JP2013112534A - Method for splitting brittle material substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify a working step by forming a scribe line having a vertical crack reaching the rear surface, only by a scribing operation of a brittle material substrate without requiring a conventional breaking step.SOLUTION: When performing splitting, information (the thickness, the kind or the like) on the brittle material substrate is inputted, and a scribing wheel corresponding to the information of the thickness or the like is selected and mounted on a scribe head. Scribing is performed by applying a prescribed scribe load corresponding to the thickness of the brittle material substrate, and thereby a scribe line having a vertical crack reaching the rear surface can be formed (fully cut) without requiring a conventional breaking step.

Description

  The present invention relates to a method for dividing a brittle material substrate, which divides the brittle material substrate.

  Conventionally, in the manufacture of a brittle material substrate such as a glass plate, for example, a flat panel display (FPD) such as a liquid crystal display panel substrate, one mother substrate is divided and a plurality of panel substrates are taken out. When the brittle material substrate is cut, a scribe line is formed in a scribe process so that the mother substrate becomes a single panel having a predetermined size. In the scribing step, for example, a scribing device shown in Patent Document 1 holds a scribing wheel rotatably at the lower end of the scribing head, and the scribing wheel is pressed against a brittle material substrate and rolled to execute scribing. In the subsequent break process, for example, the brittle material substrate is broken along the scribe line by a break apparatus shown in Patent Document 2.

  Here, as a scribing wheel used in the scribing apparatus, a high-penetration type scribing wheel described in Patent Document 3 is known in order to be able to form a scribing line with cracks extending deeply in the thickness direction of the brittle material substrate. ing.

Japanese Unexamined Patent Publication No. 2000-119030 Japanese Patent Laid-Open No. 2004-131341 Japanese Patent No. 3074143

  However, such a conventional dividing method requires a scribing device and a breaking device, and there are a plurality of manufacturing processes. Therefore, there is a problem that a large work space is required and the time required for manufacturing is long.

  The present invention has been made paying attention to such problems of the prior art, and by forming a scribe line with a vertical crack reaching the back surface of the substrate by one operation, scribing can be performed in one step. It is an object of the present invention to complete the division of the substrate as if the break was performed simultaneously.

  In order to solve this problem, a brittle material substrate cutting method according to the present invention is a scribing wheel in which grooves having a predetermined depth are formed at a predetermined pitch along the circumference of a disk-shaped cutting edge having a V-shaped outer periphery. A method of dividing a brittle material substrate by using a scribing wheel that inputs information on the brittle material substrate to be divided (for example, the thickness and type of the brittle material substrate) and corresponds to the information on the brittle material substrate The selected scribing wheel is held at the tip of the scribe head and lowered with respect to the brittle material substrate on the table, and the scribing wheel is placed on the surface of the brittle material substrate to correspond to information on the brittle material substrate. The scribe head and the brittle material substrate are relatively moved while being pressed with the selected scribe load, and the brittleness It is to divide without (also called full-cut) the need for breaking step by forming a scribe line with a vertical crack which reaches the back surface charges substrate.

  Here, the information on the brittle material substrate may be information on the thickness of the brittle material substrate.

  Here, the information about the brittle material substrate may be information about the type and thickness of the brittle material substrate.

  Here, the brittle material substrate may be an alkali-free glass substrate.

  Here, the selected scribing wheel may increase the blade edge angle as the thickness of the brittle material substrate increases, and increase the depth of the groove in the axial direction.

  Here, the scribe load may be increased as the thickness of the brittle material substrate increases.

  According to the present invention having such characteristics, a scribing wheel is selected according to information on the brittle material substrate such as the thickness and type of the brittle material substrate, and scribing is performed using this scribing wheel. At this time, since a full cut can be performed without a break process, an excellent effect of simplifying the work process can be obtained.

It is a perspective view which shows the cutting device which performs the cutting method by embodiment of this invention. It is a block diagram which shows the controller of this parting apparatus. It is a flowchart which shows operation | movement of the parting method by this Embodiment.

  FIG. 1 is a schematic perspective view showing an example of a cutting apparatus for executing a cutting method according to an embodiment of the present invention. As in the conventional scribing apparatus, the cutting apparatus 100 includes a moving table 101 that is movable along a pair of guide rails 102a and 102b in the y-axis direction. The ball screw 103 is screwed with the moving table 101. The ball screw 103 is rotated by driving the motor 104, and moves the moving base 101 in the y-axis direction along the guide rails 102a and 102b. A motor 105 is provided on the upper surface of the movable table 101. The motor 105 rotates the table 106 on the xy plane and positions it at a predetermined angle. The brittle material substrate 107 is a glass plate or a bonded substrate. The substrate 107 is placed on a table 106 and held by a vacuum suction means (not shown).

  In the cutting apparatus 100, a bridge 110 is constructed by struts 111 a and 111 b along the x-axis direction so as to straddle the moving table 101 and the upper table 106. The bridge 110 holds a scribe head 112 movably by a linear motor 113. The linear motor 113 linearly drives the scribe head 112 along the x-axis direction. A scribing wheel 115 is attached to the tip of the scribe head 112 via a holder 114. The scribing head 112 rolls a scribing wheel 115 attached to the tip of the scribing wheel 115 while pressing it onto the surface of the brittle material substrate with an appropriate load, forms a scribe line, and divides the substrate. CCD cameras 116 a and 116 b are attached to the top of the table 106.

  As the cutting device, for example, instead of the table 106, a substrate supporting mechanism as a substrate moving means such as a belt conveyor is used as a substrate supporting mechanism, and a cutting device of a type that scribes a substrate arranged on the substrate supporting mechanism is used. can do. Further, it is possible to use a type of cutting apparatus that supports the substrate so that a part of the substrate (line portion to be divided) protrudes from the substrate support mechanism and forms a scribe line on the lower surface of the protruding portion. Furthermore, a parting apparatus that supports the substrate so that a part of the substrate (line part to be divided) protrudes from the substrate support mechanism and forms scribe lines on both surfaces (upper surface and lower surface) of the protruding part is used. be able to. These cutting devices are shown, for example, in Republished 2004/048057.

  As the scribing wheel 115, a highly penetrating scribing wheel shown in Japanese Patent No. 3074153 is used. This scribing wheel is provided with a plurality of grooves on the ridgeline of the cutting edge substantially uniformly toward the axial center of the wheel. Details of the scribing wheel will be described later. As the material of the scribing wheel, sintered diamond (PCD), cemented carbide or the like can be used, but sintered diamond (PCD) is preferable from the viewpoint of the life of the scribing wheel.

  The scribing wheel used in the present invention is a scribing wheel in which grooves having a predetermined depth are formed at a predetermined pitch along the circumference of a disk-shaped cutting edge having a V-shaped outer peripheral vertical cross section. (1) A type in which a rod-shaped pin is inserted into a through-hole formed along the central axis direction of the disk shape, and both ends of the pin are held by holders, and (2) a disk shape There is a type in which pins are integrally formed on both sides along the central axis and are held rotatably by holding the ends of the pins formed on both sides with a holder. The scribing wheel is attached to the end of the scribe head via a holder.

  For example, information related to the scribing wheel (for example, outer diameter, blade edge angle, groove depth and pitch provided on the edge of the blade edge, etc.) other than the peripheral cutting edge of the scribing wheel (the outer ridge line in a V shape) By recording in the part, it is possible to easily identify the scribing wheel when the scribing wheel is selected (at the time of installation or replacement) and to prevent the mistake. Moreover, the information regarding a scribing wheel can also be recorded on a holder. In this case, a recordable space can be widened and recording becomes easy. The information about the scribing wheel depends on the material of the scribing wheel and the holder, but can be recorded by, for example, laser marking, and can be recorded as a symbol such as a one-dimensional barcode or a two-dimensional barcode.

  Furthermore, by handling the scribing wheel together with the holder (holder structure that holds the scribing wheel) (when the scribing wheel is attached, it is attached and replaced with the holder that holds the scribing wheel when it is replaced). Selection work (mounting, replacement) is facilitated, and is particularly effective when recording information on the scribing wheel in the holder. As such a holder structure, a chip holder shown in Republished No. 2007/063979 can be used.

  Here, the moving table 101, the guide rails 102a and 102b, the table 106, the motors 104 and 105 that drive these, and the linear motor 113 that moves the scribe head 112 are arranged such that the scribe head and the brittle material substrate are scribed on the surface of the substrate. A moving means for relatively moving in parallel directions is configured.

  Next, the configuration of the controller of the cutting apparatus 100 according to the present embodiment will be described using a block diagram. FIG. 2 is a block diagram of the controller 120 of the cutting apparatus 100. In this figure, outputs from the CCD cameras 116 a and 116 b are given to the control unit 122 via the image processing unit 121 of the controller 120. The input unit 123 inputs information (thickness, type, etc.) on the brittle material substrate and scribe line data as will be described later. An X motor driving unit 124 is connected to the control unit 122, and a Y motor driving unit 125, a rotation motor driving unit 126, and a scribe head driving unit 127 are further connected. The X motor drive unit 124 drives the linear motor 113. The Y motor driving unit 125 drives the motor 104. The rotation motor driving unit 126 drives the motor 105. The control unit 122 controls the position of the table 106 in the y-axis direction based on the scribe line data, and controls the rotation of the table 106. The control unit 122 drives the scribe head in the x-axis direction via the scribe head drive unit 127, and the scribing wheel 115 presses the surface of the brittle material substrate with an appropriate load when the scribing wheel 115 rolls. To drive. Further, a monitor 128 and a data holding unit 129 are connected to the control unit 122. The data holding unit 129 holds data such as a scribe load corresponding to the thickness of the brittle material substrate.

  Next, the dividing method according to this embodiment will be described with reference to the flowchart of FIG. In this embodiment, first, information relating to the brittle material substrate such as the thickness of the brittle material substrate 107 to be divided in step S1 is input by the input unit 123. For this thickness input, select a thickness divided into several ranks, for example, less than 0.4 mm, 0.4 mm or more and less than 0.6 mm, 0.6 or more and less than 1.1 mm, or 1.1 mm or more. May be input.

In step S2, an appropriate scribing wheel is selected and held at the tip of the scribe head in accordance with the thickness of the brittle material substrate 107 input by the input unit 123. An example of the substrate thickness and the scribing wheel to be selected in the case where the brittle material substrate 107 is a glass plate, particularly an alkali-free glass substrate, is shown below.
(1) For a brittle material substrate having a thickness of less than 0.4 mm,
The outer diameter of the blade edge is 1 to 3 mm,
A scribing wheel with a blade edge angle of 90-105 ° is used.
About the groove provided in the ridgeline of the cutting edge of the scribing wheel in the axial direction of the wheel,
Groove depth 1-6 μm,
The pitch is 7 to 45 μm.
(2) For a brittle material substrate having a thickness of 0.4 mm or more and less than 0.6 mm,
Blade outer diameter is 2-4mm,
A scribing wheel with a cutting edge angle of 100 to 105 ° is used.
About the groove provided in the ridgeline of the cutting edge of the scribing wheel in the axial direction of the wheel,
Groove depth 3-8 μm,
The pitch is 15 μm to 70 μm.
(3) For a brittle material substrate having a thickness of 0.6 mm or more and less than 1.1 mm,
Blade outer diameter is 2-4mm,
A scribing wheel with a cutting edge angle of 110 to 140 ° is used.
About the groove provided in the ridgeline of the cutting edge of the scribing wheel in the axial direction of the wheel,
Groove depth 5-12 μm,
The pitch is 35 μm to 80 μm.
(4) For a brittle material substrate having a thickness of 1.1 mm or more,
Blade outer diameter is 2-5mm,
A scribing wheel with a cutting edge angle of 125 to 160 ° is used.
About the groove provided in the ridgeline of the cutting edge of the scribing wheel in the axial direction of the wheel,
Groove depth 7-150 μm,
The pitch is 40 μm to 300 μm.

  Next, an appropriate scribe load is selected according to the information (thickness, type, etc.) relating to the brittle material substrate of brittle material substrate 107 input in step S3. The value of the scribe load is selected as a value at which the scribe is deeply penetrated by the scribe operation and the break is completed, and a test is performed in advance and held as data in the data holding unit 129. Generally, when the thickness of the brittle material substrate is increased, the scribe load is increased accordingly. Then, the scribe load corresponding to the inputted information (thickness, type, etc.) on the brittle material substrate is read to drive the scribe head. In step S4, the scribe head and the brittle material substrate are relatively moved along the line to be divided, and in one step operation, the division corresponding to two steps of conventional scribe and break (full cut, on the back side of the substrate). Scribe line formation with vertical cracks reaching).

  Generally, when the blade edge angle is increased, the scribe load can be increased, and the vertical crack formed along with the scribe can be deepened. A scribe line with deep vertical cracks can be formed by increasing the groove depth corresponding to the outer diameter of the cutting edge. Using the scribing wheel selected from such a viewpoint, the brittle material substrate 107 is placed on the table 106, and a scribe line is formed with the selected scribe load.

  In the case of a brittle material substrate such as a glass plate, the outer surface and the back surface are first solidified at the time of manufacture, and then the inside solidifies, so that a stress that tends to shrink inside is generated. Therefore, the glass plate can be divided into almost three layers by the internal stress. In a normal scribe using a high penetration blade shown in Patent Document 3, a scribe line with a vertical crack reaching a depth exceeding the high stress layer (compressed layer) on the surface is formed, and the vertical crack in the substrate is formed. When the tip exceeds this depth, the vertical crack penetrates deeply and reaches the high stress layer (compressed layer) on the back side, but does not penetrate into the high stress layer (compressed layer). However, in the present invention, by selecting a higher load than usual in relation to information (thickness, type, etc.) on the brittle material substrate, a scribe line that penetrates deeply until the vertical crack reaches the back surface is formed. . By executing scribing in the same way as a conventional scribing device using a highly penetrating blade edge in this way, the brittle material substrate can be fully cut as it is, and the process up to cutting is completed. Can do. Therefore, it is not necessary to provide a break process after the scribe process, and the number of processes can be greatly simplified.

  In addition, the numerical value of the scribing wheel demonstrated here is an example, and is not limited to this numerical value.

  The present invention can be widely used in a process of cutting a brittle material substrate such as a glass substrate.

DESCRIPTION OF SYMBOLS 100 Cutting device 101 Moving stand 102a, 102b Guide rail 103 Ball screw 104, 105 Motor 106 Table 107 Brittle material board 110 Bridge 111a, 111b Post 112 Scribe head 113 Linear motor 114 Holder 115 Scribing wheel 116a, 116b CCD camera 120 Controller 121 Image Processing unit 122 Control unit 123 Input unit 124 X motor driving unit 125 Y motor driving unit 126 Rotating motor driving unit 127 Scribe head driving unit 128 Monitor 129 Data holding unit

Claims (6)

A cutting method for cutting a brittle material substrate using a scribing wheel in which grooves having a predetermined depth are formed at a predetermined pitch along the circumference of a disk-shaped cutting edge having a V-shaped outer periphery,
Enter information about the brittle material substrate to be cut,
Select a scribing wheel corresponding to information on the brittle material substrate,
Holding the selected scribing wheel at the tip of a scribe head;
The scribing head and the brittle material substrate are lowered with respect to the brittle material substrate on the table and the scribing wheel is pressed against the surface of the brittle material substrate with a scribe load selected corresponding to the information about the brittle material substrate. Relatively move
A method for cutting a brittle material substrate, wherein the brittle material substrate is cut by forming a scribe line with a vertical crack reaching the back surface.   The method for dividing a brittle material substrate according to claim 1, wherein the information on the brittle material substrate is a thickness of the brittle material substrate.   The method for dividing a brittle material substrate according to claim 1, wherein the information on the brittle material substrate is the type and thickness of the brittle material substrate.   The method for cutting a brittle material substrate according to claim 1, wherein the brittle material substrate is an alkali-free glass substrate.   The brittle material substrate according to any one of claims 1 to 3, wherein the selected scribing wheel has a blade edge angle that is increased as a thickness of the brittle material substrate is increased, and a depth of a groove toward an axial direction is increased. How to divide   The method for cutting a brittle material substrate according to any one of claims 1 to 3, wherein the scribe load is increased as the thickness of the brittle material substrate increases.

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