200940884 九、發明說明： 【發明所屬之技術領域】 本發明屬高效率LED燈技術領域，提供照明使用，除具有極佳 的散熱效果外，更具有不須更換燈具而可直接替換燈泡使用之功 效0 【先前技術】 按 ’ LED 是發光二極體（Light- emitting Diode)的縮 0 寫，是半導體材料製成的固態發光元件，材料使用ΙΠ-V 族化學元素（如：磷化鎵（GaP)、砷化鎵（GaAs)等），發光 原理是將電能轉換為光，也就是對化合物半導體施加電 流，透過電子與電洞的結合，過剩的能量會以光的形式釋 出，達成發光的效果，屬於冷性發光，壽命長達十萬小時 以上。LED最大的特點在於：無須暖燈時間（idling time)、 反應速度快、體積小、用電省、耐震、污染低、適合量產， 具高可靠度，容易配合應用上的需要製成極小或陣列式的 Ο 元件。惟因為LED是固態照明，即是利用晶片通電，量子 激態回復發出能量（光），但在發光的過程，晶片内的光能 量並不能完全傳至外界，不能出光的能量，在晶片内部及 封裝體内便會被吸收，形成熱。LED —般的轉換效率約只 有10%〜30%,所以1W的電，只有不到0.2W變成你可以看 見的光，其它都是熱，若不散熱，這些熱量累積會對晶片 效率及壽命造成損傷。故要以高效率LED運用於照明設備 首先要解決散熱的問題。以LED散熱專利為例，新型 200940884 M314505號「高功率LED燈泡散熱結構」專利（2007年06 月21日專利公告資料參照），主要係於一燈頭上固定有一 底基板，該底基板的頂面支撐固定有至少一支熱導管，熱 導管套設固定有複數散熱片及一頂基板，頂基板的頂面設 有對應熱導管數量的高功率LED ，該高功率LED的底面 係黏結支撐於熱導管的頂端。新型第M314433號「發光二 極體封裝之散熱模組」專利（2〇〇7年06月21日專利公告 ❹資料參照），該散熱模組包含：一 LED電路板；一散熱 塊’包括複數個散熱片；以及一散熱膠材，藉以直接固定 該LED電路板於該散熱塊上；其中在該led電路板與該散 熱塊之間，不具有一金屬基板。發明第1260798號「高散 熱發光二極體」專利（2006年08月21日專利公告資料參 照），至少包括：一多孔隙材料層；一熱傳導層，設於該多 孔隙材料層表面；以及一晶片，設於該熱傳導層，由該熱 傳導層將該晶片所發出之熱量傳導至該多孔隙材料層，並 〇 由該多孔隙材料層將該熱量對流至外部。 由以上諸前案可知習用LED散熱大都採用金屬散熱片，或結合 熱導管、致冷晶片、均熱板、散熱風扇等方式為之，普遍具有散 熱效果不佳、散熱速度不夠迅速、散熱模組結構複雜、成本高等 缺失’且由於所需搭配之散熱結構為非規格化設計，故必需設計 專用的燈具方能使用。此即為現行習用技術存有最大之缺失，此 缺失乃成業界丞待克服之難題。 【發明内容】 200940884 本發明研發人鑒於習用技術之缺失，積其多年實際從事精密陶 瓷科技工業產品之設計製造專業知識，經不斷研究、改良後，終 有本發明之研創成功，公諸於世。 緣是’本發明之主要目的在提供一種「高效率led燈」，其主 要係由LED模組、構裝基板、電路裝置及散熱燈座所構成，該led 模組係設於構裝基板上，構裝基板為導熱性良好之金屬構成，散 熱燈座為散熱性良好之具多孔隙結構非金屬構成，並直接成型成 ❹燈座外形’其具有内凹部，内凹部之開口端藉構裝基板封閉，其 内設有電路裝置’電路裝置則連結LED模組與外部電源，當LED 點亮時，其產生的熱可迅速的被構裝基板所傳導，並藉構裝基板 與散熱燈座間之熱傳導及熱對流作用，使構裝基板上之熱迅速的 傳導至散熱燈座而散熱，本發明散熱燈座直接形成一般燈泡外 形，並兼具散熱效能，可直接取代習用燈泡使用，除具有極佳的 散熱效果外，更具有不須更換燈具可直接替換燈泡之功效。 ©該散熱燈座外緣設有燈泡專用的金屬套、絕緣套及電源接觸片， 該金屬套及電源接觸片並與電路裝置電性連結，以於制燈泡燈 本發明之另-主要目的在提供一種「高效率LED燈」，其中， 具上使用者。200940884 IX. Inventive description: [Technical field of invention] The invention belongs to the technical field of high-efficiency LED lamps, and provides illumination use, in addition to having excellent heat dissipation effect, the utility model can directly replace the use of the bulb without replacing the lamps. 0 [Prior Art] Press 'LED is a light-emitting diode'. It is a solid-state light-emitting element made of semiconductor material. The material uses ΙΠ-V chemical elements (such as gallium phosphide (GaP). ), gallium arsenide (GaAs), etc., the principle of luminescence is to convert electrical energy into light, that is, to apply current to the compound semiconductor, through the combination of electrons and holes, excess energy will be released in the form of light to achieve illuminating The effect is cold light, and the life span is more than 100,000 hours. The biggest feature of LED is that it does not require idling time, fast response speed, small size, low power consumption, low vibration, low pollution, suitable for mass production, high reliability, and easy to meet the needs of the application. Array of Ο components. However, because the LED is solid-state lighting, that is, the wafer is energized, and the quantum exciplex returns to emit energy (light), but in the process of illuminating, the light energy in the wafer cannot be completely transmitted to the outside, and the energy of the light cannot be emitted inside the wafer and The inside of the package will be absorbed to form heat. The general conversion efficiency of LED is only about 10%~30%, so 1W of electricity, less than 0.2W becomes light that you can see, the other is hot. If it does not dissipate heat, this heat accumulation will cause wafer efficiency and life. damage. Therefore, it is necessary to use high-efficiency LEDs for lighting equipment. First, we must solve the problem of heat dissipation. Taking the LED heat dissipation patent as an example, the new patent No. 200940884 M314505 "High Power LED Bulb Heat Dissipation Structure" (refer to the patent publication date of June 21, 2007) mainly fixes a base substrate on a base, and the top surface of the base substrate The support is fixed with at least one heat pipe, the heat pipe sleeve is fixed with a plurality of heat sinks and a top substrate, and the top surface of the top substrate is provided with a high-power LED corresponding to the number of heat pipes, and the bottom surface of the high-power LED is bonded and supported by heat. The tip of the catheter. The new patent No. M314433 "Light-emitting diode package for light-emitting diode package" (refer to the patent publication 〇〇 06 06 06 06 06 06 , , , , , , , , , , , , , , , , , , , , , , , , , , , , And a heat dissipating material, wherein the LED circuit board is directly fixed on the heat dissipating block; wherein there is no metal substrate between the LED circuit board and the heat dissipating block. Patent No. 1260798, "High-heat-dissipating light-emitting diode" (refer to the patent publication of August 21, 2006), comprising at least: a porous material layer; a heat conducting layer disposed on the surface of the porous material layer; The wafer is disposed on the heat conducting layer, and the heat emitted by the wafer is conducted by the heat conducting layer to the porous material layer, and the heat is convected to the outside by the porous material layer. It can be seen from the above previous cases that the conventional LED heat dissipation uses metal heat sinks, or combined with heat pipes, cooling chips, soaking plates, cooling fans, etc., generally has poor heat dissipation effect, heat dissipation speed is not fast enough, and the heat dissipation module The structure is complicated, the cost is high, etc., and because the required heat dissipation structure is a non-standardized design, it is necessary to design a dedicated lamp to use. This is the biggest lack of existing technology, and this lack is a difficult problem to be overcome in the industry. SUMMARY OF THE INVENTION 200940884 The research and development of the present invention is based on the lack of conventional technology, and has accumulated many years of experience in the design and manufacture of precision ceramics technology industrial products. After continuous research and improvement, the invention has been successfully developed and published. . The main purpose of the present invention is to provide a "high-efficiency led lamp" which is mainly composed of an LED module, a substrate, a circuit device and a heat sink, and the LED module is disposed on the structure substrate. The structure substrate is made of a metal having good thermal conductivity, and the heat dissipation lamp holder is made of a non-metallic structure having a good heat dissipation property and is directly formed into a lamp holder shape having a concave portion, and the open end of the inner concave portion is configured The substrate is closed, and the circuit device is provided therein. The circuit device connects the LED module and the external power source. When the LED is lit, the heat generated by the LED can be quickly transmitted by the substrate, and the substrate and the heat sink are arranged. The heat conduction and the heat convection function enable the heat on the structure substrate to be quickly transmitted to the heat dissipation lamp holder to dissipate heat. The heat dissipation lamp holder of the present invention directly forms a general bulb shape and has the heat dissipation performance, and can directly replace the conventional light bulb, in addition to having In addition to excellent heat dissipation, it also has the effect of directly replacing the bulb without replacing the lamp. The outer edge of the heat dissipation lamp holder is provided with a metal sleeve, an insulating sleeve and a power contact piece for the bulb, and the metal sleeve and the power contact piece are electrically connected with the circuit device to make the bulb lamp. The other main purpose of the invention is A "high-efficiency LED light" is provided, in which a user is provided.
該電路裝置設有投射燈座專用之連結端子， 種「高效率LED燈」，其中’ 舍端子’該連結端子並凸設出 散熱燈座底部外緣， ’以於習用投射燈具上使用者。The circuit device is provided with a connection terminal dedicated to the projection lamp holder, and a "high-efficiency LED lamp", wherein the connection terminal and the outer edge of the bottom of the heat dissipation lamp holder protrude from the bottom of the heat-dissipating lamp holder.
200940884 本發明之另一主要目的在提供 該構裝基板設有預定數量之穿孔， 能者。 _種「高效率led燈」，其中， 以形成ff流作用，提高散熱效 本發明之另一主要目的在提供一種「 散熱燈座設有增加散熱表面積之紋路者。5 ED燈」，其中，該 ❹ 本發明職基㈣金屬具有躲_度 性’所以具有較高之導熱能力（如：銅金屬之熱傳導率； ==:_粒徑的高熱導率非金屬二如: =:==_)，綱咖嶋熱， 【實施方式】 為達成本發明前述目的之技術手段，兹列舉一實施例，並配合 圖式說月如後’貝審查委員可由之對本發明之結構、特徵及所達 成之功效，獲致更佳之瞭解。 首先’請參閱第-、二、三圖所示，由圖可知本發日月主要包括 有： 模組⑴，為習用規格化商品，係設於構裝基板⑵上； 構裝基板⑵，為導熱性良好之金屬構成【導齡好之金屬如 金、銀、銅、鐵、鋁、鈷、鎳、鋅、鈦、錳等】； 電路裝置(3)，設於散熱燈座(4)内，連結LED模組(1)與外部 電源； 散熱燈座(4) ’為散熱性良好之具多孔隙結構(多孔隙結構即具 有高比表面積結構)非金屬構成【散熱燈座(4)由熱導率高的非金 200940884 屬粉體製成(如射出成型）’熱導率高的非金屬粉體諸如：氧化銘 Al2〇3、氧化錯Zr2〇、氮化銘A1N、氮化破SiN、氮化硼BN、碳 化鶴WC、碳化梦SiC、石墨C、結晶碳化砍、再結晶碳化♦ Resic 等’而以t*化銘及碳化石夕為佳】，並直接成型成燈座外形，其具有 内凹部(40) ’内凹部(40)之開口端藉構裝基板(2)封閉； 當LED點亮時’其產生的熱可迅速的被構裝基板(2)所傳導， 並藉構裝基板(2)與散熱燈座(4)間之熱傳導及熱對流作用，使構 ❹裝基板上(2)LED所產生的之熱迅速的傳導至散熱燈座(4)而散熱 者。 本發明散熱燈座(4)係直接形成一般燈泡外形，並兼具散熱效 能，可直接取代習用燈泡使用，除具有極佳的散熱效果外，更具 有不須更換燈具可直接替換燈泡之功效【即本發明可直接於舊的 燈具上使用】。該散熱燈座(4)外緣設有燈泡專用的金屬套(5〇)、 絕緣套(51)及電源接觸片（52)【該燈泡專用的金屬套(5〇)、絕緣 套(51)及電源接觸片（52)為國際通用規格，如E_27、E14等】，該 〇 金屬套(50)及電源接觸片（52)並與電路裝置(3)電性連結，構裝基 板(2)上設有燈罩（7)，而構成LED燈泡，如此即可以本發明直接 螺合於習用燈泡之燈具上使用，而不必替換原有的舊燈具。 再請參閱第四、五、六圖所示，本發明該電路裝置（3)設有投 射燈座專用之連結端子（6)【該投射燈座專用之連結端子（幻為國 際通用規格，如MR16等】，該連結端子（6)並凸設出散熱燈座(4) 底部外緣，構裝基板(2)上設有反射罩(8)，而構成le：I)投射燈， 如此即可以本發明直接插合於習用投射燈具上使用，而不必替換 200940884 原有的舊投射燈具者。 再者，請參閱第一、二、四、五圖所示，本發明前述構裝基板 (2)具有凹陷部（2〇) ’ LED模組(1)係設於該凹陷部（20)，在作為燈 泡使用時，該凹陷部（2〇)用為固設一燈罩⑺【請參閱第二、三 圖】。在作為投射燈使用時，該凹陷部（2〇)用為固設一反射罩(8) 【請參閱第五、六圖】。 又，本發明構裝基板(2)設有預定數量之穿孔(21)，以形成對 〇流作用，提高散熱效能。散熱燈座⑷設有增加散熱表面積之紋路 (41)者。如此而達本發明設計目的，堪稱一實用之發明者。 综上所述，本發明所揭露之一種「高效率LED燈」為昔所無， 亦未曾見於國内外公開之刊物上，理已具有「新雛」之專利要 件又本發明確可摒除習用技術缺失，並達成本發明設計目的， 亦已絲符合發明專難件，並可供產業上個，纽法提出申 請，謹睛貴審查委員惠予審查，並賜與本案專利，實感德便。 惟Μ上所述者，謹為本發明之一可行實施例而已，舉 ❹凡利用本發明說明書或申請專利範圍所做之等效結構變 化，理應包括於本發明之專利範疇内。 【圖式簡單說明】 第一圖係本發明燈泡式實施例立體圖。 第二圖係本發明燈泡式實施例立體分解圖。 第二圖係本發明燈泡式實施例組立剖面圖。 第四圖係本發明投射燈式實施例立體圖。 第五圖係本發明投射燈式實施例立體分解圖。 200940884 第六圖係本發明投射燈式實施例組立剖面圖 【主要元件符號說明】 (1) LED模組 (2) 構裝基板 (20)凹陷部 (21)穿孔 (3) 電路裝置 (4) 散熱燈座 〇 (40)内凹部 (41)紋路 (50)金屬套 (52)電源接觸片 (6) 連結端子 (7) 燈罩 (8) 反射罩 (51)絕緣套 11200940884 Another primary object of the present invention is to provide a predetermined number of perforations for the package substrate. A "high-efficiency led lamp" in which a ff flow is formed to improve heat dissipation. Another main object of the present invention is to provide a "heat-dissisting lamp holder with a texture-increasing surface area. 5 ED lamp", wherein The 职 发明 ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施The effect is better. First of all, please refer to the figures in the first, second and third figures. It can be seen from the figure that the sun and the moon mainly include: a module (1), which is a conventional product, which is disposed on the structure substrate (2); and a substrate (2) Metal with good thermal conductivity [metals with good lead age such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese, etc.]; circuit device (3), located in the heat sink base (4) , connecting LED module (1) and external power supply; heat-dissipating lamp holder (4) 'for multi-porous structure with good heat dissipation (multi-porous structure, ie with high specific surface area structure) non-metal composition [heating lamp holder (4) by Non-gold 200940884 with high thermal conductivity is made of powder (such as injection molding). Non-metallic powder with high thermal conductivity such as: Oxide Al2〇3, Oxidation Error Zr2〇, Niobin A1N, Nitrided SiN Boron nitride BN, carbonized crane WC, carbonized dream SiC, graphite C, crystalline carbonation and chopping, recrystallization carbonization ♦ Resic, etc., and t* huaming and carbonized stone eve are better, and directly formed into a lamp holder shape, It has an inner recess (40) 'the open end of the inner recess (40) is closed by the mounting substrate (2); when the LED is lit, the heat generated by it is fast The heat is transmitted by the structured substrate (2), and by the heat conduction and thermal convection between the substrate (2) and the heat dissipation lamp holder (4), the heat generated by the (2) LED on the armor substrate is configured. Quickly conduct to the heat sink base (4) and dissipate heat. The heat-dissipating lamp holder (4) of the invention directly forms a general bulb shape and has the heat-dissipating effect, and can directly replace the conventional light bulb, and has the excellent heat-dissipating effect, and has the effect of directly replacing the bulb without replacing the lamp. That is, the invention can be used directly on old lamps. The outer edge of the heat-dissipating lamp holder (4) is provided with a metal sleeve (5〇), an insulating sleeve (51) and a power contact piece (52) for the bulb (the metal sleeve (5〇) and the insulating sleeve (51) for the bulb) And the power contact piece (52) is an international standard, such as E_27, E14, etc., the metal sleeve (50) and the power contact piece (52) are electrically connected to the circuit device (3), and the substrate (2) is assembled. The lampshade (7) is provided to form an LED bulb, so that the invention can be directly screwed onto the lamp of the conventional light bulb without replacing the original old lamp. Referring to the fourth, fifth, and sixth figures, the circuit device (3) of the present invention is provided with a connection terminal (6) dedicated to the projection lamp holder. [The connection terminal dedicated to the projection lamp holder (the magical international standard, such as MR16, etc., the connecting terminal (6) protrudes from the bottom outer edge of the heat sink base (4), and the reflective substrate (8) is disposed on the mounting substrate (2) to form a le: I) projection lamp, thus The invention can be directly inserted into a conventional projection luminaire without having to replace the original projection luminaire of 200940884. Furthermore, as shown in the first, second, fourth and fifth figures, the above-mentioned structure substrate (2) of the present invention has a recessed portion (2). The LED module (1) is disposed on the recessed portion (20). When used as a light bulb, the recess (2〇) is used to fix a lamp cover (7) [please refer to the second and third figures]. When used as a projection lamp, the recessed portion (2) is used to fix a reflector (8) [please refer to FIGS. 5 and 6]. Further, the package substrate (2) of the present invention is provided with a predetermined number of perforations (21) to form a turbulent action to improve heat dissipation performance. The heat sink base (4) is provided with a pattern (41) that increases the heat dissipation surface area. Thus, the design object of the present invention is a practical inventor. In summary, the "high-efficiency LED lamp" disclosed in the present invention has never been seen in the publications disclosed at home and abroad, and has the patent requirements of the "new chick" and the invention can eliminate the conventional technology. Missing, and achieving the design purpose of the present invention, has also met the special difficulties of the invention, and can be used for the industry, New Zealand to apply, and the review of the members of the review, and give the patent, the real sense of virtue. It is to be understood that the above-described embodiments of the present invention are intended to be within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a perspective view of a bulb embodiment of the present invention. The second drawing is an exploded perspective view of a bulb embodiment of the present invention. The second drawing is a cross-sectional view of a bulb embodiment of the present invention. The fourth figure is a perspective view of a projection lamp type embodiment of the present invention. Figure 5 is a perspective exploded view of a projection lamp type embodiment of the present invention. 200940884 The sixth drawing is a sectional view of the embodiment of the projection lamp type of the present invention. [Main component symbol description] (1) LED module (2) Construction substrate (20) recessed portion (21) perforation (3) Circuit device (4) Heat sink base 40 (40) Inner recess (41) Texture (50) Metal sleeve (52) Power contact piece (6) Connecting terminal (7) Lamp cover (8) Reflector (51) Insulation sleeve 11