201000800 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種照明裝置，尤指一種具有發光二極體 之照明裝置及其製造方法。 【先前技術】 發光二極體（Light Emitting Diode，LED)具有環保、 亮度高、省電、壽命長等諸多特點，將漸漸成為主要照明 光源。單個發光二極體晶粒之亮度有限，需組合複數發光 二極體才能滿足高亮度照明需求。業内通常是將發光二極 體晶粒經過打金線、點膠等封裝工藝後形成單顆發光二極 體’然後再將發光二極體逐一安裝於照明裝置内。然，該 製造方法不能一體式實現複數發光二極體晶粒同步封裝於 照明裝置内’製造過程繁瑣，成本較高。 【發明内容】 鑒於此，有必要提供一種製造簡便且成本較低之發光 二極體照明裝置及其製造方法。 一種發光二極體照明裝置包括一第一基板、一第二基 板及複數發光二極體晶粒，該第一基板上形成有複數第一 電極、第一内總電極及第二内總電極，該複數第一電極藉 由導線與第一内總電極電連接，該複數發光二極體晶粒分 別一一對應電連接至該第一基板之複數第一電極上，該第 一基板上形成有複數第二電極及第三内總電極，該複數第 6 201000800 二電極與第—基板之複數第-電極一對應，該複數第二 電極藉由導線與第三内總電極電連接，該第二基板組裳至 第一基板上，該複數發光二極體晶粒分別與第二基板上相 對應之第二電極電連接，該第一基板之第二内總電極與第 二基板之第三内總電極電連接。 -徑媸照明裒置之製造方法 驟·提供帛-基板’該第—基板上形成有複數第一電極、 第-内總電極及第二内總電極，該複數第—電極藉由導線 與第-内總電極電連接；將複數發光二極體晶粒結合至第 一基板上，使該複數發光二極體晶粒分別--對應結合至 該複數第-電極上，將每-發光二極體晶粒與其相對康之 第一電極電連接；提供-第二基板，該第二基板上: 複數第二電極及第三内總電極，該複數第二電極與第^ 板之第-電極一對應’該複數第二電極藉由導線邀: 内總電極電連接；將第二基板組裝於第_基板上，使^ 數發光二極體晶粒分別與第二基板上相對應之第二電极 連接’使第-基板之第二内總電極與第二基板 電極電連接。 巧總 與習知技術相比較，本發明之發光二極體照明 製造方法使得複數發光二極心粒—體式时封裝於 裝〒内，無須對每-發光二極體晶粒逐—打金線、點： 工藝’製造方法簡便且成本較低。 > 寻 【實施方式】 201000800 如圖1所示，發光二極體照明裝置包括一第一基板工、 複數發光二極體晶粒16、—第二基板2、密封框3及 鏡4 〇 如圖2及圖3所示，第-基板！呈長方形板狀，包每 上表面18及下表面19上表面18與下表面19相對設置 第一基板1之二端分別開設第一導電柱13及第二導電挺 14，且第一導電柱13及第二導電柱14分別貫通於第一基 板1之上、下表面18、19。第一基板1之上表面18形成有 第一電極圖案10、第一内總電極11、第二内總電極12、第 一導電總線15及複數第一導電支線150，第一基板i之下 表面19形成有第一外總電極191及第二外總電極192，第 一内總電極11及第一外總電極191分別設於第一導電柱 之上下二端之週圍，第一導電柱13將第一内總電極u與 第一外總電極191電連接，第二内總電極12及第二外總電 極192分別設於第一導電柱14之上下二端週圍，第二導電 柱14將第二内總電極12與第二外總電極192電連接。第 一電極圖案10包括複數第一電極101，該複數第一電極1〇1 間隔地設置於第一基板1之上表面18 ’且對稱分佈在該第 一導電總線15之一側，其十每二第一電極1〇1成一組並分 佈在該第一導電總線15^ —側，該每組之二第一電極1〇1 藉由一根第一導電支線150連接，第一導電總線15連接在 各第一導電支線150之中部從而將每一第一電極1〇1均與 第一内總電極11電連接，即該複數第—電極藉由第一 導電總線15及第一導電支線150構成之導線與第一内總電 8 201000800 極11電連接。 #-發光二極體晶粒16包括上電極i6i及下電極 162 ’上電極161位於發光二極體晶粒W之頂部，下電極 162位於料二極體晶粒16之底部，該複數發光二極體晶 粒16與第-基板1之複數第—電極1〇1 一一對應，每一發 光二極體晶粒16分別設於所對應之第—電極ι〇ι上，每一 發光二極體晶粒16之下電極162與其所對應之第一電極 101電連接，如圖4所示。 如圖1及圖5所示，第二基板2呈長方形板狀，由透 光材料製成’如极氧樹脂、玻璃及壓克力等。第二基板2 包括上表面21及下表面22，上表面21與下表面22相對設 置，第二基板2之面積略小於第一基板丄之面積，第二基 板2之下表面22覆蓋於第—基板丄之上方。第二基板2之 下表面22形成有第二電極圖冑23、第三内總電極、第 二導電總線24及複數帛二導電支線·。帛二電極圖案23 包括複數第二電極231，該複數第二電極231間隔設置且平 均分佈在該第二導電總線24之二側，其中每二第二電極 231成一組並分佈在該第二導電總線％之二側，該每組之 二第二電極231藉由-根第二導電支線連接，第二導 電總線24連接在各第二導電支線24〇之中部從而將每一第 電極231與第二内總電極25電連接，即該複數第二電極 231藉由第二導電總線24及第二導電支線240構成之導線 與第三内總電極25電連接。 如圖6所示，第二基板2組裝至第一基板i時，該複 9 201000800 數第二電極231與該複數發光二極體晶粒i6 一一對應，每 一第：f極231與所對應之發光二桎體晶粒16之上電桎 =1’第三内總電極25與第-基板1之第二内總電 極12相對應且電連接。 如圖1及圖7所示，密射姑 由透光材料製成，如錢力、環4|長方财空之框狀’ 於第-基板!與第二基板2之:，等，密封框3連接 二基板2之間外關隙。第 1在第-基板1與第 第間，該複數發光二極體晶粒16、 第一基板1之第一内總電極1Ί、 一 ^ ^ ^ 第二内總電極12及第二基 板2之第二内總電極25均密封於該密封空間内。 如圖1及圖8所示，透鏡4呈殼狀，包括一頂板 一侧壁42，側壁42由頂板41 及 42環繞形成-開口 43，透^外緣向下延伸而成，側壁 π卜，m，“ 罩設於第一基板1之上表面 土板與透鏡4共同形成一容納空間，第 板2及密馳3均收容於該_ 〜 所有發光二極體晶粒16 板!之第-電極皿、第一導2電極162依次藉由第-基 第-内總電極…第-導^支線跡第—導電總線15、 基板2之第二電極231、第-裝之上電極161依次藉由第二 24、第三内總電極25及第:電支線240、第二導電總 二導電柱U電連接到第二外t1之第T總電極12、第 及第二外總電極m作為C苐一外總電極191 <原、輪入端以向所有發光二極體 201000800 晶粒16提供電屋，該發光二極體照明裝置不僅一體式佈線 以向所有發光二極體晶粒16供電，該發光二極體照明装置 之第二基板2還可一體式保護所有發光二極體晶粒16，這 使得發光二極體照明裝置之結構更加緊湊，製造更簡便。 如圖2至8所示’為本發明發光二極體照明裝置之一 種製造方法，包括以下步驟： 首先’提供一第一基板1，如圖2及圖3所示，使第一 基板1之上表面18形成有第一電極圖案10、第一内總電極 11、第一内總電極12、第一導電總線15及複數第一導電支 線150，第一電極圖案1〇之複數第一電極1〇1藉由該複數 第一導電支線150及該第一導電總線15與第一内總電極u 電連接’第一基板1之下表面19形成有第一外總電極191 及第二外總電極192，藉由第一導電柱13將第一内總電極 11與第—外總電極191電連接，藉由第二導電枉14將第二 内總電極12與第二外總電極192電連接。 其次’如圖4所示’將複數發光二極體晶粒16結合至 第一基板1上，使該複數發光二極體晶粒16與第一電極圖 案10之第一電極1〇1 一一對應，將每一發光二極體晶粒16 之下電極162分別與第一電極圖案1〇中相對應之第一電極 101電連接。 再次，如圖5所示，提供一第二基板2，使該第二基板 2之下表面22形成有第二電極圖案23、第三内總電極25、 第一導電總線24及複數第二導電支線24〇，第二電極圖案 23之複數第二電極23；[藉由該複數第二導電支線240及該 11 201000800 . 第二導電總線24與第三内總電極25電連接，第二電極圖 案23之第二電極231與第一基板i上之發光二極體晶粒16 --對應。 然後，如圖6所示，將第二基板2組裝於第一基板i 上，使發光二極體晶粒16之上電極16ι與第二基板2上相 對應之第二電極231電連接，第一基板丄之第二内總電極 12與第二基板2之第三内總電極25電連接。進一步而言， 首先在第一内總電極12及每一發光二極體晶粒16之上電 極161上設置焊料17,焊料17可為錫球或焊接金凸塊等焊 接材料；將第二基板2置於第一基板i上時，第二基板2 之每-第二電極况平貼于與其相對應之發光二極^晶粒 16並麗合在焊料17上，第三内總電極25平貼於第二内總 電極12並壓合在焊料17上；把第二基板2連同第一基板工 -起置於加熱裝置（圖中未示出）中，使每—發光二極體 晶粒16及第二内總電極12上之焊料1?被加熱炼融，使得 每一發光二極體晶粒16之上電極161 _於第二電杨圖案 23中相對應之第二電極231，第二内總電極^枯附於第三 内總電極25 ;最後冷卻第—基板！及第二基板2，於光I _晶粒16及第二内總電極12上之焊料17冷卻凝固，使 得發光二極體晶粒16連接于相對應之第二電極如 内總電極12連接於第三内總電極％。該 狀列:車封裝㈤—焊㈣呈球狀或二= ^ 陣列式分佈於第—基^上，則發光二極 體曰曰粒16上之焊料17亦按陣列式分佈，躲之谭料17具 12 201000800 有表面張力，可實現發光二極體晶粒16之上電極⑹與第 二基板2上所對應之第二電極231自動位置對齊，即使兩 者略有偏離，纽融烊料17之表面張力作用下可使得兩者 完全對齊，進而實現第-基板1與第二基板2之完全對齊。 接著，如圖7所示，在第—基板1與第二Γ板王2之間 隙Ϊ圍設置—圈密封材料，如麗克力、環氧樹脂等，形成 而第:基板^第二基板2及密封框3共同 篦：细：間該複數發光二極體晶粒16、第-基板1 = 第二内總電極12及第二基板2之第三 =極25均密封於該密封空間内。該步驟為可選步驟， 並非為必要步驟。 如圖8所示，提供—透鏡4，將透鏡4罩設於第 =二板S Γ基板1與透鏡4共同形成-容納空間， 及密封框3均收容於該容納空間内。 光-體照明裝置製造過程中，無須逐-給每-發 連接，也無須逐—給每— 體晶粒16之電極 保護發光二_晶粒16，16製作一殼體以 連接，且光二極體晶粒16之電極一體式同步 %上所所有發光二極體晶粒16之殼體安裝。 專利;請合發明專利之要件，妥依法提出 熟悉本案技藝之::迷:僅為本發明之較佳實施例，舉凡 或變化，㈣作之秘修飾 13 201000800 ' 【圖式簡單說明】 圖1為本發明之發光二極體照明裝置之一較佳實施例 之分解示意圖。 圖2為圖1中第一基板之立體示意圖。 圖3為圖2中沿Π - ΠΙ之剖面示意圖。 圖4為本發明發光二極體照明裝置製造方法中將複數 發光二極體晶粒結合至第一基板後之示意圖。 圖5為圖1中第二基板翻轉後之立體示意圖。 圖6為本發明發光二極體照明裝置製造方法中第二基 板組裝於第一基板步驟之示意圖。 圖7為本發明發光二極體照明裝置製造方法中形成密 封框後之示意圖。 圖8為本發明發光二極體照明裝置製造方法中將透鏡 罩設於第一基板步驟之示意圖。 【主要元件符號說明】 第一基板 1 第一電極圖案 10 第一電極 101 第一内總電極 11 第二内總電極 12 第一導電柱 13 第二導電柱 14 第一導電總線 15 第一導電支線 150 發光二極體晶粒 16 上電極 161 下電極 162 焊料 17 上表面 18、21 下表面 19、22 第一外總電極 191 第二外總電極 192 第二基板 2 第二電極圖案 23 第二導電總線 24 14 201000800 第二導電支線 240 第三内總電極 25 密封框 3 透鏡 4 頂板 41 側壁 42 開口 43 15201000800 IX. Description of the Invention: [Technical Field] The present invention relates to a lighting device, and more particularly to a lighting device having a light emitting diode and a method of manufacturing the same. [Prior Art] Light Emitting Diode (LED) has many characteristics such as environmental protection, high brightness, power saving and long life, and will gradually become the main illumination source. The brightness of a single light-emitting diode has a limited brightness, and it is necessary to combine a plurality of light-emitting diodes to meet the demand for high-brightness illumination. In the industry, a light-emitting diode chip is usually subjected to a packaging process such as gold wire bonding or dispensing to form a single light-emitting diode. Then, the light-emitting diodes are mounted one by one in the lighting device. However, the manufacturing method cannot realize the integrated package of the plurality of light-emitting diodes in the lighting device in an integrated manner. The manufacturing process is cumbersome and costly. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a light-emitting diode lighting device which is simple to manufacture and low in cost, and a method of manufacturing the same. A illuminating diode illuminating device includes a first substrate, a second substrate, and a plurality of illuminating diode dies. The first substrate is formed with a plurality of first electrodes, a first inner total electrode and a second inner total electrode. The plurality of first electrodes are electrically connected to the first inner total electrode by wires, and the plurality of light emitting diodes are respectively electrically connected to the plurality of first electrodes of the first substrate in one-to-one correspondence, and the first substrate is formed with a plurality of second electrodes and a third inner total electrode, wherein the plurality of sixth 201000800 two electrodes correspond to a plurality of first electrodes of the first substrate, and the plurality of second electrodes are electrically connected to the third inner total electrode by wires, the second The substrate group is mounted on the first substrate, and the plurality of LEDs are electrically connected to the second electrode corresponding to the second substrate, and the second inner electrode of the first substrate and the third inner substrate of the second substrate The total electrode is electrically connected. - manufacturing method of the 媸 媸 裒 · · 帛 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 第 第 第 第 第 第 第- the inner total electrode is electrically connected; the plurality of light emitting diode crystal grains are bonded to the first substrate, and the plurality of light emitting diode crystal grains are respectively correspondingly coupled to the plurality of first electrode, each of the light emitting diodes The body die is electrically connected to the opposite first electrode; a second substrate is provided on the second substrate: a plurality of second electrodes and a third inner total electrode, wherein the plurality of second electrodes correspond to the first electrode of the second plate The second electrode of the plurality is electrically connected by the wire: the inner electrode is electrically connected; the second substrate is assembled on the _ substrate, so that the illuminating diode dies are respectively corresponding to the second electrode on the second substrate The connection 'connects the second inner total electrode of the first substrate to the second substrate electrode. Compared with the conventional technology, the method for manufacturing the LED illumination of the present invention allows the plurality of LED dipoles to be packaged in the package without the need for a gold wire for each of the LED chips. , point: Process 'manufacturing method is simple and low cost. < 寻 [Embodiment] 201000800 As shown in FIG. 1 , the LED illumination device includes a first substrate, a plurality of LED dipoles 16, a second substrate 2, a sealing frame 3 and a mirror 4 Figure 2 and Figure 3, the first substrate! The first conductive pillar 13 and the second conductive bump 14 are respectively opened at the two ends of the first substrate 1 opposite to the upper surface 18 and the lower surface 19 of the upper surface 18 and the lower surface 19 respectively, and the first conductive pillar 13 is opened. And the second conductive pillars 14 respectively penetrate the upper and lower surfaces 18 and 19 of the first substrate 1. The upper surface 18 of the first substrate 1 is formed with a first electrode pattern 10, a first inner total electrode 11, a second inner total electrode 12, a first conductive bus 15 and a plurality of first conductive branches 150, the lower surface of the first substrate i 19, a first outer total electrode 191 and a second outer total electrode 192 are formed. The first inner total electrode 11 and the first outer total electrode 191 are respectively disposed around the lower two ends of the first conductive pillar, and the first conductive pillar 13 The first inner total electrode u is electrically connected to the first outer total electrode 191, and the second inner total electrode 12 and the second outer total electrode 192 are respectively disposed around the lower two ends of the first conductive pillar 14, and the second conductive pillar 14 is The two inner total electrodes 12 are electrically connected to the second outer total electrode 192. The first electrode pattern 10 includes a plurality of first electrodes 101, which are disposed at intervals on the upper surface 18' of the first substrate 1 and symmetrically distributed on one side of the first conductive bus 15, and each of the ten The first electrodes 1〇1 are grouped and distributed on the first conductive bus 15—the two first electrodes 1〇1 of each group are connected by a first conductive branch 150, and the first conductive bus 15 is connected. Each of the first electrodes 1〇1 is electrically connected to the first inner total electrode 11 in the middle of each of the first conductive branches 150, that is, the plurality of first electrodes are formed by the first conductive bus 15 and the first conductive branch 150. The wire is electrically connected to the first internal power 8 201000800 pole 11 . The light-emitting diode die 16 includes an upper electrode i6i and a lower electrode 162. The upper electrode 161 is located at the top of the light-emitting diode die W, and the lower electrode 162 is located at the bottom of the die diode die 16, and the plurality of light-emitting diodes The polar crystal grains 16 are in one-to-one correspondence with the plurality of first electrodes 1〇1 of the first substrate 1, and each of the light emitting diode crystal grains 16 is respectively disposed on the corresponding first electrode ι〇ι, each of the light emitting diodes The lower electrode 162 of the bulk die 16 is electrically connected to its corresponding first electrode 101, as shown in FIG. As shown in Figs. 1 and 5, the second substrate 2 has a rectangular plate shape and is made of a light-transmitting material such as an aerobic resin, glass, and acrylic. The second substrate 2 includes an upper surface 21 and a lower surface 22. The upper surface 21 is disposed opposite to the lower surface 22. The area of the second substrate 2 is slightly smaller than the area of the first substrate, and the lower surface 22 of the second substrate 2 covers the first surface. Above the substrate. The lower surface 22 of the second substrate 2 is formed with a second electrode pattern 23, a third inner total electrode, a second conductive bus 24, and a plurality of second conductive branches. The second electrode pattern 23 includes a plurality of second electrodes 231 spaced apart and evenly distributed on two sides of the second conductive bus 24, wherein each of the second electrodes 231 is grouped and distributed in the second conductive On the two sides of the bus, the second electrode 231 of each group is connected by a second conductive branch, and the second conductive bus 24 is connected to the middle of each of the second conductive branches 24 to thereby connect each of the first electrodes 231 and The two inner electrodes 25 are electrically connected to each other, that is, the plurality of second electrodes 231 are electrically connected to the third inner total electrode 25 by wires formed by the second conductive bus 24 and the second conductive branch 240. As shown in FIG. 6, when the second substrate 2 is assembled to the first substrate i, the plurality of 201000800 second electrodes 231 are in one-to-one correspondence with the plurality of light-emitting diode crystal grains i6, and each of the f-th poles 231 and Corresponding to the upper surface of the light-emitting diode body 16, the third inner total electrode 25 corresponds to and is electrically connected to the second inner total electrode 12 of the first substrate 1. As shown in FIG. 1 and FIG. 7 , the dense shot is made of a light-transmitting material, such as a frame of the Qianli, the ring 4|the rectangular space, the first substrate, the second substrate 2, and the like, sealed. Block 3 connects the outer gap between the two substrates 2. In the first substrate 1 and the first substrate, the plurality of light emitting diode crystal grains 16, the first inner total electrode 1 of the first substrate 1, the second inner total electrode 12, and the second substrate 2 The second inner total electrode 25 is sealed in the sealed space. As shown in FIG. 1 and FIG. 8 , the lens 4 has a shell shape and includes a top plate and a side wall 42. The side wall 42 is surrounded by the top plates 41 and 42 to form an opening 43. The outer edge extends downwardly, and the side wall is π. m, "the cover plate is disposed on the upper surface of the first substrate 1 and the surface plate and the lens 4 together form a receiving space, and the second plate 3 and the compact 3 are respectively accommodated in the _ ~ all of the light-emitting diode die 16 plate - the first - The electrode vessel and the first conductive electrode 162 are sequentially borrowed by the first base-internal total electrode, the first conductive lead bus, the second conductive electrode 15, the second electrode 231 of the substrate 2, and the first upper electrode 161. The second 24, the third inner total electrode 25 and the first electrical total branch 240, the second conductive total two conductive pillars U are electrically connected to the second outer total electrode 12 of the second outer t1, and the second outer total electrode m as C The outer total electrode 191 < the original, the wheel-in terminal to provide electricity to all of the light-emitting diodes 201000800 die 16 , the light-emitting diode lighting device not only integrated wiring to supply power to all of the light-emitting diode die 16 The second substrate 2 of the LED illumination device can also integrally protect all the LED dipoles 16 , which makes the LED illumination The structure of the device is more compact and easier to manufacture. As shown in Figures 2 to 8, a manufacturing method of the light-emitting diode lighting device of the present invention includes the following steps: First, a first substrate 1 is provided, as shown in Fig. 2 and 3, the first substrate 1 is formed with a first electrode pattern 10, a first inner total electrode 11, a first inner total electrode 12, a first conductive bus 15 and a plurality of first conductive branches 150, first The first electrode 1〇1 of the electrode pattern 1〇 is formed by the first first conductive branch 150 and the first conductive bus 15 electrically connected to the first inner total electrode u. The outer total electrode 191 and the second outer total electrode 192 electrically connect the first inner total electrode 11 and the first outer total electrode 191 by the first conductive pillar 13 , and the second inner total electrode 12 by the second conductive crucible 14 Electrically connected to the second outer total electrode 192. Next, as shown in FIG. 4, the plurality of light emitting diode crystal grains 16 are bonded to the first substrate 1 to make the plurality of light emitting diode crystal grains 16 and the first electrode pattern. 10 first electrode 1〇1 one-to-one correspondence, each lower electrode die 16 lower electrode 162 is electrically connected to the corresponding first electrode 101 of the first electrode pattern 1 。. Again, as shown in FIG. 5, a second substrate 2 is provided, and the lower surface 22 of the second substrate 2 is formed with a second electrode. a pattern 23, a third inner total electrode 25, a first conductive bus 24, and a plurality of second conductive legs 24A, and a plurality of second electrodes 23 of the second electrode pattern 23; [by the plurality of second conductive legs 240 and the 11 201000800 The second conductive bus 24 is electrically connected to the third inner total electrode 25, and the second electrode 231 of the second electrode pattern 23 corresponds to the light emitting diode die 16 on the first substrate i. Then, as shown in FIG. 6, the second substrate 2 is assembled on the first substrate i, and the upper electrode 16 of the LED die 16 is electrically connected to the corresponding second electrode 231 of the second substrate 2. The second inner total electrode 12 of one substrate is electrically connected to the third inner total electrode 25 of the second substrate 2. Further, first, a solder 17 is disposed on the first inner total electrode 12 and the upper electrode 161 of each of the light emitting diode dies 16, and the solder 17 may be a solder material such as a solder ball or a solder bump; When the second substrate 2 is placed on the first substrate i, the second electrode of the second substrate 2 is flatly attached to the corresponding light-emitting diodes 16 and is laminated on the solder 17, and the third inner electrode 25 is flat. Attached to the second inner total electrode 12 and pressed onto the solder 17; the second substrate 2 together with the first substrate is placed in a heating device (not shown) to make each of the light-emitting diode grains 16 and the solder 1 on the second inner total electrode 12 are heated and fused so that the upper electrode 161 of each of the light-emitting diode dies 16 is corresponding to the second electrode 231 of the second electric yang pattern 23, The two inner total electrodes are attached to the third inner total electrode 25; finally, the first substrate is cooled! And the second substrate 2, the solder 17 on the light I_die 16 and the second inner total electrode 12 is cooled and solidified, so that the light emitting diode die 16 is connected to the corresponding second electrode such as the inner total electrode 12 Third internal total electrode %. The sequence: car package (5) - welding (four) is spherical or two = ^ array is distributed on the first base, then the solder 17 on the light-emitting diode particles 16 is also distributed in an array, hiding the tan 17 with 12 201000800 has surface tension, which can realize the automatic alignment of the electrode (6) on the upper surface of the light-emitting diode die 16 and the second electrode 231 corresponding to the second substrate 2, even if the two are slightly deviated, the neon material 17 The surface tension acts to completely align the two, thereby achieving complete alignment of the first substrate 1 and the second substrate 2. Next, as shown in FIG. 7 , a ring sealing material, such as a rickett force, an epoxy resin, or the like, is formed around the gap between the first substrate 1 and the second slab 2, and the substrate 2 is formed. And the sealing frame 3 is: fine: the plurality of light-emitting diode crystal grains 16, the first substrate 1 = the second inner total electrode 12 and the third electrode 25 of the second substrate 2 are sealed in the sealed space. This step is an optional step and is not a necessary step. As shown in Fig. 8, a lens 4 is provided, and the lens 4 is placed over the second plate S. The substrate 1 and the lens 4 together form a receiving space, and the sealing frame 3 is housed in the receiving space. In the manufacturing process of the light-body illuminating device, it is not necessary to provide a connection for each connection, and it is not necessary to provide a housing for each of the electrodes 16 to protect the light-emitting diodes 16, 16 to form a casing for connection, and the light diode The electrodes of the bulk die 16 are integrally mounted on the housing of all of the light-emitting diode dies 16 on the %. Patent; please meet the requirements of the invention patent, and be familiar with the skill of the case according to the law:: fans: only the preferred embodiment of the invention, anything or change, (4) secret modification 13 201000800 ' [Simple description of the figure] Figure 1 It is an exploded schematic view of a preferred embodiment of the light-emitting diode lighting device of the present invention. 2 is a perspective view of the first substrate of FIG. 1. Figure 3 is a schematic cross-sectional view taken along line Π - 图 in Figure 2; 4 is a schematic view showing the bonding of a plurality of light-emitting diode crystal grains to a first substrate in the method for fabricating a light-emitting diode lighting device of the present invention. FIG. 5 is a schematic perspective view of the second substrate of FIG. 1 after being inverted. Fig. 6 is a schematic view showing the steps of assembling a second substrate to a first substrate in the method of manufacturing a light-emitting diode lighting device of the present invention. Fig. 7 is a schematic view showing the formation of a sealing frame in the method of manufacturing a light-emitting diode lighting device of the present invention. Fig. 8 is a schematic view showing the steps of arranging a lens cover on a first substrate in the method of manufacturing a light-emitting diode lighting device of the present invention. [Description of main component symbols] First substrate 1 First electrode pattern 10 First electrode 101 First inner total electrode 11 Second inner total electrode 12 First conductive pillar 13 Second conductive pillar 14 First conductive bus 15 First conductive branch 150 light-emitting diode die 16 upper electrode 161 lower electrode 162 solder 17 upper surface 18, 21 lower surface 19, 22 first outer total electrode 191 second outer total electrode 192 second substrate 2 second electrode pattern 23 second conductive Bus 24 14 201000800 Second conductive branch 240 Third inner total electrode 25 Seal frame 3 Lens 4 Top plate 41 Side wall 42 Opening 43 15