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TWI368464B - Flexible print circuit board - Google Patents

Flexible print circuit board

Info

Publication number
TWI368464B
TWI368464B TW094121553A TW94121553A TWI368464B TW I368464 B TWI368464 B TW I368464B TW 094121553 A TW094121553 A TW 094121553A TW 94121553 A TW94121553 A TW 94121553A TW I368464 B TWI368464 B TW I368464B
Authority
TW
Taiwan
Prior art keywords
circuit board
print circuit
flexible print
flexible
board
Prior art date
Application number
TW094121553A
Other languages
Chinese (zh)
Other versions
TW200614884A (en
Inventor
Shingo Ueda
Original Assignee
Sumitomo Elec Printed Circuits
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Elec Printed Circuits filed Critical Sumitomo Elec Printed Circuits
Publication of TW200614884A publication Critical patent/TW200614884A/en
Application granted granted Critical
Publication of TWI368464B publication Critical patent/TWI368464B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Combinations Of Printed Boards (AREA)
TW094121553A 2004-07-06 2005-06-28 Flexible print circuit board TWI368464B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004198734A JP4398311B2 (en) 2004-07-06 2004-07-06 Flexible printed circuit board

Publications (2)

Publication Number Publication Date
TW200614884A TW200614884A (en) 2006-05-01
TWI368464B true TWI368464B (en) 2012-07-11

Family

ID=35797675

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121553A TWI368464B (en) 2004-07-06 2005-06-28 Flexible print circuit board

Country Status (4)

Country Link
JP (1) JP4398311B2 (en)
KR (1) KR101098132B1 (en)
CN (1) CN1725931B (en)
TW (1) TWI368464B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007299623A (en) * 2006-04-28 2007-11-15 Optrex Corp Connecting board of folding-back type electric equipment
JP4845705B2 (en) * 2006-12-19 2011-12-28 日東電工株式会社 Printed wiring board, manufacturing method thereof, and electronic device
JP2009075365A (en) * 2007-09-20 2009-04-09 Omron Corp Optical wiring and optical transmission module
JP5515171B2 (en) * 2009-12-18 2014-06-11 住友電工プリントサーキット株式会社 Flexible printed wiring board, housing structure, electronic equipment
KR101676747B1 (en) * 2015-04-13 2016-11-16 (주) 액트 Flexible Bonding Structure including Flexible-Joints and FPCB
CN108400180B (en) * 2018-01-25 2020-06-16 北京工业大学 Textured substrates enhance electrical stability of flexible devices under mechanical stress

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3515490B2 (en) * 2000-06-30 2004-04-05 三洋電機株式会社 Flexible printed circuit board and foldable mobile phone terminal having flexible printed circuit board
JP2002368440A (en) * 2001-06-06 2002-12-20 Toshiba Corp Foldable electronic devices and their flexible substrates
TW591671B (en) * 2001-06-27 2004-06-11 Shinetsu Chemical Co Substrate for flexible printed wiring
JP2004079730A (en) 2002-08-15 2004-03-11 Nippon Mektron Ltd Flexible circuit board

Also Published As

Publication number Publication date
CN1725931B (en) 2011-05-11
KR101098132B1 (en) 2011-12-26
JP2006024584A (en) 2006-01-26
JP4398311B2 (en) 2010-01-13
KR20060048487A (en) 2006-05-18
TW200614884A (en) 2006-05-01
CN1725931A (en) 2006-01-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees