200936519 六、發明說明： 【發明所屬之技術領域】 本發明特別係關於用於低溫燒成陶瓷基板等脆性材料 基板之切斷之劃線裝置及劃線方法。 【先前技術】 低溫燒成陶瓷（以下稱為LTCC)，係於混合氧化鋁之骨 ❹ 材與玻璃材料之薄板進行導體配線而成多層膜，以8001程 度之低溫加以燒成之基板。LTCC基板係用於在1片母基板 上多數之機能區域同時形成多數格子狀，將該等機能區域 分割為小基板。以往，於母基板之分割係使用切斷工具， 以機械式進行切斷以使其斷開。 於以往之對脆性材料基板劃線之劃線方法之一，有如 專利文獻1所示從脆性材料基板之外側至外側劃線之劃線 方法。其如圖1所示，使劃線輪2(有時亦稱為刀輪）於比脆 G性材料基板i之端部務外側之點下降至劃線輪2之最下端 位於脆性材料基板1之上面之稍下方。且在對劃線輪2施 加既定之劃線壓之狀態下使其往圖中之右方向水平移動而 從脆性材料基板！之緣開始劃線，劃線至脆性材料基板ι 另-方之緣。以下將其稱為外切劃線。於外切劃線時由於 線到達基板之兩端，故劃線後之斷開(折斷)容易，又，在劃 線開始位置之滑動問題雖不會發生，但有劃線輪容易消耗 之缺點。特別在對LTCC等陶£進行劃線時，外切導致之劃 線輪消耗更顯著。 3 200936519 又，亦有一種從脆性材料基板之内側劃線至内侧而外 側不劃線之劃線方法。其係如圖2所示，使劃線輪2下_ 至脆性基板丨之緣之稱内側，之後在對劃線輪2施加向下 之既定劃線壓之狀態下，使向圖中右方水平移動，藉此從 脆性材料基板1之内侧開始劃線，劃至另一端之内側。以 下將其稱為内切劃線。於内切劃線時，劃線輪雖比外切劃 線之狀況不易消耗，但由於劃線未達基板之兩端，故有劃 〇 線後之斷開（折斷）變難之傾向。特別是對LTCC等陶瓷劃線 時，以内切難以分割。又，基板與製品基板較小時(例如分 割縱橫200 mm以下（特別是1〇〇随以下）之基版時、以分 割獲得縱橫10 _以下（特別是5 _以下）之製品時）以内 切分割顯著變難。另外，本說明書所稱之劃線，係指使劃 =輪於脆性材料基板上為壓接狀態並使其轉動，藉此刻出 劃線（切痕），並沿劃線使垂直裂痕（於板厚方向伸展之裂痕 發生。 ❹ 【專利文獻！】曰本專利第3710495號公報 【發明内容】 、4之sj線農置，劃線係僅以前述外切及内切中之一 方進行，無法使該等組合以形成劃線。 本發明係解決此種前述之缺點，其目的在能將外切及 内切劃線等加以組合進行劃線。 為解決此課題’本發明之劃線裝置係為將形成於脆性 材料基板上之機能區域依各機能區域分割以製成製品基板 4 200936519 而劃線之劃線裝置，具備：使前述劃線之種類為從前述脆 性材料基板之一邊之内侧至另一邊之内側之内切劃線、從 刖述脆性材料基板之一邊之外側至另一邊之外側之外切劃 線’前述劃線裝置係具備設置前述脆性材料基板之平台、 被5又為可對向於前述平台上之脆性材料基板升降且於其前 端保持劃線輪之劃線頭、在將前述劃線輪按壓於前述脆性 材料基板之表面之狀態下使前述劃線頭及脆性材料基板相 Φ 對移動之移動手段、先保持顯示包含劃之線與其種類之劃 線内容之配方資料表再基於前述配方資料表以前述移動手 段使前述劃線頭及脆性材料基板相對移動且使前述劃線頭 升降以進行對應於劃線種類之劃線之控制器。 為解決此課題，本發明之劃線裝置係為將形成於脆性 材料基板上之機能區域依各機能區域分割以製成製品基板 而4線之劃線裝置，具備：使前述劃線之種類為從前述脆 =材料基板之一邊之内側至另一邊之内側之内切劃線、從 〇 刖述脆性材料基板之一邊之外側至另一邊之外侧之外切劃 線、從前述脆性材料基板之一邊之内側至另一邊之外側之 内外切劃線、從前述脆性材料基板之一邊之外侧至另一邊 之内側之外内切劃線，前述劃線裝置係具備設置前述脆性 材料基板之平台、被設為可對向於前述平台上之脆性材料 基板升降且於其前端保持劃線輪之劃線頭、在將前述劃線 輪按遷於前述脆性材料基板之表面之狀態下使前述劃線頭 及脆性材料基板相對移動之移動手段、先保持顯示包 之線與其種類之劃線内容之配方資料表再基於前述配方資 5 200936519 料·表以前述移動手段使前述劃線頭及脆性材料基板相對移 動且使前述劃線頭升降以進行對應於劃線種類之劃線之控 制器。 在此前述劃線輪可為高滲透型之劃線輪。由於高 型之劃線輪容易咬入基板，故即使内切，亦具有在劃線開 始位置之滑動之問題不易發生之優點。 為解決此課題，本發明之劃線方法，係為將形成於脆 e 性材料基板上之機能區域依各機能區域分割以製成製品基 板而使用可升降之劃線頭劃線之劃線方法，在使前述劃線 之種類為從前述脆性材料基板之一邊之内側至另一邊之内 側之内切劃線、從前述脆性材料基板之一邊之外側至另一 邊之外側之外切劃線時，先保持顯示包含劃之線與其種類 之劃線内容之配方資料表，再基於前述配方資料表使前述 J線-頁及脆（·生材料基板相對移動且使基於前述配方資料表 前述劃線頭升降以對應於劃線之種類劃線。 e 為解決此課題，本發明之劃線方法係為將形成於脆性 材料基板上之機能區域依各機能區域分割以製成製品基板 而使用可升降之劃線頭劃線之劃線方法，在使前述劃線之 種類為從前述脆性材料基板之一邊之内側至另一邊之内側 之内切劃線、從前述脆性材料基板之一邊之外側至另一邊 之:側之外切劃線、從前述脆性材料基板之一邊之内側至 邊之外側之内外切劃線、從前述脆性材料基板之一邊 畫 邊之内側之外内切劃線時，先保持顯示包含 υ種類之劃線内容之配方資料表，再基於前述配 6 200936519 方資料表使前述劃線頭及脆性材料基板相對移動且使基於 月’j述配方資料表前述劃線頭升降以對應於劃線之種類劃 線。 在此前述脆性材料基板可以格子狀形成有機能區域， 以格子狀進行前述内切劃線以於前述脆性材料基板之各機 月b區域分割’沿對向之平行2邊之邊緣部外切劃線。In the present invention, the present invention relates to a scribing apparatus and a scribing method for cutting a brittle material substrate such as a low-temperature firing ceramic substrate. [Prior Art] A low-temperature fired ceramic (hereinafter referred to as LTCC) is a substrate which is obtained by laminating conductors of a composite of alumina and a thin plate of a glass material, and firing the film at a low temperature of 8001 degree. The LTCC substrate is used to form a plurality of lattice patterns in a plurality of functional regions on one mother substrate, and the functional regions are divided into small substrates. Conventionally, in the division of the mother substrate, the cutting tool is mechanically cut and disconnected. One of the conventional scribing methods for scribing a brittle material substrate is a scribing method from the outer side to the outer side of the brittle material substrate as shown in Patent Document 1. As shown in FIG. 1 , the scribing wheel 2 (sometimes referred to as a cutter wheel) is lowered to a position lower than the end portion of the brittle G-material substrate i to the lowermost end of the scribing wheel 2 at the brittle material substrate 1 . A little below it. Further, in a state where a predetermined scribing pressure is applied to the scribing wheel 2, it is horizontally moved in the right direction in the drawing from the brittle material substrate! The edge begins to be crossed, and the line is drawn to the edge of the brittle material substrate ι. Hereinafter, this is called an outer cut line. Since the line reaches the both ends of the substrate when the scribe line is scribed, it is easy to break (break) after the scribe line, and the sliding problem at the start position of the scribe line does not occur, but the scribe wheel is easily consumed. . Especially when scribing the LTCC and other pots, the tangentially caused the scribing wheel consumption is more significant. 3 200936519 Further, there is a scribing method in which the inner side of the brittle material substrate is scribed to the inner side and the outer side is not scribed. As shown in FIG. 2, the scribing wheel 2 is made _ to the inner side of the edge of the brittle substrate ,, and then, in the state where the downward scribe line pressure is applied to the scribing wheel 2, the right side is shown in the figure. The horizontal movement is performed, whereby the scribe line is drawn from the inner side of the brittle material substrate 1 and is drawn to the inner side of the other end. This is called the undercut line below. When the inner scribe line is used, the scribe line is less likely to be consumed than the outer scribe line. However, since the scribe line does not reach the both ends of the substrate, the break (break) after the scribe line tends to be difficult. In particular, when scribing ceramics such as LTCC, it is difficult to divide by incision. Further, when the substrate and the product substrate are small (for example, when the base plate having a width of 200 mm or less (especially 1 Å or less) is divided, and when the product is divided into 10 Å or less (especially 5 Å or less), the inside is cut. Segmentation is significantly more difficult. In addition, the scribe line referred to in the present specification means that the scratching wheel is pressed and rotated on the substrate of the brittle material, thereby marking the scribe line (cutting) and causing the vertical crack along the scribe line (in the thickness of the plate) Cracks in the direction of stretching occur. 专利 Patent Document! 曰 专利 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 , , , , , , , , , , , , 划线 划线 划线 划线 划线 划线 划线 划线 划线 划线 划线 划线 划线 划线 划线 划线 划线 划线 划线 划线 划线The present invention solves the above-mentioned disadvantages, and the object thereof is to enable scribe lines by combining external cutting and inscribed scribe lines, etc. In order to solve the problem, the scribing apparatus of the present invention is formed. The scribing device for dividing the functional region on the brittle material substrate into the functional regions to form the product substrate 4 200936519 includes: causing the type of the scribing to be from the inner side of one side of the brittle material substrate to the other side The inside of the inside is scribed, and the scribe line is provided from the outer side of one side of the brittle material substrate to the other side. The scribing device has a platform on which the brittle material substrate is provided, and is further a scribing head that lifts and lowers the brittle material substrate on the platform and holds the scribing wheel at the tip end thereof, and presses the scribing head and the brittle material substrate in a state where the scribing wheel is pressed against the surface of the brittle material substrate Phase Φ for the moving means of moving, first maintaining the display of the formula data table including the line of the stroke and the type of the lined content, and then moving the aforementioned scribing head and the brittle material substrate relative to each other by the aforementioned moving means based on the aforementioned recipe data table In order to solve the problem, the scribing device of the present invention divides the functional region formed on the substrate of the brittle material into functional regions according to each functional region to form a product substrate. The four-line scribing device includes: the type of the scribing line is an inner scribe line from the inner side of one side of the brittle=material substrate to the inner side of the other side, and is from the outer side of one side of the brittle material substrate The outer side of the other side is scribed, the inner and outer scribe lines from the inner side of one side of the brittle material substrate to the outer side of the other side, and the brittle material from the foregoing The scribe line is provided with an inner scribe line from the outer side to the other side of the other side, and the scribing device includes a platform on which the brittle material substrate is provided, and is configured to be movable up and down on the platform of the brittle material on the platform. a moving means for moving the scribing head and the brittle material substrate in a state in which the scribing wheel is moved to the surface of the brittle material substrate, and a line for holding the display package and the type thereof The formula data table of the scribing content is further based on the above-mentioned formula 5 200936519 material table, the scribing head and the brittle material substrate are relatively moved by the aforementioned moving means, and the scribing head is raised and lowered to perform scribing corresponding to the scribing type. The above-mentioned scribing wheel can be a high-permeability scribing wheel. Since the high-type scribing wheel is easy to bite into the substrate, even if it is inscribed, the problem of sliding at the start position of the scribing is not easy to occur. The advantages. In order to solve the problem, the scribing method of the present invention is to divide a functional region formed on a substrate of a brittle e-material into respective functional regions to form a product substrate, and to use a scribing method capable of lifting and lowering the scribing line When the type of the scribe line is scribed by a scribe line from the inner side to the other side of the side of the brittle material substrate, and is scribed from the outer side of one side of the brittle material substrate to the outer side of the other side, First, the formula data table including the lined content of the line and the type thereof is displayed, and the aforementioned J line-page and the brittle material are relatively moved based on the aforementioned recipe data table, and the aforementioned scribing head is based on the aforementioned recipe data table. In order to solve this problem, the scribing method of the present invention is to divide the functional region formed on the brittle material substrate into functional regions according to the functional regions to form a product substrate, and to use the lifting method. The scribing method for scribing the scribing line is such that the type of the scribing line is scribed by the inner side of one side of the brittle material substrate from the inner side to the other side, and the brittleness is One side of the material substrate from the outer side to the other side: the side is scribed, the inner and outer scribe lines from the inner side of one side of the brittle material substrate to the outer side of the side, and the inner side of the side of the brittle material substrate In the case of the inscribed scribe line, the formula data sheet containing the scribe line content of the υ type is first displayed, and the scribe head and the brittle material substrate are relatively moved based on the above-mentioned 6 200936519 square data table, and the recipe data based on the month 'j is described. The above-mentioned scribing head lifting and lowering is scribed in a row corresponding to the scribe line. Here, the brittle material substrate may form an organic energy region in a lattice shape, and the inner scribe line may be formed in a lattice shape to form each of the brittle material substrates. The area division 'cuts the outer edge of the two sides parallel to the opposite side.
❹ 在此前述脆性材料基板可形成有複數之機能區域，在 進行劃線以將前述脆性材料基板依各機能區域分割時，使 〜則述脆性材料基板之對向之2邊之最外側之劃線為外切 劃線，使其餘劃線為内切劃線。 在此前述脆性材料基板可形成有複數之機能區域，在 進行劃線以將前述脆性材料基板依各機能區域分割時，使 〜刖述脆性材料基板之對向之2邊之最外側之甲之一方之 劃線為外切劃線’使其餘劃線為内切劃線，並沿前述2邊 之中之另一邊於前述内切劃線之外側進行外切劃線。 在此别述外切劃線之劃線可形成 劃線中與料切劃線丨交之方向 < 劃線交又 在此前述劃線輪可為高滲透型之劃線輪。 選擇L用Π此種特徵之本發明’可於所欲之各劃線任意 :擇：1外切劃線、或加上内外切劃線、 線，劃線之自由度提高。因 工之#丨@ π 此τ選擇適合劃線後之分割加 向對向3 7、惠τ 于狀且進仃平行於從其外周部 τ向之2邊平行外切之外 之線施力可以ν 4由對被外切劃線 %他刀j合易將周邊部分離。 且在除去周邊部後可沿被 7 200936519 内切劃線之劃線將各機能區域容易分割為製品基板。又， 藉由使外切劃線之線為必要最低限度，故可將劃線輪之劣 化減至最低。 【實施方式】 圖3為顯示本實施形態之劃線裝置之一例之概略立體 圖。此劃線裝置100係移動台101被保持為可沿一對導執 ❹ 102a、i〇2b於y轴方向移動。滾珠螺桿103與移動台101 螺合。滾珠螺桿103由馬達1 04之驅動而旋轉，使移動台 101沿導軌102a、102b於y軸方向移動。於移動台1〇1上 面設有馬達105。馬達105係使平台106在Xy平面旋轉以 定位於既定角度。此處，設脆性材料基板1〇7係低溫燒成 陶瓷基板。此脆性材料基板107被載置於平台1〇6上，受 未圖示之真空吸引手段等保持。於劃線裝置上部設有拍攝 脆性材料基板107之對準標記之2台之CCD攝影機i〇8a、 ❹ 1〇8b。此外，於平台1〇6上之周邊部2處設有用以定位脆 性材料基板107之定位銷l〇9a、l〇9b。 於劃線裝置100沿x轴方向以支柱丨丨丨a、丨丨丨b架設有 橋U〇跨越移動台101與其上部之平台1〇6。橋11〇係藉由 線性馬達113將劃線頭112保持為可移動。線性馬達113 /α X軸方向直線驅動劃線頭Π2。於劃線頭112之前端部透 過保持具114安裝有劃線輪115。劃線頭112係以適當之荷 重將劃線輪115壓接於脆性材料基板1〇7之表面上並使其 轉動，以形成劃線。劃線輪115使用日本發明專利第3〇74153 8 200936519 同滲透型之劃線輪較理想’於實施形態中亦使用 此二線輪。例如，可藉由於一般所使用之通常之劃線輪之 :前端以既定節距形成既^深度之槽形成高滲透之劃線 …般所使用之通常之劃線輪，係例如沿盤狀輪之圓周 邠形成v字型之刃。v字型刃之收束角通常為鈍角，例如 可使其為9〇〜160度，較理想為MO度，更理想為1〇〇〜14〇 度。例如，V字型之77係將盤狀輪沿其圓周部研削形成外圓 周0Ρ 而 成。例如，rb ΥΤΓ· Uiil ΤίΛ J-' 藉由研削形成之v字型之刃呈因研削 條痕k成之微小鑛齒狀。高滲透型之劃線輪，可藉由規律 形成大於通常劃線輪之刃前端之鑛齒狀之谷之凹部(槽)來 加以製造。槽之深度例如可使其為2〜10”m，較理想為 3〜50 " m ’更理想為5〜2〇 " m。槽之寬度例如可使其為 _〇〇_’較理想為15〜100/zm，更理想為2〇〜5〇_。 形成槽之節距在例如直徑為卜1〇聰（特別是i 5〜7叫之 劃線輪時，可使其為20〜250/Zm，較理想為3〇〜18〇_， ❹更理想為40〜80心。此處，節距為劃線輪之圓周方向之槽 1個之長度、與因槽之形成而殘存之突起⑽之長度。通常， 在高滲透型之劃線輪中，劃線輪之圓周方向之槽i個之長 度大於突起i個之長度。劃線輪之材質難可使用燒結金剛 石（PCD)、超硬合金等’但考量劃線輪壽命因素，以燒結金 剛石（PCD)較理想。 此處，移動台101、導執l〇2a、102b或平台1〇6及驅 動該等之馬達104、105及使劃線頭112移動之線性馬達 113，構成使劃線頭與脆性材料基板在該基板之面内相對移 9 200936519 動之移動手段。 以下，以方塊圖說明本實施形態之劃線裝置1〇()之控 制器構成。® 4為劃線裝置1〇〇之控制器12〇之方塊圖。 於本圖中從2台之CCD攝影機购、祕之輸出係透過控 制器120之影像處理部121傳至控制部122。輸入部123係 如後述輸入關於脆性材料基板1〇7之劃線之配方資料。於 控制部122連接γ馬達驅動部125、旋轉用馬達驅動部126 0 及劃線頭驅動部127。Y馬達驅動部125係驅動馬達104, 旋轉用馬達驅動部126係驅動馬達1〇5。控制部122根據配 方資料控制平纟106之y轴方向之位置，旋轉控制平台 106。又，控制部122透過劃線頭驅動部127於X軸方向驅 動劃線頭，並於劃線輪115之轉動時驅動為劃線輪115以 適當之荷重壓接脆性材料基板之表面上。此外，於控制部 122連接監視器128及配方資料保持部129。配方資料保持 部129係保持後述之劃線用之配方資料。配方資料係在監 ❹ 視器128確認輸入並由輸入部123輸入。 以下’說明此實施形態之劃線裝置之劃線方法。此實 施.形態係於各劃線設定圖！所示之外切劃線與圖2所示之 内切劃線以進行劃線。由於外切劃線之狀況於劃線開始時 使劃線輪衝擊脆性材料基板之端部，故有劃線輪容易劣化 之缺點。但因外切劃線係從基板之端部至端部形成劃線及 從劃線形成往基板之厚度方向伸展之垂直裂痕，故涵蓋脆 性材料基板之全寬度形成劃線及垂直裂痕，分割較容易。 其次由於圖2所示之内切劃線之狀況係使劃線輪下降 200936519 至脆性材料基板107之端部之内侧，故劃線造成之垂直裂 痕常較淺。在此，本實施形態中係使用高滲透型之刃前端 做為劃線輪115。因此即使為内切劃線亦可使垂直裂痕滲透 至邊緣部。本實施形態可於各劃線適當切換外切劃線與内 切劃線以劃線。 以下基於圖面說明劃線之例。圖5係顯示脆性材料基 板107與於其面形成為格子狀之2〇塊機能區域。又於各機 能區域之中間如圖所示事先形成有對準標記。令其中外周 之對準標記為a〜r。 以下參照流程圖說明本實施形態之劃線裝置之動作。 首先如圖6所示於劃線前先設定外伸量，作成配方資料表。 劃線之種類如前述有内切及外切劃線，事先設定外切與内 切之外伸量。於S11係如圖1所示，設定外切之開始時之 外伸量OH1及終端之外伸量OH2。在此所謂外伸量係指從 基板之端部至劃線頭之降下位置或上升位置之距離。於外 切時使外伸量為正值。例如將開始外伸量、終端外伸量分 別設定為+5 mm時，從離基板之端部5 mm外側之處使劃線 輪降下，在基板端部之5 mm之外側使劃線輪上升，可使其 為外切。於S12係如圖2所示，設定内切之開始外伸量〇H3 及終端外伸量OH4。於内切時使外伸量為負值。例如將開 始外伸量、終端外伸量分別設定為-2 mm時，從離基板之^ 部2 mm内侧之處開始劃線，在基板端部之2mm之内側劃 線結束，可使其為内切劃線。 其後推進至S13作成配方資料表。配方資料表係例如 11 200936519 =7所不設定劃線與劃線方法及節距。此配方資料表中設 ^有圖5所不之脆性材料基板1G7之對準標I己a_f間及與其 \ 2準標3己r-g間、q-h間、p_i間、〇-j間之内切劃線。 又Λ又有沿劃線0S1之外切劃線、對準標記a-o、 間之内切劃線、沿劃線〇S2之外切劃線。 Ο 又’劃線方法係設定為〇、i、2之一。此處劃線方法〇 間、曰内h切’對準標記a_f間之劃線及與其平行之對準標記r-g 線^門P-1間、間之劃線等係設為劃線方法〇。劃 法法1為外切，係表示不使用對準標記之狀況。劃線方 對2為外切，係基於對準標記獨自對準之狀況。如後述， ^ ^ 亦事先设有對準標記之脆性材料基板可在外切時 叹定方法2。 ^卜’“心_為單位表轉㈣之基準線之平行 之端i#。所謂基準㈣指連結—對之對準標記之線或基板 接成Mi ^ #在内切劃線中’連結—對之對準標記之線直 a_f、: Sl &時之基準線’故節距為G即可。因此對準標記 〇。/ g、a_〇、b_n."f_j間之内切劃線中，係使節距為 即茂板之劃線方法1之外切係以例如mm表示離基準線 劃=邊之偏移量。於《7之配方資料表對外切用之 咖。又，；Γ線方法！，使節距為離基準線之偏移量即5 子外切之劃線0S2亦設節距為5 mm。 值，^使㈣之外伸量之絕對值小於外切之節距之絕對 又Y f如可使與外切㈣正交之内切劃線與外切劃線交 又。例如於前述之狀況内切劃線之外伸量之絕對值二 12 200936519 切劃線之節距之絕對值為5，故可如圖5所示使af間”1 間…之劃線與劃線〇S1、劃線〇S2交又。 以下以圖8之流程圖說明在如上述作成劃線實行用配 方資料表後劃線之動#。首《將脆性材料基& 1〇7配合平 台106上之定位銷109a、1〇9b置於平台1〇6上。且在劃線 開始後於S21從事先已保持之配方資料表讀出！劃線之資 料。例如圖7所示之配方資料表時，讀出通過對準標記 ❹之線。之後於S22於基準線+節距之位置設定此劃線。此時 由於連結對準標記之線為基準線，節距為〇，故連結對準標 圮之線直接成為劃線。因此以控制部122使平台於丫 軸方向移動，根據需要使平台1〇6旋轉。之後定位以使在 以線性馬達113使此劃線頭112於又軸移動時能形成劃線。 此設定結束後，於S23讀出劃線方法，選擇内切或外 切内切0^刖進至步驟S24進行内切。此時係從已設定之 内切劃線之開始外伸量0H3之位置開始劃線。藉此可如前 Ο 述圖2所示從脆性材料基板之内側開始劃線。之後進行劃 線至以終端外伸量0H4設定之終端位置，使劃線頭上升以 結束劃線。之後前進至步驟S26檢查是$完成配方資料表 中之所有劃線，若劃線未完成便返回步驟S21重複同樣之 處理。藉此可基於事先設定之配方資料表依序進行劃線。 ▲在基於配方資料表完成a_f、卜g、·,〇」之内切劃線後， 前進至外切之劃線0S1。此時驅動馬達1〇5將平台1〇6旋轉 9〇度。此時係設平行於基板之邊5職π側之線為外切之 劃線0S卜且由於劃線方法為卜故離脆性材料基板之外側 13 200936519 外切之開始外伸I QH1夕I pq仏 甲篁UH 1之量開始劃線動作（劃線頭之降 下）’進行外切劃線動作至脆性材料基板之外側終端外伸量 OH2之量，使劃線頭上升。之後同樣進行劃線^。、“、㈠ 間之内切劃線動作。此外，對劃線〇S2與⑽同樣進行外 切劃線。藉此可對圖5所示之脆性材料基板1〇7沿所欲之 線劃線。 以下§兑明如上述形成圖5所示之劃線後之分割。首先 _ 如圖9A所示，沿2條之外切劃線〇sl、〇S2除去基板之邊 緣部。如此劃線a_f、r_g、成為被劃線至基板之端部， 故如圖9B所示可容易沿此線將脆性材料基板分割為細長之 形狀。且如此分割後再沿劃線a-o、b-n、…f-j分割，可使 其為正方形狀之製品脆性材料基板（製品LTCC基板）。 另外’此實施形態中，雖於外切劃線以平行於基板之 邊緣偏離節距之量之線為劃線，但在如劃線OS2有前一内 切劃線f-j時，可設定從此線之間隔決定外切劃線之位置。 & 又’對外切亦可事先於脆性材料基板設置對準標記，基於 此對準標記實行外切。 又’此實施形態中係使外切之劃線OS 1、0S2與與其垂 直之内切劃線交叉。因此，在沿外切之劃線分割外侧之邊 緣後’可容易沿與其垂直之劃線分割基板。由於外切及内 切可於各劃線設定，故可考慮使劃線後容易分割、延長劃 線輪之哥命等而適當選擇。例如可使一方向之劃線全為外 切劃線。但若將外切劃線抑制於最小限度可使刃前端之損 傷減少。 14 200936519 例如圖10A所示，對具有9個機能區域之脆性材料基 板107a可使分割各機能區域之劃線中平行於脆性材料基板 l〇7a之左右之對向2邊之2條外側之劃線〇S3、〇S4為外 切劃線。圖10A中，可根據格子狀之内切劃線與平行於2 邊之2條外切劃線〇S3、〇S4分割脆性材料基板1〇7&，亦 可省略2條内切劃線。 又，如於圖10B顯示其他脆性材料基板1〇7b，可使分 割機能區域之劃線中平行於對向之2邊之劃線之一，此時 為僅右側為外切劃線0S3，沿另一方之邊於内切劃線之外侧 設置其他外切劃線OS5。 另外，此實施形態中係以移動手段使平台於y抽方向 移動且使平台轉動’使劃線頭於乂軸方向移動。取而代之， 移動手段可使平台於X轴及y軸方内 〇 /± . , ^❹ In the above-mentioned brittle material substrate, a plurality of functional regions may be formed. When scribing is performed to divide the brittle material substrate into respective functional regions, the outermost sides of the two sides of the brittle material substrate are aligned. The line is an outer scribe line, and the remaining lines are scribed lines. Here, the brittle material substrate may be formed with a plurality of functional regions. When the scribing is performed to divide the brittle material substrate according to each functional region, the outermost side of the two sides of the opposite side of the brittle material substrate is described. One of the scribe lines is an outer scribe line', and the remaining scribe line is an inner scribe line, and the other side of the two sides is circumscribed on the outer side of the aforementioned inner scribe line. Here, the scribe line of the outer scribe line may form a direction in which the scribe line intersects with the scribe line < scribed line. Here, the aforementioned scribe line may be a high-permeability type scribe line. The present invention in which L is selected for such a feature can be arbitrarily selected as desired: selection: 1 external scribe line, or internal and external scribe line, line, and the degree of freedom of the scribe line is improved.因 之 丨 τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ It is possible to separate the peripheral portion by ν 4 from the outer scribe line. Further, after the peripheral portion is removed, each functional region can be easily divided into product substrates along a scribe line which is internally scribed by 7 200936519. Further, by making the line of the scribe line to the minimum necessary, the deterioration of the scribing wheel can be minimized. [Embodiment] Fig. 3 is a schematic perspective view showing an example of a scribing device of the embodiment. The scribing device 100 is held by the mobile station 101 so as to be movable in the y-axis direction along the pair of guides 102a, i2b. The ball screw 103 is screwed to the moving table 101. The ball screw 103 is rotated by the motor 104 to move the moving table 101 in the y-axis direction along the guide rails 102a and 102b. A motor 105 is provided above the mobile station 101. Motor 105 rotates platform 106 in the Xy plane to be positioned at a predetermined angle. Here, the brittle material substrate 1〇7 is a low-temperature fired ceramic substrate. The brittle material substrate 107 is placed on the stage 1〇6 and held by a vacuum suction means or the like (not shown). Two CCD cameras i 8a and 8b for capturing the alignment marks of the brittle material substrate 107 are provided on the upper portion of the scribing device. Further, positioning pins 10a, 9b, 9b for positioning the brittle material substrate 107 are provided at the peripheral portion 2 on the stage 1〇6. In the x-axis apparatus 100, a bridge U is placed in the x-axis direction with the bridges 〇a and 丨丨丨b across the movable platform 101 and the upper platform 1〇6. The bridge 11 is held by the linear motor 113 to keep the scribing head 112 movable. The linear motor 113 / α linearly drives the scribing head Π 2 in the X-axis direction. A scribing wheel 115 is attached to the front end of the scribing head 112 through the holder 114. The scribing head 112 presses the scribing wheel 115 against the surface of the brittle material substrate 1〇7 with an appropriate load and rotates it to form a scribing line. The scribing wheel 115 uses the Japanese invention patent No. 3, 741 353 8 200936519, which is preferable to the oscillating type scribing wheel. The second reel is also used in the embodiment. For example, it can be used by a conventional scribing wheel which is generally used: the front end is formed with a predetermined pitch to form a groove of high penetration, and the conventional scribing wheel is used, for example, along a disc wheel. The circumference 邠 forms a v-shaped blade. The angle of convergence of the v-shaped blade is usually an obtuse angle, for example, it can be made 9 to 160 degrees, more preferably MO degrees, more preferably 1 to 14 degrees. For example, the V-shaped 77 series is formed by grinding a disk-shaped wheel along its circumferential portion to form an outer circumference 0Ρ. For example, rb ΥΤΓ· Uiil ΤίΛ J-' is formed by the v-shaped blade formed by grinding to form a tiny ore-like shape of the streak k. The high-permeability type scribing wheel can be manufactured by regularly forming a recess (groove) larger than the ore-shaped valley at the tip end of the blade of the conventional scribing wheel. The depth of the groove can be, for example, 2 to 10" m, more preferably 3 to 50 " m ' is more preferably 5 to 2 〇" m. The width of the groove can be made _〇〇_', for example. It is 15~100/zm, more preferably 2〇~5〇_. The pitch of the groove is formed, for example, by the diameter of Bu 1 (c, especially when i 5~7 is called the scribing wheel, it can be made to 20~ 250/Zm, preferably 3〇~18〇_, ❹ is more preferably 40~80 hearts. Here, the pitch is the length of one groove in the circumferential direction of the scribing wheel, and the residual due to the formation of the groove The length of the protrusion (10). Generally, in the high-permeability type scribing wheel, the length of the groove i in the circumferential direction of the scribing wheel is larger than the length of the protrusion i. The material of the scribing wheel is difficult to use sintered diamond (PCD), Superhard alloys, etc. 'but considering the life factor of the scribing wheel, it is preferable to use sintered diamond (PCD). Here, the mobile station 101, the guides l〇2a, 102b or the platform 1〇6 and the motors 104, 105 that drive the same And the linear motor 113 for moving the scribing head 112 constitutes a moving means for moving the scribing head and the brittle material substrate relative to each other in the plane of the substrate. The controller configuration of the scribing device 1 () of the present embodiment will be described in block diagram. The controller 4 is a block diagram of the controller 12 of the scribing device 1 。. In this figure, it is purchased from two CCD cameras. The output of the secret is transmitted to the control unit 122 via the image processing unit 121 of the controller 120. The input unit 123 is configured to input the recipe data for the scribe line of the brittle material substrate 1 to 7 as will be described later. The γ motor driving unit 125 is connected to the control unit 122. The rotation motor drive unit 126 0 and the scribing head drive unit 127. The Y motor drive unit 125 drives the motor 104, and the rotation motor drive unit 126 drives the motor 1〇5. The control unit 122 controls the flat 106 according to the recipe data. The position of the y-axis direction rotates the control platform 106. Further, the control unit 122 drives the scribing head in the X-axis direction through the scribing head driving unit 127, and drives it as the scribing wheel 115 when the scribing wheel 115 rotates. The load is crimped onto the surface of the brittle material substrate, and the monitor 128 and the recipe data holding unit 129 are connected to the control unit 122. The recipe data holding unit 129 holds the recipe data for the scribing described later. The recipe data is monitored. 128 confirms the loss The input unit 123 is input. The following is a description of the scribing method of the scribing device of the embodiment. This embodiment is based on the scribing map and the incision shown in FIG. The line is scribed. Since the scribe line causes the scribe wheel to strike the end of the brittle material substrate at the start of the scribe line, there is a disadvantage that the scribe line is easily deteriorated. The end portion to the end portion are formed with a scribe line and a vertical crack extending from the scribe line toward the thickness direction of the substrate. Therefore, the entire width of the brittle material substrate is formed to form a scribe line and a vertical crack, and the division is easy. Secondly, since the condition of the inner scribe line shown in Fig. 2 causes the scribing wheel to descend to the inner side of the end portion of the brittle material substrate 107 from 200936519, the vertical crack caused by the scribe line is often shallow. Here, in the present embodiment, the tip end of the high-permeability type blade is used as the scribing wheel 115. Therefore, even if it is an undercut, the vertical crack can be infiltrated into the edge portion. In the present embodiment, the outer scribe line and the inner scribe line can be appropriately switched between the scribe lines to scribe lines. The following is an example of a scribe line based on the drawing. Fig. 5 shows a brittle material substrate 107 and a two-block functional region formed in a lattice shape on its surface. Further, an alignment mark is formed in advance in the middle of each functional area as shown in the figure. Let the alignment of the outer circumference be marked as a~r. The operation of the scribing apparatus of this embodiment will be described below with reference to a flowchart. First, as shown in Fig. 6, the amount of overhang is set before the scribing, and a recipe data table is created. The type of the scribe line has an inner cut and an outer cut line as described above, and the outer cut and the inner cut extend amount are set in advance. In S11, as shown in Fig. 1, the amount of overhang OH1 at the start of the circumcision and the amount of extension OH2 of the terminal are set. The term "extension" as used herein refers to the distance from the end of the substrate to the lowered or raised position of the scribing head. When the outer cut is made, the amount of overhang is positive. For example, when the amount of overhang and the amount of extension of the terminal are set to +5 mm, respectively, the scribing wheel is lowered from the outer side of the end of the substrate by 5 mm, and the scribing wheel is raised at the outer side of 5 mm from the end of the substrate. Can be made to be external. In S12, as shown in Fig. 2, the inward extension amount 〇H3 and the terminal overhang amount OH4 are set. The amount of overhang is negative when inscribed. For example, when the amount of overhang and the amount of terminal overhang are set to -2 mm, the scribe line is started from the inner side of 2 mm from the base of the substrate, and the inner scribe line is finished at 2 mm inside the end of the substrate. Inscribed line. Then proceed to S13 to make a recipe data sheet. The recipe data sheet is, for example, 11 200936519 = 7 does not set the scribing and scribing method and pitch. In the formula data sheet, there is an inscribed line between the alignment mark I1a_f of the brittle material substrate 1G7 and the \2 standard 3, rg, qh, p_i, and 〇-j. line. Further, there is a scribe line along the scribe line 0S1, an alignment mark a-o, an inner scribe line, and a scribe line along the scribe line S2. Ο and 'The scribing method is set to one of 〇, i, 2. Here, the scribing method 曰, the h h ’ 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 〇 〇 The method 1 is an external cut, indicating that the alignment mark is not used. The scribe line pair 2 is an outer cut based on the condition in which the alignment marks are individually aligned. As will be described later, ^ ^ is also a method in which the substrate of the brittle material provided with the alignment mark in advance can be slanted when circumscribed. ^卜'"Heart_ is the parallel end of the reference line of the unit table (4) i#. The so-called reference (4) refers to the link - the line of the alignment mark or the substrate is connected to the Mi ^ # in the inscribed line - the link - Align the line of the mark with the line a_f,: Sl & the base line ', so the pitch is G. Therefore, the alignment mark 〇. / g, a_〇, b_n." In the line, the pitch is the slash method 1 of the slab, and the slash is expressed by, for example, mm from the reference line = edge offset. The recipe data sheet of the 7 is used for external use. Also; Γ line method!, so that the pitch is offset from the reference line, that is, the scribe line 0S2 of the 5 sub-cuts is also set to a pitch of 5 mm. Value, ^ makes the absolute value of (4) the amount of outward extension smaller than the pitch of the outer cut The absolute Y f can be such that the inner cut line and the outer cut line orthogonal to the outer cut (four) can be intersected. For example, in the foregoing situation, the absolute value of the outward extension of the underline is 2 12 200936519 The absolute value of the pitch is 5, so that the line between the afs and the line 〇S1 and the line 〇S2 can be made as shown in FIG. Next, the motion # after the scribing of the recipe data table as described above will be described with reference to the flowchart of Fig. 8. First, the brittle material base & 1〇7 is placed on the platform 1〇6 with the positioning pins 109a and 1〇9b on the platform 106. And after the start of the scribing, read out from the recipe data sheet that has been held in advance at S21. The information of the line. For example, in the recipe data sheet shown in Fig. 7, the line passing through the alignment mark is read. This scribe line is then set at the position of the reference line + pitch at S22. At this time, since the line connecting the alignment marks is the reference line and the pitch is 〇, the line connecting the alignment marks directly becomes the scribe line. Therefore, the control unit 122 moves the stage in the yaw axis direction, and rotates the stage 1 〇 6 as needed. Positioning is then enabled to form a scribe line when the scribe head 112 is moved by the linear motor 113 on the axis. After the setting is completed, the scribing method is read in S23, and the inscribed or circumscribed endo-cut is selected to proceed to step S24 for incision. At this time, the scribing is started from the position where the outward incision is set to 0H3. Thereby, the scribe line can be started from the inner side of the brittle material substrate as shown in Fig. 2 as before. Then, the line is drawn to the end position set by the terminal extension amount 0H4, and the scribing head is raised to end the scribing. Then, the process proceeds to step S26 to check that all the lines in the recipe data table are completed. If the line is not completed, the process returns to step S21 to repeat the same process. Thereby, the scribing can be sequentially performed based on the previously formulated recipe data table. ▲ After slashing within a_f, 卜g, ·, 〇 based on the recipe data sheet, proceed to the scribe line 0S1. At this time, the drive motor 1〇5 rotates the stage 1〇6 by 9 degrees. In this case, the line parallel to the side of the substrate 5 is the scribed line 0S, and the scribe line method is the outer side of the brittle material substrate 13 200936519 circumscribing the beginning of the extension I QH1 夕 I pq The amount of the UH 1 of the armor is started to be scribed (the lowering of the scribe head). The amount of OH2 of the outer end of the brittle material substrate is increased by the external scribe line operation to raise the scribe head. After that, the line is also marked ^. In addition, the scribing lines S2 and (10) are scribed in the same manner. The brittle material substrate 1〇7 shown in Fig. 5 can be scribed along the desired line. The following § is divided into the above-described scribe lines as shown in Fig. 5. First, as shown in Fig. 9A, the edge portions of the substrate are removed by scribe lines ss1 and 〇S2 along two lines. R_g is scribed to the end of the substrate, so that the brittle material substrate can be easily divided into elongated shapes along the line as shown in Fig. 9B, and then divided by the scribe lines ao, bn, ... fj. It can be made into a square-shaped product brittle material substrate (product LTCC substrate). In addition, in this embodiment, the outer scribe line is a line which is offset from the edge of the substrate by the amount of the pitch, but is When the scribing OS2 has the previous inscribed scribing line fj, the position of the outer scribing line can be determined from the interval of the line. & And the outer cutting can also be provided with an alignment mark on the brittle material substrate in advance, based on the alignment mark. Ex-cutting is carried out. In this embodiment, the externally-lined lines OS 1 and OS2 are The straight line is crossed and crossed. Therefore, after dividing the outer edge along the scribed line, the substrate can be easily divided along the line perpendicular thereto. Since the outer and inner cuts can be set for each line, it can be considered It is easy to divide after the scribing, and it is appropriate to select the length of the scribing wheel, etc. For example, the scribing in one direction can be all externally scribing. However, if the outer scribing is minimized, the front end of the blade can be damaged. 14 200936519 For example, as shown in FIG. 10A, for the brittle material substrate 107a having nine functional regions, the scribe lines dividing the functional regions can be parallel to the two sides of the two sides of the brittle material substrate 10a7a. The scribe lines S3 and 〇S4 are externally scribed lines. In Fig. 10A, the brittle material substrate 1 can be divided according to the inner scribe line in the lattice shape and the two outer scribe lines S3 and 〇S4 parallel to the two sides. 7&, it is also possible to omit two inscribed lines. Further, as shown in Fig. 10B, other brittle material substrates 1〇7b may be used, so that the scribe line of the division function region may be parallel to one of the two sides of the opposite side, At this time, only the right side is the outer cut line 0S3, and the other side is cut in the inner side. The other outer scribe line OS5 is disposed on the outer side. In this embodiment, the platform is moved in the y pumping direction by the moving means and the platform is rotated to move the scribe head in the yaw axis direction. Instead, the moving means can make the platform X-axis and y-axis square 〇/± . , ^
神久y釉方向移動’且使劃線頭於X 轴及y轴方向移動。 另外，此實施形態中係使跪性材料基板為低溫燒成陶It moves for a long time y glaze direction and moves the scribing head in the X-axis and y-axis directions. In addition, in this embodiment, the substrate of the inert material is made into a low temperature fired pottery.
竞基板，❻即使μ於液晶面板等之玻璃基板、其他之基 板亦可適用本發明。 α 、分1，丨眾心剴蜾選擇内切 與外切劃線，但並不限於此亦 、 ν, 亦可使用使1條之劃線之開 始部/刀為内切而終端部分為外 刀之内外切劃線。同樣亦可 使用使1條之劃線之開始部分Α 了 1刀為外切而終端部分為内 外内切劃線。此時可選擇内切、 1刀之 線4種劃線方法。 切、外内切劃 此外， 本實施形態中雖於各内 切劃線使用對準標記對 15 200936519 準，但亦可設定離丨個對準標記之節距或離前一劃線之節 距以決定劃線之位置。 此外，本實施形態雖係於各内切劃線與外切劃線設定 開始外伸量、結束外伸量並基於該資料決定外伸量，但亦 可於各劃線設定外伸量並基於此決定外伸量。 本發明可廣泛利用於對低溫燒成陶瓷基板之陶瓷基板 或玻璃基板等脆性材料基板形成劃線之流程。 【圖式簡單說明】 圖1為顯示脆性材料基板之外切劃線之圖。 圖2為顯示脆性材料基板之内切劃線之圖。 圖3為顯示本實施形態之劃線裝置之立體圖。 圖4為顯示本實施形態之控制器之方塊圖。 圖5為顯示本實施形態之劃線前之脆性材料基板之圖。 圖6為顯示劃線前之外伸量及配方資料表之作成之流 程圖。 圖7為顯示配方資料表之一例之圖。 圖8為顯示本實施形態之劃線裝置之劃線動作之流程 圖。 圖9A為顯示劃線後之脆性材料基板之分割方法之圖。 圖9B為顯示劃線後之脆性材料基板之分割方法之圖。 圖10A為顯示本實施形態之劃線前之脆性材料基板之 其他例之圖。 圖10B為顯示本實施形態之劃線前之脆性材料基板之 200936519 其他例之圖。 【主要元件符號說明】 100 劃線裝置 101 移動台 102a 、 102b 導軌 103 滚珠螺桿 104 、 105 馬達 ® 106 平台 107 、 107a 、 107b 脆性材料基板 108a 、 108b CCD攝影機 109a、109b 定位銷 1 10 橋 11 la、11 lb 支柱 112 劃線頭 113 φ 線性馬達 114 保持具 115 劃線輪 120 控制器 121 影像處理部 122 控制部 123 輸入部 124 Y馬達驅動部 126 旋轉用馬達驅動部 17 200936519 127 劃線頭驅動部 128 監視器 129 配方資料保持部The present invention can be applied to a substrate or a glass substrate such as a liquid crystal panel or other substrate. α, 分1, 丨 剀蜾 剀蜾 剀蜾 剀蜾 剀蜾 剀蜾 剀蜾 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Cut the line inside and outside the knife. It is also possible to use the first part of the line of one line to have one knife for the outer cut and the terminal portion for the inner and outer inscribed lines. At this time, you can select four kinds of scribe lines for the inner cut and one knife line. In addition, in the present embodiment, the alignment mark pair 15 200936519 is used for each inner scribe line, but the pitch from the alignment mark or the pitch from the previous line may be set. To determine the position of the line. Further, in the present embodiment, the amount of the overhanging is set for each of the inscribed scribe lines and the scribe line, and the amount of overhang is set, and the amount of overhang is determined based on the data. However, the amount of overhang can be set for each scribe line and based on This determines the amount of overhang. The present invention can be widely applied to a process of forming a scribe line for a brittle material substrate such as a ceramic substrate or a glass substrate on a low-temperature fired ceramic substrate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a scribe line outside a substrate of a brittle material. Fig. 2 is a view showing an inner scribe line of a brittle material substrate. Fig. 3 is a perspective view showing the scribing device of the embodiment. Fig. 4 is a block diagram showing the controller of the embodiment. Fig. 5 is a view showing a brittle material substrate before scribing in the embodiment; Fig. 6 is a flow chart showing the amount of overhang before the scribing and the formulation of the recipe data sheet. Fig. 7 is a view showing an example of a recipe data sheet. Fig. 8 is a flow chart showing the scribing operation of the scribing device of the embodiment. Fig. 9A is a view showing a method of dividing a substrate of a brittle material after scribing. Fig. 9B is a view showing a method of dividing a brittle material substrate after scribing. Fig. 10A is a view showing another example of the brittle material substrate before scribing in the embodiment. Fig. 10B is a view showing another example of 200936519 of a brittle material substrate before scribing according to the embodiment. [Description of main component symbols] 100 Scribe device 101 Mobile station 102a, 102b Rail 103 Ball screw 104, 105 Motor® 106 Platform 107, 107a, 107b Brittle material substrate 108a, 108b CCD camera 109a, 109b Locating pin 1 10 Bridge 11 la 11 lb struts 112 scribe head 113 φ linear motor 114 holder 115 scribe wheel 120 controller 121 image processing unit 122 control unit 123 input unit 124 Y motor drive unit 126 rotation motor drive unit 200936519 127 scribe head drive Department 128 Monitor 129 Recipe Data Keeping Department