200923471 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種製造顯示面板裝置的方法，特別是關於一種 薄化顯示面板裝置的方法。 i 【先前技術】 由於近年來光電技術不斷地進步，加上影像顯示技術進入數位 化時代，進而推動了液晶顯示器市場的蓬勃發展。液晶顯示器因 (； 為具有高晝質、輕薄、低消耗功率、無輻射等優點，因此被廣泛 地應用於個人數位助理（PDA)、行動電話、攝錄放影機、筆記型電 腦、桌上型顯示器、車用顯示器及投影電視等消費性通訊或電子 產品之上，並逐漸取代傳統陰極射線管，成為顯示器市場上的主 流。 其中，液晶顯示器的一個關鍵零組件，即是液晶顯示面板。現 今液晶顯示面板的製程技術，除了追求大尺寸之外，亦同時朝向 輕量化及薄型化的方向發展，特別是當液晶顯示器應用於可攜式 ' 電子產品時，液晶顯示面板之厚度'，將直接影響最終產品之體積， 故此業界對於液晶顯示面板的薄型化和輕量化，一直有著強烈的 需求。 1 然而，習知基板薄化技術仍有其限制。一旦將基板薄化至特定 厚度以下，基板容易產生撓曲，此時便無法再繼續進行薄化製程， 否則將會影響液晶顯示面板之整體平坦度並可能產生破片；舉例 而言，習知的基板薄化技術，若利用氳氟酸(HF)溶液，僅能將玻 璃基板由0.5毫米（mm)钮刻至0.3毫米（mm)，便無法再繼續薄化， 200923471 否則將對麵基板之平坦度造成不良影響，習知技術的薄化效果 確實存在其限制。 有鑑於此，為了提供更為輕薄之液晶顯示器，如何進—步減少 顯不面板之基板厚度，已成為此_業界亟待解決的重要課題。 【發明内容】 本發明之一目的在於提供一種薄化一顯示面板裝置的方法，本 發明之方法係利用二次單側薄化製程，分別對二基板加以薄化。 於第一次溥化製程後，先利用一承載裝置或承載板，承載已薄化 之基板，然後再對另一基板縳费薄化作業，如此一來，可避免於 薄化製程中，基板產生撓曲。 本發明之另一目的在於提供一種薄化一顯示面板裝置的方法， 猎由分次薄化，且針對已薄化基板提供支撐之製程，可用於製作 超薄化顯示面板裝置，薄化後的面板厚度可大幅降低，且亦適用 於生產大面積顯示面板。此外，本發明之製造方法可提供較佳之 薄化效果，且可符合量產之需求。 為達到上述目的，本發明提供一種用於薄化一顯示面板裝置的 方法，顯不面板裝置包括一第一基板與一第二基板。用於該薄化 面板裝置的方法包含以下步驟〆先薄化第一基板；接著支撐已薄 化之第一基板；以及薄化第二基板。於一實施例中，支撐已薄化 之第一基板的步驟係以一承載裝置，至少局部依附於已薄化之第 一基板之外側上；於另一實施例中，支撐已薄化之第一基板的步 驟係以一承載板，依附於已薄化之第一基板之一外側；其中，該 承載板可藉由一膠材貼附於已薄化之第一基板之外側上。 200923471 為讓本發明之上述目的、技術特徵、和優點能更明顯易懂，下 文係以較佳實施例配合所附圖I式進行詳細說明。 【實施方式】 以下之實施例及圖式係用以舉例說明本發明内容，並非用以限 制本發明。 首先請參見第1A圖至第1G圖，第1A圖至第1G圖係本發明用 於薄化一顯示面板裝置之方法之一實施例之示意圖。在此實施例 中，顯示面板裝置包括第一基板10與第二基板20，第一基板10 與第二基板20首先相互組立(assembly)。其中，第一基板10上可 形成有薄膜電晶體陣列，例如形成至少一開關元件與至少一晝素 電極，第二基板20例如形成一彩色濾光層於其上。第一基板10 與第二基板20間可藉由密封膠30(sealant)進行結合，而第一基板 10與第二基板20之間夾有一中間物，例如注入一液晶層40。 須說明的是，第一基板10與第二基板20之材質例如為玻璃、 塑膠等硬質或軟質材料，且第一基板10與第二基板20之材質可 為相同或不相同，在此不作限制，而目前液晶顯示面板所使用的 基板材料以玻璃為主，主要是因為玻璃具有耐高溫、耐化學性、 安定性高等特性。此外，為方便說明，此實施例中之第一基板10 與第二基板20之起始厚度分别^為tl，然而第一基板10與第二基 板20之起始厚度亦可為相同或不相同之厚度，仍可實施本發明之 方法。 本發明用於薄化一顯示面板裝置之方法，主要包含以下步驟： 首先薄化第一基板10 ;接著支撐已薄化之該第一基板10’ ；然後 200923471 薄化第二基板20。 第一基板10與第二基板20可利用以下之方式將厚度減薄： (1) 化學蝕刻方法：利用一種鮮刻溶液(solution)，例如氫氟酸(HF) 溶液，對基板進行蝕刻；進行之方式例如將蝕刻溶液喷麗或喷淋 在基板上以蝕刻基板’或者將基板置於具有蝕刻溶液之蝕刻槽中 進行蝕刻，其中蝕刻槽中可具有夾具以安置基板，蝕刻槽中可產 生氣泡來餘刻基板。 (2) 研磨（polish)方法：利研磨裝置對基板進行物理或機械性研 磨，其中研磨裝置可包括研磨墊或研磨劑。 (3) 化學截刻方法與研磨（polish)方法組合之製程方式進行。 如第1A圖至第1C圖所示，先將第一基板1〇與第二基板2〇組 立之後，可預先利用一密封秫擎P 32，對第一基板1〇與第二基板 20之邊緣進行密封，以避免後續製程所使用之其它溶劑或材料（例 如触刻溶液或研磨劑）進入第一基板1 〇與第二基板20間；此外， 如第1C圖所示，可選擇性地形成保護層12於第二基板20之一外 側上，保護層12例如為含蠟薄膜、氮化物(nitride)、薄膜鉑金屬 薄膜、或其他抗強酸或抗研磨劑材料之薄膜。然後，便可開始對 第一基板10進行薄化，薄化的方式可利用前述之化學蝕刻、機械 研磨、或其組合之製程方式進行。舉例而言，例如以化學蝕刻的 方式薄化第一基板10。當第一基板10於強酸溶液中蝕刻一預定的 時間後，第一基板10之厚度原先之tl減薄為t2，形成已薄化 之第一基板10’，如第1C圖所示。 請參照第1D圖至第1F圖，在薄化第一基板10之後，可利用一 200923471 承載板50，依附於已薄化之第一基板1〇’的外側上，以承載該已 薄化之第一基板10,，避免因為基板厚度過薄而導致撓曲。於一實 施例中，可利用膠材52將承載板50貼附於已薄化之第一基板10, 之外側上，支撐已薄化之第一秦板1〇,，如此一來，可避免已薄化 之第一基板10’產生撓性變形，導致毀壞而降低生產率。 接著，如第1E圖所示，將第二基板20進行薄化，同樣地，薄 化的方式可以化學餘刻、機械研磨、或其組合之製程方式進行， 以形成已薄化之第二基板20’。舉例來說，在本實施例中，若薄化 第二基板20以化學蝕刻的方式進行，當第二基板2〇於強酸溶液 中蝕刻一預定的時間後，第二基板2〇之厚度由原先之tl減薄為200923471 IX. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing a display panel device, and more particularly to a method of thinning a display panel device. i [Prior Art] Due to the continuous advancement of optoelectronic technology in recent years, and the introduction of image display technology into the digital age, the liquid crystal display market has been booming. LCD monitors are widely used in personal digital assistants (PDAs), mobile phones, camcorders, notebook computers, and desks because of their high quality, light weight, low power consumption, and no radiation. On the consumer communication or electronic products such as display, car display and projection TV, and gradually replace the traditional cathode ray tube, it has become the mainstream in the display market. Among them, a key component of the liquid crystal display is the liquid crystal display panel. In addition to pursuing large size, the current process technology of liquid crystal display panels is also moving toward lighter and thinner, especially when liquid crystal displays are used in portable 'electronic products, the thickness of liquid crystal display panels'. The size of the final product is directly affected, so there is a strong demand for the thinning and weight reduction of the liquid crystal display panel. 1 However, the conventional substrate thinning technique still has limitations. Once the substrate is thinned to a certain thickness or less, The substrate is prone to deflection, and it is no longer possible to continue the thinning process, otherwise it will affect The overall flatness of the liquid crystal display panel may cause fragmentation; for example, the conventional substrate thinning technique can only use the fluoric acid (HF) solution to inscribe the glass substrate from 0.5 mm (mm) to 0.3 mm. (mm), can no longer continue to thin, 200923471 Otherwise will adversely affect the flatness of the opposite substrate, the thinning effect of the conventional technology does have its limitations. In view of this, in order to provide a thinner and lighter liquid crystal display, how to enter - The step of reducing the thickness of the substrate of the panel has become an important issue to be solved in the industry. SUMMARY OF THE INVENTION An object of the present invention is to provide a method for thinning a display panel device, the method of the present invention is used twice The single-side thinning process is used to thin the two substrates respectively. After the first deuteration process, a carrier device or a carrier plate is used to carry the thinned substrate, and then the other substrate is thinned. In this way, the substrate can be prevented from being deflected during the thinning process. Another object of the present invention is to provide a method for thinning a display panel device. The process of thinning and providing support for the thinned substrate can be used to fabricate an ultra-thin display panel device, and the thickness of the thinned panel can be greatly reduced, and is also suitable for producing a large-area display panel. Further, the manufacturing of the present invention The method can provide a better thinning effect and meet the requirements of mass production. To achieve the above object, the present invention provides a method for thinning a display panel device, the display panel device comprising a first substrate and a second The method for the thinned panel device comprises the steps of: first thinning the first substrate; then supporting the thinned first substrate; and thinning the second substrate. In one embodiment, the support is thinned The step of the first substrate is at least partially attached to the outer side of the thinned first substrate; in another embodiment, the step of supporting the thinned first substrate is attached by a carrier plate. The outer side of one of the thinned first substrates; wherein the carrier plate is attached to the outer side of the thinned first substrate by a glue. The above objects, technical features, and advantages of the present invention will become more apparent from the following description. The following examples and drawings are intended to illustrate the invention and are not intended to limit the invention. Referring first to Figures 1A through 1G, Figures 1A through 1G are schematic views of one embodiment of a method for thinning a display panel device of the present invention. In this embodiment, the display panel device includes a first substrate 10 and a second substrate 20, and the first substrate 10 and the second substrate 20 are first assembled to each other. The first substrate 10 may be formed with a thin film transistor array, for example, at least one switching element and at least one halogen electrode, and the second substrate 20 forms, for example, a color filter layer thereon. The first substrate 10 and the second substrate 20 can be bonded by a sealant 30, and an intermediate is interposed between the first substrate 10 and the second substrate 20, for example, a liquid crystal layer 40 is injected. The material of the first substrate 10 and the second substrate 20 is a hard or soft material such as glass or plastic, and the materials of the first substrate 10 and the second substrate 20 may be the same or different, and are not limited herein. At present, the substrate material used in the liquid crystal display panel is mainly glass, mainly because the glass has high temperature resistance, chemical resistance, and high stability. In addition, for the convenience of description, the initial thicknesses of the first substrate 10 and the second substrate 20 in this embodiment are respectively t1, but the initial thicknesses of the first substrate 10 and the second substrate 20 may be the same or different. The thickness of the invention can still be practiced. The method for thinning a display panel device of the present invention mainly comprises the steps of: first thinning the first substrate 10; then supporting the thinned first substrate 10'; and then thinning the second substrate 20 with 200923471. The first substrate 10 and the second substrate 20 may be thinned in the following manner: (1) Chemical etching method: etching a substrate by using a fresh solution such as a hydrofluoric acid (HF) solution; For example, the etching solution is sprayed or sprayed on the substrate to etch the substrate or the substrate is placed in an etching bath having an etching solution for etching, wherein the etching groove may have a jig to set the substrate, and bubbles may be formed in the etching groove. Come back to the substrate. (2) Polish method: The polishing apparatus physically or mechanically grinds the substrate, wherein the polishing apparatus may include a polishing pad or an abrasive. (3) The chemical cutting method is combined with the polishing method. As shown in FIG. 1A to FIG. 1C, after the first substrate 1A and the second substrate 2 are assembled, the edge of the first substrate 1 and the second substrate 20 may be preliminarily utilized by a sealed engine P32. Sealing is performed to prevent other solvents or materials (such as etch solution or abrasive) used in subsequent processes from entering between the first substrate 1 and the second substrate 20; further, as shown in FIG. 1C, selectively formed The protective layer 12 is on the outer side of one of the second substrates 20. The protective layer 12 is, for example, a wax-containing film, a nitride, a thin film of a platinum metal, or other film resistant to a strong acid or anti-abrasive material. Then, the first substrate 10 can be thinned, and the thinning can be performed by the above-described chemical etching, mechanical polishing, or a combination thereof. For example, the first substrate 10 is thinned, for example, by chemical etching. After the first substrate 10 is etched in the strong acid solution for a predetermined period of time, the thickness of the first substrate 10 is originally thinned to t2 to form the thinned first substrate 10' as shown in Fig. 1C. Referring to FIGS. 1D to 1F, after thinning the first substrate 10, a 200923471 carrier 50 can be attached to the outer side of the thinned first substrate 1' to carry the thinned The first substrate 10 avoids deflection due to the thickness of the substrate being too thin. In an embodiment, the carrier 50 can be attached to the outer side of the thinned first substrate 10 by using the adhesive material 52 to support the thinned first Qin plate, so that it can be avoided. The thinned first substrate 10' is flexibly deformed, resulting in destruction and reduced productivity. Next, as shown in FIG. 1E, the second substrate 20 is thinned, and similarly, the thinning can be performed by chemical etching, mechanical polishing, or a combination thereof to form a thinned second substrate. 20'. For example, in the embodiment, if the thinned second substrate 20 is performed by chemical etching, after the second substrate 2 is etched in the strong acid solution for a predetermined time, the thickness of the second substrate 2 is originally Tl thinning to
t2在薄化第二基板20之前’可先移除保護層12。另外，如第1E 圖所不，可選擇性形成保護層22於承载板50之外侧上，保護層 22例如為含蠟溥臈、氮化物(nyride)、薄膜鉑金屬薄膜、或其他抗 5金酸或杬研磨劑材料之薄臈。再者，如第ie圖所示，為了避免例 如蚀刻冷液或研磨劑進人承載板50與該已薄化之第—基板1〇, 間可藉由狁封材料32，對承載板50與該已薄化之第一基板1〇, 之邊緣進行密封。 如第1E圖所示，已薄化之第一基板10,與已薄化之第二基板20, 的旱度刀別為t2。'然而在其他之實施例中，當第-基板1G與第二 ^板20之起始厚度不相同時薄化之第-基板10,與已薄化之 第板20可具有不同之厚度。亦或，當第一基板1〇與第二基 走'始厚度相同’藉由'控制不同之钱刻的時間，已薄化之第 一基板1〇’盘P键儿 /、匕/專化之第二基板20,可具有不同之厚度。 200923471 薄化第二基板20後，最後移除承載板50。在本實施例中，係藉 由膠材52使該承載板50貼附於已薄化之第一基板10’之外側上； 在形成已薄化之第二基板20，.之後，可利用切割刀將邊緣之膠材 52切除，使得承載板50與顯示面板裝置分離，如第1F圖及第1G 圖所示。第2A圖至第2E圖傳本發明用於薄化一顯示面板裝置之 方法的第二實施例之示意圖。在此實施例中，顯示面板裝置包括 第一基板10與第二基板20,第一基板10與第二基板20首先相互 組立（assembly)。其中，第一基板10上可形成開關元件、發光元 件與導線層，第二基板20可藉由密封膠30(sealant)貼附第一基板 10。上述開關元件例如為薄膜電'晶體，而發光元件例如為有機發 光元件。 首先，如第2A圖〜第2B圖所示，先將第一基板10進行薄化， 薄化的方式可以化學蝕刻、機械研磨、或其組合之製程方式進行； 第一基板10之厚度由原先之妙’減薄為t2。接著，如第2C圖所示， 第一基板10在薄化之後形成已薄化之第一基板10,，然後以承載 裝置60 至少局部依附於該已薄化之第一基板1〇,之外側上，以 提供已薄化之第一基板10’一支撐的力量，避免產生挽曲；承載裝 置60例如藉由黏貼或吸附之方式至少局部依附於已薄化之第一基 板10’之外側上。繼之，如第2D圖〜第2E圖所示，將第二基板20 進行薄化，同樣地，薄化的方式可以化學蝕刻、機械研磨、或其 組合之製程方式進行，以形成已薄化之第二基板20,；第二基板 2〇由原先之之厚度tl減薄為已薄化之第二基板20,之厚度t3。最 後再將承載裝置60移除。t ’ 200923471 藉由本發明之用於薄化一顯示面板裝置的方法，已薄化之第一 基板10’與已薄化之第二基板20,之厚度可達到〇 〇5毫米（mm)以下 厚度，相較於先前技術，基板厚度可大幅降低。在其他實施例中， 例如將第一基板10或第二基板20先以化學蝕刻方法進行蝕刻， 再對第一基板10或第二基板20進行研磨（p〇lish)，已薄化之第一 基板10’或已薄化之第二基板2,0’之厚度甚至可減薄至0 〇2毫米 (mm)以下厚度。綜上所述，相較於習知的薄化製程薄化基板至一 定程度後可能產生撓性變形，導致製備薄化示面板裝置的困難度 增加，故基板仍具有相當厚度之缺點；本發明所揭示之方法，可 避免基板因撓性所造成之製程極限，特別是因應平面顯示面板之 大型化的薄化需求’其為簡易、具量產性且可提高生顯產率之薄 化一顯示面板裝置的方法。 上述之實施例僅用來例舉本發明之實施態樣，以及闡釋本發明 之技術特徵’並非用來限制本發明之保護範嗜。任何熟悉此技術 者可輕易完成之改變或均等牲-之安排均屬於本發明所主張之範 圍，本發明之權利保護範圍應'以申請專利範圍為準。 【圖式簡單說明】 第1A圖至第1G圖係本發明之一實施流程示意圖；以及 第2 A圖至第2E圖係本發明之另一實施流程示意圖。 【主要元件符號說明】 1〇 第一基板 10， 已薄化之該第一於板 200923471 12 保護層 20 第二基板 20， 已薄化之第二基板 22 保護層 30 密封膠 32 密封材料 40 液晶層 50 承載板 52 膠材 60 承載裝置 tl 厚度 t2 厚度 t3 厚度The protective layer 12 may be removed first before the second substrate 20 is thinned. In addition, as shown in FIG. 1E, the protective layer 22 may be selectively formed on the outer side of the carrier plate 50, and the protective layer 22 is, for example, a wax-containing ruthenium, a nitride, a thin film of a platinum metal film, or other anti-5 gold. A thin layer of acid or bismuth abrasive material. Furthermore, as shown in the figure, in order to avoid, for example, etching cold liquid or abrasive into the carrying plate 50 and the thinned first substrate 1 , the sealing material 32 can be used to the carrier plate 50 and The edge of the thinned first substrate 1 is sealed. As shown in FIG. 1E, the wetted blade of the thinned first substrate 10 and the thinned second substrate 20 is t2. However, in other embodiments, the thinned first substrate 10 may have a different thickness from the thinned first plate 20 when the initial thicknesses of the first substrate 1G and the second plate 20 are different. Or, when the first substrate 1 〇 is the same as the second base, the first substrate is thinned by the control of the different time, and the thinned first substrate 1 〇 'disk P key /, 匕 / specialization The second substrate 20 can have different thicknesses. 200923471 After the second substrate 20 is thinned, the carrier 50 is finally removed. In this embodiment, the carrier 50 is attached to the outer side of the thinned first substrate 10' by the adhesive 52; after the thinned second substrate 20 is formed, the cutting can be utilized. The knife cuts the edge of the glue 52 so that the carrier 50 is separated from the display panel assembly, as shown in Figures 1F and 1G. 2A to 2E are views showing a second embodiment of the method for thinning a display panel device of the present invention. In this embodiment, the display panel device includes a first substrate 10 and a second substrate 20, and the first substrate 10 and the second substrate 20 are first assembled with each other. The first substrate 10 can be formed with a switching element, a light emitting element and a wire layer, and the second substrate 20 can be attached to the first substrate 10 by a sealant 30. The above switching element is, for example, a thin film electric 'crystal, and the light emitting element is, for example, an organic light emitting element. First, as shown in FIGS. 2A to 2B, the first substrate 10 is first thinned, and the thinning can be performed by chemical etching, mechanical polishing, or a combination thereof; the thickness of the first substrate 10 is originally The wonderful 'thinning is t2. Next, as shown in FIG. 2C, the first substrate 10 is formed into a thinned first substrate 10 after being thinned, and then at least partially attached to the thinned first substrate 1〇 by the carrier 60. In order to provide a support for the thinned first substrate 10', the load-carrying device 60 is at least partially attached to the outer side of the thinned first substrate 10' by, for example, pasting or adsorbing. . Then, as shown in FIGS. 2D to 2E, the second substrate 20 is thinned, and similarly, the thinning can be performed by chemical etching, mechanical polishing, or a combination thereof to form a thinned portion. The second substrate 20 is thinned from the original thickness tl to the thinned second substrate 20 by a thickness t3. The carrier device 60 is finally removed. t '200923471 By the method for thinning a display panel device of the present invention, the thinned first substrate 10' and the thinned second substrate 20 can have a thickness of less than 5 mm (mm) The substrate thickness can be greatly reduced compared to the prior art. In other embodiments, for example, the first substrate 10 or the second substrate 20 is first etched by a chemical etching method, and then the first substrate 10 or the second substrate 20 is polished, which is thinned first. The thickness of the substrate 10' or the thinned second substrate 2, 0' may even be reduced to a thickness below 0 〇 2 mm (mm). In summary, the thinning of the substrate may result in a flexible deformation compared to the conventional thinning process, resulting in an increase in the difficulty of preparing the thinned panel device, so that the substrate still has the disadvantage of considerable thickness; The disclosed method can avoid the process limit caused by the flexibility of the substrate, especially in response to the large-scale thinning requirement of the flat display panel, which is simple, mass-produced and can improve the thinning of the yield. A method of displaying a panel device. The above-described embodiments are merely illustrative of the embodiments of the present invention, and the technical features of the present invention are not intended to limit the scope of the present invention. Any changes or equivalents that can be easily made by those skilled in the art are within the scope of the invention, and the scope of the invention should be determined by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1A to 1G are schematic views showing an implementation flow of the present invention; and FIGS. 2A to 2E are schematic views showing another embodiment of the present invention. [Main component symbol description] 1〇 first substrate 10, the first plate 1223, which has been thinned 12 protective layer 20 second substrate 20, thinned second substrate 22 protective layer 30 sealant 32 sealing material 40 liquid crystal Layer 50 carrier plate 52 glue 60 carrier device tl thickness t2 thickness t3 thickness