200939419 九、發明說明： 【發明所屬之技術領域】 • 本發明係有關於一種用以容納一半導體元件之由金屬 . 所製成的封裝體及一種藉由電性連接複數個封裝體所構 成之半導體裝置。 【先前技術】 通常’為了串聯或並聯連接相同型態之多個半導體裝 置，使用用於該等半導體裝置之互連端的引線或一在一要 安裝該等半導體裝置之印刷佈線板上所形成之用於連接 的導體圖案。 已提出一種技術，該技術提供一種以一具有複數個直線 排列端子之接合部來容納一半導體元件及藉由一線束 (harness)之使用將該等端子連結在一起之封裝體（見，例 如，JP-A-2007-109879)。 附帶地’當藉由引線之使用將數個半導體裝置連接在一 ❺起時，發生包含勞力之消耗及錯誤連接之可能性的增加之 連接工作的問題。再者，一印刷佈線板之使用導致錯誤連 接之可能性的減少，然而需要一處理該印刷佈線板之導體 圖案的步驟，此轉而引起在牛㈣⑽之导體 、在歩驟之數目增加之問題。 只要採用1G9879所述之 風險將是小的。然而，必需开 u目士兩±曰#運接之 別封裝體的端子之接入邱，+ ^ ^… 《深末至個 σ β此造成在製造期間所使用之步 驟的數目顯著增加的問題。 f發明内容j 97130230 200939419 針對這些理由而構想出本發明及本 封裝體及-種半導體裝置，它們抑制在製造㈣所^起之 增加及可防止在電性連接複數個封裝體時發 本發明之第—態樣係有關於—種封裝體，該封裝體以複 數形式安裝在-支撐基座之„_安裝面上，該 半導體元件’包括：―底部基板，設有-練在該支揮基 ❹ 座上^電性連接至該半導體元件之—電極的金屬板；以及 覆蓋基板，设有一在厚度方向上堆疊在該底部基板之一 表面上且電性連接至該半導體元件之另—電極的金屬板。 本發明之第二態樣的特徵在於：該半導體元件係一發光 二極體。 本發明之第三態樣的特徵在於：該底部基板具有一安裝 孔，一旋入該支撐基座之安裝螺釘穿過該安裝孔，以及該 覆盍基板具有一覆蓋侧連接孔，將一穿過一第一連接導體 ❷之第一連接螺釘旋入該覆蓋側連接孔。 本發明之第四態樣的特徵在於：該底部基板具有一底部 側連接孔，將一穿過一電性連接至一在一相鄰封裝體中之 一底部基板上所堆疊之覆蓋基板的第一連接導體之一端 _的第一連接螺釘旋入該底部侧連接孔；以及該覆蓋基板相 .對於該底部基板之中心線係以非對稱形狀來配置，以便橫 跨該中心線，其中該中心線係朝底部基板欲排列在該支撐 基座上之排列方向來延伸及配置，以及該底部側連接孔係 形成於相對該中心線之一側上。 97130230 7 200939419 ，本發明之第五態樣的特徵在於··配置該覆蓋基板，以便 從該中心線至位於該中心線之相對側上的該 -個別端緣的距離係彼此不同的，該底部侧連接孔；；形成於 .在該底部基板上沒有疊置該覆蓋基板之區域中。 本發明之第六態樣的特徵在於：以某一尺寸在該覆蓋基 板中之疊置在該底部侧連接孔上的位置處切割成一孔，以 便該覆蓋基板沒有與該第二連接螺釘接觸。 本發明之第七態樣的特徵在於··在該覆蓋基板中之相對 ❽於該十心、線的該纟部侧連接孔之相對側上形纟—覆蓋側 連接孔，其中將一穿過一第一連接導體之第一連接螺釘旋 入該覆蓋側連接孔。 本發明之第八態樣的特徵在於：一種半導體裝置包括在 該支撐基座上所安裝之複數個前述封裝體，其中該支撐基 座係以一導電金屬材料所形成，以及 該複數個封裝體之底部基板與該支揮基座電性連接。 ❹ 本發明之第九態樣的特徵在於：一種半導體裝置包括在 該支撐基座上所安裝之複數個前述封裝體，其中該支撐基 座係以一絕緣材料所形成。 本發明之第十態樣的特徵在於：一種半導體裝置包括在 该支撐基座上所安裝之複數個前述封裝體，其中在該支撐 •基座上安裝該等封裝體，以便使沿著在該支撐基座上之該 等底部基板的排列方向所延伸之該等底部基板的中心線 彼此對齊及使該等覆蓋侧連接孔彼此對齊，以及配置該第 一連接導體’以便橫跨複數個封裝體及由第一連接螺釘固 97130230 200939419 定至該等覆蓋基板。 本發明之第十一態樣的特徵在於：配置一疊置在該等底 部基板上之第二連接導電體，以便橫跨複數個封裝體，以 .及藉由使該等安裝螺釘穿過該第二連接導體，以將該第二 連接導體與該等封裝體一起固定至該支撐基座。 本發明之第十二態樣的特徵在於：一種半導體裝置包括 複數個前述封裝體，在該支撐基座上安裝該等封裝體，以 便使該等底部基板之中心線彼此對齊，其中排列相鄰封裝 ❾體，以便相對於該等中心線使該等覆蓋基板之位置交錯排 列。 本發明之第十三態樣的特徵在於：該第一連接導體係一 在該覆蓋基板上所安裝之連接板及包括一疊置在該底部 基板之正面上的底部侧片、一疊置在該覆蓋基板之正面上 的覆蓋側片及一用以連結該底部側片至該覆蓋侧片之接 合片。 ❹ 本發明之第十四態樣的特徵在於：該第一連接導體係一 在該覆蓋基底上所連續及整體形成之連接片，以及在該底 部基板之正面上疊置該連接片之一端。 依據本發明之第一態樣，因為彼此堆疊該底部基板及該 _覆蓋基板，以致於使該底部基板及該覆蓋基板與該半導體 -裝置之電極電性連接，所以相較於個別提供端子之結構， 該結構變得簡單及在製造期間所實施之步驟數目的增加 會是小的》再者’因為該等封裝體設有金屬板，所以呈現 增強的散熱性能，以及一功率元件可應用至該封裝體。 97130230 9 200939419 另外’使該底部基板與該半導體元件之一電極連接及使 該覆蓋基板與該半導體元件之另一電極連接。因此，在串 聯連接該支撐基座上所排列之封裝體的情況中，在一相鄰 對之封裝體中使一封裝體之底部基板與另一封裝體之覆 蓋基板彼此連接。再者，在並聯連接該支撐基座上所排列 之封裝體的情況中，使該等底部基板彼此連接及使該等覆 蓋基板彼此連接。在兩者情況中’可由目測容易地發現到 錯誤連接。200939419 IX. Description of the Invention: [Technical Field] The present invention relates to a package made of metal for accommodating a semiconductor element and a package formed by electrically connecting a plurality of packages Semiconductor device. [Prior Art] Generally, a plurality of semiconductor devices of the same type are connected in series or in parallel, using leads for interconnection ends of the semiconductor devices or a printed wiring board on which the semiconductor devices are to be mounted. Conductor pattern for connection. A technique has been proposed which provides a package in which a semiconductor element is accommodated by a joint having a plurality of linearly arranged terminals and the terminals are joined together by the use of a harness (see, for example, JP-A-2007-109879). Incidentally, when a plurality of semiconductor devices are connected by a use of a lead wire, a problem of connection work involving an increase in labor consumption and an erroneous connection occurs. Furthermore, the use of a printed wiring board leads to a reduction in the possibility of erroneous connection, but a step of processing the conductor pattern of the printed wiring board is required, which in turn causes an increase in the number of conductors in the (4) (10) conductor. problem. As long as the risk described in 1G9879 is used, it will be small. However, it is necessary to open the connection of the terminals of the package of the U ± 曰 曰 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , . f SUMMARY OF INVENTION j 97130230 200939419 The present invention and the package and the semiconductor device are conceived for these reasons, which suppress the increase in manufacturing (4) and prevent the invention from being electrically connected to a plurality of packages. The first aspect relates to a package body which is mounted in plural form on a mounting surface of a support base, and the semiconductor component includes: a bottom substrate, which is provided with a metal plate electrically connected to the electrode of the semiconductor element; and a cover substrate provided with a thickness electrode stacked on one surface of the base substrate and electrically connected to the other electrode of the semiconductor element The second aspect of the present invention is characterized in that the semiconductor component is a light-emitting diode. The third aspect of the present invention is characterized in that the bottom substrate has a mounting hole into which the support base is screwed. The mounting screw passes through the mounting hole, and the cover substrate has a cover side connecting hole, and a first connecting screw passing through a first connecting conductor turns into the covering side connecting hole. A fourth aspect of the present invention is characterized in that the bottom substrate has a bottom side connecting hole, and is electrically connected to a cover substrate stacked on a bottom substrate of one adjacent package. a first connecting screw of one of the connecting conductors is screwed into the bottom side connecting hole; and the cover substrate phase is configured in an asymmetrical shape with respect to a center line of the base substrate so as to straddle the center line, wherein the center The wire system is extended and arranged toward the arrangement direction of the bottom substrate on the support base, and the bottom side connection hole is formed on one side opposite to the center line. 97130230 7 200939419, the fifth aspect of the present invention Characterizing that the cover substrate is disposed such that the distance from the center line to the individual edge on the opposite side of the center line is different from each other, the bottom side connecting hole; formed at the bottom The sixth aspect of the present invention is characterized in that the substrate is superimposed on the bottom side connecting hole at a certain size in a certain size. Cutting into a hole so that the cover substrate is not in contact with the second connecting screw. The seventh aspect of the present invention is characterized in that the crotch side connecting hole in the covering substrate is opposite to the ten core and the line The opposite side upper 纟-covering side connecting hole, wherein a first connecting screw passing through a first connecting conductor is screwed into the covering side connecting hole. The eighth aspect of the invention is characterized in that a semiconductor device comprises And a plurality of the package bodies mounted on the support base, wherein the support base is formed of a conductive metal material, and the bottom substrate of the plurality of packages is electrically connected to the support base. A ninth aspect of the invention is characterized in that a semiconductor device includes a plurality of the foregoing packages mounted on the support base, wherein the support base is formed of an insulating material. The invention is characterized in that a semiconductor device comprises a plurality of the aforementioned packages mounted on the support base, wherein the packages are mounted on the support base so as to be along The center lines of the bottom substrates extending in the direction in which the bottom substrates are arranged on the support base are aligned with each other and the cover side connection holes are aligned with each other, and the first connection conductors are disposed so as to span the plurality of packages And the first connecting screw is fixed to 97130230 200939419 to the covering substrates. An eleventh aspect of the present invention is characterized in that: arranging a second connecting conductor stacked on the bottom substrate so as to span the plurality of packages, and by passing the mounting screws through the a second connecting conductor to fix the second connecting conductor to the supporting base together with the packages. A twelfth aspect of the present invention is characterized in that a semiconductor device includes a plurality of the foregoing packages, and the packages are mounted on the support base such that the center lines of the bottom substrates are aligned with each other, wherein the adjacent rows are arranged adjacent to each other. The body is packaged to stagger the positions of the cover substrates relative to the centerlines. A thirteenth aspect of the present invention is characterized in that: the first connecting guiding system is a connecting plate mounted on the cover substrate and includes a bottom side piece stacked on a front surface of the bottom substrate, and is stacked on The cover side sheet on the front surface of the cover substrate and a joint piece for joining the bottom side piece to the cover side piece. The fourteenth aspect of the invention is characterized in that the first connecting guide system is a continuous and integrally formed connecting piece on the covering substrate, and one end of the connecting piece is superposed on the front surface of the bottom substrate. According to the first aspect of the present invention, since the bottom substrate and the cover substrate are stacked on each other such that the base substrate and the cover substrate are electrically connected to the electrodes of the semiconductor device, the terminals are provided separately. Structure, the structure becomes simple and the increase in the number of steps performed during manufacturing will be small. "Because the package is provided with a metal plate, it exhibits enhanced heat dissipation performance, and a power component can be applied to The package. 97130230 9 200939419 Further, the base substrate is connected to one of the electrodes of the semiconductor element and the cover substrate is connected to the other electrode of the semiconductor element. Therefore, in the case where the packages arranged on the support base are connected in series, the base substrate of one package and the cover substrate of the other package are connected to each other in an adjacent package. Further, in the case where the packages arranged on the support base are connected in parallel, the base substrates are connected to each other and the cover substrates are connected to each other. In both cases, the wrong connection can be easily found by visual inspection.
⑩ 而且，因為在該支撐基座上所安裝之底部基板上堆疊該 覆蓋基板，所以可藉由在該支撐基座之安裝面上排列複數 個封裝體來獲得一狹長組態。並且，藉由排列該等封裝體 而沒有形成在相鄰底部基板間之間隔，可以高密度安裝半 導體元件。於是，當該等半導體元件係為發光元件（諸如 發光二極體）時，可輕易獲得一狹長光源。此外，可藉由 使該等相鄰發光二極體間之間隔變窄，以抑制在沿著^向 上之光強度的不均勻。 依據本發明之第二態樣，使用一金屬封裝體於一發光二 極體之封I體，可提升該散熱性能及抑制該發光二極體之 ::度士升。結果’可使用發光二極體以獲得一高輸出光 :、、句話說’當增加該發光二極體之溫度時，降低該發 y亟2光發射效率。在本發明中，甚至當輸人高電流 的、、^由^供-種具有高散熱性能之封震體，可抑制這樣 照因此，可以能維持高光發射效率之高輸出來 97130230 200939419 依據本發明之第三態樣’當可以該等安裝螺釘將該底部 基板固定至該支撑基座時，可改善該底部基板至該支撐基 座，固定強度。再者，為了祕，可㈣地使該底部基板 •從該支樓基座分離及再次附著至該支樓基座。此外，因為 可以該第—連接螺釘將該第-連接導體安裝在該覆蓋基 板上’所以可藉由在該覆蓋基板與該第一連接導體間形成 密切接觸’以可靠地電性連接該覆蓋基板及該第一連接導 體。 ❹依據本發明之第四態樣，堆㈣底部基板，該底部基板 與該半體體兀件之-電極電性連接，及該覆蓋基板，以及 該覆蓋基板相對於該底部基板之中心線係以非對稱形狀 來配置’其中该中心線係朝底部基板排列在該支樓基座上 之排列方向來延伸。結果，當在該支樓基座上排列該等封 裝，時，可輕易地由該等覆蓋基板之位置的目測來決定一 、曰誤排列之存在。再者，在該等相鄰封裝體中以該連接螺 ❹釘使與一覆蓋基板電性連接之該第一連接導體的一端連 至該底σ卩基板。結果，除非造成在該支撐基座上之封裝 體的錯誤排列，否則可防止在該等封裝體間之錯誤連接。 再者’、機械地及電性地搞接該等相鄰封裝體。此外，因為 -使構成一封裝體之該底部基板及該覆蓋基板分別連接至 -該半導，7〇件之兩個電極，所以相較於提供個別端子之結 構可簡化該結構及在冑造期間之程序數目的增加會是小 勺另外，因為該封裝體設有金屬板，所以呈現增強的散 熱丨生旎及—功率元件係可應用至該封裝體。 97130230 11 200939419 —依據本發明之第五態樣，因為以該非對稱形狀配置該覆 π基板，使在该底部基板之相對於令心線之一側上的大部 -分區域與該覆蓋基板疊置在一起，然而使在該底部基板; .另=一側上的大部分區域沒有與該覆蓋基板疊置在一起且 f該區域暴露，所以可根據外觀㈣地觀察到該封裝體之 f裝方向。換句話說’當使該底部基板及該覆蓋基板與其 它零件連接時，可輕易地發現該封裝體與該等其它零件間 之錯誤連接。再者，在該底部基板中之沒有疊置該覆蓋基 板之位置處形成該底部侧連接孔。藉由在該底部基板中之 暴露大部分區域的位置處形成該底部側連接孔，可使被旋 入該底冑側連接孔之該第二連接螺針與該a蓋基板間之 距離變長，以便可輕易地提供電性絕緣。 依據本發明之第六態樣，以某—尺寸在該覆蓋基板中之 $置在該底部側連接孔上的位置處㈣成該孔，以便該覆 蓋^板沒有與該第二連接螺釘接觸。因此，該第二連接螺 ❹釘/又有與該覆蓋基板接觸及可防止該底部基板與該覆蓋 基板間之短路而沒有使用一用力該第二連接螺釘之 材料。 、依據本發明之第七態樣，在該底部基板巾形成該底部側 -連接孔，以及在該覆蓋基板中形成該覆蓋側連接孔，以及 .在相對於該底部基板之中心、線的相對側上形成該底部侧 連接孔及該覆蓋側連接孔。因此，可輕易地安裝該等第一 連接導體，以便在該支撐基座上安裝該等封裝體之狀態中 的相鄰封裝ϋ中以交錯方式電性連接該底#基板及該覆 97130230 12 200939419 蓋基板。換句話說，藉由以該第二連接螺針連接 接導體之一端與該底部基板及以該第一連接螺/連 第一連接板之另-端與該覆蓋板，可串聯連接該^相= 裝體。再者，藉由配置該第一連接板，以便 、于 底部基板彼此電性連接及使該‘覆蓋:Ϊ 彼此電性連接，可並聯連接該等相鄰封裝體。 ❹ ❹ ，據本發明之第人態樣’因為使該底部基板與以 金屬材料所形成之該支樓基座電性連接，所以 撐基座實施該等底部基板間之電性連接。換句話說，不 要使用-個料電構件，使該等相鄰底部基板彼此連接， 以便並聯連接該等相鄰封裝體。因此，可減少零件之數 目。再者，雖然只在並聯連接該等封裝體之情況中可使用 此結構，但是因為該底部侧連接孔係不需要的，所以可小 型化該等底部基板。另外，因為使該等底部基板與該支撐 基座直接接觸，所以亦期望高的散熱性能。 依據本發明之第九態樣，藉由使用以該絕緣材料所形成 之該支撐基座，可在該等相鄰封裝體間自由地選擇電性 接。 依據本發明之第十態樣，因為在該支樓基座上安裝該等 封裝體，以使該等底部基板之中心線彼此對齊，以及該第 連接導體橫跨複數個封裝體以連接該等複數個封裝 體，所以只藉由提供該直線第一連接導體，以在該等相鄰 ί裝體中使該荨覆蓋基板彼此連接。因此，輕易地並聯連 接該等封裝體。 97130230 13 200939419 依據本發明之第十一態樣，因為在該複數個封裝體中經 由该第一連接導體使該等覆蓋基板彼此電性連接，以及亦 經由該第二連接導體使該等底部基板彼此電性連接，所以 •可藉由兩個連接導體並聯連接該複數個封裝體。再者，藉 由以用以將該等底部基板安裝在該支撐基座上之安裝螺 釘來耦接該第二連接導體至該等底部基板，可整合地實施 該等底部基板之固定及與該第二連接導體之連接。因此， ο 1較於為了連接該第二連接導體與該等底部基板而個別 提供該第二螺釘之情況，因為該底部侧連接孔係不需要 的，所以減少零件之數目及可小型化該等底部基板。 依據本發明之第十二態樣，排列該等相鄰封裝體，以便 使該等底基板之中心線彼此對齊及相對於該等中心線 交錯排列+該等覆蓋基板之位置，可只藉由連接該底部基板 及該覆蓋基板與該第一連接導體來串聯連接該等封裝 體，其中當從該等相鄰封裝體中之正面觀看時，該第一連 係直線的。換句話說，因為使該等半導體與該等短 接導體連接，所以可抑制在該第—連接導體令之電 ==可防止該錯誤連接。此外，可只由該等覆蓋基 板1位置的目測來檢查該錯誤連接之存在。於是，可 配時防止該錯誤排列。 體盘二::』之：十二態樣’因為個別提供該第-連接導 體…亥封裝體，所以可簡化該封裝體之形狀。 依據本發明之第十四能媒 導體財㈣牌 μ樣目為整合地提供該第一連接 等體/、該封装體》所以除了兮读拉士审a 吓乂除了該連接螺釘之外，任何安裝用 97130230 200939419 之構件係不需要的。此外，可只藉由一個連接螺釘連接該 等相鄰對之封裝，以便輕易地實施該連接工作。 【實施方式】 (第一具體例） 藉由以下面所要描述之封裝體容納一做為一半導體元 件之紫外線發光二極體的情況為一實施例來說明該封裝 肢附帶地，在本發明中，不僅使用發射紫外線波長範圍 之光的該糸外線發光二極體，而且亦可使用一不同於該紫 外線發光二極體之發光二極體（例如，發射可見波長範圍 之光的發光二極體）來構成該封裝體。 如圖3至5C所示，建構一封裝體j成為一藉由堆疊一 由:上面安裝一紫外線發光二極體2之金屬板所製成之 氏P基板11、一由一包圍該底部基板11之安裝相當於一 曰之I外線發光二極體2的區域之金屬板所製成之覆 盍基板12及一在該底部基板u與該覆蓋基板12間所插 ❹入且使該底部基板n與該覆蓋基板12絕緣之絕緣材料層 13所產生之多層產品。因為希望這些基板使用具有高導 …、率及同導電率之材料，所以該底部基板11及該覆蓋基 板12使用一銅元素或一銅合金。 帝圖3所示，藉由晶粒接合使該紫外線發光二極體2之 电極（陽極）直接連接至該底部基板Η。 人 ί吏該紫外線發光二極继2之另-電極（陰極）連接 盘基板12。換句話說，使該紫外線發光二極It 2之-電 極電性連接至該底部基& u，以及使該紫外線發光二極 97130230 15 200939419 體2之另一電極電性連接至該覆蓋基板12。 在該覆蓋基板12中開出一暴露孔14，以便暴露在該底 ' 部基板11上所安裝之紫外線發光二極體2。使該暴露孔 • 14之内周面成為錐形，以便該暴露孔14之内徑隨著離該 底部基板11之距離的增加而變大。在該暴露孔14中安裝 一具有一凸曲（例如，球形）外表面之泛光透鏡15〇結果， 該紫外線發光二極體2被容納在一由該底部基板11、該 覆蓋基板12及該泛光透鏡丨5所包圍之密閉空間中及被保 ❹護不受環境（諸如濕氣）之影響。可藉由調整該泛光透鏡 15之位置及特性或該暴露孔14之内周面的傾斜或反射之 角度來控制從該紫外線發光二極體2所照射之光的發光 強度分佈。 該封裝體兼做一散熱器。在該底部基板丨丨之背面（相對 於該底部基板11之堆疊有該覆蓋基板12的表面之表面） 中形成一對循環孔口 16，每一循環孔口丨6係圓形開口。 ❹在該底部基板11中形成用以在該等循環孔口 i 6間建立互 通之流動通道17。形成每一流動通道丨7，以便該通道穿 過该底部基板11之安裝有該紫外線發光二極體2的鄰近 地區，藉以提高一流經該流動通道丨7之冷卻目的之流體 —與6亥糸外線發光一極體2間之熱輕合的程度。該冷卻流體 可使用水，但疋亦可使用一不同於水之物質，只要該物質 在室溫下處於液態中及呈現接近1之比熱容量。 如圖5A至5C所示，在本具體例中，當從該泛光透鏡 15之正面觀看時，該底部基板u及該覆蓋基板12兩者 97130230 16 200939419 係形成為矩形形狀及具有實質相同寬度。然而，該底部基 板π及該覆蓋基板12具有彼此不同之長度，以及該底部 基板丨1係形成比該覆蓋基板12長。此外，該底部基板 -11之長度中心的位置不同於該覆蓋基板12之長度中心的 位置’或者換句話說，使該覆蓋基板12在縱向上之一端 沿著它的縱向延伸至該底部基板u之一側。使該泛光透 鏡15之中心對齊至該底部基板11之長度中心。形成該兩 個循％孔口 16，同時使它們沿著該底部基板11之縱向以 〇彼此隔離。 在該底部基板11之每一縱端上形成一安裝孔18。再 者，在該底部基板11中開出一為螺絲孔之底部侧連接孔 21及在該覆蓋基板丨2中開出一為螺絲孔之覆蓋侧連接孔 22。該底部侧連接孔21及該覆蓋侧連接孔22係定位在該 底部基板11之長度中心與該等個別安裝孔18之間。在從 該底部基板11之長度中心至該底部侧連接孔21的距離與 ❹從該底部基板11之長度中心至該覆蓋側連接孔22的距離 間存在有等距離。該底部侧連接孔21及該覆蓋側連接孔 22係提供用以電性連接該紫外線發光二極體2至另一構 件。 • 結果，當從該泛光透鏡15之正面觀看時，以對稱於沿 著該底部基板11之寬度方向所延伸之該中心線方式定位 該安裝孔18、該底部側連接孔21及該覆蓋側連接孔 以及該泛光透鏡15。同時，以不對稱於沿著該底部基板 11之寬度方向所延伸之該中心線方式放置及排列該覆蓋 97130230 17 200939419 基板12 ’以便橫跨該中心線。亦即，從該中心線至該覆 蓋基板12在縱向上之一端的距離係不同於從該中心線至 該覆蓋基板12之另一端的距離。換句話說，使該覆蓋基 -板12疊置在該底部基板11上，以便除了使該安裝孔丄8 暴露之區域之外，在該底部基板u之縱向上的一端上以 該覆蓋基板12覆蓋該底部基板11之大部分區域，然而， 在該底部基板11之縱向上的另一端上暴露該安裝孔18及 该底部側連接孔21。在該底部基板Η上堆疊該覆蓋基板 ❹12，以及在該底部基板11中開出該底部侧連接孔21。在 该覆蓋基板12中開出該覆蓋侧連接孔22，以及該底部侧 連接孔21與該覆蓋側連接孔22之孔面相對於該底部基板 11之厚度方向具有彼此不同之高度。 附帶地，在該等個別循環孔口 16周圍形成圓形開口凹 23及24。換句話說，在該等凹部23及24之内部底面 中開出戎等個別循環孔口 16，以及在該等個別凹部23及 ❹24上集中形成該等個別循環孔口 16。 如圖1、2及3所示，在該等封裝體丨之使用時，使該 等封裝體耦接至一管集箱（header)3，以允許該冷卻流體 之循％。該管集箱3做為一上面並列有該等封裝體1之支 -撐基座及係藉由以一耦接螺釘3c固定一由金屬材料所製 成之支撐基座3a與一由絕緣材料所製成之間隔物3b所構 成L經由该支撐基座3a將連接螺釘3c旋入該間隔物3b。 該官集箱3並非侷限於上述形狀。只要一連接該等封裝體 女裝面31成為一平坦面，對該管集箱3之剖面輪廓 97130230 18 200939419 並沒有強加特定限制。 在該管集箱3中形成使該冷卻流體循環之一供應路徑 32及一排放路徑33。在該管集箱3之安裝面31的適當位 置上開出保持與該供應路徑32相通之供應通口 34及保持 與忒排放路徑33相通之排放通口 35 ^為了表示之簡化， 從圖1省略該間隔物3b。 分別以圓形開出該等供應通口 34及該等排放通口 35。 該等通口之口徑實質上等於該等循環孔口 16之口徑。使 〇忒供應通口 34與該排放通口 35間之距離等於在該封裝體 1中所形成之循環孔口 16間之距離。在該管集箱3中形 成由該供應通口 34及排放開口 35所構成之數組通口（例 如，10組）。 為了連結該封裝體1至該管集箱3,使該底部基板U 之開出有該對循環孔口 16之接觸面25與該管集箱3之安 裝面31接觸’以及經由該等安裝孔18將安裝螺釘19旋 ❹入該管集箱3。此時，使在該管集箱3之安裝面31中所 開出且屬於一組之該供應通口 34的轴線及該排放通口 的轴線對齊至一封裝體1之循環孔口 16的個別軸線。將 呈現橡膠彈性之環狀〇型環4安裝至該等個別凹部23及 -24中，以及使該封裝體丨連結至該管集箱3，以便在該等 凹部23及24之内部底面與該管集箱3之安裝面31間壓 緊忒等0型環4，因此使該供應通口 及該排放通口 35 連結至該等對應循環孔口 16而沒有間隙。 在該管集箱3之支撐基座3a與間隔物3b間亦使用用以 97130230 19 200939419 連結該封裝體1之循環孔口 16至該管集箱3之供應通口 34及排放通口 35的結構。特別地，該供應路徑32及該 •排放路徑33必須在該支撐基座3a與該間隔物扑間處= .彼此互通。因此，如圖3所示，在該支撐基座3a中之在 該支撐基座3a及該間隔物3b上要彼此連結該供應路徑 32及該排放路徑33的位置處形成凹部36。在該支撐基座 3a與談間隔物3b間夾入及壓緊一位於該等個別凹部％ 中所配置之環狀〇型環37。 © 附帶地，因為使該底部基板Π及該覆蓋基板12電性連 接至該紫外線發光二極體2之電極，所以在前述封裝體ι 中之底部基板11及覆蓋基板12做為一半導體裝置之電 極。當以高電力來使用一包含該等發光二極體之型態的半 導體裝置時，常常使用複數個半導體裝置，同時串聯連接 該複數個半導體裝置。 在本具體例之結構中，當串聯連接該等半導體裝置時， ❺该等裝置係排列成如下。特別地，如圖】及2所示，將該 等底邛基板11連結至該管集箱3，以便使在它們的寬度 方向上所延伸之底部基板丨丨的中心線彼此對齊，以及排 歹]在„亥底。卩基板之寬度方向上所相鄰之封裝體1，相 對於該中心線彼此交錯排列該等覆蓋基板12之位置。再 者，在一對相鄰封裝體丨中，使一個封裝體之底部基板 11/、另封裝體之覆蓋基板12經由一設有第一連接導體 之連接板5而彼此電性連接。為了在該等相鄰封裝體j中 避免该等底部基板π間之互相接觸及該等覆蓋基板12間 97130230 20 200939419 之互相接觸’形成-要料電性絕緣之空隙或在該等相鄰 封裝體1間插入一由絕緣材料所製成之絕緣膜。 ' 該等連接板5之每一連接板連續地且整合地包括一與 •該底部基板11之正面重疊之底部側片5a、一與該覆蓋基 板12之正面重疊之覆蓋側片讥以及一具有對應於在該^ 部基板11之正面與該覆蓋基板12之正面間的階梯的長度 且連結該底部側片5a至該覆蓋側片5b之接合片5c。藉 由彎曲-金屬板來製造該連接板5，其中該金屬板係由銅 〇或，合金以帶狀所形成。在該連接板5之底部侧片5&及 覆蓋側片5b之每一片中形成一通孔5d。 為了使該底部基板U經由具有前述幾何結構之連接板 5電性連接至該覆蓋基板12，在該底部基板^之正面上 疊置該連接板5之底部側片5a，以及在該覆蓋基板Μ之 正面上疊置該連接板5之覆蓋侧片5b。將穿過該通孔％ 之連接螺釘6旋入該底部側連接孔2卜以及將穿過該通 ❹孔5 d之連接螺釘6旋入該覆蓋侧連接孔2 2。 上使該等相鄰封裝體丨經由該連接板5連接在一起，藉以 /等相郴封裝體丨中使該底部基板丨丨與該覆蓋基板Μ彼 此連接，以及最後可串聯連接在該複數個封裝體i中之紫 •外線發光二極體2。再者’排列該等封裳# 2，以便（相對 .於圖1及2之垂直方向）相對於在該等封裝體丨之排列方 向上所對齊之該底部基板11的中心線使該等覆蓋基板12 之位置成為交錯排列，藉以可只經由該等連接板5串聯連 接該等封裂體’每一連接板5具有這樣的簡單幾何結構， 97130230 21 200939419 =使並列相鄰之底部側連接孔21及覆蓋側連接孔 連此外，由於在該等覆蓋基板12令之位置關係，可 一 f更發現到錯誤佈局；因此，可減輕錯誤連接之風險。 ❹ 在上述具❹i中，把在該封裝體i中之該底部基板u 、目對於該覆蓋基板12之表面當做—接觸面U。然而， 亦可把該底部基板11之相鄰於該覆蓋基板12所提供之表 ㈣表面當做該接觸面25。例如，亦可以把該底部基板 之-縱端面當做該接觸面25 ’以及亦可以在該接觸面 中&供該等循環孔口 16。此外，亦可以在該底部基板工工 之個別縱端面上提供該等循環孔口 16，以取代在一表面 上？列提供該兩個循環孔口 16，以及亦可以與該等個別 循壞孔口 16 -致的數目2來提供管集箱3。此外，在前 述v、體例中’在該封裝體！中提供該等凹部及μ。然 而，亦可以在該管集箱3中提供該等凹部23及24，或^ 亦可以在該封裝體i及該管集箱3兩者中提供該 ο 23 及 24 。 前述具體例已描述關於串聯連接在該封裝體丨中所容 納^紫外線發光二極體2的情況做為一實施例。然而，當 以並列方式排列該等紫外線發光二極 使在該等個別封裝體η之覆蓋基板12的位置 該底部基板11之寬度方向上所延伸之中心線；以及連接 覆蓋基板至一橫跨該全部排列封裝體i之連接導體（一帶 狀金屬板）。再者，在此情況中，該等底部基板u在該等 相鄰封裝體1中可以彼此接觸。另外，該等覆蓋基板12 97130230 22 200939419 亦可以在該等相鄰封裝體1中彼此接觸。因此，該等封裝 體1之排列密度會比串聯連接該等發光二極體之情況高。 此外，至於該管集箱3，可使用一像合成樹脂及陶瓷等 之絕緣材料來提供該管集箱3之全部’以取代該由金屬材 料所製成之支撐基座3a及該由絕緣材料所製成之間隔物 3 b之使用。 如以上所述，在此具體例中，由該底部基板丨丨及該覆 蓋基板12來裝配做為半導體裝置之紫外線發光二極體的 電極。因此，相較於個別提供端子之結構，該結構係簡單 的，以及可抑制製造程序之數目的增加。再者，因為以該 金屬板提供該封裝體1，所以甚至在該封裝體容納一像高 強度紫外線發光二極體2之功率元件的情況中，可維持散 熱性能。結果，可抑制由溫度上升所造成之光強度的變差。 ❹ 此外，因為以該底部基板u及該覆蓋基板12提供該紫 外線發光二極體2之電極，以及因為該底部基板u及該 覆蓋基板12係、形成為矩形形狀及在該管集|g 3上所安裝 之底部基板11上朝它的厚度方向堆疊該覆蓋基板12 ,戶^ 以可藉由在該管集箱3之安裝面上排列多個元件，輕易地 使該裝置形成為一狹長形壯。纟士里 __ ^ 贡小狀結果，可以期望形狀形成紫 外線或可見光之狹長光源。此外，因為在該等相鄰封裝體 1間只形成小的間隔，所以可提供一沿著縱向具有 均勻光強度的狹長光源。 再者’以穿過該底部基板U之安裝螺釘19將該封裝體 固疋至該管集箱3’以便該等電極之連接不需要焊料接 97130230 23 200939419 合。因此，在該底部基板11與該管集箱3間會有高的固 定強度及針對維修目的可輕易實施這些零件之組裝及拆 卸。 (第二具體例） 該第一具體例已提出經由該等連接板5使該等底部基 板11與該等覆蓋基板12彼此電性連接之實施例，其中該 等連接板5係與s亥等封裝體^分開之元件。然而，在本具 體例中’如圖6及7所示，從該等個別覆蓋基板Μ連續 且正〇地延伸之連接片7做為該等第一連接導體以取代 連接板5’使該等底部基板11與該等覆蓋基板12彼此連 接在之特別地，該連接片γ從縱向上遠離該底部基板 11之中〜的該覆蓋基板12的一端之側面朝該底部基板u 〇寬度方向延伸。在本具體例中，在該覆蓋基板12中沒 有形成該覆蓋侧連接孔22，以及在該連接片7之一末端 中形成一通孔7a。 2 了串聯連接該等半導體裝置，朝該底部基板11之寬 又^向並列地排列該複數個封裝體卜在該相鄰封裝體i 7 ® 板1 1上唛置從該覆蓋基板1 2所延伸之連接片 7am將—穿過在該連接片7之末端中所開出之通孔 特麻螺、釘8 %人該底部基板U之底部側連接孔2卜 該等相鄰封裝體1中之-的覆蓋基板12上 1卜連接至3 —封裝冑1之底部基板 错以串聯連接該兩個封裝體i。 :由連接之重複’可串聯連接該複數個封裝體卜如同 97130230 24 200939419 在該第一具體例中，必須排列該等封裝體，以便該等覆蓋 基板12之位置變成交錯排列。然而，甚至當該等覆蓋基 .板丨2之位置變成彼此不同時，必須使該等連接片7朝相 .同方向突出。因此，需要在覆蓋基板12上具有彼此不同 的連接片7之位置的兩種型態之封裝體1。 &著該底部基板11之寬度方向一個一個地排列該兩種 型態之封裝體1，以便可串聯連接該等相鄰封裝體丨。再 者，在該底部基板U之正面上疊置從該覆蓋基板12所延 伸之連接片7。因此，使該連接片7與該底部基板u分 開有一對應於該絕緣材料層丨3之厚度的數量。因為該絕 緣材料層13之厚度係微小的，所以沒有特別的問題產 生；然而，在該等連接片7中產生應力。 為了防止在該等連接片7中之應力的發生，基本要求是 在該連接片7與該底部基板11間插入-由導電材料所製 成之間隔物或在該連接片7之中間區域產生一階梯，其中 ❹該導電材料之厚度等於該絕緣材料13之厚度。在其^方 面，該第二具體例之結構及操作係相同於該第一具體例。 (第三具體例） ' 在前述具體例中，從該底部基板11之沿著它的寬产方 •向的中心線至該覆蓋基板12在縱向上之個別端緣的=離 =不同的。在本具體例中，如圖^及8Β所示使該底部 J反11之沿著它的寬度方向之中心線與該覆蓋基板U之 沿著它的寬度方向之中心線對齊，以便從該底部基板u 之中心線至該覆蓋基板J 2在縱向上之個別端緣的距離係 97130230 25 200939419 相同的。另一方面，為了避免在這樣的結構中該底部側連 接孔21被該覆蓋基板12所覆蓋，在該覆蓋基板12上形 • 成—孔別以暴露該底部側連接孔21。 乂 • 如圖8A所示，該孔26可以一具有大於該連接螺釘6之 頭邛的直徑之通孔所形成，以便該連接螺釘6沒有接觸該 通孔，以及如圖8B所示，該孔26可以一具有比該連接螺 釘6之頭部的直徑寬之開口寬度的切口所形成，以便該連 $螺釘6沒有接觸該士刀口。在此，該通孔表示一種周圍壁 完全包括該孔之内部空間的結構，然而該切口表示一種周 圍壁之一部分係開放的結構。附帶地，雖然像圖⑽所示 f切口的孔26在該覆蓋基板12之縱端面上係開放的，但 是可使用一種使該孔26朝該覆蓋基板12在寬度方向之一 侧面開放之結構。 在本具體例中，在做為支撐基座之管集箱3上安裝該封 ^體1的結構係相似於該第一具體例。為了串聯連接該等 ❹，外線發光二極體2，如旧所示，經由該連接板5連接 ^該等相鄰封裝體1中之底部基板11及覆蓋基板12。在 ^ 一具體例所示之配置中，該覆蓋基板12不是位於在 相鄰封裝體1中該連接板5之底部侧片5a所配置之 •^上。目此’不需要考量在該底部側片5 .f ^封裝體i中所提供之覆蓋基板緣底 甚龙Γ面，在本具體例中，因為使該底部側片5a與該覆 盘基板12部分重叠，所以需要考量它們之間的絕緣。 於是，需要將該底部基板U與該覆蓋基板12間之空隙 97130230 26 200939419 設定成大於該底部側片5a之厚度及將該等相鄰封裝體i 中之覆蓋基板12間的空隙設定成大於該接合片5c之厚 度。以該絕緣材料層13之厚度獲得該底部基板丨丨與該覆 盍基板12間之空隙（見圖3及4)。藉由在該管集箱3上 之封裝體1間設定大的距離或者藉由使該覆蓋基板12之 見度小於該底部基板11之寬度，以獲得該等相鄰覆蓋基 板12間之空隙。 1 相似於該第一具體例，藉由上述之結構，可經由該連接 〇板5電性連接在該等相鄰封裝體i中之底部基板u及覆 蓋基板12。再者，縱使使用金屬連接螺釘6，藉由形成該 孔26,可防止在該相同封裝體！中之底部基板u與覆蓋 基板12間之短路。因此，相似於該第—具體例，可串聯 連接該等紫外線發光二極體2。在其它方面，該第三具體 例之結構及操作相同於該第一具體例。 (第四具體例） ❿本具體例顯示—種並聯連接該等紫外線發光二極體2 雖然前述具體例在該底部基板11中形成該等底 '貝接孔2卜在本具體例沒有形成該底部侧連接孔 =於是’相較於前述具體例，可減少該底部基板U之 •連':二見方二在該覆蓋基板12中仍然形成該覆蓋侧 座2二所3矛上’_於該第一具體例，彻 在/袭該封褒體1 ’該等安裝螺釘19穿過 p基板11之相對縱端中所形成之安裝孔18及將該 97130230 27 200939419 等安裝螺釘〗9旋入該管隼 該等封裝體i，排列該等封^體。要在該管集箱3上安裝 接孔22沿著該管集箱3之縱向對齊以便使該等覆蓋侧連 在並％連接该等紫外線發光二 了在該等相鄰排列之封裝體體二之本具體例中’為 連接，使用下面結構。 吏部基板11彼此Further, since the cover substrate is stacked on the base substrate mounted on the support base, a slit configuration can be obtained by arranging a plurality of packages on the mounting surface of the support base. Further, by arranging the packages without forming a space between adjacent base substrates, the semiconductor elements can be mounted at a high density. Thus, when the semiconductor elements are light-emitting elements such as light-emitting diodes, a narrow light source can be easily obtained. Further, the unevenness of the light intensity along the direction can be suppressed by narrowing the interval between the adjacent light-emitting diodes. According to the second aspect of the present invention, the use of a metal package in the body of a light-emitting diode can improve the heat dissipation performance and suppress the temperature of the light-emitting diode. As a result, a light-emitting diode can be used to obtain a high-output light: , in other words, when the temperature of the light-emitting diode is increased, the light-emitting efficiency of the light-emitting diode is lowered. In the present invention, even when a high-current, high-heat-dissipating sealed body can be suppressed, it is possible to maintain a high output of high light emission efficiency. 97130230 200939419 According to the present invention The third aspect 'when the bottom substrate can be fixed to the support base by the mounting screws, the base substrate can be improved to the support base, and the fixing strength can be improved. Furthermore, for the sake of the secret, the bottom substrate can be separated from the base of the stand and reattached to the base of the stand. In addition, since the first connection conductor can be mounted on the cover substrate by the first connection screw, the cover substrate can be reliably electrically connected by forming intimate contact between the cover substrate and the first connection conductor. And the first connecting conductor. According to a fourth aspect of the present invention, a stack (4) bottom substrate, the bottom substrate is electrically connected to an electrode of the half body member, and the cover substrate, and a center line of the cover substrate relative to the bottom substrate Arranged in an asymmetrical shape, wherein the center line extends in a direction in which the bottom substrate is arranged on the base of the branch. As a result, when the packages are arranged on the base of the stand, the presence of the misalignment can be easily determined by visual inspection of the positions of the cover substrates. Furthermore, one end of the first connecting conductor electrically connected to a cover substrate is connected to the bottom σ substrate by the connecting screw in the adjacent packages. As a result, erroneous connections between the packages can be prevented unless the misalignment of the package on the support pedestal is caused. Furthermore, the adjacent packages are mechanically and electrically connected. In addition, since the bottom substrate and the cover substrate constituting a package are respectively connected to the two electrodes of the semiconductor, the semiconductor structure can be simplified and manufactured compared to the structure for providing the individual terminals. The increase in the number of programs during the period will be a small spoon. In addition, since the package is provided with a metal plate, it exhibits enhanced heat dissipation and power components can be applied to the package. 97130230 11 200939419 - According to a fifth aspect of the present invention, since the π-substrate is disposed in the asymmetric shape, a large-sub-region on the side of the base substrate opposite to the center line is overlapped with the cover substrate Putting together, but leaving most of the area on the bottom substrate; the other side is not overlapped with the cover substrate and f is exposed, so the package can be observed according to the appearance (four) direction. In other words, when the base substrate and the cover substrate are joined to other parts, the erroneous connection between the package and the other parts can be easily found. Further, the bottom side connecting hole is formed at a position in the bottom substrate where the covering substrate is not stacked. By forming the bottom side connecting hole at a position where most of the area is exposed in the bottom substrate, the distance between the second connecting screw screwed into the bottom side connecting hole and the a cover substrate can be lengthened In order to easily provide electrical insulation. According to a sixth aspect of the present invention, the hole is formed at a position (4) of the cover substrate which is placed on the bottom side connecting hole so that the cover plate is not in contact with the second connecting screw. Therefore, the second connecting screw/there is contact with the covering substrate and prevents short circuit between the bottom substrate and the covering substrate without using a material for the second connecting screw. According to a seventh aspect of the present invention, the bottom side-connection hole is formed in the bottom substrate towel, and the cover side connection hole is formed in the cover substrate, and the relative line is opposite to the center of the base substrate. The bottom side connecting hole and the covering side connecting hole are formed on the side. Therefore, the first connecting conductors can be easily mounted to electrically connect the bottom substrate and the covering 97130230 12 200939419 in adjacent packages in the state in which the packages are mounted on the supporting base. Cover the substrate. In other words, by connecting one end of the connecting conductor with the second connecting screw and the other end of the first connecting screw/connecting first connecting plate and the covering plate, the phase can be connected in series = Mounting. Furthermore, by arranging the first connecting plates so that the bottom substrates are electrically connected to each other and the 'coverings: 电 are electrically connected to each other, the adjacent packages can be connected in parallel. According to the first aspect of the present invention, since the base substrate is electrically connected to the base of the branch formed of a metal material, the support base performs electrical connection between the base substrates. In other words, it is not necessary to use a plurality of electrical components to connect the adjacent base substrates to each other so as to connect the adjacent packages in parallel. Therefore, the number of parts can be reduced. Furthermore, although this structure can be used only in the case where the packages are connected in parallel, since the bottom side connection holes are unnecessary, the base substrates can be miniaturized. In addition, since the base substrates are in direct contact with the support base, high heat dissipation performance is also desired. According to the ninth aspect of the present invention, by using the support base formed of the insulating material, electrical connection can be freely selected between the adjacent packages. According to a tenth aspect of the present invention, the packages are mounted on the base of the stand such that the center lines of the bottom substrates are aligned with each other, and the first connecting conductors are connected across the plurality of packages to connect the same A plurality of packages are provided, so that only the first connecting conductors of the straight line are provided to connect the germanium-covered substrates to each other in the adjacent packages. Therefore, the packages are easily connected in parallel. According to an eleventh aspect of the present invention, the cover substrates are electrically connected to each other via the first connecting conductor in the plurality of packages, and the bottom substrates are also passed through the second connecting conductors. They are electrically connected to each other, so that the plurality of packages can be connected in parallel by two connecting conductors. Furthermore, by coupling the second connecting conductor to the bottom substrate with mounting screws for mounting the bottom substrate on the supporting base, the fixing of the bottom substrate and the The connection of the second connecting conductor. Therefore, ο 1 is different from the case where the second screw is separately provided for connecting the second connecting conductor and the bottom substrate, because the bottom side connecting hole is unnecessary, so the number of parts is reduced and the size can be miniaturized. Bottom substrate. According to a twelfth aspect of the present invention, the adjacent packages are arranged such that the center lines of the base substrates are aligned with each other and staggered with respect to the center lines + the positions of the cover substrates can be Connecting the bottom substrate and the cover substrate and the first connecting conductor to connect the packages in series, wherein the first connection is straight when viewed from a front side of the adjacent packages. In other words, since the semiconductors are connected to the shorting conductors, it is possible to suppress the electric connection at the first connecting conductor == to prevent the erroneous connection. Furthermore, the presence of the erroneous connection can be checked only by visual inspection of the position of the overlay substrate 1. Therefore, the misalignment can be prevented when it is matched. Body plate 2:: 』: 12-state ‘Because the first-connected conductor is provided separately, the shape of the package can be simplified. According to the fourteenth energy medium conductor (4) brand of the present invention, the first connection body/the package body is integrally provided, so that in addition to the reading of the singer, a scar is not included in the connection screw. Installation of the components of 97130230 200939419 is not required. Further, the packages of the adjacent pairs can be connected by only one connecting screw to easily perform the connecting work. [Embodiment] (First Specific Example) The packaged limb is described as an embodiment in the case where the package described below is used to accommodate an ultraviolet light-emitting diode as a semiconductor element. In the present invention, , not only the external light emitting diode that emits light in the ultraviolet wavelength range, but also a light emitting diode different from the ultraviolet light emitting diode (for example, a light emitting diode emitting light in a visible wavelength range) ) to form the package. As shown in FIG. 3 to FIG. 5C, a package body j is constructed by stacking a P substrate 11 made of a metal plate on which an ultraviolet light emitting diode 2 is mounted, and a bottom substrate 11 is surrounded by a substrate. a cover substrate 12 made of a metal plate in a region corresponding to the outer LED 2 of the outer ring and a cover between the base substrate u and the cover substrate 12 and having the base substrate n interposed therebetween A multilayer product produced by the insulating material layer 13 insulated from the cover substrate 12. Since it is desired that these substrates use a material having a high conductivity and the same conductivity, the base substrate 11 and the cover substrate 12 are made of a copper element or a copper alloy. As shown in Figure 3, the electrode (anode) of the ultraviolet light-emitting diode 2 is directly connected to the bottom substrate by die bonding. The ultraviolet light emitting diode is connected to the disk substrate 12 via the other electrode (cathode). In other words, the electrode of the ultraviolet light-emitting diode It 2 is electrically connected to the bottom base & u, and the other electrode of the ultraviolet light-emitting diode 97130230 15 200939419 body 2 is electrically connected to the cover substrate 12 . An exposure hole 14 is formed in the cover substrate 12 to expose the ultraviolet light-emitting diode 2 mounted on the bottom substrate 11. The inner peripheral surface of the exposure hole 14 is tapered so that the inner diameter of the exposure hole 14 becomes larger as the distance from the base substrate 11 increases. As a result of mounting a flood lens 15 having a convex (eg, spherical) outer surface in the exposure hole 14, the ultraviolet light emitting diode 2 is received by the base substrate 11, the cover substrate 12, and the The enclosed space surrounded by the flood lens 丨5 is protected from the environment (such as moisture). The luminous intensity distribution of the light irradiated from the ultraviolet light-emitting diode 2 can be controlled by adjusting the position and characteristics of the flood lens 15 or the angle of inclination or reflection of the inner peripheral surface of the exposure hole 14. The package also serves as a heat sink. A pair of circulation orifices 16 are formed in the back surface of the base substrate (relative to the surface of the base substrate 11 on which the surface of the cover substrate 12 is stacked), and each of the circulation orifices 6 is a circular opening. A flow channel 17 is formed in the bottom substrate 11 for establishing communication between the circulating orifices i6. Forming each flow channel 丨7 so that the channel passes through the vicinity of the bottom substrate 11 on which the ultraviolet ray-emitting diode 2 is mounted, thereby improving the fluid flow for the purpose of cooling the flow channel 丨7 - 6 糸The extent to which the external light illuminates the heat between the two poles. Water can be used as the cooling fluid, but a different substance than water can be used as long as the substance is in a liquid state at room temperature and exhibits a specific heat capacity close to 1. As shown in FIGS. 5A to 5C, in the present embodiment, when viewed from the front of the flood lens 15, the bottom substrate u and the cover substrate 12 are formed into a rectangular shape and have substantially the same width. . However, the bottom substrate π and the cover substrate 12 have different lengths from each other, and the bottom substrate 丨1 is formed longer than the cover substrate 12. Further, the position of the center of the length of the base substrate 11 is different from the position of the center of the length of the cover substrate 12 or, in other words, one end of the cover substrate 12 in the longitudinal direction extends along the longitudinal direction thereof to the base substrate u One side. The center of the floodlight lens 15 is aligned to the center of the length of the base substrate 11. The two % orifices 16 are formed while being separated from each other along the longitudinal direction of the base substrate 11. A mounting hole 18 is formed in each longitudinal end of the base substrate 11. Further, a bottom side connecting hole 21 which is a screw hole is opened in the base substrate 11, and a covering side connecting hole 22 which is a screw hole is opened in the cover substrate 2. The bottom side connecting hole 21 and the covering side connecting hole 22 are positioned between the center of the length of the base substrate 11 and the individual mounting holes 18. The distance from the center of the length of the base substrate 11 to the bottom side connecting hole 21 is equidistant from the distance from the center of the length of the base substrate 11 to the covering side connecting hole 22. The bottom side connecting hole 21 and the covering side connecting hole 22 are provided to electrically connect the ultraviolet light emitting diode 2 to another member. • As a result, when viewed from the front side of the flood lens 15, the mounting hole 18, the bottom side connecting hole 21, and the covering side are positioned in a manner symmetrical with respect to the center line extending along the width direction of the base substrate 11. The connection hole and the flood lens 15 are provided. At the same time, the cover 97130230 17 200939419 substrate 12' is placed and arranged in asymmetrical manner to the center line extending along the width direction of the base substrate 11 so as to straddle the center line. That is, the distance from the center line to one end of the cover substrate 12 in the longitudinal direction is different from the distance from the center line to the other end of the cover substrate 12. In other words, the cover substrate-plate 12 is superposed on the base substrate 11 so that the cover substrate 12 is on one end in the longitudinal direction of the base substrate u except for the area where the mounting aperture 8 is exposed. A majority of the area of the base substrate 11 is covered, however, the mounting hole 18 and the bottom side connecting hole 21 are exposed at the other end in the longitudinal direction of the base substrate 11. The cover substrate ❹12 is stacked on the base substrate ,, and the bottom side connection hole 21 is opened in the base substrate 11. The cover side connecting hole 22 is opened in the cover substrate 12, and the hole side faces of the bottom side connecting hole 21 and the cover side connecting hole 22 have different heights from each other with respect to the thickness direction of the base substrate 11. Incidentally, circular opening recesses 23 and 24 are formed around the individual circulation orifices 16. In other words, individual circulation orifices 16 such as weirs are opened in the inner bottom surfaces of the recesses 23 and 24, and the individual circulation orifices 16 are collectively formed on the individual recesses 23 and 24. As shown in Figures 1, 2 and 3, the packages are coupled to a header 3 during use of the packages to allow for a % of the cooling fluid. The tube header 3 is a support-supporting base on which the packages 1 are juxtaposed, and a support base 3a made of a metal material and an insulating material are fixed by a coupling screw 3c. The spacer L formed by the spacer 3b is screwed into the spacer 3b via the support base 3a. The official box 3 is not limited to the above shape. As long as the attachment of the package body 31 becomes a flat surface, the cross-sectional profile of the header 3 is not limited by the specific restrictions 97130230 18 200939419. A supply path 32 and a discharge path 33 for circulating the cooling fluid are formed in the header 3 . A supply port 34 that communicates with the supply path 32 and a discharge port 35 that communicates with the helium discharge path 33 are opened at appropriate positions of the mounting surface 31 of the header 3, for simplicity of the representation, from FIG. This spacer 3b is omitted. The supply ports 34 and the discharge ports 35 are opened in a circular shape, respectively. The diameter of the ports is substantially equal to the diameter of the circulating orifices 16. The distance between the supply port 34 and the discharge port 35 is equal to the distance between the circulation orifices 16 formed in the package 1. An array of ports (e.g., 10 sets) formed by the supply port 34 and the discharge opening 35 is formed in the header 3 . In order to connect the package 1 to the header 3, the contact surface 25 of the pair of circulating apertures 16 is in contact with the mounting surface 31 of the header 3 and through the mounting holes 18 Screw the mounting screw 19 into the header 3 . At this time, the axis of the supply port 34 which is opened in the mounting surface 31 of the header 3 and belongs to a group and the axis of the discharge port are aligned to the circulation orifice 16 of the package 1. Individual axis. A rubber-elastic annular ring-shaped ring 4 is mounted into the individual recesses 23 and -24, and the package body is coupled to the header 3 so as to be in the inner bottom surface of the recesses 23 and 24 The 0-ring 4 is pressed between the mounting faces 31 of the header 3 so that the supply port and the discharge port 35 are coupled to the corresponding circulation orifices 16 without a gap. Between the support base 3a of the header 3 and the spacer 3b, a circulation port 16 for connecting the package 1 to the supply port 34 and the discharge port 35 of the header 3 is also used for 97130230 19 200939419. structure. In particular, the supply path 32 and the discharge path 33 must be interconnected at the support base 3a and the spacer. Therefore, as shown in Fig. 3, a recess 36 is formed in the support base 3a at a position where the supply path 32 and the discharge path 33 are to be coupled to each other on the support base 3a and the spacer 3b. A ring-shaped 环-shaped ring 37 disposed in the individual recesses % is sandwiched and pressed between the support base 3a and the spacer 3b. Incidentally, since the bottom substrate Π and the cover substrate 12 are electrically connected to the electrodes of the ultraviolet ray-emitting diode 2, the bottom substrate 11 and the cover substrate 12 in the package ι are used as a semiconductor device. electrode. When a semiconductor device including the type of the light-emitting diodes is used with high power, a plurality of semiconductor devices are often used while the plurality of semiconductor devices are connected in series. In the configuration of this specific example, when the semiconductor devices are connected in series, the devices are arranged as follows. Specifically, as shown in FIGS. 2 and 2, the base substrate 11 is joined to the header 3 so that the center lines of the bottom substrate 延伸 extending in the width direction thereof are aligned with each other, and drained. In the package body 1 adjacent to the width direction of the substrate, the positions of the cover substrates 12 are staggered with respect to the center line. Further, in a pair of adjacent package bodies, The bottom substrate 11 of one package and the cover substrate 12 of the other package are electrically connected to each other via a connecting plate 5 provided with a first connecting conductor. In order to avoid the bottom substrate π in the adjacent packages j The mutual contact and the mutual contact between the cover substrates 12 97130230 20 200939419 'forms--internally electrically insulating the gaps or insert an insulating film made of an insulating material between the adjacent packages 1 '. Each of the connecting plates 5 continuously and integrally includes a bottom side piece 5a overlapping the front surface of the bottom substrate 11, a cover side piece 重叠 overlapping the front surface of the cover substrate 12, and a corresponding one. On the substrate 11 a length of a step between the front surface and the front surface of the cover substrate 12 and connecting the bottom side sheet 5a to the joint sheet 5c of the cover side sheet 5b. The connecting sheet 5 is manufactured by bending a metal sheet, wherein the metal sheet is made of A copper beryllium or alloy is formed in a strip shape. A through hole 5d is formed in each of the bottom side sheet 5& and the covered side sheet 5b of the connecting plate 5. In order to pass the bottom substrate U through the connecting plate having the aforementioned geometric structure 5 electrically connected to the cover substrate 12, the bottom side piece 5a of the connecting plate 5 is superposed on the front surface of the bottom substrate, and the cover side piece 5b of the connecting plate 5 is superposed on the front surface of the cover substrate The connecting screw 6 passing through the through hole % is screwed into the bottom side connecting hole 2 and the connecting screw 6 passing through the through hole 5 d is screwed into the covering side connecting hole 2 2 . The adjacent packages 连接 are connected together via the connecting board 5, and the bottom substrate 丨丨 and the cover substrate Μ are connected to each other in the /isophase package, and finally connected in series in the plurality of packages i Purple • External light-emitting diodes 2. Again, 'arrange these Skirt #2 so that the positions of the cover substrates 12 are staggered with respect to the center line of the base substrate 11 aligned in the direction in which the packages are arranged (relative to the vertical direction of Figs. 1 and 2). Therefore, the splitting bodies can be connected in series only via the connecting plates 5. Each connecting plate 5 has such a simple geometric structure, 97130230 21 200939419 = the side-by-side connecting holes 21 and the covering side connecting holes are juxtaposed adjacent to each other. In addition, due to the positional relationship of the cover substrates 12, an erroneous layout can be found; therefore, the risk of erroneous connections can be mitigated. ❹ In the above, the bottom substrate in the package i u, for the surface of the cover substrate 12 as a contact surface U. However, the surface of the bottom substrate 11 adjacent to the surface (4) provided by the cover substrate 12 may also be regarded as the contact surface 25. For example, the longitudinal end face of the base substrate can also be regarded as the contact face 25' and the circulating orifices 16 can also be provided in the contact face. In addition, it is also possible to provide the circulating orifices 16 on the individual longitudinal end faces of the bottom substrate worker instead of on a surface. The column provides the two circulating orifices 16, and may also provide the header 3 with the number 2 of the individual orifices. In addition, in the above v, the system is in the package! These recesses and μ are provided. However, the recesses 23 and 24 may also be provided in the header 3 or may be provided in both the package i and the header 3 . The foregoing specific example has been described as an embodiment in which the ultraviolet light-emitting diode 2 is accommodated in series in the package. However, when the ultraviolet light-emitting diodes are arranged in a side-by-side manner, the center line extending in the width direction of the base substrate 11 at the position of the cover substrate 12 of the individual package bodies n; and the connection of the cover substrate to a span The connection conductors (a strip-shaped metal plate) of the package i are all arranged. Further, in this case, the base substrates u may be in contact with each other in the adjacent packages 1. In addition, the cover substrates 12 97130230 22 200939419 may also be in contact with each other in the adjacent packages 1 . Therefore, the arrangement density of the packages 1 is higher than in the case of connecting the light-emitting diodes in series. In addition, as for the header 3, an insulating material such as synthetic resin and ceramic may be used to provide all of the headers 3 to replace the support base 3a made of a metal material and the insulating material. The use of the spacer 3b produced. As described above, in this specific example, the electrode of the ultraviolet light-emitting diode of the semiconductor device is assembled from the base substrate 丨丨 and the cover substrate 12. Therefore, the structure is simpler and the number of manufacturing processes can be suppressed as compared with the structure in which the terminals are individually provided. Furthermore, since the package 1 is provided by the metal plate, the heat dissipation performance can be maintained even in the case where the package accommodates a power element such as the high-intensity ultraviolet light-emitting diode 2. As a result, deterioration of the light intensity caused by the temperature rise can be suppressed. Further, since the electrode of the ultraviolet light-emitting diode 2 is provided by the base substrate u and the cover substrate 12, and the base substrate u and the cover substrate 12 are formed in a rectangular shape and in the tube set |g 3 The cover substrate 12 is stacked on the bottom substrate 11 mounted thereon in the thickness direction thereof, and the device can be easily formed into a narrow shape by arranging a plurality of components on the mounting surface of the header 3 strong. Gentleman __ ^ As a result of the small shape, it is expected that the shape will form a narrow light source of ultraviolet rays or visible light. Furthermore, since only a small space is formed between the adjacent packages 1, an elongated light source having uniform light intensity along the longitudinal direction can be provided. Further, the package is fixed to the header 3' by a mounting screw 19 passing through the base substrate U so that the connection of the electrodes does not require solder joints 97130230 23 200939419. Therefore, there is a high fixing strength between the base substrate 11 and the header 3 and assembly and disassembly of these components can be easily performed for maintenance purposes. (Second Specific Example) The first embodiment has proposed an embodiment in which the base substrate 11 and the cover substrates 12 are electrically connected to each other via the connection plates 5, wherein the connection boards 5 are connected to shai, etc. The package is a separate component. However, in this embodiment, as shown in FIGS. 6 and 7, the connecting sheets 7 extending continuously and positively from the individual cover substrates are used as the first connecting conductors instead of the connecting plates 5'. Specifically, the base substrate 11 and the cover substrates 12 are connected to each other, and the connection piece γ extends from the side of one end of the cover substrate 12 of the base substrate 11 in the longitudinal direction toward the width direction of the base substrate u. In the present embodiment, the cover side connecting hole 22 is not formed in the cover substrate 12, and a through hole 7a is formed in one end of the connecting piece 7. 2, the semiconductor devices are connected in series, and the plurality of packages are arranged side by side toward the width of the bottom substrate 11 and disposed on the adjacent package i 7 ® board 1 1 from the cover substrate 1 2 The extending connecting piece 7am will pass through the through hole of the connecting piece 7 and the bottom side connecting hole 2 of the bottom substrate U of the 8% of the connecting piece 7 The cover substrate 12 is connected to the bottom substrate of the package 1 to connect the two packages i in series. The plurality of packages can be connected in series by the repetition of the connection as in the case of 97130230 24 200939419. In the first embodiment, the packages must be arranged such that the positions of the cover substrates 12 become staggered. However, even when the positions of the cover bases 2 become different from each other, it is necessary to cause the connecting pieces 7 to protrude in the same direction. Therefore, two types of packages 1 having positions of the connecting sheets 7 different from each other on the cover substrate 12 are required. The packages 1 of the two types are arranged one by one in the width direction of the base substrate 11 so that the adjacent package bodies can be connected in series. Further, a connecting sheet 7 extending from the cover substrate 12 is stacked on the front surface of the base substrate U. Therefore, the connecting piece 7 is separated from the base substrate u by a number corresponding to the thickness of the insulating material layer 3 . Since the thickness of the insulating material layer 13 is minute, no particular problem occurs; however, stress is generated in the connecting sheets 7. In order to prevent the occurrence of stress in the connecting sheets 7, a basic requirement is to insert a spacer made of a conductive material between the connecting sheet 7 and the base substrate 11 or to generate a spacer in the middle of the connecting sheet 7. a step wherein the thickness of the conductive material is equal to the thickness of the insulating material 13. In its aspect, the structure and operation of the second embodiment are the same as in the first embodiment. (Third Specific Example) ' In the foregoing specific example, the distance from the center line of the base substrate 11 along the wide side thereof to the individual end edges of the cover substrate 12 in the longitudinal direction is different. In this embodiment, as shown in FIGS. 8 and 8A, the center line of the bottom J reverse 11 along its width direction is aligned with the center line of the cover substrate U along its width direction so as to be from the bottom. The distance from the center line of the substrate u to the individual end edges of the cover substrate J 2 in the longitudinal direction is the same as 97130230 25 200939419. On the other hand, in order to prevent the bottom side connecting hole 21 from being covered by the cover substrate 12 in such a structure, a hole is formed in the cover substrate 12 to expose the bottom side connecting hole 21.如图• As shown in FIG. 8A, the hole 26 may be formed with a through hole having a diameter larger than the diameter of the head 邛 of the connecting screw 6, so that the connecting screw 6 does not contact the through hole, and as shown in FIG. 8B, the hole The 26 may be formed by a slit having a wider opening width than the diameter of the head of the connecting screw 6, so that the connecting screw 6 does not contact the knife edge. Here, the through hole indicates a structure in which the surrounding wall completely includes the inner space of the hole, but the notch indicates a structure in which one of the peripheral walls is open. Incidentally, although the hole 26 of the f-cut as shown in Fig. 10 is opened on the longitudinal end surface of the cover substrate 12, a structure in which the hole 26 is opened toward one side in the width direction of the cover substrate 12 can be used. In the present specific example, the structure in which the sealing body 1 is mounted on the header 3 as the supporting base is similar to the first specific example. In order to connect the electrodes in series, the external light-emitting diodes 2 are connected to the base substrate 11 and the cover substrate 12 in the adjacent packages 1 via the connecting plate 5 as shown. In the configuration shown in a specific example, the cover substrate 12 is not disposed on the bottom side sheet 5a of the connecting board 5 in the adjacent package 1. Therefore, it is not necessary to consider the cover substrate edge provided in the bottom side panel 5 .f ^ package i, in this embodiment, because the bottom side panel 5a and the tray substrate 12 are Partial overlap, so you need to consider the insulation between them. Therefore, the gap 97310230 26 200939419 between the base substrate U and the cover substrate 12 needs to be set larger than the thickness of the bottom side panel 5a and the gap between the cover substrates 12 in the adjacent packages i is set larger than the gap. The thickness of the engaging piece 5c. The gap between the underlying substrate 丨丨 and the overlying substrate 12 is obtained by the thickness of the insulating material layer 13 (see Figs. 3 and 4). The gap between the adjacent cover substrates 12 is obtained by setting a large distance between the packages 1 on the header 3 or by making the coverage of the cover substrate 12 smaller than the width of the base substrate 11. 1 Similar to the first specific example, the bottom substrate u and the cover substrate 12 in the adjacent packages i can be electrically connected via the connection raft 5 via the above-described structure. Further, even if the metal connecting screw 6 is used, by forming the hole 26, it is possible to prevent the same package! A short circuit between the bottom substrate u and the cover substrate 12 is obtained. Therefore, similar to the first specific example, the ultraviolet light-emitting diodes 2 can be connected in series. In other respects, the structure and operation of the third embodiment are the same as the first embodiment. (Fourth Specific Example) This specific example shows that the ultraviolet light-emitting diodes 2 are connected in parallel. Although the above-described specific example forms the bottoms of the bottom holes 11 in the specific substrate, the present example is not formed. The bottom side connecting hole = then 'relative to the foregoing specific example, the bottom substrate U can be reduced': the second side of the cover substrate 12 still forms the covering side seat 2 two 3 spears on the In a first specific example, the mounting body 19 of the sealing body 1 is inserted through the mounting hole 18 formed in the opposite longitudinal end of the p-substrate 11 and the mounting screw 9 of the 97130230 27 200939419 is screwed into the mounting hole The packages i are arranged to arrange the packages. The mounting holes 22 are arranged on the tube header 3 along the longitudinal direction of the tube header 3 so that the covering sides are connected and % connected to the ultraviolet light emitting diodes in the adjacent array of the package body 2 In the specific example, 'for connection, the following structure is used. The ankle substrates 11 are in contact with each other
正面上堆疊一以帶壯张在°亥專相鄰底部基板Π之 板9,則㈣以做4帛=連接㈣之連接 基板11因Γ / 9穿過該連接板9及該等底部 S Ut定該等底部基板11至該管集们的 叫將5亥連接板9固定至該等底部基板n。 依據上述結構’同時實 該連接板9之電性連接:因；等底福板11之固定及與 中mm 不需要像在該第—具體例 、=成用以連接該連接板9與該等底部基板u之底部側 ，孔2卜結果，可小型化該底部基板11，再者，因為 不需要連接螺钉6，所以可減少零件之數目。Stacking a board 9 on the front side with a sheet of slabs adjacent to the bottom substrate, and then (4) connecting the substrate 11 as 4 帛 = connection (4) because Γ / 9 passes through the connecting board 9 and the bottom S Ut The bottom substrate 11 to the tube set are fixed to the bottom substrate n. According to the above structure, the electrical connection of the connecting plate 9 is simultaneously performed: because the fixing of the bottom plate 11 and the middle mm do not need to be connected to the connecting plate 9 and the like in the first specific example. As a result of the hole 2 on the bottom side of the bottom substrate u, the base substrate 11 can be miniaturized. Further, since the screw 6 is not required to be connected, the number of parts can be reduced.
藉由^亥等覆盖基板12之正面上堆叠一以帶狀所形成 之做為第-連接導義連接板1G及使被旋人該覆蓋側連 接孔22之連接螺冑6穿過該連接& 1G，使在相鄰排列之 封裝體1中覆蓋基板12彼此電性連接。 藉由上述結構，因為經由該等連接板9使在該管集箱3 ^所安裝之封裝體丨之該等底部基板u彼此連接及經由 該等連接板10使該等覆蓋基板12彼此連接，所以可並聯 連接該等紫外線發光二極體2。附帶地，在本具體例中， 當並聯連接該等紫外線發光二極體2時，允許該等底部基 97130230 28 200939419 板11彼此接觸。再者，允許該等覆蓋基板12彼此接觸。 斤圖10所不之結構並非侷限於以一金屬材料提供該管集 相3之情況’以及它可使用於以一像合成樹脂或陶瓷之絕 .緣材料提供該管集箱3之情況。在以一導電金屬材料提供 該管集箱3之情況中，可省略用以使該等底部基板^彼 =連接之連接板9。換句話說，如圖u所示，藉由以該 專安裝螺釘則定該等底部基至該㈣箱3，以便 =該管集箱3直接接觸，使在該管集箱3上所安裝之封襄 ❹體1令的底部基板U經由該管集箱3而彼此電性連接。 因此’不需要該連接板9及減少零件之數目。此外， ，該等底部基板11與該管㈣3直接接觸，所以改善該 官集箱3之散熱性能。 ❹ 該等連接板9及1〇僅以直線帶狀所形成。因此，簡化 ，形狀及對於-管集箱3只提供—片連接板9及—片連接 板Η)紅夠的。維持小的零件數目。在其它方面，該第 四具體例之結構及操作相同於該第一具體例。 【圖式簡單說明】 ' u 的一實例使用之 圖1係顯示一第 爆炸立體圖； 一具體例之一封裝體 圖2係顯示該封裝體之實例使用的前視圖； 圖3係顯示該封裝體之實例使用的剖面圖. 圖4Α係該封裝體之正面的立體圖. 圖4Β係該封裝體之背面的立體圖； 圖5Α係該封裝體之前視圖； 97130230 29 200939419 圖5B係該封裝體之後視圖； 圖5C係該封裝體之側視圖； 圖6係顯示本發明之第二具體例的一封裝體之一實例 使用的立體圖； 圖7係顯示該封裝體之實例使用的前視圖； 圖8A及8B係本發明之第三具體例的立體圖； 圖9係顯示本發明之第三具體例的封裝體之實例使用 的立體圖； ® ® 10係顯示本發明之第四具體例的—封裝體之一實例 使用的立體圖；以及 圖Π係顯不本發明之第四具體例的封裝體之實例使用The first connection guide connecting plate 1G is formed by a strip shape on the front surface of the cover substrate 12, and the connecting screw 6 of the cover side connecting hole 22 is passed through the connection & 1G, so that the cover substrates 12 are electrically connected to each other in the adjacently arranged package 1. With the above configuration, the base substrates u of the package body mounted on the header 3^ are connected to each other via the connection plates 9, and the cover substrates 12 are connected to each other via the connection plates 10, Therefore, the ultraviolet light-emitting diodes 2 can be connected in parallel. Incidentally, in the present embodiment, when the ultraviolet light-emitting diodes 2 are connected in parallel, the bottom substrates 97130230 28 200939419 are allowed to come into contact with each other. Furthermore, the cover substrates 12 are allowed to contact each other. The structure of Fig. 10 is not limited to the case where the tube phase 3 is provided by a metal material' and it can be used for providing the header 3 with a barrier resin like a synthetic resin or ceramic. In the case where the header 3 is provided with a conductive metal material, the connecting plates 9 for connecting the base substrates can be omitted. In other words, as shown in FIG. u, the bottom base is fixed to the (4) tank 3 by the special mounting screw so that the tube header 3 is in direct contact, so that the seal is installed on the header box 3. The bottom substrate U of the body 1 is electrically connected to each other via the header 3 . Therefore, the connecting plate 9 is not required and the number of parts is reduced. Further, the bottom substrate 11 is in direct contact with the tube (4) 3, so that the heat dissipation performance of the header box 3 is improved. ❹ These connecting plates 9 and 1〇 are formed only in a straight strip shape. Therefore, the simplification, the shape, and the supply of the tube header 3 are only provided by the sheet connection plate 9 and the sheet connection plate 红. Maintain a small number of parts. In other respects, the structure and operation of the fourth embodiment are the same as the first embodiment. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows an exploded first perspective view; one specific example of a package FIG. 2 is a front view showing an example of the package; FIG. 3 shows the package. Figure 4 is a perspective view of the front side of the package. Figure 4 is a perspective view of the back side of the package; Figure 5 is a front view of the package; 97130230 29 200939419 Figure 5B is a rear view of the package; Figure 5C is a side view of the package; Figure 6 is a perspective view showing an example of a package of the second embodiment of the present invention; Figure 7 is a front view showing an example of the package; Figure 8A and 8B 3 is a perspective view showing a third embodiment of the present invention; FIG. 9 is a perspective view showing an example of a package of a third embodiment of the present invention; A perspective view used; and an example of a package in which the fourth embodiment of the present invention is not used
【主要元件符號說明】 1 封裝體 2 紫外線發光 3 管集箱 3a 支撐基座 3b 間隔物 3c 連接螺釘 4 0型環 5 連接板 5a 底部侧片 5b 覆蓋侧片 5c 接合>} 97130230[Explanation of main components] 1 Package 2 Ultraviolet light 3 Tube header 3a Support base 3b Spacer 3c Connection screw 4 0 ring 5 Connection plate 5a Bottom side piece 5b Cover side piece 5c Engagement>_1130130230
30 20093941930 200939419
5d 通孔 6 連接螺釘 7 連接片 7a 通孔 8 連接螺釘 9 連接板 10 連接板 11 底部基板 12 覆蓋基板 13 絕緣材料層 14 暴露孔 15 泛光透鏡 16 循環孔口 17 流動通道 18 安裝孔 19 安裝螺釘 21 底部侧連接孔 22 覆蓋側連接孔 23 凹部 24 凹部 25 接觸面 26 孔 31 安裝面 32 供應路徑 97130230 31 200939419 33 排放路徑 34 供應通口 35 排放通口 36 凹部 37 0型環5d through hole 6 connecting screw 7 connecting piece 7a through hole 8 connecting screw 9 connecting plate 10 connecting plate 11 bottom substrate 12 covering substrate 13 insulating material layer 14 exposing hole 15 flooding lens 16 circulation opening 17 flow channel 18 mounting hole 19 mounting Screw 21 bottom side connection hole 22 cover side connection hole 23 recess 24 recess 25 contact surface 26 hole 31 mounting surface 32 supply path 97130230 31 200939419 33 discharge path 34 supply port 35 discharge port 36 recess 37 type 0 ring
97130230 3297130230 32