200935882 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種鏡頭模組和其製造方法及具有該 鏡頭模組的電子裝置，特別是指一種可防止電磁波干擾 (EMD的鏡頭模組和其製造方法以及具有該鏡頭模㈣電子 裝置。 【先前技術】 ❿ 如圖1及圖2所示’ 一般鏡頭模組1包含一基座u、 分別組裝於基座U的容置空間lu内的一鏡片12與一感測 元件13,及一金屬材質的電磁屏蔽元件14,感測元件13 位於鏡片12下方並具有多數個設置於底面的銲球⑶，電 磁屏蔽元件Μ是藉由治具定位與人工組裝的方式罩設於基 座11上’電磁屏蔽元们4具有二分別設置於相對側的卡孔 141，及一對分別設置於底端相對側的接地部Μ]，藉由基 座外表面相對側的二卡塊112分別卡掣於電磁屏蔽元件 Ο 14的二卡孔141内，使得電磁屏蔽元件14卡固於基座u 上，以防止電磁波干擾（EMI)。 電路板15頂面设有用以與電磁屏蔽元件14的接地部 142電連接的二對第—導接墊151，及多數個用以與感測元 件13的銲球131電連接的第二導接墊152，當鏡頭模組1 以表面黏著技術（SMT)銲接於電路板15上時由於第一、 第二導接墊151、152以及接地部142與銲球131的位置與 尺寸需有一定的精度要求，才能讓第一、第二導接墊ΐ5ι、、 ία分別與接地部142及銲球131精準地相接觸以達到穩定 7 200935882 的電性連接。然而，接地部142及銲球131在設計上有一 定的公差，且電磁屏蔽元件14在組裝過程中是最後才罩設 於基座11上，因此接地部142底端與銲球131底端之間的 相對位置較難控制在一定的公差範圍内，導致電磁屏蔽元 件的接地部142易與第一導接墊151產生接觸不良的情 形，使得鏡頭模組1在製造上的不良率提高。此外，電磁 屏蔽元件14需藉由治具定位與人工組裝的方式進行組裝的BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lens module, a method of manufacturing the same, and an electronic device having the lens module, and more particularly to a lens module capable of preventing electromagnetic interference (EMD) And the manufacturing method thereof and the electronic device having the lens module (fourth). [Prior Art] ❿ As shown in FIG. 1 and FIG. 2, the general lens module 1 includes a susceptor u and is respectively assembled in the accommodating space lu of the susceptor U. a lens 12 and a sensing component 13, and a metal electromagnetic shielding component 14, the sensing component 13 is located under the lens 12 and has a plurality of solder balls (3) disposed on the bottom surface, and the electromagnetic shielding component is formed by the fixture The positioning and manual assembly are disposed on the base 11. The electromagnetic shielding elements 4 have two card holes 141 respectively disposed on opposite sides, and a pair of ground portions respectively disposed on opposite sides of the bottom end, by the base The two blocks 112 on the opposite sides of the outer surface of the seat are respectively engaged in the two holes 141 of the electromagnetic shielding member , 14 so that the electromagnetic shielding member 14 is clamped on the base u to prevent electromagnetic interference (EMI). top Two pairs of first conductive pads 151 for electrically connecting to the grounding portion 142 of the electromagnetic shielding component 14 and a plurality of second conductive pads 152 for electrically connecting to the solder balls 131 of the sensing component 13 are provided. When the module 1 is soldered to the circuit board 15 by surface mount technology (SMT), the position and size of the first and second conductive pads 151 and 152 and the grounding portion 142 and the solder ball 131 need to have certain precision requirements. The first and second conductive pads ι5ι, ία are in precise contact with the grounding portion 142 and the solder ball 131 respectively to achieve stable electrical connection of 200935882. However, the grounding portion 142 and the solder ball 131 have a certain design. Tolerance, and the electromagnetic shielding component 14 is finally covered on the susceptor 11 during the assembly process, so the relative position between the bottom end of the grounding portion 142 and the bottom end of the solder ball 131 is difficult to control within a certain tolerance range, resulting in a tolerance The grounding portion 142 of the electromagnetic shielding component is liable to cause poor contact with the first guiding pad 151, so that the manufacturing defect rate of the lens module 1 is improved. In addition, the electromagnetic shielding component 14 needs to be positioned and manually assembled by the jig. Method of assembly
動作，使得鏡頭模組1在製造上的成本會相對提高。 【發明内容】 本發明之一目的，在於提供一種鏡頭模組，能防止電 磁波干擾且屏蔽的效果佳’並可提高生產良率及降低製造 成本。 本發明之另一目的，在於提供一種鏡頭模組的製造方 法’能防止電磁波干擾且屏蔽的效果佳，並可提高生產良 率及降低製造成本。 本發月之再目的，在於提供一種具有鏡頭模組的電 子裝置’鏡頭模組能防止電磁波干擾且屏蔽的效果佳，並 可提高生產良率及降低製造成本。 為達上述之-或部份或全部目的或是其他目的，本發 明之實施例所揭露之鏡頭模組，包含一基座、一鏡片、一 感測元件及一電磁屏蔽元件。 基座界定有~容罟„ . 1卫間’及一使容置空間與外部相連 通用以供光源通過的開孔。鏡片設置於容置空間内並與開 孔相對應。感測元件勢里认甘― 仟π置於基座且位於鏡片下方用以感測 8 200935882 通過鏡片的光源，感測元件包括主二 , μ 卜表面、一上表面、至 位於下表面與上表面間的側表面、多數個設置於下表 面的第-導接部、至少-位於表面的第二導接部，及至少 -接地路徑，接地路徑一端與所述第一導接部中的一第一 導接部電連接以及另-端與第二導接部電連接1磁屏蔽 讀設置於基座上並包括至少—與第二導接部電連接的接 地部。 ❹ 於本發明之-實施例中，第二導接部為一位於感測元 件的下表面的導接墊，電磁屏蔽元件的接地部為一平貼於 感測元件的下表面並壓接第二導接部的接腳。 於本發明之-實施例中，第二導接部為一位於感測元 件的下表面且鄰接側表面的導接墊，電磁屏蔽元件的接地 部為一平貼於感測元件的侧表面並接觸第二導接部的接腳 0 於本發明之-實施例中，第二導接部為一位於感測元 〇 件的上表面的導接墊，電磁屏蔽元件的接地部為一平貼於 感測元件的上表面並壓接第二導接部的接腳。 於本發明之一實施例中，第二導接部為一位於感測元 件的上表面且鄰接侧表面的導接墊，電磁屏蔽元件的接地 部為一平貼於感測元件的側表面並接觸第二導接部的接腳 〇 於本發明之一實施例中，第二導接部為一位於感測元 件的側表面的導接墊，電磁屏蔽元件的接地部為一平貼於 感測元件的側表面並壓接第二導接部的接腳。 200935882 於本發明之一實施例中，基座是以模内成型的方式包 覆電磁屏蔽元件。 於本發明之一實施例中，電磁屏蔽元件為一金屬殼體 並罩β又於基座及感測元件外表面。 於本發明之一實施例中，電磁屏蔽元件為一金屬殼體 並罩設於基座外表面，鏡頭模組還包含一包覆於基座、電 磁屏蔽元件及感測元件的固定座。 © 於本發明之一實施例中，基座包括一外環面，及一與 外環面相連接的底面，電磁屏蔽元件是一鍍膜形成於外環 面及底面的金屬層，第二導接部為一位於感測元件的上表 面的導接墊，電磁屏蔽元件的接地部壓接於第二導接部。 本發明之實施例中的鏡頭模組，藉由第二導接部設置 於感測元件的上表面或下表面或側表面的設計，以及搭配 接地路徑連接於第二導接部與第一導接部之間的設計，使 得鏡頭單元與感測元件組裝後，電磁屏蔽元件的接地部能 〇 透過第二導接部及接地路徑與感測元件的第一導接部導通 ’因此鏡頭模組組I於電路板後，電磁屏蔽元件的接地部 卩月b,、電路板導通，使得電磁屏蔽元件能達纟彳&好的屏蔽 效果。此外，藉由自動化的組裝方式，能提高鏡頭模组的 生產良率並能降低製造成本。 【實施方式】 、有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之四個較佳實施例的詳細說明中，將可 /月楚的呈現。以下實施例中所提到的方向用語，例如：上 10 200935882 、下、左、右、前或後等，僅是參考附加圖式的方向。因 此’使用的方向用語是用來說明並非用來限制本發明。 在本發明被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 如圖3、圖4及圖5所示，是本發明鏡頭模組之第一較 佳實施例，該鏡頭模組3〇〇是應用於一電子裝置2〇上，在 本實施例中，電子裝置2〇為一手機，當然電子裝置2〇也 ^ 可為個人數位助理（pda)或其他可攜式的電子裝置。電子裝 置2G包括有-本體2⑽’本體界定有—用以供鏡頭模 組300安裝的安裝空間21 ’及一使安裝空間21與外部相連 通的開π 22,鏡頭模、组3〇〇 &含一鏡頭單元3、一感測元 件4 ’及一防塵元件5。 鏡頭單兀3包括-基座31、-鏡片32、一濾光片33、 -間隔環34及一電磁屏蔽元件35。基座31為塑膠材質所 製成並界定有-容置空間311，及—形成於頂端處使容置空 〇 間311與開口 22相連通的開孔312,鏡片32、遽光片33及 間隔環34皆設置於容置空間311内，鏡片％與開孔312位 置相對應並抵接於濾、光片33頂面，使得基座31外部的光 源可通過開孔312而進入鏡片32 β。遽光片33為一紅外 線濾光片（IR Filter)且抵接於間隔環34頂端，間隔環^設 置於濾光片33與防塵元件5之間，間隔環34為具有一定 厚度的環體並界定有-位於中間處的穿孔34卜電磁屏蔽元 件35是由金屬材質所製成主要用以防止電磁波干擾，基座 3!是以模内成型（1刪mGldlng)的方式包覆㈣磁屏蔽元 11 200935882 件35上，電磁屏蔽元件35包括有-位於基座31内的罩本 體1及一形成於罩本體351底端相對側的接地部352， 接也4 352為-由草本體35】底端向内變折延伸並呈一 水平狀的接腳。 感測元件4包括—下表面41、一上表面42、二連接於 下表面41、上表面42之間的側表面43、多數個設置於下 表面41的第-導接部44,及二第二導接部45，防塵元件下5 φ 毐口於感測元件4的上表面42 ’而二第二導接部45設置於 感測70件4的上表面42並位於防塵元件5相對侧，各第二 導接-P 45為-金屬材質的導接塾，並用以與電磁屏蔽元件 35的各接地部352接觸，使第二導接部45可與接地部说 電連接。感測元件4還包括二接地路徑46，各接地路徑扑 為金屬材質，各接地路徑46的—端與各第二導接部Μ電 連接:而各接地路徑46的另一端與一第一導接部料相連 接，藉此，電磁屏蔽元# 35的接地部352㉟透過第二導接 ❹ 部45及接地路徑46的配置而與第一導接部44相導通。 感測兀件4是以其上表面42黏固於基座31底端，且 防塵元件5容置於基座31的容置空間311内，藉由間隔環 34抵接於濾光片33與防塵元件5之間，使得感測元件*組 裝於基座31後，鏡片32與感測元件4之間能保持—定的 距離（亦即鏡片32與感測元件4之間能保持—定的焦距）， 因此鏡頭模組即不需再進行調焦的動作。然而，隨著 鏡頭模組300的像素或感測^件4的像素不同，間隔環μ 的高度設計可視需求而有所調整。此外，由於基座Η是以 12 200935882 杈内成型的方式成型於電磁屏蔽元件35上，且電磁屏蔽元 件35的接地部352能透過第二導接部45及接地路徑46的 配置而與第-導接部44相導通，當鏡頭模組以表面黏 著技術銲接於電路板7上時，感測元件4的第一導接部44The action makes the cost of the lens module 1 relatively high in manufacturing. SUMMARY OF THE INVENTION An object of the present invention is to provide a lens module which can prevent electromagnetic wave interference and has a good shielding effect, and can improve production yield and reduce manufacturing cost. Another object of the present invention is to provide a method for manufacturing a lens module which can prevent electromagnetic wave interference and has a good shielding effect, and can improve production yield and reduce manufacturing cost. A further object of the present month is to provide an electronic device with a lens module. The lens module can prevent electromagnetic interference and has a good shielding effect, and can improve production yield and reduce manufacturing cost. The lens module disclosed in the embodiment of the present invention comprises a base, a lens, a sensing component and an electromagnetic shielding component for achieving the above-mentioned or some or all of the objectives or other purposes. The pedestal defines a 罟 罟 „. 1 卫 ′′ and an opening for connecting the accommodating space to the outside for the light source to pass through. The lens is disposed in the accommodating space and corresponds to the opening.甘 ― 仟 置于 π placed on the pedestal and under the lens for sensing 8 200935882 through the lens light source, the sensing element includes the main two, μ bu surface, an upper surface, to the side surface between the lower surface and the upper surface a plurality of first guiding portions disposed on the lower surface, at least a second guiding portion located at the surface, and at least a grounding path, one end of the grounding path and a first guiding portion of the first guiding portion The electrical connection and the other end and the second guiding portion are electrically connected to each other. The magnetic shield is disposed on the base and includes at least a ground portion electrically connected to the second guiding portion. 本 In the embodiment of the present invention, The second guiding portion is a guiding pad on the lower surface of the sensing component, and the grounding portion of the electromagnetic shielding component is a pin flatly attached to the lower surface of the sensing component and crimped to the second guiding portion. In an embodiment, the second guiding portion is a table located in the sensing element And a grounding pad adjacent to the side surface, the grounding portion of the electromagnetic shielding component is a pin that is flatly attached to the side surface of the sensing component and contacts the second guiding portion. In the embodiment of the present invention, the second guiding portion As a guiding pad on the upper surface of the sensing element, the grounding portion of the electromagnetic shielding element is a pin that is flatly attached to the upper surface of the sensing element and is crimped to the second guiding portion. In an example, the second guiding portion is a guiding pad located on the upper surface of the sensing component and adjacent to the side surface, and the grounding portion of the electromagnetic shielding component is a flat surface that is flat on the side surface of the sensing component and contacts the second guiding portion. In one embodiment of the present invention, the second guiding portion is a guiding pad on a side surface of the sensing component, and the grounding portion of the electromagnetic shielding component is flatly attached to the side surface of the sensing component and crimped In one embodiment of the invention, the susceptor encloses the electromagnetic shielding element in an in-mold forming manner. In one embodiment of the invention, the electromagnetic shielding element is a metal shell Body cover 又 and the appearance of the pedestal and sensing component In an embodiment of the invention, the electromagnetic shielding component is a metal casing and is disposed on the outer surface of the base. The lens module further includes a fixing base covering the base, the electromagnetic shielding component and the sensing component. In an embodiment of the invention, the base includes an outer ring surface and a bottom surface connected to the outer ring surface, and the electromagnetic shielding component is a metal layer formed on the outer ring surface and the bottom surface by a coating, and the second guiding portion The grounding portion of the electromagnetic shielding component is crimped to the second guiding portion. The lens module in the embodiment of the present invention is disposed on the second guiding portion. The design of the upper surface or the lower surface or the side surface of the measuring component, and the design of the grounding path connected between the second guiding portion and the first guiding portion, so that the electromagnetic shielding component is assembled after the lens unit and the sensing component are assembled The grounding portion can be electrically connected to the first guiding portion of the sensing element through the second guiding portion and the grounding path. Therefore, after the lens module group I is on the circuit board, the grounding portion of the electromagnetic shielding component is in the month b, and the circuit board is turned on. To make electromagnetic shielding Si left foot member can be up to & good shielding effect. In addition, by automated assembly, the production yield of the lens module can be improved and the manufacturing cost can be reduced. [Embodiment] The foregoing and other technical contents, features, and advantages of the present invention will be described in the following detailed description of the preferred embodiments of the accompanying drawings. The directional terms mentioned in the following embodiments, for example: upper 10 200935882, lower, left, right, front or rear, etc., are only directions referring to the additional drawings. Therefore, the terminology used is used to describe that it is not intended to limit the invention. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. As shown in FIG. 3, FIG. 4 and FIG. 5, it is a first preferred embodiment of the lens module of the present invention. The lens module 3 is applied to an electronic device 2, in this embodiment, an electronic device. The device 2 is a mobile phone. Of course, the electronic device 2 can also be a personal digital assistant (PDA) or other portable electronic device. The electronic device 2G includes a body 2 (10)' body defining a mounting space 21 ′ for mounting the lens module 300 and an opening π 22 for connecting the mounting space 21 to the outside, a lens module, a group 3 〇〇 & A lens unit 3, a sensing element 4' and a dustproof element 5 are included. The lens unit 3 includes a base 31, a lens 32, a filter 33, a spacer ring 34, and an electromagnetic shielding member 35. The pedestal 31 is made of a plastic material and defines an accommodating space 311, and an opening 312 formed at the top end to allow the accommodating space 311 to communicate with the opening 22, the lens 32, the glazing sheet 33 and the space The ring 34 is disposed in the accommodating space 311, and the lens % corresponds to the position of the opening 312 and abuts against the top surface of the filter and the light sheet 33, so that the light source outside the susceptor 31 can enter the lens 32β through the opening 312. The glazing sheet 33 is an IR filter and abuts against the top end of the spacer ring 34. The spacer ring is disposed between the filter 33 and the dustproof member 5. The spacer ring 34 is a ring body having a certain thickness and The perforated 34 electromagnetic shielding element 35 is defined by a metal material to prevent electromagnetic interference, and the base 3 is covered by in-mold molding (4) magnetic shielding element. 11 In 200935882, the electromagnetic shielding element 35 includes a cover body 1 located in the base 31 and a ground portion 352 formed on the opposite side of the bottom end of the cover body 351, and the connection 4 352 is - by the body 35 The end extends inwardly and extends into a horizontal pin. The sensing element 4 includes a lower surface 41, an upper surface 42, two side surfaces 43 connected to the lower surface 41 and the upper surface 42, a plurality of first guiding portions 44 disposed on the lower surface 41, and two The second guiding portion 45 has a dustproof member 5 φ ported on the upper surface 42 ′ of the sensing element 4 and the second guiding portion 45 is disposed on the upper surface 42 of the sensing 70 member 4 and located on the opposite side of the dustproof member 5 . Each of the second conductive guides -P 45 is a conductive material of a metal material and is in contact with each of the grounding portions 352 of the electromagnetic shielding component 35 so that the second conductive connecting portion 45 can be electrically connected to the grounding portion. The sensing component 4 further includes two grounding paths 46. Each of the grounding paths is made of a metal material, and the ends of the grounding paths 46 are electrically connected to the second guiding portions :: the other end of each of the grounding paths 46 and a first guiding The joint portions are connected, whereby the ground portion 35235 of the electromagnetic shield element #35 is electrically connected to the first guide portion 44 through the arrangement of the second guide portion 45 and the ground path 46. The sensing element 4 is adhered to the bottom end of the base 31 by the upper surface 42 thereof, and the dustproof member 5 is received in the accommodating space 311 of the base 31, and is abutted on the filter 33 by the spacer ring 34. Between the dustproof elements 5, after the sensing element* is assembled to the base 31, the distance between the lens 32 and the sensing element 4 can be maintained at a constant distance (ie, the lens 32 and the sensing element 4 can be maintained between The focal length), so the lens module does not need to perform the focusing operation. However, as the pixels of the lens module 300 or the pixels of the sensing member 4 are different, the height design of the spacer ring μ can be adjusted as needed. In addition, since the susceptor is formed on the electromagnetic shielding element 35 in a manner of 12 200935882, the grounding portion 352 of the electromagnetic shielding element 35 can pass through the arrangement of the second guiding portion 45 and the grounding path 46, and The guiding portion 44 is electrically connected. When the lens module is soldered to the circuit board 7 by surface bonding technology, the first guiding portion 44 of the sensing element 4 is
只要確實辉接於電路板7的導接墊71上，則表示電磁屏蔽 儿件35的接地部352與電路板7電連接，藉此，能使電磁 屏蔽元件35達到良好的屏蔽效ρ再者，與切技術相較 之下由於基座31 1以模内成型的方式成型於電磁屏蔽元 件35上，且電磁屏蔽元件％的接地部352不需單獨鲜接 於電路板7,因此電磁屏蔽元件35在設計上不需考量其接 地部352與感測元件4的第—導接部44之間的相對位置及 尺寸，同時能避免先前技術中所產生的接觸不良之情形。 以下將對鏡賴組_的製造方法進行說明，如圖6 所示’圖6是本發明鏡頭模組綱的第—較佳實施例的流 程圖’圖6所示的主要流程為： 步驟75是提供一鏡頭單元3及一咸屯丨一 及感測兀•件4,鏡頭單 元包括-基座31、一設置於基座31内的鏡片Μ及一設置 於基座31上的電磁屏蔽元件35,電磁屏蔽元件％具有一 接地部352，感測元件4包括一下表面4ι、 、 上录面42、 一位於下表面41與上表面42間的侧矣1 认τ主 ㈣側表面43、多數個設置 於下表面41的第一導接部44、一 κ ; 於表面的第二導接部 45，及一電連接於所述第一導 T的一第_莫接都44 與第一導接部45之間的接地路徑46。 步驟76是組裝鏡頭單元 於感測 元件4上 使電磁屏 13 200935882 蔽元件35的接地部352與感測元件4的第二導接部45電 連接。 接著將針對前述各步驟進行詳細說明，如圖5、圖6及 圖7所示，在步驟75中，鏡頭單元3包括一基座31，基座 31是以模内成型的方式成型於電磁屏蔽元件35上，且基座 31的谷置空間311内設有一鏡片32、一濾光片33與一間隔 %： 34。另外還提供有一晶圓（wafer)4〇，晶圓4〇上佈設有多 數個感測元件4，並且以自動化的方式在晶圓4〇的各感測 元件4的上表面42黏固有一防塵元件5，各感測元件4具 有二位於上表面42的第二導接部45,及二接地路徑46, 各感測元件4的上表面42設置有二分別與接地路徑46連 接的第二導接部45，且各接地路徑46電連接於各第二導接 部45及一第一導接部44之間。 之後如圖6、圖8及圖9所示，在步驟70中，將多數 個鏡頭單元3分別組裝於晶圓4〇的各感測元件4上，使各 鏡頭單7L 3的電磁屏蔽元件35的接地部352平貼於各感測 元件4的上表面42並壓接於第二導接部45，同時，感測元 件4的上表面42所塗佈的黏膠會與基座31相黏接，接著 將如圖8所不的晶圓4〇進行熱烘烤的作業，使得鏡頭單元 3黏固於感測元件4上而形成鏡頭模組3〇〇。之後，將各鏡 頭模組300由晶圓4〇上切割下來並進行影像測試後，即完 成各鏡頭模組300的製造作業。由於前述步驟皆利用自動 化設備進行製造的作業，能減少人工的組裝，藉此以提高 製程的良率並能降低製造的成本。特別說明的是’電磁屏 14 200935882 蔽元件35的接地部352、第二導接部45及接地路徑牝的 設計數量也可各為—個，同樣能達到使電磁屏蔽元件35與 第-導接部44相導通的功效，並不受限於本實施例所揭露 的設計數量為限。As long as it is fused to the conductive pad 71 of the circuit board 7, the grounding portion 352 of the electromagnetic shielding member 35 is electrically connected to the circuit board 7, thereby enabling the electromagnetic shielding member 35 to achieve a good shielding effect. Compared with the cutting technique, since the pedestal 31 1 is molded on the electromagnetic shielding component 35 by in-mold molding, and the grounding portion 352 of the electromagnetic shielding component % does not need to be separately connected to the circuit board 7, the electromagnetic shielding component The design of the 35 does not need to consider the relative position and size between the grounding portion 352 and the first guiding portion 44 of the sensing element 4, while avoiding the situation of contact failure generated in the prior art. The manufacturing method of the mirror group _ will be described below, as shown in FIG. 6 'FIG. 6 is a flowchart of the preferred embodiment of the lens module of the present invention. The main flow shown in FIG. 6 is as follows: Step 75 A lens unit 3 and a sensing unit 4 are provided. The lens unit includes a base 31, a lens unit disposed in the base 31, and an electromagnetic shielding element disposed on the base 31. 35. The electromagnetic shielding component % has a grounding portion 352. The sensing component 4 includes a lower surface 4i, an upper recording surface 42, a side edge 1 between the lower surface 41 and the upper surface 42, and a main (four) side surface 43 and a majority. a first guiding portion 44 disposed on the lower surface 41, a κ; a second guiding portion 45 on the surface, and a first connecting portion 44 electrically connected to the first guiding portion T and the first guiding portion A ground path 46 between the junctions 45. Step 76 is to assemble the lens unit on the sensing element 4 to electrically connect the grounding portion 352 of the electromagnetic screen 13 200935882 shielding element 35 with the second guiding portion 45 of the sensing element 4. Next, the foregoing steps will be described in detail. As shown in FIG. 5, FIG. 6 and FIG. 7, in step 75, the lens unit 3 includes a base 31 which is formed by electromagnetic molding in an in-mold molding manner. On the element 35, a lens 32, a filter 33 and a spacer %: 34 are disposed in the valley 311 of the base 31. In addition, a wafer 4 is provided, a plurality of sensing elements 4 are disposed on the wafer 4, and the upper surface 42 of each sensing element 4 of the wafer 4 is adhesively dust-proof in an automated manner. The sensing element 4 has two second guiding portions 45 on the upper surface 42 and two grounding paths 46. The upper surface 42 of each sensing element 4 is provided with two second guiding lines respectively connected to the grounding path 46. The grounding portion 46 is electrically connected between the second guiding portion 45 and the first guiding portion 44. Thereafter, as shown in FIG. 6, FIG. 8, and FIG. 9, in step 70, a plurality of lens units 3 are respectively assembled on the respective sensing elements 4 of the wafer 4, so that the electromagnetic shielding elements 35 of the respective lens sheets 7L3 are provided. The grounding portion 352 is flatly attached to the upper surface 42 of each sensing element 4 and is crimped to the second guiding portion 45. At the same time, the adhesive coated on the upper surface 42 of the sensing element 4 is adhered to the base 31. Then, the wafer 4 is thermally baked as shown in FIG. 8 so that the lens unit 3 is adhered to the sensing element 4 to form the lens module 3A. Thereafter, after each of the lens modules 300 is cut from the wafer 4 and subjected to image testing, the manufacturing operations of the lens modules 300 are completed. Since the foregoing steps are all performed by automated equipment, manual assembly can be reduced, thereby improving the yield of the process and reducing the manufacturing cost. In particular, the number of designs of the grounding portion 352, the second guiding portion 45, and the grounding path 电磁 of the electromagnetic screen 14 200935882 shielding element 35 may also be one, and the electromagnetic shielding element 35 and the first guiding connection may be achieved. The effect of the phase conduction of the portion 44 is not limited to the number of designs disclosed in the embodiment.
如圖H)所示’是本發明鏡賴組之[較佳實施例的 另-實施態樣，鏡頭额3⑽，構造大致與圖9所示的構造 相同’不同之處在於兩第二導接部45是位於感測元件4的 下表面41且分別鄰接兩側表面43的導接塾，兩接地部⑸ 呈直立狀地形成於罩本體351底端，兩接地部如分別平 貼於感測元件4的兩側表面43並與兩第二導接部45接觸 ，藉由各接地路徑46,電連接於各第二導接部牦與一第一 導接部44之間’使得電磁屏蔽元件35能與感測元件4的 第一導接部44電連接。 如圖11所示’是本發明鏡頭模組之第一較佳實施例的 又一實施態樣，鏡頭馳_’，構造大致與圖9所示的構造 相同，不同之處在於兩第二導接部45是位於感測元件4相 對側的側表面43上的導接墊’兩接地部353呈直立狀地形 成於罩本體351底端，兩接地部分別平貼於兩側表面 43並壓接於兩第二導接部45，藉由各接地路徑46，，電連接 於各第二導接部45與—第—導接部44之間，使得電磁屏 蔽元件3 5 i與感測元件4的第一導接部44電連接。 如圖12、圖13及圖14所示’是本發明鏡頭模組之第 二較佳實施例，該鏡頭模組310之構造及製造方法大致盥 第—較佳實施例相同，但鏡頭模組31〇的組成構件與第一 15 200935882 較佳實施例有所不同，尤π + 設於鏡頭触3 ^座^卜f 件35是罩 土座30外表面的金屬殼體， 3H)還包含-包覆於以3 鏡頭模、.且 面及感測元件4的下表面二二電磁屏蔽…5外表 幻下表面41的固定座36,電磁 35的接地部352呈水平狀地形成於罩本體35 貼吻元件4的上表面42並壓接於第二導二: © 鏡頭模組310的製造方法除了步驟75及步驟76外， 了 一步驟77，步驟77是以模内成型方式成型一包覆 於基座3〇、電磁屏蔽元件35及感測元件4上的固定座％ 。由於固U 36是包覆於基座％外表面、電磁屏蔽元件 35外表面及感測元件4的下表面4卜以將基座％、電磁屏 蔽凡件35及感測元件4固^在—起’因此，在本實施例中 ’鏡頭模組3的基座30與感測元件4的上表面42之間即 不需透過黏膠相黏接，藉由固定座36的配置，能提供鏡頭 〇 模組3與感測元件4之間另一種組裝的方式。 如圖/5所示’是本發明鏡頭模組之第二較佳實施例的 另一實施態樣，鏡頭模組31〇，構造大致與圖12所示的構造 相同，不同之處在於兩第二導接部45是位於感測元件4的 下表面41好別鄰接於兩側表面43的導接塾，兩接地部 353呈直立狀地形成於罩本體351底端，兩接地部分別 平貼於感測7C件4的側表面43並與兩第二導接部45接觸 ，藉由各接地路徑46,電連接於各第二導接部45與一第一 導接部44之間，使得電磁屏蔽元件35能與感測元件*的 16 200935882 第一導接部44電連接。 如圖16所示，是本發明鏡頭模組之第二較佳實施例的 又一實施態樣，鏡頭模組310”構造大致與圖12所示的構造 相同，不同之處在於兩第二導接部45是分別位於感測元件 4相對側的側表面43上的導接墊，兩接地部353呈直立狀 地形成於罩本體351底端，兩接地部353分別平貼於感測 元件4的側表面43並壓接於兩第二導接部45上，藉由各 〇 接地路徑46”電連接於各第二導接部45與一第一導接部44 之間，使得電磁屏蔽元件35能與感測元件4的第一導接部 44電連接。 如圖17、圖18、圖19及圖20所示，是本發明鏡頭模 組之第三較佳實施例，該鏡頭模組32〇之構造及製造方法 與第一較佳實施例有所不同。在本實施例中，鏡頭單元371 包含有二卡固於基座38且位於容置空間381内的鏡片39， 且鏡頭單元371也可視需求增加濾光片（圖未示）或間隔環（ Ο 圖未示）的配置。兩第二導接部45是位於感測元件4的下表 面41相對側的導接墊，且各接地路徑46，電連接於各第二 導接部45與一第一導接部44之間。 以下將對鏡頭模組320的製造方法進行說明，圖2〇所 示的主要流程為： 步驟78是提供一鏡頭單元371及一感測元件4，鏡頭 單元371包括一基座38及一設置於基座38内的鏡片39， 感測元件4包括一下表面41、一上表面42、一位於下表面 41與上表面42間的側表面43、多數個設置於下表面41的 17 200935882 第-導接部44、-位於表面的第二導接部45，及一電連接 於所述第-導接部44中的_第—導接部44與第二導接部 45之間的接地路徑46,。 步驟79疋組裝鏡頭單元371於感測元件4上。 步驟80是罩設—電磁屏蔽元件^於鏡頭單元π及 感測元件4上，使電磁屏蔽元件％的一接地部352與第二 導接部45電連接。 接著將針對前述各步驟進行詳細說明，在步驟78中， 鏡頭早7L 371是設有二卡固於基座38的鏡片39，當然鏡片 39的數量也可為-個或多數個，另外還提供有—晶圓、(圖未 示），該晶圓上佈設有多數個感測元件4,各感測元件4的 上表面42黏固有防塵元件5，各感測元件4具有二第二導 接部45及二接地路徑46,，各接地路徑46，電連接於各第二 導接部45及一第一導接部44之間。在步驟79中，將多數 個鏡頭單元371分別組裝於該晶圓的各感測元件4上，由 〇 於基座38底端塗佈有黏膠，因此基座38底端可黏接於防 塵π件5頂面。接著將該晶圓進行熱烘烤的作業，使得鏡 頭早7C 371霉占固於感測元件4上而形成一半成品，之後， 即可將各半成品由該晶圓上切割下來。接著，在步驟8〇中 ，將電磁屏蔽元件35罩設於各半成品的鏡頭單元371及感 測元件4外表面’電磁屏蔽元件35為—金屬殼體，藉由治 具將電磁屏蔽元件35的罩本體351底端彎折形成二呈水= 狀的接地部352，使各接地部352平貼於感測元件4的下表 面41並壓接於各第二導接部45 i，即完成各鏡頭模組似 18 200935882 的製造作業。 如圖21所示，是本發明鏡頭模組之第三較佳實施例的 另一實施態樣，鏡頭模組32〇,構造大致與圖17所示的構造 相同，不同之處在於兩第二導接部45是位於感測元件4的 上表面42且鄰接於兩侧表面43的導接墊，兩接地部 呈直立狀地形成於罩本體351底端，兩接地部353分別平 貼於兩側表面43並與兩第二導接部45接觸，藉由各接地 路徑46電連接於各第二導接部45與一第一導接部44之間 ，使得電磁屏蔽元件35能與感測元件4的第一導接部44 電連接。 如圖22所不，是本發明鏡頭模組之第三較佳實施例的 又一實施態樣，鏡頭模組320”構造大致與圖17所示的構造 相同，不同之處在於兩第二導接部45是分別位於感測元件 4相對側的侧表面43上的導接墊，兩接地部353呈直立狀 地形成於罩本體351底端，兩接地部353分別平貼於兩側 表面43並壓接於兩第二導接部45上，藉由各接地路徑46” 電連接於各第二導接部45與一第一導接部44之間，使得 電磁屏蔽元件35能與感測元件4的第一導接部44電連接 〇 如圖23所示，是本發明鏡頭模組之第四較佳實施例， 該鏡頭模組330之構造及製造方法與第一較佳實施例有所 不同。鏡頭單元372之基座380的容置空間383内設有一 鏡片組390，鏡片組390具有一與基座38〇的開孔384位置 相對應的鏡片391，基座380包括—外環面385及一與外環 19 200935882 面385相連接的底面386，鏡頭單元372的電磁屏蔽元件 350是以鍍膜（coating)形成於外環面385及底面386的金屬 層，且電磁屏蔽元件350具有二鍍於底面386的接地部354 。感測元件4的上表面42設置有二第二導接部45，各第二 導接部45為一金屬墊，各接地路徑46電連接於各第二導 接部45與一第一導接部44之間。另外，鏡頭單元372也 可視需求增加濾光片（圖未示）或間隔環（圖未示）的配置。 鏡頭單元372是經由圖6所示之步驟75及步驟76的 流程組裝於感測元件4上，電磁屏蔽元件350的接地部354 壓接於第二導接部45頂面，使得電磁屏蔽元件350能與感 測元件4的第一導接部44電連接。 歸納上述，上述各實施例的鏡頭模組300、300’、300” 、310、310’、310”、320、320’、320”、330，藉由第二導 接部45設置於感測元件4的上表面42或下表面41或側表 面43的設計，以及搭配接地路徑46、46’、46”連接於第二 導接部45與第一導接部44之間的設計，使得鏡頭單元3、 371、372與感測元件4組裝後，電磁屏蔽元件35、350的 接地部352、353、354能透過第二導接部45及接地路徑46 、46’、46”與感測元件4的第一導接部44電連接，因此鏡 頭模組 300、300’、300，’、310、310’、310，，、320、320’、 320”、330組裝於電路板7後，電磁屏蔽元件35、350的接 地部352、353、3 54即能與電路板7電連接，使得電磁屏 蔽元件35、350能達到良好的屏蔽效果。此外，藉由自動 化的組裝方式，能提高鏡頭模組300、300’、300”、310、 20 200935882 310 31G ' 32G、32G’、32G”、33G的生產良率，並能降低 製造成本，故確實能達到本發明所訴求之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 月b以此限定本發明實施之範圍，即大凡依本發明中請專利 範圍及發月說明内谷所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範_。另外本發明的任—實施例或 申月專利圍不須達成本發明所揭露之全部目的或優點或As shown in Fig. H), 'is another embodiment of the preferred embodiment, the lens amount 3 (10), and the structure is substantially the same as the structure shown in Fig. 9'. The difference is that the two second guides are different. The portion 45 is a guiding port located on the lower surface 41 of the sensing element 4 and abutting the side surfaces 43 respectively. The two grounding portions (5) are formed in an upright manner at the bottom end of the cover body 351, and the two grounding portions are respectively flattened to the sensing. The two side surfaces 43 of the component 4 are in contact with the two second guiding portions 45, and are electrically connected between the second guiding portions 牦 and the first guiding portion 44 by the grounding paths 46 to make the electromagnetic shielding component 35 can be electrically connected to the first guiding portion 44 of the sensing element 4. As shown in FIG. 11 , it is a further embodiment of the first preferred embodiment of the lens module of the present invention. The lens is configured to be substantially the same as the structure shown in FIG. 9 , except that the two second guides are different. The connecting portion 45 is a guiding pad on the side surface 43 of the opposite side of the sensing element 4. The two grounding portions 353 are formed in an upright manner at the bottom end of the cover body 351. The two grounding portions are respectively flat on the two side surfaces 43 and pressed. Connected to the two second guiding portions 45, electrically connected between the second guiding portions 45 and the first guiding portion 44 by the grounding paths 46, so that the electromagnetic shielding elements 3 5 i and the sensing elements The first guiding portion 44 of 4 is electrically connected. 12, FIG. 13 and FIG. 14 are the second preferred embodiment of the lens module of the present invention. The structure and manufacturing method of the lens module 310 are substantially the same as in the first preferred embodiment, but the lens module The 31 〇 component is different from the preferred embodiment of the first 15 200935882, in particular, the π + is disposed on the lens, and the member 35 is a metal casing on the outer surface of the cover 30, and 3H) further includes - The grounding portion 36 of the electromagnetic surface 35 is horizontally formed on the cover body 35 by a fixing seat 36 which is covered with a three-lens mold, a surface, and a lower surface of the sensing element 4; The upper surface 42 of the kiss element 4 is crimped to the second guide 2: © The lens module 310 is manufactured in a manner other than steps 75 and 76. Step 77 is performed by in-mold forming. The base of the base 3, the electromagnetic shielding element 35 and the sensing element 4 are fixed. Since the solid U 36 is coated on the outer surface of the susceptor, the outer surface of the electromagnetic shielding component 35, and the lower surface 4 of the sensing component 4, the susceptor %, the electromagnetic shielding component 35, and the sensing component 4 are fixed. Therefore, in the present embodiment, the pedestal 30 of the lens module 3 and the upper surface 42 of the sensing element 4 do not need to be adhered through the adhesive, and the lens can be provided by the configuration of the fixing seat 36. Another way of assembling between the 〇 module 3 and the sensing element 4. As shown in FIG. 5, which is another embodiment of the second preferred embodiment of the lens module of the present invention, the lens module 31A has the same structure as that shown in FIG. 12, and the difference lies in the two The second guiding portion 45 is a guiding port located on the lower surface 41 of the sensing element 4 and adjacent to the two side surfaces 43. The two grounding portions 353 are formed in an upright manner at the bottom end of the cover body 351, and the two grounding portions are respectively flattened. The side surface 43 of the 7C member 4 is sensed and is in contact with the two second guiding portions 45, and is electrically connected between the second guiding portions 45 and a first guiding portion 44 by the grounding paths 46, so that The electromagnetic shielding element 35 can be electrically connected to the 16 200935882 first guiding portion 44 of the sensing element*. As shown in FIG. 16, in another embodiment of the second preferred embodiment of the lens module of the present invention, the lens module 310" has the same structure as that shown in FIG. 12, except that the second guide is The connecting portion 45 is a guiding pad on the side surface 43 of the opposite side of the sensing element 4, and the two grounding portions 353 are formed in an upright manner at the bottom end of the cover body 351, and the two grounding portions 353 are respectively respectively attached to the sensing element 4 The side surface 43 is crimped to the two second guiding portions 45, and is electrically connected between the second guiding portions 45 and a first guiding portion 44 by the respective grounding paths 46", so that the electromagnetic shielding elements are 35 can be electrically connected to the first guiding portion 44 of the sensing element 4. As shown in FIG. 17, FIG. 18, FIG. 19 and FIG. 20, it is a third preferred embodiment of the lens module of the present invention. The structure and manufacturing method of the lens module 32 are different from those of the first preferred embodiment. . In this embodiment, the lens unit 371 includes two lenses 39 that are fixed to the base 38 and located in the accommodating space 381, and the lens unit 371 can also add a filter (not shown) or a spacer ring as needed. The figure is not shown). The two second guiding portions 45 are the guiding pads on the opposite sides of the lower surface 41 of the sensing component 4 , and the grounding paths 46 are electrically connected between the second guiding portions 45 and the first guiding portion 44 . . The following describes the manufacturing method of the lens module 320. The main flow shown in FIG. 2A is as follows: Step 78 is to provide a lens unit 371 and a sensing component 4, the lens unit 371 includes a base 38 and a The lens 39 in the pedestal 38, the sensing element 4 includes a lower surface 41, an upper surface 42, a side surface 43 between the lower surface 41 and the upper surface 42, and a plurality of 17 disposed on the lower surface 41. a connecting portion 44, a second guiding portion 45 located at the surface, and a grounding path 46 electrically connected between the first guiding portion 44 and the second guiding portion 45 of the first guiding portion 44 ,. In step 79, the lens unit 371 is assembled on the sensing element 4. In step 80, the electromagnetic shielding component is disposed on the lens unit π and the sensing component 4, and a grounding portion 352 of the electromagnetic shielding component % is electrically connected to the second guiding portion 45. Next, the foregoing steps will be described in detail. In step 78, the lens 7L 371 is provided with a lens 39 that is fixed to the base 38. Of course, the number of the lenses 39 may be one or more, and There is a wafer, (not shown), a plurality of sensing elements 4 are disposed on the wafer, and the upper surface 42 of each sensing element 4 is adhered to the dustproof element 5, and each sensing element 4 has two second guiding ends. The portion 45 and the two grounding paths 46 are electrically connected between the second guiding portions 45 and the first guiding portions 44. In step 79, a plurality of lens units 371 are respectively assembled on the sensing elements 4 of the wafer. Since the bottom end of the base 38 is coated with adhesive, the bottom end of the base 38 can be adhered to the dustproof. π piece 5 top surface. Then, the wafer is subjected to a hot baking operation, so that the lens is fixed on the sensing element 4 to form a half finished product, and then the semi-finished products are cut from the wafer. Next, in step 8A, the electromagnetic shielding component 35 is disposed on the outer lens surface 371 of each semi-finished product and the outer surface of the sensing component 4, the electromagnetic shielding component 35 is a metal casing, and the electromagnetic shielding component 35 is The bottom end of the cover body 351 is bent to form a grounding portion 352 having a water= shape, and the grounding portions 352 are flatly attached to the lower surface 41 of the sensing element 4 and crimped to the second guiding portions 45 i. The lens module is similar to the manufacturing work of 18 200935882. As shown in FIG. 21, in another embodiment of the third preferred embodiment of the lens module of the present invention, the lens module 32A has a structure substantially the same as that shown in FIG. 17, except that two and two are The guiding portion 45 is a guiding pad located on the upper surface 42 of the sensing element 4 and adjacent to the two side surfaces 43. The two grounding portions are formed in an upright manner at the bottom end of the cover body 351, and the two grounding portions 353 are respectively affixed to the two ends. The side surface 43 is in contact with the two second guiding portions 45, and is electrically connected between the second guiding portions 45 and a first guiding portion 44 by the grounding paths 46, so that the electromagnetic shielding member 35 can be sensed and sensed. The first guiding portion 44 of the element 4 is electrically connected. As shown in FIG. 22, in another embodiment of the third preferred embodiment of the lens module of the present invention, the lens module 320" has the same structure as that shown in FIG. 17, except that the second guide is The connecting portion 45 is a guiding pad on the side surface 43 of the opposite side of the sensing element 4, and the two grounding portions 353 are formed in an upright manner at the bottom end of the cover body 351, and the two grounding portions 353 are respectively flat on the two side surfaces 43. And being electrically connected to the two second guiding portions 45, and electrically connected between the second guiding portions 45 and the first guiding portion 44 by the grounding paths 46", so that the electromagnetic shielding member 35 can be sensed and sensed. The first guiding portion 44 of the component 4 is electrically connected to the fourth preferred embodiment of the lens module of the present invention. The lens module 330 is constructed and manufactured in accordance with the first preferred embodiment. Different. A lens group 390 is disposed in the accommodating space 383 of the base 380 of the lens unit 372. The lens group 390 has a lens 391 corresponding to the position of the opening 384 of the base 38, and the base 380 includes an outer ring surface 385 and A bottom surface 386 connected to the outer ring 19 200935882 surface 385, the electromagnetic shielding element 350 of the lens unit 372 is a metal layer formed on the outer ring surface 385 and the bottom surface 386 by coating, and the electromagnetic shielding element 350 has two plating The ground portion 354 of the bottom surface 386. The upper surface 42 of the sensing component 4 is provided with two second guiding portions 45. Each of the second guiding portions 45 is a metal pad, and each grounding path 46 is electrically connected to each of the second guiding portions 45 and a first guiding portion. Between the 44. In addition, the lens unit 372 can also increase the configuration of the filter (not shown) or the spacer ring (not shown) as needed. The lens unit 372 is assembled on the sensing element 4 via the flow of steps 75 and 76 shown in FIG. 6. The grounding portion 354 of the electromagnetic shielding element 350 is crimped to the top surface of the second guiding portion 45, so that the electromagnetic shielding element 350 It can be electrically connected to the first guiding portion 44 of the sensing element 4. In summary, the lens modules 300, 300', 300", 310, 310', 310", 320, 320', 320", 330 of the above embodiments are disposed on the sensing component by the second guiding portion 45. The design of the upper surface 42 or the lower surface 41 or the side surface 43 of the 4, and the design of the grounding path 46, 46', 46" connected between the second guiding portion 45 and the first guiding portion 44, so that the lens unit 3. After the 371, 372 and the sensing component 4 are assembled, the grounding portions 352, 353, and 354 of the electromagnetic shielding component 35, 350 can pass through the second guiding portion 45 and the grounding paths 46, 46', 46" and the sensing component 4. The first guiding portion 44 is electrically connected, so that the lens modules 300, 300', 300, ', 310, 310', 310, 320, 320', 320", 330 are assembled on the circuit board 7, and electromagnetic shielding The grounding portions 352, 353, and 3 54 of the components 35, 350 can be electrically connected to the circuit board 7, so that the electromagnetic shielding components 35, 350 can achieve a good shielding effect. In addition, by means of automated assembly, the production yield of the lens modules 300, 300', 300", 310, 20 200935882 310 31G '32G, 32G', 32G", 33G can be improved, and the manufacturing cost can be reduced. It is indeed possible to achieve the object of the present invention. However, the above is only a preferred embodiment of the present invention, and the scope of the present invention is limited by the fact that it is not limited to the scope of the present invention, that is, the scope of the patent in the present invention and the simple description of the valley in the month of the present invention. Both effect changes and modifications are still covered by the patent of the present invention. In addition, any of the embodiments or the patents of the present invention are not required to achieve all of the objects or advantages disclosed herein or
特點。此外，摘要部分和標題僅是用來輔助專利文件搜尋 之用，並非用來限制本發明之權利範圍。 【圖式簡單說明】 1是習知一種鏡頭模組與一電路板的立體圖 m 圖2是圖1的剖視圖； =3是本發明鏡頭㈣之第—較佳實施例應用於一電 于裝置上的局部剖視圖； 的剖視圖;疋本發明鏡碩模組之第一較佳實施例與-電路板 m d 圖，說明鏡H 模組之第—較佳實施㈣剖視分解 兄頭單70與感測元件的組I關係； 的流程圖；疋本發明鏡頭模組之第—較佳實施例的製造方法 意圖圖曰本：明鏡頭模组之第-較佳實施例的晶圓的示 說明a晶園上佈設有多數個感測元件； 意圖，說明二發單明,模組之第一較佳實施例的晶圓的示 皁疋組裝於晶圓的感測元件上； 21 200935882 圖9是本發明鏡頭模組之第一較佳實施例的剖視圖； 圖1G是本發明鏡頭模組之第—較佳實施例的另一實施 剖視圖，說明第二導接部位於感測元件的下表面’· 是本發明鏡頭模組之第-較佳實施例的又一實施 剖視圖，說明第二導接部位於感測元件的側表面，· 的剖是本發明鏡頭模組之第二較佳實施例與—電路板 1明本發月鏡頭％組之第二較佳實施例的—剖視圖 二一組裝於感測元件的上表面，且圖中未顯示 的流程圖；本發月鏡碩模組之第二較佳實施例的製造方法 =!5是本發明鏡頭模組之第二較佳實施例的另一實施 ^…剖視圖’說明第二導接部設置於感測元件的下表面 Ο 離^ 16是本發明鏡頭模組之第二較佳實施例的又一實施 剖視圖H導接部W収件的侧表面 圖17是 的剖視圖； 本發明鏡頭模組之第 施例與—電路板 二二 的剖視分解 圖19疋本發明鏡頭模組之第三較佳實施例 22 200935882 圖20是本發明鏡 的流程圖； 棋汲之第二較佳實施例的製造方法 熊檨I:疋本發明鏡頭模組之第三較佳實施例的 另一實施 :樣的剖視圖’說明第二導接部設置於感測元件的上表面 Ο 離圖22是本發明鏡頭模組之第三較佳實施例 的又一實施 〜的uj視圖’說明第二導接部設置於元件的側表面 :及 圖23是本發明鏡頭模組之第四較佳實施例與 一電路板 的剖視圖，電磁屏蔽元件是以㈣形成於外環面及底面的 金屬層。Features. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS [1] is a perspective view of a conventional lens module and a circuit board. FIG. 2 is a cross-sectional view of FIG. 1. The third embodiment of the lens (four) of the present invention is applied to a device. A cross-sectional view of a partial cross-sectional view of the present invention; a first preferred embodiment of the mirror module of the present invention and a circuit board md, illustrating a first embodiment of the mirror H module, and a fourth embodiment of the cross-sectional decomposition of the head unit 70 and sensing A flow chart of a component I relationship of a component; a manufacturing method of a preferred embodiment of the lens module of the present invention is intended to be a schematic view of a wafer of a preferred embodiment of the lens module A plurality of sensing elements are disposed on the garden; the intent is to indicate that the saponins of the wafer of the first preferred embodiment of the module are assembled on the sensing elements of the wafer; 21 200935882 FIG. 9 is 1 is a cross-sectional view of a first preferred embodiment of the lens module of the present invention; FIG. 1G is a cross-sectional view showing another embodiment of the lens module of the present invention, illustrating that the second guiding portion is located on the lower surface of the sensing element. Still another cross-sectional view of the first preferred embodiment of the lens module of the present invention, The second guiding portion is located on the side surface of the sensing element, and the cross section is the second preferred embodiment of the lens module of the present invention and the second preferred embodiment of the circuit board 1 - sectional view 21 assembled on the upper surface of the sensing element, and the flow chart not shown in the figure; the manufacturing method of the second preferred embodiment of the present invention is the fifth embodiment of the lens module of the present invention Another embodiment of the preferred embodiment is a cross-sectional view showing that the second guiding portion is disposed on the lower surface of the sensing element. FIG. 16 is still another embodiment of the second preferred embodiment of the lens module of the present invention. FIG. 17 is a cross-sectional view showing the first embodiment of the lens module of the present invention. FIG. 17 is a cross-sectional view of the lens module of the present invention. 200935882 Figure 20 is a flow chart of the mirror of the present invention; manufacturing method of the second preferred embodiment of the chessboard Xiong Yi I: Another embodiment of the third preferred embodiment of the lens module of the present invention: a cross-sectional view of the description The second guiding portion is disposed on the upper surface of the sensing element. FIG. 22 is the mirror of the present invention. In another embodiment of the third preferred embodiment of the head module, the uj view ′ illustrates that the second guiding portion is disposed on the side surface of the component: and FIG. 23 is a fourth preferred embodiment and a lens module of the present invention. In the cross-sectional view of the circuit board, the electromagnetic shielding component is a metal layer formed on the outer ring surface and the bottom surface by (iv).
23 20093588223 200935882
【主要元件符號說明】 20 .........電子裝置 200 .......本體 21 .........安裝空間 22 .........開口 300、300’·鏡頭模組 300”、310鏡頭模組 310’、310”鏡頭模組 320、320’·鏡頭模組 320”、330鏡頭模組 3 ..........鏡頭單元 30、31……基座 311 .......容置空間 312 .......開孔 32 .........鏡片 33 .........濾光片 34 .........間隔環 341 .......穿孔 35、350·…電磁屏蔽元件 351 .......罩本體 352、353··接地部 354 .......接地部 36.........固定座 371、372··鏡頭單元 38、380····基座 38卜383··容置空間 382、384·.開孔 385 .......外環面 3 86 .......底面 390 .......鏡片組 39、391 ····鏡片 40 .........晶圓 4 ..........感測元件 41 .........下表面 42 .........上表面 43 .........側表面 44 .........第一導接部 45 .........第二導接部 46 .........接地路徑 46’、46”…接地路徑 5 ..........防塵元件 7 ..........電路板 71.........銲接件 24[Description of main component symbols] 20 .........electronic device 200 . . . body 21 ......... installation space 22 ......... opening 300, 300' lens module 300", 310 lens module 310', 310" lens module 320, 320' lens module 320", 330 lens module 3 .......... lens Unit 30, 31... pedestal 311 .... accommodating space 312 . . . opening 32 ......... lens 33 ......... Filter 34 ... spacer ring 341 .... perforation 35, 350 · electromagnetic shielding element 351 ... ... cover body 352, 353 · grounding portion 354 . . . the grounding portion 36 ... ... fixed seat 371, 372 · · lens unit 38, 380 · · · · base 38 383 · · accommodating space 382, 384 ·. Opening 385 ....... outer annulus 3 86 ....... bottom surface 390 ....... lens group 39, 391 ···· lens 40 ........ Wafer 4 ..... sensing element 41 ... ... lower surface 42 ... ... upper surface 43 ........ Side surface 44 .... first guiding portion 45 ... ... second guiding portion 46 ... ... grounding path 46', 46" ...ground path 5 ..........dust-proof element 7 ..........circuit board 71......welding twenty four