TW200927685A - Scribing apparatus and method, apparatus for cutting substrate using the scribing apparatus - Google Patents
Scribing apparatus and method, apparatus for cutting substrate using the scribing apparatus Download PDFInfo
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- TW200927685A TW200927685A TW97142568A TW97142568A TW200927685A TW 200927685 A TW200927685 A TW 200927685A TW 97142568 A TW97142568 A TW 97142568A TW 97142568 A TW97142568 A TW 97142568A TW 200927685 A TW200927685 A TW 200927685A
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- 239000000758 substrate Substances 0.000 title claims abstract description 222
- 238000005520 cutting process Methods 0.000 title claims description 59
- 238000000034 method Methods 0.000 title claims description 34
- 239000000463 material Substances 0.000 claims description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 239000002689 soil Substances 0.000 claims description 3
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000009751 slip forming Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 241000282320 Panthera leo Species 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 2
- 241000219112 Cucumis Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- 241000237858 Gastropoda Species 0.000 description 1
- 241000255777 Lepidoptera Species 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Liquid Crystal (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
200927685200927685
z^y^opn.uuC 六、發明說明: 【發明所屬之技術領域】 本發明是有關於-種料製造平板顯示器面板的裝 置以及方法,更詳細而言’本發明是有關於一種於形成^ 多個單位基㈣母基板上形成_道⑽be line)的刻線農 置與方法、以及職置與方法的_母基㈣的裝置: 【先前技術】 〇 冑近,資訊處觀備正在急速發展,變得具有多種形 態的功此及更快的負訊處理速度。此種資訊處理設備具有 用於顯示運轉資訊的顯示器(display)。先前,主要使用陰 極射線管(Cathode Ray Tube)監控器來作為顯示器,但最 近,逐步使用較輕且佔用空間較小的如薄膜電晶體_液晶顯 示器(Thin Film Transistor-Liquid Crystal Display Panel)或 者感應一極體顯示器(Organic Light Emitting Diodes display)之類的平板顯示器。 0 —般而言,平板顯示器等中所使用的面板通常是利用 脆性基板而製成,面板大致可分為由一塊基板構成的單板 基板、及由2塊基板接合而成的接合基板。 可將接合基板加工成各種大小來使用,例如加工成如 4亍動電話的液晶顯示器用的小型面板,或加工成如電視或 顯示器等的大型面板,因此,將大型的母基板切割成規定 尺寸的單位基板而用作各別的面板。 關於母基板的切割方法,主要使用的是如下的方法, 即’利用綴有微細的鑽石的刻線輪(Scribe Wheel)來進 5 200927685 Z^^opu.uuc 行切割。利用刻線輪來對母基板進行切割的方法包括:刻 線步驟,使刻線輪與母基板的切割預定線接觸之後,沿切 割預定線而形成規定深度的切割道(scribeLine”以及分 割步驟(Breaking Process),對母基板施加物理的撞擊而 使裂縫(Crack)沿切割道傳播,藉此,將母基板切割成單 位基板。 【發明内容】Z^y^opn.uuC VI. Description of the Invention: [Technical Field] The present invention relates to a device and a method for manufacturing a flat panel display panel, and more particularly, the present invention relates to a method for forming A plurality of unit bases (four) on the mother substrate to form a line (10) be line) of the line and the method, as well as the device and the method of the mother (four) of the device: [Prior Art] Close, the information office is rapidly developing , has become a variety of forms of work and faster processing speed. Such an information processing device has a display for displaying operational information. Previously, a cathode ray tube monitor was mainly used as a display, but recently, a lighter and smaller space such as a Thin Film Transistor-Liquid Crystal Display Panel or induction has been gradually used. A flat panel display such as an Organic Light Emitting Diodes display. 0 Generally, a panel used in a flat panel display or the like is usually made of a brittle substrate, and the panel can be roughly divided into a single-plate substrate composed of one substrate and a bonded substrate formed by joining two substrates. The bonded substrate can be processed into various sizes, for example, a small panel for processing a liquid crystal display such as a 4-slide telephone, or a large panel such as a television or a display, thereby cutting a large mother substrate into a predetermined size. The unit substrate is used as a separate panel. Regarding the cutting method of the mother substrate, the following method is mainly used, that is, the cutting is performed by using a Scribe Wheel affixed with a fine diamond to cut into a line of 200927685 Z^^opu.uuc. The method of cutting a mother substrate by using a reticle includes: a scribe line step of forming a scribe line of a predetermined depth along a line to be cut after the scribe line is brought into contact with a planned cutting line of the mother substrate, and a dividing step ( Breaking Process), a physical impact is applied to the mother substrate to cause a crack to propagate along the scribe line, thereby cutting the mother substrate into a unit substrate.
本發月的目的在於知1供一種能夠利用1次的刻線步驟 而同時形成多條切割道的刻線裝置與方法、以及利用該裝 置與方法之基板切割裝置。 义 本發_其他目的並祕於此,本賴技術人員應可 根據以下的說明而明確地理解文中未提及的其他目的。 於將’該刻線步驟用 上述列㈣署2基板基板分離成各個單位基板。 美板上…列地配置著’以能夠於上述母 “二 及間隔調節單 產=述相互平行的多條切割道=間:能夠改變同時 移動路徑上,且可設置於上述續構件的 向而並列地配置著述支禮構件進行直線移動的第!方 上述刻線單元可更包括 方_的第2方向移動的移動單二 == 6 200927685 zyyzopu.uuc 包括:驅動構件,佶μ _ 線移動;導引構件,产ϋ第C述第2方向進行直 對上述刻線單元的直且 配置於上述導引構件 引’撐口,分別 ο ο 上述間隔械留·對迷導引構件進行支揮。 上述第1方向而配署疋可包括:導螺桿(leadscrew),沿 合;支擇台單元的切台相結 述導螺桿旋轉。導螺才干進订支揮;以及驅動器,使上 上述刻線單元有兩個,使上述 即第1刻線單元移動的上述移動 3 = 2 一個 基座(base),使上述刻線單元中 J二二置: 方式而設置於上述基座,上述間隔調節單:可【二=The purpose of this month is to provide a scribe line apparatus and method capable of simultaneously forming a plurality of scribe lines by one reticle step, and a substrate dicing apparatus using the apparatus and method.义本发_ Other purposes and secrets here, the technical staff should be able to clearly understand the other purposes not mentioned in the text according to the following instructions. The substrate step is separated into the respective unit substrates by the above-mentioned column (four). The US board is arranged in a row to be able to adjust the yields in the above-mentioned parental and second-order intervals: a plurality of cutting lanes that are parallel to each other = can change the simultaneous moving path, and can be arranged in parallel with the above-mentioned continuation members The above-mentioned engraving unit that performs the linear movement of the ritual member can further include the movement of the second direction of the square _ 2 == 6 200927685 zyyzopu.uuc includes: drive member, 佶μ _ line movement; The lead member is placed in the second direction of the second step, and is disposed directly on the guide member, and is disposed on the guide member guide port, and the spacer member is supported by the spacer member. The first direction may include: a lead screw, which is spliced; the cutting table of the splicing unit is said to rotate the lead screw; the snail is ready to be dispensed; and the driver is used to make the above-mentioned reticle unit There are two, the above movement, that is, the movement of the first engraving unit, 3 = 2, a base, and the above-mentioned engraving unit is disposed in the pedestal, and the interval adjustment sheet is: Can [two =
移動單元的支撐台沿上述第〗方向 ;L 動單元使上述第2刻線單;移:?移動的咖,上述移 =刻線單元有三個,使上述刻線單元中的配置於中 於=1 _單元移動的上述移鱗元的支撐台固 線單元中料_線單元即第2刻線單 可動的上述移動單元的支撐台,以分別 ::節單元可包括使上述移動單元的支撐台沿上述第七 j動的驅動器,上述移動單元使上述第2刻 述第3刻線單元移動。 根據其他示例,上述刻線單元可設置於上述支揮構件 7 200927685 ^.^^opu.uuc 的移動路Ul ’且可沿與上述支撐構件進行直線移動的 1方向垂直的第2方向而並列地配置。 -上述間隔調節單元可包括:驅動構件,使上述刻 疋分別向上述第2方向進行直線移動;以及導引構件,沿 而配置於直線上,且對上述刻線單元的“ 驅動構件可包括:支架(bmeket),分別連結於上 0 述Si盖:螺桿’插入至所有上述支架中’且配置成 棘· 平行;以及驅動器’使上述導螺桿分別旋 -個導成有母螺纹™述導㈣的任 平撐構件包括用於支撐上述母基板的平台,上述 口可0括.下部板,可向上述第1方向進行直線移動. lii部板,放置有上述母基板,且與上述下部板的上部 〇倾,魏轉媒動構 列绂ΐ”·1料齡別包括相互並舰配置的兩個 t „線器可於彼此相反的方向上形成切割道。 ^發明提供一種將母基板切割成多個單位基板 單:二板=]裝置包括:裝載部’裝載有形成著多個 述母騎部,㈣域錢部移送來的上 八〜土板上,沿上述單位基板的排列方向而產生切. 刀副部,沿上述母基板上所產生的切割道,來將上述=基 8 200927685 zy^zapn.aoc 板分離成單位基板;以及卸载部,卸載分離 基板’·上述刻線部包括:支撐構件,放置有上述母基板立 =線移動,·刻線單元,相互並列地配置,=上 2基板上_產生相互平行的多條蝴道;以及間隔調 上述刻線單元間的間隔進行調節,以能夠改變 ° 、上述相互平行的多條切財間的間隔。 Ο ❹ 罩你Π本發賴供—種實施肖以將母基板分離成多個 刻線步驟的方法。根據本發明,利用相 =置的多個刻線單元’於母基板上同時形成 =切割道,但當將要形成在上述母基板上的切割道的方 心變時’可對上述多侧線單元間㈣隔進行調節。 改變支撐構件旋轉90度,藉此來 要V成在上逑母基板上的切割道的方向。 動敗根f一示例,上述刻線單元設置於上述支標構件的移 ΐ沿上述支摔構件進行直線移動的第1方向而 ϋ線=上述第1方向垂直的第2方=二 動’一邊形成上述切割道。 移勒i艮=他示例,上述刻線單元設置於上述支撐構件的 ,.L上,且沿與上述支撐構件進行直線移動的第1方 :垂直的第2方向而並列地配置著,將上述多個刻線單元 ^以固^ ’ -邊使上述母基板沿上述第i方向進行直線移 動’一邊形成上述切割道。 [發明效果] 9 200927685 zyyzopu.uuc 根據本發明,使用多侧線單 成切割道,故而可縮短刻線步驟所需的;於母基板上形 而且,康本發明,可對刻線單 節’故而,當將要產生的切割道間的間隔, 所設置的單絲㈣湘方向㈣所刊時, 的排列方向上同時產生多條切割道。 有The support table of the moving unit is along the above-mentioned 〗 〖 direction; the L-moving unit makes the second scribe line single; shifts: the moving coffee, the above-mentioned shift= scribe unit has three, so that the arrangement in the above-mentioned reticle unit is in the = 1 _ unit moving the above-mentioned moving scale unit of the above-mentioned shifting scale unit, the material _ line unit, that is, the second reticle, the movable table of the above moving unit, respectively: to: the squaring unit may include a support table for the above moving unit The moving unit moves the second engraved third engraving unit along the seventh j-th drive. According to another example, the above-described engraving unit may be disposed on the movement path U1′ of the above-described support member 7 200927685 ^.^^opu.uuc and may be juxtaposed in the second direction perpendicular to the one direction in which the support member linearly moves. Configuration. The interval adjusting unit may include: a driving member that linearly moves the above-described engravings to the second direction; and a guiding member disposed along the straight line, and the driving member for the engraving unit may include: Brackets are respectively attached to the above-mentioned Si cover: the screw 'inserted into all the above-mentioned brackets' and configured to be parallel to the spine; and the driver 'rotate the above-mentioned lead screw to be guided by the female thread TM (4) Any of the flat members includes a platform for supporting the mother substrate, and the port may include a lower plate that is linearly movable in the first direction. The lii plate is placed with the mother substrate and the lower plate The upper part is tilted, and the Wei-transfer medium is constructed. The first two ages include the two parallel lines that can form the cutting path in opposite directions. The invention provides a method for cutting the mother substrate into A plurality of unit substrate sheets: two plates=] The device includes: a loading portion 'loaded with a plurality of mating portions that are formed, and (4) a top eight-soil plate that is transported by the money portion, and is generated along the direction in which the unit substrates are arranged Cut. Knife And separating the above-mentioned base 8 200927685 zy^zapn.aoc plate into a unit substrate; and unloading portion, unloading the separation substrate'. The above-mentioned scribe line portion includes: a support member, and is placed The above-mentioned mother substrate vertical = line movement, and the reticle unit are arranged in parallel with each other, = a plurality of butterflies which are parallel to each other on the upper substrate; and an interval between the above-mentioned reticle units is adjusted to be able to be changed °, the interval between the plurality of cuts that are parallel to each other. Ο 罩 Π Π 发 — — 种 种 以 以 以 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 。 。 。 。 。 。 。 The plurality of scribe units ' simultaneously form a scribe line on the mother substrate, but when the square of the scribe line to be formed on the mother substrate is changed', the inter-line unit (four) compartment can be adjusted. Rotating 90 degrees, thereby making V the direction of the cutting path on the upper mother substrate. As an example, the above-mentioned marking unit is disposed on the movement of the above-mentioned branch member and moves linearly along the supporting member. 1st The direction and the ϋ line = the second side of the first direction perpendicular to the second direction = the second movement 'the side forms the above-mentioned scribe line. The displacement 艮 i = his example, the above-mentioned reticle unit is disposed on the above-mentioned support member, . The first member in which the support member linearly moves is arranged in parallel in the second direction perpendicular to the second direction, and the plurality of scribe units are linearly moved in the i-th direction while fixing the plurality of reticle units The above-mentioned cutting path is formed. [Invention effect] 9 200927685 zyyzopu.uuc According to the present invention, a multi-sided line is used to form a dicing line, so that the scribe line step can be shortened; on the mother substrate, and the invention can be The scribe line section "Therefore, when the interval between the scribe lines to be produced, the monofilament (4) Xiang direction (4) is set, a plurality of scribe lines are simultaneously generated in the arrangement direction. Have
為讓本發明之上述特徵和優點能更明顯易僅,下文特 舉實施例,並配合所附圖式作詳細說明如下。 【實施方式】 a以下,參照隨附的圖1〜圖18E,對本發明的實施形 f進行更詳細的說明。本發明的實施形態可變形為多種形 態,本發明的範圍並不受後述的實施形態的限制。本實施 形態僅疋為了向本領域技術人員進一步清晰地說明本發明 而提供。故而,為了進一步明確地進行說明,圖式中的要 素的形狀等有所誇張。 (實施形態) 圖1為表示母基板的一例的圖。 如圖1所示,母基板1可為薄膜電晶體-液晶顯示器 (Thin Film Transistor-Liquid Crystal Display * TFT-LCD) 用面板。母基板1由大致具有四邊形的板狀的第1母基板 2及第2母基板3所構成。第1母基板2與第2母基板3 積層於上下。第1母基板2可以是形成著薄膜電晶體基板 的基板’第2母基板3可以是形成著彩色遽光片基板(color filter substrate)的基板。 200927685The above described features and advantages of the present invention will become more apparent and obvious. [Embodiment] Hereinafter, an embodiment f of the present invention will be described in more detail with reference to the accompanying drawings 1 to 18E. The embodiments of the present invention can be modified into various forms, and the scope of the present invention is not limited by the embodiments described below. This embodiment is provided only to further illustrate the present invention to those skilled in the art. Therefore, in order to further clarify the description, the shape of the elements in the drawings and the like are exaggerated. (Embodiment) FIG. 1 is a view showing an example of a mother substrate. As shown in FIG. 1, the mother substrate 1 may be a panel for a Thin Film Transistor-Liquid Crystal Display (TFT-LCD). The mother substrate 1 is composed of a first mother substrate 2 and a second mother substrate 3 having a substantially quadrangular shape. The first mother substrate 2 and the second mother substrate 3 are stacked on the upper and lower sides. The first mother substrate 2 may be a substrate on which a thin film transistor substrate is formed. The second mother substrate 3 may be a substrate on which a color filter substrate is formed. 200927685
^yy^opu.uuC 2 3第1二m母基板2、3上可形成衫個單位基板 t二 3a可格子狀地排列於第1以及第 2 :基板2、3的平面上。—般而言,單位基板^^的 ㈣長及縱邊長可互不相同,根據單位基板2a、3a的排列 方向’將要產生的切割道間的距離亦可互不相同。 二τ方紐1除了可以是薄膜電晶體-液晶顯示 ^ · CD)用面板以外’亦可以是平板顯示器用面板 Ο ❹ 的一種、即,有機發光二極體(〇聊iC Light Emitting Diodes ’ OLED)顯示器用面板。 圖2為概略性地表示本發明的基板切割裝置ι〇的構 成的圖。 士如圖2所示,基板切割裝置10用於將母基板(圖1 中的圖式符號1)切割成多個單位基板, ^部12、分割和以及卸載部14。裝載部η刻線部 h分割部13以及卸載部14可依序配置成—行。母基板 經由裝載部11而流入至基板切割裝置10,依序經過刻線 =12及分割部13而分離成多個單位基板,之後,經由卻 載部14而流出至基板切割裝置1〇的外部。 刻線部12利用後述的刻線裝置12a,於第i母基板2 ,者第2母基板3上沿單位基板的排列方向而形成切割道 一 ^cribeLine)。分割部13利用切割棒(BreakBar)(未圖 示將力施加至形成於母基板i的切割道部位以將母基 板1切割成單位基板。 可於刻線部12的-側配置反轉部15。反轉部15使形 11 200927685^yy^opu.uuC 2 3 The first two m mother substrates 2 and 3 can form a unit substrate t 2a can be arranged in a lattice on the planes of the first and second substrates 2 and 3. In general, the (four) length and the longitudinal length of the unit substrate ^^ may be different from each other, and the distance between the dicing streets to be generated depending on the arrangement direction of the unit substrates 2a, 3a may be different from each other. In addition to the thin-film transistor-liquid crystal display (CD) panel, it can also be a panel for flat panel display, ie, an organic light-emitting diode (〇Cai iC Light Emitting Diodes ' OLED) ) Display panel. Fig. 2 is a view schematically showing the configuration of a substrate cutting device ι of the present invention. As shown in FIG. 2, the substrate cutting device 10 is for cutting a mother substrate (schematic symbol 1 in FIG. 1) into a plurality of unit substrates, a portion 12, a division and an unloading portion 14. The loading portion η reticle portion h dividing portion 13 and the unloading portion 14 may be sequentially arranged in a row. The mother substrate flows into the substrate dicing apparatus 10 via the loading unit 11 , and is sequentially separated into a plurality of unit substrates by scribe line 12 and the dividing unit 13 , and then flows out to the outside of the substrate dicing apparatus 1 经由 via the carrier unit 14 . . The reticle portion 12 forms a dicing line on the i-th mother substrate 2 on the second mother substrate 3 along the direction in which the unit substrates are arranged by the scribe line device 12a, which will be described later. The dividing portion 13 is formed by a BreakBar (a force is not applied to the scribe line portion formed on the mother substrate i to cut the mother substrate 1 into a unit substrate. The inverting portion 15 can be disposed on the side of the reticle portion 12). Reverse part 15 makes shape 11 200927685
Z^^opn.uuC 成著切割道的一面的位置與未形成切割道的另 一面的位置 互換。亦即,首先在第1以及第2母基板2、3中的第1 母基板2上形成切割道,然後在第2母基板3上形成切割 道時,使母基板1反轉,以使第〖母基板2與第2母基板 3的上下位置互換。 圖3為表示圖2的刻線部12中所設置的刻線裝置12a 的一例的立體圖,圖4以及圖5為圖3中的刻線裝置i2a ^ 的平面圖以及侧視圖。 為了便於說明,將後述的支撐構件1〇〇的直線移動方 向稱作第1方向22,將水平面上的與第i方向22垂直的 方向稱作第2方向24,將與第1以及第2方向22、24垂 直的上下方向稱作第3方向26。第丄方向22與第2方向 24,分別與格子狀地排列於母基板丨的單位基板2的邊中 的任一邊相對應。 ^圖3〜圖5所示’刻線裝置12a包括支撐構件1〇〇、 刻線單元200、移動單元300以及間隔調節單元400。支柃 Q 齡100於實施刻線步驟時支標母基板1。支撐構件10牙0 使母基板1向第1方向22進行直線移動,且使母基板工 =朝向第3方向26❸支撐構件100的中心軸為基準而旋 轉。刻線單it 200與設在支樓構件刚上的母基板^ 觸’於母基才反1上形成切割道。移動單元3 沿第2方向24進行直線移動。間隔調節單元働= 1方向22上的刻線單元200之間的間隔進行調節。 支撐構件100包括平台_6)120、直線驅動構件_ 12 200927685 ZOJJi i · Uaju 以及旋轉驅動構件160。平台120具有上部板122及下部 板124。自上部觀察時,上部板122及下部板124大致具 有,方形的形狀。上部板122及下部板124相互平行地配 置著,上部板122位於下部板124的上侧。上部板122上 設置著母基板1。上部板122與母基板i相似,或者具有 大於母基板1的面積。於上部板122的上表面上可形成與 真空管線(vacuumline)(未圖示)連結的多個孔(未圖示), 0 母基板1藉由真空壓而固定於上部板122。上部板122或 ,下部板124上,可選擇性地附加設置用於將母基板1固 疋於上部板122的夾具(eiamp)(未圖示)。 直線驅動構件140使平台120向第1方向22進行直 線移動。直線驅動構件140包括導引構件142、支架144 以及驅動器(未圖示)。導引構件142以較長的長度沿第i 方向22而設置’且配置於基座3〇上的中央。導引構件142 在長度方向上具有相同的寬度。導引構件的上表面平 坦’導引構件142的兩側面分別於第1方向22上形成著較 V 長的槽141。 平台120藉由支架144而與導引構件142連結。支架 144具有底板145、支撐板147以及結合板149。底板145 具有平坦的長方形的板狀,且位於導引構件142上。支撐 板147垂直地固定設置於底板145的上表面,並以對平台 12〇進行支撐的方式而固定結合於平台120的下部板124。 支撐板147有兩個,且並列地配置於底板145的上表面的 兩側。結合板149具有垂直地結合於底板145的底面的側 13 200927685 z^^zopu.uuc 板149a、及自侧板149a的下端垂直地延伸至内側的插入 板149b。插入板149b插人至形成於導引構件142的侧面 的槽141内。結合板149有兩個且彼此相對向。Z^^opn.uuC The position of one side of the cut track is interchanged with the position of the other side where the cut track is not formed. In other words, first, a dicing street is formed on the first mother substrate 2 of the first and second mother substrates 2, 3, and when the dicing street is formed on the second mother substrate 3, the mother substrate 1 is reversed so that the first The upper and lower positions of the mother substrate 2 and the second mother substrate 3 are interchanged. Fig. 3 is a perspective view showing an example of the reticle device 12a provided in the reticle portion 12 of Fig. 2, and Figs. 4 and 5 are a plan view and a side view of the reticle device i2a^ of Fig. 3. For convenience of explanation, the linear movement direction of the support member 1 后 to be described later is referred to as a first direction 22 , and the direction perpendicular to the i-th direction 22 on the horizontal surface is referred to as a second direction 24 , and the first and second directions will be referred to. The vertical direction of the 22, 24 vertical is referred to as the third direction 26. The second direction 22 and the second direction 24 correspond to one of the sides of the unit substrate 2 arranged in a lattice shape on the mother substrate 分别. The scribe line device 12a shown in Figs. 3 to 5 includes a support member 1A, a reticle unit 200, a moving unit 300, and a spacing adjustment unit 400. The support Q age 100 is used to support the mother substrate 1 when the reticle step is performed. The support member 10 tooth 0 linearly moves the mother substrate 1 in the first direction 22, and rotates the mother substrate = toward the central axis of the third direction 26 ❸ support member 100 as a reference. The scribe line unit 200 and the mother substrate disposed on the slab member are in contact with the mother substrate to form a scribe line. The moving unit 3 moves linearly in the second direction 24. The spacing between the reticle units 200 on the interval adjustment unit 働 = 1 direction 22 is adjusted. The support member 100 includes a platform_6) 120, a linear drive member _ 12 200927685 ZOJJi i · Uaju, and a rotary drive member 160. The platform 120 has an upper plate 122 and a lower plate 124. The upper plate 122 and the lower plate 124 have a substantially square shape when viewed from the upper portion. The upper plate 122 and the lower plate 124 are arranged in parallel with each other, and the upper plate 122 is located above the lower plate 124. The mother substrate 1 is provided on the upper plate 122. The upper plate 122 is similar to the mother substrate i or has an area larger than that of the mother substrate 1. A plurality of holes (not shown) connected to a vacuum line (not shown) are formed on the upper surface of the upper plate 122, and the 0 mother substrate 1 is fixed to the upper plate 122 by vacuum pressing. An ei-amp (not shown) for fixing the mother substrate 1 to the upper plate 122 may be selectively provided on the upper plate 122 or the lower plate 124. The linear drive member 140 linearly moves the stage 120 in the first direction 22. The linear drive member 140 includes a guide member 142, a bracket 144, and a driver (not shown). The guiding member 142 is disposed in the i-th direction 22 with a long length and is disposed at the center of the base 3〇. The guiding members 142 have the same width in the length direction. The upper surface of the guiding member is flat. Both sides of the guiding member 142 form grooves 141 longer than V in the first direction 22, respectively. The platform 120 is coupled to the guiding member 142 by a bracket 144. The bracket 144 has a bottom plate 145, a support plate 147, and a coupling plate 149. The bottom plate 145 has a flat rectangular plate shape and is located on the guiding member 142. The support plate 147 is vertically fixedly disposed on the upper surface of the bottom plate 145, and is fixedly coupled to the lower plate 124 of the platform 120 in a manner of supporting the platform 12A. There are two support plates 147 which are arranged side by side on both sides of the upper surface of the bottom plate 145. The coupling plate 149 has a side plate 13 149a vertically joined to the bottom surface of the bottom plate 145, and an insertion plate 149b extending perpendicularly from the lower end of the side plate 149a to the inner side. The insertion plate 149b is inserted into the groove 141 formed in the side surface of the guiding member 142. The bonding plates 149 have two and are opposed to each other.
驅動器提供驅動力,以使平台丨2〇受到導引構件142 的引導而向第1方向22進行直線移動。可將包括馬達 (motor )與螺;f干(serew )的組合件(assembiy )用作驅動 器。可選擇性地將由馬達、傳送帶(belt)以及滑輪的组 合所構成的組合件或者包括線性馬達(u· Μ_)的 組合件用作驅動器。相關技術領域的技術人貞已知曉上述 的多種驅動組合件的具體構成,故而省略與該構成相關的 詳細說明。 旋轉駆動構件16G使平台12〇旋轉。平台m的旋轉 使母基板1上的_道的產生方向發生變化。若沿著母基 板1上所形成的單位基板2a、3a的排列方向中的任一個方 向’產生了切割^’則旋轉驅動構件16〇使母基板i旋轉 又,再次沿者早位基板2a、3a的 方向來產心财。 w ’旋轉驅動構件160具有馬達162及旋轉 連社於置於支架144的底板145的中心部。 =24.而與上部板⑵相結合。下部= (未_),此抽承構件以可旋轉的 行支撐。藉由此種構成,可使設置 者母基板丨的千台12G的上部板122旋轉上部板_ 200927685 zy^zopn.uuc 旋轉角度為90度。 如圖3以及圖4所示,根據本發明,設置多個刻線單 元200。本實施形態中,以配置著兩個刻線單元2〇加、2〇肋 的情況為例來進行說明。然而,亦可與上述例不同地,設 置二個或二個以上的刻線單元。第i刻線單元2〇〇a與第2 刻線單元200b配置於支撐構件1〇〇的移動路徑上,且'於第 1方向22上相互隔離。The driver provides a driving force to cause the stage 丨2〇 to be linearly moved in the first direction 22 by being guided by the guiding member 142. An assembly (assembiy) including a motor and a screw can be used as a driver. An assembly composed of a combination of a motor, a belt, and a pulley or an assembly including a linear motor (u· Μ_) can be selectively used as the driver. The specific configuration of the above various drive assemblies is known to those skilled in the related art, and detailed descriptions related to the configuration are omitted. The rotary swaying member 16G rotates the platform 12 〇. The rotation of the stage m changes the direction in which the path of the mother substrate 1 is generated. When a cutting is generated in any one of the arrangement directions of the unit substrates 2a, 3a formed on the mother substrate 1, the rotation driving member 16 rotates the mother substrate i again, and again along the early substrate 2a, The direction of 3a comes to produce money. The w' rotary drive member 160 has a motor 162 and a rotary joint at a central portion of the bottom plate 145 of the bracket 144. =24. Combined with the upper plate (2). Lower = (not _), this draw member is supported in a rotatable row. With this configuration, the upper plate 122 of the plurality of sets 12G of the mother substrate can be rotated by the upper plate _ 200927685 zy ^ zopn.uuc with a rotation angle of 90 degrees. As shown in Figures 3 and 4, a plurality of reticle units 200 are provided in accordance with the present invention. In the present embodiment, a case where two reticle units 2 are added and two ribs are arranged will be described as an example. However, two or more reticle units may be provided differently from the above examples. The i-th line unit 2〇〇a and the second engraving unit 200b are disposed on the movement path of the support member 1〇〇, and are separated from each other in the first direction 22.
卜如圖6所示,第1刻線單元200a具有並列地配置於 第2方向24上的兩個刻線器22〇a、24〇a,第2刻線單元 2〇〇b具有並列地配置於第2方向24上的兩個刻線器 220b、240b。刻線器 22〇a、24〇a、220b、24〇b 具有相同的 構成,以下,以上述刻線器中的刻線器22〇a為例來進行說 明。 圖7為表示圖6中的刻線器22〇a的立體圖,圖8為 圖7中的刻線器220a的下端部的局部剖面圖,圖9為圖8 中的刻線輪的平面圖。 如圖7〜圖9所示,刻線器22〇a具有刻線輪222、支 导224擠壓構件226以及振盪器228。刻線輪222於實 驟時與母基板1相接觸,且—邊沿母基板1的表 r〇〗ling) ’ 一邊於母基板1上形成切割道。可使用 質的輪(wheel)來作為刻線輪222。於刻線輪您 =$成著圓形的通孔222b,刻線輪似㈣緣2瓜 鋒利。刻線輪222由支撐體224支揮。支標體 /、有本體224a及軸桿(shaft pin) 22牝。於本體224a 15 200927685 ^yy^opu.ixuc 的下表面形成有向一個方向貫穿本體224a的槽225。軸桿 224b具有剖面呈圓形的長柱(rod)狀。軸桿224b沿與槽225 的長度方向垂直的方向而位於槽225内。軸桿224b的兩端 固定設置於本體224a。軸桿224b貫穿該形成於刻線輪222 中的通孔222b。當藉由軸桿224b來對刻線輪222進行支 樓時,刻線輪222的一部分位於槽225内,而另一部分向 支撐體224的下方突出。當刻線輪222與母基板1接觸時, 0 該擠壓構件226對刻線輪222加壓,以使刻線輪222以固 定的力來擠壓母基板1。根據一示例,擠壓構件226位於 支撐體224的上部,利用空壓來將支撐體224向下方向擠 壓’猎此來對刻線輪222加壓。振盪器228於刻線步驟進 行時對刻線輪222施加振動。振盪器228安裝於本體224a 内4 ’可使用超音波振盡器(megasonic transducer)來作 為振盪器228。 兩個刻線器220a、240a以互不相同的方式配置著。 其中一個刻線器220a配置成當向一個方向移動時,可於母 基板1上產生切割道,而另一個刻線器24〇a則配置成當向 與上述方向相反的方向移動時,可於母基板丨上產生切割 道。藉此,當其中一個刻線器220a自母基板1的一側向與 其相向的另一侧移動時,於母基板丨上產生切割道,而當 另個刻線器240a自母基板1的另一側向與其相向的上述 一側移動時’於母基板1上產生切割道。刻線器22〇a、24〇a 以分別獨立地向上下方向移動的方式而設置,用於產生切 割道的刻線器比其他刻線器位於更下方向。 16 200927685 zy^zdpii.uoc 第2刻線單元200b中所設置的刻線器2施、2獅, 亦與第1刻線單元200a中所設置的刻線器22〇b、2働相 同。 而且」如圖3〜圖5所示,移動單元300包括··使第 5線單元2GGa移動的第1移動單元32。、以及使第2刻 線單元200b移動的第2移動單元34〇。第1移動單元32〇 與第2移動單元340具有大致類似的構造。第1移動單元 © 320具有兩個垂直支撐台32卜導引構件323、支架3乃以 及驅動構件(圖4中的329)。垂直支撐台321配置成於第 2方向24上相互隔離。以如下的方式來設置垂直支撐台321 間的間隔’即,當母基板i沿第丨方向22進行直線移動時, 使得母基板1能夠通過垂直支撐台321之間。 導引構件323具有長條形狀,且以較長的長度而配置 於第2方向24。導引構件323對第1刻線單元2〇〇a進行 導引,使該第1刻線單元200a沿第2方向24進行直線移 動。導引構件323的兩端分別設置於垂直支撑台321上, © 從而受到垂直支撐台321支撐。導引構件323的上表面以 及下表面上分別沿第2方向24而設有較長的槽323a。 第1刻線单元200a藉由支架325而與導引構件323 相結合。如圖6所示,支架325具有支撐板330及結合板 335。支撐板336具有平坦的長方形的板狀,且位於導引構 件323的一侧面上。結合板335具有侧板331及插入板 333’該側板331自支撐板336的上側以及下侧以與支樓板 336垂直的方式而犬出’該插入板333插入至形成於導引 17 200927685As shown in FIG. 6, the first engraving unit 200a has two reticle 22A, 24A arranged in parallel in the second direction 24, and the second engraving unit 2〇〇b is arranged side by side. Two scribers 220b, 240b in the second direction 24. The scribers 22A, 24A, 220b, and 24b have the same configuration. Hereinafter, the scriber 22A in the above scriber will be described as an example. Fig. 7 is a perspective view showing the scriber 22A of Fig. 6, Fig. 8 is a partial cross-sectional view of the lower end portion of the scriber 220a of Fig. 7, and Fig. 9 is a plan view of the reticle of Fig. 8. As shown in Figs. 7 to 9, the scriber 22A has a reticle 222, a guide 224 pressing member 226, and an oscillator 228. The sprocket wheel 222 is in contact with the mother substrate 1 at the actual step, and a scribe line is formed on the mother substrate 1 along the side of the mother substrate 1. A qualitative wheel can be used as the engraving wheel 222. On the engraving wheel you =$ into a circular through hole 222b, the engraving wheel looks like (four) edge 2 melon sharp. The engraving wheel 222 is supported by the support body 224. The support body / has a body 224a and a shaft pin 22 牝. A groove 225 penetrating the body 224a in one direction is formed on the lower surface of the body 224a 15 200927685 ^yy^opu.ixuc. The shaft 224b has a long rod shape having a circular cross section. The shaft 224b is located in the groove 225 in a direction perpendicular to the longitudinal direction of the groove 225. Both ends of the shaft 224b are fixedly disposed to the body 224a. The shaft 224b penetrates through the through hole 222b formed in the reeling wheel 222. When the engraving wheel 222 is branched by the shaft 224b, a portion of the engraving wheel 222 is located in the groove 225 and the other portion protrudes below the support body 224. When the sprocket 222 is in contact with the mother substrate 1, the pressing member 226 pressurizes the sprocket 222 to cause the sprocket 222 to press the mother substrate 1 with a fixed force. According to an example, the pressing member 226 is located at the upper portion of the support body 224, and the support body 224 is pressed in the downward direction by the air pressure to pressurize the engraving wheel 222. The oscillator 228 applies vibration to the engraving wheel 222 as it proceeds. The oscillator 228 is mounted in the body 224a 4' and can be used as an oscillator 228 using a megasonic transducer. The two scribers 220a, 240a are arranged differently from each other. One of the scribers 220a is configured to generate a scribe line on the mother substrate 1 when moving in one direction, and the other scriber 24 〇a is configured to be movable in a direction opposite to the above direction. A scribe line is created on the mother substrate. Thereby, when one of the scribers 220a moves from one side of the mother substrate 1 to the other side opposite thereto, a scribe line is formed on the mother substrate ,, and when another scriber 240a is attached to the other from the mother substrate 1 When one side moves toward the one side opposite thereto, a scribe line is formed on the mother substrate 1. The scribers 22A, 24A are provided in such a manner as to be independently moved up and down, and the scriber for generating the dicing track is located lower than the other scribers. 16 200927685 zy^zdpii.uoc The scriber 2 and the 2 lions provided in the second engraving unit 200b are also the same as the scribers 22〇b and 2働 provided in the first engraving unit 200a. Further, as shown in Figs. 3 to 5, the moving unit 300 includes a first moving unit 32 that moves the fifth line unit 2GGa. And a second moving unit 34 that moves the second reticle unit 200b. The first moving unit 32 具有 has a substantially similar configuration to the second moving unit 340. The first moving unit © 320 has two vertical support tables 32, a guide member 323, a bracket 3, and a drive member (329 in Fig. 4). The vertical support tables 321 are arranged to be isolated from each other in the second direction 24. The interval between the vertical support stages 321 is set in such a manner that when the mother substrate i moves linearly in the second direction 22, the mother substrate 1 can pass between the vertical support stages 321. The guiding member 323 has an elongated shape and is disposed in the second direction 24 with a long length. The guiding member 323 guides the first engraving unit 2A, and linearly moves the first engraving unit 200a in the second direction 24. Both ends of the guiding member 323 are respectively disposed on the vertical supporting table 321 so as to be supported by the vertical supporting table 321 . The upper surface of the guiding member 323 and the lower surface are respectively provided with long grooves 323a along the second direction 24. The first engraving unit 200a is coupled to the guiding member 323 by a bracket 325. As shown in FIG. 6, the bracket 325 has a support plate 330 and a coupling plate 335. The support plate 336 has a flat rectangular plate shape and is located on one side of the guiding member 323. The coupling plate 335 has a side plate 331 and an insertion plate 333' which is inserted from the upper side and the lower side of the support plate 336 in a manner perpendicular to the branch floor 336. The insertion plate 333 is inserted into the guide 17 200927685
厶OjpihUUG 構件323的槽323a内。 驅動構件329提供驅動力,以使支架325沿導引構件 323進行直線移動。驅動構件329具有導螺桿327、以及對 該導螺桿327提供旋轉力的驅動器328。導螺桿327以與 導引構件323平行的方式而設置於導引構件323的一側了 導螺4干327的兩端由垂直支撐台321支撐。駆動器328設厶OjpihUUG member 323 is in slot 323a. The driving member 329 provides a driving force to linearly move the bracket 325 along the guiding member 323. The drive member 329 has a lead screw 327 and a driver 328 that provides a rotational force to the lead screw 327. The lead screw 327 is disposed on one side of the guide member 323 in parallel with the guide member 323. Both ends of the guide screw 4 327 are supported by the vertical support table 321. Actuator 328
❹ 置於垂直支撐台321中的任一個上,且與導螺桿327的一 端相連結。可使用馬達來作為驅動器328。而且,支架325 中可設置與導螺桿327的公螺紋部相嚙合的母螺紋部'(未 圖示)。可選擇性地使用包括馬達、傳送帶以及滑輪^組人 件、或者採用了線性馬達的組合件等來作為驅動構件329"。 第1刻線單元200a以可上下移動的方式而安裝於 架325的支撐板336。根據一示例,支撐板336上,沪 方向26而形成著狹縫形狀的導引槽336a, /σββ 一 1 裹lj -甲.-yr 2〇〇a的刻線器220a、240a分別與插入至導弓丨槽幻6卞、 支撐軸(未圖示)相結合。 内的 ,隔調節單元40㈣第1方向22上的第Μ線單元 篇,、第2刻線單元200b之間的間隔進行 根 示例,第丨移動單元320的垂直支樓台321, 座30,使得第1刻線單元200a不會向第丨义又置I岙 第2移動單元爛衫遍34Ux = 第1方向22移動的方式而設置,第2刻雄„暴座30上向 夠向第1方向22移動的方式而設置。間二以能 使第2移動單元34〇的垂直支撐台341 ^調卽單兀4〇0 句第1方向22移 18 200927685 zy^z-opn.uuc 動,藉此來對第1刻線單元20〇a 間的間隔進行調節。 與第2刻線單元2〇〇b 之❹ is placed on either of the vertical support tables 321 and coupled to one end of the lead screw 327. A motor can be used as the driver 328. Further, a female thread portion ' (not shown) that engages with the male thread portion of the lead screw 327 may be provided in the bracket 325. As the drive member 329", a motor, a belt, and a pulley member, or a combination of a linear motor or the like can be selectively used. The first engraving unit 200a is attached to the support plate 336 of the holder 325 so as to be movable up and down. According to an example, on the support plate 336, a slit-shaped guide groove 336a is formed in the Shanghai direction 26, and the scribers 220a, 240a of the / σββ-1 wrapped lj-A.-yr 2〇〇a are respectively inserted and inserted into The guide bow groove is combined with a support shaft (not shown). In the internal adjustment unit 40 (four), the first line direction in the first direction 22, and the interval between the second line unit 200b are rooted, and the vertical branch block 321 of the second moving unit 320, the seat 30, makes The 1st line unit 200a is not provided in the manner of moving the second moving unit and the second moving unit 34Ux = the first direction 22, and the second moment is the upper direction of the turret 30. The movement mode is set. The second support unit 341 can adjust the vertical support table 341 of the second mobile unit 34, and the first direction 22 is shifted by 18 200927685 zy^z-opn.uuc. The interval between the first engraving units 20〇a is adjusted. The second engraving unit 2〇〇b
間隔調節單元400具有支揮纟42〇、導引構件44〇以 及驅,構件(圖4中的46。)。域台42。分別配置於第2 移動早疋340的垂直支撐台341的兩側。第!支撐塊422 配置於第1移動單元320的垂直支撐台321與第2移動單 元的垂直支撐台341之間。第2支撐塊424以第2移 動单元340的垂直支樓台341為基準而配置於第1支撑塊 422的相反側。驅動構件46〇使第2移動單元34〇的=直 支擇台341沿第丨方向22進行直線移動。驅動構件彻 具有導螺桿462、及對該導螺桿462提供旋轉力的驅動器 464。導螺桿462的長度方向為第1方向22,位於第j支 撐塊422與第2支撐塊424之間,且兩端分別與第丨支撐 塊422及第2支撐塊424相結合。導螺桿462分別與第^ 移動單元340的垂直支撐台341上所形成的母螺紋部'(未 圖示)相嚙合。驅動器464設置於第1支撐塊422或者第 2支撐塊424上,且與導螺桿462的一端相連結。可使用 馬達來作為驅動器464。以具有馬達464及導螺桿462的 組合件為例,對驅動構件460進行說明,但除了上述組人 件以外’亦可使用如線性馬達等能夠對移動單元的垂直支 撐台提供直線驅動力的多種驅動器。 導引構件440對第2移動皁元340的垂直支樓台Mi 進行導引’使該垂直支撐台341向第1方向進行直線^動。 導引構件440設置成與導螺桿462平行。例如,導引構件 19 200927685 440可設置為柱(r〇d)狀,且兩端分別與第i支撐塊422及 第2支撐塊424固定結合。此時,導引構件44〇插入至第 2移動單元340的垂直支撐台341上所形成的孔(未圖示) 内。 藉由控制部500來對第1移動單元32〇、第2移動單 元340、間隔調節單元400以及平台12〇的動作進行控制。 亦即,於產生切割道時,控制部5〇〇對第i移動單元32〇 〇 及第2移動單元進行控制,以使第i刻線單元篇 及第2刻線單元2_肖第2方向進行直線移動。若產生兩 個,割道’則控制部500對驅動器進行控制,以使平台12〇 進行直線義。而且,當形成全部與母基板i上所 單位基板2a、3a的排列方向中的任—個方向平行的切判道 之後^控制部500對旋轉驅動構件16〇進行控制而使^台 120旋轉,且上述控制部5〇〇對間隔調節單元*⑽ 二 制,以對第1刻線單元20〇a與第2刻線單元島之^ 間隔進行調節。 曰、 使用具有上述構成的本發明的基板切割裳置1〇來製 造平板顯Μ®板’以下_製造輕加以說明。 為依序表示_本發明的基板_裝置來製造 千板顯不盗的過程的流程圖。 表 母^圖^及圖10崎,母基板1裝·裝载部11。 母基板1是在第1以及第2母基板2、3中的任 向的狀態下被裝載。此處,為了便於說明, 母基板2朝向上方向的情況為例來進行制。裝載部第^ 20 200927685 2vvz5pn.aoc 將母基板1移送至刻線部12 (sl〇)。 刻線部12對朝向上方向的第1母基板2實施刻線步 骤於第1母基板2上形成切割道之後,刻線部12將母基 板1移送至反轉部15 (S20)。 反轉部15使母基板i反轉,以使第2母基板3朝向 上方向,且再次將反轉後的母基板丨移送至刻線部a (S30)。The interval adjusting unit 400 has a supporting member 42〇, a guiding member 44〇, and a driving member (46 in Fig. 4). Domain station 42. They are respectively disposed on both sides of the vertical support table 341 of the second moving early 340. The first! The support block 422 is disposed between the vertical support table 321 of the first moving unit 320 and the vertical support table 341 of the second moving unit. The second support block 424 is disposed on the opposite side of the first support block 422 with respect to the vertical support floor 341 of the second moving unit 340. The driving member 46 causes the second moving unit 34's = straight branching table 341 to linearly move in the second direction 22 . The drive member has a lead screw 462 and a driver 464 that provides a rotational force to the lead screw 462. The lead screw 462 has a longitudinal direction of the first direction 22 and is located between the j-th support block 422 and the second support block 424, and is coupled to the second support block 422 and the second support block 424, respectively. The lead screw 462 is engaged with a female screw portion ' (not shown) formed on the vertical support table 341 of the second moving unit 340, respectively. The driver 464 is disposed on the first support block 422 or the second support block 424 and is coupled to one end of the lead screw 462. A motor can be used as the driver 464. The driving member 460 is described by taking an assembly having the motor 464 and the lead screw 462 as an example, but in addition to the above-described group member, a plurality of drivers capable of providing a linear driving force to a vertical supporting table of the moving unit such as a linear motor may be used. . The guiding member 440 guides the vertical branch floor Mi of the second moving soap unit 340. The vertical supporting table 341 is linearly moved in the first direction. The guiding member 440 is disposed in parallel with the lead screw 462. For example, the guiding member 19 200927685 440 may be disposed in a column shape, and the two ends are fixedly coupled to the i-th support block 422 and the second support block 424, respectively. At this time, the guide member 44 is inserted into a hole (not shown) formed in the vertical support table 341 of the second moving unit 340. The operation of the first moving unit 32A, the second moving unit 340, the interval adjusting unit 400, and the stage 12A is controlled by the control unit 500. That is, when the scribe line is generated, the control unit 5 控制 controls the i-th moving unit 32 〇〇 and the second moving unit so that the i-th reticle unit and the second reticle unit 2 _ the second direction Make a straight line move. If two cuts are generated, the control unit 500 controls the drive so that the platform 12 is linearly defined. Further, after all the cutting paths which are parallel to any one of the arrangement directions of the unit substrates 2a and 3a on the mother substrate i are formed, the control unit 500 controls the rotation driving member 16A to rotate the table 120. Further, the control unit 5 〇〇 pairs the interval adjusting unit * (10) to adjust the interval between the first reticle unit 20 〇 a and the second reticle unit island.曰 The use of the substrate of the present invention having the above-described configuration is carried out by cutting the wafer to form a flat panel. A flow chart for the process of manufacturing the substrate-device of the present invention to produce a thousand-plate display. The mother and the figure 10 and the mother board 1 are mounted and loaded. The mother substrate 1 is mounted in the state of any of the first and second mother substrates 2, 3. Here, for convenience of explanation, the case where the mother substrate 2 faces upward is taken as an example. The loading unit No. 20 200927685 2vvz5pn.aoc transfers the mother substrate 1 to the reticle portion 12 (s1〇). The reticle portion 12 performs a scribe step on the first mother substrate 2 in the upward direction to form a scribe line on the first mother substrate 2, and then the reticle portion 12 transfers the mother substrate 1 to the inversion portion 15 (S20). The inverting portion 15 reverses the mother substrate i so that the second mother substrate 3 faces upward, and again transfers the inverted mother substrate 至 to the reticle portion a (S30).
刻線部12對朝向上方向的第2母基板3實施刻線步 驟。於第2母基板3上形成切割道之後,刻線 板1移送至分離ea_13⑽)。p 12將母基 分割部13對母基板i實施分割步驟,將該母基板i 分離成多個單位基板,其巾該母基板丨上的第丨以及第2 母基板2、3已被實施了刻線步驟(S5〇)。 抑藉由分割步驟來將母紐!分離成多個單位基板後, 將單位基板卸載至卸載部14 (S6〇),然後,對單位美 施清洗步驟。 土貝 接著’對於在刻線部12巾,使用本發明的刻線裝置 12a來對母基板〗實施刻線步驟的過程進 、 置於^^〜圖111為表示利用圖3以及圖4中的刻線裝 置於母基板1上產生切割道的過程的圖。 母基板1設於平台120的上部板122上。平台12〇藉 由驅動器(未圖示)而向第】方向22進行直線:動(圖 11A) 〇 當平台120移動至預先設定的位置(亦即,母基板工 21 200927685 zyyzopu.aoc 3 i切割預定線a與第〗刻線單元職對齊的位置)為 止後,使平台120停止移動。之後,使間 ⑽ 器464受到驅動,以對第1刻線單二二2第2 之間的間隔進行調節。間隔調節單元400 使第2移動早元340的垂直支擇台341向第i方向D進行 ❹ ,線當齡第2機單元㈣的移動,將第2刻線 早το 2_移動至預先設定的位置(亦即,第2刻線單元 2〇〇b與母基板!的第2切割預定線b對齊的位置)為止後, 使第2移動單元34〇的垂直支樓台341停止移動(圖iib)。 於第1刻線單元200a以及第2刻線單元2〇〇b沿第i 方向22而與母基板1的第1切割預定線a及第2切割預定 線b對齊的狀態下,使第!移動單元32〇及第2移動單元 340的驅動器328、348受到驅動,以使第i刻線單元2〇〇& 及第2刻線單元2〇〇b向母基板1的一側方向移動。 之後’第1刻線單元200a及第2刻線單元2〇〇b的刻 線器中,各自的一個刻線器220a、220b向下方向移動,並 與母基板1相接觸(圖11C)。 圖11A、圖11B以及圖11C的順序可相互對調。例如, 亦可首先對第1刻線單元200a及第2刻線單元2〇〇b之間 的間隔進行調節之後,使母基板1的第1切割預定線a及 第2切割預定線b與第1刻線單元200a以及第2刻線單元 200b對齊。 之後,使移動單元320、340的驅動器328、348受到 驅動’使刻線單元200a、200b沿第2方向24以橫穿母基 22 200927685 z^^zopii.uuc 板1的方式而移動。此時,刻線單元200a、200b的刻線器 22〇a、22%會使母基板1上形成裂縫。沿切割預定線a、b 連續地形成裂縫,藉此,於母基板丨上形成 11D)。 f沿切割預定線a、b於母基板丨上形成切割道之後, 刻線單元20〇a、200b的刻線器22〇a、22%向上方向移動。 ^平台U0藉由驅動器(未圖示)而向第1方向22進 ❹ π直線移動:當平台12。移動至預先設定的位置(亦即, 母基板1的第3切割預定線c與第㈣線單元2〇〇a對齊的 位置)為止後’使平台120停止移動。此時,第1刻線單 ? 200, * 2刻線單元2_之間的間隔已於上述過程中 得到調節’因此,第2刻線單元鳩與母基板i的第4 切割預定線d對齊(圖he)。 刻線單元20〇a、200b的刻線器240a、240b向下方向 移動,並與母基板i接觸。使移動單元32〇、34〇的驅動器 328、348受到驅動,使第1刻線單元200a及第2刻線單 ❿元200b沿第2方向24以橫穿母基板i的方式而移動。此 時,第1刻線單元200a及第2刻線單元鳩的刻線器 240a 240b會使母基板1上形成裂縫。沿切割預定線〇、廿 連續地形成裂縫,藉此,於母基板丨上形成切割道(圖 11F)。 當沿切割預定線a、b形成切割道時可使用刻線器 220a 220b,富沿切割預定線c、d形成切割道時可使用刻 線器240a、240b。其理由在於’為了使形成裂縫的刻線器 23 200927685 zyyzdpu.aoc 220a、22Gb、24Ga、24Gb的刻線輪的方向性保持固定。 當於上述過程中,沿著形成於母基板i 2:、3b的排列方向中的任-個方向而形成所有的:割S 後,=另-個方向而於母基板i上形成切割道。因此,將 放置者母基板1的平台120的上部板122相對於 旋轉90度(圖iig)。 奴 之後’平台120向第1方向22進行直線移動,以使 〇 切割預與第1刻線單元鳥對齊。當平台120 至預先設定的位置(亦即,母基板1的切割預定線f與第 1刻線單T〇2GGa對齊的位置)為止後,使平台 動(圖11H)。 秒 。使間隔調節單元4〇〇的驅動器464驅動,以對第1刻 線單元200a與第2刻線單元通之間的間隔進行調二 間隔調節單元400使第2移動單元340的垂直支撐台341 向第1方向22進行直線移動。當藉由第2移動單^ 34〇 的移動’將第2刻線單元200b移動至預先設定的位置(亦 即’第2刻線單元2〇〇b與母基板i的切割預定線e對齊的 位置)為止後,使第2移動單元340的垂直支撐台341停 止移動(圖111)。 之後,第1刻線單元200a及第2刻線單元200b的刻 線器中,各自的一個刻線器220a、220b向下方向移動並與 ,基板1接觸’藉由實施圖11D〜圖11F中所說明的過程: 可於母基板1上形成如下的切割道,該切割道與之前形成 在母基板1上的切割道的方向垂直。 24 200927685 zy^zopn.auc 單說明。 形_形後所得的多種示例進行簡 ⑽移在動上== 如;'情況:藉由使第2移動單元 到線單元2咖之間== = == 與第2 同,如圖12所+7 調即然而,亦可與此不 ❹ 移^元34的垂ff單元細的垂直支撐台切 動,340的垂直支撑台341都被移動。 了說明。然=:此::,線單元的情況進行 的刻線單元。當設有^_單個以上 單元200a哼罟士 時將位於中央的刻線 線單元‘=:==位於兩_ 而且,上述示例中,對在—個 線器的情況進行了說明。4 3線⑽設置兩個刻 -個刻線器。 …、而,可在-個刻線單元中設置 « ,c L ^ , 運便刻線早兀移動,一邊於母 基板上產生切割道。然而,亦可與此不同,The reticle portion 12 performs a reticle step on the second mother substrate 3 in the upward direction. After the dicing streets are formed on the second mother substrate 3, the reticle 1 is transferred to the separation ea_13 (10)). p 12 divides the mother substrate division unit 13 into the mother substrate i, and separates the mother substrate i into a plurality of unit substrates, and the second and second mother substrates 2 and 3 on the mother substrate are implemented. Marking step (S5〇). Let's take the split step to get the mother! After being separated into a plurality of unit substrates, the unit substrate is unloaded to the unloading portion 14 (S6〇), and then the cleaning step is applied to the unit. The soil shell is followed by the process of performing the scribe step on the mother substrate using the reticle device 12a of the present invention in the reticle portion 12, and the arrangement is shown in Fig. 3 and Fig. 4 A diagram of a process in which the scribe line device produces a scribe line on the mother substrate 1. The mother substrate 1 is disposed on the upper plate 122 of the stage 120. The platform 12 is linearly moved to the first direction 22 by a driver (not shown): (FIG. 11A) When the platform 120 is moved to a predetermined position (ie, the mother substrate 21 200927685 zyyzopu.aoc 3 i cutting After the predetermined line a is aligned with the position of the reticle unit, the platform 120 is stopped. Thereafter, the inter-unit (10) 464 is driven to adjust the interval between the first engravings, the second two-two, and the second. The interval adjusting unit 400 moves the vertical supporting stage 341 of the second moving element 340 to the i-th direction D, and moves the second machine unit (four) at the time of the line, and moves the second scribe line early το 2_ to a predetermined value. After the position (that is, the position where the second reticle unit 2〇〇b is aligned with the second planned cutting line b of the mother substrate!), the vertical pedestal 341 of the second moving unit 34〇 is stopped (Fig. iib). . In a state where the first engraving unit 200a and the second engraving unit 2〇〇b are aligned with the first cutting planned line a and the second cutting planned line b of the mother substrate 1 in the i-th direction 22, the first! The moving unit 32 and the drivers 328 and 348 of the second moving unit 340 are driven to move the i-th line unit 2〇〇& and the second engraving unit 2〇〇b toward one side of the mother substrate 1. Then, in the reticle of the first reticle unit 200a and the second reticle unit 2〇〇b, each of the scribers 220a and 220b moves downward and comes into contact with the mother substrate 1 (Fig. 11C). The order of FIGS. 11A, 11B, and 11C can be mutually adjusted. For example, first, the interval between the first engraving unit 200a and the second engraving unit 2〇〇b may be adjusted, and then the first cutting planned line a and the second cutting planned line b of the mother substrate 1 may be adjusted. The 1st line unit 200a and the 2nd line unit 200b are aligned. Thereafter, the drivers 328, 348 of the mobile units 320, 340 are driven to move the reticle units 200a, 200b in a second direction 24 so as to traverse the base 22 200927685 z^^zopii.uuc board 1. At this time, the scribers 22A, 22% of the reticle units 200a, 200b cause cracks to form on the mother substrate 1. Cracks are continuously formed along the planned cutting lines a, b, whereby 11D) is formed on the mother substrate. f After forming the dicing streets on the mother substrate 沿 along the cutting planned lines a and b, the scribers 22〇a, 22% of the reticle units 20〇a, 200b are moved upward. ^ Platform U0 moves in the first direction 22 by a drive (not shown) π linearly: when platform 12. When the movement to a predetermined position (i.e., the position at which the third planned cutting line c of the mother substrate 1 is aligned with the fourth (4) line unit 2A) is moved, the platform 120 is stopped. At this time, the interval between the first reticle single 200, * 2 reticle unit 2_ has been adjusted in the above process. Therefore, the second reticle unit 对齐 is aligned with the fourth planned cutting line d of the mother substrate i. (Figure he). The scribers 240a, 240b of the reticle units 20A, 200b move in the downward direction and are in contact with the mother substrate i. The drivers 328 and 348 of the moving units 32A and 34B are driven to move the first engraving unit 200a and the second engraving unit 200b so as to traverse the mother substrate i in the second direction 24. At this time, the first reticle unit 200a and the second scribe unit 240a 240b of the second reticle unit 会使 cause cracks to form on the mother substrate 1. Cracks are continuously formed along the predetermined lines 〇 and 切割, whereby a dicing street is formed on the mother substrate ( (Fig. 11F). The scriber 220a 220b can be used when the scribe line is formed along the planned cutting lines a, b, and the scribers 240a, 240b can be used when forming the scribe line along the cutting planned lines c, d. The reason for this is that the directionality of the reticle of the scriber 23 200927685 zyyzdpu.aoc 220a, 22Gb, 24Ga, 24Gb which forms the crack is kept fixed. In the above process, all of them are formed along any one of the arrangement directions of the mother substrates i 2:, 3b: after cutting S, the other direction is formed on the mother substrate i. Therefore, the upper plate 122 of the stage 120 of the placement mother substrate 1 is rotated by 90 degrees (Fig. iig). After the slave platform 120 moves linearly in the first direction 22 so that the 切割 cut is aligned with the first reticle unit bird. When the stage 120 is at a predetermined position (i.e., a position at which the planned cutting line f of the mother substrate 1 is aligned with the first reticle line T 〇 2GGa), the platform is moved (Fig. 11H). second . The driver 464 of the interval adjusting unit 4 is driven to adjust the interval between the first engraving unit 200a and the second engraving unit to adjust the vertical support table 341 of the second moving unit 340. The first direction 22 is linearly moved. When the second reticle unit 200b is moved to a predetermined position by the movement of the second moving unit 34 (that is, the second reticle unit 2 〇〇b is aligned with the planned cutting line e of the mother substrate i) After the position), the vertical support table 341 of the second moving unit 340 is stopped (FIG. 111). Thereafter, in the scriber of the first engraving unit 200a and the second engraving unit 200b, each of the scribers 220a, 220b moves in the downward direction and is in contact with the substrate 1 by implementing FIGS. 11D to 11F. The illustrated process: A dicing street can be formed on the mother substrate 1 that is perpendicular to the direction of the scribe line previously formed on the mother substrate 1. 24 200927685 zy^zopn.auc Single explanation. A variety of examples obtained after the shape _ shape are simply (10) shifting on the motion == as in; 'Case: by making the second mobile unit to the line unit 2 between === == and the second, as shown in Figure 12 However, the vertical support table of the 340 unit can be moved, and the vertical support table 341 of the 340 is moved. The explanation. However =: This::, the line unit in the case of the line unit. When a single unit 200a gentleman is provided, the centrally located reticle unit ‘=:== is located at two _ and, in the above example, the case of the in-line unit is explained. 4 3 lines (10) set two engraving - one engraver. ..., instead, « , c L ^ can be set in a reticle unit, and the scribe line is moved early to produce a scribe line on the mother substrate. However, it can be different from this.
以固定,一邊使母基板移動,—邊 x、、,卓兀D 線單元可並列地配置於第2方向24,母基 二 他實====== 25 200927685By fixing, while moving the mother substrate, the sides x, ,, Zhuo D D line units can be arranged side by side in the second direction 24, the mother base two real ====== 25 200927685
厶:7 7厶 O 圖。而且,圖16兔广 為表示圖16中的切轉^ B」部分的放大圖’圖17 如圖14以及戶斤螺桿之間的結合關係的剖面圖。 100、刻線單元200,以及’刻線裝置12b具有支樓構件 對母基板丨進行支擇。=單元蕭。支撐構件100 向_亍直線移動,且使=;沿第1方 直的中心軸為二基板1以與母基板1的平面垂 〇 件U)0上的二°刻線單元200’與放置在支樓構 列綠留 使線早70 200’向第2方向24移動,以對 刻聲單疋:之間的間隔進行調節。#實施刻線步驟時, ;;線一被固定,母基板1沿第丨方㈣進行二 巧構件⑽的構成與之前參照圖3 切構件相同,故而省略與該構成相關的詳細說明伙月的 單元=14以及圖15所示’刻線料着具有第1刻線 的直及第2騎單元2嶋,配置於與域構件100 上$移動方向垂直的方向上,亦即配置於第2方向24 _本實麵態中,以配置著兩侧線單元細,a、2_ =兄為例來進行說明,但當然亦可配置兩個或兩個以上 各=刻線單元肅。第i以及第2刻線單元2〇o,a、2_ 從而轉ΐ後述的間隔調節單元300,而向第2方向24移動, 而調節間隔。 第2如圖16所示,第1刻線單元200,a具有並列地配置於 方向24上的兩個刻線器220,a、240,a,第2刻線單元 26 200927685 zyyzopu.aoc 200’b具有朗軌置於帛2 μ 24 220,b、240,b。刻線器 220,a、24〇,a 到骒器 彻夕乂叙眧园7面Λ 22〇b、240’b的構成 與之則參照圖7〜圖9所說明的刻線器相 該構成相關的詳細說明。 間隔調節單元獅’使各個刻線單元2GG,a、2G〇,b向第 2方向24移動,以對刻線單元肅a、2b之 隔 行調節。間隔調節單元3〇(V具有垂直支撐台31〇,、 Ο ❹ 件320’、支架330’a、330’b、以及驅動構件34〇,。垂 台31〇’配置成於第2方向24上隔開固定的距離。= 台珊配置成當母基板丨沿第丨方向η進行直線移動時, 使母基板1能夠穿過垂直支撐台310,之間。導引 固定設置於垂直支撐台3H),的上端。於導引構件32〇,的上 表面以及下表面上,沿長度方向設置著較長的槽切,。 第1刻線單元200’a藉由支架33〇’a而與導引構件32〇, 相結合,第2刻線單元200,b藉由支架33〇,b而與導 320’相結合。支架33(ra與支架33〇,b具有相同的構成故 而’以下僅對支架330,a進行說明。如圖16所示,支架33〇,& 具有支撐板332’及結合板334’。支撐板332’具有平坦的長 方开〉的板狀,且位於導引構件320’的一側面上。結合板334, 具有側板334’a及插入板334’b’該側板334fa自支樓板332' 的上侧以及下侧以與支撐板332,垂直的方式而突出,該插 入板334’b插入至導引構件320,上所形成的槽322,内。 驅動構件340'提供驅動力,以使支架330’a、330'b沿 導引構件320’進行直線移動。驅動構件340,具有配置成與 27 200927685 zyyzopu.uuc 導引構件32(r平行的第1導螺桿342,及第2導螺桿344,。 如圖17所示,第i導螺桿342,上安裝著可直線移動的支架 330心第2導螺桿344’上安裝著可直線移動的支架幻叽。 亦即,支架330’a中插入著第!導螺桿342,及第2導螺桿 344’’但第1導螺桿342’與支架33(),a中所形成的母螺紋部 335’a相嚙合,而第2導螺桿344t在不與支架33〇,a中所形 成的孔336’a接觸的狀態下貫穿於該孔336,a。與此相同 〇 地,支架330’b中插入著第1導螺桿342’及第2導螺桿 344’,但第1導螺桿342’在不與支架3動中所形成的孔 336’b接觸的狀態下貫穿於該孔336,b,而第2導螺桿μ# 與支架330,b中所形成的母螺紋部335,b相喊合。 構成,當驅動第i導螺桿342,時,支架職進== 動,但支架330,b不移動,而當驅動第2導螺桿344,時, 支架330’a不移動,但支架3遍進行直線移動。藉由此種 驅動方式,可對連結於支架330’a的第i刻線單元2〇〇4、 與連結於支架33〇’b的第2刻線單元200,b之間的間隔進行 ^。在第1導螺桿342,的-端連接著祕提供旋轉力的 第1驅動器343,,在第2導螺桿344,的一端連結著用於提 供旋轉力的第2驅動器345,。可使用馬達等的驅動器來作 為第1以及第2驅動器343,、345,。以具有馬達及導螺桿 ^組合件為例,對驅動構件34〇,進行說明,但除了上述組 合件以外,亦可使用如氣缸(cylinder)等能夠對支架 33〇a、330’b提供直線驅動力的多種驅動器。 如圖16所示’第1刻線單元2〇〇,a以能夠上下移動的 28 200927685 zy^zopii.uuc 方式而安裝於支架33G,a的支撐板332,。根據-示例,於 支撑板332’上,沿第3方向%形成著狹縫形狀的導引槽 33Γ ’第1刻線單元2〇〇’a的刻線器m術&分別與插 入至導引槽331'内的支推軸(未圖示)相結合。第2刻線 單元2麟亦以能夠上下移動的方式而與支架3獅相連 結,,、連結構造與第1刻線單元·,a的連結構造相同,故 而省略與此連結構造相關的說明。厶: 7 7厶 O map. Further, Fig. 16 is a cross-sectional view showing the enlarged relationship between the portion of the cutting portion B in Fig. 16 and Fig. 17 as shown in Fig. 14 and the pin screw. 100. The engraving unit 200, and the 'scribing device 12b' has a branch member for controlling the mother substrate 丨. = Unit Xiao. The support member 100 is linearly moved toward the _ , and is placed on the second substrate 1 along the central axis of the first square to be placed with the two-dimensional reticle unit 200 ′ on the plane of the mother substrate 1 The green line is arranged to move the line 70 200' to the second direction 24 to adjust the interval between the sounds: When the scribe line step is performed, the line 1 is fixed, and the configuration of the dies (10) of the mother substrate 1 along the second side (four) is the same as that of the front member of Fig. 3, and the detailed description of the structure is omitted. The unit=14 and the 'lined material' having the first reticle and the second riding unit 2嶋 are arranged in the direction perpendicular to the moving direction of the domain member 100, that is, in the second direction. 24 _ in the real surface state, the arrangement of the two side line units is fine, a, 2_ = brother as an example to illustrate, but of course, two or more than two = line unit can be configured. The i-th and second engraving units 2〇o, a, and 2_ are turned to the interval adjusting unit 300, which will be described later, and moved in the second direction 24 to adjust the interval. As shown in FIG. 16, the first engraving unit 200, a has two scribers 220, a, 240, a arranged in the direction 24 in parallel, and a second engraving unit 26 200927685 zyyzopu.aoc 200' b has a rail placed at 帛2 μ 24 220, b, 240, b. The scriber 220, a, 24 〇, a to the 彻 彻 彻 彻 乂 7 7 7 7 〇 〇 〇 〇 〇 、 、 、 、 、 、 、 、 、 240 240 、 240 240 240 240 240 240 240 240 240 240 240 240 240 240 240 240 240 240 Related detailed instructions. The interval adjusting unit lion ' moves each of the engraving units 2GG, a, 2G, and b in the second direction 24 to adjust the interlacing units a and 2b. The spacing adjustment unit 3〇 (V has a vertical support table 31〇, a ❹ member 320', brackets 330'a, 330'b, and a drive member 34〇. The table 31〇 is disposed in the second direction 24 Separate the fixed distance. = Taishan is configured to enable the mother substrate 1 to pass through the vertical support table 310 when the mother substrate 直线 moves linearly along the second direction η. The guide is fixedly disposed on the vertical support table 3H) The upper end. On the upper surface and the lower surface of the guiding member 32, a long groove cut is provided along the length direction. The first engraving unit 200'a is coupled to the guiding member 32A by the bracket 33A', and the second engraving unit 200, b is coupled to the guide 320' by the brackets 33A, b. The bracket 33 (ra has the same configuration as the brackets 33A and b). Hereinafter, only the brackets 330 and a will be described. As shown in Fig. 16, the brackets 33A, & have a support plate 332' and a coupling plate 334'. The plate 332' has a flat rectangular shape and is located on one side of the guiding member 320'. The bonding plate 334 has a side plate 334'a and an insertion plate 334'b'. The side plate 334fa is self-supporting the floor 332' The upper side and the lower side protrude in a manner perpendicular to the support plate 332, and the insertion plate 334'b is inserted into the groove 322 formed in the guiding member 320. The driving member 340' provides a driving force to enable The brackets 330'a, 330'b are linearly moved along the guiding member 320'. The driving member 340 has a first lead screw 342 disposed in parallel with the 27 200927685 zyyzopu.uuc guiding member 32 (r, and a second lead screw) 344, as shown in Fig. 17, the i-th lead screw 342 is mounted with a linearly movable bracket 330. The second lead screw 344' is mounted with a linearly movable bracket illusion. That is, the bracket 330'a is Inserting the first lead screw 342 and the second lead screw 344'' but the first lead screw 342' and the bracket 33 (), a The formed female screw portion 335'a is engaged, and the second lead screw 344t penetrates through the hole 336, a without being in contact with the hole 336'a formed in the bracket 33A, a. The first lead screw 342' and the second lead screw 344' are inserted into the bracket 330'b, but the first lead screw 342' is penetrated without being in contact with the hole 336'b formed in the movement of the bracket 3. The holes 336, b, and the second lead screw μ# are combined with the female thread portions 335, b formed in the brackets 330, b. The configuration, when the ith lead screw 342 is driven, the support position == However, the brackets 330, b do not move, and when the second lead screw 344 is driven, the bracket 330'a does not move, but the bracket 3 moves linearly. By this driving method, the bracket 330'a can be coupled to the bracket 330'a. The interval between the i-th engraving unit 2〇〇4 and the second engraving unit 200, b connected to the holder 33〇'b is performed at the end of the first lead screw 342. The first actuator 343 of the force is connected to the second actuator 345 for supplying a rotational force at one end of the second lead screw 344. The driver such as a motor can be used. The first and second actuators 343 and 345 have a motor and a lead screw assembly as an example, and the driving member 34 is described. However, in addition to the above-described assembly, a cylinder such as a cylinder can be used. A plurality of drivers for providing linear driving force to the brackets 33A, 330'b. As shown in Fig. 16, the 'first engraving unit 2', a is mounted on the bracket in a manner that can be moved up and down by 28 200927685 zy^zopii.uuc 33G, a support plate 332, a. According to the example, on the support plate 332', a slit-shaped guide groove 33Γ is formed along the third direction %, and the first line unit 2〇〇'a is scribed by the scriber & The thrust shafts (not shown) in the guide grooves 331' are combined. The second reticle unit 2 is also connected to the bracket 3 lion so as to be movable up and down. The connection structure is the same as the connection structure of the first reticle unit and a, and therefore the description of the connection structure is omitted.
工·㈣即早I 300’的動作受到控制部蕭的控 制。控制部5〇0’對間隔調節單元3〇〇,的第1以 ^ 器343,、345,的動作進行控制’以使第 = 元200'纖向第2方向24移動,從而對第2二早 上的刻線广το 20G’a、2嶋之間的間隔進行調節。。 接者’對利用具有上述構成的本發明的 12b,於母基板!上實施刻線步驟的過程進行^裝置The operation of (4) early I 300' is controlled by the control department Xiao. The control unit 5〇0' controls the operation of the first means 343, 345 of the interval adjusting unit 3A to move the second element 200' to the second direction 24, thereby making the second two In the morning, the interval between the lines το 20G'a and 2嶋 is adjusted. . The receiver's use of the 12b of the present invention having the above configuration on the mother substrate! The process of performing the engraving step is performed
圖18A〜圖18E為表示利用圖14以及圖 裝置於母基板1上產生切騎的触的圖。 、U 將母基板1放置於平台120的上 元3〇〇,的驅動請使第1導螺桿34^ 1刻線單元2〇0,a與切割預定線a,對齊。間 使第 的驅動器345,使第2導螺桿344,驅動,以〗使第300, 2〇〇,b移動,藉由第2騎單元2_的移動來=單元 ^ 200^ ^ 200,b ^ fa^ ^ ^ 第2刻線早元2〇〇ib與切割預定線b,對齊。延仃調即。 第1刻線單元鳥與第2刻線單元 29 200927685 中’各自的一個刻線器220,a、220,b向下方向移動,平台 120藉由驅動器(未圖示)而向第1方向22進行直線移動 (圖 18A) 〇 ,當平台120沿第1方向22移動時,刻線單元200,a、 2〇(Vb^刻線器220’a、220,b使母基板1上形成裂縫。沿切 割預定線a,、b,連續地形成裂縫,藉此,於母基板1上形 成切割道(圖18B)。 © f 切割預定線a’、b’於母基板1上形成切割道之後, 刻線單元2〇〇,a、200,b的刻線器22〇’a、22〇,b向上方向移 動。 間隔調節單元300’的驅動器345’使第2導螺桿344,受 到驅動’以使第2刻線單元200'b與切割預定線d,對齊。 間隔調節單元300,的驅動器343,使第1導螺桿342,受到驅 動以使第1刻線單元2〇〇’a移動,藉由第1刻線單元2〇〇,a 的移動來對第1刻線單元200,a與第2刻線單元200,b之間 Λ Ϊ間隔進行調節。第1刻線單元200,a與切割預定線c,對 〇 齊(圖 18c)。 第1刻線單元200,a及第2刻線單元200,b的刻線器 中,各自的一個刻線器240,a、240,b向下方向移動,平台 藉由驅動器(未圖示)而向第1方向22進行直線移動。 °'平0 1^0沿第1方向22移動時,刻線單元2〇〇'a、200,b =刻線器240,a、240,b使母基板1上形成裂縫。沿切割預 疋線c,、d,連續地形成裂縫,藉此,於母基板1上形成切 €沿切割預定線c'、d'於母基板1上形成切割道之 30 200927685 厶7:7 厶 〇ρΐ 丄 後,刻線單元200’a、200,b的刻線器24〇,a、24〇,b 向移動(圖18D)。 當沿切割預定線a’、b,形成切割道時可使用刻線器 220’a、220’b,t沿切割預定線c,、d,形成切割道 用 刻線器施、鳩。其原因在於,為了使用於形成裂縫 的刻線器篇、2鳥、2術、2條的刻線輪的方向性= 持固定。 ❹ 〇 當經過上述難㈣母絲1上形成全部朝向-個方 ^的切割道之後,再沿另-方向於母基板i 置著母基板1的平台120的上部二 對於下部板124旋轉90度(圖18E)。 之後,再次實施圖18A〜圖18D中所說明的過程 4,可於母純!上形成如下㈣ 與之前所形成的切割道垂直。 道的方向 如上所述,本發明具有多個刻線單元, 線步驟來同時形成多條切割道,藉此, 人的刻 需的時間,從而可提高基板製造步驟的生產^線步驟所 而可明可對刻線單元之間的間隔進行調節,故 多條切^ 成的單位基板的各個排列方向上形成 本發日rfr月已以實施例揭露如上,然其並非用以限定 本發明之精通常知識者’在不脫離 發明之保護範園當=附:本 31 200927685 圖式簡單說明】 圖1為表示母基板的一例的圖。 圖 圖2為概略性地表示本發明的基板切割裝置的構成的 Λ 圖3為表示圖2的刻線部中所設置的刻線裴置的一例 的立體圖。 圖4為圖3中的刻線裝置的平面圖。 ❹ Ο 圖5為圖3中的刻線裝置的侧視圖。 圖6為圖3中的「Α」部分的放大圖。 圖7為圖6中的刻線器的立體圖。 圖8為圖7中的刻線器的下端部的局部剖面圖。 圖9為圖8中的刻線輪的平面圖。 平板顯圖示 本發明的基板切割裝置來製造 基板上產生及圖4中的刻線裝置’於母 基板上產生的3^ 4中的刻線裝置,於母 基板:產生及圖4中的刻線裝置,於母 基板生及圖4中的騎裝置,於母 基:切 32 200927685Figs. 18A to 18E are views showing the contact of the cut and the ride on the mother substrate 1 by the apparatus of Fig. 14 and Fig. 14E. U places the mother substrate 1 on the upper surface of the platform 120, and drives the first lead screw 34^1 to align the line unit 2〇0, a with the planned cutting line a. The first driver 345 is caused to drive the second lead screw 344 to drive the 300th, 2nd, and bth movements, and the movement of the second riding unit 2_ = unit ^ 200 ^ ^ 200, b ^ Fa^ ^ ^ The second reticle is 2 Yuan ib and aligned with the cutting line b. Delayed adjustment. In the first engraving unit bird and the second engraving unit 29 200927685, one of the respective scribers 220, a, 220, b moves downward, and the platform 120 is moved to the first direction 22 by a driver (not shown). Linear movement (Fig. 18A) 〇, when the stage 120 moves in the first direction 22, the reticle units 200, a, 2 (Vb^ scribers 220'a, 220, b cause cracks on the mother substrate 1. A slit is continuously formed along the planned cutting lines a, b, whereby a dicing street is formed on the mother substrate 1 (Fig. 18B). © f After the cutting line a', b' is formed on the mother substrate 1, a scribe line is formed. The scriber unit 22A, a, 200, b of the scriber 22 〇 'a, 22 〇, b moves upward. The driver 345' of the interval adjusting unit 300' causes the second lead screw 344 to be driven 'to The second engraving unit 200'b is aligned with the planned cutting line d. The driver 343 of the spacing adjusting unit 300 drives the first lead screw 342 to move the first engraving unit 2〇〇'a by The movement of the first engraving unit 2A, a adjusts the interval between the first engraving unit 200, a and the second engraving unit 200, b. The first engraving The element 200, a is aligned with the cutting line c, and is aligned (Fig. 18c). In the scriber of the first engraving unit 200, a and the second engraving unit 200, b, a respective scriber 240, a , 240, b move in the downward direction, and the platform linearly moves in the first direction 22 by a driver (not shown). When the 'flat 0 1^0 moves along the first direction 22, the reticle unit 2 〇〇 ' a, 200, b = scriber 240, a, 240, b form a crack on the mother substrate 1. A crack is continuously formed along the cutting pre-twist lines c, d, thereby forming a cut on the mother substrate 1. A scribe line 30 is formed on the mother substrate 1 along the cutting line c', d'. 200927685 厶7:7 厶〇ρΐ ,, the scriber 24', 24, b of the reticle unit 200'a, 200, b 〇, b is moved (Fig. 18D). When the scribe line is formed along the cutting line a', b, the scriber 220'a, 220'b can be used, along the cutting line c, d, to form a scribe line The reason is that the directionality of the scriber, the 2 birds, the 2 knives, and the 2 reticles used for the formation of the cracks is fixed. ❹ 经过 经过 After the above difficult (four) mother Formed on silk 1 After all the dicing tracks toward the square, the upper portion 2 of the stage 120 on which the mother substrate 1 is placed on the mother substrate i in the other direction is rotated by 90 degrees for the lower plate 124 (FIG. 18E). Thereafter, FIG. 18A is again performed. The process 4 illustrated in Fig. 18D can be formed on the mother pure! as follows: (iv) perpendicular to the previously formed scribe line. The direction of the track is as described above, the present invention has a plurality of reticle units, and the line steps to simultaneously form a plurality of lines Cutting the road, thereby taking the time required by the person, thereby improving the production step of the substrate manufacturing step, and clearly adjusting the interval between the reticle units, so that the plurality of cut unit substrates are The present invention has been disclosed in the above-mentioned embodiments. However, it is not intended to limit the general knowledge of the present invention, and it does not deviate from the invention of the invention. = Attachment: This 31 200927685 Schematic description FIG. 1 is a view showing an example of a mother substrate. Fig. 2 is a perspective view schematically showing a configuration of a substrate dicing apparatus according to the present invention. Fig. 3 is a perspective view showing an example of a scribe line provided in the reticle portion of Fig. 2 . Figure 4 is a plan view of the reticle apparatus of Figure 3. ❹ Ο Figure 5 is a side view of the scribe line device of Figure 3. Fig. 6 is an enlarged view of a portion of "Α" in Fig. 3. Figure 7 is a perspective view of the reticle of Figure 6. Figure 8 is a partial cross-sectional view showing the lower end portion of the reticle of Figure 7. Figure 9 is a plan view of the reticle of Figure 8. The substrate is shown in the substrate cutting device of the present invention to produce the scribe line device produced on the substrate and the scribe line device of FIG. 4 on the mother substrate, in the mother substrate: the generation and the engraving in FIG. Wire device, born on the mother substrate and riding device in Figure 4, in the mother base: cut 32 200927685
厶 7 :^厶 ϋριι_ · uajC 美;產“為利用圖3以及圖4中的刻線裝置,於母 基板上產生切割道的過程的圖。 某;彻圖3以及11 4中賴線裝置,於母 基板上產生切割道的過程的圖。 圖11H為表示利用圖3以 基板上產生切割道的過程的圖。_巾的刻線裝置,於母 Ο 美杯為i示利用圖3 3"及圖4中的刻線裝置,於母 基板上產生切割道的過程的圖。 口 =示圖3中的刻線裳置的其他實施形態的圖。 示圖3中的刻線裝置的其他實施形態的圖。 圖14為表示圖2的刻_ 他實施形㈣立咖。 ^絲罝的其 圖15為圖14中的刻線裝置的平面圖。 圖16為圖14中的ΓΒ」部分的放大圖。 剖面Γ7為表賴16中的支架與導螺桿_結合關係的 么為表示利用圖M以及圖15中的刻線裝置,於 母基板上產生切割道的過程的圖。 圖⑽表示利用圖14以及圖15中的刻線裝置, 基板上產生切割道的過程的圖。 圖18C表示利用圖14以及圖15中的刻線裝置,於母 基板上產生切割道的過程的圖。 圖18D表示利用圖14以及圖15中的刻線裝置,於母 基板上產生切割道的過程的圖。 33 200927685 圖18Ε表示利用圖14以及圖15中的刻線裝置,於母 基板上產生切割道的過程的圖。 【主要元件符號說明】 1 .母基板 2 :第1母基板 2a、3a :單位基板 3 :第2母基板 10:基板切割裝置 ^ 11 :裝載部 12 :刻線部 12a :刻線裝置 13 :分割部 14 :卸載部 15 :反轉部 22 :第1方向 24 :第2方向 〇 26 :第3方向 30 :基座 100 :支撐構件 120 :平台 122 :上部板 124 :下部板 140 :直線驅動構件 141、225、322,、323a :槽 34 200927685厶7 :^厶ϋριι_ · uajC 美;Production "A diagram for the process of producing a scribe line on the mother substrate by using the scribe line device of Figs. 3 and 4." Fig. 11H is a view showing a process of producing a scribe line on a substrate by using Fig. 3. The scribe line of the _ towel is shown in Fig. 3 3" And the scribe line device of Fig. 4, the process of creating a scribe line on the mother substrate. Port = diagram of another embodiment of the scribe line in Fig. 3. Other implementations of the scribe line device in Fig. Fig. 14 is a plan view showing the shape of Fig. 2, Fig. 15 is a plan view of the scribe line device of Fig. 14. Fig. 16 is an enlarged view of the ΓΒ" portion of Fig. 14. Figure. The cross-section Γ7 is a view showing the relationship between the support and the lead screw in the table 16, and is a view showing a process of generating a scribe line on the mother substrate by using the scribe line device of Fig. M and Fig. 15. Fig. 10 is a view showing a process of generating a scribe line on a substrate by using the scribe line device of Figs. 14 and 15 . Fig. 18C is a view showing a process of producing a scribe line on the mother substrate by using the scribe line device of Figs. 14 and 15; Fig. 18D is a view showing a process of producing a scribe line on the mother substrate by using the scribe line device of Figs. 14 and 15; 33 200927685 Fig. 18A is a view showing a process of generating a scribe line on a mother substrate by using the reticle device of Figs. 14 and 15 . [Main component symbol description] 1. Mother substrate 2: First mother substrate 2a, 3a: Unit substrate 3: Second mother substrate 10: Substrate cutting device ^11: Loading portion 12: reticle portion 12a: scribe device 13: Division part 14 : Unloading section 15 : Inversion part 22 : First direction 24 : Second direction 〇 26 : Third direction 30 : Base 100 : Support member 120 : Platform 122 : Upper plate 124 : Lower plate 140 : Linear drive Member 141, 225, 322, 323a: slot 34 200927685
厶 7 7 厶 〇pil, WVjG 142、320,、323、440 :導引構件 144 :支架 145 :底板 147、332'、336 :支撐板 149、334'、335 :結合板 149a :側板 149b、334'b :插入板 160 :旋轉驅動構件 ® 162 :馬達 164 :旋轉軸 200、200’ :刻線單元 200a、200’a :第一刻線單元 200b、200’b :第二刻線單元 220a、240a、220b、240b、220’a、240’a、220’b、240’b : 刻線器 222 :刻線輪 〇 222a :邊緣 222b :通孔 224 :支撐體 224a :本體 224b :軸桿 226 :擠壓構件 228 :振盪器 300 :移動單元 35 200927685厶7 7 厶〇pil, WVjG 142, 320, 323, 440: guiding member 144: bracket 145: bottom plate 147, 332', 336: support plate 149, 334', 335: bonding plate 149a: side plates 149b, 334 'b: insertion plate 160: rotary drive member® 162: motor 164: rotary shaft 200, 200': scribe unit 200a, 200'a: first reticle unit 200b, 200'b: second reticle unit 220a, 240a, 220b, 240b, 220'a, 240'a, 220'b, 240'b: scriber 222: scribe rim 222a: edge 222b: through hole 224: support body 224a: body 224b: shaft 226 : Squeeze member 228 : Oscillator 300 : Mobile unit 35 200927685
厶77 厶OpihUUC 300':間隔調節單元 320 :第1移動單元 321、341、310’ :垂直支撐台 325、330’a、330,b :支架 327 :導螺桿 328、 348 :驅動器 329、 340’、460 :驅動構件 331 :側板 ® 333 :插入板 336 :支撐板 336a、33Γ :導引槽 340 :第2移動單元 334’a :側板 335’a、335’b :母螺紋部 336’a、336'b :孔 342’ :第1導螺桿 G 343’ :第1驅動器 344’ :第2導螺桿 345’ :第2驅動器 400 :間隔調節單元 420 :支撐台 422 :第1支撐塊 424 :第2支撐塊 462 :導螺桿 36 200927685 464 :驅動器 500、500':控制部 a、b、c、d、a’、b'、c'、d'、e、f :切割預定線厶77 厶OpihUUC 300': interval adjustment unit 320: first moving unit 321, 341, 310': vertical support table 325, 330'a, 330, b: bracket 327: lead screw 328, 348: driver 329, 340' 460: drive member 331: side plate® 333: insertion plate 336: support plate 336a, 33Γ: guide groove 340: second moving unit 334'a: side plates 335'a, 335'b: female thread portion 336'a, 336'b: hole 342': first lead screw G 343': first driver 344': second lead screw 345': second driver 400: interval adjusting unit 420: support table 422: first support block 424: 2 support block 462: lead screw 36 200927685 464 : driver 500, 500': control part a, b, c, d, a', b', c', d', e, f: cutting line
3737
Claims (1)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070119002A KR100889308B1 (en) | 2007-11-21 | 2007-11-21 | Scribing device and method and substrate cutting device using same |
| KR1020070119005A KR100905898B1 (en) | 2007-11-21 | 2007-11-21 | Scribing device and substrate cutting device and method using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200927685A true TW200927685A (en) | 2009-07-01 |
| TWI385136B TWI385136B (en) | 2013-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97142568A TWI385136B (en) | 2007-11-21 | 2008-11-04 | Scribing apparatus and method, apparatus for cutting substrate using the scribing apparatus |
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| Country | Link |
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| JP (1) | JP2009126780A (en) |
| TW (1) | TWI385136B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI585023B (en) * | 2013-06-26 | 2017-06-01 | 三星鑽石工業股份有限公司 | Method for conveying brittle material substrate and conveying device |
| CN107238683A (en) * | 2017-06-09 | 2017-10-10 | 江苏昊科汽车空调有限公司 | A kind of automobile emission gas analyzer adjusting means |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5091961B2 (en) * | 2010-02-15 | 2012-12-05 | 三星ダイヤモンド工業株式会社 | Scribing equipment |
| KR101322670B1 (en) * | 2011-10-21 | 2013-11-04 | 주식회사 호영하이텍 | Non-slip deck materials manufacturing apparatus and Non-slip deck materials manufacturing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0718737Y2 (en) * | 1989-10-26 | 1995-05-01 | 株式会社小坂研究所 | Panel cutting device |
| JP2503765B2 (en) * | 1992-04-16 | 1996-06-05 | 坂東機工株式会社 | Numerically controlled cutting device for glass plate |
| JP2916046B2 (en) * | 1992-07-29 | 1999-07-05 | シャープ株式会社 | Liquid crystal display device manufacturing equipment |
| JPH11343133A (en) * | 1998-03-31 | 1999-12-14 | Shirai Tekkosho:Kk | Apparatus for cutting sheet glass |
| JP4149742B2 (en) * | 2002-06-10 | 2008-09-17 | 中村留精密工業株式会社 | Hard brittle plate cutting device |
| KR101152763B1 (en) * | 2003-12-29 | 2012-06-18 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Scribing line forming mechanism, scribing head and scribing apparatus |
| EP1800820B1 (en) * | 2004-10-13 | 2012-12-12 | Mitsuboshi Diamond Industrial Co., Ltd. | Method and apparatus for scribing brittle material board and system for breaking brittle material board |
| TWI284399B (en) * | 2005-06-30 | 2007-07-21 | Advanced Semiconductor Eng | Chip package process |
| JP2007045656A (en) * | 2005-08-09 | 2007-02-22 | Citizen Seimitsu Co Ltd | Work dividing apparatus and display panel manufactured using the same |
| KR100863438B1 (en) * | 2006-05-08 | 2008-10-16 | 주식회사 탑 엔지니어링 | Scribing device using multi-axis synchronous control and its method |
-
2008
- 2008-10-23 JP JP2008273122A patent/JP2009126780A/en active Pending
- 2008-11-04 TW TW97142568A patent/TWI385136B/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI585023B (en) * | 2013-06-26 | 2017-06-01 | 三星鑽石工業股份有限公司 | Method for conveying brittle material substrate and conveying device |
| CN107238683A (en) * | 2017-06-09 | 2017-10-10 | 江苏昊科汽车空调有限公司 | A kind of automobile emission gas analyzer adjusting means |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI385136B (en) | 2013-02-11 |
| JP2009126780A (en) | 2009-06-11 |
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