Byk_361 (trade name; manufactured by Byk Chemie Co., Ltd.) 4 acrylic surfactant; DFX_18, Ftergent 250, or Ftergent 251 (trade name respectively; Ne〇s Co., Ltd. 32 201016799 31945pit) , Megafac F_410, Megafac F_443, and other toe F 445,
Megafac F-470、Megafac F-479、Megafac F-483、Megafac F-489 (为別為商品名;Dainipp〇n Ink股份有限公司製造) 等氟系界面活性劑。A fluorine-based surfactant such as Megafac F-470, Megafac F-479, Megafac F-483, Megafac F-489 (trade name: manufactured by Dainipp〇n Ink Co., Ltd.).
若於熱硬化性組成物中含有大於等於〇〇1 wt%的界 面活性劑,則硬化膜的膜面均勻性提高,故較好,若考慮 到與其他特性的平衡,則較好的是〇 〇1 wt%〜i wt%。 1.7.5著色劑(κ) 喷墨用墨水可含有著色劑,此時,例如於檢查所得的 硬化膜的狀料可容易地與基板制。於嘴㈣墨水中可 含有0.01 wt%〜1〇 wt%左右的著色劑,較好岐含有 邊〜5感左右的著色劑。就墨水原料的相容性的觀點而 言’著色劑較好的是染料。 1.7.6抗靜電劑(L) 抗靜電劑並無特別限定,可使用公知的抗靜 體可列舉:氧化錫、氧化錫.氧化銻複合氧化物、錫 氧化銦複合氧化物等金屬氧化物,或四級銨(amm〇nium; 鹽等。抗靜電劑是用以防止帶電的’較好岐相對) 用墨水100重量份而添加使用〇.〇1重量份〜1重量份。 1.8喷墨用墨水的製備方法 里刀。 細墨水較好的是藉由對現合必需成 膜 液進行過_調整。於_、中’例如可使用氟樹脂製^ 過滤器(membrane filter)等。 1.9喷墨用墨水的黏度 33 201016799 3iy4^pit 若噴墨用墨水利用E型黏度計所測定的25。(:下的黏 度為2mPa.s〜500mPa.s,則自喷墨喷頭的塗佈特性(喷 射精度等)變得良好,因此較好。25。(:下的喷墨用墨水的 黏度更好的是3 mPa.s〜300 mPa.s,進而好的是5 mPa.s 〜200 mPa· s 〇 於25 C下的黏度超過3〇 mPa. s的情形時,若加熱喷 墨喷頭而降低噴出時的黏度,則可實現更加穩定地喷出。 於加熱噴墨嘴頭進行喷射的情形時,加熱溫度(較好的是 40C〜120°C )下的噴墨用墨水的黏度較好的是3 mPa.s 〜 30 mIVs ’若噴墨用墨水的黏度為5 mPa.s〜25 mPa.s, 則更好’尤其好的是7 mPa.s〜2〇 mpa.s。 喷墨用墨水的保存 喷墨用墨水若於-2(TC〜2(TC下進行保存,則黏度變化 較小,且保存穩定性良好。 2·藉由喷墨方法的喷墨用墨水的塗佈 本發明的喷墨用墨水可使用公知的噴墨塗佈方法進 "Γ亍塗佈噴墨塗佈方法例如有:將機械能(mechanical energy)作用於墨水,而使墨水自喷頭喷出(塗佈)的方 法(所明壓電方式(piez〇));以及將熱能作用於墨水而 塗佈墨水的塗佈方法(所謂氣泡喷射(bubble-jet)(註冊 商標)方式)等。 j v胃 # —藉由使用喷墨塗佈方法,可將喷墨用墨水塗佈成預先 〇又疋的圖案狀。藉此,可僅於需要的部位塗佈墨水,與光 微影法相比,可降低成本。 201016799 你^使用本發明的噴墨用墨水進行塗佈時較好的塗 ===?舉:包含,些墨水的墨水收 、塗佈單元。塗佈單元例如可列舉:使與 生對應的熱能作用於墨水,並藉由上述能量而產 生墨水液滴的塗佈單元。 ❿ 熱部頭具或金屬氧化物的發 具㈣i 赁 述金屬及/或金屬氧化物的 叙(AD等金HM(Ta)、錯㈤、钦(Ti)、錄(Ni)、 〕等金屬、及這些金屬的氧化物等。 置例明用墨水進行塗料較好的塗佈裝 二裝置的固定部位,經由墨水供給構件例如管^ 而向塗钸喷頭供給墨水的形態。 ) 2外,喷墨时出(㈣)溫餘好的是阶〜 3〇时2溫度下时墨用墨柄減較好岐3时a.s〜 3.硬化膜的形成 本發明的硬化膜可使用公知的喷墨塗佈方法,將上述 35 201016799When the thermosetting composition contains a surfactant of 大于1 wt% or more, the uniformity of the film surface of the cured film is improved, so that it is preferable to consider the balance with other characteristics. 〇1 wt%~i wt%. 1.7.5 Colorant (κ) The ink for inkjet may contain a coloring agent. In this case, for example, the material of the obtained cured film can be easily made into a substrate. The ink may be contained in the ink of the mouth (four) in an amount of about 0.01 wt% to about 1% by weight, and preferably contains a coloring agent of about 5% to about 5%. From the viewpoint of the compatibility of the ink raw material, the coloring agent is preferably a dye. 1.7.6 Antistatic agent (L) The antistatic agent is not particularly limited, and a known antistatic agent may be a metal oxide such as tin oxide, tin oxide, cerium oxide composite oxide or tin indium oxide composite oxide. Or a quaternary ammonium (amm〇nium; a salt, etc.. The antistatic agent is used to prevent charging.) It is used in an amount of 100 parts by weight of the ink, and 1 part by weight to 1 part by weight. 1.8 Preparation method of ink for inkjet. Fine ink is preferably adjusted by the necessary film forming solution. For example, a fluororesin filter or the like can be used. 1.9 Viscosity of ink for inkjet 33 201016799 3iy4^pit If the ink for inkjet is 25 measured by an E-type viscometer. (The viscosity of the lower ink is 2 mPa·s to 500 mPa·s, and the coating characteristics (ejection accuracy, etc.) from the ink jet head are good. Therefore, the viscosity of the inkjet ink is lower. Preferably, it is 3 mPa.s to 300 mPa.s, and further preferably 5 mPa.s to 200 mPa·s. When the viscosity at 25 C exceeds 3 〇 mPa·s, if the inkjet head is heated, When the viscosity at the time of ejection is lowered, a more stable discharge can be achieved. In the case of heating the ink jet head to eject, the ink of the ink jet at a heating temperature (preferably 40 C to 120 ° C) has a good viscosity. It is 3 mPa.s ~ 30 mIVs 'If the viscosity of inkjet ink is 5 mPa.s~25 mPa.s, then it is better', especially 7 mPa.s~2〇mpa.s. When the ink is stored at -2 (TC~2 (TC), the viscosity change is small and the storage stability is good. 2. The inkjet ink by the inkjet method is coated with the present invention. The inkjet ink can be sprayed by a known inkjet coating method. For example, the inkjet coating method is applied to: mechanical energy is applied to the ink, and the ink is self-sprayed. a method of ejecting (coating) a head (a piezoelectric method (piez)); and a coating method of applying ink by applying thermal energy to an ink (so-called bubble-jet (registered trademark) method) Jv stomach #— By using an inkjet coating method, the ink for inkjet can be applied in a pre-twisted pattern, whereby the ink can be applied only at a desired portion, and the photolithography method is used. In comparison, the cost can be reduced. 201016799 You can use the inkjet ink of the present invention to apply a better coating. ===: It includes an ink collecting and coating unit for some inks. A coating unit that generates thermal ink corresponding to the ink and generates ink droplets by the above energy. ❿ Hot head or metal oxide hair (4) i cites the metal and/or metal oxide Metals such as AD such as HM (Ta), er(5), chin (Ti), and (Ni), and oxides of these metals, etc. The use of inks for the coating of coatings is better. a portion that supplies ink to the coating nozzle via an ink supply member such as a tube State.) 2, when the ink is ejected ((4)) the temperature is good is the order ~ 3 〇 when the temperature is lower than 2 when the ink stalk is better 岐 3 as~ 3. The formation of the cured film The cured film of the present invention A well-known inkjet coating method can be used, which will be the above 35 201016799
Jiy4i5pit 喷墨用墨水噴出至基板表面後,對墨水照射紫外線或可見 光線等光而獲得。經光照射的部分的墨水藉由自由基聚合 性單體’例如(甲基)丙烯酸系單體的聚合而成為立體化交 聯體而硬化’從而有效地抑制墨水的擴散。因此,若使用 上述噴墨用墨水’則可實現高精細的圖案的描繪。所照射 的光的量依存於喷墨用墨水的組成,於使用紫外線作為照 射的光的情形時,辦照射的紫外線的量是利用Ushio Denki 股份有限公司製造的安裝有受光器UVD_405PD的累計光 量計UIT-201進行測定,較好的是1〇 mj/cm2〜ι,〇〇〇 mJ/cm左右’更好的是10 mJ/em2〜800 mJ/cm2左右,進 而好的是20 mJ/cm2〜500 mJ/cm2左右。另外,所照射的紫 外線的波長較好的是200 nm〜450 nm,更好的是220 nm 〜430 nm ’進而好的是250 nm〜400nm。 另外’視需要可進一步對藉由光的照射而硬化的上述 硬化膜進行加熱、煅燒,尤其好的是於12(TC〜25CTC下加 熱10分鐘〜60分鐘,更好的是於Mot〜24〇。(:下加熱1〇 分鐘〜60分鐘’進而好的是於i8〇〇c〜23〇°c下加熱分 鐘〜60分鐘。 本發明中所使用的基板若為可成為塗佈上述喷墨用 墨水的對象的基板,則並無特別限定,其形狀並不限於平 板狀,亦可為曲面狀。 另外,基板的材質並無特別限定,例如可列舉:聚對 苯二甲酸乙二酯(PET,polyethylene terephthalate )、聚對 苯二甲酸丁二酯(PBT,polybutylene terephthalate)等聚 201016799The Jiy4i5pit inkjet ink is ejected onto the surface of the substrate, and is then obtained by irradiating the ink with ultraviolet light or visible light. The ink of the portion irradiated with light is hardened by the polymerization of a radical polymerizable monomer, for example, a (meth)acrylic monomer, to form a three-dimensional crosslinked body, thereby effectively suppressing the diffusion of the ink. Therefore, the use of the inkjet ink described above enables the drawing of a high-definition pattern. The amount of light to be irradiated depends on the composition of the ink for inkjet. When ultraviolet light is used as the light to be irradiated, the amount of ultraviolet light to be irradiated is an integrated light meter equipped with a light receiver UVD_405PD manufactured by Ushio Denki Co., Ltd. UIT-201 is measured, preferably 1 〇 mj / cm 2 ~ i, 〇〇〇 mJ / cm or so 'better 10 mJ / em 2 ~ 800 mJ / cm 2 or so, and preferably 20 mJ / cm 2 ~ 500 mJ/cm2 or so. Further, the wavelength of the ultraviolet light to be irradiated is preferably from 200 nm to 450 nm, more preferably from 220 nm to 430 nm and further preferably from 250 nm to 400 nm. Further, the above-mentioned cured film which is hardened by irradiation with light may be further heated and calcined as needed, and it is particularly preferably heated at 12 (TC to 25 CTC for 10 minutes to 60 minutes, more preferably at Mot to 24 Torr). (: heating for 1 minute to 60 minutes), and further preferably heating at i8〇〇c~23〇°c for ~60 minutes. The substrate used in the present invention can be used for coating the above inkjet. The substrate of the ink is not particularly limited, and the shape thereof is not limited to a flat plate shape, and may be a curved shape. The material of the substrate is not particularly limited, and examples thereof include polyethylene terephthalate (PET). ,polyethylene terephthalate ), polybutylene terephthalate (PBT), etc. 201016799
Jiy43pit 酯系樹脂,聚乙烯、聚丙烯等聚烯烴樹脂,聚氯乙烯、氟 樹脂、丙烯酸系樹脂、聚醯胺、聚碳酸酯、聚醯亞胺等塑 膠膜,賽珞玢(cellophane)、乙酸酯、金屬箔、聚醯亞胺 與金屬猪的積層膜、具有填充效果的玻璃紙(glassine paper)、羊皮紙(parchment paper)、或者利用聚乙烯、黏 土黏合劑、聚乙烯醇、澱粉、羧基曱基纖維素(, carboxymethyl cellulose)等進行填充處理的紙,玻璃等。 ❹ 構成基板的物質中,於不對本發明的效果產生不 良影響的範圍内,可進一步含有顏料、染料、抗氧化劑、 抗劣化劑、填充劑、紫外線吸收劑、抗靜電劑及/或防電磁 波劑等添加劑。另外,亦可於基板表面的_部分形成與基 板不同的材質。 基板的用途亦無特別限定,由本發明的噴墨用墨水所 得的硬化膜由於耐蝕刻液性、鍍敷液耐性、對鹼性水溶液 的剝離性、及耐熱性優異,因此較好的是用於 美 翁表面具有金屬製電路的電子電路基板等。形成電路的^屬 ® 並無特職定’較好的是金、銀、銅、銘或氧化銦錫(IT0, Indium Tin Oxide )。 基板的厚度並無特別限定,通常為1〇 左 右,根據所使用的目的而進行適當調整,較好的是15以 m〜500 /zm,更好的是2〇 "m〜2〇〇 "瓜。 亦可視需要於基板的軸硬化上實施斥水處 理、電暈(corona)處理、電漿(plasma)處理、嘴擊( 處理等易黏接處理,或者於表面設置易黏接層或彩色滤光 37 201016799 3194^pit 片(color filter)用保護膜。 另外’將喷墨用墨水僅塗佈於特定的部位,藉此可形 成特定圖案的硬化膜’並可謀求降低用於形成硬化膜的成 本。尤其是於電子電路基板中,於金屬配線圖案形成或鍍 敷圖案形成、金屬配線保護膜(覆蓋層)形成中,可將噴 出性、保存穩定性優異的本發明的喷墨用墨水僅塗佈於特 定的電路部分,因此可有效地形成符合各目的之硬化膜。 [實施例] ' 以下,藉由實施例進一步對本發明進行說明,但本發 _ 明並不受這些實施例限定。另外,以下只要無特別規定, 則「份」是指重量份。 實驗例及比較例中所使用的各成分如下所述。 含有大於等於5員環的環狀醚的自由基聚合性單體 (A) A1 :甲基丙烯酸四氫糠酯 (商品名「SR203」、Sartomer公司製造;5員環化合 物) A2 :環狀三羥甲基丙烷縮曱醛丙烯酸醋 % (商品名「SR531」、Sartomer公司製造;6員環化人 物) 〇 具有熱反應性官能基的自由基聚合性單體(B) B1 :曱基丙烯酸-2-羥基乙酯 B2 :鄰苯二甲酸單(甲基丙烯酸羥基乙酯) (商品名「CB-1」、新中村化學工業股份有限公司製 38 201016799 3194^ρΐ1 造) Β3 :丙烯酸_4-羥基丁酯 光聚合起始劑(C ) ci : 2,4,6-三曱基苯甲醯基二苯基氧化膦 (商品名「DAROCUR ΤΡΟ」、Ciba Japan股份有限公 司製造) 熱反應性樹脂(D) D1 ·聚乙稀苯盼 (商品名「Maruka Lyncur MS-2P」、丸善石油化學股 份有限公司製造) D2 .以上述式(d-Ι)所表示的化合物及其縮合物的 混合物 (商品名「Nikalac MW-30」、Sanwa Chemical 股份有 限公司製造) 阻燃劑(E) E1 :縮合9,10-二氫-9-氧雜-10-鱗雜菲_10_氧化物 (商品名「HFA-3003」、昭和高分子股份有限公司製 造) 多官能(甲基)丙烯酸酯(F) F1 :雙酚F型環氧丙烯酸酯 (商品名「NEOPOL 8477」、Japan U_pica股份有限公 司製造) F2 :雙酚F型環氧乙烷改質二丙烯酸酯 (商品名「M-208」、東亞合成股份有限公司製造) 39 201016799 3iy45pltJiy43pit ester resin, polyolefin resin such as polyethylene, polypropylene, plastic film such as polyvinyl chloride, fluororesin, acrylic resin, polyamide, polycarbonate, polyimine, cellophane, B Acidic acid, metal foil, laminated film of polyimine and metal pig, glasse paper with filling effect, parchment paper, or polyethylene, clay adhesive, polyvinyl alcohol, starch, carboxyl group Paper, glass, etc., which are subjected to filling treatment, such as carboxymethyl cellulose.物质 A substance constituting the substrate may further contain a pigment, a dye, an antioxidant, an anti-deterioration agent, a filler, an ultraviolet absorber, an antistatic agent, and/or an anti-electromagnetic wave agent within a range that does not adversely affect the effects of the present invention. And other additives. Further, a material different from the substrate may be formed on the _ portion of the surface of the substrate. The use of the substrate is not particularly limited, and the cured film obtained by the inkjet ink of the present invention is preferably used for etching liquid resistance, plating solution resistance, peelability to an alkaline aqueous solution, and heat resistance. An electronic circuit board or the like having a metal circuit on the surface of the Meg. There is no special job to form a circuit. ‘Better is gold, silver, copper, indium or indium tin oxide (IT0, Indium Tin Oxide). The thickness of the substrate is not particularly limited, but is usually about 1 Torr, and is appropriately adjusted depending on the purpose of use. Preferably, it is 15 m to 500 /zm, more preferably 2 〇"m~2〇〇" ;melon. It is also possible to perform water repellent treatment, corona treatment, plasma treatment, mouth impact (treatment, etc.) on the shaft hardening of the substrate, or to provide an easy adhesion layer or color filter on the surface. 37 201016799 3194^Pit protective film for color filter. In addition, 'the inkjet ink is applied only to a specific part, whereby a cured film of a specific pattern can be formed' and the cost for forming a cured film can be reduced. In particular, in the electronic circuit board, in the formation of a metal wiring pattern, a plating pattern, and a metal wiring protective film (cover layer), the inkjet ink of the present invention excellent in discharge property and storage stability can be coated only. It is disposed on a specific circuit portion, so that a cured film suitable for each purpose can be effectively formed. [Embodiment] Hereinafter, the present invention will be further described by way of examples, but the present invention is not limited by these examples. Unless otherwise specified, the "parts" means parts by weight. The components used in the experimental examples and the comparative examples are as follows. The cyclic ether having a ring of 5 or more members is contained. From the base polymerizable monomer (A) A1: tetrahydrofurfuryl methacrylate (trade name "SR203", manufactured by Sartomer Co., Ltd.; 5-membered ring compound) A2: cyclic trimethylolpropane acetal acrylate vinegar % ( Trade name "SR531", manufactured by Sartomer Co., Ltd.; 6-membered cyclized person) 自由基 Radical polymerizable monomer having a heat-reactive functional group (B) B1: 2-hydroxyethyl methacrylate B2: phthalic acid Mono (hydroxyethyl methacrylate) (trade name "CB-1", manufactured by Shin-Nakamura Chemical Co., Ltd. 38 201016799 3194^ρΐ1) Β3: Acrylic _4-hydroxybutyl ester photopolymerization initiator (C) Ci : 2,4,6-trimercaptobenzylidene diphenylphosphine oxide (trade name "DAROCUR ΤΡΟ", manufactured by Ciba Japan Co., Ltd.) Thermally reactive resin (D) D1 · Polyethylene benzene ( The product name "Maruka Lyncur MS-2P", manufactured by Maruzen Petrochemical Co., Ltd.) D2. A mixture of the compound represented by the above formula (d-Ι) and its condensate (trade name "Nikalac MW-30", Sanwa Chemical Manufacturing Co., Ltd.) Flame Retardant (E) E1 : Condensation 9,10-Dihydro-9- Miscellaneous 10-scale phenanthrene _10_oxide (trade name "HFA-3003", manufactured by Showa Polymer Co., Ltd.) Polyfunctional (meth) acrylate (F) F1: bisphenol F type epoxy acrylate (trade name "NEOPOL 8477", manufactured by Japan U_pica Co., Ltd.) F2: bisphenol F-type ethylene oxide modified diacrylate (trade name "M-208", manufactured by Toagosei Co., Ltd.) 39 201016799 3iy45plt
反應性稀釋劑(Η) HI :曱基丙烯酸環己酯 H2 :甲基丙烯酸丁酯 (實驗例1〜2、比較例1〜3)Reactive diluent (Η) HI : cyclohexyl methacrylate H2 : butyl methacrylate (Experimental Examples 1 to 2, Comparative Examples 1 to 3)
於本實驗例中,對形成含有5員環化合物作為含有大 於等於5員環的環狀醚的自由基聚合性單體(a)的本發 明的噴墨用墨水的硬化膜,來用於抗蝕用途或抗鍍敷用途 的情形進行驗證。以表1中所記載的比例(重量份)進行 調配,並混合、溶解,利用氟樹脂製薄膜過濾器(0.2以 m)進行過滤,而製備各喷墨用墨水。 另外’比較例1及2是主要對不含具有大於等於5員 環的環狀醚的自由基聚合性單體(A)成分的情形進行驗 證的例子,比較例3是主要對雖含(A)成分但不含熱反 應性樹脂(D)成分的情形進行驗證的例子。 40 3 201016799 ^ly^Dpu ❹ [表i] 成分 實驗例 比較例 1 2 1 2 A1 400 200 — — B1 50 50 50 50 B2 150 150 150 150 ---- C1 100 100 100 100 D1 30 30 30 30 F1 150 150 150 150 H1 — 200 400 H2 100 100 100 500 1 I〇o^In the present experimental example, a cured film of the inkjet ink of the present invention containing a 5-membered ring compound as a radically polymerizable monomer (a) having a cyclic ether of 5 or more members is used for the anti-corrosion film. Verification for etch or anti-plating applications. The ratio (parts by weight) described in Table 1 was adjusted, mixed, dissolved, and filtered through a fluororesin membrane filter (0.2 m) to prepare each inkjet ink. Further, 'Comparative Examples 1 and 2 are examples in which the radical polymerizable monomer (A) component having no cyclic ether of 5 or more members is contained, and Comparative Example 3 is mainly composed of (A). An example in which the component does not contain the component of the thermally reactive resin (D). 40 3 201016799 ^ly^Dpu ❹ [Table i] Ingredient Experimental Example Comparative Example 1 2 1 2 A1 400 200 — — B1 50 50 50 50 B2 150 150 150 150 ---- C1 100 100 100 100 D1 30 30 30 30 F1 150 150 150 150 H1 — 200 400 H2 100 100 100 500 1 I〇o^
〜3的噴墨用墨水 份塞嗪r妝^ 另外,於實驗例1〜2及比較例1 中,聚合抑制劑(I)是添加0.05重量~3 inkjet inks ketazine r makeup^ In addition, in Experimental Examples 1 to 2 and Comparative Example 1, the polymerization inhibitor (I) was added with 0.05 weight.
聚合抑制劑(I)以外的噴墨用墨水的總量設為1()Q 份)。 重量 (1 )墨水的黏度、由保管所引起的黏度的變化 利用E型黏度計(東機產業股份有限公司製造 ❷ VISCOMETER TV-22) ’對各噴墨用墨水於25。(:下的=声 進行測定。將結果示於表2中。 ^ 另外’將各喷墨用墨水的一部分(10 g)加入至3〇n^ 的樣品瓶中’並蓋緊,於100°C下保管5小時。並且,調 查保管後的墨水的黏度相對於保管前的墨水的黏度的變化 率。墨水的黏度均於保管後增加,將變化率小於1〇%的情 形判為「〇」,將大於等於10%的情形判為「X」。將結果 示於表2中。 可知’實驗例1〜2的喷墨用墨水的保存穩定性優異。 41 201016799 3iy45pii (2)噴射特性的評價 中,使用10pl用的嘴頭,於喷心 電壓)為16 V、嘴頭溫声兔7Λ。 件下,觀窣喰屮㈣又為 驅動頻率為5kHz的僻The total amount of the inkjet ink other than the polymerization inhibitor (I) is 1 () Q parts). (1) The viscosity of the ink and the viscosity of the ink were changed by an E-type viscometer (manufactured by Toki Sangyo Co., Ltd. ❷ VISCOMETER TV-22). (The following = sound was measured. The results are shown in Table 2. ^ In addition 'Part of each inkjet ink (10 g) was added to the vial of 3〇n^' and tightly closed at 100° The storage rate of the ink after storage was compared with the viscosity of the ink before storage. The viscosity of the ink was increased after storage, and the rate of change was less than 1%. The case where the ratio is 10% or more is judged as "X". The results are shown in Table 2. It is understood that the inkjet inks of Experimental Examples 1 to 2 are excellent in storage stability. 41 201016799 3iy45pii (2) Evaluation of ejection characteristics In the case of using 10 pl, the mouth voltage is 16 V, and the mouth is warm and the rabbit is 7 Λ. Under the condition, Guanlan (4) is also a secluded driving frequency of 5 kHz.
出,並:將噴射時的液柱沿著垂直方向, 生衛星點Satdlite)的情形判為「〇」 =與相鄰的液柱接觸或產生衛星點的情形 < 結果示於表2中。 (3 )武驗基板的製作 將各喷墨用墨水注入至嘴墨g中,並將其裝著於嘴墨 褒置(FUJIFILMDimatix公司製造的DMp_28〇〇)中,於And: the case where the liquid column at the time of spraying is in the vertical direction, the position of the satellite point Satdlite) is judged as "〇" = the case of contact with an adjacent liquid column or the generation of a satellite point < The results are shown in Table 2. (3) Production of the test substrate The ink for each inkjet was injected into the nozzle ink g, and it was placed in the nozzle ink set (DMp_28〇〇 manufactured by FUJIFILM Dimatix Co., Ltd.).
以下的基板製作齡下,藉㈣墨印錢(说㈣扣嫩、) 將各喷墨用墨水塗佈(赠)於基板上,接著,進行紫外 線(UV ’ ultraviolet)硬化,而製作形成有硬化膜的試驗 基板。使用以上述方式製作的試驗基板,對以下(4)〜(6) 所示的硬化膜對蝕刻液的耐性、對鹼性水溶液(剝離液) 的剝離性、對鍍敷液的耐性進行調查。 基板製作條件 基板:將銅箔積層於聚醯亞胺上而成的基板(厚度為 35 /i m) [(東洋紡績股份有限公司製造)Vyloflex (商品名)] 硬化膜的膜厚:30 //m 喷出條件:與上述(2)相同的喷出條件 42 201016799 3iy4^pit UV 曝光量:250mJ/cm2 (4)硬化膜對蚀刻液的耐性的評價 為了評價硬化膜對蝕刻液的耐性,而將所製作的試驗 基板於50°C的13%FeCl3水溶液中浸潰15分鐘,然後進行 水洗,並目視判定硬化膜的表面狀態。將未產生剝離或變 色的情形判為「〇」’將產生剝離或變色的情形判為「X」。 將結果示於表2中。 ® (5)硬化膜對鹼性水溶液(剝離液)的剝離性的評 價 為了評價硬化膜對鹼性水溶液(剝離液)的剝離性, 而將所製作的試驗基板於50°C的8%NaOH水溶液中浸潰1 分鐘,然後進行水洗,並目視判定硬化膜的剝離狀態。將 完全溶解或剝離的情形判為「〇」,將未溶解或剝離的情形 判為「X」。將結果不於表2中。 (6)硬化膜對鍍敷液的耐性的評價 • 為了評價硬化膜對鍍敷液的耐性,而將所製作的試驗 〇 基板於60°c的非電解鍍鎳液(商品名:Nimden NPR-4、 Ni濃度為4.5 g/L、上村工業股份有限公司製造)中浸潰 20分鐘,進行水洗,接著將其於60°C的金打底(Gold Strike ) 魏敷液(商品名:Acid Strike、日本高純度化學股份有限 公司製造)中浸潰10分鐘,進行水洗,接著將其於100¾ 的非電解鍍金液(商品名:Goblite TAM-55、Au濃度為i g/L、上村工業股份有限公司製造)中浸潰30分鐘,進行 水洗,藉此形成鍍敷皮膜。將該步驟中未產生鍍敷液滲入 43 201016799 3iy4i)pii =膜内部或剝離的情形判為「〇」,將產生鑛敷液渗入硬 化膜内部或剝離的情形判為「X」。將結果示於表2中。 硬化膜的特性 實驗例 比較例The following substrates are produced under the age of (4) ink-printed money (say (four) buckled,) each inkjet ink is coated (given) on a substrate, followed by ultraviolet (UV 'ultraviolet) hardening, and the resulting hardened Test substrate for the membrane. Using the test substrate prepared as described above, the resistance of the cured film shown in the following (4) to (6) to the etching solution, the peeling property to the alkaline aqueous solution (peeling liquid), and the resistance to the plating solution were examined. Substrate production condition substrate: a substrate obtained by laminating a copper foil on a polyimide (thickness: 35 / im) [(made by Toyobo Co., Ltd.) Vyloflex (trade name)] Thickness of cured film: 30 // m discharge condition: the same discharge condition as the above (2) 42 201016799 3iy4^pit UV exposure amount: 250 mJ/cm 2 (4) Evaluation of the resistance of the cured film to the etching liquid In order to evaluate the resistance of the cured film to the etching liquid, The prepared test substrate was immersed in a 13% FeCl3 aqueous solution at 50 ° C for 15 minutes, and then washed with water, and the surface state of the cured film was visually judged. The case where peeling or discoloration did not occur was judged as "〇", and the case where peeling or discoloration occurred was judged as "X". The results are shown in Table 2. ® (5) Evaluation of the peeling property of the cured film to the alkaline aqueous solution (release liquid) In order to evaluate the peelability of the cured film to the alkaline aqueous solution (release liquid), the prepared test substrate was 8% NaOH at 50 ° C. The solution was immersed in the aqueous solution for 1 minute, then washed with water, and the peeling state of the cured film was visually judged. The case of completely dissolving or peeling was judged as "〇", and the case of not being dissolved or peeled was judged as "X". The results are not in Table 2. (6) Evaluation of the resistance of the cured film to the plating solution • In order to evaluate the resistance of the cured film to the plating solution, the prepared test substrate was subjected to an electroless nickel plating solution at 60 ° C (trade name: Nimden NPR- 4, Ni concentration of 4.5 g / L, manufactured by Shangcun Industrial Co., Ltd.), soaked for 20 minutes, washed with water, and then placed at 60 ° C gold (Gold Strike) Wei dressing liquid (trade name: Acid Strike , manufactured by Japan High Purity Chemical Co., Ltd.), immersed for 10 minutes, washed with water, and then applied to 1003⁄4 of electroless gold plating solution (trade name: Goblite TAM-55, Au concentration ig/L, Shangcun Industrial Co., Ltd. The film was immersed for 30 minutes and washed with water to form a plating film. In the step, the plating solution was not infiltrated into the film, and the inside of the film or the peeling was judged as "〇", and the case where the ore solution was infiltrated into the hardened film or peeled off was judged as "X". The results are shown in Table 2. Characteristics of cured film Experimental example Comparative example
(實驗例3〜4、比較例4〜6) 於^驗射,對形成本發_喷㈣墨水的硬 來用於覆蓋層用途的情形進行驗證。 例(重詈份)糾偷Γ 所記載的比 膜過遽器⑽w進行 1^,、=’利_脂製薄 另外,比關4及5是主要料含H用等墨水^ 環的環狀醚的自由基聚合性單f「 ,大於專於5貝 證的例子,比較例ό是主要對 成分的情形進行驗 應性樹脂⑼成分的情形進行碰=子成分但不含熱反 201016799 3iy4^plt [表3] 成为 實辱 会例 比較例 3 4 4 5 1 6 A1 40 10 — _ 40 B3 15 15 15 15 15 C1 8 8 8 8 8 D2 10 10 10 10 E1 40 40 40 40 40 F2 70 70 70 70 70 H1 — 30 40 — 一 H2 — 一 — 40 — 另外,於實驗例3〜4及比較例4〜6的噴墨用墨水 中,聚合抑制劑(I)是添加0.05重量份的盼η塞唤(將除 聚合抑制劑(I)以外的噴墨用墨水的總量設為1〇〇重量 份)。 (1) 墨水的黏度、由保管所引起的黏度的變化 利用Ε型黏度計測定各噴墨用墨水於25。(:下的黏 度。將結果示於表4中。(Experimental Examples 3 to 4 and Comparative Examples 4 to 6) The test was carried out to verify the case where the ink of the present invention was used for the use of the cover layer. For example, the 膜 Γ Γ Γ 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比 比The free-radical polymerization of ether is a single f", which is larger than the example of the 5-boiler. The comparative example is mainly for the case of the component. The component of the test resin (9) is subjected to the touch-subcomponent but does not contain heat. 201016799 3iy4^ Plt [Table 3] becomes a humiliation example Comparative Example 3 4 4 5 1 6 A1 40 10 — _ 40 B3 15 15 15 15 15 C1 8 8 8 8 8 D2 10 10 10 10 E1 40 40 40 40 40 F2 70 70 Further, in the inkjet inks of Experimental Examples 3 to 4 and Comparative Examples 4 to 6, the polymerization inhibitor (I) was added with 0.05 part by weight of η. The total amount of the ink for inkjet other than the polymerization inhibitor (I) is 1 part by weight. (1) The viscosity of the ink and the change in viscosity due to storage are measured by a Ε-type viscometer. Each of the inkjet inks had a viscosity of 25. (the lower viscosity). The results are shown in Table 4.
另外,將各喷墨用墨水的一部分(1〇g)加入至3〇mL 的樣品瓶中,並蓋緊’於100°C下保管5小時。並且,調 查保管後的墨水的黏度相對於保管前的墨水的黏度的變化 率。墨水的黏度均於保管後增加,將變化率小於1〇%的情 形判為「〇」,將大於等於1〇%的情形判為Γχ」。將結果 斧於表4中。 ° 可知’實驗例3〜4的喷墨用墨水的保存穩定性優異。 (2) 噴射特性的評價 45 201016799 31945pif 將各喷墨用墨水注入至噴墨匡中,並將其裝著於嘴墨 裝置(FUJIFILM Dimatix公司製造的DMp_28〇〇)中,使 用10 pl用的喷頭,於喷出電壓(壓電電壓)為16v、喷 頭溫度為WC、驅動頻率為5 kHz的條件下,觀察喷出的 情況。將噴射時的液柱沿著垂直方向喷出,並且未產生衛 星點的情形判為「〇」’將液柱與相鄰的液柱接觸、或產生 衛星點的情形判為「X」。將結果示於表4中。 (3) 試驗基板的製作 將各噴墨用墨水注入至喷墨匣中,並將其裝著於喷墨 © 裝置(FUJIFILM Dimatix公司製造的DMP_28〇〇)中,於 以下的基板製作條件下,藉由噴墨印表機將各噴墨用墨水 塗佈(描緣)於基板上’接著進行uv硬化及熱硬化,而 製作形成有硬化膜的試驗基板。使用以上述方式製作的試 驗基板’對以下(4)及(5)所示的硬化膜對鍍敷液的对 性及焊錫耐熱性進行調查。 · 基板製作條件 基板:將銅箔積層於聚醯亞胺上而成的基板(厚度為 ❹ 35 β m) [(東洋纺績股份有限公司製造)Vyloflex (商品名)] 硬化膜的膜厚:30 /zm 喷出條件:與上述(2)相同的喷出條件 UV 曝光量:40 mJ/cm2 熱硬化條件:19(TCx30分鐘 (4) 硬化獏對鍍敷液的耐性的評價 46 201016799 3iy45plt 為了評價硬化膜對鍵敷液的耐性,而將所製作的試驗 基板於30°c的鈀水溶液(商品名:KAT-450、Pd為濃度12 mg/L、上村工業股份有限公司製造)中浸潰1分鐘,進行 水洗後’將其於8(TC的非電解鍍鎳液(商品名:Nimden NPR-4、Ni濃度為4.5 g/L、上村工業股份有限公司製造) 中浸漬30分鐘’進行水洗’接著,將其於8〇它的非電解 鍍金液(商品名:Goblite TAM-55、Au濃度為1 g/L、上 ❿ 村工業股份有限公司製造)中浸潰10分鐘,進行水洗,藉 此形成鍍敷皮膜。將該步驟中未產生鍍敷液滲入硬化膜内 部或硬化膜剝離的情形判為「〇」,將產生鍍敷液滲入硬化 膜内部或硬化膜剝離的情形判為「X」。將結果示於表4中。 (5)硬化膜的焊錫财熱性的評價 為了評價硬化膜的焊錫耐熱性’而於試驗基板的硬化 膜表面塗佈松香(rosin)系助焊劑(flux)(商品名:Ns_829、 Nihon Superior股份有限公司製造),並將其k26〇〇c的焊 錫浴中浸潰30秒’調查是否產生剝離或隆起。將完全未產 ® 生剝離與隆起的情形判為「〇」,將雖少但還是產生剝離或 隆起的情形判為「X」。將結果示於表4中。 47 201016799 31945pifFurther, a part (1 μg) of each inkjet ink was placed in a 3 〇mL sample vial and capped and stored at 100 ° C for 5 hours. Further, the rate of change of the viscosity of the ink after storage with respect to the viscosity of the ink before storage was examined. The viscosity of the ink is increased after storage, and the case where the rate of change is less than 1% is judged as "〇", and the case where the rate is greater than or equal to 1% is judged as "Γχ". The result is shown in Table 4. ° It is understood that the inkjet inks of Experimental Examples 3 to 4 are excellent in storage stability. (2) Evaluation of ejection characteristics 45 201016799 31945pif Each inkjet ink was injected into an inkjet cartridge, and it was mounted in a nozzle ink device (DMp_28® manufactured by FUJIFILM Dimatix Co., Ltd.) using a spray of 10 pl. The head was observed under the conditions of a discharge voltage (piezoelectric voltage) of 16 v, a shower head temperature of WC, and a drive frequency of 5 kHz. The liquid column at the time of ejection was ejected in the vertical direction, and the case where no satellite point was generated was judged as "〇". The case where the liquid column was brought into contact with the adjacent liquid column or the satellite point was generated was judged as "X". The results are shown in Table 4. (3) Preparation of test substrate Each inkjet ink was injected into an inkjet cartridge, and was placed in an inkjet© device (DMP_28® manufactured by FUJIFILM Dimatix Co., Ltd.) under the following substrate production conditions. A test substrate on which a cured film was formed was produced by applying (painting) each inkjet ink onto a substrate by an inkjet printer followed by uv hardening and thermal curing. The test substrate prepared in the above manner was used to investigate the properties of the plating solution and the solder heat resistance of the cured films shown in the following (4) and (5). Substrate production condition substrate: a substrate obtained by laminating a copper foil on a polyimide (thickness: ❹ 35 β m) [(made by Toyobo Co., Ltd.) Vyloflex (trade name)] Thickness of cured film: 30 /zm Ejection conditions: The same ejection conditions as above (2) UV exposure: 40 mJ/cm2 Thermal curing conditions: 19 (TCx30 minutes (4) Evaluation of the resistance of the plating solution to the plating solution 46 201016799 3iy45plt Evaluation of the resistance of the cured film to the bonding liquid, and the prepared test substrate was immersed in a 30 ° C palladium aqueous solution (trade name: KAT-450, Pd concentration: 12 mg/L, manufactured by Uemura Industrial Co., Ltd.) After washing with water for 1 minute, it was immersed in 8 (TC non-electrolytic nickel plating solution (trade name: Nimden NPR-4, Ni concentration: 4.5 g/L, manufactured by Uemura Industrial Co., Ltd.) for 30 minutes. ' Next, it was immersed in an electroless gold plating solution (trade name: Goblite TAM-55, Au concentration of 1 g/L, manufactured by Shangyu Village Industrial Co., Ltd.) for 8 minutes, and washed with water. This forms a plating film. No plating solution is infiltrated in this step. In the case where the inside of the film or the cured film was peeled off, it was judged as "〇", and the case where the plating solution penetrated into the cured film or the cured film was peeled off was judged as "X". The results are shown in Table 4. (5) The cured film In order to evaluate the solder heat resistance of the cured film, a rosin-based flux (trade name: Ns_829, manufactured by Nihon Superior Co., Ltd.) was applied to the surface of the cured film of the test substrate, and In the solder bath of k26〇〇c, it was dipped for 30 seconds to investigate whether peeling or bulging occurred. The case of peeling and bulging of the completely unproductive product was judged as “〇”, and the case of peeling or bulging was small. It is "X". The results are shown in Table 4. 47 201016799 31945pif
[表4] 硬化膜的特性[Table 4] Characteristics of the cured film
(實驗例5〜6、比較例7〜9) 於本實驗彳料,對形成含有6貞環化合物作為含有大 於等於5員環的環狀_的自由基聚合性單體(A)的本發 明的噴墨用墨水的硬化膜,來用於抗蝕用途或抗鍍敷用途 的障形進行驗證。以表5中所記載的比例(重量份)進行 調配,並混合、溶解,利用氟樹脂製薄膜過濾器(〇2 # m)進行過濾,而製備各喷墨用墨水。 ❹ 另外,比較例7及8是主要對不含具有大於等於5員 環的環狀醚的自由基聚合性單體(A)成分的情形進行驗 證的例子,比較例9是主要對雖含(A)成分但不含熱反 應性樹脂(D)成分的情形進行驗證的例子。 … 48 201016799(Experimental Examples 5 to 6 and Comparative Examples 7 to 9) In the present invention, the present invention for forming a cyclic polymerizable monomer (A) containing a 6-fluorene ring compound as a ring-shaped ring of 5 or more members was formed. The cured film of the inkjet ink is used for verification of a barrier for resisting or plating resistance. The ratio (parts by weight) described in Table 5 was adjusted, mixed, dissolved, and filtered using a fluororesin membrane filter (〇2 #m) to prepare each inkjet ink. Further, Comparative Examples 7 and 8 are examples in which the radical polymerizable monomer (A) component having no cyclic ether of 5 or more members is contained, and Comparative Example 9 is mainly An example in which the component A) does not contain the component of the thermally reactive resin (D). ... 48 201016799
Jiy4Dpit [表5] 成为 實驗例 比較例 5 6 7 8 9 A2 130 60 — — 130 B1 50 50 50 50 50 B2 — 一 — — — C1 60 60 60 60 60 D1 30 30 30 30 — F1 250 250 250 250 250 H1 — 70 130 — _ H2 50 50 50 180 50 另外,於實驗例5〜6及比較例7〜9的喷墨用墨水 中,聚合抑制劑(I)是添加0.05重量份的酚噻嗪(將除 聚合抑制劑(I)以外的喷墨用墨水的總量設為1〇〇重量 份)。 ' (1)墨水的黏度、由保管所引起的黏度的變化 , 以與實驗例1相同的方法,測定各喷墨用墨水於25 φ °(:下的黏度。將結果示於表6中。 另外,以與實驗例1相同的方法,調查墨水的黏度的 變化率。將結果示於表6中。 可知,實驗例5〜6的喷墨用墨水的保存穩定性優異。 (2) 喷射特性的評價 以與實驗例1相同的方法,觀察各喷墨用墨水的喷出 的情況。將結果示於表6中。 (3) 試驗基板的製作 以與實驗例1相同的方法,製作形成有硬化膜的試驗 49 201016799 31945ριί 基板。使用以上述方式製作的試驗基板,對以下(4)〜(6) 所示的硬化膜對姓刻液的耐性、對鹼性水溶液(剝離液) 的剝離性、對鍍敷液的耐性進行調查。 (4) 硬化膜對餘刻液的耐性的評價 以與實驗例1相同的方法,評價硬化膜對蝕刻液的耐 性。將結果示於表6中。 (5) 硬化膜對鹼性水溶液(剝離液)的剝離性的評 價 以與實驗例1相同的方法,評價硬化膜對鹼性水溶液 (剝離液)的剝離性。將結果示於表6中。 (6) 硬化膜對鍛敷液的耐性的評價 以與實驗例1相同的方法,評價硬化膜對鍍敷液的耐 性。將結果示於表6中。 [表6]Jiy4Dpit [Table 5] becomes an experimental example Comparative Example 5 6 7 8 9 A2 130 60 — — 130 B1 50 50 50 50 50 B2 — One — — — C1 60 60 60 60 60 D1 30 30 30 30 — F1 250 250 250 250 250 H1 — 70 130 — _ H2 50 50 50 180 50 Further, in the inkjet inks of Experimental Examples 5 to 6 and Comparative Examples 7 to 9, the polymerization inhibitor (I) was added with 0.05 part by weight of phenothiazine ( The total amount of the inkjet ink other than the polymerization inhibitor (I) was set to 1 part by weight. (1) Viscosity of ink and change in viscosity due to storage The viscosity of each inkjet ink at 25 φ ° (:) was measured in the same manner as in Experimental Example 1. The results are shown in Table 6. In addition, the change rate of the viscosity of the ink was examined in the same manner as in Experimental Example 1. The results are shown in Table 6. It is understood that the inkjet inks of Experimental Examples 5 to 6 are excellent in storage stability. (2) Spray characteristics Evaluation The ejection of each inkjet ink was observed in the same manner as in Experimental Example 1. The results are shown in Table 6. (3) Preparation of test substrate The same procedure as in Experimental Example 1 was carried out to prepare Test of cured film 49 201016799 31945ριί substrate. Using the test substrate prepared as described above, the resistance of the cured film shown in the following (4) to (6) to the surname and the peeling property to the alkaline aqueous solution (peeling solution) (4) Evaluation of the resistance of the cured film to the residual liquid The resistance of the cured film to the etching liquid was evaluated in the same manner as in Experimental Example 1. The results are shown in Table 6. 5) The cured film is applied to an alkaline aqueous solution (peeling solution) Evaluation of Peelability The peeling property of the cured film to the alkaline aqueous solution (release liquid) was evaluated in the same manner as in Experimental Example 1. The results are shown in Table 6. (6) Evaluation of the resistance of the cured film to the forging liquid was The resistance of the cured film to the plating solution was evaluated in the same manner as in Experimental Example 1. The results are shown in Table 6. [Table 6]
(實驗例7〜8、比較例10〜12) 於本實驗例中’斜形成本發明的喷墨用墨水的硬化膜 50 201016799(Experimental Examples 7 to 8 and Comparative Examples 10 to 12) In the present experimental example, the cured film of the inkjet ink of the present invention was obliquely formed 50 201016799
Jiy4^pit 來用於覆蓋層用途的情形進行驗證。以表7中所記載的比 例(重量份)進行調配’並混合、溶解,利用氟樹脂製薄 膜過濾器(0.2 "m)進行過濾,而製備各噴墨用墨水。 另外,比較例10及11是主要對不含具有大於等於5 貝環的環狀謎的自由基聚合性早體(A)成分的情形進行 驗證的例子,比較例12是主要對雖含(A)成分但不含熱 反應性樹脂(D)成分的情形進行驗證的例子。Jiy4^pit is used for verification of the use of the overlay. Each of the inkjet inks was prepared by mixing and dissolving in a ratio (parts by weight) described in Table 7, and mixing and dissolving them with a fluororesin membrane filter (0.2 "m). In addition, Comparative Examples 10 and 11 are examples in which the radically polymerizable early (A) component having no ring puzzle of 5 or more rings is mainly used, and Comparative Example 12 is mainly used for (A) An example in which the component does not contain the component of the thermally reactive resin (D).
[表7] 成分 實驗例 比較例 7 8 10 11 12 A2 90 45 — 一 90 B3 30 30 30 30 30 C1 8 8 8 8 8 D2 10 10 10 10 — E1 40 40 40 40 40 F2 60 60 60 60 60 H1 — 45 90 — — H2 — — — 90 一 另外,於實驗例7〜8及比較例10〜12的噴墨用墨水 中,聚合抑制劑(I)是添加0.05重量份的酚噻嗪(將除 聚合抑制劑(I)以外的噴墨用墨水的總量設為1〇〇重量 份)。 (1)墨水的黏度、由保管所引起的黏度的變化 以與實驗例3相同的方法,測定各喷墨用墨水於25 °(:下的黏度。將結果示於表8中。 另外,以與實驗例3相同的方法,調查墨水的黏度的 201016799 31945pif 變化率。將結果示於表8中。 墨用墨水的保存穩定性優異。 以與實驗例3相同的方法,觀察各 的情況。將結果示於表8中。 、墨水的喷出 (3) 試驗基板的製作 〇 以與實關3糊的方法,製作軸有硬化膜的試驗 土板。使用以上述方式製作的試驗基板對以下⑷及 所示的硬化膜對鍍敷液的耐性及焊錫耐熱性進行調查。 (4) 硬化膜對鑛敷液的耐性的評價 以與實驗例3相同的方法’評價硬化膜對鍍敷液的财 性。將結果示於表8中。 (5) 硬化膜的焊錫耐熱性的評價 以與實驗例3相同的方法,評價硬化膜的焊錫耐熱 性。將結果示於表8中。[Table 7] Ingredient Experimental Example Comparative Example 7 8 10 11 12 A2 90 45 - One 90 B3 30 30 30 30 30 C1 8 8 8 8 8 D2 10 10 10 10 - E1 40 40 40 40 40 F2 60 60 60 60 60 H1 — 45 90 — — H 2 — — — 90 In addition, in the inkjet inks of Experimental Examples 7 to 8 and Comparative Examples 10 to 12, the polymerization inhibitor (I) was added with 0.05 part by weight of phenothiazine (will The total amount of the inkjet ink other than the polymerization inhibitor (I) was set to 1 part by weight. (1) Viscosity of Ink and Change in Viscosity by Storage The viscosity of each inkjet ink was measured at 25 ° (in the same manner as in Experimental Example 3). The results are shown in Table 8. In the same manner as in Experimental Example 3, the change rate of the viscosity of the ink of 201016799 31945pif was examined. The results are shown in Table 8. The ink ink was excellent in storage stability. Each case was observed in the same manner as in Experimental Example 3. The results are shown in Table 8. Ejection of ink (3) Preparation of test substrate 试验 A test soil plate having a cured film was produced by a method of solid-state 3 paste. The test substrate prepared as described above was used (4). The cured film shown and the solder resist heat resistance were investigated. (4) Evaluation of the resistance of the cured film to the ore solution The same method as in Experimental Example 3 was used to evaluate the effect of the cured film on the plating solution. The results are shown in Table 8. (5) Evaluation of solder heat resistance of cured film The solder heat resistance of the cured film was evaluated in the same manner as in Experimental Example 3. The results are shown in Table 8.
52 201016799 3iy45plt [表8]52 201016799 3iy45plt [Table 8]
❹ ❹ [產業上之可利用性] 本發明例如可用於電子電路基板中所使用的保護膜 或絕緣膜、或者金屬圖案配線形成用阻劑、或者鑛敷圖宏 形成用阻劑。 瑕驭圚累 雖然本發明已以實施例揭露如上,然其 本發明,任何所屬技術領域中具有通常 '^疋 本發明之精神和範圍内,當可作些許之^ ’不脫離 ,明之保護範圍當視後附之申請專利範圍㈡ 【圖式簡單說明】 I疋者為準。 益 【主要元件符號說明】 53产业 ❹ [Industrial Applicability] The present invention can be applied, for example, to a protective film or an insulating film used in an electronic circuit board, or a resist for forming a metal pattern wiring, or a resist for forming a mineral pattern. Although the present invention has been disclosed in the above embodiments, the present invention is intended to be within the spirit and scope of the present invention. The scope of the patent application attached to it (2) [Simple description of the drawing] I shall prevail. Benefit [Main component symbol description] 53
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008225659A JP2010059299A (en) | 2008-09-03 | 2008-09-03 | Inkjet ink, and cured film obtained from the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201016799A true TW201016799A (en) | 2010-05-01 |
Family
ID=42178847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98129444A TW201016799A (en) | 2008-09-03 | 2009-09-01 | Ink for inkjet and curing film formed form the ink |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2010059299A (en) |
| KR (1) | KR20100027962A (en) |
| TW (1) | TW201016799A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI622857B (en) * | 2011-06-10 | 2018-05-01 | 捷恩智股份有限公司 | Photo-curable inkjet ink, cured film,microlens, optical component and liquid crystal display |
| CN112055733A (en) * | 2017-12-18 | 2020-12-08 | 爱克发-格法特公司 | Solder mask inkjet inks for the manufacture of printed circuit boards |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5573323B2 (en) * | 2010-04-16 | 2014-08-20 | Jnc株式会社 | Curable composition and use thereof, and curing agent |
| JP2011256271A (en) * | 2010-06-09 | 2011-12-22 | Jnc Corp | Curable composition, use thereof and new compound |
| JP6066558B2 (en) * | 2010-09-22 | 2017-01-25 | 積水化学工業株式会社 | Curable composition for inkjet and method for producing electronic component |
| WO2012039379A1 (en) * | 2010-09-22 | 2012-03-29 | 積水化学工業株式会社 | Curable composition for inkjet, and method for producing electronic component |
| WO2012043473A1 (en) * | 2010-09-28 | 2012-04-05 | 積水化学工業株式会社 | Curable composition for inkjet applications, and process for manufacturing electronic component |
| JP5349628B2 (en) * | 2011-02-08 | 2013-11-20 | 富士フイルム株式会社 | Inkjet recording method and printed matter |
| CN104685010B (en) * | 2012-09-27 | 2016-08-17 | 积水化学工业株式会社 | Ink-jet solidification compound and the manufacture method of electronic component |
| JP6339925B2 (en) * | 2014-11-27 | 2018-06-06 | 互応化学工業株式会社 | UV curable composition for inkjet etching resist |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1039503A (en) * | 1996-07-23 | 1998-02-13 | Mitsubishi Chem Corp | Color resist composition |
| JP3808999B2 (en) * | 1997-12-08 | 2006-08-16 | 互応化学工業株式会社 | Photoresist ink and printed wiring board manufacturing ink |
| WO2007026366A1 (en) * | 2005-08-31 | 2007-03-08 | Printar Ltd. | Uv curable hybridcuring ink jet ink composition and solder mask using the same |
| JP5408838B2 (en) * | 2006-08-23 | 2014-02-05 | 帝国インキ製造株式会社 | Display board |
-
2008
- 2008-09-03 JP JP2008225659A patent/JP2010059299A/en active Pending
-
2009
- 2009-08-13 KR KR20090074641A patent/KR20100027962A/en not_active Ceased
- 2009-09-01 TW TW98129444A patent/TW201016799A/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI622857B (en) * | 2011-06-10 | 2018-05-01 | 捷恩智股份有限公司 | Photo-curable inkjet ink, cured film,microlens, optical component and liquid crystal display |
| CN112055733A (en) * | 2017-12-18 | 2020-12-08 | 爱克发-格法特公司 | Solder mask inkjet inks for the manufacture of printed circuit boards |
| US11492509B2 (en) | 2017-12-18 | 2022-11-08 | Agfa-Gevaert Nv | Solder mask inkjet inks for manufacturing printed circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010059299A (en) | 2010-03-18 |
| KR20100027962A (en) | 2010-03-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201016799A (en) | Ink for inkjet and curing film formed form the ink | |
| TW201024380A (en) | Inks for ink-jet printing | |
| TWI582533B (en) | Photo-curing inkjet ink and electronic circuit board | |
| TW201213452A (en) | Photo-curable ink composition for ink jet | |
| CN105408417B (en) | Thermosetting resin composition, cured film, substrate and electronic component with cured film | |
| CN103364860B (en) | Color filter, organic EL display element, and coloring composition | |
| TWI551944B (en) | Photo-curable inkjet ink, cured film with surface liquid repellency, microlens and method for forming the same, optical component and image display device | |
| TW201019054A (en) | Stripping liquid | |
| TW201042395A (en) | Photo-curable ink for inkjet with liquid repellence | |
| JP2011256271A (en) | Curable composition, use thereof and new compound | |
| TWI622857B (en) | Photo-curable inkjet ink, cured film,microlens, optical component and liquid crystal display | |
| TW201015220A (en) | Colored radiation sensitive composition, color filter and color liquid crystal display element | |
| JP5504769B2 (en) | Polymerizable composition | |
| JP2011026403A (en) | Optically curable inkjet ink | |
| TW201122000A (en) | Ink for in inkjet | |
| TW200909534A (en) | A method for forming a hardened film | |
| JP2020105232A (en) | Thermosetting resin composition, cured film, substrate with cured film, electronic component and inkjet ink | |
| JP2013241613A (en) | Ink composition for roll printing, colored ink, black matrix, color filter, and display device | |
| JPWO2018159675A1 (en) | Thermosetting resin composition, cured film, substrate with cured film, electronic component, and ink composition for inkjet | |
| TW201211166A (en) | Coloring composition for color filter, color filter, and display element | |
| TWI538964B (en) | Ink for inkjet | |
| TWI382065B (en) | Ink composition for color filter and color filter | |
| TW201510055A (en) | Thermosetting resin composition, cured film, substrate with cured film and electronic component | |
| JP2017187752A (en) | Interlayer insulating film forming composition, interlayer insulating film, interlayer insulating film pattern forming method, and device | |
| TW201807110A (en) | Composition for forming release layer, laminate, and method for producing laminate |