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TWI398602B - High efficiency LED lights - Google Patents

High efficiency LED lights Download PDF

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Publication number
TWI398602B
TWI398602B TW98129650A TW98129650A TWI398602B TW I398602 B TWI398602 B TW I398602B TW 98129650 A TW98129650 A TW 98129650A TW 98129650 A TW98129650 A TW 98129650A TW I398602 B TWI398602 B TW I398602B
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heat
lamp holder
heat dissipation
lamp
led module
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TW98129650A
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TW201109576A (en
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Wen Lung Chin
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Wen Lung Chin
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Description

高效率LED燈High efficiency LED light

本發明屬高效率LED燈技術領域,提供照明使用,除具有極佳的散熱、電絕緣效果外,更具有不須更換燈具而可直接替換燈泡使用之功效。The invention belongs to the technical field of high-efficiency LED lamps and provides illumination use. In addition to having excellent heat dissipation and electrical insulation effects, the invention can directly replace the use of the bulbs without replacing the lamps.

按,LED是發光二極體(Light-emitting Diode)的縮寫,是半導體材料製成的固態發光元件,材料使用III-V族化學元素(如:磷化鎵(GaP)、砷化鎵(GaAs)等),發光原理是將電能轉換為光,也就是對化合物半導體施加電流,透過電子與電洞的結合,過剩的能量會以光的形式釋出,達成發光的效果,屬於冷性發光,壽命長達十萬小時以上。LED最大的特點在於:無須暖燈時間(idling time)、反應速度快、體積小、用電省、耐震、污染低、適合量產,具高可靠度,容易配合應用上的需要製成極小或陣列式的元件。惟因為LED是固態照明,即是利用晶片通電,量子激態回復發出能量(光),但在發光的過程,晶片內的光能量並不能完全傳至外界,不能出光的能量,在晶片內部及封裝體內便會被吸收,形成熱。LED一般的轉換效率約只有10%~30%,所以1W的電,只有不到0.2W變成你可以看見的光,其它都是熱,若不散熱,這些熱量累積會對晶片效率及壽命造成損傷。故要以高效率LED運用於照明設備首先要解決散熱的問題。以LED散熱專利為例,新型M314505號「高功率LED燈泡散熱結構」專利(2007年06月21日專利公告資料參照),主要係於一燈頭上固定有一底基板,該底基板的頂面支撐固定有至少一支熱導管,熱導管套設固定有複數散熱片及一頂基板,頂基板的頂面設有對應熱導管數量的高功率LED,該高功率LED的底面係黏結支撐於熱導管的頂端。新型第M314433號「發光二極體封裝之散熱模組」專利(2007年06月21日專利公告資料參照),該散熱模組包含:一LED電路板;一散熱塊,包括複數個散熱片;以及一散熱膠材,藉以直接固定該LED電路板於該散熱塊上;其中在該LED電路板與該散熱塊之間,不具有一金屬基板。發明第I260798號「高散熱發光二極體」專利(2006年08月21日專利公告資料參照),至少包括:一多孔隙材料層;一熱傳導層,設於該多孔隙材料層表面;以及一晶片,設於該熱傳導層,由該熱傳導層將該晶片所發出之熱量傳導至該多孔隙材料層,並由該多孔隙材料層將該熱量對流至外部。According to the LED, it is an abbreviation of Light-emitting Diode. It is a solid-state light-emitting component made of semiconductor materials. The material uses III-V chemical elements (such as gallium phosphide (GaP), gallium arsenide (GaAs). ), etc.), the principle of luminescence is to convert electrical energy into light, that is, to apply current to the compound semiconductor, through the combination of electrons and holes, excess energy will be released in the form of light, achieving the effect of luminescence, belonging to cold luminescence, The life span is over 100,000 hours. The biggest features of LED are: no idling time, fast response, small size, low power consumption, low vibration, low pollution, suitable for mass production, high reliability, easy to match with the needs of the application to make very small or Array of components. However, because the LED is solid-state lighting, that is, the wafer is energized, and the quantum exciplex returns to emit energy (light), but in the process of illuminating, the light energy in the wafer cannot be completely transmitted to the outside, and the energy of the light cannot be emitted inside the wafer and The inside of the package will be absorbed to form heat. LED conversion efficiency is only about 10% to 30%, so 1W of electricity, less than 0.2W becomes light that you can see, the other is hot, if not heat, these heat accumulation will damage the efficiency and life of the chip. . Therefore, the application of high-efficiency LEDs to lighting equipment must first solve the problem of heat dissipation. Taking the LED heat dissipation patent as an example, the new M314505 "High Power LED Bulb Heat Dissipation Structure" patent (refer to the patent announcement on June 21, 2007) mainly fixes a base substrate on a base, and the top surface of the base substrate is supported. At least one heat pipe is fixed, the heat pipe sleeve is fixed with a plurality of heat sinks and a top substrate, and the top surface of the top substrate is provided with a high-power LED corresponding to the number of heat pipes, and the bottom surface of the high-power LED is bonded and supported by the heat pipe. The top of the. A new type of heat-dissipating module of the light-emitting diode package (refer to the patent publication of June 21, 2007), the heat-dissipating module comprises: an LED circuit board; a heat-dissipating block, comprising a plurality of heat sinks; And a heat dissipating adhesive material for directly fixing the LED circuit board to the heat dissipating block; wherein there is no metal substrate between the LED circuit board and the heat dissipating block. Patent No. I260798, "High Heat Dissipating Light Emitting Diode" (refer to the patent publication of August 21, 2006), comprising at least: a porous material layer; a heat conducting layer disposed on the surface of the porous material layer; The wafer is disposed on the heat conducting layer, and the heat emitted by the wafer is conducted by the heat conducting layer to the porous material layer, and the heat is convected to the outside by the porous material layer.

由以上諸前案可知習用LED散熱大都採用金屬散熱片,或結合熱導管、致冷晶片、均熱板、散熱風扇等方式為之,普遍具有散熱效果不佳、散熱速度不夠迅速、散熱模組結構複雜、成本高、不具電絕緣性安規通過不易等缺失,且由於所需搭配之散熱結構為非規格化設計,故必需設計專用的燈具方能使用。此即為現行習用技術存有最大之缺失,此缺失乃成業界亟待克服之難題。It can be seen from the above previous cases that the conventional LED heat dissipation uses metal heat sinks, or combined with heat pipes, cooling chips, soaking plates, cooling fans, etc., generally has poor heat dissipation effect, heat dissipation speed is not fast enough, and the heat dissipation module The structure is complicated, the cost is high, the electrical insulation is not easy to be lost, and the heat dissipation structure required for the non-standard design is required, so it is necessary to design a dedicated lamp. This is the biggest lack of current conventional technology, and this lack is a difficult problem to be overcome in the industry.

本發明研發人鑒於習用技術之缺失,積其多年實際從事精密陶瓷科技工業產品之設計製造專業知識,經不斷研究、改良後,終有本發明之研創成功,公諸於世。In view of the lack of conventional technology, the research and development of the present invention has accumulated many years of practical expertise in the design and manufacture of precision ceramics technology industrial products. After continuous research and improvement, the invention has been successfully developed and made public.

緣是,本發明之主要目的在提供一種「高效率LED燈」,其主要係由交流電LED模組及散熱燈座所構成,該交流電LED模組具有導熱部及電連結部,散熱燈座為散熱性良好之非金屬直接成型成具多孔隙結構燈座外形,其具有內凹部來容設前述交流電LED模組,交流電LED模組之導熱部與散熱燈座結合,電連結部則連結外部電源,當點亮LED燈時,其產生的熱可迅速的被散熱燈座所傳導而散熱,本發明散熱燈座直接形成一般燈泡之燈座外形,並兼具散熱及電絕緣效能,可直接取代習用燈泡使用,除具有較佳的散熱效果外,更具有不須更換燈具可直接替換燈泡之功效。The main purpose of the present invention is to provide a "high-efficiency LED lamp", which is mainly composed of an alternating current LED module and a heat-dissipating lamp holder. The alternating current LED module has a heat-transfer portion and an electric connection portion, and the heat-dissipating lamp holder is The non-metal having good heat dissipation is directly formed into a shape of a socket having a multi-porous structure, and has a concave portion for accommodating the AC LED module, the heat conducting portion of the AC LED module is combined with the heat sink socket, and the electrical connection portion is connected to the external power source. When the LED lamp is lit, the heat generated by the LED lamp can be quickly transmitted by the heat dissipation lamp holder to dissipate heat. The heat dissipation lamp holder of the present invention directly forms the shape of the lamp holder of the general light bulb, and has the functions of heat dissipation and electrical insulation, and can directly replace The use of conventional light bulbs, in addition to better heat dissipation, has the effect of directly replacing the bulb without replacing the lamps.

本發明另包括有導熱片,該導熱片設於交流電LED模組導熱部與散熱燈座間,當點亮LED燈時,其產生的熱可迅速的被導熱片所傳導,並藉導熱片與散熱燈座間之熱傳導及熱對流作用,使導熱片上之熱迅速的傳導至散熱燈座而散熱。The invention further comprises a heat conducting sheet disposed between the heat conducting portion of the alternating current LED module and the heat sink base. When the LED lamp is lit, the heat generated by the LED lamp can be quickly conducted by the heat conducting sheet, and the heat conducting sheet and the heat sink are used. The heat conduction between the lamp holders and the heat convection cause the heat on the heat transfer sheets to be quickly transmitted to the heat dissipation lamp holder to dissipate heat.

前述散熱燈座外緣設有燈泡專用的金屬套、絕緣套及電源接觸片,該金屬套及電源接觸片並與交流電LED模組之電連結部電性連結,以於習用燈泡燈具上使用。The outer edge of the heat dissipation lamp holder is provided with a metal sleeve, an insulating sleeve and a power contact piece for the bulb, and the metal sleeve and the power contact piece are electrically connected to the electrical connection portion of the AC LED module for use on the conventional light bulb lamp.

前述交流電LED模組之電連結部設有投射燈座專用之連結端子,該連結端子並凸設出散熱燈座底部外緣,以於習用投射燈具上使用。The electrical connection portion of the alternating current LED module is provided with a connection terminal dedicated to the projection lamp holder, and the connection terminal protrudes from the outer edge of the bottom of the heat dissipation lamp holder for use on a conventional projection lamp.

前述散熱燈座設有增加散熱表面積之紋路者。The aforementioned heat sink base is provided with a pattern for increasing the heat dissipation surface area.

本發明之另一主要目的在提供一種「高效率LED燈」,其主要係由預定數量的交流電LED模組、導熱件及散熱燈座所構成,該交流電LED模組具有導熱部及電連結部,各交流電LED模組係設於導熱件上,其導熱部與導熱件結合,電連結部則連結外部電源,散熱燈座為散熱性良好之非金屬直接成型成具多孔隙結構燈座外形,當點亮LED燈時,其產生的熱可迅速的被導熱件所傳導,並藉導熱件與散熱燈座間之熱傳導及熱對流作用,使導熱件上之熱迅速的傳導至散熱燈座而散熱,本發明散熱燈座直接形成一般燈泡外形,並兼具散熱、電絕緣效能,可直接取代習用燈泡使用,除具有極佳的散熱效果外,更具有不須更換燈具可直接替換燈泡之功效。Another main object of the present invention is to provide a "high-efficiency LED lamp" which is mainly composed of a predetermined number of AC LED modules, a heat-conducting member and a heat-dissipating lamp holder. The AC LED module has a heat-conducting portion and an electrical connection portion. Each of the alternating current LED modules is disposed on the heat conducting member, the heat conducting portion is combined with the heat conducting member, and the electrical connecting portion is connected to the external power source, and the heat dissipating lamp holder is directly formed into a multi-porous lamp holder shape by the non-metal having good heat dissipation. When the LED lamp is lit, the heat generated by the LED lamp can be quickly transmitted by the heat conducting member, and the heat conduction between the heat conducting member and the heat dissipating lamp holder and the heat convection force, the heat on the heat conducting member is quickly transmitted to the heat dissipating lamp holder to dissipate heat. The heat-dissipating lamp holder of the invention directly forms the general shape of the bulb, and has the functions of heat dissipation and electric insulation, and can directly replace the conventional light bulb. In addition to having excellent heat dissipation effect, the utility model can directly replace the bulb with no need to replace the lamp.

本發明前述散熱燈座具有內承部,導熱件係容設於內承部。The heat dissipation lamp holder of the present invention has an inner bearing portion, and the heat conduction member is received in the inner bearing portion.

前述散熱燈座外緣設有燈泡專用的金屬套、絕緣套及電源接觸片,該金屬套及電源接觸片並與交流電LED模組電連結部電性連結,以於習用燈泡燈具上使用。The outer edge of the heat dissipation lamp holder is provided with a metal sleeve, an insulating sleeve and a power contact piece for the bulb, and the metal sleeve and the power contact piece are electrically connected to the electrical connection part of the alternating current LED module for use on the conventional light bulb lamp.

前述交流電LED模組之電連結部設有投射燈座專用之連結端子,該連結端子並凸設出散熱燈座底部外緣,以於習用投射燈具上使用。The electrical connection portion of the alternating current LED module is provided with a connection terminal dedicated to the projection lamp holder, and the connection terminal protrudes from the outer edge of the bottom of the heat dissipation lamp holder for use on a conventional projection lamp.

前述散熱燈座設有增加散熱表面積之紋路者。The aforementioned heat sink base is provided with a pattern for increasing the heat dissipation surface area.

本發明構裝基板係利用金屬具有高結構密度以及高比容熱之特性,所以具有較高之導熱能力(如:銅金屬之熱傳導率為382W/m℃)。而該散熱燈座係利用不同粒徑的高熱導率非金屬粉粒(如:碳化矽SiC熱傳導率為270W/m℃),非金屬具有較低的比容熱,是一種相當好的散熱材料。固體材料導熱的機制有兩種,一種是通過自由電子進行熱的傳遞,這是金屬材料導熱的主要機制。另一種是通過點陣或晶格振動,即通過晶格波或熱波來進行熱的傳遞,這即是本發明散熱燈座的機制。The structure substrate of the present invention utilizes a metal having a high structural density and a high specific heat capacity, so that it has a high thermal conductivity (for example, a thermal conductivity of copper metal of 382 W/m ° C). The heat-dissipating lamp holder utilizes high thermal conductivity non-metallic particles of different particle sizes (for example, SiC thermal conductivity of SiC is 270 W/m ° C), and non-metal has a low specific heat, which is a fairly good heat-dissipating material. . There are two mechanisms for the thermal conduction of solid materials. One is the transfer of heat through free electrons, which is the main mechanism of heat conduction of metal materials. The other is heat transfer through lattice or lattice vibration, that is, through lattice waves or heat waves, which is the mechanism of the heat sink base of the present invention.

為達成本發明前述目的之技術手段,茲列舉一實施例,並配合圖式說明如後,貴審查委員可由之對本發明之結構、特徵及所達成之功效,獲致更佳之瞭解。In order to achieve the above-described technical means of the present invention, an embodiment will be described, and with reference to the drawings, the reviewer can obtain a better understanding of the structure, features and effects of the present invention.

首先,請參閱第一、二、三圖所示,由圖可知本發明主要包括有:交流電LED模組(1),為規格化商品,其具有導熱部(10)及電連結部(11),交流電LED模組(1)之導熱部(10)與散熱燈座(2)結合,電連結部(11)則連結外部電源;散熱燈座(2),為散熱性良好之具多孔隙結構(多孔隙結構即具有高比表面積結構)非金屬構成【散熱燈座(2)如可由熱導率高的非金屬粉體製成(如射出成型等),熱導率高的非金屬粉體諸如:氧化鋁Al2 O3 、氧化鋯Zr2 O、氮化鋁AlN、氮化矽SiN、氮化硼BN、碳化鎢WC、碳化矽SiC、石墨C、結晶碳化矽、再結晶碳化矽RSiC等,而以氮化鋁及碳化矽為佳】,並直接成型成燈座外形,其具有內凹部(20),內凹部(20)容設前述交流電LED模組(1);當點亮LED燈時,其產生的熱可迅速的被散熱燈座(2)所傳導而散熱,本發明散熱燈座(2)直接形成一般燈泡之燈座外形,並兼具散熱及電絕緣效能,可直接取代習用燈泡使用,除具有較佳的散熱效果外,更具有不須更換燈具可直接替換燈泡之功效。First, please refer to the first, second and third figures. It can be seen from the figure that the invention mainly comprises an alternating current LED module (1), which is a standardized product having a heat conducting portion (10) and an electrical connecting portion (11). The heat conducting portion (10) of the alternating current LED module (1) is combined with the heat sink base (2), the electrical connecting portion (11) is connected to the external power source, and the heat sink base (2) is a porous structure having good heat dissipation. (Polyporous structure, ie, high specific surface area structure) Non-metallic composition [Thermal lamp holder (2) can be made of non-metallic powder with high thermal conductivity (such as injection molding), non-metallic powder with high thermal conductivity Such as: alumina Al 2 O 3 , zirconia Zr 2 O, aluminum nitride AlN, tantalum nitride SiN, boron nitride BN, tungsten carbide WC, tantalum carbide SiC, graphite C, crystalline tantalum carbide, recrystallized niobium carbide RSiC Etc., and aluminum nitride and tantalum carbide are preferred, and directly formed into a lamp holder shape, which has a concave portion (20), and the inner concave portion (20) accommodates the aforementioned alternating current LED module (1); When the lamp is used, the heat generated by the heat can be quickly transmitted by the heat dissipation lamp holder (2) to dissipate heat. The heat dissipation lamp holder (2) of the present invention directly forms the shape of the lamp holder of the general light bulb, and has both The heat dissipation and electrical insulation performance can directly replace the use of conventional light bulbs. In addition to better heat dissipation, the utility model can directly replace the light bulb without replacing the lamps.

請參閱第四、五圖所示,本發明另包括有導熱片(3),該導熱片(3)為導熱性良好之金屬構成【導熱良好之金屬如金、銀、銅、鐵、鋁、鈷、鎳、鋅、鈦、錳等】,其係設於交流電LED模組導熱部(10)與散熱燈座(2)間,當點亮LED燈時,其產生的熱可迅速的被導熱片(3)所傳導,並藉導熱片(3)與散熱燈座(2)間之熱傳導及熱對流作用,使導熱片(3)上之熱迅速的傳導至散熱燈座(2)而散熱。Referring to the fourth and fifth figures, the present invention further includes a thermal conductive sheet (3) which is made of a metal having good thermal conductivity. [Good thermal conductivity metals such as gold, silver, copper, iron, aluminum, Cobalt, nickel, zinc, titanium, manganese, etc., which is disposed between the heat conducting portion (10) of the alternating current LED module and the heat sink base (2). When the LED lamp is lit, the heat generated by the LED lamp can be quickly thermally conducted. Conducted by the sheet (3), and by the heat conduction and heat convection between the heat conducting sheet (3) and the heat sink base (2), the heat on the heat conducting sheet (3) is quickly transmitted to the heat sink base (2) to dissipate heat. .

請再參閱第六、七圖所示,為提高散熱效率,前述導熱片(3)與散熱燈座(2)間另設有傳導板(30),該傳導板(30)為導熱性良好之金屬構成【導熱良好之金屬如金、銀、銅、鐵、鋁、鈷、鎳、鋅、鈦、錳等】,使導熱片(3)之熱更迅速傳導至散熱燈座(2)而散熱。Please refer to the sixth and seventh figures. In order to improve the heat dissipation efficiency, a conductive plate (30) is further disposed between the heat conducting sheet (3) and the heat sink base (2), and the conductive plate (30) has good thermal conductivity. Metal composition [good thermal conductivity metals such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese, etc.], so that the heat of the thermal conductive sheet (3) is more quickly transmitted to the heat dissipation lamp holder (2) and dissipates heat. .

本發明散熱燈座(2)係直接形成一般燈座外形,並兼具散熱、電絕緣效能,可直接取代習用燈泡使用,除具有極佳的散熱效果外,更具有不須更換燈具可直接替換燈泡之功效【即本發明可直接於舊的燈具上使用】。請參閱第一至七圖所示,該散熱燈座(2)外緣設有燈泡專用的金屬套(21)、絕緣套(22)及電源接觸片(23)【該燈泡專用的金屬套(21)、絕緣套(22)及電源接觸片(23)為國際通用規格,如E-27、E-14等】,該金屬套(21)及電源接觸片(23)並與交流電LED模組(1)之電連結部(11)電性連結。又,散熱燈座(2)上可設有燈罩(24),而構成LED燈泡,如此即可以本發明直接螺合於習用燈泡之燈具上使用,而不必替換原有的舊燈具。The heat-dissipating lamp holder (2) of the invention directly forms the general shape of the lamp holder, and has the functions of heat dissipation and electric insulation, and can directly replace the use of the conventional light bulb. In addition to the excellent heat dissipation effect, the lamp holder can be directly replaced without replacing the lamp. The efficacy of the bulb [that is, the invention can be used directly on old lamps]. Please refer to the first to seventh figures. The outer edge of the heat-dissipating lamp holder (2) is provided with a metal sleeve (21), an insulating sleeve (22) and a power contact piece (23) for the bulb. 21), the insulating sleeve (22) and the power contact piece (23) are internationally accepted specifications, such as E-27, E-14, etc., the metal sleeve (21) and the power contact piece (23) and the alternating current LED module (1) The electrical connection portion (11) is electrically connected. Moreover, the heat-dissipating lamp holder (2) can be provided with a lamp cover (24) to constitute an LED bulb, so that the invention can be directly screwed onto the lamp of the conventional light bulb without replacing the original old lamp.

再請參閱第八、九、十、十一、十二圖所示,本發明交流電LED模組(1)之電連結部(11)連結有投射燈座專用之連結端子(25)【該投射燈座專用之連結端子(25)為國際通用規格,如MR16等】,該連結端子(25)並凸設出散熱燈座(2)底部外緣,散熱燈座(2)上設有反射罩(26),而構成LED投射燈,如此即可以本發明直接插合於習用投射燈具上使用,而不必替換原有的舊投射燈具者。Referring to the eighth, ninth, tenth, eleventh and twelfth drawings, the electrical connection portion (11) of the alternating current LED module (1) of the present invention is connected with a connection terminal (25) dedicated to the projection lamp holder. The connecting terminal (25) for the lamp holder is an international standard, such as MR16, etc., the connecting terminal (25) protrudes from the bottom outer edge of the heat-dissipating lamp holder (2), and the heat-dissipating lamp holder (2) is provided with a reflecting cover. (26), and constitutes an LED projection lamp, so that the invention can be directly inserted into a conventional projection lamp without having to replace the original old projection lamp.

又,本發明散熱燈座(2)設有增加散熱表面積之紋路(27)者。Further, the heat-dissipating lamp holder (2) of the present invention is provided with a texture (27) which increases the surface area of the heat dissipation.

本發明之另一實施例請參閱第十三、十五圖,由圖可知本實施例主要包括有:預定數量的交流電LED模組(1)【本實施例為一個】,為規格化商品,其具有導熱部(10)及電連結部(11),交流電LED模組(1)之導熱部(10)與導熱件(4)結合,電連結部(11)則連結外部電源;導熱件(4),可為導熱性良好之金屬構成【導熱良好之金屬如金、銀、銅、鐵、鋁、鈷、鎳、鋅、鈦、錳等】,或可為熱導率高之非金屬構成【熱導率高的非金屬諸如:氧化鋁Al2 O3 、氧化鋯Zr2 O、氮化鋁AlN、氮化矽SiN、氮化硼BN、碳化鎢WC、碳化矽SiC、石墨C、結晶碳化矽、再結晶碳化矽RSiC等,而以氮化鋁及碳化矽為佳】;散熱燈座(5),為散熱性良好之具多孔隙結構(多孔隙結構即具有高比表面積結構)非金屬構成【散熱燈座(5)如由熱導率高的非金屬粉體製成(如射出成型等),熱導率高的非金屬粉體諸如:氧化鋁Al2 O3 、氧化鋯Zr2 O、氮化鋁AlN、氮化矽SiN、氮化硼BN、碳化鎢WC、碳化矽SiC、石墨C、結晶碳化矽、再結晶碳化矽RSiC等,而以氮化鋁及碳化矽為佳】,並直接成型成燈座外形;當點亮LED燈時,其產生的熱可迅速的被導熱件(4)所傳導,並藉導熱件(4)與散熱燈座(5)間之熱傳導及熱對流作用,使導熱件(4)上之熱迅速的傳導至散熱燈座(5)而散熱者。For another embodiment of the present invention, please refer to the thirteenth and fifteenth drawings. It can be seen from the figure that the embodiment mainly includes: a predetermined number of alternating current LED modules (1) [this embodiment is one], which is a standardized product. The heat conducting portion (10) and the electrical connecting portion (11) are combined, the heat conducting portion (10) of the alternating current LED module (1) is combined with the heat conducting member (4), and the electrical connecting portion (11) is connected to the external power source; 4) It can be made of a metal with good thermal conductivity [a metal with good thermal conductivity such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese, etc.], or a non-metallic composition with high thermal conductivity. [Non-metal with high thermal conductivity such as: alumina Al 2 O 3 , zirconia Zr 2 O, aluminum nitride AlN, tantalum nitride SiN, boron nitride BN, tungsten carbide WC, tantalum carbide SiC, graphite C, crystal Tantalum carbide, recrystallized niobium carbide, RSiC, etc., and aluminum nitride and tantalum carbide are preferred; heat-dissipating lamp holder (5) is a porous structure with good heat dissipation (multi-porous structure, ie, high specific surface area structure) Metal composition [The heat-dissipating lamp holder (5) is made of a non-metallic powder having a high thermal conductivity (such as injection molding), and a non-metallic powder having a high thermal conductivity such as Alumina Al 2 O 3, zirconium oxide Zr 2 O, aluminum nitride AlN, silicon nitride SiN, boron nitride BN, tungsten carbide WC, silicon carbide SiC, graphite C, crystallized silicon carbide, recrystallized silicon carbide RSiC the like, Aluminum nitride and tantalum carbide are preferred, and directly formed into the shape of the lamp holder; when the LED lamp is lit, the heat generated by the LED lamp can be quickly conducted by the heat conducting member (4), and the heat conducting member (4) The heat conduction and heat convection between the heat-dissipating lamp holder (5) causes the heat on the heat-conducting member (4) to be quickly transmitted to the heat-dissipating lamp holder (5) to dissipate heat.

本發明前述導熱件(4)與交流電LED模組(1)之結合,可為交流電LED模組(1)構裝完成後再與導熱件(4)結合【請參閱第十三圖】,亦可於導熱件(4)上直接構裝交流電LED模組(1’)【請參閱第十四圖】。The combination of the heat conducting member (4) and the alternating current LED module (1) of the present invention can be combined with the heat conducting member (4) after the configuration of the alternating current LED module (1) is completed [please refer to the thirteenth figure], The AC LED module (1') can be directly mounted on the heat-conducting member (4) [see Figure 14].

本發明導熱件(4)可直接成形於散熱燈座(5)上【例如,請參閱第十六圖所示,以印刷或塗佈等方式直接於散熱燈座(5)結合部上形成金屬導熱層(40)】,以減少部件、降低成本。The heat-conducting member (4) of the present invention can be directly formed on the heat-dissipating lamp holder (5) [for example, as shown in Fig. 16, the metal is directly formed on the joint portion of the heat-dissipating lamp holder (5) by printing or coating. Thermal layer (40) to reduce parts and reduce costs.

請參閱第十七、十八圖所示,本發明前述散熱燈座(5)具有內承部(50),導熱件(4)係容設於內承部(50)。Referring to Figures 17 and 18, the heat sink base (5) of the present invention has an inner receiving portion (50), and the heat conducting member (4) is received in the inner receiving portion (50).

本發明散熱燈座(5)係直接形成一般燈座外形,並兼具散熱效能,可直接取代習用燈泡使用,除具有極佳的散熱、電絕緣效果外,更具有不須更換燈具可直接替換燈泡之功效【即本發明可直接於舊的燈具上使用】。請參閱相關圖面所示,該散熱燈座(5)外緣設有燈泡專用的金屬套(51)、絕緣套(52)及電源接觸片(53)【該燈泡專用的金屬套(51)、絕緣套(52)及電源接觸片(53)為國際通用規格,如E-27、E-14等】,該金屬套(51)及電源接觸片(53)並與交流電LED模組(1)之電連結部(11)電性連結。又,散熱燈座(5)上可設有燈罩(54),而構成LED燈泡,如此即可以本發明直接螺合於習用燈泡之燈具上使用,而不必替換原有的舊燈具。The heat-dissipating lamp holder (5) of the invention directly forms the general shape of the lamp holder, and has the heat-dissipating effect, and can directly replace the conventional light bulb, and has the advantages of excellent heat dissipation and electric insulation effect, and can be directly replaced without replacing the lamp. The efficacy of the bulb [that is, the invention can be used directly on old lamps]. Please refer to the relevant figure. The outer edge of the heat-dissipating lamp holder (5) is provided with a metal sleeve (51), an insulating sleeve (52) and a power contact piece (53) for the bulb. [The metal sleeve for the bulb (51) The insulating sleeve (52) and the power contact piece (53) are internationally accepted specifications, such as E-27, E-14, etc., the metal sleeve (51) and the power contact piece (53) and the alternating current LED module (1) The electrical connection portion (11) is electrically connected. Moreover, the heat-dissipating lamp holder (5) can be provided with a lamp cover (54) to constitute an LED bulb, so that the invention can be directly screwed onto the lamp of the conventional light bulb without replacing the original old lamp.

再請參閱第十九、二十、二十一圖所示,本發明交流電LED模組(1)之電連結部(11)連結有投射燈座專用之連結端子(55)【該投射燈座專用之連結端子(55)為國際通用規格,如MR16等】,該連結端子(55)並凸設出散熱燈座(5)底部外緣,散熱燈座(5)上設有固定板(58),固定板(58)固定有反射罩(56),而構成LED投射燈,如此即可以本發明直接插合於習用投射燈具上使用,而不必替換原有的舊投射燈具者。Referring to the nineteenth, twenty-first, and twenty-first, the electrical connection portion (11) of the alternating current LED module (1) of the present invention is coupled with a connection terminal (55) dedicated to the projection lamp holder. The special connection terminal (55) is an international standard, such as MR16, etc., the connection terminal (55) protrudes from the bottom outer edge of the heat dissipation lamp holder (5), and the fixing lamp holder (5) is provided with a fixing plate (58). The fixing plate (58) is fixed with a reflector cover (56) to constitute an LED projection lamp, so that the invention can be directly inserted into a conventional projection lamp without having to replace the original old projection lamp.

本發明前述固定板(58)設有預定數量之穿孔(59),以形成對流作用,提高散熱效能。散熱燈座(2)設有增加散熱表面積之紋路(57)者。The fixing plate (58) of the present invention is provided with a predetermined number of perforations (59) to form a convection effect to improve heat dissipation performance. The heat sink base (2) is provided with a pattern (57) that increases the heat dissipation surface area.

如此而達本發明設計目的,堪稱一實用之發明者。Thus, the design object of the present invention is a practical inventor.

綜上所述,本發明所揭露之一種「高效率LED燈」為昔所無,亦未曾見於國內外公開之刊物上,理已具新穎性之專利要件,又本發明確可摒除習用技術缺失,並達成本發明設計目的,亦已充分符合發明專利要件,並可供產業上利用,爰依法提出申請,謹請 貴審查委員惠予審查,並賜與本案專利,實感德便。In summary, the "high-efficiency LED lamp" disclosed in the present invention is unprecedented in the past, and has not been seen in publications published at home and abroad, and has a novel patent requirement, and the present invention can eliminate the lack of conventional technology. And to achieve the design purpose of the invention, has also fully met the requirements of the invention patent, and can be used in the industry, 提出 apply in accordance with the law, I would like to ask your review board to review, and give the patent in this case, really feel good.

惟以上所述者,僅為本發明之一較佳可行實施例而已,並非用以拘限本發明之範圍,舉凡熟悉此項技藝人士,運用本發明說明書及申請專利範圍所作之等效結構變化,理應包括於本發明之專利範圍內。However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the equivalent structural changes made by the present invention and the scope of the patent application are known to those skilled in the art. It is intended to be included in the scope of the patent of the present invention.

(1)(1’)...交流電LED模組(1) (1’). . . AC LED module

(10)...導熱部(10). . . Heat transfer department

(11)...電連結部(11). . . Electrical connection

(2)...散熱燈座(2). . . Cooling lamp holder

(20)...內凹部(20). . . Inner recess

(21)...金屬套(twenty one). . . Metal sleeve

(22)...絕緣套(twenty two). . . Insulating sleeve

(23)...電源接觸片(twenty three). . . Power contact piece

(24)...燈罩(twenty four). . . lampshade

(25)...連結端子(25). . . Connection terminal

(26)...反射罩(26). . . Reflector

(27)...紋路(27). . . Grain

(28)...固定板(28). . . Fixed plate

(29)...穿孔(29). . . perforation

(3)...導熱片(3). . . Thermal sheet

(30)...傳導板(30). . . Conductive plate

(4)...導熱件(4). . . Heat conductive member

(40)...導熱層(40). . . Thermal layer

(5)...散熱燈座(5). . . Cooling lamp holder

(50)...內承部(50). . . Inner bearing

(51)...金屬套(51). . . Metal sleeve

(52)...絕緣套(52). . . Insulating sleeve

(53)...電源接觸片(53). . . Power contact piece

(54)...燈罩(54). . . lampshade

(55)...連結端子(55). . . Connection terminal

(56)...反射罩(56). . . Reflector

(57)...紋路(57). . . Grain

(58)...固定板(58). . . Fixed plate

(59)...穿孔(59). . . perforation

第一圖係本發明燈泡式實施例立體圖。The first figure is a perspective view of a bulb embodiment of the present invention.

第二圖係本發明燈泡式第一實施例立體分解圖。The second drawing is an exploded perspective view of a first embodiment of the bulb of the present invention.

第三圖係本發明燈泡式第一實施例組立剖面圖。The third drawing is a sectional view of a first embodiment of the bulb of the present invention.

第四圖係本發明燈泡式第二實施例立體分解圖。The fourth drawing is an exploded perspective view of a second embodiment of the bulb of the present invention.

第五圖係本發明燈泡式第二實施例組立剖面圖。Figure 5 is a cross-sectional view showing a second embodiment of the bulb of the present invention.

第六圖係本發明燈泡式第三實施例立體分解圖。Figure 6 is a perspective exploded view of a third embodiment of the bulb of the present invention.

第七圖係本發明燈泡式第三實施例組立剖面圖。Figure 7 is a cross-sectional view showing a third embodiment of the bulb of the present invention.

第八圖係本發明投射燈式實施例立體圖。Figure 8 is a perspective view of a projection lamp type embodiment of the present invention.

第九圖係本發明投射燈式第一實施例立體分解圖。Figure 9 is a perspective exploded view of the first embodiment of the projection lamp of the present invention.

第十圖係本發明投射燈式第一實施例組立剖面圖。Figure 11 is a cross-sectional view showing the first embodiment of the projection lamp type of the present invention.

第十一圖係本發明投射燈式第二實施例立體分解圖。Figure 11 is a perspective exploded view of a second embodiment of the projection lamp of the present invention.

第十二圖係本發明投射燈式第二實施例組立剖面圖。Figure 12 is a cross-sectional view showing a second embodiment of the projection lamp type of the present invention.

第十三圖係本發明燈泡式第四實施例立體分解圖。Figure 13 is a perspective exploded view of a fourth embodiment of the bulb of the present invention.

第十四圖係本發明燈泡式第五實施例立體分解圖。Figure 14 is a perspective exploded view of a fifth embodiment of the bulb of the present invention.

第十五圖係本發明燈泡式第四實施例組立剖面圖。Fifteenth is a sectional view showing a fourth embodiment of the bulb of the present invention.

第十六圖係本發明燈泡式第六實施例組立剖面圖。Figure 16 is a cross-sectional view showing a sixth embodiment of the bulb of the present invention.

第十七圖係本發明燈泡式第七實施例立體分解圖。Figure 17 is a perspective exploded view of a seventh embodiment of the bulb of the present invention.

第十八圖係本發明燈泡式第七實施例組立剖面圖。Figure 18 is a cross-sectional view showing a seventh embodiment of the bulb of the present invention.

第十九圖係本發明投射燈式第三實施例立體圖。Fig. 19 is a perspective view showing a third embodiment of the projection lamp of the present invention.

第二十圖係本發明投射燈式第三實施例立體分解圖。Figure 20 is a perspective exploded view of a third embodiment of the projection lamp of the present invention.

第二十一圖係本發明投射燈式第三實施例組立剖面圖。The twenty-first drawing is a sectional view showing a third embodiment of the projection lamp type of the present invention.

(1)‧‧‧交流電LED模組(1)‧‧‧AC LED Module

(10)‧‧‧導熱部(10) ‧‧‧Transfer Department

(11)‧‧‧電連結部(11) ‧‧‧Electrical connection

(2)‧‧‧散熱燈座(2) ‧‧‧Heat lamp holder

(20)‧‧‧內凹部(20) ‧ ‧ inner recess

(21)‧‧‧金屬套(21)‧‧‧Metal sets

(22)‧‧‧絕緣套(22)‧‧‧Insulation sleeve

(23)‧‧‧電源接觸片(23)‧‧‧Power contact strips

(24)‧‧‧燈罩(24)‧‧‧shade

(3)‧‧‧導熱片(3) ‧‧‧thermal sheet

Claims (6)

一種高效率LED燈,主要包括有:一散熱燈座,該散熱燈座係形成一具有高散熱性質之非金屬多孔隙結構,其係被構造成具有一普通燈殼之外形,該散熱燈座具有一內凹部,該內凹部係可容置該交流電LED模組;一交流電LED模組,該交流電LED模組係裝設於該散熱燈座之中,包括有一導熱部以及兩電連接部,其導熱部係與該散熱燈座結合,之電連接部係與外部電源電氣連接;該高效率LED燈更進一步包括:一導熱片,該導熱片係裝設於該交流電LED模組的導熱部與該散熱燈座之間;一傳導板,該傳導板係裝設於該導熱片與該散熱燈座之間;該導熱片係由一具有高導熱率之金屬所製成;該交流電LED模組之導熱部係被該導熱片包覆;該導熱片將該交流電LED模組之導熱部與該散熱燈座隔開;該傳導板係由一具有高導熱率之金屬所製成;該傳導板具有一頂面與一底面,該頂面係抵靠該導熱片,該底面係抵靠該散熱燈座。 A high-efficiency LED lamp mainly comprises: a heat-dissipating lamp holder, wherein the heat-dissipating lamp holder forms a non-metallic porous structure with high heat dissipation property, and is configured to have a common lamp housing shape, the heat dissipation lamp holder The utility model has an inner recessed portion, wherein the inner recessed portion can accommodate the alternating current LED module; an alternating current LED module, the alternating current LED module is mounted in the heat dissipation lamp socket, and comprises a heat conducting portion and two electrical connecting portions. The heat conducting portion is coupled to the heat sink base, and the electrical connection portion is electrically connected to the external power source. The high efficiency LED lamp further includes: a heat conducting sheet mounted on the heat conducting portion of the alternating current LED module Between the heat sink and the heat sink; the conductive plate is disposed between the heat conductive sheet and the heat sink; the heat conductive sheet is made of a metal having high thermal conductivity; the alternating current LED mold The heat conducting portion of the group is covered by the heat conducting sheet; the heat conducting sheet separates the heat conducting portion of the alternating current LED module from the heat dissipating lamp holder; the conductive plate is made of a metal having high thermal conductivity; the conducting The board has a top surface and a bottom surface The top surface of the thermally conductive sheet based abuts the bottom surface of the cooling system against the socket. 如申請專利範圍第1項所述之高效率LED燈,其中:該交流電LED模組之導熱部係部分容置於該散熱燈座的內凹部之中,並且部分突出於該散熱燈座的內凹部之外; 該交流電LED模組之電連接部係完全容置於並且隱藏於該散熱燈座的內凹部之中;該導熱片係部分容置於該散熱燈座的內凹部之中,並且部分突出於該散熱燈座的內凹部之外;該傳導板係完全突出於該散熱燈座的內凹部之外;該散熱燈座之外緣係設置一螺柱,該螺柱係用以安裝一金屬套,一絕緣套以及一電源接觸片;該金屬套以及該電源接觸片係與該交流電LED模組之電連接部電氣連接。 The high efficiency LED lamp of claim 1, wherein the heat conducting portion of the alternating current LED module is partially received in the inner recess of the heat sink base and partially protrudes from the heat sink base. Outside the recess; The electrical connection portion of the AC LED module is completely received and hidden in the inner recess of the heat dissipation lamp holder; the thermal conductive film portion is received in the inner recess of the heat dissipation lamp holder, and partially protrudes from the The conductive plate is completely protruded from the inner concave portion of the heat dissipation lamp holder; the conductive plate is completely protruded from the inner concave portion of the heat dissipation lamp holder; the outer edge of the heat dissipation lamp holder is provided with a stud for mounting a metal sleeve. An insulating sleeve and a power contact piece; the metal sleeve and the power contact piece are electrically connected to the electrical connection portion of the alternating current LED module. 如申請專利範圍第1項所述之高效率LED燈,其中該高效率LED燈更進一步包括:一燈罩,該燈罩係裝設於該散熱燈座上,以包覆該交流電LED模組。 The high-efficiency LED lamp of the first aspect of the invention, wherein the high-efficiency LED lamp further comprises: a lamp cover mounted on the heat dissipation lamp holder to cover the AC LED module. 如申請專利範圍第1項所述之高效率LED燈,其中該高效率LED燈更進一步包括:兩連結端子,該兩連結端子係與該交流電LED模組之電連接部電氣連接,其中,該兩連結端子係部分容置於該散熱燈座的內凹部之中,並且部分突出於該散熱燈座的內凹部之外。 The high-efficiency LED lamp of the first aspect of the invention, wherein the high-efficiency LED lamp further comprises: two connection terminals, wherein the two connection terminals are electrically connected to the electrical connection portion of the alternating current LED module, wherein the The two connecting terminal portions are received in the inner recess of the heat sink base and partially protrude from the inner recess of the heat sink base. 如申請專利範圍第4項所述之高效率LED燈,其中該高效率LED燈更進一步包括:一反射燈罩,該反射燈罩係裝設於該散熱燈座上,以包覆該交流電LED模組。 The high-efficiency LED lamp of claim 4, wherein the high-efficiency LED lamp further comprises: a reflector cover, the reflector is mounted on the heat sink to cover the AC LED module . 如申請專利範圍第1項所述之高效率LED燈,其中該散熱燈座之一表面係設置多個散熱紋路,以增加該散熱燈座之散熱表面積。 The high efficiency LED lamp of claim 1, wherein a surface of the heat dissipation lamp holder is provided with a plurality of heat dissipation lines to increase a heat dissipation surface area of the heat dissipation lamp holder.
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