TW200920206A - Method for plating wiring board, and wiring board - Google Patents

Abstract

A method for plating a wiring board is provided. In the method, to selectively plate a plating target area on the wiring board wherein a circuit pattern having an unevenness of 25[mu]m or more is formed on an insulating base material, areas other than the plating target area are masked. For masking, a masking film wherein an adhesive layer and a releasing sheet are laminated in sequence on one surface of a polybutylene terephthalate film is used.After removing the releasing sheet of the masking film, the adhesive layer surface of the masking film is bonded to a prescribed area on the wiring board under the thermoneutral environment, the work is bonded by thermocompression bonding, then, the plating target area is plated. A wiring board using such plating method is also provided. An area not to be plated is not plated by entry of a plating solution, even a wiring board has a large unevenness in a circuit pattern. Furthermore, the masking film has excellent blanking workability, and generation of especially a bur and a hole is prevented.

Description

200920206 IX. OBJECTS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a mineral deposit method and a wiring substrate for mineral depositing in a manufacturing step of a wiring substrate, and more particularly, a connection to a flexible printed circuit board or the like A plating method using a masking film and a wiring board obtained therefrom by selective plating are applied to a specific portion of a terminal or the like. [Prior Art] As shown in Fig. 1, the wiring board is formed by etching a laminate of a conductor layer of a conductor layer formed by laminating copper or the like via an adhesive layer on the insulating substrate 4. Form any circuit pattern, etc. : The surface of the circuit pattern 2 is formed with a metallized layer which reduces the electric resistance, protects the metal surface by emulsification or friction, or charges according to expectations. Furthermore, the circuit board is not connected to the wafer or the electrode, and the insulating film is applied according to the desired adhesive film. The method of forming the above-described mineral deposit layer, for example, as a method of making a portion (4) for connecting a terminal portion or the like, is a method of plating or electroless plating after a masking tape is formed without forming a mineral deposit layer in a non-bell portion. However, in the surface of the printed circuit board and the flexible printed circuit board to which the masking tape is attached, since the complicated unevenness of the circuit pattern formed first is formed, the masking tape needs to follow the unevenness to prevent the plating liquid from entering the mask portion. If the adhesiveness of the masking tape is low, the immersion of the mineralizing solution is liable to occur, and the reduction of the clocking force f' becomes a cause of circuit malfunction. Such a problem, plating or masking method, 'Proposal, for example, among the keying portions of the wiring substrate, 5 2033-97〇3-PF; Ahddub 200920206 applies selective plating to a predetermined target portion, When masking other plating target portions, a masking method for a masking film sheet having an adhesive surrounding the non-adhesive surface and covering the other plating target portions with the wiring substrate is used (Patent Document) ).

In addition to the above-mentioned masking method, in order to improve the plating precision, a soft f-vinyl resin is used as a support for the masking tape. However, recently, when it is disposed (incineration) by the gas-based resin, There is a problem with the adverse effects on the environment, so the proposal has the following mask materials. In the case of forming a plating layer, a plating method comprising a polyimide or a polyacetate is prevented from adhering via an adhesive (Patent Document 2 is a masking tape which is provided with a water-soluble or water-dispersible adhesive on a substrate) Adhesive layer of a benzotriazole-based compound (Patent Document 3); a mask adhesive film which is a resin film mainly composed of a polypropylene and a polyolefin-based elastomer, and when the 'ι〇% is skewed The adhesive sheet having a film tensile stress of 0.20 kg/m 2 to 80.80 kg/m 2 is provided on one side of the support (Patent Document 4); an adhesive film for a plating mask, characterized in that the density is 0 。 kg g g g g g g g g g g g 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 An adhesive layer is disposed on the side of the ethylene-vinyl acetate copolymer layer (Patent Document 5); a protective film for a plating mask, which has a thickness of 1 〇 to 2 〇M m and a tensile modulus of 0.5 to 150 kg. a layer composed of a soft resin of /mm2 (layer A) and a layer of resin having a bending strength of 5 to 30 kg/mm2 (B) The two or more layers of the multilayer film are provided as a support, and an adhesive layer is provided on the side of the layer A (Patent Document 6); a masking tape for metal plating, which is characterized in that it is attached to 2033-9703 - PF; Ahddub 6 200920206 One side of the substrate, comprising a propylene having a carbon number of 4 to 12 and ethylene as a copolymerized polypropylene copolymer, comprising a differential scanning calorimeter (DSC) at 0 to 200 ° C The temperature range is measured by an adhesive of a propylene-based copolymer having no endothermic peak of 1 J/g or more (Patent Document 7); a masking tape for metal ore coating, which is provided on one side of a substrate, An adhesive having a modulus of elasticity of 50 to 750 N/cm 2 after bridging, the adhesive comprising 5 to 45 wt% of (a) mercaptopropyl acrylate monomer, (b) comprising a warp group and (a) a copolymer of 0.5 to 15% by weight of the copolymerized monomer, and (c) a copolymer of the above-mentioned (and (13) copolymerized alkyl acrylate monomer, having the same or more than two or more isocyanate groups A polymer obtained by bridging a cyanic acid vinegar compound. [Patent Document 丨] Japanese Laid-Open Patent Publication No. Hei No. Hei 1 1-12783 [Patent Document 2] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Patent Document 7] Japanese Laid-Open Patent Publication No. 2003-35965 (Patent Document No. 2004-35965) SUMMARY OF THE INVENTION However, Patent Document i

2033-9703-PF; the masking method of Ahddub, or the non-plating part of the 'patent documents 2, 3, the adhesion follow-up of the recording liquid intrusion prevention due to the formation of the adhesive, 8 are in the formation The face is still not full 7 200920206 The foot is it, and the mask material is adhered to the circuit pattern::: film: the situation between the air. Also, a temperature = force deviation occurs, or adhesion of the adhesive layer... The thickness of the above-mentioned size changes and peels off 1 and the non-(four) part = falls or depends on the temperature of the mineral processing treatment's air expansion two masks The problem. In addition, in the patent documents 4 to 6, it is proposed that even if the electricity is used: (5) the glass epoxy printed substrate of 25" is used, There will be no shovel infusion immersion, for the ancient stalks to pass through the u, +,, 'and ~...~, 54 the same 'to stick the mask material to the circuit two rolls is difficult to prevent the interface between the wiring substrate and the mask material Into the air. When the picture is affixed to the empty ground, the circuit can be used even if the bump is large: the liquid is not easily immersed in the non-plated part, but it is not involved in =^' labor or time consuming and only In order to paste, it is necessary to re-import a high amount of machinery, which has the problem of reducing production efficiency or increasing cost. The shape is complicated by the complexity of the circuit pattern, and it is fine for the complicated #: uniform plating treatment, and more electroless plating is performed. The temperature of the electric ore deposit is higher than that of the snow. You are the main + & (5〇9frr, the temperature of the electric mine (3., the high temperature of the magic plating is r J), depending on the temperature of the mineral deposit. And the cover film is collected in %, or after the mineral deposit treatment, the mask film is made up of the layer of the body agent - part of the can Residual glue is placed on the body, and in the same way, the precision of the mineral deposit is required to wipe off the adhesive remaining on the object to become "a problem in reducing productivity and product quality." The problem underlying the present invention is to provide good followability of the pattern of the problem points and entrapment of air during adhesion prevention, and by: 2033-97〇3-PF; Ahddub 〇200920206 liters of the opening process when the opening is formed A method of depositing money and a wiring board obtained by the plating method to improve productivity and plating precision. According to the results of the research conducted by the present invention, it has been found that the selective plating is applied to the plating target portion of the wiring board having a large unevenness of the circuit m and 0. The cover film covers the part of the plating target, and the #film is not followed by the size of the unevenness. As a result, the plating solution can be prevented from being immersed in the person: I a and the object is placed outside the position of the 卩, and the height can be obtained. Plating

The plating method of the degree and the use of the method can obtain a higher quality wiring base anti-' and by using a specific adhesive layer as the above masking film: in the adhesion step to inhibit the adhesive of the masking film Between the layer and the adhesive portion 1 can prevent the immersion or plating precision of the plating liquid which is caused by the expansion of the air entrained during the mineral deposit treatment, and the present invention can be completed. That is, the present invention provides the following mineral deposit method and the wiring board obtained thereby. έ [1] A method of plating a wiring board, which is characterized in that a wiring board having a circuit pattern having irregularities of 25 # m or more is formed on a soil plate, and a σρ-position remote selective mineral deposit is applied. The masking film is used to cover the d-layer and the masking film of the release film on one side of the 4-p-phenylene phthalate-butane vinegar film, and the release film of the mask film is peeled off. After the adhesive layer of the cover film is adhered to a predetermined portion of the wiring substrate in a normal temperature environment, the target portion is further plated by thermocompression bonding. [4] The method of mineralizing a wiring board according to the above [1], wherein the adhesive layer of the mask film is based on JIS z 8741, and the specular gloss of 6G is 30% or less 'and the initial peeling force of the following test (4) It is 2033-9703-PF; Ahddub 9 200920206 〇. Bu 1. 0N/2 5mm and (b) a masking film having a ball adhesion value of 3 or less. (a) Initial peeling force After the production, the mask film which was not subjected to heat treatment or ultraviolet irradiation treatment was cut into a test piece having a width of 25 minutes and a length of 250 mm, and a thick polyimine film (trade name) was used for the test piece. :Kapt〇nlOOV, TORAY. DUPONT Company) Pressed 2 kg at a room temperature and a speed of 20 mm/s to make a rubber test of the rubber ring. From the test piece, according to j I $ Z 0237, the polyimide film was oriented at a tensile speed of 3 〇〇 mm/min to 180.

The peeling force when pulling in the direction. (b) Ball adhesion value The ball adhesion value of the surface of the adhesive layer at an inclination angle of 30 degrees was measured in accordance with JIS Z 0 2 3 7. [3] The method of plating a wiring board according to the above [2], wherein (c) the release force of the release sheet and the adhesive layer of the mask film are 0.04 N/25 mm or more. (c) Peeling force of the release sheet and the adhesive layer After the manufacture, the mask film which is not treated by heat treatment or ultraviolet irradiation is cut into a width of 25 mm and a length of 250 mm as a test piece, and the test piece is gathered. Butylene phthalate § is intended to be at a drawing speed of 3. 〇—to 18 ◦. The peeling force in the direction of peeling was measured in accordance with JIS z 0237. Here, the circuit pattern is formed on the surface of at least one side of the insulating substrate, and the surface of the conductive metal layer 矣 quot 曰 layer of the acoustic sheet provided with the conductive gold layer via the adhesive layer is desired. A photosensitive barrier such as a liquid resist material or a film resist material is provided, and the photosensitive resin layer is exposed by a crater layer. 2033-9703-PF; Ahddub 10 200920206 == the desired mask „, Taking the above (4) as a masking material, the main "metal layer is selectively silver-engraved, leaving the masking material, continuously =: the substrate metal material is guided to include the one having the knitting. The water-cooling liquid (e.g., the developing solution or the cleaning liquid) is treated to form the embossing of the circuit pattern from the surface of the insulating substrate to the surface of the pattern. In addition, the cover film is adhered to a predetermined portion of the wiring substrate, and the opening portion π of the opening portion and the mineralized object portion of the wiring substrate are disposed at positions corresponding to the position of the mineralizing target portion of the wiring substrate. Stick to the ground. °"Adhesive is usually carried out at room temperature (23.(::)). [4] A wiring board which is plated by any of the plating methods described in (1) to [3] above. ::In the case of a silver-coated object portion of a wiring board having a circuit pattern having a bump of 25 " m or more, the adhesive layer and the strip layer are sequentially laminated on the polybutylene terephthalate film; The release sheet of the mask film is peeled off, and the adhesive layer is bonded to the circuit pattern. Even if the unevenness is a circuit pattern on the surface, the shape of the coating is excellent, and the plating solution can be prevented from entering. As a result, the plating can be improved. Accuracy: In the case of I, a specific gloss agent layer is provided on the butane dicarboxylate butyl glycol vinegar film, and a masking film having a specific peeling force is adhered to suppress the entrapment of air at the interface with the wiring substrate, thereby preventing the cause The swelling of the air entrained in the air during the plating treatment is reduced by the precision of the plating. In addition, the masking film is excellent in puncture workability, and can prevent the penetration of the 2033-97〇3-PF due to the puncture. ; Ahddub 11 200920206 The toughness or burr plating The adhesive layer is immersed in or generated by the work with

The residue of the wire substrate peeling off, & ap , L can prevent the decrease in productivity and the accuracy of the mineral deposit. [Embodiment] Hereinafter, a preferred embodiment of the plating method and the wiring substrate for carrying out the present invention will be specifically described. The invention is not limited to the following forms. [Milling method of wiring board] The wiring board of the money method of the present invention is formed by forming a circuit pattern of a Thunder and a smear of 25/zm or more on an insulating substrate. As the insulating substrate, for example, polyparaphenylene phthalate; ^ t ^ -~~ alcohol oxime, polyethylene naphthalate ethylene glycol, polynaphthalene dicarboxylic acid butyl-age K-- knowing 8 曰, bin Propylene, polyolefin, polycarbonate, cellulose triacetate, cellophane, phthalimide polyamine, polyphenylene sulfide, polyether sulfimide, polyether sulfone, oxime I know melamine, liquid crystal high A synthetic tree A insulating paper, glass, or ceramic 4 of a molecule, polyetheretherketone, or polyfluorene. The thickness of the insulating substrate film, the circumference. I is usually in the range of 4 to 25 0 //m. The circuit pattern formed on the local substrate of the Thunderbolt on the insulating substrate is, for example, conductive on the substrate via the adhesive via the adhesive. The part of the layer is not selected by etching or temple to remove the circuit pattern (subtraction method); on the insulating substrate, the T-life material is selected, for example, by laser plating, etc., to form a circuit diagram... Method (additional method); use guide

The pen ink forms a circuit diagram V on the insulating substrate, and the method of the circuit; after the clock resist or the etching resist is printed, the plating or the etching process is performed, and the method of forming the circuit pattern by the resisting agent is formed. Wait. 2〇33-9703-PF; Ahddub 200920206 This circuit pattern usually has a bump of 25~1〇(four). When the unevenness is less than 25^, the mask film used can be fully used by the user, but there is a mask film which has been used 25 times or more, and it is difficult to follow the unevenness of the circuit pattern. When it is made larger, the mask film is easily entangled with air when it is adhered to the circuit pattern. Therefore, the mineral deposit method of the present invention requires a specific mask film to be adhered to the wiring substrate in two stages. Further, in order to make the mask film follow 25 In the present invention, it is necessary to use a polybutylene terephthalate film as a base material constituting the mask film. The thickness of the polybutylene terephthalate film used is 4 0 &quot What is the m, especially in the range of 5~3 〇"Yang's range, the followability of the circuit pattern with the bumps of 25# m or more and the formation of the opening, especially the excellent punchability The method for producing the poly(p-butylene glycol vinegar) is not particularly limited, and a general production method such as 'direct polymerization method or vinegar exchange method can be used. Direct polymerization method means benzoic acid: formic acid With H — Ding Er The alcohol is directly acetated to form a polybutylene terephthalate vinegar precursor, and then the poly(p-xylylene phthalate) 觭 amp amp 丁 私 私 私 私 私 私 私 私 私Polycondensation 2 method for producing polybutylene terephthalate vinegar, brewing exchange method, refers to

By polybutylene terephthalate, a lower alkyl hydrazine of ρ I and a butylene glycol transesterification reaction, a polyparaphenylene butylene glycol ester precursor, followed by the polybutylene terephthalate The diol is obtained by a polycondensation of a precursor to a polycondensation under reduced pressure to produce a poly(p-dicarboxylic acid) diol. The polybutylene terephthalate polybutylene terephthalate film for use in the production of the base substrate of the present invention may be produced by a method other than cough. A method of producing a film using the thus obtained poly-ply 2033-9703-PF; Ahddub 13 200920206 acid butylene glycol ester. The method for producing a polybutylene terephthalate film is exemplified by terephthalic acid terephthalate vinegar and polyparaphenylene glycol/ethylene glycol vinegar or polytrimethylene terephthalate according to the desired use. Other than sulphuric acid, poly(p-xylylene glycol glycerol/isophthalic acid ethoxide (IV)), or polycarbonate, etc.: conventional nucleating agents, slip agents, anti-caking agents can be used. , stability sword, anti-fogging agent, anti-fogging agent, oxidation inhibitor, ultraviolet ray external absorbent, filler, agent, coloring agent, etc., for example, τ mold 戋, and unextended film of film Manufacturing method, etc. Further, the γ% μ knife J can extend the uniaxially or biaxially stretched film, but the unconformed film is preferably formed by the surface of the unevenness follower. Further, the polybutylene terephthalate film may be surface-treated, for example, for the purpose of improving adhesion to the adhesive layer, and may be subjected to corona discharge treatment, glow discharge treatment, etc. , fire treatment, ozone treatment, ultraviolet treatment. Electronic renewal of electricity in the line processing. Radiation treatment such as radiation treatment, sandblasting treatment. Outside the field, 1 field treatment, silk processing, etc. , chemical treatment, easy adhesion layer coating treatment. A release film constituting a mask film, such as a plastic film, a plastic sheet, a paper, a cloth, a non-woven fabric, a metal enamel metal V white, or a plastic layer house, a plastic ♦ layered body, and various types Various sheets are used as the substrate, and the surface is made of paper, plastic film or plastic sheet = film material, which can be made of strength, heat resistance, etc. as required. surface

For example, polyethylene, polypropylene, ethylene-propylene copolymer, ethylether-acetate copolymerized version M _ , α olefin, hydrazine is a monomer component of olefinic taro Polyethylene naphthalate S, poly-pair 2033-9703-PF; Ahddub 14 200920206 phthalic acid butyl phthalate, etc.; polyvinyl chloride, polystyrene (tetra), _ amine, total aromatic poly A guanamine-based resin such as guanamine; _ ether ketone, poly retin, poly phthalimide, polystyrene, acryl resin, and the like. These may be used alone or in combination of two or more, and as the plastic film, an unstretched film may be used, and any one of the alignment film and the two-axis alignment film may be used, and the film may be composed of two or more layers. As the laminated film to be formed, a film suitable for adding a lubricant such as an inert particle may be used from the viewpoint of workability. The cadmium of the above-mentioned substrate is not particularly limited, and it is preferable that the detachability layer can be formed on the substrate as desired in order to improve the mold release property. The mold release layer may, for example, be a butterfly such as a wax or a synthetic fiber; or a coater comprising a release agent such as a stone knee, and a binder composed of an acrylic resin, a cellulose resin, or a vinyl resin. The liquid 'coating liquid is applied onto the above substrate, and the release layer is formed by drying. In addition, it can be used for gas system, Shishijiao, Juxi Xingxuan, melamine resin, ammonia I resin, polyolefin resin, polyfunctional acrylic acid, ", epoxy resin, titanium integrated resin, poly A resin such as an imide is applied to the substrate to form a coating film 'or the resin is formed by extrusion coating equal to the substrate layer to form a release layer. The thickness of the release layer is usually 0 small 2" range. As the adhesive layer formed on the above-mentioned polybutylene terephthalate film, a rubber-based resin, an acrylic resin, a Shishi resin, a mixture or the like can be used. Among them, the surface of the weather resistance and the heat resistance is acrylic acid, which is a LS acrylic acid. It can be used for the polymerization of various vinyl monomers having a functional group by using a vinyl group as a main component. -9703-pF; Ahddub 15 200920206. a (meth) acrylate having an alkyl group having a carbon number of 1 to 18, such as 'methyl (meth) acrylate, ethyl (meth) acrylate, (methyl) Isopropyl acrylate, lauryl (meth)acrylate, butyl (meth)acrylate, hexyl (meth)propionate, octyl (meth)acrylate, dodecyl (meth)acrylate, (methyl) stearyl benzoate and the like. Further, the vinyl monomer having a functional group may, for example, be a vinyl monomer having a hydroxyl group, a vinyl monomer having a carboxyl group, a vinyl monomer having a mercapto group, a vinyl monomer having an amine group, and having an alkane. A vinyl monomer of an oxy group, a vinyl monomer having an oxirane group, or the like. Here, the vinyl monomer having a hydroxyl group may be 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate or 2-hydroxybutyl (meth)acrylate. Further, examples of the vinyl monomer having a carboxyl group include acrylic acid, methacrylic acid, itaconic acid, maleic acid, and fumaric acid. Furthermore, the ethylenic monomer of the genus of the genus can be exemplified by (mercapto) acrylamide, methyl (mercapto) acrylamide, N-decyloxymethyl (decyl) acrylamide , N, N, _ methylene mono(indenyl) acrylamide and the like. Further, a vinyl monomer having an amine group, (meth)acrylonitrile-mercaptoaminoethyl ester, diethylaminoethyl (meth)acrylate or the like. Further, examples of the vinyl monomer having an alkoxy group include methoxyethyl (meth)acrylate, ethoxyethyl (meth)acrylate, butoxyethyl (meth)acrylate, and (methyl). ) Acrylic acid, phenyloxy, and the like. Further, the vinyl monomer having an epoxy group is exemplified by (mercapto) acrylic acid diethylene glycol, (sub) methacrylic acid diethylene glycol s, (mercapto) acrylic acid Methoxypolyethylene glycol oxime, etc., can be used as needed, with styrene, styrene, methyl styrene, vinyl chloroethylene, acetic acid, acrylonitrile, etc. 9703-PF; Ahddub 16 200920206 Bulk copolymerization. In these acrylic resins, ytterbium is added as desired, and for example, rosin, Dama resin, polymerized rosin, partially added water rosin, medium venomene resin, olefinene denatured body, oily resin' A cyclopentadiene resin, a phenol resin, a styrene resin, a xylene resin, an ugly resin, or the like, or a softener or a filler. When an acrylic resin containing a warp group or a Wei group is used, it is preferred to use an I epoxy compound or a polyisocyanate compound as a bridge back. Polycyclic _ _ 了 举 sorbitol polyglycidol _, polyglycerol polyglycidyl ether, isoprene tetraglycol polyglycidyl ether, diglycerol polyglycidyl ether, triglycidyl-tris(2-hydroxyethyl Isocyanurate, glycerol polyglycidyl ether, trimethylolpropane polyglycidyl ether, resorcinol glycidyl ether, neopentyl diglycidyl ether, hydrazine, 6-hexanediol diglycidyl Ether, bisphenol S - glycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, and the like. Further, a polyisocyanate compound, a pyromellitic diisocyanate, a 2, 4-toluene diisocyanate dimer, a naphthalene-upper, a 5-diisocyanate, a toluene diisoxanoate, a phenyl group Burning bismuth diisophthalate monophenylmethane diisocyanate, tris-(p-phenyl isocyanate) thiophosphonium sulfonate, polymethylene polyphenyl isocyanate, hexamethylene Isocyanate, monodecyl hexane methylene diisocyanate, isophorone diisocyanate, trimethyl hexamethylene diisocyanate, and the like. The method of opening the above adhesive layer is to be used for the above adhesive agent and according to the desired use of bridging agent, organic and/or inorganic particles, various additives 'for example, surfactant, lubricant, stabilizer, viscosity adjustment Agent such as 2〇33-9703-PF; Ahddub 200920206 / : solution or dispersion in solvent 'modulate its solid concentration to 2. ~50% by mass of the adhesive layer is formed into a coating solution. Next, the prepared adhesive layer is formed into a coating liquid, applied to the release sheet, and dried, and the base substrate is laminated or bonded, or coated on the base substrate, and dried to remove the release sheet. The backlog grafting method forms an adhesive layer. It is preferable to form an adhesive layer having a thickness of 5 and "ra. When the thickness is thinner than this range, the followability of the circuit pattern is deteriorated, and since it is difficult to prevent the infiltration of the ore solution, it is a cause of reducing the accuracy of the money application. If the thickness exceeds the range, the solvent-based adhesive is likely to be dried. Insufficient, 2, easy to frame the lack of oranges, the production speed is reduced or the need to use a large amount of: "agent" and shows a tendency to be unproductive and cost-effective. Further, when the mask film is produced in a roll state, the glue tends to overflow the side surface of the film by being wound around the core. It is preferable that the surface of the key application precision or productivity is 5 to 50/zm, and further preferably 1 〇 to 3 〇 #m. The above-mentioned polybutylene terephthalate film constituting the mask film or the surface glossiness of the adhesive layer provided on the surface-treated surface as desired is in accordance with JIS Z 8741, and the 60-degree specular gloss measured is 3 〇% is better. When the 60-degree specular gloss exceeds 3 G%, when it is pasted at room temperature, when the air is entangled between the adhesive layer and the substrate, it may not be relocated by the second heat. (4) The air that is entrained is discharged outside the substrate. As a result, in the case of the mineral deposit treatment, the entrapped air expands at the plating temperature and tends to cause the mask film to float or peel off. Because of the floating or (4) (four) dressing, the application of the manure is not necessary, and the enthalpy becomes the tendency of the accuracy of the ore deposit or the original of the substrate contamination. The air is not entangled when the mask film is pasted, and the 5% or less is preferably 20% or less. 2033-9703-PF; Ahddub 18 200920206 The method of adjusting the 60-degree specular gloss of the above-mentioned adhesive culvert|thinking _ 曰 〇 to 3〇% can be demolded by using 1 士 &# /, Method of film; use of surface processing with a specific shape of the skin roller; sandblasting; chemical treatment, etc. suitable for writing, selection, from the aspect of production and surface gloss adjustment, using the release sheet The method is better. It is used in the use of the release sheet. It is used in the surface of the surface: the weight of the film, the above-mentioned release sheet, the average gloss of the surface gloss line _: 2 Γ:: 勹 2 5 / zm or more and bump The average interval is: the bump of 1.0 mm or less is preferred. The average center sugar content of the surface of the release sheet ((6) is less than Η" or =: the average Pwj exceeds 1〇_ to increase the thickness of the object: == it is easy to cause the mask film to be trapped in the air, and as a result, it will be layered. "The foot is not good. The preferred range of the center line and the unevenness of the unevenness from the surface of the air-entangled surface (the following range. 1_0_ in the method of using the release sheet, at ω π . , ^ '秀女7 of the surface of the release sheet is an adhesive layer, because the more % y Υ I — / / 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 • • • • • • • • • • • • • • • • • 'The surface of the release sheet is broken and written to the adhesive layer table ^ , 〇 〇 / , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , On the upper layer of the adhesive, the η θ masking film is initially stripped '〇. I ~1. The range of 0N/25mm is 祛, ,. The lower target (5) is better. The adhesion of the wiring board on which the circuit pattern is formed is small, and it becomes a 〇33-9703-PF; Ahddub 19 200920206 "Fruit: = the range is too strong to make the adhesive force" to make it "difficult", then, cover the film with the body of the body, or wet it at room temperature, so that the mask It is easy to get involved in the second 'there is a tendency for the lamination to be insufficient due to the entrapment of the air. The improvement of the product yield and the quality of the product is particularly good. The adhesive layer used for the masking film of the mineral depositing method of the present invention is in accordance with the thickness of the adhesive sword measured by JIS Ζ 0237, and the ball adhesion value on the surface of the 俐 layer of i and 4 is preferably _. (4) If the value exceeds 3, the mask film is adhered to the room air, and then the S仃 is wet. Therefore, it is difficult to prevent the mask film from being caught in the air, and it is difficult to prevent the mask film from being caught in the air, and the film is directly attached to the cover film by the heat. Into the air: the law is detached, the gentleman strikes, the ancient s fruit layer due to the heating during the plating process to make the roll, '... private sheeting to make the cover part float, which is not good for reducing the accuracy of the money. In the method of mineral depositing of the present invention, the masking film is adhered to a place other than the pattern of the circuit. The masking film is provided with a negative opening at the position of the portion to be plated as required, and a method for forming the opening portion can be appropriately selected by means of punching and puncturing, and the method of cutting In the case of laser burning, ^ the method of the knife is better from the production and cost of the teeth, used for the masking of the present invention, the circuit diagram is concave, due to the size under the heating step The surface of the stability is made of polybutylene terephthalate as the base substrate, so the puncture process is difficult. Therefore, in order to use the polybutylene terephthalate film, the S-up can also be broken. The processability is such that the adhesive layer of the mask film and the release sheet are stripped 20 2 〇 33-97 〇 3-PF; Ahddub 200920206 is preferably 0.04 N/25 _ or more. Ιιί ^ ^ ^ , 芍仫Dhai peeling force is not full 〇.〇4N/25mm, J although..., 'as a masking film, there is no reduction in the workability of the teeth, but the appearance of the teeth on the end of the teeth Also, the raw edges are not good in terms of productivity and plating accuracy. The method corresponding to the mask film: the opening portion of the plating target portion of the I # film is explained based on Fig. 2 by the method of punch-through. The punching device 5 has a house means 6, and a core ', 11. A masking film is placed on the cooker 11 to press the blade 6 into the masking film by pressing the hand, and the opening is formed by the blade edge 7. The masking film is composed of a base substrate 1A, an adhesive layer 9, and a release paper 8, and as shown in Fig. 2, (1) the base substrate 1 is formed by the blade edge 7. Side puncture method: outer # (2) The masking film is placed opposite to FIG. 2, and the method of piercing from the side of the release paper 8'. Further, (3) the mold 11 and the mask film (base substrate) may also be used. 1 〇 or pull-off paper 8) The method of breaking through the interlayer cushioning material, etc. The method of (1) is preferred in the case where the precision of the puncture (the peeling of the burr or the adhesive layer is less) occurs. (4) The method of the present invention (4), after the mask film is adhered to a predetermined portion of the wiring substrate, the hot-dust connection is required. Sticky poetry is a method of setting a place, and an operator can stick it with a hand. You can also use a laminating machine such as a laminating machine, and stick the temperature at a temperature of f. For example, the masking tape is adhered to the room temperature (before and after 23 ° C). The temperature of the wiring substrate may be performed. By this operation, the alignment of the wiring substrate and the mask film can be performed correctly. Further, in the thermocompression bonding of the adhesive film after the pasting, it is preferable to use a bonding substrate which is adhered and covered with a thermal overlap temperature to form a bonding machine such as a laminating machine for laminating the reel. . The thermocompression bonding conditions can be appropriately selected according to the characteristics of the masking film using 2033-97〇3-PF; Ahddub 21 200920206, and the heating conditions are 8 〇 12 12 (rc, and the pressure condition is 200 200 〇 k: Pa). It can follow the irregularities of the circuit board with a height of 25"m or more, and the follow-up property becomes insufficient when the heating condition is less than 80 °C, which will become the cause of the immersion of the strontium ore deposit, or the cause of the decrease in the precision of the ore deposit. When the temperature exceeds 1 20 C, the glue leaks from the end surface of the opening of the masking film, and the bleeding glue remains on the object to be placed. Further, if the pressing condition is less than 2 kPa, the followability is likely to change. If it is insufficient, it is difficult to prevent the plating solution from entering, which is a cause of a decrease in plating precision. When the pressure exceeds 2 kPa, the glue is formed by the end face of the mask opening: moxibustion _ , Λ , — knowing the surface The reason why the oozing glue remains on the body of the person. Moreover, the speed of the hot house is sufficient to the degree of ΐιη/_, but the processing speed can be appropriately adjusted by the state of the mask film after the thermocompression bonding. The wiring substrate of the film is plated and plated. The plating is carried out at this time. At this time, the method of ruining the heart is applied, and plating methods such as electroless plating or electric ore plating may be used. The method of helmet lightning ", electroplating is on a metal or non-metal surface, and does not flow. Current and zinc ώ 而 Hunting by replacing the metal with the reductant, or replacing it with the plated material.. ^ ^ Bamboo method, electrical plating method, used to contain the metal to be plated ,, ^ The electrolysis liquid t, the plated material is used as the cathode DC electrolysis, the metal is electro-electrolyzed... *The ion is deposited on the surface of the plated material of the cathode, and the method is used. The type of plating method, in the case of electroless plating, gold ore plating or nickel plating, tin shovel coating, nickel-gold plating, nickel-boron plating, tin-plated snail butterfly " Mineral deposit, Jin - window, Qiu for application, recording - scale money, nickel - road ore, f Jinte 4 plating, 镡 ' ', iron - know plating, palladium plating, silver electric shovel number ; _ r , 臬-palladium-gold plating, etc. Also, in the case of ruthenium plating, copper plating, chrome plating, zinc plating, tin 2〇33-97〇3-PF; Ahddub 22 20092 0206 Plating, lead plating, gold plating, silver plating, molybdenum plating, copper-zinc plating, copper-tin plating U ore, tin_word alloy money, tin-drill alloy deposit, tin A silver plating, the words 'nickel alloy plating, Qin-nickel alloy plating, etc.. According to the above mineralization method, passed on the κ, s edge substrate directly adhered to the mask film and then recorded, in this Invention, * + 4 aL . 'In addition to this, the circuit pattern can also be adhered to the film according to the desired i by the squeezing agent, and then the insulating material of the film is used. Applying a masking gland to the circuit pattern or the cover film, and plating the pancreas at the site where the difference is expected, Example 1 r

In the following, the invention will be described in more detail by way of examples, but the invention is not limited by the examples. For the mask films of the examples and the comparative examples, the substrate elastic modulus of the 90t atmosphere, the heat shrinkage ratio, the adhesion (4) the surface glossiness, the initial peeling force, the ball dryness, the release force of the release sheet and the adhesive layer, and the adhesiveness Nine items of followability and plating liquid penetration were measured by the following methods. (Substrate elasticity coefficient (pa) of the 90 C atmosphere) The elastic modulus (Pa) at 9 G ° C was measured. Specifically, a sample having a width U_ and a length of 15. 〇 of a base substrate on which an adhesive layer is not formed is prepared, and the end portion of the longitudinal direction of the sample is fixed-type jig, and the other end is The movable clamp is manufactured by the company, and the temperature is measured by the TMA4000S (MAC sheet mode method under the load conditions of 'loading -1.0g to -2.0g). The temperature rise rate during the measurement is 5 C. /minus 'measured atmosphere is air atmosphere. (heat shrinkage rate) without applying heat treatment or UV according to JIS C 2318, after the manufacture of 2033-9703-PF; Ahddub 200920206 line irradiation treatment of the mask film cut into width 2G_, u The film was peeled off as a test piece. The test piece was placed at a distance of about 100 mm from the test point, and the test piece was then held at 90 °C. After the thermostat phase is heated for 3 〇 minutes, take it out, and visit the palace, and the hotel to visit 0 n ^ ®, and put it for 30 minutes, then take the distance between the punctuation to the micrometer (MITSUTQY0 company, product mouth r, . j seat 0 The name of the mouth. Digimatic a iper) The heating shrinkage rate was calculated by the following formula. . Rate (%) = Shu (add forgiveness months before terbium eyelid ,,, J Intuit length of the test piece - after the heating test

Length of the film) / Length of the test piece before heating 丨χ1 〇〇 (Gloss of the surface of the adhesive layer) Name of the product ·· PG -1Μ, Determination of the adhesive layer in accordance with JIS Z 8741, using a portable gloss meter Co., Ltd.), the release sheet is peeled off by a masking film, and the surface has a 60 degree specular gloss. (Initial Peeling Force) After the production, the mask film which was not subjected to heat treatment or ultraviolet irradiation treatment was cut into a width of 25 mm and a length of 25 Å to obtain a test piece. For the test ("The thickness of the polyurethane film (trade name: Kapt〇n 〇〇 〇〇 , 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 于 于 于 于 于 于 于 于 于 于 于The wheel was rubbed back and forth twice, and the dust was connected to a test piece. The peeling force of the polyimine film at a tensile speed of 3 〇〇/min was measured by the test piece according to Chuan 2_. (Ball adhesion) JIS Z 0237, measuring the ball adhesion value on the surface of the adhesive layer at an inclination angle of 30 degrees (release force of the release sheet and the adhesive layer) 2〇33-97〇3-pF; Ahddub 24 200920206 After manufacture, not The mask film subjected to the heat treatment or the ultraviolet irradiation treatment is cut into a width of 20 mm and a length of 250 mm as a test piece. The peeling force of the base substrate at a tensile speed of 300 min/min to 180° in the direction of stretching is It is measured in accordance with JIS Z 0237. (Adhesiveness) After the production, the mask film which is not subjected to heat treatment or ultraviolet irradiation treatment is formed into an opening portion (Α=15_) of the symbol 13 of Fig. 1 using a blade edge. Then at 23 ° C In the environment, use two wiring boards with a 3〇#m bump pattern and have 50/ζ The wiring board of the πι concave-convex pattern is attached to the opening portion by hand, and then the laminating machine ASL-24MII) is used, and the heating temperature of the laminating roller is 9 〇〇c. The pressure was 5 kPa, the transfer (thermo-compression bonding) speed was lm/min, and the mask film was crimped on the wiring substrate. The air entrapment at this time was visually observed and evaluated on the following basis. 〇: No air entrapment (bubble) X: Air entrapment (bubble) can be seen (follow-up) After the manufacturing, the mask film is not subjected to heat treatment or ultraviolet irradiation treatment, and the above (adhesiveness) Similarly, each of the wiring substrates having a concave-convex pattern of 30" or 50p is thermocompression-bonded. At this time, for the symbol of Fig. i: 12 [deep or 50/zm 'bottom area 18_2 (3_x6_)], use a microscope (product name: VH — _, KEY 公司 company system), after 25 times observation, after the thermocompression bonding, the area of the contact area is the ratio of the symbol area of the figure 。. The value of the chasing property (%) can be derived from the following formula. -97〇3-PF;Ahddub 200920206 Chasing (%)=[(contact area:_2) / 1 8 _2 ] χ 1 〇〇 (plating solution immersion) After manufacturing, no heat treatment or UV treatment The masking film of the irradiation treatment was thermocompression-bonded to each wiring substrate having a concave-convex pattern of 30//m or 50//111 in the same manner as described above. The wiring substrate was immersed in 9 (rc-free nickel-plated aqueous solution (bath composition) : nickel sulfate 25g / L, sodium hypophosphite 30g / L, sodium acetate 30g / L) 20 minutes, nickel plating, from In the case of the water treatment, the wiring board was produced as a plating process. At this time, the substrate plating was observed by visual observation of the wiring, and the evaluation was performed on the following basis: 〇: no key solution was immersed in the mask portion X: there was a bell solution immersed in the mask In the mold examples, the polymer (eight components) and the bridging agent (component B) shown below were used in the examples ' and the comparative examples. (A-1 component) An acrylic copolymer having a weight average molecular weight of 300,000 and a glass transition temperature. The constituent monomer comprises a propyl group τ_, a (tetra) acid methyl _, an acetic acid B (a quinone-2 component), a hydroxy group, a hydroxy group, and a hydroxy group of the acrylic copolymer. It is an aluminum acrylate copolymer with a weight average molecular weight of 300,000 and a glass crucible and a spear temperature of -33 ° C. The constituent monomers include butyl hydrazine t hydrazine, decyl acrylate, ethyl acetate and methacrylic acid 2- Oxygen oxychloride 1 'the mass ratio of its composition is 68 : 5 : 20 : 7. The acrylic copolymer has a working soil of 30 mg KOH / g. (A-3 component) 2033-9703-PF; Ahddub 26 200920206 ^Acrylic tree moon 曰 with a weight average molecular weight of 390,000 and a glass transition temperature of -42 ° C Containing 2-ethylhexyl acrylate, ethyl acetate and 2-hydroxyethyl methacrylate, the composition ratio is 64:35: 丨, and the hydroxyl group of the acrylic copolymer is 6 mg K〇H/g. A-4 component) The average molecular weight of $700,000, and the glass transition temperature of 15 °C of acrylic acid', the κ composition monomer comprises ethyl acrylate, methyl acrylate, methyl methacrylate, methacrylic acid 2, The base ratio of the base ethyl group and the propylene material is 43. 7:25:20··!. 3:10. The base price of the acrylic copolymer is _ KOH / g 〇 (B-1 component) isocyanate-based bridging agent 'the constituent component is toluene diisocyanate vinegar TMP (three sulfhydryl-based propylene) addition molding, The (4) contained is 1S%. (Example 1) As a component of the adhesive, A_(100 parts of a component of the 忐8 knife Λ 1 component was added as a frame t.

桥 Β 成分 成分 成分 成分 成分 成分 成分 , , , , , K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K

The combination of the tax and the composition of the adhesive forms about 40% of the adhesive layer to form the coating liquid. U-shaped knife J Next, the adhesive layer is formed into a coating liquid by ten methods, and coated on the release sheet. Drying is formed into a thickness of 10# m. The layer is separated from the two sides of the paper, formed on both sides of the paper. A polyethylene resin layer having a thickness of 130' of a release layer composed of a silicone resin on the early surface of the material, and a center line average roughness (Ra) of the surface of the release layer is 2.6 Am. ω ω 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Method) 110N/m. Next, a single surface of the unstretched polybutylene terephthalate film having a thickness of 25 # m was subjected to corona treatment, and the treated surface and the adhesive layer were laminated, using ASL-24MII at 4 (TC, 350 kPa, Conditional thermocompression bonding at a speed of 1 m/m 1 η, and further storage of the mask film for 35 weeks. The surface gloss of the surface of the adhesive layer is 丨丨%. The initial peeling force at this time is 〇· 9N/25mm, the ball adhesion value is 2 or less, and the peeling force of the release sheet and the adhesive layer is 〇·07N/25mm. Further, the evaluation of the other physical properties of the obtained mask film and the immersion property of the plating solution are shown in the table. The table ('3 ° (Comparative Example 1) is the same as Example 1 except that the unstretched poly(p-butylene phthalate) film forming the mask film was used as a mask film in the same manner as in Example 1 except that the vinyl chloride film was used. And using the same to make a wiring substrate. The 60-degree specular gloss of the surface of the adhesive layer is 11%. The initial peeling force at this time is 0.9 N / 25 mm, the ball adhesion value is 2 or less, and the release sheet and the adhesive layer are The peeling force is [〇7N/25mm. The physical property evaluation of the mask film and the wiring substrate is shown in the table. (Comparative Example 2) In the same manner as in Example 1, except that the non-stretched polybutylene terephthalate film constituting the mask film was used in the Example Ϊ except the 2-axis extended polyethylene terephthalate film. A masking film is used and a wiring board is produced using the same. The 60-degree specular gloss of the surface of the adhesive layer is 11%, and the initial peeling force at this time is 0·9N/25 mm. The ball adhesion value is 2 or less, and the release sheet and the adhesive are attached. The peeling force of the agent layer was 0_07N/25 mm. The physical property evaluation of 2033-9703-PF, *Ahddub 28 200920206 regarding the mask film and the wiring substrate is shown in Table 1. (Comparative Example 3) A film-free, non-stretched polybutylene terephthalate film was used as a mask film in the same manner as in Example 及 except that a non-stretched polypropylene film was used, and a wiring board was produced using the film. The surface glossiness of the surface of the adhesive layer was 6 degrees. The initial peeling force at this time is 〇.gN/25mm, the ball adhesion value is 2 or less, and the peeling force of the release sheet and the adhesive layer is 〇. 7N/25 nm. Regarding the mask film and the wiring substrate The physical property evaluation is shown in Table 1 〇 [Table 1]

9 (elastic coefficient of the substrate of TC atmosphere, heat shrinkage rate (%), bump (#m), followability (%), plating solution, 梦 Dream A {All Example 1 1. 8xl08Pa MD: 1. 1 30 85 〇TD: - 50. 74 〇 Comparative Example 1 4. 8xl06Pa Γ MD: l〇30 88 X TD: -2 50 76 y Comparative Example 2 1. 7xl09Pa MD: 〇. 4 30 50 X ---- TD: -〇 2 50 40 y Comparative Example 3 1. lxl08Pa MD: 5 30 65 X ID: -2 50 55 X In Example 1 and Comparative Example 3, the adhesive layer was changed to the release sheet, and only the base substrate was changed to make a mask. The film was evaluated for the elastic modulus, the heat shrinkage ratio, the followability, and the immersion property of the plating solution of the substrate of the masking film. The results show the influence of the base substrate. Although the properties all showed good results, the following results were different between the followability and the plating solution immersion. The wiring substrate of Comparative Example 1 has the following tendency for the unevenness c; η " m 玎 w convex bu from m 76% is excellent, but when plating, you can see 餹踟, # # jy satin 孜 / re-in, and reduce plating 2033-9703-PF; Ahddub 29 200920206 application accuracy. This is due to use in The base material of the masking film is a vinyl chloride film, and the elastic modulus of the substrate of the thermocompression bonding is 4·〇χ1()6ρ& and is sufficiently low, so that the wiring substrate can be followed, but the heat shrinkage rate md :i〇%, td._2% and very high so that the dimensional stability is not #, so the opening of the mask is deformed when the mineral deposit is warmed, and the plating solution is immersed. Further, the plasticizer contained in the vinyl chloride film : When the mineral coating is warmed, it is transferred to the adhesive to soften the adhesive, and when the masking film is peeled off, it is also confirmed that the residual glue or the plasticizer adheres to the wiring substrate.

C. The wiring board of Comparative Example 2 has a low followability for the unevenness, and the plating solution is immersed in the plating treatment to reduce the shovel. This is the base substrate used for the mask film. 2-axis extended polyethylene terephthalate film, heat shrinkage rate is MD: 0 4%, TD: _m and low, although showing high dimensional stability, but due to the thermocompression of the 9 death atmosphere The material elastic modulus is 1·7×1 09Pa and is high, and the film is hard and does not elongate. Therefore, the mask film cannot follow the unevenness of the wiring substrate, and the plating solution is immersed in the non-plating place.

The wiring substrate of the low-precision precision comparison example 3 has a followability of 55% for the unevenness 5m and can be seen when the plating solution is immersed in the plating treatment, and the base substrate for reducing the plating used for the masking film is The non-stretched polypropylene film has a low elastic modulus of 基材.lxl〇Bpa although it is thermocompression bonded at 90° C., but the heat shrinkage ratio is MD: 5%, TD: -2%. This is slightly harder than the vinyl film and lacks flexibility but is a film exhibiting high dimensional stability. However, the mask film cannot follow the unevenness of the wiring board, and the plating solution is immersed in the non-plated portion. In the wiring board of the first embodiment, the followability of 50 μm of the unevenness was excellent in %, and the plating solution was not observed to be infiltrated during the plating treatment, and the plating precision was not lowered. The base substrate used for masking the film is not extended polypyrene 2033-9703-PF; Ahddub 200920206 acid butanediol (4), thermocompression ""x~low, and the heat shrinkage rate is also low. Similar to the non-stretched polypropylene film of Comparative Example 3, == ratio, the tip is hard and lacks f softness, and the film of the B-expanded (four) is stable and shows that the film is higher than the non-extended polypropylene film. When the concavo-convex film of the mask film of the butane carboxylic acid film of formic acid is 55%, the film is leaped to 74%. This shows that the elastic modulus of the substrate in the 9rc atmosphere shows the mask film of the 108pa process. 'High dimensional stability rj Effectively promotes bump followability. The dream is stabilized by the size of the 彳 彳 8 p. Λ 、 /, the substrate elastic modulus of the twist, the mask film can fully follow the unevenness of the wiring substrate, and the opening of the mask film will not be deformed when the money is warmed up. Does not reduce the plating accuracy. Also, the polyparaphenylene? Since the acid butanediol film does not contain a low molecular weight component such as a plasticizer contained in a vinyl chloride film, it is not confirmed that the residual film or the plasticizer is on the wiring substrate after the film is peeled off. Attached, etc. From the results of Table 1, it is understood that the base substrate of the mask film used in the plating method of the present invention is excellent in the followability and the infiltration property of the bell dressing liquid. When the polybutylene terephthalate film is used as the base material, the other physical properties of the mask film are, in particular, adhesion and bellows immersion. (Example 2) A coating liquid was formed as an adhesive layer, and a B-forming tool was used as a bridging agent to form a coating. The bonding was carried out in the same manner as in Example i, and the adhesion was carried out in the same manner as in Example i. 2033-9703-pf; Ahddub 31 200920206 The coating layer forms a coating liquid, and the coating liquid is formed using the adhesive layer to form a masking film in the same manner as in the embodiment. The 6-degree specular gloss of the surface of the adhesive layer is 11%, the initial peeling force is 0·7N/25 mm, the ball adhesion value is 2 or less, and the peeling force of the release sheet and the adhesive layer is 〇·〇5N/25 mm. The evaluation of other physical properties is not shown in Table 1. Further, a wiring board was produced in the same manner as in Example 1 using this mask film. The physical properties are shown in Tables 2 and 3. (Example 3) A coating liquid was formed as an adhesive layer, and a coating liquid was prepared in the same manner as in Example 以外 except that the blending amount of the B-ring component as a bridging agent was 1 〇 mass portion, and the coating liquid was used. The adhesive layer forming coating liquid was used as a masking film in the same manner as in the embodiment, and a wiring board was produced using the same. The 60 degree specular gloss of the surface of the adhesive layer was 11%. The initial peeling force is 〇1Ν/25π^, the ball adhesion value is 2 or less, and the peeling force of the release sheet and the adhesive layer is 0.04N/25_. The physical properties of the other masking film and the wiring substrate are shown in Table 2. And Table 3. (Example 4) Using the mass component of the A-2 component as the adhesive component, and the mass component of the B_i component 2 as a bridging agent, the adhesive layer was prepared in the same manner as in Example 形成 to form a coating liquid, and the adhesive layer was used. A coating liquid was formed in the same manner as in Example 1 and a wiring board was produced using the same, and the 6-degree specular gloss of the surface of the adhesive layer was 11%. The initial peeling force is 〇. 6N/25mm, the ball adhesion value is 3, and the peeling force of the release sheet and the adhesive layer is 〇. 〇 5N/25mm. The physical properties of the mask film and the wiring board are shown in Tables 2 and 3. 2033-9703-PF; Ahddub 32 200920206 (Example 5) A coating liquid was formed as an adhesive layer, and an adhesive layer was prepared in the same manner as in Example 4 except that the compound was used as the β-1 component. The working fluid was formed in the same manner as in Example 1 using the adhesive layer to form a coating liquid. The wiring board was produced using the same. The 6-degree mirror gloss of the surface of the adhesive layer was 11%. The initial peeling force is 〇·3N/25mm, the ball adhesion value is 3, and the peeling force of the release sheet and the adhesive layer is 〇. 04N/25匪. The physical properties of other masking films and wiring boards are shown in Tables 2 and 3. (Example 6) A coating liquid was formed as an adhesive layer, and an adhesive agent was prepared in the same manner as in Example 1 except that the mass portion of the component A-3 was used as the adhesive component, and the mass portion of the component B-1 was used as the bridging agent. The layer formed a coating liquid, and the coating liquid of the adhesive layer was formed to cover the film in the same manner as in Example 1, and the 60-degree specular gloss of the surface of the adhesive layer was 丨1%. The initial peeling force was 2. 5 N/25 mm, the ball adhesion value was 1 Torr, and the peeling force of the release sheet and the adhesive layer was 0.12 N/25 Å. The physical properties of the other mask films and wiring boards were shown in Table 2. (Example 7) The coating liquid was formed as an adhesive layer, and the adhesive was prepared in the same manner as in Example 1 except that the mass portion of the A-3 component was used as the adhesive component 'B-1 component 5 mass portion as a bridging agent. The coating layer was formed into a coating liquid, and a masking film was formed in the same manner as in Example 1 of the coating liquid working solution, and this was used to manufacture a wiring board. The 6-degree mirror gloss of the surface of the adhesive layer was 11%. The initial peeling force is 〇·8N/25mm, the ball adhesion value is 4, the release sheet and the adhesive 2033-9703-pp; and the peeling force of the Ahddub 33 200920206 layer is. Surface 5, the physical properties of the other masking films and wiring boards are shown in Table 2. (Example 8) A coating liquid was formed as an adhesive layer, and the component A_4 was made into an ι mass part, and the B-! component as a bridging agent was 5 mass parts, and the adhesive layer formation coating was prepared similarly to Example i. The working fluid was formed into a coating liquid using the adhesive layer to form a masking film in the same manner as in Example 1, and this was used to manufacture a wiring board. The 60 degree specular gloss of the surface of the adhesive layer is m. The initial peeling force was 〇._/25_, the ball adhesion value was 2 or less, and the peeling force of the release sheet and the adhesive layer was 0·01 Ν / 25ππη. The physical properties of the other masking films and wiring boards are shown in Tables 2 and 3. (Example 9) A coating liquid was formed as an adhesive layer, and an adhesive layer was formed to form a coating liquid in the same manner as in Example i except that 3 parts of the granules were used as the granules of the granules. The coating liquid was formed using this adhesive layer, and the film was masked in the same manner as in Example 1 and used to manufacture a wiring board. Adhesive layer table

The 60 degree mirror gloss is 11%. The initial peeling force is L ball adhesion value of 2 or less, and the peeling force of the release sheet and the adhesive layer is 〇·〇5N/25min. The physical properties of the other masking films and wiring boards are shown in Table 2. (Example 1 〇) As a release sheet, the center line average roughness (Ra) of the surface on which the paper substrate was placed was 2.0/m, and the unevenness of the unevenness of the unevenness was 2·〇. In the same manner as in Example 1, except that the release sheet having the thickness 130 of the layer was 34 2033-9703-PF; Ahddub 200920206 mask film and the wiring board produced therefrom, the 6-degree specular gloss of the surface of the adhesive layer was 56%. The initial peeling force is Q 9N/25_, the ball adhesion value is, and the peeling force of the lower stripping sheet and the adhesive layer is 〇. 〇 7N/25 mm. Further, the physical properties of the other mask films and wiring boards are shown in Table 2. (Example 11) As a release sheet, the center line average roughness (Ra) of the surface provided on the paper substrate was 2. 4", and the thickness of the release layer having the unevenness of the unevenness of 16_ is the thickness of the release layer (four) The film was masked and used to form a wiring board, except for the release sheet. The surface of the adhesive layer was 6 〇, and the specular gloss was 35%. The initial peeling force was Q9n/25_, and the ball adhesion value was 2, the peeling force of the release sheet and the adhesive layer is 〇·〇7Ν/25_. Further, the evaluation of physical properties of other masking films and wiring boards is shown in Table 2. Example 5 and Examples 6 to 9 The release sheet was made of the same as the base substrate by using poly(p-phenylene tert-butanol-ol_胄', and the mask film having a (10) degree mirror gloss of %11% was formed on the surface of the adhesive layer. Further, the examples 10 and 11, using a polybutylene terephthalate film on the base substrate to make the adhesive the same, and to make a cover film having a different specular gloss of 6 degrees on the surface of the release sheet and the adhesive layer. The evaluation of the puncture, adhesion, followability and immersion of the plating solution of the masking film is shown in Table 2. The results show the influence of 60° specular gloss, initial peeling force and ball adhesion value on the surface of the adhesive layer of the mask film. 2033-9703-PF; Ahddub 35 200920206 [Table 2] Puncture bump (#πι) Adhesive followability (%) Plating solution immersion Example 1 〇30 〇85 〇50 〇74 〇Example 2 〇30 〇83 〇50 〇73 〇Example 3 〇30 〇82 〇50 〇 70 〇Example 4 〇30 〇86 〇50 〇78 〇Example 5 〇30 〇84 〇50 〇77 〇Example 6 〇30 X 86 X 50 X 75 X Example 7 〇30 X 85 X 50 X 74 X Example 8 An X 30 X 84 X 50 X 75 X Example 9 〇 30 X 87 X 50 X 75 X Example 10 〇 30 X 86 X 50 X 75 - — X Example 11 〇 30 X 86 X 50 X 75 X ----] Example 1 and Examples 丨〇 11 are based on the base substrate using polybutylene terephthalate m ' to make the adhesive layer the same, and only changing the release sheet

The average center roughness of the surface (Ra) and the mask of the unevenness of the average. The evaluation of the puncture, adhesion, followability, and plating solution immersion of each masking film is shown in Table 2. From this result, the influence of the surface glossiness of the adhesive layer was revealed. Although following the loss of pregnancy, immersion shows different results. In the adhesion and recording fluid examples, the adhesive properties of the examples and the examples u are 2〇33-97〇3-pp; Ahddub 36 200920206, the 60-degree specular gloss of the surface of the adhesive layer is different, the initial peeling The force is 0.9 N/25 mm, the ball adhesion value is 2 or less, and the peeling force of the release sheet and the adhesive layer is 0.07 N/25 mm. In the mask film of the first embodiment, when the wiring board was placed in an environment of 23 〇c, the air was not caught when the hand was pasted, and the wiring board after the thermocompression bonding was not confirmed to be entrained in the air, and the display film was excellent. result. Further, in the case of the mineral deposit treatment, the infiltration of the plating solution was not confirmed, and the plating precision was not lowered. When the mask film of the Example 1G and the Example 11 was adhered to the wiring substrate in an environment of 23 ° C, it was confirmed that air was caught. Further, it was confirmed that air was entangled in the wiring board which was adhered by thermocompression bonding, and it was shown that in the environment of 23t:, the air which was caught by the hand was not discharged by thermocompression. The plating solution is immersed because the air is entangled, and the plating precision is lowered. The adhesion to the wiring board was estimated to be small due to the fact that the mirror gloss of the surface of the adhesive layer of Example 60 was u%, and the 60-degree specular gloss of the surface of the adhesive layer of Examples 〇 and ji, respectively. It is 56% and 35% large. Since the adhesive is applied to the release sheet, the polybutylene terephthalate film is laminated and pressure-bonded, so that the surface shape of the release sheet is transferred on the surface of the adhesive layer. It can be easily estimated that when the release sheet having a large center line average roughness (Ra) and a small unevenness of the unevenness is obtained, the surface of the adhesive layer having a 60-degree specular gloss can be obtained, and the adhesive having a 60-degree specular gloss is smaller. The surface of the layer, the thicker the surface of the adhesive layer. In the first embodiment, the surface glossiness of the adhesive layer is 6%, 2033-9703-PF, Ahddub 37 200920206, and the surface of the adhesive layer is very rough, so it is equipped with IV 9 Q °Ρ When m ^ ^ and % are under the condition of the hand, the surface of the adhesive layer is in contact with the wiring substrate i: the surface contact is close to the point contact', and it is not visually confirmed that the hole is caught. x 'In the subsequent thermocompression bonding, the air between the adhesive layer I and the wiring substrate does not occur and is discharged by the interface of the adhesive. The wiring substrate after the thermocompression bonding is also failed. It was confirmed that the air was caught and showed good results. Furthermore, it was not confirmed at the time of the plating treatment that the accuracy of the "immersion of liquid" was not lowered. The 6-degree specular gloss of the surface of the adhesive film of Example 10 and u was (10) and 35%, respectively, and showed a large value compared with Example i, that is, the adhesion of Examples 1G and 11 was shown. The agent layer is compared to the embodiment! The thickness of the surface of the adhesive layer is small. When the traits were afflicted, the _^ w , J u was adhered to the wiring substrate in an environment of 23 ° C, and it was confirmed by the visual observation that the air was caught. It is considered that the contact area is increased due to the contact of the surface of the adhesive layer with the surface of the wiring substrate close to the surface contact. In addition, in the subsequent thermocompression bonding, it is shown that the air entrapped by the hand in a hungry environment is not discharged by thermocompression bonding. Further, at the time of the bell treatment, the entrapped air is swollen or peeled off by the temperature of the mineral deposit to cause the mask film to float or peel off. Due to the floating or peeling, it can be seen that the plating solution is immersed in the precision of the land drop. Therefore, in order to prevent the infiltration of the recording liquid during the mineral deposit treatment, the accuracy of the clock application is not lowered, and the wiring substrate after the thermocompression bonding does not confirm that the air is caught, and the substrate is in a 23 t environment. When you stick your hands, you can't be obsessed with it. In order to prevent the user from sticking in the environment under the environment of 23, the air can be visually entangled to make the surface of the adhesive layer 6 . 2033-9703-PF; Ahddub 38 200920206 The mirror gloss is preferably less than 30%. Example 5 is a masking film having an initial peeling force of 9·9 to 0.1 N/25 mm and a ball adhesion value of 2 or less and 3 or less. Adhesiveness, followability, and squeegee immersion were all good results, and the plating accuracy was not lowered. On the other hand, in the examples 6 to 9, the 6-degree specular gloss of the surface of the adhesive layer was 丨1%, and it was confirmed that the wiring was confirmed to be entrained in the wiring board after the thermocompression bonding. The use of a polybutylene terephthalate film on the base substrate showed good results, but it was caused by the entrapment of air, and there was a possibility that the plating solution was infiltrated during the plating treatment. The case of precision. Example 6 is a masking film having an initial peeling force of 2. 5 N/2 Snm and a ball adhesion value of 1 Å. Example 7 is a masking film having an initial peeling force of 〇 8 N / 25 mm and a ball adhesion value of 4. Further, Example 8 is a masking film having an initial peeling force of 〇·〇8Ν/25_ and a ball adhesion value of 2 or less. Further, in Example 9, the initial peeling force was a masking film having a ball adhesion value of 2 or less. Only the example 6 7 9 was attached to the wiring substrate at a temperature of 23 ° C, and when it was pasted by hand, the air was not visually observed after the adhesion. However, immediately after the wiring substrate and the mask are wetted to contact the area, the peeling force is excessively strong at the initial stage of the second gas introduction, or the adhesive having a large ball adhesion value and a low elastic modulus tends to increase the contact area. Further, it is shown that the air pressure of the person to be wounded in the environment of 23 t: in the subsequent hot press bonding cannot be discharged by thermocompression. Embodiment 8 is attached to the wiring substrate by 23. In the embarrassing environment, it is not true that the air is caught by the hand. However, it is dense with the wiring board 2033-9703-PF; Ahddub 39 200920206 is low in nature and easy to peel off. Since the adhesion to the wiring substrate is low, and a soft polybutylene terephthalate mold is used for the base substrate, each of the subsequent thermocompression bonding causes the wiring substrate to be caused by the stress of the thermocompression bonding roller. The masking film is partially peeled off, and the wrinkles are mixed, so that it is easy to wind the air. During the forging treatment, the entrapped air expands due to the plating temperature, causing the mask film to float or peel off, and as a result, the plating solution is immersed to reduce the plating precision. From Examples 1 to 5 and Examples 6 to 9, good results were obtained for the adhesion test. The 6-degree specular gloss of the surface of the adhesive layer was 3% or less, and the initial peeling force was 〇.H.ON/ 25mm' and the ball adhesion value is preferably in the range of 3 or less. Further, the puncture of the mask films used in Examples 1 to 5, Example 8 and Example 2 was evaluated by the following method, and the puncture of each mask film and the peeling of the release sheet and the adhesive layer were evaluated. The evaluation of the force is shown in Table 3 (penetration). After the manufacture, the masking film is not applied by heat treatment or ultraviolet irradiation to penetrate the device (CARL Transparency Co., Ltd., product name: 2-hole punching machine UB-85 The appearance of the puncture at the time of piercing from the side of the base substrate was visually observed from the side of the base substrate side and the sides of the release sheet side, and was evaluated as a flaw by the wearer and as X by the wearer. (Example 12) A silicone resin which used a peeling force of A 2 0 N / m was used as a full-ply palladium example 1 except for a release sheet, and a wiring board was produced in the same manner. The 60-degree specular gloss of the surface of the adhesive layer is 4 11%, and the initial peeling force is 2033-9703-PF; Ahddub 4〇200920206 0. 9N/25mm, the ball adhesion value is 2 or less, the release sheet and the adhesive layer The peeling force is 0. 02N/25mni. Further, the puncture property of the mask film is shown in the table [Table 3] Puncture I------" ---- Release force of the release sheet and the adhesive layer Example 1 〇0. 07N/25imn Example 2 〇0.05N/25mm Example 3 〇0.04N/25mm Example 4 Γ 〇0. 05N/25ram Example 5 〇0. 04N/25mm Example 8 X 0. 01N/25mm Example 12 X 0. 02N/25mm From the results of Table 3, it was shown that the mask film of Example 5 could be pierced by the punching device, and the mask films of Example 8 and Example 12 could not be broken. In this case, the peeling force of the release sheet and the adhesive layer is less than 0·04N/25_ under full (〇. 〇1 and 〇. 〇2N/25mm) in the mask films of the embodiment 8 and the embodiment 而2. Weak, in the case of puncture, the release sheet is adhered to the adhesive layer to make the base substrate polybutylene terephthalate film elongated. Compared with the masking films used in Examples 1 to 5, the wiring substrate was fabricated using the mask film of Example 8 or 12, and even if it was not broken, even if the adhesive layer which penetrated the masking film peeled off, or When the penetration occurs, the puncture property such as burrs is poor, and it is possible to predict the occurrence of the penetration of the plating solution or the residual glue when peeled off from the wiring substrate, thereby reducing productivity and plating precision. Further, the mask film used in Example 12 was the same as that of Example 1 except that the peeling force of the Shiqi gum-based resin was small, and the adhesiveness, followability, and plating were not shown in Table 3. The liquid immersion system is as good as that of the first embodiment. 0 41 2033-9703-PF; Ahddub 200920206 [Industrial Applicability] The present invention can be utilized in the manufacture of various wiring substrates, which can contribute to effective plating of circuit patterns. The plating portion is plated with high plating precision. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial plan view showing a wiring board according to an embodiment of the present invention. Fig. 2 is a cross-sectional view showing an example of a punching means for punching a mask film used for the manufacture of the wiring board of the present invention into a predetermined pattern. [Main component symbol description] 3~ cover film; 4~ insulating substrate; 6~ punching means; 8~ release paper; 1 0~ base substrate; 12~ concave and convex portion;

1, 2 ~ plating target parts (circuit pattern); 5 ~ puncture device; 7 ~ blade edge; 9 ~ adhesive layer; 11 ~ mold; 13 ~ opening; A ~ between the circuit pattern and the circuit pattern (pitch ). 2033-9703-PF; Ahddub 42

Claims (1)

200920206 X. Patent application scope: 1 _ A kind of wiring board: + i ^ The plating method of the board is a plating method which has a bump of 25" or more for the insulating substrate. When the target portion is covered, the -1 text is used to cover the plating target portion, and the poly-p-benzoic acid: butane glycol s| film is used to laminate the adhesive layer on one side and the mask film of the release film. After the release film of the mask film is peeled off, the adhesive film of the mask film is adhered to a predetermined portion of the wiring substrate under a normal temperature environment, and then adhered by thermocompression bonding, and then plated to the target portion. The method of applying a wiring board according to the first aspect of the invention, wherein the adhesive layer using the masking film has a specular gloss of 60% or less based on JIS z 8741 of not less than 3% by weight, and is in the initial stage of the following test. The peeling force is 0.1 to 1. 〇N/25min' (b) a masking film having a ball adhesion value of 3 or less. 3. The method of plating a wiring board according to the second aspect of the invention, wherein the peeling force of the (c) release sheet and the adhesive layer of the mask film is 0.04 N/25 mm or more. A wiring board which is plated by the plating method according to any one of claims 1 to 3. 2033-9703-PF; Ahddub 43