CN203038968U

CN203038968U - LED illumination module

Info

Publication number: CN203038968U
Application number: CN2012206379906U
Authority: CN
Inventors: 韦嘉; 王之英; 董明智; 梁润园; 袁长安
Original assignee: BEIJING SEMICONDUCTOR LIGHTING TECHNOLOGY PROMOTION CENTER
Current assignee: BEIJING SEMICONDUCTOR LIGHTING TECHNOLOGY PROMOTION CENTER
Priority date: 2012-11-27
Filing date: 2012-11-27
Publication date: 2013-07-03
Anticipated expiration: 2022-11-27

Abstract

The application provides an LED illumination module. The LED illumination module comprises: a heat radiation plate; one or more LED packaging units isolated from each other and fixed on the heat radiation plate, wherein each LED packaging unit includes an LED chip and a driving circuit that are electrically connected with each other; a circuit board that is fixed on the heat radiation plate and is electrically connected with the LED packaging units; and a discrete device that is fixed on the circuit board and is electrically connected with the circuit board. The LED chips and the driving circuits are all packaged in the LED packaging units and are fixed on the heat radiation plate, so that a high-cost metal-based printed circuit board is avoided, costs are saved and excellent heat radiation effects can be exhibited through heat radiation of the heat radiation plate. Meanwhile, the discrete device that cannot be integrated and is low in heating energy is fixed on the common circuit board of the heat radiation plate, such that integrated levels of the LED illumination module is enhanced, the size of the LED illumination module is minimized and the excellent heat radiation effects are exhibited under a low cost condition.

Description

The LED lighting module

Technical field

The utility model relates to the LED lighting field, in particular to a kind of LED lighting module.

Background technology

The assembling of LED light fixture or module is often adopted as Fig. 1 or structure shown in Figure 2 at present.Connecting up at metal base printed circuit board 600 ' or heat sink 100 ' as shown in Figure 1, drive circuit 216 ' and discrete device 500 ' often are placed on the extra printed circuit board (PCB) 400 ' of light fixture outer, or led chip as shown in Figure 2 211 ' is arranged on the metal base printed circuit board 600 ' with drive circuit 216 ' simultaneously, the area of required like this metal base printed circuit board 600 ' increases greatly, and, realize better radiating effect in order to guarantee drive circuit 216 ' and led chip 211 ', all need to carry out special heat dissipation design, cause the complex structure of whole LED lighting module, because the cost of metal base printed circuit board 600 ' is higher and generally adopt the higher lamp bead seal of packaging cost to adorn led chip 211 ', cause the cost up of whole LED lighting module simultaneously.

The utility model content

The utility model aims to provide a kind of LED lighting module, has reduced cost and the volume of LED lighting module.

To achieve these goals, according to an aspect of the present utility model, provide a kind of LED lighting module, the LED lighting module comprises: heating panel; One or mutual a plurality of LED encapsulation units of isolating are fixed on the heating panel, and each LED encapsulation unit comprises led chip and drives the drive circuit of chip; Circuit board is fixed on the heating panel, is electrically connected with each LED encapsulation unit; Discrete device is fixed on the circuit board and with circuit board and is electrically connected.

Further, above-mentioned heating panel has hollow-out parts, and the part discrete device is arranged on the circuit board surface corresponding with hollow-out parts and to hollow-out parts and extends.

Further, the led chip of above-mentioned each LED encapsulation unit is one or is a plurality of chips of array distribution, each LED encapsulation unit also comprises: light emitting functional layer, and light emitting functional layer comprises: first package main body, led chip and drive circuit all are encapsulated in first package main body; First conductive layer is encapsulated in first package main body, and led chip and drive circuit all are electrically connected with first conductive layer, and circuit board is electrically connected with first conductive layer; Light translation function layer, light translation function layer comprises: one or be a plurality of phosphor powder layers of array distribution, phosphor powder layer is fixed on the side away from heating panel of light emitting functional layer, and aligns setting with led chip; Carrier, be fixed on light emitting functional layer away from a side of heating panel and have one or be a plurality of container cavities of array distribution, phosphor powder layer is arranged in the container cavity.

Further, above-mentioned each LED encapsulation unit also comprises optical functional layer, and optical functional layer comprises lens or scattering layer, and lens or scattering layer are located on the surface away from light emitting functional layer of phosphor powder layer.

Further, above-mentioned each LED encapsulation unit also comprises the heat-conducting substrate of surface insulation, and heat-conducting substrate is arranged on the bottom of LED encapsulation unit.

Further, above-mentioned LED lighting module also comprises the heat conduction glue-line, and heat-conducting substrate is fixed on the heating panel.

Further, the foregoing circuit plate arranges around the LED encapsulation unit, and each discrete device dispersed placement is on circuit board.

Further, the foregoing circuit plate is provided with a plurality of anchor clamps, and anchor clamps are fixedly clamped the LED encapsulation unit on heating panel.

Further, above-mentioned anchor clamps have conducting function and by anchor clamps the LED encapsulation unit are electrically connected with circuit board.

Further, circuit board is the annular circuit board with cavity, and the height of the heat-conducting substrate of LED encapsulation unit is less than the height of cavity, and heat-conducting substrate is arranged in the cavity and with the sidewall clamping of cavity.

Further, have groove on the above-mentioned heating panel, heat-conducting substrate is arranged in the groove, and circuit board fixes heat-conducting substrate in groove.

Further, above-mentioned heat-conducting substrate is electrically connected with first conductive layer, and circuit board is provided with the pad that the LED encapsulation unit is electrically connected with circuit board with the contact-making surface of heat-conducting substrate.

Use the technical solution of the utility model, be encapsulated in led chip and drive circuit in the LED encapsulation unit jointly and be fixed on the heating panel, not only saved the higher metal base printed circuit board of cost, saved cost but also can realize better radiating effect by the thermolysis of heating panel; The discrete device that caloric value that can not be integrated is lower is fixed on the common circuit board on the heating panel simultaneously, not only improved the LED lighting module integrated level, reduced its volume but also under lower-cost situation, can realize better radiating effect.

Description of drawings

The Figure of description that constitutes the application's a part is used to provide further understanding of the present utility model, and illustrative examples of the present utility model and explanation thereof are used for explaining the utility model, do not constitute improper restriction of the present utility model.In the accompanying drawings:

Fig. 1 shows the structural representation of a kind of LED lighting module in the prior art;

Fig. 2 shows the structural representation of another kind of LED lighting module in the prior art;

Fig. 3 shows the structural representation according to the LED lighting module of a kind of preferred embodiment of the present utility model;

Fig. 4 shows the structural representation according to the LED lighting module of another preferred embodiment of the present utility model;

Fig. 5 shows the structural representation according to the LED lighting module of another preferred embodiment of the present utility model;

Fig. 6 shows the structural representation according to the LED lighting module of another preferred embodiment of the present utility model;

Fig. 7 shows the structural representation according to the LED lighting module of another preferred embodiment of the present utility model;

Fig. 8 shows the structural representation according to the LED lighting module of another preferred embodiment of the present utility model;

Fig. 9 shows the structural representation according to the LED encapsulation unit in another preferred embodiment of the present utility model;

Figure 10 shows the structural representation according to the LED encapsulation unit in another preferred embodiment of the present utility model;

Figure 11 shows the structural representation according to the LED encapsulation unit in another preferred embodiment of the present utility model;

Figure 12 shows the structural representation according to the LED encapsulation unit in another preferred embodiment of the present utility model; And

Figure 13 shows the structural representation according to the LED encapsulation unit in another preferred embodiment of the present utility model.

Embodiment

Need to prove that under the situation of not conflicting, embodiment and the feature among the embodiment among the application can make up mutually.Describe the utility model below with reference to the accompanying drawings and in conjunction with the embodiments in detail.

To shown in Figure 8, in the application's a kind of typical embodiment, provide a kind of LED lighting module as Fig. 3, this LED lighting module comprises heating panel 100, one or mutual a plurality of LED encapsulation units 200, circuit board 400 and discrete device 500 of isolating; LED encapsulation unit 200 is fixed on the heating panel 100, and each LED encapsulation unit 200 comprises the drive circuit 216 of led chip 211 and driving LED chip 211; Circuit board 400 is fixed on the heating panel 100, is electrically connected with each LED encapsulation unit 200; Discrete device 500 is fixed on the circuit board 400 and with circuit board 400 and is electrically connected.

LED lighting module with said structure, be encapsulated in led chip 211 and drive circuit 216 in the LED encapsulation unit jointly and be fixed on the heating panel 100, not only saved the higher metal base printed circuit board of cost, saved cost but also can realize heat radiation preferably by the thermolysis of heating panel 100; The discrete device 500 that caloric value that can not be integrated is lower simultaneously is fixed on the common circuit board 400 cheaply on the heating panel 100, not only improved the LED lighting module integrated level, reduced its volume but also under lower-cost situation, can realize better radiating effect.The led chip 211 of circuit board 400, discrete device 500 and LED encapsulation unit 200 and drive circuit 216 are electrically connected mutually, realize the illumination functions of LED lighting module, the mode that wherein is electrically connected the wire bonds that can adopt the LED lighting field commonly used, lead-in wire bonding or directly carries out bridge joint with scolding tin realizes.

In a kind of preferred embodiment of the application, above-mentioned heating panel 100 has hollow-out parts, and part discrete device 500 is arranged on circuit board 400 surface corresponding with hollow-out parts and to hollow-out parts and extends.In this embodiment, the hollow-out parts that discrete device 500 is arranged on heating panel 100 makes the LED lighting module more attractive in appearance, and the heat that discrete device 500 sends also can distribute by heating panel 100, can not cause adverse effect to heat radiation.

As Fig. 9 and shown in Figure 10, in another preferred embodiment of the application, the led chip 211 of above-mentioned each LED encapsulation unit 200 is one or more chips that are array distribution, each LED encapsulation unit 200 also comprises light emitting functional layer 201 and light translation function layer 202, light emitting functional layer 201 comprises first package main body 214 and first conductive layer 212, and led chip 211 and drive circuit 216 all are encapsulated in first package main body 214; First conductive layer 212 is encapsulated in first package main body 214, and led chip 211 and drive circuit 216 all are electrically connected with first conductive layer 212, and circuit board 400 is electrically connected with first conductive layer 212; Light translation function layer 202 comprises one or be a plurality of phosphor powder layers 221 and the carrier 222 of array distribution, and phosphor powder layer 221 is fixed on the side away from heating panel 100 of light emitting functional layer 201, and aligns setting with led chip 211; Carrier 222, be fixed on light emitting functional layer 201 away from a side of heating panel 100 and have one or be a plurality of container cavities of array distribution, phosphor powder layer 221 is arranged in the container cavity.

LED encapsulation unit 200 with said structure, by the independently light emitting functional layer 201 and light translation function layer 202 that comprise stack, the different adverse effects that produce of encapsulation condition owing to have separately been avoided when led chip 211 and phosphor powder layer 221 successively encapsulated, and, phosphor powder layer 221 and led chip 211 are located in separately the functional layer, formed remote fluorescence powder structure, and then avoided because influencing each other between fluorescent material spontaneous heating and the led chip 211 improved LED encapsulation unit 200 stability and reliability.The mode that being electrically connected between first conductive layer 212 of above-mentioned smooth translation function and the circuit board 400 can be adopted wire bonds, lead-in wire bonding or directly be carried out bridge joint with scolding tin realizes.

And, with first conductive layer 212 and led chip 211 be encapsulated in together in first package main body 214 as light emitting functional layer 201 luminescent devices, first conductive layer 212 can link to each other with circuit board 400; Phosphor powder layer 221 is arranged in the container cavity of carrier 222; when being convenient on the one hand the making of phosphor powder layer 221 and encapsulation and the aligning of led chip 211; 222 pairs of phosphor powder layers 221 of carrier play the certain protection effect on the other hand; avoid it in processes such as transportation, storage, to be polluted; light translation function layer 202 is not only simple in structure, can satisfy the needs of LED encapsulation unit 200 fully.Above-mentioned carrier 222 mainly is to arrange as the carrier in phosphor powder layer district 221, all can be used as the raw material that forms carrier 222 so long as be adapted to the material of LED encapsulation unit 200, and for the consideration that goes out light effect, the setting of carrier 222 can not hinder light to see through phosphor powder layer 221, so preferred vector 222 is set to be communicated with the intercommunicating pore of carrier 222 upper surfaces and lower surface for the container cavity of transparent carrier or carrier 222.

When preparing above-mentioned LED encapsulation unit 200, because each functional layer separate making, each functional layer of one side can adopt independently the streamline production that walks abreast, and is unaffected each other, thereby improved the make efficiency of LED encapsulation unit 200; On the other hand, each functional layer that completes can be assembled according to client's demand, and flexibility increases; In addition, each functional layer is carried out independent detection, guarantee qualified after assembling again, the mode with respect to detecting again after the assembling of the LED encapsulation unit 200 of traditional structure has improved the finished product yield, has reduced unnecessary waste.

As shown in Figure 9, part first conductive layer 212 of light emitting functional layer 201 away from the surface exposure of heating panel 100 in the outside of first package main body 214, light translation function layer 202 has the through hole corresponding with the exposed part of first conductive layer 212.

When the carrier 222 of first package main body 214 of making light emitting functional layer 201 and light translation function layer 202, utilize regional vacant that method of molding will be corresponding with the exposed part of first conductive layer 212, make part first conductive layer 212 expose outside in first package main body 214, and the part that light translation function layer 202 is corresponding with the part that first conductive layer 212 exposes has through hole, is convenient to LED encapsulation unit 200 is electrically connected with circuit board 400.

In another preferred embodiment of the application, for the ease of above-mentioned LED encapsulation unit 200 is linked to each other to satisfy the more function demand with circuit board 400, as shown in figure 10, light emitting functional layer 201 also comprises one or more first conductors 213, one end of any one first conductor 213 is arranged on first conductive layer 212, and the other end extends to the surface away from heating panel 100 of first package main body 214; Light translation function layer 202 comprises that also second conductor 223, the second conductors 223 corresponding with first conductor 213 are extended to and this surface facing surfaces by the surface of the close light emitting functional layer 201 of carrier 222, and first conductor 213 and second conductor 223 are electrically connected.By first conductor 213 and second conductor 223 lead-in wire or pad etc. being set is electrically connected LED encapsulation unit 200 with circuit board 400.

The application's drive circuit 216 comprises components of drive circuit, control circuit element and/or communication module.Wherein, can be used for components of drive circuit of the present utility model and include but not limited to drive discrete elements such as chip, resistance, electric capacity and inductance; The control circuit element includes but not limited to elements such as control chip, resistance, electric capacity and inductance, and the connected mode between each circuit element is can realize that its function serves as that the basis adopts connected mode of the prior art to get final product.

As Figure 11 and shown in Figure 12, each LED encapsulation unit 200 also comprises optical functional layer 204, and optical functional layer 204 comprises lens 241 or scattering layer 242, and lens 241 or scattering layer 242 are located on the surface away from light emitting functional layer 201 of phosphor powder layer 221.Optical functional layer 204 is set to have the optical functional layer of light-focusing function or scattering function, makes the further variation of function of LED encapsulation unit 200.

The application's LED encapsulation unit 200 can be for not having the flexible LED encapsulation unit of substrate, can be fixed on the heating panel 100 of surface curvature, radiating effect for the LED encapsulation unit 200 that further improves the application, as shown in figure 13, each LED encapsulation unit 200 also comprises the heat-conducting substrate 205 of surface insulation, and heat-conducting substrate 205 is arranged on the bottom of LED encapsulation unit 200.

The upper surface of above-mentioned heat-conducting substrate 205 is fitted with the lower surface that is positioned at LED encapsulation unit 200 undermost functional layers, and the heat that functional layer is produced diffuses to heating panel 100 from the bottom, optimized the radiating effect of whole LED encapsulation unit 200.The lower surface size of the upper surface of heat-conducting substrate 205 and LED encapsulation unit 200 is consistent or greater than the lower surface of LED encapsulation unit 200, and above-mentioned heat-conducting substrate 205 can adopt thermal conductive ceramic plate or surface coverage that the silicon materials of electric insulation layer are arranged, the thinner thickness of insulating barrier, be generally several microns to tens microns, to reduce the influence to heat conductivility.

The preparation method of each functional layer of LED encapsulation unit 200 with said structure is as follows:

Light emitting functional layer 1 adopts following method preparation: A1, at first substrate first conductive layer 212 is set, and first conductive layer 212 is graphical; A2, at first substrate led chip 211 and drive circuit 216 are set, and led chip 211, drive circuit 216 are electrically connected with first conductive layer 212 respectively; A3, first conductive layer 212, drive circuit 216 and led chip 211 are encapsulated in first package main body 214, form light emitting functional layer 201.

Light translation function layer 202 adopts following method preparation: B1, molding is provided the carrier 222 of container cavity on second substrate; B2, in the container cavity of carrier 222, adopt method making phosphor powder layer 221 such as printing.

Optical functional layer 204 adopts following method preparation: mould out lens jacket 241 or scattering layer 242 at optical function laminar substrate patrix.

Fixing means between above-mentioned each functional layer is as follows: the jut of led chip 211 with phosphor powder layer 221, lens jacket 241 aligned, utilize LED encapsulation adhesive glue commonly used to bond then, each functional layer after will boning is as required again cut, and obtains a plurality of as Figure 10 and/or LED encapsulation unit as shown in figure 11.

The package main body of above-mentioned each functional layer can adopt LED encapsulation macromolecular material commonly used, and used substrate can be removed after functional layer completes when making, each functional layer is become have flexual flexibility function layer, and then the LED encapsulation unit of gained is the flexible package unit, relies on its pliability LED encapsulation unit 200 of the present utility model can be installed on the structure of plane or curved surface.

When in light emitting functional layer 201, light translation function layer 202 and optical functional layer 204, conductor being set if desired, the example that is set to first conductor 213 describes: at first conductive layer 212 first conductor 213 was set before first package main body 214 is set, and makes the height of first conductor 213 equal the height of first package main body 214 that desire forms.Second conductor 223 of light translation function layer 202 the following method that adopts is set: before carrier 222 is set, at second substrate second conductor 223 is set, and makes the height of second conductor 223 equal the height of the carrier 222 that desire forms.The optical functional layer conductor 243 of optical functional layer 204 the following method that adopts is set: optical functional layer conductor 243 is set and makes the upper surface of optical functional layer conductor 243 expose outside at lens jacket 241 or scattering layer 242 at the optical function laminar substrate.Adopt the mode of welding to make its electrical connection between first conductor 213 of made, second conductor 223, the optical functional layer conductor 243.

Each conductive layer adopts sputtering method, evaporation or galvanoplastic to make in the said method, and can adopt photoetching in conjunction with dry etching or pressure mask each conductive layer to be carried out graphical treatment in conjunction with wet etching, photoetching.Drive circuit 216 can adopt the Heraeus bonding to cooperate lead-in wire bonding or flip chip bonding or the high bonding of printing weldering to cooperate the mode of Reflow Soldering to be fixed on the substrate.Led chip 211, drive circuit 216 and all can adopt modes such as lead-in wire bonding, flip chip bonding or Reflow Soldering etc. being connected of conductive layer.

Said method all is to adopt the existing processes technology to make each functional layer respectively, therefore make and to finish on the basis that is produced on original production equipment of LED encapsulation unit 200 of the present utility model, do not need to carry out other technology and equipment investment and further saved the cost of making LED encapsulation unit 200.

As shown in Figure 3, above-mentioned LED lighting module also comprises heat conduction glue-line 300, and heat-conducting substrate 205 is fixed on the heating panel 100.The heat conduction glue-line 300 that employing has an attachment function is heat-conducting substrate 205 fixedly, has not only realized LED encapsulation unit 200 is fixed on purpose on the heating panel 100, and has optimized the radiating effect of LED encapsulation unit 200.

Too concentrate the problem appearance that causes radiating effect undesirable for fear of discrete device 500, preferred circuit plate 400 arranges around LED encapsulation unit 200, and each discrete device 500 dispersed placement is on circuit board 400.Circuit board 400 is arranged the two-dimensional areas that has increased circuit board 400 around LED encapsulation unit 200, therefore be conducive to the dispersed placement of each discrete device 500, optimized the radiating effect of discrete device 500, and be convenient in circuit board 400 wirings.

As shown in Figure 5, foregoing circuit plate 400 is provided with a plurality of anchor clamps 401, and anchor clamps 401 are fixedly clamped LED encapsulation unit 200 on heating panel 100.Above-mentioned anchor clamps 401 adopt the conventional anchor clamps that can be used for the LED lighting field to get final product, and, when adopting anchor clamps 401 fixed L ED encapsulation units 200, the heat conduction glue-line 300 with attachment function can be set or heat conduction glue-line 300 is not set.

When utilizing anchor clamps 401 fixed L ED encapsulation units 200, in order further to simplify the structure of whole LED lighting module, preferred fixture 401 has conducting function and utilizes anchor clamps 401 that LED encapsulation unit 200 is electrically connected with circuit board 400.One end of these anchor clamps 401 is fixed on the pad of circuit board 400, the other end adopts modes such as wire bonds, lead-in wire bonding to be electrically connected with first conductive layer 212 of LED encapsulation unit 200, thus the real purpose that LED encapsulation unit 200 is electrically connected with circuit board 400.

As shown in Figure 6 and Figure 7, circuit board 400 is for having the annular circuit board of cavity, and the height of the heat-conducting substrate 205 of LED encapsulation unit 200 is less than the height of cavity, and heat-conducting substrate 205 is arranged in the cavity and with the sidewall clamping of cavity.Utilize sidewall and heat-conducting substrate 205 clampings of the cavity of circuit board 400, thereby LED encapsulation unit 200 can be fixed on the heating panel 100.When adopting the mode fixed L ED encapsulation unit 200 of above-mentioned clamping, the heat conduction glue-line 300 with attachment function can be set or heat conduction glue-line 300 is not set.

As shown in Figure 7, have groove on the above-mentioned heating panel 100, heat-conducting substrate 205 is arranged in the groove, and circuit board 400 fixes heat-conducting substrate 205 in groove.In said structure, be arranged on heat-conducting substrate 205 in the groove and adopt circuit board 400 that heat-conducting substrate 205 is fixed in groove, adopt simple structure namely to realize the purpose of fixed L ED encapsulation unit 200, can not hinder the bright dipping of led chip 211 again.

Because circuit board 400 directly contacts with heat-conducting substrate 205, therefore preferred heat-conducting substrate 205 is electrically connected with first conductive layer 212, and circuit board 400 is provided with the pad that LED encapsulation unit 200 is electrically connected with circuit board 400 with the contact-making surface of heat-conducting substrate 205.Heat-conducting substrate 205 can adopt the mode of lead or lead-in wire bonding to be electrically connected with first conductive layer 212, on the contact-making surface with circuit board 400 and heat-conducting substrate 205 pad is set then, utilize pad that circuit board 400 is electrically connected with first conductive layer 212, thereby realize being electrically connected of LED encapsulation unit 200 and circuit board 400.

The above is preferred embodiment of the present utility model only, is not limited to the utility model, and for a person skilled in the art, the utility model can have various changes and variation.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., all should be included within the protection range of the present utility model.

Claims

1. An LED lighting module, characterized in that, the LED lighting module comprises:

cooling plate (100);

One or a plurality of LED packaging units (200) isolated from each other are fixed on the heat dissipation plate (100), each of the LED packaging units (200) includes an LED chip (211) and a driver for driving the LED chip (211) drive circuit (216);

The circuit board (400), fixed on the heat dissipation plate (100), is electrically connected to each of the LED packaging units (200);

The discrete device (500) is fixed on the circuit board (400) and electrically connected with the circuit board (400). the

2. The LED lighting module according to claim 1, characterized in that, the heat dissipation plate (100) has a hollow part, and part of the discrete devices (500) are arranged between the circuit board (400) and the hollow part on the corresponding surface and extend toward the hollow part. the

3. The LED lighting module according to claim 1, characterized in that, the LED chip (211) of each LED packaging unit (200) is one or a plurality of chips distributed in an array, and each of the LED packaging units ( 200) also includes:

A luminescent functional layer (201), the luminescent functional layer (201) comprising:

The first package body (214), the LED chip (211) and the drive circuit (216) are packaged in the first package body (214);

The first conductive layer (212), encapsulated in the first package body (214), the LED chip (211) and the driving circuit (216) are both electrically connected to the first conductive layer (212), and the The circuit board (400) is electrically connected to the first conductive layer (212);

A photoconverting functional layer (202), the photoconverting functional layer (202) comprising:

One or a plurality of phosphor layers (221) distributed in an array, the phosphor layers (221) are fixed on the side of the light-emitting functional layer (201) away from the heat dissipation plate (100), and are connected to the The LED chip (211) is aligned and set;

The carrier (222) is fixed on the side of the light-emitting functional layer (201) away from the heat dissipation plate (100) and has one or a plurality of accommodating cavities distributed in an array, and the phosphor layer (221) is arranged on inside the accommodating cavity. the

4. The LED lighting module according to claim 3, characterized in that each of the LED packaging units (200) further comprises an optical function layer (204), and the optical function layer (204) comprises a lens (241) or a scattering The layer (242), the lens (241) or the scattering layer (242) is covered on the surface of the phosphor layer (221) away from the light-emitting functional layer (201). the

5. The LED lighting module according to claim 3, characterized in that, each of the LED package units (200) further comprises a surface-insulated heat conduction substrate (205), and the heat conduction substrate (205) is arranged on the LED package bottom of unit (200). the

6. The LED lighting module according to Claim 5, characterized in that, the LED lighting module further comprises a thermally conductive adhesive layer (300) for fixing the thermally conductive substrate (205) on the heat dissipation plate (100). the

7. The LED lighting module according to claim 5, characterized in that, the circuit board (400) is arranged around the LED packaging unit (200), and each of the discrete devices (500) is dispersedly arranged on the circuit board (400) on. the

8. The LED lighting module according to claim 7, characterized in that, the circuit board (400) is provided with a plurality of clamps (401), and the clamps (401) clamp the LED packaging unit (200) Tightly fixed on the heat dissipation plate (100). the

9. The LED lighting module according to claim 8, characterized in that, the clamp (401) has a conductive function and the LED packaging unit (200) and the circuit board (400) are connected by the clamp (401) ) electrical connection. the

10. The LED lighting module according to claim 7, characterized in that, the circuit board (400) is an annular circuit board with a cavity, and the height of the thermally conductive substrate (205) of the LED packaging unit (200) is less than The height of the cavity, and the heat conduction substrate (205) is arranged in the cavity and clamped with the side wall of the cavity. the

11. The LED lighting module according to claim 7, characterized in that, the heat dissipation plate (100) has a groove, the heat conducting substrate (205) is set in the groove, and the circuit board (400) ) to fasten the heat-conducting substrate (205) in the groove. the

12. The LED lighting module according to claim 10 or 11, characterized in that, the heat-conducting substrate (205) is electrically connected to the first conductive layer (212), and the circuit board (400) is connected to the heat-conducting Soldering pads for electrically connecting the LED package unit (200) and the circuit board (400) are arranged on the contact surface of the substrate (205). the