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TW200943036A - Heat dissipation device - Google Patents

Heat dissipation device

Info

Publication number
TW200943036A
TW200943036A TW97113277A TW97113277A TW200943036A TW 200943036 A TW200943036 A TW 200943036A TW 97113277 A TW97113277 A TW 97113277A TW 97113277 A TW97113277 A TW 97113277A TW 200943036 A TW200943036 A TW 200943036A
Authority
TW
Taiwan
Prior art keywords
holder
heat sink
heat dissipation
dissipation device
electronic device
Prior art date
Application number
TW97113277A
Other languages
Chinese (zh)
Inventor
Xu-Xin Min
Meng Fu
Chun-Chi Chen
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW97113277A priority Critical patent/TW200943036A/en
Publication of TW200943036A publication Critical patent/TW200943036A/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a holder securing the heat sink onto the electronic device. The holder includes a frame, a plurality of protrusion walls and protrusion posts extending downwardly from the frame. The protrusion walls of the holder extend downwardly through the heat sink and engage with edges of the electronic device at distal end thereof. The heat dissipation device is further provided with a plurality of elastic members which respectively wear on the corresponding protrusion posts of the holder and are located between the holder and the heat sink.
TW97113277A 2008-04-11 2008-04-11 Heat dissipation device TW200943036A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97113277A TW200943036A (en) 2008-04-11 2008-04-11 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97113277A TW200943036A (en) 2008-04-11 2008-04-11 Heat dissipation device

Publications (1)

Publication Number Publication Date
TW200943036A true TW200943036A (en) 2009-10-16

Family

ID=44868898

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97113277A TW200943036A (en) 2008-04-11 2008-04-11 Heat dissipation device

Country Status (1)

Country Link
TW (1) TW200943036A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103858067A (en) * 2011-03-09 2014-06-11 汤姆逊许可公司 Set top box or server having snap-in heat sink and smart card reader
US9578783B2 (en) 2010-02-25 2017-02-21 Thomson Licensing Miniature multilayer radiative cooling case wtih hidden quick release snaps
TWI913286B (en) 2020-07-13 2026-02-01 瑞士商太谷康奈特提威提索洛訊有限公司 Heat sink assembly for an electrical component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9578783B2 (en) 2010-02-25 2017-02-21 Thomson Licensing Miniature multilayer radiative cooling case wtih hidden quick release snaps
CN103858067A (en) * 2011-03-09 2014-06-11 汤姆逊许可公司 Set top box or server having snap-in heat sink and smart card reader
TWI913286B (en) 2020-07-13 2026-02-01 瑞士商太谷康奈特提威提索洛訊有限公司 Heat sink assembly for an electrical component

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