TW201003876A - Lead frame and package of semiconductor device - Google Patents

Abstract

A lead frame including a stage and a plurality, of terminals is embedded in a mold resin including a base portion for mounting a semiconductor chip (e.g. a microphone chip), a peripheral wall disposed in the periphery of the base portion, and an extension portion extended outside of the peripheral wall, thus forming a package base. A plurality of holes is formed in the peripheral wall so as to expose the internal connection surface of the stage and the internal connection surfaces of the terminals. An extension portion of the stage is exposed on the extension portion of the mold resin in which the surfaces of the terminals are embedded. An extension portion (e.g. a brim) of a cover composed of a conductive material is attached to the extension portion of the mold resin of the package base, thus completely producing a semiconductor device.

Description

201003876 VI. Description of the Invention: TECHNICAL FIELD The present invention relates to a lead frame and a package for use in a semiconductor device. In particular, the present invention relates to a lead frame that is partially embedded in a molded resin in a package, such as a package for a microphone, a sensor, a SAW device, a quartz oscillator, and a solid-state image pickup device. The present application claims priority to the present patent application Serial No. 2, the entire disclosure of which is incorporated herein by reference. [Prior Art] A semiconductor device which has been exemplarily designed for use as an 11-microphone and a pressure sensor allows the microphone package to be held inside a pre-molded hollow package in which the resin molded lead frame is previously used. Various semiconductor devices using pre-molded packages have been developed and disclosed in various documents such as Patent Documents 1 and 2. Patent Document 1: Japanese Unexamined Patent Application Publication No. 2007-66967 Patent Document 2: US Patent No. 6,781, 231 Patent Document 1 teaches a semiconductor device in which a semiconductor wafer system is located approximately at the center of a lead frame The -the base...the molded resin is integrally formed on the back side and the surrounding area of the cymbal. The interconnecting lead extends from the outside of the base to make 1 of the molded resin of the base/ The W sub-system is exposed on the surface of the upper part of the abutment #° soil. A cup-shaped metal tweezers is placed on the periphery of the molded tree to protect θ, ... A 7 , θ is such that the peripheral end of the whisker is joined to the molding resin, and the semiconductor crystal is electrically connected to the interconnecting leads. Exposure part. The genus is 134421.doc 201003876 The distal end of the interconnecting leads disposed outside the device and the distal end of the arched wire are exposed on the back side of the molded resin (or an external circuit board) The circuit is used to mount it on: semi-conducting: device.

Patent Document 2 teaches a semiconductor device in which a semiconductor wafer (a microphone chip) is mounted on a circuit surface of a "flat" external substrate, and the external substrate is then used - a metal case (or a metal cover). Cover and fix to the metal casing (or a metal cover). The semiconductor device of the document 1 is designed such that the exposure of the interconnecting leads is connected to the base of the wire frame and the metal cover such that the semi-conducting: a piece of film, surrounded by metal, improved Shielding properties. This semiconductor device 1 is manufactured at a low cost because the lead frame is simply molded and combined using the resin: a simple structure. However, the manufacturing method requires two rigorous bending procedures in which the interconnecting leads are vertically extended such that the squeegee is exposed on the upper surface of the peripheral wall of the resin and then the distal end thereof. It is folded in half and guided downward so that it is exposed on the back side of the molded resin. In the semiconductor device of Patent Document 2 having an eight-flat package, it is possible to use 晶粒 to fix the semiconductor wafer by die bonding. The bonding agent may also be so as to reach and cover the inner end of the wiring. The disadvantage of preventing the adhesive from overflowing so as to reach the inner end of the bow line is to ensure a sufficient distance between the mounting area and the inner end of the lead to prevent it. The interface agent unexpectedly overflows toward the inner end of the lead. This makes it difficult to reduce the overall size of the semiconductor device of Patent Document 2. SUMMARY OF THE INVENTION One object of the present invention is to provide a lead frame and package each having a simple structure for reducing the overall size of a semiconductor device. In the present invention, a lead frame is constructed by: a base Δ embedded in a base portion of the molded resin such that its extension: extends in an extended portion of the molded resin; And a terminal is formed adjacent to the base and is separated from each other by a peripheral wall and an extending portion of the molding resin, wherein the lead frame is molded into the resin, and the box molding resin comprises a bottom portion a peripheral wall disposed on a periphery of the bottom portion; and an extension portion extending from a periphery of the base portion outside the (four) side wall. The surface of the abutment defines a portion of the peripheral wall - (4) connecting surface, and a predetermined portion of the surface of the material terminal is bonded to the periphery (4) as an internal connecting surface. The other portion of the surface of the terminals is bonded to the extended portion of the molded resin for use as a lower surface which is lower in thickness than the surface of the base. A package substrate is formed by sealing a lead frame by using a molding resin by partially forming a plurality of holes in the peripheral wall to partially expose an inner connecting surface of the base and an inner connecting surface of the terminals. 'The extension of the abutment is exposed on the extended portion of the molded resin on the surface of the terminals of the poet I. When a cover composed of a conductive material is attached to an extended portion of the molded resin for exposing the extended portion of the base, the field is shieldably mounted on the outer wall of the base Semiconductor wafer. Further, a plurality of holes are formed in the peripheral wall 134421.doc 201003876 disposed inwardly of the extended portion of the molded resin to expose the inner connecting surface of the base and the inner connecting surface of the terminals. In other words, the holes are contained in the peripheral wall, and the extended portion of the molded resin is disposed outside the peripheral wall. That is, when the semiconductor wafer is fixed to the base portion of the package substrate via die bonding, it is possible to reliably prevent the bonding agent from overflowing toward the inner connecting surface of the lead frame and the extended portion of the molding tree. This makes it possible to access the internal mounting surfaces by accessing the wafer mounting area. Further, the four tweezers are attached to the extension port P knife 153 of the molded resin outside the peripheral wall, and the inner connecting surface is exposed through the hole of the peripheral wall. This enables the lead frame to be completely formed into a flat plate shape. - can be formed at a position perpendicular to the internal connection surface of the abutment at the position of the back side of the base of the base. a connecting surface and protruding from the back side of the terminals at a position perpendicular to the internal connecting surface of the terminals

A plurality of external connection tables s. The μ L , π surface can be formed at a height similar to the outer connecting surfaces to form a plurality of supports projecting from the back side of the base. = the outer connecting surface and the supports are on the back side of the molding resin::: this allows the outer connecting surface and the support to be supported by the - ejecting metal mold (four) wire frame for forming the molding resin The object contacts δ hai to project the inner surface of the metal mold. The double-package is made up of the package base and the cover for covering the inner space of the periphery, and the cover of the gentleman, the gans, the cover, and the octopus, which consists of a conductive material. The connection of the molded resin to the (4) connection table (4) is only exposed in the peripheral wall of the partition wall, and is exposed in the hole of the sea, which can reliably prevent a joint of 134421.doc 201003876 The agent overflows toward the internal connection surfaces. - The semiconductor device is made of _semiconductor 其 $ τ μ + 6 糸 3 and 3 is molded resin on the package substrate directly above the lead frame: The socket is electrically connected to the base and the terminal surface via the hole of the peripheral wall. The 卩 connection type microphone package uses the package to generate the base mounted on the lead frame. A sound hole that is connected to the inner surface of the package substrate is formed in the cover or the seal. The inner space surrounded by the peripheral wall is reduced by arranging the peripheral wall adjacent to the wind wafer. Can increase the resonance of the microphone package Rate. Further, a plurality of small holes collectively used as the sound hole may be formed in the exposure of the base exposed through the -t π hole formed in the molded resin. As explained above, the following effects can be exhibited. (a) The bonding agent for adhering the cover to the molding resin of the package substrate can be prevented from overflowing toward the internal connection surfaces exposed only in the holes of the peripheral wall. (b) Since the inner connecting surfaces are contained in the peripheral wall, the inner connecting surfaces may be disposed adjacent to the D-chip semiconductor wafer. () can reduce the overall size of the semiconductor device, thereby reducing the manufacturing cost of the semiconductor device. (d) A high-density package can be realized due to a reduction region for mounting the semiconductor device on an external substrate. 134421.doc 201003876 [Embodiment] The present invention will be described in further detail by way of examples with reference to the accompanying drawings. 1. First Embodiment A semiconductor device 1 according to a first embodiment of the present invention will be described with reference to Figs. As shown in Figures 4, 6 and 7, the semiconductor device i stores a microphone chip 2 and a control chip (or - circuit wafer) 3, each of which is encapsulated in a package 4. The package 4 is composed of: a package substrate 7, which

a flat-shaped lead frame 5; and a box-shaped molding resin 6' integrally formed with the lead frame 5; and a cover 8 for closing the upper portion of the package substrate 7 by a plurality of lead frames (per The corresponding lead frame 5) is continuously formed and linearly aligned in the strip-like sheet of the metal sheet subjected to the pressing work. In this specification, with respect to the lead frame 5 shown in Fig. 5, the upper/: direction is referred to as - vertical direction, and the left/right direction is referred to as "_ horizontal direction" (or & direction). Reference numeral 9 designates a connection for connecting the lead frame $ to the outer frame 1G formed by punching. The lead frame 5 includes a certain a! ! ^ soil σ 11, which is close to a power supply terminal 12, an output terminal U, and a gain terminal 14, which are arranged with a gauge distance therebetween and via a nightmare, The lead frames 5 are connected to the outer frame 10 by the connections 9 respectively. The lead frame 5 is completely formed into a rectangular shape, wherein the base u is arranged on the side corners defined by the adjacent sides, the adjacent two The side further defines its - main portion 15' and wherein the two extensions 16 and 17 extend from the main portion 15 and join the main portion. The extensions serve the approximate center position on both sides of the end 134421.doc 201003876 The end portions are arranged at other adjacent sides of the rectangular shape. Further, the three terminals 12 to 14 are respectively disposed at the other three corners of the rectangular shape surrounded by the outer frame (four). The inner connecting surfaces 21, 22 and 23 Regarding the semiconductor wafers 2 and 3 occupying the terminals & like the prescribed regions, details of the semiconductor wafers will be described later. Other regions of the terminals (2^ (except the internal connection surfaces 21 to 23) are borrowed. Semi-synthesis To reduce the thickness' to form a lower surface 24 which is lower in the thickness direction of the lead frame 5 than the internal interconnect surfaces 21 to 23. As in Figure 1, the corners of the main portion 15 and the extensions The distal ends of 16 and 17 are disposed within the periphery of the lead frame 5. Further, the half-etched car and the lower surface 24 are formed in the terminals 12 to 14 disposed at the other three corners in the periphery of the lead frame 5. Therein, wherein the inner connecting surfaces Η to 23 are arranged inwardly from the periphery of the lead frame 5. That is, the terminals η to 14 are located. The 卩 connecting surfaces 21 to 23 are arranged to form the molding resin 6 ( One of the peripheral walls is defined as an inner side of one of the peripheral walls (defined by a broken line in the middle). One portion of the extended portion 16 disposed in the inner portion of the region eight serves as a ground connection surface 25 for the base U. The base 11 The main portion of the 丨5 corner, the distal end of the extended 卩 16 16 and 17 and the lower surface 24 of the terminals 12 to 14 are arranged to form the molding resin 6 outside the region a. a peripheral wall of an extended portion for forming a peripheral wall of the molded resin 6 As shown in Fig. 2, except for its four rectangular corners, the back side of the lead frame $ is engraved with the second father and the half (see the hatched area). The four sides of the lead frame 5 are raised by the four corners. The external connection surfaces 26 to 29 are placed with respect to an external substrate (or an external circuit board) for mounting the 134421.doc -10·201003876 δ semiconductor wafer 1 thereon. In the back side of the abutment, the outer connecting surface 29 is disposed at the upper right corner of the main portion 15; the outer connecting surface 27 is disposed at the lower left corner to match the overall rectangular back side of the terminal 13; the outer connecting surface 26 Arranged at the upper left corner to match the back side of the terminal 12, an extension portion 30 extends from the back side toward the lower side of FIG. 2; and the external connection surface μ is disposed at the lower right corner to match the back side of the terminal 14. An extension portion 3-1 extends from the back side toward the left side of FIG. Both the extensions "and" = experience half (four) and thus reduce the thickness compared to other areas of the lead frame 5. All of the external connection surfaces 26 to 28 of the terminals 12 to 14 and the external connection surface 29 of the base 11 are formed to have substantially the same size = melon shape] wherein four external connection surfaces 26 to (9) are arranged Four corners of the back side of the lead frame 5. In this regard, the surfaces of the extensions 3G and 31 of the terminals 12 and 14 correspond to the (4) connection surfaces 21 and 23.

L All eight=9 lines arranged at four centers on four sides and close to four corners are formed at the same height as the outer connecting surface 29, so that the shapes, struts 32 and 33 (the system contacts are used for Forming a molded resin). Similar to the support, the 32-degree connecting surface phase is high-producing, and the support 34 is attached to the outer back side and disposed at the extended portion 31 of the terminal M, that is, in the extended portion. 31 is located at an approximately central position in the lower direction = the horizontal direction (or the width direction) of the lead frame 5. All connections 9 are the original metal plates. And the + surname is to maintain the initial thickness as the molded resin 6 is integrally formed with the lead frame 5 having the above structure, and is opened from 134421.doc 201003876 to the package substrate 7 which is not shown in FIG. As shown in FIGS. 3 and 4, the package substrate 7 is formed in a box shape and is composed of a shape of a rectangular plate having a shape of a rectangular plate and a bottom portion of the substrate. Elongating to accommodate a linear abutment of the wafer wafer 2 and the control wafer 3; a peripheral wall 42 having a prism shape disposed on the periphery of the base portion 41; and an extension portion 43 Extending integrally from the lower section of the peripheral wall 42. The surface of the base 11 and the back side of the substantially central portion of the lead frame 5 (i.e., occupying the area indicated by m in Fig. 1 and located in the peripheral wall 42) The system 70 is fully inserted into the base portion 41. The cross section of the peripheral wall 42 has a trapezoidal shape in which its width gradually decreases from the lower section to the upper section thereof. Further, 'the portion including the main portion 15 of the base n, the intermediate portion of the extended portions 16 and 17 (where the extended portion 16 serves as the inner connecting surface 25), and the inner connecting surfaces 21 to 23 and the lower surface 24 of the terminals 12 to 14 The region a is partially embedded in the base portion 41. As shown in Figure 3, one of the perimeter walls 42 is defined. The file reduces the twist and widens the width slightly to form a wider portion 44. Four holes 45 for partially connecting the inner connecting surface of the base u and the inner connecting surfaces 2 1 to 23 of the terminals a to μ are formed in the wider portion 44 of the peripheral wall 42. An extended portion 43 extending from the outside of the peripheral wall 42 is formed in the same plane as the base portion 41 to arrange the outer portion of the lead frame 5 outside the region a shown in Fig. i. The corners of the main portion 15 of the abutment 与 and the distal ends of the extension portions 16 and 7 of the lead frame 5 are exposed on the surface of the extension portion 43 and the half surfaces of the terminals 12 to 14 are etched lower surface 24 It is embedded in the extended portion 43 in the molded resin 6. The surface of the extension portion 43 is located in the same plane as the 134421.doc 12 201003876 exposed surface and the extended portions 16 and 17 of the base 丨1. As shown in Fig. 5, the half-etched portion of the lead frame 5 is embedded in the back side of the molded resin 6 'where the external connection table (4) of the base u and the external connection surfaces 26 to 28 of the terminals 12 to 14 are attached to the mold The four corners of the back side of the resin 6 are exposed, and the cut 32 disposed in the base (10) is now exposed on the back side of the molded resin 6. The microphone chip shown in Figures 6 and 7 2 and the control wafer 3 are fixed to the base portion 41 of the package substrate 7 via the die bond 46, wherein the internal connection surfaces 21 to 23 of the terminals 12 to 14 are electrically connected to the internal connection of the base U via the bonding wires 47. The surface 25, the inner connecting surface of the material, is exposed inside the hole 45 of the wider portion 44 of the peripheral wall 42 of the molding resin 6. The microphone chip 2 is designed to vibrate in response to pressure vibrations (such as vibration of sound pressure) - The diaphragm electrode is positioned opposite to the fixed electrode to reflect the vibration of the diaphragm electrode to detect the vibration of the electrostatic capacitor. The control wafer 3 includes a power supply circuit of the microphone chip 2 and an amplifier for amplifying the output signal of the microphone chip 2. Installation A cover 8 on the package substrate 7 is formed of a conductive metal material (such as copper) and is subjected to the height of the peripheral wall U of the drawn package substrate 7. A side wall 52 is formed on the periphery of one of the top portions of the cover 8. Inside, an edge 53 of the basin is formed at the lower end of the side wall 52 and is horizontally elongated parallel to the top portion. A sound hole 54 is formed to pass through the prescribed position of the top portion 51 of the cover 8. (4) As shown in Fig. 7, when the cover 8 is mounted on the package substrate 7, the top portion 5 is an internal space 55' defined by the periphery (4) of the package substrate 7, wherein the internal space 55 is punched through the sound hole to an external space. 134421.doc ·]3· 201003876 The 'and the side wall 52 are arranged outside the peripheral wall 42 such that the edge 53 is planted on the extended portion 43 of the package substrate 7. The package substrate 7 is assembled using the cover 8 with the edge 53 attached to the extension 43 via a conductive adhesive 56, wherein the specified portion of the base n exposed on the extension 43 is via the conductive adhesive 56. The call is connected to the cover 8. That is, the package substrate 7 is assembled using the cover 8 to completely form the package. * In the package 4, the cover 8 is electrically connected to the base of the lead frame 5, and the semiconductor wafers 2 and 3 are contained in the internal space. Within 55. Next, a method of manufacturing the semiconductor device 1 will be described with reference to FIG. First, a metal plate is subjected to half etching while shielding a prescribed portion thereof to reduce the thickness of the hatched region of the lead frame 5 shown in Figs. 1 and 2 to about half of the initial thickness. The overall contour is punched by the pressing work, thereby forming the lead frame 5 connected to the outer frame 1 through the connections 9. The lead frame 5 may have a small irregularity in the half etching portion, but is formed in a substantially planar plate shape. Next, the lead frame 5 is placed in an injection metal mold into which molten resin is injected to produce a molding resin 6 in which the lead frame 5 is housed. Fig. 8 shows that the lead frame 5 which has been subjected to pressing work is placed in the injection metal cookware, and a cavity 63 for introducing the e-melting resin is formed between the upper mold 61 and the lower mold 62. In a plan view, the inner connecting surfaces 21 to 23 of the terminals 12 to 14 and the inner connecting surface 25 of the base 11 are exposed on the surface of the lead frame 5. In a rear view, the outer connecting surfaces 26 to 29, the supports 32 and 33 of the base 11, and the supports 34 134421 .doc -14· 201003876 of the terminal 14 are exposed in the back side of the lead frame 5. The exposed portions are formed by contacting the inner surfaces of the upper mold 61 and the lower mold 62 of the injection metal mold. The lead frame 5 is supported inside the cavity 63 so that the exposed portions formed on the surface and the back side of the lead frame 5 contact the inner surfaces of the upper mold 61 and the lower mold 62. Specifically, the surface of the base 11 is attached to the base portion of the package substrate 7.

The resin is sealed by 41 using a resin, and a relatively large gap is formed between the surface U and the inner surface of the upper mold 61. The base u is supported at both its surface and the back side because the supports 32 and 33 formed on the back side of the base u contact the inner surface of the lower mold 62 and the extended portion 43 of the package substrate 7 is tightly held. Between the upper mold 61 and the lower mold 62. That is, the lead frame 5 is firmly fixed in place by the upper mold 61 and the lower mold 62 so as not to be deflected or moved by the injection pressure. After the molding resin 6 is integrally formed with the lead frame 5, the semiconductor wafers 2 and 3 are bonded to the base portion 41 of the package substrate 7 via the die bond 46, and are electrically connected to the terminal 12 via wire bonding. The internal connection surfaces 21 to 23 of the 14 are connected to the internal connection table (4) of the base n, and the internal connection statements are exposed in the apertures formed in the wider portion of the peripheral wall 42. The conductive adhesive %, which is applied to the extended portion 43, is fixedly attached to the package substrate 7 independently of the cover 8 produced by the package. In this case, the lead wires (four) (each corresponding to the lead frame 5) are abutted via the links, and a plurality of covers (each corresponding to the cover A are interconnected by a connection (not shown) to abut together, Substrates (each corresponding to the package base TM are made up: this wood water is interconnected to be adjacent - (. Therefore, the lids simultaneously join I34421.doc 201003876 to the package substrates having the bow I-line frames. After the joining process, the joints of the lead and the spring frame protruding from the molding resin are subjected to cutting together with the joints of the caps, thereby producing

Individual products (each corresponding to the package 4 composed of the lead frame 5, the package substrate 7, and the cover 8). The semiconductor device 1 is mounted on an (or an external circuit board) by soldering the terminals 12 to 4 and the base u (10) to the external substrate. In the semiconductor device shown in FIG. 7, the substrate 1} embedded in the substrate portion 41 is disposed under the semiconductor wafers 2 and 3; the semiconductor wafers 2 and 3 are connected to the internal connection surface 25 of the substrate; The cover is fixedly bonded to the extensions 16 and 17 of the submount 11 via a conductive adhesive 56; and the cover 8 overlies the semiconductor wafers 2 and 3. The semiconductor wafers 2 and 3 are surrounded by the base and the cover 8, and the external connection surface 29 of the base is grounded via the external substrate; therefore, the semiconductor wafers 2 and 3 can be shielded from external electromagnetic waves. In the package substrate 7, the peripheral wall 42 is perpendicular to the extension portion 43 disposed between the base portion 41 for fixing the semiconductor wafers 2 and 3 and the edge 53 of the cover 8, and the terminals 12 to 14 The inner connecting surfaces 21 to 23 and the inner connecting surface 25 of the base 11 are exposed in the holes 45 formed in the wider portion 44 of the peripheral wall 42; therefore, the peripheral wall 42 resists the grain bonds 46 and conducts electricity. The adhesive 56 is prevented from overflowing through the peripheral wall 42 toward the holes 45. This allows the wafer mounting regions of the substrate portion 41 to be positioned close to the inner connecting surfaces 21 to 23 and 25; thus, the entire area of the semiconductor device 1 can be reduced. 134421.doc 16 201003876

Further, the inner connecting surfaces 21 to 23 of the terminals 12 to 14 and the inner connecting surface 25 of the base u are exposed inside the holes 45 formed in the wider portion of the peripheral wall 42; the cover is tied at the edge 53 One of the extending portions fixed to the outside of the peripheral wall 42 to the same plane as the base portion 41 is fixed to the package substrate 7; and the lead frame 5 is completely formed in a flat plate shape. Thus, the overall size of the lead frame can be reduced as compared to conventionally known lead frames that are partially curved to form terminals and connections for the cover. Therefore, the necessary area for mounting the semiconductor wafer on an external substrate can be reduced, whereby the semiconductor device can be packaged at a higher density [without causing interference with the circuit of the external substrate. 2. Second Embodiment Next, a semiconductor device 97 according to a second embodiment of the present invention will be described with reference to FIGS. 9 to 5, in which the portions identical to those shown in FIG. The same reference numerals are used to refer to them, and thus the description thereof will not be repeated below. The semiconductor device 97 of the second embodiment is designed to form a sound hole in a package substrate 94, with the semiconductor device 1 of the first embodiment in which the sound hole 54 is formed in the cover 8. 9 and Π) show that a main portion 73 of a lead frame|middle-substrate 72 is vertically elongated to be longer than the main portion W of the lead frame 5 used in the first embodiment, and is 15' A sound hole is like π, / 曰 的. The P hole 74 is formed in the main portion 73 of the base 72. Similar to the lead frame 5 of the first embodiment, the terminals 13 and 14 are arranged in the lead frame of the second embodiment which is not provided with the terminal 12 Μ 13442J.doc • 17· 201003876 is equipped with an additional terminal 75, which is In the hanging place. Similar to not having any extension at both corners. The lead frame 7 1 is linearly arranged at approximately the center portion of the terminal 1 3 '. The terminal 7 5 is opened, and is formed into a rectangular shape, a portion of which serves as an internal connecting surface 76. Similar to the H H _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Shape. The back side of the base 72 is substantially subjected to half-touch (see the area of the shadow shown in Figure 1). An outer connecting surface 77 is formed at a central position in the vertical direction along the side of the base 72, the side being opposed to the side along which the terminal 75 is disposed at the center position. A support 78 is formed to surround the back side region of the lower aperture 74. Since the main portion 73 of the base 72 is vertically elongated, the two supports 32 are formed at the center positions in the width direction, and the two pairs of supports 33 are connected to the opposite sides of the base 72. Formed together. The lead frame 71 is subjected to pressing and then placed in an ejection metal mold as shown in Fig. 15. In the injection metal mold, a pin 82 having a diameter slightly smaller than the diameter of the lower hole 74 of the lead frame 71 partially protrudes above a lower mold 81, and a hole for inserting the distal end of the pin 82 is slightly smaller in diameter. A column of holes 85 larger than the diameter of the hole 84 is formed concentrically with the pin 82 of the lower mold 81 in an upper mold 83. When the dies 8 1 and 83 are clamped to insert the yoke 82 into the hole 84, a cavity 86 is formed in a cylindrical space formed around the yoke 82 by the crater 85. When a molten resin is injected into the injection metal mold that closely holds the lead frame 71, a molding resin 91 is integrally formed with the lead frame 71 so as to be formed by the pin 82 by a 134421.doc -18-201003876 boring 92. Within the base portion thereof, a cylindrical wall 983 is formed to surround the sound hole 9 2 on the base portion 4 ′ to form the package substrate 94 as shown in FIGS. The cylindrical wall 93 blocks the die bond 46 for bonding the semiconductor wafers 2 and 3 to the base portion 41 so as to prevent it from overflowing into the sound hole 92. Correspondingly, a cover 96 (see Fig. 14) without any holes is attached to the package substrates 94, 9 to completely create the semiconductor skirt 97. Similar to the cover 8 of the first embodiment, the cover 96 of the second embodiment is comprised of a conductive metal material. Since the cover % is electrically connected to the lead frame 71, it is formed between the package substrate 94 and the cover 96. The germanium space is electromagnetically shielded in the semiconductor device 97. 3. Third Embodiment In accordance with a third embodiment of the present invention, a semiconductor device (10) is designed in accordance with the semiconductor device 97 of the second embodiment, wherein a pupil 92 is formed in the package substrate 94. This will be explained with reference to Figs. 16 to 18. °, the semiconductor device of the third embodiment is made of a package, i.e., the package is sealed by a cover 96 and a molded resin 1〇5 therein, and the lead frame 103 of the earth opening 104 is used. A package substrate 1 〇 2 is formed. As shown in Figs. 16 and 17, a circular area of the molded resin 1〇5 is drawn so as to form a window hole 1〇6' in which a circular area of the base 1〇4 is correspondingly exposed. A plurality of apertures 1 〇 7 are formed to form a sound hole 108 through the exposed circle/area bonfire of the base. An arcuate wall 109 is disposed between the sound hole 1〇8 and the semiconductor wafer 2 mounted on the base portion 41 of the package substrate 102. 134421.doc • 19- 201003876 In the manufacture of the package substrate 102, the small holes ι 7 of the sound holes 1 〇 8 are simultaneously formed by half etching on the lead frame 103. Similar to the lead frames 5 and 71 of the first and second embodiments, the lead frame 1〇3 of the third embodiment is subjected to half etching, which uses a mask having a small hole with 108 The cover is implemented to form the apertures 107. In the injection molding of the molded resin crucible 5 as shown in Fig. 18, the lead frame 103 is held relative to the sound hole 1 〇 8 to the upper mold (1) having the circular projection i 丨 3 Between the molds 112, the small holes 107 are closed. An arcuate passage 114 is formed in the upper mold 111 near the circular projection 113. As shown in Figures 16 and 17, a circular area of the base 104 is exposed to form a sound hole 108 having the small holes 107 therein, and the curved wall 109 is formed to define the sound hole 1〇8. About half of the area. The arcuate wall 109 may be re-formed into a cylindrical shape as similar to the cylindrical wall formed in the package substrate 71 of the second embodiment. The above structure allows the sound hole 108 to be efficiently formed by etching which forms part of the manufacturing method. Since the small holes 1〇7 are used to form the sound holes 1〇8 and are each reduced in size, it is possible to reliably prevent foreign matter such as dust from entering the inner space 55 of the package 101, and also to reduce the noise. The invention is not necessarily limited to the specific embodiments described above, which may be modified in various ways. The above specific embodiments are directed to semiconductor devices that accommodate microphone packages; however, this is not a limitation. The invention can be applied to other types of sensors (other than microphones) such as quartz oscillators, high frequency SWA filters, duplex, solid state image pickup devices, and MEMS devices (such as acceleration sensors, 134421 .doc -20- 201003876 Angular speed sensing Is, magnetic sensor, pressure sensor, infrared sensor, micro mirror array, xenon microphone, xenon oscillator and rf_mems switch) as well as flow sensor and wind pressure sensor. The microphone requires a through hole, such as a sound hole that allows the internal space to circulate with the external space, while some sensors do not require a through hole and the flow sensor requires two through holes. In the case of a hermetic seal and vacuum seal, for example after attaching a hermetic seal such as a quartz oscillator to the package substrate 7, the cover 8 is bonded to the package in a vacuum seal (not shown) Substrate 7. A sufficiently large contact area can be ensured between the cover 8 and the package substrate 7 having the peripheral wall 42 and the extension 43. Only the inner connecting surfaces 21 to 23 (corresponding to the surfaces of the terminals 12 to 14) and the inner connecting surface of the base are in the package * and the other areas of the package substrate 7 are sealed using the molding resin 6; The first space formed by the encapsulation base 7 and the cover 8 is sealed at the end of the mode. The semiconductor package according to the present invention is preferably applied to a hermetic sealing and vacuum sealing device, the inner space of which is sealed in a gas-tight manner and in a vacuum substrate, such as a quartz vibrating filter. The above embodiments (4) are designed such that four external connection surfaces corresponding to the base and the terminals are respectively used for power supply, output, gain control, and grounding, and the semiconductor device of the present invention requires a connection surface for each of the components. For the purpose of power supply, output and grounding, two connection surfaces can be formed for the purpose of grounding with the #拉αm junction. The number of terminals is the number of semiconductor wafers and the number of semiconductor wafers in the semiconductor device of the semiconductor wafer. Not limited to two two = 134421.doc -21 - 201003876, etc. The connection 9 is added to the number of terminals connected to the external frame 1 (for example) five-terminal or six-terminal configuration, so that the above specific embodiments are Designed to make the lead frame complete in a flat shape' while forming a specified height difference by semi-touching (the:: = but this is not a 'constraint.) by (for example) embossing or embossing two degrees of difference (or not Regularity. ^ : forming a concave (four) forming a (four) outer connecting surface to form the molding resin by means of a metal mold, thereby forming a protrusion protruding from the molded resin The external connection surface and the support are in this case. In this case, the back side of the purpose is floating above the surface of an external substrate. The above specific embodiment is such that each cover is bonded via the conductive adhesive. To the package substrate, the electrical bonding is pre-applied to the extended portion of the package substrate; however, this is not a constraint. The cover can be fixed to the package substrate via an adhesive sheet. The adhesive is attached to the extension of the package substrate. In the meantime, the present invention is not limited to the above specific embodiments and the modifications, and may be further modified within the scope of the invention defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS These and other objects, aspects and embodiments of the present invention are described in more detail. Figure 1 is a diagram showing the surface of a lead frame for use in a semiconductor device in accordance with a first embodiment of the present invention. A plan view: Fig. 2 is a rear view showing the back side of the lead frame shown in Fig. 1; >3442].d〇c •22· 201003876 Fig. 3 is a perspective view showing the material substrate. Figure 4 is a plan view of the package substrate shown in Figure 3; Figure 5 is a rear view of the package substrate shown in Figure 3; Figure 6 is along Figure 4. A longitudinal cross-sectional view taken from the center line B to B, showing a cover applied to the package substrate on which the semiconductor wafer is mounted; FIG. 7 is a line taken from line c to c of FIG. A longitudinal sectional view showing the cover attached to the package substrate; FIG. 8 is a longitudinal sectional view showing a lead frame held by an injection mold; FIG. 9 is a view showing a second embodiment according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A plan view of a surface of a lead frame in a semiconductor device; FIG. 1 is a rear view of the back side of the lead frame shown in FIG. 9; FIG. 11 is not used for the second specific Figure 1 is a plan view of a package substrate shown in Figure 11; Figure 13 is a rear view of the package substrate shown in Figure 11; Figure 1 is a longitudinal section of the line D to D, which is not fixed by the cover. FIG. 15 is a longitudinal sectional view of the lead frame of FIG. 9 which is not held by the injection metal mold; FIG. 16 shows a third embodiment according to the present invention. A longitudinal sectional view of one of the semiconductor devices; and FIG. 17 is an enlarged plan view showing an acoustic hole formed by 134421.doc -23-201003876 which is not in the package substrate of the semiconductor device shown in FIG. 16; Fig. 18 is a longitudinal sectional view showing a lead frame of a semiconductor device shown in Fig. 16 held by an injection metal mold. [Main component symbol description] 1 Semiconductor device 2 Microphone chip 3 Control chip/circuit wafer 4 Package 5 Lead frame 6 Box molding resin 7 Package substrate 8 Cover 9 Connection 10 External frame 11 Abutment/surface 12 Power supply terminal 13 Output Terminal 14 Gain terminal 15 Main portion 16 Extension portion 17 Extension portion 21 Internal connection surface 22 Internal connection surface 23 Internal connection surface 134421.doc -24- 201003876

24 Lower surface 25 Internal connection surface 26 External connection surface 27 External connection surface 28 External connection surface 29 External connection surface 30 Extension portion 31 Extension portion 32 Support 33 Support 34 Support 41 Base portion 42 Peripheral wall 43 Extension portion 44 Wide section 45 hole 46 Die key 47 Bonding wire 51 Top part 52 Side wall 53 Edge 54 Sound hole 55 Internal space 56 Conductive adhesive 134421.doc -25- 201003876 61 Upper mold 62 Lower mold 63 Cavity 71 Lead frame 72 Abutment 73 Main section 74 Lower hole 75 Terminal 76 Internal connection surface 77 Extension/external connection surface 78 Support 81 Lower mold 82 Connector 83 Upper mold 84 Sub L 85 Pillar 86 Cavity 91 Molded resin 92 Sound hole 93 Cylindrical wall 94 Package Substrate 96 Cover 97 Semiconductor Device 100 Semiconductor Device.doc -26- 201003876 101 102 103 104 105 106 107 108 f \ 109 111 112 113

A Package Package base Lead frame Abutment Molded resin Window hole Small hole Sound hole Curved wall Upper mold Lower mold Round protrusion Area

134421.doc

Claims (1)

201003876 VII. Patent application scope: 1. A lead frame embedded in a box-shaped molding resin; the box-shaped wedge resin comprises: a bottom portion; a peripheral wall disposed around one of the base portions And an extension portion extending from the periphery of the base portion outside the peripheral wall, the lead frame comprising: a base embedded in the base portion of the molding resin, wherein the base One of the extension portions extends within the extended portion of the molded resin; a plurality of terminals adjacent to the base and formed by the peripheral wall of the molding resin and the extending portion away from each other; wherein a portion of the surface of the base is combined with the peripheral wall to serve as an internal connection a surface, and a defined portion of the surface of the terminals is used in conjunction with the peripheral wall as an internal connecting surface; wherein other portions of the surfaces of the terminals are bonded to the molding resin, the extended portion serving as a lower surface, which is attached A surface in the thickness direction is lower than the surface of the 5 mystery abutment. 2. 3. 4. A lead frame as claimed, wherein the extension of the abutment extends in conjunction with the extension of the molding resin. °: a lead frame of claim i, wherein an external connection surface is formed such that a surface of the two κ bases is vertically opposed to each other at a position where a position protrudes from the H of the ' and a plurality of external connection surfaces are formed to The plurality of terminals (four) of the terminals of the terminals are perpendicularly opposed to each other. The lead frame of claim 3, which further comprises a plurality of supports, 134421.doc 201003876 has a height from which the back of the base protrudes on the same side as the outer connecting surfaces. 5 . A sealing substrate comprising: a lead frame comprising a base and a plurality of terminal turns and a molded resin comprising: a bottom portion; a peripheral wall disposed on the base portion _ L a periphery of the T7 plaque, and an extension portion extending from the periphery of the base portion outside the peripheral wall; wherein the base is embedded in the base portion of the molded tree wax, the base And extending the portion of the molded resin to the exposed portion and exposing the plurality of terminals to the base to form and bonding the peripheral wall of the molding resin and the extending portion away from each other, Wherein a predetermined portion of the surface of the abutment is used in conjunction with the peripheral wall as an inner surface, and a predetermined portion of the surface of the terminal is used in conjunction with the peripheral wall as an internal connecting surface; wherein the surfaces of the terminals The other portion is combined with the extended portion of the molding resin to serve as a lower surface which is lower than the surface of the base in the thickness direction; wherein a plurality of holes are formed in the periphery of the molding resin So that the base of (iv) exposing the inner surface of the connection portion of the feeding terminal connecting material surface. The package substrate of claim 5 is formed such that an external connection surface is formed to protrude from the back side of the base at a position where the inner surface of the base is vertically opposed, and a plurality of external connection surfaces are formed. And protruding from a plurality of back sides of the terminal such as 134421.doc 201003876 at positions vertically opposite to the internal connection surface such as shai, such as &, 4, etc., and wherein the external connection surface of the base and the terminals The outer connecting surfaces are exposed on the back side of one of the molding resins. 7. The package substrate of claim 6, further comprising a plurality of supports protruding from the back side of the base using the same height as the external connection surfaces such that the supports are connected to the outer portions The surface is exposed on the back side of one of the molded resins. 8. A package comprising: a package substrate comprising: a lead frame comprising a base and a plurality of terminals; and a molded resin comprising: a bottom portion; a peripheral wall disposed on a periphery of one of the base portions; and an extended portion extending from the periphery of the base portion outside the peripheral wall; and a cover composed of a conductive material The package substrate is assembled to cover an inner space surrounded by the peripheral wall in such a manner that a peripheral portion thereof is electrically connected to one of the extended portions of the molding resin of the package substrate; wherein the base is embedded in the molding In the base portion of the resin, an extension portion of the base extends over the extended portion of the molded resin - and is exposed, and a plurality of terminals are formed adjacent to the base and bonded to the periphery of the molded resin The wall and the extending portion are away from each other; wherein one of the surfaces of one of the surfaces of the base is combined with the peripheral wall to serve as an internal connecting surface, and a predetermined portion of the surface of the terminal The peripheral wall is used as an internal connecting surface; 134421.doc 201003876 wherein the other portions of the surfaces of the terminals are combined with the extended portion of the molding resin for use as a lower surface, which is low in a thickness direction The surface of the abutment; wherein a plurality of holes are formed in the peripheral wall of the molding resin to expose the inner connecting surface of the base and the inner connecting surfaces of the terminals. 9. The package of claim 8, wherein an outer connecting surface is formed to protrude from the back side of the base at a position perpendicular to the inner connecting surface of the base and a plurality of external connecting surface systems Forming to protrude from a plurality of back sides of the terminals at positions where the internal connection surfaces of the terminals of the disk are vertically opposed, and wherein the hexagram is violent, and the external connection surface and the terminals are These external 矣 矣 && heart < / son. The crucible joining surface is exposed on the back side of one of the molding resins. The package of claim 9, further comprising a plurality of branches that are identical to the outer connecting surfaces - the height protruding from the back side of the base such that the objects and the outer look Bu. The crucible joining surface is exposed on the back side of one of the molded resins. 11. A semiconductor device comprising: a semiconductor wafer; a package substrate comprising: a bow I-line frame comprising: a base and a plurality of terminals; and, & resin comprising: a bottom portion; a peripheral wall disposed on the periphery of the base portion, and a portion extending from the outer periphery of the peripheral wall from the periphery of the base portion of the octagonal portion And 134421.doc 201003876 a cover consisting of a conductive material that is assembled with the package substrate so as to be covered by one of the extended portions of the molding resin whose peripheral portion is electrically connected to the chassis package substrate An inner space surrounded by the peripheral wall; Wherein the base is embedded in the base portion of the molding resin, an extension portion of the base extends over the extended portion of the molding resin and is exposed, and a plurality of terminals are formed adjacent to the base. And the peripheral wall of the molding resin is separated from the extending portion; wherein a predetermined portion of one surface of the base is combined with the peripheral wall to serve as an internal connecting surface, and a predetermined portion of the surface of the terminal is combined The peripheral wall serves as an internal connection surface; wherein the other portions of the surfaces of the terminals are bonded to the extended portion of the molding resin for use as a lower surface that is lower than the surface of the abutment in a thickness direction Wherein a plurality of holes are formed in the peripheral wall of the molding resin to expose the inner connecting surface of the base and the inner name connecting surfaces of the terminals, so that the semiconductor wafer is mounted on the base The internal connections of the peripheral walls of the peripheral wall are electrically connected to the internal connection surfaces of the terminals and the internal connection surfaces of the terminals. 12' The semiconductor device of claim n wherein the outer connecting surface is shaped to protrude from the back side of one of the substations at a position perpendicular to the inner connecting surface of the submount, and the plurality of external connecting surfaces are The plurality of back sides of the terminals protrude at positions perpendicular to the internal connecting surfaces of the terminals, and wherein the outer portion 13442 of the base is attached to the molded resin joint surface It is exposed on the back side of one of the external connection tables of the terminals. 13. The semiconductor device of claim 2, further comprising a plurality of supports' which protrude from the back side of the base 2 using a height equal to the outer connecting surface of the outer joint, such that the branches樘° * The foot support and the external connection surfaces are exposed on the back side of one of the molding resins. A microphone package comprising: a microphone wafer; a package substrate comprising: a lead frame comprising - a base and a plurality of terminals; and - a molding resin comprising: - a bottom a portion; a peripheral wall disposed on a periphery of the base portion; and an extension portion extending from the periphery of the base portion outside the peripheral wall; and a cover composed of a conductive material, And the package substrate is assembled to cover an inner space surrounded by the peripheral wall with one of the extended portions of the molding resin electrically connected to the package substrate; wherein the base is embedded in In the base portion of the molding resin, an extension portion of the base extends over the extended portion of the molding resin and is exposed, and a plurality of terminals are formed adjacent to the base and bonded to the molding resin. The peripheral wall and the extending portion are away from each other; wherein one of the surfaces of one of the bases is combined with the peripheral wall to serve as an internal connecting surface, and the terminals are The specified portion of the surface is combined with the peripheral wall for use as an internal connecting surface; I3442J.doc • 6 · 201003876 wherein the other portions of the surfaces of the terminals are bonded to the lower surface of the extended portion of the molded resin, which is attached to a thickness lower than the surface of the base; wherein a plurality of holes are formed in the peripheral wall of the molding resin to expose the internal connecting surface of the base and the internal connecting surfaces of the terminals The semiconductor crystal system 1 is disposed on the wire table and is electrically connected to the inner connecting surface of the base and the inner connecting surfaces of the terminals via holes d of the peripheral wall; ^ wherein the inner space is connected to the inner space; A sound hole is formed in the cover or the package substrate. 15. 16. 17. The microphone package of claim 14 wherein the outer connecting surface is formed at a position perpendicular to the inner surface of the 6-inch internal connection of the base of the base. And a plurality of external connection surfaces are formed to protrude from a plurality of back sides of the terminals at positions perpendicular to the material receiving surfaces of the terminals, and the external connection surface of the substrate of the substrate The material external material surface of the material is exposed on the back side of one of the (4) resin. According to the microphone package of claim 15, the step-by-step includes a plurality of branches which protrude from the base 4 (four) at the same height as the external connection surface such as 5 hai, so that the material cut and the outer connecting surface of the material are attached to each other. One side of the side molding resin is exposed on the back side. The microphone package of claim U, wherein a plurality of solid small holes commonly used as the sound hole are formed in an exposed area of the base exposed through a window hole formed in the molding resin. 134421.doc